Intel R1000SPO Series Technical Product Specification

Intel® Server System R1000SPO

Revision 1.0

March 2016

Intel® Server Boards and Systems

Product Family

Technical Product Specification

A document providing an overview of product features, functions, architecture, and
support specifications

Intel® Server System R1000SPO Product Family TPS

Date

Revision Number

Modifications

January 2016

0.7

First preliminary version

March 2016

1.0

First External Public Release
Changes:

 Updated Illustrations
 Appendix E - Added High Temperature Ambient Information
 Section 3.3.4 - Added Holdup time for Fixed Power Supply
 Section 3.2.3 - Added Information for Power Distribution Board
 Added Glossary
 Removed – AXXPRAIL from supported Rail kits
 Updated Copyright data
 Table 2 - Added info about PCIe riser slot

Revision History

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Intel® Server System R1000SPO Product Family TPS

Disclaimers

No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this
document.

Intel disclaims all express and implied warranties, including without limitation, the implied warranties of
merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from
course of performance, course of dealing, or usage in trade.

This document contains information on products, services and/or processes in development. All information
provided here is subject to change without notice. Contact your Intel representative to obtain the latest TPS.

The products and services described may contain defects or errors known as errata which may cause
deviations from published specifications. Current characterized errata are available on request.

Intel, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.

*Other names and brands may be claimed as the property of others

© 2016 Intel Corporation.

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Intel® Server System R1000SPO Product Family TPS

Table of Contents

1. Introduction ........................................................................................................................................ 1

1.1 Chapter Outline .................................................................................................................................... 1

1.2 Server Board Use Disclaimer ......................................................................................................... 2

1.3 Product Errata ....................................................................................................................................... 2

2. Product Family Overview ................................................................................................................ 3

2.1 Operating System Support............................................................................................................... 5

2.1.1 OS Validation Levels .......................................................................................................................... 5

2.1.2 OS Technical Support Levels ......................................................................................................... 6

2.2 System Features Overview.............................................................................................................. 6

2.3 Server Board Features Overview .................................................................................................. 8

2.4 Back Panel Features ....................................................................................................................... 10

2.5 Front Control Panel .......................................................................................................................... 11

2.6 Front Drive Bay Options ................................................................................................................. 11

2.7 Locking Front Bezel ......................................................................................................................... 12

2.8 System Dimensions ......................................................................................................................... 14

2.8.1 Chassis Dimensions ........................................................................................................................ 14

2.8.2 Label Emboss Dimensions ........................................................................................................... 15

2.8.3 Pull-out Tab Label Emboss Dimensions ................................................................................. 16

2.9 Available Rack Mounting Kit Options ....................................................................................... 16

2.10 System Level Environmental Limits .......................................................................................... 17

2.11 System Packaging ............................................................................................................................ 18

2.11.1 Intel Product Weight Information ................................................................................................ 18

3. System Power ................................................................................................................................. 19

3.1 Power Supply Configurations ...................................................................................................... 19

3.2 Power Supply Module Options .................................................................................................... 20

3.2.1 Power Supply Module Efficiency ................................................................................................ 20

3.2.2 Power Supply Module Mechanical Overview ........................................................................ 20

3.2.3 Power distribution board ................................................................................................................ 21

3.2.4 Power Cord Specification Requirements ................................................................................ 22

3.3 AC Power Supply Input Specifications ..................................................................................... 22

3.3.1 Power Factor ...................................................................................................................................... 22

3.3.2 AC Input Voltage Specification .................................................................................................... 23

3.3.3 AC Line Isolation Requirements ................................................................................................. 23

3.3.4 AC Line Dropout / Holdup ............................................................................................................. 23

3.3.5 AC Line Fuse ...................................................................................................................................... 24

3.3.6 AC Line Transient Specification .................................................................................................. 24

3.3.7 Susceptibility Requirements ......................................................................................................... 25

3.3.8 Electrostatic Discharge Susceptibility ....................................................................................... 25

3.3.9 Fast Transient/Burst ........................................................................................................................ 25

3.3.10 Radiated Immunity ........................................................................................................................... 25

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Intel® Server System R1000SPO Product Family TPS

3.3.11 Power Recovery ................................................................................................................................ 25

3.3.12 Voltage Interruptions ....................................................................................................................... 25

3.3.13 Protection Circuits ............................................................................................................................ 25

3.3.14 Power Supply Status LED ............................................................................................................. 27

3.4 Server Board Power Connectors................................................................................................ 27

4. Thermal Management ................................................................................................................... 29

4.1 Thermal Operation and Configuration Requirements ........................................................ 30

4.2 Thermal Management Overview ................................................................................................ 30

4.2.1 Fan Speed Control ........................................................................................................................... 30

4.2.2 Programmable Fan PWM Offset ................................................................................................ 31

4.2.3 Fan Domains ...................................................................................................................................... 31

4.2.4 Nominal Fan Speed ......................................................................................................................... 32

4.2.5 Thermal and Acoustic Management ......................................................................................... 32

4.2.6 Thermal Sensor Input to Fan Speed Control ......................................................................... 32

4.3 System Fans ....................................................................................................................................... 34

5. System Storage and Peripheral Drive Bay Overview ........................................................... 36

5.1 Front Mount Drive Support............................................................................................................ 36

5.2 System Fan RVI and Hard Disk Drive Storage Performance ......................................... 36

5.3 Hot Swap Drive Carriers ................................................................................................................ 37

5.4 Storage Backplane Options .......................................................................................................... 39

5.4.1 I2C Functionality ............................................................................................................................... 40

5.4.2 4 x 3.5” Drive Hot-Swap Backplane Overview ...................................................................... 40

5.4.3 8 x 2.5” Drive SAS Backplane ..................................................................................................... 42

5.5 M.2 SSD Support .............................................................................................................................. 43

5.6 SATA DOM Support ........................................................................................................................ 44

6. Storage Controller Options Overview ...................................................................................... 45

6.1 Embedded SATA/SATA RAID Support ................................................................................... 45

6.2 Intel® Integrated RAID Module Support ................................................................................... 47

6.2.1 Intel® RAID Maintenance Free Backup Unit (RMFBU) Support .................................... 47

7. Front Control Panel and I/O Panel Overview .......................................................................... 48

7.1 I/O Panel Features ........................................................................................................................... 48

7.2 Control Panel Features .................................................................................................................. 48

7.2.1 System Status LED .......................................................................................................................... 49

8. PCIe* Riser Card Support ............................................................................................................ 51

9. Intel® I/O Module Support ........................................................................................................... 52

10. Basic and Advanced Server Management Features ............................................................ 53

10.1 IPMI 2.0 Features ............................................................................................................................. 54

10.2 Non-IPMI Features ........................................................................................................................... 54

10.2.1 Dedicated Management Port ....................................................................................................... 55

10.2.2 Embedded Web Server .................................................................................................................. 55

10.2.3 Advanced Management Feature Support (RMM4 Lite) .................................................... 57

Appendix A: Integration and Usage Tips ........................................................................................ 61

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Intel® Server System R1000SPO Product Family TPS

Appendix B: POST Code Diagnostic LED Decoder ..................................................................... 62

Appendix C: POST Code Errors ........................................................................................................ 72

Appendix D: System Cable Routing Diagrams ............................................................................. 76

Appendix E: High Temperature Ambient Info ................................................................................ 77

Glossary .................................................................................................................................................. 79

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Intel® Server System R1000SPO Product Family TPS

List of Figures

Figure 1. System Components Overview ............................................................................................................. 6

Figure 2. Top Cover Features .................................................................................................................................... 7

Figure 3. Server Board Features ............................................................................................................................... 8

Figure 4. On-board Diagnostic LEDs ...................................................................................................................... 9

Figure 5. System Reset and Configuration Jumpers .................................................................................... 10

Figure 6. Back Panel Features ................................................................................................................................ 10

Figure 7. Front Control Panel Options ............................................................................................................... 11

Figure 8. 3.5" Drive Bay – 4 Drive Configuration (Model R1304SPxxxxx) ............................................ 11

Figure 9. 2.5" Drive Bay – 8 Drive Configuration (Model R1208SPxxxxx) ............................................ 11

Figure 10. Front Bezel ............................................................................................................................................... 12

Figure 11. Front Bezel Accessory with Optionally Installed Wave Feature ........................................ 12

Figure 12. Front Bezel Accessory with Optionally Installed Wave and ID Badge (1) ...................... 13

Figure 13. Front Bezel Accessory with Optionally Installed Wave and ID Badge (2) ...................... 13

Figure 14. Front Bezel Accessory ID Badge Mechanical Drawings ......................................................... 13

Figure 15. Chassis Dimensions .............................................................................................................................. 14

Figure 16. Label Emboss Dimensions ................................................................................................................. 15

Figure 17. Pull-out Tab Label Emboss Dimensions ...................................................................................... 16

Figure 18. 350W AC Fixed Power Supply ......................................................................................................... 19

Figure 19. 450W AC Power Supply...................................................................................................................... 19

Figure 20. 350W Power Supply Mechanical Drawings ................................................................................ 20

Figure 21. 450W Power Supply Mechanical drawings ................................................................................ 21

Figure 22. Power Distribution Board ................................................................................................................... 21

Figure 23. AC Power Cord ........................................................................................................................................ 22

Figure 24. System Air Flow and Fan Identification ........................................................................................ 29

Figure 25. Fan Control Model ................................................................................................................................ 33

Figure 26. System Fans ............................................................................................................................................. 34

Figure 27. System Fan Connector Locations on Server Board ................................................................ 35

Figure 28. 8x2.5" Drive Bay Configuration (Model R1208xxxxx) ............................................................. 36

Figure 29. 4x3.5" Drive Bay Configuration (Model R1304WTxxxx) ........................................................ 36

Figure 30. Hot Swap Storage Device Carrier Removal ................................................................................. 37

Figure 31. 2.5" SSD mounted to 3.5" Drive Tray ............................................................................................ 38

Figure 32. Drive Tray LED Identification ............................................................................................................ 38

Figure 33. Backplane Installation ......................................................................................................................... 40

Figure 34. 4 x 3.5” Drive Hot-Swap Backplane – front view ...................................................................... 41

Figure 35. 4 x 3.5” Drive Hot-Swap Backplane – rear view ........................................................................ 41

Figure 36. 8 x 2.5” Drive SAS/SATA Backplane – front view ..................................................................... 42

Figure 37. 8 x 2.5” Drive SAS/SATA Backplane – rear view ....................................................................... 42

Figure 38. Installing M.2 Device ............................................................................................................................ 43

Figure 39. Intel® Raid Upgrade Key ...................................................................................................................... 46

Figure 40. Intel® RAID Maintenance Free Backup Unit ................................................................................. 47

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Intel® Server System R1000SPO Product Family TPS

Figure 41. Front I/O Panel Features .................................................................................................................... 48

Figure 42. Front Panel LEDs and Buttons ......................................................................................................... 48

Figure 43. Add-in Card Support ............................................................................................................................ 51

Figure 44. Riser Card Assembly............................................................................................................................. 51

Figure 45. Intel® I/O Module Placement ............................................................................................................ 52

Figure 46. Intel® RMM4 Lite Activation Key Installation .............................................................................. 55

Figure 47. POST Diagnostic LED Location ........................................................................................................ 62

Figure 48. Internal Cable Routing ......................................................................................................................... 76

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Intel® Server System R1000SPO Product Family TPS

List of Tables

Table 1. Reference Documents ................................................................................................................................ 1

Table 2. Intel® Server System R1000SPO Product Family Feature Set ................................................... 3

Table 3. Operating System Support List .............................................................................................................. 5

Table 4. Operating System Validation Levels .................................................................................................... 5

Table 5. System Environmental Limits Summary .......................................................................................... 17

Table 6. Intel Product Weight Information ....................................................................................................... 18

Table 7. 350 Watt AC Power Supply Efficiency (Gold) ................................................................................ 20

Table 8. 450 Watt AC Power Supply Efficiency (Gold) ................................................................................ 20

Table 9. AC Power Cord Specifications .............................................................................................................. 22

Table 10. Input Voltage Range – 350W Power Supply ............................................................................... 23

Table 11. AC Input Voltage Range – 450W Power Supply ........................................................................ 23

Table 12. AC Line Holdup Time – 350W Power supply .............................................................................. 23

Table 13. AC Line Holdup Time – 450W Power Supply.............................................................................. 24

Table 14. AC Line Sag Transient Performance – 350W Power Supply ................................................ 24

Table 15. AC Line Surge Transient Performance – 350W Power Supply ............................................ 24

Table 16. AC Line Sag Transient Performance – 450W Power Supply ................................................ 24

Table 17. AC Line Surge Transient Performance – 450W Power Supply ............................................ 25

Table 18. Performance Criteria ............................................................................................................................. 25

Table 19. Over Current Protection – 350W Power Supply ........................................................................ 26

Table 20. Over Current Protection – 450 Watt Power Supply ................................................................. 26

Table 21. Over Voltage Protection - 350W Power Supply ........................................................................ 26

Table 22. Over Voltage Protection (OVP) Limits – 750W Power Supply ............................................. 27

Table 23. LED Indicators .......................................................................................................................................... 27

Table 24. Main Power Connector Pin-out ......................................................................................................... 28

Table 25. CPU Power Connector Pin-out .......................................................................................................... 28

Table 26. PMBUS SSI Connector Pin-out (PS_AUX) ..................................................................................... 28

Table 27. System Volumetric Air Flow ............................................................................................................... 29

Table 28. System Fan Connector Pin-out ......................................................................................................... 35

Table 29. Drive Status LED States ........................................................................................................................ 39

Table 30. Drive Activity LED States ...................................................................................................................... 39

Table 31. SATA/SATADOM capable Connector Pin-out ............................................................................ 44

Table 32. Front Control Panel Buttons And Indicators ............................................................................... 48

Table 33. System Status LED Indicator States ................................................................................................ 49

Table 34. Front panel LED indication of BMC state ...................................................................................... 50

Table 35. Supported Intel® I/O Modules ........................................................................................................... 52

Table 36. Intel® Remote Management Module 4 (RMM4) Options ......................................................... 53

Table 37. Basic and Advanced Server Management Features Overview ............................................. 53

Table 38. POST Progress Code LED Example ................................................................................................. 63

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Intel® Server System R1000SPO Product Family TPS

Table 39. POST Progress Codes ........................................................................................................................... 63

Table 40. MRC Progress Codes ............................................................................................................................. 69

Table 41. POST Progress LED Codes .................................................................................................................. 70

Table 42. POST Error Codes and Messages..................................................................................................... 72

Table 43. POST Error Beep Codes ....................................................................................................................... 74

Table 44. Integrated BMC Beep Codes .............................................................................................................. 75

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Intel® Server System R1000SPO Product Family TPS

Document Title

Document

Classification

Intel® Server Board S1200SP Family BMC EPS 1.1

Intel Confidential

Intel® Server Board S1200SP Family BIOS EPS v1.0

Intel Confidential

Intel® Xeon® Processor E3-1200 v5 Product Family
Datasheet

Intel Confidential
Intel® Ethernet Controller I210: Datasheet

Intel® Server Board S1200SP Family Technical Product
Specification 1.0

1. Introduction

This Technical Product Specification (TPS) provides system level information for the Intel® Server System
R1000SPO product family.

This document describes the embedded functionality and available features of the integrated server system
which includes: the chassis layout, system boards, power subsystem, cooling subsystem, storage subsystem
options, and available installable options. Note that some system features are provided as configurable
options and may not be included standard in every system configuration offered. Please reference the Intel®
Server Board S1200SP Product Family Configuration Guide for a list of configurable options.

Server board specific detail can be obtained by referencing the Intel® Server Board S1200SP Technical
Product Specification.

NOTE: Some of the documents listed in the following table are classified as “Intel Confidential”. These
documents are made available under a Non-Disclosure Agreement (NDA) with Intel and must be ordered
through your local Intel representative.

Table 1. Reference Documents

1.1 Chapter Outline

This document is divided into the following chapters:

 Chapter 1 – Introduction
 Chapter 2 – Product Family Overview
 Chapter 3 – System Power
 Chapter 4 – Thermal Management
 Chapter 5 – System Storage and Peripherals Drive Bay Overview
 Chapter 6 – Storage Controller Options Overview
 Chapter 7 – Front Control Panel and I/O Panel Overview
 Chapter 8 – PCIe* Riser Card Support
 Chapter 9 – Intel® I/O Module Support
 Chapter 10 – Basic and Advanced Server Management Features
 Appendix A – Integration and Usage Tips
 Appendix B – POST Code Diagnostic LED Decoder
 Appendix C – POST Code Errors
 Appendix D – System Configuration Tables for Thermal Compatibility
 Appendix E – High Temperature Ambient Info
 Glossary

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Intel® Server System R1000SPO Product Family TPS

1.2 Server Board Use Disclaimer

Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel® server building blocks are used together, the fully integrated
system will meet the intended thermal requirements of these components. It is the responsibility of the
system integrator who chooses not to use Intel-developed server building blocks to consult vendor
datasheets and operating parameters to determine the amount of airflow required for their specific
application and environmental conditions. Intel Corporation cannot be held responsible if components fail
or the server board does not operate correctly when used outside any of their published operating or non­operating limits.

1.3 Product Errata

Shipping product may have features or functionality that may deviate from published specifications. These
deviations are generally discovered after the product has gone into formal production. Intel terms these
deviations as product Errata. Known product Errata will be published in the Monthly Specification Update for
the given product family which can be downloaded from the following Intel web site:

http://www.intel.com/support

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Intel® Server System R1000SPO Product Family TPS

Feature

Description

Chassis Type

1U Rack Mount Chassis

Server Board

Intel® Server Board S1200SP – (Intel product code - S1200SPO)

Processor Support

 One LGA1151 (Socket H4) processor socket
 Support for one Intel® Xeon® E3-1200 V5 processor without processor graphics (GT0 or 4+0)
 Maximum supported Thermal Design Power (TDP) of up to 80 W.
 8 GT/s point-to-point DMI 3.0 interface to PCH

Memory

 Two memory channels, four memory DIMM Slots (Two memory DIMMs per channel)
 Support for 2133 MT/s Unbuffered DIMMs (UDIMM DDR4 ECC memory)

Chipset

Intel® C236 Platform Controller Hub (PCH) chipset

External I/O

connections

 1x DB-15 video connector
 Two Gigabit Ethernet Ports
 Dedicated RJ-45 server management port
 Two USB 2.0 connectors on back panel
 Two USB 3.0 connectors on back panel
 Two USB 3.0 connectors on front panel

Internal I/O connectors
/ headers

 One Type-A USB 2.0 connector
 One 2x5 pin connector providing front panel support for two USB 2.0 ports
 One 2x10 pin connector providing front panel support for two USB 2.0 / 3.0 ports

Intel® I/O Module
Accessory Options

The server board includes a proprietary on-board connector allowing for the installation of a variety of
available Intel® I/O modules. An installed I/O module can be supported in addition to standard on-board
features and add-in PCIe* cards.

The Following Intel® I/O Modules are supported:

 AXX4P1GBPWLIOM – Quad port 1GbE I/O based on Intel® Ethernet Controller I350
 AXX10GBNIAIOM – Dual SFP+ port 10GbE based on Intel® 82599 10 Gigabit Ethernet Controller
 AXX10GBTWLIOM3 – Dual RJ-45 port 10G BASE-T based on Intel® Ethernet Controller X540

System Fans

 Three managed 40mm single rotor system fans
 One power supply fan for each installed power supply module

Riser Card Support

 One x16 PCIe* 3.0 Riser Card H87808-XXX on a x8 Riser slot (slot-6)

Video

 Integrated 2D video controller
 16 MB DDR3 Memory

2. Product Family Overview

The Intel® Server System R1000SPO product family offers a variety of system options to meet the varied
configuration requirements of entry level computing environments, and includes several available 1U rack
mount server systems. Each integrated system within this product family is configured around the Intel®
Server Board S1200SPO.

This chapter provides a high-level overview of the system features and available options as supported in
different system models within this product family. Greater detail for each major sub-system, feature, or
option is provided in the following chapters.

Table 2. Intel

®

Server System R1000SPO Product Family Feature Set

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Intel® Server System R1000SPO Product Family TPS

Feature

Description

On-board storage
controllers and options

 8x SATA connectors up to 6Gbps
 1x SATADOM connector (SATA port 4)
 1x 75 pin connector for M.2 SATA SSD (2242 form factor)

 Embedded Software SATA RAID

o Intel® RSTe 4 SW RAID through onboard SATA connectors provides SATA RAID 0/1/10/5.
o Intel

®

Embedded Server RAID Technology II through onboard SATA connectors provides SATA
RAID 0/1/10 and optional RAID 5 support provided by the Intel® RAID Activation Key
RKSATA8R5.

Security

Intel® Trusted Platform Module (TPM) 1.2 based on LPC

Server Management

 Integrated Baseboard Management Controller, IPMI 2.0 compliant
 Support for Intel® Server Management Software
 On-board RJ45 management port
 Advanced Server Management via an Intel® Remote Management Module 4 Lite (Accessory Option)

Power Supply Options

 The server system supports two options for Power Supply:

o 1 x 350w Power Supply (Fixed)
o 2 x 450w Power Supply Modules (Redundant, Hot-Swap capable)

Storage Bay Options

Hot Swap Backplane Options:
NOTE: All available backplane options have support for SAS 3.0 (12 Gb/sec)

 4 x 3.5” SAS/SATA backplane
 8 x 2.5” SAS/SATA backplane

Storage Bay Options:

 4 x 3.5” SAS/SATA hot swap drive bays + front panel I/O
 8 x 2.5” SAS/SATA hot swap drive bays + front panel I/O

Supported Rack Mount
Kit Accessory Options

 AXXVPSRAIL - Value Plus Short Rail

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Intel® Server System R1000SPO Product Family TPS

Operating System

Operating System

Validation Level

(P)

Windows Server 2012* R2 with Hyper-Vx64 & EFI

P1

Red Hat Enterprise Linux* 7.0 with KVM x64 & UEFI

P1

SuSE Linux Enterprise Server* 12 with XEN x64

P1

Red Hat Enterprise Linux 6U5 with KVM x64 & UEFI

P2

VMWare ESXi* 5.5 U3

P2

SuSE Linux Enterprise Server 11 SP4 with XEN x64

P2

Windows Server 2008 R2 SP1

P2

Windows 7*

P2

Ubuntu* 14.04

P2

FreeBSD* 10.1

P3

CentOS* 7.0

P3

Operating System Validation Levels

P1

P2

P3

Basic Installation testing

Yes

Yes

Yes

Test all on-board I/O features in all modes

Yes

Adapter\Peripheral Compatibility & Stress testing

Yes

Technical Support Level

T1

T2

T3

2.1 Operating System Support

As of this writing, the Intel® Server System R1000SPO product family provides support for the following
operating systems. This list will be updated as new operating systems are validated by Intel.

Table 3. Operating System Support List

Table 4. Operating System Validation Levels

See the following sections for additional information regarding validation levels and technical support levels
as referenced in Table 4.

2.1.1 OS Validation Levels

Basic installation testing is performed with each supported operating system. The testing validates that the

system can install the operating system and that the base hardware feature set is functional. A small set of
peripherals is used for installation purposes only. Add-in adapter cards are not tested.

Adapter compatibility validation (CV) testing uses test suites to gain an accurate view of how the server
performs with a wide variety of adapters under the primary supported operating systems. These tests are
designed to show hardware compatibility between the cards and the server platform and include functional
testing only. No heavy stressing of the systems or the cards is performed for CV testing.

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Intel® Server System R1000SPO Product Family TPS

Stress Testing uses configurations that include add-in adapters in all available slots for a 48-hour (two-day),

or a 72-hour (three-day) test run without injecting errors. Each configuration passes an installation test and a
Network/Disk Stress test. Any fatal errors that occur require a complete test restart.

2.1.2 OS Technical Support Levels

T1: Intel will provide support for issues involving the installation and/or functionality of a specified operating

system as configured with or without supported adapters and/or peripherals.

T2: Intel will provide and test operating system drivers for each of the server board’s integrated controllers,

provided that the controller vendor has a driver available upon request. Vendors will not be required by Intel
to develop drivers for operating systems that they do not already support. Intel will NOT provide support for
issues related to the use of any add-in adapters or peripherals installed in the server system when an
operating system that received only basic installation testing is in use.

T3: Intel will not provide technical support for an open source operating system. All questions and issues
related to an open source operating system must be submitted to and supported by the open source
community supporting the given operating system.

2.2 System Features Overview

Figure 1. System Components Overview

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Intel® Server System R1000SPO Product Family TPS

Figure 2. Top Cover Features

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Intel® Server System R1000SPO Product Family TPS

2.3 Server Board Features Overview

The following illustration provides a general overview of the server board, identifying key feature and
component locations. Please refer to Intel® Server Board S1200SP Technical Product Specification for more
information.

Figure 3. Server Board Features

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Intel® Server System R1000SPO Product Family TPS

The server board includes several LEDs to identify system status. The following illustrations define
supported LEDs and identify their location.

Figure 4. On-board Diagnostic LEDs

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Intel® Server System R1000SPO Product Family TPS

Figure 5. System Reset and Configuration Jumpers

2.4 Back Panel Features

Figure 6. Back Panel Features

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Intel® Server System R1000SPO Product Family TPS

Label

Description

A

System ID Button w/Integrated LED

B

NMI Button (recessed, tool required for use)

C

NIC 1 & 2 Activity LEDs

D

System Cold Reset Button (recessed, tool required for use)

E

System Status LED

F

Power Button w/Integrated LED

G

Drive Activity LED

2.5 Front Control Panel

Figure 7. Front Control Panel Options

2.6 Front Drive Bay Options

Figure 8. 3.5" Drive Bay – 4 Drive Configuration (Model R1304SPxxxxx)

Figure 9. 2.5" Drive Bay – 8 Drive Configuration (Model R1208SPxxxxx)

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Intel® Server System R1000SPO Product Family TPS

2.7 Locking Front Bezel

The optional front bezel is made of Black molded plastic and uses a snap-on design. When installed, its
design allows for maximum airflow to maintain system cooling requirements. The front bezel includes a
keyed locking mechanism which can be used to prevent unauthorized access to installed storage devices
and front I/O ports.

Figure 10. Front Bezel

(Intel Product Order Code – A1UBEZEL)

The face of the bezel assembly includes snap-in identification badge options and a wave feature option to
allow for customization.

Figure 11. Front Bezel Accessory with Optionally Installed Wave Feature

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Intel® Server System R1000SPO Product Family TPS

Figure 12. Front Bezel Accessory with Optionally Installed Wave and ID Badge (1)

Figure 13. Front Bezel Accessory with Optionally Installed Wave and ID Badge (2)

Figure 14. Front Bezel Accessory ID Badge Mechanical Drawings

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Intel® Server System R1000SPO Product Family TPS

1.7”

2.8 System Dimensions

2.8.1 Chassis Dimensions

Figure 15. Chassis Dimensions

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Intel® Server System R1000SPO Product Family TPS

2.8.2 Label Emboss Dimensions

15

Figure 16. Label Emboss Dimensions

Intel® Server System R1000SPO Product Family TPS

2.8.3 Pull-out Tab Label Emboss Dimensions

Figure 17. Pull-out Tab Label Emboss Dimensions

2.9 Available Rack Mounting Kit Options

Advisory Note – Available rack and cabinet mounting kits are not designed to support shipment of the

server system while installed in a rack. If you chose to do so, Intel advises you verify your shipping
configuration with appropriate shock and vibration testing, before shipment. Intel does not perform shipping
tests which cover the complex combination of unique rack offerings and custom packaging options.

Caution: Exceeding the rail kit’s specified maximum weight limit or misalignment of the server in the rack
may result in failure of the rack rails, resulting in damage to the system or personal injury. Two people or the
use of a mechanical assist tool to install and align the server into the rack is highly recommended.

Available Rack mounting kits:

 AXXVPSRAIL – Vale plus short rail

- 424mm max travel length

- 129 lbs. (59 Kg) max support weight

- Front and rear mounting bracket adjustment distance: 609mm to 705mm

- Stab-in system install

- x8 #10-32 screws to mount rail kit on rack flange (screw kit come with rail kit assembling)

- No cable management arm support

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Intel® Server System R1000SPO Product Family TPS

Parameter

Limits

Temperature
Operating

ASHRAE Class A2 – Continuous Operation. 10º C to 35º C (50º F to 95º F) with the maximum
rate of change not to exceed 10°C per hour

ASHARE Class A3 – Includes operation up to 40°C for up to 900 hours per year. Refer to
Appendix E for detailed guidance.

Shipping

-40º C to 70º C (-40º F to 158º F)

Altitude

Operating

Support operation up to 3050m with ASHRAE class de-ratings.

Humidity

Shipping

50% to 90%, non-condensing with a maximum wet bulb of 28° C (at temperatures from 25°
C to 35° C)

Shock

Operating

Half sine, 2 g, 11 mSec

Unpackaged

Trapezoidal, 25 g, velocity change is based on packaged weight

Packaged

ISTA (International Safe Transit Association) Test Procedure 3A 2008

Vibration
Unpackaged

5 Hz to 500 Hz 2.20 g RMS random

Packaged

ISTA (International Safe Transit Association) Test Procedure 3A 2008

AC-DC

Voltage

90 V to 132 V and 180 V to 264 V

Frequency

47 Hz to 63 Hz

Source Interrupt

No loss of data for power line drop-out of 12 mSec

Surge Non­operating and
operating

Unidirectional

Line to earth Only

AC Leads 2.0 kV

I/O Leads 1.0 kV
DC Leads 0.5 kV

ESD
Air Discharged

12.0 kV

Contact Discharge

8.0 kV

Acoustics
Sound Power
Measured

Power in Watts

<300 W ≥300 W ≥600 W ≥1000 W

Servers/Rack
Mount Sound
Power Level (in
BA)

7.0 7.0 7.0 7.0

2.10 System Level Environmental Limits

The following table defines the system level operating and non-operating environmental limits.

Table 5. System Environmental Limits Summary

17

Intel® Server System R1000SPO Product Family TPS

Product code

Net Weight（kg）

Gross Weight（kg）

Net Weight (Lbs.)

Gross Weight (Lbs.)

R1304SPOSHBN

7.77

11.6

17.1

25.6

R1304SPOSHOR

8.87

12.8

19.6

28.2

R1208SPOSHOR

9.09

13

20

28.7

E1304SPOSHON

8.99

12.8

19.8

28.2

2.11 System Packaging

The original Intel packaging, in which the server system is delivered, is designed to provide protection to a
fully configured system and was tested to meet ISTA (International Safe Transit Association) Test Procedure
3A (2008). The packaging was also designed to be re-used for shipment after system integration has been
completed.

The original packaging includes – a small inner box for ship along accessories, the outer shipping main box,
and various protective inner packaging components. The boxes and packaging components are designed to
function together as a protective packaging system. When reused, all of the original packaging material must
be used, including both boxes and each inner packaging component. In addition, all inner packaging
components MUST be reinstalled in the proper location to ensure adequate protection of the system for
subsequent shipment.

Please refer to the Intel® Server System R1000SPO Product Family System Integration and Service Guide for
complete packaging assembly instructions.

NOTE: The design of the inner packaging components does not prevent improper placement within the
packaging assembly. There is only one correct packaging assembly that will allow the package to meet the
ISTA (International Safe Transit Association) Test Procedure 3A (2008) limits.

Failure to follow the specified packaging assembly instructions may result in damage to the system during
shipment.

2.11.1 Intel Product Weight Information

Table 6. Intel Product Weight Information

NOTE: An L6 system does not include processors, memory, drives, or add-in cards. It is the system

configuration as shipped from Intel. Integrated system weights (System configurations that include the items
above) will vary depending on the final system configuration. For the 1U product family, a fully integrated
un-packaged system can weigh up to 40 Lbs. (18+ Kg).

18

Intel® Server System R1000SPO Product Family TPS

3. System Power

This chapter provides a high level overview of the features and functions related to system power.

3.1 Power Supply Configurations

Systems within this product family are offered with options to support a single fixed mount 350 watt power
supply or dual 450 watt power supply modules. Dual power supply configurations support the following
power configurations: 1+0 (single), and 1+1 (redundant).

1+1 redundant power is supported if the total system power draw remains below the maximum power
capacity of a single power supply module. If a power supply fails, the remaining power supply will allow the
system to remain fully operational. The power supplies are hot swap capable allowing the failed power
supply to be replaced without powering down the system.

In dual power supply configured systems, the power supplies are modular, allowing for tool-less insertion
and extraction from a bay in the back of the chassis. When inserted, the card edge connector of the power
supply mates blindly to a matching slot connector on the Power Distribution Board (PDB).

19

Figure 18. 350W AC Fixed Power Supply

Figure 19. 450W AC Power Supply

Intel® Server System R1000SPO Product Family TPS

Loading

Efficiency

20% of maximum

85%

50% of maximum

88%

100% of maximum

85%

Loading

Efficiency

20% of maximum

88%

50% of maximum

92%

100% of maximum

88%

3.2 Power Supply Module Options

There are two power supply options available for this server product family: 350W AC (fixed mount) and
450W AC (Module).

3.2.1 Power Supply Module Efficiency

The following tables provide the required minimum efficiency level at various loading conditions. These are
provided at three different load levels: 100%, 50%, and 20%.

The AC power supply efficiency is tested over an AC input voltage of 230 VAC.

Table 7. 350 Watt AC Power Supply Efficiency (Gold)

Table 8. 450 Watt AC Power Supply Efficiency (Gold)

3.2.2 Power Supply Module Mechanical Overview

Figure 20. 350W Power Supply Mechanical Drawings

20

Intel® Server System R1000SPO Product Family TPS

Figure 21. 450W Power Supply Mechanical drawings

3.2.3 Power distribution board

The dual power supply configuration option for the Intel® Server System R1000SPO product family
incorporates a Power Distribution Board (PDB), and is where the Redundant Power Supply modules are
attached. The Connections for Server Board power, communications for power supply monitoring, power for
the Backplane and Optical Disk Drive, come from the Power Distribution Board. For connector pinout and
power supply monitoring details, please refer to the Intel® Server Board S1200SP Product Family Technical
Product Specification. The PDB is designed to plug directly to the output connector of the power supply and
it contains two DC/DC power converters to produce other required voltages.

Figure 22. Power Distribution Board

21

Intel® Server System R1000SPO Product Family TPS

Cable Type

SJT

Wire Size

16 AWG

Temperature Rating

105ºC

Amperage Rating

13 A

Voltage Rating

125 V

Output power (350w PSU)

20% load

50% load

100% load

Power factor

0.8

0.9

0.98

Output power (450w PSU)

20% load

50% load

100% load

Power factor

0.8

0.9

0.95

3.2.4 Power Cord Specification Requirements

The AC power cord used must meet the specification requirements listed in the following table.

Table 9. AC Power Cord Specifications

Figure 23. AC Power Cord

3.3 AC Power Supply Input Specifications

The following sections provide the AC Input Specifications for systems configured with AC power supply
modules.

3.3.1 Power Factor

The power supply must meet the power factor requirements stated in the Energy Star* Program
Requirements for Computer Servers. These requirements are stated below.

22

Intel® Server System R1000SPO Product Family TPS

PARAMETER

MIN

RATED

MAX

Max Input AC Current

Line Voltage (110)

90V

rms

100-127 V

rms

140V

rms

6 A

rms

1

Line Voltage (220)

180V

rms

200-240 V

rms

264V

rms

3 A

rms

2

Frequency

47 Hz

50/60Hz

63 Hz

DC Voltage

237VDC

250VDC

262VDC

PARAMETER

MIN

RATED

VMAX

Start-up VAC

Power-off VAC

Voltage (110)

90 V

rms

100-127 V

rms

140 V

rms

1

85VAC +/-4VAC

70VAC +/-5VAC

Voltage (220)

180 V

rms

200-240 V

rms

264 V

rms

2

Frequency

47 Hz

50/60 Hz

63 Hz³

Loading

Holdup time

75%

12msec

3.3.2 AC Input Voltage Specification

The power supply must operate within all specified limits over the following input voltage range. Harmonic
distortion of up to 10% of the rated line voltage must not cause the power supply to go out of specified
limits. Application of an input voltage below 85VAC shall not cause damage to the power supply, including a
blown fuse.

Table 10. Input Voltage Range – 350W Power Supply

1. Maximum input current at low input voltage range shall be measured at 90VAC, at max load.

2. Maximum input current at high input voltage range shall be measured at 180VAC, at max load.

Table 11. AC Input Voltage Range – 450W Power Supply

1. Maximum input current at low input voltage range shall be measured at 90VAC, at max load.

2. Maximum input current at high input voltage range shall be measured at 180VAC, at max load.

3. This requirement is not to be used for determining agency input current markings.

3.3.3 AC Line Isolation Requirements

The power supply shall meet all safety agency requirements for dielectric strength. Transformers’ isolation
between primary and secondary windings must comply with the 3000Vac (4242Vdc) dielectric strength
criteria. If the working voltage between primary and secondary dictates a higher dielectric strength test
voltage the highest test voltage should be used. In addition the insulation system must comply with
reinforced insulation per safety standard IEC 950. Separation between the primary and secondary circuits,
and primary to ground circuits, must comply with the IEC 950 spacing requirements.

3.3.4 AC Line Dropout / Holdup

An AC line dropout is defined to be when the AC input drops to 0VAC at any phase of the AC line for any
length of time. An AC line dropout for less than 12ms shall not cause tripping of control signals or protection
circuits. If the AC dropout lasts longer than the holdup time the power supply should recover and meet all
turn on requirements. The power supply shall meet the AC dropout requirement over rated AC voltages and
frequencies. A dropout of the AC line for any duration shall not cause damage to the power supply.

23

Table 12. AC Line Holdup Time – 350W Power supply

Intel® Server System R1000SPO Product Family TPS

Loading

Holdup time

75%

12msec

100%

10msec

AC Line Sag (10sec interval between each sagging)

Duration

Sag

Operating AC Voltage

Line Frequency

Performance Criteria

Continuous

10%

Nominal AC Voltage ranges

50/60Hz

No loss of function or performance

1 to 12ms

100%

Nominal AC Voltage ranges

50/60Hz

No loss of function or performance

> 12ms

>30%

Nominal AC Voltage ranges

50/60Hz

Loss of function acceptable, self­recoverable

AC Line Surge

Duration

Surge

Operating AC Voltage

Line Frequency

Performance Criteria

Continuous

10%

Nominal AC Voltages

50/60Hz

No loss of function or performance

0 to ½ AC
cycle

30%

Nominal AC Voltages

50/60Hz

No loss of function or performance

AC Line Sag (10sec interval between each sagging)

Duration

Sag

Operating AC Voltage

Line Frequency

Performance Criteria

0 to 1/2 AC cycle

95%

Nominal AC Voltage ranges

50/60Hz

No loss of function or performance

> 1 AC cycle

>30%

Nominal AC Voltage ranges

50/60Hz

Loss of function acceptable, self-recoverable

Table 13. AC Line Holdup Time – 450W Power Supply

3.3.5 AC Line Fuse

The power supply shall have one line fused in the single line fuse on the line (Hot) wire of the AC input. The
line fusing shall be acceptable for all safety agency requirements. The input fuse shall be a slow blow type.
AC inrush current shall not cause the AC line fuse to blow under any conditions. All protection circuits in the
power supply shall not cause the AC fuse to blow unless a component in the power supply has failed. This
includes DC output load short conditions.

3.3.6 AC Line Transient Specification

AC line transient conditions shall be defined as “sag” and “surge” conditions. “Sag” conditions are also
commonly referred to as “brownout”, these conditions will be defined as the AC line voltage dropping below

nominal voltage conditions. “Surge” will be defined to refer to conditions when the AC line voltage rises
above nominal voltage.

Table 14. AC Line Sag Transient Performance – 350W Power Supply

Table 15. AC Line Surge Transient Performance – 350W Power Supply

Table 16. AC Line Sag Transient Performance – 450W Power Supply

24

Intel® Server System R1000SPO Product Family TPS

AC Line Surge

Duration

Surge

Operating AC Voltage

Line Frequency

Performance Criteria

Continuous

10%

Nominal AC Voltages

50/60Hz

No loss of function or performance

0 to ½ AC cycle

30%

Mid-point of nominal AC Voltages

50/60Hz

No loss of function or performance

Level

Description

A

The apparatus shall continue to operate as intended. No degradation of performance.

B

The apparatus shall continue to operate as intended. No degradation of performance beyond spec limits.

C

Temporary loss of function is allowed provided the function is self-recoverable or can be restored by the
operation of the controls.

Table 17. AC Line Surge Transient Performance – 450W Power Supply

3.3.7 Susceptibility Requirements

The power supply shall meet the following electrical immunity requirements when connected to a cage with
an external EMI filter which meets the criteria defined in the SSI document EPS Power Supply Specification.
For further information on Intel standards please request a copy of the Intel Environmental Standards
Handbook.

Table 18. Performance Criteria

3.3.8 Electrostatic Discharge Susceptibility

The power supply shall comply with the limits defined in EN 55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-2: Edition 1.2: 2001-04 test standard and performance criteria B defined in Annex B of CISPR 24.

3.3.9 Fast Transient/Burst

The power supply shall comply with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-4: Second edition: 2004-07 test standard and performance criteria B defined in Annex B of CISPR

24.

3.3.10 Radiated Immunity

The power supply shall comply with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-3: Edition 2.1: 2002-09 test standard and performance criteria A defined in Annex B of CISPR 24.

3.3.11 Power Recovery

The power supply shall recover automatically after an AC power failure. AC power failure is defined to be
any loss of AC power that exceeds the dropout criteria.

3.3.12 Voltage Interruptions

The power supply shall comply with the limits defined in EN55024: 1998/A1: 2001/A2: 2003 using the IEC
61000-4-11: Second Edition: 2004-03 test standard and performance criteria C defined in Annex B of CISPR

24.

3.3.13 Protection Circuits

Protection circuits inside the power supply cause only the power supply’s main outputs to shut down. If the

power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15 seconds and a PSON#
cycle HIGH for one second reset the power supply.

25

Intel® Server System R1000SPO Product Family TPS

Output Voltage
Continuous Load

Current Limit MIN

Current Limit MAX

+12V1

18.2A

20A

+12V2

18.2A

20A

+5V

19.2A

24A

+3.3V

12A

15A

-12V

4A

+5VSB

4.5A

Output

Min OCP

Max OCP

+12V

40 A

54 A

5Vstby

3.6A~8A

Output Voltage

OVP MIN (V)

OVP MAX (V)

+3.3V

3.7

4.5

+5V

5.7

6.5

+12V1/+12V2

13.3

15.6

-12V

-13.3

-15.6

+5VSB

5.7

6.5

3.3.13.1 Over-current Protection (OCP)

The power supply shall have current limit to prevent the outputs from exceeding the values shown in table
below. If the current limits are exceeded the power supply shall shutdown and latch off. The latch will be
cleared by toggling the PSON# signal or by an AC power interruption. The power supply shall not be
damaged from repeated power cycling in this condition. 5VSB will be auto-recovered after removing OCP
limit.

Table 19. Over Current Protection – 350W Power Supply

Table 20. Over Current Protection – 450 Watt Power Supply

3.3.13.2 Over-voltage Protection (OVP)

The power supply over voltage protection shall be locally sensed. The power supply shall shutdown and
latch off after an over voltage condition occurs. This latch shall be cleared by an AC power interruption. The
values are measured at the output of the power supply’s connectors. The voltage shall never exceed the
maximum levels when measured at the power connectors of the power supply connector during any single
point of fail. The voltage shall never trip any lower than the minimum levels when measured at the power
connector. 12VSB will be auto-recovered after removing OVP limit.

Table 21. Over Voltage Protection - 350W Power Supply

26

Intel® Server System R1000SPO Product Family TPS

OUTPUT VOLTAGE

PROTECTION POINT [ V]

+12 V

13.6V ~ 15.0V

5VSB

5.6V ~ 6.5V

Power Supply Condition

LED State

Output ON and OK

GREEN

No AC power to all power supplies

OFF

AC present / Only 12VSB on (PS off) or PS in Cold
redundant state

1Hz Blink GREEN

AC cord unplugged or AC power lost; with a second
power supply in parallel still with AC input power.

AMBER

Power supply warning events where the power supply
continues to operate; high temp, high power, high
current, slow fan.

1Hz Blink Amber

Power supply critical event causing a shutdown; failure,
OCP, OVP, Fan Fail

AMBER
Power supply FW updating

2Hz Blink GREEN

Table 22. Over Voltage Protection (OVP) Limits – 750W Power Supply

3.3.13.3 Over-temperature Protection (OTP)

The power supply will be protected against over temperature conditions caused by loss of fan cooling or
excessive ambient temperature. In an OTP condition the PSU will shut down. When the power supply
temperature drops to within specified limits, the power supply shall restore power automatically, while the
12VSB remains always on. The OTP circuit must have built in margin such that the power supply will not
oscillate on and off due to temperature recovering condition. The OTP trip level shall have a minimum of 4C
of ambient temperature margin.

3.3.14 Power Supply Status LED

There is a single bi-color LED to indicate the power supply status on the Redundant Power Supply Modules.
The LED operation is defined in the following table.

Table 23. LED Indicators

3.4 Server Board Power Connectors

The server board provides several connectors to provide power to various system options. The following
sub-sections will provide the pin-out definition; and a brief usage description for each.

The main power supply connection uses an SSI-compliant 2x12 pin connector.

Two additional power-related connectors also exist:

 One SSI-compliant 2x4 pin power connector to provide 12-V power to the CPU voltage regulators and

memory.

 One SSI-compliant 1x5 pin connector to provide monitoring of the power supply.

27

Intel® Server System R1000SPO Product Family TPS

Pin

IO

Signal Name

Pin

IO

Signal Name

1

PWR

+3.3V

13

PWR

+3.3V

2

PWR

+3.3V

14

PWR

-12V (NA for most designs)

3

GND

GND

15

GND

GND

4

PWR

+5V

16

I

PS_ON#

5

GND

GND

17

GND

GND

6

PWR

+5V

18

GND

GND

7

GND

GND

19

GND

GND

8 O PWR_GD

20

NC

NC

9

PWR

SB5V

21

PWR

+5V

10

PWR

+12V

22

PWR

+5V

11

PWR

+12V

23

PWR

+5V

12

PWR

+3.3V

24

GND

GND

Pin

IO

Signal Name

Pin

IO

Signal Name

1

GND

GND

5

PWR

P12V1

2

GND

GND

6

PWR

P12V1

3

GND

GND

7

PWR

P12V2

4

GND

GND

8

PWR

P12V2

Pin

IO

Signal Name

1 I PMBUS_CLK

2

IO

PMBUS_DATA

3 O IRQ_PMBUS_ALERT_N

4

GND

GND Return Sense

5 I P3V3 Sense

The following tables define the pin-out for the connectors:

Table 24. Main Power Connector Pin-out

Table 25. CPU Power Connector Pin-out

Table 26. PMBUS SSI Connector Pin-out (PS_AUX)

28

Intel® Server System R1000SPO Product Family TPS

4X3.5'' Front End

All System Fan

PSU Fan

w/o
PSU(CFM)

w/
PSU(CFM)

100%

Auto

42.6

44.19

85%

35.3

37.2

75%

31.1

32.4

65%

26.7

27.6

55%

22.3

22.7

45%

18.1

18.2

35%

13.5

14.0

20%

7.5

7.7

4. Thermal Management

The fully integrated system is designed to operate at external ambient temperatures of between 10°C and
35°C. Working with integrated platform management, several features within the system are designed to
move air in a front to back direction, through the system and over critical components to prevent them from
overheating and allow the system to operate with best performance.

Figure 24. System Air Flow and Fan Identification

The following table provides air flow data associated with one of the system models within this 1U product
family, and is provided for reference purposes only. The data was derived from actual wind tunnel test
methods and measurements using fully configured (worst case) system configurations. Lesser system
configurations may produce slightly different data results. In addition, the CFM data was derived using server
management utilities that utilize platform sensor data, and may vary slightly from the data listed in the
tables.

Table 27. System Volumetric Air Flow

29

Intel® Server System R1000SPO Product Family TPS

The Intel® Server System R1000SPO product family is thermally designed and developed in compliance with
ASHRAE Class A2 environment guidance; however, there is extra thermal margin for all components in the
system, so ASHRAE Class A3 environment conditions can be thermally supported.

Note: ASHARE Class A3 – Includes operation up to 40°C for up to 900 hours per year. Refer to Appendix E for
detailed HTA guidance.

The installation and functionality of several system components are used to maintain system thermals. They
include three managed 40mm single rotor system fans, fans integrated into each installed power supply
module, an air duct, populated drive carriers, and a CPU heat sink. Drive carriers can be populated with a
storage device (SSD or Hard Disk Drive) or supplied drive blank.

4.1 Thermal Operation and Configuration Requirements

To keep the system operating within supported maximum thermal limits, the system must meet the
following operating and configuration guidelines:

 The system is designed for sustained operation on ambient temperature up to 35°C (ASHRAE Class

A2)

 All externally accessed drive bays must be populated. Drive carriers can be populated with a storage

device (SSD or HDD) or supplied drive blank

 When the system is operating, the air duct must be installed at all times
 The system top cover must be installed at all times when the system is in operation in order to have

proper air flow

4.2 Thermal Management Overview

In order to maintain the necessary airflow within the system, all of the previously listed components need to
be properly installed. For best system performance, the external ambient temperature should remain below
35°C and all system fans (all rotors) should be operational.

NOTE: All system fans are controlled independent of each other. The fan control system may adjust fan
speeds for different fans based on increasing/decreasing temperatures in different thermal zones within the
chassis.

In the event that system temperatures should continue to increase with the system fans operating at their
maximum speed, platform management may begin to throttle bandwidth of either the memory subsystem or
the processors or both, in order to keep components from overheating and keep the system operational.
Throttling of these subsystems will continue until system temperatures are reduced below preprogrammed
limits.

The power supply will be protected against over temperature conditions caused by excessive ambient
temperature. In an over-temperature protection condition, the power supply module will shut down.

4.2.1 Fan Speed Control

The baseboard management controller (BMC) supports monitoring and control of fan speed (RPM). Each fan
is associated with a fan speed sensor that detects fan failure.

30

Intel® Server System R1000SPO Product Family TPS

The system fans are divided into fan domains, each of which has a separate fan speed control signal and a
separate configurable fan control policy. A fan domain can have a set of temperature and fan sensors
associated with it. These are used to determine the current fan domain state.

A fan domain has three states:

 The sleep and boost states have fixed (but configurable through OEM SDRs) fan speeds associated

with them

o The nominal state has a variable speed determined by the fan domain policy. An OEM SDR

record is used to configure the fan domain policy

The fan domain state is controlled by several factors. They are listed below in order of precedence, high to
low:

 Boost

- Associated fan is in a critical state or missing. The SDR describes which fan domains are boosted

in response to a fan failure or removal in each domain. If a fan is removed when the system is in

‘Fans-off’ mode it will not be detected and there will not be any fan boost till system comes out of
‘Fans-off; mode.

- Any associated temperature sensor is in a critical state. The SDR describes which temperature

threshold violations cause fan boost for each fan domain.

- The BMC is in firmware update mode, or the operational firmware is corrupted.

- If any of the above conditions apply, the fans are set to a fixed boost state speed.

 Nominal

- A fan domain’s nominal fan speed can be configured as static (fixed value) or controlled by the

state of one or more associated temperature sensors.

4.2.2 Programmable Fan PWM Offset

The system provides a BIOS Setup option to boost the system fan speed by a programmable positive offset

or a “Max” setting. Setting the programmable offset causes the BMC to add the offset to the fan speeds to

which it would otherwise be driving the fans. The Max setting causes the BMC to replace the domain
minimum speed with alternate domain minimums that also are programmable through SDRs.

This capability is offered to provide system administrators the option to manually configure fan speeds in
instances where the fan speed optimized for a given platform may not be sufficient when a high end add-in
adapter is configured into the system. This enables easier usage of the fan speed control to support Intel as
well as third party chassis and better support of ambient temperatures higher than 35°C.

4.2.3 Fan Domains

System fan speeds are controlled through pulse width modulation (PWM) signals, which are driven
separately for each domain by integrated PWM hardware. Fan speed is changed by adjusting the duty cycle,
which is the percentage of time the signal is driven high in each pulse.

The BMC controls the average duty cycle of each PWM signal through direct manipulation of the integrated
PWM control registers.

The same device may drive multiple PWM signals.

31

Intel® Server System R1000SPO Product Family TPS

4.2.4 Nominal Fan Speed

A fan domain’s nominal fan speed can be configured as static (fixed value) or controlled by the state of one

or more associated temperature sensors.

OEM SDR records are used to configure which temperature sensors are associated with which fan control
domains and the algorithmic relationship between the temperature and fan speed. Multiple OEM SDRs can
reference or control the same fan control domain; and multiple OEM SDRs can reference the same
temperature sensors.

The PWM duty-cycle value for a domain is computed as a percentage using one or more instances of a
stepwise linear algorithm and a clamp algorithm. The transition from one computed nominal fan speed
(PWM value) to another is ramped over time to minimize audible transitions. The ramp rate is configurable by
means of the OEM SDR.

Multiple stepwise linear and clamp controls can be defined for each fan domain and used simultaneously.

For each domain, the BMC uses the maximum of the domain’s stepwise linear control contributions and the
sum of the domain’s clamp control contributions to compute the domain’s PWM value, except that a

stepwise linear instance can be configured to provide the domain maximum.

Hysteresis can be specified to minimize fan speed oscillation and to smooth fan speed transitions. If a
Tcontrol SDR record does not contain a hysteresis definition, for example, an SDR adhering to a legacy
format, the BMC assumes a hysteresis value of zero.

4.2.5 Thermal and Acoustic Management

This feature refers to enhanced fan management to keep the system optimally cooled while reducing the
amount of noise generated by the system fans. Aggressive acoustics standards might require a trade-off
between fan speed and system performance parameters that contribute to the cooling requirements and
primarily memory bandwidth. The BIOS, BMC, and SDRs work together to provide control over how this
trade-off is determined.

This capability requires the BMC to access temperature sensors on the individual memory DIMMs.
Additionally, closed-loop thermal throttling is only supported with buffered DIMMs.

4.2.6 Thermal Sensor Input to Fan Speed Control

The BMC uses various IPMI sensors as input to the fan speed control. Some of the sensors are IPMI models

of actual physical sensors whereas some are “virtual” sensors whose values are derived from physical

sensors using calculations and/or tabular information.

The following IPMI thermal sensors are used as input to fan speed control:

1, 7, 9

1

2,4

6

5

5

7

 Front Panel Temperature Sensor
 CPU Margin Sensors

2,4,5

 DIMM Thermal Margin Sensors
 Exit Air Temperature Sensor
 PCH Temperature Sensor

3,5

 Add-In Intel SAS Module Temperature Sensors
 PSU Thermal Sensor

3, 8

 CPU VR Temperature Sensors
 DIMM VR Temperature Sensors
 BMC Temperature Sensor

3, 6

 Global Aggregate Thermal Margin Sensors

32

Intel® Server System R1000SPO Product Family TPS

Resulting

Fan Speed

Policy

Events

Sensor

System Behavior

Memory

Settings

Intrusion

Fan Failure

Power Supply

Failure

Other Sensors

(Chipset, Temp,

etc..)

Policy: CLTT,

Acoustic/Performance,

configuration

Front Panel

Processor

Margin

 Hot Swap Backplane Temperature Sensors
 I/O Module Temperature Sensor (With option installed)
 Intel

®

SAS Module (With option installed)

Notes:

1. For fan speed control in Intel chassis

2. Temperature margin from throttling threshold

3. Absolute temperature

4. PECI value or margin value

5. On-die sensor

6. On-board sensor

7. Virtual sensor

8. Available only when PSU has PMBus

9. Calculated estimate

A simple model is shown in the following figure which gives a high level representation of how the fan speed
control structure creates the resulting fan speeds

Auto-Profile

Throttle

33

Figure 25. Fan Control Model

Intel® Server System R1000SPO Product Family TPS

4.3 System Fans

Three single rotor 40 x 56mm system fans, and dedicated fans for the installed power supply modules
provide the primary airflow for the system.

The system includes three system fans (see Figure 26). The fans are held in place by fitting them over
mounting pins coming up from the chassis base.

The Fixed Power Supply option of this product family comes with a dedicated fan inside the Power Supply
Module.

The dual Power Supply Option integrates a Power supply Cage with a fixed single rotor 40x56mm fan for
each Power Supply Module. They are responsible for airflow through the power supply module. The fans are
managed by the fan control system. Should a fan fail, the power supply will shut down.

Figure 26. System Fans

 System fans are NOT hot-swap capable
 Each fan and is designed for tool-less insertion and extraction from the system. For instructions on

fan replacement, please refer to the Intel® Server System R1000SPO System Integration and Service
Guide

 Each fan and incorporates vibration dampening features used to minimize fan vibration affects within

the chassis

 Fan speed for each fan is controlled by integrated platform management as controlled by the

integrated BMC on the server board. As system thermals fluctuate high and low, the integrated BMC
firmware will increase and decrease the speeds to specific fans to regulate system thermals.

 Each fan has a tachometer signal for each rotor that allows the Integrated BMC to monitor their

status.

 Each fan has a 4-pin wire harness that connects to a matching connector on the server board.

34

Intel® Server System R1000SPO Product Family TPS

Pin

Signal Name

Type

Description

1

Ground

GND

Ground is the power supply ground

2

12V

Power

Power supply 12 V

3

Fan Tach Fan
PWM

In Out

FAN_TACH signal is connected to the BMC to monitor the fan speed
FAN_PWM signal to control fan speed

4

Fan PWM Fan
Tach

Out In

FAN_PWM signal to control fan speed FAN_TACH signal is connected to
the BMC to monitor the fan speed

Figure 27. System Fan Connector Locations on Server Board

Table 28. System Fan Connector Pin-out

35

Intel® Server System R1000SPO Product Family TPS

5. System Storage and Peripheral Drive Bay Overview

The Intel® Server System R1000SPO product family has support for a variety of different storage options,
including:

 Up to 8 x 2.5” hot swap SAS or SATA drives (hard disk or SSD)
 Up to 4 x 3.5” hot swap SAS or SATA hard disk drives or 2.5” SSDs
 SATA Slim-line Optical Drive support
 SATADOM Support on SATA port 4
 Internally mounted Low Profile M.2 Solid State Device (M.2 SSD)

Support for different storage and peripheral options will vary depending on the system model and/or
available accessory options installed. This section will provide an overview of each available option.

5.1 Front Mount Drive Support

The 1U product family provides options to support either 8x2.5” or 4x3.5” front mounted drives. Both
system options provide front panel I/O and front control panel support.

Figure 28. 8x2.5" Drive Bay Configuration (Model R1208xxxxx)

Figure 29. 4x3.5" Drive Bay Configuration (Model R1304WTxxxx)

5.2 System Fan RVI and Hard Disk Drive Storage Performance

Hard disk drive storage technology, which utilizes the latest state-of-the-art track density architectures, are
susceptible to the effects of system fan rotational vibration interference (RVI) within the server system. As
system fan speeds increase to their upper limits (>80% PWM or > 19,320 RPM), hard disk drive performance
can be impacted.

Intel publishes a list of supported hard drives on its Tested Hardware and OS List (THOL). In general, unless
identified in the NOTES column in the THOL, all listed hard drives have been tested to meet Intel
performance targets when the systems fans are operating above 80% PWM and/or the system is operating
at or below the platform ambient thermal limit of 35°C (95°F).

The THOL may also list hard drives that are only recommended for use in non-extreme operating
environments, where the ambient air is at or below 20°C (68°F) and /or the hard drives are installed in
system configurations where the system fans regularly operate below 80% PWM. Hard drives that require
these support criteria for a given system will include an “Environmental Limitation” tag and message in the
THOL “NOTES” column for that device. Using these drives in the more extreme operating environments puts
these devices at higher risk of performance degradation.

36

Intel® Server System R1000SPO Product Family TPS

Intel recommends the following general support guidelines for server systems configured with hard drive
storage technology:

 Avoid sustained server operation in extreme operating environments. Doing so will cause the system

fans to operate at their upper speed limits and produce higher levels of RVI which could affect hard
drive performance.

NOTE: Solid State Drive (SSD) performance is not impacted by the effects of system fan RVI.

5.3 Hot Swap Drive Carriers

Each SAS/SATA hard disk drive or SSD that interfaces with a backplane is mounted to a hot swap drive
carrier. Drive carriers include a latching mechanism used to assist with drive extraction and drive insertion.

Figure 30. Hot Swap Storage Device Carrier Removal

NOTE: To ensure proper system air flow requirements, all front drive bays must be populated with a drive

carrier. Drive carriers must be installed with either a drive or supplied drive blank.

There are drive carriers to support 2.5” devices and 3.5” devices. To maintain system thermals, all drive bays
must be populated with a drive carrier mounted with a hard disk drive, SSD, or supplied drive blank. Drive
blanks used with the 3.5” drive carrier can also be used to mount a 2.5” SSD into it as shown below.

37

Intel® Server System R1000SPO Product Family TPS

Amber Status LED

Green Activity LED

2.5” only drive tray

Amber Status LED

Green Activity LED

2.5” / 3.5” drive tray

Figure 31. 2.5" SSD mounted to 3.5" Drive Tray

NOTE: Due to degraded performance and reliability concerns, the use of the 3.5” drive blank as a 2.5” device

bracket is intended to support SSD type storage devices only. Installing a 2.5” hard disk drive into the 3.5”
drive blank cannot be supported.

Each drive carrier includes separate LED indicators for drive Activity and drive Status. Light pipes integrated
into the drive carrier assembly direct light emitted from LEDs mounted next to each drive connector on the
backplane to the drive carrier faceplate, making them visible from the front of the system.

Figure 32. Drive Tray LED Identification

38

Intel® Server System R1000SPO Product Family TPS

Amber

Off

No access and no fault

Solid On

Hard Drive Fault has occurred

Blink

RAID rebuild in progress (1 Hz), Identify (2 Hz)

Green

Condition

Drive Type

Behavior

Power on with no drive activity
SAS

LED stays on

SATA

LED stays off

Power on with drive activity
SAS

LED blinks off when processing a command

SATA

LED blinks on when processing a command

Power on and drive spun down
SAS

LED stays off

SATA

LED stays off

Power on and drive spinning up
SAS

LED blinks

SATA

LED stays off

Table 29. Drive Status LED States

Table 30. Drive Activity LED States

NOTE: The drive activity LED is driven by signals coming from the drive itself. Drive vendors may choose to

operate the activity LED different from what is described in the table above. Should the activity LED on a
given drive type behave differently than what is described, customers should reference the drive vendor
specifications for the specific drive model to determine what the expected drive activity LED operation
should be.

5.4 Storage Backplane Options

The 1U system has support for two backplane options.

For 2.5” drives:

 8 x 2.5” drive (SAS/SATA) backplane

For 3.5” drives:

 4 x 3.5 SAS/SATA backplane

All available backplane options mount directly to the back of the drive bay as shown in the following
illustration.

39

Intel® Server System R1000SPO Product Family TPS

Figure 33. Backplane Installation

NOTE: For details on the istallation/removal of the Backplane, please refer to the Intel® Server System

R1000SPO Product Family System Integration and Service Guide.

All available SAS/SATA compatible backplanes include the following common features:

 12 Gb SAS and 6Gb SAS/SATA
 29-pin SFF-8680 12 Gb rated drive interface connectors, providing both power and I/O signals to

attached devices

 Hot swap support for SAS/SATA devices
 I2C interface from a 3-pin connector for device status communication to the BMC over slave SMBus
 LEDs to indicate drive activity and status for each attached device

5.4.1 I2C Functionality

The microcontroller has a master/slave I2C connection to the server board BMC. The microcontroller is not
an IPMB compliant device. The BMC will generate SEL events by monitoring registers on the HSBP
microcontroller for DRIVE PRESENCE, FAULT, and RAID REBUILD in progress.

5.4.2 4 x 3.5” Drive Hot-Swap Backplane Overview

Intel Spare Product Code: FXX35HSCAR

The 3.5” drive system SKUs within the product family will ship with a 4x drive backplane capable of
supporting 12 Gb/sec SAS and 6 Gb/sec SAS / SATA drives. Both hard disks and Solid State Drives (SSDs)
can be supported within a common backplane. Each backplane can support either SATA or SAS devices.
However, mixing of SATA and SAS devices within a common hot swap backplane is not supported.
Supported devices are dependent on the type of host bus controller driving the backplane, SATA only or
SAS.

40

Intel® Server System R1000SPO Product Family TPS

Label

Description

A

HDD_0

B

HDD_1

C

HDD_2

D

HDD_3

Label

Description

A

Power connector

B

SAS/SATA Ports 0-3 Mini-SAS HD cable connector

C

I2C connector

The front side of the backplane includes 4 x 29-pin drive interface connectors, each capable of supporting
12 Gb SAS or 6 Gb SAS/SATA. The connectors are numbered 0 thru 3. Signals for all four drive connectors
are routed to a single multi-port mini-SAS HD connector on the back side of the backplane.

Figure 34. 4 x 3.5” Drive Hot-Swap Backplane – front view

On the backside of the backplane are several connectors. The following illustration identifies each.

Figure 35. 4 x 3.5” Drive Hot-Swap Backplane – rear view

A – Power Connector – The backplane includes a 2x2 connector supplying power to the backplane. Power is

routed to the backplane via a power cable harness from the Power Supply Modules.
B – Multi-port Mini-SAS Cable Connector – The backplane includes one multi-port mini-SAS cable

connector providing data signals for four SAS/SATA drives on the backplane. A cable can be routed from
matching connectors on the server board or add-in SAS/SATA RAID cards.

C – I2C Cable Connector – The backplane includes a 1x3 cable connector used as a management interface
to the server board.

41

Intel® Server System R1000SPO Product Family TPS

Label

Description

A

HDD_0

B

HDD_1

C

HDD_2

D

HDD_3

E

HDD_4

F

HDD_5

G

HDD_6

H

HDD_7

Label

Description

A

Power connector

B

I2C-In cable connector – From Server board

C

SAS/SATA Ports 4-7 Mini-SAS HD cable connector

D

SAS/SATA Ports 0-3 Mini-SAS HD cable connector

5.4.3 8 x 2.5” Drive SAS Backplane

Intel Spare Product Code: F1U8X25S3HSBP

The 2.5” drive system SKU will ship with a 8x drive backplane capable of supporting 12 Gb/sec SAS and 6

Gb/sec SAS / SATA drives. Both hard disks and Solid State Devices (SSDs) can be supported within a
common backplane. Each backplane can support either SATA or SAS devices. However, mixing of SATA and
SAS devices within a common hot swap backplane is not supported. Supported devices are dependent on
the type of host bus controller driving the backplane, SATA only or SAS.

The front side of the backplane includes 8 x 29-pin drive interface connectors, each capable of supporting
12 Gb SAS or 6 Gb SAS/SATA. The connectors are numbered 0 thru 7. Data signals for each set of four drive
connectors (0-3 and 4-7), are routed to separate multi-port mini-SAS HD connectors on the back side of the
backplane.

Figure 36. 8 x 2.5” Drive SAS/SATA Backplane – front view

On the backside of each backplane are several connectors. The following illustration identifies each.

Figure 37. 8 x 2.5” Drive SAS/SATA Backplane – rear view

42

Intel® Server System R1000SPO Product Family TPS

PIN

SIGNAL

SIGNAL

PIN

1

GND

P12V

3

2

GND

P12V

4

A – Power Connector – The backplane includes a 2x2 connector supplying power to the backplane. Power is
routed to the backplane via a power cable harness from the Power Supply Modules.

B – I2C Cable Connectors – The backplane includes a 1x3 cable connector used as a management interface
to the server board.

C and D – Multi-port Mini-SAS Cable Connectors – The backplane includes two multi-port mini-SAS cable
connectors, each providing data signals for four SAS/SATA drives on the backplane. Cables can be routed
from matching connectors on the server board or add-in SAS/SATA RAID cards.

5.5 M.2 SSD Support

The system provides support for a SATA M.2 SSD storage device. A 22x42mm 75-pin connector labeled “M.2
SATA” at the left of the battery section of the server board is used to connect this small flash storage device.
In order to use an M.2 device, a SATA cable needs to be connected between any of the SATA connectors
(SATA-0 to SATA-7, recommend SATA-7 for better cable routing) and the SATA connector (black) next to the
jumpers. See illustration below. This cable needs to be purchased separately.

Figure 38. Installing M.2 Device

Visit https://serverconfigurator.intel.com for a list of supported devices.

43

Intel® Server System R1000SPO Product Family TPS

Pin

IO

Signal Name

MH1

PWR

GND

1

GND

GND

2 I SATA_TX_P

3 I SATA_TX_N

4

GND

GND

5 O SATA_RX_N

6 O SATA_RX_P

7

PWR

GND

MH2

PWR

P5V (For Apacer* SATADOM)

GND (For SATA)

5.6 SATA DOM Support

The SATA-4 connector on the server board is designed to be compatible with SATADOM devices.

Table 31. SATA/SATADOM capable Connector Pin-out

Visit https://serverconfigurator.intel.com for a list of supported SATA DOM devices.

44

Intel® Server System R1000SPO Product Family TPS

6. Storage Controller Options Overview

The server platform supports different embedded and add-in SAS/SATA controller options to provide a
larger number of possible storage configurations. This section will provide an overview of the different
options available.

6.1 Embedded SATA/SATA RAID Support

The Intel® Server System R1000SPO product family provides an embedded SATA host controller that
supports independent DMA operation on up to eight ports and supports data transfer rates of up to 6.0 Gb/s
(600 MB/s). The SATA controller contains two modes of operation – a legacy mode using I/O space, and an
AHCI mode using memory space. Software that uses legacy mode will not have AHCI capabilities. The Intel®
C230 series chipset supports the Serial ATA Specification, Revision 3.0. The Intel® C230 series also supports
several optional sections of the Serial ATA II: Extensions to Serial ATA 1.0 Specification, Revision 1.0 (AHCI
support is required for some elements).

The server board also offers hardware support for Advanced Host Controller Interface (AHCI), a standardized
programming interface for SATA host controllers. Platforms supporting AHCI may take advantage of
performance features such as no master/slave designation for SATA devices—each device is treated as a
master—and hardware assisted native command queuing. AHCI also provides usability enhancements such
as Hot-Plug. AHCI requires appropriate software support (for example, an AHCI driver) and for some features,
hardware support in the SATA device or additional platform hardware.

The Intel® Server System R1000SPO product family includes support for two embedded software RAID
options:

 Intel
 Intel

®

Embedded Server RAID Technology 2 (ESRT2) based on LSI* MegaRAID SW RAID technology

®

Rapid Storage Technology (RSTe)

Using the <F2> BIOS Setup Utility, accessed during system POST, options are available to enable/disable SW
RAID, and select which embedded software RAID option to use.

6.1.1.1 Intel

®

Rapid Storage Technology Enterprise

The server board provides support for Intel® Rapid Storage Technology enterprise, providing both AHCI (see
above for details on AHCI) and integrated RAID functionality. The industry-leading RAID capability provides
high-performance RAID functionality on up to 8 SATA ports of the server board on the following
configurations:

 RAID Level 0 – Non-redundant striping of drive volumes with performance scaling of up to 6 drives,

enabling higher throughput for data intensive applications such as video editing.

 Data security is offered through RAID Level 1, which performs mirroring.
 RAID Level 10 provides high levels of storage performance with data protection, combining the fault-

tolerance of RAID Level 1 with the performance of RAID Level 0. By striping RAID Level 1 segments,
high I/O rates can be achieved on systems that require both performance and fault-tolerance. RAID
Level 10 requires 4 hard drives, and provides the capacity of two drives.

 RAID Level 5 provides highly efficient storage while maintaining fault-tolerance on 3 or more drives.

By striping parity, and rotating it across all disks, fault tolerance of any single drive is achieved while
only consuming 1 drive worth of capacity. That is, a 3 drive RAID 5 has the capacity of 2 drives, or a 4
drive RAID 5 has the capacity of 3 drives. RAID 5 has high read transaction rates, with a medium write

45

Intel® Server System R1000SPO Product Family TPS

rate. RAID 5 is well suited for applications that require high amounts of storage while maintaining
fault tolerance.

RSTe RAID support is provided to allow multiple RAID levels to be combined on a single set of hard drives,
such as RAID 0 and RAID 1 on two disks. Other RAID features include hot-spare support, and SMART alerting.
Software components include an Option ROM for pre-boot configuration and boot functionality, a Microsoft
Windows* compatible driver, and a user interface for configuration and management of the RAID capability
of the Intel® C230 series chipset.

6.1.1.2 Intel

®

Embedded Server RAID Technology 2 (ESRT2)

Features of the embedded software RAID option Intel® Embedded Server RAID Technology 2 (ESRT2) include
the following:

 Based on LSI* MegaRAID* Software Stack
 Software RAID with system providing memory and CPU utilization
 Supported RAID Levels – 0, 1, 10
 RAID 5 support is provided when an upgrade key RKSATA8R5 is installed. RAID 5 under legacy BIOS

mode is not supported.

 Open Source Compliance = Binary Driver (includes Partial Source files) or Open Source using MDRAID

layer in Linux*

 OS Support = Microsoft Windows 2012*, Microsoft Windows 2008*, RHEL*, SLES, and other Linux*

variants using partial source builds

 Utilities = Microsoft Windows* GUI and CLI, Linux* GUI and CLI, DOS CLI, and EFI CLI

Figure 39. Intel® Raid Upgrade Key

46

Intel® Server System R1000SPO Product Family TPS

6.2 Intel

®

Integrated RAID Module Support

The Intel® Server System R1000SPO product family provides a high density 80-pin connector labeled
SAS_MOD for the installation of an optional Intel® SAS/ROC Mezzanine Integrated RAID Module.

Features of this option include:

 SKU options to support full or entry level hardware RAID
 6Gb SAS/SATA ROC/IOC (LSI* 2208 and 2308)
 12Gb SAS ROC/IOC (LSI* 3008 and 3108)
 4 or 8 ports and SAS/SATA or SATA
 SKU options to support 512MB or 1GB embedded memory
 Intel

®

designed flash plus optional support for Intel® RAID Maintenance Free Backup Units

(AXXRMFBU5)

NOTE: RAID configurations cannot span across the embedded and add-in AHCI SATA controllers.

For supported SAS modules, refer to the document Intel® Server Boards S1200SP Configuration Guide and
Spares/Accessories List

6.2.1 Intel

®

RAID Maintenance Free Backup Unit (RMFBU) Support

The Intel® Server System R1000SPO product family has support for an Intel® RAID Maintenance Free Backup
Unit (RMFBU).

47

Figure 40. Intel® RAID Maintenance Free Backup Unit

Intel® Server System R1000SPO Product Family TPS

Label

Description

A

System ID Button w/Integrated LED

B

NMI Button (recessed, tool required for use)

C

NIC 1 & 2 Activity LEDs

D

System Cold Reset Button (recessed, tool required for use)

E

System Status LED

F

Power Button w/Integrated LED

G

Drive Activity LED

USB 2.0/3.0**

7. Front Control Panel and I/O Panel Overview

All system configurations include a Control Panel and I/O Panel on the front of the system.

7.1 I/O Panel Features

Figure 41. Front I/O Panel Features

USB 2.0/3.0 Ports –The front I/O panel includes two USB 2.0/3.0 ports. The USB ports are cabled to a Blue

2x5 connector on the server board labeled “Internal_USB3.0”.

** NOTE: Due to signal strength limits associated with USB 3.0 ports cabled to a front panel, some marginally
compliant USB 3.0 devices may not be supported from these ports. In addition, server systems based on the
Intel® Server Board S1200SP cannot be USB 3.0 certified with USB 3.0 ports cabled to a front panel.

7.2 Control Panel Features

Figure 42. Front Panel LEDs and Buttons

The system includes a front panel that provides button system controls and LED indicators for several
system features. This section will provide a description for each front control panel feature.

Table 32. Front Control Panel Buttons And Indicators

48

Intel® Server System R1000SPO Product Family TPS

LED
color
state

LED

Activity

State

BIOS Status description

Off

Off

System is not operating.

System AC power is off.

Green

Solid

On

System is operating normally.

System is running (in S0 State) and no error
conditions affecting the Status LED have been
observed.

Green

Blink

System is operating in a degraded state although
still functional, or system is operating in a
redundant state but with an impending failure
warning.

1. Unable to use all of the installed memory (one or
more DIMMs failed/disabled but functional memory
remains available).

2. Correctable memory error threshold has been
reached for a failing DDR4 DIMM in memory Sparing
Mode, causing Loss of Redundancy.

3. Uncorrectable memory error has occurred in
memory Mirroring Mode, causing Loss of
Redundancy.

4. Correctable memory error threshold has been
reached for a failing DDR4 DIMM when the system is
operating in fully redundant RAS Mirroring Mode.

Amber

Blink

System is operating in a degraded state with an
impending failure warning, although still
functioning.

Correctable memory error threshold has been
reached for a failing DDR4 DIMM when the system is
operating in a non-redundant mode.

Amber

Solid

On

Critical/Fatal – system is halted.

1. Fatal Error in processor initialization.
o Processor family not identical
o Processor model not identical
o Processor core/thread counts not identical
o Processor cache size not identical
o Unable to synchronize processor frequency
o Unable to synchronize QPI Link frequency

2. Uncorrectable memory error in a non-redundant
mode.

7.2.1 System Status LED

NOTE: The Status LED is controlled by the BMC but the BIOS informs the BMC of the state to which the

Status LED should be set.

The System Status LED has specific states that are described in the following table but the actual state of the
Status LED is indicative of one or more of the conditions listed. When multiple conditions are indicated to
the BMC, the BMC reflects in the Status LED the highest severity of the conditions which have been reported
to it. There are also conditions for which the BIOS is not responsible which may set the Status LED to the
same or higher level of severity.

Table 33. System Status LED Indicator States

The BMC-detected states are included in the LED states. For fault states that are monitored by the BMC
sensors, the contribution to the LED state follows the associated sensor state, with priority given to the most
critical asserted state.

When the server is powered down (transitions to the DC-off state or S5), the BMC is still on standby power
and retains the sensor and front panel status LED state established before the power-down event.

49

Intel® Server System R1000SPO Product Family TPS

State

Chassis ID

(Blue)

Status LED

Comment

BMC/Video

memory test

failed

Solid

Blue

Solid

Amber

Non-recoverable condition. Contact your
Intel representative for information on
replacing this motherboard.

Both

Universal

Bootloader

(u-Boot)

images bad

Blink

Blue 6Hz

Solid

Amber

Non-recoverable condition. Contact your
Intel representative for information on
replacing this motherboard

BMC in u-

Boot

Blink

Blue 3Hz

Blink

Green

1Hz

Blinking green indicates degraded state
(no manageability), blinking blue indicates
u-Boot is running but has not transferred
control to BMC Linux*. Server will be in this
state 6-8 seconds after BMC reset while it
pulls the Linux* image into flash

BMC Booting

Linux*

Solid

Blue

Solid

Green

Solid green with solid blue after an AC
cycle/BMC reset, indicates that the control
has been passed from u-Boot to BMC
Linux* itself. It will be in this state for ~10­~20 seconds.

Normal

operation

Off

Solid

Green

Indicates BMC Linux* has booted and
manageability functionality is up and
running. Fault/Status LEDs operate as per
usual.

When AC power is first applied to the system, the status LED turns solid amber and then immediately
changes to green blinking to indicate that the BMC is booting. Upon completing the BMC boot, the status
LED will be solid green if there are no errors/abnormal conditions in the system. Please refer to the System
Status LED states information in Table 33 for more details.

Table 34. Front panel LED indication of BMC state

50

Intel® Server System R1000SPO Product Family TPS

8. PCIe* Riser Card Support

The system includes a riser card slot on the server board. This section will provide an overview and
description of the server board features and architecture supporting it.

NOTE: The riser card slot is specifically designed to support riser cards only. Attempting to install a PCIe*
add-in card directly into a riser card slot on the server board may damage the server board, the add-in card,
or both.

The system supports a single slot PCIe* x16 (16 lanes, x16 slot) riser card. The riser card is mounted to a
bracket assembly which is inserted into the riser card slot on the server board.

Figure 43. Add-in Card Support

The riser card assembly has support for a single full height, half-length PCIe* add-in card.

NOTE: Add-in cards that exceed the PCI specification for ½ length PCI add-in cards (167.65mm or 6.6in) may
interfere with other installed devices on the server board.

51

Figure 44. Riser Card Assembly

Intel® Server System R1000SPO Product Family TPS

Intel Product Code

Description

Intel® I/O Module AXX10GBTWLIOM3

Dual RJ-45 port 10G BASE-T I/O expansion module, based on Intel® Ethernet
Controller X540

Intel® I/O Module AXX10GBNIAIOM

Dual SFP+ port 10GbE IO module based on Intel® 82599 10 Gigabit Ethernet
Controller

Intel® I/O Module AXX4P1GBPWLIOM

Quad port 1GbE I/O expansion module based on Intel® Ethernet Controller I350

9. Intel® I/O Module Support

To broaden the standard on-board feature set, the server board provides support for one of several
available Intel® I/O Module options. The I/O module attaches to a high density 80-pin connector on the
server board (labeled “IO_Module”) and is supported by x8 PCIe Gen3 signals from the IIO module of the
CPU 1 processor.

Supported I/O modules include:

Figure 45. Intel® I/O Module Placement

Table 35. Supported Intel® I/O Modules

52

Intel® Server System R1000SPO Product Family TPS

Intel Product

Code

Description

Kit Contents

Benefits

AXXRMM4LITE

Intel® Remote Management Module 4 Lite

RMM4 Lite Activation Key

Enables KVM & media redirection

Feature

Basic

Advanced

w/RMM4

Lite Key

IPMI 2.0 Feature Support

X

X

In-circuit BMC Firmware Update

X

X

FRB 2 X X

Chassis Intrusion Detection

X

X

Fan Redundancy Monitoring

X X Hot-Swap Fan Support

X X Acoustic Management

X X Diagnostic Beep Code Support

X X Power State Retention

X X ARP/DHCP Support

X X PECI Thermal Management Support

X X E-mail Alerting

X X Embedded Web Server

X X SSH Support

X X Integrated KVM

X Integrated Remote Media Redirection

X

Lightweight Directory Access Protocol (LDAP)

X X Intel® Intelligent Power Node Manager Support

X X SMASH CLP

X

X

10. Basic and Advanced Server Management Features

The integrated BMC has support for basic and advanced server management features. Basic management
features are available by default. Advanced management features are enabled with the addition of an
optionally installed Remote Management Module 4 Lite (RMM4 Lite) key.

Table 36. Intel® Remote Management Module 4 (RMM4) Options

When the BMC FW initializes, it attempts to access the Intel® RMM4 lite. If the attempt to access Intel® RMM4
lite is successful, then the BMC activates the Advanced features.

The following table identifies both Basic and Advanced server management features.

Table 37. Basic and Advanced Server Management Features Overview

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Intel® Server System R1000SPO Product Family TPS

10.1 IPMI 2.0 Features

 Baseboard management controller (BMC)
 IPMI Watchdog timer
 Messaging support, including command bridging and user/session support
 Chassis device functionality, including power/reset control and BIOS boot flags support
 Event receiver device: The BMC receives and processes events from other platform subsystems.
 Field Replaceable Unit (FRU) inventory device functionality: The BMC supports access to system FRU

devices using IPMI FRU commands.

 System Event Log (SEL) device functionality: The BMC supports and provides access to a SEL.
 Sensor Data Record (SDR) repository device functionality: The BMC supports storage and access of

system SDRs.

 Sensor device and sensor scanning/monitoring: The BMC provides IPMI management of sensors. It

polls sensors to monitor and report system health.

 IPMI interfaces

- Host interfaces including system management software (SMS) with receive message queue

support, and server management mode (SMM)

- IPMB interface

- LAN interface that supports the IPMI-over-LAN protocol Remote Management Control Protocol

(RMCP, RMCP+)

 Serial-over-LAN (SOL)
 ACPI state synchronization: The BMC tracks ACPI state changes that are provided by the BIOS.
 BMC self-test: The BMC performs initialization and run-time self-tests and makes results available to

external entities.

Please refer to the Intelligent Platform Management Interface Specification Second Generation v2.0 for more
details.

10.2 Non-IPMI Features

The BMC supports the following non-IPMI features. This list does not preclude support for future
enhancements or additions.

 In-circuit BMC firmware update
 Fault resilient booting (FRB): FRB2 is supported by the watchdog timer functionality.
 Chassis intrusion detection
 Basic fan speed control using Control version 2 SDRs
 Fan redundancy monitoring and support
 Power supply redundancy monitoring and support
 Hot-swap fan support
 Acoustic management: Support for multiple fan profiles
 Signal testing support: The BMC provides test commands for setting and getting platform signal states.
 The BMC generates diagnostic beep codes for fault conditions.
 System GUID storage and retrieval

54

Intel® Server System R1000SPO Product Family TPS

 Front panel management: The BMC controls the system status LED and chassis ID LED. It supports

secure lockout of certain front panel functionality and monitors button presses. The chassis ID LED is
turned on using a front panel button or a command.

 Power state retention
 Power fault analysis
 Intel
 Power unit management: Support for power unit sensor. The BMC handles power-good dropout

®

Light-Guided Diagnostics

conditions.

 DIMM temperature monitoring: New sensors and improved acoustic management using closed-loop

fan control algorithm taking into account DIMM temperature readings.

 Address Resolution Protocol (ARP): The BMC sends and responds to ARPs (supported on embedded

NICs).

 Dynamic Host Configuration Protocol (DHCP): The BMC performs DHCP (supported on embedded

NICs).

 Platform environment control interface (PECI) thermal management support
 E-mail alerting
 Embedded web server:
 Integrated KVM
 Integrated Remote Media Redirection

 Lightweight Directory Access Protocol (LDAP) support
 Intel

®

Intelligent Power Node Manager support

On the server board the Intel® RMM4 Lite key is installed at the following location.

Figure 46. Intel® RMM4 Lite Activation Key Installation

10.2.1 Dedicated Management Port

The server board includes a dedicated 1GbE RJ45 Management Port. The management port is active with or
without the RMM4 Lite key installed.

10.2.2 Embedded Web Server

BMC Base manageability provides an embedded web server and an OEM-customizable web GUI which
exposes the manageability features of the BMC base feature set. It is supported over all on-board NICs that

55

Intel® Server System R1000SPO Product Family TPS

have management connectivity to the BMC as well as an optional dedicated add-in management NIC. At least
two concurrent web sessions from up to two different users is supported. The embedded web user interface
shall support the following client web browsers:

 Microsoft Internet Explorer 9.0*
 Microsoft Internet Explorer 10.0*
 Mozilla Firefox 24*
 Mozilla Firefox 25*

The embedded web user interface supports strong security (authentication, encryption, and firewall support)
since it enables remote server configuration and control. The user interface presented by the embedded web
user interface, shall authenticate the user before allowing a web session to be initiated. Encryption using
128-bit SSL is supported. User authentication is based on user id and password.

The GUI presented by the embedded web server authenticates the user before allowing a web session to be
initiated. It presents all functions to all users but grays-out those functions that the user does not have
privilege to execute. For example, if a user does not have privilege to power control, then the item shall be
displayed in grey-out font in that user’s UI display. The web GUI also provides a launch point for some of the
advanced features, such as KVM and media redirection. These features are grayed out in the GUI unless the
system has been updated to support these advanced features. The embedded web server only displays US
English or Chinese language output.

Additional features supported by the web GUI includes:

 Presents all the Basic features to the users
 Power on/off/reset the server and view current power state
 Displays BIOS, BMC, ME and SDR version information
 Display overall system health.
 Configuration of various IPMI over LAN parameters for both IPV4 and IPV6
 Configuration of alerting (SNMP and SMTP)
 Display system asset information for the product, board, and chassis.
 Display of BMC-owned sensors (name, status, current reading, enabled thresholds), including color-

code status of sensors.

 Provides ability to filter sensors based on sensor type (Voltage, Temperature, Fan and Power supply

related)

 Automatic refresh of sensor data with a configurable refresh rate
 On-line help
 Display/clear SEL (display is in easily understandable human readable format)
 Supports major industry-standard browsers (Microsoft Internet Explorer* and Mozilla Firefox*)
 The GUI session automatically times-out after a user-configurable inactivity period. By default, this

inactivity period is 30 minutes.

 Embedded Platform Debug feature - Allow the user to initiate a “debug dump” to a file that can be

sent to Intel for debug purposes.

 Virtual Front Panel. The Virtual Front Panel provides the same functionality as the local front panel.

The displayed LEDs match the current state of the local panel LEDs. The displayed buttons (for
example, power button) can be used in the same manner as the local buttons.

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Intel® Server System R1000SPO Product Family TPS

 Display of ME sensor data. Only sensors that have associated SDRs loaded will be displayed.
 Ability to save the SEL to a file
 Ability to force HTTPS connectivity for greater security. This is provided through a configuration

option in the UI.

 Display of processor and memory information as is available over IPMI over LAN.
 Ability to get and set Node Manager (NM) power policies
 Display of power consumed by the server
 Ability to view and configure VLAN settings
 Warn user the reconfiguration of IP address will cause disconnect.
 Capability to block logins for a period of time after several consecutive failed login attempts. The

lock-out period and the number of failed logins that initiates the lock-out period are configurable by
the user.

 Server Power Control – Ability to force into Setup on a reset
 System POST results – The web server provides the system’s Power-On Self-Test (POST) sequence

for the previous two boot cycles, including timestamps. The timestamps may be viewed in relative to
the start of POST or the previous POST code.

 Customizable ports – The web server provides the ability to customize the port numbers used for

SMASH, http, https, KVM, secure KVM, remote media, and secure remote media.

For additional information, reference the Intel® Remote Management Module 4 and Integrated BMC Web
Console Users Guide.

10.2.3 Advanced Management Feature Support (RMM4 Lite)

The integrated baseboard management controller has support for advanced management features which are
enabled when an optional Intel® Remote Management Module 4 Lite (RMM4 Lite) is installed. The Intel RMM4
add-on offers convenient, remote KVM access and control through LAN and internet. It captures, digitizes,
and compresses video and transmits it with keyboard and mouse signals to and from a remote computer.
Remote access and control software runs in the integrated baseboard management controller, utilizing
expanded capabilities enabled by the Intel RMM4 hardware.

Key Features of the RMM4 add-on are:

 KVM redirection from either the dedicated management NIC or the server board NICs used for

management traffic; up to two KVM sessions

 Media Redirection – The media redirection feature is intended to allow system administrators or

users to mount a remote IDE or USB CDROM, floppy drive, or a USB flash disk as a remote device to
the server. Once mounted, the remote device appears just like a local device to the server allowing
system administrators or users to install software (including operating systems), copy files, update
BIOS, or boot the server from this device.

 KVM – Automatically senses video resolution for best possible screen capture, high performance

mouse tracking and synchronization. It allows remote viewing and configuration in pre-boot POST
and BIOS setup.

10.2.3.1 Keyboard, Video, Mouse (KVM) Redirection

The BMC firmware supports keyboard, video, and mouse redirection (KVM) over LAN. This feature is available
remotely from the embedded web server as a Java applet. This feature is only enabled when the Intel® RMM4

57

Intel® Server System R1000SPO Product Family TPS

lite is present. The client system must have a Java Runtime Environment (JRE) version 6.0 or later to run the
KVM or media redirection applets.

The BMC supports an embedded KVM application (Remote Console) that can be launched from the
embedded web server from a remote console. USB1.1 or USB 2.0 based mouse and keyboard redirection are
supported. It is also possible to use the KVM-redirection (KVM-r) session concurrently with media-redirection
(media-r). This feature allows a user to interactively use the keyboard, video, and mouse (KVM) functions of
the remote server as if the user were physically at the managed server. KVM redirection console supports the
following keyboard layouts: English, Dutch, French, German, Italian, Russian, and Spanish.

KVM redirection includes a “soft keyboard” function. The “soft keyboard” is used to simulate an entire
keyboard that is connected to the remote system. The “soft keyboard” functionality supports the following
layouts: English, Dutch, French, German, Italian, Russian, and Spanish.

The KVM-redirection feature automatically senses video resolution for best possible screen capture and
provides high-performance mouse tracking and synchronization. It allows remote viewing and configuration
in pre-boot POST and BIOS setup, once BIOS has initialized video.

Other attributes of this feature include:

 Encryption of the redirected screen, keyboard, and mouse
 Compression of the redirected screen.
 Ability to select a mouse configuration based on the OS type.
 Supports user definable keyboard macros.

KVM redirection feature supports the following resolutions and refresh rates:

 640x480 at 60Hz, 72Hz, 75Hz, 85Hz, 100Hz
 800x600 at 60Hz, 72Hz, 75Hz, 85Hz
 1024x768 at 60Hx, 72Hz, 75Hz, 85Hz
 1280x960 at 60Hz
 1280x1024 at 60Hz
 1600x1200 at 60Hz
 1920x1080 (1080p),
 1920x1200 (WUXGA)
 1650x1080 (WSXGA+)

10.2.3.2 Remote Console

The Remote Console is the redirected screen, keyboard and mouse of the remote host system. To use the
Remote Console window of your managed host system, the browser must include a Java* Runtime
Environment plug-in. If the browser has no Java support, such as with a small handheld device, the user can
maintain the remote host system using the administration forms displayed by the browser.

The Remote Console window is a Java Applet that establishes TCP connections to the BMC. The protocol
that is run over these connections is a unique KVM protocol and not HTTP or HTTPS. This protocol uses
ports #7578 for KVM, #5120 for CDROM media redirection, and #5123 for Floppy/USB media redirection.
When encryption is enabled, the protocol uses ports #7582 for KVM, #5124 for CDROM media redirection,
and #5127 for Floppy/USB media redirection. The local network environment must permit these

58

Intel® Server System R1000SPO Product Family TPS

connections to be made, that is, the firewall and, in case of a private internal network, the NAT (Network
Address Translation) settings have to be configured accordingly.

10.2.3.3 Performance

The remote display accurately represents the local display. The feature adapts to changes to the video
resolution of the local display and continues to work smoothly when the system transitions from graphics to
text or vice-versa. The responsiveness may be slightly delayed depending on the bandwidth and latency of
the network.

Enabling KVM and/or media encryption will degrade performance. Enabling video compression provides the
fastest response while disabling compression provides better video quality.

For the best possible KVM performance, a 2Mb/sec link or higher is recommended.

The redirection of KVM over IP is performed in parallel with the local KVM without affecting the local KVM
operation.

10.2.3.4 Security

The KVM redirection feature supports multiple encryption algorithms, including RC4 and AES. The actual
algorithm that is used is negotiated with the client based on the client’s capabilities.

10.2.3.5 Availability

The remote KVM session is available even when the server is powered-off (in stand-by mode). No re-start of
the remote KVM session shall be required during a server reset or power on/off. A BMC reset (for example,
due to a BMC Watchdog initiated reset or BMC reset after BMC FW update) will require the session to be re­established.

KVM sessions persist across system reset, but not across an AC power loss.

10.2.3.6 Usage

As the server is powered up, the remote KVM session displays the complete BIOS boot process. The user is
able interact with BIOS setup, change and save settings as well as enter and interact with option ROM
configuration screens.

At least two concurrent remote KVM sessions are supported. It is possible for at least two different users to
connect to same server and start remote KVM sessions.

10.2.3.7 Force-enter BIOS Setup

KVM redirection can present an option to force-enter BIOS Setup. This enables the system to enter F2 setup
while booting which is often missed by the time the remote console redirects the video.

10.2.3.8 Media Redirection

The embedded web server provides a Java applet to enable remote media redirection. This may be used in
conjunction with the remote KVM feature, or as a standalone applet.

The media redirection feature is intended to allow system administrators or users to mount a remote IDE or
USB CD-ROM, floppy drive, or a USB flash disk as a remote device to the server. Once mounted, the remote
device appears just like a local device to the server, allowing system administrators or users to install
software (including operating systems), copy files, update BIOS, and so on, or boot the server from this
device.

59

Intel® Server System R1000SPO Product Family TPS

The following capabilities are supported:

 The operation of remotely mounted devices is independent of the local devices on the server. Both

remote and local devices are useable in parallel.

 Either IDE (CD-ROM, floppy) or USB devices can be mounted as a remote device to the server.
 It is possible to boot all supported operating systems from the remotely mounted device and to boot

from disk IMAGE (*.IMG) and CD-ROM or DVD-ROM ISO files. See the Tested/supported Operating
System List (Table 3) for more information.

 Media redirection supports redirection for both a virtual CD device and a virtual Floppy/USB device

concurrently. The CD device may be either a local CD drive or else an ISO image file; the Floppy/USB
device may be a local Floppy drive, a local USB device, or a disk image file.

 The media redirection feature supports multiple encryption algorithms, including RC4 and AES. The

actual algorithm that is used is negotiated with the client based on the client’s capabilities.

 A remote media session is maintained even when the server is powered-off (in standby mode). No

restart of the remote media session is required during a server reset or power on/off. An BMC reset
(for example, due to an BMC reset after BMC FW update) will require the session to be re-established

 The mounted device is visible to (and useable by) managed system’s OS and BIOS in both pre-boot

and post-boot states.

 The mounted device shows up in the BIOS boot order and it is possible to change the BIOS boot

order to boot from this remote device.

 It is possible to install an operating system on a bare metal server (no OS present) using the remotely

mounted device. This may also require the use of KVM-r to configure the OS during install.

USB storage devices will appear as floppy disks over media redirection. This allows for the installation of
device drivers during OS installation.

If either a virtual IDE or virtual floppy device is remotely attached during system boot, both the virtual IDE
and virtual floppy are presented as bootable devices. It is not possible to present only a single-mounted
device type to the system BIOS.

Availability

The default inactivity timeout is 30 minutes and is not user-configurable. Media redirection sessions persist
across system reset but not across an AC power loss or BMC reset.

Network Port Usage

The KVM and media redirection features use the following ports:

 5120 – CD Redirection
 5123 – FD Redirection
 5124 – CD Redirection (Secure)
 5127 – FD Redirection (Secure)
 7578 – Video Redirection
 7582 – Video Redirection (Secure)

For additional information, reference the Intel® Remote Management Module 4 and Integrated BMC Web
Console Users Guide.

60

Intel® Server System R1000SPO Product Family TPS

Appendix A: Integration and Usage Tips

This section provides a list of useful information that is unique to the Intel® Server System R1000SPO
Product Family and should be kept in mind while configuring your server system.

 When adding or removing components or peripherals from the server board, you must remove the AC

power cord. With AC power plugged into the server board, 5-V standby is still present even though the
server board is powered off.

 This server board supports the Intel

Design Power (TDP) of up to and including 80 Watts. Previous generation Intel® Xeon® processors are
not supported.

 On the back edge of the server board are EIGHT (2 rows of 4) diagnostic LEDs that display a sequence

of POST codes during the boot process. If the server board hangs during POST, the LEDs display the
last POST event run before the hang.

 Only ECC Unbuffered DDR4 DIMMs (UDIMMs) are supported on this Product Family.
 Clear CMOS with the AC power cord plugged in. Removing AC power before performing the CMOS

Clear operation causes the system to automatically power up and immediately power down after the
CMOS Clear procedure is followed and AC power is re-applied. If this happens, remove the AC power
cord, wait 30 seconds, and then re-connect the AC power cord. Power up the system and proceed to
the <F2> BIOS Setup Utility to reset the desired settings.

®

Xeon® Processor E3-1200 V5 product family with a Thermal

 Normal BMC functionality is disabled with the Force BMC Update jumper set to the “enabled” position

(pins 2-3). You should never run the server with the Force BMC Update jumper set in this position and
should only use the jumper in this position when the standard firmware update process fails. This
jumper must remain in the default (disabled) position (pins 1-2) when the server is running normally.

 Make sure the recovery jumper is placed on pins 1-2, before a normal BIOS update procedure.

61

Intel® Server System R1000SPO Product Family TPS

Appendix B: POST Code Diagnostic LED Decoder

As an aid to assist in trouble shooting a system hang that occurs during a system’s Power-On Self-est (POST)
process, the server board includes a bank of eight (2 rows of 4) POST Code Diagnostic LEDs on the back
edge of the server board.

During the system boot process, Memory Reference Code (MRC) and System BIOS execute a number of
memory initialization and platform configuration processes, each of which is assigned a specific hex POST
code number. As each routine is started, the given POST code number is displayed to the POST Code
Diagnostic LEDs on the back edge of the server board.

During a POST system hang, the displayed post code can be used to identify the last POST routine that was
run prior to the error occurring, helping to isolate the possible cause of the hang condition.

Each POST code is represented by eight LEDs; four Green and four Amber. The POST codes are divided into
two groups, an upper nibble and a lower nibble. The upper nibble bits are represented by Amber Diagnostic
LEDs #4, #5, #6, #7. The lower nibble bits are represented by Green Diagnostics LEDs #0, #1, #2 and #3. If
the bit is set in the upper and lower nibbles, the corresponding LED is lit. If the bit is clear, the corresponding
LED is off.

Figure 47. POST Diagnostic LED Location

In the following example, the BIOS sends a value of ACh to the diagnostic LED decoder. The LEDs are
decoded as follows:

62

Intel® Server System R1000SPO Product Family TPS

LED #3

LED #2

LED #1

LED #0

8h (MSB)

4h

2h

1h (LSB)

LED
Status

ON

off

ON

off

Upper Nibble: Ah

ON

ON

off

off

Lower Nibble: Ch

8h (MSB)

4h

2h

1h (LSB)

POST CODE: ACh
LED #3

LED #2

LED #1

LED #0

Diagnostic LED Decoder

LED #

LED 3

LED 2

LED 1

LED 0

Description

Checkpoint

Upper Nibble

8h (MSB)

4h

2h

1h (LSB)

Lower Nibble

8h (MSB)

4h

2h

1h (LSB)

SEC Phase

01h

Upper Nibble

off

off

off

off

First POST code after CPU reset

Lower Nibble

off

off

off

ON

02h

Upper Nibble

off

off

off

off

Microcode load begin

Lower Nibble

off

off

ON

off

03h

Upper Nibble

off

off

off

off

CRAM initialization begin

Lower Nibble

off

off

ON

ON

04h

Upper Nibble

off

off

off

off

Pei Cache When Disabled

Lower Nibble

off

ON

off

off

05h

Upper Nibble

off

off

off

off

SEC Core At Power On Begin.

Lower Nibble

off

ON

off

ON

06h

Upper Nibble

off

off

off

off

Early CPU initialization during Sec Phase.

Lower Nibble

off

ON

ON

off

07h

Upper Nibble

off

off

off

off

Early SB initialization during Sec Phase.

Lower Nibble

off

ON

ON

ON

08h

Upper Nibble

off

off

off

off

Early NB initialization during Sec Phase.

Lower Nibble

ON

off

off

off

Table 38. POST Progress Code LED Example

Note: Upper nibble bits = 1010b = Ah; Lower nibble bits = 1100b = Ch; the two are concatenated as ACh

The following table provides a list of all POST progress codes.

Table 39. POST Progress Codes

63

Intel® Server System R1000SPO Product Family TPS

Diagnostic LED Decoder

LED #

LED 3

LED 2

LED 1

LED 0

Description

Checkpoint

Upper Nibble

8h (MSB)

4h

2h

1h (LSB)

Lower Nibble

8h (MSB)

4h

2h

1h (LSB)

09h

Upper Nibble

off

off

off

off

End Of Sec Phase.

Lower Nibble

ON

off

off

ON

0Eh

Upper Nibble

off

off

off

off

Microcode Not Found.

Lower Nibble

ON

ON

ON

off

0Fh

Upper Nibble

off

off

off

off

Microcode Not Loaded.

Lower Nibble

ON

ON

ON

ON

PEI Phase

10h

Upper Nibble

off

off

off

ON

PEI Core

Lower Nibble

off

off

off

off

11h

Upper Nibble

off

off

off

ON

CPU PEIM

Lower Nibble

off

off

off

ON

15h

Upper Nibble

off

off

off

ON

NB PEIM

Lower Nibble

off

ON

off

ON

19h

Upper Nibble

off

off

off

ON

SB PEIM

Lower Nibble

ON

off

off

ON

MRC Process Codes – MRC Progress Code Sequence is executed

PEI Phase continued…

31h

Upper Nibble

off

off

ON

ON

Memory Installed

Lower Nibble

off

off

off

ON

32h

Upper Nibble

off

off

ON

ON

CPU PEIM (Cpu Init)

Lower Nibble

off

off

ON

off

33h

Upper Nibble

off

off

ON

ON

CPU PEIM (Cache Init)

Lower Nibble

off

off

ON

ON

4Fh

Upper Nibble

off

ON

off

off

Dxe IPL started

Lower Nibble

ON

ON

ON

ON

DXE Phase

60h

Upper Nibble

off

ON

ON

off

DXE Core started

Lower Nibble

off

off

off

off

61h

Upper Nibble

off

ON

ON

off

DXE NVRAM Init

Lower Nibble

off

off

off

ON

62h

Upper Nibble

off

ON

ON

off

SB RUN Init

Lower Nibble

off

off

ON

off

64

Intel® Server System R1000SPO Product Family TPS

Diagnostic LED Decoder

LED #

LED 3

LED 2

LED 1

LED 0

Description

Checkpoint

Upper Nibble

8h (MSB)

4h

2h

1h (LSB)

Lower Nibble

8h (MSB)

4h

2h

1h (LSB)

63h

Upper Nibble

off

ON

ON

off

DXE CPU Init

Lower Nibble

off

off

ON

ON

65h

Upper Nibble

off

ON

ON

off

DXE CPU BSP Select

Lower Nibble

off

ON

off

ON

66h

Upper Nibble

off

ON

ON

off

DXE CPU AP Init

Lower Nibble

off

ON

ON

off

68h

Upper Nibble

off

ON

ON

off

DXE PCI Host Bridge Init

Lower Nibble

ON

off

off

off

69h

Upper Nibble

off

ON

ON

off

DXE NB Init

Lower Nibble

ON

off

off

ON

6Ah

Upper Nibble

off

ON

ON

off

DXE NB SMM Init

Lower Nibble

ON

off

ON

off

70h

Upper Nibble

off

ON

ON

ON

DXE SB Init

Lower Nibble

off

off

off

off

71h

Upper Nibble

off

ON

ON

ON

DXE SB SMM Init

Lower Nibble

off

off

off

ON

72h

Upper Nibble

off

ON

ON

ON

DXE SB devices Init

Lower Nibble

off

off

ON

off

78h

Upper Nibble

off

ON

ON

ON

DXE ACPI Init

Lower Nibble

ON

off

off

off

79h

Upper Nibble

off

ON

ON

ON

DXE CSM Init

Lower Nibble

ON

off

off

ON

80h

Upper Nibble

ON

off

off

off

DXE BDS Started

Lower Nibble

off

off

off

off

81h

Upper Nibble

ON

off

off

off

DXE BDS connect drivers

Lower Nibble

off

off

off

ON

82h

Upper Nibble

ON

off

off

off

DXE PCI Bus begin

Lower Nibble

off

off

ON

off

83h

Upper Nibble

ON

off

off

off

DXE PCI Bus HPC Init

Lower Nibble

off

off

ON

ON

84h

Upper Nibble

ON

off

off

off

DXE PCI Bus enumeration

Lower Nibble

off

ON

off

off

65

Intel® Server System R1000SPO Product Family TPS

Diagnostic LED Decoder

LED #

LED 3

LED 2

LED 1

LED 0

Description

Checkpoint

Upper Nibble

8h (MSB)

4h

2h

1h (LSB)

Lower Nibble

8h (MSB)

4h

2h

1h (LSB)

85h

Upper Nibble

ON

off

off

off

DXE PCI Bus resource requested

Lower Nibble

off

ON

off

ON

86h

Upper Nibble

ON

off

off

off

DXE PCI Bus assign resource

Lower Nibble

off

ON

ON

off

87h

Upper Nibble

ON

off

off

off

DXE CON_OUT connect

Lower Nibble

off

ON

ON

ON

88h

Upper Nibble

ON

off

off

off

DXE CON_IN connect

Lower Nibble

ON

off

off

off

89h

Upper Nibble

ON

off

off

off

DXE SIO Init

Lower Nibble

ON

off

off

ON

8A

Upper Nibble

ON

off

off

off

DXE USB start

Lower Nibble

ON

off

ON

off

8B

Upper Nibble

ON

off

off

off

DXE USB reset

Lower Nibble

ON

off

ON

ON

8C

Upper Nibble

ON

off

off

off

DXE USB detect

Lower Nibble

ON

ON

off

off

8D

Upper Nibble

ON

off

off

off

DXE USB enable

Lower Nibble

ON

ON

off

ON

90h

Upper Nibble

ON

off

off

ON

DXE IDE begin

Lower Nibble

off

off

off

off

91h

Upper Nibble

ON

off

off

ON

DXE IDE reset

Lower Nibble

off

off

off

ON

92h

Upper Nibble

ON

off

off

ON

DXE IDE detect

Lower Nibble

off

off

ON

off

93h

Upper Nibble

ON

off

off

ON

DXE IDE enable

Lower Nibble

off

off

ON

ON

94h

Upper Nibble

ON

off

off

ON

DXE SCSI begin

Lower Nibble

off

ON

off

off

95h

Upper Nibble

ON

off

off

ON

DXE SCSI reset

Lower Nibble

off

ON

off

ON

96h

Upper Nibble

ON

off

off

ON

DXE SCSI detect

Lower Nibble

off

ON

ON

off

66

Intel® Server System R1000SPO Product Family TPS

Diagnostic LED Decoder

LED #

LED 3

LED 2

LED 1

LED 0

Description

Checkpoint

Upper Nibble

8h (MSB)

4h

2h

1h (LSB)

Lower Nibble

8h (MSB)

4h

2h

1h (LSB)

97h

Upper Nibble

ON

off

off

ON

DXE SCSI enable

Lower Nibble

off

ON

ON

ON

98h

Upper Nibble

ON

off

off

ON

DXE verifying SETUP password

Lower Nibble

ON

off

off

off

99h

Upper Nibble

ON

off

off

ON

DXE SETUP start

Lower Nibble

ON

off

off

ON

9Ah

Upper Nibble

ON

off

off

ON

DXE SETUP input wait

Lower Nibble

ON

off

ON

off

9Bh

Upper Nibble

ON

off

off

ON

DXE Ready to Boot

Lower Nibble

ON

off

ON

ON

9Ch

Upper Nibble

ON

off

off

ON

DXE Legacy Boot

Lower Nibble

ON

ON

off

off

9Dh

Upper Nibble

ON

off

off

ON

DXE Exit Boot Services

Lower Nibble

ON

ON

off

ON

C0h

Upper Nibble

ON

ON

off

off

RT Set Virtual Address Map Begin

Lower Nibble

off

off

off

off

C1h

Upper Nibble

ON

ON

off

off

RT Set Virtual Address Map End

Lower Nibble

off

off

off

ON

C2h

Upper Nibble

ON

ON

off

off

DXE Legacy Option ROM init

Lower Nibble

off

off

ON

off

C3h

Upper Nibble

ON

ON

off

off

DXE Reset system

Lower Nibble

off

off

ON

ON

C4h

Upper Nibble

ON

ON

off

off

DXE USB Hot plug

Lower Nibble

off

ON

off

off

C5h

Upper Nibble

ON

ON

off

off

DXE PCI BUS Hot plug

Lower Nibble

off

ON

off

ON

C6h

Upper Nibble

ON

ON

off

off

DXE NVRAM cleanup

Lower Nibble

off

ON

ON

off

C7h

Upper Nibble

ON

ON

off

off

DXE Configuration Reset

Lower Nibble

off

ON

ON

ON

00h

Upper Nibble

off

off

off

off

INT19

Lower Nibble

off

off

off

off

67

Intel® Server System R1000SPO Product Family TPS

Diagnostic LED Decoder

LED #

LED 3

LED 2

LED 1

LED 0

Description

Checkpoint

Upper Nibble

8h (MSB)

4h

2h

1h (LSB)

Lower Nibble

8h (MSB)

4h

2h

1h (LSB)

S3 Resume

40h

Upper Nibble

off

ON

off

off

S3 Resume PEIM (S3 started)

Lower Nibble

off

off

off

off

41h

Upper Nibble

off

ON

off

off

S3 Resume PEIM (S3 boot script)

Lower Nibble

off

off

off

ON

42h

Upper Nibble

off

ON

off

off

S3 Resume PEIM (S3 Video Repost)

Lower Nibble

off

off

ON

off

43h

Upper Nibble

off

ON

off

off

S3 Resume PEIM (S3 OS wake)

Lower Nibble

off

off

ON

ON

BIOS Recovery

46h

Upper Nibble

off

ON

off

off

PEIM which detected forced Recovery condition

Lower Nibble

off

ON

ON

off

47h

Upper Nibble

off

ON

off

off

PEIM which detected User Recovery condition

Lower Nibble

off

ON

ON

ON

48h

Upper Nibble

off

ON

off

off

Recovery PEIM (Recovery started)

Lower Nibble

ON

off

off

off

49h

Upper Nibble

off

ON

off

off

Recovery PEIM (Capsule found)

Lower Nibble

ON

off

off

ON

4Ah

Upper Nibble

off

ON

off

off

Recovery PEIM (Capsule loaded)

Lower Nibble

ON

off

ON

off

POST Memory Initialization MRC Diagnostic Codes

There are two types of POST Diagnostic Codes displayed by the MRC during memory initialization; Progress
Codes and Fatal Error Codes.

The MRC Progress Codes are displays to the Diagnostic LEDs that show the execution point in the MRC
operational path at each step.

68

Intel® Server System R1000SPO Product Family TPS

Diagnostic LED Decoder

LED #

LED 3

LED 2

LED 1

LED 0

Description
Checkpoint

Upper Nibble

8h (MSB)

4h

2h

1h (LSB)

Lower Nibble

8h (MSB)

4h

2h

1h (LSB)

MRC Progress Codes

B0h

Upper Nibble

ON

off

ON

ON

Detect DIMM population

Lower Nibble

off

off

off

off

B1h

Upper Nibble

ON

off

ON

ON

Set DDR4 frequency

Lower Nibble

off

off

off

ON

B2h

Upper Nibble

ON

off

ON

ON

Gather remaining SPD data

Lower Nibble

off

off

ON

off

B3h

Upper Nibble

ON

off

ON

ON

Program registers on the memory controller level

Lower Nibble

off

off

ON

ON

B4h

Upper Nibble

ON

off

ON

ON

Evaluate RAS modes and save rank information

Lower Nibble

off

ON

off

off

B5h

Upper Nibble

ON

off

ON

ON

Program registers on the channel level

Lower Nibble

off

ON

off

ON

B6h

Upper Nibble

ON

off

ON

ON

Perform the JEDEC defined initialization sequence

Lower Nibble

off

ON

ON

off

B7h

Upper Nibble

ON

off

ON

ON

Train DDR4 ranks

Lower Nibble

off

ON

ON

ON

B8h

Upper Nibble

ON

off

ON

ON

Initialize CLTT/OLTT

Lower Nibble

ON

off

off

off

B9h

Upper Nibble

ON

off

ON

ON

Hardware memory test and init

Lower Nibble

ON

off

off

ON

BAh

Upper Nibble

ON

off

ON

ON

Execute software memory init

Lower Nibble

ON

off

ON

off

BBh

Upper Nibble

ON

off

ON

ON

Program memory map and interleaving

Lower Nibble

ON

off

ON

ON

BCh

Upper Nibble

ON

off

ON

ON

Program RAS configuration

Lower Nibble

ON

ON

off

off

BFh

Upper Nibble

ON

off

ON

ON

MRC is done

Lower Nibble

ON

ON

ON

ON

Table 40. MRC Progress Codes

69

Intel® Server System R1000SPO Product Family TPS

Diagnostic LED Decoder

LED #

LED 3

LED 2

LED 1

LED 0

Description
Checkp

oint

Upper
Nibble

8h
(MSB)

4h

2h

1h
(LSB)

Lower
Nibble

8h
(MSB)

4h

2h

1h
(LSB)

MRC Fatal Error Codes

E8h

Upper
Nibble

ON

ON

ON

off
No usable memory error

01h = No memory was detected from the SPD read, or invalid
config that causes no operable memory.

Lower
Nibble

ON

off

off

off
02h = Memory DIMMs on all channels of all sockets are

disabled due to hardware mem-test error.

3h = No memory installed. All channels are disabled.

E9h

Upper
Nibble

ON

ON

ON

off

Memory is locked by Intel® Trusted Execution Technology
and is inaccessible

Lower
Nibble

ON

off

off

ON

EAh

Upper
Nibble

ON

ON

ON

off

DDR4 channel training error

01h = Error on read DQ/DQS (Data/Data Strobe) init

02h = Error on Receive Enable

Lower
Nibble

ON

off

ON

off
3h = Error on Write Leveling

04h = Error on write DQ/DQS (Data/Data Strobe

EBh

Upper
Nibble

ON

ON

ON

off

Memory test failure

01h = Software mem-test failure.

02h = Hardware mem-test failed.

Lower
Nibble

ON

off

ON

ON

03h = Hardware Mem-test failure in Lockstep Channel mode
requiring a channel to be disabled.
This is a fatal error which requires a reset and calling MRC with
a different RAS mode to retry.

Memory Initialization at the beginning of POST includes multiple functions, including: discovery, channel
training, validation that the DIMM population is acceptable and functional, initialization of the IMC and other
hardware settings, and initialization of applicable RAS configurations.

When a major memory initialization error occurs and prevents the system from booting with data integrity, a
beep code is generated, the MRC will display a fatal error code on the diagnostic LEDs, and a system halt
command is executed. Fatal MRC error halts do NOT change the state of the System Status LED, and they do
NOT get logged as SEL events. The following table lists all MRC fatal errors that are displayed to the
Diagnostic LEDs.

Table 41. POST Progress LED Codes

70

Intel® Server System R1000SPO Product Family TPS

Diagnostic LED Decoder

LED #

LED 3

LED 2

LED 1

LED 0

Description
Checkp

oint

Upper
Nibble

8h
(MSB)

4h

2h

1h
(LSB)

Lower
Nibble

8h
(MSB)

4h

2h

1h
(LSB)

EDh

Upper
Nibble

ON

ON

ON

off

DIMM configuration population error

01h = Different DIMM types (UDIMM, RDIMM, LRDIMM) are
detected installed in the system.

02h = Violation of DIMM population rules.

Lower
Nibble

ON

ON

off

ON
03h = The 3rd DIMM slot cannot be populated when QR DIMMs

are installed.

04h = UDIMMs are not supported in the 3rd DIMM slot.

05h = Unsupported DIMM Voltage.

EFh

Upper
Nibble

ON

ON

ON

off

Indicates a CLTT table structure error

Lower
Nibble

ON

ON

ON

ON

71

Intel® Server System R1000SPO Product Family TPS

Error Code

Error Message

Response

0012

System RTC date/time not set

Major

0048

Password check failed

Major

0140

PCI component encountered a PERR error

Major

0141

PCI resource conflict

Major

0146

PCI out of resources error

Major

0191

Processor core/thread count mismatch detected

Fatal

0192

Processor cache size mismatch detected

Fatal

0194

Processor family mismatch detected

Fatal

Appendix C: POST Code Errors

Most error conditions encountered during POST are reported using POST Error Codes. These codes
represent specific failures, warnings, or are informational. POST Error Codes may be displayed in the Error
Manager Display screen, and are always logged to the System Event Log (SEL). Logged events are available to
System Management applications, including Remote and Out of Band (OOB) management.

There are exception cases in early initialization where system resources are not adequately initialized for
handling POST Error Code reporting. These cases are primarily Fatal Error conditions resulting from
initialization of processors and memory, and they are handed by a Diagnostic LED display with a system halt.

The following table lists the supported POST Error Codes. Each error code is assigned an error type which
determines the action the BIOS will take when the error is encountered. Error types include Minor, Major, and
Fatal. The BIOS action for each is defined as follows:

 Minor: The error message is displayed on the screen or on the Error Manager screen, and an error is

logged to the SEL. The system continues booting in a degraded state. The user may want to replace
the erroneous unit. The POST Error Pause option setting in the BIOS setup does not have any effect
on this error.

 Major: The error message is displayed on the Error Manager screen, and an error is logged to the

SEL. The POST Error Pause option setting in the BIOS setup determines whether the system pauses
to the Error Manager for this type of error so the user can take immediate corrective action or the
system continues booting.

Note that for 0048 “Password check failed”, the system halts, and then after the next reset/reboot
will displays the error code on the Error Manager screen.

 Fatal: The system halts during post at a blank screen with the text “Unrecoverable fatal error found.

System will not boot until the error is resolved” and “Press <F2> to enter setup” The POST Error

Pause option setting in the BIOS setup does not have any effect with this class of error.

When the operator presses the F2 key on the keyboard, the error message is displayed on the Error
Manager screen, and an error is logged to the SEL with the error code. The system cannot boot
unless the error is resolved. The user needs to replace the faulty part and restart the system.

NOTE: The POST error codes in the following table are common to all current generation Intel server
platforms. Features present on a given server board/system will determine which of the listed error codes
are supported

Table 42. POST Error Codes and Messages

72

Intel® Server System R1000SPO Product Family TPS

Error Code

Error Message

Response

0195

Processor Intel(R) QPI link frequencies unable to synchronize

Fatal

0196

Processor model mismatch detected

Fatal

0197

Processor frequencies unable to synchronize

Fatal

5220

BIOS Settings reset to default settings

Major

5221

Passwords cleared by jumper

Major

5224

Password clear jumper is Set

Major

8130

Processor 01 disabled

Major

8131

Processor 02 disabled

Major

8160

Processor 01 unable to apply microcode update

Major

8161

Processor 02 unable to apply microcode update

Major

8170

Processor 01 failed Self Test (BIST)

Major

8171

Processor 02 failed Self Test (BIST)

Major

8180

Processor 01 microcode update not found

Minor

8181

Processor 02 microcode update not found

Minor

8190

Watchdog timer failed on last boot

Major

8198

OS boot watchdog timer failure

Major

8300

Baseboard management controller failed self test

Major

8305

Hot Swap Controller failure

Major

83A0

Management Engine (ME) failed self test

Major

83A1

Management Engine (ME) Failed to respond.

Major

84F2

Baseboard management controller failed to respond

Major

84F3

Baseboard management controller in update mode

Major

84F4

Sensor data record empty

Major

84FF

System event log full

Minor

8500

Memory component could not be configured in the selected RAS mode

Major

8501

DIMM Population Error

Major

8520

DIMM_A1 failed test/initialization

Major

8521

DIMM_A2 failed test/initialization

Major

8523

DIMM_B1 failed test/initialization

Major

8524

DIMM_B2 failed test/initialization

Major

8540

DIMM_A1 disabled

Major

8541

DIMM_A2 disabled

Major

8543

DIMM_B1 disabled

Major

8544

DIMM_B2 disabled

Major

8560

DIMM_A1 encountered a Serial Presence Detection (SPD) failure

Major

8561

DIMM_A2 encountered a Serial Presence Detection (SPD) failure

Major

8563

DIMM_B1 encountered a Serial Presence Detection (SPD) failure

Major

8564

DIMM_B2 encountered a Serial Presence Detection (SPD) failure

Major

8604

POST Reclaim of non-critical NVRAM variables

Minor

8605

BIOS Settings are corrupted

Major

8606

NVRAM variable space was corrupted and has been reinitialized

Major

8607

Recovery boot has been initiated.
NOTE: The Primary BIOS image may be corrupted or the system may hang

during POST. A BIOS update is required.

Fatal

73

Intel® Server System R1000SPO Product Family TPS

Error Code

Error Message

Response

92A3

Serial port component was not detected

Major

92A9

Serial port component encountered a resource conflict error

Major

A000

TPM device not detected.

Minor

A001

TPM device missing or not responding.

Minor

A002

TPM device failure.

Minor

A003

TPM device failed self-test.

Minor

A100

BIOS ACM Error

Major

A421

PCI component encountered a SERR error

Fatal

A5A0

PCI Express component encountered a PERR error

Minor

A5A1

PCI Express component encountered an SERR error

Fatal

A6A0

DXE Boot Services driver: Not enough memory available to shadow a Legacy
Option ROM.

Minor

Beeps

Error Message

POST Progress Code

Description

1

USB device action

N/A

Short beep sounded whenever USB device is
discovered in POST, or inserted or removed during
runtime.

1 long

Intel® TXT security
violation

0xAE, 0xAF

System halted because Intel® Trusted Execution
Technology detected a potential violation of system
security.

3

Memory error

Multiple

System halted because a fatal error related to the
memory was detected.

3 long
and 1

CPU mismatch
error

0xE5, 0xE6

System halted because a fatal error related to the
CPU family/core/cache mismatch was detected.

The following Beep Codes are sounded during BIOS Recovery.

2

BIOS Recovery
started

N/A

Recovery boot has been initiated.

4

BIOS Recovery
failure

N/A

BIOS recovery has failed. This typically happens so
quickly after recovery us initiated that it sounds like a
2-4 beep code.

POST Error Beep Codes

The following table lists the POST error beep codes. Prior to system video initialization, the BIOS uses these
beep codes to inform users on error conditions. The beep code is followed by a user-visible code on the
POST Progress LEDs.

Table 43. POST Error Beep Codes

74

Intel® Server System R1000SPO Product Family TPS

Code

Associated Sensors

Reason for Beep

1-5-2-1

No CPUs installed or first CPU socket is
empty.

CPU1 socket is empty, or sockets are populated
incorrectly

CPU1 must be populated before CPU2.

1-5-2-4

MSID Mismatch

MSID mismatch occurs if a processor is installed
into a system board that has incompatible power
capabilities.

1-5-4-2

Power fault

DC power unexpectedly lost (power good
dropout) – Power unit sensors report power unit
failure offset

1-5-4-4

Power control fault (power good
assertion timeout).

Power good assertion timeout – Power unit
sensors report soft power control failure offset

1-5-1-2

VR Watchdog Timer sensor assertion

VR controller DC power on sequence was not
completed in time.

1-5-1-4

Power Supply Status

The system does not power on or unexpectedly
powers off and a Power Supply Unit (PSU) is
present that is an incompatible model with one or
more other PSUs in the system.

The Integrated BMC may generate beep codes upon detection of failure conditions. Beep codes are sounded
each time the problem is discovered, such as on each power-up attempt, but are not sounded continuously.
Codes that are common across all Intel server boards and systems that use same generation chipset are
listed in the following table. Each digit in the code is represented by a sequence of beeps whose count is
equal to the digit.

Table 44. Integrated BMC Beep Codes

75

Intel® Server System R1000SPO Product Family TPS

Appendix D: System Cable Routing Diagrams

Figure 48. Internal Cable Routing

76

Intel® Server System R1000SPO Product Family TPS

Appendix E: High Temperature Ambient Info

The system can operate in an environment that complies with ASHARE Class A3 specification with no
hardware configuration limitation. However, there are limitations regarding the time that the system can
operate in such situation.

The ASHARE Class A3 specification includes operation of the system in an environment with a temperature
of 40°C for up to 900 hours per year. The use beyond this limits may impact system reliability.

The following notes communicate support criteria associated with specific configurations identified in the
following table. Each relevant note to a configuration is identified by reference number in the table.

1. The 27°C configuration alone is limited to elevations of 900m or less. Altitudes higher than 900m need to
be de-rated to ASHRAE Class 2 levels.

2. To support system fan redundancy, the system must be configured with two power supplies to maintain
sufficient cooling. Concurrent system and power supply fan failures is not supported.

3. Processor and memory throttling may occur which may impact system performance. CPU reliability is not
impacted.

4. In fan fail mode, Intel® I/O Modules AXX10GBTWLIOM and AXX2FDRIBIOM are only supported in the
specified base system model configured with 120W processors and DRx4 memory.

5. Use of the designated PCIe* slot is limited to add-in cards that have a limit of 55°C local ambient
temperature and air flow requirements of 200 LFM or less. Please refer to the add-in card specs for air flow
requirements.

6. For ASHRAE Class 3 and Class 4 support, the following power supply margining is required to meet
thermal specifications:
a) For dual power supply configurations, the power budget must fit within a single power supply rated load
and be installed in a dual configuration, or
b) For single power supply configurations, the power budget must be sized with 30% margin to single power
supply rated load.

7. The system only supports PCIe* SSD Add-in Card FF devices which have operational temperature limits of
55°C local ambient temperature and 300LFM.

8. The Intel® RAID Maintenance Free Backup Unit (AXXRMFBUx) can support a case temperature of up to
45°C with the system operating in normal mode and up to 55°C with the system operating in a fan fail mode.
Excursions over these specs may result in a reliability impact.

9. M.2 drives may see performance impact under heavy work load

10. Light workload is assuming 70% write, 30% read, 100% Random, 100% access, 8kb transfer rate, I/O
"delay" of 8ms

11. M.2 drives may see a slight performance impact under light workloads.

77

Intel® Server System R1000SPO Product Family TPS

ASHRAE

(See Note 1)

Classifications

27°C

A2

A3

Maximum Ambient Temperature

27°C(1)

35°C

40°C

Altitude in meters

900

900

900

Power Supply

(See Note 6)

450W AC

● ● ●

350W AC

● ● ●

Intel® Xeon® E3

Processors

(See Note 3)

E3-1280V5 4+0 80W TDP

● ● ●

E3-1270V5 4+0 80W TDP

● ● ●

E3-1240V5 4+0 80W TDP

● ● ●

E3-1230V5 4+0 80W TDP

● ● ●

E3-1220V5 4+0 80W TDP

● ● ●

E3-1260LV5 4+0 45W TDP

● ● ●

E3-1240LV5 4+0 25W TDP

● ● ●

Memory Type

DDR4 UDIMM-up to 2133MHz

● ● ●

Add-in Cards

(See note 5)

On Riser Card

● ● ●

SAS and I/O

Modules

(See Note 4)

Intel® Integrated RAID Modules (Mezzanine
cards)

● ● ●

AXX10GBTWLIOM3 - Dual 10GBASE-T
I/O Module

● ● ●

AXX4P1GBPWLIOM - Quad Port 1GbE
I/O Module

● ● ●

AXX10GBNIAIOM - Dual SFP+ port 10GbE
I/O Module

● ● ●

Battery Backup

(See note 8)

BBU (rated to 45°C)

● ● ●

RMFBU (rated to 55°C)

● ● ●

Cache Offload Module (rated to 55°C)

● ● ●

2.5'' SSD on front
edge

Rated to 60°C

● ● ●

Rated to 70°C

● ● ●

PCIe* SSD AIC

FF(DC

P3700/P3500)

(See note 7)

1.6TB/2TB

● ● ●

800GB

● ● ●

600GB

● ● ●

400GB

● ● ●

200GB

● ● ●

Chipset

C230 Series Chipset up to 5.9W TDP

● ● ●

NIC

NIC chip up to 0.74W

● ● ●

M.2 full TDP

ADATA* M.2 SATA SSD 128GB

● ● ●

Plextor* M.2 SATA SSD 64GB

● ● ●

Other Non-Intel M.2 SSD

10

10

10

M.2 Typical OS

Workload [10]

ADATA* M.2 SATA SSD 128GB

● ● ●

Plextor* M.2 SATA SSD 64GB

● ● ●

Other Non-Intel M.2 SSD

12

12

12

Thermal Configuration Table

"●" = Full Support without limitation
"4.5" (Cell with number) = Conditional support with limitation
" " (Blank) = Not supported

78

Intel® Server System R1000SPO Product Family TPS

Acronym

Definition

TPS

Technical Product Specification

NDA

Non-Disclosure Agreement

I/O

Input/Output

VLSI

Very Large Scale Integration

TDP

Thermal Design Power

PCH

Platform Hub Controller

DMI

Direct Media Interface

PCIe*

Peripheral Component Interconnect Express*

SFP+

Enhanced Small Form-Factor Pluggable

DIMM

Dual In-line Memory Module

RAID

Redundant Array of Independent Disks

TPM

Trusted Platform Module

IPMI

Intelligent Platform Management Interface

SAS

Serial Attached SCSI

SATA

Serial Advanced Technology Attachment

EFI

Extended Firmware Interface

UEFI

Unified Extended Firmware Interface

OS

Operating System

CV

Compatibility Validation

NMI

Non-Maskable Interrupt

NIC

Network Interface Card

ISTA

International Safe Transit Association

PDB

Power Distribution Board

VAC

Voltage Alternating Current

VDC

Voltage Direct Current

SSI

Server System Infrastructure Forum

EPS

External Product Specification

OCP

Over-Current Protection

OVP

Over Voltage Protection

OTP

Over Temperature Protection

PS

Power Supply

CFM

Cubic Feet per minute

LFM

Linear feet per minute

HTA

High Temperature Ambient

BMC

Baseboard Management Controller

SDR

Sensor Data Record

SSD

Solid State Drive

HDD

Hard Disk Drive

PWM

Pulse Width Modulation

BIOS

Basic Input-Output System

Glossary

79

Intel® Server System R1000SPO Product Family TPS

Acronym

Definition

PMBUS

Power Management Bus

SATADOM

SATA Disk On a Module

RVI

Rotational Vibration Interference

THOL

Tested Hardware and operating list

HSBP

Hot-Swap Backplane

AHCI

Advanced Host Controller Interface

ESRT2

Embedded Server RAID Technology 2

RSTE

Intel® Rapid Storage Technology enterprise

USB

Universal Serial Bus

KVM

Keyboard, Video and Mouse Interface

RMM4

Remote Management Module

FRU

Field Replaceable Unit

SEL

System Event Log

SMS

System Management Software

RMCP

Remote Management Control Protocol

SMN

Server Management Mode

FRB

Fault Resilient Booting

DHCP

Dynamic Host Configuration Protocol

PECI

Platform Environment Control Interface

LDAP

Lightweight Directory Access Protocol

SSL

Secure Socket Layer

SMTP

Simple Mail Transfer Protocol

SNMP

Simple Network Management Protocol

VLAN

Virtual Local Area Network

POST

Power-On Self Test

FW

Firmware

AIC

Add-in Card

80

Intel® Server System R1000SPO Product Family TPS

81

Intel® Server System R1000SPO Product Family TPS

NOTES

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