Intel P3700 User Manual

Intel® Solid-State Drive DC P3700 Series

Capacities: 400GB, 800GB, 1.6TB, 2TB Components

–Intel® 20nm MLC NAND Flash Memory Form Factors

–2.5-inch Form Factor

15mm Z-height

8639-compatible connector

–AIC Form Factor

Half-height, Half-length

Single slot x4 connector

PCIe* Gen3 X4 Performance1,2

–Seq R/W: Up to 2800/2000MB/s3

–IOPS Rnd 4KB4 70/30 R/W: Up to 265K

–IOPS Rnd 4KB4 R/W: Up to 460/175K

–Seq Latency (typ) R/W: 20/20µs

Operating System Support:

–Windows* Server 2012 R2, 2012, 2008 R2 x64

–Windows* 7, Windows* 8, Windows* 8.1, 10 (32/64bit)

–RHEL* 6.5, 6.6, 6.7,7.0, 7.1

–SLES11 SP3*, SP4, SLES12

–Citrix* XenServer* 6.5

–VMWare* ESXi 5.5

–CentOS* 6.5

–UEFI 2.3.1*

Reliability

–Uncorrectable Bit Error Rate (UBER):

1sector per 1017 bits read

–Mean Time Before Failure (MTBF):

2million hours

–T10 DIF protection

–Variable Sector Size: 512, 520, 528, 4096, 4104, 4160, 4224 Bytes

Compliance

–NVM Express* 1.0

–PCI Express* Base Specification Rev 3.0

–Enterprise SSD Form Factor Version 1.0a

–PCI Express Card Electro-Mechanical (CEM) Specification Rev 2.0

Certifications and Declarations

–UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft* WHQL*, VCCI*

Product Specification

Power

–2.5-inch: 3.3V and 12V Supply Rail

–AIC: 3.3V and 12V Supply Rail

–Enhanced power-loss data protection

–Active/Idle (TYP): Up to 25W/4W (TYP)

Endurance Rating

–Up to 62.05 PBW (Petabytes Written)5

–Up to 17 Drive Writes/day (JESD219 workload)

Temperature Specification

–Operating:

AIC: 0 to 55° C ambient with specified airflow

2.5-inch: 0 to 35° C ambient,

0 to 70° C case with specified airflow

–Non-Operating6: -55 to 95° C

–Temperature monitoring (In-band and by way of SMBUS)

–Thermal throttling when approaching maximum operating temperature

Airflow

–AIC (55° C airflow towards IO bracket7)

400GB: 200 LFM

800GB, 1.6TB, 2.0TB: 300 LFM

–2.5-inch (Airflow towards the connector)

400GB: 250/300 LFM (25/35° C)

800GB: 350/500 LFM (25/35° C)

1.6TB, 2TB: 450/600 LFM (25/35° C)

Weight

–AIC: 400/800GB up to 185gm 1.6TB, 2TB up to 195gm

–2.5-inch: 400/800GB up to 115gm 1.6TB, 2TB up to 125gm

Shock

–2.5-inch: 1,000 G/0.5msec

–AIC: 50 G Trapezoidal, 170 in/s

Vibration

–Operating: 2.17 GRMS (5-700Hz)

–Non-Operating: 3.13 GRMS (5-800Hz)

Altitude (Simulated)

–Operating: -1,000 to 10,000 ft

–Non-Operating: -1,000 to 40,000 ft

Product Ecological Compliance

– RoHS

1.Performance values vary by capacity and form factor

2.Performance specifications apply to both compressible and incompressible data

3.MB/s = 1,000,000 bytes/second

4.4KB = 4,096 bytes; 8KB = 8,192 bytes

5.1PB = 1015 Bytes

6.Please contact your Intel representative for details on the non-operating temperature range

7.Airflow out of server through PCIe Card Slot

Order Number: 330566-009US

Ordering Information

Contact your local Intel sales representative for ordering information.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.

All documented endurance test results are obtained in compliance with JESD218 Standards; refer to individual sub-sections within this document for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document contains information on products in the design phase of development.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htmIntel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others. Copyright © 2015 Intel Corporation. All rights reserved.

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Contents
1	Overview..........................................................................................................................................................................................................		7
1.1	References .................................................................................................................................................................................................		8
1.2	Terms and Acronyms............................................................................................................................................................................		9
2	Product Specifications...........................................................................................................................................................................		10
2.1	Capacity ...................................................................................................................................................................................................		10
2.2	Performance ..........................................................................................................................................................................................		10
2.3	Electrical Characteristics..................................................................................................................................................................		12
2.4	Environmental Conditions ..............................................................................................................................................................		14
2.5	Product Regulatory Compliance ..................................................................................................................................................		15
2.6	Reliability Specifications ..................................................................................................................................................................		16
2.7	Temperature Sensor..........................................................................................................................................................................		16
2.8	Power Loss Capacitor Test..............................................................................................................................................................		16
2.9	Hot Plug Support.................................................................................................................................................................................		17
2.10 Out of Band Management (SMBUS)...........................................................................................................................................			17
2.11 Variable Sector Size Support........................................................................................................................................................			17
3	Mechanical Information ........................................................................................................................................................................		18
4	Pin and Signal Descriptions.................................................................................................................................................................		20
4.1	Pin Signal Definitions.........................................................................................................................................................................		20
5	Supported Command Sets ..................................................................................................................................................................		23
5.1	NVMe Admin Command Set...........................................................................................................................................................		23
5.2	NVMe I/O Command Set..................................................................................................................................................................		23
5.3	Log Page Support................................................................................................................................................................................		24
5.4	SMART Attributes................................................................................................................................................................................		24
5.5	Temperature Statistics......................................................................................................................................................................		27
5.6	Drive Marketing Name Log..............................................................................................................................................................		28
5.7	IO Command Latency Statistics....................................................................................................................................................		28
5.8	SET Feature Identifiers......................................................................................................................................................................		28
6	NVMe Driver Support .............................................................................................................................................................................		30
7	Certifications and Declarations..........................................................................................................................................................		31
Appendix A IDENTIFY Data Structure ........................................................................................................................................................			32
Appendix B		Vital Data Structure...................................................................................................................................................................	40
Appendix C		Out of Band Temperature Sensor Read Out .................................................................................................................	41
Appendix D		SMBUS Command Response on 0x6A (NVMe Workgroup Defined) .................................................................	42
Appendix E		SMBUS Command Response on 0x6A (Intel Specific)..............................................................................................	44
Appendix F		PCIe* ID ...........................................................................................................................................................................................	45
Appendix G SCSI Command Translation ..................................................................................................................................................			46
Appendix H Add-in Card LED Decoder......................................................................................................................................................			47

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Figures
Figure 3-1:	Intel SSD DC P3700 Series SFF Dimensions......................................................................................................................	18
Figure 3-2:	Intel SSD DC P3700 Series PCIe Dimensions ....................................................................................................................	19
Figure A-1:	LED Location.....................................................................................................................................................................................	47
Tables
Table 1:	Standard Information referenced in this document .........................................................................................................	8
Table 2:	Glossary of Terms and Acronyms..............................................................................................................................................	9
Table 3:	User Addressable Sectors...........................................................................................................................................................	10
Table 4:	Random Read/Write Input/Output Operations Per Second (IOPS) ........................................................................	10
Table 5:	Random Read/Write IOPS Consistency................................................................................................................................	11
Table 6:	Sequential Read and Write Bandwidth.................................................................................................................................	11
Table 7:	Latency ................................................................................................................................................................................................	11
Table 8:	Quality of Service............................................................................................................................................................................	12
Table 9:	Operating Voltage ..........................................................................................................................................................................	12
Table 10:	Power Consumption......................................................................................................................................................................	13
Table 11:	Temperature, Shock, Vibration ................................................................................................................................................	14
Table 12:	Airflow Requirements for Intel SSD DC P3700 Series (Add-In Card) .....................................................................	14
Table 13:	Airflow Requirements for Intel SSD DC P3700 Series (2.5-inch Form Factor)...................................................	15
Table 14:	Product Regulatory Compliance Specifications ...............................................................................................................	15
Table 15:	Reliability Specifications..............................................................................................................................................................	16
Table 16:	Pin Definition for 2.5-inch Form Factor (8639 connector specification) ..............................................................	20
Table 17:	Pin Definition for Add-In Card (Half Height Half Length) Form Factor ..................................................................	22
Table 18:	SMART Attributes (Log Identifier 02h)..................................................................................................................................	24
Table 19:	Additional SMART Attributes (Log Identifier CAh) ..........................................................................................................	26
Table 20:	Temperature Statistics (Log Identifier C5h) .......................................................................................................................	27
Table 21:	Drive Marketing Name Log (Log Identifier DDh)...............................................................................................................	28
Table 22:	Read/Write Command Latency Log (Log Identifier C1h/C2h) ...................................................................................	28
Table 23:	Set Max LBA Setting - Command Dword 11 and Command Dword 12 ................................................................	29
Table 24:	Status Code - Set Max LBA Command Specific Status Values ..................................................................................	29
Table 25:	C6h - Set/ Get Power (Typical) Governor Setting – Command Dword 11............................................................	29
Table 26:	Status Codes - Power Governor Setting Command Specific Status Values........................................................	29
Table 27:	D5h – Reset Timed Workload Counters – Command Dword 11 ..............................................................................	29
Table 28:	E2h – Set/Get Enable Latency Tracking ...............................................................................................................................	29
Table 29:	NVMe Driver Support....................................................................................................................................................................	30
Table 30:	Device Certifications and Declarations.................................................................................................................................	31
Table 31:	Identify Controller ..........................................................................................................................................................................	32
Table 32:	Power State Descriptor ................................................................................................................................................................	36
Table 33:	Identify Namespace.......................................................................................................................................................................	37
Table 34:	LBA Format Data Structure ........................................................................................................................................................	39
Table 35:	Vital Product Data Structure (VPD).........................................................................................................................................	40
Table 36:	Capability List Pointer (Out of Band Temperature Sensor).........................................................................................	40
Table 37:	Register 0x05 read out format..................................................................................................................................................	41
Table 38:	Command Response on 0x6A (NVMe Workgroup Defined).......................................................................................	42
Table 39:	Command Response on 0x6A (Intel Specific) ...................................................................................................................	44
Table 40:	PCIe ID..................................................................................................................................................................................................	45
Table 41:	LED Functionality............................................................................................................................................................................	47

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Revision History

	Revision	Description	Revision Date
	Number
	001	Initial release	June 2014
	002	Driver and temperature updates	July 2014
		Updated performance information
	003	Updated power number for 400GB	September 2014
		Update driver/OS support list
	004	Endurance rating corrected	September 2014
		Added clarification in SMART critical warning
	005	Corrected error is QoS percentile	October 2014
		Modified power governor setting target for 01 and 02
		Updated Endurance Specifications
	006	Updated Log Identifier 0xCA and Identify Data Structure	January 2015
		SMBUS footnote
		Added RHEL 6.6 Operating System Support
		Updated Quality of Service values
	007	Modified C7 (CRC Error Count) Description	March 2015
		Modified Table 16 footnote
		Updated Power on to Ready specification
	008	Updated IDENTIFY Data Structure	March 2015
		Updated OS support list
		Added additional log page supports (05h,C1h,C2h)
	009	Updated CAh log page with NAND Bytes and Host Bytes Written	May 2015
		attributes
		Updated SMBUS management features
		Clarified slew rate requirement

§

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1 Overview

This document describes the specifications and capabilities of the Intel® Solid-State Drive (SSD) Data Center P3700 Series.

P3700 Series is a PCIe Gen3 SSD architected with the new high performance controller interface – NVMe (Non-Volatile Memory express) delivering leading performance, low latency and Quality of Service. Matching the performance with world-class reliability and endurance, P3700 Series offers a range of capacity – 400GB, 800GB, 1.6TB and 2TB in both Add-In card and 2.5-inch form factor.

With PCIe Gen3 support and NVMe queuing interface, the P3700 Series delivers excellent sequential read performance of up to 2.8GB/s and sequential write speeds of up to 2.0GB/s. P3700 Series delivers very high random read IOPS of 460K and random write IOPS of 175K for 4KB operations. Taking advantage of the direct path from the storage to the CPU by means of NVMe, P3700 Series exhibits low latency of less than 20 μs for sequential access to the SSD.

P3700 Series also includes High Endurance Technology (HET), which combines NAND silicon enhancements and SSD NAND management techniques to extend SSD write endurance up to 17 drive writes per day for 5 years.

The 2.5-inch P3700 Series takes advantage of the 8639 connector and provides hot-pluggable removal and insertion providing in-service replacement options.

P3700 Series includes these key features:

Consistently High IOPS and throughput

Sustained low latency

High Endurance Technology (HET)

Variable Sector Size and End-to-End data-path protection

Enhanced power-loss data protection

Power loss protection capacitor self-test

Out of band management

Thermal throttling and monitoring

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1.1References

Table 1: Standard Information referenced in this document

	Date	Title	Location
	Jan 2013	Enterprise SSD Form Factor Version 1.0a	http://www.ssdformfactor.org
	Feb 2012	NVMe Revision 1.0c	http://www.nvmexpress.org
	Nov 2010	PCIe Base Specification Revision 3.0	http://pcisig.com
	July 2012	Solid-State Drive (SSD) Requirements and Endurance Test	http://www.jedec.org/standards-
		Method (JESD219)	documents/results/jesd219
	Sept 2010	Solid-State Drive (SSD) Requirements and Endurance Test	http://www.jedec.org/standards-
		Method (JESD218)	documents/docs/jesd218/
	Dec 2008	VCCI	http://www.vcci.jp/vcci_e/
			http://qdms.intel.com/
	June 2009	RoHS	Click Search MDDS Database and
			search for material description
			datasheet
	1995	International Electrotechnical Commission EN 61000
		4-2 (Electrostatic discharge immunity test)
	1996
		4-3 (Radiated, radio-frequency, electromagnetic field immunity
		test)
	1995	4-4 (Electrical fast transient/burst immunity test)	http://www.iec.ch/
	1995	4-5 (Surge immunity test)
	1997	4-6 (Immunity to conducted disturbances, induced by radio-
		frequency fields)
	1994	4-11 (Voltage Variations, voltage dips, short interruptions and
		voltage variations immunity tests)
	1995	ENV 50204	http://www.dbicorporation.com/
		(Radiated electromagnetic field from digital radio telephones)	radimmun.htm/

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1.2Terms and Acronyms

Table 2: Glossary of Terms and Acronyms

Term	Definition
ATA	Advanced Technology Attachment
CRC	Cyclic Redundancy Check
DAS	Device Activity Signal
DMA	Direct Memory Access
ECC	Error Correction Code
EEPROM	Electrically Erasable Programmable Read Only Memory
EXT	Extended
FPDMA	First Party Direct Memory Access
	Gigabyte
GB	Note: The total usable capacity of the SSD may be less than the total physical capacity because a
	small portion of the capacity is used for NAND flash management and maintenance purposes.
Gb	Gigabit
HDD	Hard Disk Drive
HET	High Endurance Technology
KB	Kilobyte
I/O	Input/Output
IOPS	Input/Output Operations Per Second
ISO	International Standards Organization
LBA	Logical Block Address
MB	Megabyte (1,000,000 bytes)
MLC	Multi-level Cell
MTBF	Mean Time Between Failures
NOP	No Operation
NVMe	Non-Volatile Memory Express
PB	Petabyte
PCB	Printed Circuit Board
RDT	Reliability Demonstration Test
RMS	Root Mean Square
SSD	Solid-State Drive
TB	Terabyte
TYP	Typical
UBER	Uncorrectable Bit Error Rate
VPD	Vital Product Data
	§

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2 Product Specifications

2.1 Capacity

Table 3: User Addressable Sectors

	Intel SSD DC P3700 Series	Unformatted Capacity
		(Total User Addressable Sectors in LBA Mode)
	400GB	781,422,768
	800GB	1,562,824,368
	1.6TB	3,125,627,568
	2TB	3,907,029,168

NOTES:

1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes or 520 bytes or 528 bytes.

LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive.

The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND media management and maintenance. IDEMA or JEDEC standard is used.

2.2Performance

Table 4: Random Read/Write Input/Output Operations Per Second (IOPS)

			Intel SSD DC P3700 Series
Specification1	Unit
		400GB		800GB	1.6TB	2TB
Random 4KB 70/30 Read/Write	IOPS	150,000		200,000	240,000	265,000
(up to) 2
Random 8KB 70/30 Read/Write	IOPS	75,000		100,000	140,000	150,000
(up to) 3
Random 4KB Read (up to)2	IOPS	450,000		460,000	450,000	450,000
Random 4KB Write (up to)	IOPS	75,000		90,000	150,000	175,000
Random 8KB Read (up to)3	IOPS	275,000		285,000	290,000	295,000
Random 8KB Write (up to)	IOPS	32,000		45,000	75,000	90,000

NOTES:

1.Performance measured using IOMeter* on Windows* Server 2012 R2 driver with Queue Depth 32 and 4 workers. Measurements are performed on a full Logical Block Address (LBA) span of the drive. Power mode set at 25W.

2.4KB = 4,096 bytes

3.8KB = 8,192 bytes

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Table 5: Random Read/Write IOPS Consistency

				Intel SSD DC P3700 Series
	Specification1	Unit
			400GB	800GB	1.6TB	2TB

Random 4KB Read (up to)2	%	90	90	90	90
Random 4KB Write (up to)	%	90	90	90	90
Random 8KB Read (up to)3	%	90	90	90	90
Random 8KB Write (up to)	%	90	90	90	90

NOTES:

1.Performance consistency measured using IOMeter* based on Random 4KB with total queue depth of 128, measured as (IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability

2.4KB = 4,096 bytes

3.8KB = 8,192 bytes

Table 6: Sequential Read and Write Bandwidth

				Intel SSD DC P3700 Series
	Specification	Unit
			400GB	800GB	1.6TB	2TB
	Sequential Read (up to)1	MB/s	2,700	2,800	2,800	2,800
	Sequential Write (up to)1	MB/s	1,080	1,900	1,900	2,000

NOTES:

1.Performance measured using IOMeter* with 128 KB (131,072 bytes) of transfer size with Queue Depth 128. Power mode set at 25W.

Table 7: Latency

Specification	Intel SSD DC P3700 Series
Latency1 (TYP)
Read Sequential/Random	20/115 µs
Write Sequential/Random	20/25 µs
2	2.0 sec (TYP)
Power On to PCIe Config Ready Power On to
Controller Ready3	10.0 sec (TYP)

NOTES:

1.Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload using Windows Server 2012 R2 driver. Power mode set at 25W.

2.Power On To Ready time measured from de-assertion of PCIe* reset to PCIe Config Ready state.

3.Power On to Controller ready signifies when drive can begin receiving PCIe commands from host based on a single #PERESET. For power on from unsafe shutdown, power on to controller ready can take up to 20 seconds.

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		Intel® Solid-State Drive DC P3700 Series
Table 8: Quality of Service
		Intel SSD DC P3700 Series
Specification	Unit
		QD = 1		QD = 128
Quality of Service1,2 (99%)
Reads	ms	0.120		0.750
Writes	ms	0.090		11
Quality of Service1,2 (99.99%)
Reads	ms	4		5
Writes	ms	0.500 (400GB)		25
		0.250 (800GB, 1.6TB, 2.0TB)

NOTES:

1.Device measured using IOMeter. Quality of Service measured using 4KB (4,096 bytes) transfer size on a random workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

2.Based on Random 4KB QD=1,128 workloads, measured as the time taken for 99.0 (or 99.99) percentile of commands to finish the round-trip from host to drive and back to host.

2.3Electrical Characteristics

Table 9: Operating Voltage

	Electrical Characteristics	Intel SSD DC P3700 Series
	3.3V Operating Characteristics: (Add-in Card only)	3.3 V (±10%)
	Operating Voltage range
		66/3300 V/s
	Rise Slew Rate (Min/Max)
	Fall Slew Rate (Min/Max)1	0.66/3300 V/s
	Noise level	300 mV pp 10Hz – 100 KHz
		50 mV pp 100KHz – 20 MHz
	Min Off time2	3 seconds
	Inrush Current (Typical Peak) 3	1.5 A
	Max Average Current
		3.0 A
	12V Operating Characteristics:	12 V (+10%/-20%)
	Operating Voltage range
		240/12000 V/s
	Rise Slew Rate (Min/Max)
	Fall Slew Rate (Min/Max)1	2.4/12000 V/s
	Noise level	1000 mV pp 10Hz – 100 KHz
		100 mV pp 100KHz – 20 MHz
	Min Off time2	3 seconds
	Inrush Current (Typical Peak) 3	1.5 A
	Max Average Current
		2.1 A/ 2.45 A (Add-in Card/ 2.5-inch FF)

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Electrical Characteristics	Intel SSD DC P3700 Series
3.3Vaux Operating Characteristics:
Operating Voltage range	3.3 V (±9%)
Rise Slew Rate (Min/Max)	66/3300 V/s
Fall Slew Rate (Min/Max)1	0.66/3300 V/s
Noise level	300 mV pp 10Hz – 100 KHz
	50 mV pp 100KHz – 20 MHz
Max Current	20mA/1mA (AIC/2.5-inch FF)

Notes:

1.Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power loss management.

2.The drive must be powered off for at least 3 seconds before powering on.

3.Measured during initial power supply application. Typically this will be seen within 2 seconds of initial power up. Inrush specified for 12V and 3.3V supply, not the 3.3Vaux.

4.3.3Vaux is optional, not needed for power up or functionality. 3.3Vaux is needed for accessing VPD page by means of SMBUS for both form factors.

Table 10: Power Consumption

			Intel SSD DC P3700 Series
Specification	Unit
		400GB	800GB	1.6TB	2TB
Active Write - Average1	W	12	18	22	25
Active Read - Average2	W	9	9	10	11
Idle	W	4	4	4	4

Notes:

1.The workload equates 128KB (131,072 bytes) Queue Depth equal to 128 sequential writes. Average power is measured using scope trigger over a 100 ms sample period.

2.The workload equates 128KB (131,072 bytes) Queue Depth equal to 128 sequential reads.

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2.4Environmental Conditions

Table 11: Temperature, Shock, Vibration

Temperature	Add-In card form factor		2.5-inch form factor
Temperature
Operating1	Ambient: 0 – 55o C / 0 -40o C2		Ambient: 0–35o C, Case: 0-70o C
Non-operating3	-55–95o C
Temperature Gradient4
Operating	30o C/hr (Typical)		30o C/hr (Typical)
Non-operating	30o C/hr (Typical)		30o C/hr (Typical)
Humidity
Operating	5–95%		5–95%
Non-operating	5–95%		5–95%
Shock and Vibration		Range
Shock5
Operating	50 G Trapezoidal, 170 in/s		1,000 G (Max) at 0.5 msec
Non-operating	50 G Trapezoidal, 170 in/s		1,000 G (Max) at 0.5 msec
Vibration6
Operating	2.17 GRMS (5-700 Hz) Max		2.17 GRMS (5-700 Hz) Max
Non-operating	3.13 GRMS (5-800 Hz) Max		3.13 GRMS (5-800 Hz) Max

Notes:

1.Operating temperature implies ambient air temperature under defined airflow in Tables 12 and 13.

2.0-55° C is for airflow from the server towards the card and 0-40° C is for airflow into the server.

3.Please contact your Intel representative for details on the non-operating temperature range.

4.Temperature gradient measured without condensation.

5.Shock specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.

6.Vibration specifications assume the SSD is mounted securely with the input vibration applied to the drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using RMS value.

Table 12: Airflow Requirements for Intel SSD DC P3700 Series (Add-In Card)

Airflow		Ambient		Intel SSD DC P3700 Series
	Unit
Direction		Temperature	400GB	800GB	1.6TB	2TB
Towards	LFM	40o C	200	300	300	300
the server
Out of the	LFM	55o C	200	300	300	300
server
NOTE: For Add-In cards airflow can be for both the directions. Airflow specified is based on approach velocity.
Product Specification							May 2015
14							330566-009US

Intel® Solid-State Drive DC P3700 Series

Table 13: Airflow Requirements for Intel SSD DC P3700 Series (2.5-inch Form Factor)

	Airflow		Ambient		Intel SSD DC P3700 Series
		Unit
	Definition		Temperature	400GB	800GB	1.6TB	2TB
	Airflow Along	LFM	35o C	300	500	650	650
	Drive1	LFM	25o C	250	350	450	450
	Approach	LFM	35o C	70	120	155	155
	Airflow2	LFM	25o C	60	85	110	110

Notes:

1.It is recommended that airflow for 2.5-inch form factor should be towards the server, from the non-connector side to the connector side. Airflow is specified across the surface of the drive. Spacing between two SSDs is assumed to be 3mm.

2.The approach velocity of the airflow will be less than the airflow along the surface. Approach area of 1.35 ft2 is assumed.

2.5Product Regulatory Compliance

Intel SSD DC P3700 Series meets or exceeds the following regulatory or certification requirements.

Table 14: Product Regulatory Compliance Specifications

	Title	Description	Region For Which
			Conformity Declared
	TITLE 47-Telecommunications CHAPTER 1 –	FCC Part 15B Class A	USA
	FEDERAL COMMUNMICATIONS COMMISSION PART
	15 – RADIO FREQUENCY DEVICES	CA/CSA-CEI/IEC CISPR 22:10. This is
	ICES*-003, Issue 4 Interference-Causing Equipment	CISPR 22:2008 with Canadian	Canada
	Standard Digital Apparatus	Modifications
	IEC* 55024 Information Technology Equipment –
	Immunity characteristics – Limits and methods of	EN-55024: 2010 and its amendments	European Union
	measurement CISPR24:2010
	IEC 55022 Information Technology Equipment –
	Radio disturbance Characteristics – Limits and	EN-55022: 2010 and its amendments	European Union
	methods of measurement CISPR24:2008 (Modified)
	EN-60950-1 2nd Edition	Information Technology Equipment –	USA/Canada
		Safety – Part 1: General Requirements
	UL/CSA EN-60950-1 2nd Edition	Information Technology Equipment –	USA/Canada
		Safety – Part 1: General Requirements

May 2015	Product Specification
330566-009US	15