Intel R1000SPO Series Technical Product Specification

Intel® Server System R1000SPO

Revision 1.0

March 2016

Intel® Server Boards and Systems

Product Family

Technical Product Specification

A document providing an overview of product features, functions, architecture, and
support specifications

Intel® Server System R1000SPO Product Family TPS

Date

Revision Number

Modifications

January 2016

0.7

First preliminary version

March 2016

1.0

First External Public Release
Changes:

 Updated Illustrations
 Appendix E - Added High Temperature Ambient Information
 Section 3.3.4 - Added Holdup time for Fixed Power Supply
 Section 3.2.3 - Added Information for Power Distribution Board
 Added Glossary
 Removed – AXXPRAIL from supported Rail kits
 Updated Copyright data
 Table 2 - Added info about PCIe riser slot

Revision History

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Intel® Server System R1000SPO Product Family TPS

Disclaimers

No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this
document.

Intel disclaims all express and implied warranties, including without limitation, the implied warranties of
merchantability, fitness for a particular purpose, and non-infringement, as well as any warranty arising from
course of performance, course of dealing, or usage in trade.

This document contains information on products, services and/or processes in development. All information
provided here is subject to change without notice. Contact your Intel representative to obtain the latest TPS.

The products and services described may contain defects or errors known as errata which may cause
deviations from published specifications. Current characterized errata are available on request.

Intel, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries.

*Other names and brands may be claimed as the property of others

© 2016 Intel Corporation.

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Intel® Server System R1000SPO Product Family TPS

Table of Contents

1. Introduction ........................................................................................................................................ 1

1.1 Chapter Outline .................................................................................................................................... 1

1.2 Server Board Use Disclaimer ......................................................................................................... 2

1.3 Product Errata ....................................................................................................................................... 2

2. Product Family Overview ................................................................................................................ 3

2.1 Operating System Support............................................................................................................... 5

2.1.1 OS Validation Levels .......................................................................................................................... 5

2.1.2 OS Technical Support Levels ......................................................................................................... 6

2.2 System Features Overview.............................................................................................................. 6

2.3 Server Board Features Overview .................................................................................................. 8

2.4 Back Panel Features ....................................................................................................................... 10

2.5 Front Control Panel .......................................................................................................................... 11

2.6 Front Drive Bay Options ................................................................................................................. 11

2.7 Locking Front Bezel ......................................................................................................................... 12

2.8 System Dimensions ......................................................................................................................... 14

2.8.1 Chassis Dimensions ........................................................................................................................ 14

2.8.2 Label Emboss Dimensions ........................................................................................................... 15

2.8.3 Pull-out Tab Label Emboss Dimensions ................................................................................. 16

2.9 Available Rack Mounting Kit Options ....................................................................................... 16

2.10 System Level Environmental Limits .......................................................................................... 17

2.11 System Packaging ............................................................................................................................ 18

2.11.1 Intel Product Weight Information ................................................................................................ 18

3. System Power ................................................................................................................................. 19

3.1 Power Supply Configurations ...................................................................................................... 19

3.2 Power Supply Module Options .................................................................................................... 20

3.2.1 Power Supply Module Efficiency ................................................................................................ 20

3.2.2 Power Supply Module Mechanical Overview ........................................................................ 20

3.2.3 Power distribution board ................................................................................................................ 21

3.2.4 Power Cord Specification Requirements ................................................................................ 22

3.3 AC Power Supply Input Specifications ..................................................................................... 22

3.3.1 Power Factor ...................................................................................................................................... 22

3.3.2 AC Input Voltage Specification .................................................................................................... 23

3.3.3 AC Line Isolation Requirements ................................................................................................. 23

3.3.4 AC Line Dropout / Holdup ............................................................................................................. 23

3.3.5 AC Line Fuse ...................................................................................................................................... 24

3.3.6 AC Line Transient Specification .................................................................................................. 24

3.3.7 Susceptibility Requirements ......................................................................................................... 25

3.3.8 Electrostatic Discharge Susceptibility ....................................................................................... 25

3.3.9 Fast Transient/Burst ........................................................................................................................ 25

3.3.10 Radiated Immunity ........................................................................................................................... 25

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Intel® Server System R1000SPO Product Family TPS

3.3.11 Power Recovery ................................................................................................................................ 25

3.3.12 Voltage Interruptions ....................................................................................................................... 25

3.3.13 Protection Circuits ............................................................................................................................ 25

3.3.14 Power Supply Status LED ............................................................................................................. 27

3.4 Server Board Power Connectors................................................................................................ 27

4. Thermal Management ................................................................................................................... 29

4.1 Thermal Operation and Configuration Requirements ........................................................ 30

4.2 Thermal Management Overview ................................................................................................ 30

4.2.1 Fan Speed Control ........................................................................................................................... 30

4.2.2 Programmable Fan PWM Offset ................................................................................................ 31

4.2.3 Fan Domains ...................................................................................................................................... 31

4.2.4 Nominal Fan Speed ......................................................................................................................... 32

4.2.5 Thermal and Acoustic Management ......................................................................................... 32

4.2.6 Thermal Sensor Input to Fan Speed Control ......................................................................... 32

4.3 System Fans ....................................................................................................................................... 34

5. System Storage and Peripheral Drive Bay Overview ........................................................... 36

5.1 Front Mount Drive Support............................................................................................................ 36

5.2 System Fan RVI and Hard Disk Drive Storage Performance ......................................... 36

5.3 Hot Swap Drive Carriers ................................................................................................................ 37

5.4 Storage Backplane Options .......................................................................................................... 39

5.4.1 I2C Functionality ............................................................................................................................... 40

5.4.2 4 x 3.5” Drive Hot-Swap Backplane Overview ...................................................................... 40

5.4.3 8 x 2.5” Drive SAS Backplane ..................................................................................................... 42

5.5 M.2 SSD Support .............................................................................................................................. 43

5.6 SATA DOM Support ........................................................................................................................ 44

6. Storage Controller Options Overview ...................................................................................... 45

6.1 Embedded SATA/SATA RAID Support ................................................................................... 45

6.2 Intel® Integrated RAID Module Support ................................................................................... 47

6.2.1 Intel® RAID Maintenance Free Backup Unit (RMFBU) Support .................................... 47

7. Front Control Panel and I/O Panel Overview .......................................................................... 48

7.1 I/O Panel Features ........................................................................................................................... 48

7.2 Control Panel Features .................................................................................................................. 48

7.2.1 System Status LED .......................................................................................................................... 49

8. PCIe* Riser Card Support ............................................................................................................ 51

9. Intel® I/O Module Support ........................................................................................................... 52

10. Basic and Advanced Server Management Features ............................................................ 53

10.1 IPMI 2.0 Features ............................................................................................................................. 54

10.2 Non-IPMI Features ........................................................................................................................... 54

10.2.1 Dedicated Management Port ....................................................................................................... 55

10.2.2 Embedded Web Server .................................................................................................................. 55

10.2.3 Advanced Management Feature Support (RMM4 Lite) .................................................... 57

Appendix A: Integration and Usage Tips ........................................................................................ 61

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Intel® Server System R1000SPO Product Family TPS

Appendix B: POST Code Diagnostic LED Decoder ..................................................................... 62

Appendix C: POST Code Errors ........................................................................................................ 72

Appendix D: System Cable Routing Diagrams ............................................................................. 76

Appendix E: High Temperature Ambient Info ................................................................................ 77

Glossary .................................................................................................................................................. 79

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Intel® Server System R1000SPO Product Family TPS

List of Figures

Figure 1. System Components Overview ............................................................................................................. 6

Figure 2. Top Cover Features .................................................................................................................................... 7

Figure 3. Server Board Features ............................................................................................................................... 8

Figure 4. On-board Diagnostic LEDs ...................................................................................................................... 9

Figure 5. System Reset and Configuration Jumpers .................................................................................... 10

Figure 6. Back Panel Features ................................................................................................................................ 10

Figure 7. Front Control Panel Options ............................................................................................................... 11

Figure 8. 3.5" Drive Bay – 4 Drive Configuration (Model R1304SPxxxxx) ............................................ 11

Figure 9. 2.5" Drive Bay – 8 Drive Configuration (Model R1208SPxxxxx) ............................................ 11

Figure 10. Front Bezel ............................................................................................................................................... 12

Figure 11. Front Bezel Accessory with Optionally Installed Wave Feature ........................................ 12

Figure 12. Front Bezel Accessory with Optionally Installed Wave and ID Badge (1) ...................... 13

Figure 13. Front Bezel Accessory with Optionally Installed Wave and ID Badge (2) ...................... 13

Figure 14. Front Bezel Accessory ID Badge Mechanical Drawings ......................................................... 13

Figure 15. Chassis Dimensions .............................................................................................................................. 14

Figure 16. Label Emboss Dimensions ................................................................................................................. 15

Figure 17. Pull-out Tab Label Emboss Dimensions ...................................................................................... 16

Figure 18. 350W AC Fixed Power Supply ......................................................................................................... 19

Figure 19. 450W AC Power Supply...................................................................................................................... 19

Figure 20. 350W Power Supply Mechanical Drawings ................................................................................ 20

Figure 21. 450W Power Supply Mechanical drawings ................................................................................ 21

Figure 22. Power Distribution Board ................................................................................................................... 21

Figure 23. AC Power Cord ........................................................................................................................................ 22

Figure 24. System Air Flow and Fan Identification ........................................................................................ 29

Figure 25. Fan Control Model ................................................................................................................................ 33

Figure 26. System Fans ............................................................................................................................................. 34

Figure 27. System Fan Connector Locations on Server Board ................................................................ 35

Figure 28. 8x2.5" Drive Bay Configuration (Model R1208xxxxx) ............................................................. 36

Figure 29. 4x3.5" Drive Bay Configuration (Model R1304WTxxxx) ........................................................ 36

Figure 30. Hot Swap Storage Device Carrier Removal ................................................................................. 37

Figure 31. 2.5" SSD mounted to 3.5" Drive Tray ............................................................................................ 38

Figure 32. Drive Tray LED Identification ............................................................................................................ 38

Figure 33. Backplane Installation ......................................................................................................................... 40

Figure 34. 4 x 3.5” Drive Hot-Swap Backplane – front view ...................................................................... 41

Figure 35. 4 x 3.5” Drive Hot-Swap Backplane – rear view ........................................................................ 41

Figure 36. 8 x 2.5” Drive SAS/SATA Backplane – front view ..................................................................... 42

Figure 37. 8 x 2.5” Drive SAS/SATA Backplane – rear view ....................................................................... 42

Figure 38. Installing M.2 Device ............................................................................................................................ 43

Figure 39. Intel® Raid Upgrade Key ...................................................................................................................... 46

Figure 40. Intel® RAID Maintenance Free Backup Unit ................................................................................. 47

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Intel® Server System R1000SPO Product Family TPS

Figure 41. Front I/O Panel Features .................................................................................................................... 48

Figure 42. Front Panel LEDs and Buttons ......................................................................................................... 48

Figure 43. Add-in Card Support ............................................................................................................................ 51

Figure 44. Riser Card Assembly............................................................................................................................. 51

Figure 45. Intel® I/O Module Placement ............................................................................................................ 52

Figure 46. Intel® RMM4 Lite Activation Key Installation .............................................................................. 55

Figure 47. POST Diagnostic LED Location ........................................................................................................ 62

Figure 48. Internal Cable Routing ......................................................................................................................... 76

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Intel® Server System R1000SPO Product Family TPS

List of Tables

Table 1. Reference Documents ................................................................................................................................ 1

Table 2. Intel® Server System R1000SPO Product Family Feature Set ................................................... 3

Table 3. Operating System Support List .............................................................................................................. 5

Table 4. Operating System Validation Levels .................................................................................................... 5

Table 5. System Environmental Limits Summary .......................................................................................... 17

Table 6. Intel Product Weight Information ....................................................................................................... 18

Table 7. 350 Watt AC Power Supply Efficiency (Gold) ................................................................................ 20

Table 8. 450 Watt AC Power Supply Efficiency (Gold) ................................................................................ 20

Table 9. AC Power Cord Specifications .............................................................................................................. 22

Table 10. Input Voltage Range – 350W Power Supply ............................................................................... 23

Table 11. AC Input Voltage Range – 450W Power Supply ........................................................................ 23

Table 12. AC Line Holdup Time – 350W Power supply .............................................................................. 23

Table 13. AC Line Holdup Time – 450W Power Supply.............................................................................. 24

Table 14. AC Line Sag Transient Performance – 350W Power Supply ................................................ 24

Table 15. AC Line Surge Transient Performance – 350W Power Supply ............................................ 24

Table 16. AC Line Sag Transient Performance – 450W Power Supply ................................................ 24

Table 17. AC Line Surge Transient Performance – 450W Power Supply ............................................ 25

Table 18. Performance Criteria ............................................................................................................................. 25

Table 19. Over Current Protection – 350W Power Supply ........................................................................ 26

Table 20. Over Current Protection – 450 Watt Power Supply ................................................................. 26

Table 21. Over Voltage Protection - 350W Power Supply ........................................................................ 26

Table 22. Over Voltage Protection (OVP) Limits – 750W Power Supply ............................................. 27

Table 23. LED Indicators .......................................................................................................................................... 27

Table 24. Main Power Connector Pin-out ......................................................................................................... 28

Table 25. CPU Power Connector Pin-out .......................................................................................................... 28

Table 26. PMBUS SSI Connector Pin-out (PS_AUX) ..................................................................................... 28

Table 27. System Volumetric Air Flow ............................................................................................................... 29

Table 28. System Fan Connector Pin-out ......................................................................................................... 35

Table 29. Drive Status LED States ........................................................................................................................ 39

Table 30. Drive Activity LED States ...................................................................................................................... 39

Table 31. SATA/SATADOM capable Connector Pin-out ............................................................................ 44

Table 32. Front Control Panel Buttons And Indicators ............................................................................... 48

Table 33. System Status LED Indicator States ................................................................................................ 49

Table 34. Front panel LED indication of BMC state ...................................................................................... 50

Table 35. Supported Intel® I/O Modules ........................................................................................................... 52

Table 36. Intel® Remote Management Module 4 (RMM4) Options ......................................................... 53

Table 37. Basic and Advanced Server Management Features Overview ............................................. 53

Table 38. POST Progress Code LED Example ................................................................................................. 63

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Intel® Server System R1000SPO Product Family TPS

Table 39. POST Progress Codes ........................................................................................................................... 63

Table 40. MRC Progress Codes ............................................................................................................................. 69

Table 41. POST Progress LED Codes .................................................................................................................. 70

Table 42. POST Error Codes and Messages..................................................................................................... 72

Table 43. POST Error Beep Codes ....................................................................................................................... 74

Table 44. Integrated BMC Beep Codes .............................................................................................................. 75

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Intel® Server System R1000SPO Product Family TPS

Document Title

Document

Classification

Intel® Server Board S1200SP Family BMC EPS 1.1

Intel Confidential

Intel® Server Board S1200SP Family BIOS EPS v1.0

Intel Confidential

Intel® Xeon® Processor E3-1200 v5 Product Family
Datasheet

Intel Confidential
Intel® Ethernet Controller I210: Datasheet

Intel® Server Board S1200SP Family Technical Product
Specification 1.0

1. Introduction

This Technical Product Specification (TPS) provides system level information for the Intel® Server System
R1000SPO product family.

This document describes the embedded functionality and available features of the integrated server system
which includes: the chassis layout, system boards, power subsystem, cooling subsystem, storage subsystem
options, and available installable options. Note that some system features are provided as configurable
options and may not be included standard in every system configuration offered. Please reference the Intel®
Server Board S1200SP Product Family Configuration Guide for a list of configurable options.

Server board specific detail can be obtained by referencing the Intel® Server Board S1200SP Technical
Product Specification.

NOTE: Some of the documents listed in the following table are classified as “Intel Confidential”. These
documents are made available under a Non-Disclosure Agreement (NDA) with Intel and must be ordered
through your local Intel representative.

Table 1. Reference Documents

1.1 Chapter Outline

This document is divided into the following chapters:

 Chapter 1 – Introduction
 Chapter 2 – Product Family Overview
 Chapter 3 – System Power
 Chapter 4 – Thermal Management
 Chapter 5 – System Storage and Peripherals Drive Bay Overview
 Chapter 6 – Storage Controller Options Overview
 Chapter 7 – Front Control Panel and I/O Panel Overview
 Chapter 8 – PCIe* Riser Card Support
 Chapter 9 – Intel® I/O Module Support
 Chapter 10 – Basic and Advanced Server Management Features
 Appendix A – Integration and Usage Tips
 Appendix B – POST Code Diagnostic LED Decoder
 Appendix C – POST Code Errors
 Appendix D – System Configuration Tables for Thermal Compatibility
 Appendix E – High Temperature Ambient Info
 Glossary

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Intel® Server System R1000SPO Product Family TPS

1.2 Server Board Use Disclaimer

Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel® server building blocks are used together, the fully integrated
system will meet the intended thermal requirements of these components. It is the responsibility of the
system integrator who chooses not to use Intel-developed server building blocks to consult vendor
datasheets and operating parameters to determine the amount of airflow required for their specific
application and environmental conditions. Intel Corporation cannot be held responsible if components fail
or the server board does not operate correctly when used outside any of their published operating or non­operating limits.

1.3 Product Errata

Shipping product may have features or functionality that may deviate from published specifications. These
deviations are generally discovered after the product has gone into formal production. Intel terms these
deviations as product Errata. Known product Errata will be published in the Monthly Specification Update for
the given product family which can be downloaded from the following Intel web site:

http://www.intel.com/support

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Intel® Server System R1000SPO Product Family TPS

Feature

Description

Chassis Type

1U Rack Mount Chassis

Server Board

Intel® Server Board S1200SP – (Intel product code - S1200SPO)

Processor Support

 One LGA1151 (Socket H4) processor socket
 Support for one Intel® Xeon® E3-1200 V5 processor without processor graphics (GT0 or 4+0)
 Maximum supported Thermal Design Power (TDP) of up to 80 W.
 8 GT/s point-to-point DMI 3.0 interface to PCH

Memory

 Two memory channels, four memory DIMM Slots (Two memory DIMMs per channel)
 Support for 2133 MT/s Unbuffered DIMMs (UDIMM DDR4 ECC memory)

Chipset

Intel® C236 Platform Controller Hub (PCH) chipset

External I/O

connections

 1x DB-15 video connector
 Two Gigabit Ethernet Ports
 Dedicated RJ-45 server management port
 Two USB 2.0 connectors on back panel
 Two USB 3.0 connectors on back panel
 Two USB 3.0 connectors on front panel

Internal I/O connectors
/ headers

 One Type-A USB 2.0 connector
 One 2x5 pin connector providing front panel support for two USB 2.0 ports
 One 2x10 pin connector providing front panel support for two USB 2.0 / 3.0 ports

Intel® I/O Module
Accessory Options

The server board includes a proprietary on-board connector allowing for the installation of a variety of
available Intel® I/O modules. An installed I/O module can be supported in addition to standard on-board
features and add-in PCIe* cards.

The Following Intel® I/O Modules are supported:

 AXX4P1GBPWLIOM – Quad port 1GbE I/O based on Intel® Ethernet Controller I350
 AXX10GBNIAIOM – Dual SFP+ port 10GbE based on Intel® 82599 10 Gigabit Ethernet Controller
 AXX10GBTWLIOM3 – Dual RJ-45 port 10G BASE-T based on Intel® Ethernet Controller X540

System Fans

 Three managed 40mm single rotor system fans
 One power supply fan for each installed power supply module

Riser Card Support

 One x16 PCIe* 3.0 Riser Card H87808-XXX on a x8 Riser slot (slot-6)

Video

 Integrated 2D video controller
 16 MB DDR3 Memory

2. Product Family Overview

The Intel® Server System R1000SPO product family offers a variety of system options to meet the varied
configuration requirements of entry level computing environments, and includes several available 1U rack
mount server systems. Each integrated system within this product family is configured around the Intel®
Server Board S1200SPO.

This chapter provides a high-level overview of the system features and available options as supported in
different system models within this product family. Greater detail for each major sub-system, feature, or
option is provided in the following chapters.

Table 2. Intel

®

Server System R1000SPO Product Family Feature Set

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Intel® Server System R1000SPO Product Family TPS

Feature

Description

On-board storage
controllers and options

 8x SATA connectors up to 6Gbps
 1x SATADOM connector (SATA port 4)
 1x 75 pin connector for M.2 SATA SSD (2242 form factor)

 Embedded Software SATA RAID

o Intel® RSTe 4 SW RAID through onboard SATA connectors provides SATA RAID 0/1/10/5.
o Intel

®

Embedded Server RAID Technology II through onboard SATA connectors provides SATA
RAID 0/1/10 and optional RAID 5 support provided by the Intel® RAID Activation Key
RKSATA8R5.

Security

Intel® Trusted Platform Module (TPM) 1.2 based on LPC

Server Management

 Integrated Baseboard Management Controller, IPMI 2.0 compliant
 Support for Intel® Server Management Software
 On-board RJ45 management port
 Advanced Server Management via an Intel® Remote Management Module 4 Lite (Accessory Option)

Power Supply Options

 The server system supports two options for Power Supply:

o 1 x 350w Power Supply (Fixed)
o 2 x 450w Power Supply Modules (Redundant, Hot-Swap capable)

Storage Bay Options

Hot Swap Backplane Options:
NOTE: All available backplane options have support for SAS 3.0 (12 Gb/sec)

 4 x 3.5” SAS/SATA backplane
 8 x 2.5” SAS/SATA backplane

Storage Bay Options:

 4 x 3.5” SAS/SATA hot swap drive bays + front panel I/O
 8 x 2.5” SAS/SATA hot swap drive bays + front panel I/O

Supported Rack Mount
Kit Accessory Options

 AXXVPSRAIL - Value Plus Short Rail

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Intel® Server System R1000SPO Product Family TPS

Operating System

Operating System

Validation Level

(P)

Windows Server 2012* R2 with Hyper-Vx64 & EFI

P1

Red Hat Enterprise Linux* 7.0 with KVM x64 & UEFI

P1

SuSE Linux Enterprise Server* 12 with XEN x64

P1

Red Hat Enterprise Linux 6U5 with KVM x64 & UEFI

P2

VMWare ESXi* 5.5 U3

P2

SuSE Linux Enterprise Server 11 SP4 with XEN x64

P2

Windows Server 2008 R2 SP1

P2

Windows 7*

P2

Ubuntu* 14.04

P2

FreeBSD* 10.1

P3

CentOS* 7.0

P3

Operating System Validation Levels

P1

P2

P3

Basic Installation testing

Yes

Yes

Yes

Test all on-board I/O features in all modes

Yes

Adapter\Peripheral Compatibility & Stress testing

Yes

Technical Support Level

T1

T2

T3

2.1 Operating System Support

As of this writing, the Intel® Server System R1000SPO product family provides support for the following
operating systems. This list will be updated as new operating systems are validated by Intel.

Table 3. Operating System Support List

Table 4. Operating System Validation Levels

See the following sections for additional information regarding validation levels and technical support levels
as referenced in Table 4.

2.1.1 OS Validation Levels

Basic installation testing is performed with each supported operating system. The testing validates that the

system can install the operating system and that the base hardware feature set is functional. A small set of
peripherals is used for installation purposes only. Add-in adapter cards are not tested.

Adapter compatibility validation (CV) testing uses test suites to gain an accurate view of how the server
performs with a wide variety of adapters under the primary supported operating systems. These tests are
designed to show hardware compatibility between the cards and the server platform and include functional
testing only. No heavy stressing of the systems or the cards is performed for CV testing.

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Intel® Server System R1000SPO Product Family TPS

Stress Testing uses configurations that include add-in adapters in all available slots for a 48-hour (two-day),

or a 72-hour (three-day) test run without injecting errors. Each configuration passes an installation test and a
Network/Disk Stress test. Any fatal errors that occur require a complete test restart.

2.1.2 OS Technical Support Levels

T1: Intel will provide support for issues involving the installation and/or functionality of a specified operating

system as configured with or without supported adapters and/or peripherals.

T2: Intel will provide and test operating system drivers for each of the server board’s integrated controllers,

provided that the controller vendor has a driver available upon request. Vendors will not be required by Intel
to develop drivers for operating systems that they do not already support. Intel will NOT provide support for
issues related to the use of any add-in adapters or peripherals installed in the server system when an
operating system that received only basic installation testing is in use.

T3: Intel will not provide technical support for an open source operating system. All questions and issues
related to an open source operating system must be submitted to and supported by the open source
community supporting the given operating system.

2.2 System Features Overview

Figure 1. System Components Overview

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Intel® Server System R1000SPO Product Family TPS

Figure 2. Top Cover Features

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Intel® Server System R1000SPO Product Family TPS

2.3 Server Board Features Overview

The following illustration provides a general overview of the server board, identifying key feature and
component locations. Please refer to Intel® Server Board S1200SP Technical Product Specification for more
information.

Figure 3. Server Board Features

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Intel® Server System R1000SPO Product Family TPS

The server board includes several LEDs to identify system status. The following illustrations define
supported LEDs and identify their location.

Figure 4. On-board Diagnostic LEDs

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Intel® Server System R1000SPO Product Family TPS

Figure 5. System Reset and Configuration Jumpers

2.4 Back Panel Features

Figure 6. Back Panel Features

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Intel® Server System R1000SPO Product Family TPS

Label

Description

A

System ID Button w/Integrated LED

B

NMI Button (recessed, tool required for use)

C

NIC 1 & 2 Activity LEDs

D

System Cold Reset Button (recessed, tool required for use)

E

System Status LED

F

Power Button w/Integrated LED

G

Drive Activity LED

2.5 Front Control Panel

Figure 7. Front Control Panel Options

2.6 Front Drive Bay Options

Figure 8. 3.5" Drive Bay – 4 Drive Configuration (Model R1304SPxxxxx)

Figure 9. 2.5" Drive Bay – 8 Drive Configuration (Model R1208SPxxxxx)

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Intel® Server System R1000SPO Product Family TPS

2.7 Locking Front Bezel

The optional front bezel is made of Black molded plastic and uses a snap-on design. When installed, its
design allows for maximum airflow to maintain system cooling requirements. The front bezel includes a
keyed locking mechanism which can be used to prevent unauthorized access to installed storage devices
and front I/O ports.

Figure 10. Front Bezel

(Intel Product Order Code – A1UBEZEL)

The face of the bezel assembly includes snap-in identification badge options and a wave feature option to
allow for customization.

Figure 11. Front Bezel Accessory with Optionally Installed Wave Feature

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Intel® Server System R1000SPO Product Family TPS

Figure 12. Front Bezel Accessory with Optionally Installed Wave and ID Badge (1)

Figure 13. Front Bezel Accessory with Optionally Installed Wave and ID Badge (2)

Figure 14. Front Bezel Accessory ID Badge Mechanical Drawings

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Intel® Server System R1000SPO Product Family TPS

1.7”

2.8 System Dimensions

2.8.1 Chassis Dimensions

Figure 15. Chassis Dimensions

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Intel® Server System R1000SPO Product Family TPS

2.8.2 Label Emboss Dimensions

15

Figure 16. Label Emboss Dimensions

Intel® Server System R1000SPO Product Family TPS

2.8.3 Pull-out Tab Label Emboss Dimensions

Figure 17. Pull-out Tab Label Emboss Dimensions

2.9 Available Rack Mounting Kit Options

Advisory Note – Available rack and cabinet mounting kits are not designed to support shipment of the

server system while installed in a rack. If you chose to do so, Intel advises you verify your shipping
configuration with appropriate shock and vibration testing, before shipment. Intel does not perform shipping
tests which cover the complex combination of unique rack offerings and custom packaging options.

Caution: Exceeding the rail kit’s specified maximum weight limit or misalignment of the server in the rack
may result in failure of the rack rails, resulting in damage to the system or personal injury. Two people or the
use of a mechanical assist tool to install and align the server into the rack is highly recommended.

Available Rack mounting kits:

 AXXVPSRAIL – Vale plus short rail

- 424mm max travel length

- 129 lbs. (59 Kg) max support weight

- Front and rear mounting bracket adjustment distance: 609mm to 705mm

- Stab-in system install

- x8 #10-32 screws to mount rail kit on rack flange (screw kit come with rail kit assembling)

- No cable management arm support

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Intel® Server System R1000SPO Product Family TPS

Parameter

Limits

Temperature
Operating

ASHRAE Class A2 – Continuous Operation. 10º C to 35º C (50º F to 95º F) with the maximum
rate of change not to exceed 10°C per hour

ASHARE Class A3 – Includes operation up to 40°C for up to 900 hours per year. Refer to
Appendix E for detailed guidance.

Shipping

-40º C to 70º C (-40º F to 158º F)

Altitude

Operating

Support operation up to 3050m with ASHRAE class de-ratings.

Humidity

Shipping

50% to 90%, non-condensing with a maximum wet bulb of 28° C (at temperatures from 25°
C to 35° C)

Shock

Operating

Half sine, 2 g, 11 mSec

Unpackaged

Trapezoidal, 25 g, velocity change is based on packaged weight

Packaged

ISTA (International Safe Transit Association) Test Procedure 3A 2008

Vibration
Unpackaged

5 Hz to 500 Hz 2.20 g RMS random

Packaged

ISTA (International Safe Transit Association) Test Procedure 3A 2008

AC-DC

Voltage

90 V to 132 V and 180 V to 264 V

Frequency

47 Hz to 63 Hz

Source Interrupt

No loss of data for power line drop-out of 12 mSec

Surge Non­operating and
operating

Unidirectional

Line to earth Only

AC Leads 2.0 kV

I/O Leads 1.0 kV
DC Leads 0.5 kV

ESD
Air Discharged

12.0 kV

Contact Discharge

8.0 kV

Acoustics
Sound Power
Measured

Power in Watts

<300 W ≥300 W ≥600 W ≥1000 W

Servers/Rack
Mount Sound
Power Level (in
BA)

7.0 7.0 7.0 7.0

2.10 System Level Environmental Limits

The following table defines the system level operating and non-operating environmental limits.

Table 5. System Environmental Limits Summary

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