Intel P3700 User Manual

Intel® Solid-State Drive DC P3700 Series

Product Specification

Capacities: 400GB, 800GB, 1.6TB, 2TB Components

– Intel® 20nm MLC NAND Flash Memory

Form Factors

– 2.5-inch Form Factor

 15mm Z-height  8639-compatible connector

– AIC Form Factor

 Half-height, Half-length  Single slot x4 connector

PCIe* Gen3 X4 Performance

– Seq R/W: Up to 2800/2000MB/s – IOPS Rnd 4KB – IOPS Rnd 4KB

1,2

70/30 R/W: Up to 265K

R/W: Up to 460/175K

– Seq Latency (typ) R/W: 20/20µs

Operating System Support:

– Windows* Server 2012 R2, 2012,

2008 R2 x64

– Windows* 7, Windows* 8,

Windows* 8.1, 10 (32/64bit)

– RHEL* 6.5, 6.6, 6.7,7.0, 7.1 – SLES11 SP3*, SP4, SLES12 – Citrix* XenServer* 6.5 – VMWare* ESXi 5.5 – CentOS* 6.5 – UEFI 2.3.1*

Reliability

– Uncorrectable Bit Error Rate (UBER):

1 sector per 10

bits read

– Mean Time Before Failure (MTBF):

2 million hours

– T10 DIF protection – Variable Sector Size: 512, 520, 528, 4096,

4104, 4160, 4224 Bytes

Compliance

– NVM Express* 1.0 – PCI Express* Base Specification Rev 3.0 – Enterprise SSD Form Factor Version 1.0a – PCI Express Card Electro-Mechanical (CEM)

Specification Rev 2.0

Certifications and Declarations

– UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft*

WHQL*, VCCI*

Performance values vary by capacity and form factor

2. Performance specifications apply to both compressible and incompressible data

3. MB/s = 1,000,000 bytes/second

4. 4KB = 4,096 bytes; 8KB = 8,192 bytes

5. 1PB = 10

6. Please contact your Intel representative for details on the non-operating temperature range

7. Airflow out of server through PCIe Card Slot

Bytes

Power

– 2.5-inch: 3.3V and 12V Supply Rail – AIC: 3.3V and 12V Supply Rail – Enhanced power-loss data protection – Active/Idle (TYP): Up to 25W/4W (TYP)

Endurance Rating

– Up to 62.05 PBW (Petabytes Written) – Up to 17 Drive Writes/day (JESD219 workload)

Temperature Specification

– Operating:

 AIC: 0 to 55° C ambient with

specified airflow

 2.5-inch: 0 to 35° C ambient,

0 to 70° C case with specified airflow

– Non-Operating

: -55 to 95° C

– Temperature monitoring (In-band and by

way of SMBUS)

– Thermal throttling when approaching

maximum operating temperature

Airflow

– AIC (55° C airflow towards IO bracket

 400GB: 200 LFM  800GB, 1.6TB, 2.0TB: 300 LFM

– 2.5-inch (Airflow towards the connector)

 400GB: 250/300 LFM (25/35° C)  800GB: 350/500 LFM (25/35° C)  1.6TB, 2TB: 450/600 LFM (25/35° C)

Weight

– AIC: 400/800GB up to 185gm

1.6TB, 2TB up to 195gm

– 2.5-inch: 400/800GB up to 115gm

1.6TB, 2TB up to 125gm

Shock

– 2.5-inch: 1,000 G/0.5msec – AIC: 50 G Trapezoidal, 170 in/s

Vibration

– Operating: 2.17 G

RMS

– Non-Operating: 3.13 G

Altitude (Simulated)

– Operating: -1,000 to 10,000 ft – Non-Operating: -1,000 to 40,000 ft

Product Ecological Compliance

– RoHS

(5-700Hz)

(5-800Hz)

RMS

)

Order Number: 330566-009US

Ordering Information

Contact your local Intel sales representative for ordering information.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.

All documented endurance test results are obtained in compliance with JESD218 Standards; refer to individual sub-sections within this document for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document contains information on products in the design phase of development.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htmIntel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

Product Specification May 2015 2 330566-009US

Intel® Solid-State Drive DC P3700 Series

Contents

1 Overview.......................................................................................................................................................................................................... 7

1.1 References ................................................................................................................................................................................................. 8

1.2 Terms and Acronyms ............................................................................................................................................................................ 9

2 Product Specifications ........................................................................................................................................................................... 10

2.1 Capacity ................................................................................................................................................................................................... 10

2.2 Performance .......................................................................................................................................................................................... 10

2.3 Electrical Characteristics .................................................................................................................................................................. 12

2.4 Environmental Conditions .............................................................................................................................................................. 14

2.5 Product Regulatory Compliance .................................................................................................................................................. 15

2.6 Reliability Specifications .................................................................................................................................................................. 16

2.7 Temperature Sensor .......................................................................................................................................................................... 16

2.8 Power Loss Capacitor Test .............................................................................................................................................................. 16

2.9 Hot Plug Support ................................................................................................................................................................................. 17

2.10 Out of Band Management (SMBUS) ........................................................................................................................................... 17

2.11 Variable Sector Size Support ........................................................................................................................................................ 17

3 Mechanical Information ........................................................................................................................................................................ 18

4 Pin and Signal Descriptions ................................................................................................................................................................. 20

4.1 Pin Signal Definitions ......................................................................................................................................................................... 20

5 Supported Command Sets .................................................................................................................................................................. 23

5.1 NVMe Admin Command Set........................................................................................................................................................... 23

5.2 NVMe I/O Command Set .................................................................................................................................................................. 23

5.3 Log Page Support ................................................................................................................................................................................ 24

5.4 SMART Attributes ................................................................................................................................................................................ 24

5.5 Temperature Statistics ...................................................................................................................................................................... 27

5.6 Drive Marketing Name Log .............................................................................................................................................................. 28

5.7 IO Command Latency Statistics .................................................................................................................................................... 28

5.8 SET Feature Identifiers...................................................................................................................................................................... 28

6 NVMe Driver Support ............................................................................................................................................................................. 30

7 Certifications and Declarations .......................................................................................................................................................... 31

Appendix A IDENTIFY Data Structure ........................................................................................................................................................ 32

Appendix B Vital Data Structure ................................................................................................................................................................... 40

Appendix C Out of Band Temperature Sensor Read Out ................................................................................................................. 41

Appendix D SMBUS Command Response on 0x6A (NVMe Workgroup Defined) ................................................................. 42

Appendix E SMBUS Command Response on 0x6A (Intel Specific) .............................................................................................. 44

Appendix F PCIe* ID ........................................................................................................................................................................................... 45

Appendix G SCSI Command Translation .................................................................................................................................................. 46

Appendix H Add-in Card LED Decoder ...................................................................................................................................................... 47

May 2015 Product Specification 330566-009US 3

Intel® Solid-State Drive DC P3700 Series

Figures

Figure 3-1: Intel SSD DC P3700 Series SFF Dimensions ...................................................................................................................... 18

Figure 3-2: Intel SSD DC P3700 Series PCIe Dimensions .................................................................................................................... 19

Figure A-1: LED Location ..................................................................................................................................................................................... 47

Tables

Table 1: Standard Information referenced in this document ......................................................................................................... 8

Table 2: Glossary of Terms and Acronyms .............................................................................................................................................. 9

Table 3: User Addressable Sectors........................................................................................................................................................... 10

Table 4: Random Read/Write Input/Output Operations Per Second (IOPS) ........................................................................ 10

Table 5: Random Read/Write IOPS Consistency ................................................................................................................................ 11

Table 6: Sequential Read and Write Bandwidth ................................................................................................................................. 11

Table 7: Latency ................................................................................................................................................................................................ 11

Table 8: Quality of Service ............................................................................................................................................................................ 12

Table 9: Operating Voltage .......................................................................................................................................................................... 12

Table 10: Power Consumption ...................................................................................................................................................................... 13

Table 11: Temperature, Shock, Vibration ................................................................................................................................................ 14

Table 12: Airflow Requirements for Intel SSD DC P3700 Series (Add-In Card) ..................................................................... 14

Table 13: Airflow Requirements for Intel SSD DC P3700 Series (2.5-inch Form Factor) ................................................... 15

Table 14: Product Regulatory Compliance Specifications ............................................................................................................... 15

Table 15: Reliability Specifications.............................................................................................................................................................. 16

Table 16: Pin Definition for 2.5-inch Form Factor (8639 connector specification) .............................................................. 20

Table 17: Pin Definition for Add-In Card (Half Height Half Length) Form Factor .................................................................. 22

Table 18: SMART Attributes (Log Identifier 02h) .................................................................................................................................. 24

Table 19: Additional SMART Attributes (Log Identifier CAh) .......................................................................................................... 26

Table 20: Temperature Statistics (Log Identifier C5h) ....................................................................................................................... 27

Table 21: Drive Marketing Name Log (Log Identifier DDh) ............................................................................................................... 28

Table 22: Read/Write Command Latency Log (Log Identifier C1h/C2h) ................................................................................... 28

Table 23: Set Max LBA Setting - Command Dword 11 and Command Dword 12 ................................................................ 29

Table 24: Status Code - Set Max LBA Command Specific Status Values .................................................................................. 29

Table 25: C6h - Set/ Get Power (Typical) Governor Setting – Command Dword 11 ............................................................ 29

Table 26: Status Codes - Power Governor Setting Command Specific Status Values ........................................................ 29

Table 27: D5h – Reset Timed Workload Counters – Command Dword 11 .............................................................................. 29

Table 28: E2h – Set/Get Enable Latency Tracking ............................................................................................................................... 29

Table 29: NVMe Driver Support .................................................................................................................................................................... 30

Table 30: Device Certifications and Declarations ................................................................................................................................. 31

Table 31: Identify Controller .......................................................................................................................................................................... 32

Table 32: Power State Descriptor ................................................................................................................................................................ 36

Table 33: Identify Namespace ....................................................................................................................................................................... 37

Table 34: LBA Format Data Structure ........................................................................................................................................................ 39

Table 35: Vital Product Data Structure (VPD) ......................................................................................................................................... 40

Table 36: Capability List Pointer (Out of Band Temperature Sensor) ......................................................................................... 40

Table 37: Register 0x05 read out format .................................................................................................................................................. 41

Table 38: Command Response on 0x6A (NVMe Workgroup Defined) ....................................................................................... 42

Table 39: Command Response on 0x6A (Intel Specific) ................................................................................................................... 44

Table 40: PCIe ID .................................................................................................................................................................................................. 45

Table 41: LED Functionality ............................................................................................................................................................................ 47

Product Specification May 2015 4 330566-009US

Revision

Number

Description

Revision Date

001

 Initial release

June 2014

002

 Driver and temperature updates  Updated performance information

July 2014

003

 Updated power number for 400GB  Update driver/OS support list

September 2014

004

 Endurance rating corrected

September 2014

005

 Added clarification in SMART critical warning  Corrected error is QoS percentile  Modified power governor setting target for 01 and 02

October 2014

006

 Updated Endurance Specifications  Updated Log Identifier 0xCA and Identify Data Structure  SMBUS footnote  Added RHEL 6.6 Operating System Support

January 2015

007

 Updated Quality of Service values  Modified C7 (CRC Error Count) Description  Modified Table 16 footnote  Updated Power on to Ready specification

March 2015

008

 Updated IDENTIFY Data Structure

March 2015

009

 Updated OS support list  Added additional log page supports (05h,C1h,C2h)  Updated CAh log page with NAND Bytes and Host Bytes Written

attributes

 Updated SMBUS management features  Clarified slew rate requirement

May 2015

Intel® Solid-State Drive DC P3700 Series

Revision History

May 2015 Product Specification 330566-009US 5

Intel® Solid-State Drive DC P3700 Series

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Product Specification May 2015 6 330566-009US

Intel® Solid-State Drive DC P3700 Series

1 Overview

This document describes the specifications and capabilities of the Intel® Solid-State Drive (SSD) Data Center P3700 Series.

P3700 Series is a PCIe Gen3 SSD architected with the new high performance controller interface – NVMe (Non-Volatile Memory express) delivering leading performance, low latency and Quality of Service. Matching the performance with world-class reliability and endurance, P3700 Series offers a range of capacity – 400GB, 800GB, 1.6TB and 2TB in both Add-In card and 2.5-inch form factor.

With PCIe Gen3 support and NVMe queuing interface, the P3700 Series delivers excellent sequential read performance of up to 2.8GB/s and sequential write speeds of up to 2.0GB/s. P3700 Series delivers very high random read IOPS of 460K and random write IOPS of 175K for 4KB operations. Taking advantage of the direct path from the storage to the CPU by means of NVMe, P3700 Series exhibits low latency of less than 20 μs for sequential access to the SSD.

P3700 Series also includes High Endurance Technology (HET), which combines NAND silicon enhancements and SSD NAND management techniques to extend SSD write endurance up to 17 drive writes per day for 5 years.

The 2.5-inch P3700 Series takes advantage of the 8639 connector and provides hot-pluggable removal and insertion providing in-service replacement options.

P3700 Series includes these key features:

 Consistently High IOPS and throughput  Sustained low latency  High Endurance Technology (HET)  Variable Sector Size and End-to-End data-path protection  Enhanced power-loss data protection  Power loss protection capacitor self-test  Out of band management  Thermal throttling and monitoring

May 2015 Product Specification 330566-009US 7

Date

Title

Location

Jan 2013

Enterprise SSD Form Factor Version 1.0a

http://www.ssdformfactor.org

Feb 2012

NVMe Revision 1.0c

http://www.nvmexpress.org

Nov 2010

PCIe Base Specification Revision 3.0

http://pcisig.com

July 2012

Solid-State Drive (SSD) Requirements and Endurance Test Method (JESD219)

http://www.jedec.org/standardsdocuments/results/jesd219

Sept 2010

Solid-State Drive (SSD) Requirements and Endurance Test Method (JESD218)

http://www.jedec.org/standardsdocuments/docs/jesd218/

Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

June 2009

RoHS

http://qdms.intel.com/

Click Search MDDS Database and search for material description datasheet

1995 1996

1995 1995 1997

1994

International Electrotechnical Commission EN 61000 4-2 (Electrostatic discharge immunity test) 4-3 (Radiated, radio-frequency, electromagnetic field immunity

test) 4-4 (Electrical fast transient/burst immunity test) 4-5 (Surge immunity test) 4-6 (Immunity to conducted disturbances, induced by radiofrequency fields) 4-11 (Voltage Variations, voltage dips, short interruptions and voltage variations immunity tests)

http://www.iec.ch/

1995

ENV 50204 (Radiated electromagnetic field from digital radio telephones)

http://www.dbicorporation.com/ radimmun.htm/

1.1 References

Table 1: Standard Information referenced in this document

Intel® Solid-State Drive DC P3700 Series

Product Specification May 2015 8 330566-009US

Term

Definition

ATA

Advanced Technology Attachment

CRC

Cyclic Redundancy Check

DAS

Device Activity Signal

DMA

Direct Memory Access

ECC

Error Correction Code

EEPROM

Electrically Erasable Programmable Read Only Memory

EXT

Extended

FPDMA

First Party Direct Memory Access

Gigabyte Note: The total usable capacity of the SSD may be less than the total physical capacity because a

small portion of the capacity is used for NAND flash management and maintenance purposes.

Gigabit

HDD

Hard Disk Drive

HET

High Endurance Technology

Kilobyte

I/O

Input/Output

IOPS

Input/Output Operations Per Second

ISO

International Standards Organization

LBA

Logical Block Address

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NOP

No Operation

NVMe

Non-Volatile Memory Express

Petabyte

PCB

Printed Circuit Board

RDT

Reliability Demonstration Test

RMS

Root Mean Square

SSD

Solid-State Drive

Terabyte

TYP

Typical

UBER

Uncorrectable Bit Error Rate

VPD

Vital Product Data

Intel® Solid-State Drive DC P3700 Series

1.2 Terms and Acronyms

Table 2: Glossary of Terms and Acronyms

May 2015 Product Specification 330566-009US 9

Intel® Solid-State Drive DC P3700 Series

Intel SSD DC P3700 Series

Unformatted Capacity

(Total User Addressable Sectors in LBA Mode)

400GB

781,422,768

800GB

1,562,824,368

1.6TB

3,125,627,568

2TB

3,907,029,168

Specification1

Unit

Intel SSD DC P3700 Series

400GB

800GB

1.6TB

2TB

Random 4KB 70/30 Read/Write

(up to) 2

IOPS

150,000

200,000

240,000

265,000

Random 8KB 70/30 Read/Write

(up to) 3

IOPS

75,000

100,000

140,000

150,000

Random 4KB Read (up to)2

IOPS

450,000

460,000

450,000

Random 4KB Write (up to)

IOPS

75,000

90,000

150,000

175,000

Random 8KB Read (up to)3

IOPS

275,000

285,000

290,000

295,000

Random 8KB Write (up to)

IOPS

32,000

45,000

75,000

90,000

2 Product Specifications

2.1 Capacity

Table 3: User Addressable Sectors

NOTES:

1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes or 520 bytes or 528 bytes. LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive.

The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND media management and maintenance. IDEMA or JEDEC standard is used.

2.2 Performance

Table 4: Random Read/Write Input/Output Operations Per Second (IOPS)

NOTES:

1. Performance measured using IOMeter* on Windows* Server 2012 R2 driver with Queue Depth 32 and 4 workers.

Measurements are performed on a full Logical Block Address (LBA) span of the drive. Power mode set at 25W.

2. 4KB = 4,096 bytes

3. 8KB = 8,192 bytes

Product Specification May 2015 10 330566-009US

Specification1

Unit

Intel SSD DC P3700 Series

400GB

800GB

1.6TB

2TB

Random 4KB Read (up to)2

Random 4KB Write (up to)

Random 8KB Read (up to)3

Random 8KB Write (up to)

Specification

Unit

Intel SSD DC P3700 Series

400GB

800GB

1.6TB

2TB

Sequential Read (up to)1

MB/s

2,700

2,800

Sequential Write (up to)1

MB/s

1,080

1,900

2,000

Specification

Intel SSD DC P3700 Series

Latency1 (TYP)

Read Sequential/Random

Write Sequential/Random

Power On to PCIe Config Ready2Power On to

Controller Ready

20/115 µs

20/25 µs

2.0 sec (TYP)

10.0 sec (TYP)

Intel® Solid-State Drive DC P3700 Series

Table 5: Random Read/Write IOPS Consistency

NOTES:

1. Performance consistency measured using IOMeter* based on Random 4KB with total queue depth of 128, measured as

(IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability

2. 4KB = 4,096 bytes

3. 8KB = 8,192 bytes

Table 6: Sequential Read and Write Bandwidth

NOTES:

1. Performance measured using IOMeter* with 128 KB (131,072 bytes) of transfer size with Queue

Depth 128. Power mode set at 25W.

Table 7: Latency

NOTES:

1. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload using

Windows Server 2012 R2 driver. Power mode set at 25W.

2. Power On To Ready time measured from de-assertion of PCIe* reset to PCIe Config Ready state.

3. Power On to Controller ready signifies when drive can begin receiving PCIe commands from host based on a single

#PERESET. For power on from unsafe shutdown, power on to controller ready can take up to 20 seconds.

May 2015 Product Specification 330566-009US 11

Intel® Solid-State Drive DC P3700 Series

Specification

Unit

Intel SSD DC P3700 Series

QD = 1

QD = 128

Quality of Service

1,2

(99%)

Reads

0.120

0.750

Writes

0.090

Quality of Service

1,2

(99.99%)

Reads

Writes

0.500 (400GB)

0.250 (800GB, 1.6TB, 2.0TB)

Electrical Characteristics

Intel SSD DC P3700 Series

3.3V Operating Characteristics: (Add-in Card only)

Operating Voltage range Rise Slew Rate (Min/Max) Fall Slew Rate (Min/Max)1 Noise level

Min Off time2 Inrush Current (Typical Peak)

Max Average Current

3.3 V (±10%) 66/3300 V/s

0.66/3300 V/s

300 mV pp 10Hz – 100 KHz

50 mV pp 100KHz – 20 MHz

3 seconds

1.5 A

3.0 A

12V Operating Characteristics:

Operating Voltage range Rise Slew Rate (Min/Max) Fall Slew Rate (Min/Max)1 Noise level

Min Off time2 Inrush Current (Typical Peak)

Max Average Current

12 V (+10%/-20%)

240/12000 V/s

2.4/12000 V/s

1000 mV pp 10Hz – 100 KHz

100 mV pp 100KHz – 20 MHz

3 seconds

1.5 A

2.1 A/ 2.45 A (Add-in Card/ 2.5-inch FF)

Table 8: Quality of Service

NOTES:

1. Device measured using IOMeter. Quality of Service measured using 4KB (4,096 bytes) transfer size on a random

workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

2. Based on Random 4KB QD=1,128 workloads, measured as the time taken for 99.0 (or 99.99) percentile of commands

to finish the round-trip from host to drive and back to host.

2.3 Electrical Characteristics

Table 9: Operating Voltage

Product Specification May 2015 12 330566-009US

Electrical Characteristics

Intel SSD DC P3700 Series

3.3Vaux Operating Characteristics:

Operating Voltage range Rise Slew Rate (Min/Max) Fall Slew Rate (Min/Max)

Noise level

Max Current

3.3 V (±9%)

66/3300 V/s

0.66/3300 V/s

300 mV pp 10Hz – 100 KHz

50 mV pp 100KHz – 20 MHz

20mA/1mA (AIC/2.5-inch FF)

Specification

Unit

Intel SSD DC P3700 Series

400GB

800GB

1.6TB

2TB

Active Write - Average1

Active Read - Average2

W 9 9

Idle

W 4 4 4 4

Intel® Solid-State Drive DC P3700 Series

Notes:

1. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power

loss management.

2. The drive must be powered off for at least 3 seconds before powering on.

3. Measured during initial power supply application. Typically this will be seen within 2 seconds of initial power up.

Inrush specified for 12V and 3.3V supply, not the 3.3Vaux.

4. 3.3Vaux is optional, not needed for power up or functionality. 3.3Vaux is needed for accessing VPD page by means

of SMBUS for both form factors.

Table 10: Power Consumption

Notes:

1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 128 sequential writes. Average power is

measured using scope trigger over a 100 ms sample period.

2. The workload equates 128KB (131,072 bytes) Queue Depth equal to 128 sequential reads.

May 2015 Product Specification 330566-009US 13

Temperature

Add-In card form factor

2.5-inch form factor

Temperature Operating1 Non-operating3

Ambient: 0 – 55o C / 0 -40o C2

-55–95o C

Ambient: 0–35o C, Case: 0-70o C

Temperature Gradient

Operating Non-operating

30o C/hr (Typical) 30o C/hr (Typical)

Humidity Operating Non-operating

5–95% 5–95%

Shock and Vibration

Range

Shock

Operating Non-operating

50 G Trapezoidal, 170 in/s 50 G Trapezoidal, 170 in/s

1,000 G (Max) at 0.5 msec 1,000 G (Max) at 0.5 msec

Vibration

Operating Non-operating

2.17 GRMS (5-700 Hz) Max

3.13 G

RMS

(5-800 Hz) Max

2.17 GRMS (5-700 Hz) Max

3.13 G

RMS

(5-800 Hz) Max

Airflow

Direction

Unit

Ambient

Temperature

Intel SSD DC P3700 Series

400GB

800GB

1.6TB

2TB

Towards

the server

LFM

40o C

200

300

Out of the

server

LFM

55o C

200

300

2.4 Environmental Conditions

Table 11: Temperature, Shock, Vibration

Intel® Solid-State Drive DC P3700 Series

Notes:

1. Operating temperature implies ambient air temperature under defined airflow in Tables 12 and 13.

2. 0-55° C is for airflow from the server towards the card and 0-40° C is for airflow into the server.

3. Please contact your Intel representative for details on the non-operating temperature range.

4. Temperature gradient measured without condensation.

5. Shock specifications assume the SSD is mounted securely with the input vibration applied to the

drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.

6. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the

drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using RMS value.

Table 12: Airflow Requirements for Intel SSD DC P3700 Series (Add-In Card)

NOTE: For Add-In cards airflow can be for both the directions. Airflow specified is based on approach velocity.

Product Specification May 2015 14 330566-009US

Airflow

Definition

Unit

Ambient

Temperature

Intel SSD DC P3700 Series

400GB

800GB

1.6TB

2TB

Airflow Along Drive1

LFM

35o C

300

500

650

LFM

25o C

250

350

450

Approach Airflow2

LFM

35o C

120

155

LFM

25o C

110

Title

Description

Region For Which

Conformity Declared

TITLE 47-Telecommunications CHAPTER 1 – FEDERAL COMMUNMICATIONS COMMISSION PART 15 – RADIO FREQUENCY DEVICES ICES*-003, Issue 4 Interference-Causing Equipment Standard Digital Apparatus

FCC Part 15B Class A

CA/CSA-CEI/IEC CISPR 22:10. This is CISPR 22:2008 with Canadian Modifications

USA

Canada

IEC* 55024 Information Technology Equipment – Immunity characteristics – Limits and methods of measurement CISPR24:2010

EN-55024: 2010 and its amendments

European Union

IEC 55022 Information Technology Equipment – Radio disturbance Characteristics – Limits and methods of measurement CISPR24:2008 (Modified)

EN-55022: 2010 and its amendments

European Union

EN-60950-1 2nd Edition

Information Technology Equipment – Safety – Part 1: General Requirements

USA/Canada

UL/CSA EN-60950-1 2nd Edition

Information Technology Equipment – Safety – Part 1: General Requirements

USA/Canada

Intel® Solid-State Drive DC P3700 Series

Table 13: Airflow Requirements for Intel SSD DC P3700 Series (2.5-inch Form Factor)

Notes:

1. It is recommended that airflow for 2.5-inch form factor should be towards the server, from the non-connector

side to the connector side. Airflow is specified across the surface of the drive. Spacing between two SSDs is assumed to be 3mm.

2. The approach velocity of the airflow will be less than the airflow along the surface. Approach area

of 1.35 ft2 is assumed.

2.5 Product Regulatory Compliance

Intel SSD DC P3700 Series meets or exceeds the following regulatory or certification requirements.

Table 14: Product Regulatory Compliance Specifications

May 2015 Product Specification 330566-009US 15

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