Enterprise Platforms and Services Division – Marketing
Revision History Intel® Server System SR2500AL
Revision History
Date Revision
Number
June 2006 1.0 Initial release.
August 2006 1.1 Updated Active Midplane Diagram.
Updated single power supply population rules.
Updated fan numbering orientation.
January 2007 1.2 Updated ASR2500FHR population table.
Updated figure 16.
Updated regulatory section.
February 2007 1.3 Updated power supply illustrations to show proper placement when using only
one power supply.
August 2007 1.4 Updated figure 18 to reflect proper fan circuitry. Edited processor support and
platform control section.
October 2007 1.5 Updated Power Sub-System. Updated Table 54.
November 2008 1.6 Add introduction of Midplane2
Modifications
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Intel order number D31980-009
Intel® Server System SR2500AL Disclaimers
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel
assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining
applications. Intel may make changes to specifications and product descriptions at any time,
without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined." Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Server System SR2500AL may contain design defects or errors known as errata
which may cause the product to deviate from published specifications. Current characterized
errata are available on request.
This document and the software described in it is furnished under license and may only be used
or copied in accordance with the terms of the license. The information in this manual is
furnished for informational use only, is subject to change without notice, and should not be
construed as a commitment by Intel Corporation. Intel Corporation assumes no responsibility or
liability for any errors or inaccuracies that may appear in this document or any software that may
be provided in association with this document.
Except as permitted by such license, no part of this document may be reproduced, stored in a
retrieval system, or transmitted in any form or by any means without the express written consent
of Intel Corporation.
The Intel® Server Chassis SR2500 is a 2U server chassis that is designed to support the Intel®
Server Board S5000PAL. The server board and the chassis have features that are designed to
support the high-density server market. This chapter provides a high-level overview of the
chassis features. Greater detail for each major chassis component or feature is provided in the
following chapters.
The chassis differs from previous generation products in that the majority of cables have been
removed from the system and in their place are a series of board-to-board interconnects. The
benefits of using board-to-board interconnects are simplification of platform integration and
improved airflow for more reliable cooling.
A second significant change from the previous generation is the introduction of the mid-plane
circuit board. There are two options for the mid-plane circuit board: the first option provides
SAS RAID support. The second option is a passive SATA/SAS mid-plane that can be used with
either the SATA only connectors from the server board, or SATA/SAS connectors from an addin card.
1.1 Chassis Views
TP02091
Figure 1. Front View with Optional Bezel
TP02092
Figure 2. Front View without Bezel (Shown with Standard Control Panel Option)
TP02093
Figure 3. Back View – (Shown with 1+1 Power Supply Configuration)
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1.2 Chassis Dimensions
Table 1. Chassis Dimensions
Height 87.30 mm 3.44”
Width without rails 430 mm 16.93”
Width with rails 451.3 mm 17.77”
Depth without CMA 704.8 mm 27.75”
Depth with CMA 838.2 mm 33.0”
Max. Weight 29.5 kg 65 lbs
1.3 System Components
E
F
D
C
B
A
N
M
L
K
A
J
Figure 4. Major Chassis Components
A. Rack Handles H. CPU Air Duct
B. SAS/SATA Backplane I. System Fan Assembly
C. Air Baffles J. Standard Control Panel
D. Power Distribution Module K. Flex Bay – 6
E. Power Supply Modules L. Hard Drive Bays
F. Riser Card Assembly M. Slim-Line Optical Drive Bay
G. System Memory N. Front Bezel (Optional)
th
HDD or Tape (Optional)
G
H
I
TP02094
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The I/O connector locations on the back of the chassis are pre-cut, so the use of an I/O shield is
not required. The supplied EMI gasket must be installed to maintain Electromagnetic
Interference (EMI) compliance levels.
AB
P
A. Low Profile PCIe* Add-in Card Slots I. USB 6
B. Full Height PCI Add-in Card Slots J. USB 5
C. Upper Power Supply Module K. Video
D. Upper Power Receptacle L. DB-9 Serial A Connector
E. Lower Power Receptacle M. NIC 2
F. Lower Power supply Module N. NIC 1
G. Intel® Remote Management Module NIC (Optional) O. RJ45 Serial B Connector
H. Intel
®
I/O Expansion Module (Optional) P.
N
O
K
L
M
Figure 5. Back Panel Feature Overview
I
GHEF
J
PS2* Keyboard and Mouse
Connectors
C
D
TP02095
1.4 System Boards
The complete system includes the use of several system boards which are used as internal
interconnects and provide feature accessibility. The following provides a brief description for
each.
•Bridge Board – PCB used to route signals from the server board to the mid-plane and
control panel boards.
•Mid-plane – A PCB used to determine the desired hard drive interface for the system.
Two mid-plane options are available for this system:
o Active SAS/SAS RAID – cable less solution with onboard SAS controller
o Passive SATA – cabled to SATA ports on the server board or from add-in
adapter.
•Backplane – Hot swap backplane capable of supporting both SATA and SAS hard
drives.
•Riser Cards – PCI riser cards used to provide up to five add-in card slots to the system.
Available riser card options for this system include:
o Low profile, two slot PCI Express*
o Full height, three slot PCI-X* (passive)
o Full height, three slot PCI-X (active) with onboard PXH PCI bridge chip
o Full height, two PCI Express slots + one PCI-X slot
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•Optical Drive Interposer Card – Used to interface optical drive with 44-pin IDE cable as
cabled from the server board.
•Control Panel – A PCB providing system status and control functionality features. Two
control panel options are available for this system
o Standard Control Panel
o Intel
®
Local Control Panel with LCD support
•RAID Activation Keys – The system provides different RAID options depending on the
mid-plane option selected. Two RAID Activation Keys are available for this system
o Hardware RAID Activation Key – Used on the Active SAS/SAS RAID Mid-plane
to enable hardware RAID support.
o Software SATA RAID 5 Activation Key – This RAID key plugs into a connector on
the server board. It is used to enable the software SATA RAID 5 functionality of
the Intel
®
6321ESB I/O Controller Hub SATA ports of the server board when
cabled to the passive mid-plane.
1.5 Control Panel Options
The chassis can support either of two control panels: a Standard Control Panel and an Intel®
Local Control Panel with LCD support. The control panel assemblies are pre-assembled and
modular in design. The entire module assembly slides into a predefined slot in the front of the
chassis.
A
Figure 6. Control Panel Modules
B
TP02097
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The standard control panel supports several push buttons and status LEDs, along with USB and
video ports to centralize system control, monitoring, and accessibility. The following diagram
overviews the layout and functions of the control panel.
BAFGEDC
H
I
LJK
TP02098
Figure 7. Standard Control Panel Overview
A. NIC #2 Activity LED G. System Identification LED
B. NIC #1 Activity LED H. System Identification Button
C. Power / Sleep Button I. System Reset Button
D. Power / Sleep LED J. USB 2.0 Connector
E. Hard Drive Activity LED K. Recessed NMI Button (Tool Required)
F. System Status LED L. Video Connector
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The Intel® Local Control Panel utilizes a combination of control buttons, LEDs, and an LCD
display to provide system accessibility, monitoring, and control functions. The following diagram
provides an overview of this control panel.
BA
C
D
E
F
OM L K JHING
TP02099
Figure 8. LCD Control Panel Overview
A USB 2.0 Port I Power/Sleep Button
B LCD Display J System Status LED
C Menu Control Button, Scroll up K NIC 2 Activity LED
D Menu Control Button, Scroll down L NIC 1 Activity LED
E Menu Control Button, Scroll left M Hard Disk Drive Activity LED
F Menu Control Button, Enter N Reset Button
G System Identification LED O USB 2.0 Port
H Power/Sleep LED
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1.6 Hard Drive and Peripheral Bays
The chassis is designed to support several different hard drive and peripheral configurations.
The system includes a hot swap backplane capable of supporting either SAS or SATA drives.
The sixth bay (see letter “B” in the figure below) can optionally be configured to support a sixth
hard drive or 3.5” tape drive.
AC
Figure 9. Front Panel Feature Overview
A. Slimline Optical Drive Bay
B. 6th HDD Drive or Tape Drive Bay (Optional)
C. System Control Panel
D. 3.5” Hard Drive Bays (5)
1.7 Power Sub-system
B
D
TP02096
The power subsystem of the chassis consists of an integrated power distribution board and
module enclosure which is capable of housing up to two 750 Watt power supply modules
supporting 1+0 or redundant 1+1 power configurations. In a 1+1 redundant configuration, each
power supply module is hot-swappable should one fail.
The power sub-system has several integrated management features including:
• Status LED on each power module
• Over-temperature protection circuitry
• Over-voltage protection circuitry
With the addition of server management software, the power subsystem is capable of
supporting several system management features including:
• Remote Power On/Off
• Status Alerting
• FRU Information Reporting
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Each power supply module operates within the following voltage ranges and ratings:
Start-up
PARAMETER MIN RATED MAX
Line Voltage
(110)
Line Voltage
(220)
Frequency 47 Hz 50/60Hz 63 Hz
1 Maximum input current at low input voltage range shall be measured at 90Vac, at max load.
2 Maximum input current at high input voltage range shall be measured at 180VAC, at max load.
90V
100-127 V
rms
180V
200-240 V
rms
140V
rms
264V
rms
rms
- - 6.0 A
rms
Vac
85Vac
±4Vac
Power
Off
Vac
75Vac
±5Vac
Max Input
AC Current
1,3
12 A
11.0A
rms
2,3
rms
Max Rated
Input AC
5.5A
3 This is not to be used for determining agency input current markings.
4 Maximum rated input current is measured at 100VAC and 200VAC.
1.8 System Cooling
The chassis is offered with two system cooling options. The first option is a three fan solution
providing sufficient airflow to maintain internal system thermal requirements when the external
ambient temperature remains within specified limits. The second option is a 5+1 fan
configuration. Refer to section 3.2 for details. Should a single fan failure occur, this option
provides support for hot-swap fans and fan redundancy.
In addition to the system fan options, each power supply module installed provides two
additional non-redundant fans which pull air from inside the chassis out the back.
Current
4
rms
4
rms
1.9 Chassis Security
The chassis provides support for a lockable front bezel which prevents unauthorized access to
the system control buttons and hard drives. In addition, a chassis intrusion switch is provided
allowing server management software to monitor removal of the top cover from the chassis.
1.10 Rack and Cabinet Mounting Options
The chassis was designed to support 19” wide by up to 30” deep server cabinets. The chassis
supports three rack mount options:
o A fixed mount relay rack / cabinet mount kit (Product order code - AXXBRACKETS ) which
can be configured to mount the system into either a 2-post rack or 4-post cabinet
o A tool-less full extracting slide rail kit (Product order code – AXXHERAIL) designed to
support an optional cable management arm (Product order code – AXXRACKCARM).
o A basic slide rail kit (Product order code – AXXBASICRAIL) designed to mount the chassis
into a standard (19” by up to 30” deep) EIA-310D compatible server cabinet.
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1.11 Front Bezel Features
The optional front bezel is made of molded plastic and uses a snap-on design. When installed,
its design allows for maximum airflow to maintain system cooling requirements.
TP02100
Figure 10. Optional Front Bezel
Separate front bezels are available to support systems that use either a standard control panel
or the Intel
®
Local Control Panel with LCD support.
When the standard control panel is used, light pipes on the backside of the front bezel allow the
system status LEDs to be monitored with the front bezel in the closed position. The front bezel
lock is provided to prevent unauthorized access to hard drives, peripheral devices and the
control panel.
TP02101
Figure 11. Front Bezel Supporting Standard Control Panel
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When the local control panel is used, the control panel module can be adjusted to extend further
out from the chassis face to allow the LCD panel to protrude from the front bezel.
AF000054
Figure 12. Front Bezel Supporting Intel
®
Local Control Panel
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Intel® Server System SR2500AL 1BPower Sub-System
2. Power Sub-System
The power sub-system of the chassis consists of an integrated Power Distribution Module
(PDM), a power module enclosure, and support for up to two 750 Watt power supply modules.
The power sub-system can be configured to support a single module in a 1+0 non-redundant
configuration, or dual modules in a 1+1 redundant power configuration. In a 1+1 configuration, a
single failed power module can be hot-swapped with the system running. Either configuration
will support up to a maximum of 750 Watts of power.
This chapter provides technical details to the operation of the power supply module and power
sub-system.
2.1 Mechanical Overview
The drawing below displays the Power Distribution Module and the power supply module
enclosure assembly.
FLANGE DETAILS TDB
FLANGE DETAILS TDB
106.0 +/- 0.5
106.0 +/- 0.5
MODULE
MODULE
83.5 +/- 0.5
83.5 +/- 0.5
CAGE
CAGE
40.0 +/- 0.5
(100)
(100)
400 +/- 1.0
400 +/- 1.0
300 +/- 0.5
300 +/- 0.5
MAX TBD
MAX TBD
109.0 +/- 0.5
109.0 +/- 0.5
CAGE
CAGE
40.0 +/- 0.5
MODULE
MODULE
Figure 13. Mechanical Drawing for Dual (1+1 configuration) Power Supply Enclosure with PDM
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2.2 Single Power Supply Module Population
In single power module configurations, server management firmware requires that the power
supply module be populated in the top power module slot. The non-operating slot must have
the power supply blank installed.
AF000023
Figure 14. Power Supply Blank
Configuring a single power supply module in the bottom location will cause the server
management firmware and BIOS to generate a system error during POST and the error will be
reported to the System Event Log (SEL).
2.3 Handle and Retention Mechanism
Each power supply module includes a handle for module insertion to or removal from the
module enclosure. Each module has a simple retention mechanism to hold the power module
in place once it is inserted. This mechanism will withstand the specified platform mechanical
shock and vibration requirements. The tab on the retention mechanism is colored green
to
indicate it is a hot-swap touch point. The latch mechanism is designed to prevent insertion or
removal of the module with the power cord plugged in. This will aid the hot-swapping procedure.
2.4 Hot-swap Support
Hot-swapping a power supply module is the process of extracting and re-inserting a power
supply module from an operating power system. During this process the output voltages shall
remain within specified limits. Up to two power supply modules may be on a single AC line.
The power supply module can be hot-swapped by the method listed below.
Extraction: on removal, the power cord is unplugged first, and then the power module is
removed. This can be done in standby mode or power-on mode.
Insertion: The module is inserted first, and then the power cord is plugged in. If powered off, the
system and the power supply will power on into standby mode or power-on mode.
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2.5 Airflow
Each power supply module incorporates two non-redundant 40mm fans for self cooling and
partial system cooling. The fans will provide no less than 10 CFM airflow through the power
supply when installed in the system and operating at maximum fan speed. The cooling air will
enter the power module from the PDB side (pre-heated air from the system).
2.6 AC Power Cord Specification Requirements
The AC power cord used must meet the following specification requirements:
Cable Type SJT
Wire Size 16 AWG
Temperature Rating 105º C
Amperage Rating 13A
Voltage Rating 125V
2.7 Output Cable Harness
The power distribution board provides a cable harness providing connectors to the various
system boards. The harness size, connectors, and pin outs are shown below. Listed or
recognized component appliance wiring material (AVLV2), CN, rated 105
shall be used for all output wiring.
Table 2. Power Harness Cable Definitions
Length
mm
90, 90°
angle
115, 90°
angle
100 P3 1x5 Server Board Signal Connector
150 P4 2x4 Backplane Power Connector
220 P5 2x5 Mid-plane Power Connector
To
connector #
P1 2x12 Main Power Connector
P2 2x4 Processor Power Connector
No of
pins
Description
°C min, 300Vdc min
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2.7.1 P1 – Server Board Power Connector
Connector housing: 24- Pin Molex* Mini-Fit Jr. 39-01-2245 or equivalent
Contact: Molex Mini-Fit, HCS, Female, Crimp 44476 or equivalent
Table 3. P1 Main Power Connector
PIN SIGNALS 18 AWG COLOR PIN SIGNAL
1 +3.3 VDC Orange 13 +3.3 VDC Orange
2 +3.3 VDC Orange 14
3 COM (GND) Black 15 COM Black
4 5 VDC Red 16 PS_ON# Green
5V RS Red (24 AWG) 17 COM Black
5 COM Black 18 COM Black
6 +5 VDC Red 19 COM Black
7 COM Black 20
8 PWR OK Gray 21 +5 VDC Red
9 5Vsb Purple 22 +5 VDC Red
10 +12 V3 Yellow/Blue 23 +5 VDC Red
11 +12 V3 Yellow/Blue 24 COM Black
12 +3.3 VDC Orange
-12 VDC
Reserved (-5V in ATX)N.C.
2.7.2 P2 – Processor Power Connector
Connector housing: 8- Pin Molex 39-01-2085 or equivalent
Contact: Molex
44476-1111 or equivalent
18 AWG
COLORS
Blue
PIN SIGNAL 18 AWG COLORS PIN SIGNAL 18 AWG COLORS
1 COM Black 5 +12 V1 Yellow
2 COM Black 6 +12 V1
3 COM Black 7 +12 V2
4 COM Black 8 +12 V2
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Table 4. P2 Processor Power Connector
Yellow
Yellow/Black
Yellow/Black
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2.7.3 P3 – Power Signal Connector
Connector housing: 5-pin Molex 50-57-9705 or equivalent
Contacts: Molex 16-02-0087 or equivalent
Table 5. P3 Power Signal Connector
PIN SIGNAL 24 AWG COLORS
1 I2C Clock (SCL) White/Green
2 I2C Data (SDL) White/Yellow
3 SMBAlert# White
4 ReturnS Black
5 3.3RS White/Brown
2.7.4 P4 – Backplane Power Connector
Connector housing: 8 Pin Molex Mini-Fit Jr. PN# 39-01-2245 or equivalent
Contact: Molex Mini-Fit, HCS, Female, Crimp 44476 or equivalent
Table 6. P4 Hot Swap Backplane Power Connector
PIN SIGNAL 18 AWG COLORS PIN SIGNAL 18 AWG COLORS
1 COM Black 5 +12 V4 Yellow/Green
2 COM Black 6 +12 V4 Yellow/Green
3 +5V Red 7 +5Vsb Purple
4 +5V Red 8 +3.3V Orange
2.7.5 P5 Mid-plane Power Connector
Connector housing: 10 Pin Molex Mini-Fit Jr. 43025-1000 or equivalent
Contact: Molex Mini-Fit, HCS, Female, Crimp 43030-0007 or equivalent
Table 7. P5 Mid-plane Power Connector
PIN SIGNAL 20 AWG Colors PIN SIGNAL 20 AWG Colors
1 COM Black 6 +12 V4 Yellow/Green
2 COM Black 7 +12 V4 Yellow/Green
3 +5V Red 8 +12 V4 Yellow/Green
4 +3.3V Orange 9 +12 V4 Yellow/Green
5 COM Black 10 +5Vsb Purple
2.8 AC Input Requirements
The power supply module incorporates universal power input with active power factor
correction, which reduces line harmonics in accordance with the EN61000-3-2 and JEIDA MITI
standards.
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2.8.1 Efficiency
The following table provides the required minimum efficiency level at various loading conditions.
These are provided at three different load levels; 100%, 50% and 20%. Efficiency is tested over
an AC input voltage range of 115VAC to 220VAC.
Table 8. Efficiency
Loading 100% of maximum 50% of maximum 20% of maximum
Recommended Efficiency ~80% ~83% ~78%
2.8.2 AC Input Voltage Specification
The power supply must operate within all specified limits over the input voltage range shown in
the following table.
Table 9. AC Input Rating
Start-up
PARAMETER MIN RATED MAX
Line Voltage
(110)
Line Voltage
(220)
Frequency 47 Hz 50/60Hz 63 Hz
90V
100-127 V
rms
180V
200-240 V
rms
140V
rms
264V
rms
rms
rms
Vac
85Vac
±4Vac
-
Notes:
1. Maximum input current at low input voltage range shall be measured at 90Vac, at max load.
2. Maximum input current at high input voltage range shall be measured at 180VAC, at max load.
3. This is not to be used for determining agency input current markings.
4. Maximum rated input current is measured at 100VAC and 200VAC.
Harmonic distortion of up to 10% of the rated AC input voltage must not cause the power supply
to go out of specified limits. The power supply shall power off at or below 75Vac ±5Vac. The
power supply shall start up at or above 85VAC ±4Vac. Application of an input voltage below
85VAC shall not cause damage to the power supply or blow a fuse.
Power
Off
Vac
75Vac
±5Vac
-
Max Input
AC Current
rms
rms
1,3
2,3
12 A
6.0 A
Max Rated
Input AC
11.0A
5.5A
Current
rms
rms
4
4
2.8.3 AC Line Dropout / Holdup
An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC
line for any length of time. During an AC dropout of one cycle or less the power supply must
meet dynamic voltage regulation requirements over the rated load. If the AC dropout lasts
longer than one cycle the power supply should recover and meet all turn-on requirements. The
power supply must meet the AC dropout requirement over rated AC voltages, frequencies, and
output loading conditions. Any dropout of the AC line shall not cause damage to the power
supply.
20ms Min when tested under the following conditions: Max combined load = 525W,
12ms Min when tested under the following conditions: Max combined load = 750W
2.8.4 AC Line 5 VSB Holdup
The 5VSB output voltage should stay in regulation under its full load (static or dynamic) during
an AC dropout of 70ms min (=5VSB holdup time) whether the power supply is in ON or OFF
state (PSON asserted or de-asserted).
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2.8.5 AC Inrush
AC line inrush current shall not exceed 40A peak for up to one-quarter of the AC cycle, after
which, the input current should be no more than the specified maximum input current. The peak
inrush current shall be less than the ratings of its critical components (including input fuse, bulk
rectifiers, and surge limiting device).
The power supply must meet the inrush requirements for any rated AC voltage, during turn on at
any phase of AC voltage, during a single cycle AC dropout condition as well as upon recovery
after AC dropout of any duration, and over the specified temperature range (T
). It is
op
acceptable that AC line inrush current may reach up to 60A peak for up to 1 msec.
2.9 Protection Circuits
Protection circuits inside the PDB and the power supply shall cause the power supply’s main
+12V output to shut down, or shall cause a shut down of any of the three outputs on the PDB.
Either of these shutdowns will result in shutting down the entire power supply / PDB
combination. If the power supply latches off due to a protection circuit tripping, an AC cycle
OFF for 15 seconds shall be able to reset the power supply and the PDB.
2.9.1 Over-Current Protection (OCP)
Each DC/DC converter output on the PDB shall have individual OCP protection circuits. The
power supply and power distribution board (PS and PDB) shall shutdown and latch off after an
over-current condition occurs. This latch shall be cleared by an AC power interruption. The
following table provides the over-current limits. The values are measured at the PDB harness
connectors. The DC/DC converters shall not be damaged from repeated power cycling in this
condition. The +12V output from the power supply is divided on the PDB into four channels
and each is limited to 240VA of power. There shall be current sensors and limit circuits to shut
down the entire PS and PDB if the limit is exceeded. The limits are listed below.
Output Voltage MIN OCP TRIP LIMITS MAX OCP TRIP LIMITS
+3.3V 110% min (= 26.4A min) 150% max (= 36A max)
+5V 110% min (= 33A min) 150% max (= 45A max)
-12V 125% min (= 0.625A min) 400% max (= 2.0A max)
+12V1 112.5% min (= 18.0A min) 20A max
+12V2 112.5% min (= 18.0A min) 20A max
+12V3 112.5% min (= 18.0A min) 20A max
+12V4 112.5% min (= 18.0A min) 20A max
2.9.2 Over-Voltage Protection (OVP)
Each DC/DC converter output on the PDB shall have individual OVP circuits built in and they
shall be locally sensed. The PS and PDB shall shutdown and latch off after an over-voltage
condition occurs. This latch shall be cleared by an AC power interruption. The following table
provides the over-voltage limits. The values are measured at the PDB harness connectors. The
voltage shall never exceed the maximum levels when measured at the power pins of the output
harness connector during any single point of fail. The voltage shall never trip any lower than the
minimum levels when measured at the power pins of the PDB connector.
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Table 11. Over-Voltage Protection (OVP) Limits
Output Voltage OVP MIN (V) OVP MAX (V)
+3.3V 3.9 4.5
+5V 5.7 6.5
+5VSB 5.7 6.5
-12V -13.3 -14.5
+12V1/2/3/4 13.0 14.5
2.9.3 Over-Temperature Protection (OTP)
The power supply will be protected against over-temperature conditions caused by loss of fan
cooling or excessive ambient temperature. In an OTP condition the power supply will shutdown.
When the power supply temperature drops to within specified limits, the power supply shall
restore power automatically, while the 5 Vsb remains constantly on. The OTP trip level shall
have a minimum of 4°C of ambient temperature hysteresis, so that the power supply will not
oscillate on and off due to a temperature recovery condition. The power supply shall alert the
system of the OTP condition via the power supply FAIL signal and the PWR LED.
2.10 DC Output Specification
2.10.1 Output Power / Currents
The following table defines power and current ratings for this 750W continuous (860W pk)
power supply in 1+0 or 1+1 redundant configuration. The combined output power of both
outputs shall not exceed the rated output power. The power supply must meet both static and
dynamic voltage regulation requirements for the minimum loading conditions. Also, the power
supply shall be able to supply the listed peak currents and power for a minimum of 10 seconds.
Outputs are not required to be peak loaded simultaneously.
+12V +5Vsb
MAX Load
MIN DYNAMIC Load
MIN STATIC Load
PEAK Load
Max Output Power (continuous)
Peak Output Power
2.10.2 Standby Output / Standby Mode
The 5Vsb output shall be present when an AC input greater than the power supply turn-on AC
voltage is applied. Applying an external 5.25V to 5Vsb shall not cause the power supply to shut
down or exceed operating limits. When the external voltage is removed the voltage shall return
to the power supplies operating voltage without exceeding the dynamic voltage limits.
62.0A 3.0A
3.0A 0.1A
0.0A 0.1A
70.0A(12s min) 5.0A (0.5s min @ turn-on)
12V x 62A = 744W max 5V x 3A = 15W max
12V x 70A = 840W pk 5V x 5A = 25W pk
Revision – 1.6
18
Intel order number D31980-009
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