Intel SR1500 - AXXMINIDIMM DDR-2 RAID Controller Cache Memory, SR2500, SR2500AL User Manual

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Intel® Server Chassis SR2500

Intel

Technical Product Specification

Server System SR2500AL

Intel order number D31980-009

Revision – 1.6

November 2008

Enterprise Platforms and Services Division – Marketing

Revision History Intel® Server System SR2500AL

Revision History

Date Revision

Number

June 2006 1.0 Initial release.

August 2006 1.1 Updated Active Midplane Diagram.

Updated single power supply population rules. Updated fan numbering orientation.

January 2007 1.2 Updated ASR2500FHR population table.

Updated figure 16. Updated regulatory section.

February 2007 1.3 Updated power supply illustrations to show proper placement when using only

one power supply.

August 2007 1.4 Updated figure 18 to reflect proper fan circuitry. Edited processor support and

platform control section.

October 2007 1.5 Updated Power Sub-System. Updated Table 54.

November 2008 1.6 Add introduction of Midplane2

Modifications

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL Disclaimers

Disclaimers

Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel® Server System SR2500AL may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

This document and the software described in it is furnished under license and may only be used or copied in accordance with the terms of the license. The information in this manual is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by Intel Corporation. Intel Corporation assumes no responsibility or liability for any errors or inaccuracies that may appear in this document or any software that may be provided in association with this document.

Except as permitted by such license, no part of this document may be reproduced, stored in a retrieval system, or transmitted in any form or by any means without the express written consent of Intel Corporation.

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Table of Contents Intel® Server System SR2500AL

Table of Contents

1. Product Overview.................................................................................................................1

1.1 Chassis Views .........................................................................................................1

1.2 Chassis Dimensions................................................................................................2

1.3 System Components ...............................................................................................2

1.4 System Boards ........................................................................................................3

1.5 Control Panel Options..............................................................................................4

1.6 Hard Drive and Peripheral Bays ..............................................................................7

1.7 Power Sub-system...................................................................................................7

1.8 System Cooling........................................................................................................8

1.9 Chassis Security......................................................................................................8

1.10 Rack and Cabinet Mounting Options.......................................................................8

1.11 Front Bezel Features...............................................................................................9

2. Power Sub-System.............................................................................................................11

2.1 Mechanical Overview.............................................................................................11

2.2 Single Power Supply Module Population...............................................................12

2.3 Handle and Retention Mechanism.........................................................................12

2.4 Hot-swap Support..................................................................................................12

2.5 Airflow....................................................................................................................13

2.6 AC Power Cord Specification Requirements.........................................................13

2.7 Output Cable Harness...........................................................................................13

2.7.1 P1 – Server Board Power Connector ....................................................................14

2.7.2 P2 – Processor Power Connector .........................................................................14

2.7.3 P3 – Power Signal Connector................................................................................15

2.7.4 P4 – Backplane Power Connector.........................................................................15

2.7.5 P5 Mid-plane Power Connector.............................................................................15

2.8 AC Input Requirements .........................................................................................15

2.8.1 Efficiency ...............................................................................................................16

2.8.2 AC Input Voltage Specification..............................................................................16

2.8.3 AC Line Dropout / Holdup......................................................................................16

2.8.4 AC Line 5 VSB Holdup ..........................................................................................16

2.8.5 AC Inrush...............................................................................................................17

2.9 Protection Circuits..................................................................................................17

2.9.1 Over-Current Protection (OCP)..............................................................................17

2.9.2 Over-Voltage Protection (OVP) .............................................................................17

2.9.3 Over-Temperature Protection (OTP) .....................................................................18

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2.10 DC Output Specification ........................................................................................18

2.10.1 Output Power / Currents........................................................................................18

2.10.2 Standby Output / Standby Mode............................................................................18

2.11 Power Supply Status LED .....................................................................................19

3. Cooling Sub-System ..........................................................................................................20

3.1 Non-redundant Fan Module...................................................................................21

3.2 Redundant System Fan Module ............................................................................23

3.3 Air Flow Support....................................................................................................25

3.3.1 Power Supply Zone ...............................................................................................25

3.3.2 Full Height Riser Zone...........................................................................................25

3.3.3 CPU / Memory / Low Profile PCI Zone ..................................................................26

3.4 Drive Bay Population.............................................................................................26

4. Platform Control.................................................................................................................27

4.1 Overview................................................................................................................27

5. System Board Interconnects.............................................................................................28

5.1 Mid-plane...............................................................................................................28

5.2 Bridge Board..........................................................................................................36

5.3 Hot-Swap SATA/SAS Backplane...........................................................................36

6. Peripheral and Hard Drive Sub-System............................................................................44

6.1 Slimline Drive Bay..................................................................................................44

6.2 Hard Drive Bays.....................................................................................................46

6.2.1 Hot-swap Drive Trays ............................................................................................46

6.3 Optional Tape Drive or 6th Hard Drive Flex Bay.....................................................47

6.4 Mid-plane Options..................................................................................................48

6.4.1 Passive Mid-plane .................................................................................................48

6.4.2 Active Mid-plane with SAS /SAS RAID Support ....................................................49

6.4.3 Active Midplane2 with SAS/SAS RAID Support.....................................................49

6.5 Hot-Swap SAS/SATA Backplane...........................................................................52

6.5.1 SAS/SATA Backplane Layout................................................................................53

6.5.2 SAS/SATA Backplane Functional Architecture......................................................55

7. Standard Control Panel .....................................................................................................57

7.1 Control Panel Buttons...........................................................................................57

7.2 Control Panel LED Indicators ................................................................................58

7.2.1 Power / Sleep LED ................................................................................................60

7.2.2 System Status LED................................................................................................60

7.2.3 Drive Activity LED..................................................................................................61

7.2.4 System Identification LED......................................................................................61

7.3 Control Panel Connectors......................................................................................62

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Table of Contents Intel® Server System SR2500AL

7.4 Internal Control Panel Interconnect.......................................................................63

8. Intel® Local Control Panel..................................................................................................65

8.1 LED Functionality...................................................................................................66

8.1.1 Power / Sleep LED ................................................................................................67

8.1.2 System Status LED................................................................................................67

8.1.3 Drive Activity LED..................................................................................................68

8.1.4 System Identification LED......................................................................................68

8.2 Intel® Local Control Panel Interconnects ...............................................................69

9. PCI Riser Cards and Assembly.........................................................................................71

9.1 Riser Card Options................................................................................................72

9.2 PCI Riser Card Mechanical Drawings ...................................................................73

10. Supported Intel® Server Boards........................................................................................77

10.1 Intel® Server Board S5000PAL / S5000XAL Feature Set......................................77

10.1.1 Processor Support.................................................................................................79

11. Environmental and Regulatory Specifications...............................................................80

11.1 System Level Environmental Limits.......................................................................80

11.2 Serviceability and Availability.................................................................................80

11.3 Replacing the Back up Battery ..............................................................................81

11.4 Product Regulatory Compliance............................................................................82

11.5 Use of Specified Regulated Components..............................................................82

11.6 Electromagnetic Compatibility Notices ..................................................................84

11.6.1 USA .......................................................................................................................84

11.6.2 FCC Verification Statement...................................................................................85

11.6.3 ICES-003 (Canada)...............................................................................................85

11.6.4 Europe (CE Declaration of Conformity) .................................................................85

11.6.5 Japan EMC Compatibility ......................................................................................85

11.6.6 BSMI (Taiwan).......................................................................................................86

11.6.7 RRL (Korea)...........................................................................................................86

11.6.8 CNCA (CCC-China)...............................................................................................86

11.7 Product Ecology Compliance.................................................................................87

11.8 Other Markings......................................................................................................89

Appendix A: Chassis Integration and Usage Tips.................................................................91

Appendix B: POST Code Diagnostic LED Decoder...............................................................92

Appendix C: POST Error Beep Codes.....................................................................................96

Glossary.....................................................................................................................................97

Reference Documents..............................................................................................................98

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Intel® Server System SR2500AL List of Figures

List of Figures

Figure 1. Front View with Optional Bezel......................................................................................1

Figure 2. Front View without Bezel (Shown with Standard Control Panel Option) .......................1

Figure 3. Back View – (Shown with 1+1 Power Supply Configuration).........................................1

Figure 4. Major Chassis Components...........................................................................................2

Figure 5. Back Panel Feature Overview.......................................................................................3

Figure 6. Control Panel Modules ..................................................................................................4

Figure 7. Standard Control Panel Overview .................................................................................5

Figure 8. LCD Control Panel Overview.........................................................................................6

Figure 9. Front Panel Feature Overview.......................................................................................7

Figure 10. Optional Front Bezel....................................................................................................9

Figure 11. Front Bezel Supporting Standard Control Panel..........................................................9

Figure 12. Front Bezel Supporting Intel® Local Control Panel....................................................10

Figure 13. Mechanical Drawing for Dual (1+1 configuration) Power Supply Enclosure with PDM11

Figure 14. Power Supply Blank...................................................................................................12

Figure 15. Non-Redundant Fan Module .....................................................................................21

Figure 16. Non-Redundant Fan Header Assignments on Mid-plane..........................................22

Figure 17. Fan Module Assembly...............................................................................................23

Figure 18. Redudant Fan Header Assignments on Mid-plane....................................................24

Figure 19. CPU Air Duct with Air Baffle ......................................................................................26

Figure 20. Drive Blank ................................................................................................................26

Figure 21. Passive Mid-plane Board...........................................................................................28

Figure 22. SAS/SAS RAID Mid-plane Board ..............................................................................29

Figure 22. Active SAS/SAS RAID Midplane 2 Board..................................................................35

Figure 23. Bridge Board..............................................................................................................36

Figure 24. Hot-Swap SAS/SATA Backplane (Front Side View)..................................................37

Figure 25. Hot-Swap SAS/SATA Backplane (Back Side View) ..................................................37

Figure 26. Optional 6th Hard Drive (Front View)..........................................................................44

Figure 27. Slim-Line Optical Drive Assembly..............................................................................44

Figure 28. 50-pin Connector to Slimline Optical Device .............................................................45

Figure 29. Hard Drive Tray Assembly.........................................................................................46

Figure 30. Optional 6th Hard Drive (Front View)..........................................................................47

Figure 31. Optional Tape Drive (Front View)..............................................................................47

Figure 32. Passive Mid-plane Board...........................................................................................48

Figure 33. Active Mid-plane with SAS / SAS RAID Support .......................................................49

Figure 34. Architecture Overview................................................................................................51

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List of Figures Intel® Server System SR2500AL

Figure 35. Hot-swap SAS/SATA Backplane (Front Side View) ..................................................53

Figure 36. Hot-swap SAS/SATA Backplane (Back Side View)...................................................54

Figure 37. SAS/SATA Backplane Functional Block Diagram .....................................................55

Figure 38. Standard Control Panel Assembly Module................................................................57

Figure 39. Control Panel Buttons................................................................................................57

Figure 40. Control Panel LEDs...................................................................................................58

Figure 41. Standard Control Panel PCB.....................................................................................63

Figure 42. Intel® Local Control Panel Assembly Module.............................................................65

Figure 43. Intel® Local Control Panel Overview..........................................................................65

Figure 44. Low Profile PCIe* Riser.............................................................................................71

Figure 45. Low Profile Passive PCI Express* Riser Card...........................................................73

Figure 46. Full Height PCI Express* Riser Card.........................................................................74

Figure 47. Full Height Passive PCI-X* Riser Card......................................................................75

Figure 48. Full Height Active PCI-X* Riser Card.........................................................................76

Figure 49. Intel® Server Board S5000PAL..................................................................................78

Figure 50. Intel® Server Board S5000PAL Components.............................................................79

Figure 51. Diagnostic LED Placement Diagram .........................................................................92

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Intel® Server System SR2500AL List of Tables

List of Tables

Table 1. Chassis Dimensions .......................................................................................................2

Table 2. Power Harness Cable Definitions.................................................................................13

Table 3. P1 Main Power Connector............................................................................................14

Table 4. P2 Processor Power Connector....................................................................................14

Table 5. P3 Power Signal Connector..........................................................................................15

Table 6. P4 Hot Swap Backplane Power Connector ..................................................................15

Table 7. P5 Mid-plane Power Connector...................................................................................15

Table 8. Efficiency......................................................................................................................16

Table 9. AC Input Rating.............................................................................................................16

Table 10. Over-Current Protection Limits / 240VA Protection ....................................................17

Table 11. Over-Voltage Protection (OVP) Limits ........................................................................18

Table 12. LED Indicators ............................................................................................................19

Table 13 Nonredundant Cooling Zones.....................................................................................21

Table 14. Non-redundant Fan Connector Pin Assingment........................................................22

Table 15. Nonredundant Fan Header Assignment ....................................................................23

Table 16 Redundant Cooling Zones..........................................................................................23

Table 17 Redundant Fan Connector Pin Assingment................................................................24

Table 18 Redundant Fan Header Assignment...........................................................................25

Table 19. 120-pin Server Board-to-Mid-plane Bridge Board Connector Pin-out.........................29

Table 20. Mid-plane Fan Header Pin-outs..................................................................................31

Table 21. Mid-plane Power Connector Pin-out...........................................................................31

Table 22. Mid-plane-to-Backplane Card Edge Connector #1 Pin-out.........................................32

Table 23. Mid-plane-to-Backplane Card Edge Connector #2 Pin-out.........................................33

Table 24. Active Mid-plane SAS RAID Battery Backup Connector Pin-out ................................34

Table 25. Passive Mid-plane SATA/SAS Connector Pin-outs ....................................................34

Table 26. 2x4 SAS/SATA Backplane Power Connector Pin-out (J7L2) .....................................38

Table 27. 1x7 6th HDD / Tape Drive Option Power Connector Pin-out (J2M1)..........................38

Table 28. 6th HDD Option SATA/SAS I/O Connector Pin-out (J4L1).........................................38

Table 29. 2x22 Slim-Line IDE Optical Drive Connector Pin-out (J5N1)......................................38

Table 30. Slim-Line Optical Drive Slot Connector (J1A1)...........................................................39

Table 31. IDE Device Master/Slave Configuration Jumper (J6L1) .............................................39

Table 32. I2C Connector (J6L3)..................................................................................................40

Table 33. PCIe X4 Slot Connector from Mid-plane (J4N1).........................................................40

Table 34. PCIe* X4 Slot Connector from Mid-plane (J6N1)........................................................41

Table 35. USB Floppy Drive Connector (J2A1) ..........................................................................41

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List of Tables Intel® Server System SR2500AL

Table 36. Intel® Local Control Panel (LCP) Connector (J9A1)...................................................42

Table 37. Control Panel Slot Connector (J9B1)..........................................................................42

Table 38. SAS/SATA Hard Drive Connector Pin-outs (J2C3, J2B1, J4C1, J4B1, J7C1)............43

Table 39. J1L1 50-pin Connector to Slimline Optical Device......................................................45

Table 40. Hard Drive LED Function Definitions..........................................................................56

Table 41. Hard Drive Activity LED Functionality.........................................................................56

Table 42. Control Button and Intrusion Switch Functions...........................................................58

Table 43. Control Panel LED Functions......................................................................................59

Table 44. SSI Power LED Operation..........................................................................................60

Table 45. Control Panel LED Operation .....................................................................................60

Table 46. External USB Connectors (J1B1) ...............................................................................62

Table 47. Video Connector (J1A1)..............................................................................................62

Table 48. 64-pin Control Panel Connector (J6B1)......................................................................64

Table 49. Control Panel LED Functions......................................................................................66

Table 50. SSI Power LED Operation..........................................................................................67

Table 51. Control Panel LED Operation .....................................................................................67

Table 52. 50-pin Control Panel Connector..................................................................................69

Table 53. Internal USB Header...................................................................................................70

Table 54. System Environmental Limits Summary .....................................................................80

Table 55. Product Safety & Electromagnetic (EMC) Compliance...............................................83

Table 56: POST Progress Code LED Example ..........................................................................92

Table 57. Diagnostic LED POST Code Decoder........................................................................93

Table 58. POST Error Beep Codes ............................................................................................96

Table 59. BMC Beep Codes.......................................................................................................96

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Intel® Server System SR2500AL 0BProduct Overview

1. Product Overview

The Intel® Server Chassis SR2500 is a 2U server chassis that is designed to support the Intel® Server Board S5000PAL. The server board and the chassis have features that are designed to support the high-density server market. This chapter provides a high-level overview of the chassis features. Greater detail for each major chassis component or feature is provided in the following chapters.

The chassis differs from previous generation products in that the majority of cables have been removed from the system and in their place are a series of board-to-board interconnects. The benefits of using board-to-board interconnects are simplification of platform integration and improved airflow for more reliable cooling.

A second significant change from the previous generation is the introduction of the mid-plane circuit board. There are two options for the mid-plane circuit board: the first option provides SAS RAID support. The second option is a passive SATA/SAS mid-plane that can be used with either the SATA only connectors from the server board, or SATA/SAS connectors from an addin card.

1.1 Chassis Views

TP02091

Figure 1. Front View with Optional Bezel

TP02092

Figure 2. Front View without Bezel (Shown with Standard Control Panel Option)

TP02093

Figure 3. Back View – (Shown with 1+1 Power Supply Configuration)

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0BProduct Overview Intel® Server System SR2500AL

1.2 Chassis Dimensions

Table 1. Chassis Dimensions

Height 87.30 mm 3.44” Width without rails 430 mm 16.93” Width with rails 451.3 mm 17.77” Depth without CMA 704.8 mm 27.75” Depth with CMA 838.2 mm 33.0” Max. Weight 29.5 kg 65 lbs

1.3 System Components

Figure 4. Major Chassis Components

A. Rack Handles H. CPU Air Duct B. SAS/SATA Backplane I. System Fan Assembly C. Air Baffles J. Standard Control Panel D. Power Distribution Module K. Flex Bay – 6 E. Power Supply Modules L. Hard Drive Bays F. Riser Card Assembly M. Slim-Line Optical Drive Bay G. System Memory N. Front Bezel (Optional)

HDD or Tape (Optional)

TP02094

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Intel® Server System SR2500AL 0BProduct Overview

The I/O connector locations on the back of the chassis are pre-cut, so the use of an I/O shield is not required. The supplied EMI gasket must be installed to maintain Electromagnetic Interference (EMI) compliance levels.

A B

A. Low Profile PCIe* Add-in Card Slots I. USB 6 B. Full Height PCI Add-in Card Slots J. USB 5 C. Upper Power Supply Module K. Video D. Upper Power Receptacle L. DB-9 Serial A Connector E. Lower Power Receptacle M. NIC 2 F. Lower Power supply Module N. NIC 1 G. Intel® Remote Management Module NIC (Optional) O. RJ45 Serial B Connector

H. Intel

I/O Expansion Module (Optional) P.

Figure 5. Back Panel Feature Overview

GH EF

PS2* Keyboard and Mouse Connectors

TP02095

1.4 System Boards

The complete system includes the use of several system boards which are used as internal interconnects and provide feature accessibility. The following provides a brief description for each.

• Bridge Board – PCB used to route signals from the server board to the mid-plane and control panel boards.

• Mid-plane – A PCB used to determine the desired hard drive interface for the system. Two mid-plane options are available for this system:

o Active SAS/SAS RAID – cable less solution with onboard SAS controller o Passive SATA – cabled to SATA ports on the server board or from add-in

adapter.

• Backplane – Hot swap backplane capable of supporting both SATA and SAS hard drives.

• Riser Cards – PCI riser cards used to provide up to five add-in card slots to the system. Available riser card options for this system include:

o Low profile, two slot PCI Express* o Full height, three slot PCI-X* (passive) o Full height, three slot PCI-X (active) with onboard PXH PCI bridge chip o Full height, two PCI Express slots + one PCI-X slot

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• Optical Drive Interposer Card – Used to interface optical drive with 44-pin IDE cable as cabled from the server board.

• Control Panel – A PCB providing system status and control functionality features. Two control panel options are available for this system

o Standard Control Panel o Intel

Local Control Panel with LCD support

• RAID Activation Keys – The system provides different RAID options depending on the mid-plane option selected. Two RAID Activation Keys are available for this system

o Hardware RAID Activation Key – Used on the Active SAS/SAS RAID Mid-plane

to enable hardware RAID support.

o Software SATA RAID 5 Activation Key – This RAID key plugs into a connector on

the server board. It is used to enable the software SATA RAID 5 functionality of the Intel

6321ESB I/O Controller Hub SATA ports of the server board when

cabled to the passive mid-plane.

1.5 Control Panel Options

The chassis can support either of two control panels: a Standard Control Panel and an Intel® Local Control Panel with LCD support. The control panel assemblies are pre-assembled and modular in design. The entire module assembly slides into a predefined slot in the front of the chassis.

Figure 6. Control Panel Modules

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The standard control panel supports several push buttons and status LEDs, along with USB and video ports to centralize system control, monitoring, and accessibility. The following diagram overviews the layout and functions of the control panel.

BA F GEDC

L JK

TP02098

Figure 7. Standard Control Panel Overview

A. NIC #2 Activity LED G. System Identification LED B. NIC #1 Activity LED H. System Identification Button C. Power / Sleep Button I. System Reset Button D. Power / Sleep LED J. USB 2.0 Connector E. Hard Drive Activity LED K. Recessed NMI Button (Tool Required) F. System Status LED L. Video Connector

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The Intel® Local Control Panel utilizes a combination of control buttons, LEDs, and an LCD display to provide system accessibility, monitoring, and control functions. The following diagram provides an overview of this control panel.

C D E

O M L K J HIN G

TP02099

Figure 8. LCD Control Panel Overview

A USB 2.0 Port I Power/Sleep Button B LCD Display J System Status LED C Menu Control Button, Scroll up K NIC 2 Activity LED D Menu Control Button, Scroll down L NIC 1 Activity LED E Menu Control Button, Scroll left M Hard Disk Drive Activity LED F Menu Control Button, Enter N Reset Button G System Identification LED O USB 2.0 Port H Power/Sleep LED

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1.6 Hard Drive and Peripheral Bays

The chassis is designed to support several different hard drive and peripheral configurations. The system includes a hot swap backplane capable of supporting either SAS or SATA drives. The sixth bay (see letter “B” in the figure below) can optionally be configured to support a sixth hard drive or 3.5” tape drive.

A C

Figure 9. Front Panel Feature Overview

A. Slimline Optical Drive Bay B. 6th HDD Drive or Tape Drive Bay (Optional) C. System Control Panel D. 3.5” Hard Drive Bays (5)

1.7 Power Sub-system

TP02096

The power subsystem of the chassis consists of an integrated power distribution board and module enclosure which is capable of housing up to two 750 Watt power supply modules supporting 1+0 or redundant 1+1 power configurations. In a 1+1 redundant configuration, each power supply module is hot-swappable should one fail.

The power sub-system has several integrated management features including:

• Status LED on each power module

• Over-temperature protection circuitry

• Over-voltage protection circuitry

With the addition of server management software, the power subsystem is capable of supporting several system management features including:

• Remote Power On/Off

• Status Alerting

• FRU Information Reporting

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Each power supply module operates within the following voltage ranges and ratings:

Start-up

PARAMETER MIN RATED MAX

Line Voltage (110) Line Voltage (220) Frequency 47 Hz 50/60Hz 63 Hz

1 Maximum input current at low input voltage range shall be measured at 90Vac, at max load. 2 Maximum input current at high input voltage range shall be measured at 180VAC, at max load.

90V

100-127 V

rms

180V

200-240 V

rms

140V

rms

264V

rms

- - 6.0 A

rms

Vac

85Vac ±4Vac

Power

Off

Vac

75Vac ±5Vac

Max Input

AC Current

1,3

12 A

11.0A

rms

2,3

rms

Max Rated

Input AC

5.5A

3 This is not to be used for determining agency input current markings.

4 Maximum rated input current is measured at 100VAC and 200VAC.

1.8 System Cooling

The chassis is offered with two system cooling options. The first option is a three fan solution providing sufficient airflow to maintain internal system thermal requirements when the external ambient temperature remains within specified limits. The second option is a 5+1 fan configuration. Refer to section 3.2 for details. Should a single fan failure occur, this option provides support for hot-swap fans and fan redundancy.

In addition to the system fan options, each power supply module installed provides two additional non-redundant fans which pull air from inside the chassis out the back.

Current

rms

1.9 Chassis Security

The chassis provides support for a lockable front bezel which prevents unauthorized access to the system control buttons and hard drives. In addition, a chassis intrusion switch is provided allowing server management software to monitor removal of the top cover from the chassis.

1.10 Rack and Cabinet Mounting Options

The chassis was designed to support 19” wide by up to 30” deep server cabinets. The chassis supports three rack mount options:

o A fixed mount relay rack / cabinet mount kit (Product order code - AXXBRACKETS ) which

can be configured to mount the system into either a 2-post rack or 4-post cabinet

o A tool-less full extracting slide rail kit (Product order code – AXXHERAIL) designed to

support an optional cable management arm (Product order code – AXXRACKCARM).

o A basic slide rail kit (Product order code – AXXBASICRAIL) designed to mount the chassis

into a standard (19” by up to 30” deep) EIA-310D compatible server cabinet.

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1.11 Front Bezel Features

The optional front bezel is made of molded plastic and uses a snap-on design. When installed, its design allows for maximum airflow to maintain system cooling requirements.

TP02100

Figure 10. Optional Front Bezel

Separate front bezels are available to support systems that use either a standard control panel or the Intel

Local Control Panel with LCD support.

When the standard control panel is used, light pipes on the backside of the front bezel allow the system status LEDs to be monitored with the front bezel in the closed position. The front bezel lock is provided to prevent unauthorized access to hard drives, peripheral devices and the control panel.

TP02101

Figure 11. Front Bezel Supporting Standard Control Panel

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When the local control panel is used, the control panel module can be adjusted to extend further out from the chassis face to allow the LCD panel to protrude from the front bezel.

AF000054

Figure 12. Front Bezel Supporting Intel

Local Control Panel

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Intel® Server System SR2500AL 1BPower Sub-System

2. Power Sub-System

The power sub-system of the chassis consists of an integrated Power Distribution Module (PDM), a power module enclosure, and support for up to two 750 Watt power supply modules. The power sub-system can be configured to support a single module in a 1+0 non-redundant configuration, or dual modules in a 1+1 redundant power configuration. In a 1+1 configuration, a single failed power module can be hot-swapped with the system running. Either configuration will support up to a maximum of 750 Watts of power.

This chapter provides technical details to the operation of the power supply module and power sub-system.

2.1 Mechanical Overview

The drawing below displays the Power Distribution Module and the power supply module enclosure assembly.

FLANGE DETAILS TDB

106.0 +/- 0.5

106.0 +/- 0.5 MODULE

MODULE

83.5 +/- 0.5

83.5 +/- 0.5 CAGE

CAGE

40.0 +/- 0.5

(100)

400 +/- 1.0

300 +/- 0.5

MAX TBD

109.0 +/- 0.5

109.0 +/- 0.5 CAGE

CAGE

40.0 +/- 0.5 MODULE

MODULE

Figure 13. Mechanical Drawing for Dual (1+1 configuration) Power Supply Enclosure with PDM

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2.2 Single Power Supply Module Population

In single power module configurations, server management firmware requires that the power supply module be populated in the top power module slot. The non-operating slot must have the power supply blank installed.

AF000023

Figure 14. Power Supply Blank

Configuring a single power supply module in the bottom location will cause the server management firmware and BIOS to generate a system error during POST and the error will be reported to the System Event Log (SEL).

2.3 Handle and Retention Mechanism

Each power supply module includes a handle for module insertion to or removal from the module enclosure. Each module has a simple retention mechanism to hold the power module in place once it is inserted. This mechanism will withstand the specified platform mechanical shock and vibration requirements. The tab on the retention mechanism is colored green

to indicate it is a hot-swap touch point. The latch mechanism is designed to prevent insertion or removal of the module with the power cord plugged in. This will aid the hot-swapping procedure.

2.4 Hot-swap Support

Hot-swapping a power supply module is the process of extracting and re-inserting a power supply module from an operating power system. During this process the output voltages shall remain within specified limits. Up to two power supply modules may be on a single AC line. The power supply module can be hot-swapped by the method listed below.

Extraction: on removal, the power cord is unplugged first, and then the power module is removed. This can be done in standby mode or power-on mode.

Insertion: The module is inserted first, and then the power cord is plugged in. If powered off, the system and the power supply will power on into standby mode or power-on mode.

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2.5 Airflow

Each power supply module incorporates two non-redundant 40mm fans for self cooling and partial system cooling. The fans will provide no less than 10 CFM airflow through the power supply when installed in the system and operating at maximum fan speed. The cooling air will enter the power module from the PDB side (pre-heated air from the system).

2.6 AC Power Cord Specification Requirements

The AC power cord used must meet the following specification requirements:

Cable Type SJT Wire Size 16 AWG Temperature Rating 105º C Amperage Rating 13A Voltage Rating 125V

2.7 Output Cable Harness

The power distribution board provides a cable harness providing connectors to the various system boards. The harness size, connectors, and pin outs are shown below. Listed or recognized component appliance wiring material (AVLV2), CN, rated 105 shall be used for all output wiring.

Table 2. Power Harness Cable Definitions

Length

90, 90° angle 115, 90° angle

100 P3 1x5 Server Board Signal Connector 150 P4 2x4 Backplane Power Connector 220 P5 2x5 Mid-plane Power Connector

connector #

P1 2x12 Main Power Connector P2 2x4 Processor Power Connector

No of

pins

Description

°C min, 300Vdc min

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2.7.1 P1 – Server Board Power Connector

Connector housing: 24- Pin Molex* Mini-Fit Jr. 39-01-2245 or equivalent Contact: Molex Mini-Fit, HCS, Female, Crimp 44476 or equivalent

Table 3. P1 Main Power Connector

PIN SIGNALS 18 AWG COLOR PIN SIGNAL

1 +3.3 VDC Orange 13 +3.3 VDC Orange 2 +3.3 VDC Orange 14 3 COM (GND) Black 15 COM Black

4 5 VDC Red 16 PS_ON# Green

5V RS Red (24 AWG) 17 COM Black 5 COM Black 18 COM Black 6 +5 VDC Red 19 COM Black 7 COM Black 20 8 PWR OK Gray 21 +5 VDC Red 9 5Vsb Purple 22 +5 VDC Red

10 +12 V3 Yellow/Blue 23 +5 VDC Red 11 +12 V3 Yellow/Blue 24 COM Black 12 +3.3 VDC Orange

-12 VDC

Reserved (-5V in ATX) N.C.

2.7.2 P2 – Processor Power Connector

Connector housing: 8- Pin Molex 39-01-2085 or equivalent Contact: Molex

44476-1111 or equivalent

18 AWG

COLORS

Blue

PIN SIGNAL 18 AWG COLORS PIN SIGNAL 18 AWG COLORS

1 COM Black 5 +12 V1 Yellow 2 COM Black 6 +12 V1 3 COM Black 7 +12 V2 4 COM Black 8 +12 V2

Revision – 1.6

Table 4. P2 Processor Power Connector

Yellow Yellow/Black Yellow/Black

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2.7.3 P3 – Power Signal Connector

Connector housing: 5-pin Molex 50-57-9705 or equivalent Contacts: Molex 16-02-0087 or equivalent

Table 5. P3 Power Signal Connector

PIN SIGNAL 24 AWG COLORS

1 I2C Clock (SCL) White/Green 2 I2C Data (SDL) White/Yellow 3 SMBAlert# White 4 ReturnS Black 5 3.3RS White/Brown

2.7.4 P4 – Backplane Power Connector

Connector housing: 8 Pin Molex Mini-Fit Jr. PN# 39-01-2245 or equivalent Contact: Molex Mini-Fit, HCS, Female, Crimp 44476 or equivalent

Table 6. P4 Hot Swap Backplane Power Connector

PIN SIGNAL 18 AWG COLORS PIN SIGNAL 18 AWG COLORS

1 COM Black 5 +12 V4 Yellow/Green 2 COM Black 6 +12 V4 Yellow/Green 3 +5V Red 7 +5Vsb Purple 4 +5V Red 8 +3.3V Orange

2.7.5 P5 Mid-plane Power Connector

Connector housing: 10 Pin Molex Mini-Fit Jr. 43025-1000 or equivalent Contact: Molex Mini-Fit, HCS, Female, Crimp 43030-0007 or equivalent

Table 7. P5 Mid-plane Power Connector

PIN SIGNAL 20 AWG Colors PIN SIGNAL 20 AWG Colors

1 COM Black 6 +12 V4 Yellow/Green 2 COM Black 7 +12 V4 Yellow/Green 3 +5V Red 8 +12 V4 Yellow/Green 4 +3.3V Orange 9 +12 V4 Yellow/Green 5 COM Black 10 +5Vsb Purple

2.8 AC Input Requirements

The power supply module incorporates universal power input with active power factor correction, which reduces line harmonics in accordance with the EN61000-3-2 and JEIDA MITI standards.

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2.8.1 Efficiency

The following table provides the required minimum efficiency level at various loading conditions. These are provided at three different load levels; 100%, 50% and 20%. Efficiency is tested over an AC input voltage range of 115VAC to 220VAC.

Table 8. Efficiency

Loading 100% of maximum 50% of maximum 20% of maximum

Recommended Efficiency ~80% ~83% ~78%

2.8.2 AC Input Voltage Specification

The power supply must operate within all specified limits over the input voltage range shown in the following table.

Table 9. AC Input Rating

Start-up

PARAMETER MIN RATED MAX

Line Voltage (110)

Line Voltage (220) Frequency 47 Hz 50/60Hz 63 Hz

90V

100-127 V

rms

180V

200-240 V

rms

140V

rms

264V

rms

Vac

85Vac ±4Vac

Notes:

1. Maximum input current at low input voltage range shall be measured at 90Vac, at max load.

2. Maximum input current at high input voltage range shall be measured at 180VAC, at max load.

3. This is not to be used for determining agency input current markings.

4. Maximum rated input current is measured at 100VAC and 200VAC.

Harmonic distortion of up to 10% of the rated AC input voltage must not cause the power supply to go out of specified limits. The power supply shall power off at or below 75Vac ±5Vac. The power supply shall start up at or above 85VAC ±4Vac. Application of an input voltage below 85VAC shall not cause damage to the power supply or blow a fuse.

Power

Off

Vac 75Vac ±5Vac

Max Input

AC Current

rms

1,3

2,3

12 A

6.0 A

Max Rated

Input AC

11.0A

5.5A

Current

rms

2.8.3 AC Line Dropout / Holdup

An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC line for any length of time. During an AC dropout of one cycle or less the power supply must meet dynamic voltage regulation requirements over the rated load. If the AC dropout lasts longer than one cycle the power supply should recover and meet all turn-on requirements. The power supply must meet the AC dropout requirement over rated AC voltages, frequencies, and output loading conditions. Any dropout of the AC line shall not cause damage to the power supply.

20ms Min when tested under the following conditions: Max combined load = 525W, 12ms Min when tested under the following conditions: Max combined load = 750W

2.8.4 AC Line 5 VSB Holdup

The 5VSB output voltage should stay in regulation under its full load (static or dynamic) during an AC dropout of 70ms min (=5VSB holdup time) whether the power supply is in ON or OFF state (PSON asserted or de-asserted).

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2.8.5 AC Inrush

AC line inrush current shall not exceed 40A peak for up to one-quarter of the AC cycle, after which, the input current should be no more than the specified maximum input current. The peak inrush current shall be less than the ratings of its critical components (including input fuse, bulk rectifiers, and surge limiting device).

The power supply must meet the inrush requirements for any rated AC voltage, during turn on at any phase of AC voltage, during a single cycle AC dropout condition as well as upon recovery after AC dropout of any duration, and over the specified temperature range (T

). It is

acceptable that AC line inrush current may reach up to 60A peak for up to 1 msec.

2.9 Protection Circuits

Protection circuits inside the PDB and the power supply shall cause the power supply’s main +12V output to shut down, or shall cause a shut down of any of the three outputs on the PDB. Either of these shutdowns will result in shutting down the entire power supply / PDB combination. If the power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15 seconds shall be able to reset the power supply and the PDB.

2.9.1 Over-Current Protection (OCP)

Each DC/DC converter output on the PDB shall have individual OCP protection circuits. The power supply and power distribution board (PS and PDB) shall shutdown and latch off after an over-current condition occurs. This latch shall be cleared by an AC power interruption. The following table provides the over-current limits. The values are measured at the PDB harness connectors. The DC/DC converters shall not be damaged from repeated power cycling in this condition. The +12V output from the power supply is divided on the PDB into four channels and each is limited to 240VA of power. There shall be current sensors and limit circuits to shut down the entire PS and PDB if the limit is exceeded. The limits are listed below.

Table 10. Over-Current Protection Limits / 240VA Protection

Output Voltage MIN OCP TRIP LIMITS MAX OCP TRIP LIMITS

+3.3V 110% min (= 26.4A min) 150% max (= 36A max)

+5V 110% min (= 33A min) 150% max (= 45A max)

-12V 125% min (= 0.625A min) 400% max (= 2.0A max) +12V1 112.5% min (= 18.0A min) 20A max +12V2 112.5% min (= 18.0A min) 20A max +12V3 112.5% min (= 18.0A min) 20A max +12V4 112.5% min (= 18.0A min) 20A max

2.9.2 Over-Voltage Protection (OVP)

Each DC/DC converter output on the PDB shall have individual OVP circuits built in and they shall be locally sensed. The PS and PDB shall shutdown and latch off after an over-voltage condition occurs. This latch shall be cleared by an AC power interruption. The following table provides the over-voltage limits. The values are measured at the PDB harness connectors. The voltage shall never exceed the maximum levels when measured at the power pins of the output harness connector during any single point of fail. The voltage shall never trip any lower than the minimum levels when measured at the power pins of the PDB connector.

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Table 11. Over-Voltage Protection (OVP) Limits

Output Voltage OVP MIN (V) OVP MAX (V)

+3.3V 3.9 4.5

+5V 5.7 6.5

+5VSB 5.7 6.5

-12V -13.3 -14.5

+12V1/2/3/4 13.0 14.5

2.9.3 Over-Temperature Protection (OTP)

The power supply will be protected against over-temperature conditions caused by loss of fan cooling or excessive ambient temperature. In an OTP condition the power supply will shutdown. When the power supply temperature drops to within specified limits, the power supply shall restore power automatically, while the 5 Vsb remains constantly on. The OTP trip level shall have a minimum of 4°C of ambient temperature hysteresis, so that the power supply will not oscillate on and off due to a temperature recovery condition. The power supply shall alert the system of the OTP condition via the power supply FAIL signal and the PWR LED.

2.10 DC Output Specification

2.10.1 Output Power / Currents

The following table defines power and current ratings for this 750W continuous (860W pk) power supply in 1+0 or 1+1 redundant configuration. The combined output power of both outputs shall not exceed the rated output power. The power supply must meet both static and dynamic voltage regulation requirements for the minimum loading conditions. Also, the power supply shall be able to supply the listed peak currents and power for a minimum of 10 seconds. Outputs are not required to be peak loaded simultaneously.

+12V +5Vsb MAX Load MIN DYNAMIC Load MIN STATIC Load PEAK Load Max Output Power (continuous) Peak Output Power

2.10.2 Standby Output / Standby Mode

The 5Vsb output shall be present when an AC input greater than the power supply turn-on AC voltage is applied. Applying an external 5.25V to 5Vsb shall not cause the power supply to shut down or exceed operating limits. When the external voltage is removed the voltage shall return to the power supplies operating voltage without exceeding the dynamic voltage limits.

62.0A 3.0A

3.0A 0.1A

0.0A 0.1A

70.0A(12s min) 5.0A (0.5s min @ turn-on) 12V x 62A = 744W max 5V x 3A = 15W max 12V x 70A = 840W pk 5V x 5A = 25W pk

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2.11 Power Supply Status LED

Each power supply module will have a single bi-color LED to indicate power supply status. The LED operation is defined below.

Table 12. LED Indicators

Power Supply Condition Bi-Color LED

No AC power to all power supplies No AC power to this PSU only (for 1+1 configuration)

or Power supply critical event causing a shutdown: failure, fuse blown (1+1 only), OCP, OVP, Fan Failed Power supply warning events where the power supply continues to operate: high temp, high power, high current, slow fan. AC present / Only 5VSB on (PS Off)

Output ON and OK

The LED is visible on the rear panel of each installed power supply module.

OFF

AMBER

1Hz Blink AMBER 1Hz Blink GREEN

GREEN

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2BCooling Sub-System Intel® Server System SR2500AL

3. Cooling Sub-System

Several components and configuration requirements make up the cooling sub-system of the chassis. These include the system fan module, the power supply fans, air baffles, CPU air duct, and drive bay population. All are necessary to provide and regulate the air flow and air pressure needed to maintain the system’s thermals when operating at or below maximum specified thermal limits. See Table 54. System Environmental Limits.

Two system fan assembly options are available for this chassis. The first option is a nonredundant three fan solution providing sufficient airflow to maintain internal system thermal requirements when the external ambient temperature remains within specified limits. The second option is a redundant fan solution. Three parallel sets of fans are arranged in series to provide redundant cooling in the event of a single fan failure. Each cooling option utilizes two fan types: a 60mm variable speed fan and an 80mm variable speed fan.

The chassis uses a variable fan speed control engine to provide adequate cooling for the system at various ambient temperature conditions, under various server workloads, and with the least amount of acoustic noise possible. The fans operate at the lowest speed for any given condition in order to minimize acoustics. The Baseboard Management Controller (BMC) integrated on the Intel function. The controller monitors selective component temperatures and the ambient temperature, as well as each fan’s RPM to determine the necessary airflow. The BMC sets the fan speeds to the appropriate RPM in order to maintain proper cooling. The BMC controller will also log errors into the System Event Log (SEL) when temperature sensors exceed their safe operating ranges, or if any of the fans fail to operate at safe airflow speeds. In the event of a fan failure, the BMC will boost the remaining fans to compensate for the lost air flow. A chassis with redundant fans can continue to operate in this degraded condition while the non-redundant chassis may not. If the cooling is not sufficient under a failed fan condition, the system will eventually shutdown to protect itself from thermal damage.

Server Board S5000PAL is used for the variable fan speed control

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3.1 Non-redundant Fan Module

TP02119

Figure 15. Non-Redundant Fan Module

This option provides the primary airflow for system configurations that do not require redundant cooling.

Table 13 Nonredundant Cooling Zones

Fan Cooling

System Fan #1 CPU1 Primary cooling for CPU1 and memory System Fan #2 CPU2 Primary cooling for hard drives 4 and 5, CPU2,

System Fan #3 PCI Primary cooling for hard drives 2 and 3, Full Power Supply

Fans 2 fans per module

Zone

Power

Supply

Description of greatest cooling influence

the MCH, and the low profile PCI cards Height PCI cards, PXH and IOP80333 chipset

Primary cooling for hard drives 0 and 1, and the power supply module(s)

The system fan module has been designed for ease of use and has support for several management features that can be utilized by the server board management system.

• The fan module houses two different fan sizes. System fans 1 and 2 use an 80mm fan, while system fan 3 uses a 60mm fan.

• Each fan is designed for tool-less insertion to or removal from the fan module housing. Note: The fans are NOT hot-swappable. The system must be turned off in order to replace a failed fan.

• Each fan within the module is capable of supporting multiple speeds. If the internal ambient temperature of the system exceeds the value programmed into the thermal sensor data record (SDR), the BMC firmware will increase the speed for all the fans within the fan module.

• Each fan connector within the module supplies a tachometer signal that allows the BMC to monitor the status of each fan. If one of the fans should fail, the remaining fans will increase their rotation and attempt to maintain the thermal requirements of the system.

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• Each fan has an associated fault LED on the mid-plane located next to the fan header. In the event of a fan failure, the fault LED for the failing fan can be illuminated by system management.

Table 14. Non-redundant Fan Connector Pin Assingment

Pin Signal Name Description

1 Tachometer B Reserved, unused by the non-redundant fan 2 PWM Fan speed control signal 3 12V Power for fan 4 12V Power for fan 5 Tachometer A Fan RPM sensor output

Two pulse per revolution for the 80mm fan Four pulses per revolution for the 60mm fan

6 Return Return path to ground 7 Return Return path to ground 8 Fan Presence Reserved, unused by the non-redundant fan 9 LED Cathode Loopback signal to pin 10

10 LED Anode Loopback signal to pin 9

The system fans plug into headers on the mid-plane board according to the following diagram.

Figure 16. Non-Redundant Fan Header Assignments on Mid-plane

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Table 15. Nonredundant Fan Header Assignment

Fan ID Mid-plane Fan Header Name

Fan #1 - CPU1 cooling FAN_2 Fan #2 - CPU2 cooling FAN_4 Fan #3 - PCI Cooling FAN_5

3.2 Redundant System Fan Module

TP02102

Figure 17. Fan Module Assembly

Table 16 Redundant Cooling Zones

Fan Cooling

System Fan #1 & #2 CPU1 Primary cooling for CPU1 and memory System Fan #2 & #3 CPU2 Primary cooling for hard drives 4 and 5, CPU2,

System Fan #5 & #6 PCI Primary cooling for hard drives 2 and 3, Full Power Supply Fans 2

fans per module

Zone

Power

Supply

Description of greatest cooling influence

the BNB, and the low profile PCI cards Height PCI cards, PXH and IOP80333 chipset

Primary cooling for hard drives 0 and 1, and the power supply module(s)

Each 10-pin fan connector provides power and ground, PWM control, tachometer output, a fan present detection signal, and a fault LED signal allowing it to be monitored independently by server management software. The following table provides the pin-out and description for the connectors on each fan.

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Table 17 Redundant Fan Connector Pin Assingment

Pin Signal Name Description

1 Tachometer B Reserved, unused by redundant fan 2 PWM Fan speed control signal 3 12V Power for fan 4 12V Power for fan 5 Tachometer A Fan RPM sensor output

Two pulses per revolution for the 80mm fan Four pulses per revolution for the 60mm fan

6 Return Return path to ground 7 Return Return path to ground 8 Fan Presence Detection if fan is installed in system 9 LED Cathode LED in fan

10 LED Anode Reserved, unused by the redundant fan

The system fans are hot-pluggable and do not have any cable connections. They mate directly to the fan module. The system fan module plugs into headers on the mid-plane board according the following diagram.

Figure 18. Redudant Fan Header Assignments on Mid-plane

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Table 18 Redundant Fan Header Assignment

Fan ID Mid-plane Fan Header Name

Fan #1 - CPU1 Cooling FAN_1 Fan #2 - CPU1 Cooling FAN_2 Fan #3 - CPU2 Cooling FAN_3 Fan #4 - CPU2 Cooling FAN_4 Fan #5 - PCI Cooling FAN_5 Fan #6 - PCI Cooling FAN_6

The system fan module has been designed for ease of use and has support for several management features that can be utilized by the server board management system.

• The fan module houses two different fan sizes. System fans 1, 2, 3 and 4 use an 80mm fan, while system fans 5 and 6 use a 60mm fan.

• Each fan is designed for tool-less insertion to or removal from the fan module and can be hot-swapped in the event of failure.

• Each fan within the module is equipped with a failure LED. In the event of a fan failure, the failure LED on the failing fan can be illuminated by server management.

3.3 Air Flow Support

To control airflow within the system, the chassis uses an air baffle and a CPU air duct to isolate and direct airflow to three critical zones: the power supply zone, the full height PCI riser zone, and the CPU/memory/low profile PCI riser zone.

3.3.1 Power Supply Zone

An air baffle is used to isolate the air flow of the main system board zones from the zone directly behind the power supply. As the power supply fans pull pre-heated air through the power supply from inside the chassis, the zone behind it must remain as cool as possible by drawing air from the leftmost drive bays only.

3.3.2 Full Height Riser Zone

The full height riser zone is the area between the power supply assembly and the full height riser card of the riser assembly. The air flow through this area is generated by system fan 3 of the fan module in a non-redundant fan configuration. In a redundant fan configuration, the air flow for this zone is provided by system fans 5 and 6. Air is drawn from the drive bay area through the fan and pushed out of the system through ventilation holes the back side of the chassis.

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3.3.3 CPU / Memory / Low Profile PCI Zone

The CPU / memory / low profile PCI zone is the area between the low profile riser card of the riser assembly and the right chassis wall. In a non-redundant fan configuration, the air flow for this zone is generated by system fans 1 and 2 of the fan module. In a redundant fan configuration, the air flow for this zone is provided by system fans 1, 2, 3 and 4. Air is drawn from the drive bay area, through the fans, directed through the CPU air duct, and out through ventilation holes on both the back wall and rear side wall of the chassis.

The CPU air duct is used to direct air flow through the processor heat sinks for both single and dual processor configurations. For single processor configurations, a flexible air baffle is attached to the air duct as shown in the following diagram.

AF000048

Figure 19. CPU Air Duct with Air Baffle

Operating a single processor configuration without the air baffle installed will result in the processor over heating and may cause the system to shutdown.

3.4 Drive Bay Population

To maintain the proper air pressure within the system, all hard drive bays must be populated with either a hard drive, or drive blank.

Revision – 1.6

Figure 20. Drive Blank

Intel order number D31980-009

TP02104

Intel® Server System SR2500AL 3BPlatform Control

4. Platform Control

This server system has embedded platform control which is capable of automatically adjusting system performance and acoustic levels.

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4.1 Overview

Platform control optimizes system performance and acoustics levels through:

 Performance Management  Performance Throttling  Thermal Monitoring  Fan Speed Control  Acoustics Management

The platform components used to implement platform control include:

 Baseboard Management Controller functions of the ESB-2  LM94 Sensor Monitoring Chip  Platform Sensors  Variable Speed System Fans  System BIOS  BMC Firmware  Sensor Data Records as loaded by the FRUSDR Utility  FBDIMM type  Processor type

For additional details on platform control, please see the Intel Datasheet

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4BSystem Board Interconnects Intel® Server System SR2500AL

5. System Board Interconnects

The chassis incorporates several design changes from the previous generation Intel 2U server chassis, resulting in improved cable routing. System boards within the chassis include the midplane, bridge board, hot-swap backplane, and control panel. This chapter describes the interconnect features of each, and defines the pin-outs for each of their connectors. Functional details of each system board are described in later chapters.

5.1 Mid-plane

The mid-plane is new to this generation of Intel high density server platforms. Its design and use, along with that of the bridgeboard and hot-swap backplane, improve cable routing within the system. The mid-plane is the key system board of the chassis. It serves as the primary interface between the server board, hot-swap backplane, and control panel. Two mid-planes are offered for this chassis: a passive SATA/SAS, and an active SAS/SAS RAID.

The passive midplane is a simple pass through from the backplane to the SATA connectors on the baseboard or SAS/SATA connectors on an add-in card.

The following diagram shows the location for each connector found on the passive mid-plane board.

AF000047

Figure 21. Passive Mid-plane Board

A Power Connector F Fan 4 Connector B Fan 6 Connector G Fan 3 Connector C Fan 5 Connector H Fan 1 Connector

D SAS/SATA Connectors I Fan 2 Connector E Bridge Board Connector J Backplane Connector

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The chassis also supports an active SAS / SAS RAID mid-plane. This system board incorporates an LSI* LSISAS1068 SAS controller onto the board. See Chapter 5 for details describing SAS / SAS RAID support. The following diagram shows the location for each connector found on this board.

AF000046

Figure 22. SAS/SAS RAID Mid-plane Board

Optional RAID Cache Battery

Backup Connection B Power Connector H Fan 3 Connector C Mini-DIMM Connector I Fan 1 Connector D Fan 6 Connector J Fan 2 Connector

E Fan 5 Connector K F Bridge Board Connector L Backplane Connector

G Fan 4 Connector

RAID Activation Key Connector

The following tables define the connector pin-outs for both mid-plane boards.

Table 19. 120-pin Server Board-to-Mid-plane Bridge Board Connector Pin-out

PIN SIGNAL NAME PIN SIGNAL NAME

1 GND 61 SMB_SENSOR_3V3SB_CLK_BUF 2 PE1_ESB_TX_DN3 62 SMB_SENSOR_3V3SB_DAT_BUF 3 PE1_ESB_TX_DP3 63 FM_BRIDGE_PRSNT_N 4 GND 64 GND 5 PE_WAKE_N 65 PE1_ESB_RX_DN_C3 6 GND 66 PE1_ESB_RX_DP_C3 7 PE1_ESB_TX_DN2 67 GND 8 PE1_ESB_TX_DP2 68 FAN_PRSNT6_N 9 GND 69 GND 10 FAN_PRSNT5_N 70 PE1_ESB_RX_DN_C2 11 GND 71 PE1_ESB_RX_DP_C2

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4BSystem Board Interconnects Intel® Server System SR2500AL

PIN SIGNAL NAME PIN SIGNAL NAME

12 PE1_ESB_TX_DN1 72 GND 13 PE1_ESB_TX_DP1 73 FAN_PRSNT4_N 14 GND 74 GND 15 RST_PS_PWRGD 75 PE1_ESB_RX_DN_C1 16 GND 76 PE1_ESB_RX_DP_C1 17 PE1_ESB_TX_DN0 77 GND 18 PE1_ESB_TX_DP0 78 RAID_KEY_PRES 19 GND 79 GND 20 FM_RAID_MODE 80 PE1_ESB_RX_DN_C0 21 GND 81 PE1_ESB_RX_DP_C0 22 CLK_IOP_DN 82 GND 23 CLK_IOP_DP 83 FAN_PRSNT1_N 24 GND 84 FAN_PRSNT3_N 25 SGPIO_DATAOUT1 85 FAN_PRSNT 2_N 26 SGPIO_DATAOUT0 86 GND 27 SGPIO_LOAD 87 USB1_ESB_DP 28 SGPIO_CLOCK 88 USB1_ESB_DN 29 GND 89 GND 30 USB2_ESB_DP 90 USB1_ESB_OC_N 31 USB2_ESB_DN 91 USB0_ESB_OC_N 32 GND 92 GND 33 USB2_ESB_OC_N 93 USB0_ESB_DP 34 NIC1_LINK_LED_N 94 USB0_ESB_DN 35 NIC1_ACT_LED_N 95 GND 36 LED_STATUS_AMBER_R1 96 FP_NMI_BTN_N 37 NIC2_LINK_LED_N 97 BMC_RST_BTN_N 38 NIC2_ACT_LED_N 98 FP_PWR_BTN_N 39 LED_STATUS_GREEN_BUF_R1 99 FP_ID_SW_L 40 GND 100 GND 41 SMB_PBI_5VSB_DAT 101 SMB_IPMB_5VSB_DAT 42 SMB_PBI_5VSB_CLK 102 SMB_IPMB_5VSB_CLK 43 GND 103 GND 44 V_IO_HSYNC2_BUF_FP 104 LED_HDD_ACT I VITY_N 45 V_IO_VSYNC2_BUF_FP 105 LED_HDD_5V_A 46 GND 106 FP_PWR_LED_R_N 47 V_IO_BLUE_CONN_FP 107 FP_PWR_LED_3VSB 48 V_IO_GREEN_CONN_FP 108 FP_ID_LED_R1_N 49 V_IO_RED_CONN_FP 109 FM_SIO_TEMP_SENSOR 50 GND 110 LED_FAN3_FAULT 51 LED_FAN6_FAULT 111 LED_FAN2_FAULT 52 LED_FAN5_FAULT 112 LED_FAN1_FAULT 53 LED_FAN4_FAULT 113 FAN_PWM_CPU1 54 FAN_PWM3 114 GND 55 GND 115 FAN_PWM_CPU2 56 PCI_FAN_TACH10 116 PCI_FAN_TACH9 57 FAN_TACH8 117 FAN_TACH7 58 FAN_TACH6 118 FAN_TACH5 59 FAN_TACH4_H7 119 FAN_TACH3_H7 60 FAN_TACH2_H7 120 FAN_TACH1_H7

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 4BSystem Board Interconnects

Table 20. Mid-plane Fan Header Pin-outs

J2B1 - FAN_1 J2B3 - FAN_3 J7B1 - FAN_5

PIN SIGNAL NAME PIN SIGNAL NAME PIN SIGNAL NAME

1 FAN_TACH5 1 FAN_TACH7 1 FAN_TACH10 2 FAN_PWM_CPU1 2 FAN_PWM_CPU2 2 FAN_PWM3 3 P12V 3 P12V 3 P12V 4 P12V 4 P12V 4 P12V 5 FAN_TACH1_H7 5 FAN_TACH3_H7 5 FAN_TACH9 6 GND 6 GND 6 GND 7 GND 7 GND 7 GND 8 FAN_PRSNT1_N 8 FAN_PRSNT3_N 8 FAN_PRSNT5_N 9 LED_FAN1_FAULT 9 LED_FAN3_FAULT 9 LED_FAN5_FAULT 10 LED_FAN1 10 LED_FAN3 10 LED_FAN5

J2B2 - FAN_2 J3B1 - FAN_4 J7B2 - FAN_6

PIN SIGNAL NAME PIN SIGNAL NAME PIN SIGNAL NAME

1 FAN_TACH6 1 FAN_TACH8 1 UNUSED 2 FAN_PWM_CPU1 2 FAN_PWM_CPU2 2 FAN_PWM3 3 P12V 3 P12V 3 P12V 4 P12V 4 P12V 4 P12V 5 FAN_TACH2_H7 5 FAN_TACH4_H7 5 FAN_TACH10 6 GND 6 GND 6 GND 7 GND 7 GND 7 GND 8 FAN_PRSNT2_N 8 FAN_PRSNT4_N 8 FAN_PRSNT6_N 9 LED_FAN2_FAULT 9 LED_FAN4_FAULT 9 LED_FAN6_FAULT 10 LED_FAN2 10 LED_FAN4 10 LED_FAN6

Table 21. Mid-plane Power Connector Pin-out

PIN Signal Description

1 GND 2 GND 3 P5V 4 P3V3 5 GND 6 P12V 7 P12V 8 P12V 9 P12V

10 P5V_STBY

Revision – 1.6

Intel order number D31980-009

4BSystem Board Interconnects Intel® Server System SR2500AL

Table 22. Mid-plane-to-Backplane Card Edge Connector #1 Pin-out

J7A1 - HSBP#1 I/F

PIN SIGNAL NAME PIN SIGNAL NAME

A1 RST_PS_PWRGD B1 GND A2 GND B2 SATA0_RX_N A3 GND B3 SATA0_RX_P A4 SATA1_RX_N B4 GND A5 SATA1_RX_P B5 GND A6 GND B6 SATA0_TX_N A7 GND B7 SATA0_TX_P A8 SATA1_TX_P B8 GND A9 SATA1_TX_N B9 GND A10 GND B10 USB2_ESB_DN A11 GND B11 USB2_ESB_DP A12 USB2_ESB_OC_N B12 GND A13 GND B13 SATA2_RX_N A14 GND B14 SATA2_RX_P A15 SATA3_RX_N B15 GND A16 SATA3_RX_P B16 NC_RESERVEDB16 A17 GND B17 SMB_SAS_EDGE_DAT A18 GND B18 NC_RESERVEDB18 A19 GND B19 SMB_SAS_EDGE_CLK A20 SATA3_TX_P B20 NC_RESERVEDB20 A21 SATA3_TX_N B21 GND A22 GND B22 SATA2_TX_P A23 GND B23 SATA2_TX_N A24 SATA5_RX_N B24 GND A25 SATA5_RX_P B25 GND A26 GND B26 SATA4_RX_N A27 GND B27 SATA4_RX_P A28 SATA5_TX_P B28 GND A29 SATA5_TX_N B29 GND A30 GND B30 SATA4_TX_P A31 GND B31 SATA4_TX_N A32 P5V_STBY B32 GND

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 4BSystem Board Interconnects

Table 23. Mid-plane-to-Backplane Card Edge Connector #2 Pin-out

J4A1 - HSBP#2 I/F

PIN SIGNAL NAME PIN SIGNAL NAME

A1 SGPIO_DATAOUT0 B1 SGPIO_CLOCK A2 SGPIO_DATAOUT1 B2 GND A3 GND B3 SATA_ADDIN1_RX_N A4 GND B4 SATA_ADDIN1_RX_P A5 SATA_ADDIN2_RX_N B5 GND A6 SATA_ADDIN2_RX_P B6 GND A7 GND B7 SATA_ADDIN1_TX_N A8 GND B8 SATA_ADDIN1_TX_P A9 SATA_ADDIN2_TX_P B9 GND A10 SATA_ADDIN2_TX_N B10 GND A11 GND B11 SGPIO_LOAD A12 SMB_PBI_3VSB_DAT B12 SMB_IPMB_5VSB_DAT A13 SMB_PBI_3VSB_CLK B13 SMB_IPMB_5VSB_CLK A14 USB0_ESB_OC_N B14 GND A15 GND B15 USB1_ESB_DP A16 GND B16 USB1_ESB_DN A17 USB0_ESB_DP B17 GND A18 USB0_ESB_DN B18 GND A19 GND B19 USB1_ESB_OC_N A20 LED_NIC1_ACT_N B20 LED_HDD_ACTIVITY_N A21 LED_NIC1_LINK_N B21 LED_HDD_5V_A A22 FM_SIO_TEMP_SENSOR B22 FP_ID_SW_L A23 LED_NIC2_LINK_N B23 BMC_RST_BTN_N A24 LED_NIC2_ACT_N B24 FP_PWR_BTN_N A25 GND B25 FP_NMI_BTN_N A26 V_BLUE_CONN_FP B26 FP_PWR_LED_3VSB A27 V_GREEN_CONN_FP B27 FP_PWR_LED_R_N A28 V_RED_CONN_FP B28 FP_ID_LED_R1_N A29 GND B29 GND A30 V_HSYNC2_BUF_FP B30 LED_STATUS_AMBER_R1 A31 V_VSYNC2_BUF_FP B31 LED_STATUS_GREEN_BUF_R1 A32 GND B32 FP_LED

Revision – 1.6

Intel order number D31980-009

4BSystem Board Interconnects Intel® Server System SR2500AL

Table 24. Active Mid-plane SAS RAID Battery Backup Connector Pin-out

PIN Signal Description

1 P12V 2 GND 3 NC_P5V_MONITOR 4 GND 5 P1V8_VBAT_RAID 6 GND 7 PWRGD_P3V3_STBY 8 GND

9 P1V8_VBAT_RAID 10 GND 11 PX_RESET_N 12 GND 13 SMB_CLK_P3V3 14 GND 15 SMB_DAT_P3V3 16 BBU_PFAIL_N 17 BBU_DDR_SEL 18 BBU_BBE 19 BBU_BBSTROBE 20 BBU_BBSTATUS

Table 25. Passive Mid-plane SATA/SAS Connector Pin-outs

J5A2 - SAS_7 J6A1 - SAS_6 J5B1 - SAS_4 J6B1 - SAS_2

PIN SIGNAL NAME PIN SIGNAL NAME PIN SIGNAL NAME PIN SIGNAL NAME

1 GND 1 GND 1 GND 1 GND 2 SATA_ADDIN1_TX_P 2 SATA5_TX_P 2 SATA3_TX_P 2 SATA1_TX_P 3 SATA_ADDIN1_TX_N 3 SATA5_TX_N 3 SATA3_TX_N 3 SATA1_TX_N 4 GND 4 GND 4 GND 4 GND 5 SATA_ADDIN1_RX_N 5 SATA5_RX_N 5 SATA3_RX_N 5 SATA1_RX_N 6 SATA_ADDIN1_RX_P 6 SATA5_RX_P 6 SATA3_RX_P 6 SATA1_RX_P 7 GND 7 GND 7 GND 7 GND

J5A1- SAS_8 J6A2 - SAS_5 J5B2 - SAS_3 J6B2 - SAS_1

PIN SIGNAL NAME PIN SIGNAL NAME PIN SIGNAL NAME PIN SIGNAL NAME

1 GND 1 GND 1 GND 1 GND 2 SATA_ADDIN2_TX_P 2 SATA4_TX_P 2 SATA2_TX_P 2 SATA0_TX_P 3 SATA_ADDIN2_TX_N 3 SATA4_TX_N 3 SATA2_TX_N 3 SATA0_TX_N 4 GND 4 GND 4 GND 4 GND 5 SATA_ADDIN2_RX_N 5 SATA4_RX_N 5 SATA2_RX_N 5 SATA0_RX_N 6 SATA_ADDIN2_RX_P 6 SATA4_RX_P 6 SATA2_RX_P 6 SATA0_RX_P 7 GND 7 GND 7 GND 7 GND

The system also supports an active SAS/SAS RAID midplane2. This system board incorporates an LSI LSISAS1078 SAS controller onto the board. The following figure shows the location for each connector found on this board.

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 4BSystem Board Interconnects

Optional RAID Cache Battery

Backup Connection B. Power Connector H. Fan 3 Connector C. Mini-DIMM Connector I. Fan 1 Connector D. Fan 6 Connector J. Fan 2 Connector

E. Fan 5 Connector K. F. Bridge Board Connector L. Backplane Connector

Figure 23. Active SAS/SAS RAID Midplane 2 Board

G. Fan 4 Connector

RAID Activation Key Connector

AF002790

Revision – 1.6

Intel order number D31980-009

4BSystem Board Interconnects Intel® Server System SR2500AL

5.2 Bridge Board

The chassis utilizes a bridge board to route signals from the server board to the mid-plane board. The bridge board carries signals for three USB ports, SSI front panel control signals, video, various I2C buses, fan control signals, and a PCIe* x4 bus for SAS controller function. See Table 19. 120-pin Server Board-to-Mid-plane Bridge Board Connector Pin-out.

AF000037

Figure 24. Bridge Board

5.3 Hot-Swap SATA/SAS Backplane

The hot swap backplane provides support for both SAS and SATA hard drives. There are no hard drive cables that connect to the backplane. All hard drive control signals are routed from the mid-plane board which plugs directly into the backplane.

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 4BSystem Board Interconnects

AF000045

Figure 25. Hot-Swap SAS/SATA Backplane (Front Side View)

A Slimline Optical Drive Connector C Control Panel Connector B USB Floppy Connector D SAS/SATA Hot Swap Connectors

AF000044

Figure 26. Hot-Swap SAS/SATA Backplane (Back Side View)

A Power Connector (for 6th Hard Drive or

SATA Tape Drive)

B SAS/SATA Connector (for 6th Hard

Drive or SATA Tape Drive)

C IDE Connector

Revision – 1.6

D Power Connector

E Midplane Connector

Intel order number D31980-009

4BSystem Board Interconnects Intel® Server System SR2500AL

Table 26. 2x4 SAS/SATA Backplane Power Connector Pin-out (J7L2)

Pin # Signal Name

1 Ground 2 Ground 3 P5V 4 P5V 5 P12V 6 P12V 7 P5V_STBY 8 P3V3

Table 27. 1x7 6th HDD / Tape Drive Option Power Connector Pin-out (J2M1)

Pin # Signal Name

1 P12V 2 Ground 3 Ground 4 P5V 5 SASS_PRSTNT_L 6 LED_SASS_ACT_L 7 P3V3

Table 28. 6th HDD Option SATA/SAS I/O Connector Pin-out (J4L1)

Pin # Signal Name

1 Ground 2 SASS_TX_DP 3 SASS_TX_DN 4 Ground 5 SASS_RX_DN 6 SASS_RX_DP 7 Ground

Table 29. 2x22 Slim-Line IDE Optical Drive Connector Pin-out (J5N1)

Pin # Signal Name Pin # Signal Name

1 RST_IDE_L 23 RIDE_DIOW_N 2 Ground 24 Ground 3 RIDE_DD <15..0> 7 25 RIDE_DIOR_N 4 RIDE_DD <15..0> 8 26 Ground 5 RIDE_DD <15..0> 6 27 RIDE_DIORDY 6 RIDE_DD <15..0> 9 28 IDE_ALE_H 7 RIDE_DD <15..0> 5 29 RIDE_DDACK_N 8 RIDE_DD <15..0> 10 30 Ground

9 RIDE_DD <15..0> 4 31 IRQ_IDE 10 RIDE_DD <15..0> 11 32 TP_PIDE_32 11 RIDE_DD <15..0> 3 33 RIDE_DA1 12 RIDE_DD <15..0> 12 34 IDE_PRI_CBLSNS 13 RIDE_DD <15..0> 2 35 RIDE_DA0

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 4BSystem Board Interconnects

Pin # Signal Name Pin # Signal Name

14 RIDE_DD <15..0> 13 36 RIDE_DA2 15 RIDE_DD <15..0> 1 37 RIDE_DCS1_N 16 RIDE_DD <15..0> 14 38 RIDE_DCS3_N 17 RIDE_DD <15..0> 0 39 LED_IDE_L 18 RIDE_DD <15..0> 15 40 Ground 19 Ground 41 Not Used 20 Not Used 42 Not Used 21 RIDE_DDREQ 43 Not Used 22 Ground 44 Not Used

Table 30. Slim-Line Optical Drive Slot Connector (J1A1)

Pin # Signal Name Pin # Signal Name

A1 RST_IDE_L B1 RIDE_DD<15..0> 8 A2 Ground B2 Ground A3 RIDE_DD<15..0> 7 B3 RIDE_DD<15..0> 9 A4 Ground B4 Ground A5 RIDE_DD<15..0> 6 B5 RIDE_DD<15..0> 10 A6 Ground B6 Ground A7 RIDE_DD<15..0> 5 B7 RIDE_DD<15..0> 11 A8 Ground B8 Ground

A9 RIDE_DD<15..0> 4 B9 RIDE_DD<15..0> 12 A10 Ground B10 Ground A11 RIDE_DD<15..0> 3 B11 RIDE_DD<15..0> 13 A12 Ground B12 Ground A13 RIDE_DD<15..0> 2 B13 RIDE_DD<15..0> 14 A14 Ground B14 Ground A15 RIDE_DD<15..0> 1 B15 RIDE_DD<15..0> 15 A16 Ground B16 Ground A17 RIDE_DD<15..0> 0 B17 RIDE_DDREQ A18 Ground B18 Ground A19 RIDE_DIOW_N B19 RIDE__DIOR_N A20 Ground B20 Ground A21 RIDE_DIORDY B21 RIDE_DDACK_N A22 Ground B22 TP_PIDE_32 A23 IRQ_IDE B23 IDE_PRI_CBLSNS A24 Ground B24 Ground A25 RIDE_DA1 B25 RIDE_DA2 A26 Ground B26 Ground A27 RIDE_DA0 B27 RIDE_DCS3_N A28 Ground B28 P5V A29 RIDE_DCS1_N B29 P5V A30 P5V B30 P5V A31 P5V B31 IDE_ALE_S_H A32 LED_IDE_L

PRSNT1_N 12V 12V 12V 12V RSVD GND GND JTAG2 SMCLK JTAG3 SMDAT JTAG4 GND JTAG5 3_3V 3_3V JTAG1 3_3V 3_3VAUX PERST_N WAKE_N

---------------KEY -------------------GND RSVD REFCLK+ GND REFCLK – PETP0 GND PETN0 PERP0 GND PERN0 PRSNT2_N GND GND RSVD PETP1 GND PETN1 PERP1 GND PERN1 GND GND PETP2 GND PETN2 PERP2 GND PERN2 GND GND PETP3 GND PETN3 PERP3 GND PERN3 RSVD GND PRSNT2_N RSVD GND

B32 Ground

Table 31. IDE Device Master/Slave Configuration Jumper (J6L1)

Revision – 1.6

Jumper

Configuration

Setting

1-2 IDE Master 2-3 IDE Slave

Intel order number D31980-009

4BSystem Board Interconnects Intel® Server System SR2500AL

Table 32. I2C Connector (J6L3)

Pin # Signal Description

1 SMB_VSC_12C_DAT0 2 GROUND 3 SMB_VSC_12C_CLK0 4 Not Used

Table 33. PCIe X4 Slot Connector from Mid-plane (J4N1)

A1 SGPIO_DATA0 B1 SGPIO_CLOCK A2 SGPIO_DATA1 B2 Ground A3 Ground B3 SAS6_RX_DN A4 Ground B4 SAS6_RX_DP A5 SAS7_RX_DN B5 Ground A6 SAS7_RX_DP B6 Ground A7 Ground B7 SAS6_TX_DN A8 Ground B8 SAS6_TX_DP A9 SAS7_TX_DP B9 Ground A10 SAS7_TX_DN B10 Ground A11 Ground B11 SGPIO_LOAD A12 SMB_PB1_5VSB_DAT B12 SMB_IPMB_5VSB_DAT A13 SMB_PB1_5VSB_CLK B13 SMB_IPMB_5VSB_CLK A14 USB_OC1_N B14 Ground A15 Ground B15 USB_P2P A16 Ground B16 USB_P2N A17 USB_P1P B17 Ground A18 USB_P1N B18 Ground A19 Ground B19 USB_OC2_N A20 LED_NIC1_ACT_L B20 LED_HDD_ACT_R_L A21 LED_NIC1_LINK_R_L B21 PV_HDD_LED_3V_A A22 FP_THERM_SENSOR B22 FP_ID_SW_L A23 LED_NIC2_LINK_R_L B23 RST_FP_BTN_L A24 LED_NIC2_ACT_L B24 FP_PWR_BTN_L A25 Ground B25 FP_NMI_BTN_L A26 V_IO_BLUE_CONN_FP B26 FP_PWR_LED_5VSB A27 V_IO_GREEN_CONN_FP B27 LED_FP_PWR_R_L A28 V_IO_RED_CONN_FP B28 LED_FP_ID_R_L A29 Ground B29 Ground A30 V_IO_HSYNC_BUFF_FP_L B30 LED_FP_SYS_FLT1_R_L A31 V_IO_VSYNC_BUFF_FP_L B31 LED_FP_SYS_FLT2_R_L A32 Ground B32 FP_FLT_LED_5VSB

Signal Name Pin

Signal Name

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 4BSystem Board Interconnects

Table 34. PCIe* X4 Slot Connector from Mid-plane (J6N1)

A1 RST_PWRGD_PS B1 Ground A2 Ground B2 SAS0_RX_DN A3 Ground B3 SAS0_RX_DP A4 SAS1_RX_DN B4 Ground A5 SAS1_RX_DP B5 Ground A6 Ground B6 SAS0_TX_DN A7 Ground B7 SAS0_TX_DP A8 SAS1_TX_DP B8 Ground

A9 SAS1_TX_DN B9 Ground A10 Ground B10 USB_P3N A11 Ground B11 USB_P3P A12 USB_OC3_N B12 Ground A13 Ground B13 SAS2_RX_DN A14 Ground B14 SAS2_RX_DP A15 SAS3_RX_DN B15 Ground A16 SAS3_RX_DP B16 Not Used A17 Ground B17 SMB_SAS_3V3_SDA A18 Ground B18 Not Used A19 Ground B19 SMB_SAS_3V3_SCL A20 SAS3_TX_DP B20 Not Used A21 SAS3_RT_DN B21 Ground A22 Ground B22 SAS2_TX_DP A23 Ground B23 SAS2_TX_DN A24 SAS5_RX_DN B24 Ground A25 SAS5_RX_DP B25 Ground A26 Ground B26 SAS4_RX_DN A27 Ground B27 SAS4_RX_DP A28 SAS5_TX_DP B28 Ground A29 SAS5_TX_DN B29 Ground A30 Ground B30 SAS4_TX_DP A31 Ground B31 SAS4_TX_DN A32 P5V_STBY B32 Ground

Signal Name Pin

Signal Name

Table 35. USB Floppy Drive Connector (J2A1)

Revision – 1.6

Pin # Signal Description

1 P5V_USB_FP_P3 2 USB_P3N 3 USB_P3P 4 Ground

Intel order number D31980-009

4BSystem Board Interconnects Intel® Server System SR2500AL

Table 36. Intel® Local Control Panel (LCP) Connector (J9A1)

Pin # Signal Description

1 SMB_IPMB_5VSB_DAT 2 Ground 3 SMB_IPMB_5VSB_CLK 4 P5V_STBY_R

Table 37. Control Panel Slot Connector (J9B1)

Pin # Signal Name Pin # Signal Name

A1 Ground B1 FP_THERM_SENSOR A2 V_IO_VSYNC_BUFF_FP_L B2 P5V A3 Ground B3 P5V A4 V_IO_HSYNC_BUFF_FP_L B4 P5V A5 Ground B5 V_VIDEO_IN_USE A6 V_IO_BLUE_BUFF_FP_L B6 Ground A7 Ground B7 P5V_STBY A8 V_IO_GREEN_BUFF_FP_L B8 Ground

A9 Ground B9 FP_FLT_LED_5VSB A10 V_IO_RED_BUFF_FP_L B10 Ground A11 Ground B11 LED_FP_SYS_FLT1_R_L A12 Ground B12 FP_ID_SW_L A13 RST_FP_BTN_L B13 LED_FP_ID_R_L A14 Ground B14 SMB_IPMB_5VSB_DAT A15 FP_CHASSIS_INTRU B15 SMB_IPMB_5VSB_CLK A16 Ground B16 Ground A17 SMB_PB1_5VSB_DAT B17 LED_NIC1_ACT_L A18 SMB_PB1_5VSB_CLK B18 LED_NIC1_LINK_R_L A19 Ground B19 FP_PWR_BTN_L A20 FP_NMI_BTN_L B20 FP_PWR_LED_5VSB A21 Ground B21 PV_HDD_LED_3V_A A22 USB_P1P B22 Ground A23 USB_P1N B23 Ground A24 Ground B24 LED_NIC2_ACT_L A25 Ground B25 LED_NIC2_LINK_R_L A26 P5V_USB_P1 B26 LED_HDD_FLT_R_L A27 P5V_USB_P2 B27 LED_HDD_ACT_RR_L A28 Ground B28 LED_FP_PWR_R_L A29 Ground B29 LED_FP_SYS_FLT2_R_L A30 USB_P2P B30 Ground A31 USB_P2N B31 Ground A32 Ground

PRSNT1_N 12V 12V 12V 12V RSVD GND GND JTAG2 SMCLK JTAG3 SMDAT JTAG4 GND JTAG5 3_3V 3_3V JTAG1 3_3V 3_3VAUX PERST_N WAKE_N

-------------- KEY -------------GND RSVD REFCLK + GND REFCLK – PETP0 GND PETN0 PERP0 GND PERN0 PRSNT2_N GND GND RSVD PETP1 GND PETN1 PERP1 GND PERN1 GND GND PETP2 GND PETN2 PERP2 GND PERN2 GND GND PETP3 GND PETN3 PERP3 GND PERN3 RSVD GND PRSNT2_N RSVD GND

B32 RST_PWRGD_PS

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 4BSystem Board Interconnects

Table 38. SAS/SATA Hard Drive Connector Pin-outs (J2C3, J2B1, J4C1, J4B1, J7C1)

Pin# Signal Description

SI Ground S2 SAS#_TX_DP (# = 0…4) S3 SAS#_TX_DN (# = 0…4) S4 Ground S5 SAS#_RX_DN (# = 0…4) S6 SAS#_RX_DP (# = 0…4) S7 Ground S8 Not Used S9 Not Used

S10 Not Used S11 Not Used S12 Not Used S13 Not Used S14 Not Used

P1 Not Used P2 Not Used P3 Not Used P4 Ground P5 Ground P6 P3V3 P7 P5V P8 P5V P9 P5V

P10 Ground P11 LED_SAS#_ACT_L (# =

0…4)

P12 Ground P13 P12V P14 P12V P15 P12V

PTH0 Ground

PTY1 Ground

Revision – 1.6

Intel order number D31980-009

5BPeripheral and Hard Drive Sub-System Intel® Server System SR2500AL

6. Peripheral and Hard Drive Sub-System

The chassis can be configured to support several different hard drive and peripheral configurations. The peripheral/hard drive sub-system consists of a drive bay, supporting a slimline optical drive, hard drives, and flex bay; a mid-plane; and hot-swap backplane. This chapter describes the details for each sub-system component.

A. Slimline IDE Optical Drive Bay B. Optional 6th HDD Drive or Tape Drive Bay C. System Control Panel D. 3.5” Hard Drive Bays x5

B C

TP02108

Figure 27. Optional 6th Hard Drive (Front View)

6.1 Slimline Drive Bay

The chassis provides a slim-line drive bay that is designed to support a single slim-line IDE optical drive or USB Floppy Drive. A list of supported drives can be found in the Intel Board S5000PAL/S5000XAL Tested Hardware and OS List. Either drive type is mounted to a tool-less tray which allows for easy installation into and removal from the chassis. Once inserted into the chassis, the assembly locks into place. It is not hot-swappable. For removal, the system must be powered down, the chassis top cover removed and the locking latch disengaged.

AF000043

Server

Figure 28. Slim-Line Optical Drive Assembly

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 5BPeripheral and Hard Drive Sub-System

The IDE Optical drive assembly includes an interposer board which plugs into the back of the optical drive. The interposer board is a card-edge type card that eliminates the need for cable connections. As the drive assembly is inserted into the drive bay, the edge connector is blind mated to a slot connector on the backplane.

The interposer board has two connectors. The first connector is the industry standard 50-pin IDE interface used by all slim-line optical devices. The second connector is the card edge used to connect directly to the hot-swap backplane board.

AF000042

Figure 29. 50-pin Connector to Slimline Optical Device

Table 39. J1L1 50-pin Connector to Slimline Optical Device

PIN SIGNAL NAME PIN SIGNAL NAME

1 TP_LCH 26 GND 2 TP_RCH 27 IDE_SIORDY 3 TP_GND 28 IDE_SDDACK_L 4 GND 29 IRQ_IDE_S 5 RST_IDE_S_L 30 IDEIO16_L 6 IDE_SDD8 31 IDE_SDA1 7 IDE_SDD7 32 IDE_CBL_DET_S 8 IDE_SDD9 33 IDE_SDA0 9 IDE_SDD6 34 IDE_SDA2 10 IDE_SDD10 35 IDE_SDCS0_L 11 IDE_SDD5 36 IDE_SDCS1_L 12 IDE_SDD11 37 IDE_SEC_HD_ACT_L 13 IDE_SDD4 38 P5V 14 IDE_SDD12 39 P5V 15 IDE_SDD3 40 P5V 16 IDE_SDD13 41 P5V 17 IDE_SDD2 42 P5V 18 IDE_SDD14 43 GND 19 IDE_SDD1 44 GND 20 IDE_SDD15 45 GND 21 IDE_SDD0 46 GND 22 IDE_SDDREQ 47 IDEP_ALE_H 23 GND 48 GND 24 IDE_SDIOR_L 49 UNUSED 25 IDE_SDIOW_L 50 UNUSED

Revision – 1.6

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The USB floppy drive assembly includes a USB cable which plugs into the back of the USB floppy drive and is then routed to the backplane’s 4-pin USB connector J2A1 (See Table 35. USB Floppy Drive Connector (J2A1).

Note: The optional internal USB floppy drive accessory kit (product order code – AXXUSBFLOPPY) includes a slim-line USB floppy drive, a USB cable, and mounting hardware to install the drive into either the slim-line drive bay or one of the hard drive bays.

6.2 Hard Drive Bays

The chassis can be configured to support up to 61 hot-swap 3.5” x1” SAS or SATA hard disk drives. Hard drives are mounted to hot-swap drive trays for easy insertion to or extraction from the drive bay.

6.2.1 Hot-swap Drive Trays

Each hard drive must be mounted to a hot-swap drive tray, making insertion and extraction of the drive from the chassis very simple. Each drive tray has its own dual purpose latching mechanism which is used to both insert/extract drives from the chassis and lock the tray in place. Each drive tray supports a light pipe providing a drive status indicator, located on the backplane, to be viewable from the front of the chassis.

Figure 30. Hard Drive Tray Assembly

A. Hard Drive B. Drive Carrier C. Side Rail D. Mounting Screw

TP02106

E. Hard Drive Connector

Default 5 Hard Drives + one optional 6Th Hard Drive using Flex Bay

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6.3 Optional Tape Drive or 6th Hard Drive Flex Bay

For system configurations that require either a Tape Drive or a 6th hard disk drive, a dual purpose drive bay is provided. By default this drive bay is covered by two face plates as shown in the following diagram. The drive bay is located next to the control panel.

TP02108

Figure 31. Optional 6th Hard Drive (Front View)

To configure a 6th hard drive, the lower face plate is removed and the 6th hard drive accessory kit is installed (product order code – ASR2500SIXDRV). This kit includes a backplane board insert, power cable, and drive carrier.

To install a 3.5” tape drive, both face plates are removed and the optional tape drive kit is installed (product order codes – ASR2500SATAPE or ADRTAPEKIT). Both tape drive kits include tape drive mounting tray and necessary cables.

Note: To remove the tape drive tray from the chassis, a spring latch located inside the chassis on the back right side of the carrier must be released to allow the drive tray to slide free. Do not attempt to pull out the drive tray without first releasing the spring latch. Doing so may damage the plastic faceplate.

TP02105TP02092

Figure 32. Optional Tape Drive (Front View)

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6.4 Mid-plane Options

New to this generation of high density server platform is the concept of the mid-plane. The midplane is the interconnect between the server board and both the hot-swap backplane and control panel. It is also used to determine which hard drive technology is to be supported. Two different Mid-plane options are available for this platform 1) a passive mid-plane capable of supporting SATA ports from the server board or SAS using ports from an add-in card; 2) an active SAS / SAS RAID mid-plane. This section will describe the hard drive interface support of each of the mid-plane boards.

6.4.1 Passive Mid-plane

The passive mid-plane is used as an interconnect, routing drive control signals from either the on-board SATA ports of the baseboard or SAS/SATA ports from an add-in card to the hot-swap backplane. The hard drive controller signals are cabled to the mid-plane which then routes the signals to the hot-swap backplane through two edge connectors that plug directly into it. See Table 22. Mid-plane-to-Backplane Card Edge Connector #1 Pin-out and Table 23. Mid-plane-toBackplane Card Edge Connector #2 Pin-out.

AF000047

Figure 33. Passive Mid-plane Board

A Power Connector F Fan 4 Connector B Fan 6 Connector G Fan 3 Connector C Fan 5 Connector H Fan 1 Connector D SAS/SATA Connectors I Fan 2 Connector E Bridge Board Connector J Backplane Connector

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6.4.2 Active Mid-plane with SAS /SAS RAID Support

The active mid-plane is used to provide SAS / SAS RAID support. It has integrated on to it an Intel IOP80333 IO processor and an LSI* LSLSAS1068 3Gb/s SAS controller. Together they provide support for up to six SAS drives in this chassis. By default, this mid-plane option provides software RAID levels 0, 1, and 10 utilizing Intel the installation of optional RAID enablement devices, the mid-plane can support hardware RAID levels 0, 1, 5, 10, and 50. The mid-plane attaches to the hot-swap backplane by two card edge connectors which eliminates the need for any hard drive cables. The following sub-sections describe the board level SAS / SAS RAID functionality.

Embedded RAID Technology II. With

AF000046

Figure 34. Active Mid-plane with SAS / SAS RAID Support

RAID Battery Backup Unit

Connector B Power Connector H Fan 3 Connector C Mini-DIMM Connector I Fan 1 Connector D Fan 6 Connector J Fan 2 Connector

E Fan 5 Connector K F Bridge Board Connector L Backplane Connector

G Fan 4 Connector

RAID Activation Key Connector

6.4.3 Active Midplane2 with SAS/SAS RAID Support

The active midplane2 is used to provide SAS/SAS RAID support. It has an integrated LSI LSISAS1078 3 Gb/s RAID On-a-Chip (ROC) device. It provides support for up to eight SAS drives in this system. By default, this midplane2 option provides software RAID levels 0, 1, and 10 and utilizes Intel enablement devices, the midplane2 can support hardware RAID levels 0, 1, 5, 6, 10, 50 and 60. The midplane2 attaches to the hot-swap backplane by two card edge connectors, which eliminates the need for any hard drive cables. The following sub-sections describe the board level SAS/SAS RAID functionality.

Embedded RAID Technology II. With the installation of optional RAID

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AF002790

RAID Battery Backup Unit

Connector B. Power Connector H. Fan 3 Connector C. Mini-DIMM Connector I. Fan 1 Connector D. Fan 6 Connector J. Fan 2 Connector

E. Fan 5 Connector K. F. Bridge Board Connector L. Backplane Connector

G. Fan 4 Connector

RAID Activation Key Connector

Figure 35. Active Midplane2 with SAS/SAS RAID Support

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6.4.3.1 Architectural Overview

Figure 36. Architecture Overview

6.4.3.2 x4 PCIe* Card Edge Interfaces

Two x4 PCIe* card edges are used to connect the active mid-plane to the hot-swap backplane. See Table 22. Mid-plane-to-Backplane Card Edge Connector #1 Pin-out and Table 23. Midplane-to-Backplane Card Edge Connector #2 Pin-out for details. The use of card edge connectors to the back plane eliminates all hard drive cabling.

6.4.3.3 IOP80333 IO processor

The Intel 80333 IO processor is a multi-function device that integrates the Intel X with intelligent peripherals and two PCIe* to PCI-X* bridges. It will be connected to the server board’s x4 PCIe lane and serve as bridge for PCI-X 133MHz secondary bus. The IOP80333 also includes fully functional RAID support.

6.4.3.4 LSI* LSISAS1068 SAS Controller

The LSI* LSISAS1068 controller resides on the Channel A PCI-X

bus of the IOP80333 supporting transfer rates of up to 3GB/s. It includes an Address Translation Unit (ATU) supporting transactions between PCI address space and 80333 address space. Address translation for the ATU is controlled through programmable registers accessible from both the PCI interface and the Intel Xscale

core. The LSISAS1068 controller includes its own Flash ROM and NVSRAM to support SAS only software RAID. Software RAID Levels supported include 0, 1, and 10.

scale

core

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6.4.3.5 Optional Hardware RAID Support

The active mid-plane supports options to provide full hardware RAID support. Options required to enable hardware RAID support include an Intel AXXRAK18E) and installation of a Mini-DIMM for Intel RAID Cache support. To protect from data loss during an unexpected power loss event, an Intel

RAID Activation Key (product order code -

RAID Smart Battery Backup module

(AXXRSBBU3) is also supported. Hardware RAID levels supported include 0, 1, 5, 10, and 50.

6.4.3.5.1 Intel

The Intel

RAID Activation Key enables the full intelligent SAS Hardware RAID solution

engineered around the Intel

RAID Activation Key

80333 I/O Processor @ 500MHz. The activation key plugs directly in to a connector (J1A10) on the mid-plane board. With no RAID activation key installed, only SAS Software RAID levels 0, 1, and 10 are supported.

6.4.3.5.2 Intel RAID Cache support

To further enable support for hardware RAID, the active mid-plane provides a 244-pin miniDIMM connector (J8C1), supporting a single registered ECC non-parity DDR2-400 MHz MiniDIMM to provide Intel RAID cache. Mini-DIMM capacities supported range from 128MB to 1GB.

Note: See the Intel

Server Board S5000PAL Tested Memory List for a list of Intel validated

mini-DIMMs.

6.4.3.5.3 Intel

With an Intel

RAID Smart Battery Backup Module

RAID Smart Battery Backup module installed, data loss is prevented when data is still present in the RAID Cache Module and power is unexpectedly lost. Depending on the cache module capacity used, the battery backup unit can provide 48 to 72 hours of battery backup power to allow data stored in the RAID cache to be processed. A 2x10 connector (J9A2) is used to attach the battery backup unit to the mid-plane. See Table 24. Active Mid-plane SAS RAID Battery Backup Connector Pin-out for details.

6.5 Hot-Swap SAS/SATA Backplane

The chassis supports a multifunctional SAS/SATA backplane with the following features:

• Vitesse* VSC410 enclosure management controller

o External non-volatile Flash ROM

o Four I o Compliance with SCSI Accessed Fault Tolerant Enclosures (SAF-TE)

specification

o Compliance with Intelligent Platform Management Interface (IPMI)

• Five SAS/SATA compatible hot-swap hard drive connectors

• Designed to support an optional 6

• Hard Drive Status and Fault LEDs for each hard drive connector

Revision – 1.6

C interfaces

hard drive, or power for an optional tape drive.

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• Card edge connectors for most interconnects, including:

o Mid-plane o Control Panel o Slim-line IDE Optical Drive

• Temperature Sensor

• FRU EEPROM

• One 2x4-pin Power Connector

6.5.1 SAS/SATA Backplane Layout

The hot-swap backplane installs on the back side of the hot-swap drive bay inside the chassis. Alignment features on the chassis and backplane assembly make for easy tool-less installation. The following diagram shows the layout of components and connectors found on the board.

AF000045

Figure 37. Hot-swap SAS/SATA Backplane (Front Side View)

A Slim-line Optical Drive Connector C Control Panel Connector B Slim-line USB Floppy Connector D SAS/SATA Hot Swap Connectors

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AF000044

Figure 38. Hot-swap SAS/SATA Backplane (Back Side View)

A Power Connector (for 6th Hard Drive or

Tape Drive)

B SAS/SATA Connector (for 6th Hard

Drive or SATA Tape Drive)

C IDE Connector

D Power Connector

E Midplane Connectors

Notes: To prevent the backplane from flexing when installing or removing hard drives from the drive bay, make sure the mid-plane is securely fastened and the system top cover is in place.

Make sure all system boards, peripherals, and cables are detached from the backplane before removing the backplane from the system. Failure to detach components from the backplane before removal may result in component damage.

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6.5.2 SAS/SATA Backplane Functional Architecture

The figure below shows the functional blocks of the SAS/SATA backplane.

LM75

EEPROM

HBA Connector

SEEPROM

(FRU)

SEEPROM

Connector

SAS/SATA HDD3

Connector (29P)

SAS/SATA HDD4

Connector (29P)

SAS/SATA HDD5

Connector (7P)

(to 2U SAS/SATA

HDD Optional Board)

6th SAS/SATA

HDD Optional Board

I2C Bus0

I2C Bus1

I2C Bus2

Flash Room

SAS/SATA HDD0

Connector (29P)

SAS/SATA HDD1

Connector (29P)

SAS/SATA HDD2

Connector (29P)

SAS/SATA PWR, LED,

PRSNT Connector (7P)

(to 2U SAS/SATA

HDD Optional Board)

VSC410

64P Connector X2

(from midplane)

SAS_I2C

Midplane

LED

BUS SW

IPMB_I2C

I2C Connector

4P LCD Connector

4P USB Connector

(for USB CD-ROM/FDD)

64P Front Panel Connector

(to Front Panel Board)

44P Internal

IDE Connector

(from baseboard)

64P Internal

IDE Connector

(to 64P CD-ROM

Interposer Board)

VRS RST

AF000040

Figure 39. SAS/SATA Backplane Functional Block Diagram

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6.5.2.1 Enclosure Management Controller

The backplane utilizes the features of the Vitesse* VSC410 to implement several enclosure management functions. The chip provides in-band SAF-TE and SES management and utilizes the four I

C interfaces listed below.

1. I2C bus 0 is connected to an EEPROM which stores configuration and FRU data

2. I2C bus 1 is connected to an LM75 temperature sensor

3. I2C bus 2 is connected to an IPMB bus from the server board.

4. I2C bus 3 is connected to the LSISAS1068 SAS controller.

6.5.2.2 Hard Drive Activity and Fault LEDs

The backplanes support an activity/fault LED for each of the hard drive connectors. The LED will illuminate green for activity or amber for a drive fault. The green activity LED is driven by the SAS/SATA hard disk drive directly. The amber fault LED is driven by the VSC410* management controller whenever a fault condition is detected. When the drive is used in a RAID configuration, the RAID controller will have control over the fault LED and it may exhibit different behavior.

Table 40. Hard Drive LED Function Definitions

Status LED Definition

GREEN HDD Activity AMBER HDD Fail

The activity LED functionality is controlled directly by the hard drives. This causes the LED to function differently between SAS and SATA drives. The expected operation is outlined below.

Table 41. Hard Drive Activity LED Functionality

Condition Drive Type Behavior

SAS Ready LED stays on Power on with no drive activity SATA Ready LED stays off SAS Ready LED blinks off when processing a command Power on with drive activity SATA Ready LED blinks on when processing a command SAS Ready LED stays off Power on and drive spun down SATA Ready LED stays off SAS Ready LED blinks* Power on and drive spinning up SATA Ready LED stays off

6.5.2.3 Optional 6th Hard Drive

The backplane is capable of supporting a 6 an optionally installed backplane add-in board. The 6 a PCB with power and interface connectors, and a mounting bracket allowing for the add-in card to slide into a fitted cut out on the existing backplane.

Revision – 1.6

hot-swap SAS/SATA hard drive with the addition of

drive add-in board assembly consists of

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7. Standard Control Panel

The standard control panel supports several push buttons and status LEDs, along with USB and video ports to centralize system control, monitoring, and accessibility to within a common compact design.

The control panel assembly comes pre-assembled and is modular in design. The control panel assembly module slides into a slot on the front of the chassis and is blind mated with a slot connector on the backplane. It is not hot-swappable.

TP02110

Figure 40. Standard Control Panel Assembly Module

7.1 Control Panel Buttons

The standard control panel assembly houses several system control buttons. Each of their functions is listed in the table below.

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Figure 41. Control Panel Buttons

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Table 42. Control Button and Intrusion Switch Functions

Reference Feature Function

A Power /

Sleep Button

B ID Button Toggles the front panel ID LED and the server board ID LED on/off. The

C Reset Button Reboots and initializes the system. D NMI Button Pressing the recessed button with a paper clip or pin puts the server in a

Toggles the system power on/off. This button also functions as a Sleep Button if enabled by an ACPI-compliant operating system.

server board ID LED is visible through the rear of the chassis and allows you to locate the server you’re working on from behind a rack of servers.

halt state for diagnostic purposes and allows you to issue a non-maskable interrupt. After issuing the interrupt, a memory download can be performed to determine the cause of the problem.

7.2 Control Panel LED Indicators

The control panel houses six LEDs, which are viewable with or without the front bezel to display the system’s operating state.

Power and Sleep LED

NIC1 and NIC2

Activity LEDs

Hard Drive Activity LED

System Status LED

Figure 42. Control Panel LEDs

System Identity LED

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The following table identifies each LED and describes their functionality.

Table 43. Control Panel LED Functions

LED Color State Description

Green On NIC Link NIC1 / NIC2

Activity

Power / Sleep (on standby power)

System Status (on standby power)

Disk Activity

System Identification

Green Blink NIC Activity

On Legacy power on / ACPI S0 state Green

1,4

Blink Off Off Power Off / ACPI S4 or S5 state Green/Amber Alternating

Blink

On Running / normal operation Green

Blink

On Critical or non-recoverable condition. Amber

Blink Off Off POST / system stop. Green Random blink Provides an indicator for disk activity. Off Off Blue On Identify active via command or button. Off Off No Identification.

Sleep / ACPI S1 state

Pre DC Power On – 15-20 second BMC Initialization

1,2

Degraded

1,2

Non-critical condition.

No hard disk activity

Notes:

1. Blink rate is ~1 Hz with at 50% duty cycle.

2. The amber status takes precedence over the green status. When the amber LED is on or blinking, the green LED is off.

3. Also off when the system is powered off (S4/S5) or in a sleep state (S1).

4. The power LED sleep indication is maintained on standby by the chipset. If the system is powered down without going through BIOS, the LED state in effect at the time of power off will be restored when the system is powered on until the BIOS clears it. If the system is not powered down normally, it is possible that the Power LED will be blinking at the same time that the system status LED is off due to a failure or configuration change that prevents the BIOS from running.

The current limiting resistors for the power LED, the system fault LED, and the NIC LEDs are located on the server board.

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7.2.1 Power / Sleep LED

Table 44. SSI Power LED Operation

State Power Mode LED Description

Power Off Non-ACPI Off System power is off, and the BIOS has not initialized the chipset. Power On Non-ACPI On System power is on, but the BIOS has not yet initialized the chipset. S5 ACPI Off Mechanical is off, and the operating system has not saved any context

to the hard disk.

S4 ACPI Off Mechanical is off. The operating system has saved context to the hard

disk.

S3-S1 ACPI Slow blink 1 DC power is still on. The operating system has saved context and

gone into a level of low-power state.

S0 ACPI Steady on System and the operating system are up and running.

Notes:

1. Blink rate is ~ 1Hz with at 50% duty cycle.

7.2.2 System Status LED

Color State Criticality Description

Off N/A Not ready AC power off Green/ Amber

Alternating Blink

Not ready Pre DC Power On – 15-20 second BMC Initialization when

Green Solid on Ok System booted and ready Green Blink Degraded System degraded

Amber Blink Non-critical Non-fatal alarm – system is likely to fail

Revision – 1.6

Table 45. Control Panel LED Operation

AC is applied to the server. Control Panel buttons are disabled until BMC initialization is complete.

　 Unable to use all of the installed memory (more than one DIMM installed). 　 Correctable errors over a threshold of 10 and migrating to a spare DIMM (memory sparing). This indicates that the user no longer has spared DIMMs indicating a redundancy lost condition. Corresponding DIMM LED should light up. 　 In mirrored configuration, when memory mirroring takes place and system loses memory redundancy. This is not covered by (2). 　 Redundancy loss such as power-supply or fan. This does not apply to non-redundant sub-systems.

　 PCIe* link errors 　 CPU failure / disabled – if there are two processors and

one of them fails 　 Fan alarm – Fan failure. Number of operational fans should be more than minimum number needed to cool the system

　 Non-critical threshold crossed – Temperature and voltage 　 Critical voltage threshold crossed

　 VRD hot asserted 　 Minimum number of fans to cool the system not present

or failed 　 In non-sparing and non-mirroring mode if the threshold of ten correctable errors is crossed within the window

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Amber Solid on Critical, non-

recoverable

Fatal alarm – system has failed or shutdown 　 DIMM failure when there is one DIMM present, no good memory present 　 Run-time memory uncorrectable error in non-redundant mode

　 IERR signal asserted 　 Processor 1 missing 　 Temperature (CPU ThermTrip, memory TempHi, critical

threshold crossed)

　 No power good – power fault 　 Processor configuration error (for instance, processor

stepping mismatch)

7.2.2.1 System Status LED – BMC Initialization

When AC power is first applied to the system and 5V-STBY is present, the BMC controller on the server board requires 15-20 seconds to initialize. During this time, the system status LED will blink, alternating between amber and green, and the power button functionality of the control panel is disabled, preventing the server from powering up. Once BMC initialization has completed, the status LED will stop blinking and the power button functionality is restored and can be used to turn on the Server.

7.2.3 Drive Activity LED

The drive activity LED on the front panel indicates drive activity from the onboard hard disk controllers. The Intel LED for add-in controllers.

Server Board S5000PAL also provides a header giving access to this

7.2.4 System Identification LED

The blue system identification LED is used to help identify a system for servicing. This is especially useful when the system is installed when in a high density rack or cabinet that is populated with several similar systems.

The blue system ID LED can be illuminated using either of two mechanisms.

- By pressing the system ID button on the system control panel, the ID LED will display a solid blue color until the button is pressed again.

- By issuing the appropriate hex IPMI chassis identify value, the ID LED will either blink blue for 15 seconds and turn off or will blink indefinitely until the appropriate hex IPMI chassis identify value is issued to turn it off.

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6BStandard Control Panel Intel® Server System SR2500AL

7.3 Control Panel Connectors

The control panel has two external I/O connectors:

• One USB port

• One VGA video port

The following tables provide the pin-outs for each connector.

Table 46. External USB Connectors (J1B1)

Pin # Description

1 PWR_FP_USB2 2 USB_DN2_FP_R 3 USB_DP2_FP_R 4 GND 5 GND 6 GND 7 GND

Table 47. Video Connector (J1A1)

Description Pin # Pin # Description

VGA_RED 1 9 GND VGA_GREEN 2 10 GND VGA_BLUE 3 11 Unused Unused 4 12 VGA_DDCDAT GND 5 13 VGA_HSYNC_L GND 6 14 VGA_VSYNC_L VGA_INUSE_L 7 15 VGA_DDCCLK GND 8 16 GND 17 GND

If a monitor is connected to the control panel video connector, the rear video port on the server board will be disabled and the control panel video will be enabled. The video source is the same for both connectors and is switched between the two, with the control panel having priority over the rear video. This provides for easy front accessibility to the server.

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7.4 Internal Control Panel Interconnect

All control panel signals are directed through a single 64-pin card edge connector eliminating the need for any cables. When installed into the chassis control panel bay, the control panel card edge connector is blind mated with a slot connector on the backplane.

Standard Control

Panel PCB

AF000039

Figure 43. Standard Control Panel PCB

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6BStandard Control Panel Intel® Server System SR2500AL

The following table defines the pin-out for the 64-pin edge connector.

Table 48. 64-pin Control Panel Connector (J6B1)

PIN SIGNAL NAME PIN SIGNAL NAME

A1 GND B1 1_WIRE_BUS A2 VGA_VSYNC_FP_L B2 P5V A3 GND B3 P5V A4 VGA_HSYNC_FP_L B4 P5V A5 GND B5 VGA_INUSE_L A6 VGA_BLUE_FP B6 GND A7 GND B7 P5V_STBY A8 VGA_GREEN_FP B8 GND A9 GND B9 FAULT_LED_5VSB A10 VGA_RED_FP B10 GND A11 GND B11 FP_SYS_FLT_LED1_R_L A12 GND B12 FP_ID_SW_L A13 FP_RST_BTN_L B13 FP_ID_LED_R_L A14 GND B14 NC_IPMB_5VSB_SDA A15 NC_FP_CHASSIS_L B15 NC_IPMB_5VSB_SCL A16 GND B16 GND A17 BP_I2C_5V_SDA B17 NIC1_ACT _LED_L A18 BP_I2C_5V_SCL B18 NIC1_LINK_LED_R_L A19 GND B19 FP_PWR_BTN_L A20 FP_NMI_BTN_L B20 PWR_LED_5VSB A21 GND B21 HDD_LED_P3V3_A A22 USB_DP2_FP B22 GND A23 USB_DN2_FP B23 GND A24 GND B24 NIC2_ACT_LED_L A25 GND B25 NIC2_LINK_LED_R_L A26 PWR_FP_USB2 B26 HDD_FAULT_LED_R_L A27 PWR_FP_USB3 B27 HDD_LED_ACT_R_L A28 GND B28 FP_PWR_LED_R_L A29 GND B29 FP_SYS_FLT_LED2_R_L A30 USB_DP3_FP B30 GND A31 USB_DN3_FP B31 GND A32 GND B32 NC_RST_P6_PWRGOOD

Revision – 1.6

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Intel® Server System SR2500AL 7BIntel® Local Control Panel

8. Intel® Local Control Panel

The Intel® Local Control Panel utilizes a combination of control buttons, LEDs, and LCD display to provide system accessibility, monitoring, and control functions. The pre-assembled module slides into a slot on the front of the chassis where a card edge connector is blind mated to a matching slot edge connector on the backplane eliminating any cable attachments. The Intel Local Control Panel module is designed so that it can be adjusted for use with or without an outer front bezel.

TP02113

Figure 44. Intel® Local Control Panel Assembly Module

The following diagram provides an overview of the control panel features.

C D E

O M L K J HIN G

TP02099

Figure 45. Intel® Local Control Panel Overview

A LCD Display I System Status LED B LCD Menu Control Button – Up J NIC 2 Activity LED C LCD Menu Control Button – Down K NIC 1 Activity LED D LCD Menu Control Button – Previous Option L Hard Drive Activity LED E LCD Menu Control Button – Previous Page M System Reset Button F ID LED N USB 2.0 Port G Power LED O NMI Button (Tool Required) H System Power Button P USB 2.0 Port

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8.1 LED Functionality

The following table identifies each LED and describes their functionality.

Table 49. Control Panel LED Functions

LED Color State Description

Green On NIC Link NIC1 / NIC2

Activity

Power / Sleep (on standby power)

System Status (on standby power)

Disk Activity

System Identification

Notes:

1. Blink rate is ~1 Hz with at 50% duty cycle.

2. The amber status takes precedence over the green status. When the amber LED is on or blinking, the green LED is off.

3. Also off when the system is powered off (S4/S5) or in a sleep state (S1).

Green Blink NIC Activity

On Legacy power on / ACPI S0 state Green

1,4

Blink Off Off Power Off / ACPI S4 or S5 state Green/Amber Alternating

Blink

On Running / normal operation Green

Blink

On Critical or non-recoverable condition. Amber

Blink Off Off POST / system stop. Green Random blink Provides an indicator for disk activity. Off Off Blue On Identify active via command or button. Off Off No Identification.

Sleep / ACPI S1 state

Pre DC Power On – 15-20 second BMC Initialization

1,2

Degraded

1,2

Non-critical condition.

No hard disk activity

The current limiting resistors for the power LED, the system fault LED, and the NIC LEDs are located on the Intel

Revision – 1.6

Server Board S5000PAL.

Intel order number D31980-009

Intel® Server System SR2500AL 7BIntel® Local Control Panel

8.1.1 Power / Sleep LED

Table 50. SSI Power LED Operation

State Power Mode LED Description

to the hard disk.

S4 ACPI Off Mechanical is off. The operating system has saved context to the hard

disk.

S3-S1 ACPI Slow blink 1 DC power is still on. The operating system has saved context and

gone into a level of low-power state.

S0 ACPI Steady on System and the operating system are up and running.

Notes:

1. Blink rate is ~ 1Hz with at 50% duty cycle.

8.1.2 System Status LED

Table 51. Control Panel LED Operation

Color State Criticality Description

Off N/A Not ready AC power off Green/ Amber

Alternating Blink

Not ready Pre DC Power On – 15-20 second BMC Initialization when

AC is applied to the server. Control Panel buttons are

disabled until BMC initialization is complete. Green Solid on Ok System booted and ready Green Blink Degraded System degraded

　 Unable to use all of the installed memory (more than one

DIMM installed).

　 Correctable errors over a threshold of 10 and migrating to

a spare DIMM (memory sparing). This indicates that the user

no longer has spared DIMMs indicating a redundancy lost

condition. Corresponding DIMM LED should light up.

　 In mirrored configuration, when memory mirroring takes

place and system loses memory redundancy. This is not

covered by (2).

　 Redundancy loss such as power-supply or fan. This does

not apply to non-redundant sub-systems.

　 PCIe link errors

　 CPU failure / disabled – if there are two processors and

one of them fails

　 Fan alarm – Fan failure. Number of operational fans

should be more than minimum number needed to cool the

system

　 Non-critical threshold crossed – Temperature and voltage Amber Blink Non-critical Non-fatal alarm – system is likely to fail

　 Critical voltage threshold crossed

　 VRD hot asserted

　 Minimum number of fans to cool the system not present

or failed

　 In non-sparing and non-mirroring mode if the threshold of

ten correctable errors is crossed within the window

Revision – 1.6

Intel order number D31980-009

7BIntel® Local Control Panel Intel® Server System SR2500AL

Amber Solid on Critical, non-

recoverable

Fatal alarm – system has failed or shutdown

　 DIMM failure when there is one DIMM present, no good

memory present

　 Run-time memory uncorrectable error in non-redundant

mode

　 IERR signal asserted

　 Processor 1 missing

　 Temperature (CPU ThermTrip, memory TempHi, critical

threshold crossed)

　 No power good – power fault

　 Processor configuration error (for instance, processor

stepping mismatch)

8.1.2.1 System Status LED – BMC Initialization

8.1.3 Drive Activity LED

The drive activity LED on the front panel indicates drive activity from the onboard hard disk controllers. The Intel LED for add-in controllers.

Server Board S5000PAL also provides a header giving access to this

8.1.4 System Identification LED

The blue system ID LED can be illuminated using either of two mechanisms.

- By pressing the system ID button on the system control panel, the ID LED will display a solid blue color until the button is pressed again.

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 7BIntel® Local Control Panel

8.2 Intel® Local Control Panel Interconnects

The Intel® Local Control Panel module includes the control panel interface board and an interposer board. Connectors on the control panel interface board are cabled to matching connectors on the interposer board. When the pre-assembled control panel module is installed into the chassis, a card edge connector on the interposer card is blind mated with a slot edge connector on the backplane. This section will define the pin-out for each connector and header found on both the control panel interface board and interposer board.

• A 64-pin card edge connector on the interposer board is used to route signals to/from

the backplane to the control panel interface board. The backplane is used as a conduit for communication to the server board.

• Signals from the card edge connector are routed to control panel interface board through

matching 50-pin connectors on the interposer board and control panel interface board. The 50-pin connectors are attached using a small 50-pin flat cable.

• USB signals from the card edge connector are routed to the control panel interface

board through matching 10-pin connectors on the interposer board and control panel interface board. The 10-pin connectors are attached using a small 10-pin round cable.

• A 4-pin IPMI header (not used).

• A 4-pin NMI/Temp Sensor header.

The following tables provide the pin-outs for each connector.

Table 52. 50-pin Control Panel Connector

PIN SIGNAL NAME PIN SIGNAL NAME

Revision – 1.6

Intel order number D31980-009

7BIntel® Local Control Panel Intel® Server System SR2500AL

PIN SIGNAL NAME PIN SIGNAL NAME

A26 PWR_FP_USB2 B26 HDD_FAULT_LED_R_L A27 PWR_FP_USB3 B27 HDD_LED_ACT_R_L A28 GND B28 FP_PWR_LED_R_L A29 GND B29 FP_SYS_FLT_LED2_R_L A30 USB_DP3_FP B30 GND A31 USB_DN3_FP B31 GND A32 GND B32 NC_RST_P6_PWRGOOD

Table 53. Internal USB Header

Pin # Description

1 PWR_FP_USB2 2 PWR_FP_USB3 3 USB_DP2_FP 4 USB_DN2_FP 5 USB_DP3_FP 6 USB_DN3_FP 7 GND 8 GND 9 TP_USB0_P9 10 TP_USB0_P10

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 8BPCI Riser Cards and Assembly

9. PCI Riser Cards and Assembly

The chassis supports different riser card options depending on the add-in card configuration desired. The riser assembly for the chassis is tool-less. Stand-offs on the bracket allow the riser cards to slide onto the assembly where a latching mechanism than holds each riser in place. Holding down the latch releases the risers for easy removal.

When re-inserting the riser assembly into the chassis, tabs on the back of the assembly should be aligned with slots on the back edge of the chassis. The tabs fit into the slots securing the riser assembly to the chassis when the top cover is in place.

The riser assembly provides two extraction levers to assist with riser assembly removal from the riser slots.

AF000038

Figure 46. Low Profile PCIe* Riser

Revision – 1.6

Intel order number D31980-009

8BPCI Riser Cards and Assembly Intel® Server System SR2500AL

9.1 Riser Card Options

The Intel® Server Board S5000PAL has two riser slots capable of supporting riser cards for both 1U and 2U system configurations. Because of board placement resulting in different pin orientations, and expanded technology support associated with the full-height riser, the riser slots are not the same and require different riser cards.

The low profile riser slot (J5B1) utilizes a 98-pin connector. It is capable of supporting up to two low profile PCIe* add-in cards. The x8 PCIe bus can support bus speeds of up to 20Gb/S. The following table provides the supported bus throughput for the given riser card used and the number of add-in cards installed.

Low Profile Riser 1 add-in card 2 add-in cards

2U X4 X4

Note: There are no population rules for installing a single low profile add-in card in the 2U low profile riser card; a single add in card can be installed in either PCI Express* slot. While each slot can accommodate a x8 card, each slot will only support x4 bus speeds.

The full height riser slot (J4F1) implements Intel

Adaptive Slot Technology. This 280-pin connector is capable of supporting riser cards that meet either the PCI-X* or PCI Express* technology specifications. The following tables show the maximum bus speed supported with different add-in card populations.

Full Height Riser

PCI-X “Passive” (Product

Order Code –

ADRPCIXRIS)

2U – 3 add-in card slots Up to 100MHz in top PCI

1 add-in card 2 add-in cards 3 add-in cards

slot

Up to 100MHz using top and middle slots

66MHz

Note: For the 2U PCI-X* (passive) riser card, add-in cards should be installed starting with the top slot first, followed by the middle, and then the bottom. Any add-in card populated in the bottom PCI slot will cause the bus to operate at 66MHz.

Full Height Riser

PCI-X “Active” (Product

Order Code –

ADRACTRIS)

2U Up to 133MHz Up to 133MHz Up to 133MHz

1 add-in card 2 add-in cards 3 add-in cards

Note: Each PCI slot on the 2U PCI-X* (active) riser card operates on an independent PCI bus.

Using an add-in card that operates below 133MHz will not affect the bus speed of the other PCI slots.

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 8BPCI Riser Cards and Assembly

Full Height Riser

PCI Express* (Product

Order Code –

ASR2500FHR)

2U – 3 add-in card slots Single PCIe* x4 in top slot

1 add-in card 2 add-in cards 3 add-in cards

Dual PCIe – x4 And PCI-X – Up to 133MHz

or x8 in middle slot Or PCI-X* – Up to 133MHz in bottom slot

Single PCIe – x4 in either slot or x8 in middle slot and PCIX – Up to 133MHz Or Dual PCIe – x4

9.2 PCI Riser Card Mechanical Drawings

Ø 6.00 [0.236]

R2.00

[0.079]

5.00 [0.197]

Detail A

Scale 2.000

Well Buying

DMI-02D-30-3

2X 67.75 [2.667]

66.17 [2.605]

46.98 [1.850]

41.98 [1.653]

24.32 [0.958]

23.32 [0.918]

19.32 [0.761]

10.90 [0.429]

8.40 [0.331]

Ø 3.50 [0.138]

See Detail A

Pad

154.00 [6.063]

2X 144.00 [5.669]

10.16 [0.400]

2X R1.00

[0.039]

98.27 [3.869]

2X 69.26 [2.727]

2X 58.50 [2.303]

1.90 [0.075]

39.15 [1.541]

2X 28.51 [1.123]

20.37 [0.802]

22.37 [0.881]

14.40 [0.567]

4.50 [0.177]

0.00 [0.000]

2X Molex SD-87715-013 6012A0100101

12.15 [0.478]

74.75 [2.943]

64.25 [2.530]

54.25 [2.136]

35.32 [1.391]

33.16 [1.306]

27.32 [1.076]

17.24 [0.679]

12.84 [0.506]

8.40 [0.0331]

0.00 [0.000]

Figure 47. Low Profile Passive PCI Express* Riser Card

Revision – 1.6

Side 2

Ground Pad

87.00 [3.425]

Intel order number D31980-009

13.89 [0.547]

25.39 [0.999]

TP02322

8BPCI Riser Cards and Assembly Intel® Server System SR2500AL

Ø 8.26

[0.325]

Both Side

Ground Pad

3.50 [0.138]

Ø 3.50 [0.138]

20˚

10.76

[0.424]

1.60 [0.063]

Detail A

Scale 2.000

74.75 [2.943]

70.43 [2.773]

67.67 [2.664]

58.18 [2.291]

50.11 [1.973]

38.29 [1.508]

35.40 [1.394]

32.20 [1.268]

27.40 [1.079]

2X 17.15 [0.675]

8.40 [0.331]

3.50 [0.138]

0.00 [0.000]

0.5 X 45˚ 6 Pcs

5.00 [0.197]

Ø 6.00 [0.236]

R2.00 [0.079]

0.00 [0.000]

22.36 [0.880]

2X 5.00 [0.197]

2X 14.91 [0.587]

9.22 [0.363]

24.24 [0.954]

2X 24.24 [0.954]

4X Side 1

No Component

Side 2 No Component

66.05 [2.600] 66.00 [2.598]

1.90 [0.075]

71.12 [2.800]

83.59 [3.291]

8.40 [0.331]

75.27 [2.963]

2X 94.41 [3.717]

Side 2 Ground Pad

See Detail B

12.15 [0.478]

1.90 [0.075]

4X 2.50 [0.098]

155.70 [6.130]

141.27 [5.562]

152.77 [6.015]

153.42 [6.040]

156.77 [6.172]

See Detail A

5X R1.00 [0.039]

161.02 [6.339]

170.65 [6.719]

68.90 [2.713]

2X 67.78 [2.668]

2X 47.46 [1.868]

2X R1.27 [0.050]

6.25 [0.246]

Detail B

Scale 2.000

Notes:

1. PCB tolerance: A: 62 mil (1.58 mm) ± 7 mil B: 93 mil (2.36 mm) ± 9 mil C: 98 mil (2.49 mm) ± 9 mil

2. If there is needed: sheet 1: Board profile and mounting hole 2: Pin location 3: Constrain area on both sides

3. No indicated radii should be 2.00 mm

5.00 [0.197]

Figure 48. Full Height PCI Express* Riser Card

TP02320

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 8BPCI Riser Cards and Assembly

Ø 8.26

[0.325]

Both Side

Ground Pad

3.50 [0.138]

Ø 3.50 [0.138]

Scale 2.000

74.75 [2.943]

72.84 [2.868]

67.67 [2.664]

52.52 [2.068]

Detail A

See Detail A

5.00 [0.197]

Ø 6.00 [0.236]

R2.00 [0.079]

22.36 [0.880]

2X 5.00 [0.197]

71.12 [2.800]

2X 83.59 [3.291]

Side 2 Ground Pad

2X 155.70 [6.130]

5X R1.00 [0.039]

68.90 [2.713]

58.18 [2.291]

35.40 [1.394]

32.20 [1.268]

27.40 [1.079]

2X 17.15 [0.675]

8.40 [0.331]

0.00 [0.000]

1.60 [0.063]

10.76

[0.424]

Scale 2.000

Notes:

1. PCB tolerance: A: 62 mil (1.58 mm) ± 7 mil B: 93 mil (2.36 mm) ± 9 mil C: 98 mil (2.49 mm) ± 9 mil

2. If there is needed: sheet 1: Board profile and mounting hole 2: Pin location 3: Constrain area on both sides

3. No indicated radii should be 2.00 mm

Detail B

0.5 X 45˚ 6 Pcs

5.00 [0.197]

Figure 49. Full Height Passive PCI-X* Riser Card

0.00 [0.000]

9.22 [0.363]

5.00 [0.197]

See Detail B

Side 2 No Component

1.90 [0.075]

66.05 [2.600] 66.00 [2.598]

3X 24.24 [0.954]

75.27 [2.963]

74.32 [2.926]

76.22 [3.001]

8.40 [0.331]

12.15 [0.478]

1.90 [0.075]

141.27 [5.562]

142.22 [5.599]

140.32 [5.524]

152.77 [6.015]

153.42 [6.040]

156.77 [6.172]

161.02 [6.339]

170.65 [6.719]

38.29 [1.508]

2X R1.27 [0.050]

6.25 [0.246]

3.50 [0.138]

TP02321

Revision – 1.6

Intel order number D31980-009

8BPCI Riser Cards and Assembly Intel® Server System SR2500AL

See Detail A

74.75 [2.943]

72.84 [2.868]

67.67 [2.664]

58.18 [2.291]

52.52 [2.068]

38.39 [1.508]

35.40 [1.394]

32.20 [1.268]

27.40 [1.079]

17.15 [0.675]

2X 8.40 [0.331]

3.50 [0.138]

0.00 [0.000]

0.5 X 45˚ 6 Pcs

0.00 [0.000]

22.36 [0.880]

9.22 [0.363]

2X 5.00 [0.197]

3X 24.24 [0.954]

66.05 [2.600] 66.00 [2.598]

Notes:

1. PCB tolerance: A: 62 mil (1.58 mm) ± 7 mil B: 93 mil (2.36 mm) ± 9 mil C: 98 mil (2.49 mm) ± 9 mil

2. If there is needed: sheet 1: Board profile and mounting hole 2: Pin location 3: Constrain area on both sides

3. No indicated radii should be 2.00 mm

1.90 [0.075]

Ø 8.26

[0.325]

3.50 [0.138]

71.12 [2.800]

83.59 [3.291]

75.27 [2.963]

74.32 [2.926]

76.22 [3.001]

Scale 2.000

8.40 [0.331]

Detail A

Side 2 Ground Pad

See Detail B

12.15 [0.478]

1.90 [0.075]

141.27 [5.562]

140.32 [5.524]

5.00 [0.197]

Ø 6.00 [0.236]

2X R2.00 [0.079]

155.70 [6.130]

142.22 [5.599]

152.77 [6.015]

153.42 [6.040]

156.77 [6.172]

10.76

[0.424]

2X R1.27 [0.050]

161.02 [6.339]

170.65 [6.719]

Detail B

Scale 2.000

204.35 [8.045]

192.41 [7.575]

5.00 [0.197]

213.35 [8.400]

R1.00 [0.039]

70.50 [2.776]

68.90 [2.713]

56.63 [2.230]

8.40 [0.331]

6.25 [0.246]

1.60 [0.063]

TP02323

Figure 50. Full Height Active PCI-X* Riser Card

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 9BSupported Intel® Server Boards

10. Supported Intel® Server Boards

The chassis is mechanically and functionally designed to support the Intel® Server Board S5000PAL and Intel

Server Board S5000XAL. The following sections provide an overview of the server board feature sets. The Technical Product Specification for the server board should be referenced for more detailed information.

10.1 Intel® Server Board S5000PAL / S5000XAL Feature Set

The Intel® Server Board S5000PAL and Intel® Server Board S5000XAL are monolithic printed circuit boards with features that were designed to support the high-density 1U and 2U server markets.

Feature Description

Processors 771-pin LGA sockets supporting 1 or 2 Dual-Core Intel® Xeon® processors 5000 sequence, with

Memory 8 Keyed DIMM slots supporting fully buffered DIMM technology (FBDIMM) memory. 240-pin

Chipset Intel® 5000 Chipset Family which includes the following components:

On-board Connectors/Headers

Add-in PCI, PCI-X*, PCI Express* Cards

On-board Video ATI* ES1000 video controller with 16MB DDR SDRAM On-board Hard Drive

Controller

LAN Two 10/100/1000 Intel® 82563EB PHYs supporting Intel® I/O Acceleration Technology System Fans Six 4-pin Fan Headers supporting two processor fans, and four system fans System Management Support for Intel® System Management Software

system bus speeds of 667 MHz, 1066 MHz, or 1333 MHz

DDR2-533 and DDR2-677 FBDIMMs must be used.

Intel

5000P Memory Controller Hub or Intel® 5000X Memory Controller Hub

Intel

6321ESB I/O Controller Hub1

Note: Intel w Controller Hub.

External connections:

 Stacked PS/2* ports for keyboard and mouse  RJ45 Serial B port  Two RJ45 NIC connectors for 10/100/1000 Mb connections  Two USB 2.0 ports  Video Connector

Internal connectors/headers:

 One USB port header, capable of providing two USB 2.0 ports  One DH10 Serial A header  Six SATA ports via the ESB-2 and integrated SW RAID 0/1/10 support  One 44pin (power + I/O) ATA/100 connector for optical drive support  One Intel  One Intel

 SSI-compliant 24-pin control panel header  SSI-compliant 24-pin main power connector, supporting the ATX-12V standard on the first 20 pins  8-Pin +12V Processor Power Connector

ill only make available an OEM SKU of this server board using the Intel

Remote Management Module (Intel® RMM) connector (Intel® RMM use is optional)

I/O Expansion Module Connector supporting:

 Dual GB NIC Intel  External SAS Intel  Infiniband* I/O Expansion Module (Optional)

I/O Expansion Module (Optional)

5000X Memory

 One low profile riser slot supporting 1U or 2U PCIe* riser cards  One full height riser slot supporting 1U or 2U PCI-X* and PCIe* riser cards

 Six ESB-2 SATA ports.  Intel

 Optional support for SW RAID 5 with activation key.2

Embedded Server RAID Technology II with SW RAID levels 0/1/10.

For the remainder of this document, the Intel® 6321ESB I/O Controller Hub may be refferred to as ESB-2.

Onboard SATA SW RAID 5 support provided as a post-launch product feature.

Revision – 1.6

Intel order number D31980-009

9BSupported Intel® Server Boards Intel® Server System SR2500AL

FF EE DD

CC BB

K L

TP02071

V UST

Figure 51. Intel® Server Board S5000PAL

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 9BSupported Intel® Server Boards

Description Description

A BIOS Bank Select Jumper V System Fan #2 Header B Intel® 6321ESB I/O Controller Hub W CPU Power Connector C IO Module Option Connector X Main Power Connector D POST Code Diagnostic LEDs Y Battery E Intel® Adaptive Slot – Full Height Z Power Supply Management Connector F PCI Express* Riser Slot – Low Profile AA Dual Port USB 2.0 Header G System Identification LED - Blue BB System Fan #1 Header H External IO Connectors CC SSI 24-pin Control Panel Header I Status LED – Green / Amber DD SATA 0 J Serial ‘B’ Port Configuration Jumper EE SATA 1 K System Fan #4 Header FF SATA 2 L System Fan #3 Header GG SATA 3 M FBDIMM Slots HH SATA 4 N Intel® 5000P Memory Controller Hub (MCH) or

O CPU #1 Connector JJ SATA SW RAID 5 Activation Key Connector P CPU #2 Connector KK Intel® Remote Management Module (RMM)

Q CPU #1 Fan Header LL System Recovery Jumper Block R Voltage Regulator Heat Sink MM Chassis Intrusion Switch Header S CPU #2 Fan Header NN 3-pin IPMB Header T Bridge Board Connector OO Intel® Local Control Panel Header U ATA-100 Optical Drive Connector (Power+IO) PP Serial ‘A’ Header QQ Intel® RMM NIC Connector

Intel

5000X Memory Controller Hub (MCH)

II SATA 5

Connector

Figure 52. Intel® Server Board S5000PAL Components

10.1.1 Processor Support

The server system supports one or two Dual-Core Intel® Xeon® processors 5000 sequence, with system bus speeds of 667 MHz, 1066 MHz, and 1333 MHz, and core frequencies starting at

2.67 GHz. Previous generations of the Intel board.

For additional information on processor compatibility and a list of supported processors, please see the Intel

Server Board S5000PAL/S5000XAL Technical Product Specification (TPS).

Xeon® processor are not supported on this server

Revision – 1.6

Intel order number D31980-009

10BEnvironmental and Regulatory Specifications Intel® Server System SR2500AL

11. Environmental and Regulatory Specifications

11.1 System Level Environmental Limits

The table below defines the system level operating and non-operating environmental limits

Table 54. System Environmental Limits Summary

Parameter Limits

Operating Temperature Non-Operating

Temperature Non-Operating Humidity

Acoustic noise Sound Pressure: 55 dBA (Rack mount) in an idle state at typical office ambient

Shock, operating Half sine, 2 g peak, 11 mSec Shock, unpackaged Trapezoidal, 25 g, velocity change 136 inches/sec Shock, packaged Vibration, unpackaged 5 Hz to 500 Hz, 2.20 g RMS random Shock, operating Half sine, 2 g peak, 11 mSec ESD +/-15kV except I/O port +/-8KV per Intel Environmental test specification System Cooling

Requirement in BTU/Hr

+10°C to +35°C with the maximum rate of change not to exceed 10°C per hour

-40°C to +70°C 90%, non-condensing @ 28°C

temperature. (23 +/- degrees C) Sound Power: 7.0 BA in an idle state at typical office ambient temperature. (23 +/- 2 degrees C)

Non-palletized free fall in height 24 inches (≧40 lbs to < 80 lbs)

3264 BTU/hour

11.2 Serviceability and Availability

The system is designed to be serviced by qualified technical personnel only. The desired Mean Time To Repair (MTTR) of the system is 30 minutes including diagnosis of

the system problem. To meet this goal, the system enclosure and hardware have been designed to minimize the MTTR.

Following are the maximum times that a trained field service technician should take to perform the listed system maintenance procedures, after diagnosis of the system and having identified the failed component.

Activity Time

Estimate

Remove cover 1 min Remove and replace hard disk drive 5 min Remove and replace power supply module 1 min Remove and replace system fan (non-hot swappable) 7 min Remove and replace system fan (hot swappable) 1 min Remove and replace backplane board 12 min Remove and replace midplane board 10 min Remove and replace control panel module 2 min Remove and replace server board 15 min

Revision – 1.6

Intel order number D31980-009

Intel® Server System SR2500AL 10BEnvironmental and Regulatory Specifications

11.3 Replacing the Back up Battery

The lithium battery on the server board powers the real time clock (RTC) for up to 10 years in the absence of power. When the battery starts to weaken, it loses voltage, and the server settings stored in CMOS RAM in the RTC (for example, the date and time) may be wrong. Contact your customer service representative or dealer for a list of approved devices.

WARNING

Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the equipment manufacturer. Discard used batteries according to manufacturer’s instructions.

ADVARSEL!

Lithiumbatteri - Eksplosionsfare ved fejlagtig håndtering. Udskiftning må kun ske med batteri af samme fabrikat og type. Levér det brugte batteri tilbage til leverandøren.

ADVARSEL

Lithiumbatteri - Eksplosjonsfare. Ved utskifting benyttes kun batteri som anbefalt av apparatfabrikanten. Brukt batteri returneres apparatleverandøren.

VARNING

Explosionsfara vid felaktigt batteribyte. Använd samma batterityp eller en ekvivalent typ som rekommenderas av apparattillverkaren. Kassera använt batteri enligt fabrikantens instruktion.

VAROITUS

Paristo voi räjähtää, jos se on virheellisesti asennettu. Vaihda paristo ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä käytetty paristo valmistajan ohjeiden mukaisesti.

Revision – 1.6

Intel order number D31980-009

10BEnvironmental and Regulatory Specifications Intel® Server System SR2500AL

11.4 Product Regulatory Compliance

The server chassis product, when correctly integrated per this guide, complies with the following safety and electromagnetic compatibility (EMC) regulations. Intended Application – This product was evaluated as Information Technology Equipment (ITE), which may be installed in offices, schools, computer rooms, and similar commercial type locations. The suitability of this product for other product categories and environments (such as: medical, industrial, telecommunications, NEBS, residential, alarm systems, test equipment, etc.), other than an ITE application, may require further evaluation.

Notifications to Users on Product Regulatory Compliance and Maintaining Compliance

To ensure regulatory compliance, you must adhere to the assembly instructions in this guide to ensure and maintain compliance with existing product certifications and approvals. Use only the described, regulated components specified in this guide. Use of other products / components will void the UL listing and other regulatory approvals of the product and will most likely result in noncompliance with product regulations in the region(s) in which the product is sold. To help ensure EMC compliance with your local regional rules and regulations, before computer integration, make sure that the chassis, power supply, and other modules have passed EMC testing using a server board with a microprocessor from the same family (or higher) and operating at the same (or higher) speed as the microprocessor used on this server board. The final configuration of your end system product may require additional EMC compliance testing. For more information please contact your local Intel Representative. This is an FCC Class A device and its use is intended for a commercial type market place.

11.5 Use of Specified Regulated Components

To maintain the UL listing and compliance to other regulatory certifications and/or declarations, the following regulated components must be used and conditions adhered to. Interchanging or use of other component will void the UL listing and other product certifications and approvals. Updated product information for configurations can be found on the Intel Server Builder Web site at the following URL:

http://channel.intel.com/go/serverbuilder

If you do not have access to Intel’s Web address, please contact your local Intel representative.

Server chassis (base chassis is provided with power supply and fans)⎯UL listed.

Server board⎯you must use an Intel server board—UL recognized. Add-in boards⎯must have a printed wiring board flammability rating of minimum UL94V-

1. Add-in boards containing external power connectors and/or lithium batteries must be UL recognized or UL listed. Any add-in board containing modem telecommunication circuitry must be UL listed. In addition, the modem must have the appropriate telecommunications, safety, and EMC approvals for the region in which it is sold.

Peripheral Storage Devices - must be UL recognized or UL listed accessory and TUV or VDE licensed. Maximum power rating of any one device or combination of devices can not exceed manufacturers specifications. Total server configuration is not to exceed the maximum loading conditions of the power supply.

The following table references Server Chassis Compliance and markings that may appear on the product. Markings below are typical markings however, may vary or be different based on how certification is obtained.

Note: Certifications Emissions requirements are to Class A

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Table 55. Product Safety & Electromagnetic (EMC) Compliance

Compliance Regional

Description

Compliance

Reference

Compliance Reference Marking Example

Australia / New Zealand AS/NZS 3548 (Emissions)

N232

Argentina IRAM Certification (Safety)

Belarus Belarus Certification None Required Canada / USA

CSA 60950 – UL 60950 (Safety)

Industry Canada ICES-003 (Emissions)

FCC CFR 47, Part 15 (Emissions)

CANADA ICES-003 CLASS A

CANADA NMB-003 CLASSE A

This device complies with Part 15 of the

FCC Rules. Operation of this device is subject to the following two conditions: (1) This device may not cause harmful

interference, and (2) This device must accept interference receive, including

interference that may cause undesired operation.

China CNCA – CB4943 (Safety)

GB 9254 (Emissions) GB17625 (Harmonics)

CENELEC Europe Low Voltage Directive 93/68/EEC;

EMC Directive

89/336/EEC

EN55022 (Emissions) EN55024 (Immunity) EN61000-3-2 (Harmonics) EN61000-3-3 (Voltage Flicker) CE Declaration of Conformity

Germany GS Certification – EN60950

International CB Certification – IEC60950

CISPR 22 / CISPR 24

Japan VCCI Certification

Korea RRL Certification

MIC Notice No. 1997-41 (EMC) & 1997-42 (EMI)

None Required

인증번호: CPU-Model Name (A)

Russia GOST-R Certification

GOST R 29216-91 (Emissions) GOST R 50628-95 (Immunity)

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Compliance Regional

Description

Ukraine Ukraine Certification None Required Taiwan BSMI CNS13438

Compliance

Reference

Compliance Reference Marking Example

R33025

11.6 Electromagnetic Compatibility Notices

11.6.1 USA

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this product, contact: Intel Corporation

5200 N.E. Elam Young Parkway Hillsboro, OR 97124 1-800-628-8686

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

 Reorient or relocate the receiving antenna.  Increase the separation between the equipment and the receiver.  Connect the equipment to an outlet on a circuit other than the one to which the receiver

is connected.

 Consult the dealer or an experienced radio/TV technician for help.

Any changes or modifications not expressly approved by the grantee of this device could void the user’s authority to operate the equipment. The customer is responsible for ensuring compliance of the modified product.

Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC Class B limits may be attached to this computer product. Operation with noncompliant peripherals is likely to result in interference to radio and TV reception.

All cables used to connect to peripherals must be shielded and grounded. Operation with cables, connected to peripherals that are not shielded and grounded may result in interference to radio and TV reception.

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11.6.2 FCC Verification Statement

Product Type: SR2500; S5000PAL This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this product, contact: Intel Corporation

5200 N.E. Elam Young Parkway Hillsboro, OR 97124-6497

Phone: 1 (800)-INTEL4U or 1 (800) 628-8686

11.6.3 ICES-003 (Canada)

Cet appareil numérique respecte les limites bruits radioélectriques applicables aux appareils numériques de Classe A prescrites dans la norme sur le matériel brouilleur: “Appareils Numériques”, NMB-003 édictée par le Ministre Canadian des Communications.

(English translation of the notice above) This digital apparatus does not exceed the Class A limits for radio noise emissions from digital apparatus set out in the interference-causing equipment standard entitled “Digital Apparatus,” ICES-003 of the Canadian Department of Communications.

11.6.4 Europe (CE Declaration of Conformity)

This product has been tested in accordance too, and complies with the Low Voltage Directive (73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark to illustrate its compliance.

11.6.5 Japan EMC Compatibility

Electromagnetic Compatibility Notices (International)

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English translation of the notice above: This is a Class A product based on the standard of the Voluntary Control Council For

Interference (VCCI) from Information Technology Equipment. If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

11.6.6 BSMI (Taiwan)

The BSMI Certification number and the following warning is located on the product safety label which is located on the bottom side (pedestal orientation) or side (rack mount configuration).

11.6.7 RRL (Korea)

Following is the RRL certification information for Korea.

English translation of the notice above:

1. Type of Equipment (Model Name): On License and Product

2. Certification No.: On RRL certificate. Obtain certificate from local Intel representative

3. Name of Certification Recipient: Intel Corporation

4. Date of Manufacturer: Refer to date code on product

5. Manufacturer/Nation: Intel Corporation/Refer to country of origin marked on product

11.6.8 CNCA (CCC-China)

The CCC Certification Marking and EMC warning is located on the outside rear area of the product.

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11.7 Product Ecology Compliance

Intel has a system in place to restrict the use of banned substances in accordance with world wide product ecology regulatory requirements. The following is Intel’s product ecology compliance criteria.

Compliance Regional

Description

California California Code of Regulations, Title 22, Division 4.5;

Chapter 33: Best Management Practices for Perchlorate Materials.

China

China RoHS Administrative Measures on the Control of Pollution Caused by Electronic Information Products” (EIP) #39. Referred to as China RoHS. Mark requires to be applied to retail products only. Mark used is the Environmental Friendly Use Period (EFUP). Number represents years.

Compliance Reference

Marking Example

Special handling may

apply. See

www.dtsc.ca.gov/hazardo

uswaste/perchlorate

This notice is required by

California Code of

Regulations, Title 22,

Division 4.5; Chapter 33:

Best Management

Practices for Perchlorate

Materials. This product /

part includes a battery

which contains

Perchlorate material.

Intel Internal Specification

Europe

China Recycling (GB18455-2001)

Mark requires to be applied to be retail product only. Marking applied to bulk packaging and single packages. Not applied to internal packaging such as plastics, foams, etc.

All materials, parts and subassemblies must not contain restricted materials as defined in Intel’s Environmental Product Content Specification of Suppliers and Outsourced Manufacturers – http://supplier.intel.com/ehs/environmental.htm

Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC – Mark applied to system level products only.

European Directive 2002/95/EC Restriction of Hazardous Substances (RoHS) Threshold limits and banned substances are noted below. Quantity limit of 0.1% by mass (1000 PPM) for: Lead, Mercury, Hexavalent Chromium, Polybrominated Biphenyls Diphenyl Ethers (PBB/PBDE) Quantity limit of 0.01% by mass (100 PPM) for: Cadmium

None Required

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Compliance Regional

Description

Germany

Intel Internal Specification

International

Japan

Compliance Reference

German Green Dot Applied to Retail Packaging Only for Boxed Boards

ISO11469 - Plastic parts weighing >25gm are intended to be marked with per ISO11469.

Recycling Markings – Fiberboard (FB) and Cardboard (CB) are marked with international recycling marks. Applied to outer bulk packaging and single package.

Japan Recycling Applied to Retail Packaging Only for Boxed Boards

Compliance Reference

Marking Example

None Required

>PC/ABS<

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