Intel SR1425BK1 - Entry Server Platform, SC1400UP, SR1425BK1-E Technical Specifications

Intel® Server Chassis SC1400UP /

®

Intel

Technical Product Specification

Server Platform SR1425BK1-E

Intel order number C94051-001

Revision 1.0

October 2004

Enterprise Platforms and Services Marketing

Revision History

Date Revision

Number

February 2004 0.5 Updated to reflect Alpha – first external release
July 2004 0.8 Added CPU air duct, updated SATA and SCSI backplane info, added LCP

info, added riser card info,
October 2004 0.9 Updated P/S specification
October 2004 1.0 Final Release

Modifications

Revision 1.0 ii

Disclaimers

Information in this document is provided in connection with Intel® products. No license, express
or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel
assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular
purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining
applications. Intel may make changes to specifications and product descriptions at any time,
without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined." Intel reserves these for future definition and shall have no
responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

This document contains information on products in the design phase of development. Do not
finalize a design with this information. Revised information will be published when the product
is available. Verify with your local sales office that you have the latest datasheet before
finalizing a design.

The Intel® Server Chassis SC1400UP and Intel® Server Platform SR1425BK1-E may contain
design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.

This document and the software described in it is furnished under license and may only be used
or copied in accordance with the terms of the license. The information in this manual is
furnished for informational use only, is subject to change without notice, and should not be
construed as a commitment by Intel Corporation. Intel Corporation assumes no responsibility or
liability for any errors or inaccuracies that may appear in this document or any software that may
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Except as permitted by such license, no part of this document may be reproduced, stored in a
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of Intel Corporation.

Intel, Pentium and Xeon are trademarks or registered trademarks of Intel Corporation.

*Other brands and names may be claimed as the property of others.

Copyright © Intel Corporation 2004.

Revision 1.0 iii

Table of Contents

1. Intel® Server Chassis SC1400UP Feature Summary ..................................................- 13 -

1.1 Chassis Views ...................................................................................................- 13 -

1.2 Chassis Dimensions ..........................................................................................- 13 -

1.3 Intel® Server Chassis SC1400UP System Components...................................- 14 -

1.4 Rear Panel Components ...................................................................................- 15 -

1.5 Hard Drive and Peripheral Bays ........................................................................- 15 -

1.6 Control Panel .....................................................................................................- 16 -

1.7 Power Sub-system.............................................................................................- 17 -

1.8 System Cooling..................................................................................................- 18 -

1.9 Chassis Security ................................................................................................- 18 -

1.10 Rack and Cabinet Mounting Options .................................................................- 18 -

1.11 Front Bezels.......................................................................................................- 18 -

2. Cooling Sub-System ......................................................................................................- 20 -

2.1 System Fans......................................................................................................- 21 -

2.2 Power Supply Fans............................................................................................- 22 -

2.3 CPU/Memory Air Duct and Side Air Baffle.........................................................- 22 -

2.4 Hard Drive Bays.................................................................................................- 23 -

3. Peripheral and Hard Drive Support...............................................................................- 24 -

3.1 Slimline Drive Bay..............................................................................................- 24 -

3.1.1 Floppy Drive Support with or without Backplane present ..................................- 24 -

3.2 Hard Disk Drive Bays.........................................................................................- 27 -

3.2.1 Hot Swap Hard Disk Drive Trays .......................................................................- 28 -

3.2.2 Fixed Drive Trays...............................................................................................- 28 -

3.2.3 Drive Blanks.......................................................................................................- 28 -

3.3 Hot-Swap SCSI Backplane................................................................................- 29 -

3.3.1 Hot-Swap SCSI Backplane Board Layout .........................................................- 29 -

3.3.2 SCSI Backplane Functional Architecture...........................................................- 30 -

3.3.3 SCSI Backplane Connector Definitions .............................................................- 33 -

3.4 Hot-Swap SATA Backplane...............................................................................- 36 -

3.4.1 SATA Backplane Layout....................................................................................- 37 -

3.4.2 SATA Backplane Functional Architecture..........................................................- 37 -

3.4.3 SATA Backplane Connector Definitions ............................................................- 40 -

4. Standard Control Panel .................................................................................................- 42 -

4.1 Control Panel Buttons.......................................................................................- 42 -

Revision 1.0 iv

4.2 Control Panel LED Indicators ............................................................................- 43 -

4.2.1 Power / Sleep LED ............................................................................................- 44 -

4.2.2 System Status LED............................................................................................- 44 -

4.2.3 Drive Activity LED ..............................................................................................- 45 -

4.2.4 System Identification LED..................................................................................- 45 -

4.3 Control Panel Connectors..................................................................................- 46 -

4.4 Internal Control Panel Assembly Headers.........................................................- 46 -

5. PCI Riser Cards and Assembly.....................................................................................- 48 -

5.1 Riser Card Options ............................................................................................- 48 -

6. Power Sub-system .........................................................................................................- 50 -

6.1 Mechanical Specifications .................................................................................- 50 -

6.2 Airflow Requirements.........................................................................................- 51 -

6.3 Acoustics ...........................................................................................................- 51 -

6.4 Temperature ......................................................................................................- 52 -

6.5 Output Connectors.............................................................................................- 52 -

6.5.1 P1 Main power connector ..................................................................................- 52 -

6.5.2 P2 Processor Power Connector ........................................................................- 53 -

6.5.3 P3-P5 Peripheral Connectors ............................................................................- 53 -

6.6 AC Inlet Connector ............................................................................................- 54 -

6.7 Marking and Identification..................................................................................- 54 -

6.8 AC Input Voltage................................................................................................- 54 -

6.9 AC Line Transient Specification.........................................................................- 54 -

6.10 Susceptibility......................................................................................................- 55 -

6.10.1 Electrostatic Discharge Susceptibility ................................................................- 55 -

6.10.2 Fast Transient/Burst ..........................................................................................- 55 -

6.10.3 Radiated Immunity.............................................................................................- 55 -

6.10.4 Surge Immunity..................................................................................................- 55 -

6.11 AC Line Fast Transient (EFT) Specification ......................................................- 56 -

6.12 AC Line Dropout / Holdup..................................................................................- 56 -

6.12.1 AC Line 5VSB Holdup .......................................................................................- 56 -

6.13 Power Recovery ................................................................................................- 56 -

6.13.1 Voltage Brown Out.............................................................................................- 56 -

6.13.2 Voltage Interruptions..........................................................................................- 56 -

6.14 AC Line Inrush ...................................................................................................- 57 -

6.15 AC Line Isolation Requirements ........................................................................- 57 -

6.16 AC Line Leakage Current ..................................................................................- 57 -

6.17 AC Line Fuse .....................................................................................................- 57 -

Revision 1.0 v

6.18 Power Factor Correction....................................................................................- 57 -

6.19 Efficiency ...........................................................................................................- 57 -

6.20 Grounding ..........................................................................................................- 58 -

6.21 Remote Sense ...................................................................................................- 58 -

6.22 Output Power / Currents ....................................................................................- 58 -

6.22.1 Standby Outputs ................................................................................................- 59 -

6.22.2 Fan-less Operation ............................................................................................- 59 -

6.23 Voltage Regulation ............................................................................................- 59 -

6.23.1 Dynamic Loading ...............................................................................................- 59 -

6.24 Capacitive Loading ............................................................................................- 60 -

6.25 Closed loop stability...........................................................................................- 60 -

6.26 Common Mode Noise ........................................................................................- 60 -

6.27 Ripple / Noise ....................................................................................................- 61 -

6.28 Soft Starting .......................................................................................................- 61 -

6.29 Zero Load Stability Requirements .....................................................................- 61 -

6.30 Timing Requirements.........................................................................................- 61 -

6.31 Residual Voltage Immunity in Standby mode ....................................................- 63 -

6.32 Protection Circuits..............................................................................................- 63 -

6.33 Current Limit (OCP) .........................................................................................- 63 -

6.34 Over Voltage Protection (OVP).........................................................................- 64 -

6.35 Over Temperature Protection (OTP).................................................................- 64 -

6.36 Control and Indicator Functions.........................................................................- 64 -

6.37 PSON

#

Input Signal ..........................................................................................- 65 -

6.38 PWOK (Power OK) Output Signal .....................................................................- 65 -

6.39 Environmental Requirements ............................................................................- 66 -

6.40 Temperature ......................................................................................................- 66 -

6.41 Humidity.............................................................................................................- 66 -

6.42 Altitude...............................................................................................................- 66 -

6.43 Mechanical Shock..............................................................................................- 66 -

6.44 Random Vibration ..............................................................................................- 67 -

6.45 Thermal Shock (Shipping) .................................................................................- 67 -

6.46 Ecological Requirements ...................................................................................- 67 -

6.47 Catastrophic Failure...........................................................................................- 67 -

7. Electromagnetic Compatibility......................................................................................- 68 -

7.1 EMI ....................................................................................................................- 68 -

7.2 Input Line Current Harmonic Content (PFC) ....................................................- 68 -

7.3 Magnetic Leakage Fields...................................................................................- 68 -

Revision 1.0 vi

7.4 Voltage Fluctuations and Flicker........................................................................- 69 -

7.5 Reliability / Warranty / Service...........................................................................- 69 -

7.6 Component De-rating ........................................................................................- 69 -

7.7 Component Life requirement .............................................................................- 69 -

7.8 Mean Time Between Failures (MTBF)...............................................................- 69 -

7.9 Warranty Period.................................................................................................- 69 -

7.10 Serviceability......................................................................................................- 69 -

7.11 Power Supply Returned for Repair ....................................................................- 69 -

7.12 Modifications / Change Control..........................................................................- 70 -

7.13 Power Supply Compliance Overview.................................................................- 70 -

7.14 Power Supplies Compliance Information...........................................................- 70 -

7.15 EMC Compliance Information............................................................................- 71 -

7.16 Immunity Compliance Information .....................................................................- 71 -

7.17 Harmonics & Voltage Flicker Compliance Information ......................................- 71 -

7.18 Environmental / Ecology Compliance Information .............................................- 71 -

7.19 Other Safety Requirement Notations.................................................................- 72 -

7.19.1 Certification Conditions......................................................................................- 72 -

7.19.2 Isolation Between Primary - Secondary.............................................................- 72 -

7.19.3 Creepage & Clearance Requirements...............................................................- 72 -

7.19.4 Leakage Current Maximums..............................................................................- 72 -

7.19.5 Max Surface Temperatures ...............................................................................- 72 -

7.19.6 Date Coded Serial Numbers..............................................................................- 73 -

7.19.7 Power Input Electrical Ratings...........................................................................- 73 -

7.19.8 Maximum Allowable Temperatures on Inlet Receptacles..................................- 73 -

7.19.9 Maximum Allowable Temperatures on Power Cords.........................................- 73 -

8. Supported Intel® Server Boards...................................................................................- 74 -

8.1 Intel® Server Board SE7221BK1-E Feature Set ...............................................- 74 -

9. Regulatory, Environmentals, and Specifications........................................................- 76 -

9.1 Product Regulatory Compliance ........................................................................- 76 -

9.1.1 Product Safety Compliance ...............................................................................- 76 -

9.1.2 Product EMC Compliance .................................................................................- 76 -

9.1.3 Product Regulatory Compliance Markings ........................................................- 76 -

9.2 Electromagnetic Compatibility Notices ..............................................................- 77 -

9.2.1 USA ...................................................................................................................- 77 -

9.2.2 FCC Verification Statement ...............................................................................- 77 -

9.2.3 ICES-003 (Canada) ...........................................................................................- 78 -

9.2.4 Europe (CE Declaration of Conformity) .............................................................- 78 -

Revision 1.0 vii

9.2.5 Japan EMC Compatibility ..................................................................................- 78 -

9.2.6 BSMI (Taiwan) ...................................................................................................- 78 -

9.3 Replacing the Back up Battery ..........................................................................- 78 -

9.4 System Level Environmental Limits...................................................................- 79 -

9.5 Serviceability......................................................................................................- 80 -

Appendix A: Intel® Server Chassis SC1400UP Integration and Usage Tips.......................... I

Glossary....................................................................................................................................... II

Revision 1.0 viii

List of Figures

Figure 1. Front and Rear Chassis Views ................................................................................- 13 -

Figure 2. Major Chassis Components.....................................................................................- 14 -

Figure 3. Back Panel Feature Overview .................................................................................- 15 -

Figure 4. Front Panel Feature Overview.................................................................................- 16 -

Figure 5. Control Panel Module ..............................................................................................- 16 -

Figure 6. Standard Control Panel Overview ...........................................................................- 17 -

Figure 7. Optional Front Bezel ................................................................................................- 18 -

Figure 8. Front Bezel Options .................................................................................................- 19 -

Figure 9. Intel® Server Chassis SC1400UP Cooling Subsystem ...........................................- 20 -

Figure 10. Intel® Server Chassis SC1400UP System Fans 4, 5, 6, 7, 8 ................................- 21 -

Figure 11. Intel® Server Platform SE7221BK1-E System Fan headers 4, 5, 6, 7, 8 ..............- 21 -

Figure 12. Air Baffle ................................................................................................................- 22 -

Figure 13. CPU/Memory Air Duct ...........................................................................................- 23 -

Figure 14. Intel® Server Chassis SC1400UP Peripheral Bay Configuration Options.............- 24 -

Figure 15. View of Slim-Line Drive Bay ..................................................................................- 24 -

Figure 16. Optional Floppy Drive Configuration......................................................................- 25 -

Figure 17. Hard Drive Tray Assembly.....................................................................................- 28 -

Figure 18. Drive Tray with Drive Blank ...................................................................................- 29 -

Figure 19. Hot-Swap SCSI Backplane Layout ........................................................................- 30 -

Figure 20. Hot-Swap SCSI Backplane Functional Diagram....................................................- 30 -

Figure 21. Intel® Server Chassis SC1400UP 1U SCSI HSBP I2C Bus Connection Diagram- 32 -

Figure 22. 68-Pin SCSI Cable Connector ...............................................................................- 33 -

Figure 23. 80-pin SCA2 SCSI Interface ..................................................................................- 34 -

Figure 24. SATA Backplane Layout........................................................................................- 37 -

Figure 25. SATA Backplane Layout........................................................................................- 37 -

Figure 26. SATA Backplane Functional Block Diagram..........................................................- 38 -

Figure 27. Intel® Server Chassis SC1400UP 1U SATA HSBP I2C Bus Connection Diagram- 39 -

Figure 28. Standard Control Panel Assembly Module ............................................................- 42 -

Figure 29. Control Panel Buttons............................................................................................- 42 -

Figure 31. PCI Riser bracket and optional PCI-X and PCI-Express risers .............................- 48 -

Figure 32. 1U Full Height PCI-X Riser Card Mechanical Drawing..........................................- 49 -

Figure 33. 1U Full Height PCI-Express Riser Card Mechanical Drawing ...............................- 49 -

Figure 34. Power Supply Enclosure Drawing .........................................................................- 50 -

Figure 35. Airflow Characteristics ...........................................................................................- 51 -

Revision 1.0 ix

Figure 36. Output Voltage Timing ...........................................................................................- 62 -

Figure 37. Turn On/Off Timing (Power Supply Signals)..........................................................- 63 -

Figure 38. PSON# Required Signal Characteristic. ................................................................- 65 -

Figure 39. SE7221BK1-E Board Layout .................................................................................- 75 -

Revision 1.0 x

List of Tables

Table 1. Chassis Dimensions .................................................................................................- 13 -

Table 2. Individual Fan Assy Pinout (J6J1, J6J2, J6J3, J6J4)................................................- 22 -

Table 3. 4-pin floppy power connector Pinout (J3) .................................................................- 25 -

Table 4. 34-pin floppy connector Pinout (J2) ..........................................................................- 25 -

Table 5. 50-pin CD-ROM connector Pinout (J6) .....................................................................- 26 -

Table 6. 4-pin CD-ROM power connector Pinout (J5) ............................................................- 26 -

Table 7. 40-pin CD-ROM connector Pinout (J1) .....................................................................- 27 -

Table 8. SCSI Backplane Power Connector Pinout (J1).........................................................- 33 -

Table 9. UltraWide (SE) and Ultra2 (LVD) Ultra320 SCSI Connector Pinout (J8) ..................- 33 -

Table 10. 80-pin SCA2 SCSI Interface Pinout (J9, J2, J10) ...................................................- 35 -

Table 11. LED Function ..........................................................................................................- 40 -

Table 12. SATA Backplane Power Connector Pinout.............................................................- 40 -

Table 13. 7-Pin SATA Connector Pinout (J2, J3, J4, J5, J6) ..................................................- 41 -

Table 14. 22-Pin SATA Connector Pinout ..............................................................................- 41 -

Table 15. Contol Button and Intrusion Switch Functions ........................................................- 43 -

Table 16. Control Panel LED Functions..................................................................................- 43 -

Table 17. SSI Power LED Operation ......................................................................................- 44 -

Table 18. External USB Connectors (J1B1) ...........................................................................- 46 -

Table 19. 50-pin Control Panel Connector (J6B1) ..................................................................- 47 -

Table 20. Internal USB Header (J2B1) ...................................................................................- 47 -

Table 21. Acoustic Requirements ...........................................................................................- 51 -

Table 22. Environmental Requirements.................................................................................- 52 -

Table 23. Cable Lengths.........................................................................................................- 52 -

Table 24. P1 Main Power Connector .....................................................................................- 52 -

Table 25. P2 Processor Power Connector.............................................................................- 53 -

Table 26. Peripheral Power Connectors ................................................................................- 53 -

Table 27. AC Input Rating.......................................................................................................- 54 -

Table 28. AC Line Sag Transient Performance ....................................................................- 54 -

Table 29. AC Line Surge Transient Performance .................................................................- 55 -

Table 30. Performance Criteria...............................................................................................- 55 -

Table 31. Load Ratings..........................................................................................................- 58 -

Table 32. Load Range 2 .........................................................................................................- 58 -

Table 33. Voltage Regulation Limits .......................................................................................- 59 -

Table 34. Transient Load Requirements.................................................................................- 60 -

Revision 1.0 xi

Table 35. Capacitve Loading Conditions ................................................................................- 60 -

Table 36. Ripple and Noise.....................................................................................................- 61 -

Table 37. Output Voltage Timing ............................................................................................- 61 -

Table 38. Turn On/Off Timing .................................................................................................- 62 -

Table 39. Over Current Protection (OCP)...............................................................................- 64 -

Table 40. Over Voltage Protection (OVP) Limits ....................................................................- 64 -

Table 41. PSON

#

Signal Characteristic...................................................................................- 65 -

Table 42. PWOK Signal Characteristics .................................................................................- 66 -

Table 43. Harmonic Limits, Class A equipment ......................................................................- 68 -

Table 44: Baseboard Layout Reference .................................................................................- 75 -

Table 45. System Office Environment Summary ....................................................................- 79 -

Table 46. Mean Time To Repair Estimate ..............................................................................- 80 -

Revision 1.0 xii

Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

1. Intel® Server Chassis SC1400UP Feature

Summary

The Intel® Server Chassis SC1400UP is a 1U server chassis specifically designed to support
the Intel® Server Board SE7221BK1-E. The integration of the SC1400UP chassis and
SE7221BK1-E server board comprise the Intel® Server Platform SR1425BK1-E. The
SC1400UP is not offered as a standalone chassis solution from Intel and is only available as an
integrated system as the SR1425BK1-E. Both the board and chassis have a feature set that is
designed to support the high-density server market. This document provides details on the
chassis feature set and technical specifications. For technical details related to the Intel® Server
Board SE7221BK1-E, please refer to the baseboard Technical Product Specification document.

1.1 Chassis Views

Front view without bezel

Figure 1. Front and Rear Chassis Views

1.2 Chassis Dimensions

Front view with Bezel

Rear view

Height 43.25 mm 1.703”

Width 430 mm 16.930”

Depth 672 mm 26.457”

Max. Weight 14.1 kg 31 LBS

Table 1. Chassis Dimensions

- 13 -

Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

1.3 Intel® Server Chassis SC1400UP System Components

A Power supply G Control Panel
B Chassis Intrusion Switch H Hard Drive Bays
C Full length PCI Add in card slot I Chassis Handle
D PCI Riser Card Assembly Placement J Slim Line Drive Bay

E System Fan Module K PS / Electronics Bay Isolation Air Baffle
F CPU Air Duct Placement L Power Supply Fans

Revision 1.0 - 14 -

Figure 2. Major Chassis Components

Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

1.4 Rear Panel Components

On the back of the chassis are cutouts for all external I/O connectors found on the server board.
The I/O connector locations are pre-cut, so the use of an I/O shield is not required.

A PS2 keyboard connector G USB 2 connector
B PS2 mouse connector H NIC 1 connector (RJ45)
C Serial port A connector (DB9) I PCI card bracket (full-height)
D Video connector J Rear chassis venting holes
E NIC 2 connector (RJ45) K Power Supply fans
F USB 1 connector L AC Power Receptacle

Figure 3. Back Panel Feature Overview

1.5 Hard Drive and Peripheral Bays

The Server Chassis SC1400UP is designed to support several different hard drive and
peripheral configurations. The hard drive bay is designed to support up to three cabled SATA
or SCSI drives or hot-swappable SATA or SCSI drives. SATA and SCSI hot-swap
configurations require an orderable accessory kit which includes the necessary cables, drive
trays and applicable backplane. Reference Intel Server Chassis SR1400 for detailed accessory
information.

The slim-line peripheral bay is capable of supporting any of the following slim-line devices:
CDROM drive, DVD Drive, DVD/CDR Drive, or Floppy drive. If both a CDROM or DVD/CDR and
Floppy drive are required, on optional kit is available to convert the first 1” hard drive bay to a
floppy drive bay. The kit includes the necessary cables and slim-line floppy drive mounting tray.

Revision 1.0 - 15 -

Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

Figure 4. Front Panel Feature Overview

A Slim-line drive bay (CDROM or DVD/CDR or Floppy)
B Control Panel
C Hard Drive Fault/Activity LED
D 1” Hard Drive Bays
E Chassis Handle

1.6 Control Panel

The Server Chassis SC1400UP control panel assembly is pre-assembled and modular in
design. The entire module assembly slides into a predefined slot in the front of the chassis.

Revision 1.0 - 16 -

Figure 5. Control Panel Module

Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

The control panel supports several push buttons and status LEDs, along with USB and video
ports to centralize system control, monitoring, and accessibility to within a common compact
design. The following diagram overviews the layout and functions of the control panel.

C D E

B

F

G

H

A

I

L

Figure 6. Standard Control Panel Overview

A Power / Sleep Button G System Identification LED
B NIC #2 Activity LED H System Identification Button
C NIC #1 Activity LED I System Reset Button
D Power / Sleep LED J USB 2.0 Connector
E System Status LED K Recessed NMI Button (Tool Required)
F Hard Drive Activity LED L Video connector (not supported on SC1400UP)

K

J

1.7 Power Sub-system

The power sub-system of the SC1400UP consists of a single non-redundant 300 watt power
supply and provides several integrated management features including:

• Status LED

• Over temperature protection circuitry

• Over voltage protection circuitry

With the addition of Server Management Software, the power subsystem is capable of
supporting several system management features including:

• Remote Power On/Off

• Status Alerting

• FRU Information Reporting

The power supply operates within the following voltage ranges and ratings 100-127VAC (V) ∼ at
50/60 Hertz (Hz); 8.2 Ampere (A) maximum (max) 200-240VAC∼ at 50/60 Hz; 4.1 A maximum

Revision 1.0 - 17 -

Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

1.8 System Cooling

The chassis provides a non-redundant system fans and dual non-redundant power supply fans
to provide sufficient air flow for cabled and hot-swap drive configurations, processors, memory
and add-in cards, when external ambient temperatures remain within specified limits.

1.9 Chassis Security

The SC1400UP provides support for several platform security features including a lockable front
bezel, chassis intrusion switch, and a Kensington style lock attach point.

1.10 Rack and Cabinet Mounting Options

The SC1400UP chassis was designed to support 19” wide by up to 24”-30” deep server
cabinets. The chassis can be configured to support either a relay rack / cabinet mount kit that
can be configured to support both 2-post racks and 4-post cabinets, or with a tool-less sliding
rail kit that is used to mount the chassis into a standard (19” by up to 30” deep) EIA-310D
compatible server cabinet.

1.11 Front Bezels

The optional front bezel is made of molded plastic and uses a snap-on design. When installed,
its design allows for maximum airflow. Separate front bezels are available to support systems
that use either a Standard Control Panel or Intel Local Control Panel.

Revision 1.0 - 18 -

Figure 7. Optional Front Bezel

Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

Light pipes in the front bezel supporting the Standard Control Panel allow the system status
LEDs to be monitored with the bezel installed

Figure 8. Front Bezel Options

Revision 1.0 - 19 -

Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

2. Cooling Sub-System

The cooling sub-system on the SC1400UP is compromised of four 40x40x56mm dual rotor fans,
one 40x40x28mm single rotor fan, two 40x40x28mm power supply fans, CPU/Memory air duct,
and PS/Electronics Bay Isolation Air Baffle, to provide the necessary cooling and airflow to the
system. A fan on the processor heat sink is not necessary in this chassis. In order to maintain
the necessary airflow within the system, the air baffle, CPU/Memory air duct, and the top cover
need to be properly installed.

Note: The Server Chassis SC1400UP does not support redundant cooling. Should a fan fail, the
system should be brought down as soon as possible to replace the failed fan.

Figure 9. Intel® Server Chassis SC1400UP Cooling Subsystem

A System Fan #4 D Air Baffle

B Fans 5, 6, 7, 8 E CPU Heat Sink

C CPU / Memory Air Duct

Revision 1.0 - 20 -

Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

2.1 System Fans

The Intel® Server Chassis SC1400UP system fans consist of four 40x40x56mm dual rotor and
one 40x40x28mm single rotor multi-speed fans, which provide the primary airflow for the
system. The four dual rotor fans provide the primary cooling for the CPU, GMCH, and memory
components on the Intel Server Board SE7221BK1-E. The single rotor fan provides the primary
cooling for PCI add-in cards, the ICH6R and PXH chipset components.

Removal and insertion of individual fans is a tool-less operation, and provides for ease of
installation and serviceability of the server chassis cooling subsystem. The individual fans are
not hot swappable. The server must be turned off and power removed from the system before
any of the fans can safely be replaced.

Each dual rotor fan has an 8-pin wire harness which connects to the system fan headers 5,6,7
and 8 on the Intel Server Board SE7221BK1-E. These are shown, from left to right, in the
following figure. Each fan harness provides power and tachometer lines allowing the fans to be
monitored independently by server management software. The fan distribution board has a 20­pin connector which provides the power and communication signal path from the baseboard.

Figure 10. Intel® Server Chassis SC1400UP System Fans 4, 5, 6, 7, 8

Figure 11. Intel® Server Platform SE7221BK1-E System Fan headers 4, 5, 6, 7, 8

Revision 1.0 - 21 -

Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

The following table provides the pin-outs for each dual rotor fan header.

Table 2. Individual Fan Assy Pinout (J6J1, J6J2, J6J3, J6J4)

Pin Signal Name Description

1 FAN_SPEED_CNTL2 Control the fan speed
2 FAN_FAIL FAN_TACH signal
3 GND Power Supply Ground
4 Reserved Reserved
5 GND Power Supply Ground
6 GND Power Supply Ground
7 FAN_FAIL FAN_TACH signal
8 Fan speed control Variable Speed Fan Power

The single rotor fan is a standard 3 pin SSI fan header that connects directly to the baseboard
system fan header #4 (JP5J2).

Each fan within the module is capable of supporting multiple speeds. If the internal ambient
temperature of the system exceeds the value programmed into the thermal sensor data record
(SDR), the Baseboard Management Controller (BMC) firmware will increase the rotational
speed for all the fans within fan module.

Note: There is no fan redundancy. Should a fan fail, the system should be shut down as soon
as possible to have the fan replaced. The system fans are not hot-swapable.

2.2 Power Supply Fans

The power supply supports two non-redundant 40mm fans. They are responsible for the cooling
of the power supply and drive bay 1 (the far left hard drive as viewed from the front of the
chassis).

2.3 CPU/Memory Air Duct and Side Air Baffle

The chassis requires the use of a CPU/Memory air duct and power supply / electronics bay
isolation air baffle to direct airflow and sustain appropriate air pressure.

An air baffle is used to isolate airflow of the two power supply fans from that of the system fan
module. The baffle is mounted into three stand-offs with one end fitting under the back edge of
the hard drive bay

The CPU/Memory air duct must be properly installed to direct airflow through the processor
heatsink(s) to the low profile PCI and memory area of the system. The CPU air duct is

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Figure 12. Air Baffle

Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

designed to support either a single or dual processor configuration. For single processor
configurations the pre-installed air damn must be left in place in order to maintain necessary air
pressure and air flow through the processor heat sink. For dual processor configurations, the
air damn must be snapped off of the CPU air duct. The CPU air duct cannot be installed if the
air damn is in place and two processors are installed.

Figure 13. CPU/Memory Air Duct

Note: If the CPU/Memory air duct is removed, the system will not meet the thermal cooling

requirements of the processor, which will most likely result in degraded performance as a result
of throttling or thermal shutdown of the system.

Note: Once the air damn is removed from the CPU air duct, it cannot be reinstalled.

2.4 Hard Drive Bays

Hard drive bays must be populated in order to maintain system thermals. Hard drive trays, both
hot-swap and cabled drive, must ether have a hard drive or drive blank installed in them.

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Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

3. Peripheral and Hard Drive Support

The server chassis SC1400UP provides three hard drive bays and one slim-line peripheral drive
bay at the front of the chassis. The drive bays are designed to support both SCSI and SATA
hot-swap backplanes or can support cabled SATA drive configurations.

Figure 14. Intel® Server Chassis SC1400UP Peripheral Bay Configuration Options

3.1 Slimline Drive Bay

The chassis provides a slim-line drive bay that can be configured for either CDROM,
DVD/CDRW, or Floppy drives with or without the presence of a backplane. Regardless of
whether a SATA or SCSI backplane is present, all slimline devices attach directly to the
SE7221BK1-E baseboard The 100pin connector on the SATA and SCSI backplane DOES
NOT APPLY to the Intel Server Chassis SC1400UP and Intel Server Board SE7221BK1-E.
Drives are mounted on a tool-less tray which allows for easy installation into and removal from
the chassis. The slim-line devices are not hot-swappable.

Figure 15. View of Slim-Line Drive Bay

3.1.1 Floppy Drive Support with or without Backplane present

Whether a SATA or SCSI backplane is used in the Intel Server Chassis SC1400UP or not, the
floppy drive is mated with an interposer card which provides the power and IO interconnects
between the drive, power supply and SE7221BK1-E baseboard. The 100pin connector on the
backplane is not used with the Intel Server Board SE7221BK1-E. The interposer card has
three connectors; the first has 28 pins which is cabled directly to the drive. The second
connector has 4 pins and is cabled to the 2x3 pin power lead from the power supply. This
connector has the following pinout.

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Intel® Server Chassis SC1400UP / Intel® Server Platform SR1425BK1-E

Table 3. 4-pin floppy power connector Pinout (J3)

Pin Name

1 P12V
2 GND
3 GND
4 P5V

The power cable for the floppy drive is provided via a slimline Y cable which comes with the
SC1400UP chassis. The third connector has 34 pins and is cabled to the legacy floppy
connector on the baseboard. This connector has the following pinout.

Table 4. 34-pin floppy connector Pinout (J2)

Name Pin Pin Name

GND 1 2 FD_DENSEL0
GND 3 4 2M_MEDIA
GND 5 6 FD_DRATE0_L
GND 7 8 FD_INDEX_L
GND 9 10 FD_MTR0_L
GND 11 12 FD_DS1_L
GND 13 14 FD_DS0_L
GND 15 16 FD_MTR1_L
Unused 17 18 FD_DIR_L
GND 19 20 FD_STEP_L
GND 21 22 FD_WDATA_L
GND 23 24 FD_WGATE_L
GND 25 26 FD_TRK0_L
Unused 27 28 FD_WP_L
GND_FDD 29 30 FD_RDATA_L
GND 31 32 FD_HDSEL_L
MSEN0 33 34 FD_DSKCHG_L

3.1.1.1 Optional Floppy Drive Configuration

For system configurations that require a CDROM or DVD-CDR and Floppy drive, where using a
USB Floppy or USB CDROM is not desired, an accessory kit which consists of a slim-line floppy
drive tray and face plate can be used to install a floppy drive into the hard drive bay directly
beneath the slim-line drive bay a shown in the following diagram.

Figure 16. Optional Floppy Drive Configuration

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