Intel OCPRF100 MP User Manual
OCPRF100 MP
Server System
Supporting Up To Eight Intel®
®
Pentium
III Xeon™ Processors
Technical Product Specification
Intel Order #753674-001
Revision 1.0
OPRF100 MP Board Set Technical Product Specification
Revision 1.0
Revision History
Date Rev. Modifications
September, 1999 1.0 Initial release.
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INFORMATION CONTAINED HEREIN.
THE INTEL
DARD COMMERCIAL USE ONLY. CUSTOMERS ARE SOLELY RESPONSIBLE FOR
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®
PRODUCT REFERRED TO IN THIS DOCUMENT IS INTENDED FOR STAN-
OPRF100 MP Board Set Technical Product Specification
Revision 1.0
Only approved software drivers and accessori es that are recommended for the revision number
of the boards and system being operated should be used with Int el products . Please note that, as
a result of warranty repairs or replacements, alternate software and firmware versions may be
required for proper operation of the equipment.
The hardware vendor remains solely responsibl e for the design, sale and func ti onalit y of its product, including any liability arising from product infringement or product warranty.
The OPRF100 MP Board Set and the OCPRF100 MP Server System product may contain
design defects or errors known as errata that may cause the product to deviate fr om published
specifications. Current characterized errata are availab le on request.
2
I
C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the
2
I
C bus/protocol and was developed by Intel. Implementations of the I2C bus/protocol or the
SMBus bus/protocol may require li censes from vari ous entiti es, includi ng Philips Electr onics N.V.
and North American Philips Corporation.
Copyright © 1999 Intel Corporation.
*Other brands and names are the property of their respective owners.
OCPRF100 MP Server System Technical Product Specification
Revision 1.0
Table of Contents
Introduction........................................................................................................................... 1
Server System Chassis and Assemblies............................. .. .. ....................... ....................3
Front Panel Assembly....................................................................................................... 4
Peripheral Bay................................................................................................................... 4
Top Cover Assembly........................................ .. ...................... ..................... ....................5
Hot-plug PCI Access Door .......................................................................................... 6
Fan Bay............ ......................................................................... ........................................6
Front Panel Board.............................................................................................................8
Processor Mezzanine Board............................................................................................. 9
Processor Retention Mechanism ...................................................................................... 9
Profusion® Carrier Tray .................................................................................................. 11
Midplane As se m b l y................... .. ........................... .. ............. .. ... ............. .. ............. ... .. .... 13
I/O Carrier ....................................................................................................................... 14
Power Supply................................. .. .. ............. .. ........................... .. ........................... .. .. .. 16
OCPRF100 MP Server System Chassis..................... .. ..................... .. ........................... 16
System Over view ............. .. .. .............. .. ............. .. .. .............. .. ............. .. ... ............. .. ............. 17
Introduction..................................................................................................................... 17
External Chassis Features................................................................ .................... .. ........20
Front View of Ch a ss is .. ........................... .. ........................... .. .. ............. ... ................. 20
Rear View of Cha s sis. .. ........................... .. ............. ... .. ............. .. .............. .. ............... 2 3
Riser Board External I/O Connectors........................................................................24
Peripheral Bay........................................................................................................... 25
3.5-inch Use r- a cc e s sible Drive Bay .... ............. .. .. ............. ... .......................... .. ... ...... 26
5.25-inch User-accessible Drive Bay ........................................................................ 26
3.5-inch SCSI Hot-swap Drive Bays ....................................... .. .................... ............26
Internal Chas s is Features ........... ... .. ............. .. ........................... .. .......................... ... .. .... 27
Power Syste m . .. ... ............. .. .. .............. .. .......................... .. ........................... .. .. ......... 27
Cooling Syst e m ............... .. .. ............. ... .......................... .. ........................... .. .. ........... 29
PCI Hot-plug.... .. .............. .. .......................... ... .. ............. .. ........................... .. .. ........... 31
Server Management........................................................................................................34
Front Panel Controller...............................................................................................34
Baseboard Management Controller........................... ........................ .......................35
Hot-swap Con troller ............ ........................... .. .......................... ... .. ............. .. ........... 36
Expansion Support..........................................................................................................36
Specifications..................................................................................................................37
Environmental Specifications.................................................................................... 37
Physical Specifications.............................................................................................. 37
Cables and Connectors....................................... .................. ................................... .. ........39
Cables............................................................................................................................. 41
Connectors......................................................................................................................42
User-accessible I/O Connectors ............................................... ................................42
Serial Ports................................................................................................................ 43
Parallel Port............................................................................................................... 44
VGA Video Port.........................................................................................................44
Universal Serial Bus Interface................................................................................... 45
ICMB Connectors................. .............. .......................................................................46
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Fan Connector .......................... ...................... ...................... .. ...................... .. ..........47
Peripheral Bay P o w e r C o n nec tor. .. .. .............. .. .......................... ... .. ............. .. ........... 47
Peripheral Bay Backplane Header............................................................................48
LED Board Connector................................... .. ........................ .. ........................ ........50
SCSI Connector........................................................................................................ 51
IDE Connectors.........................................................................................................52
Floppy Connectors...... ................ ................................................. .............................53
Power Supply .................................... .......................................................................... ........54
Mechanical Requirements............. ..................................................................................54
Mechanical Outline.................................................................................................... 54
Fan Requirements........................................................................ ................... ..........55
Interface Requirements................................................................................................... 55
AC Inlet Connector............................ ....................... ........................ .. .......................55
DC Output Connector(s) .......................... .................... .. .................... .. .....................55
Marking and Identification...............................................................................................56
LED Labeling............................... .. .. ........................ ............................................. .. ... 56
Internal Syst e m M ar k in g ........... .. .............. .. .. ............. .. ........................... .. .. .............. .. .... 56
Electrical Re q ui re m e n ts................................ .. ........................... .. .......................... ... .. .... 58
Efficiency................................................................................................................... 58
AC Input Voltage Specification......................................... .. .................... ...................58
AC Input Voltage Ranges........................... .. .......................................... ...................58
DC Output Specification............................................................................................ 59
Control Signals................................................................................................................ 62
Power Supply On (Input). ..........................................................................................62
AC OK Signal (Output).............................................................................................. 62
Power Good (Output). ...............................................................................................63
Power Supply Present Indicator (Output).................................................... ..............64
Predictive Failure Signal (Output).............................. .. .................. .. .................. .. ..... 64
Power Supply Failure Signal (Output)................................... .................. .. ................64
Power Supply Kill (Input)...........................................................................................65
Power Supply Field Replacement Unit Signals.........................................................66
LED Indicators........................................................................................................... 66
Fan Speed Control............................................................................. ...................... .. ..... 67
Environmental Requirements............................................................... ...........................67
Physical Environment................................................................................................ 67
Thermal Protection............................................ ................. ................ .......................67
Regulatory Agency Requirements..................................................................................67
System Softw a r e . ............. .. ........................... .. .. ............. .. ........................... .. .. .............. .. ....68
System Hardware............................................................................................................ 69
Processors ................................................................................................................ 69
Profusion® Chip Set.................................................................................................. 70
I/O Subsystem................................................................ .. .................... .................... .70
Intelligent Platform Management Bus............................................................... ........71
Industry Standards..........................................................................................................71
ACPI..........................................................................................................................71
Boot Devices a nd P e ri ph e rals. . .. ............. .. ............. ... ............. .. ............. ... .. ............. .. 7 2
Management.............................................................................................................73
Configuration............................................................................................................. 73
BIOS Setup Utility ........................................................................................................... 74
Main Menu ...................... .. .......................... ... .......................... .. ... ............. .. ............. 75
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Advanced Menu ........................................................................................................ 78
Security Men u ................. .. .. ............. ... .......................... .. ........................... .. .. ........... 82
Server Menu.... .. ... ............. .. ........................... .. .. ............. .. ........................... .. .. ......... 83
Boot Menu.............. .. ........................... .. .. ............. .. ........................... .. ...................... 85
Exit Menu ........ .. .............. .. .. ............. ... .......................... .. .. .............. .. ........................ 86
Flash Utility...................................................................................................................... 86
Regulatory Specifications............................................ ................................... ................... 88
Safety Compliance............. ... .. ............. .. ... ............. .. ........................... .. .......................... 88
Electromagnetic Compatibility.........................................................................................88
CE Mark .......................................................................................................................... 88
Electromagnetic Compatibility Notice (USA)........................ .. .................... .. ...................89
Electromagnetic Compatibility Notices (International).....................................................89
Peripheral Bay Backplane Board ......................... ........................................... .. ................90
Peripheral Bay Backplane Overview...............................................................................90
Architectural Overview .............................................................................................. 91
Placement Dia g ra m.. ............. ... .. ............. .. ........................... .. .......................... ... .. .... 91
Deviations from SAF-TE Specification...................................................................... 91
Functional Description.....................................................................................................91
Hot-swap Connectors................................................................................................ 92
SCSI Interface . .......................................................................................................... 92
LVD/SE Acti ve T e rmination........ .......................... .. .............. .. .. ............. ... ............. .. .. 9 2
Power Contr ol ...... .. .......................... ... .. ............. .. ........................... .. .. ............. ... ...... 92
FET Short Protection................................................................................................. 93
Microcontroller........................................................................................................... 93
LED Arrangement .................................. .. .. ......................... .. ............................ ........93
IPMB (I2C bus).......................................................................................................... 94
Temperature Sensor ................................................................................................. 94
Serial EEPROM ........................................................... .. .. ...................................... ...94
Board Functi o n s......... ............. .. ........................... .. .. ............. .. ........................... .. .. ......... 94
Reset......................................................................................................................... 94
Microcontroller........................................................................................................... 95
SCSI Controller.........................................................................................................97
LVDS SCSI Termination .................................... ...................... .......................................97
LVDS Termination.................................................... ................... .................. ............97
Single Ended T e rm i n a tio n.................................... .. ... ............. .. ........................... .. .... 98
Programmab le Lo g ic................. .. ........................... .. .. ............. ... .......................... .. ... ...... 98
Memory Map ........... ... ............. .. ........................... .. .......................... ... .. ............. .. ........... 98
Memory Map ..... ... ............. .. ........................... .. .......................... ... .. ............. .. ........... 98
I/O Ports.................................................................................................................. 101
Signal Descriptions....................................................................................................... 103
Power Good Signal.................................................................................................103
CONN_EN_L........................................................................................................... 103
CONN_SDI.............................................................................................................. 103
CONN_SDO............................................................................................................ 103
CONN_MODE......................................................................................................... 104
CONN_SCLK .......................................................................................................... 104
Electrical, Mechanical Specifications.................. ..................... .................................... .104
Connectors..............................................................................................................104
Peripheral Bay Board (Chassis Side).................... ..................... .................................... .111
Introduction................................................................................................................... 111
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OCPRF100 MP Server System Technical Product Specification
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Mechanical Description................................................................................................. 111
Board Layou t.............. .............. .. .......................... .. .............. .. .. ............. ... ............. .. 11 1
Front Panel..................... .. .. ..................... .............................................. ........................ .......... 113
Introduction................................................................................................................... 113
Board Overv ie w.... ............. .. .. .............. .. ............. .. .. .............. .. ............. .. ... ............. .. 1 1 3
Functional Description...................................................................................................114
Microcontroller......................................................................................................... 114
Memory Maps ...... .. ............. .. ........................... .. .. ............. ... .......................... .. ....... 114
Memory ................................................................................................................... 118
Front Panel Indicator LEDs..................................................................................... 122
Front Panel LCD .....................................................................................................123
System Power......................................................................................................... 123
Reset....................................................................................................................... 124
Speaker...................................................................................................................126
Fan Control ............................... .............................................. ................................126
ICMB and COM2 Redirection....................................................... .. .. .......................126
Front Panel Push Buttons.......................................................................................129
I2C Interface s............. .............. .. .. ............. .. ... ............. .. ........................... .. ............. 13 0
Miscellaneous ......................................................................................................... 132
Appendix A: Glossary ................................. .................. .. .................. .. .................. ................133
Appendix B: References .......................................................... .......................................... ... 137
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OCPRF100 MP Server System Technical Product Specification
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1. Introduction
This document provides an overview of the OCPRF100 MP server system and includes information on cabling, connectors, power supply, and regulatory requirements.
Document Structure and Outline
This document is organized into ten chapters:
Chapter 1: Introduction
Provides an overview of this document.
Chapter 2: Server System Chassis and Assemblies
Provides an overview of the chassis hardware.
Chapter 3: System Overview
Provides an overview of the system hardware.
Chapter 4: Cables and Connectors
Describes the cables and connectors used to interconnect the OPRF100
board set and the server system components.
Chapter 5: Power Supply
Describes the specifications for the 750-W power supply.
Chapter 6: OCPRF100 MP Server Software
Provides an overview of the system software.
Chapter 7: Regulatory Specifications
Describes system compliance to regulatory specifications.
Chapter 8: Peripheral Bay Backplane Board
Describes the features and functional ity of the peripheral bay backplane
board.
Chapter 9: Peripheral Bay Board (Chassis Side)
Describes the design of the peripheral bay board (chass is si de).
Chapter 10: Front Panel
Describes the design and external interface of the OCPRF100 MP server
system front panel.
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OCPRF100 MP Server System Technical Product Specification
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2. Server System Chassis and Assemblies
This chapter describes the chassis and assembly pieces that reside within the chassis. This
chapter is divided into the following areas:
• Front panel assembly
• Peripheral bay
• Top cover assembly
• Fan bay
• Front panel board
• Processor mezzanine board
• Processor retention mechanism
®
• Profusion
carrier tray
• Midplane assembly
• I/O carrier assembly
• Power supply
• OCPRF100 MP server system chassis
Figure 2-1: OCPRF100 MP Server System Chassis
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OCPRF100 MP Server System Technical Product Specification
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2.1 Front Panel Assembly
The front panel assembly consists of an upper and lower bezel. The bezels serve as cosmetic
pieces only, and can be integrator specific. Finger grips are provided to make it easy to remove
the bezels. Removing the bezels exposes the front side of the fan bay, the front panel controller
(FPC) switches (power, reset, and nonmaskable interrupt (NMI)), as well as the indicator lights
(power indicator, predictive power supply failure, predictive fan failure, and hard drive failure).
From this location, the hot-swap hard drives and/or t he peripheral bay may be removed from the
system.
Figure 2-2: Front Panel
2.2 Periphera l Ba y
The peripheral bay is defined to be a customer specif ic, removable device capable of supporting
a floppy drive, dual hot-swap hard drives, and a low-voltage differential SCSI (LVDS) or single
ended SCSI device. The integrator has the option of defining the size and capacity of the hard
drives, as well as deciding whether the LVDS will support CD-ROM, tape, or other device. A single ended SCSI channel is provided for support of a SCSI device, should the integrat or so desire.
The peripheral bay is designed to be easily added and removed from the front of the server by
removing the front cover and four mounting screws. The peripheral bay connects to the
OPRF100 I/O carrier and the power supply via a blind mate board connector and cabli ng. The
blind mate board is located in front of the midplane board, on the left side of the server (when
viewing the server from the front). The blind mate connector connects to the peripheral bay’s
LVDS board upon insertion, thus connecting all peripheral devices to the I/O carrier.
The peripheral bay will contain a 1.4 MB floppy dr ive, space for a half-height 5 ¼ inch device
(typically a CD-ROM), and has two bays designed to accommodate either a 1-inch or a 1.6-i nch
SCA hard drive.
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OCPRF100 MP Server System Technical Product Specification
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Figure 2-3: Peripheral Bay
2.3 Top Cover Assembly
The top cover assembly is released by removing the two retaining screws located on the top
toward the front (E in Figure 2-4: Hot-plug PCI Access Door) , between the fan bay assembly and
the top cover assembly marked with the AC caution icon. The cover slides towar d the rea r of the
server and then lifts straight up off of the ser ver cha ssi s, expos ing t he upper port ion o f the ser ver
for maintenance, upgrades, or adding components.
Tape and sheet metal work were done to the sides of the top cover assembly to provide a better
gripping surface for easier removal and replacement of the top cover assembly. Care should be
taken to avoid damage to the electromagnetic compatibility (EMC) gasket material on the ins ide
of the top cover.
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OCPRF100 MP Server System Technical Product Specification
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2.3.1 Hot-plug PCI Access Door
The hot-plug PCI access door is released by removing the two ret ai ning screws (A i n Figure 2-4:
Hot-plug PCI Access Door) located on the top, middle area of the server . The cover sli des toward
the rear of the server and lifts straight up off of the server chassis, exposing the hot-plug PCI
cards.
The hot-plug PCI access door is designed to maintain a flush surface with the top cover assembly, such that a vacuum-based hoist may be used during the assembly proc ess.
A
B
Figure 2-4: Hot-plug PCI Access Door
2.4 Fan Bay
The fan bay is a mechanical structure designed to contain six separate 120-mm cooling fans.
These fans operate at a nominal voltage of 8.4 Vdc (2% toleran ce) under normal conditions.
Each fan produces a tachometer- based output to indicat e the revolu tions per minute (RPM) read ing of the motor . Should a fa n’s t achometer out put drop below a predefined normal range of operation, the FPC notifies the server management soft ware that a fan has entered into th e predictive
fan failure condition. At t his point, the f ans will operat e at an elevated volt age of approximatel y 12
Vdc.
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OCPRF100 MP Server System Technical Product Specification
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The fan bay will operate at high speed on the following conditions:
• Internal temperature has reached an elevated, but noncritical set-point.
• Ambient temperate exceeds 30°C.
• A fan has entered into the predictive failure mode.
• A fan has failed.
If the FPC detects a fan entering the predictive fan failure mode, the speed of all of the fans will
be increased to maintain thermal requirements. The individu al fans within the fan bay are all hotswappable, meaning that they can be removed and inserted while the server is running. Server
management will identify that a fan has either fail ed or has entered into the predictive failure
mode. In both cases, the fan should be repl aced immediately. Removal of a fan is accompli shed
by opening the fan bay cover and pulling (A) to lift the malfunctioning fan (B) out through the top
of the server as shown in Figure 2-5: Fan Bay. The malfunctioning fan shoul d then be repl aced
with a new fan. The system will detect that the fan has been replaced, and as long as no other
thermal violations are currently occurring, the fan will resume operation at the reduced speed.
A
B
Figure 2-5: Fan Bay
OM07304
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OCPRF100 MP Server System Technical Product Specification
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Fans are installed with th e connector on t he left side fac ing down. The cavities i n the f an bay are
keyed to prevent a fan from being install ed backwards.
The fan bay is installed after the Profusion carrier assembly is installed and completely seated
into the midplane. The fan bay is lowered into the chassis unti l it is seated on the flanges of the
Profusion tray. Two screw holes, one on each side, should now be aligned on the sides of the
chassis. Insert screws into these holes to secure the fan bay into the chassis.
The fan bay cover is hinged at the rear and captivated by the system top cover assembly. Tabs in
the rear of the fan bay cover engage with slots on the rear of the fan bay to secure the cover in
normal operation. The fan bay cover is secured by one noncap tive screw loca ted on the center of
the cover’s front flange. Remove the screw, slide the cover forward and lift. The cover remains
open while servicing the fans.
To remove the fan bay from the chassis, it is first necessary to re move all in dividual fans from the
fan bay . The fans plug direct ly into the front p anel board and must be removed before the fan bay
can be lifted out.
The fan bay cover provides critical electr omagnetic interference (EMI) containment. To avoid
electrical interference with adjacent equipment, close and secure the fan bay cover during normal system operation.
In systems with only one processor mezzanine board, an air baffle needs to be installed on the
vacant side of the CPU retention cage to ensure proper cooling for the installed processo rs.
2.5 Front Panel Board
The FPC board provides power and monitors the tach ometer readings from each individual fan
within the fan bay. The FPC also serves as a platform for the server contr oller switches, and supports circuitry required for server management.
The FPC board is located on the same plane as, and connects to the Profusion carrier board via
a connector. Both the FPC and Profusion carrier board are mounted to the topsi de of the Profusion carrier tray. On the left front edge of the FPC board are three push but ton switch es—power,
reset, and NMI. Each switch plunger has a small black cap on it s end, which is necessar y for the
proper operation of the buttons on the front bezel.
To install an FPC board, tilt the board forward as shown in Figur e 2-6: Fr ont Panel Board I nst al la tion, and insert the switches into the openings on the front flange of the Profusion carrier tray.
Lower the back of the board onto the standoff s on the tr ay. Align the board-to-board connectors
and slide the board back to engage the connectors. Secure with nine screws. Reverse this operation to remove the board.
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OCPRF100 MP Server System Technical Product Specification
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Figure 2-6: Front Panel Board Installation
2.6 Processor Mezzanine Board
The base configuration of an OCPRF100 MP server system consists of a single processor mezzanine board. The processor mezzanine board is designed to support one to four Pentium
®
III
Xeon™ processors, providing power, ground and other connections to the processor(s) and to
the Profusion carrier. The processor mezzanine board incorporates integrated volt age regulator
modules (VRMs) to supply the internal voltage requirements to the processor cartridge.
2.7 Processor Retention Mechanism
The processors and termination cards are secured in their respective slots by means of the processor retention mechanism. The processor retention mechanism holds up to eight processors
or termination cards. In th e ev ent th e server is populat ed wit h o nly a singl e proces sor mezzan ine
card, the processor retention mechanism will be popul ated with a total of four contiguous processors and/or terminators.
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OCPRF100 MP Server System Technical Product Specification
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A
Captive Screw
B
Hold-down
Strap
C
Air Baffle
Figure 2-7: Processor Retention Mechanism
A processor/termination card p air is secured with a hold-down strap (B) that hooks into the back
of the retention mechanism and is fastened at the front with two capt ive screws (A). (The retention strap is for a pair of process ors or terminat ors). See Fi gure 2-7: Pro cessor Retent io n Mechanism.
The processor retention mechanism is secured t o the mezzanine boar ds with the sa me four l ock
bars that secure the mezzanine boards to the Profusion ca rrier board. In the event the server is
populated with only a single process or mezzanine car d, an air baffle (C) must be install ed on the
vacant side of the processor retention mechanism.
To remove or add a processor, first relea se the capti ve screws (A), then swi ng the reten tion strap
(B) upward. Remove the terminator card, and install the processor. Replace the retention strap
(B), and tighten the captive screw (A).
Due to space restrictions in the system, the Profusion carrier tray assembly must be removed
from the chassis to install and service the mezzanine boards. The fan bay assembly must be
removed prior to removing the Profusion carrier tray.
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OCPRF100 MP Server System Technical Product Specification
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2.8 Profusion® Carrier Tray
The processor mezzanine boards plug into the Profusi on carrier tray. The Profusion carrier tray
serves as a platform to provide power and signals to the processor mezzanine board, route signals through the 1008-pin grand connector, and carry components of the Profusion chip set.
Components of the Profusion chip set th at reside on the Profu sion carrie r are the memory acces s
controller (MAC) and the data interface buffer (DIB).
The Profusion chip set allows a five-por t system data bus, with concur rent switching t aking place.
This is a requirement for an efficient eight-way server. The Profusion chip set will suppor t two
processor buses (each bus containing between one and four processors), two memory buses,
and a single I/O bus. All of the buses operate at 100 MHz for maximum throughput. The data is
routed through the Profusion tray, into the midplane connector for distribution to the appropriate
source (memory carriers or the I/O carri er).
B
Lock Bars
C
Lock Bar
Release Handle
A
Alignment Tabs
Figure 2-8: Profusion® Carrier Tray
Assembly of the Profusion carrier board, and mezzanine boards to the Profusion carrier tray, is
performed outside the cha ssis. To start the assembly, install the Profusion carrie r to the Profusi on
tray by aligning the eight tabs on the tray with the slots on the board (See Figure 2-8 (A)). Next,
install the FPC board by passing the FPC switches through the switch openings in the tray and
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OCPRF100 MP Server System Technical Product Specification
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then moving back into place for connection to the Profusion carrier board. Place the four lock
bars over the protruding tabs and onto the Profusi on carrier board (B). The release handles of
the lock bars (C) should be pointed to the outsid e of the board and t hey should be in t he unlocked
position. Place the first mezzanine board on the left side of the Profusion carrier board, oriented
so the mezzanine board does not extend over the 1008-pin grand connector on the Profusion
carrier board. Press down in the center of the mezzani ne board until it is seated down onto the
lock bars. If the configurat ion call s for a second mezzani ne board, i nstall it on the r ight side of the
Profusion carrier board by following th e same steps as described for the first board.
2
2
1
1
3
3
Figure 2-9: Profusion® Carrier Tray
Lower the processor retent ion mechanism onto t he mezzanine board(s) , aligning the hooks on it s
bottom with the slots in the mezzanine board(s). The processor retention mechanism should be
oriented such that the center notch for the coher ency filters is facing forward. Engage the fou r
lock bars by pushing in on their ends until they click. The Profusion carrier tray assembly is now
ready for installation in the chassis.
To install the Profusion carrier tray assembly into the chass is, set the tray on t he tray support s on
the inside walls of the chassis and slide it towared the midplane. The tray and chassis have selfaligning features to help guide the tray as it approaches the grand connector on the midplane.
When the connectors are within approximateil y 1” from connect ing, check under the Profusion
carrier tray for proper engagement of the center supports. The insertion/extraction levers (3) on
the side of the tray should be tilted forward as the connectors approach each other. As the con-
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OCPRF100 MP Server System Technical Product Specification
Revision 1.0
nectors begin to engage, rotate the levers back until the connectors are fully engaged. Levers
should be in an upright or near upright position. Secure the tray and the processor retention
mechanism to the sides of the chassis with screws (1) and (2) as indi cated in Figure 2-9.
2.9 Midplane Assembly
The midplane assembly serves as an i nterconnect bet ween the power suppli es, memory boa rds,
Profusion carrier, and the I/O carrier. With the exception of limited server management and field
replaceable unit (FRU) components, the mi dplane assembly s erves merely as an interconnect ion
device, routing the signa ls between the boards , whi le maintaining the signal integr i ty requi re d for
the 100-MHz buses.
Figure 2-10: Midplane Assembly
The midplane assembly is inst alled into the OCPRF100 MP server system chass is by rotating the
assembly about two ali gnment s tru ctures. T he assembly i s secur ed b y a tot a l of fo ur scr ews, t wo
screws are located on each side of the system. All four screws must be removed to extract the
midplane assembly. The tab on the midplane assembly is used to manage the cables between
the I/O baseboard and the peripheral blind-mat e board.
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OCPRF100 MP Server System Technical Product Specification
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Figure 2-11: Midplane Assembly Installed in System
2.10 I/O Carrier
The I/O carrier is the i nterf ace that con nects the I/O port of t he Profu sio n chi p set to the foll owing :
• Ten hot-swappable PCI slots (four of which support 66-MHz transactions).
• Legacy connector (video, keyboard, serial, parallel, USB, and Intelligent Chassis Man-
agement Bus (ICMB) ports).
• Dual LVDS.
• Internal IDE buses, floppy disk, disk drives, and SCSI connectors for peripheral support.
The PCI hot-plug (PHP) I/O carrier, legacy connector, LVDS connectors, ICMB board, and
enhanced PCI hot-plug board are assembled onto the I/O carrier tray. The PCI hot-plug base
shield is assembled and mounted over the PHP I/O board, and secured by six screws. The PHP
slot dividers snap onto the PHP base shield.
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OCPRF100 MP Server System Technical Product Specification
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Figure 2-12: I/O Carrier Tray
The I/O carrier tray features tabs on the base of the tray that engage into slots on the horizontal
members in the chassis. Lower the tray from the top of the system and slide the tray toward the
center of the chassis using the two insert/extract handles located on the back of the tray. Secure
the I/O carrier tray to the chassis with the four screws located on the sides and back of the chassis.
Figure 2-13: Installing the I/O Carrier Tray
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OCPRF100 MP Server System Technical Product Specification
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The PHP mechanism is a rotating part that actuates a switch located on the PHP board. There
are four light emitting diodes (LEDs) per sl ot--tw o can be viewed fr om the rear of the system and
two from inside the system. Once the LED shows which slot is powered down, the PHP mechanism can be depressed on the PHP actuator and the mechanism can be rotated out of place to
remove the PCI card. Once the new PCI card is installed, rotate the PHP mechanism back into
place to activate the switch and secure the PCI card.
Figure 2-14: PHP Mechanism
2.11 Power Supply
The OCPRF100 MP server system power supply operates at 208 - 220 Vac, or 100 - 115 Vac is
rated at 750 watts, and is designed to be hot-swappable, with a 2+1 redundancy factor. Each
power supply has indicators showing correct operation, failure, and predictive failure. A power
supply displaying the predicti ve fail ure LED still will oper ate corect ly, but needs to be sent out for
repair as quickly as p ossible. The predictiv e failure feature is designed t o warn the operat or of an
impending power supply failure.
2.12 OCPRF100 MP Server System Chassis
The system chassis is the rack-mount chassis used in the system. The system chassis is
designed to house all of the components listed above within a 7Ux 32” (+/-) deep space, and
mount in a 19-inch rack. The chassis itsel f is 28” deep with the extra 4” to account for cable management. The chassis was engineered to provide easy access to per form maintenance,
upgrades, add memory, and add or remove PCI cards.
The functional server weighs between 120 and 140 pounds, depending on internal configurations. The chassis is designed to provide adequa te thermal cooling of all devices within an ambient temperature of 10° to 40°C, while maintaining noise levels below 57 dB. If the ambient
temperature exceeds 30°C, the fans in the fan bay will sw itch to high speed, cooling the system
to operational values. Server management will log that a thermal excursion has occurred. Several internal heat sensors will monitor the temper ature at key point s inside the server. Should any
of these sensors indicate that the temperature has exceeded a critical thermal set-point, server
management will log the event, and the server will be shut down gracefull y, according to user
setup.
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OCPRF100 MP Server System Technical Product Specification
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3. System Overview
This chapter describes the features of the OCPRF100 MP server system chass is.
System Features
Table 3-1 provides a list and brief description of the features of the OCPRF100 MP server system, which utilizes the OPRF100 board set.
Table 3-1: OCPRF100 MP Server System Feature List
Feature Description
Upgradeability
PCI hot plug The chassis with the OPRF100 board set supports 10 64-bit PCI hot-plug
Compact, high-density system The system size is a 7U (12.25-inch) rack-mount server.
Redundant power The system supports three 750-W power supplies in a redundant (2 + 1)
Redundant cooling Six system fans in a redundant (5+1) configuration cool the upper system
Modular peripheral bay The peripheral bay supports one floppy disk drive, one 5.25-inch half-
Front panel liquid cr ys t al displ ay
(LCD)
Intelligent Management Platform Initiative (IPMI) compliant
The system can be upgraded to future processors within the Pentium
Xeon™ processor fa mily.
slots (four at 66 MHz, six at 33 MHz).
configuration.
(CPU and I/O). Three internal power supply fans cool the lower system
(memory, peripheral ba y, and p ower sup plies ) in a red undan t confi guratio n
when the power supply configuration is redundant (2+1).
height device, and two 3.5-inch by 1.0- or 1.6-inch hot-swappable LVDS
SCSI hard drives.
A two line LCD provides the system status.
Intelligent Platform Management Bus (IPMB) for intrachassis communication is provided. Emergency management port (EMP) is used for remote
management.
®
III
3.1 Introduction
The scalable architecture of the OCPRF100 MP server syste m supports symmetrical multiprocessing (SMP) and a variety of operating systems (OS). The server provides 10 PCI card slots.
The Profusion carrier contains connectors for installing up to eight Pentium III Xeon processors
packaged in single-edge contact cartridges (SECC). Each of the two memory carriers supports
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OCPRF100 MP Server System Technical Product Specification
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up to 16 GB of error correcti on code (ECC) PC-100 comp atible regi stered DIMMs. The I/O c arrier
contains four 66-MHz and six 33-MHz 64-bit hot-swap PCI slots, I/O ports, and various controllers.
Figure 3-1: OCPRF100 MP Server System Chassis with Peripheral Bay shows an isometr ic view
of the chassis with the peripheral bay installed.
Figure 3-1: OCPRF100 MP Server System Chassis with Peripheral Bay
Figure 3-2: OPRF100 Board Set/System Board Locations withi n Server Chassis displays t he layout of the OPRF100 board set with respect to location within the chassis. The Profusion carrier
and I/O carrier are mounted hor izont ally, with the Profusion carrier toward the front of the ch assis
and the I/O carrier immediat ely behind at the r ear of th e chassis . The midplan e di stri butes power
and signal connections to al l boards. T he midplane resi des between the Pr ofusion car rier and the
I/O carrier, and interconnects these carriers with the memory carriers and system power supplies. The front panel resides in front of the Profusion c arrier in the same plane and provides the
user interface, system management, and cooling syst em power and control.
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Profusion Carrier
Front Panel
OCPRF100 MP Server System Technical Product Specification
Revision 1.0
I/O Riser Board
I/O Carrier
Power Supplies
Memory Carriers
Midplane
Figure 3-2: OPRF100 Board Set/System Board Locations within Server Chassis
The peripheral bay mounted at the lower front of the chassis sup ports a 3.5-inch floppy drive, a
half-height 5.25-inch device (e.g., CD-ROM) and two 3.5-inch by 1.0- or 1.6-inch hot-swap hard
drives. SCSI drives in the hot-swap hard drive bays can be hot-swapped without shutting down
the server.
The chassis supports up to three hot-swap, redundant power supplies in a 2+1 configuration.
These supplies provide redundant and hot-swappable cooling to the memor y carri ers an d per ipherals when the power supplies are i n a redundant conf iguration. A cover plate for the un occupied
power supply location is supplied for sys tems without redundancy, and should be used to provide
adequate cooling and EMI shielding.
The system design provides a hot-swap, redundant (5+1) cooling system for the Profusion and I/
O carriers. Basic controls and indicators are located on the front panel.
The front bezel can be customized for integrators to meet their industrial design requirements.
The front bezel contains openings to provide adequate cooling for the chassis components and
access to the peripherals.
Figure 3-3: OCPRF100 MP Server System Chassis Bloc k Diagram shows a block diagram of t he
server system.
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OCPRF100 MP Server System Technical Product Specification
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FRU
Hot Swap
Power
Supply
FRU
Hot Swap
Power
Supply
FRU
Hot Swap
Power
Supply
Intelligent
Chassis
Management
Bus PBA
icmb
icmb
Intelligent
Chassis
Mgt. Bus
kbd
mouse
serial
serial
parallel
video
icmb
Temp
FRU
Power
Distribution
Volt
Temp
Status
FRU
I/O riser
card
LCD
Memory Carrier
(16 DIMMs)
Midplane
IPMB,
I2C
FRU
I2C,
PIIX4E SMBus
Volt
Temp
BMC flash
BMC
SMIC
Profusion*
Carrier
BMC RAM
ISA Bus
FRU
FRU
Temp
Volt
Status
SEEPROM
LEDs
Slot Type-2
Slot Type-2
IPMB, I2C, PIIX4E SMBus
PB64
BMC
SDR
SEL
FRU
Slot Type-2
Processor
Mezzanine
33MHz
PCI
FPC
Front Panel
Temp
FRU
Slot Type-2
Board
PB64
I/O Carrier
IPMB, I2C
33MHz
PCI
FPC flash
IPMB, I2C
Temp
FRU
Processor
Mezzanine
Board
PB64
66MHz
PCI
FPC RAM
Slot Type-2
Slot Type-2
FRU
Cache
Coherency
Board
(optional)
PB64
All slots are
64-bit &
Hot- Plug
Slot Type-2
66MHz
PCI
Slot Type-2
FRU
Cache
Coherency
Board
(optional)
IPMB
FAN
FAN
FAN
FAN
FAN
Temp
Pentium®III
Xeon™
Processor
FRU
Temp
Pentium®III
Xeon™
Processor
FRU
LVDS Disk Backplane
HSC flash
HSC RAM
HSC
SCSI I/F
Drive Slots
Temp
FRU
external
64b PCI
Add In Card
PCI Hot-Plug LED/Switch Board
64b PCI
Add In Card
Add In Card
Figure 3-3: OCPRF100 MP Server System Chassis Block Diagram
3.2 External Chassis Features
3.2.1 Front View of Chassis
The front bezel of the server has two main user-accessible areas:
Front panel liquid crystal display (LCD), switches and indicato rs.
Replaceable media bays—floppy drive and 5.25-inch half-height bay.
20
64b PCI
64b PCI
Add In Card
OCPRF100 MP Server System Technical Product Specification
A B C D E F G H
Revision 1.0
I J K L M N
O P Q
Figure 3-4: Front View of Chassis with No Bezel
Table 3-2: System Features – Front
Item Feature Description
Front Panel Controls and Indicators
A Power switch When pressed, turns the DC power inside the server on or off.
B Reset switch When pressed, resets the server and causes the power-on self-test
(POST) to run.
C NMI switch When pressed, causes a nonmaskable interrupt (NMI). This switch is
recessed behind the front panel to prevent inadvertent activation. (The
switch must be pressed with a narrow tool.)
D Power (LED) (green) When continuously lit, indicates the presence of DC power in the server.
The light emitting diode (LED) goes out when the power is turned off or
when the power source i s disrupted. Wh en flashin g, indicate s the syst em is
in advanced configuration and power interface (ACPI) sleep mode.
E Power fault LED (yellow) When continuously lit, indi cates a power suppl y failu re. When fla shing , indi-
cates a 240 VA overload shutdown and power control failure.
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OCPRF100 MP Server System Technical Product Specification
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Table 3-2: System Features – Front
F Fan fault LED (yellow) When lit, indicates either a fan failure, or that a predictive fan failure has
been detected in the server.
G Drive fault LED (yellow) When continuously lit, indicates an asserted fault status on one or more
hard disk drives in th e hot-swap bay. When flas hi ng, in dic ate s drive rebuild
in progress.
H Front panel LCD Displays information about processor type and failure codes.
(Items I through L on are control buttons for the CD-ROM, and the location may vary from manufacturer to manu-
facturer.)
3.5-inch Floppy Diskette Drive Descriptions
M Activity LED When lit, indicates the drive is in use.
N Ejector button When pressed, ejects the diskette.
Status LEDs for SCSI Drives in Hot-swap Bays
O Drive power LED
(green)
P Drive activity LED
(green)
Q Drive fault LED (yellow) When continuously lit, indicates an asserted fault status on one or more
When continuously lit, indicates the presence of the drive and that drive is
powered on.
When flashing, indicates drive activity.
hard disk drives in the hot-swap bay. When flashing, indicates that drive
rebuild is in progress.
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3.2.2 Rear View of Chassis
OCPRF100 MP Server System Technical Product Specification
Revision 1.0
A
E
F
G
H
CB
D
I
Table 3-3: System Features – Rear
Item Description
A PCI add-in board slots.
B External LVDS connector.
C ICMB connectors in/out.
D I/O riser board.
E AC input power connector.
F Three power supplies.
Figure 3-5: Rear View of Chassis
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