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Intel® I/O Controller Hub 8 (ICH8)
Family
Thermal and Mechanical Design Guidelines
— For the Intel® I/O Controller Hub 8 (ICH8) Desktop Family.
June 2006
Document Number: 313058-001
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THIS DOCUMENT AND RELATED MATERIALS AND INFORMATION ARE PROVIDED "AS IS” WITH NO WARRANTIES,
EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR
A PARTICULAR PURPOSE, NON-INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, OR ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE. INTEL ASSUMES NO RESPONSIBILITY FOR
ANY ERRORS CONTAINED IN THIS DOCUMENT AND HAS NO LIABILITIES OR OBLIGATIONS FOR ANY DAMAGES ARISING
FROM OR IN CONNECTION WITH THE USE OF THIS DOCUMENT. Intel products are not intended for use in medical, life saving,
life sustaining, critical control or safety systems, or in nuclear facility applications.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that
relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any
license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property
rights.
Intel may make changes to specifications and product descriptions at any time, without notice. Intel is not obligated to provide any
support, installation or other assistance with regard to the information or products made in accordance with it.
®
Intel
I/O Controller Hub (ICH8) components may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Intel, Pentium, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States
and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2006 Intel Corporation. All rights reserved.
2 Thermal and Mechanical Design Guidelines
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Contents
1 Introduction..........................................................................................................................7
1.1 Terminology............................................................................................................7
1.2 Reference Documents............................................................................................8
2 Product Specifications.........................................................................................................9
2.1 Package Description...............................................................................................9
2.2 Package Loading Specifications.............................................................................9
2.3 Thermal Specifications ...........................................................................................9
2.4 Power Specifications ............................................................................................11
3 Thermal Metrology.............................................................................................................13
3.1 Case Temperature Measurements.......................................................................13
3.2 0° Angle Thermocouple Attach Methodology.......................................................13
3.3 Ambient Temperature and Airflow Measurement.................................................14
4 Reference Thermal Solution..............................................................................................17
4.1 Environmental Reliability Requirements...............................................................17
Appendix A Enabled Suppliers .............................................................................................................19
Appendix B Mechanical Drawings........................................................................................................21
Thermal and Mechanical Design Guidelines 3
Figures
Tables
Figure 1. 0° Angle Attach Methodology (top view, not to scale) .......................................14
Figure 2. 0° Angle Attach Heatsink Modifications (generic heatsink shown, not to scale)14
Figure 3. Recommended Temperature Measurement Placement: Top View ..................15
Figure 4. Recommended Airflow and Temperature Placement: Side View......................15
Figure 8. Intel® ICH8 Component Package Drawing ........................................................22
Figure 9. Motherboard Keep-Out for Reference Heatsink................................................23
Figure 10. Reference Heatsink Extrusion .........................................................................24
Figure 11. Reference Heatsink Clip..................................................................................25
Figure 12. Reference Heatsink Assembly.........................................................................26
Table 1. Package Loading Specifications...........................................................................9
Table 2. Intel® ICH8 Component Case Temperature Specifications ................................10
Table 3. Intel® ICH8 Thermal Design Power Guidelines...................................................11
Table 6. Reference Thermal Solution Environmental Reliability Requirements...............17
Table 7. Enabled Suppliers for the Intel® ICH6, ICH7, and ICH8 Reference Heatsink ....19
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4 Thermal and Mechanical Design Guidelines
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Revision History
Rev. No. Description Date
-001 • Initial Release. June 2006
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Thermal and Mechanical Design Guidelines 5
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6 Thermal and Mechanical Design Guidelines
Introduction
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1 Introduction
The objective of thermal management is to ensure that the temperatures of all components in a
system are maintained within functional limits. The functional temperature limit is the range within
which the electrical circuits can be expected to meet specified performance requirements. Operation
outside the functional limit can degrade system performance, cause logic errors, or cause component
and/or system damage. Temperatures exceeding the maximum operating limits may result in
irreversible changes in the operating characteristics of the component. The goal of this document is
to provide an understanding of the operating limits of the Intel
As the complexity of computer systems increases, so do power dissipation requirements. The
additional power of next generation systems must be properly dissipated. Heat can be dissipated
using improved system cooling, selective use of ducting, and/or passive heatsinks.
The simplest and most cost-effective method is to improve the inherent system cooling
characteristics of the ICH8 through careful design and placement of fans, vents, and ducts. When
additional cooling is required, component thermal solutions may be implemented in conjunction
with system thermal solutions. The size of the fan or heatsink can be varied to balance size and
space constraints with acoustic noise.
®
ICH8 component.
This document presents the conditions and requirements to properly design a cooling solution for
systems that implement the ICH8 component. Properly designed solutions provide adequate cooling
to maintain the ICH8 component case temperature at or below thermal specifications. This is
accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and
minimizing the case to local-ambient thermal resistance. By maintaining the ICH8 component case
temperature at or below maximum specifications, a system designer can ensure the proper
functionality, performance, and reliability of this component.
Note: This document only applies to the desktop implementation of the Intel
Note: Unless otherwise specified, the term ICH8 refers to the Intel
family.
Note: References to RAID in this document only apply to the Intel
with RAID capabilities.
1.1 Terminology
Term Description
mBGA Mini Ball Grid Array. Smaller versions of the BGA with a ball pitch of 1.07 mm. Wirebonded
package with die encased with a mold encapsulant.
TC The measured case temperature of a component. It is generally measured at the geometric
center of the die or case, as specified in the component documentation.
®
ICH8 component.
®
I/O Controller Hub 8 (ICH8) desktop
®
82801HR ICH8R I/O Controller Hub
T
The maximum case/die temperature.
C-MAX
Thermal and Mechanical Design Guidelines 7
Introduction
Term Description
T
The minimum case/die temperature.
C-MIN
TDP Thermal Design Power is specified as the highest sustainable power level of most or all of
the real applications expected to be run on the given product, based on extrapolations in
both hardware and software technology over the life of the component. Thermal solutions
should be designed to dissipate this target power level.
TIM Thermal Interface Material: thermally conductive material installed between two surfaces to
improve heat transfer and reduce interface contact resistance.
LFM Linear Feet per Minute. Units of airflow velocity.
PTC Package Thermal Capability. The power level at which at or below its value, the component
does not require a heatsink under the reference boundary condition assumptions.
Theta_CA Thermal Resistance described using power dissipated between two points. Here, theta_ca is
defined as: (Tc – Tambient)/(Power
)
CA
1.2 Reference Documents
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Document Comments
Intel® I/O Controller Hub 8 (ICH8) Datasheet www.intel.com/design/chips
ets/datashts/313056.htm
Various System Thermal Design Suggestions http://www.formfactors.org
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8 Thermal and Mechanical Design Guidelines
Product Specifications
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2 Product Specifications
2.1 Package Description
The ICH8 component is available in a 652 ball, 31mm square mBGA package shown in Figure 5 in
Appendix B.
2.2 Package Loading Specifications
Table 1 provides static load specifications for the ICH8 package. This mechanical maximum load
limit should not be exceeded during heatsink assembly, shipping conditions, or typical use
condition. Also, any mechanical system or component testing should not exceed the maximum limit.
The chipset package substrate should not be used as a mechanical reference or load-bearing surface
for the thermal and mechanical solution.
Table 1. Package Loading Specifications
Parameter Maximum Notes
Static 15 lbf 1,2,3
NOTES:
1. These specifications apply to uniform compressive loading in a direction normal to the chipset package
2. This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide
the minimum specified load on the ICH package.
3. These specifications are based on limited testing for design characterization. Loading limits are for the
package only.
2.3 Thermal Specifications
To ensure proper operation and reliability of the ICH8 component, the case temperature TC must be
at or below the maximum value T
exceeds the maximum temperature listed, system or component level thermal enhancements are
required to dissipate the heat generated. The system designer must design a thermal solution for the
ICH8 such that it maintains T
below T
C
power (TDP). Please note that the T
equal to TDP, and that the case temperature must be maintained at temperatures less than T
when operating at power levels less than TDP. This temperature compliance is to ensure chipset
reliability over its useful life. Chapter
temperature measurements. Chapter
ATX systems.
specified in Table 2. If the temperature of the component
C-MAX
for sustained power level equal to the Thermal Design
C-MAX
specification is a requirement for a sustained power level
C-MAX
3 provides the thermal metrology guidelines for case
4 provides information on the reference cooling solution for
C-MAX
Intel’s reference boundary conditions for ICH8 in an ATX system are 60 °C inlet ambient
temperature and 0.25m/s [50 lfm] of airflow. The ICH8 package will not require a heatsink when
power dissipation is at or below 3.0 W. This value is referred to as the Package Thermal Capability,
or PTC. Note that the power level at which a heatsink is required will also change depending on
system local operating ambient conditions and system configuration. For example, the local inlet
Thermal and Mechanical Design Guidelines 9
Product Specifications
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ambient air for the ICH8 component in a BTX system is projected to be approximately 55°C. For
BTX platforms that have similar boundary conditions to what is stated above, ICH8 does not require
a heatsink.
Note that the local ambient air temperature for BTX is a projection based on anticipated
power increases on a 2005 platform and are subject to change in the next revision of this
document.
It is important to note, however, that since the ICH8 package has a molded plastic encapsulant, and
because plastic is such a poor heat conductor, the relative importance of the motherboard heat
transfer characteristics increases.
The heat transfer capability of the motherboard in the area of the
ICH8 should be characterized. Knowledge of these heat transfer paths can be used to determine if
an ICH8 heatsink is required.
In addition, high power PCI Express* graphic cards may alter the local ambient temperature as well
as the airflow patterns in the vicinity of the chipset. Systems that have interface utilization less than
that of the TDP configuration may be at power levels that may not require a heatsink.
In conclusion, thermal validation should be performed in your anticipated system environment, in
particular measuring the ICH8 case temperature to ensure it does not exceed its maximum case
temperature specification. To evaluate the capability of your system for cooling the ICH8, the
following system level tests are suggested to assess ICH8 case temperature compliancy:
1. Shipping configuration(s) with expected end user add-in cards and I/O peripherals installed.
2. All available slots and IO ports populated (only worst case if all I/O is fully populated including
SATA, USB, etc.).
For completeness, both room ambient conditions (approximately 23 °C, to simulate impact of fan
speed control) and worse case maximum external temperature (35 °C) conditions should be
considered in the validation test suite. If the ICH8 case temperature is above the published Tc-max
in any test scenario, a heatsink is required.
If you determine that the ICH8 package requires a heatsink in your system configuration, please
refer to
The component should be operated above the minimum case temperature specification listed in
Table 2.
Table 2. Intel
NOTES:
Appendix A for the current reference ICH8 heatsink vendor information.
®
ICH8 Component Case Temperature Specifications
Parameter Value
See Table 3 for additional configurations
T
(Note 1 below) for TDP condition
C-MAX
of 4.1 W
T
C-MIN
0 °C
No Heatsink Attached: 105 °C
Table 3 for additional configuration
See
Heatsink Attached: 92 °C
Storage Temperature -10 °C to +45 °C
1. Without a heatsink, most of the heat dissipated by ICH8 goes through the PCB, acting as a heat
spreader, and then into the ambient air. When a heatsink is installed on the package, more power is
now being pulled through the case. As a result the maximum case temperature must be maintained at
lower level than without a heatsink to remain within specification.
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Product Specifications
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2.4 Power Specifications
The ICH8 component is estimated to dissipate the Thermal Design Power (TDP) value provided in
Table 3. This TDP value is estimated based on various factors including: system configurations,
industry stress applications, die temperature and part-to-part variance.
Note that
Table 3. Intel
NOTES:
Table 3 reflects post silicon validated power numbers.
®
ICH8 Thermal Design Power Guidelines
Configuration Configuration
DMI x4 X4 X4
PCI 3 3 3 3
PCI Express* Two x1 s Two x1 s Two x1 s One each x4
Devices
Configuration Based Power
1. USB HS = USB 2.0 High Speed Device (480 Mb/s), USB FS = USB 2.0 Full Speed Device (12 Mb/s)
2. 4 devices assume RAID 5 with 3 hard drives (3 Gb/s) and 1 optical drive (1.5 Gb/s).
3. The number of devices refers to both the number of ports supported on the board as well as the
4. Refers to the power of each listed configuration. Configuration 4 is the typical configuration for Thermal
5. The Intel reference design supports Configuration 3.
LAN Gigabit LAN
SATA2 4 4 6 6
USB (HS/FS)1 8/2 8/2 8/2 8/2
HD Audio Yes Yes Yes Yes
4
6 devices assumes RAID 5 with 4 hard drives (3 Gb/s) and 2 optical drives (1.5 Gb/s)
quantity of devices attached. Any ports not routed to a connector is assumed to be functionally
disabled according to Intel guidelines
Design Power.
1
3.0 W 3.3 W 3.7 W 4.1 W
Configuration 2 Configuration 3 Configuration
Connect
Interface (GLCI)
X4 x4
GLCI GLCI
4
and x1
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Thermal and Mechanical Design Guidelines 11
Product Specifications
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12 Thermal and Mechanical Design Guidelines
Thermal Metrology
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3 Thermal Metrology
The system designer must make temperature measurements in order to accurately determine the
thermal performance of the system. Intel has established guidelines for measuring chipset
component case temperatures.
3.1 Case Temperature Measurements
To ensure functionality and reliability, the chipset component is specified for proper operation when
is maintained at or below the maximum temperature listed in Table 2. The surface temperature
T
C
at the geometric center of the mold encapsulant corresponds to T
care to ensure an accurate temperature measurement.
Temperature differences between the temperature of a surface and the surrounding local ambient air
can introduce error in the measurements. The measurement errors could be due to a poor thermal
contact between the thermocouple junction and the surface of the package, heat loss by radiation
and/or convection, and/or conduction through thermocouple leads. To minimize these measurement
errors, the approach described below titled
recommended.
0° Angle Thermocouple Attach Methodology is
. Measuring TC requires special
C
3.2 0° Angle Thermocouple Attach Methodology
1. Mill a 3.3 mm [0.13 in] diameter hole centered on bottom of the heatsink base. The milled hole
should be approximately 1.5 mm [0.06 in] deep.
2. Mill a 1.3 mm [0.05 in] wide slot, 0.5 mm [0.02 in] deep, from the centered hole to one edge of
the heatsink. The slot should be in the direction parallel to the heatsink fins (see
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts
should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of
the top surface of the case using high thermal conductivity cement. During this step, make sure
no contact is present between the thermocouple cement and the heatsink base because any
contact will affect the thermocouple reading. It is critical that the thermocouple bead makes
contact with the case (see
6. Attach heatsink assembly to the ICH8, and route thermocouple wires out through the milled
slot.
Figure 1).
Figure 2).
Thermal and Mechanical Design Guidelines 13
Thermal Metrology
Figure 1. 0° Angle Attach Methodology (top view, not to scale)
Figure 2. 0° Angle Attach Heatsink Modifications (generic heatsink shown, not to scale)
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3.3 Ambient Temperature and Airflow Measurement
Figure 3 describes the recommended location for air temperature measurements measured relative to
the component. For a more accurate measurement of the average approach air temperature, Intel
recommends averaging temperatures recorded from two thermocouples spaced about 25 mm [1.0 in]
apart. Locations for both a single thermocouple and a pair of thermocouples are presented.
Airflow velocity should be measured using industry standard air velocity sensors. Typical airflow
sensor technology may include hot wire anemometers.
velocity measurement locations. These locations are for a typical JEDEC test setup and may not be
compatible with all chassis layouts due to the proximity of the processor to the ICH8, PCI and
PCI Express* add-in cards. The user may have to adjust the locations for a specific chassis. Be
aware that sensors may need to be aligned perpendicular to the airflow velocity vector or an
inaccurate measurement may result. Measurements should be taken with the chassis fully sealed in
its operational configuration to achieve a representative airflow profile within the chassis.
14 Thermal and Mechanical Design Guidelines
Figure 4 provides guidance for airflow
Thermal Metrology
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Figure 3. Recommended Temperature Measurement Placement: Top View
T/C pair
location
T
op View
13 mm
(0.5in)
Single T/C
location
T/C pair
location
13 mm
(0.5in)
Figure 4. Recommended Airflow and Temperature Placement: Side View
Airflow
H/2
S
ide View
ICH package
CL
ICH Heatsink, if
required
H
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Thermal and Mechanical Design Guidelines 15
Thermal Metrology
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16 Thermal and Mechanical Design Guidelines
Reference Thermal Solution
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4 Reference Thermal Solution
The ICH8 reference solution on an ATX platform assumes a component local operating
environment with a maximum local-ambient temperature of 60 °C and airflow of 0.25 m/s [50 lfm].
In these ambient conditions, with the configurations given in
an attached heatsink to meet thermal specifications. The local-ambient conditions are based on a
35 °C external-ambient temperature at sea level, where external-ambient refers to the environment
external to the system. Refer to
thermal solution and
Appendix B for reference thermal solution mechanical drawings.
Note: The reference heatsink for the ICH8 is the same reference heatsink for the developed Intel
which was also used for the Intel
Appendix A for currently enabled suppliers for the reference
®
ICH7.
Table 3, the ICH8 component requires
®
ICH6
Refer to
Figure 6 for reference ATX/μATX motherboard keep-out information. The heatsink can be
tape-attached, or attached with a Z-clip. The motherboard keep-out allows for a Z-clip heatsink
attach.
Note: Intel has not completed thermal or mechanical validation with a tape-attached ICH heatsink
solution.
4.1 Environmental Reliability Requirements
If an attached heatsink is implemented due to a severe component local operating environment, the
reliability requirements in
may vary depending on the heatsink, and attach method used. The user should define validation
tests based on the anticipated use conditions and resulting reliability requirements.
Table 4. Reference Thermal Solution Environmental Reliability Requirements
Test1 Requirement Pass/Fail Criteria2
Mechanical
Shock
Random
Vibration
Thermal
Cycling
Temperature
Life
Unbiased
Humidity
• 3 drops for + and - directions in each of 3 perpendicular axes
• Profile: 50 G trapezoidal waveform, 11 ms duration,
• Setup: Mount sample board on test fixture.
• Duration: 10 min/axis, 3 axes
• Frequency Range: 5 Hz to 500 Hz
• Power Spectral Density (PSD) Profile: 3.13 g RMS
• -40 °C to +85 °C, 1000 cycles Visual Check
• 85 °C, 1000 hours total Visual/Electrical
• 85 % relative humidity / 55 °C, 1000 hours Visual Check
Table 4 are recommended. The mechanical loading of the component
(i.e., total 18 drops).
170 inches/sec minimum velocity change.
Visual\Electrical
Check
Visual/Electrical
Check
Check
NOTES:
1. The above tests should be performed on a sample size of at least 12 assemblies from 3 different lots
of material.
2. Additional Pass/Fail Criteria may be added at the discretion of the user.
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Thermal and Mechanical Design Guidelines 17
Reference Thermal Solution
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18 Thermal and Mechanical Design Guidelines
Currently Enabled Suppliers
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Appendix A Currently Enabled Suppliers
The currently enabled suppliers for the reference thermal solution supporting the ICH6, ICH7 and
ICH8 are listed in
Table 5 and Table 6.
Table 5. Heatsink Enabled Suppliers for Intel
items Intel PN AVC CCI Foxconn
ICH 6, 7, and 8 C46655-001 S702C00001 00C855802B 2Z802-009
Table 6. Enabled Suppliers for the Intel
Supplier contacts location phone email
AVC (Asia Vital
Components)
CCI (Chaun
Choung
Technology)
Foxconn
Wieson
Technologies
David Chao Taiwan
Raichel Hsu Taiwan
Monica Chih Taiwan
Harry Lin USA (714) 739-5797 hlinack@aol.com
Jack Chen USA (714) 626-1233 jack.chen@foxconn.com
Wanchi Chen USA (714) 626-1376
Andrea Lai Taiwan
Edwina Chu Taiwan
®
ICH6, ICH7, and ICH8 Reference Heatsink
®
ICH6, ICH7, and ICH8
+886-2-22996930 ext. 7619 david_chao@avc.com.tw
+886-2-22996930 ext. 7630
+886-2-29952666 monica_chih@ccic.com.tw
+886-2-26471896 ext. 6684 andrea24@wieson.com
+886-2-26471896 ext. 6390
raichel_hsi@avc.com.tw
wanchi.chen@foxconn.com
edwina@wieson.com
Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but
Intel does not make any representations or warranties whatsoever regarding quality, reliability,
functionality, or compatibility of these devices. This list and/or these devices may be subject to
change without notice.
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Thermal and Mechanical Design Guidelines 19
Currently Enabled Suppliers
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20 Thermal and Mechanical Design Guidelines
Mechanical Drawings
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Appendix B Mechanical Drawings
The following table lists the mechanical drawings available in this document:
Drawing Name Page Number
Intel® ICH8 Component Package Drawing 22
Motherboard Keep-Out 23
Reference Heatsink Extrusion 24
Reference Heatsink Clip 25
Reference Heatsink Assembly 26
Thermal and Mechanical Design Guidelines 21
Mechanical Drawings
®
Figure 5. Intel
ICH8 Component Package Drawing
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26 Thermal and Mechanical Design Guidelines
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Mechanical Drawings
Figure 6. Motherboard Keep-Out for Reference Heatsink
Thermal and Mechanical Design Guidelines 23
Mechanical Drawings
Figure 7. Reference Heatsink Extrusion
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24 Thermal and Mechanical Design Guidelines
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Mechanical Drawings
Figure 8. Reference Heatsink Clip
Thermal and Mechanical Design Guidelines 25
Mechanical Drawings
Figure 9. Reference Heatsink Assembly
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26 Thermal and Mechanical Design Guidelines
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