Intel P3700 User Manual

Download

Intel® Solid-State Drive DC P3700 Series

Product Specification

Capacities: 400GB, 800GB, 1.6TB, 2TB Components

– Intel® 20nm MLC NAND Flash Memory

Form Factors

– 2.5-inch Form Factor

 15mm Z-height  8639-compatible connector

– AIC Form Factor

 Half-height, Half-length  Single slot x4 connector

PCIe* Gen3 X4 Performance

– Seq R/W: Up to 2800/2000MB/s – IOPS Rnd 4KB – IOPS Rnd 4KB

1,2

70/30 R/W: Up to 265K

R/W: Up to 460/175K

– Seq Latency (typ) R/W: 20/20µs

Operating System Support:

– Windows* Server 2012 R2, 2012,

2008 R2 x64

– Windows* 7, Windows* 8,

Windows* 8.1, 10 (32/64bit)

– RHEL* 6.5, 6.6, 6.7,7.0, 7.1 – SLES11 SP3*, SP4, SLES12 – Citrix* XenServer* 6.5 – VMWare* ESXi 5.5 – CentOS* 6.5 – UEFI 2.3.1*

Reliability

– Uncorrectable Bit Error Rate (UBER):

1 sector per 10

bits read

– Mean Time Before Failure (MTBF):

2 million hours

– T10 DIF protection – Variable Sector Size: 512, 520, 528, 4096,

4104, 4160, 4224 Bytes

Compliance

– NVM Express* 1.0 – PCI Express* Base Specification Rev 3.0 – Enterprise SSD Form Factor Version 1.0a – PCI Express Card Electro-Mechanical (CEM)

Specification Rev 2.0

Certifications and Declarations

– UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft*

WHQL*, VCCI*

Performance values vary by capacity and form factor

2. Performance specifications apply to both compressible and incompressible data

3. MB/s = 1,000,000 bytes/second

4. 4KB = 4,096 bytes; 8KB = 8,192 bytes

5. 1PB = 10

6. Please contact your Intel representative for details on the non-operating temperature range

7. Airflow out of server through PCIe Card Slot

Bytes

Power

– 2.5-inch: 3.3V and 12V Supply Rail – AIC: 3.3V and 12V Supply Rail – Enhanced power-loss data protection – Active/Idle (TYP): Up to 25W/4W (TYP)

Endurance Rating

– Up to 62.05 PBW (Petabytes Written) – Up to 17 Drive Writes/day (JESD219 workload)

Temperature Specification

– Operating:

 AIC: 0 to 55° C ambient with

specified airflow

 2.5-inch: 0 to 35° C ambient,

0 to 70° C case with specified airflow

– Non-Operating

: -55 to 95° C

– Temperature monitoring (In-band and by

way of SMBUS)

– Thermal throttling when approaching

maximum operating temperature

Airflow

– AIC (55° C airflow towards IO bracket

 400GB: 200 LFM  800GB, 1.6TB, 2.0TB: 300 LFM

– 2.5-inch (Airflow towards the connector)

 400GB: 250/300 LFM (25/35° C)  800GB: 350/500 LFM (25/35° C)  1.6TB, 2TB: 450/600 LFM (25/35° C)

Weight

– AIC: 400/800GB up to 185gm

1.6TB, 2TB up to 195gm

– 2.5-inch: 400/800GB up to 115gm

1.6TB, 2TB up to 125gm

Shock

– 2.5-inch: 1,000 G/0.5msec – AIC: 50 G Trapezoidal, 170 in/s

Vibration

– Operating: 2.17 G

RMS

– Non-Operating: 3.13 G

Altitude (Simulated)

– Operating: -1,000 to 10,000 ft – Non-Operating: -1,000 to 40,000 ft

Product Ecological Compliance

– RoHS

(5-700Hz)

(5-800Hz)

RMS

)

Order Number: 330566-009US

Ordering Information

Contact your local Intel sales representative for ordering information.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase.

All documented endurance test results are obtained in compliance with JESD218 Standards; refer to individual sub-sections within this document for specific methodologies. See www.jedec.org for detailed definitions of JESD218 Standards.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document contains information on products in the design phase of development.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htmIntel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

Product Specification May 2015 2 330566-009US

Intel® Solid-State Drive DC P3700 Series

Contents

1 Overview.......................................................................................................................................................................................................... 7

1.1 References ................................................................................................................................................................................................. 8

1.2 Terms and Acronyms ............................................................................................................................................................................ 9

2 Product Specifications ........................................................................................................................................................................... 10

2.1 Capacity ................................................................................................................................................................................................... 10

2.2 Performance .......................................................................................................................................................................................... 10

2.3 Electrical Characteristics .................................................................................................................................................................. 12

2.4 Environmental Conditions .............................................................................................................................................................. 14

2.5 Product Regulatory Compliance .................................................................................................................................................. 15

2.6 Reliability Specifications .................................................................................................................................................................. 16

2.7 Temperature Sensor .......................................................................................................................................................................... 16

2.8 Power Loss Capacitor Test .............................................................................................................................................................. 16

2.9 Hot Plug Support ................................................................................................................................................................................. 17

2.10 Out of Band Management (SMBUS) ........................................................................................................................................... 17

2.11 Variable Sector Size Support ........................................................................................................................................................ 17

3 Mechanical Information ........................................................................................................................................................................ 18

4 Pin and Signal Descriptions ................................................................................................................................................................. 20

4.1 Pin Signal Definitions ......................................................................................................................................................................... 20

5 Supported Command Sets .................................................................................................................................................................. 23

5.1 NVMe Admin Command Set........................................................................................................................................................... 23

5.2 NVMe I/O Command Set .................................................................................................................................................................. 23

5.3 Log Page Support ................................................................................................................................................................................ 24

5.4 SMART Attributes ................................................................................................................................................................................ 24

5.5 Temperature Statistics ...................................................................................................................................................................... 27

5.6 Drive Marketing Name Log .............................................................................................................................................................. 28

5.7 IO Command Latency Statistics .................................................................................................................................................... 28

5.8 SET Feature Identifiers...................................................................................................................................................................... 28

6 NVMe Driver Support ............................................................................................................................................................................. 30

7 Certifications and Declarations .......................................................................................................................................................... 31

Appendix A IDENTIFY Data Structure ........................................................................................................................................................ 32

Appendix B Vital Data Structure ................................................................................................................................................................... 40

Appendix C Out of Band Temperature Sensor Read Out ................................................................................................................. 41

Appendix D SMBUS Command Response on 0x6A (NVMe Workgroup Defined) ................................................................. 42

Appendix E SMBUS Command Response on 0x6A (Intel Specific) .............................................................................................. 44

Appendix F PCIe* ID ........................................................................................................................................................................................... 45

Appendix G SCSI Command Translation .................................................................................................................................................. 46

Appendix H Add-in Card LED Decoder ...................................................................................................................................................... 47

May 2015 Product Specification 330566-009US 3

Intel® Solid-State Drive DC P3700 Series

Figures

Figure 3-1: Intel SSD DC P3700 Series SFF Dimensions ...................................................................................................................... 18

Figure 3-2: Intel SSD DC P3700 Series PCIe Dimensions .................................................................................................................... 19

Figure A-1: LED Location ..................................................................................................................................................................................... 47

Tables

Table 1: Standard Information referenced in this document ......................................................................................................... 8

Table 2: Glossary of Terms and Acronyms .............................................................................................................................................. 9

Table 3: User Addressable Sectors........................................................................................................................................................... 10

Table 4: Random Read/Write Input/Output Operations Per Second (IOPS) ........................................................................ 10

Table 5: Random Read/Write IOPS Consistency ................................................................................................................................ 11

Table 6: Sequential Read and Write Bandwidth ................................................................................................................................. 11

Table 7: Latency ................................................................................................................................................................................................ 11

Table 8: Quality of Service ............................................................................................................................................................................ 12

Table 9: Operating Voltage .......................................................................................................................................................................... 12

Table 10: Power Consumption ...................................................................................................................................................................... 13

Table 11: Temperature, Shock, Vibration ................................................................................................................................................ 14

Table 12: Airflow Requirements for Intel SSD DC P3700 Series (Add-In Card) ..................................................................... 14

Table 13: Airflow Requirements for Intel SSD DC P3700 Series (2.5-inch Form Factor) ................................................... 15

Table 14: Product Regulatory Compliance Specifications ............................................................................................................... 15

Table 15: Reliability Specifications.............................................................................................................................................................. 16

Table 16: Pin Definition for 2.5-inch Form Factor (8639 connector specification) .............................................................. 20

Table 17: Pin Definition for Add-In Card (Half Height Half Length) Form Factor .................................................................. 22

Table 18: SMART Attributes (Log Identifier 02h) .................................................................................................................................. 24

Table 19: Additional SMART Attributes (Log Identifier CAh) .......................................................................................................... 26

Table 20: Temperature Statistics (Log Identifier C5h) ....................................................................................................................... 27

Table 21: Drive Marketing Name Log (Log Identifier DDh) ............................................................................................................... 28

Table 22: Read/Write Command Latency Log (Log Identifier C1h/C2h) ................................................................................... 28

Table 23: Set Max LBA Setting - Command Dword 11 and Command Dword 12 ................................................................ 29

Table 24: Status Code - Set Max LBA Command Specific Status Values .................................................................................. 29

Table 25: C6h - Set/ Get Power (Typical) Governor Setting – Command Dword 11 ............................................................ 29

Table 26: Status Codes - Power Governor Setting Command Specific Status Values ........................................................ 29

Table 27: D5h – Reset Timed Workload Counters – Command Dword 11 .............................................................................. 29

Table 28: E2h – Set/Get Enable Latency Tracking ............................................................................................................................... 29

Table 29: NVMe Driver Support .................................................................................................................................................................... 30

Table 30: Device Certifications and Declarations ................................................................................................................................. 31

Table 31: Identify Controller .......................................................................................................................................................................... 32

Table 32: Power State Descriptor ................................................................................................................................................................ 36

Table 33: Identify Namespace ....................................................................................................................................................................... 37

Table 34: LBA Format Data Structure ........................................................................................................................................................ 39

Table 35: Vital Product Data Structure (VPD) ......................................................................................................................................... 40

Table 36: Capability List Pointer (Out of Band Temperature Sensor) ......................................................................................... 40

Table 37: Register 0x05 read out format .................................................................................................................................................. 41

Table 38: Command Response on 0x6A (NVMe Workgroup Defined) ....................................................................................... 42

Table 39: Command Response on 0x6A (Intel Specific) ................................................................................................................... 44

Table 40: PCIe ID .................................................................................................................................................................................................. 45

Table 41: LED Functionality ............................................................................................................................................................................ 47

Product Specification May 2015 4 330566-009US

Revision

Number

Description

Revision Date

001

 Initial release

June 2014

002

 Driver and temperature updates  Updated performance information

July 2014

003

 Updated power number for 400GB  Update driver/OS support list

September 2014

004

 Endurance rating corrected

September 2014

005

 Added clarification in SMART critical warning  Corrected error is QoS percentile  Modified power governor setting target for 01 and 02

October 2014

006

 Updated Endurance Specifications  Updated Log Identifier 0xCA and Identify Data Structure  SMBUS footnote  Added RHEL 6.6 Operating System Support

January 2015

007

 Updated Quality of Service values  Modified C7 (CRC Error Count) Description  Modified Table 16 footnote  Updated Power on to Ready specification

March 2015

008

 Updated IDENTIFY Data Structure

March 2015

009

 Updated OS support list  Added additional log page supports (05h,C1h,C2h)  Updated CAh log page with NAND Bytes and Host Bytes Written

attributes

 Updated SMBUS management features  Clarified slew rate requirement

May 2015

Intel® Solid-State Drive DC P3700 Series

Revision History

May 2015 Product Specification 330566-009US 5

Intel® Solid-State Drive DC P3700 Series

This page intentionally left blank.

Product Specification May 2015 6 330566-009US

Intel® Solid-State Drive DC P3700 Series

1 Overview

This document describes the specifications and capabilities of the Intel® Solid-State Drive (SSD) Data Center P3700 Series.

P3700 Series is a PCIe Gen3 SSD architected with the new high performance controller interface – NVMe (Non-Volatile Memory express) delivering leading performance, low latency and Quality of Service. Matching the performance with world-class reliability and endurance, P3700 Series offers a range of capacity – 400GB, 800GB, 1.6TB and 2TB in both Add-In card and 2.5-inch form factor.

With PCIe Gen3 support and NVMe queuing interface, the P3700 Series delivers excellent sequential read performance of up to 2.8GB/s and sequential write speeds of up to 2.0GB/s. P3700 Series delivers very high random read IOPS of 460K and random write IOPS of 175K for 4KB operations. Taking advantage of the direct path from the storage to the CPU by means of NVMe, P3700 Series exhibits low latency of less than 20 μs for sequential access to the SSD.

P3700 Series also includes High Endurance Technology (HET), which combines NAND silicon enhancements and SSD NAND management techniques to extend SSD write endurance up to 17 drive writes per day for 5 years.

The 2.5-inch P3700 Series takes advantage of the 8639 connector and provides hot-pluggable removal and insertion providing in-service replacement options.

P3700 Series includes these key features:

 Consistently High IOPS and throughput  Sustained low latency  High Endurance Technology (HET)  Variable Sector Size and End-to-End data-path protection  Enhanced power-loss data protection  Power loss protection capacitor self-test  Out of band management  Thermal throttling and monitoring

May 2015 Product Specification 330566-009US 7

Date

Title

Location

Jan 2013

Enterprise SSD Form Factor Version 1.0a

http://www.ssdformfactor.org

Feb 2012

NVMe Revision 1.0c

http://www.nvmexpress.org

Nov 2010

PCIe Base Specification Revision 3.0

http://pcisig.com

July 2012

Solid-State Drive (SSD) Requirements and Endurance Test Method (JESD219)

http://www.jedec.org/standardsdocuments/results/jesd219

Sept 2010

Solid-State Drive (SSD) Requirements and Endurance Test Method (JESD218)

http://www.jedec.org/standardsdocuments/docs/jesd218/

Dec 2008

VCCI

http://www.vcci.jp/vcci_e/

June 2009

RoHS

http://qdms.intel.com/

Click Search MDDS Database and search for material description datasheet

1995 1996

1995 1995 1997

1994

International Electrotechnical Commission EN 61000 4-2 (Electrostatic discharge immunity test) 4-3 (Radiated, radio-frequency, electromagnetic field immunity

test) 4-4 (Electrical fast transient/burst immunity test) 4-5 (Surge immunity test) 4-6 (Immunity to conducted disturbances, induced by radiofrequency fields) 4-11 (Voltage Variations, voltage dips, short interruptions and voltage variations immunity tests)

http://www.iec.ch/

1995

ENV 50204 (Radiated electromagnetic field from digital radio telephones)

http://www.dbicorporation.com/ radimmun.htm/

1.1 References

Table 1: Standard Information referenced in this document

Intel® Solid-State Drive DC P3700 Series

Product Specification May 2015 8 330566-009US

Term

Definition

ATA

Advanced Technology Attachment

CRC

Cyclic Redundancy Check

DAS

Device Activity Signal

DMA

Direct Memory Access

ECC

Error Correction Code

EEPROM

Electrically Erasable Programmable Read Only Memory

EXT

Extended

FPDMA

First Party Direct Memory Access

Gigabyte Note: The total usable capacity of the SSD may be less than the total physical capacity because a

small portion of the capacity is used for NAND flash management and maintenance purposes.

Gigabit

HDD

Hard Disk Drive

HET

High Endurance Technology

Kilobyte

I/O

Input/Output

IOPS

Input/Output Operations Per Second

ISO

International Standards Organization

LBA

Logical Block Address

Megabyte (1,000,000 bytes)

MLC

Multi-level Cell

MTBF

Mean Time Between Failures

NOP

No Operation

NVMe

Non-Volatile Memory Express

Petabyte

PCB

Printed Circuit Board

RDT

Reliability Demonstration Test

RMS

Root Mean Square

SSD

Solid-State Drive

Terabyte

TYP

Typical

UBER

Uncorrectable Bit Error Rate

VPD

Vital Product Data

Intel® Solid-State Drive DC P3700 Series

1.2 Terms and Acronyms

Table 2: Glossary of Terms and Acronyms

May 2015 Product Specification 330566-009US 9

Intel® Solid-State Drive DC P3700 Series

Intel SSD DC P3700 Series

Unformatted Capacity

(Total User Addressable Sectors in LBA Mode)

400GB

781,422,768

800GB

1,562,824,368

1.6TB

3,125,627,568

2TB

3,907,029,168

Specification1

Unit

Intel SSD DC P3700 Series

400GB

800GB

1.6TB

2TB

Random 4KB 70/30 Read/Write

(up to) 2

IOPS

150,000

200,000

240,000

265,000

Random 8KB 70/30 Read/Write

(up to) 3

IOPS

75,000

100,000

140,000

150,000

Random 4KB Read (up to)2

IOPS

450,000

460,000

450,000

Random 4KB Write (up to)

IOPS

75,000

90,000

150,000

175,000

Random 8KB Read (up to)3

IOPS

275,000

285,000

290,000

295,000

Random 8KB Write (up to)

IOPS

32,000

45,000

75,000

90,000

2 Product Specifications

2.1 Capacity

Table 3: User Addressable Sectors

NOTES:

1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes or 520 bytes or 528 bytes. LBA count shown represents total user storage capacity and will remain the same throughout the life of the drive.

The total usable capacity of the SSD may be less than the total physical capacity because a small portion of the capacity is used for NAND media management and maintenance. IDEMA or JEDEC standard is used.

2.2 Performance

Table 4: Random Read/Write Input/Output Operations Per Second (IOPS)

NOTES:

1. Performance measured using IOMeter* on Windows* Server 2012 R2 driver with Queue Depth 32 and 4 workers.

Measurements are performed on a full Logical Block Address (LBA) span of the drive. Power mode set at 25W.

2. 4KB = 4,096 bytes

3. 8KB = 8,192 bytes

Product Specification May 2015 10 330566-009US

Specification1

Unit

Intel SSD DC P3700 Series

400GB

800GB

1.6TB

2TB

Random 4KB Read (up to)2

Random 4KB Write (up to)

Random 8KB Read (up to)3

Random 8KB Write (up to)

Specification

Unit

Intel SSD DC P3700 Series

400GB

800GB

1.6TB

2TB

Sequential Read (up to)1

MB/s

2,700

2,800

Sequential Write (up to)1

MB/s

1,080

1,900

2,000

Specification

Intel SSD DC P3700 Series

Latency1 (TYP)

Read Sequential/Random

Write Sequential/Random

Power On to PCIe Config Ready2Power On to

Controller Ready

20/115 µs

20/25 µs

2.0 sec (TYP)

10.0 sec (TYP)

Intel® Solid-State Drive DC P3700 Series

Table 5: Random Read/Write IOPS Consistency

NOTES:

1. Performance consistency measured using IOMeter* based on Random 4KB with total queue depth of 128, measured as

(IOPS in the 99.9th percentile slowest 1-second interval)/(average IOPS during the test). Measurements are performed on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability

2. 4KB = 4,096 bytes

3. 8KB = 8,192 bytes

Table 6: Sequential Read and Write Bandwidth

NOTES:

1. Performance measured using IOMeter* with 128 KB (131,072 bytes) of transfer size with Queue

Depth 128. Power mode set at 25W.

Table 7: Latency

NOTES:

1. Latency measured using 4 KB (4,096 bytes) transfer size with Queue Depth equal to 1 on a sequential workload using

Windows Server 2012 R2 driver. Power mode set at 25W.

2. Power On To Ready time measured from de-assertion of PCIe* reset to PCIe Config Ready state.

3. Power On to Controller ready signifies when drive can begin receiving PCIe commands from host based on a single

#PERESET. For power on from unsafe shutdown, power on to controller ready can take up to 20 seconds.

May 2015 Product Specification 330566-009US 11

Intel® Solid-State Drive DC P3700 Series

Specification

Unit

Intel SSD DC P3700 Series

QD = 1

QD = 128

Quality of Service

1,2

(99%)

Reads

0.120

0.750

Writes

0.090

Quality of Service

1,2

(99.99%)

Reads

Writes

0.500 (400GB)

0.250 (800GB, 1.6TB, 2.0TB)

Electrical Characteristics

Intel SSD DC P3700 Series

3.3V Operating Characteristics: (Add-in Card only)

Operating Voltage range Rise Slew Rate (Min/Max) Fall Slew Rate (Min/Max)1 Noise level

Min Off time2 Inrush Current (Typical Peak)

Max Average Current

3.3 V (±10%) 66/3300 V/s

0.66/3300 V/s

300 mV pp 10Hz – 100 KHz

50 mV pp 100KHz – 20 MHz

3 seconds

1.5 A

3.0 A

12V Operating Characteristics:

Operating Voltage range Rise Slew Rate (Min/Max) Fall Slew Rate (Min/Max)1 Noise level

Min Off time2 Inrush Current (Typical Peak)

Max Average Current

12 V (+10%/-20%)

240/12000 V/s

2.4/12000 V/s

1000 mV pp 10Hz – 100 KHz

100 mV pp 100KHz – 20 MHz

3 seconds

1.5 A

2.1 A/ 2.45 A (Add-in Card/ 2.5-inch FF)

Table 8: Quality of Service

NOTES:

1. Device measured using IOMeter. Quality of Service measured using 4KB (4,096 bytes) transfer size on a random

workload on a full Logical Block Address (LBA) span of the drive once the workload has reached steady state but including all background activities required for normal operation and data reliability.

2. Based on Random 4KB QD=1,128 workloads, measured as the time taken for 99.0 (or 99.99) percentile of commands

to finish the round-trip from host to drive and back to host.

2.3 Electrical Characteristics

Table 9: Operating Voltage

Product Specification May 2015 12 330566-009US

Electrical Characteristics

Intel SSD DC P3700 Series

3.3Vaux Operating Characteristics:

Operating Voltage range Rise Slew Rate (Min/Max) Fall Slew Rate (Min/Max)

Noise level

Max Current

3.3 V (±9%)

66/3300 V/s

0.66/3300 V/s

300 mV pp 10Hz – 100 KHz

50 mV pp 100KHz – 20 MHz

20mA/1mA (AIC/2.5-inch FF)

Specification

Unit

Intel SSD DC P3700 Series

400GB

800GB

1.6TB

2TB

Active Write - Average1

Active Read - Average2

W 9 9

Idle

W 4 4 4 4

Intel® Solid-State Drive DC P3700 Series

Notes:

1. Fall time needs to be equal or better than minimum in order to guarantee full functionality of enhanced power

loss management.

2. The drive must be powered off for at least 3 seconds before powering on.

3. Measured during initial power supply application. Typically this will be seen within 2 seconds of initial power up.

Inrush specified for 12V and 3.3V supply, not the 3.3Vaux.

4. 3.3Vaux is optional, not needed for power up or functionality. 3.3Vaux is needed for accessing VPD page by means

of SMBUS for both form factors.

Table 10: Power Consumption

Notes:

1. The workload equates 128KB (131,072 bytes) Queue Depth equal to 128 sequential writes. Average power is

measured using scope trigger over a 100 ms sample period.

2. The workload equates 128KB (131,072 bytes) Queue Depth equal to 128 sequential reads.

May 2015 Product Specification 330566-009US 13

Temperature

Add-In card form factor

2.5-inch form factor

Temperature Operating1 Non-operating3

Ambient: 0 – 55o C / 0 -40o C2

-55–95o C

Ambient: 0–35o C, Case: 0-70o C

Temperature Gradient

Operating Non-operating

30o C/hr (Typical) 30o C/hr (Typical)

Humidity Operating Non-operating

5–95% 5–95%

Shock and Vibration

Range

Shock

Operating Non-operating

50 G Trapezoidal, 170 in/s 50 G Trapezoidal, 170 in/s

1,000 G (Max) at 0.5 msec 1,000 G (Max) at 0.5 msec

Vibration

Operating Non-operating

2.17 GRMS (5-700 Hz) Max

3.13 G

RMS

(5-800 Hz) Max

2.17 GRMS (5-700 Hz) Max

3.13 G

RMS

(5-800 Hz) Max

Airflow

Direction

Unit

Ambient

Temperature

Intel SSD DC P3700 Series

400GB

800GB

1.6TB

2TB

Towards

the server

LFM

40o C

200

300

Out of the

server

LFM

55o C

200

300

2.4 Environmental Conditions

Table 11: Temperature, Shock, Vibration

Intel® Solid-State Drive DC P3700 Series

Notes:

1. Operating temperature implies ambient air temperature under defined airflow in Tables 12 and 13.

2. 0-55° C is for airflow from the server towards the card and 0-40° C is for airflow into the server.

3. Please contact your Intel representative for details on the non-operating temperature range.

4. Temperature gradient measured without condensation.

5. Shock specifications assume the SSD is mounted securely with the input vibration applied to the

drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Shock specification is measured using Root Mean Squared (RMS) value.

6. Vibration specifications assume the SSD is mounted securely with the input vibration applied to the

drive-mounting screws. Stimulus may be applied in the X, Y or Z axis. Vibration specification is measured using RMS value.

Table 12: Airflow Requirements for Intel SSD DC P3700 Series (Add-In Card)

NOTE: For Add-In cards airflow can be for both the directions. Airflow specified is based on approach velocity.

Product Specification May 2015 14 330566-009US

Airflow

Definition

Unit

Ambient

Temperature

Intel SSD DC P3700 Series

400GB

800GB

1.6TB

2TB

Airflow Along Drive1

LFM

35o C

300

500

650

LFM

25o C

250

350

450

Approach Airflow2

LFM

35o C

120

155

LFM

25o C

110

Title

Description

Region For Which

Conformity Declared

TITLE 47-Telecommunications CHAPTER 1 – FEDERAL COMMUNMICATIONS COMMISSION PART 15 – RADIO FREQUENCY DEVICES ICES*-003, Issue 4 Interference-Causing Equipment Standard Digital Apparatus

FCC Part 15B Class A

CA/CSA-CEI/IEC CISPR 22:10. This is CISPR 22:2008 with Canadian Modifications

USA

Canada

IEC* 55024 Information Technology Equipment – Immunity characteristics – Limits and methods of measurement CISPR24:2010

EN-55024: 2010 and its amendments

European Union

IEC 55022 Information Technology Equipment – Radio disturbance Characteristics – Limits and methods of measurement CISPR24:2008 (Modified)

EN-55022: 2010 and its amendments

European Union

EN-60950-1 2nd Edition

Information Technology Equipment – Safety – Part 1: General Requirements

USA/Canada

UL/CSA EN-60950-1 2nd Edition

Information Technology Equipment – Safety – Part 1: General Requirements

USA/Canada

Intel® Solid-State Drive DC P3700 Series

Table 13: Airflow Requirements for Intel SSD DC P3700 Series (2.5-inch Form Factor)

Notes:

1. It is recommended that airflow for 2.5-inch form factor should be towards the server, from the non-connector

side to the connector side. Airflow is specified across the surface of the drive. Spacing between two SSDs is assumed to be 3mm.

2. The approach velocity of the airflow will be less than the airflow along the surface. Approach area

of 1.35 ft2 is assumed.

2.5 Product Regulatory Compliance

Intel SSD DC P3700 Series meets or exceeds the following regulatory or certification requirements.

Table 14: Product Regulatory Compliance Specifications

May 2015 Product Specification 330566-009US 15

Intel® Solid-State Drive DC P3700 Series

Parameter

Value

Uncorrectable Bit Error Rate (UBER) Uncorrectable bit error rate will not exceed one sector in the

specified number of bits read. In the unlikely event of a nonrecoverable read error, the SSD will report it as a read failure to the host; the sector in error is considered corrupt and is not returned to the host.

< 1 sector per 1017 bits read

Mean Time Between Failures (MTBF) Mean Time Between Failures is estimated based on Telcordia*

methodology and demonstrated through Reliability Demonstration Test (RDT).

2 million hours

Data Retention The time period for retaining data in the NAND at maximum rated endurance.

3 months power-off retention once SSD

reaches rated write endurance at 40° C

Endurance Rating

The number of drive writes such that the SSD meets the requirements according to the JESD218 standard. Endurance rating verification is defined to establish UBER <1E-16 at 60% upper confidence limit.

400GB: 7.3 PBW

800GB: 14.6 PBW

(10 drive writes/day*)

1.6TB: 43.8 PBW

(15 drive writes/day*)

2.0TB: 62.05 PBW

(17 drive writes/day*)

2.6 Reliability Specifications

Intel SSD DC P3700 Series meets or exceeds SSD endurance and data retention requirements as specified in the JESD218 standard. Reliability specifications are listed in the following table.

Table 15: Reliability Specifications

Note: Petabytes Written (PBW). Refer to JESD218 standard table 1 for UBER, FFR and other Enterprise SSD

requirements.

2.7 Temperature Sensor

P3700 Series has an internal temperature sensor with an accuracy of +/-2° C over a range of -10° C to +85° C which can be monitored using NVMe Health Log.

For more information on sensor reading see SMART attributes section. In addition, drive will provide out of band access to temperature by means of SMBUS. The sensor has an accuracy of +/- 3° C over a range of -20° C to 125° C. SMBUS temperature sensor will not be reported in NVMe Health Log.

2.8 Power Loss Capacitor Test

P3700 Series supports testing of the power loss capacitor, which can be monitored using SMART attribute critical warning in log page identifier 02h, byte 0, bit 4.

Product Specification May 2015 16 330566-009US

Intel® Solid-State Drive DC P3700 Series

2.9 Hot Plug Support

2.5-inch form factor will support surprise hot plug feature in capable platforms and OSs. P3700 Series supports hot insertion and removal and surprise hot insertion by means of presence detect and link-up detect. On surprise hot removal during IOs, P3700 Series will ensure the integrity of already committed data on the media and commit acknowledged writes to the media.

2.10 Out of Band Management (SMBUS)

Intel SSD DC P3700 Series provides out of band management by means of SMBUS interface. This requires 3.3V Auxiliary voltage. SMBUS accesses a VPD page as listed in Appendix B through address 0X53/0XA6 (7bit/8bit).

Temperature sensor is accessed through address 0x1B/0x36(7bit/8bit). For temperature sensor access, temperature can be read by the BMC (base) using Read Temperature Data Register (0x05) by means of SMBUS 0x1B. Bits [11:0] return raw ambient temperature.

Intel SSD DC P3700 provides additional drive information via address 0x6/0xD4(7bit/8bit) as outlined in the NVMe Basic Management Command (see http://www.nvmexpress.org/wp-content/uploads/NVMe_Management_-

_Technical_Note_on_Basic_Management_Command.pdf).

Appendix B, C and D have details on the Out of Band Management data structure.

NOTES:

1. In certain tools the address for the VPD and temperature sensor will appear as 0xA6 and 0x36

respectively, due to bit shift.

2. BMC should not access the SMBUS address within 100msec of device power up, it may experience

some glitch on the bus.

2.11 Variable Sector Size Support

P3700 Series supports 512, 520, 528, 4096, 4104, 4160 and 4224 byte sector sizes. P3700 Series will also support DIF as specified in NVMe 1.0 specification. Host sector sizes supporting DIF are 512 bytes and 4096 bytes with a PI (Protection Information) of 8 bytes.

In terms of protection information action (PRACT), bit 29 of DWORD12 in READ/WRITE command should not be equal to 1. Device only supports PRACT=0 implying protection information is passed to the SSD and checked by the SSD.

May 2015 Product Specification 330566-009US 17

Intel® Solid-State Drive DC P3700 Series

X – Length

Y - Width

Z - Height

100.45 Max

69.85 +/- 0.25

15.0 +0/-0.5

3 Mechanical Information

Figures 3-1 and 3-2 show the physical package information for the Intel SSD DC P3700 Series in the 2.5-inch form factors. All dimensions are in millimeters.

Figure 3-1: Intel SSD DC P3700 Series SFF Dimensions

Note: Length does not include 0.3 connector protrusion

Product Specification May 2015 18 330566-009US

Intel® Solid-State Drive DC P3700 Series

Figure 3-2: Intel SSD DC P3700 Series PCIe Dimensions

May 2015 Product Specification 330566-009US 19

Intel® Solid-State Drive DC P3700 Series

Name

Description

Name

Description

GND

Ground

REFCLK0+

Reference clock port 0

S2 Not used (SATA/SAS)

REFCLK0-

Reference clock port 0

S3 Not used (SATA/SAS)

GND

Ground

GND

Ground

E10

PETp0

Transmitter differential pair, Lane 0

S5 Not used (SATA/SAS)

E11

PETn0

Transmitter differential pair, Lane 0

S6 Not used (SATA/SAS)

E12

GND

Ground

GND

Ground

E13

PERn0

Receiver differential pair, Lane 0

REFCLK1+

Reference clock port 1 (not used)

E14

PERp0

Receiver differential pair, Lane 0

REFCLK1-

Reference clock port 1 (not used)

E15

GND

Ground E3

3.3Vaux

3.3V auxiliary power

E16

RSVD

Reserved

PERST1#

Fundamental reset port 1 (not used)

GND

Ground E5

PERST0#

Fundamental reset port 0

S9 Not used (SATAe/SAS)

RSVD

Reserved

S10 Not used (SATAe/SAS)

P1 Not used (SATAe/SAS)

S11

GND

Ground

P2 Not used (SATAe/SAS)

S12 Not used (SATAe/SAS)

P3 Not used (SATAe)

S13 Not used (SATAe/SAS)

IfDet_N

Interface detect (drive type)

S14

GND

Ground

GND

Ground

S15

RSVD

Reserved

GND

Ground

S16

GND

Ground

P7 Not used (SATA/SAS)

S17

PETp1

Transmitter differential pair, Lane 1

P8 Not used (SATA/SAS)

S18

PETn1

Transmitter differential pair, Lane 1

P9 Not used (SATA/SAS)

S19

GND

Ground

P10

PRSNT_N

Presence detect (also used for drive type)

S20

PERn1

Receiver differential pair, Lane 1 P11

Activity

Activity signal from the drive

S21

PERp1

Receiver differential pair, Lane 1

P12

Hot-Plug

Ground

S22

GND

Ground

P13

+12V_pre

12V power

S23

PETp2

Transmitter differential pair, Lane 2

P14

+12V

12V power

S24

PETn2

Transmitter differential pair, Lane 2

P15

+12V

12V power

S25

GND

Ground

S26

PERn2

Receiver differential pair, Lane 2

S27

PERp2

Receiver differential pair, Lane 2

S28

GND

Ground

4 Pin and Signal Descriptions

4.2 Pin Signal Definitions

Table 16: Pin Definition for 2.5-inch Form Factor (8639 connector specification)

Product Specification May 2015 20 330566-009US

Name

Description

Name

Description

E17

PETp3

Transmitter differential pair, Lane 3

E18

PETn3

Transmitter differential pair, Lane 3

E19

GND

Ground

E20

PERn3

Receiver differential pair, Lane 3

E21

PERp3

Receiver differential pair, Lane 3

E22

GND

Ground

E23

SMCLK

SMBus clock

E24

SMDAT

SMBus data

E25

DualPortEn_N

Dual port enable

Intel® Solid-State Drive DC P3700 Series

NOTES:

 SMCLK and SMDAT routes to an internal EEPROM which contains Vital Product Data (VPD).  PRSNT_N is kept open by the P3700 Series.  IfDet_N is grounded by P3700 Series.  DualPortEn_N pin should be left un-connected or un-driven by the system to enable single port operation with

all 4 lanes. If un-connected, P3700 Series will pull it high. However, if the pin is asserted by the system (driven low by storage backplane), then P3700 Series will be configured as x2 lanes

 Transmit differential pair lanes have 220 nF of AC coupling capacitance.  P11 is used for activity. When idle, logic level is low (LED Solid On). During IO activity and formatting,

pin toggles 250msec high, 250msec low signal.

 P3700 Series only uses REFCLK0+ and REFCLK0- as reference clock pair.  P3700 Series only uses PERST0# as a fundamental reset.  3.3Vaux is only needed during SMBUS access to the VPDROM.

May 2015 Product Specification 330566-009US 21

Intel® Solid-State Drive DC P3700 Series

Side B

Side A

Name

Description

Name

Description

+12V

12V power

PRSNT1#

Hot-Plug presence detect

+12V

12V power

+12V

12V power

+12V

12V power

+12V

12V power

GND

Ground

GND

Ground

SMCLK

SMBus(System Management Bus) clock

JTAG2

TCK (Test Clock), clock input for JTAG interface

SMDAT

SMBus (System Management Bus) data

JTAG3

TDI (Test Data Input)

GND

Ground / UART_HOST

JTAG4

TDO (Test Data Output)

+3.3V

3.3V power

JTAG5

TMS (Test Mode Select)

JTAG1

TRST# (Test Reset) resets the JTAG interface

+3.3V

3.3V power

3.3Vaux

3.3V auxiliary power

+3.3V

3.3V power

WAKE#

Signal for Link reactivation

PERST#

Fundamental reset

Mechanical Key

RSVD

Reserved

GND

Ground

GND

Ground

REFCLK+

Reference clock (differential pair)

PETp0

Transmitter differential pair, Lane 0

REFCLK-

Reference clock (differential pair)

PETn0

Transmitter differential pair, Lane 0

GND

Ground

GND

Ground

PERp0

Receiver differential pair, Lane 0

PRSNT2#

Hot-Plug presence detect

PERn0

Receiver differential pair, Lane 0

GND

Ground

GND

Ground

End of the x1 Connector

PETp1

Transmitter differential pair, Lane 1

RSVD

Reserved

PETn1

Transmitter differential pair, Lane 1

GND

Ground

GND

Ground

PERp1

Receiver differential pair, Lane 1

GND

Ground

PERn1

Receiver differential pair, Lane 1

PETp2

Transmitter differential pair, Lane 2

GND

Ground

PETn2

Transmitter differential pair, Lane 2

GND

Ground

GND

Ground

PERp2

Receiver differential pair, Lane 2

GND

Ground

PERn2

Receiver differential pair, Lane 2

PETp3

Transmitter differential pair, Lane 3

GND

Ground

PETn3

Transmitter differential pair, Lane 3

GND

Ground

GND

Ground

PERp3

Receiver differential pair, Lane 3

RSVD

Reserved

PERn3

Receiver differential pair, Lane 3

PRSNT2#

Hot-Plug presence detect

GND

Ground

GND

Ground

RSVD

Reserved

End of the x4 Connector

Table 17: Pin Definition for Add-In Card (Half Height Half Length) Form Factor

NOTES:

 All pins are numbered in ascending order from the left to the right, with side A on the top of the centerline and

side B on the bottom of the centerline, use the reference drawing in Fig2, with the logo visible.

 The PCI Express interface pins PETpx, PETnx, PERpx, and PERnx are named with the following convention: “PE”

stands for PCI Express high speed, “T” for Transmitter, “R” for Receiver, “p” for positive (+) and “n” for negative (-).

 The sequential mating for Hot-Plug is accomplished by staggering the edge fingers on the add-in card.

Product Specification May 2015 22 330566-009US

Intel® Solid-State Drive DC P3700 Series

5 Supported Command Sets

Intel SSD DC P3700 Series supports all mandatory Admin and I/O commands defined in NVMe (Non-Volatile Memory Express) revision 1.0.

5.1 NVMe Admin Command Set

P3700 Series supports all mandatory NVMe commands, which consists of:

 Delete I/O Submission Queue  Delete I/O Completion Queue  Create I/O Submission Queue  Create I/O Completion Queue  Get Log Page  Identify  Abort  SET Features  GET Features  Asynchronous Event Notification

P3700 Series also supports the following optional I/O commands defined in NVMe revision 1.0:

 Firmware Activate  Firmware Image Download  Format NVM

Note: See Appendix A, “Identify Controller Data Structure” for details on commands

and capabilities.

5.2 NVMe I/O Command Set

P3700 Series supports all the mandatory NVMe I/O command set defined in NVMe 1.0 specification, which consists of:

 Flush  Write  Read

Additionally, the following optional commands are supported:

 Write Uncorrectable  Dataset Management (De-allocate only)

Note: See Appendix G, “SCSI Command Translation Table” for details on SCSI supported commands and

capabilities.

May 2015 Product Specification 330566-009US 23

Intel® Solid-State Drive DC P3700 Series

Byte

# of

Bytes

Attribute

Description

Critical Warning: These bits if set, flag various

warning sources.

Bit 0: Available Spare is below Threshold

Bit 1: Temperature has exceeded Threshold

Bit 2: Reliability is degraded due to excessive media

or internal errors

Bit 3: Media is placed in Read- Only Mode

Bit 4: Volatile Memory Backup System has failed (e.g., enhanced power loss capacitor test failure)

Bits 5-7: Reserved

Any of the critical warning can be tied to

asynchronous event notification. Drive

Health Indicator defined under bytes 3095-

3076 of Identify Controller may still indicate

“healthy” status when the critical warning

flag is set.

Temperature: Overall Device current temperature in

Kelvin.

For AIC, this reports the NAND temperature,

for 2.5-inch FF, this reports the case

temperature,

Available Spare: Contains a normalized percentage

(0 to 100%) of the remaining spare capacity

available

Starts from 100 and decrements.

Available Spare Threshold

Threshold is set to 10%.

Percentage Used Estimate (Value allowed to exceed

100%)

A value of 100 indicates that the estimated

endurance of the device has been

consumed, but may not indicate a device

failure. The value is allowed to exceed 100.

Percentages greater than 254 shall be

represented as 255. This value shall be

updated once per power-on hour (when the

controller is not in a sleep state).

5.3 Log Page Support

Intel SSD DC P3700 Series supports the following mandatory log pages defined in NVMe 1.0 specification:

 Error Information (Log Identifier 01h)  SMART/ Health Information (Log Identifier 02h)  Firmware Slot Information (Log Identifier 03h)  Command Effects Log (Log Identifier 05h)

Note: See NVMe 1.0 version of the specification for the log page content. Additionally, P3700 Series will support

the following vendor unique log pages:

 Log Page Directory (Log Identifier C0h)  Read Command Latency Statistics Log (Log Identifier C1h)  Write Command Latency Statistics Log (Log Identifier C2h)  Temperature Statistics (Log Identifier C5h)  Vendor Unique SMART Log (Log Identifier CAh)

5.4 SMART Attributes

The following table lists the SMART attributes supported by the P3700 Series in accordance with NVMe 1.0 specification.

Table 18: SMART Attributes (Log Identifier 02h)

Product Specification May 2015 24 330566-009US

Byte

# of

Bytes

Attribute

Description

Data Units Read (in LBAs)

Contains the number of 512 byte data units

the host has read from the controller; this

value does not include metadata. This value

is reported in thousands (i.e., a value of 1

corresponds to 1000 units of 512 bytes

read) and is rounded up. When the LBA size

is a value other than 512 bytes, the

controller shall convert the amount of data

read to 512 byte units.

Data Units Write (in LBAs)

Contains the number of 512 byte data units

the host has written to the controller; this

value does not include metadata. This value

is reported in thousands (i.e., a value of 1

corresponds to 1000 units of 512 bytes

written) and is rounded up. When the LBA

size is a value other than 512 bytes, the

controller shall convert the amount of data

written to 512 byte units. For the NVM*

command set, logical blocks written as part of Write operations shall be included in this value. Write Uncorrectable commands shall

not impact this value.

Host Read Commands

Contains the number of read commands

issued to the controller.

Host Write Commands

Contains the number of write commands

issued to the controller.

Controller Busy Time (in minutes)

Contains the amount of time the controller is

busy with I/O commands. The controller is

busy when there is a command outstanding

to an I/O Queue (specifically, a command

was issued by way of an I/O Submission

Queue Tail doorbell write and the

corresponding completion queue entry has

not been posted yet to the associated I/O

Completion Queue). This value is reported in

minutes.

112

Power Cycles

Contains the number of power cycles.

128

Power On Hours

Contains the number of power-on hours.

This does not include time that the

controller was powered and in a low power

state condition.

144

Unsafe shutdowns

Contains the number of unsafe shutdowns.

This count is incremented when a shutdown notification (CC.SHN) is not received prior to

loss of power.

160

Media Errors

Contains the number of occurrences where

the controller detected an unrecovered data

integrity error. Errors such as uncorrectable

ECC, CRC checksum failure, or LBA tag

mismatch are included in this field.

176

Number of Error Information Log Entries

Contains the number of Error Information

log entries over the life of the controller.

Intel® Solid-State Drive DC P3700 Series

May 2015 Product Specification 330566-009US 25

Byte

# of Bytes

Attribute

Description

AB (Program Fail Count)

Raw value: shows total count of program fails. Normalized value: beginning at 100, shows the percent remaining of allowable program fails.

Normalized Value

Current Raw Value

AC (Erase Fail Count)

Raw value: shows total count of erase fails. Normalized value: beginning at 100, shows the percent remaining of allowable erase fails.

Normalized Value

Current Raw Value

AD (Wear Leveling Count)

Raw value: Bytes 1-0: Min. erase cycle Bytes 3-2: Max. erase cycle Bytes 5-4: Avg. erase cycles Normalized value: decrements from 100 to 0.

Normalized Value

Current Raw Value

B8 (End to End Error Detection Count)

Raw value: reports number of End-to-End detected and corrected errors by hardware. Normalized value: always 100.

Normalized Value

Current Raw Value

C7 (CRC Error Count)

Raw value: total number of PCIe Interface CRC errors encountered, as specified in PCIe Link Performance Counter Parameter for “Bad TLP”. Normalized value: always 100.

Normalized Value

Current Raw Value

E2 (Timed Workload, Media Wear)

Raw value: measures the wear seen by the SSD (since reset of the workload timer, attribute E4h), as a percentage of the maximum rated cycles. Divide the raw value by 1024 to derive the percentage with 3 decimal points. Normalized value: always 100.

Normalized Value

Current Raw Value

E3 (Timed Workload, Host Reads %)

Raw value: shows the percentage of I/O operations that are read operations (since reset of the workload timer, attribute E4h). Reported as integer percentage from 0 to 100. Normalized value: always 100.

Normalized Value

Current Raw Value

E4 (Timed Workload, Timer)

Raw value: measures the elapsed time (number of minutes since starting this workload timer).

Normalized value: always 100.

Normalized Value

Current Raw Value

EA (Thermal Throttle Status)

Raw value: reports Percent Throttle Status and Count of events Byte 0: Throttle status reported as integer percentage. Bytes 1-4: Throttling event count. Number of times thermal throttle has activated. Preserved over power cycles. Byte 5: Reserved. Normalized value: always 100.

Normalized Value

101

Current Raw Value

108

F0 (Retry Buffer Overflow Counter)

Raw Value: Counter to indicate the number of times Retry Buffer has overflown

Normalized Value is always 100

111

Normalized Value

113

Current Raw Value

120

F3 (PLL Lock Loss Count)

Raw Value: Counter to indicate the number of times PCIe Refclock PLL has unlocked

Normalized Value is always 100

123

Normalized Value

125

Current Raw Value

Table 19: Additional SMART Attributes (Log Identifier CAh)

Intel® Solid-State Drive DC P3700 Series

Product Specification May 2015 26 330566-009US

Byte

# of Bytes

Attribute

Description

132

F4 (NAND Bytes Written)

Nand sectors written divided by 65536 (1 count = 32 MiB)

Normalized value always 100

135

Normalized Value

137

Current Value

144

F5 (Host Bytes Written)

Host sectors written divided by 65536 (1 count = 32 MiB)

Normalized value always 100

147

Normalized Value

149

Current Value

Byte

# of Bytes

Description

Current Temperature

8 8 Overtemp shutdown Flag for last critical component temperature

16 8 Overtemp shutdown Flag for life critical component temperature

Highest temperature

Lowest temperature

Specified Maximum Operating Temperature

Specified Minimum Operating Temperature

104

Estimated offset

Intel® Solid-State Drive DC P3700 Series

5.5 Temperature Statistics

Table 20: Temperature Statistics (Log Identifier C5h)

Note: For 2.5-inch form factor, case temperature is reported.

For Add-in Card, NAND temperature is reported.

May 2015 Product Specification 330566-009US 27

Byte

# of Bytes

Log Page Content

Intel

Space

SSD

Space

P3700

Space

Series

28-511

484

Reserved

Byte

# of Bytes

Log Page Content

Major Revision

Minor Revision

128

First group of buckets: range 0-1ms, step 32us, each bucket size is 4 bytes, total 32

buckets

132

124

Second group of buckets: range 1-32ms, step 1ms, each bucket size is 4 bytes, total 31

buckets

256

124

Third group of buckets: range 32ms-1s, step 32ms, each bucket size is 4 bytes, total 31

buckets

5.6 Drive Marketing Name Log

Table 21: Drive Marketing Name Log (Log Identifier DDh)

Intel® Solid-State Drive DC P3700 Series

5.7 IO Command Latency Statistics

Table 22: Read/Write Command Latency Log (Log Identifier C1h/C2h)

5.8 SET Feature Identifiers

In addition to the SMART attribute structure, features pertaining to the operation and health of the Intel SSD DC P3700 Series can be reported to the host on request through the Get Features command. P3700 Series can change settings using SET Features on the following items as defined in NVMe 1.0 specification.

 Arbitration (Feature Identifier 01h)  Power Management (Feature Identifier 02h)  Temperature Threshold (Feature Identifier 04h)  Error Recovery (Feature Identifier 05h)  Volatile Write Cache (Feature Identifier 06h)  Number of Queues (Feature Identifier 07h)  Interrupt Coalescing (Feature Identifier 08h)  Interrupt Vector Configuration (Feature Identifier 09h)  Write Atomicity (Feature Identifier 0Ah)  Asynchronous Event Configuration (Feature Identifier 0Bh)

Product Specification May 2015 28 330566-009US

Bit

Description

63:00

Maximum User LBA: Write Usage: This field sets the 64-bit maximum LBA addressable by the Drive.

Read Usage: This field contains the 64-bit maximum LBA addressable by the Drive.

Command Dword 11 contains bits 31:00; Command Dword 12 contains bits 63: 32.

Value

Description

C0h

Requested MAX LBA exceeds Available capacity

C1h

Requested MAX LBA smaller than minimum allowable limit.

C2h

Requested MAX LBA is smaller than allocated Namespace requirements

Bit

Description

31:08

Reserved (TBD)

07:00

Power Governor Setting: 00h = 25W , 01h = 20W , 02h = 10W

Value

Description

C0h

Invalid Setting

Bit

Description

31:01

Reserved

Timed Workload Reset Settings: Write Usage: 00 = NOP, 1 = Reset E2, E3,E4 counters; Read Usage: Not Supported

Bit

Description

31:01

Write Usage: 00h = Disable Latency Tracking (Default) 01h = Enable Latency Tracking

Intel® Solid-State Drive DC P3700 Series

Intel SSD DC P3700 Series will also support the following vendor unique SET Features.

 Set/Get Max LBA (Feature Identifier C1h)  Get Native Max LBA (Feature Identifier C2h)  Power Governor Setting (Feature Identifier C6h)  Reset Timed Workload Counters (Feature Identifier D5h)  Set/Get Enable Latency Tracking (Feature Identifier E2h)

Table 23: Set Max LBA Setting - Command Dword 11 and Command Dword 12

Table 24: Status Code - Set Max LBA Command Specific Status Values

Table 25: C6h - Set/ Get Power (Typical) Governor Setting – Command Dword 11

Table 26: Status Codes - Power Governor Setting Command Specific Status Values

Table 27: D5h – Reset Timed Workload Counters – Command Dword 11

Note: Get Features will not work for “Reset Timed Workload Counters” and status code is same as Table 25.

Table 28: E2h – Set/Get Enable Latency Tracking

May 2015 Product Specification 330566-009US 29

Intel® Solid-State Drive DC P3700 Series

Support Level

Operating System Description

Intel Provided1

Windows Server 2012 R2, 2012, 2008 R2 x64, Windows 7(32bit/64bit), Windows 8 (32bit/64bit), Windows 8.1, Windows 10, (32bit/64Bit), VMWare ESXi 5.5

In-box Driver

RHEL 6.5, RHEL 6.6, RHEL 6.7, RHEL 7.0, RHEL 7.1, SLES11 SP3, SP4, SLES12, CentOS 6.5, Citrix XenServer 6.5, Windows Server 2012 R2, Windows 8.1

6 NVMe Driver Support

The following table describes the NVMe Driver Support for Intel SSD DC P3700 Series. The support includes releasing and validating NVMe drivers for certain operating systems and validating functionality for open source drive, inbox or native drivers for select operating systems.

Table 29: NVMe Driver Support

NOTES:

1. With Intel provided driver, full product specification is guaranteed, booting is only supported for 64bit OS

2. With open source non-Intel driver, compatibility and functionality is validated

Product Specification May 2015 30 330566-009US

Certification

Description

CE* Compliant

European Economic Area (EEA): Compliance with the essential requirements of EC Council Directives Low Voltage Directive (LVD) 2006/95/EC, EMC Directive 2004/108/EC and Directive 2011/65/EU.

UL* Recognized

Certified Underwriters Laboratories, Inc. Bi-National Component Recognition; UL 60950-1, 2nd Edition, 2007-03-27 (Information Technology Equipment - Safety - Part 1: General Requirements)

CSA C22.2 No. 60950-1-07, 2nd Edition, 2007-03 (Information Technology Equipment - Safety

- Part 1: General Requirements)

C-Tick* Compliant

Compliance with the Australia/New Zealand Standard AS/NZS3548 and Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communication Authority (ACA).

BSMI* Compliant

Compliance to the Taiwan EMC standard CNS 13438: Information technology equipment Radio disturbance Characteristics - limits and methods of measurement, as amended on June 1, 2006, is harmonized with CISPR 22: 2005.04.

KCC*

Compliance with paragraph 1 of Article 11 of the Electromagnetic Compatibility Control Regulation and meets the Electromagnetic Compatibility (EMC) Framework requirements of the Radio Research Laboratory (RRL) Ministry of Information and Communication Republic of Korea.

VCCI*

Voluntary Control Council for Interface to cope with disturbance problems caused by personal computers or facsimile.

Microsoft* WHCK

Microsoft Windows Hardware Certification Kit

RoHS* Compliant

Restriction of Hazardous Substance Directive

WEEE*

Directive on Waste Electrical and Electronic Equipment

Intel® Solid-State Drive DC P3700 Series

7 Certifications and Declarations

Table 30: Device Certifications and Declarations

May 2015 Product Specification 330566-009US 31

Intel® Solid-State Drive DC P3700 Series

Bytes

F = Fixed

V = Variable

X = Both

Default

Value

Interpretation

Description

1-0 F

8086h

Contains the company vendor identifier that is assigned by the PCI SIG

PCI Vendor ID (VID)

3-2 F

8086h

Contains the company vendor identifier that is assigned by the PCI SIG for subsystem

PCI Subsystem Vendor ID (SSVID) 23-4 V

varies

Contains the serial number for the NVM subsystem

Serial Number (SN)

63-24 V

varies

Contains the serial number for the NVM subsystem that is assigned by the vendor as an ASCII string

Model Number (MN)

71-64 V

varies

Contains the currently active firmware revision for the NVM subsystem

Firmware Revision (FR) 72 F

Recommended Arbitration Burst size equals 1

Recommended Arbitration Burst (RAB)

75-73 F

5CD2E4h

Contains the Organization Unique Identifier (OUI) for the controller vendor

IEEE OUI Identifier (IEEE)

76 X

No of multiple PCI Express interfaces connected to the host, bit 0 determines multiple interface

Multi-Interface Capabilities (MIC) 77 F 05h Supports MDTS of 128K

Maximum Data Transfer Size (MDTS)

255:78

Reserved

257-256 F

06h

Supports Security Send/Receive, Format NVM and Firmware Activate/Download

Optional Admin Command Support (OACS)

258 F 03h

Supports up to 3 concurrently outstanding abort commands

Abort Command Limit (ACL)

259 F 03h

Supports up to 3 concurrently outstanding asynchronous event requests

Asynchronous Event Request Limit (AERL)

260 X 02h

Single slot

Read/write capable

Firmware Updates (FRMW)

261 X 0h

SMART/Health Log Support per drive not per namespace

Log Page Attributes (LPA)

262 F 3Fh

Number of Error Information log entries equals 64

Error Log Page Entries (ELPE)

263 F 0h

Number of NVM Express power states equal 1

Number of Power States Support (NPSS)

264 F 0h

Configuration settings for Admin Vendor Specific command handling

Admin Vendor Specific Command Configuration (AVSCC)

Appendix A IDENTIFY Data Structure

Table 31: Identify Controller

Product Specification May 2015 32 330566-009US

Bytes

F = Fixed

V = Variable

X = Both

Default

Value

Interpretation

Description

511-265

Reserved

512 F 66h

Required and max submission queue entry size is 64 Byte

Submission Queue Entry Size (SQES)

513 F 44h

Required and max submission queue entry size is 16 Byte

Completion Queue Entry Size (CQES) 515-514

Reserved

519-516

01h

Supports single namespace

Number of Namespaces (NN)

521-520

06h

Supports Dataset Management and Write Uncorrectable optional NVMe commands.

Optional NVMe Command Support (ONCS)

523-522

Fused commands not supported

Fused Operation Support (FUSES)

524 F 07h

Supports Crypto Erase and format of entire drive, not per namespace

Format NVM Attributes (FNA): 525 F 0h

Volatile write cache is not present

Volatile Write Cache (VWC)

527-526

Atomic write size for controller during normal equals to 512B

Atomic Write Unit Normal (AWUN)

529-528

Indicates the atomic write size for the controller during a power fail condition equals 512B

Atomic Write Unit Power Fail (AWUPF) 530 X 0h

Not Supported

NVM Vendor Specific Command Configuration (NVSCC)

703-531

Reserved

2047-704

Reserved

2079-2048

Indicates the characteristics of power state 0

Power State 0 Descriptor (PSD0)

2111-2080

Indicates the characteristics of power state 1

Power State 1 Descriptor (PSD1)

2143-2112

Indicates the characteristics of power state 2

Power State 2 Descriptor (PSD2)

2175-2144

Indicates the characteristics of power state 3

Power State 3 Descriptor (PSD3)

2207-2176

Indicates the characteristics of power state 4

Power State 4 Descriptor (PSD4)

2239-2208

Indicates the characteristics of power state 5

Power State 5 Descriptor (PSD5)

2271-2240

Indicates the characteristics of power state 6

Power State 6 Descriptor (PSD6)

2303-2272

Indicates the characteristics of power state 7

Power State 7 Descriptor (PSD7)

2335-2304

Indicates the characteristics of power state 8

Power State 8 Descriptor (PSD8)

2367-2336

Indicates the characteristics of power state 9

Power State 9 Descriptor (PSD9)

2399-2368

Indicates the characteristics of power state 10

Power State 10 Descriptor (PSD10)

2431-2400

Indicates the characteristics of power state 11

Power State 11 Descriptor (PSD11)

Intel® Solid-State Drive DC P3700 Series

May 2015 Product Specification 330566-009US 33

Bytes

F = Fixed

V = Variable

X = Both

Default

Value

Interpretation

Description

2463-2432

Indicates the characteristics of power state 12

Power State 12 Descriptor (PSD12)

2495-2464

Indicates the characteristics of power state 13

Power State 13 Descriptor (PSD13)

2527-2496

Indicates the characteristics of power state 14

Power State 14 Descriptor (PSD14)

2559-2528

Indicates the characteristics of power state 15

Power State 15 Descriptor (PSD15)

2591-2560

Indicates the characteristics of power state 16

Power State 16 Descriptor (PSD16)

2623-2592

Indicates the characteristics of power state 17

Power State 17 Descriptor (PSD17)

2655-2624

Indicates the characteristics of power state 18

Power State 18 Descriptor (PSD18)

2687-2656

Indicates the characteristics of power state 19

Power State 19 Descriptor (PSD19)

2719-2688

Indicates the characteristics of power state 20

Power State 20 Descriptor (PSD20)

2751-2720

Indicates the characteristics of power state 21

Power State 21 Descriptor (PSD21)

2783-2752

Indicates the characteristics of power state 22

Power State 22 Descriptor (PSD22)

2815-2784

Indicates the characteristics of power state 23

Power State 23 Descriptor (PSD23)

2847-2816

Indicates the characteristics of power state 24

Power State 24 Descriptor (PSD24)

2879-2848

Indicates the characteristics of power state 25

Power State 25 Descriptor (PSD25)

2911-2880

Indicates the characteristics of power state 26

Power State 26 Descriptor (PSD26)

2943-2912

Indicates the characteristics of power state 27

Power State 27 Descriptor (PSD27)

2975-2944

Indicates the characteristics of power state 28

Power State 28 Descriptor (PSD28)

3007-2976

Indicates the characteristics of power state 29

Power State 29 Descriptor (PSD29)

3039-3008

Indicates the characteristics of power state 30

Power State 30 Descriptor (PSD30)

3071-3040

Indicates the characteristics of power state 31

Power State 31 Descriptor (PSD31)

3075

05h

Data striped at 128 KB, value shown is reported as 2^ (CAP.MPSMIN)

Internal stripe size 3095-3076

Varies

Shows healthy status or error code

Health indicator

3096

Varies

Reads current negotiated PCIe link speed, as reported by PXLS register (PXCAP + 12h), bits[3:0]

Current PCIe Link Speed field (CLS)

Intel® Solid-State Drive DC P3700 Series

Product Specification May 2015 34 330566-009US

Bytes

F = Fixed

V = Variable

X = Both

Default

Value

Interpretation

Description

3097

Varies

Reads current negotiated PCIe Link Width as reported by PXLS register (PXCAP + 12h), bits[9:4]

Negotiated Link Width (NLW)

3107-3100

Varies

Bootloader Version

Bootloader Version reported by the drive

3109-3108

0x8086

Company Vendor Identifier

Vendor identifier assigned by PCI-SIG (Intel)

3111-3110

0x0953

Device Identifier

Device identifier assigned by PCI-SIG (Intel)

4095-3112

Range of bytes is allocated for vendor specific usage

Vendor Specific (VS)

Intel® Solid-State Drive DC P3700 Series

NOTES:

F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change

when media is removed or changed. V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the commands executed by the device. X = F or V. The content of the word may be fixed or variable.

May 2015 Product Specification 330566-009US 35

Bytes

F = Fixed

V = Variable

X = Both

Default

Value

Interpretation

Description

255-125

Reserved

124-120 F

Indicates the relative write latency associated with this power state

Relative Write Latency (RWL) 119-117

Reserved

116-112 F 0h

Indicates the relative write throughput associated with this power state

Relative Write Throughput (RWT) 111-109

Reserved

108-104 F 0h

Indicates the relative read latency associated with this power state

Relative Read Latency (RRL) 103-101

Reserved

100-96 F 0h

Indicates the relative read throughput associated with this power state.

Relative Read Throughput (RRT)

95-64 F 0h

Indicates the maximum exit latency in microseconds associated with exiting this power state.

Exit Latency (EXLAT)

63-32 F 0h

Indicates the maximum entry latency in microseconds

associated with entering this power state

Entry Latency (ENLAT)

31-16

Reserved

15-00 F 09C4h

Indicates the maximum power consumed by the NVM subsystem in this power state. The power in Watts is equal to the value in this field multiplied by 0.01

Maximum Power (MP)

Table 32: Power State Descriptor

Intel® Solid-State Drive DC P3700 Series

NOTES:

F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when

media is removed or changed. V = Variable. The state of at least one bit in a word is variable and may change depending on the state of the device or the commands executed by the device. X = F or V. The content of the word may be fixed or variable.

Product Specification May 2015 36 330566-009US

Bytes

F = Fixed

V = Variable

X = Both

Default

Value

Interpretation

Description

7-0

varies

Indicates the total size of the namespace in logical blocks.

Namespace Size (NSZE)

15-8

varies

Indicates the maximum number of logical blocks that may be allocated in the namespace at any point in time

Namespace Capacity (NCAP)

23-16

varies

Indicates the current number of logical blocks allocated in the namespace

Namespace Utilization (NUSE)

00h

Indicates thin provisioning is not supported

Namespace Features (NSFEAT)

06h

Defines the number of supported LBA size and metadata size combinations supported by the namespace

Number of LBA Formats (NLBAF)

00h

Indicates metadata transferred with the extended data LBA or in separate buffer

Formatted LBA Size (FLBAS)

03h

Indicates support for metadata transferred with the extended data LBA and in separate buffer – both are supported

Metadata Capabilities (MC)

11h

Indicates PI supports Type 1,2,3 with PI transferred as the first 8 bytes

End-to-end Data Protection Capabilities (DPC)

00h

Indicates type settings for the namespace

End-to-end Data Protection Type Settings (DPS)

127-30

Reserved

131-128

MS:0, LBADS:9, RP:2

Indicates the LBA format 0 that is supported by the controller

LBA Format 0 Support (LBAF0)

135-132

MS:8, LBADS:9, RP:2

Indicates the LBA format 1 that is supported by the controller

LBA Format 1 Support (LBAF1)

139-136

MS:16, LBADS:9,

RP:2

Indicates the LBA format 2 that is supported by the controller

LBA Format 2 Support (LBAF2)

143-140

MS:0, LBADS:12, RP:0

Indicates the LBA format 3 that is supported by the controller

LBA Format 3 Support (LBAF3)

147-144

MS:8, LBADS:12, RP:0

Indicates the LBA format 4 that is supported by the controller

LBA Format 4 Support (LBAF4)

151-148

MS:64, LBADS:12, RP:0

Indicates the LBA format 5 that is supported by the controller

LBA Format 5 Support (LBAF5)

Intel® Solid-State Drive DC P3700 Series

Table 33: Identify Namespace

May 2015 Product Specification 330566-009US 37

Bytes

F = Fixed

V = Variable

X = Both

Default

Value

Interpretation

Description

155-152

MS:128, LBADS:12, RP:0

Indicates the LBA format 6 that is supported by the controller

LBA Format 6 Support (LBAF6)

159-156

Not supported

Indicates the LBA format 7 that is supported by the controller

LBA Format 7 Support (LBAF7)

163-160

Not supported

Indicates the LBA format 8 that is supported by the controller

LBA Format 8 Support (LBAF8)

167-164

Not supported

Indicates the LBA format 9 that is supported by the controller

LBA Format 9 Support (LBAF9)

171-168

Not supported

Indicates the LBA format 10 that is supported by the controller

LBA Format 10 Support (LBAF10)

175-172

Not supported

Indicates the LBA format 11 that is supported by the controller

LBA Format 11 Support (LBAF11)

179-176

Not supported

Indicates the LBA format 12 that is supported by the controller

LBA Format 12 Support (LBAF12)

183-180

Not supported

Indicates the LBA format 13 that is supported by the controller

LBA Format 13 Support (LBAF13)

187-184

Not supported

Indicates the LBA format 14 that is supported by the controller

LBA Format 14 Support (LBAF14)

191-188

Not supported

Indicates the LBA format 15 that is supported by the controller

LBA Format 15 Support (LBAF15)

383-192

Not supported

Reserved

4095-384

Not supported

Range of bytes is allocated for vendor specific usage

Vendor Specific (VS)

Intel® Solid-State Drive DC P3700 Series

NOTES:

F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when

Product Specification May 2015 38 330566-009US

Bytes

F = Fixed

V = Variable

X = Both

Default Value

Interpretation

Description

31-26

Reserved

25-24

Varies (2,0)

Relative Performance ranging from “best” to “degraded”

Relative Performance (RP)

23-16

Varies (9 and 12)

Indicates the LBA data size supported. The value is reported in terms of a power of two (2^n)

LBA Data Size (LBADS)

15-00 V

Varies (0, 8, 16,64, 128)

Indicates the number of metadata bytes provided per LBA based on the LBA Data Size indicated.

Metadata Size (MS)

Intel® Solid-State Drive DC P3700 Series

Table 34: LBA Format Data Structure

NOTES:

F = Fixed. The content of the word is fixed and does not change. For removable media devices, these values may change when

May 2015 Product Specification 330566-009US 39

Intel® Solid-State Drive DC P3700 Series

Address

# Bytes

Function

Programming

Value

Byte

Description

Class Code

02h

Device type and Programming Interface

08h

01h

3 2

86h

PCI-SIG Vendor ID

80h

Varies

5-24

Serial Number

25 40

Varies

25-64

Model Number

PCIe Port0 Capabilities

03h

Maximum Link Speed

66 1 04h

Maximum Link Width

PCIe Port1 Capabilities

03h

Maximum Link Speed

68 1 04h

Maximum Link Width

Initial Power Requirements

0Ah

12V Power rail initial power requirement (W)

Reserved

00h

70-71

Maximum Power Requirements

19h

12V Power rail maximum power requirement (W)

Reserved

00h

73-74

Capability List Pointer

50h

16b address pointer to start of capability list

Addr

(Hex)

09 A B

varies

Description

Capability ID (temp)

Next Capability (none)

Sensor Type

SMBUS address

Reserved

Warning Threshold

Over Temperature

Appendix B Vital Data Structure

Table 35: Vital Product Data Structure (VPD)

Table 36: Capability List Pointer (Out of Band Temperature Sensor)

Product Specification May 2015 40 330566-009US

Binary

Hex

Temperature

1 1100 1001 0000

1C90

-55° C

1 1100 1110 0000

1CE0

-50° C

1 1110 0111 0000

1E70

-25° C

1 1111 1111 1111

1FFFF

-0.0625° C

0 0000 0000 0000

000

0° C

0 0000 0000 0001

001

0.0625° C

0 0001 1001 0000

190

25° C

0 0011 0010 0000

320

50° C

0 0111 1101 0000

7D0

55° C

Intel® Solid-State Drive DC P3700 Series

Appendix C Out of Band Temperature Sensor

Read Out

Register 0x05 on address 0x1B contains the temperature information for the latest readout. Measured temperature is captured by bit 12 to bit 0. Data format is two’s complement. Bit12 represents sign value, bit11 presents 128° C and bit0 represents 0.0625° C. Following table gives an example of the read out.

Table 37: Register 0x05 read out format

May 2015 Product Specification 330566-009US 41

Intel® Solid-State Drive DC P3700 Series

Command

Code

Offset (byte)

Description

Length of Status: Indicates number of additional bytes to read before encountering PEC. This value should always be 6 (06h) in implementations of this version of the spec.

Status Flags (SFLGS): This field indicates the status of the NVM subsystem.

SMBus Arbitration – Bit 7 is set ‘1’ after a SMBus block read is completed all the way

to the stop bit without bus contention and cleared to ‘0’ if a SMBus Send Byte FFh is

received on this SMBus slave address.

Drive Not Ready – Bit 6 is set to ‘1’ when the subsystem cannot process NVMe management commands, and the rest of the transmission may be invalid. If cleared

to ‘0’, then the NVM subsystem is fully powered and ready to respond to management

commands. This logic level intentionally identifies and prioritizes powered up and ready drives over their powered off neighbors on the same SMBus segment.

Drive Functional – Bit 5 is set to ‘1’ to indicate an NVM subsystem is functional. If cleared to ‘0’, then there is an unrecoverable failure in the NVM subsystem and the

rest of the transmission may be invalid.

Reset Not Required - Bit 4 is set to ‘1’ to indicate the NVM subsystem does not need a reset to resume normal operation. If cleared to ‘0’ then the NVM subsystem has

experienced an error that prevents continued normal operation. A controller reset is required to resume normal operation.

Port 0 PCIe Link Active - Bit 3 is set to ‘1’ to indicate the first port’s PCIe link is up (i.e., the Data Link Control and Management State Machine is in the DL_Active state). If cleared to ‘0’, then the PCIe link is down.

Port 1 PCIe Link Active - Bit 2 is set to ‘1’ to indicate the second port’s PCIe link is up. If cleared to ‘0’, then the second port’s PCIe link is down or not present.

Bits 1-0 shall be set to ‘1’.

SMART Warnings: This field shall contain the Critical Warning field (byte 0) of the NVMe SMART / Health Information log. Each bit in this field shall be inverted from the NVMe definition (i.e., the management interface shall indicate a ‘0’ value while the corresponding bit is ‘1’ in the log page). Refer to the NVMe specification for bit definitions.

If there are multiple controllers in the NVM subsystem, the management endpoint shall combine the Critical Warning field from every controller such that a bit in this field is:

 Cleared to ‘0’ if any controller in the subsystem indicates a critical warning for that

corresponding bit.

Set to ‘1’ if all controllers in the NVM subsystem do not indicate a critical warning for the

corresponding bit.

Composite Temperature (CTemp): This field indicates the current temperature in degrees Celsius. If a temperature value is reported, it should be the same temperature as the Composite Temperature from the SMART log of hottest controller in the NVM subsystem. The reported temperature range is vendor specific, and shall not exceed the

Appendix D SMBUS Command Response on

0x6A (NVMe Workgroup Defined)

Table 38: Command Response on 0x6A (NVMe Workgroup Defined)

Product Specification May 2015 42 330566-009US

Command

Code

Offset (byte)

Description

range -60 to +127°C. The 8 bit format of the data is shown below.

This field should not report a temperature when that is older than 5 seconds. If recent data is not available, the NVMe management endpoint should indicate a value of 80h for this field.

Value

Description

00h-7Eh

Temperature is measured in degrees Celsius (0° to 126° C)

7Fh

127° C or higher

80h

No temperature data or temperature data is more than 5 seconds old.

81h

Temperature sensor failure

82h-C3h

Reserved

Temperature is -60° C or lower

C5-FFh

Temperature measured in degrees Celsius is represented in twos complement (-1° to -59° C)

Percentage Drive Life Used (PDLU): Contains a vendor specific estimate of the percentage of NVM subsystem NVM life used based on the actual usage and the manufacturer’s prediction of NVM life. If an NVM subsystem has multiple controllers the highest value is returned. A value of 100 indicates that the estimated endurance of the NVM in the NVM subsystem has been consumed, but may not indicate an NVM subsystem failure. The value is allowed to exceed 100. Percentages greater than 254 shall be represented as 255. This value should be updated once per power-on hour and equal the Percentage Used value in the NVMe SMART Health Log Page.

06:05

Reserved: Shall be set to 0000h

PEC: An 8 bit CRC calculated over the slave address, command code, second slave address and returned data. Algorithm is in SMBus Specifications.

Length of identification: Indicates number of additional bytes to read before encountering PEC. This value should always be 22 (16h) in implementations of this version of the spec.

10:09

Vendor ID: The 2 byte vendor ID, assigned by the PCI SIG. Should match VID in the Identify Controller command response. MSB is transmitted first.

30:11

Serial Number: 20 characters that match the serial number in the NVMe Identify Controller command response. First character is transmitted first

PEC: An 8 bit CRC calculated over the slave address, command code, second slave address and returned data. Algorithm is in SMBus Specifications.

32+

255:32

Vendor Specific – This data structure shall not exceed the maximum read length of 255 specified in the SMBus version 3 specification. Preferably length is not greater than 32 for compatibility with SMBus 2.0, additional blocks shall be on 8 byte boundaries.

Intel® Solid-State Drive DC P3700 Series

May 2015 Product Specification 330566-009US 43

Intel® Solid-State Drive DC P3700 Series

Command

Code

Offset (byte)

Description

Length of Intel Corporation’s Block: shall be 22 until this spec is updated

Reserved: Currently cleared to zero. Anticipated future use will be several bits for version number, a bit if there are additional Intel blocks, and some other less thought out ideas at this point

Reserved: Value = 0xff

Reserved: Value = 0x80

38:36

Reserved: Value = 0x000000

46:39

Firmware Version: 8 characters, ASCII representation

54:47

Bootloader Version: 8 characters, ASCII representation

PEC: An 8 bit CRC calculated over the slave address, command code, second slave address and returned data. Algorithm is in SMBus Specifications.

56+

255:56

Reserved: all bytes cleared to zero, no PEC

Appendix E SMBUS Command Response on

0x6A (Intel Specific)

Table 39: Command Response on 0x6A (Intel Specific)

Product Specification May 2015 44 330566-009US

ID name

Description

Add-in

Card

2.5” FF

PCIe Register

Location

Identify

Controller

Location

Vital Product Data

Location

Vendor ID (VID)

Vendor ID assigned by PCI-SIG

0x8086

PCI Header Offset 00h (bits 15:00)

Bytes 01:00h

Address 3, (size 2B)

Device ID (DID)

Device ID assigned by vendor

0x0953

PCI Header Offset 00h (bits 31:16)

Subsystem Vendor ID

Indicates Subsystem vendor ID

0x8086

PCI Header Offset 2Ch (bits 15:00)

Bytes 03:02h

Subsystem ID

Sub-system identifier

0x3702

0x3703

PCI Header Offset 2Ch (bits 31:16)

Intel® Solid-State Drive DC P3700 Series

Appendix F PCIe* ID

Table 40: PCIe ID

May 2015 Product Specification 330566-009US 45

Intel® Solid-State Drive DC P3700 Series

Appendix G SCSI Command Translation

Following SCSI commands are supported:

 Read 6,10,12,16  Inquiry  Mode Sense 6,10  Mode Select 6.10  Log Sense  Read Capacity 10,16  Report LUNs  Request Sense  Start Stop Unit  Test Unit Ready  Write Buffer  Unmap

Note: Refer to NVM Express*: SCSI translation reference doc under nvmexpress.org.

Product Specification May 2015 46 330566-009US

LED

Description

Blink Behavior

LED 1 ( Amber)

Shows IO activity

Blinks at the rate of 250msec high, 250msec low with IO activity

LED 2 (Red)

Drive fail indicator

Solid red if drive is in disabled logical mode

LED 3 (Yellow)

Drive pre-fail indicator

Solid yellow if any of the critical warnings in log page 0x02 is triggered

LED 4 (Green)

Drive health indicator

Solid green when drive is healthy

Intel® Solid-State Drive DC P3700 Series

Appendix H Add-in Card LED Decoder

Table 41: LED Functionality

Figure A-1: LED Location

Note: 2.5-inch Form factor does not contain LEDs

May 2015 Product Specification 330566-009US 47

Intel P3700 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual