Intel Q67 User Manual
USER'S MANUAL
Of
Intel Q67 Express Chipset
Based
M/B for LGA 1155 Quad Core Ready
Intel Core Processor
Rev: 1.0
Release date: July
，
2011
Trademark:
* Specifications and Information contained in this documentation a re furnis hed for i nforma tion use only , a nd are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
J29FAN - Q67
ii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii
ENVIRONMENTAL PROTECTION ANNOUCEMENT..............................................................iii
USER’S NOTICE .......................................................................................................................iv
MANUAL REVISION INFORMATION.......................................................................................iv
ITEM CHECKLIST.....................................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 SPECIFICATION.........................................................................................................1
1-2 LAYOUT DIAGRAM....................................................................................................2
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING.....................................................................................................5
2-2 CONNECTORS AND HEADERS................................................................................11
2-2-1 REAR I/O BACK PANEL CONNECTORS....................................................11
2-2-2 MOTHERBOARD INTERNAL CONNECTORS............................................12
2-2-3 HEADER PIN DEFINITION ...........................................................................14
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERNING SETUP...................................................................................................18
3-2 BIOS MENU SCREEN ................................................................................................19
3-3 FUNCTION KEYS .......................................................................................................19
3-4 GETTING HELP ..........................................................................................................20
3-5 MENU BAR..................................................................................................................20
3-6 MAIN MENU................................................................................................................21
3-7 ADVANCED MENU.....................................................................................................22
3-8 CHIPSET MENU..........................................................................................................28
3-9 BOOT MENU...............................................................................................................30
3-10 SECURITY MENU.......................................................................................................31
3-11 SAVE & EXIT MENU...................................................................................................32
TABLE OF CONTENT
iii
Environmental Safety Instruction
z Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z 0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
z Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERI ES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS M ANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition July, 2011
Item Checklist
5
Motherboard
5
User’s Manual
5
DVD for motherboard utilities
5
Cable(s)
5
I/O Back panel shield
1
Chapter 1
Introduction of the Motherboard
1-1 Specification
Spec Description
Design
z ATX form factor 4 layers;
Chipset
z Intel Q67 Express Chipset
CPU Socket
(LGA1155 )
z Intel® Socket LGA1155
* For detailed CPU support information please visit our website
Memory Slot
z DDRIII RAM module socket x 4 supporting four DDRIII
1333/1066MHz RAM Module expandable to 32 GB (Maximum)
z Support dual-channel function
Expansion Slots
z 4 pcs *32-bit PCI slot
z 1 pcs* PCI-Express 2.0 x16 slot
z 1 pcs* PCI-Express 2.0 x4 slot
z 1 pcs* PCI-Express 2.0 x1 slot
z 1 pcs*Mini-PCI-E x 1
Serial ATAⅠ
/Ⅱ
/
Ⅲ
z Support four serial ATA2 ports
z Support two serial ATA3 ports
Dual LAN Chip
z
Integrated Intel 82574L and 82579LM Gigabit Ethernet
LAN chip that supports Fast Ethernet LAN function of
providing 10Mb/100Mb/1000Mb Ethernet data transfer
rate
HD Audio Chip
z
VIA VT 1705CE 6-channel HD Audio Codec integrated
z Audio driver and utility included
BIOS
z 64MB SMT Flash ROM
Multi I/O
z PS/2 keyboard x1
z DVI Connector x1
z D-Sub 15-pin VGA Connector x1
z USB 2.0 connector x 6
z USB 2.0 headers x3
z RJ-45 LAN connector x2
z Serial port connector x1
z Audio connector x1
z Front panel header x1
z PER LED header x1
z Speaker header x1
z Front panel audio header x1
z CDIN header x1
z GPIO header x1
z TPM 1.2 header x1
z CIR header x1
z HDMI-SPDIF header x1
z Parallel header x1
z TX-RX COM1 header x 1
z COM port header x 9
2
1-2 Layout Diagram
Rear IO Diagram
Motherboard Internal Diagram
RJ-45 LAN Ports
USB Ports
PS/2 KB/MS
Port
Line-IN/
Optical SPDIF OUT
Line-OUT
MIC-IN
USB Ports
Serial Port
VGA Port
ATX 12V Power
Connector
Front Panel Header
ATX Powe
r
Connector
CPU Socket LGA1155
Intel Q67
Chipset
Speaker /PWR LED Headers
DDRIII DIMMx4
32-bit PCI Slots
Serial Port over
HDMI port
Front Panel
Audio Heade
r
DVI port over
VGA Port
RJ-45 Over USB Ports
PCI Ex16 Slot
PS2 KB/MS Port
over
USB Ports
6-CH
Audio Connector
DVI Port
Parallel Header
TPM Header
HDMI S/PDIF Header
GPIO Heade
r
TX-RX COM
Header
MINI PCIE
Slot
PCIE x 4 Slots
SATA3_4 Connectors
CIR Heade
r
RJ-45 Over USB Ports
PCIE x1 Slot
CDIN Header
SYS FAN2
SATA1_2 Connectors
SATA5 Connecto
r
CASE OPEN
USB1, USB2, USB3 Headers
HDMI Port
MSATA
Connector
COM3/COM5/COM7/COM9
(from left to right)
COM4/COM6/COM8/COM10
COM 2
3
Motherboard Jumper Position
Jumper
Jumper Name Description
JBAT CMOS RAM Clear Function Setting 3-pin Block
JP3 USB Port Power On Function Setting 3-pin Block
JP5 USB Port Power On Function Setting 3-pin Block
JP8 COM2 Header Pin9 Function Selecting 6-pin Block
JP9 COM2 RS232/485/422 Function Selecting 6-pin Block
JP10 KB/MS/USB Power-On Function Setting 3-pin Block
JP11 COM2 Header Pin9 Function Selecting 6-pin Block
JP12 COM2 Header Pin9 Function Selecting 6-pin Block
JP13 COM2 Header Pin9 Function Selecting 6-pin Block
JP14 COM2 Header Pin9 Function Selecting 6-pin Block
JP15 COM2 Header Pin9 Function Selecting 6-pin Block
JP16 COM2 Header Pin9 Function Selecting 6-pin Block
JBAT
J
P10
JP5
J
P20
COPEN
J
P18
J
P13 JP15
JP9 J
P11
J
P19
J
P12
J
P2
JP
14
JP
16
JP
17
J
P8
JP
3
4
JP17 COM2 Header Pin9 Function Selecting 6-pin Block
JP18 COM2 Header Pin9 Function Selecting 6-pin Block
JP19 COM2 Header Pin9 Function Selecting 6-pin Block
JP20 Mini PCI-E Power VCC3.3V/3.3V SB 3-pin Block
Connectors
Connector Name Description
KB/MS from UK1 PS2 Keyboard/Mouse Connector 6-pin Female
VGA1 Video Graphic Attach Connector 15-pin Female
DVI1 DVI Port Connector 24-pin Connector
USB from UL1/UL2 USB Port Connectors 4-pin Connectors
LAN from UL1/UL2 RJ-45 LAN Connectors 8-pin Connectors
COM1 Serial Port COM Connector 9-pin Connector
AUDIO Audio Connector 3-phone Jack
ATXPWR ATX Power Connector 24-pin Block
ATX12V1 ATX 12V Power Connector 8-pin Block
SATA3_4/SATA5 Serial ATAII Connectors 7-pin Connector
SATA1_2
Serial ATAⅢ Connector
7-pin Connector
USB from UK1 USB Port Connectors 4-pin Connectors
HDMI High-Definition Multimedia Interface 10-pin Connector
Headers
Header Name Description
FP_AUDIO Front panel audio Headers 9-pin block
CDIN CD Audio-In Header 4-pin Block
SPEAK Speaker Header 4-pin Block
PWRLED Power LED 3-pin Block
JW_FP
(Front Panel Header)
PWR LED/ HD LED/ /Power Button /Reset 9-pin Block
USB1 USB1 Header 9-pin Block
USB2 USB2 Header 9-pin Block
CPUFAN,SYSFAN2 FAN Speed Headers 4-pin Block
SYSFAN1 FAN Speed Header 3-pin Block
GPIO_CON GPIO Header 10-pin Block
COM2/3/4/5/6/7/8/9/10 Serial Port Headers 9-pin Block
TX-RXCOM1 RS 232/422/485 port headers 4-pin block
CIR CIR infrared module Headers 4-pin Block
HDMI_SPDIF SPDIF Out header 2-pin Block
TPM TPM Header 19-pin Block
USB3 USB Header 9-pin Block
CASE_OPEN Case Open Message Display Function 2-pin Block
5
Chapter 2
Hardware Installation
2-1 Jumper Setting
(1) Clear CMOS (3-pin): JBAT
1 1 1
3 3
CMOS Cl e ar Se tting
2-3 Short： Clear CMOS
JBAT
1-2 Sho r t： Normal
(2) JP3 (3-pin): USB Power On Function Setting
2-3 closed: USB POWER-O N Enabl ed
JP3
JP3
1-2 closed : USB POWER- O N Disabled(def ault)
1
3
1
3
(3) JP5 (3-pin): USB Power On Function Setting
2-3 closed : USB POWER-ON En abled
JP5
JP5
1-2 closed : USB POWER-ON Disabled( default)
1
3
6
(4) JP8 (6-pin): COM2 Header Pin9 Function Selecting
3-4 closed : +12V
JP8
1
1-2 closed: RS232
1
1
5-6 closed : +5V
(5) JP9 (6-pin): COM2 Port RS232/485/422 Function Select
3-4 closed : RS485
JP9
1-2 closed: RS232
5-6 closed : RS422
(6)JP10 (6-pin): KB/MS/USB Power-On Function Setting
2-3 closed: KB/MS/ USB POWER-ON Enabled
JP10
JP10
1-2 closed : KB/MS /U SB POWER-ON Disabled(default)
1
3
7
(7) JP11 (6-pin): COM2 Pin9 function select
3-4 closed : +12V
JP11
1
1-2 closed: RS232
1
1
5-6 closed : +5V
(8) JP12 (6-pin): COM3 Pin9 function select
3-4 closed : +12V
JP12
1
1-2 closed: RS232
1
1
5-6 closed : +5V
(9) JP13 (6-pin): COM4 Pin9 function select
3-4 closed : +12V
JP13
1
1-2 closed: RS232
1
1
5-6 closed : +5V
(10) JP14 (6-pin): COM5 Pin9 function select
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