Intel SSDMCEAC240B301 User Manual

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Intel® Solid-State Drive 525 Series

Product Specification

 Capacity: 30/60 GB

(No longer available: 90/120/180/240 GB)

 Components:

— Intel

25nm NAND Flash Memory

— Multi-Level Cell (MLC)

 Form Factor: mSATA full size  Thickness: 3.7 mm  Weight: <10 grams  SATA 6Gb/s Bandwidth Performance

(Iometer* Queue Depth 32)

— Sustained Sequential Read: up to 550

MB/s

— Sustained Sequential Write: up to 520

MB/s

 Read and Write IOPS

(Iometer Queue Depth 32)

— Random 4 KB Reads: Up to 50,000 IOPS — Random 4 KB Writes: Up to 80,000 IO P S

 Latency (average sequential)

— Read: 80 µs (TYP) — Write: 85 µs (TYP)

 Data Compression  AES 128-bit Encryption  End-to-end Data Protection  Compatibility

— Intel® SSD Toolbox with Intel® SSD

Optimizer — Intel® Data Migra tion Software — Intel® Rapid Storage T ec hnology — SATA Revision 3.0 — ACS-2 — SSD-enhanced SMART ATA feature set — Native Command Queuing (NCQ)

command set — Data Set Management Command

 Power Management

— 3.3 V SATA Supply Rail — SATA Link Power Management (LPM)

 Power

— Active (MobileMark* 2007 W or k loa d) :

300 mW (TYP)

— Idle: 250 mW (TYP)

 Temperature

— Operating — Non-Operating: -55

 Reliability

— Uncorrectable Bit Error Rate (UBE R):

<1 sector per 10

: 0o C to 70o C

C to 95o C

bits read

— Mean Time Between Failure (MTBF):

1,200,000 hours

— Shock (operatin g a nd non-operating):

1,000 G/0.5 msec

 Vibration

— Operating: 2.17 G — Non-operating: 3.13 G

 Certifications and Declarations:

(5-700 Hz)

RMS

(5-800 Hz)

— UL* — CE* — C-Tick* — BSMI* — KCC* — Microsoft* WHCK — VCCI* — SATA-IO*

 Product Ecological Compliance

RoHS*

1. Performance values vary by capacity.

2. Random 4 KB writes measured using out-of-box SSD.

3. As measured by temperature sensor, SMART Attribute BEh. Active air flow is rec o mmended within the system for maintaining proper device operatin g temperatures on heavier workloads.

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Ordering Information

Contact your local Intel sales representative for order ing information.

Intel® Solid-State Drive 525 Series

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERT Y R IGH T S IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTE L ASSU MES NO LIABIL IT Y WHATSOE VE R AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PROD U CTS INCL UDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFF I LI AT E S, AND TH E DIRE CT OR S, OFFIC E R S, AND EM PL OYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND RE ASONABLE AT T OR NE Y S' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJUR Y, OR D E ATH AR ISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIG N, MANU F AC T U RE , OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristic s of a n y features or instructions marked "re s erved" or "undefined." Intel reserves these for future definition and shall have no responsibility w hatsoever for conflicts or incompa tibilities arising from future chang e s to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from publis hed specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest spe cifications and before placing you r prod uct order. Copies of document s which have an order number and are referen c e d in t his document, or other Intel literature, may be obtained by calling 1-800-

548-4725, or go to: http://www.intel.com/design/literature.htm Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as

purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halog e nated flame retardants and/or PVC may not be better for the environment .

Intel and the Intel log o are trademarks of Intel Corporation i n t he U.S. and other countries. *Other names and brand s may be claimed as the property of othe rs . Copyright © 2013 Int el C orpora tion. All rights reserved.

Intel® Solid-State Drive 525 Ser ies Product Specification March 2013 2 Order Number: 328354-002US

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Intel® Solid-State Drive 525 Series

Contents

1.0 Overview ............................................................................................................................ 4

2.0 Product Specifications ......................................................................................................... 5

2.1 Capacity ............................................................................................................................... 5

2.2 Performance ........................................................................................................................ 5

2.3 Electrical Characteristics ..................................................................................................... 7

2.4 Environmental Conditions ................................................................................................... 7

2.5 Product Regulatory Compliance .......................................................................................... 9

2.6 Reliability ........................................................................................................................... 10

3.0 Mechanical Information ..................................................................................................... 11

4.0 Pin and Signal Descriptions ................................................................................................. 12

4.1 Pin Locations ..................................................................................................................... 12

4.2 Signal Descriptions ............................................................................................................ 12

5.0 Supported Command Sets .................................................................................................. 14

5.1 ATA General Feature Command Set ................................................................................. 14

5.2 Power Management .......................................................................................................... 14

5.3 Security Mode Feature Set ................................................................................................ 15

5.4 SMART Command Set ....................................................................................................... 15

5.5 Device Statistics ................................................................................................................. 20

5.6 SMART Command Transport (SCT) .................................................................................... 20

5.7 Data Set Management Command Set ............................................................................... 20

5.8 Host Protected Area Command Set .................................................................................. 20

5.9 48-Bit Address Command Set ............................................................................................ 21

5.10 General Purpose Log Command Set .................................................................................. 21

5.11 Native Command Queuing ................................................................................................ 21

5.12 Software Settings Preservation ......................................................................................... 21

5.13 SATA Link Power Management (LPM)............................................................................... 21

6.0 Certifications and Declarations ........................................................................................... 22

7.0 References ......................................................................................................................... 23

8.0 Terms and Acronyms .......................................................................................................... 23

9.0 Revision History ................................................................................................................. 24

Appendix: IDENTIFY DEVICE Command Data .................................................................................. 25

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1.0 Overview

Intel® Solid-State Drive 525 Series

This document describes the specif ic ations and capabilities of the Intel® S olid-State Drive 525 Series (Intel

SSD 525 Series)1.

The Intel SSD 525 Series delivers small form-factor storage and leading performance for Serial Advanced Technology Attachment (SATA)-based computers in capacities ranging from 30GB to 240GB.

By combining Intel's high quality 25nm NAND f lash memory technology w ith SATA 6G b/s interfac e support, the Intel SSD 525 Series delivers sequential read speeds of up to 550 MB/s and sequential write speeds of up to 520 MB/s.

The case-less mSATA (mini-SATA) design has a significantly sm aller footprint tha n a 2.5-inch hard disk drive (HDD), and enables fast read/write access times and a significant I/O and throughput performance improvement as compared to HDDs. This design mak e s it id ea l for new and inn ovative small form factor c om p uting platforms that have size and weight requirements that traditional 2. 5 inch or 1.8-inch HDDs cannot meet; such as, netbooks, thin-and-light systems, min i- and subnotebooks, all-in-one computers, and embedded platforms.

As compared to standard SATA HDDs, Intel SSD 525 Series offers these key features:

• High I/O and throughput performance

• Low power

• Increased system responsiveness

• High reliability

• Enhanced ruggedness

• Small form-factor

• Minimum weight

The Intel SSD 525 Series also offers additional key features such as:

• Advanced Encryption Standard (AES) 128-bit Encryption AES 128-bit encryption is a n industry standar d in data security, provid ing a hardware-based

mechanism for encryption and decryption of user data. Utilizing a 12 8-bit encryption key, AES encryption—when combined with an ATA drive pas sword—helps protect user data.

• End-to-End Data Protection End-to-end data protection helps pr otect da ta from being corrupted across the data path by

using cyclic redundancy check (CRC), parity, and error correction code (ECC) checks in the data path from the hos t interface to the NAND , and back.

• Data Compression Data compression helps im pr ove performance and endura nce by automatically com p r essing

information sen t to the SSD so that less data has to be processed a nd stored on the NA N D . Th e amount of data that can be compres s ed depends on the type of data.

Note: 1. The Intel SSD 525 Series is currently not validated for data center usage.

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Table 1. User Addressa ble Sectors

Unformatted Capacity

(Total User Addressable Sectors in LBA Mode)

Table 2.

Compressible Performance

Intel SSD 525 Series

SATA 3Gb/s

Intel® Solid-State Drive 525 Series

2.0 Product Specifications

2.1 Capacity

Intel SSD 525 Series

30 GB 58,626,288

60 GB 117,231,408

120 GB 234,441,648

180 GB 351,651,888

Note: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.

LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive. The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity

is used for NAND flash management and maintenance purposes.

240 GB 468,862,128

2.2 Performance

The data compression engine in the Intel SSD 525 Series contr oller optimizes performan c e ba s ed on the data pattern of the workload.

This section provide s both compressible and incompressibl e Input/Output Operations per Second (IOPS) and sustained sequential read and write bandwidth specifications.

Specification Unit

30 GB 60 GB 90 GB 120 GB 180 GB 240 GB

Random 4 KB Read (up to) IOPS 5,000 15,000 25,000 25,000 50,000 50,000

Random 4 KB Write (up to)1 IOPS 80,000 80,000 80,000 80,000 80,000 80,000

Random 4 KB Write (TYP)2 IOPS 10,000 23,000 38000 40,000 60,000 60,000

Sequential Read (up to) SATA 6Gb/s

Seque ntial Write (up to) SATA 6Gb/s SATA 3Gb/s

Notes:

1. Random 4 KB write performance measured using out-of-box SSD.

2. Performance measured using Iometer* with Queue Depth 32. Measurements are p erf o rm ed on 8 GB of Logical Block Address (LBA) range on a full SSD.

3. Performance measured using Iometer with Queue Depth 32.

March 2013 Product Specification Order Number: 328354-002US

MB/s

500 280

275 240

550 280

475 245

550 280

485 250

550 280

500 260

550 280

520 260

550 280

520 260

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Table 3.

Incompressible Performance

Specification Unit

Intel SSD 525 Series

Table 4. Latency

Power On To Ready2

2 s (TYP)

Intel® Solid-State Drive 525 Series

30 GB 60 GB 90 GB 120 GB 180 GB 240 GB

Random 4 KB Read (up to) 1 IOPS 7,000 12,000 24,000 24,000 46,000

Random 4 KB Write (up to)

Sequential Read (up to) 1 MB/s 200 430 470 550

IOPS 2,500 6,900 6,900 13,000

13,000

550 550

Seque ntial Write (up to) 1 MB/s 40 80 115 150 170

46,000

16,500

235

Notes:

1. Performance measured using Iometer with Queue Depth 32. Measurements are performed on 8 GB of Logical Block Address (LBA) range.

Specification Intel SSD 525 Series

Latency Read Write

80 µs (TYP) 85 µs (TYP)

Notes:

1. Based on sequential 4 KB using Iometer with Queue Depth 1 workload with com p r essible (non-random) data pattern. Write Cache Enabled.

2. Power On To Ready time assumes proper shutdown.

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Table 5. Operating Voltage and Power Consumption

Max

Idle2

Table 6. Temperature, Shock, Vi bration

Non-operating

Intel® Solid-State Drive 525 Series

2.3 Electrical Characteristics

Values

Electrical Characteristics 30GB 60GB 90GB 120GB 180GB 240GB

Operating Voltage for 3.3 V (±5%) Min

Client Power Consumption (TYP) Active

Thermal Power3

Regulator Power4

Notes:

1. Active power measured during execution of MobileMark* 2007 with SATA Link Power Management (LPM) enabled.

2. Idle power defined as SSD at idle with SATA Lin k Power Management (LPM) enabled.

3. Power measured during 128 kB sequential writes with Queue Depth 32 workload using 100 ms sample period. This

4. Power measured during 128 kB sequential writes with Queue Depth 32 workload using 500 us sample period. This

2.6 W 2.8 W 3.2 W 3.8 W 4.0 W 4.5 W

2.7 W 2.9 W 3.3 W 4.0 W 4.3 W 4.8 W

represents power that would be thermal load on system during heavy workloads. represents power that system power supply would have to regulate for proper device operation.

3.14 V

3.47 V

300 mW 250 mW

2.4 Environmental Conditions

2.4.1 Temperature, Shock, Vibration

Temperature Range

Module Temperature Operating

Temperature Gradient Operating

Humidity Operating

March 2013 Product Specification Order Number: 328354-002US

0 – 70 oC

C/hr

5 – 95 % 5 – 95 %

-55 – 95

30 (TYP) 30 (TYP) oC/hr

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Intel® Solid-State Drive 525 Series

Non-operating

Shock and Vibration Range

Shock Operating

1,000 G (Max) at 0.5 msec 1,000 G (Max) at 0.5 msec

Vibration Operating

Notes:

2.17 G

3.13 G

(5-700 Hz) Max

RMS

(5-800 Hz) Max

RMS

1. As measured by temperature sensor, SMART Attribute BEh. Active ai r flow is recommended within the system for maintaining proper device operating temperatures on heav ier wor kloads.

2. Temperature gradient measured without condensation.

3. Shock specifications assume that one side of SSD is inserted into SATA connector and the o t her side is secured by screw. Both connector and screw are securely mounted on a fixture that is firmly attached on a shock table. The shock stimulus is applie d in X, Y and Z axis respectively. Shock specification is measured using peak acceleration and pulse width value.

4. Vibration specifications as su me that one side of SSD is inserted into SATA connector and the other side is secured by screw. Both connector and screw are securely mounted on a fixture that is firmly attached on vibration table. The vib ration stimul u s is applied in X, Y and Z axis respectively Vibration specification is measured using G Root mea n Squa re d (GRMS) value.

2.4.2 Altitude

The drive is not sensitive to changes in atmospheric pressure because it has no moving parts. Dr ive tested to pressures repres entative of -1K and +40K f eet.

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Table 7. Product Regulatory Compliance Specif ications

TITLE 47-Telecommunication CHAPTER I— FEDERAL

Standard Digital Apparatus

IEC 555024 Information Technology Equipment —

measurement CISPR 24:2010

EN-55022 Information technology equipment —

methods of measurement CISPR 22:2008 (Modified)

Information Technology Equipment — Safety

Part 1: General Requirements

Information Technology Equipment — Safety

Part 1: General Requirements

Intel® Solid-State Drive 525 Series

2.5 Product Regulatory Compliance

The Intel SSD 525 Series meets or exceeds the regulator y or certification requirements in Product Regulatory Compliance Specifications

Title Description

COMMUNICATIONS COMMISSION PART 15 — RADIO FREQUENCY DEVICES ICES-003, Issue 4 Interference-Causing Equipment

Immunity characteristics — Limits and methods of

Radio disturbance characteristics — Limits and

EN-60950-1 2nd Edition

UL/CSA 60950-1 2nd Edition

Region for which

conformity declared

FCC Part 15B Class B CAN/CSA-CEI/IEC CISPR 22:02. This is CISPR

22:1997 with Canadian modifications.

EN-55024: 1998 and its amendments European Union

EN-55022: 2006 and its amendments European Union

—

USA

Canada

USA / Canada

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Intel® Solid-State Drive 525 Series

Table 8. Reliability Specifications

returned to the host.

Mean Time Between Failures ( M T BF)

Test (RDT).

Minimum Useful Life/Endurance Rating

Insertion Cycles

2.6 Reliability

The Intel SSD 525 Series meets or exceeds SSD endura nce and data retention requirements a s specified in the JESD218 s pec if ic a tion.

Reliability spec ifications are liste d in Reliability Specifications.

Parameter Value

Uncorrectable Bit Error Rate (UBER)

Uncorrectable bit error rate will not exceed one sector i n the

specified number of bits read. In the unlikely event of a nonrecoverable read error, the SSD will report it as a read failure to the host; the sector in error is considered corrupt and is not

Mean Time Between Failures is estimated based on Telcordi a *

methodology and demonstrated through Reliability Demonstration

Minimum useful life under typical client workloads with up to 20 GB

of host writes per day.

Maximum insertion/removal cycles on mSATA/power cable.

< 1 sector per 10

1,200,000 hours

30 GB: 3 years

250 insertion/removal cy cles

bits read

Other Capacities:

5 years

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Intel® Solid-State Drive 525 Series

3.0 Mechanical Information

This figure shows the physical package information for the mSAT A fu ll s ize Intel SSD 525 Series. All dimensions are in m illimeters.

Figure 1. Dimensions for Intel SSD 525 Series

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4.0 Pin and Signal Descriptions

Figure 3. Layout of Signal a nd Power Segment Pins

Table 9. Serial ATA Power Pin Definitions

Reserved

No Connect

Reserved

No Connect

GND

Return Current Path

P16

Reserved

No Connect

P17

Reserved

No Connect

P18

GND

Return Current Path

P19

Reserved

No Connect

4.1 Pin Locations

Intel® Solid-State Drive 525 Series

4.2 Signal Descriptions

Pin1 Function Definition

P1 Reserved No Connect P2 +3.3 V 3.3 V Source P3 Reserved No Connect P4 GND Return Current Path P5 Reserved No Connect

P61 +1.5 V 1.5 V Source

P10 Reserved No Connect P11 Reserved No Connect P12 Reserved No Connect P13 Reserved No Connect P14 Reserved No Connect P15 GND Return Current Path

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Table 9. Serial ATA Power Pin Definitions

P20

Reserved

No Connect

P21

GND

Return Current Path

P22

Reserved

No Connect

P29

GND

Return Current Path

P302

Two Wire Interface

Two Wire Interface Clock

P31

-A

Host Transmitter Differential Signal Pair (This is an input of the SSD)

P322

Two Wire Interface

Two Wire Interface Data

P40

GND

Return Current Path

P41

+3.3 V

3.3 V Source

P42

Reserved

No Connect

P43

Device Type

No Connect

P50

GND

Return Current Path

P514

Presence Detection

Shall be pulled to GND by device

P52

+3.3 V

3.3 V Source

Intel® Solid-State Drive 525 Series

Pin1 Function Definition

P23 +B Host Receiver Differential Signal Pair (This is an output of the SSD) P24 +3.3 V 3.3 V Source P25 -B Host Receiver Differential Signal Pair (This is an output of the SSD) P26 GND Return Current Path P27 GND Return Current Path

P281 +1.5 V 1.5 V Source

P33 +A Host Transmitter Differential Signal Pair (This is an input of the SSD) P34 GND Return Current Path P35 GND Return Current Path P36 Reserved No Connect P37 GND Return Current Path P38 Reserved No Connect P39 +3.3 V 3.3 V Source

P44 Reserved No Connect

P453 Vendor Vendo r Sp ecifi c / Manufacturing Pin

P46 Reserved No Connect P473 Vendor Vendo r Sp ecifi c / Manufacturing Pin P481 +1.5 V 1.5 V Source

P49 DA/DSS Device Activity Signal / Disable Staggered Spin-up

Notes:

1. 1.5 V rail is not used on the Intel SSD 525 Series. No connect on the host side. Pin 6, 28, and 48 shall be unconnected on the device side to avoid conflicts with wireless coexistence pins as specified in PCI Express Mini Card Specification.

5. Pins 30 and 32 are intended for use as a two-wire interface to read a memory device to determine device information (an example of this would be for use as SMB bus pins). These pins are not designed to be active in conjunction with the SATA signal differential pairs. Not used on the Intel SSD 525 Series. No connect on the host side.

3. Vendor-specific pins are not used in the Intel SSD 525 Series. No connect on the host sid e.

4. Presence detection pin indica tes pres ence of an mSATA device.

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Intel® Solid-State Drive 525 Series

5.0 Supported Command Sets

The Intel SSD 525 Series supports all mandatory Advanced Technology Attachment (ATA) and Serial ATA (SATA) commands defined in the ACS-2 and SATA Revision 3.0 spec if ic a tions. The mandatory and optional commands are defined in this section.

5.1 ATA General Feature Command Set

General Feature command set (non-PACKET), which consists of:

• EXECUTE DEVICE DIAGNOSTIC

• FLUSH CACHE

• IDENTIFY DEVICE

Note: See the Appendix for details on the sector data returned after issuing an IDENTIFY DEVICE command.

• READ DMA

• READ SECTOR(S)

• READ VERIFY SECTOR(S)

• SEEK

• SET FEATURES

• WRITE DMA

• WRITE SECTOR(S)

• READ MULTIPLE

• SET MULTIPLE MODE

• WRITE MULTIPLE

The Intel SSD 525 Series also supports the following optional com mands:

• READ BUFFFER

• WRITE BUFFER

• NOP

• DOWNLOAD MICROCODE

5.2 Power Management

The Intel SSD 525 Series supports several power man a gement feature sets as defined by th e ATA specification: general Power Management featur e s et, A dvanced Power Management feature set, and Power-Up In Standby (PUIS) feature set.

The Advanced Power Management and PUIS features can be en a bled or dis a bled using the SET FEATURES command.

The Power Management feature set includes the following commands:

• CHECK POWER MODE

• IDLE

• IDLE IMMEDIATE

• SLEEP

• STANDBY

• STANDBY IMMEDIATE

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Intel® Solid-State Drive 525 Series

5.3 Security Mode Feature Set

The Intel SSD 525 Series supports the Security Mode command s et, which consists of :

• SECURITY SET PASSWORD

• SECURITY UNLOCK

• SECURITY ERASE PREPARE

• SECURITY ERASE UNIT

• SECURITY FREEZE LOCK

• SECURITY DISABLE PASSWORD

5.4 SMART Command Set

The Intel SSD 525 Series supports the SMAR T command set, which c onsists of:

• SMART READ DATA

• SMART READ ATTRIBUTE THRESHOLDS

• SMART ENABLE/DISABLE ATTRIBUTE AUTOSAVE

• SMART SAVE ATTRIBUTE VALUES

• SMART EXECUTE OFF-LINE IMMEDIATE

• SMART READ LOG SECTOR

• SMART WRITE LOG SECTOR

• SMART ENABLE OPERATIONS

• SMART DISABLE OPERATIONS

• SMART RETURN STATUS

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Intel® Solid-State Drive 525 Series

Table 10. SMART Attributes

Status Flags1

factory (grown defect count).

active, idle and slumber.

over the life of the device.

AAh

Available Reserved Space

1 1 0 0 1 1 10

remaining of allowable program fails.

remaining of allowable erase fails.

IMMEDIATE being the last command

to error.

5.4.1 SMART Attributes

Table 10 lists the SMART attri butes supported by the Intel SS D 525 Series; Table 11 lists the corresponding status flags and threshold settings.

ID Attribute

Re-allocated Sector Count

05h

09h

0Ch

The raw value of this attribute shows the number of retired blocks since leaving the

Power-On Hours Count The raw value reports two values: the first

4 bytes report the cumulative number of power-on hours over the life of the device, the remaining bytes report the number of milliseconds since the last hour increment.

The On/Off status of the Device Initiated Power Management (DIPM) feature will affect the number of hours reported. If DIPM is turned On, the recorded value for power-on hours does not include the time that the device is in a "slumber" state. If DIPM is turned Off, the recorded value for power-on hours should match the clock time, as all three device states are counted:

Power Cycle Count The raw value of this attribute reports the cumulative number of power cycle events

SP EC ER PE OC PW

1 1 0 0 1 0 0 (none)

Threshold

Program Fail Count

ABh

ACh

AEh

B7h

The raw value of this attribute shows total count of program fails and the normalized value, beginning at 100, shows the percent

Erase Fail Count The raw value of this attribute shows total

count of erase fails and the normalized value, beginning at 100, shows the percent

Unexpected Power Loss The raw value of this attribute reports the

cumulative number of unsafe (unclean) shutdown events over the life of the device. An unsafe shutdown occurs whenever the device is powered off without STANDBY

SATA Downshift Count

The count of the number of times SATA interface selected low er sig n aling rate due

1 1 0 0 1 0 0 (none)

1 1 0 0 1 0 10

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Table 10. SMART Attributes

Status Flags1

SSD data path.

Correction Code (ECC).

temp Celsius.

IMMEDIATE being the last command.

the host.

cycles.

workload timer, attribute E4h).

minutes since starting this workload timer).

Intel® Solid-State Drive 525 Series

ID Attribute

End-to-End Error Detection Count

B8h

BBh

BEh

C0h

Reports number of errors encountered during end-to-end error detection within the

Uncorrectable Error Count The raw value shows the count of errors

that could not be recovered using Error

Temperature

Reports real-time temperature of drive as measured by temperature s ensor on drive PCB. The normalized value reports the current temperature value. The raw value shows current, lifet i me highest and lifetime lowest temperatures. Byt e 1 :0 = current temp Celsius; Byte 3:2 = lifetim e highest temp Celsius; Byte 5:4 = lifetime lowest

Power-Off Retract Count (Unsafe Shutdown Count)

The raw value of this attribute reports the cumulative number of unsafe (unclean) shutdown events over the life of the device. An unsafe shutdown occurs whenever the device is powered off without STANDBY

SP EC ER PE OC PW

1 1 0 0 1 1 90

1 1 0 0 1 0 0 (none)

1 1 0 0 1 0 0(none)

1 1 0 0 1 0 0 (none)

Threshold

C7h

E1h

E2h

E3h

E4h

CRC Error Count

The total number of encountered SATA interface cyclic redundancy check (CRC) errors.

Host Writes The raw value of this attribute reports the

total number of sectors written by the host system. The raw value is increased by 1 for every 65,536 sectors (32MB) written by

Timed Workload Media Wear Measures the wear seen by the SSD (since

reset of the workload timer, attribute E4h), as a percentage of the maximum rated

Timed Workloa d Host Read/Write Ratio Shows the percentage of I/O operations

that are read operations (since reset of the

Timed Workload Timer Measures the elapsed time (number of

1 1 0 0 1 0 0 (none)

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Intel® Solid-State Drive 525 Series

Table 10. SMART Attributes

Status Flags1

is 10 percent availability.

on the device.

the host.

NAND in 1 GB increments.

Table 11. SMART Attribute Status Flags

Status Flag

Description

Value = 0

Value = 1

Self-preserving attribute

Not a self-preserving attribute

Self-preserving attribute

Event count attribute

Not an event count attribute

Event count attribute

Error rate attribute

Not an error rate attribute

Error rate attribute

Performance attribute

Not a performance attribute

Performance attribute

Collected only d uring off line

activity

Collected during both offline

and online activity

Pre-fail warranty attribute

Advisory

Pre-fail

ID Attribute

Available Reserved Space This attribute reports th e numbe r of reserv e

E8h

E9h

F1h

F2h

blocks remaining. The normalized value begins at 100 (64h), which corresponds to 100 percent availability of the reserved space. The threshold value for this attribute

Media Wearout Indicator This attribute reports the number of cycles

the NAND media has undergone. The normalized value declines linearly from 100 to 1 as the average erase cycle count increases from 0 to the maximum rated cycles.

Once the normalized value reaches 1, the number will not decrease, although it is likely that significant additional wear can be put

Total LBAs Written The raw value of this attribute reports the

total number of sectors written by the host system. The raw value is increased by 1 for every 65,536 sectors (32MB) written by

Total LBAs Read The raw value of this attribute reports the

total number of sectors read by the host system. The raw value is increased by 1 for every 65,536 sectors (32MB) read by

SP EC ER PE OC PW

1 1 0 0 1 1 10

1 1 0 0 1 0 0 (none)

Threshold

F9h

Total NAND Writes Raw value reports the number of writes to

1 1 0 0 1 0 0 (none)

Table 11 defines the SMART Attribute status flags .

OC Online collection attribute

5.4.2 SMART Logs

The Intel SSD 525 Series implements the following Log Addresses: 00h, 02h, 03h, 06h, and 07h.

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Intel® Solid-State Drive 525 Series

The Intel SSD 525 Series implements host vendor spec if ic logs ( a ddresses 80h-9Fh) as read and write scratchpa ds, where the default value is zero (0). Intel SSD 525 Series does n ot write any specific values to these logs unles s d ir ected by the host throu gh the appropriate commands.

The Intel SSD 525 Series also implements a device vendor specific log at address A9h as a read-only log area with a defa ult value of zero (0) .

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Table 12. Device Statistics Log

Equivalent SMART attribute if

applicable

0x00

List of Supported Pages

0x08

Power Cycle Count

0Ch

0x10

Power-On Hours

09h

0x18

Logical Sectors Written

E1h

0x08

Num Reported Uncorrectable Errors

BBh

Acceptance and Completion

0x08

Num Hardware Resets

0x10

Num ASR Events

0x18

Num Interface CRC Errors

exceed their expected lifetime.

5.5 Device Statistics

In addition to the S M ART attribute struc ture, statistics p ertaining to the operation and health of the Intel SSD 525 Series can be reported to the host on request through the Device Statistics log as defined in the AT A specification.

The Device Statistics log is a read-only G PL/SMART log located at read log addre s s 0x04 and is accessible using READ LOG EXT, READ LOG DMA EXT or SMART READ LOG commands.

Table 12 lists the Devic e Statistics support e d b y the Intel SSD 525 Series .

Page Offset Description

0x01 - General Statistics

0x28 Logical Sectors Read F2h

0x04 - General Errors Statistics

0x06 - Transport Statistics

0x07 - Solid State Device Statistics 0x08 Percentage Used Endurance Indi c ato r

0x10

Num Resets Between Command

E9h

This statistic counts up from 0

rather than down from 100, and

may go beyond 100 for drives that

5.6 SMART Command Transport (SCT)

With SMART Command Transport (SCT), a host can send commands and data to an SSD and receive status and data from an SSD using standard write/read commands to manipulate two SMART Logs:

• Log Address E0h ("SCT Command/Status") — used to send commands and retrieve status

• Log Address E1h ("SCT Data Transfer") — used to transport data

5.7 Data Set Management Command Set

The Intel SSD 525 Series supports the Data Set Management command set Trim attribute, which consists of:

• DATA SET MANAGEMENT

5.8 Host Protected Area Command Set

The Intel SSD 525 Series supports the Host Pr otected Area comm and set, which consis ts of:

• READ NATIVE MAX ADDRESS

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Intel® Solid-State Drive 525 Series

• SET MAX ADDRESS

• READ NATIVE MAX ADDRESS EXT

• SET MAX ADDRESS EXT

5.9 48-Bit Address Command Set

The Intel SSD 525 Series supports the 48-bit Address command set, which consists of:

• FLUSH CACHE EXT

• READ DMA EXT

• READ NATIVE MAX ADDRESS

• READ NATIVE MAX ADDRESS EXT

• READ SECTOR(S) EXT

• READ VERIFY SECTOR(S) EXT

• SET MAX ADDRESS EXT

• WRITE DMA EXT

• WRITE MULTIPLE EXT

• WRITE SECTOR(S) EXT

5.10 General Purpose Log Command Set

The Intel SSD 525 Series supports the General Purpose Log command set, which consists of:

• READ LOG EXT

• WRITE LOG EXT

• READ LOG DMA EXT

• WRITE LOG DMA EXT

5.11 Native Command Queuing

The Intel SSD 525 Series supports the Native Command Queuing (NCQ) command set, w hich includes:

• READ FPDMA QUEUED

• WRITE FPDMA QUEUED

Note: With a maximum queue depth equal to 32.

5.12 Software Settings Preservation

The Intel SSD 525 Series supports the SET FEATURES pa r a m eter to en a ble/disable the preservation of software settin g s .

5.13 SATA Link Power Management (LPM)

The Intel SSD 525 Series supports the SET FEATURES pa r a m eter to en a ble Device Initiated Power Management (DIPM). The SSD also supports Host Initiated Power Management (HIPM).

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Intel® Solid-State Drive 525 Series

Table 13. Device Certifications and Declarations

substances.

Part 1: General Requirements)

harmonized with CISPR 22: 2005.04.

Research Laboratory (RRL) Ministry of Information and Communication Republic of Korea.

Microsoft WHCK

Microsoft Windows Hardware Certification Kit

computers or facsim ile.

halogenated flame retardants and/or PVC may not be better for the environment.

6.0 Certifications and Declarations

Table 13 describes the Devic e Certifications supported by th e Intel SSD 525 Series.

Certification Description

Low Voltage DIRECTIVE 2006/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCI L

CE Compliant

UL Certified

of 12 December 2006, and EMC Directive 2004/108/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 15 December 2004. Per EN 50581:2012 – Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous

Certified Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd Edition, 2007-03-27 (Information Technology Equipment - Safety - Part 1: General Requirements)

CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Information Technology Equipment - Safety -

C-Tick Compliant

BSMI Compliant

KCC

RoHS Compliant Restriction of Hazardous Substance Directive

VCCI

SATA-IO Indicates certified logo program from Serial ATA International Organization.

Low Halogen

Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA).

Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment - Radio disturbance Characteristics - limits and methods of measurement, as amended on June 1, 2006, is

Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control Regulation and meets the Electromagnetic Compatibility (EMC) Framework requirements of the Radio

Voluntary Control Council for Interface to cope with disturbance problems caused by personal

Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of

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Table 14. Standards References

Method (JESD218)

documents/docs/jesd218/

for material description datasheet

June 2009

Serial ATA Revision 3.0

http://www.sata-io.org/

July 2011

Serial ATA Revision 3.1 (mSATA definition)

http://www.sata-io.org/

methods of measurement CISPR 22:1997 (Modified)

Table 15. Glossary of Terms and Acrony m s

Intel® Solid-State Drive 525 Series

7.0 References

Table 14 identifies the standards information referenced in this document.

Date or

Rev. #

Sept 2010

Dec 2008 VCCI http://www.vcci.jp/vcci_e/

June 2009 RoHS

August 2009 ACS-2 Specification http://www.t13.org/

Oct 2010 JEDEC Solid-State Product Outline – mSATA SSD Assembly http://www.jedec.org/

Solid-State Drive (SSD) Requirements a nd Endurance Test

Compliance with EN 55022:1998 Information technology equipment - Radio disturbance characteristics - Limits and

Title Location

http://www.jedec.org/standards-

http://qdms.intel.com/ Click Search MDDS Database and search

http://www.iec.ch/

8.0 Terms and Acronyms

Table 15 defines the terms and acronyms used in this document.

Term Definition

ATA Advanced Technology Attachment

DAS Device Activity Signal

DIPM Device Initiated Power Management

DMA Direct Memory Access

EXT Extended

FPDMA First Party Direct Memory Access

HDD Hard Disk Drive

HIPM Host Initiated Power Management

Gigabyte (1,000,000,000 bytes) Note: The total usable capacity of the SSD may be less than the total physical capacity because a

small portion of the capacity is used for NAND flash management and maintenance purposes.

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Table 15. Glossary of Terms and Acrony m s

Term Definition

I/O

Input/Output

Kilobyte (1,024 bytes)

LPM

Link Power Management

MLC

Multi-level Cell

NCQ

Native Command Queuing

PIO

Programmed Input/Output

RMS

Root Mean Squared

SMART

Self-Monitoring, Analysis and Reporting Technology

TYP

Typical

active workloads.

December 2012

001

Initial release.

IOPS Input/Output Operations Per Second

LBA Logical Block Address

MB Megabyte (1,000,000 bytes)

MTBF Mean Time Between Failures

Intel® Solid-State Drive 525 Series

NOP No Operation

RDT Reliability Demonstration Test

SATA Serial Advanced Technology Attachment

SSD Solid-State Drive

UBER Uncorrectable Bit Error Rate

9.0 Revision History

Date Revision Description

Added 90GB SKU. Added Altitude specification. Removed number read/write commands

March 2013 002

device statistics beca u se not supported. Added new design-in power specifications for

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Table 16. Returned Sector Data

F = Fixed

X = Both

0040h

General configuration bit-significant information

1 X 3FFFh

Obsolete - Number of logical cylinders (16,383)

2 V C837h

Specific configuration

3 X 0010h

Obsolete - Number of logical heads (16)

4-5 X 0h

Retired

6 X 003Fh

Obsolete - Number of logical sectors per log ic al track (63)

(CFA)

9 X 0h

Retired

10-19 F varies

Serial number (20 ASCII characters)

20-21 X 0h

Retired

22 X 0h

Obsolete

23-26 F varies

Firmware revision (8 ASCII characters)

27-46 F varies

Model number (Intel® Solid-State Drive)

multiple commands

48 F 4000h

Reserved

49 F 2F00h

Capabilities

50 F 4000h

Capabilities

51-52 X 0h

Obsolete

53 F 0007h

Words 88 and 70:64 valid

54 X 3FFFh

Obsolete - Number of logical cylinders (16,383)

55 X 0010h

Obsolete - Number of logical heads (16)

56 X 003Fh

Obsolete - Number of logical sectors per logical track (63 )

57-58 X 00FBFC10h

Obsolete

commands

Intel® Solid-State Drive 525 Series

Appendix: IDENTIFY DEVICE Command Data

Table 16 details the sector data returned after issuing an IDENTIFY DEVICE command.

Word

V = Variable

Default Value Description

7-8 V 0h

Reserved for assignment by the CompactFlas h* A ssocia tio n

47 F 8010h

59 V 0110h

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7:0—Maximum number of sectors transferred per interrupt on

Number of sectors transferred per interr up t on multiple

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Intel® Solid-State Drive 525 Series

Table 16. Returned Sector Data

F = Fixed

X = Both

60-61 F varies

Total number of user-addressable sectors

62 X 0h

Obsolete

63 F 0007h

Multi-word DMA modes supported/selected

64 F 0003h

PIO modes supported

65 F 0078h

Minimum multiword DMA transfer cycle time per word

time

67 F 0078h

Minimum PIO transfer cycle time without flow contro l

68 F 0078h

Minimum PIO transfer cycle time with IORDY flow contro l

69 F 4010h

Additional Supported

71-74 F 0h

Reserved for IDENTIFY PACKET DEVICE command

75 F 001Fh

Queue depth

76 F 070Eh

Serial ATA capabilities

77 F 0006h

Reserved for future Serial ATA definition

78 F 004Ch

Serial ATA features supported

79 V 0040h

Serial ATA features enabled

80 F 03FCh

Major version number

81 F FFFFh

Minor version number

82 F 746Bh

Command set supported

83 F 7429h

Command sets supported

84 F 6163h

Command set/feature supported extens ion

7469h

Command set/feature enabled

B409h

Command set/feature enabled

6163h

Command set/feature default

207Fh

Ultra DMA Modes

89 F 0002h

Time required for security erase unit completion

90 F 0001h

Time required for enhanced security erase completion

Word

66 F 0078h

70 F 0h Reserved

V = Variable

Default Value Description

Manufacturer’s recommended multiword DMA transfer cycle

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Table 16. Returned Sector Data

F = Fixed

X = Both

91 V 00FEh

Current advanced power management value

92 V FFFEh

Master Password Revision Code

shall change only during the execution of a hardwar e res e t

94 V 0h

Vendor’s recommended and actual acoustic manage me nt value

95 F 0h

Stream minimum request size

96 V 0h

Streaming transfer time - DMA

97 V 0h

Streaming access latency - DMA and PIO

98-99 F 0h

Streaming performance granularity

100-103

varies

Maximum user LBA for 48-bit address feature set

104 V 0h

Streaming transfer time - PIO

105 F 0001h

Reserved

106 F 4000h

Physical sector size / logical sector siz e

107 F 0h

Inter-seek delay for ISO-7779 acoustic testing in microseconds

108-111 F varies

Unique ID

112-115 F 0h

Reserved for world wide name extension to 128 bits

116 V 0h

Reserved for technical report

117-118 F 0h

Words per logical sector

119 F 401Ch

Supported settings

120 F 401Ch

Command set/feature enabled/suppor te d

121-126 F 0h

Reserved

127 F 0h

Removable Media Status Notification f e ature set support

128 V 0021h

Security status

129-159 X varies

Vendor-specific

160

CompactFlash Association (CFA) power mode 1

161-168 X 0h

Reserved for assignment by the CFA

170-173 F 0h

Addit io nal Product Ident ifier

Intel® Solid-State Drive 525 Series

Word

V = Variable

Default Value Description

93 F 0h

Hardware reset result: the contents of bits (12:0) of this word

169 X 0001h Data set management Trim attribute support

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Table 16. Returned Sector Data

F = Fixed

X = Both

176-205 V 0h

Current media serial number

206 X 0021h

SCT Command Transport

207-208 X 0h

Reserved

210-211 X 0h

Write-Read-Verify Sector Count Mode 3 (DWord)

212-213

Write-Read-Verify Sector Count Mode 2 (DWord)

214 X 0h

NV Cache Capabilities

217 X 0001h

Nominal media rotation rate

218

Reserved

219 X 0h

NV Cache Options

221 X 0h

Reserved

223 X 0h

Transport minor version number

230-233 X 0h

Extended Number of User Addressable Sectors (QWord)

command for m ode 03h

236-254 X 0h

Reserved

Word

174-175 F 0h Reserved

209 X 4000h Alignment of lo gical blocks within a physical block

215-216 X 0h NV Cache Size in Logical Blocks (DWord)

220 X 0h Write-Read-Verify feature set

V = Variable

Default Value Description

222 X 103Fh Transport major version number

224-229 X 0h Reserved

234 X 0002h

235 X 0400h

255 X varies Integrity word

Notes:

F = Fixed. The content of the word is fixed a nd does not change. For removable media devic es, these values may change when V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the X = F or V. The content of the word may be fixed or variable.

media is removed or changed. commands executed by the device.

Minimum number of 512-byte data blocks per DOWNLOAD MICROCODE command for m ode 03h

Maximum number of 512-byte data blocks per DOWNLOAD MICROCODE

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