Intel IO CONTROLLER HUB 8, ICH8 User Manual

Intel® I/O Controller Hub 8 (ICH8) Family

Thermal and Mechanical Design Guidelines

— For the Intel® I/O Controller Hub 8 (ICH8) Desktop Family.

June 2006

Document Number: 313058-001

THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. INTEL ASSUMES NO RESPONSIBILITY FOR ANY ERRORS CONTAINED IN THIS DOCUMENT AND HAS NO LIABILITIES OR OBLIGATIONS FOR ANY DAMAGES ARISING FROM OR IN CONNECTION WITH THE USE OF THIS DOCUMENT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.

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Intel may make changes to specifications and product descriptions at any time, without notice. Intel is not obligated to provide any support, installation or other assistance with regard to the information or products made in accordance with it.

Intel

I/O Controller Hub (ICH8) components may contain design defects or errors known as errata, which may cause the product to

deviate from published specifications. Current characterized errata are available on request. Intel, Pentium, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States

2 Thermal and Mechanical Design Guidelines

1 Introduction..........................................................................................................................7

1.1 Terminology............................................................................................................7

1.2 Reference Documents............................................................................................8

2 Product Specifications.........................................................................................................9

2.1 Package Description...............................................................................................9

2.2 Package Loading Specifications.............................................................................9

2.3 Thermal Specifications ...........................................................................................9

2.4 Power Specifications ............................................................................................11

3 Thermal Metrology.............................................................................................................13

3.1 Case Temperature Measurements.......................................................................13

3.2 0° Angle Thermocouple Attach Methodology.......................................................13

3.3 Ambient Temperature and Airflow Measurement.................................................14

4 Reference Thermal Solution..............................................................................................17

4.1 Environmental Reliability Requirements...............................................................17

Appendix A Enabled Suppliers .............................................................................................................19

Appendix B Mechanical Drawings........................................................................................................21

Thermal and Mechanical Design Guidelines 3

Figures

Tables

Figure 1. 0° Angle Attach Methodology (top view, not to scale) .......................................14

Figure 2. 0° Angle Attach Heatsink Modifications (generic heatsink shown, not to scale)14

Figure 3. Recommended Temperature Measurement Placement: Top View ..................15

Figure 4. Recommended Airflow and Temperature Placement: Side View......................15

Figure 8. Intel® ICH8 Component Package Drawing ........................................................22

Figure 9. Motherboard Keep-Out for Reference Heatsink................................................23

Figure 10. Reference Heatsink Extrusion .........................................................................24

Figure 11. Reference Heatsink Clip..................................................................................25

Figure 12. Reference Heatsink Assembly.........................................................................26

Table 1. Package Loading Specifications...........................................................................9

Table 2. Intel® ICH8 Component Case Temperature Specifications ................................10

Table 3. Intel® ICH8 Thermal Design Power Guidelines...................................................11

Table 6. Reference Thermal Solution Environmental Reliability Requirements...............17

Table 7. Enabled Suppliers for the Intel® ICH6, ICH7, and ICH8 Reference Heatsink ....19

4 Thermal and Mechanical Design Guidelines

Revision History

Rev. No. Description Date

-001 • Initial Release. June 2006

Thermal and Mechanical Design Guidelines 5

6 Thermal and Mechanical Design Guidelines

Introduction

1 Introduction

The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements. Operation outside the functional limit can degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component. The goal of this document is to provide an understanding of the operating limits of the Intel

As the complexity of computer systems increases, so do power dissipation requirements. The additional power of next generation systems must be properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or passive heatsinks.

The simplest and most cost-effective method is to improve the inherent system cooling characteristics of the ICH8 through careful design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

ICH8 component.

This document presents the conditions and requirements to properly design a cooling solution for systems that implement the ICH8 component. Properly designed solutions provide adequate cooling to maintain the ICH8 component case temperature at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the ICH8 component case temperature at or below maximum specifications, a system designer can ensure the proper functionality, performance, and reliability of this component.

Note: This document only applies to the desktop implementation of the Intel

Note: Unless otherwise specified, the term ICH8 refers to the Intel

family.

Note: References to RAID in this document only apply to the Intel

with RAID capabilities.

1.1 Terminology

Term Description

mBGA Mini Ball Grid Array. Smaller versions of the BGA with a ball pitch of 1.07 mm. Wirebonded

package with die encased with a mold encapsulant.

TC The measured case temperature of a component. It is generally measured at the geometric

center of the die or case, as specified in the component documentation.

ICH8 component.

I/O Controller Hub 8 (ICH8) desktop

82801HR ICH8R I/O Controller Hub

The maximum case/die temperature.

C-MAX

Thermal and Mechanical Design Guidelines 7

Introduction

Term Description

The minimum case/die temperature.

C-MIN

TDP Thermal Design Power is specified as the highest sustainable power level of most or all of

the real applications expected to be run on the given product, based on extrapolations in both hardware and software technology over the life of the component. Thermal solutions should be designed to dissipate this target power level.

TIM Thermal Interface Material: thermally conductive material installed between two surfaces to

improve heat transfer and reduce interface contact resistance.

LFM Linear Feet per Minute. Units of airflow velocity.

PTC Package Thermal Capability. The power level at which at or below its value, the component

does not require a heatsink under the reference boundary condition assumptions.

Theta_CA Thermal Resistance described using power dissipated between two points. Here, theta_ca is

defined as: (Tc – Tambient)/(Power

)

1.2 Reference Documents

Document Comments

Intel® I/O Controller Hub 8 (ICH8) Datasheet www.intel.com/design/chips

ets/datashts/313056.htm

Various System Thermal Design Suggestions http://www.formfactors.org

8 Thermal and Mechanical Design Guidelines

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