Intel Quad-Core Xeon 3300 Series, Xeon X3380, Xeon X3360, Xeon X3350, Xeon X3330 Datasheet

...

Download

Quad-Core Intel® Xeon® Processor 3300 Series

Datasheet

February 2009

Version -002

Document Number: 319005-002

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING T O SALE AND/OR USE OF INTEL PRODUCT S INCLUDING LIABILITY OR WARRANTIES RELA TING T O FITNES S FOR A PARTICULAR PURPOSE, MERCHANT ABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CR EA TE A SITUA TION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights

that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

The Quad-Core Intel® Xeon® Processor 3300 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

∆

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.

Intel® 64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel 64. Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http://www.intel.com/info/em64t for more information including details on which processors support Intel 64, or consult with your system vendor for more information.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM) and, for some uses, certain platform software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configur ations and may re quire a BIOS update. S oftware applicatio ns may not be compatible with all operating systems. Please check with your application vendor.

Not all specified units of this processor support Thermal Monitor 2, Enhanced HALT State and Enhanced Intel SpeedStep® Technology. See the Processor Spec Finder at http://processorfinder.intel.com or contact your Intel representative for more information.

Intel, Pentium, Xeon, Intel Core, Intel SpeedStep, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

2 Datasheet

Contents

1Introduction..............................................................................................................9

1.1 Terminology .......................................................................................................9

1.1.1 Processor Terminology Definitions ............................................................10

1.2 References.......................................................................................................11

2 Electrical Specifications...........................................................................................13

2.1 Power and Ground Lands....................................................................................13

2.2 Decoupling Guidelines ........................................................................................13

2.2.1 Vcc Decoupling ......................................................................................13

2.2.2 Vtt Decoupling.......................................................................................13

2.2.3 FSB Decoupling......................................................................................13

2.3 Voltage Identification.........................................................................................14

2.4 Reserved, Unused, and TESTHI Signals ................................................................16

2.5 Flexible Motherboard Guidelines (FMB)............................. ... .. .. ........................... ..16

2.6 Power Segment Identifier (PSID).........................................................................17

2.7 Voltage and Current Specification........................................................................17

2.7.1 Absolute Maximum and Minimum Ratings ..................................................17

2.7.2 DC Voltage and Current Specification.................................................... .. ..18

2.7.3 VCC Overshoot ......................................................................................21

2.7.4 Die Voltage Validation............................................................... ..............22

2.8 Signaling Specifications............................................ .. ........................................22

2.8.1 FSB Signal Groups..................................................................................22

2.8.2 CMOS and Open Drain Signals .................................................................24

2.8.3 Processor DC Specifications .....................................................................24

2.8.3.1 Platform Environment Control Interface (PECI) DC Specifications..... 26

2.8.3.2 GTL+ Front Side Bus Specifications.............................................26

2.9 Clock Specifications...........................................................................................28

2.9.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking............................28

2.9.2 FSB Frequency Select Signals (BSEL[2:0]).................................................29

2.9.3 Phase Lock Loop (PLL) and Filter..............................................................29

2.9.4 BCLK[1:0] Specifications.........................................................................30

3 Package Mechanical Specifications ..........................................................................33

3.1 Package Mechanical Specifications.......................................................................33

3.1.1 Package Mechanical Drawing........................................... .. .......................34

3.1.2 Processor Component Keep-Out Zones..................................... ... ..............38

3.1.3 Package Loading Specifications ................................................................38

3.1.4 Package Handling Guidelines.............................. .. ............................ .. .. .. ..38

3.1.5 Package Insertion Specifications.......................................... .. .. .................39

3.1.6 Processor Mass Specification....................................................................39

3.1.7 Processor Materials.................................................................................39

3.1.8 Processor Markings.................................................................................39

3.1.9 Processor Land Coordinates.....................................................................40

4 Land Listing and Signal Descriptions .......................................................................41

4.1 Processor Land Assignments...............................................................................41

4.2 Alphabetical Signals Reference............................................................................64

5 Thermal Specifications and Design Considerations ..................................................75

5.1 Processor Thermal Specifications.........................................................................75

5.1.1 Thermal Specifications............................................................................75

5.1.2 Thermal Metrology .................................................................................80

Datasheet 3

5.2 Processor Thermal Features ................................................................................80

5.2.1 Thermal Monitor.......................... .. .. .......................... .. ......................... ..80

5.2.2 Thermal Monitor 2 ...................................... ......................... .. .. ...............81

5.2.3 On-Demand Mode...................................................................................82

5.2.4 PROCHOT# Signal ................... ......................... .. .. .......................... .. .. ....83

5.2.5 THERMTRIP# Signal................................................................................83

5.3 Platform Environment Control Interface (PECI)......................................................83

5.3.1 Introduction...........................................................................................83

5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems..................84

5.3.2 PECI Specifications .................................................................................84

5.3.2.1 PECI Device Address............................ .. .......................... .. ........84

5.3.2.2 PECI Command Support......................... .. .......................... .. ......84

5.3.2.3 PECI Fault Handling Requirements...............................................84

5.3.2.4 PECI GetTemp0() Error Code Support ......................... .. ...............85

6Features..................................................................................................................87

6.1 Power-On Configuration Options..........................................................................87

6.2 Clock Control and Low Power States........................... .. .. ............................ ..........87

6.2.1 Normal State .........................................................................................88

6.2.2 HALT and Extended HALT Powerdown States..............................................88

6.2.2.1 HALT Powerdown State.................................................. .. .. ........88

6.2.2.2 Extended HALT Powerdown State ................................................89

6.2.3 Stop Grant State ....................................................................................89

6.2.4 Extended HALT Snoop or HALT Snoop State,

Stop Grant Snoop State...........................................................................89

6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................90

6.2.4.2 Extended HALT Snoop State .......................................................90

6.2.5 Enhanced Intel SpeedStep

Technology .......................................... ..........90

6.2.6 Processor Power Status Indicator (PSI) Signal ............................................90

7 Boxed Processor Specifications................................................................................91

7.1 Introduction......................................................................................................91

7.2 Mechanical Specifications....................................................................................92

7.2.1 Boxed Processor Cooling Solution Dimensions.............................................92

7.2.2 Boxed Processor Fan Heatsink Weight .......................................................94

7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....94

7.3 Electrical Requirements ....................... .. .. ................................................... .. .. .. ..94

7.3.1 Fan Heatsink Power Supply.................................. .. ... .. ........................... ..94

7.4 Thermal Specifications........................... ........................... ..................................96

7.4.1 Boxed Processor Cooling Requirements......................................................96

7.4.2 Variable Speed Fan............................ .......................... .. .........................98

8 Debug Tools Specifications ....................................................................................101

8.1 Logic Analyzer Interface (LAI) ...........................................................................101

8.1.1 Mechanical Considerations .....................................................................101

8.1.2 Electrical Considerations........................................................................ 101

Figures

2-1 VCC Static and Transient Tolerance.........................................................................20

2-2 V

2-3 Differential Clock Waveform.................. .. .. ........................... ... .. ........................... ..31

2-4 Measurement Points for Differential Clock Waveforms ...............................................31

3-1 Processor Package Assembly Sketch.......................................................................33

3-2 Processor Package Drawing Sheet 1 of 3 ........................... ............................ .. ........35

3-3 Processor Package Drawing Sheet 2 of 3 ........................... ............................ .. ........36

3-4 Processor Package Drawing Sheet 3 of 3 ........................... ............................ .. ........37

3-5 Processor Top-Side Markings Example.....................................................................39

4 Datasheet

Overshoot Example Waveform .........................................................................21

3-6 Processor Land Coordinates and Quadrants, Top View...............................................40

4-1 land-out Diagram (Top View – Left Side).................................................................42

4-2 land-out Diagram (Top View – Right Side)...............................................................43

5-1 Quad-Core Intel

® Xeon® Processor 3300 Series

Thermal Profile(95W)................................78

5-2 Quad-Core Intel® Xeon® Processor 3300 Series Thermal Profile (65W) ................ ....... 79

5-3 Case Temperature (TC) Measurement Location ........................................................80

5-4 Thermal Monitor 2 Frequency and Voltage Ordering..................................................82

5-5 Conceptual Fan Control Diagram on PECI-Based Platforms ........................................84

6-1 Processor Low Power State Machine.......................................................................88

7-1 Mechanical Representation of the Boxed Processor ...................................................91

7-2 Side View Space Requirements for the Boxed Processor............................................92

7-3 Top View Space Requirements for the Boxed Processor.............................................93

7-4 Overall View Space Requirements for the Boxed Processor ........................................93

7-5 Boxed Processor Fan Heatsink Power Cable Connector Description..............................95

7-6 Baseboard Power Header Placement Relative to Processor Socket...............................96

7-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view)...............97

7-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view)...............98

7-9 Boxed Processor Fan Heatsink Set Points................................................................99

Tables

1-1 References..........................................................................................................11

2-1 Voltage Identification Definition .............................................................................14

2-2 Absolute Maximum and Minimum Ratings................................................................17

2-3 Voltage and Current Specifications.........................................................................18

2-4 V

2-5 VCC Overshoot Specifications.................................................................................21

2-6 FSB Signal Groups...............................................................................................23

2-7 Signal Characteristics...........................................................................................24

2-8 Signal Reference Voltages.....................................................................................24

2-9 GTL+ Signal Group DC Specifications .....................................................................24

2-10 Open Drain and TAP Output Signal Group DC Specifications.......................................25

2-11 CMOS Signal Group DC Specifications.....................................................................25

2-12 PECI DC Electrical Limits.......................................................................................26

2-13 GTL+ Bus Voltage Definitions................................................................................27

2-14 Core Frequency to FSB Multiplier Configuration........................................................28

2-15 BSEL[2:0] Frequency Table for BCLK[1:0]...............................................................29

2-16 Front Side Bus Differential BCLK Specifications ........................................................30

2-17 FSB Differential Clock Specifications (1333 MHz FSB) ................................ ............... 30

3-1 Processor Loading Specifications............................................................................38

3-2 Package Handling Guidelines.................................................................................38

3-3 Processor Materials..............................................................................................39

4-1 Alphabetical Land Assignments..............................................................................44

4-2 Numerical Land Assignment .............................................. ... .. .. .............................54

4-3 Signal Description................................................................................................64

5-1 Processor Thermal Specifications ...........................................................................76

5-2 Quad-Core Intel 5-3 Quad-Core Intel

5-4 GetTemp0() Error Codes.......................................................................................85

6-1 Power-On Configuration Option Signals...................................................................87

7-1 Fan Heatsink Power and Signal Specifications ..........................................................95

7-2 Fan Heatsink Power and Signal Specifications ..........................................................99

Static and Transient Tolerance.........................................................................19

® Xeon® Processor 3300 Series ® Xeon® Processor 3300 Series

Thermal Profile (95W)...............................77

Thermal Profile (65W)...............................79

Datasheet 5

Revision History

Document

Number

319005 1.0 -001 • Initial release

Version

Number

Revision Description

• Added Quad-Core Intel® Xeon® Processor

-002

X3380 & L3360

• Updated VID information

• Added PSI# Signal

Revision

Date

January

2008

February

2009

6 Datasheet

Quad-Core Intel® Xeon® Processor 3300 Series Features

• Available at 3.16 GHz, 3.00 GHz, 2.83 GHz,

2.66 GHz, and 2.50 GHz (Quad-Core Intel Xeon® Processor 3300 Series)

• Enhanced Intel Speedstep

•Supports Intel

64 architecture

Virtualization Technology

Technology

• Supports Execute Disable Bit capability

• FSB frequency at 1333 MHz

• Binary compatible with applications running on previous members of the Intel microprocessor line

• Advance Dynamic Execution

• Enhanced branch prediction

• Very deep out-of-order execution

• Optimized for 32-bit applications running on advanced 32-bit operating systems

•Intel

Advanced Smart Cache

• Two 6 MB Level 2 caches (Quad-Core Intel Xeon® Processor X3350, X3360)

• Two 3 MB Level 2 caches (Quad-Core Intel Xeon® Processor X3320)

•Intel

Advanced Digital Media Boost

• Enhanced floating point and multimedia unit for enhanced video, audio, encryption, and 3D performance

• Power Management capabilities

• System Management mode

• Multiple low-power states

• 8-way cache associativity provides improved cache hit rate on load/store operations

• 775-land Package

The Quad-Core Intel® Xeon® Processor 3300 Series deliver Intel's advanced, powerful processors for desktop PCs. The processor is designed to deliver performance across applications and usages where end-users can truly appreciate and experience the performance. These applications include Internet audio and streaming video, image processing, video content creation, speech, 3D, CAD, games, multimedia, and multitasking user environments.

Intel® 64 architecture enables the processor to execute operating systems and applications written to take advantage of the Intel 64 architecture. The processor, supporting Enhanced Intel Speedstep

technology, allows tradeoffs to be made between performance and power consumption.

The Quad-Core Intel

Xeon® Processor 3300 Series also includes the Execute Disable Bit capability. This feature, combined with a supported operating system, allows memory to be marked as executable or non-executable.

The Quad-Core Intel

Xeon® Processor 3300 Series support Intel® Virtualization Technology. Virtualization Technology provides silicon-based functionality that works together with compatible Virtual Machine Monitor (VMM) software to improve on software-only solutions.

Datasheet 7

8 Datasheet

Introduction

1 Introduction

The Quad-Core Intel® Xeon® Processor 3300 Series, like the Quad-Core Intel® Xeon® Processor 3200 Series, is a based on the Intel® CoreTM microarchitecture. The Intel Core microarchitecture combines the performance of previous generation Desktop products with the power efficiencies of a low-power microarchitecture to enable smaller, quieter systems.The Quad-Core Intel® Xeon® Processor 3300 Series are 64bit processors that maintain compatibility with IA-32 software.

The processor utilizes Flip-Chip Land Grid Array (FC-LGA6) package technology, and plug into a 775-land surface mount, Land Grid Array (LGA) socket, referred to as the LGA775 socket.

Note: In this document the Quad-Core Intel® Xeon® Processor 3300 Series may be referred

to simply as "the processor."

Note: The Quad-Core Intel® Xeon® Processor 3300 Series refers to X3380, X3360, X3350,

X3330, X3320, L3360. The processor is a quad-core processor, based on 45 nm process technology. The

processor features the Intel cache that significantly reduces latency to frequently used data. The processors feature a 1333 MHz front side bus (FSB) and either two independent but shared 6 MB of L2 cache (2x6M) or two independent but shared 3 MB of L2 cache (2x3M).The processor supports all the existing Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3), Supplemental Streaming SIMD Extension 3 (SSSE3), and the Streaming SIMD Extensions 4.1 (SSE4.1). The processor supports several Advanced Technologies: Execute Disable (XD) Bit, Intel Intel SpeedStep

The processor's front side bus (FSB) utilizes a split-transaction, deferred reply protocol. The FSB uses Source-Synchronous Transfer of address and data to improve performance by transferring data four times per bus clock (4X data transfer rate). Along with the 4X data bus, the address bus can deliver addresses two times per bus clock and is referred to as a "double-clocked" or 2X address bus. Working together, the 4X data bus and 2X address bus provide a data bus bandwidth of up to 10.7 GB/s.

The processor use some of the infrastructure already enabled by 2005 FMB platforms including heatsink, heatsink retention mechanism, and socket. Manufacturability is a high priority; hence, mechanical assembly may be completed from the top of the baseboard and should not require any special tooling.

Technology, and Intel® Virtualization Technology (Intel® VT).

1.1 Terminology

A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the active state when driven to a low level. For example, when RESET# is low, a reset has been requested. Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where the name does not imply an active state but describes part of a binary sequence (such as address or data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).

Advanced Smart Cache, a shared multi-core optimized

64 architecture (Intel® 64), Enhanced

“Front Side Bus” refers to the interface between the processor and system core logic (a.k.a. the chipset components). The FSB is a multiprocessing interface to processors, memory, and I/O.

Datasheet

1.1.1 Processor Terminology Definitions

Commonly used terms are explained here for clarification:

• Quad-Core Intel® Xeon® Processor 3300 Series — Quad core processor in the FC-LGA6 package with two 6 MB L2 cache or two 3 B L2 cache.

• Processor — For this document, the term processor is the generic form of the Quad-Core Intel® Xeon® Processor 3300 Series.

• Intel

• Keep-out zone — The area on or near the processor that system design can not

• Processor core — Processor die with integrated L2 cache.

• LGA775 socket — The processor mates with the system board through a surface

• Integrated heat spreader (IHS) —A component of the processor package used

• Retention mechanism (RM) — Since the LGA775 socket does not include any

• FSB (Front Side Bus) — The electrical interface that connects the processor to

• Storage conditions — Refers to a non-operational state. The processor may be

• Functional operation — Refers to normal operating conditions in which all

• Execute Disable (XD) Bit — XD allows memory to be marked as executable or

• Intel

• Enhanced Intel SpeedStep

• Intel® Virtualization Technology (Intel® VT) — A set of hardware

CoreTM microarchitecture — A new foundation for Intel® architecture-

based desktop, mobile and mainstream server multi-core processors. For additional information refer to: http://www.intel.com/technology/architecture/coremicro/

utilize.

mount, 775-land, LGA socket.

to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

mechanical features for heatsink attach, a retention mechanism is required. Component thermal solutions should attach to the processor via a retention mechanism that is independent of the socket.

the chipset. Also referred to as the processor system bus or the system bus. All memory and I/O transactions as well as interrupt messages pass between the processor and chipset over the FSB.

installed in a platform, in a tray , or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor lands should not be connected to any supply voltages, have any I/Os biased, or receive any clocks. Upon exposure to “free air”(i.e., unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material.

processor specifications, including DC, AC, system bus, signal quality, mechanical and thermal are satisfied.

non-executable, when combined with a supporting operating system. If code attempts to run in non-executable memory the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer over run vulnerabilities and can thus help improve the overall security of the system. See the Intel® Architecture Software Developer's Manual for more detailed information.

64 Architecture — An enhancement to Intel's IA-32 architec ture, allowing

the processor to execute operating systems and applications written to take advantage of Intel 64 architecture. Further details on Intel 64 architecture and programming model can be found in the Software Developer Guide at http:// developer.intel.com/technology/64bitextensions/.

Technology — Enhanced Intel SpeedStep

Te chnology allows trade-offs to be made between performance and power consumptions, based on processor utilization. This may lower average power consumption (in conjunction with OS support).

enhancements to Intel server and client platforms that can improve virtualization solutions. Intel VT will provide a foundation for widely-deployed virtualization

Introduction

10 Datasheet

Introduction

solutions and enables more robust hardware assisted virtualization solutions. More information can be found at: http://www.intel.com/technology/virtualization/

• Platform Environment Control Interface (PECI) — A proprietary one-wire bus interface that provides a communication channel between the processor and chipset components to external monitoring devices.

1.2 References

Material and concepts available in the following documents may be beneficial when reading this document:

Table 1-1. References

Quad-Core Intel® Xeon® Processor 3300 Series Thermal and Mechanical Design Guidelines Addendum

Quad-Core Intel® Xeon® Processor 3300 Series Specification Update

Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket

LGA775 Socket Mechanical Design Guide

IA-32 Intel Architecture Software Developer's Manual

Volume 1: Basic Architecture Volume 2A: Instruction Set Reference, A-M Volume 2B: Instruction Set Reference, N-Z Volume 3A: System Programming Guide, Part 1 Volume 3B: System Programming Guide, Part 2

Document Location

http://www.intel.com/

products/processor/

xeon3000/

documentation.htm#therma

l_models

http://download.intel.com/

design/intarch/specupdt/

319007.pdf

http://www.intel.com/

design/processor/applnots/

313214.htm

http://intel.com/design/ Pentium4/guides/

302666.htm

http://www.intel.com/

products/processor/

manuals/

Datasheet

Introduction

12 Datasheet

Electrical Specifications

2 Electrical Specifications

2.1 Power and Ground Lands

The processor has VCC (power), VTT, and VSS (ground) inputs for on-chip power distribution. All power lands must be connected to V connected to a system ground plane. The processor VCC lands must be supplied the voltage determined by the Voltage IDentification (VID) lands.

The signals denoted as VTT provide termination for the front side bus and power to the I/O buffers. A separate supply must be implemented for these lands, that meets the V

specifications outlined in Table 2-3.

2.2 Decoupling Guidelines

Due to its large number of transistors and high internal clock speeds, the processor is capable of generating large current swings. This may cause voltages on power planes to sag below their minimum specified values if bulk decoupling is not adequate. Larger bulk storage (C current during longer lasting changes in current demand by the component, such as coming out of an idle condition. Similarly, they act as a storage well for current when entering an idle condition from a running condition. The motherboard must be designed to ensure that the voltage provided to the processor remains within the specifications listed in Table 2-3. Failure to do so can result in timing violations or reduced lifetime of the component. For further information and guidelines, refer to the appropriate platform design guidelines.

2.2.1 VCC Decoupling

VCC regulator solutions need to provide sufficient decoupling capacitance to satisfy the processor voltage specifications. This includes bulk capacitance with low effective series resistance (ESR) to keep the voltage rail within specifications during large swings in load current. In addition, ceramic decoupling capacitors are required to filter high frequency content generated by the front side bus and processor activity. Consult the

Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket and appropriate platform design guidelines for further

information.

), such as electrolytic or aluminum-polymer capacitors, supply

BULK

, while all VSS lands must be

2.2.2 VTT Decoupling

Decoupling must be provided on the motherboard. Decoupling solutions must be sized to meet the expected load. To ensure compliance with the specifications, various factors associated with the power delivery solution must be considered including regulator type, power plane and trace sizing, and component placement. A conservative decoupling solution would consist of a combination of low ESR bulk capacitors and high frequency ceramic capacitors. For further information regarding power delivery, decoupling and layout guidelines, refer to the appropriate platform design guidelines.

2.2.3 FSB Decoupling

The processor integrates signal termination on the die. In addition, some of the high frequency capacitance required for the FSB is included on the processor package. However, additional high frequency capacitance must be added to the motherboard to

Datasheet

properly decouple the return currents from the front side bus. Bulk decoupling must also be provided by the motherboard for proper [A]GTL+ bus operation. Decoupling guidelines are described in the appropriate platform design guidelines.

2.3 Voltage Identification

The Voltage Identification (VID) specification for the processor is defined by the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket. The voltage set by the VID signals is the reference VR output voltage

to be delivered to the processor VCC lands (see Chapter 2.7.3 for V specifications). Refer to Table 2-11 for the DC specifications for these signals. Voltages for each processor frequency is provided in Table 2-3.

NOTE: To support the Deeper Sleep State the platform must use a VRD 11.1 compliant solution. The Deeper Sleep State also requires additional platform support. Refer to the platform design guide and the Voltage Regulator-Down (VRD) 11.1 Processor Power Delivery Design Guidelines for further details.

Individual processor VID values may be calibrated during manufacturing such that two devices at the same core speed may have different default VID settings. This is reflected by the VID Range values provided in Table 2-3. Refer to the Processor Specification Update for further details on specific valid core frequency and VID values of the processor. Note that this differs from the VID employed by the processor during a power management event (Thermal Monitor 2, Enhanced Intel SpeedStep technology, or Extended HALT State).

Electrical Specifications

overshoot

The processor uses eight voltage identification signals, VID[7:0], to support automatic selection of power supply voltages. Table 2-1 specifies the voltage level corresponding to the state of VID[7:0]. A ‘1’ in this table refers to a high voltage level and a ‘0’ refers to a low voltage level. If the processor socket is empty (VID[7:0] = 11111110), or the voltage regulation circuit cannot supply the voltage that is requested, it must disable itself.

The processor provides the ability to operate while transitioning to an adjacent VID and its associated processor core voltage (V line. It should be noted that a low-to-high or high-to-low voltage state change may

). This will represent a DC shift in the load

result in as many VID transitions as necessary to reach the target core voltage. T ransitions abo ve the specified VID are not permitted. Table 2-3 includes VID step sizes and DC shift ranges. Minimum and maximum v oltages must be maintained as shown in

Table 2-4 and Figure 2-1as measured across the VCC_SENSE and VSS_SENSE lands.

The VRM or VRD utilized must be capable of regulating its output to the value defined by the new VID. DC specifications for dynamic VID transitions are included in Table 2-3 and Table 2-4. Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for further details.

Table 2-1. Voltage Identification Def inition

VID7VID6VID5VID4VID3VID2VID1VID

00000000 OFF 010111001.0375 00000010 1.6 01011110 1.025

000001001.5875 011000001.0125 00000110 1.575 01100010 1

000010001.5625 011001000.9875 00001010 1.55 01100110 0.975

000011001.5375 011010000.9625

Voltage

VID7VID6VID5VID4VID3VID2VID1VID

Voltage

14 Datasheet

Electrical Specifications

VID7VID6VID5VID4VID3VID2VID1VID

Voltage

VID7VID6VID5VID4VID3VID2VID1VID

Voltage

00001110 1.525 01101010 0.95

000100001.5125 011011000.9375 00010010 1.5 01101110 0.925

000101001.4875 011100000.9125 00010110 1.475 01110010 0.9

000110001.4625 011101000.8875 00011010 1.45 01110110 0.875

000111001.4375 011110000.8625 00011110 1.425 01111010 0.85

001000001.4125 011111000.8375 00100010 1.4 01111110 0.825

001001001.3875 100000000.8125 00100110 1.375 10000010 0.8

001010001.3625 100001000.7875 00101010 1.35 10000110 0.775

001011001.3375 100010000.7625 00101110 1.325 10001010 0.75

001100001.3125 100011000.7375 00110010 1.3 10001110 0.725

001101001.2875 100100000.7125 00110110 1.275 10010010 0.7

001110001.2625 100101000.6875 00111010 1.25 10010110 0.675

001111001.2375 100110000.6625 00111110 1.225 10011010 0.65

010000001.2125 100111000.6375 01000010 1.2 10011110 0.625

010001001.1875 101000000.6125 01000110 1.175 10100010 0.6

010010001.1625 101001000.5875 01001010 1.15 10100110 0.575

010011001.1375 101010000.5625 01001110 1.125 10101010 0.55

010100001.1125 101011000.5375 01010010 1.1 10101110 0.525

010101001.0875 101100000.5125 01010110 1.075 10110010 0.5

010110001.0625 11111110 OFF 01011010 1.05

Datasheet

2.4 Reserved, Unused, and TESTHI Signals

All RESERVED lands must remain unconnected. Connection of these lands to VCC, VSS,

or to any other signal (including each other) can result in component malfunction

TT ,

or incompatibility with future processors. See Chapter 4 for a land listing of the processor and the location of all RESERVED lands.

In a system level design, on-die termination has been included by the processor to allow signals to be terminated within the processor silicon. Most unused GTL+ inputs should be left as no connects as GTL+ termination is provided on the processor silicon. However, see Table 2-6 for details on GTL+ signals that do not include on-die termination.

Electrical Specifications

Unused active high inputs, should be connected through a resistor to ground (V Unused outputs can be left unconnected, however this may interfere with some TAP

functions, complicate debug probing, and prevent boundary scan testing. A resistor must be used when tying bidirectional signals to power or ground. When tying any signal to power or ground, a resistor will also allow for system testability. Resistor values should be within ± 20% of the impedance of the motherboard trace for front side bus signals. For unused GTL+ input or I/O signals, use pull-up resistors of the same value as the on-die termination resistors (R

). For details see Table 2-13.

TAP and CMOS signals do not include on-die termination. Inputs and utilized outputs must be terminated on the motherboard. Unused outputs may be terminated on the motherboard or left unconnected. Note that leaving unused outputs unterminated may interfere with some TAP functions, complicate debug probing, and prevent boundary scan testing. Signal termination for these signal types is discussed in the appropriate platform design guidelines.

All TESTHI[13,11:10:7:0] lands should be individually connected to V resistor which matches the nominal trace impedance.

via a pull-up

The TESTHI signals may use individual pull-up resistors or be grouped together as detailed below. A matched resistor must be used for each group:

•TESTHI[1:0]

•TESTHI[7:2]

• TESTHI10 – cannot be grouped with other TESTHI signals

• TESTHI11 – cannot be grouped with other TESTHI signals

• TESTHI13 – cannot be grouped with other TESTHI signals

Terminating multiple TESTHI pins together with a single pull-up resistor is not recommended for designs supporting boundary scan for proper Boundary Scan testing of the TESTHI signals. For optimum noise margin, all pull-up resistor values used for TESTHI[13, 11:10,7:0] lands should have a resistance value within ± 20% of the impedance of the board transmission line traces. For example, if the nominal trace impedance is 50

2.5 Flexible Motherboard Guidelines (FMB)

The Flexible Motherboard (FMB) guidelines are estimates of the maximum values the processor will have over certain time periods. The values are only estimates and actual specifications for future processors may differ. Processors may or may not have specifications equal to the FMB value in the foreseeable future. System designers should meet the FMB values to ensure their systems will be compatible with future processors. The FMB values are shown in Table 2-3 and Table 5-1.

16 Datasheet

Ω, then a value between 40 Ω and 60 Ω should be used.

Electrical Specifications

2.6 Power Segment Identifier (PSID)

Power Segment Identifier (PSID) is a mechanism to prevent booting under mismatched power requirement situations. The PSID mechanism enables BIOS to detect if the processor in use requires more power than the platform voltage regulator (VR) is capable of supplying. For example, a 130W TDP processor installed in a board with a 65W or 95W TDP capable VR may draw too much power and cause a potential VR issue.

2.7 Voltage and Current Specification

2.7.1 Absolute Maximum and Minimum Ratings

Table 2-2 spe cifies absolute maximum and minimum ratings only and lie outside the

functional limits of the processor. Within functional operation limits, functionality and long-term reliability can be expected.

At conditions outside functional operation condition limits, but within absolute maximum and minimum ratings, neither functionality nor long-term reliability can be expected. If a device is returned to conditions within functional operation limits after having been subjected to conditions outside these limits, but within the absolute maximum and minimum ratings, the device may be functional, but with its lifetime degraded depending on exposure to conditions exceeding the functional operation condition limits.

At conditions exceeding absolute maximum and minimum ratings, neither functionality nor long-term reliability can be expected. Moreover, if a device is subjected to these conditions for any length of time then, when returned to conditions within the functional operating condition limits, it will either not function, or its reliability will be severely degraded.

Although the processor contains protective circuitry to resist damage from static electric discharge, precautions should always be taken to avoid high static voltages or electric fields.

Table 2-2. Absolute Maximum and Minimum Ratings

Symbol Parameter Min Max Unit Notes

CASE

STORAGE

NOTES:

1. For functional operation, all processor electrical, signal quality, mechanical and thermal

2. Overshoot and undershoot voltage guidelines for input, output and I/O signals are outlined

3. Storage temperature is applicable to storage conditions only. In this scenario, the

Core voltage with respect to V

FSB termination voltage with respect to V

Processor case temperature See Section 5

Processor storage temperature

specifications must be satisfied.

in Chapter 3. Excessive overshoot or undershoot on any signal will likely result in permanent damage to the processor.

processor must not receive a clock, and no lands can be connected to a voltage bias.

–0.3 1.45 V -

See

Section 5

–40 85 °C 3, 4, 5

°C -

1, 2

Datasheet

Storage within these limits will not affect the long-term reliability of the device . For functional operation, refer to the processor case temperature specifications.

4. This rating applies to the processor and does not include any tray or packaging.

5. Failure to adhere to this specif ication can affect the long term reliability of the processor.

2.7.2 DC Voltage and Current Specification

Table 2-3. Voltage and Current Specifications

Electrical Specifications

Symbol Parameter Min Typ Max Unit

VID Range VID 0.8500 - 1.3625 V 1

Processor Number

for 775_VR_CONFIG_05A

(95W) 775_VR_CONFIG_06A (65W)

3.16 GHz (12MB Cache)

3.00 GHz (12MB Cache)

2.83 GHz (12MB Cache)

2.66 GHz (6MB Cache)

2.83 GHz (12MB Cache)

2.66 GHz (12MB Cache)

2.50 GHz (6MB Cache)

for 775_VR_CONFIG_05A

(95W)

Refer to Table 2-4 and

Figure 2-1

- 5% 1.50 + 5%

Core

CC_BOOT

CCPLL

X3380

X3370

L3360

X3330 X3360 X3350 X3320

Default VCC voltage for initial power up - 1.10 - V PLL V

Processor Number

775_VR_CONFIG_06A (65W)

X3380

X3370

L3360

X3330 X3360 X3350 X3320

FSB termination voltage (DC + AC specifications)

3.16 GHz (12MB Cache)

3.00 GHz (12MB Cache)

2.83 GHz (12MB Cache)

2.66 GHz (6MB Cache)

2.83 GHz (12MB Cache)

2.66 GHz (12MB Cache)

2.50 GHz (6MB Cache)

- - 100 A 6, 7

1.045 1.10 1.155 V 8, 9

VTT_OUT_LEFT and VTT_OUT_RIGHT I

CC_VCCPLL

CC_GTLREF

DC Current that may be drawn from VTT_OUT_LEFT and VTT_OUT_RIGHT per land

ICC for VTT supply before VCC stable

for VTT supply after VCC stable

- - 580 mA

8.0

7.0

A10

ICC for PLL land 130 mA ICC for GTLREF - - 200 µA

Notes

2, 11

3, 4, 5

NOTES:

1. Each processor is programmed with a maximum valid voltage identification value (VID), which is set at manufacturing and can not be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have

18 Datasheet

Electrical Specifications

2. Unless other w ise noted, all specifications in this table are based on estima tes and

3. These voltages are targets only. A variable voltage source should exist on systems in the

4. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE

5. Refer to Table 2-4 and Figure 2-1 for the minimum, typical, and maximum V

6. FMB is the Flexi b le Motherboard guideline. These guidelines are for estimation purpose s

7. I

8. V

9. Baseboard bandwidth is limited to 20 M H z.

10. This is the maximum total current drawn from the V

11. Adherence to the voltage specifications for the processor are required to ensure reliable

different settings within the VID range. Note that this differ s from the VID employed by the processor during a power management event (Thermal Monitor 2, Enhanced Intel SpeedStep

Technology, or Extended HALT State).

simulations or empirical data. These specifications will be updated with characterized data from silicon measurements at a later date.

event that a different voltage is required. See Section 2.3 and Table 2-1 for more information.

lands at the socket with a 100MHz bandwidth oscilloscope, 1.5 pF maxi mum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.

allowed for a given current. The processor should not be subjected to any V wherein V

exceeds V

for a given current.

CC_MAX

and ICC combination

only. See Section 2.5 for further details on FMB guidelines.

specification is based on V

CC_MAX

must be provided via a separate voltage source and not be connected to VCC. This

specification is measured at the land.

specification does not include the current coming from on-board termination (R through the signal line. Refer to the appropriate platform design guide and the Voltage

loadline. Refer to Figure 2-1 for details.

CC_MAX

plane by only the processor. This

Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket to determine the total I

design characterization and is not tested.

drawn by the system. This parameter is based on

processor operation.

Table 2-4. VCC Static and Transient Tolerance

Voltage Deviation from VID Setting (V)

ICC (A)

0 0.000 -0.019 -0.038

5 -0.007 -0.026 -0.045 10 -0.013 -0.033 -0.053 15 -0.020 -0.040 -0.060 20 -0.026 -0.047 -0.067 25 -0.033 -0.053 -0.074 30 -0.039 -0.060 -0.082 35 -0.046 -0.067 -0.089 40 -0.052 -0.074 -0.096 45 -0.059 -0.081 -0.103 50 -0.065 -0.088 -0.111 55 -0.072 -0.095 -0.118 60 -0.078 -0.102 -0.125 65 -0.085 -0.108 -0.132 70 -0.091 -0.115 -0.140 75 -0.098 -0.122 -0.147 80 -0.101 -0.126 -0.151

Maximum Voltage

1.30 mΩ

Typical Voltage

1.38 mΩ

1, 2, 3, 4

Minimum Voltage

1.45 mΩ

Datasheet

Table 2-4. VCC Static and Transient Tolerance (Continued)

Voltage Deviation from VID Setting (V)

ICC (A)

85 -0.111 -0.136 -0.161 90 -0.117 -0.143 -0.169 95 -0.124 -0.150 -0.176

100 -0.130 -0.157 -0.183

NOTES:

1. The loadline specification includes both static and transient limits except for overshoot allowed as shown in Section 2.7.3.

2. This table is intended to aid in reading discrete points on Figure 2-1.

3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be tak en from processor VCC and VSS lands. Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for socket loadline guidelines and VR implementation details.

4. Adherence to this loadline specification is required to ensure reliable processor operation.

Maximum Voltage

1.30 mΩ

Typical Voltage

1.38 mΩ

Electrical Specifications

1, 2, 3, 4

Minimum Voltage

1.45 mΩ

Figure 2-1. VCC Static and Transient Tolerance

VID - 0.000

VID - 0.013

VID - 0.025

VID - 0.038

VID - 0.050

VID - 0.063

VID - 0.075

VID - 0.088

VID - 0.100

Vcc [V]

VID - 0.113

VID - 0.125

VID - 0.138

VID - 0.150

VID - 0.163

VID - 0.175

VID - 0.188

0 102030405060708090100

Vcc Typical

Vcc Minimum

Icc [A]

Vcc Maximum

NOTES:

1. The loadline specification includes both static and transient limits except for overshoot allowed as shown in Section 2.7.3.

2. This loadline specification shows the deviation from the VID set point.

20 Datasheet

Electrical Specifications

3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer to the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for socket loadli ne guidelines and VR implementation details.

2.7.3 VCC Overshoot

The processor can tolerate short transient overshoot events where VCC exceeds the VID voltage when transitioning from a high to low current load condition. This overshoot cannot exceed VID + V The time duration of the overshoot event must not exceed T

OS_MAX

maximum allowable time duration above VID). These specifications apply to the processor die voltage as measured across the VCC_SENSE and VSS_SENSE lands.

Table 2-5. VCC Overshoot Specifications

Symbol Parameter Min Max Unit Figure Notes

OS_MAX

NOTES:

1. Adherence to these s pecifications is required to ensure reliable processor operation.

Magnitude of VCC overshoot above VID

Time duration of VCC overshoot above VID

OS_MAX

is the maximum allowable overshoot voltage).

OS_MAX

-50mV2-2

-25µs2-2

is the

Figure 2-2. VCC Overshoot Example Waveform

Example Overshoot Waveform

VID + 0.050

Voltage [V]

VID - 0.000

0 5 10 15 20 25

TOS: Overshoot time above VID V

: Overshoot above VID

NOTES:

1. V

2. T

is measured overshoot voltage.

is measured time duration above VID.

Time [us]

Datasheet

2.7.4 Die Voltage Validation

Overshoot events on processor must meet the specifications in Table 2-5 when measured across the VCC_SENSE and VSS_SENSE lands. Overshoot events that are < 10 ns in duration may be ignored. These measurements of processor die level overshoot must be taken with a bandwidth limited oscilloscope set to a greater than or equal to 100 MHz bandwidth limit.

2.8 Signaling Specifications

Most processor Front Side Bus signals use Gunning Transceiver Logic (GTL+) signaling technology. This technology provides improved noise margins and reduced ringing through low voltage swings and controlled edge rates. Platforms implement a termination voltage level for GTL+ signals defined as V separate power planes for each processor (and chipset), separate V are necessary. This configuration allows for improved noise tolerance as processor frequency increases. Speed enhancements to data and address busses have caused signal integrity considerations and platform design methods to become even more critical than with previous processor families. Design guidelines for the processor front side bus are detailed in the appropriate platform design guides (refer to Section 1.2).

The GTL+ inputs require a reference voltage (GTLREF) which is used by the receivers to determine if a signal is a logical 0 or a logical 1. GTLREF must be generated on the motherboard (see Table 2-13 for GTLREF specifications). Refer to the applicable platform design guidelines for details. Termination resistors (R provided on the processor silicon and are terminated to V provide on-die termination, thus eliminating the need to terminate the bus on the motherboard for most GTL+ signals.

Electrical Specifications

. Because platforms implement

. Intel chipsets will also

and V

supplies

) for GTL+ signals are

2.8.1 FSB Signal Groups

The front side bus signals have been combined into groups by buffer type. GTL+ input signals have differential input buffers, which use GTLREF[3:0] as a reference level. In this document, the term “GTL+ Input” refers to the GTL+ input group as well as the GTL+ I/O group when receiving. Similarly, “GTL+ Output” refers to the GTL+ output group as well as the GTL+ I/O group when driving.

With the implementation of a source synchronous data bus comes the need to specify two sets of timing parameters. One set is for common clock signals which are dependent upon the rising edge of BCLK0 (ADS#, HIT#, HITM#, etc.) and the second set is for the source synchronous signals which are relative to their respective strobe lines (data and address) as well as the rising edge of BCLK0. Asychronous signals are still present (A20M#, IGNNE#, etc.) and can become active at any time during the clock cycle. Table 2-6 identifies which signals are common clock, source synchronous, and asynchronous.

22 Datasheet

Electrical Specifications

Table 2-6. FSB Signal Groups

Signal Group Type Signals

GTL+ Common Clock Input

GTL+ Common Clock I/O

GTL+ Source Synchronous I/O

Synchronous to BCLK[1:0]

Synchronous to assoc. strobe

BPRI#, DEFER#, RESET#, RS[2:0]#, TRDY#

ADS#, BNR#, BPM[5:0]#, BPMb[3:0]#, BR0# DRDY#, HIT#, HITM#, LOCK#

Signals Associated Strobe

REQ[4:0]#, A[16:3]# A[35:17]#

ADSTB0#

ADSTB1# D[15:0]#, DBI0# DSTBP0#, DSTBN0# D[31:16]#, DBI1# DSTBP1#, DSTBN1# D[47:32]#, DBI2# DSTBP2#, DSTBN2# D[63:48]#, DBI3# DSTBP3#, DSTBN3#

, DBSY#,

GTL+ Strobes

CMOS

Synchronous to BCLK[1:0]

ADSTB[1:0]#, DSTBP[3:0]#, DSTBN[3:0]#

A20M#, DPSLP#, DPRSTP#, IGNNE#, INIT#, LINT0/ INTR, LINT1/NMI, SMI#

, STPCLK#, PWRGOOD, SLP#, TCK, TDI, TDI_M, TMS, TRST#, BSEL[2:0], VID[7:0],

PSI#

Open Drain Output

Open Drain Input/Output

FSB Clock Clock BCLK[1:0], ITP_CLK[1:0]

FERR#/PBE#, IERR#, THERMTRIP#, TDO, TDO_M

PROCHOT#

VCC, VTT, VCCA, VCCIOPLL, VCCPLL, VSS, VSSA, GTLREF[3:0], COMP[8,3:0], RESERVED,

Power/Other

TESTHI[13,11:10,7:0], VCC_SENSE, VCC_MB_REGULATION, VSS_SENSE, VSS_MB_REGULATION, DBR#

, VTT_OUT_LEFT,

VTT_OUT_RIGHT, VTT_SEL, FCx, PECI, MSID[1:0]

NOTES:

1. Refer to Section 4.2 for signal descriptions.

2. In processor systems where no debug port is implemented on the system board, the se signals are used to support a debug port interposer. In systems with the debug port implemented on the system board, these signals are no connects.

3. The value of these signals during the active-to-inactive edge of RESET# defines the processor configuration options. See Section 6.1 for details.

4. PROCHOT# signal type is open drain output and CMOS input.

Datasheet

Table 2-7. Signal Characteristics

Electrical Specifications

Signals with R

A[35:3]#, ADS#, ADSTB[1:0]#, BNR#, BPRI#, D[63:0]#, DBI[3:0]#, DBSY#, DEFER#, DRDY#, DSTBN[3:0]#, DSTBP[3:0]#, HIT#, HITM#, LOCK#, PROCHOT#, REQ[4:0]#, RS[2:0]#, TRDY#

Open Drain Signals

THERMTRIP#, FERR#/PBE#, IERR#, BPM[5:0]#, BPMb[3:0]#, BR0#, TDO, TDO_M, FCx

NOTES:

1. Signals that do not have R

Table 2-8. Signal Reference Voltages

GTLREF VTT/2

BPM[5:0]#, BPMb[3:0]#, RESET#, BNR#, HIT#, HITM#, BR0#, A[35:0]#, ADS#, ADSTB[1:0]#, BPRI#, D[63:0]#, DBI[3:0]#, DBSY#, DEFER#, DRDY#, DSTBN[3:0]#, DSTBP[3:0]#, LOCK#, REQ[4:0]#, RS[2:0]#, TRDY#

NOTE:

1. See Table 2-10 for more information.

Signals with No R

A20M#, BCLK[1:0], BSEL[2:0], COMP[8,3:0], FERR#/PBE#, IERR#, IGNNE#, INIT#, ITP_CLK[1:0], LINT0/INTR, LINT1/ NMI, MSID[1:0], PWRGOOD, RESET#, SMI#, STPCLK#, TDO, TDO_M, TESTHI[13,11:10,7:0], THERMTRIP#, VID[6:0], GTLREF[3:0], TCK, TDI, TDI_M, TMS, TRST#, VTT_SEL

, nor are actively driven to their high-voltage level.

A20M#, LINT0/INTR, LINT1/NMI, IGNNE#, INIT#, PROCHOT#, PWRGOOD TDI

, SMI#, STPCLK#, TCK1,

, TDI_M1, TMS1, TRST#

2.8.2 CMOS and Open Drain Signals

Legacy input signals such as A20M#, IGNNE#, INIT#, SMI#, and STPCLK# use CMOS input buffers. All of the CMOS and Open Drain signals are required to be asserted/ deasserted for at least eight BCLKs in order for the processor to recognize the proper signal state. See Section 2.8.3 for the DC specifications. See Section 6.2 for additional timing requirements for entering and leaving the low power states.

2.8.3 Processor DC Specifications

The processor DC specifications in this section are defined at the processor core (pads) unless otherwise stated. All specifications apply to all frequencies and cache sizes unless otherwise stated.

Table 2-9. GTL+ Signal Group DC Specifications

Symbol Parameter Min Max Unit Notes

24 Datasheet

Input Low Voltage -0.10 GTLREF - 0.10 V 2, 6

Input High Voltage GTLREF + 0.10 V

Output High Voltage V

Output Low Current N/A

- 0.10 V

[(R

TT_MIN

+ 0.10 V 3, 4, 6

V ) + (2 * R

TT_MAX

ON_MIN

)]

V4, 6

A-

Electrical Specifications

Table 2-9. GTL+ Signal Group DC Specifications

Symbol Parameter Min Max Unit Notes

Input Leakage

Current Output Leakage

Current Buffer On Resistance 7.49 9.16 Ω 5

N/A ± 100 µA 7

N/A ± 100 µA 8

NOTES:

1. Unless other wise noted, all specifications in this table apply to all processor frequencies.

2. V

3. V

is defined as the voltage range at a receiving agent that will be interpreted as a logical

low value.

is defined as the voltage r ange at a rec eiving age nt that will be interpreted as a logical

high value.

4. V

and VOH may experience excursions above VTT. However, input signal drivers must

comply with the signal quality specifi cations in Chapter 3.

5. Refer to processor I/O Buffer Models for I/V characteristics.

6. The V

7. Leakage to V

8. Leakage to V

referred to in these specifications is the instantaneous VTT.

with land held at VTT.

with land held at 300mV.

Table 2-10. Open Drain and TAP Output Signal Group DC Specifications

Symbol Parameter Min Max Unit Notes

I I

Output Low Voltage 0 0.20 V -

Output Low Current 16 50 mA 2

Output Leakage Current N/A ± 200 µA 3

NOTES:

1. Unless other wise noted, all specifications in this table apply to all processor frequencies.

2. Measured at V

3. For Vin between 0 and V

* 0.2V.

Table 2-11. CMOS Signal Group DC Specifications

Symbol Parameter Min Max Unit Notes

V V V

NOTES:

1. Unless other wise noted, all specifications in this table apply to all processor frequencies.

2. All outputs are open drain.

Input Low Voltage -0.10 VTT * 0.30 V 3, 6

Input High Voltage VTT * 0.70 V

Output Low Voltage -0.10 VTT * 0.10 V 6

Output High Voltage 0.90 * V

Output Low Current

Input Leakage Current N/A ± 100 µA 8

Output Leakage Current N/A ± 100 µA 9

* 0.10 / 67VTT * 0.10 /

+ 0.10 V 4, 5, 6

+ 0.10 V 2, 5, 6

A6, 7

Datasheet

Electrical Specifications

3. VIL is defined as the voltage range at a receiving agent that will be interpret ed as a l ogical low value.

4. V

5. V

6. The V

7. I

8. Leakage to VSS with land held at VTT.

9. Leakage to V

is defined as the voltage range at a receiving agent that will be int erpreted as a logic al

high value.

and VOH may experience excursions above VTT. However, input signal drivers must

comply with the signal quality specifications in Chapter 3.

referred to in these specifications refers to instantaneous VTT.

is measured at 0.10 * V

with land held at 300 mV.

is measured at 0.90 * V

TT. IOH

TT .

2.8.3.1 Platform Environment Control Interface (PECI) DC Specifications

PECI is an Intel proprietary one-wire interface that provides a communication channel between Intel processors, chipsets, and external thermal monitoring devices. The Yorkfield processor contains Digital Thermal Sensors (DTS) distributed throughout die. These sensors are implemented as analog-to-digital converters calibrated at the factory for reasonable accuracy to provide a digital representation of relative processor temperature. PECI provides an interface to relay the highest DTS temper ature within a die to external management devices for thermal/fan speed control. More detailed information may be found in the Platform Environment Control Interface (PECI)

Specification.

Table 2-12. PECI DC Electrical Limits

Symbol Definition and Conditions Min Max Units Notes

hysteresis

V V

source

sink

leak+

leak-

noise

NOTES:

1. V

refer to Table 2-3 for VTT specifications.

2. The leakage specification applies t o powered devices on the PECI bus.

3. The input buffers use a Schmitt-triggered input design for improved noise immunity.

4. One node is counted for each client and one node for the sy stem ho st. Ex tended trace lengths

might appear as additional nodes.

Input Voltage Range -0.15 V

Hysteresis 0.1 * V Negative-edge threshold voltage 0.275 * VTT0.500 * V

Positive-edge threshold voltage 0.550 * VTT0.725 * V

High level output source

= 0.75 * VTT)

Low level output sink

= 0.25 * VTT)

High impedance state leakage to V

-6.0 N/A mA

0.5 1.0 mA

N/A 50 µA

-V

High impedance leakage to GND N/A 10 µA 2 Bus capacitance per node -10pF4

bus

Signal noise immunity above 300 MHz 0.1 * V

-V

p-p

supplies the PECI interface. PECI behavior does not affect VTT min/max specifications. Please

2.8.3.2 GTL+ Front Side Bus Specifications

In most cases, termination resistors are not required as these are integrated into the processor silicon. See Table 2-7 for details on which GTL+ signals do not include on-die termination. Refer to the appropriate platform design guidelines for specific implementation details.

26 Datasheet

Electrical Specifications

Valid high and low levels are determined by the input buffers by comparing with a reference voltage called GTLREF. Table 2-13 lists the GTLREF specifications. The GTL+ reference voltage (GTLREF) should be generated on the system board using high precision voltage divider circuits. For more details on platform design, see the applicable platform design guide.

Table 2-13. GTL+ Bus Voltage Definitions

Symbol Parameter Min Typ Max Units Notes

GTLREF_PU GTLREF pull up resistor 57.6 * 0.99 57.6 57.6 * 1.01 Ω 2 GTLREF_PD GTLREF pull down resistor 100 * 0.99 100 100 * 1.01 Ω 2 R

COMP[3:0] COMP Resistance 49.40 49.90 50.40 Ω 4 COMP8 COMP Resistance 24.65 24.90 25.15 Ω 4

NOTES:

1. Unless other wise noted, all specifications in this table apply to all processor frequencies.

2. GTLREF is to be generated from VTT by a voltage divider of 1% resistors. If an Variable

3. R

4. COMP resistance must be provided on the system board with 1% resistors. See the

Termination Resistance 45 50 55 Ω 3

GTLREF circuit is used on the board the GTLREF lands connected to the Variable GTLREF circuit may require different resistor values. Each GTLREF land must be connected, refer to the platform design guide for implementation details.

is the on-die termination resistance measured at VTT/3 of the GTL+ output driver.

Refer to the appropriate platform design guide for the board impedance. Refer to processor I/O buffer models for I/V characteristics.

applicable platform design guide for implementation details. COMP[3:0] and COMP8 resistors are to V

Datasheet

Electrical Specifications

2.9 Clock Specifications

2.9.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking

BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the processor. As in previous generation processors, the processor’s core frequency is a multiple of the BCLK[1:0] frequency . The processor bus r atio multiplier will be set at its default ratio during manufacturing. The processor supports Half Ratios between 7.5 and 13.5, refer to Table 2-14 for the processor supported ratios.

The processor uses a differential clo cking implem entation. For more information on the processor clocking, contact your Intel field representative.

Table 2-14. Core Frequency to FSB Multiplier Configuration

Multiplication of

System Core

Frequency to FSB

Frequency

1/6 1/7

1/7.5

1/8

1/8.5

1/9

1/9.5

1/10

1/10.5

1/11

1/11.5

1/12

1/12.5

1/13

1/13.5

1/14 1/15

Core Frequency

(333 MHz BCLK/1333

MHz FSB)

2 GHz

2.33 GHz

2.50 GHz

2.66 GHz

2.83 GHz 3 GHz

3.16 GHz

3.33 GHz

3.50 GHz

3.66 GHz

3.83 GHz 4 GHz

4.16 GHz

4.33 GHz

4.50 GHz

4.66 GHz 5 GHz

Notes

1, 2

NOTES:

1. Individual processors operate only at or below the rated frequency.

2. Listed frequencies are not necessarily committed production frequencies.

2.9.2 FSB Frequency Select Signals (BSEL[2:0])

The BSEL[2:0] signals are used to select the frequency of the processor input clock (BCLK[1:0]). Table 2-15 defines the possible combinations of the signals and the frequency associated with each combination. The required frequency is determined by the processor, chipset, and clock synthesizer. All agents must operate at the same frequency.

28 Datasheet

Electrical Specifications

The Yorkfield processor will operate at a 1333 MHz FSB frequency (selected by a 333 MHz BCLK[1:0] frequency). Individual processors will only operate at their specified FSB frequency.

For more information about these signals, refer to Section 4.2 and the appropriate platform design guidelines.

Table 2-15. BSEL[2:0] Frequency Tab le for BCLK[1:0]

BSEL2 BSEL1 BSEL0 FSB Frequency

L L L RESERVED L L H RESERVED L H H RESERVED

L H L RESERVED H H L RESERVED H H H RESERVED H L H RESERVED HL L333 MHz

2.9.3 Phase Lock Loop (PLL) and Filter

An on-die PLL filter solution will be implemented on the processor. The VCCPLL input is used for the PLL. Refer to Table 2-3 for DC specifications. Refer to the appropriate platform design guidelines for decoupling and routing guidelines.

Datasheet

2.9.4 BCLK[1:0] Specifications

Table 2-16. Front Side Bus Differential BCLK Specifications

Symbol Parameter Min Typ Max Unit Figure Notes

V V

CROSS(abs)

∆V

CROSS

SWING

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. Crossing voltage is defined as the instantaneous voltage value when the rising edge of

3. “Steady state” voltage, not including overshoot or undershoot.

4. Overshoot is defined as the absolute value of the maximum voltage. Undershoot is defined

5. Measurement taken from differential waveform.

Input Low Voltage -0.30 N/A N/A V 2-3 3

Input High Voltage N/A N/A 1.15 V 2-3 3

Absolute Crossing Point

Range of Crossing Points

0.300 N/A 0.550 V 2-3 2

N/A N/A 0.140 V 2-3 -

Overshoot N/A N/A 1.4 V 2-3 4 Undershoot -0.300 N/A N/A V 2-3 4 Differential Output

Swing

0.300 N/A N/A V 2-4 5

BCLK0 equals the falling edge of BCLK1.

as the absolute value of the minimum voltage.

Electrical Specifications

Table 2-17. FSB Differential Clock Specifications (1333 MHz FSB)

T# Parameter Min Nom Max Unit Figure Notes

BCLK[1:0] Frequency 331.633 - 333.367 MHz - 7 T1: BCLK[1:0] Period 2.99970 - 3.01538 ns 2-3 2 T2: BCLK[1:0] Period Stability - - 150 ps 2-3 3, 4 T5: BCLK[1:0] Rise and Fall Slew

Rate Slew Rate Matching N/A N/A 20 % - 6

NOTES:

1. Unless otherwise noted, all specifications in this table apply to all processor core frequencies based on a 333 MHz BCLK[1:0].

2. The period specified here is the average period. A given period may vary from this specification as governed by the period stability specification (T2). Min period specification is based on -300 PPM deviation from a 3 ns period. Max period specification is based on the summation of +300 PPM deviation from a 3 ns period and a +0.5% maxi mum variance due to spread spectrum clocking.

3. For the clock jitter specification, refer to the CK505 Clock Synthesizer Specification.

4. In this context, period stability is defined as the worst case timing difference between successive crossover voltages. In other words, the largest absolute difference between adjacent clock periods must be less than the period stability.

5. Slew rate is measured through the VSWING voltage range centered about differential zero. Measurement taken from differential waveform.

6. Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a ±75mV window centered on the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the oscilloscope is to use for the edge rate calculations.

2.5 - 8 V/ns 2-4 5

30 Datasheet

Electrical Specifications

7. Duty Cycle (High time/Period) must be between 40 and 60%

Figure 2-3. Differential Clock Waveform

BCLK1

Threshold

Region

BCLK0

Tp = T 1 : B CLK[1 :0 ] period T2: BCLK[1:0] pe r io d stability ( n ot shown) Tph = T3: BCLK[1:0] pulse high time Tpl = T4: BCLK[1:0] pulse low time T5: BCLK[1:0] rise time through the threshold region T6: BCLK[1 :0 ] fa ll time thr o u gh the th reshold r e g i o n

Tph

CROSS (ABS

Tpl

Overshoot

Rising Edge

Ringback

)

Margin

Ringback

Falling Edge

Undershoot

Ringback

Figure 2-4. Measurement Points for Differential Clock Waveforms

Slew_rise

+150 mV

0.0 V 0.0V

V_swing

-150 mV

Diff

T5 = BCLK[1:0] rise and fall time through the swing region

Slew _fall

+150mV

-150mV

Datasheet

Electrical Specifications

32 Datasheet

Package Mechanical Specifications

3 Package Mechanical

Specifications

3.1 Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array (FC-L GA8) package that interfaces with the motherboard via an LGA775 socket. The package consists of a processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch of the processor package components and how they are assembled together. Refer to the LGA775 Socket Mechanical Design Guide for complete details on the LGA775 socket.

The package components shown in Figure 3-1 include the following:

1. Integrated Heat Spreader (IHS)

2. Thermal Interface Material (TIM)

3. Processor core (die)

4. Package substrate

5. Capacitors

Figure 3-1. Processor Package Assembly Sketch

Substrate

System Board

IHS

NOTE:

1. Socket and motherboard are included for reference and are not part of processor package.

Core (die)

TIM

Capacitors

LGA775 Socket

Datasheet

3.1.1 Package Mechanical Drawing

The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include:

1. Package reference with tolerances (total height, length, width, etc.)

2. IHS parallelism and tilt

3. Land dimensions

4. Top-side and back-side component keep-out dimensions

5. Reference datums

6. All drawing dimensions are in mm [in].

7. Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution is available in the processor Thermal/Mechanical Design Guidelines.

Package Mechanical Specifications

34 Datasheet

Package Mechanical Specifications

Figure 3-2. Processor Package Drawing Sheet 1 of 3

Datasheet

Figure 3-3. Processor Package Drawing Sheet 2 of 3

Package Mechanical Specifications

36 Datasheet

Package Mechanical Specifications

Figure 3-4. Processor Package Drawing Sheet 3 of 3

Datasheet

3.1.2 Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure 3-2 and Figure 3-3 for keepout zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in.

3.1.3 Package Loading Specifications

Table 3-1 provides dynamic and static load specifications for the processor package.

These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum loading specification must be

Table 3-1. Processor Loading Specifications

maintained by any thermal and mechanical solutions.

Parameter Minimum Maximum Notes

Static 80 N [17 lbf] 311 N [70 lbf] 1, 2, 3

Dynamic - 756 N [170 lbf] 1, 3, 4

Package Mechanical Specifications

NOTES:

1. These specifications apply to uniform compressive l oading in a direction normal to the processor IHS.

2. This is the maximum force that can be applied by a heatsink retention clip. The clip must

3. These specifications are based on limited testing for design characterization. Loading limits

4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static

also provide the minimum specified load on the processor package.

are for the package only and do not include the limits of the processor socket.

load requirement.

3.1.4 Package Handling Guidelines

Table 3-2 includes a list of guidelines on package handling in terms of recommended

maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.

Table 3-2. Package Handling Guidelines

Parameter Maximum Recommended Notes

Shear 311 N [70 lbf] 1, 4 Tensile 111 N [25 lbf] 2, 4 Torque 3.95 N-m [35 lbf-in] 3, 4

NOTES:

1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the

3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal

IHS surface.

to the IHS top surface.

38 Datasheet

Package Mechanical Specifications

4. These guidelines are bas ed on limited testing for design characterization.

3.1.5 Package Insertion Specifications

The processor can be inserted into and removed from a LGA775 socket 15 times. The socket should meet the LGA775 requirements detailed in the LGA775 Socket Mechanical Design Guide.

3.1.6 Processor Mass Specification

The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all the components that are included in the package.

3.1.7 Processor Materials

Table 3-3 lists some of the package components and associated materials.

Table 3-3. Processor Materials

Component Material

Integrated Heat Spreader (IHS) Nickel Plated Copper

Substrate Fiber Reinforced Resin

Substrate Lands Gold Plated Copper

3.1.8 Processor Markings

Figure 3-5 shows the topside markings on the processor. This diagram is to aid in the

identification of the processor.

Figure 3-5. Processor Top-Side Markings Example

INTEL ©'06 3360 INTEL® XEON® SLxxx [COO]

2.83GHZ/12M/1333/05A [FPO]

Datasheet

ATPO

S/N

Package Mechanical Specifications

3.1.9 Processor Land Coordinates

Figure 3-6 shows the top view of the processor land coordinates. The coordinates are

Figure 3-6. Processor Land Coordinates and Quadrants, Top View

referred to throughout the document to identify processor lands.

/ V

89101112131415161718192021222324252627282930

1234567

AN AM AL AK AJ AH AG AF AE AD AC AB AA

AN AM AL AK AJ AH AG AF AE AD AC AB

AA Y W V U

T R P N M

L K

J H G

F E D C B A

Socket 775

Quadrants

Top View

123456789101112131415161718192021222324252627282930

V U T R P N

L K J H G F E D C B A

Address/

Common Clock/

Async

VTT / Clocks Data

40 Datasheet

Land Listing and Signal Descriptions

4 Land Listing and Signal

Descriptions

This chapter provides the processor land assignment and signal descriptions.

4.1 Processor Land Assignments

This section contains the land listings for the processor. The land-out footprint is shown in Figure 4-1 and Figure 4-2. These figures represent the land-out arranged by land number and they show the physical location of each signal on the package land array (top view). Table 4-1 is a listing of all processor lands ordered alphabetically by land (signal) name. Table 4-2 is also a listing of all processor lands; the ordering is by land number.

Datasheet

Land Listing and Signal Descriptions

Figure 4-1.land-out Diagram (Top View – Left Side)

30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15

VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC

AM VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC AL VCC VCC VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC AK VSS VSS VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC

VSS VSS VSS VSS VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC

VCC VCC VCC VCC VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC

AG VCC VCC VCC VCC VCC VCC VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC AF VSS VSS VSS VSS VSS VSS VSS VSS VCC VCC VSS VCC VCC VSS VSS VCC AE VSS VSS VSS VSS VSS VSS VSS VCC VCC VCC VSS VCC VCC VSS VSS VCC AD VCC VCC VCC VCC VCC VCC VCC VCC AC VCC VCC VCC VCC VCC VCC VCC VCC AB VSS VSS VSS VSS VSS VSS VSS VSS

AA VSS VSS VSS VSS VSS VSS VSS VSS

Y VCC VCC VCC VCC VCC VCC VCC VCC

W VCC VCC VCC VCC VCC VCC VCC VCC V VSS VSS VSS VSS VSS VSS VSS VSS U VCC VCC VCC VCC VCC VCC VCC VCC T VCC VCC VCC VCC VCC VCC VCC VCC

R VSS VSS VSS VSS VSS VSS VSS VSS

P VSS VSS VSS VSS VSS VSS VSS VSS N VCC VCC VCC VCC VCC VCC VCC VCC

M VCC VCC VCC VCC VCC VCC VCC VCC

L VSS VSS VSS VSS VSS VSS VSS VSS K VCC VCC VCC VCC VCC VCC VCC VCC

VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC VCC FC34 FC31 VCC

BSEL1 FC15 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS FC33 FC32

G BSEL2 BSEL0 BCLK1 TESTHI4 TESTHI5 TESTHI3 TESTHI6 RESET# D47# D44# DSTBN2# DSTBP2# D35# D36# D32# D31# F E D

C VTT VTT VTT VTT VTT VTT VSS

B VTT VTT VTT VTT VTT VTT VSS VSSA D63# D59# VSS D60# D57# VSS D55# D53#

RSVD BCLK0 VTT_SEL TESTHI0 TESTHI2 TESTHI7 RSVD VSS D43# D41# VSS D38# D37# VSS D30# FC26 VSS VSS VSS VSS FC10 RSVD D45# D42# VSS D40# D39# VSS D34# D33#

VTT VTT VTT VTT VTT VTT VSS VCCPLL D46# VSS D48# DBI2# VSS D49# RSVD VSS

VCCIO

VSS D58# DBI3# VSS D54# DSTBP3# VSS D51#

PLL

VTT VTT VTT VTT VTT VTT FC23 VCCA D62# VSS RSVD D61# VSS D56# DSTBN3# VSS

30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15

42 Datasheet

Land Listing and Signal Descriptions

Figure 4-2.land-out Diagram (Top View – Righ t Side)

14 13 12 11 10 9 8 7 6 5 4 3 2 1

VCC VSS VCC VCC VSS VCC VCC

VCC VSS VCC VCC VSS VCC VCC VID7 FC40 VID6 VSS VID2 VID0 VSS AM VCC VSS VCC VCC VSS VCC VCC VSS VID3 VID1 VID5 VRDSEL PROCHOT# FC25 AL VCC VSS VCC VCC VSS VCC VCC VSS FC8 VSS VID4 ITP_CLK0 VSS FC24 AK VCC VSS VCC VCC VSS VCC VCC VSS A35# A34# VSS ITP_CLK1 BPM0# BPM1# AJ VCC VSS VCC VCC VSS VCC VCC VSS VSS A33# A32# VSS RSVD VSS AH VCC VSS VCC VCC VSS VCC VCC VSS A29# A31# A30# BPM5# BPM3# TRST# AG VCC VSS VCC VCC VSS VCC VCC VSS VSS A27# A28# VSS BPM4# TDO AF VCC VSS VCC VCC VSS VCC SKTOCC# VSS RSVD VSS RSVD FC18 VSS TCK AE

VCC VCC VCC VCC VCC VCC VCC VSS REQ4# REQ1# VSS FC22 FC3

VSS VSS VSS VSS VSS VSS VSS VSS VSS TESTHI10 FC35 VSS GTLREF1 GTLREF0

VID_SEL

VCC VSS A22# ADSTB1# VSS FC36 BPM2# TDI AD VCC VSS VSS A25# RSVD VSS DBR# TMS AC VCC VSS A17# A24# A26# FC37 IERR# VSS AB

VCC VSS VSS A23# A21# VSS FC39

VCC VSS A19# VSS A20# PSI# VSS

VCC VSS A18# A16# VSS TESTHI1 TDI_M MSID0 W VCC VSS VSS A14# A15# VSS RSVD MSID1 V VCC VSS A10# A12# A13# FC30 FC29 TDO_M U VCC VSS VSS A9# A11# VSS FC4 COMP1 T

VCC VSS ADSTB0# VSS A8#

VCC VSS A4# RSVD VSS INIT# SMI# TESTHI11 P VCC VSS VSS RSVD RSVD VSS IGNNE# PWRGOOD N

VCC VSS REQ2# A5# A7# STPCLK#

VCC VSS VSS A3# A6# VSS TESTHI13 LINT1 L VCC VSS REQ3# VSS REQ0# A20M# VSS LINT0 K

ECT

VSS_MB_

REGULATION

VCC_MB_

REGULATION

VSS_

SENSE

VCC_

SENSE

FERR#/

PBE#

VSS VSS AN

VTT_OUT_

RIGHT

FC0/BOOT-

SELECT

VSS COMP3 R

THER-

MTRIP#

VSS M

VTT_OUT_

LEFT

D29# D27# DSTBN1# DBI1# GTLREF3 D16# BPRI# DEFER# RSVD PECI BPMb2# BPMb3# COMP2 BPMb0# G D28# VSS D24# D23# VSS D18# D17# VSS FC21 RS1# VSS BR0# GTLREF2 F

VSS D26# DSTBP1# VSS D21# D19# VSS RSVD RSVD FC20 HITM# TRDY# VSS E

RSVD D25# VSS D15# D22# VSS D12# D20# VSS VSS HIT# VSS ADS# RSVD D

D52# VSS D14# D11# VSS BPMb1# DSTBN0# VSS D3# D1# VSS LOCK# BNR# DRDY#

VSS COMP8 D13# VSS D10# DSTBP0# VSS D6# D5# VSS D0# RS0# DBSY# VSS B

D50# COMP0 VSS D9# D8# VSS DBI0# D7# VSS D4# D2# RS2# VSS

14 13 12 11 10 9 8 7 6 5 4 3 2 1

Datasheet

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

A10# U6 Source Synch Input/Output A11# T4 Source Synch Input/Output A12# U5 Source Synch Input/Output A13# U4 Source Synch Input/Output A14# V5 Source Synch Input/Output A15# V4 Source Synch Input/Output A16# W5 Source Synch Input/Output A17# AB6 Source Synch Input/Output A18# W6 Source Synch Input/Output A19# Y6 Source Synch Input/Output A20# Y4 Source Synch Input/Output

A20M# K3 Asynch CMOS Input

A21# AA4 Source Synch Input/Output A22# AD6 Source Synch Input/Output A23# AA5 Source Synch Input/Output A24# AB5 Source Synch Input/Output A25# AC5 Source Synch Input/Output A26# AB4 Source Synch Input/Output A27# AF5 Source Synch Input/Output A28# AF4 Source Synch Input/Output A29# AG6 Source Synch Input/Output

A3# L5 Source Synch Input/Output A30# AG4 Source Synch Input/Output A31# AG5 Source Synch Input/Output A32# AH4 Source Synch Input/Output A33# AH5 Source Synch Input/Output A34# AJ5 Source Synch Input/Output A35# AJ6 Source Synch Input/Output

A4# P6 Source Synch Input/Output

A5# M5 Source Synch Input/Output

A6# L4 Source Synch Input/Output

A7# M4 Source Synch Input/Output

A8# R4 Source Synch Input/Output

A9# T5 Source Synch Input/Output ADS# D2 Common Clock Input/Output

ADSTB0# R6 Source Synch Input/Output ADSTB1# AD5 Source Synch Input/Output

BCLK0 F28 Clock Input BCLK1 G28 Clock Input

Signal Buffer

Type

Direction

Table 4-1. Alphabeti cal Land

Assignments

Land Name Land #

BNR# C2 Common Clock Input/Output BPM0# AJ2 Common Clock Input/Output BPM1# AJ1 Common Clock Input/Output BPM2# AD2 Common Clock Input/Output BPM3# AG2 Common Clock Input/Output BPM4# AF2 Common Clock Input/Output BPM5# AG3 Common Clock Input/Output

BPMb0# G1 Common Clock Input/Output BPMb1# C9 Common Clock Input/Output BPMb2# G4 Common Clock Input/Output BPMb3# G3 Common Clock Input/Output

BPRI# G8 Common Clock Input

BR0# F3 Common Clock Input/Output BSEL0 G29 Asynch CMOS Output BSEL1 H30 Asynch CMOS Output BSEL2 G30 Asynch CMOS Output

COMP0 A13 Power/Other Input COMP1 T1 Power/Other Input COMP2 G2 Power/Other Input COMP3 R1 Power/Other Input COMP8 B13 Power/Other Input

D0# B4 Source Synch Input/Output

D1# C5 Source Synch Input/Output D10# B10 Source Synch Input/Output D11# C11 Source Synch Input/Output D12# D8 Source Synch Input/Output D13# B12 Source Synch Input/Output D14# C12 Source Synch Input/Output D15# D11 Source Synch Input/Output D16# G9 Source Synch Input/Output D17# F8 Source Synch Input/Output D18# F9 Source Synch Input/Output D19# E9 Source Synch Input/Output

D2# A4 Source Synch Input/Output D20# D7 Source Synch Input/Output D21# E10 Source Synch Input/Output D22# D10 Source Synch Input/Output D23# F11 Source Synch Input/Output D24# F12 Source Synch Input/Output

Signal Buffer

Type

Direction

44 Datasheet

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

D25# D13 Source Synch Input/Outpu t D26# E13 Source Synch Input/Outpu t D27# G13 Source Synch Input/Output D28# F14 Source Synch Input/Output D29# G14 Source Synch Input/Output

D3# C6 Source Synch Input/Output D30# F15 Source Synch Input/Output D31# G15 Source Synch Input/Output D32# G16 Source Synch Input/Output D33# E15 Source Synch Input/Outpu t D34# E16 Source Synch Input/Outpu t D35# G18 Source Synch Input/Output D36# G17 Source Synch Input/Output D37# F17 Source Synch Input/Output D38# F18 Source Synch Input/Output D39# E18 Source Synch Input/Outpu t

D4# A5 Source Synch Input/Output D40# E19 Source Synch Input/Outpu t D41# F20 Source Synch Input/Output D42# E21 Source Synch Input/Outpu t D43# F21 Source Synch Input/Output D44# G21 Source Synch Input/Output D45# E22 Source Synch Input/Outpu t D46# D22 Source Synch Input/Outpu t D47# G22 Source Synch Input/Output D48# D20 Source Synch Input/Outpu t D49# D17 Source Synch Input/Outpu t

D5# B6 Source Synch Input/Output D50# A14 Source Synch Input/Output D51# C15 Source Synch Input/Output D52# C14 Source Synch Input/Output D53# B15 Source Synch Input/Output D54# C18 Source Synch Input/Output D55# B16 Source Synch Input/Output D56# A17 Source Synch Input/Output D57# B18 Source Synch Input/Output D58# C21 Source Synch Input/Output D59# B21 Source Synch Input/Output

D6# B7 Source Synch Input/Output

Signal Buffer

Type

Direction

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

D60# B19 Source Synch Input/Output D61# A19 Source Synch Input/Output D62# A22 Source Synch Input/Output D63# B22 Source Synch Input/Output

D7# A7 Source Synch Input/Output D8# A10 Source Synch Input/Output

D9# A11 Source Synch Input/Output DBI0# A8 Source Synch Input/Output DBI1# G11 Source Synch Input/Output DBI2# D19 Source Synch Input/Output DBI3# C20 Source Synch Input/Output

DBR# AC2 Power/Other Output

DBSY# B2 Common Clock Input/Output

DEFER# G7 Common Clock Input

DRDY# C1 Common Clock Input/Output DSTBN0# C8 Source Synch Input/Output DSTBN1# G12 Source Synch Input/Output DSTBN2# G20 Source Synch Input/Output DSTBN3# A16 Source Synch Input/Output

DSTBP0# B9 Source Synch Input/Output DSTBP1# E12 Source Synch Input/Output DSTBP2# G19 Source Synch Input/Output DSTBP3# C 17 Source Synch Input/Output

FC0/

BOOTSELECT

FC10 E24 Power/Other FC15 H29 Power/Other FC17 Y3 Power/Other FC18 AE3 Power/Other FC20 E5 Power/Other FC21 F6 Power/Other FC22 J3 Power/Other FC23 A24 Power/Other FC24 AK1 Power/Other FC25 AL1 Power/Other FC26 E29 Power/Other FC29 U2 Power/Other

FC3 J2 Power/Other FC30 U3 Power/Other FC31 J16 Power/Other

Signal Buffer

Type

Y1 Power/Other

Direction

Datasheet

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Table 4-1. Alphabeti cal Land

Assignments

Land Name Land #

FC32 H15 Power/Other FC33 H16 Power/Other FC34 J17 Power/Other FC35 H4 Power/Other FC36 AD3 Power/Other FC37 AB3 Power/Other FC39 AA2 Power/Other

FC4 T2 Power/Other

FC40 AM6 Power/Other

FC8 AK6 Power/Other

FERR#/PBE# R3 Asynch CMOS Output

GTLREF0 H1 Power/Other Input GTLREF1 H2 Power/Other Input GTLREF2 F2 Power/Other Input GTLREF3 G10 Power/Other Input

HIT# D4 Common Clock Input/Output

HITM# E4 Common Clock Input/Output

IERR# AB2 Asynch CMOS Output

IGNNE# N2 Asynch CMOS Input

INIT# P3 Asynch CMOS Input ITP_CLK0 AK3 TAP Input ITP_CLK1 AJ3 TAP Input

LINT0 K1 Asynch CMOS Input

LINT1 L1 Asynch CMOS Input

LOCK# C3 Common Clock Input/Output

MSID0 W1 Power/Other Output MSID1 V1 Power/Other Output

PECI G5 Power/Other Input/Output

PROCHOT# AL2 Asynch CMOS Input/Output

PWRGOOD N1 Power/Other Input

REQ0# K4 Source Synch Input/Output REQ1# J5 Source Synch Input/Output REQ2# M6 Source Synch Input/Output REQ3# K6 Source Synch Input/Output

REQ4# J6 Source Synch Input/Output RESERVED V2 RESERVED A20 RESERVED AC4 RESERVED AE4

Signal Buffer

Type

Direction

THERMTRIP# M2 Asynch CMOS Output

Assignments

Land Name Land #

RESERVED AE6 RESERVED AH2 RESERVED D1 RESERVED D14 RESERVED D16 RESERVED E23 RESERVED E6 RESERVED E7 RESERVED F23 RESERVED F29 RESERVED G6 RESERVED N4 RESERVED N5 RESERVED P5

RESET# G23 Common Clock Input

RS0# B3 Common Clock Input RS1# F5 Common Clock Input RS2# A3 Common Clock Input

SKTOCC# AE8 Power/Other Output

SMI# P2 Asynch CMOS Input

STPCLK# M3 Asynch CMOS Input

TCK AE1 TAP Input

TDI AD1 TAP Input

TDI_M W2 Power/Other Input

TDO AF1 TAP Output

TDO_M U1 TAP Output TESTHI0 F26 Power/Other Input TESTHI1 W3 Power/Other Input

TESTHI10 H5 Power/Other Input TESTHI11 P1 Power/Other Input TESTHI13 L2 Power/Other Input

TESTHI2 F25 Power/Other Input TESTHI3 G25 Power/Other Input TESTHI4 G27 Power/Other Input TESTHI5 G26 Power/Other Input TESTHI6 G24 Power/Other Input TESTHI7 F24 Power/Other Input

TMS AC1 TAP Input

Signal Buffer

Type

Direction

46 Datasheet

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

TRDY# E3 Common Clock Input

TRST# AG1 TAP Input

VCC AA8 Power/Other VCC AB8 Power/Other VCC AC23 Power/Other VCC AC24 Power/Other VCC AC25 Power/Other VCC AC26 Power/Other VCC AC27 Power/Other VCC AC28 Power/Other VCC AC29 Power/Other VCC AC30 Power/Other VCC AC8 Power/Other VCC AD23 Power/Other VCC AD24 Power/Other VCC AD25 Power/Other VCC AD26 Power/Other VCC AD27 Power/Other VCC AD28 Power/Other VCC AD29 Power/Other VCC AD30 Power/Other VCC AD8 Power/Other VCC AE11 Power/Other VCC AE12 Power/Other VCC AE14 Power/Other VCC AE15 Power/Other VCC AE18 Power/Other VCC AE19 Power/Other VCC AE21 Power/Other VCC AE22 Power/Other VCC AE23 Power/Other VCC AE9 Power/Other VCC AF11 Power/Other VCC AF12 Power/Other VCC AF14 Power/Other VCC AF15 Power/Other VCC AF18 Power/Other VCC AF19 Power/Other VCC AF21 Power/Other

Signal Buffer

Type

Direction

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

VCC AF22 Power/Other VCC AF8 Power/Other VCC AF9 Power/Other VCC AG11 Power/Other VCC AG12 Power/Other VCC AG14 Power/Other VCC AG15 Power/Other VCC AG18 Power/Other VCC AG19 Power/Other VCC AG21 Power/Other VCC AG22 Power/Other VCC AG25 Power/Other VCC AG26 Power/Other VCC AG27 Power/Other VCC AG28 Power/Other VCC AG29 Power/Other VCC AG30 Power/Other VCC AG8 Power/Other VCC AG9 Power/Other VCC AH11 Power/Other VCC AH12 Power/Other VCC AH14 Power/Other VCC AH15 Power/Other VCC AH18 Power/Other VCC AH19 Power/Other VCC AH21 Power/Other VCC AH22 Power/Other VCC AH25 Power/Other VCC AH26 Power/Other VCC AH27 Power/Other VCC AH28 Power/Other VCC AH29 Power/Other VCC AH30 Power/Other VCC AH8 Power/Other VCC AH9 Power/Other VCC AJ11 Power/Other VCC AJ12 Power/Other VCC AJ14 Power/Other VCC AJ15 Power/Other

Signal Buffer

Type

Direction

Datasheet

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

VCC AJ18 Power/Other VCC AJ19 Power/Other VCC AJ21 Power/Other VCC AJ22 Power/Other VCC AJ25 Power/Other VCC AJ26 Power/Other VCC AJ8 Power/Other VCC AJ9 Power/Other VCC AK11 Power/Other VCC AK12 Power/Other VCC AK14 Power/Other VCC AK15 Power/Other VCC AK18 Power/Other VCC AK19 Power/Other VCC AK21 Power/Other VCC AK22 Power/Other VCC AK25 Power/Other VCC AK26 Power/Other VCC AK8 Power/Other VCC AK9 Power/Other VCC AL11 Power/Other VCC AL12 Power/Other VCC AL14 Power/Other VCC AL15 Power/Other VCC AL18 Power/Other VCC AL19 Power/Other VCC AL21 Power/Other VCC AL22 Power/Other VCC AL25 Power/Other VCC AL26 Power/Other VCC AL29 Power/Other VCC AL30 Power/Other VCC AL8 Power/Other VCC AL9 Power/Other VCC AM11 Power/Other VCC AM12 Power/Other VCC AM14 Power/Other VCC AM15 Power/Other VCC AM18 Power/Other

Signal Buffer

Type

Direction

Table 4-1. Alphabeti cal Land

Assignments

Land Name Land #

VCC AM19 Power/Other VCC AM21 Power/Other VCC AM22 Power/Other VCC AM25 Power/Other VCC AM26 Power/Other VCC AM29 Power/Other VCC AM30 Power/Other VCC AM8 Power/Other VCC AM9 Power/Other VCC AN11 Power/Other VCC AN12 Power/Other VCC AN14 Power/Other VCC AN15 Power/Other VCC AN18 Power/Other VCC AN19 Power/Other VCC AN21 Power/Other VCC AN22 Power/Other VCC AN25 Power/Other VCC AN26 Power/Other VCC AN29 Power/Other VCC AN30 Power/Other VCC AN8 Power/Other VCC AN9 Power/Other VCC J10 Power/Other VCC J11 Power/Other VCC J12 Power/Other VCC J13 Power/Other VCC J14 Power/Other VCC J15 Power/Other VCC J18 Power/Other VCC J19 Power/Other VCC J20 Power/Other VCC J21 Power/Other VCC J22 Power/Other VCC J23 Power/Other VCC J24 Power/Other VCC J25 Power/Other VCC J26 Power/Other VCC J27 Power/Other

Signal Buffer

Type

Direction

48 Datasheet

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

VCC J28 Power/Other VCC J29 Power/Other VCC J30 Power/Other VCC J8 Power/Other VCC J9 Power/Other VCC K23 Power/Other VCC K24 Power/Other VCC K25 Power/Other VCC K26 Power/Other VCC K27 Power/Other VCC K28 Power/Other VCC K29 Power/Other VCC K30 Power/Other VCC K8 Power/Other VCC L8 Power/Other VCC M23 Power/Other VCC M24 Power/Other VCC M25 Power/Other VCC M26 Power/Other VCC M27 Power/Other VCC M28 Power/Other VCC M29 Power/Other VCC M30 Power/Other VCC M8 Power/Other VCC N23 Power/Other VCC N24 Power/Other VCC N25 Power/Other VCC N26 Power/Other VCC N27 Power/Other VCC N28 Power/Other VCC N29 Power/Other VCC N30 Power/Other VCC N8 Power/Other VCC P8 Power/Other VCC R8 Power/Other VCC T23 Power/Other VCC T24 Power/Other VCC T25 Power/Other VCC T26 Power/Other

Signal Buffer

Type

Direction

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

VCC T27 Power/Other VCC T28 Power/Other VCC T29 Power/Other VCC T30 Power/Other VCC T8 Power/Other VCC U23 Power/Other VCC U24 Power/Other VCC U25 Power/Other VCC U26 Power/Other VCC U27 Power/Other VCC U28 Power/Other VCC U29 Power/Other VCC U30 Power/Other VCC U8 Power/Other VCC V8 Power/Other VCC W23 Power/Other VCC W24 Power/Other VCC W25 Power/Other VCC W26 Power/Other VCC W27 Power/Other VCC W28 Power/Other VCC W29 Power/Other VCC W30 Power/Other VCC W8 Power/Other VCC Y23 Power/Other VCC Y24 Power/Other VCC Y25 Power/Other VCC Y26 Power/Other VCC Y27 Power/Other VCC Y28 Power/Other VCC Y29 Power/Other VCC Y30 Power/Other VCC Y8 Power/Other

VCC_MB_

REGULATION

VCC_SENSE AN3 Power/Other Output

VCCA A23 Power/Other

VCCIOPLL C23 Power/Other

VCCPLL D23 Power/Other

VID_SELECT AN7 Power/Other Output

Signal Buffer

Type

AN5 Power/Other Output

Direction

Datasheet

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

VID0 AM2 Asynch CMOS Output VID1 AL5 Asynch CMOS Output VID2 AM3 Asynch CMOS Output VID3 AL6 Asynch CMOS Output VID4 AK4 Asynch CMOS Output VID5 AL4 Asynch CMOS Output VID6 AM5 Asynch CMOS Output VID7 AM7 Asynch CMOS Output

VRDSEL AL3 Power/Other

VSS B1 Power/Other VSS B11 Power/Other VSS B14 Power/Other VSS B17 Power/Other VSS B20 Power/Other VSS B24 Power/Other VSS B5 Power/Other VSS B8 Power/Other VSS A12 Power/Other VSS A15 Power/Other VSS A18 Power/Other VSS A2 Power/Other VSS A21 Power/Other VSS A6 Power/Other VSS A9 Power/Other VSS AA23 Power/Other VSS AA24 Power/Other VSS AA25 Power/Other VSS AA26 Power/Other VSS AA27 Power/Other VSS AA28 Power/Other VSS AA29 Power/Other VSS AA3 Power/Other VSS AA30 Power/Other VSS AA6 Power/Other VSS AA7 Power/Other VSS AB1 Power/Other VSS AB23 Power/Other VSS AB24 Power/Other VSS AB25 Power/Other

Signal Buffer

Type

Direction

Table 4-1. Alphabeti cal Land

Assignments

Land Name Land #

VSS AB26 Power/Other VSS AB27 Power/Other VSS AB28 Power/Other VSS AB29 Power/Other VSS AB30 Power/Other VSS AB7 Power/Other VSS AC3 Power/Other VSS AC6 Power/Other VSS AC7 Power/Other VSS AD4 Power/Other VSS AD7 Power/Other VSS AE10 Power/Other VSS AE13 Power/Other VSS AE16 Power/Other VSS AE17 Power/Other VSS AE2 Power/Other VSS AE20 Power/Other VSS AE24 Power/Other VSS AE25 Power/Other VSS AE26 Power/Other VSS AE27 Power/Other VSS AE28 Power/Other VSS AE29 Power/Other VSS AE30 Power/Other VSS AE5 Power/Other VSS AE7 Power/Other VSS AF10 Power/Other VSS AF13 Power/Other VSS AF16 Power/Other VSS AF17 Power/Other VSS AF20 Power/Other VSS AF23 Power/Other VSS AF24 Power/Other VSS AF25 Power/Other VSS AF26 Power/Other VSS AF27 Power/Other VSS AF28 Power/Other VSS AF29 Power/Other VSS AF3 Power/Other

Signal Buffer

Type

Direction

50 Datasheet

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

VSS AF30 Power/Other VSS AF6 Power/Other VSS AF7 Power/Other VSS AG10 Power/Other VSS AG13 Power/Other VSS AG16 Power/Other VSS AG17 Power/Other VSS AG20 Power/Other VSS AG23 Power/Other VSS AG24 Power/Other VSS AG7 Power/Other VSS AH1 Power/Other VSS AH10 Power/Other VSS AH13 Power/Other VSS AH16 Power/Other VSS AH17 Power/Other VSS AH20 Power/Other VSS AH23 Power/Other VSS AH24 Power/Other VSS AH3 Power/Other VSS AH6 Power/Other VSS AH7 Power/Other VSS AJ10 Power/Other VSS AJ13 Power/Other VSS AJ16 Power/Other VSS AJ17 Power/Other VSS AJ20 Power/Other VSS AJ23 Power/Other VSS AJ24 Power/Other VSS AJ27 Power/Other VSS AJ28 Power/Other VSS AJ29 Power/Other VSS AJ30 Power/Other VSS AJ4 Power/Other VSS AJ7 Power/Other VSS AK10 Power/Other VSS AK13 Power/Other VSS AK16 Power/Other VSS AK17 Power/Other

Signal Buffer

Type

Direction

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

VSS AK2 Power/Other VSS AK20 Power/Other VSS AK23 Power/Other VSS AK24 Power/Other VSS AK27 Power/Other VSS AK28 Power/Other VSS AK29 Power/Other VSS AK30 Power/Other VSS AK5 Power/Other VSS AK7 Power/Other VSS AL10 Power/Other VSS AL13 Power/Other VSS AL16 Power/Other VSS AL17 Power/Other VSS AL20 Power/Other VSS AL23 Power/Other VSS AL24 Power/Other VSS AL27 Power/Other VSS AL28 Power/Other VSS AL7 Power/Other VSS AM1 Power/Other VSS AM10 Power/Other VSS AM13 Power/Other VSS AM16 Power/Other VSS AM17 Power/Other VSS AM20 Power/Other VSS AM23 Power/Other VSS AM24 Power/Other VSS AM27 Power/Other VSS AM28 Power/Other VSS AM4 Power/Other VSS AN1 Power/Other VSS AN10 Power/Other VSS AN13 Power/Other VSS AN16 Power/Other VSS AN17 Power/Other VSS AN2 Power/Other VSS AN20 Power/Other VSS AN23 Power/Other

Signal Buffer

Type

Direction

Datasheet

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

VSS AN24 Power/Other VSS AN27 Power/Other VSS AN28 Power/Other VSS C10 Power/Other VSS C13 Power/Other VSS C16 Power/Other VSS C19 Power/Other VSS C22 Power/Other VSS C24 Power/Other VSS C4 Power/Other VSS C7 Power/Other VSS D12 Power/Other VSS D15 Power/Other VSS D18 Power/Other VSS D21 Power/Other VSS D24 Power/Other VSS D3 Power/Other VSS D5 Power/Other VSS D6 Power/Other VSS D9 Power/Other VSS E11 Power/Other VSS E14 Power/Other VSS E17 Power/Other VSS E2 Power/Other VSS E20 Power/Other VSS E25 Power/Other VSS E26 Power/Other VSS E27 Power/Other VSS E28 Power/Other VSS E8 Power/Other VSS F10 Power/Other VSS F13 Power/Other VSS F16 Power/Other VSS F19 Power/Other VSS F22 Power/Other VSS F4 Power/Other VSS F7 Power/Other VSS H10 Power/Other VSS H11 Power/Other

Signal Buffer

Type

Direction

Table 4-1. Alphabeti cal Land

Assignments

Land Name Land #

VSS H12 Power/Other VSS H13 Power/Other VSS H14 Power/Other VSS H17 Power/Other VSS H18 Power/Other VSS H19 Power/Other VSS H20 Power/Other VSS H21 Power/Other VSS H22 Power/Other VSS H23 Power/Other VSS H24 Power/Other VSS H25 Power/Other VSS H26 Power/Other VSS H27 Power/Other VSS H28 Power/Other VSS H3 Power/Other VSS H6 Power/Other VSS H7 Power/Other VSS H8 Power/Other VSS H9 Power/Other VSS J4 Power/Other VSS J7 Power/Other VSS K2 Power/Other VSS K5 Power/Other VSS K7 Power/Other VSS L23 Power/Other VSS L24 Power/Other VSS L25 Power/Other VSS L26 Power/Other VSS L27 Power/Other VSS L28 Power/Other VSS L29 Power/Other VSS L3 Power/Other VSS L30 Power/Other VSS L6 Power/Other VSS L7 Power/Other VSS M1 Power/Other VSS M7 Power/Other VSS N3 Power/Other

Signal Buffer

Type

Direction

52 Datasheet

Land Listing and Signal Descriptions

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

VSS N6 Power/Other VSS N7 Power/Other VSS P23 Power/Other VSS P24 Power/Other VSS P25 Power/Other VSS P26 Power/Other VSS P27 Power/Other VSS P28 Power/Other VSS P29 Power/Other VSS P30 Power/Other VSS P4 Power/Other VSS P7 Power/Other VSS R2 Power/Other VSS R23 Power/Other VSS R24 Power/Other VSS R25 Power/Other VSS R26 Power/Other VSS R27 Power/Other VSS R28 Power/Other VSS R29 Power/Other VSS R30 Power/Other VSS R5 Power/Other VSS R7 Power/Other VSS T3 Power/Other VSS T6 Power/Other VSS T7 Power/Other VSS U7 Power/Other VSS V23 Power/Other VSS V24 Power/Other VSS V25 Power/Other VSS V26 Power/Other VSS V27 Power/Other VSS V28 Power/Other VSS V29 Power/Other VSS V3 Power/Other VSS V30 Power/Other VSS V6 Power/Other VSS V7 Power/Other VSS W4 Power/Other

Signal Buffer

Type

Direction

Table 4-1. Alphabetical Land

Assignments

Land Name Land #

VSS W7 Power/Other VSS Y2 Power/Other VSS Y5 Power/Other VSS Y7 Power/Other

VSS_MB_

REGULATION

VSS_SENSE AN4 Power/Other Output

VSSA B23 Power/Other

VTT B25 Power/Other VTT B26 Power/Other VTT B27 Power/Other VTT B28 Power/Other VTT B29 Power/Other VTT B30 Power/Other VTT A25 Power/Other VTT A26 Power/Other VTT A27 Power/Other VTT A28 Power/Other VTT A29 Power/Other VTT A30 Power/Other VTT C25 Power/Other VTT C26 Power/Other VTT C27 Power/Other VTT C28 Power/Other VTT C29 Power/Other VTT C30 Power/Other VTT D25 Power/Other VTT D26 Power/Other VTT D27 Power/Other VTT D28 Power/Other VTT D29 Power/Other VTT D30 Power/Other

VTT_OUT_LE

VTT_OUT_RI

GHT

VTT_SEL F27 Power/Other Output

Signal Buffer

Type

AN6 Power/Other Output

J1 Power/Other Output

AA1 Power/Other Output

Direction

Datasheet

Land Listing and Signal Descriptions

Table 4-2. Numerical Land

Assignment

Land

Land Name

A10 D08# Source Synch Input/Output A11 D09# Source Synch Input/Output A12 VSS Power/Other A13 COMP0 Power/Other Input A14 D50# Source Synch Input/Output A15 VSS Power/Other A16 DSTBN3# Source Synch Input/Output A17 D56# Source Synch Input/Output A18 VSS Power/Other A19 D61# Source Synch Input/Output

A2 VSS Power/Other A20 RESERVED A21 VSS Power/Other A22 D62# Source Synch Input/Output A23 VCCA Power/Other A24 FC23 Power/Other A25 VTT Power/Other A26 VTT Power/Other A27 VTT Power/Other A28 VTT Power/Other A29 VTT Power/Other

A3 RS2# Common Clock Input A30 VTT Power/Other

A4 D02# Source Synch Input/Output

A5 D04# Source Synch Input/Output

A6 VSS Power/Other

A7 D07# Source Synch Input/Output

A8 DBI0# Source Synch Input/Output

A9 VSS Power/Other

VTT_OUT_RI

AA1

AA2 FC39 Power/Other AA23 VSS Power/Other AA24 VSS Power/Other AA25 VSS Power/Other AA26 VSS Power/Other AA27 VSS Power/Other AA28 VSS Power/Other AA29 VSS Power/Other

AA3 VSS Power/Other

GHT

Signal Buffer

Type

Power/Other Output

Direction

Table 4-2. Numerical Land

Assignment

Land

Land Name

AA30 VSS Power/Other

AA4 A21# Source Synch Input/Output AA5 A23# Source Synch Input/Output AA6 VSS Power/Other AA7 VSS Power/Other AA8 VCC Power/Other AB1 VSS Power/Other

AB2 IERR# Asynch CMOS Output AB23 VSS Power/Other AB24 VSS Power/Other AB25 VSS Power/Other AB26 VSS Power/Other AB27 VSS Power/Other AB28 VSS Power/Other AB29 VSS Power/Other

AB3 FC37 Power/Other AB30 VSS Power/Other

AB4 A26# Source Synch Input/Output

AB5 A24# Source Synch Input/Output

AB6 A17# Source Synch Input/Output

AB7 VSS Power/Other

AB8 VCC Power/Other

AC1 TMS TAP Input

AC2 DBR# Power/Other Output AC23 VCC Power/Other AC24 VCC Power/Other AC25 VCC Power/Other AC26 VCC Power/Other AC27 VCC Power/Other AC28 VCC Power/Other AC29 VCC Power/Other

AC3 VSS Power/Other AC30 VCC Power/Other

AC4 RESERVED

AC5 A25# Source Synch Input/Output

AC6 VSS Power/Other

AC7 VSS Power/Other

AC8 VCC Power/Other

AD1 TDI TAP Input

Signal Buffer

Type

Direction

54 Datasheet

Land Listing and Signal Descriptions

Table 4-2. Numerical Land

Assignment

Land

Land Name

AD2 BPM2# Common Clock Input/Output AD23 VCC Power/Other AD24 VCC Power/Other AD25 VCC Power/Other AD26 VCC Power/Other AD27 VCC Power/Other AD28 VCC Power/Other AD29 VCC Power/Other

AD3 FC36 Power/Other AD30 VCC Power/Other

AD4 VSS Power/Other

AD5 ADSTB1# Source Synch Input/Output

AD6 A22# Source Synch Input/Output

AD7 VSS Power/Other

AD8 VCC Power/Other

AE1 TCK TAP Input AE10 VSS Power/Other AE11 VCC Power/Other AE12 VCC Power/Other AE13 VSS Power/Other AE14 VCC Power/Other AE15 VCC Power/Other AE16 VSS Power/Other AE17 VSS Power/Other AE18 VCC Power/Other AE19 VCC Power/Other

AE2 VSS Power/Other AE20 VSS Power/Other AE21 VCC Power/Other AE22 VCC Power/Other AE23 VCC Power/Other AE24 VSS Power/Other AE25 VSS Power/Other AE26 VSS Power/Other AE27 VSS Power/Other AE28 VSS Power/Other AE29 VSS Power/Other

AE3 FC18 Power/Other AE30 VSS Power/Other

Signal Buffer

Type

Direction

Table 4-2. Numerical Land

Assignment

Land

Land Name

AE4 RESERVED AE5 VSS Power/Other AE6 RESERVED AE7 VSS Power/Other AE8 SKTOCC# Power/Other Output AE9 VCC Power/Other

AF1 TDO TAP Output AF10 VSS Power/Other AF11 VCC Power/Other AF12 VCC Power/Other AF13 VSS Power/Other AF14 VCC Power/Other AF15 VCC Power/Other AF16 VSS Power/Other AF17 VSS Power/Other AF18 VCC Power/Other AF19 VCC Power/Other

AF2 BPM4# Common Clock Input/Output AF20 VSS Power/Other AF21 VCC Power/Other AF22 VCC Power/Other AF23 VSS Power/Other AF24 VSS Power/Other AF25 VSS Power/Other AF26 VSS Power/Other AF27 VSS Power/Other AF28 VSS Power/Other AF29 VSS Power/Other

AF3 VSS Power/Other AF30 VSS Power/Other

AF4 A28# Source Synch Input/Output

AF5 A27# Source Synch Input/Output

AF6 VSS Power/Other

AF7 VSS Power/Other

AF8 VCC Power/Other

AF9 VCC Power/Other

AG1 TRST# TAP Input AG10 VSS Power/Other AG11 VCC Power/Other

Signal Buffer

Type

Direction

Datasheet

Land Listing and Signal Descriptions

Table 4-2. Numerical Land

Assignment

Land

Land Name

AG12 VCC Power/Other AG13 VSS Power/Other AG14 VCC Power/Other AG15 VCC Power/Other AG16 VSS Power/Other AG17 VSS Power/Other AG18 VCC Power/Other AG19 VCC Power/Other

AG2 BPM3# Common Clock Input/Outpu t AG20 VSS Power/Other AG21 VCC Power/Other AG22 VCC Power/Other AG23 VSS Power/Other AG24 VSS Power/Other AG25 VCC Power/Other AG26 VCC Power/Other AG27 VCC Power/Other AG28 VCC Power/Other AG29 VCC Power/Other

AG3 BPM5# Common Clock Input/Outpu t AG30 VCC Power/Other

AG4 A30# Source Synch Input/Output

AG5 A31# Source Synch Input/Output

AG6 A29# Source Synch Input/Output

AG7 VSS Power/Other

AG8 VCC Power/Other

AG9 VCC Power/Other

AH1 VSS Power/Other AH10 VSS Power/Other AH11 VCC Power/Other AH12 VCC Power/Other AH13 VSS Power/Other AH14 VCC Power/Other AH15 VCC Power/Other AH16 VSS Power/Other AH17 VSS Power/Other AH18 VCC Power/Other AH19 VCC Power/Other

AH2 RESERVED

Signal Buffer

Type

Direction

Table 4-2. Numerical Land

Assignment

Land

Land Name

AH20 VSS Power/Other AH21 VCC Power/Other AH22 VCC Power/Other AH23 VSS Power/Other AH24 VSS Power/Other AH25 VCC Power/Other AH26 VCC Power/Other AH27 VCC Power/Other AH28 VCC Power/Other AH29 VCC Power/Other

AH3 VSS Power/Other

AH30 VCC Power/Other

AH4 A32# Source Synch Input/Output AH5 A33# Source Synch Input/Output AH6 VSS Power/Other AH7 VSS Power/Other AH8 VCC Power/Other AH9 VCC Power/Other

AJ1 BPM1# Common Clock Input/Output AJ10 VSS Power/Other AJ11 VCC Power/Other AJ12 VCC Power/Other AJ13 VSS Power/Other AJ14 VCC Power/Other AJ15 VCC Power/Other AJ16 VSS Power/Other AJ17 VSS Power/Other AJ18 VCC Power/Other AJ19 VCC Power/Other

AJ2 BPM0# Common Clock Input/Output AJ20 VSS Power/Other AJ21 VCC Power/Other AJ22 VCC Power/Other AJ23 VSS Power/Other AJ24 VSS Power/Other AJ25 VCC Power/Other AJ26 VCC Power/Other AJ27 VSS Power/Other AJ28 VSS Power/Other

Signal Buffer

Type

Direction

56 Datasheet

Land Listing and Signal Descriptions

Table 4-2. Numerical Land

Assignment

Land

Land Name

AJ29 VSS Power/Other

AJ3 ITP_CLK1 TAP Input

AJ30 VSS Power/Other

AJ4 VSS Power/Other AJ5 A34# Source Synch Input/Output AJ6 A35# Source Synch Input/Output AJ7 VSS Power/Other AJ8 VCC Power/Other AJ9 VCC Power/Other

AK1 FC24 Power/Other AK10 VSS Power/Other AK11 VCC Power/Other AK12 VCC Power/Other AK13 VSS Power/Other AK14 VCC Power/Other AK15 VCC Power/Other AK16 VSS Power/Other AK17 VSS Power/Other AK18 VCC Power/Other AK19 VCC Power/Other

AK2 VSS Power/Other AK20 VSS Power/Other AK21 VCC Power/Other AK22 VCC Power/Other AK23 VSS Power/Other AK24 VSS Power/Other AK25 VCC Power/Other AK26 VCC Power/Other AK27 VSS Power/Other AK28 VSS Power/Other AK29 VSS Power/Other

AK3 ITP_CLK0 TAP Input AK30 VSS Power/Other

AK4 VID4 Asynch CMOS Output

AK5 VSS Power/Other

AK6 FC8 Power/Other

AK7 VSS Power/Other

AK8 VCC Power/Other

AK9 VCC Power/Other

Signal Buffer

Type

Direction

Table 4-2. Numerical Land

Assignment

Land

Land Name

AL1FC25Power/Other AL10 VSS Power/Other AL11 VCC Power/Other AL12 VCC Power/Other AL13 VSS Power/Other AL14 VCC Power/Other AL15 VCC Power/Other AL16 VSS Power/Other AL17 VSS Power/Other AL18 VCC Power/Other AL19 VCC Power/Other

AL2 PROCHOT# Asynch CMOS Input/Output AL20 VSS Power/Other AL21 VCC Power/Other AL22 VCC Power/Other AL23 VSS Power/Other AL24 VSS Power/Other AL25 VCC Power/Other AL26 VCC Power/Other AL27 VSS Power/Other AL28 VSS Power/Other AL29 VCC Power/Other

AL3 VRDSEL Power/Other AL30 VCC Power/Other

AL4 VID5 Asynch CMOS Output

AL5 VID1 Asynch CMOS Output

AL6 VID3 Asynch CMOS Output

AL7 VSS Power/Other

AL8 VCC Power/Other

AL9 VCC Power/Other

AM1 VSS Power/Other AM10 VSS Power/Other AM11 VCC Power/Other AM12 VCC Power/Other AM13 VSS Power/Other AM14 VCC Power/Other AM15 VCC Power/Other AM16 VSS Power/Other AM17 VSS Power/Other

Signal Buffer

Type

Direction

Datasheet

Land Listing and Signal Descriptions

Table 4-2. Numerical Land

Assignment

Land

Land Name

AM18 VCC Power/Other AM19 VCC Power/Other

AM2 VID0 Asynch CMOS Output AM20 VSS Power/Other AM21 VCC Power/Other AM22 VCC Power/Other AM23 VSS Power/Other AM24 VSS Power/Other AM25 VCC Power/Other AM26 VCC Power/Other AM27 VSS Power/Other AM28 VSS Power/Other AM29 VCC Power/Other

AM3 VID2 Asynch CMOS Output AM30 VCC Power/Other

AM4 VSS Power/Other

AM5 VID6 Asynch CMOS Output

AM6 FC40 Power/Other

AM7 VID7 Asynch CMOS Output

AM8 VCC Power/Other

AM9 VCC Power/Other

AN1 VSS Power/Other AN10 VSS Power/Other AN11 VCC Power/Other AN12 VCC Power/Other AN13 VSS Power/Other AN14 VCC Power/Other AN15 VCC Power/Other AN16 VSS Power/Other AN17 VSS Power/Other AN18 VCC Power/Other AN19 VCC Power/Other

AN2 VSS Power/Other AN20 VSS Power/Other AN21 VCC Power/Other AN22 VCC Power/Other AN23 VSS Power/Other AN24 VSS Power/Other AN25 VCC Power/Other

Signal Buffer

Type

Direction

Table 4-2. Numerical Land

Assignment

Land

Land Name

AN26 VCC Power/Other AN27 VSS Power/Other AN28 VSS Power/Other AN29 VCC Power/Other

AN3 VCC_SENSE Power/Other Output

AN30 VCC Power/Other

AN4 VSS_SENSE Power/Other Output

VCC_MB_

AN5

REGULATION

VSS_MB_

AN6

REGULATION AN7 VID_SELECT Power/Other Output AN8 VCC Power/Other AN9 VCC Power/Other

B1 VSS Power/Other B10 D10# Source Synch Input/Output B11 VSS Power/Other B12 D13# Source Synch Input/Output B13 COMP8 Power/Other Input B14 VSS Power/Other B15 D53# Source Synch Input/Output B16 D55# Source Synch Input/Output B17 VSS Power/Other B18 D57# Source Synch Input/Output B19 D60# Source Synch Input/Output

B2 DBSY# Common Clock Input/Output B20 VSS Power/Other B21 D59# Source Synch Input/Output B22 D63# Source Synch Input/Output B23 VSSA Power/Other B24 VSS Power/Other B25 VTT Power/Other B26 VTT Power/Other B27 VTT Power/Other B28 VTT Power/Other B29 VTT Power/Other

B3 RS0# Common Clock Input B30 VTT Power/Other

B4 D00# Source Synch Input/Output

B5 VSS Power/Other

Signal Buffer

Type

Power/Other Output

Direction

58 Datasheet

Land Listing and Signal Descriptions

Table 4-2. Numerical Land

Assignment

Land

Land Name

B6 D05# Source Synch Input/Output B7 D06# Source Synch Input/Output B8 VSS Power/Other B9 DSTBP0# Source Synch Input/Output

C1 DRDY# Common Clock Input/Output C10 VSS Power/Other C11 D11# Source Synch Input/Output C12 D14# Source Synch Input/Output C13 VSS Power/Other C14 D52# Source Synch Input/Output C15 D51# Source Synch Input/Output C16 VSS Power/Other C17 DSTBP3# Source Synch Input/Output C18 D54# Source Synch Input/Output C19 VSS Power/Other

C2 BNR# Common Clock Input/Output C20 DBI3# Source Synch Input/Output C21 D58# Source Synch Input/Output C22 VSS Power/Other C23 VCCIOPLL Power/Other C24 VSS Power/Other C25 VTT Power/Other C26 VTT Power/Other C27 VTT Power/Other C28 VTT Power/Other C29 VTT Power/Other

C3 LOCK# Common Clock Input/Output C30 VTT Power/Other

C4 VSS Power/Other

C5 D01# Source Synch Input/Output

C6 D03# Source Synch Input/Output

C7 VSS Power/Other

C8 DSTBN0# Source Synch Input/Output

C9 BPMb1# Common Clock Input/Output

D1 RESERVED

D10 D22# Source Synch Input/Output D11 D15# Source Synch Input/Output D12 VSS Power/Other D13 D25# Source Synch Input/Output

Signal Buffer

Type

Direction

Table 4-2. Numerical Land

Assignment

Land

Land Name

D14 RESERVED D15 VSS Power/Other D16 RESERVED D17 D49# Source Synch Input/Output D18 VSS Power/Other D19 DBI2# Source Synch Input/Output

D2 ADS# Common Clock Input/Output D20 D48# Source Synch Input/Output D21 VSS Power/Other D22 D46# Source Synch Input/Output D23 VCCPLL Power/Other D24 VSS Power/Other D25 VTT Power/Other D26 VTT Power/Other D27 VTT Power/Other D28 VTT Power/Other D29 VTT Power/Other

D3 VSS Power/Other D30 VTT Power/Other

D4 HIT# Common Clock Input/Output

D5 VSS Power/Other

D6 VSS Power/Other

D7 D20# Source Synch Input/Output

D8 D12# Source Synch Input/Output

D9 VSS Power/Other

E10 D21# Source Synch Input/Output E11 VSS Power/Other E12 DSTBP1# Source Synch Input/Output E13 D26# Source Synch Input/Output E14 VSS Power/Other E15 D33# Source Synch Input/Output E16 D34# Source Synch Input/Output E17 VSS Power/Other E18 D39# Source Synch Input/Output E19 D40# Source Synch Input/Output

E2 VSS Power/Other E20 VSS Power/Other E21 D42# Source Synch Input/Output E22 D45# Source Synch Input/Output

Signal Buffer

Type

Direction

Datasheet

Land Listing and Signal Descriptions

Table 4-2. Numerical Land

Assignment

Land

Land Name

E23 RESERVED E24 FC10 Power/Other E25 VSS Power/Other E26 VSS Power/Other E27 VSS Power/Other E28 VSS Power/Other E29 FC26 Power/Other

E3 TRDY# Common Clock Input E4 HITM# Common Clock Input/Output E5 FC20 Power/Other E6 RESERVED E7 RESERVED E8 VSS Power/Other

E9 D19# Source Synch I nput/Output F10 VSS Power/Other F11 D23# Source Synch Input/Output F12 D24# Source Synch Input/Output F13 VSS Power/Other F14 D28# Source Synch Input/Output F15 D30# Source Synch Input/Output F16 VSS Power/Other F17 D37# Source Synch Input/Output F18 D38# Source Synch Input/Output F19 VSS Power/Other

F2 GTLREF2 Power/Other Input F20 D41# Source Synch Input/Output F21 D43# Source Synch Input/Output F22 VSS Power/Other F23 RESERVED F24 TESTHI7 Power/Other Input F25 TESTHI2 Power/Other Input F26 TESTHI0 Power/Other Input F27 VTT_SEL Power/Other Output F28 BCLK0 Clock Input F29 RESERVED

F3 BR0# Common Clock Input/Output

F4 VSS Power/Other

F5 RS1# Common Clock Input

F6 FC21 Power/Other

Signal Buffer

Type

Direction

Table 4-2. Numerical Land

Assignment

Land

Land Name

F7 VSS Power/Other F8 D17# Source Synch Input/Output F9 D18# Source Synch Input/Output

G1 BPMb0# Common Clock Input/Output G10 GTLREF3 Power/Other Input G11 DBI1# Source Synch Input/Output G12 DSTBN1# Source Synch Input/Output G13 D27# Source Synch Input/Output G14 D29# Source Synch Input/Output G15 D31# Source Synch Input/Output G16 D32# Source Synch Input/Output G17 D36# Source Synch Input/Output G18 D35# Source Synch Input/Output G19 DSTBP2# Source Synch Input/Output

G2 COMP2 Power/Other Input G20 DSTBN2# Source Synch Input/Output G21 D44# Source Synch Input/Output G22 D47# Source Synch Input/Output G23 RESET# Common Clock Input G24 TESTHI6 Power/Other Input G25 TESTHI3 Power/Other Input G26 TESTHI5 Power/Other Input G27 TESTHI4 Power/Other Input G28 BCLK1 Clock Input G29 BSEL0 Asynch CMOS Output

G3 BPMb3# Common Clock Input/Output G30 BSEL2 Asynch CMOS Output

G4 BPMb2# Common Clock Input/Output

G5 PECI Power/Other Input/Output

G6 RESERVED

G7 DEFER# Common Clock Input

G8 BPRI# Common Clock Input

G9 D16# Source Synch Input/Output

H1 GTLREF0 Power/Other Input H10 VSS Power/Other H11 VSS Power/Other H12 VSS Power/Other H13 VSS Power/Other H14 VSS Power/Other

Signal Buffer

Type

Direction

60 Datasheet

Land Listing and Signal Descriptions

Table 4-2. Numerical Land

Assignment

Land

Land Name

H15 FC32 Power/Other H16 FC33 Power/Other H17 VSS Power/Other H18 VSS Power/Other H19 VSS Power/Other

H2 GTLREF1 Power/Other Input H20 VSS Power/Other H21 VSS Power/Other H22 VSS Power/Other H23 VSS Power/Other H24 VSS Power/Other H25 VSS Power/Other H26 VSS Power/Other H27 VSS Power/Other H28 VSS Power/Other H29 FC15 Power/Other

H3 VSS Power/Other H30 BSEL1 Asynch CMOS Output

H4 FC35 Power/Other

H5 TESTHI10 Power/Other Input

H6 VSS Power/Other

H7 VSS Power/Other

H8 VSS Power/Other

H9 VSS Power/Other

VTT_OUT_LE

J10 VCC Power/Other J11 VCC Power/Other J12 VCC Power/Other J13 VCC Power/Other J14 VCC Power/Other J15 VCC Power/Other J16 FC31 Power/Other J17 FC34 Power/Other J18 VCC Power/Other J19 VCC Power/Other

J2 FC3 Power/Other J20 VCC Power/Other J21 VCC Power/Other J22 VCC Power/Other

Signal Buffer

Type

Power/Other Output

Direction

Table 4-2. Numerical Land

Assignment

Land

Land Name

J23 VCC Power/Other J24 VCC Power/Other J25 VCC Power/Other J26 VCC Power/Other J27 VCC Power/Other J28 VCC Power/Other J29 VCC Power/Other

J3 FC22 Power/Other

J30 VCC Power/Other

J4 VSS Power/Other J5 REQ1# Source Synch Input/Output J6 REQ4# Source Synch Input/Output J7 VSS Power/Other J8 VCC Power/Other

J9 VCC Power/Other K1 LINT0 Asynch CMOS Input K2 VSS Power/Other

K23 VCC Power/Other K24 VCC Power/Other K25 VCC Power/Other K26 VCC Power/Other K27 VCC Power/Other K28 VCC Power/Other K29 VCC Power/Other

K3 A20M# Asynch CMOS Input

K30 VCC Power/Other

K4 REQ0# Source Synch Input/Output K5 VSS Power/Other K6 REQ3# Source Synch Input/Output K7 VSS Power/Other K8 VCC Power/Other

L1 LINT1 Asynch CMOS Input

L2 TESTHI13 Power/Other Input L23 VSS Power/Other L24 VSS Power/Other L25 VSS Power/Other L26 VSS Power/Other L27 VSS Power/Other L28 VSS Power/Other

Signal Buffer

Type

Direction

Datasheet

Land Listing and Signal Descriptions

Table 4-2. Numerical Land

Assignment

Land

Land Name

L29 VSS Power/Other

L3 VSS Power/Other

L30 VSS Power/Other

L4 A06# Source Synch Input/Output L5 A03# Source Synch Input/Output L6 VSS Power/Other L7 VSS Power/Other L8 VCC Power/Other M1 VSS Power/Other

M2 THERMTRIP# Asynch CMOS Output M23 VCC Power/Other M24 VCC Power/Other M25 VCC Power/Other M26 VCC Power/Other M27 VCC Power/Other M28 VCC Power/Other M29 VCC Power/Other

M3 STPCLK# Asynch CMOS Input M30 VCC Power/Other

M4 A07# Source Synch Input/Output

M5 A05# Source Synch Input/Output

M6 REQ2# Source Synch Input/Output

M7 VSS Power/Other

M8 VCC Power/Other

N1 PWRGOOD Power/Other Input

N2 IGNNE# Asynch CMOS Input N23 VCC Power/Other N24 VCC Power/Other N25 VCC Power/Other N26 VCC Power/Other N27 VCC Power/Other N28 VCC Power/Other N29 VCC Power/Other

N3 VSS Power/Other N30 VCC Power/Other

N4 RESERVED

N5 RESERVED

N6 VSS Power/Other

N7 VSS Power/Other

Signal Buffer

Type

Direction

Table 4-2. Numerical Land

Assignment

Land

Land Name

N8 VCC Power/Other P1 TESTHI11 Power/Other Input

P2 SMI# Asynch CMOS Input P23 VSS Power/Other P24 VSS Power/Other P25 VSS Power/Other P26 VSS Power/Other P27 VSS Power/Other P28 VSS Power/Other P29 VSS Power/Other

P3 INIT# Asynch CMOS Input P30 VSS Power/Other

P4 VSS Power/Other

P5 RESERVED

P6 A04# Source Synch Input/Output

P7 VSS Power/Other

P8 VC C Power/Other

R1 COMP3 Power/Other Input

R2 VSS Power/Other R23 VSS Power/Other R24 VSS Power/Other R25 VSS Power/Other R26 VSS Power/Other R27 VSS Power/Other R28 VSS Power/Other R29 VSS Power/Other

R3 FERR#/PBE# Asynch CMOS Output R30 VSS Power/Other

R4 A08# Source Synch Input/Output

R5 VSS Power/Other

R6 ADSTB0# Source Synch Input/Output

R7 VSS Power/Other

R8 VCC Power/Other

T1 COMP1 Power/Other Input

T2 FC4 Power/Other T23 VCC Power/Other T24 VCC Power/Other T25 VCC Power/Other T26 VCC Power/Other

Signal Buffer

Type

Direction

62 Datasheet

Land Listing and Signal Descriptions

Table 4-2. Numerical Land

Assignment

Land

Land Name

T27 VCC Power/Other T28 VCC Power/Other T29 VCC Power/Other

T3 VSS Power/Other

T30 VCC Power/Other

T4 A11# Source Synch Input/Output T5 A09# Source Synch Input/Output T6 VSS Power/Other T7 VSS Power/Other T8 VCC Power/Other U1 TDO_M TAP Output

U2 FC29 Power/Other U23 VCC Power/Other U24 VCC Power/Other U25 VCC Power/Other U26 VCC Power/Other U27 VCC Power/Other U28 VCC Power/Other U29 VCC Power/Other

U3 FC30 Power/Other U30 VCC Power/Other

U4 A13# Source Synch Input/Output

U5 A12# Source Synch Input/Output

U6 A10# Source Synch Input/Output

U7 VSS Power/Other

U8 VCC Power/Other

V1 MSID1 Power/Other Output

V2 RESERVED V23 VSS Power/Other V24 VSS Power/Other V25 VSS Power/Other V26 VSS Power/Other V27 VSS Power/Other V28 VSS Power/Other V29 VSS Power/Other

V3 VSS Power/Other V30 VSS Power/Other

V4 A15# Source Synch Input/Output

V5 A14# Source Synch Input/Output

Signal Buffer

Type

Direction

Table 4-2. Numerical Land

Assignment

Land

Land Name

V6 VSS Power/Other V7 VSS Power/Other

V8 VCC Power/Other W1 MSID0 Power/Other Output W2 TDI_M Power/Other Input

W23 VCC Power/Other W24 VCC Power/Other W25 VCC Power/Other W26 VCC Power/Other W27 VCC Power/Other W28 VCC Power/Other W29 VCC Power/Other

W3 TESTHI1 Power/Other Input

W30 VCC Power/Other

W4 VSS Power/Other W5 A16# Source Synch Input/Output W6 A18# Source Synch Input/Output W7 VSS Power/Other W8 VCC Power/Other

Y2 VSS Power/Other Y23 VCC Power/Other Y24 VCC Power/Other Y25 VCC Power/Other Y26 VCC Power/Other Y27 VCC Power/Other Y28 VCC Power/Other Y29 VCC Power/Other

Y3 PSI# Power/Other Y30 VCC Power/Other

Y4 A20# Source Synch Input/Output

Y5 VSS Power/Other

Y6 A19# Source Synch Input/Output

Y7 VSS Power/Other

Y8 VCC Power/Other

FC0/

BOOTSELECT

Signal Buffer

Type

Power/Other

Direction

Datasheet

4.2 Alphabetical Signals Reference

Table 4-3. Signal Description (Sheet 1 of 10)

Name Type Description

A[35:3]# (Address) define a 2 space. In sub-phase 1 of the address phase, these signals transmit the address of a transaction. In sub-phase 2, these signals transmit transaction type information. These signals must connect the

A[35:3]#

A20M# Input

ADS#

ADSTB[1:0]#

Input/

Output

Input/

Output

Input/

Output

appropriate pins/lands of all agents on the processor FSB. A[35:3]# are source synchronous signals and are latched into the receiving buffers by ADSTB[1:0]#.

On the active-to-inactive transition of RESET#, the proce ssor samples a subset of the A[35:3]# signals to determine power-on configuration. See Section 6.1 for more details.

If A20M# (Address-20 Mask) is asserted, the processor masks physical address bit 20 (A20#) before looking up a line in any internal cache and before driving a read/write transaction on the bus. Asserting A20M# emulates the 8086 processor's address wraparound at the 1-MB boundary. Assertion of A20M# is only supported in real mode.

A20M# is an asynchronous signal. However, to ensure recognition of this signal following an Input/Output write instruction, it must be valid along with the TRDY# assertion of the corresponding Input/ Output Write bus transaction.

ADS# (Address Strobe) is asserted to indicate the validity of the transaction address on the A[35:3]# and REQ[4:0]# signals. All bus agents observe the ADS# activation to begin protocol checking, address decode, internal snoop, or deferred reply ID match operations associated with the new transaction.

Address strobes are used to latch A[35:3]# and REQ[4:0]# on their rising and falling edges. Strobes are associated with signals as shown below.

Signals

Land Listing and Signal Descriptions

-byte physical memory address

Associated

Strobe

BCLK[1:0] Input

BNR#

64 Datasheet

Input/

Output

REQ[4:0]#, A[16:3]# ADSTB0#

A[35:17]# ADSTB1#

The differential pair BCLK (Bus Clock) determines the FSB frequency. All processor FSB agents must receive these signals to drive their outputs and latch their inputs.

All external timing parameters are speci fied with r espect to the ri sing edge of BCLK0 crossing V

BNR# (Block Next Request) is used to assert a bus stall by any bus agent unable to accept new bus transactions. During a bus stall, the current bus owner cannot issue any new transactions.

CROSS

Land Listing and Signal Descriptions

Table 4-3. Signal Description (Sheet 2 of 10)

Name Type Description

BPM[5:0]# and BPMb[3:0]# (Breakpoint Monitor) are breakpoint and performance monitor signals. They are outputs from the processor which indicate the status of breakpoints and programmable counters used for monitoring processor performance. BPM[5:0]# and BPMb[3:0]# should connect the appropriate pins/lands of all processor FSB agents. BPM[3:0]# are associated with core 0. BPMb[3:0]# are associated with core 1.

BPM[5:0]# BPMb[3:0]#

Input/

Output

BPRI# Input

BR0#

Input/

Output

BSEL[2:0] Output

COMP[3:0], COMP8

Analog

BPM4# provides PRDY# (Probe Ready) functionality for the TAP port. PRDY# is a processor output used by debug tools to determine processor debug readiness.

BPM5# provides PREQ# (Probe Request) functionality for the TAP port. PREQ# is used by debug tools to request debug operation of the processor.

Refer to the appropriate platform design guide for more detailed information.

These signals do not have on-die termination. Refer to Section 2.7.2, and appropriate platform design guide for termination requirements.

BPRI# (Bus Priority Request) is used to arbitrate for ownershi p of the processor FSB. It must connect the appropriate pins/lands of all processor FSB agents. Observing BPRI# active (as asserted by the priority agent) causes all other agents to stop issuing new requests, unless such requests are part of an ongoing locked operation. The priority agent keeps BPRI# asserted until all of its requests are completed, then releases the bus by de-asserting BPRI#.

BR0# drives the BREQ0# signal in the system and is used by the processor to request the bus. During power-on configuration this signal is sampled to determine the agent ID = 0.

This signal does not have on-die termination and must be terminated. The BCLK[1:0] frequency select signals BSEL[2:0] are used to select

the processor input clock frequency. Table 2-15 defines the possible combinations of the signals and the frequency associated with each combination. The required frequency is determined by the processor, chipset and clock synthesizer. All agents must operate at the same frequency. For more information about these signals, including termination recommendations refer to Section 2.9.2 and the appropriate platform design guidelines.

COMP[3:0] and COMP8 must be terminated to V board using precision resistors. Refer to the appropriate platform design guide for details on implementation.

on the system

Datasheet

Table 4-3. Signal Description (Sheet 3 of 10)

Name Type Description

D[63:0]# (Data) are the data signals. These signals provide a 64-bit data path between the processor FSB agents, and must connect the appropriate pins/lands on all such agents. The data driver asserts DRDY# to indicate a valid data transfer.

D[63:0]# are quad-pumped signals and will, thus, be driven four times in a common clock period. D[63:0]# are latched off the falling edge of both DSTBP[3:0]# and DSTBN[3:0]#. Each group of 16 data signals correspond to a pair of one DSTBP# and one DSTBN#. The following table shows the grouping of data signals to data strobes and DBI#.

Quad-Pumped Signal Groups

D[63:0]#

Input/

Output

Data Group

D[15:0]# 0 0 D[31:16]# 1 1 D[47:32]# 2 2 D[63:48]# 3 3

DSTBN#/

DSTBP#

Land Listing and Signal Descriptions

DBI#

DBI[3:0]#

Input/

Output

DBR# Output

DBSY#

Input/

Output

Furthermore, the DBI# signals determine the polarity of the data signals. Each group of 16 data signals corresponds to one DBI# signal. When the DBI# signal is active, the corresponding data group is inverted and therefore sampled active high.

DBI[3:0]# (Data Bus Inversion) are source synchronous and indicate the polarity of the D[63:0]# signals.The DBI[3:0]# signals are activated when the data on the data bus is inverted. If more than half the data bits, within a 16-bit group, would have been asserted electrically low, the bus agent may invert the data bus signals for that particular sub-phase for that 16-bit group.

DBI[3:0] Assignment To Data Bus

Bus Signal

Data Bus

Signals

DBI3# D[63:48]# DBI2# D[47:32]# DBI1# D[31:16]#

DBR# (Debug Reset) is used only in processor systems where no debug port is implemented on the system board. DBR# is used by a debug port interposer so that an in-target probe can drive system reset. If a debug port is implemented in the system, DBR# is a no connect in the system. DBR# is not a processor signal.

DBSY# (Data Bus Busy) is asserted by the agent responsible for driving data on the processor FSB to indicate that the data bus is in use. The data bus is released after DBSY# is de-asserted. This signal must connect the appropriate pins/lands on all processor FSB agents.

66 Datasheet

Land Listing and Signal Descriptions

Table 4-3. Signal Description (Sheet 4 of 10)

Name Type Description

DEFER# is asserted by an agent to indicate that a transaction cannot be ensured in-order completion. Assertion of DEFER# is normally the

DEFER# Input

DPRSTP# Input

DPSLP# Input

responsibility of the addressed memory or input/output agent. This signal must connect the appropriate pins/lands of all processor FSB agents.

DPRSTP#, when asserted on the platform, causes the processor to transition from the Deep Sleep State to the Deeper Sleep state. To return to the Deep Sleep State, DPRSTP# must be deasserted. Use of the DPRSTP# pin, and corresponding low power state, requires chipset support and may not be available on all platforms. Refer to the appropriate platform design guide for implementation details.

NOTE: Some processors may not have the Deeper Sleep State

enabled, refer to the Specification Update for specific sku and stepping guidance.

DPSLP#, when asserted on the platform, causes the processor to transition from the Sleep State to the Deep Sleep state. To return to the Sleep State, DPSLP# must be deasserted. Us e of the DPSLP# pin, and corresponding low power state, requires chipset support and may not be available on all platforms. Refer to the appropriate platform design guide for implementation details.

DRDY#

DSTBN[3:0]#

DSTBP[3:0]#

FC0/ BOOTSELECT

Input/

Output

Input/

Output

Input/

Output

Other

NOTE: Some processors may not have the Deep Sleep State enabled,

refer to the Specification Update for specific sku and stepping guidance.

DRDY# (Data Ready) is asserted by the data driver on each data transfer, indicating valid data on the data bus. In a multi-common clock data transfer, DRDY# may be de-asserted to insert idle clocks. This signal must connect the appropriate pins/lands of all processor FSB agents.

DSTBN[3:0]# are the data strobes used to latch in D[63:0]#.

Signals

Associated

Strobe

D[15:0]#, DBI0# DSTBN0# D[31:16]#, DBI1# DSTBN1# D[47:32]#, DBI2# DSTBN2# D[63:48]#, DBI3# DSTBN3#

DSTBP[3:0]# are the data strobes used to latch in D[63:0]#.

Signals

Associated

Strobe

D[15:0]#, DBI0# DSTBP0# D[31:16]#, DBI1# DSTBP1# D[47:32]#, DBI2# DSTBP2# D[63:48]#, DBI3# DSTBP3#

FC0/BOOTSELECT is not used by the Yorkfield processor. When this land is tied to Vss previous processors based on the Intel NetBurst® microarchitecture should be disabled and prevented from booting. Refer to appropriate platform design guide for termination guidance.

Datasheet

Table 4-3. Signal Description (Sheet 5 of 10)

Name Type Description

FCx Other

FERR#/PBE# Output

GTLREF[3:0] Input

Input/

HIT#

HITM#

Output

Input/

Output

IERR# Output

IGNNE# Input

FC signals are signals that are available for compatibility with other processors. Refer to the appropriate platform design guide for more information on how these are connected on the motherboard.

FERR#/PBE# (floating point error/pending break event) is a multiplexed signal and its meaning is qualified by STPCLK#. When STPCLK# is not asserted, FERR#/PBE# indicates a floating-point error and will be asserted when the processor detects an unmasked floating-point error. When STPCLK# is not asserted, FERR#/PBE# is similar to the ERROR# signal on the Intel 387 coprocessor, and is included for compatibility with systems using MS-DOS*-type floatingpoint error reporting. When STPCLK# is asserted, an assertion of FERR#/PBE# indicates that the processor has a pending break event waiting for service. The assertion of FERR#/PBE# indicates that the processor should be returned to the Normal state. For additional information on the pending break event functionality, including the identification of support of the feature and enable/disable information, refer to volume 3 of the Intel Architecture Software

Developer's Manual and the Intel Processor Identification and the CPUID Instruction application note.

GTLREF[3:0] determine the signal reference level for GTL+ input signals. GTLREF is used by the GTL+ receivers to determine if a signal is a logical 0 or logical 1. Refer to the applicable platform design guide for more information.

HIT# (Snoop Hit) and HITM# (Hit Modified) convey tr ansaction snoop operation results. Any FSB agent may assert both HIT# and HITM# together to indicate that it requires a snoop stall, which can be continued by reasserting HIT# and HITM# together.

IERR# (Internal Error) is asserted by a processor as the result of an internal error. Assertion of IERR# is usually accompanied by a SHUTDOWN transaction on the processor FSB. This transaction may optionally be converted to an external error signal (e.g., NMI) by system core logic. The processor will keep IERR# asserted until the assertion of RESET#.

This signal does not have on-die termination. Refer to Section 2.7.2 for termination requirements.

IGNNE# (Ignore Numeric Error) is asserted to the processor to ignore a numeric error and continue to execute noncontrol floating-point instructions. If IGNNE# is de-asserted, the processor generates an exception on a noncontrol floating-point instruction if a previous floating-point instruction caused an error. IGNNE# has no effect when the NE bit in control register 0 (CR0) is set.

IGNNE# is an asynchronous signal. However, to ensure recognition of this signal following an Input/Output write instruction, it must be valid along with the TRDY# assertion of the corresponding Input/ Output Write bus transaction.

Land Listing and Signal Descriptions

68 Datasheet

Land Listing and Signal Descriptions

Table 4-3. Signal Description (Sheet 6 of 10)

Name Type Description

INIT# (Initialization), when asserted, resets integer registers inside the processor without affecting its internal caches or floating-point registers. The processor then begins e xecutio n at the power -on Res et vector configured during power-on configuration. The processor

INIT# Input

ITP_CLK[1:0] Input

LINT[1:0] Input

LOCK#

Input/

Output

MSID[1:0] Output

PECI

PROCHOT#

Input/

Output

Input/

Output

continues to handle snoop requests during INIT# assertion. INIT# is an asynchronous signal and must connect the appropriate pins/lands of all processor FSB agents.

If INIT# is sampled active on the active to inactive transition of RESET#, then the processor executes its Built-in Self-Test (BIST).

ITP_CLK[1:0] are copies of BCLK that are used only in processor systems where no debug port is implemented on the system board. ITP_CLK[1:0] are used as BCLK[1:0] references for a debug port implemented on an interposer. If a debug port is implemented in the system, ITP_CLK[1:0] are no connects in the system. These are not processor signals.

LINT[1:0] (Local APIC Interrupt) must connect the appropriate pins/ lands of all APIC Bus agents. When the APIC is disabled, the LINT0 signal becomes INTR, a maskable interrupt request signal, and LINT1 becomes NMI, a nonmaskable interrupt. INTR and NMI are backward compatible with the signals of those names on the Pentium processor . Both signals are asynchronous.

Both of these signals must be software configured via BIOS programming of the APIC register space to be used either as NMI/ INTR or LINT[1:0]. Because the APIC is enabled by default after Reset, operation of these signals as LINT[1:0] is the default configuration.

LOCK# indicates to the system that a transaction must occur atomically. This signal must connect the appropriate pins/lands of all processor FSB agents. For a locked sequence of transactions, LOCK# is asserted from the beginning of the first transaction to the end of the last transaction.

When the priority agent asserts BPRI# to arbitrate for ownership of the processor FSB, it will wait until it observes LOCK# de-asserted. This enables symmetric agents to retain ownership of the processor FSB throughout the bus locked operation and ensure the atomicity of lock.

On a Yorkfield processor these signals are not connected on the package (they are floating). As an alternative to MSID, Intel has implemented the Power Segment Identifier (PSID) to report the maximum Thermal Design Power of the processor. Refer to the Platform Design Guide for additional information regarding PSID.

PECI is a proprietary one-wire bus interface. See Chapter 5.3 for details.

As an output, PROCHOT# (Processor Hot) will go active when the processor temperature monitoring sensor detects that the processor has reached its maximum safe operating temperature. This indicates that the processor Thermal Control Circuit (TCC) has been activated, if enabled. As an input, assertion of PROCHOT# by the system will activate the TCC, if enabled. The TCC will remain active until the system de-asserts PROCHOT#. See Section 5.2.4 for more details.

Datasheet

Table 4-3. Signal Description (Sheet 7 of 10)

Name Type Description

PWRGOOD (Power Good) is a processor input. The processor requires this signal to be a clean indication that the clocks and power supplies are stable and within their specifications. ‘Clean’ implies that the signal will remain low (capable of sinking leakage current), without glitches, from the time that the power supplies are turned on until

PWRGOOD Input

REQ[4:0]#

Input/

Output

RESET# Input

RESERVED

RS[2:0]# Input

SKTOCC# Output

SMI# Input

they come within specification. The signal must then transition monotonically to a high state. PWRGOOD can be driven inactive at any time, but clocks and power must again be stable before a subsequent rising edge of PWRGOOD. The PWRGOOD signal must be supplied to the processor; it is used to protect internal circuits against voltage sequencing issues. It should be driven high throughout boundary scan operation.

REQ[4:0]# (Request Command) must connect the appropriate pins/ lands of all processor FSB agents. They are asserted by the current bus owner to define the currently active transaction type. These signals are source synchronous to ADSTB0#.

Asserting the RESET# signal resets the processor to a known state and invalidates its internal caches without writing back any of their contents. For a power-on Reset, RESET# must stay active for at least one millisecond after V specifications. On observing active RESET#, all FSB agents will deassert their outputs within two clocks. RESET# must not be kept asserted for more than 10 ms while PWRGOOD is asserted.

A number of bus signals are sampled at the active-to-inactive transition of RESET# for power-on configuration. These configuration options are described in the Section 6.1.

This signal does not have on-die termination and must be terminated on the system board.

All RESERVED lands must remain unconnected. Connection of these lands to V

can result in component malf unction or incompatibility with f u ture processors.

RS[2:0]# (Response Status) are driven by the response agent (the agent responsible for completion of the current transaction), and must connect the appropriate pins/lands of all processor FSB agents.

SKTOCC# (Socket Occupied) will be pulled to ground by the processor. System board designers may use this signal to determine if the processor is present.

SMI# (System Management Int errupt) is asserted a synchronously by system logic. On accepting a System Management Interrupt, the processor saves the current state and enter System Management Mode (SMM). An SMI Acknowledge transaction is issued, and the processor begins program execution from the SMM handler.

If SMI# is asserted during the de-assertion of RESET#, the processor will tri-state its outputs.

Land Listing and Signal Descriptions

and BCLK have reached their proper

, VSS, VTT, or to any other signal (including each other)

70 Datasheet

Land Listing and Signal Descriptions

Table 4-3. Signal Description (Sheet 8 of 10)

Name Type Description

STPCLK# (Stop Clock), when asserted, causes the processor t o enter a low power Stop-Grant state. The processor issues a Stop-Grant Acknowledge transaction, and stops providing internal clock signals to all processor core units except the FSB and APIC units. The

STPCLK# Input

TCK Input

TDI, TDI_M Input

TDO, TDO_M Output

TESTHI[13, 11:10,7:0]

Input

THERMTRIP# Output

TMS Input

TRDY# Input

TRST# Input

processor continues to snoop bus transactions and service interrupts while in Stop-Grant state. When STPCLK# is de-asserted, the processor restarts its internal clock to all units and resumes execution. The assertion of STPCLK# has no effect on the bus clock; STPCLK# is an asynchronous input.

TCK (Test Clock) provides the clock input for the processor Test Bus (also known as the Test Access Port).

TDI and TDI_M (Test Data In) transfers serial test data into the processor. TDI and TDI_M provide the serial input needed for JTAG specification support. TDI connects to core 0. TDI_M con nects to core

1. Refer to the appropriate platform design guide for more information.

TDO and TDO_M (Test Data Out) transfers serial test data out of the processor . TDO and TDO_M provide the serial output needed for JTAG specification support. TDO connects to core 1. TDO_M connects to core 0. Refer to the appropriate platform design guide for more information.

TESTHI[13,11:10,7:0] must be connected to the processor’s appropriate power source (refer to VTT_OUT_LEFT and VTT_OUT_RIGHT signal description) through a resistor for proper processor operation. See Section 2.4 for more details.

In the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached a temperature approximately 20 °C above the maximum T THERMTRIP# (Thermal Trip) indicates the processor junction temperature has reached a level beyond where permanent silicon damage may occur. Upon assertion of THERMTRIP#, the processor will shut off its internal clocks (thus, halting program execution) in an attempt to reduce the processor junction temperature. To protect the processor, its core voltage (V assertion of THERMTRIP#. Driving of the THERMTRIP# signal is enabled within 10 µs of the assertion of PWRGOOD (provided V V

are asserted) and is disabled on de-assertion of PWRGOOD (if VTT

or V

are not valid, THERMTRIP# may also be disabled). Once

activated, THERMTRIP# remains latched until PWRGOOD, V is de-asserted. While the de-assertion of the PWRGOOD, V signal will de-assert THERMTRIP#, if the processor’s junction temperature remains at or above the trip level, THERMTRIP# will again be asserted within 10 µs of the assertion of PWRGOOD (provided V

TMS (Test Mode Select) is a JTAG specification support signal used by debug tools.

TRDY# (Target Ready) is asserted by the target to indicate that it is ready to receive a write or implicit writeback data transfer. TRDY# must connect the appropriate pins/lands of all FSB agents.

TRST# (Test Reset) resets the Test Access Port (TAP) logic. TRST# must be driven low during power on Reset. Refer to the Debug Port Design Guide for UP / DP Systems for complete implementation details.

and V

are valid).

. Assertion of

) must be removed following the

or V

and

Datasheet

Table 4-3. Signal Description (Sheet 9 of 10)

Name Type Description

VCC Input

VCCA Input

VCCIOPLL Input

VCCPLL Input VCCPLL provides isolated power for internal processor FSB PLLs.

VCC_SENSE Output

VCC_MB_ REGULATION

Output

VID[7:0] Output

VID_SELECT Output

VRDSEL Input

VSS Input

VSSA Input

VSS_SENSE Output

VSS_MB_ REGULATION

Output

VTT Miscellaneous voltage supply.

VCC are the power pins for the processor. The voltage supplied to these pins is determined by the VID[7:0] pins.

VCCA provides isolated power for internal PLLs on previous generation processors. It may be left as a No-Connect on boards supporting the Wolfdale processor.

VCCIOPLL provides isolated power for internal processor FSB PLLs on previous generation processors. It may be left as a No-Connect on boards supporting the Wolfdale processor.

VCC_SENSE is an isolated low impedance connection to processor core power (V the silicon with little noise.

This land is provided as a voltage regulator feedback sense point for V

. It is connected internally in the processor package to the sense

point land U27 as described in the Voltage Regulator-Down (VRD)

11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket.

The VID (Voltage ID) signals are used to support automatic selection of power supply voltages (V design guide or the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for more information. The voltage supply for these signals must be valid before the VR can supply V output must be disabled until the voltage supply for the VID signals becomes valid. The VID signals are needed to support the processor voltage specification variations. See Table 2-1 for definitions of these signals. The VR must supply the voltage that is requested by the signals, or disable itself.

This land is tied high on the processor package and is used by the VR to choose the proper VID table. Refer to the appropriate platform design guide or the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for more information.

This input should be left as a no connect in order for the processor to boot. The processor will not boot on legacy platforms where this land is connected to V

VSS are the ground pins for the processor and should be connected to the system ground plane.

VSSA provides isolated ground for internal PLLs on previous generation processors. It may be left as a No-Connect on boards supporting the Wolfdale processor.

VSS_SENSE is an isolated low impedance connection to processor core V with little noise.

. It can be used to sense or measure gro un d n ear th e si licon

This land is provided as a voltage regulator feedback sense point for V

. It is connected internally in the processor package to the sense

point land V27 as described in the Voltage Regulator-Down (VRD)

11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket.

Land Listing and Signal Descriptions

). It can be used to sense or measure voltage near

). Refer to the appropriate platform

to the processor. Conversely, the VR

72 Datasheet

Land Listing and Signal Descriptions

Table 4-3. Signal Description (Sheet 10 of 10)

Name Type Description

VTT_OUT_LEFT

Output

VTT_OUT_RIGHT

VTT_SEL Output

The VTT_OUT_LEFT and VTT_OUT_RIGHT signals are included to provide a voltage supply for some signals that require termination to V

on the motherboard. Refer to the appropriate platform design

guide for details on implementation. The VTT_SEL signal is used to select the correct V

the processor. This land is connected internally in the package to V

voltage level for

Datasheet

Land Listing and Signal Descriptions

74 Datasheet

Thermal Specifications and Design Considerations

5 Thermal Specifications and

Design Considerations

5.1 Processor Thermal Specifications

The processor requires a thermal solution to maintain temperatures within the operating limits as set forth in Section 5.1.1. Any attempt to operate the processor outside these operating limits may result in permanent damage to the processor and potentially other components within the system. As processor technology changes, thermal management becomes increasingly crucial when building computer systems. Maintaining the proper thermal environment is key to reliable, long-term system operation.

A complete thermal solution includes both component and system level thermal management features. Component level thermal solutions can include active or passive heatsinks attached to the processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of system fans combined with ducting and venting.

For more information on designing a component level thermal solution, refer to the Yorkfield Processor Thermal and Mechanical Design Guidelines Addendum.

Note: The boxed processor will ship with a component thermal solution. Refer to Chapter 7

for details on the boxed processor.

5.1.1 Thermal Specifications

To allow for the optimal operation and long-term reliability of Intel processor-based systems, the system/processor thermal solution should be designed such that the processor remains within the minimum and maximum case temperature (T specifications when operating at or below the Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not designed to provide this level of thermal capability may affect the long-term reliability of the processor and system. For more details on thermal solution design, refer to the Yorkfield Processor Thermal and Mechanical Design Guidelines Addendum.

The processor uses a methodology for managing processor temperatures which is intended to support acoustic noise reduction through fan speed control. Selection of the appropriate fan speed is based on the relative temperature data reported by the processor’s Platform Environment Control Interface (PECI) bus as described in

Section 5.3. If the value reported via PECI is less than T

temperature is permitted to exceed the Thermal Profile. If the value reported via PECI is greater than or equal to T at or below the temperature as specified by the thermal profile. The temperature reported over PECI is always a negative value and represents a delta below the onset of thermal control circuit (TCC) activation, as indicated by PROCHOT# (see Section 5.2). Systems that implement fan speed control must be designed to take these conditions in to account. Systems that do not alter the fan speed only need to ensure the case temperature meets the thermal profile specifications.

In order to determine a processor's case temperature specification based on the thermal profile, it is necessary to accurately measure processor power dissipation. Intel has developed a methodology for accurate power measurement that correlates to Intel test temperature and voltage conditions. Refer to the Yorkfie ld Proce ssor Thermal and

Mechanical Design Guidelines Addendum and the Live Die System Thermal Testing Basics for the details of this methodology.

CONTROL

, then the processor case temperature must remain

CONTROL

, then the case

)

Datasheet

The case temperature is defined at the geometric top center of the processor. Analysis indicates that real applications are unlikely to cause the processor to consume maximum power dissipation for sustained time periods. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP) indicated in

Table 5-1 instead of the maximum processor power consumption. The Thermal Monitor

feature is designed to protect the processor in the unlikely event that an application exceeds the TDP recommendation for a sustained periods of time. For more details on the usage of this feature, refer to Section 5.2. To ensure maximum flexibility for future requirements, systems should be designed to the Flexible Motherboard (FMB) guidelines, even if a processor with a lower thermal dissipation is currently planned. In

all cases the Thermal Monitor or Thermal Monitor 2 feat ure must be enabled for the processor to remain within specification.

Table 5-1. Processor Thermal Specifications

Thermal Specifications and Design Considerations

Processor

Number

X3380

X3370 X3330

X3360 X3350 X3320

L3360

Core

Frequency

(GHz)

3.16

3.00

2.66

2.83

2.66

2.50

2.83

Thermal

Design

Power (W)

2, 3

95 95

95 95 95

Extended

HALT

Power

(W)

16 16

12 12 12

FMB Guidance

775_VR_CONFIG_05A

(95W)

775_VR_CONFIG_05A

(95W)

775_VR_CONFIG_06A

(65 W) [L3360]

Minimum

(°C)

Maximum T

(°C)

See Table 5-2

and

Figure 5-1

See Table 5-2

and

Figure 5-1

Notes

NOTES:

1. Specification is at 37°C Tc and minimum voltage loadline. Specification is guaranteed by design characterization and not 100% tested.

2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processo r can dissipate.

3. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the maximum T individual processor. Refer to thermal profile figure and associated table for the allowed combinations of power and T

will vary depending on the TDP of the

4. FMB, or Flexible Motherboard, guidelines provide a design target for meeting future thermal requirements.

76 Datasheet

Thermal Specifications and Design Considerations

Table 5-2. Quad-Core Intel® Xeon® Processor 3300 Series Thermal Profile (95W)

Power (W) Maximum Tc (°C) Power (W) Maximum Tc (°C)

0 44.8 50 58.8 2 45.4 52 59.4 4 45.9 54 59.9 6 46.5 56 60.5

8 47.0 58 61.0 10 47.6 60 61.6 12 48.2 62 62.2 14 48.7 64 62.7 16 49.3 66 63.3 18 49.8 68 63.8 20 50.4 70 64.4 22 51.0 72 65.0 24 51.5 74 65.5 26 52.1 76 66.1 28 52.6 78 66.6 30 53.2 80 67.2 32 53.8 82 67.8 34 54.3 84 68.3 36 54.9 86 68.9 38 55.4 88 69.4 40 56.0 90 70.0 42 56.6 92 70.6 44 57.1 94 71.1 46 57.7 95 71.4 48 58.2

Datasheet

Thermal Specifications and Design Considerations

Figure 5-1. Quad-Core Intel® Xeon® Processor 3300 Series Thermal Profile(95W)

72.0

68.0

64.0

y = 0.28x + 44.8

60.0

Tcase (C)

56.0

52.0

48.0

44.0 0 102030405060708090

Power (W)

78 Datasheet

Thermal Specifications and Design Considerations

Table 5-3. Quad-Core Intel® Xeon® Processor 3300 Series Thermal Profile (65W)

Power (W)

0 49.6 34 63.54 2 50.42 36 64.36 4 51.24 38 65.18 6 52.06 40 66

8 52.88 42 66.82 10 53.7 44 67.64 12 54.52 46 68.46 14 55.34 48 69.28 16 56.16 50 70.1 18 56.98 52 70.92 20 57.8 54 71.74 22 58.62 56 72.56 24 59.44 58 73.38 26 60.26 60 74.2 28 61.08 62 75.02 30 61.9 64 75.84 32 62.72 65 76.25

Maximum Tc

Figure 5-2. Quad-Core Intel

(°C)

Xeon® Processor 3300 Series Thermal Profile (65W)

Power (W)

Maximum Tc

(°C)

Datasheet

Thermal Profile

80 70 60 50 40 30

Tcase (C)

20 10

0 10203040506070

y = .41x + 49.6

Power (W)

5.1.2 Thermal Metrology

The maximum and minimum case temperatures (TC) for the processor is specified in

Table 5-1. This temperature specification is meant to help ensure proper operation of

the processor. Figure 5-3 illustrates where Intel recommends TC thermal measurements should be made. For detailed guidelines on temperature measurement methodology, refer to the Yorkfield Processor Thermal and Mechanical Design Guidelines Addendum.

Thermal Specifications and Design Considerations

Figure 5-3. Case Temperature (T

37.5 mm

) Measurement Location

(geometric center of the package)

37.5 mm

Measure TCat this point

5.2 Processor Thermal Features

5.2.1 Thermal Monitor

The Thermal Monitor feature helps control the processor temper ature by activ ating the thermal control circuit (TCC) when the processor silicon reaches its maximum operating temperature. The TCC reduces processor power consumption by modulating (starting and stopping) the internal processor core clocks. The Thermal Monitor feature must be enabled for the processor to be operating within specifications. The temperature at which Thermal Monitor activates the thermal control circuit is not user configurable and is not software visible. Bus traffic is snooped in the normal manner, and interrupt requests are latched (and serviced during the time that the clocks are on) while the TCC is active.

When the Thermal Monitor feature is enabled, and a high temperature situation exists (i.e., TC C is active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle specific to the processor (typically 30-50%). Clocks often will not be off for more than 3.0 microseconds when the TCC is active. Cycle times are processor speed dependent and will decrease as processor core frequencies increase. A small amount of hysteresis has been included to prevent rapid active/inactive transitions of the TCC when the processor temperature is near its maximum operating temperature. Once the temperature has dropped below the maximum operating temperature, and the hysteresis timer has expired, the TCC goes inactive and clock modulation ceases.

With a properly designed and characterized thermal solution, it is anticipated that the TCC would only be activated for very short periods of time when running the most power intensive applications. The processor performance impact due to these brief

80 Datasheet

Thermal Specifications and Design Considerations

periods of TCC activation is expected to be so minor that it would be immeasurable. An under-designed thermal solution that is not able to prevent excessive activation of the TCC in the anticipated ambient environment ma y cause a noticeable performance loss, and in some cases may result in a T and may affect the long-term reliability of the processor. In addition, a thermal solution that is significantly under-designed may not be capable of cooling the processor even when the TCC is active continuously. Refer to the Yorkfield Processor Thermal and Mechanical Design Guidelines Addendum for information on designing a thermal solution.

The duty cycle for the TCC, when activated by the Thermal Monitor, is factory configured and cannot be modified. The Thermal Monitor does not require any additional hardware, software drivers, or interrupt handling routines.

5.2.2 Thermal Monitor 2

The processor also supports an additional power reduction capability known as Thermal Monitor 2. This mechanism provides an efficient means for limiting the processor temperature by reducing the power consumption within the processor.

When Thermal Monitor 2 is enabled, and a high temperature situation is detected, the Thermal Control Circuit (TCC) will be activated. The TCC causes the processor to adjust its operating frequency (via the bus multiplier) and input voltage (via the VID signals). This combination of reduced frequency and VID results in a reduction to the processor power consumption.

that exceeds the specified maximum temperature

A processor enabled for Thermal Monitor 2 includes two operating points, each consisting of a specific operating frequency and voltage. The first operating point represents the normal operating condition for the processor. Under this condition, the core-frequency-to-FSB multiple utilized by the processor is that contained in the CLK_GEYSIII_STAT MSR and the VID is that specified in Table 2-3. These parameters represent normal system operation.

The second operating point consists of both a lower operating frequency and voltage. When the TCC is activated, the processor automatically transitions to the new frequency. This transition occurs very rapidly (on the order of 5 µs). During the frequency transition, the processor is unable to service any bus requests, and consequently, all bus traffic is blocked. Edge-triggered interrupts will be latched and kept pending until the processor resumes operation at the new frequency.

Once the new operating frequency is engaged, the processor will transition to the new core operating voltage by issuing a new VID code to the voltage regulator. The voltage regulator must support dynamic VID steps in order to support Thermal Monitor 2. During the voltage change, it will be necessary to transition through multiple VID codes to reach the target operating voltage. Each step will likely be one VID table entry (see

Table 2-3). The processor continues to execute instructions during the voltage

transition. Operation at the lower voltage reduces the power consumption of the processor.

A small amount of hysteresis has been included to prevent rapid active/inactive transitions of the TCC when the processor temperature is near its maximum operating temperature. Once the temperature has dropped below the maximum operating temperature, and the hysteresis timer has expired, the operating frequency and voltage transition back to the normal system operating point. Transition of the VID code will occur first, in order to ensure proper operation once the processor reaches its normal operating frequency. Refer to Figure 5-4 for an illustration of this ordering.

Datasheet

Thermal Specifications and Design Considerations

Figure 5-4. Thermal Monitor 2 Frequency and Voltage Ordering

TM2

MAX

TM2

Temperature

Frequency

VID

TM2

VID

PROCHOT#

The PROCHOT# signal is asserted when a high temperature situation is detected, regardless of whether Thermal Monitor or Thermal Monitor 2 is enabled.

It should be noted that the Thermal Monitor 2 TCC cannot be activated via the on demand mode. The Thermal Monitor TCC, however, can be activated through the use of the on demand mode.

5.2.3 On-Demand Mode

The processor provides an auxiliary mechanism that allows system software to force the processor to reduce its power consumption. This mechanism is referred to as “OnDemand” mode and is distinct from the Thermal Monitor feature. On-Demand mode is intended as a means to reduce system level power consumption. Systems using the processor must not rely on software usage of this mechanism to limit the processor temperature.

If bit 4 of the ACPI P_CNT Control Register (located in the processor IA32_THERM_CONTROL MSR) is written to a '1', the processor will immediately reduce its power consumption via modulation (starting and stopping) of the internal core clock, independent of the processor temperature. When using On-Demand mode, the duty cycle of the clock modulation is programmable via bits 3:1 of the same ACPI P_ CN T Control Register. In On-Demand mode, the duty cycle can be programmed from 12.5% on/87.5% off, to 87.5% on/12.5% off in 12.5% increments. On-Demand mode may be used in conjunction with the Thermal Monitor. If the system tries to enable On-Demand mode at the same time the TCC is engaged, the factory configured duty cycle of the TCC will override the duty cycle selected by the On-Demand mode.

82 Datasheet

Thermal Specifications and Design Considerations

5.2.4 PROCHOT# Signal

An external signal, PROCHOT# (processor hot), is asserted when the processor core temperature has reached its maximum operating temperature. If the Thermal Monitor is enabled (note that the Thermal Monitor must be enabled for the processor to be operating within specification), the TCC will be active when PROCHOT# is asserted. The processor can be configured to generate an interrupt upon the assertion or deassertion of PROCHOT#.

PROCHOT# is a bi-directional signal. As an output, PROCHOT# (Processor Hot) will go active when the processor temperature monitoring sensor detects that one or both cores has reached its maximum safe operating temperature. This indicates that the processor Thermal Control Circuit (TCC) has been activated, if enabled. As an input, assertion of PROCHOT# by the system will activate the T CC, if enabled, for both cores. The TCC will remain active until the system de-asserts PROCHOT#.

PROCHOT# allows for some protection of various components from over-temperature situations. The PROCHOT# signal is bi-directional in that it can either signal when the processor (either core) has reached its maximum operating temperature or be driven from an external source to activate the TCC. The ability to activate the TCC via PROCHOT# can provide a means for thermal protection of system components.

Bi-directional PROCHOT# can allow VR thermal designs to target maximum sustained current instead of maximum current. Systems should still provide proper cooling for the VR, and rely on bi-directional PROCHOT# only as a backup in case of system cooling failure. The system thermal design should allow the power delivery circuitry to operate within its temperature specification even while the processor is operating at its Thermal Design Power. With a properly designed and characterized thermal solution, it is anticipated that bi-directional PROCHOT# would only be asserted for very short periods of time when running the most power intensive applications. An under-designed thermal solution that is not able to prevent excessive assertion of PROCHOT# in the anticipated ambient environment may cause a noticeable performance loss. Refer to the appropriate platform design guide and the Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop LGA775 Socket for details on implementing the bi-directional PROCHOT# feature.

5.2.5 THERMTRIP# Signal

Regardless of whether or not Thermal Monitor or Thermal Monitor 2 is enabled, in the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached an elevated temperature (refer to the THERMTRIP# definition in

Table 4-3). At this point, the FSB signal THERMTRIP# will go active and stay active as

described in Table 4-3. THERMTRIP# activation is independent of processor activity and does not generate any bus cycles.

5.3 Platform Environment Control Interface (PECI)

5.3.1 Introduction

PECI offers an interface for thermal monitoring of Intel processor and chipset components. It uses a single wire, thus alleviating routing congestion issues. PECI uses CRC checking on the host side to ensure reliable transfers between the host and client devices. Also, data transfer speeds across the PECI interface are negotiable within a wide range (2Kbps to 2Mbps). The PECI interface on the Wolfdale processor is disabled by default and must be enabled through BIOS. More information can be found in the

Platform Environment Control Interface (PECI) Specification.

Datasheet

Thermal Specifications and Design Considerations

5.3.1.1 T

CONTROL

Fan speed control solutions based on PECI utilize a T processor IA32_TEMPERATURE_TARGET MSR. The T temperature format as PECI though it contains no sign bit. Thermal management devices should infer the T should utilize the relative temperature value delivered over PECI in conjunction with the T

CONTROL

fan control diagram using PECI temperatures.

and TCC activation on PECI-Based Systems

CONTROL

value as negative. Thermal management algorithms

MSR value to control or optimize fan speeds. Figure 5-5 shows a conceptual

value stored in the

MSR uses the same offset

The relative temperature value reported over PECI represents the delta below the onset of thermal control circuit (TCC) activation as indicated by PROCHOT# assertions. As the temperature approaches TCC activation, the PECI value approaches zero. T CC activates at a PECI count of zero.

Figure 5-5. Conceptual Fan Control Diagram on PECI-Based Platforms

5.3.2 PECI Specifications

5.3.2.1 PECI Device Address

The PECI register resides at address 0x30.

5.3.2.2 PECI Command Support

PECI command support is covered in detail in the Platform Environment Control Interface Specification. Please refer to this document for details on supported PECI

command function and codes.

5.3.2.3 PECI Fault Handling Requirements

PECI is largely a fault tolerant interface, including noise immunity and error checking improvements over other comparable industry standard interfaces. The PECI client is as reliable as the device that it is embedded in, and thus given operating conditions

84 Datasheet

Thermal Specifications and Design Considerations

that fall under the specification, the PECI will always respond to requests and the protocol itself can be relied upon to detect any transmission failures. There are, however, certain scenarios where the PECI is know to be unresponsive.

Prior to a power on RESET# and during RESET# assertion, PECI is not guaranteed to provide reliable thermal data. System designs should implement a default power-on condition that ensures proper processor operation during the time frame when reliable data is not available via PECI.

To protect platforms from potential operational or safety issues due to an abnormal condition on PECI, the Host controller should take action to protect the system from possible damage. It is recommended that the PECI host controller take appropriate action to protect the client processor device if valid temperature readings have not been obtained in response to three consecutive GetTe mp()s or for a one second time interval. The host controller may also implement an alert to software in the event of a critical or continuous fault condition.

5.3.2.4 PECI GetTemp0() Error Code Support

The error codes supported for the processor GetTemp() command are listed in Table 5-

Table 5-4. GetTemp0() Error Codes

Error Code Description

0x8000 General sensor error

0x8002

Sensor is operational, but has detected a temperature below its operational range (underflow)

Datasheet

Thermal Specifications and Design Considerations

86 Datasheet

Features

6 Features

6.1 Power-On Configuration Options

Several configuration options can be configured by hardware. The processor samples the hardware configuration at reset, on the active-to-inactive transition of RESET#. F or specifications on these options, refer to Table 6-1.

The sampled information configures the processor for subsequent operation. These configuration options cannot be changed except by another reset. All resets reconfigure the processor; for configuration purposes, the processor does not distinguish between a "warm" reset and a "power-on" reset.

Table 6-1. Power-On Configuration Option Signals

Configuration Option Signal

Output tristate SMI# Execute BIST A3# Disable dynamic bus parking A25# Symmetric agent arbitration ID BR0# RESERVED A[24:4]#, A[35:26]#

1,2

NOTE:

1. Asserting this signal during RESET# will select the corresponding option.

2. Address signals not identified in this table as configuration options should not be asserted

3. Disabling of any of the cores within a Yorkfield processor must be handled by configuring

during RESET#.

the EXT_CONFIG Model Specific Register (MSR). This MSR will allow for the disabling of a single core per die within the Yorkfield package.

6.2 Clock Control and Low Power States

The processor allows the use of AutoHALT and Stop-Grant states to reduce power consumption by stopping the clock to internal sections of the processor, depending on each particular state. See Figure 6-1 for a visual representation of the processor low power states.

Datasheet

Figure 6-1. Processor Low Power State Machine

HALT or MWAIT Instruction and HALT Bus Cycle Generated

Normal State

- Normal Ex ec u tio n

INIT#, IN TR , NMI, SM I#, RESET#, FSB interrupts

Features

Extended HALT or HALT State

- BCLK running

- Snoops and interrup ts allowe d

STPCLK#

Asserted

Stop Grant State

- BCLK ru n n ing

- Snoops and interrup ts allow e d

STPCLK#

De-asserted

STPCLK#

Asserted

Snoop Event Occurs

Snoop Event Serviced

STPCLK#

De-asserted

Extended HALT Snoop or HALT Snoop State

- BCLK running

- Service S n oo p s t o ca ch e s

Stop Grant Snoop State

- BCLK running

- Service S n oo p s t o ca ch e s

6.2.1 Normal State

This is the normal operating state for the processor.

6.2.2 HALT and Extended HALT Powerdown States

The processor supports the HALT or Extended HALT powerdown state. The Extended HALT Powerdown state must be configured and enabled via the BIOS for the processor to remain within specification.

The Extended HALT state is a lower power state as compared to the Stop Grant State.

Snoop

Event

Occurs

Snoop

Event

Serviced

If Extended HALT is not enabled, the default Powerdown state entered will be HALT. Refer to the sections below for details about the HALT and Extended HALT states.

6.2.2.1 HALT Powerdown State

HAL T is a low power state entered when all the processor cores have executed the HALT or MWAIT instructions. When one of the processor cores executes the HALT instruction, that processor core is halted, however, the other processor continues normal operation. The halted core will transition to the Normal state upon the occurrence of SMI#, INIT#, or LINT[1:0] (NMI, INTR). RESET# will cause the processor to immediately initialize itself.

The return from a System Management Interrupt (SMI) handler can be to either Normal Mode or the HALT Power Down state. See the Intel Architecture Software Developer's Manual, Volume 3B: System Programming Guide, Part 2 for more information.

88 Datasheet

Features

The system can generate a STPCLK# while the processor is in the HALT Power Down state. When the system deasserts the STPCLK# interrupt, the processor will return execution to the HALT state.

While in HALT Power Down state, the processor will process bus snoops.

6.2.2.2 Extended HALT Powerdown State

Extended HALT is a low power state entered when all processor cores have executed the HALT or MWAIT instructions and Extended HALT has been enabled via the BIOS. When one of the processor cores executes the HALT instruction, that logical processor is halted; however, the other processor continues normal operation. The Extended HALT Powerdown must be enabled via the BIOS for the processor to remain within its specification.

The processor will automatically transition to a lower frequency and voltage operating point before entering the Extended HALT state. Note that the processor FSB frequency is not altered; only the internal core frequency is changed. When entering the low power state, the processor will first switch to the lower bus ratio and then transition to the lower VID.

While in Extended HALT state, the processor will process bus snoops. The processor exits the Extended HALT state when a break event occurs. When the

processor exits the Extended HALT state, it will first transition the VID to the original value and then change the bus ratio back to the original value.

6.2.3 Stop Grant State

When the STPCLK# signal is asserted, the Stop Grant state of the processor is entered 20 bus clocks after the response phase of the processor-issued Stop Grant Acknowledge special bus cycle.

Since the GTL+ signals receive power from the FSB, these signals should not be driven (allowing the level to return to V resistors in this state. In addition, all other input signals on the FSB should be driven to

) for minimum power drawn by the termination

the inactive state. RESET# will cause the processor to immediately initialize itself, but the processor will

stay in Stop-Grant state. A transition back to the Normal state will occur with the deassertion of the STPCLK# signal.

A transition to the Grant Snoop state will occur when the processor detects a snoop on the FSB (see Section 6.2.4).

While in the Stop-Grant State, SMI#, INIT# and LINT[1:0] will be latched by the processor, and only serviced when the processor returns to the Normal State. Only one occurrence of each event will be recognized upon return to the Normal state.

While in Stop-Grant state, the processor will process a FSB snoop.

6.2.4 Extended HALT Snoop or HALT Snoop State, Stop Grant Snoop State

The Extended HAL T Snoop State is used in conjunction with the Extended HAL T state. If Extended HALT state is not enabled in the BIOS, the default Snoop State entered will be the HALT Snoop State. Refer to the sections below for details on HALT Snoop State, Grant Snoop State and Extended HALT Snoop State.

Datasheet

6.2.4.1 HALT Snoop State, Stop Grant Snoop State

The processor will respond to snoop transactions on the FSB while in Stop-Grant state or in HALT Power Down state. During a snoop transaction, the processor enters the HAL T Snoop State:Stop Grant Snoop state. The processor will stay in this state until the snoop on the FSB has been serviced (whether by the processor or another agent on the FSB). After the snoop is serviced, the processor will return to the Stop Grant state or HALT Power Down state, as appropriate.

6.2.4.2 Extended HALT Snoop State

The Extended HALT Snoop State is the default Snoop State when the Extended HALT state is enabled via the BIOS. The processor will remain in the lower bus ratio and VID operating point of the Extended HALT state.

While in the Extended HALT Snoop State, snoops are handled the same way as in the HAL T Snoop State. After the snoop is serviced the processor will return to the Extended HALT state.

6.2.5 Enhanced Intel SpeedStep® Technology

The processor supports Enhanced Intel SpeedStep T echnology. This technology enables the processor to switch between frequency and voltage points, which may result in platform power savings. In order to support this technology, the system must support dynamic VID transitions. Switching between voltage/frequency states is software controlled.

Features

Enhanced Intel SpeedStep Technology is a technology that creates processor performance states (P states). P states are power consumption and capability states within the Normal state as shown in Figure 6-1. Enhanced Intel SpeedStep Technology enables real-time dynamic switching between frequency and voltage points. It alters the performance of the processor by changing the bus to core frequency ratio and voltage. This allows the processor to run at different core frequencies and voltages to best serve the performance and power requirements of the processor and system. Note that the front side bus is not altered; only the internal core frequency is changed. In order to run at reduced power consumption, the voltage is altered in step with the bus ratio.

The following are key features of Enhanced Intel SpeedStep Technology:

• Voltage/Frequency selection is software controlled by writing to processor MSR's (Model Specific Registers), thus eliminating chipset dependency.

- If the target frequency is higher than the current frequency, Vcc is incremented in steps (+12.5 mV) by placing a new value on the VID signals after which the processor shifts to the new frequency. Note that the top frequency for the processor can not be exceeded.

- If the target frequency is lower than the current frequency, the processor shifts to the new frequency and Vcc is then decremented in steps (-12.5 mV) by changing the target VID through the VID signals.

6.2.6 Processor Power Status Indicator (PSI) Signal

The processor incorporates the PSI# signal that is asserted when the processor is in a reduced power consumption state. PSI# can be used to improve efficiency of the voltage regulator, resulting in platform power savings. For details, refer to the compatible chipset Platform Design Guide and Voltage Regulator-Down (VRD) 11.1 Processor Power Delivery Design Guidelines.

PSI# may be asserted only when the processor is in the Deeper Sleep state.

90 Datasheet

Boxed Processor Specifications

7 Boxed Processor Specifications

7.1 Introduction

The processor will also be offered as an Intel boxed processor. Intel boxed processors are intended for system integrators who build systems from baseboards and standard components. The boxed processor will be supplied with a cooling solution. This chapter documents baseboard and system requirements for the cooling solution that will be supplied with the boxed processor. This chapter is particularly important for OEMs that manufacture baseboards for system integrators.

Note: Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and

inches [in brackets]. Figure 7-1 shows a mechanical representation of a boxed processor.

Note: Drawings in this section reflect only the specifications on the Intel boxed processor

product. These dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system designers’ responsibility to consider their proprietary cooling solution when designing to the required keep-out zone on their system platforms and chassis. Refer to the Yorkfield Processor Thermal and Mechanical Design Guidelines Addendum for further guidance. Contact your local Intel Sales

Figure 7-1. Mechanical Representation of the Boxed Processor

Representative for this document.

NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.

Datasheet

Boxed Processor Specifications

7.2 Mechanical Specifications

7.2.1 Boxed Processor Cooling Solution Dimensions

This section documents the mechanical specifications of the boxed processor. The boxed processor will be shipped with an unattached fan heatsink. Figure 7-1 shows a mechanical representation of the boxed processor.

Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 7-2 (Side View), and Figure 7-3 (Top View). The airspace requirements for the boxed processor fan heatsink must also be incorporated into new baseboard and system designs. Airspace requirements are shown in Figure 7-7 and Figure 7-8. Note that some figures have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.

Figure 7-2. Side View Space Requirements for the Boxed Processor

95.0

[3.74]

81.3 [3.2]

10.0

[0.39]

25.0

[0.98]

Boxed_Proc_SideView

92 Datasheet

Boxed Processor Specifications

Figure 7-3. Top View Space Requirements for the Boxed Processor

95.0

[3.74]

95.0

[3.74]

Boxed_Proc_TopView

NOTES:

1. Diagram does not show the attached hardware for the clip design and is provided only as a mechanical representation.

Figure 7-4. Overall View Space Requirements for the Boxed Processor

Datasheet

Boxed Processor Specifications

7.2.2 Boxed Processor Fan Heatsink Weight

The boxed processor fan heatsink will not weigh more than 450 grams. See Chapter 5 and the Yorkfield Processor Thermal and Mechanical Design Guidelines Addendum for details on the processor weight and heatsink requirements.

7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

The boxed processor thermal solution requires a heatsink attach clip assembly, to secure the processor and fan heatsink in the baseboard socket. The boxed processor will ship with the heatsink attach clip assembly.

7.3 Electrical Requirements

7.3.1 Fan Heatsink Power Supply

The boxed processor's fan heatsink requires a +12V power supply. A fan power cable will be shipped with the boxed processor to draw power from a power header on the baseboard. The power cable connector and pinout are shown in Figure 7-5. Baseboards must provide a matched power header to support the boxed processor. Table 7-1 contains specifications for the input and output signals at the fan heatsink connector.

The fan heatsink outputs a SENSE signal, which is an open- collector output that pulses at a rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to match the system board-mounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should be tied to GND.

The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the connector labeled as CONTROL.

The boxed processor's fanheat sink requires a constant +12 V supplied to pin 2 and does not support variable voltage control or 3-pin PWM control.

The power header on the baseboard must be positioned to allow the fan heatsink power cable to reach it. The power header identification and location should be documented in the platform documentation, or on the system board itself. Figure 7-6 shows the location of the fan power connector relative to the processor socket. The baseboard power header should be positioned within 110 mm [4.33 inches] from the center of the processor socket.

94 Datasheet

Boxed Processor Specifications

Figure 7-5. Boxed Processor Fan Heatsink Power Cable Connector Description

Signal

1 2

GND

+12 V

SENSE CONTROL

Straight square pi n, 4-pin terminal housing with polarizi ng r ibs and fric tion locking ramp.

0.100" pitch, 0.025" square pin width. Match with straight pin, friction lock header on

mainboard.

Table 7-1. Fan Heatsink Power and Signal Specifications

Description Min Typ Max Unit Notes

+12V: 12 volt fan power supply 11.4 12 12.6 V -

IC:

- Maximum fan steady-state current draw

- Average fan steady-state current draw

- Maximum fan start-up current draw

- Fan start-up current draw maximum duration

SENSE: SENSE frequency — 2 —

CONTROL 21 25 28 kHz

NOTES:

1. Baseboard should pull this pin up to 5V with a resistor.

2. Open drain type, pulse width modulated.

3. Fan will have pull-up resistor for this signal to maximum of 5.25 V.

— — — —

1.2

0.5

2.2

1.0

— — — —

Second

pulses per

fan

revolution

A A A

2, 3

Datasheet

Boxed Processor Specifications

Figure 7-6. Baseboard Power Header Placement Relative to Processor Socket

R110

[4.33]

Boxed_Proc_PwrHeaderPlacement

7.4 Thermal Specifications

This section describes the cooling requirements of the fan heatsink solution utilized by the boxed processor.

7.4.1 Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's temperature specification is also a function of the thermal design of the entire system, and ultimately the responsibility of the system integrator. The processor temperature specification is found in Chapter 5 of this document. The boxed processor fan heatsink is able to keep the processor temperature within the specifications (see

Table 5-1) in chassis that provide good thermal management. For the boxed processor

fan heatsink to operate properly, it is critical that the airflow provided to the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and decreases fan life. Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan heatsink. The air temperature entering the fan should be kept below 38 ºC. Again, meeting the processor's temperature specification is the responsibility of the system integrator.

96 Datasheet

Boxed Processor Specifications

Figure 7-7. Boxed Processor Fan Heatsink Airspace Keepout Requirem ents (side 1 view)

Datasheet

Boxed Processor Specifications

Figure 7-8. Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view)

7.4.2 Variable Speed Fan

If the boxed processor fan heatsink 4-pin connector is connected to a 3-pin motherboard header it will operate as follows:

The boxed processor fan will operate at different speeds over a short range of internal chassis temperatures. This allows the processor fan to operate at a lower speed and noise level, while internal chassis temperatures are low. If internal chassis temperature increases beyond a lower set point, the fan speed will rise linearly with the internal temperature until the higher set point is reached. At that point, the fan speed is at its maximum. As fan speed increases, so does fan noise levels. Systems should be designed to provide adequate air around the boxed processor fan heatsink that remains cooler then lower set point. These set points, represented in Figure 7-9 and Table 7-2, can vary by a few degrees from fan heatsink to fan heatsink. The internal chassis temperature should be kept below 38 ºC. Meeting the processor's temperature specification (see Chapter 5) is the responsibility of the system integrator.

The motherboard must supply a constant +12V to the processor's power header to ensure proper operation of the variable speed fan for the boxed processor. Refer to

Table 7-1 for the specific requirements.

98 Datasheet

Boxed Processor Specifications

Figure 7-9. Boxed Processor Fan Heatsink Set Points

Table 7-2. Fan Heatsink Power and Signal Specifications

Boxed Processor

Fan Heatsink Set

Point (

NOTES:

1. Set point variance is approximately ± 1 °C from fan heatsink to fan heatsink.

X ≤ 30

Y = 35

Z ≥ 39

ºC)

When the internal chassis temperature is below or equal to this set point, the fan operates at its lowest speed. Recommended maximum internal chassis temperature for nominal operating environment.

When the internal chassis temperature is at this point, the fan operates between its lowes t and highest speeds. Recommended maximum internal chassis temperature for worst-case operating environment.

When the internal chassis temperature is above or equal to this set point, the fan operates at its highest speed.

Boxed Processor Fan Speed Notes

If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and the motherboard is designed with a fan speed controller with PWM output (CONTROL see Table 7-1) and remote thermal diode measurement capability the boxed processor will operate as follows:

As processor power has increased the required thermal solutions have generated increasingly more noise. Intel has added an option to the boxed processor that allows system integrators to have a quieter system in the most common usage.

The 4th wire PWM solution provides better control over chassis acoustics. This is achieved by more accurate measurement of processor die temperature through the processor's Digital Thermal Sensors (DTS) and PECI. Fan RPM is modulated through the use of an ASIC located on the motherboard that sends out a PWM control signal to the 4th pin of the connector labeled as CONTROL. The fan speed is based on actual processor temperature instead of internal ambient chassis temperatures.

Datasheet

Boxed Processor Specifications

If the new 4-pin active fan heat sink solution is connected to an older 3-pin baseboard CPU fan header it will default back to a thermistor controlled mode, allowing compatibility with existing 3-pin baseboard designs. Under thermistor controlled mode, the fan RPM is automatically varied based on the Tinlet temperature measured by a thermistor located at the fan inlet.

For more details on specific motherboard requirements for 4-wire based fan speed control see the Yorkfield Processor Thermal and Mechanical Design Guidelines Addendum.

100 Datasheet

Intel Quad-Core Xeon 3300 Series, Xeon X3380, Xeon X3360, Xeon X3350, Xeon X3330 Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual