INTEL INTEL D455 User guide

Document Number: 337029-009

Intel® RealSense

TM

Product Family D400 Series

Datasheet

Intel® RealSense™ Vision Processor D4, Intel® RealSense™ Vision
Processor D4 Board, Intel® RealSense™ Vision Processor D4 Board V2,
Intel® RealSense™ Vision Processor D4 Board V3, Intel® RealSense™
Depth Module D400, Intel® RealSense™ Depth Module D410, Intel®
RealSense™ Depth Module D415, Intel® RealSense™ Depth Camera D415,
Intel® RealSense™ Depth Module D420, Intel® RealSense™ Depth Module
D430, Intel® RealSense™ Depth Module D450, Intel® RealSense™ Depth
Camera D435, Intel® RealSense™ Depth Camera D435i, Intel®

RealSense™ Depth Camera D455

Revision 009

June 2020

2 337029-009

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Description and Features

337029-009 3

Contents

1 Description and Features .................................................................................. 14

2 Introduction .................................................................................................... 15

2.1 Purpose and Scope of this Document ....................................................... 15

2.2 Terminology ......................................................................................... 15

2.3 Stereo Vision Depth Technology Overview ................................................ 16

2.4 Camera System Block Diagram ............................................................... 18

2.5 Intel® RealSense™ Depth Module D400 series Product SKUs ...................... 19

2.6 Intel® RealSense™ Depth Camera D400 series Product SKUs ..................... 20

3 Component Specification .................................................................................. 21

3.1 Vision Processor D4 Camera System Components ..................................... 21

3.2 Host Processor ..................................................................................... 21

3.3 Intel® RealSense™ Vision Processor D4 ................................................... 21

3.3.1 Vision Processor D4 Features .................................................... 21

3.3.2 Vision Processor D4 Signal Description ....................................... 22

3.3.3 Vision Processor D4 Package Mechanical Attributes ...................... 27

3.3.4 Vision Processor D4 Power Requirements .................................... 33

3.3.5 Vision Processor D4 Power Sequencing ....................................... 33

3.3.6 Vision Processor D4 Spec Code .................................................. 34

3.3.7 Vision Processor D4 Storage and Operating Conditions ................. 34

3.3.8 Vision Processor D4 Thermals ................................................... 35

3.4 Clock ................................................................................................... 35

3.5 Serial (SPI) Flash Memory ...................................................................... 35

3.6 Stereo Depth Module ............................................................................. 35

3.6.1 Left and Right Imagers ............................................................. 37

3.6.2 Infrared Projector .................................................................... 38

3.6.3 Color Sensor ........................................................................... 39

3.6.4 Depth Module Connector .......................................................... 40

3.6.5 Stereo Depth Module Label ....................................................... 40

3.6.6 Stiffener ................................................................................. 41

3.6.7 Temperature Sensor ................................................................ 41

3.6.8 Other Stereo Depth Module Components .................................... 41

3.6.9 Mechanical Dimensions ............................................................. 42

3.6.10 Stereo Depth Module Power Sequence........................................ 43

3.6.11 Stereo Depth Module Storage and Powered Conditions ................. 43

3.7 Intel® RealSense™ Vision Processor D4 Board .......................................... 44

3.7.1 Mechanical Dimensions ............................................................. 45

3.7.2 Depth Module Receptacle .......................................................... 45

3.7.3 Flex and Rigid Interposer Interconnect ....................................... 45

3.7.4 External Sensor Sync Connector ................................................ 50

3.7.5 USB Peripheral Connector – Type-C ........................................... 50

3.7.6 Color Image Signal Processor (ISP) ............................................ 52

3.7.7 Vision Processor D4 Board Power Requirements .......................... 52

3.7.8 Vision Processor D4 Board Thermals .......................................... 52

3.7.9 Vision Processor D4 Board Storage and Powered Conditions .......... 53

3.7.10 Intel® RealSense™ Vision Processor D4 Board Product Identifier and

Material Code .......................................................................... 54

3.8 Intel® RealSense™ Depth Camera D400 Series ......................................... 54

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3.8.1 Depth Camera D400 Series Mechanical Dimensions ..................... 55

3.8.2 Depth Camera D400 Series Thermals ......................................... 56

3.8.3 Depth Camera D400 Series Product Identifier and Material Code ... 58

3.8.4 Camera Lens Cleaning Procedure ............................................... 58

4 Functional Specification .................................................................................... 59

4.1 Vendor Identification (VID) and Device Identification (DID) ........................ 59

4.2 Vision Processor D4 Data Streams .......................................................... 59

4.3 Depth Field of View (FOV) ...................................................................... 62

4.4 Depth Field of View at Distance (Z) ......................................................... 63

4.5 Invalid Depth Band ............................................................................... 64

4.6 Minimum-Z Depth ................................................................................. 65

4.7 Depth Quality Specification .................................................................... 65

4.8 Depth Start Point (Ground Zero Reference) .............................................. 67

4.8.1 Depth Origin X-Y Coordinates .................................................... 69

4.9 Depth Camera Functions ........................................................................ 70

4.10 Color Camera Functions ......................................................................... 71

4.11 IMU Specifications ................................................................................. 72

5 Firmware ........................................................................................................ 73

5.1 Update ................................................................................................ 73

5.1.1 Update Limits .......................................................................... 73

5.2 Recovery ............................................................................................. 73

6 Software ......................................................................................................... 74

6.1 Intel® RealSense™ Software Development Kit 2.0 ..................................... 74

7 System Integration .......................................................................................... 75

7.1 System Level Block Diagram .................................................................. 75

7.2 Vision Processor D4 System Integration ................................................... 75

7.2.1 Vision Processor D4 Board ........................................................ 75

7.2.2 Vision Processor D4 on Motherboard .......................................... 76

7.3 D4 Camera System Power Delivery ......................................................... 77

7.4 Vision Processor D4 Board for Integrated Peripheral .................................. 78

7.4.1 USB 3.1 Gen 1 Receptacle ........................................................ 78

7.4.2 USB 3.1 Gen 1 High Speed Cable Assembly ................................ 78

7.4.3 Transmit to Receive Crossover .................................................. 79

7.4.4 Motherboard Receptacle ........................................................... 80

7.4.5 Vision Processor D4 Board for Integrated Peripheral Power

Requirements .......................................................................... 80

7.5 Thermals ............................................................................................. 80

7.6 Stereo Depth Module Flex ...................................................................... 82

7.7 Stereo Depth Module Mounting Guidance ................................................. 82

7.7.1 Screw Mount ........................................................................... 82

7.7.2 Bracket Mount ......................................................................... 83

7.7.3 Stereo Depth Module Air gap ..................................................... 84

7.8 Thermal Interface Material ..................................................................... 85

7.9 Heat Sink ............................................................................................. 85

7.10 Cover Design and Material Guidance ....................................................... 85

7.11 Gaskets ............................................................................................... 86

7.11.1 Optical Isolation ...................................................................... 87

7.11.2 Dust Protection ....................................................................... 88

7.12 Firmware Recovery ............................................................................... 88

Description and Features

337029-009 5

7.13 Calibration Support ............................................................................... 89

7.14 Multi-Camera Hardware Sync ................................................................. 89

7.15 Handling Conditions .............................................................................. 90

8 Platform Design Guidelines ............................................................................... 91

8.1 Vision Processor D4 on Motherboard ....................................................... 91

8.2 Kaby Lake U and Kaby Lake Y platforms .................................................. 92

8.2.1 Kaby Lake Platform Introduction ................................................ 92

8.2.2 Supported PCB Stack-Up and Routing Geometries ....................... 92

8.2.3 Vision Processor D4 on Motherboard with USB Host Interface ........ 93

8.2.4 Vision Processor D4 on Motherboard with MIPI Host Interface ....... 94

8.2.5 Vision Processor D4 Board for Integrated Peripheral (USB 3.1 Gen 1

Host to Vision Processor D4 Routing) ......................................... 96

8.2.6 USB2.0 Design Guidelines (USB2 Host to Vision Processor D4

Routing) ................................................................................. 97

8.3 Cherry Trail T4 Platform ......................................................................... 98

8.3.1 Cherry Trail T4 Platform Introduction ......................................... 98

8.3.2 Vision Processor D4 Platform Design Guidelines ........................... 98

9 Regulatory Compliance ..................................................................................... 99

9.1 System Laser Compliance ...................................................................... 99

9.1.1 Certification Statement............................................................. 99

9.1.2 Explanatory Label .................................................................... 99

9.1.3 Cautionary Statements ............................................................. 99

9.1.4 US FDA Accession Number ....................................................... 100

9.2 Regulatory Compliance ......................................................................... 100

9.2.1 Manufacturer’s Information ...................................................... 100

9.2.2 EU Single Place of Contact ....................................................... 100

9.2.3 NRTL Statement ..................................................................... 101

9.2.4 FCC Part 15 Declaration of Conformity ...................................... 101

9.2.5 Canada ................................................................................. 102

9.2.6 European Directives ................................................................ 102

9.2.7 Japan .................................................................................... 102

9.2.8 South Korea ........................................................................... 102

9.3 Ecology Compliance ............................................................................. 103

9.3.1 China RoHS Declaration ........................................................... 103

9.3.2 Waste Electrical and Electronic Equipment (WEEE) ...................... 105

10 Mechanical Drawings ....................................................................................... 106

11 Connector Drawings ........................................................................................ 115

12 Appendix A – Vision Processor D4 on Motherboard Schematic Checklist ................. 117

12.1 Power Delivery .................................................................................... 124

13 Appendix B- Cover Material .............................................................................. 127

Figures

Figure 2-1. Active Infrared (IR) Stereo Vision Technology ......................................................... 17

Figure 2-2. Depth Measurement (Z) versus Range (R) .............................................................. 17

Figure 2-3. Vision Processor D4 Camera System Block Diagram ................................................ 18

Figure 3-1. Vision Processor D4 Package Drawing .................................................................... 29

6 337029-009

Figure 3-2. Vision Processor D4 Ball-out ................................................................................. 30

Figure 3-3. Vision Processor D4 Power Sequencing .................................................................. 34

Figure 3-4. Stereo Depth Module (Intel® RealSense™ Depth Module D410)................................. 36

Figure 3-5. Stereo Depth Module (Intel® RealSense™ Depth Module D430)................................. 36

Figure 3-6. Stereo Depth Module Power Sequence ................................................................... 43

Figure 3-7. Vision Processor D4 Board (USB Peripheral Type-C)................................................. 44

Figure 3-8. Flex Interposer (Illustration) ................................................................................. 46

Figure 3-9. Rigid Interposer (Illustration) ............................................................................... 46

Figure 3-10. Depth Module Receptacle and Plug Connector Pin Position ...................................... 47

Figure 3-11. Depth Module Connector Orientation and Pin Position ............................................. 49

Figure 3-12. USB Type-C Receptacle Pin Map .......................................................................... 51

Figure 3-13. Intel® RealSenseTM Depth Camera D415 ............................................................... 54

Figure 3-14. Intel® RealSense™ Depth Camera D435/D435i ..................................................... 54

Figure 3-15. Intel® RealSense™ Depth Camera D455 ............................................................... 55

Figure 4-1. Depth Field of View to Depth Map illustration .......................................................... 63

Figure 4-2. Left Invalid Depth Band ....................................................................................... 64

Figure 4-3. Depth Module Depth Start Point Reference ............................................................. 67

Figure 4-4. Depth Camera Depth Start Point Reference ............................................................ 68

Figure 4-5. Depth Module X-Y Depth Origin Reference .............................................................. 69

Figure 4-6. Depth Camera X-Y Depth Origin Reference ............................................................. 70

Figure 7-1. System Block Diagram ......................................................................................... 75

Figure 7-2. Intel® RealSense™ Vision Processor D4 Board ........................................................ 76

Figure 7-3. Vision Processor D4 on Motherboard (Illustration) ................................................... 76

Figure 7-4. D4 Camera System Power Scheme ........................................................................ 77

Figure 7-5. Host Motherboard USB 3.1 Gen 1 Routing .............................................................. 79

Figure 7-6. Receptacle Ground Bar Motherboard Connections .................................................... 80

Figure 7-7. Bottom Stiffener Depth Module D410 ..................................................................... 82

Figure 7-8. Bottom Stiffener Depth Module D430 ..................................................................... 82

Figure 7-9. Stereo Depth Module Screw Mount ........................................................................ 83

Figure 7-10. Stereo Depth Module Bracket .............................................................................. 83

Figure 7-11. Stereo Depth Module Bracket Mount .................................................................... 84

Figure 7-12. Stereo Depth Module Bracket Install .................................................................... 84

Figure 7-13. Stereo Depth Module Air Gap .............................................................................. 85

Figure 7-14. Illustration of Gasket Placement and Cover Material ............................................... 87

Figure 7-15. Example of Light Leakage Effects......................................................................... 88

Figure 7-16. Firmware Recovery Sequence ............................................................................. 89

Figure 7-17. External Sensor Sync Connector Location on D4 Vision Processor D4 Board .............. 89

Figure 7-18. External Sensor Sync Connector Location on Depth Camera D435/D435i/D455 ......... 90

Figure 8-1. Vision Processor D4 with USB Host Interface .......................................................... 91

Figure 8-2. Vision Processor D4 with MIPI Host Interface .......................................................... 91

Figure 8-3. Vision Processor D4 on Board for USB Integrated Peripheral ..................................... 92

Figure 8-4. Host Processor - Vision Processor D4 ..................................................................... 93

Figure 8-5. Vision Processor D4 Transmit - Host Receive ......................................................... 94

Figure 8-6. Stereo Depth Transmit - Vision Processor D4 Receive .............................................. 95

Figure 8-7. Flex Interposer PCB Stack-Up ............................................................................... 96

Figure 8-8. USB 3.1 Gen 1 Host to Vision Processor D4 Topology ............................................... 96

Figure 8-9. USB2.0 Host to Vision Processor D4 ....................................................................... 97

Figure 9-1. NRTL Certifications ............................................................................................. 101

Figure 10-1. Intel® RealSense™ Depth Module D400 ............................................................... 106

Figure 10-2. Intel® RealSense™ Depth Module D410 ............................................................... 107

Figure 10-3. Intel® RealSense™ Depth Module D415 ............................................................... 108

Figure 10-4. Intel® RealSense™ Depth Module D420 ............................................................... 109

Figure 10-5. Intel® RealSense™ Depth Module D430 ............................................................... 110

Figure 10-6. Vision Processor D4 Board USB Type-C (Intel® RealSense™ Vision Processor D4 Board)

.................................................................................................................... 111

Description and Features

337029-009 7

Figure 10-7. Intel® RealSense™ Depth Camera D415 .............................................................. 112

Figure 10-8. Intel® RealSense™ Depth Camera D435/D435i .................................................... 113

Figure 10-9. Intel® RealSense™ Depth Camera D455 .............................................................. 114

Figure 11-1. Receptacle Mechanical Drawing (50 Pin Depth Module Receptacle).......................... 115

Figure 11-2. Plug Mechanical Drawing (50 pin Depth Module Plug) ............................................ 116

Figure 12-1. Vision Processor D4 Laser PWM Reference Platform Schematic ............................... 124

Figure 12-2. Vision Processor D4 24MHz Crystal Clock Reference Platform Schematic .................. 124

Figure 12-3. DC-DC Reference Platform Schematic (3.3V, 1.8V, 0.9V) ....................................... 125

Figure 12-4. Vision Processor D4 VDD_PG and AVDD Reference Platform Schematic ................... 126

Tables

Table 2-1. Depth Module Product SKU Descriptions .................................................................. 19

Table 2-2. Depth Camera Product SKU Descriptions ................................................................. 20

Table 3-1. Component Descriptions ........................................................................................ 21

Table 3-2. Vision Processor D4 Signal Descriptions .................................................................. 22

Table 3-3. Hardware Straps .................................................................................................. 27

Table 3-4. Vision Processor D4 Package Mechanical Attributes ................................................... 28

Table 3-5. Vision Processor D4 Ball-out by Signal Name ........................................................... 30

Table 3-6. Vision Processor D4 Power Requirements ................................................................ 33

Table 3-7. Vision Processor D4 Power Sequencing Timing Parameters ........................................ 33

Table 3-8. Vision Processor D4 SPEC Code .............................................................................. 34

Table 3-9. Vision Processor D4 Storage and Operating Conditions .............................................. 34

Table 3-10. Stereo Depth Module........................................................................................... 35

Table 3-11. Stereo Depth Module SKU Properties ..................................................................... 36

Table 3-12. Standard Left and Right Imager Properties ............................................................ 37

Table 3-13. Wide Left and Right Imager Properties .................................................................. 37

Table 3-14. Standard Infrared Projector Parameters ................................................................ 38

Table 3-15. Wide Infrared Projector Parameters ...................................................................... 38

Table 3-16. Color Sensor Properties ....................................................................................... 39

Table 3-17. Depth Module 50-pin Connector Plug Details .......................................................... 40

Table 3-18. Stereo Depth Module Product Labeling .................................................................. 40

Table 3-19. Stereo Depth Module Label Fields ......................................................................... 40

Table 3-20. Intel® RealSense™ Depth Module D400 Series Product Identifier Code and Product

Material Code .................................................................................................. 41

Table 3-21. Other Stereo Depth Module Components ............................................................... 41

Table 3-22. Intel® RealSense™ Depth Module D400 Mechanical Dimensions ............................... 42

Table 3-23. Intel® RealSense™ Depth Module D410 Mechanical Dimensions ............................... 42

Table 3-24. Intel® RealSense™ Depth Module D415 Mechanical Dimensions ............................... 42

Table 3-25. Intel® RealSense™ Depth Module D420 Mechanical Dimensions ............................... 42

Table 3-26. Intel® RealSense™ Depth Module D430 Mechanical Dimensions ............................... 43

Table 3-27. Stereo Depth Module Storage and Powered Conditions ............................................ 43

Table 3-28. Vision Processor D4 Board .................................................................................. 44

Table 3-29. Vision Processor D4 Board Components ................................................................. 44

Table 3-30. Vision Processor D4 USB Type-C Board Mechanical Dimensions ................................ 45

Table 3-31. Depth Module Receptacle Details .......................................................................... 45

Table 3-32. Interposer Interconnect Signal Description............................................................ 47

Table 3-33. Custom Flex Interposer Ordering Logistics ............................................................. 49

Table 3-34. External Sensor Connector Details ........................................................................ 50

Table 3-35. External Sensor Sync Connector Pin List ................................................................ 50

Table 3-36. USB Peripheral Connector Pin List ......................................................................... 51

Table 3-37. Recommended USB Type C cable Assemblies Ordering Logistics ............................... 52

Table 3-38. ISP Properties .................................................................................................... 52

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Table 3-39. Vision Processor D4 Board Power Requirements ..................................................... 52

Table 3-40. Vision Processor D4 Board Storage and Powered Conditions ..................................... 53

Table 3-41. Vision Processor D4 Board Product Identifier and Material Code ................................ 54

Table 3-42. Depth Camera SKU properties .............................................................................. 55

Table 3-43. Intel® RealSense™ Depth Camera D415 Mechanical Dimensions ............................... 55

Table 3-44. Intel® RealSense™ Depth Camera D435, D435i Mechanical Dimensions .................... 56

Table 3-45. Intel® RealSense™ Depth Camera D455 Mechanical Dimensions ............................... 56

Table 3-46. Depth Camera D400 Series Storage and Powered Conditions ................................... 56

Table 3-47. Depth Camera D400 Series Product Identifier and Material Code .............................. 58

Table 4-1. Vendor ID and Device ID Table .............................................................................. 59

Table 4-2. Image Formats (USB 3.1 Gen1) ............................................................................. 59

Table 4-3. Image Formats (USB 3.1 Gen1) – D455 .................................................................. 60

Table 4-4. Simultaneous Image Streams (USB 3.1 Gen1 & USB2.0) ........................................... 62

Table 4-5. Depth Field of View ............................................................................................... 62

Table 4-6. Minimum-Z Depth ................................................................................................ 65

Table 4-7: Depth Quality Metric ............................................................................................. 65

Table 4-8: Depth Quality Metric Illustration ............................................................................. 66

Table 4-9. Depth Quality Specification .................................................................................... 66

Table 4-10. Depth Module Depth Start Point .......................................................................... 67

Table 4-11. Depth Cameras Depth Start Point ........................................................................ 68

Table 4-12. Depth Module X-Y Depth Origin Coordinates.......................................................... 69

Table 4-13. Depth Camera X-Y Depth Origin Coordinates ......................................................... 70

Table 4-14. Depth Camera Controls ....................................................................................... 70

Table 4-15. RGB Exposed Controls ......................................................................................... 71

Table 4-16. IMU Specifications .............................................................................................. 72

Table 7-1. USB 3.1 Gen 1 Receptacle Characteristics................................................................ 78

Table 7-2. USB 3.1 Gen 1 Receptacle Pin Out .......................................................................... 78

Table 7-3. USB 3.1 Gen 1 Plug Characteristics ......................................................................... 78

Table 7-4. Cable Assembly Specification ................................................................................. 79

Table 7-5. Motherboard Receptacle Properties ......................................................................... 80

Table 7-6. Vision Processor D4 Board as Embedded Peripheral Power Requirements .................... 80

Table 7-7. Vision Processor D4 Board – Component Power and TDP at Max Operating Mode

(1)

....... 81

Table 7-8. Stereo Depth Module (Standard) – Component Power and TDP at Max Operating Mode

(1)

..................................................................................................................... 81

Table 7-9. Stereo Depth Module (Wide) – Component Power and TDP at Max Operating Mode

(1)

.... 81

Table 7-10. Vision Processor D4 Board Components – Case Temperature Limits (Still Air) ............ 81

Table 7-11. Component Transmission ..................................................................................... 86

Table 7-12. Electrostatic Discharge Caution ............................................................................ 90

Table 8-1. Host Transmit – Vision Processor D4 Receive Routing Guidelines ................................ 93

Table 8-2. Vision Processor D4 Transmit - Host Receive Routing Guidelines ................................ 93

Table 8-3. Vision Processor D4 Transmit – Host Receive Routing Guidelines ................................ 94

Table 8-4. Stereo Depth Module Transmit - Vision Processor D4 Receive Routing Guidelines ........ 95

Table 8-5. USB 3.1 Gen 1 Host to Vision Processor D4 Routing Guidelines ................................. 97

Table 9-1. U.S. FDA Accession Number.................................................................................. 100

Table 12-1. Vision Processor D4 on Motherboard Schematic Checklist ....................................... 117

Table 12-2. Vision Processor D4 Decoupling and Filter Requirements ........................................ 126

Table 13-1. Example: Cover Material Parameters .................................................................... 127

Description and Features

337029-009 9

Revision History

Document Number

Revision Number

Description

Revision Date

337029

001

Initial release

January 2018

002

Tracking Module 1 removal, NRTL

certification, 7.2.2.1 Firmware Update

March 2018

003

• Added USB2.0 support

• Removed VBUS0 from Table 3 6.Vision

Processor D4 Power Requirements

• Table 3 12. Standard Left and Right

Imager Properties

• Table 3 13. Wide Left and Right

Imager Properties

• Table 3 9. Vision Processor D4 Storage

and Operating Conditions

• Table 3 27 Stereo Depth Module

Storage and Operating Conditions

• Table 3 38. Vision Processor D4 Board

Storage and Operating Conditions

• Table 3 44. Depth Camera D400 Series

Storage and Operating Conditions

• Table 4 3. Image Formats (USB 2.0)

• Table 4 5. Simultaneous Image

Streams (USB3.1 Gen1, USB 2.0)

• 4.7 Depth Origin Point (Ground Truth

Zero)

• 7.14 Multi-Camera hardware sync for

multi-camera configuration

July 2018

10 337029-009

Document Number

Revision Number

Description

Revision Date

004

• Description and Features

• Terminology

• Table 2-2. Depth Camera Product SKU

Descriptions

• Table 3-11. Stereo Depth Module SKU

Properties

• Table 3-33. Custom Flex Interposer

Ordering Logistics

• Table 3-35. External Sensor Sync

Connector Pin List

• Table 3-42. Depth Camera SKU

properties

• Table 3-47. Depth Camera D400 Series

Product Identifier and Material
Code

• Table 4-1. Vendor ID and Device ID

Table

• Table 4-2. Image Formats (USB 3.1

Gen1)

• Table 4-3. Image Formats (USB 2.0)

• Table 4-9. Depth Quality Specification

• Section 4-12 IMU Specification

November 2018

005

• Table 3-11. Stereo Depth Module SKU

Properties

• Table 3-42. Depth Camera SKU

Properties

• Table 4-4. Simultaneous Image

Streams (USB 3.1 Gen 1 & USB

2.0)

• Table 4-18. IMU Specifications

January 2019

006

• Table 3-28. Vision Processor D4 Board

• Table 4-2. Image Formats (USB 3.1

Gen1)

• Table 4-4. Simultaneous Image

Streams (USB 3.1 Gen1 & USB 2.0)

• Table 4-17. RGB Exposed Controls

• Figure 10-7. Intel® RealSense™ Depth

Camera D415

• Figure 10-8. Intel® RealSense™ Depth

Camera D435/D435i

• Figure 4-1. Depth Field of View to

Depth Map illustration

June 2019

Description and Features

337029-009 11

Document Number

Revision Number

Description

Revision Date

007

• Table 3-19. Stereo Depth Module

Label Fields

• Table 3 43. Intel® RealSense™ Depth

Camera D415 Mechanical
Dimensions

• Table 3 44. Intel® RealSense™ Depth

Camera D435, D435i Mechanical
Dimensions

• Table 4-9. Depth Quality Specification

• Section 7.6. Stereo Depth Module Flex

• Remove Table 7-11. Bracket Ordering

Logistics

October 2019

12 337029-009

Document Number

Revision Number

Description

Revision Date

008

• Support for Intel® RealSense™ Vision

Processor D4 Board V2 (IMU
version for MM#954010)

• Table 2-1. Depth Module Product SKU

Descriptions

• Table 3-9. Vision Processor D4 Storage

and Operating Conditions

• Table 3-15. Wide Infrared Projector

Parameters

• Table 3-27. Stereo Depth Module

Storage and Powered Conditions

• Table 3-37. Recommended USB Type C

cable Assemblies Ordering Logistics

• Table 3-40. Vision Processor D4 Board

Storage and Powered Conditions

• Table 3-41. Vision Processor D4 Board

Product Identifier and Material
Code

• Table 3-45. Depth Camera D400 Series

Storage and Powered Conditions

• Table 4-2. Image Formats (USB 3.1

Gen 1)

• Table 4-15. RGB Exposed Controls

• Table 4-16. IMU Specifications

• Table 7-10. Vision Processor D4 Board

Components – Case Temperature
Limits (Still Air)

• Table 13-1. Example: Cover Material

Parameters

• Section 1. Description and Features

• Section 3.6.7. Temperature Sensor

• Section 3.7.5. USB Peripheral

Connector – Type-C

• Section 3.8.2.2. Depth Camera D400

Series Thermal Solution Guidance

• Remove Table 4-3. Image Formats

(USB 2.0)

• Remove Section 4.8. Measured Power

April 2020

Description and Features

337029-009 13

Document Number

Revision Number

Description

Revision Date

009

• Section 1. Description and Features

• Section 3.8.4. Camera Lens Cleaning

Procedure

• Section 9. Regulatory Compliance

• Table 2-2. Depth Camera Product SKU

Descriptions

• Table 3-42. Depth Camera SKU

properties

• Table 3-45. Intel® RealSense™ Depth

Camera D455 Mechanical
Dimensions

• Table 3-47. Depth Camera D400 Series

Product Identifier and Material
Code

• Table 4-3. Image Formats (USB 3.1

Gen1) – D455

• Table 4-1. Vendor ID and Device ID

Table

• Table 4-4. Simultaneous Image

Streams (USB 3.1 Gen1 & USB2.0)

• Table 4-5. Depth Field of View

• Table 4-6. Minimum-Z Depth

• Table 4-9. Depth Quality Specification

• Table 4-13. Depth Camera X-Y Depth

Origin Coordinates

• Table 4-11. Depth Cameras Depth

Start Point

• Table 4-16. IMU Specifications

• Figure 3-15. Intel® RealSense™ Depth

Camera D455

• Figure 10-9. Intel® RealSense™ Depth

Camera D455

June 2020

§ §

Description and Features

Datasheet 14

1 Description and Features

Description

The Intel® RealSense

TM

D400 series is a stereo vision depth
camera system. The subsystem assembly contains stereo depth
module and vision processor with USB 2.0/USB 3.1 Gen 1 or
MIPI1 connection to host processor.

The small size and ease of integration of the camera sub system
provides system integrators flexibility to design into a wide
range of products.

The Intel® RealSenseTM D400 series also offers complete depth
cameras integrating vision processor, stereo depth module, RGB
sensor with color image signal processing and Inertial
Measurement Unit2 (IMU). The depth cameras are designed for
easy setup and portability making them ideal for makers,
educators, hardware prototypes and software development.

The Intel® RealSenseTM D400 series is supported with cross­platform and open source Intel® RealSense™ SDK 2.0

Usages/Markets

• Drones

• Robots

• Home and Surveillance

• Virtual Reality

• PC Peripherals

Minimum System Requirements

USB 2.0/USB 3.1 Gen 1
Ubuntu*16.xx/Windows*10

Intel® RealSense™ Depth Camera D415 Features

• Intel® RealSense™ Vision Processor D4

• Up to 1280x720 active stereo depth resolution

• Up to 1920x1080 RGB resolution

• Depth Diagonal Field of View over 70°

• Dual rolling shutter sensors for up to 90 FPS depth

streaming

• Range 0.3m to over 10m (Varies with lighting conditions)

Intel® RealSense™ Depth Camera D435/D435i Features

• Intel® RealSense™ Vision Processor D4

• Up to 1280x720 active stereo depth resolution

• Up to 1920x1080 RGB resolution

• Depth Diagonal Field of View over 90°

• Dual global shutter sensors for up to 90 FPS depth

streaming

• Range 0.2m to over 10m (Varies with lighting conditions)

• Intel® RealSense™ Depth Camera D435i includes Inertial

Measurement Unit (IMU) for 6 degrees of freedom (6DoF)
data

Intel® RealSense™ Depth Camera D455 Features

• Intel® RealSense™ Vision Processor D4

• Up to 1280x720 active stereo depth resolution

• Up to 1280x800 RGB resolution

• Diagonal Field of View over 90°

• Dual global shutter sensors for up to 90 FPS depth

streaming

• RGB global shutter sensor for up to 90 FPS

• Range 0.4m to over 10m (Varies with lighting conditions)

• Intel® RealSense™ Depth Camera D455 includes Inertial

Measurement Unit (IMU) for 6 degrees of freedom (6DoF)
data

Features

• 2nd Generation Stereo Depth Camera System

• 2nd Generation dedicated Intel® RealSense™ Vision

Processor D4 with advanced algorithms

• Infrared (IR) Laser Projector System (Class 1)

• Full HD resolution Image sensors

• Active Power Management

• Selection of Stereo Depth Module options to meet your

usage requirements

1. MIPI is not currently supported. Please contact your

Intel representative on MIPI enablement timelines.

2. Module and Camera SKU dependent

§ §

Introduction

337029-009 15

2 Introduction

2.1 Purpose and Scope of this Document

This document captures the specifications and the design–in details for the Intel®
RealSense™ D400 series family of products. This document provides information

necessary to understand and implement an Intel® RealSense™ D400 series based
camera system.

Note: Intel® RealSense™ D400 series is alternately referred as “D4 Camera System”
in this document. Intel® RealSense™ Vision Processor D4 is alternately referred as
“D4” in this document.

2.2 Terminology

Term

Description

6DOF

Six degrees of freedom (6DoF) refers to the freedom of movement of a rigid
body in three-dimensional space. Forward/back, up/down, left/right, pitch,
yaw, roll

Stereo Depth
Baseline

The distance between the center of the left and right imagers in a stereo
camera

MIPI CSI-2

The Camera Serial Interface (CSI) is a specification of the Mobile Industry
Processor Interface (MIPI) Alliance and CSI-2 is the 2nd generation
specification defining the interface between a camera and a host processor

Depth

Depth video streams are like color video streams except each pixel has a
value representing the distance away from the camera instead of color
information

D4 (DS5)

If the term D4 is used alone, it refers to the entire D4 camera system
consisting of various modules and components.

If the term D4 is used with an appropriate qualifier (i.e. D4 Vision Processor,
D4 Vision Processor Board), it refers to the specific module or component
within the D4 camera system.

FOV

Field Of View (FOV) describes the angular extent of a given scene that is
imaged by a camera. A camera's FOV can be measured horizontally,
vertically, or diagonally

Host System

Computer or SOC connected to D4 camera

I2C

I²C (Inter-Integrated Circuit), pronounced I-squared-C, is a multi-master,
multi-slave, single-ended, serial computer bus invented by Philips
Semiconductor (now NXP Semiconductors). It is typically used to allow easy
control and data communication between components.

IR Projector

This refers to the source of infrared (IR) light used for illuminating a scene,
object, or person to collect depth data.

Introduction

16 337029-009

Term

Description

Imagers

Depth camera system uses a pair of cameras referred as imagers to calculate
depth. They are identical cameras configured with identical settings.

Image Signal
Processor (ISP)

Image processing functions to enhance color image quality

Left imager

From the perspective of the stereo camera looking out at the world, the left
imager is on the left side of the camera module. Thus, when the user is
facing the D4 camera, the left imager is actually on the right side of the
camera module.

Lens

This refers to the optical component of an imager in the D4 camera. Its
purpose is to focus the incoming light rays onto the CMOS chip in the imager.

MIPI

MIPI (Mobile Industry Processor Interface) is a global, open membership
organization that develops interface specifications for the mobile ecosystem

Platform
camera

This refers to the two-dimensional (2D) color camera on platform

System On
Chip (SoC)

Integrated circuit (IC) that integrates all components of a computer

Stereo Depth
Module

This refers to a stiffened module containing at least two imagers. The
distance between the imagers, which is referred to as the baseline or
intraocular spacing, is typically in the range of 20 mm to 70 mm.

Stereo camera

This refers to a pair of imagers looking at the same subject from slightly
different perspectives. The difference in the perspectives is used to generate
a depth map by calculating a numeric value for the distance from the imagers
to every point in the scene.

SKU

Stock Keeping Unit (SKU) is a unique identifier for distinct products. It is
often used in the scope of naming different versions of a device

TBD

To Be Determined. In the context of this document, information will be
available in a later revision.

2.3 Stereo Vision Depth Technology Overview

The Intel® RealSense™ D400 series depth camera uses stereo vision to calculate
depth. The stereo vision implementation consists of a left imager, right imager, and an
optional infrared projector. The infrared projector projects non-visible static IR pattern
to improve depth accuracy in scenes with low texture. The left and right imagers
capture the scene and sends imager data to the depth imaging (vision) processor,
which calculates depth values for each pixel in the image by correlating points on the
left image to the right image and via shift between a point on the Left image and the
Right image. The depth pixel values are processed to generate a depth frame.
Subsequent depth frames create a depth video stream.

Introduction

337029-009 17

Figure 2-1. Active Infrared (IR) Stereo Vision Technology

Image

Sensors

IR Projector

1) Capture

2) Search

3) Depth

The depth pixel value is a measurement from the parallel plane of the imagers and not
the absolute range as illustrated.

Figure 2-2. Depth Measurement (Z) versus Range (R)

Introduction

18 337029-009

2.4 Camera System Block Diagram

The camera system has two main components, Vision processor D4 and Depth
module. The Vision processor D4 is either on the host processor motherboard or on a
discrete board with either USB2.0/USB 3.1 Gen1 or MIPI connection to the host
processor. The Depth module incorporates left and right imagers for stereo vision with
the optional IR projector and RGB color sensor. The RGB color sensor data is sent to
vision processor D4 via the color Image Signal Processor (ISP) on Host Processor
motherboard or D4 Board.

Figure 2-3. Vision Processor D4 Camera System Block Diagram

Introduction

337029-009 19

2.5 Intel

®

RealSense™ Depth Module D400 series

Product SKUs

Table below describes main components that make up the different depth module
SKUs

Table 2-1. Depth Module Product SKU Descriptions

Component

Subcomponent

D400

D410

D415

D420

D430

D450

Intel® RealSense™

Vision Processor D4

-

√ √ √ √ √

√

Intel® RealSense™

Vision Processor D4

Board

-

√ √ √ √ √

X

Intel® RealSense™

Vision Processor D4

Board V2 (IMU

Version)

-

X X X

X √ X

Intel® RealSense™

Vision Processor D4

Board V3 (IMU

Version)

-

X X X X X

√

Intel® RealSense™

Depth Module

Standard Stereo Imagers

√ √ √ X X X Wide Stereo Imagers

X X X √ √

√

Standard Infrared

Projector

X √ √ X X

X

Wide Infrared Projector

X X X X √

√

RGB color sensor

X X √ X X

√

D400 - Intel® RealSense™ Depth Module D400
D410 - Intel® RealSenseTM Depth Module D410
D415 - Intel® RealSenseTM Depth Module D415
D420 - Intel® RealSenseTM Depth Module D420
D430 - Intel® RealSenseTM Depth Module D430
D450 - Intel® RealSenseTM Depth Module D450

Introduction

20 337029-009

2.6 Intel

®

RealSense™ Depth Camera D400 series

Product SKUs

Table below describes main components that make up the different camera SKUs:

Table 2-2. Depth Camera Product SKU Descriptions

Component

Subcomponent

Intel®

RealSenseTM

Depth

Camera

D415

Intel®

RealSenseTM

Depth

Camera

D435

Intel®

RealSenseTM

Depth

Camera

D435i

Intel®

RealSenseTM

Depth

Camera

D455

Intel®

RealSense™

Vision

Processor D4

- √ √ √ √

Intel®

RealSense™

Depth

Module

Standard Stereo

Imagers

√ X X

X

Wide Stereo

Imagers

X √ √

√

Standard Infrared

Projector

√ X X

X

Wide Infrared

Projector

X √ √

√

RGB color sensor

√ √ √

√

Inertial
Measurement
Unit (IMU)

X X √

√

§ §

Component Specification

337029-009 21

3 Component Specification

3.1 Vision Processor D4 Camera System Components

Table 3-1. Component Descriptions

Component

Description

Host Processor

Host Processor that receives Depth and other data streams from Vision
Processor D4

Vision
Processor D4
(DS5 ASIC)

Depth Imaging Processor with USB 2.0/USB 3.1 Gen 1 or MIPI interface
connection to Host Processor
Clock

24MHz clock source for Vision Processor D4

Serial Flash
Memory

SPI 16Mb Serial Flash memory for firmware storage

Stereo Depth
Module

Camera module with left and Right Imager, Color Sensor†, IR projector†
enclosed in a stiffener

Power Delivery

Circuitry on motherboard/Vision processor D4 Board to deliver and manage
power to Vision Processor D4 and Stereo Depth Module.

Stereo Depth
Connector and
Interposer

50 pin connector on motherboard/Vision Processor D4 Board and Stereo
Depth module with interposer for connection

(†) SKU dependent

3.2 Host Processor

The host processor interface to Vision Processor D4 is either USB 2.0/USB 3.1 Gen 1
or MIPI. To ensure the best of quality of service, the Vision Processor D4 must be
connected to a dedicated USB 3.1 Gen 1 root port within the host processor system.

3.3 Intel

®

RealSense™ Vision Processor D4

The primary function of Vision Processor D4 is to perform depth stereo vision
processing. The Vision Processor D4 on Host Processor motherboard or on Vision
Processor D4 Board communicates to the host processor through USB2.0/USB 3.1 Gen
1 or MIPI and receives sensor data from stereo depth module. The Vision Processor
D4 supports MIPI CSI-2 channels for connection to image sensors.

3.3.1 Vision Processor D4 Features

• 28nm Process Technology.

Component Specification

22 337029-009

• 5 MIPI camera ports with each MIPI lane capable of handling data transfers of up

to 750 Mbps.

• USB2.0/USB 3.1 Gen 1 or MIPI interface to host system.

• Image rectification for camera optics and alignment compensation

• IR Projector (Laser) controls

• Serial Peripheral Interface for fast data transfer with external SPI flash.

• Integrated I2C ports

• General purpose Input Output pins

• Active power gating

3.3.2 Vision Processor D4 Signal Description

Table 3-2. Vision Processor D4 Signal Descriptions

RESERVED – Signal reserved for future usage

IO Type- Input Output Buffer type

A – Analog

I – Input

O - Output

Signal Name

Description

IO

Type

After

RESET

Host MIPI

H_DATAP0
H_DATAN0

Host MIPI Data Lane 0 Differential Pair

A

I

H_DATAP1
H_DATAN1

Host MIPI Data Lane 1 Differential Pair

A

I

H_DATAP2
H_DATAN2

Host MIPI Data Lane 2 Differential Pair

A

I

H_DATAP3
H_DATAN3

Host MIPI Data Lane 3 Differential Pair

A

I

H_CLKP
H_CLKN

Host MIPI Clock Differential Transmit Pair

A

I

H_SDA
H_SCL

Host I2C Bus Data and Clock

I/O

IO

H_REXT

Host MIPI External Reference 6.04K 1% resistor pull down
to ground)

A

I

Imager A MIPI

A_DATAP0
A_DATAN0

Imager A MIPI Data Lane 0 Differential Receive Pair

A

I

A_DATAP1
A_DATAN1

Imager A MIPI Data Lane 1 Differential Receive Pair

A

I

Component Specification

337029-009 23

Signal Name

Description

IO

Type

After

RESET

A_CLKP
A_CKLN

Imager A MIPI Clock Differential Receive Pair

A

I

A_SDA
A_SCL

Imager A I2C Bus Data and Clock

I/O

IO

A_RCLK

Imager A Reference Clock

I/O

O

A_PDOWN

(RESERVED) Imager A Power Down Signal

I/O

O

A_VSYNC

Imager A Vertical/Frame Sync

I/O

I

A_RESETN

Imager A Reset

I/O

O

A_REXT

Imager A MIPI External Reference (6.04K 1% resistor pull
down to ground)

A

I

Imager B MIPI

B_DATAP0
B_DATAN0

(RESERVED) Imager B MIPI Data Lane 0 Differential
Receive Pair

A

I

B_DATAP1
B_DATAN1

(RESERVED) Imager B MIPI Data Lane 1 Differential
Receive Pair

A

I

B_CLKP
B_CKLN

(RESERVED) Imager B MIPI Clock Differential Receive Pair

A

I

B_SDA
B_SCL

(RESERVED) Imager B I2C Bus Data and Clock

I/O

IO

B_RCLK

(RESERVED) Imager B Reference Clock

I/O

O

B_PDOWN

(RESERVED) Imager B Power Down

I/O

O

B_VSYNC

(RESERVED) Imager B Vertical/Frame Sync

I/O

I

B_RESETN

(RESERVED) Imager B Reset

I/O

O

B_REXT

Imager B MIPI External Reference (6.04K 1% resistor pull
down to ground)

A

I

Imager M MIPI

M_DATAP0
M_DATAN0

Imager M MIPI Data Lane 0 Differential Receive Pair

A

I

M_DATAP1
M_DATAN1

Imager M MIPI Data Lane 1 Differential Receive Pair

A

I

M_CLKP
M_CKLN

Imager M MIPI Clock Differential Receive Pair

A

I

M_SDA
M_SCL

Imager M I2C Bus Data and Clock

I/O

IO

M_RCLK

Imager M Reference Clock

I/O

O

M_PDOWN

(RESERVED) Imager M Power Down

I/O

O

M_VSYNC

Imager M Vertical/Frame Sync

I/O

I

Component Specification

24 337029-009

Signal Name

Description

IO

Type

After

RESET

M_RESETN

Imager M Reset

I/O

O

M_REXT

Imager M MIPI External Reference (6.04K 1% resistor pull
down to ground)

A

I

Imager Y MIPI

Y_DATAP0
Y_DATAN0

Imager Y MIPI Data Lane 0 Differential Receive Pair

A

I

Y_DATAP1
Y_DATAN1

Imager Y MIPI Data Lane 1 Differential Receive Pair

A

I

Y_CLKP
Y_CKLN

Imager Y MIPI Clock Differential Receive Pair

A

I

Y_SDA
Y_SCL

Imager Y I2C Bus Data and Clock

I/O

IO

Y_RCLK

Imager Y Reference Clock

I/O

O

Y_PDOWN

(RESERVED) Imager Y Power Down

I/O

O

Y_VSYNC

Imager Y Vertical/Frame Sync

I/O

I

Y_RESETN

Imager Y Reset

I/O

O

Y_REXT

Imager Y MIPI External Reference (6.04K 1% resistor pull
down to ground)

A

I

Imager Z MIPI

Z_DATAP0
Z_DATAN0

(RESERVED) Imager Z MIPI Data Lane 0 Differential
Receive Pair

A

I

Z_DATAP1
Z_DATAN1

(RESERVED) Imager Z MIPI Data Lane 1 Differential
Receive Pair

A

I

Z_CLKP
Z_CKLN

(RESERVED) Imager Z MIPI Clock differential Receive Pair

A

I

Z_SDA
Z_SCL

(RESERVED) Imager Z I2C Bus Data and Clock

I/O

IO

Z_RCLK

(RESERVED) Imager Z Reference Clock

I/O

O

Z_PDOWN

(RESERVED) Imager Z Power Down

I/O

O

Z_VSYNC

Depth Vertical/Frame Sync

I/O

O

Z_RESETN

(RESERVED) Imager Z Reset

I/O

O

Z_REXT

Imager Z MIPI External Reference (6.04K 1% resistor pull
down to ground)

A

I

Serial Peripheral Interconnect (SPI)

SPI_DI

SPI Data Input

I/O

I

SPI_DO

SPI Data Output

I/O

O

SPI_CLK

SPI Clock

O

O

Component Specification

337029-009 25

Signal Name

Description

IO

Type

After

RESET

SPI_CS

SPI Chip Select

O

O

SPI_WP

Flash Write Protect

O

O

General Purpose Input Output (GPIO)

GPIO[0]

(RESERVED) Not Defined

I/O

I

GPIO[1]

(RESERVED) Not Defined

I/O

I

GPIO[2]

Laser PWM – Controls Laser Power for IR projector on
Stereo Module

I/O

O

GPIO[3]

(RESERVED) Not Defined

I/O

I

GPIO[4]

(RESERVED) Not Defined

I/O

I

GPIO[5]

(RESERVED) Not Defined

I/O

I

GPIO[6]

(RESERVED) Not Defined

I/O

I

GPIO[7]

(RESERVED) Not Defined

I/O

I/O

EGPIO[0]

(RESERVED) Not Defined

I/O

I/O

EGPIO[1]

(RESERVED) Not Defined

I/O

I/O

EGPIO[2]

(RESERVED) Not Defined

I/O

I/O

EGPIO[3]

Laser_PWRDN - IR projector Power Down Signal

I/O

O

EGPIO[4]

(RESERVED) Not Defined

I/O

I/O

EGPIO[5]

FLAGB – IR Projector Fault Detect

I/O

I

EGPIO[6]

(RESERVED) Not Defined

I/O

I/O

EGPIO[7]

(RESERVED) Not Defined

I/O

I/O

EGPIO[8]

ISP_FCS (Color ISP)

I/O

O

EGPIO[9]

(RESERVED) Not Defined

I/O

I/O

EGPIO[10]

(RESERVED) Not Defined

I/O

I/O

EGPIO[11]

(RESERVED) Not Defined

I/O

I/O

EGPIO[12]

(RESERVED) Not Defined

I/O

I/O

EGPIO[13]

(RESERVED) - For Intel test purpose only

I/O

I/O

Miscellaneous

LD_ON_OUT_XX

(RESERVED) Laser Enable

O

O

MODSTROB

(RESERVED) Modulation current strobe

O

O

MODSIGN

(RESERVED) Modulation current sign

O

O

LD_ERR

Laser Error (Active High)

I

I

CLKXI

24MHz XTAL

I

I

CLKXO

24MHz XTAL

I

I

PRSTN

D4 Reset

I

I

CW_CSR_PRSTn

Hardware reset without debug port reset

I/O

I

Component Specification

26 337029-009

Signal Name

Description

IO

Type

After

RESET

PMU_PWR_EN

Switchable domain (VDD_PG) power control signal

I/O

O

DFU

Dynamic FW update, used for FW recovery

I/O

I

ISP_SCL
ISP_SDA

I2C Bus Data and Clock

I/O

IO

VQPSQ

(RESERVED) – For Intel test purpose only

O

O

VQPSM

(RESERVED) – For Intel test purpose only

O

O

REFPADCLKP

(RESERVED) – For Intel test purpose only

I

I

REFPADCLKM

(RESERVED) – For Intel test purpose only

I

I

JTAG

TDI

Test Data Input

I/O

I

TDO

Test Data Output

I/O

O

TCLK

Test Clock Input

I/O

I

TMS

Test Mode Select

I/O

I

TRSTN

Test Reset

I/O

I

USB

USB_RXP

USB 3.1 Gen 1 receive, positive side

A

I

USB_RXN

USB 3.1 Gen 1 receive, negative side

A

I

USB_TXP

USB 3.1 Gen 1 Transmit, positive side

A

O

USB_TXN

USB 3.1 Gen 1 Transmit, negative side

A

O

USB_DP

USB 2.0 D+ line

A

IO

USB_DN

USB 2.0 D- line

A

IO

USB_ID

Mini-receptacle identifier and test point

USB_RESREF

Reference Resistor input. 200 Ohm 1%

A

I

Power and Ground

VDD

0.9V (Core Voltage)

Power

VDD_PG

0.9V (Switched Core Voltage)

Power

USB_DVDD

0.9V (USB Core Voltage)

Power

VPTX0

0.9V (USB Core Voltage)

Power

VP

0.9V (USB Core Voltage)

Power

*_AVDD

1.8V (MIPI Core and IO Voltage)

Power

VDDPLL

0.9V (PLL Voltage)

Power

VDDTS

1.8V (Temperature Sensor Voltage)

Power

VDDPST18

1.8V (IO Voltage)

Power

USB_VDD330

3.3V (USB Core Voltage)

Power

Component Specification

337029-009 27

Signal Name

Description

IO

Type

After

RESET

VBUS0

3.3V (VBUS power monitor)

Power

VSS

Ground

GND

*_AGND

Ground

GND

Table 3-3. Hardware Straps

Pin

Boot
Load

HW/FW

Description

EPGPIO0

No

FW

USB connection type:
0: Peripheral (default)

1: Integrated

EGPIO4

Yes

HW

SPI Interface:
0: SPI on “Z”
1: SPI connected (default)

EPGPIO7

Yes

FW

Flash
00: 64Mbit
01: 8Mbit
10: 16 Mbit (default)
11: 32 Mbit

EPGPIO8

EPGPIO9

No

FW

Host interface:

0: USB (default)
1: MIPI

EPGPIO10

No

FW

Board version [0] (default: 0)

EPGPIO11

No

FW

Board version [1] (default: 0)

EPGPIO12

No

FW

Board version [2] (default: 0)

DFU

Yes

HW

Go to DFU
0: Disabled (default)
1: Go to DFU mode (Recovery)

NOTES:

• Boot Load – Read during Boot

• Hardware (HW) Strap – External hardware pin state directly configures D4 functionality

• Firmware (FW) Strap – External hardware pin state is read by firmware and firmware

configures D4 functionality

3.3.3 Vision Processor D4 Package Mechanical Attributes

Table below provides an overview of the mechanical attributes of the package.

Component Specification

28 337029-009

Table 3-4. Vision Processor D4 Package Mechanical Attributes

Pin

Boot Load

HW/FW

Package Technology

Package Type

FlipChip CSP (Chip Scale Package)

Interconnect

Ball Grid Array (BGA) Ball

Lead Free

Yes

Halogenated Flame Retardant Free

Yes

Package Configuration

Solder Ball Composition

SAC125Ni

Ball/Pin Count

225 solder balls

Grid Array Pattern

15 x 15

Package Dimensions

Nominal Package Size (mm)

6.40 x 6.40

Min Ball/Pin pitch (mm)

0.42

Weight ~1 gm

Component Specification

337029-009 29

Figure 3-1. Vision Processor D4 Package Drawing

Component Specification

30 337029-009

Figure 3-2. Vision Processor D4 Ball-out

A B C D E F G H J K L M N P R

15

VSS

Y_DATAN0

Y_REXT Y_SCL GPIO_0 GPIO_1 GPIO_5 GPIO_6

MODSTROB

TMS TRSTN SPI_WPN SPI_MISO

CW_CSR_RSTN

VSS

15

14

Y_CLKN Y_CLKP

Y_DATAP0

Y_RCLK Y_SDA

Y_RESETN

GPIO_2 GPIO_3

MODSIGN

TCLK TDO SPI_CLK SPI_MOSI

Z_RESETN

Z_VSYNC

14

13

Y_DATAN1 Y_DATAP1

VSS VSS

Y_PDOWN

Y_VSYNC GPIO_4 GPIO_7 LD_ERR

LD_ON_OUT_XX

TDI SPI_CS Z_SDA

Z_DATAP0

Z_RCLK

13

12

B_DATAN0

B_SCL B_SDA Y_AVDD V SS VSS

VDDPST18_LEFT

VSS VSS

VDDPST18_LEFT

VSS VSS Z_SCL Z_CLKP

Z_DATAN0

12

11

B_CLKN

B_DATAP0

B_REXT VSS VSS VSS V DD VDD V DD VSS VS S Z_AVDD

Z_PDOWN Z_DATAP1

Z_CLKN

11

10

B_DATAN1

B_CLKP

B_RESETN

B_AVDD VDD_PG VDD_PG V DD_PG V DD VDD VDD_PG VDD_PG ISP _SCL Z_REXT

M_DATAP1 Z_DATAN1

10

9

H_DATAN3 B_DATAP1 B_PDOWN

VSS V DD_PG VDD_PG VDD_PG VSS VSS VDD_PG VDD_PG VSS ISP_SDA M_CLKP

M_DATAN1

9

8

H_DATAN2 H_DATAP3

B_VSYNC VSS VSS VDD_PG VDD_PG VSS VSS VSS VSS VSS V SS

M_DATAP0

M_CLKN

8

7

H_CLKN

H_DATAP2

B_RCLK H_AVDD V SS VSS V SS VSS V SS VDD_PG V DD_PG M_AVDD

M_RESETN M_PDOWN M_DATAN 0

7

6

H_DATAN1

H_CLKP H_AVDD

REFPADCLKP REFPADCLKM

VSS VDD V DD VSS VDD_PG VDD_PG M_REXT

M_VSYNC

M_SDA M_RCLK

6

5

H_DATAN0 H_DATAP1

H_REXT VP USB_ID VDD VDD VDD VSS VSS VSS V SS VSS

A_DATAP1

M_SCL

5

4

H_SCL

H_DATAP0

USB_VDD330

VPTX0

USB_RESREF

USB_DVDD

VSS VSS

VDDPST18_RIGHT

VSS VSS A_AVDD A_REXT A_CLKP

A_DATAN1

4

3

USB_RXN H_SDA PRSTN USB_DP EGPIO_1 EGPIO_11 VDDTS VSSTS

VDDPST18_RIGHT

PMU_PWR_EN

VQPSQ VQPSM

A_PDOWN A_DATAP0

A_CLKN

3

2

USB_TXN USB_RXP DFU USB_DN EGPIO_9 EGPIO_13 VDDPLL VSSPLL EGPIO_5 EGPIO_12 EGPIO_3 EGPIO_4 A _SCL A_RCLK

A_DATAN0

2

1

VSS USB_TXP VBUS0 EGPIO_6 EGPIO_7 EGPIO_8 CLK_XIN

CLK_XOUT

EGPIO_10 EGPIO_2 EGPIO_0 A _VSYNC A_SDA

A_RESETN

VSS

1

A B C D E F G H J K L M N P R

Table 3-5. Vision Processor D4 Ball-out by Signal Name

Ball

Name

Ball

Name

Ball

Name

A01

H_AGND

B01

USB_TXP

C01

VBUS0

A02

USB_TXN

B02

USB_RXP

C02

DFU

A03

USB_RXN

B03

H_SDA

C03

PRSTN

A04

H_SCL

B04

H_DATAP0

C04

USB_VDD330

A05

H_DATAN0

B05

H_DATAP1

C05

H_REXT

A06

H_DATAN1

B06

H_CLKP

C06

H_AVDD

A07

H_CLKN

B07

H_DATAP2

C07

B_RCLK

Component Specification

337029-009 31

Ball

Name

Ball

Name

Ball

Name

A08

H_DATAN2

B08

H_DATAP3

C08

B_VSYNC

A09

H_DATAN3

B09

B_DATAP1

C09

B_PDOWN

A10

B_DATAN1

B10

B_CLKP

C10

B_RESETN

A11

B_CLKN

B11

B_DATAP0

C11

B_REXT

A12

B_DATAN0

B12

B_SCL

C12

B_SDA

A13

Y_DATAN1

B13

Y_DATAP1

C13

Y_AGND

A14

Y_CLKN

B14

Y_CLKP

C14

Y_DATAP0

A15

Y_AGND

B15

Y_DATAN0

C15

Y_REXT

D01

EGPIO_6

E01

EGPIO_7

F01

EGPIO_8

D02

USB_DN

E02

EGPIO_9

F02

EGPIO_13

D03

USB_DP

E03

EGPIO_1

F03

EGPIO_11

D04

VPTX0

E04

USB_RESREF

F04

USB_DVDD

D05

VP

E05

USB_ID

F05

VDD

D06

REFPADCLKP

E06

REFPADCLKM

F06

VSS

D07

H_AVDD

E07

H_AGND

F07

VSS

D08

B_AGND

E08

VSS

F08

VDD_PG

D09

B_AGND

E09

VDD_PG

F09

VDD_PG

D10

B_AVDD

E10

VDD_PG

F10

VDD_PG

D11

VSS

E11

VSS

F11

VSS

D12

Y_AVDD

E12

VSS

F12

VSS

D13

VSS

E13

Y_PDOWN

F13

Y_VSYNC

D14

Y_RCLK

E14

Y_SDA

F14

Y_RESETN

D15

Y_SCL

E15

GPIO_0

F15

GPIO_1

G01

CLK_XIN

H01

CLK_XOUT

J01

EGPIO_10

G02

VDDPLL

H02

VSSPLL

J02

EGPIO_5

G03

VDDTS

H03

VSSTS

J03

VDDPST18_RIGHT

G04

VSS

H04

VSS

J04

VDDPST18_RIGHT

G05

VDD

H05

VDD

J05

VSS

G06

VDD

H06

VDD

J06

VSS

G07

VSS

H07

VSS

J07

VSS

G08

VDD_PG

H08

VSS

J08

VSS

G09

VDD_PG

H09

VSS

J09

VSS

G10

VDD_PG

H10

VDD

J10

VDD

G11

VDD

H11

VDD

J11

VDD

G12

VDDPST18_LEFT

H12

VSS

J12

VSS

Component Specification

32 337029-009

Ball

Name

Ball

Name

Ball

Name

G13

GPIO_4

H13

GPIO_7

J13

LD_ERR

G14

GPIO_2

H14

GPIO_3

J14

MODSIGN

G15

GPIO_5

H15

GPIO_6

J15

MODSTROB

K01

EGPIO_2

L01

EGPIO_0

M01

A_VSYNC

K02

EGPIO_12

L02

EGPIO_3

M02

EGPIO_4

K03

PMU_PWR_EN

L03

VQPSQ

M03

VQPSM

K04

VSS

L04

VSS

M04

A_AVDD

K05

VSS

L05

VSS

M05

VSS

K06

VDD_PG

L06

VDD_PG

M06

M_REXT

K07

VDD_PG

L07

VDD_PG

M07

M_AVDD

K08

VSS

L08

VSS

M08

M_AGND

K09

VDD_PG

L09

VDD_PG

M09

M_AGND

K10

VDD_PG

L10

VDD_PG

M10

ISP_SCL

K11

VSS

L11

VSS

M11

Z_AVDD

K12

VDDPST18_LEFT

L12

VSS

M12

VSS

K13

LD_ON_OUT_XX

L13

TDI

M13

SPI_CS

K14

TCLK

L14

TDO

M14

SPI_CLK

K15

TMS

L15

TRSTN

M15

SPI_WPN

N01

A_SDA

P01

A_RESETN

R01

A_AGND

N02

A_SCL

P02

A_RCLK

R02

A_DATAN0

N03

A_PDOWN

P03

A_DATAP0

R03

A_CLKN

N04

A_REXT

P04

A_CLKP

R04

A_DATAN1

N05

A_AGND

P05

A_DATAP1

R05

M_SCL

N06

M_VSYNC

P06

M_SDA

R06

M_RCLK

N07

M_RESETN

P07

M_PDOWN

R07

M_DATAN0

N08

VSS

P08

M_DATAP0

R08

M_CLKN

N09

ISP_SDA

P09

M_CLKP

R09

M_DATAN1

N10

Z_REXT

P10

M_DATAP1

R10

Z_DATAN1

N11

Z_PDOWN

P11

Z_DATAP1

R11

Z_CLKN

N12

Z_SCL

P12

Z_CLKP

R12

Z_DATAN0

N13

Z_SDA

P13

Z_DATAP0

R13

Z_RCLK

N14

SPI_MOSI

P14

Z_RESETN

R14

Z_VSYNC

N15

SPI_MISO

P15

CW_CSR_RSTN

R15

Z_AGND

Component Specification

337029-009 33

3.3.4 Vision Processor D4 Power Requirements

The Vision Processor D4 requires the following power supplies for operation.

Table 3-6. Vision Processor D4 Power Requirements

Voltage Ball Name

Min.

(V)

Nominal

(V)

Max.

(V)

Peak Current

(Icc)

VDD

0.85

0.9

0.95

0.4A

VDD_PG

0.85

0.9

0.95

1.6A

USB_DVDD

0.81

0.9

0.99

0.2A

VPTX0

0.81

0.9

0.99

0.2A

VP

0.81

0.9

0.99

0.2A

*AVDD

1.71

1.8

1.89

0.2A

VDDPLL

0.85

0.9

0.95

0.2A

VDDTS

1.71

1.8

1.89

0.2A

VDDPST18 (Left and

Right)

1.71

1.8

1.89

0.2A

USB_VDD330

3.13

3.3

3.46

0.2A

3.3.5 Vision Processor D4 Power Sequencing

The timing requirement for power sequencing is listed below and shown in the
following figure.

• Hold Vision Processor D4 in reset

• Ramp up power in the 3.3V

• Ramp up power in the 0.9V

• Ramp up power in the 1.8V

• Release Vision Processor D4 Reset

Table 3-7. Vision Processor D4 Power Sequencing Timing Parameters

Parameter

Value

Units

Label

0.9V stable to 3.3V stable

>=50

us

T1

PMU_PWR_EN to 0.9V Stable

>=50

us

T2

1.8V stable to 0.9V Stable

>=50

us

T3

PRSTN (D4 RESET) assertion to 1.8V stable

15

us

T4

Component Specification

34 337029-009

Figure 3-3. Vision Processor D4 Power Sequencing

Note: Vision Processor D4 has no specific power down sequence requirement.

3.3.6 Vision Processor D4 Spec Code

The spec code is an identification mark printed on Vision Processor D4.

Table 3-8. Vision Processor D4 SPEC Code

Vision Processor D4

SPEC CODE

Production (Shipped in Tape and Reel)

SLLY5

Production (Shipped in Tray)

SLM6B

3.3.7 Vision Processor D4 Storage and Operating Conditions

Table 3-9. Vision Processor D4 Storage and Operating Conditions

Condition

Description

Min

Max

Unit

Storage (Still Air), Not
Operating

Temperature (Sustained,
Controlled)

(1)

0

85 oC

Component Specification

337029-009 35

Temperature (Short
Exposure)

(2)

-40

85 oC

Humidity

Temperature/ RH: 40oC / 90%

Operating, Component
Case Temperature

(3)

Temperature

0

85 oC

NOTE:

(1) Controlled conditions should be used for long term storage of product.
(2) Short exposure represents temporary max limits acceptable for transportation conditions.

(3) Component case temperature limits must be met during operation.

3.3.8 Vision Processor D4 Thermals

The thermal design should be such that Vision Processor D4 does not exceed
component case temperature limit. Care must also be taken to make sure that the
Vision Processor D4 heat is not transferred to other components of the imaging
system or stereo depth module. It will be best to thermally isolate Vision Processor D4
from the stereo depth module.

3.4 Clock

Vision Processor D4 requires a single 24 MHz clock oscillator. All clocks required by
stereo depth module are generated by Vision Processor D4.

3.5 Serial (SPI) Flash Memory

Vision Processor D4 requires 16Mbit Serial Flash Memory for its firmware storage. The
recommended part number is IS25WP016 (www.issi.com) or equivalent

3.6 Stereo Depth Module

The stereo depth module components are described in Table 3-10. The stereo depth
printed circuit board and components are encapsulated in a common metal stiffener.

Table 3-10. Stereo Depth Module

Component

Description

Left and Right Imagers

2 HD image sensors

Infrared (IR) Projector

Class 1 laser compliant (optional)

Color Sensor

1080p RGB image sensor (optional)

Depth Module Connector

50 pin connector plug

Privacy LED

Indicator when stereo module is streaming data (optional)

Stiffener

Reinforcement housing to keep imagers aligned

Label

Manufacture and product identifier information

Component Specification

36 337029-009

Other Components

Laser Driver, EEPROM, Voltage Regulators, etc.

Figure 3-4. Stereo Depth Module (Intel® RealSense™ Depth Module D410)

Right

Imager

Left

Imager

IR

Projector

Camera

Connector

Module

Label

Figure 3-5. Stereo Depth Module (Intel® RealSense™ Depth Module D430)

Right Imager Left ImagerIR Projector

Camera

Connector

Module Label

Table 3-11. Stereo Depth Module SKU Properties

Stereo Module

Intel®

RealSense™

Depth Module

D400

Intel®

RealSense™

Depth Module

D410

Intel®

RealSense™

Depth Module

D415

Intel®

RealSense™

Depth Module

D420

Intel®

RealSense™

Depth Module

D430

Baseline

55mm

55mm

55mm

50mm

50mm

Left/Right

Imagers Type

Standard

Standard

Standard

Wide

Wide

Depth FOV HD

(degrees)

H:65±2 /

V:40±1 /

D:72±2

H:65±2 /

V:40±1 /

D:72±2

H:65±2 /

V:40±1 /

D:72±2

H:87±3 /

V:58±1 /

D:95±3

H:87±3 /

V:58±1 /

D:95±3

Depth FOV VGA

(degrees)

H:50±2 /

V:40±1 /

D:61±2

H:50±2 /

V:40±1 /

D:61±2

H:50±2 /

V:40±1 /

D:61±2

H:75±3 /

V:62±1 /

D:89±3

H:75±3 /

V:62±1 /

D:89±3

IR Projector

-

Standard

Standard

-

Wide

IR Projector FOV

-

H:67 / V:41 /

D:75

H:67 / V:41 /

D:75

-

H:90 / V:63 /

D:99

Color Sensor

-

-

OV2740

-

-

Color Camera

FOV

-

-

H:69±1/

V:42±1 /

D:77±1

-

-

Component Specification

337029-009 37

Module

Dimensions

(mm)

X=74.7mm

Y=10mm

Z=4.7mm

X=74.7mm

Y=10mm

Z=4.7mm

X=83.7mm

Y=10mm

Z=4.7mm

X=70.7mm

Y=14mm

Z=10.53mm

X=70.7mm

Y=14mm

Z=10.53mm

NOTE:

• H – Horizontal FOV, V – Vertical FOV, D – Diagonal FOV, X – Length, Y – Breadth, Z –

Thickness

• Depth FOV specified at 2 meters

• Due to mechanical tolerances of +/-5%, Max and Min FOV values can vary from lens to

lens and module to module by ~ +/- 3 degrees.

3.6.1 Left and Right Imagers

The stereo depth module has two camera sensors referred here as imagers, they are
identical parts and are configured with identical settings. The imagers are labeled
“left” and “right” from the perspective of the camera module looking outward. The
stereo imager pairs are referred as Standard or Wide based on imager field of view.

Table 3-12. Standard Left and Right Imager Properties

Parameter

Camera Sensor Properties

Image Sensor

OmniVision OV2740

Active Pixels

1920 × 1080

Sensor Aspect Ratio

16:9

Format

10-bit RAW

F Number

f/2.0

Focal Length

1.88mm

Filter Type

IR Cut – D400, None – D410, D415, Camera D415

Focus

Fixed

Shutter Type

Rolling Shutter

Signal Interface

MIPI CSI-2, 2X Lanes

Horizontal Field of View

69.4o

Vertical Field of View

42.5o

Diagonal Field of View

77o

Distortion

<=1.5%

Table 3-13. Wide Left and Right Imager Properties

Parameter

Camera Sensor Properties

Image Sensor

OmniVision OV9282

Active Pixels

1280 X 800

Sensor Aspect Ratio

8:5

Component Specification

38 337029-009

Parameter

Camera Sensor Properties

Format

10-bit RAW

F Number

f/2.0

Focal Length

1.93mm

Filter Type

IR Cut – D420, None – D430, D435/D435i

Focus

Fixed

Shutter Type

Global Shutter

Signal Interface

MIPI CSI-2, 2X Lanes

Horizontal Field of View

91.2o

Vertical Field of View

65.5o

Diagonal Field of View

100.6o

Distortion

<=1.5%

3.6.2 Infrared Projector

The infrared projector improves the ability of the stereo camera system to determine
depth by projecting a static infrared pattern on the scene to increase texture on low
texture scenes. The infrared projector meets class 1 laser safety under normal
operation. The power delivery and laser safety circuits are on the stereo depth
module. The infrared projector is referred as Standard or Wide based on field of
projection.

Table 3-14. Standard Infrared Projector Parameters

Parameter

Properties

Projector

Infrared

Pattern Type

Static

Illuminating Component

Vertical-cavity surface-emitting laser (VCSEL) + Optics

Laser Controller

PWM

Optical Power

360mW average, 440mW peak

Laser Wavelength

850nm ± 10 nm nominal @ 20°C

Laser Compliance

Class 1, IEC 60825-1:2007 Edition 2, IEC 60825-1:2014
Edition 3

Horizontal Field of Projection

64°±3°

Vertical Field of Projection

41°±3°

Diagonal Field of Projection

72°±3°

Table 3-15. Wide Infrared Projector Parameters

Parameter

Properties

Projector

Infrared

Component Specification

337029-009 39

Parameter

Properties

Pattern Type

Static

Illuminating Component

Vertical-cavity surface-emitting laser (VCSEL) + optics

Laser Controller

PWM

Optical Power

360mW average, 4.25W peak

Laser Wavelength

850nm ± 10 nm nominal @ 20°C

Laser Compliance

Class 1, IEC 60825-1:2007 Edition 2, IEC 60825-1:2014
Edition 3

Horizontal Field of Projection

90°±3°

Vertical Field of Projection

63°±3°

Diagonal Field of Projection

99°±3°

3.6.3 Color Sensor

The color sensor on the stereo depth module in addition to color image provides
texture information. Usages for the texture information include overlay on a depth
image to create a color point cloud and overlay on a 3d model for reconstruction.

Table 3-16. Color Sensor Properties

Parameter

Camera Sensor Properties

Image Sensor

OmniVision OV2740

Color Image Signal Processor

Discrete

Active Pixels

1920 X 1080

Sensor Aspect Ratio

16:9

Format

10-bit RAW RGB

F Number

f/2.0

Focal Length

1.88mm

Filter Type

IR Cut Filter

Focus

Fixed

Shutter Type

Rolling Shutter

Signal Interface

MIPI CSI-2, 1 Lane

Horizontal Field of View

69.4o

Vertical Field of View

42.5o

Diagonal Field of View

77o

Distortion

<=1.5%

Component Specification

40 337029-009

3.6.4 Depth Module Connector

The depth module connector provides signal and power interface to the stereo depth
module. The connector on stereo depth module is a 50-pin connector plug.

Table 3-17. Depth Module 50-pin Connector Plug Details

Parmeter

Description

Diagram

Number of Contacts

50

Product Name

NOVASTACK 35-P

Plug Assembly

Part Number

20708-050E

Manufacturer Website

www.i-pex.com

3.6.5 Stereo Depth Module Label

Table 3-18. Stereo Depth Module Product Labeling

For illustration purpose only, subject to

change

Dimension

Value

Unit

A

Label Width

17

mm

B

Label Height

6.9

mm

C

Scan Code Width

5

mm

D

Scan Code
Height

5

mm

Scan Code Format

XXXXXXXXXXXXOOOOOOXXXXXX-XXX

Table 3-19. Stereo Depth Module Label Fields

Group

Field

Description

Type

Company

Intel

Manufacturer

Static

Model Number

RealSenseTM Camera
4XX

Camera Model Number

Static

Product Assembly
Number

XXXXXX

Product Identifier Code

Static

-XXX

Manufacture Configuration
Code

Dynamic
OOOOOO

Product Material Code

Static

Serial Number

XXXXXXXXXXXX

Manufacture Unit Code

Dynamic

Component Specification

337029-009 41

Note: Product Material Code (MM code) within the QR code on the label of the device will
read “000000”. The QR code MM code will be zero.

Table 3-20. Intel® RealSense™ Depth Module D400 Series Product Identifier Code and

Product Material Code

Production

Product Identifier Code-

Manufacture Configuration Code

Product Material Code

Depth Module D400

J32082-100

951934

Depth Module D410

J32106-100

951913

Depth Module D415

J32114-100

952000

Depth Module D420

J51355-100

956826

Depth Module D430

J42086-100

954010

3.6.6 Stiffener

The stiffener maintains the precise alignment of the camera sensors and assists in
subassembly rigidity. The stiffener consists of a bottom and a top plate. The stiffener
is of stainless steel grade AISI 304.

3.6.7 Temperature Sensor

The stereo depth module is equipped with a thermal sensor that is used for laser
safety control (IR Projector). The Intel® RealSense™ SDK 2.0 library provides access
to the thermal sensor readouts. Temperature information does not reflect the
ambient temperature of the module.

3.6.8 Other Stereo Depth Module Components

Table 3-21. Other Stereo Depth Module Components

Component

Description

Laser (IR
Projector) Driver

The depth module implements a laser driver which controls the infrared
laser within the infrared projector system.

Laser (IR
projector)
Thermal Control

The depth module implements a laser safety control circuit that adjusts
laser drive output. When laser power and depth streaming is enabled and if
stereo depth module temperature is >60°C, laser power is halved. If
temperature is not lowered below temperature limit within a certain
interval, the laser is shut off.

EEPROM

The depth module implements flash memory for storing the calibration data.

Fork/Screw Mount

Secure placement and mounting to system/chassis/heat sink

Component Specification

42 337029-009

Voltage
Regulators

The stereo depth module implements DC to DC voltage converters

3.6.9 Mechanical Dimensions

Table 3-22. Intel® RealSense™ Depth Module D400 Mechanical Dimensions

Dimension

Min

Nominal

Max

Unit

Width

74.5

74.7

74.9

mm

Height

9.8

10

10.2

mm

Depth

4.5

4.7

4.9

mm

Flatness Tolerance

-

0.2

-

mm

Weight

6.5

7.2

8

gr

Table 3-23. Intel® RealSense™ Depth Module D410 Mechanical Dimensions

Dimension

Min

Nominal

Max

Unit

Width

74.5

74.7

74.9

mm

Height

9.8

10

10.2

mm

Depth

4.5

4.7

4.9

mm

Flatness Tolerance

-

0.2

-

mm

Weight

7.3

8.1

8.9

gr

Table 3-24. Intel® RealSense™ Depth Module D415 Mechanical Dimensions

Dimension

Min

Nominal

Max

Unit

Width

89.5

89.7

89.9

mm

Height

9.8

10

10.2

mm

Depth

4.5

4.7

4.9

mm

Flatness Tolerance

TBD

mm

Weight

TBD

gr

Table 3-25. Intel® RealSense™ Depth Module D420 Mechanical Dimensions

Dimension

Min

Nominal

Max

Unit

Width

70.5

70.7

70.9

mm

Height

13.8

14

14.2

mm

Depth

10.33

10.53

10.73

mm

Flatness Tolerance

-

0.2

-

mm

Weight

TBD

gr

Component Specification

337029-009 43

Table 3-26. Intel® RealSense™ Depth Module D430 Mechanical Dimensions

Dimension

Min

Nominal

Max

Unit

Width

70.5

70.7

70.9

mm

Height

13.8

14

14.2

mm

Depth

10.33

10.53

10.73

mm

Flatness Tolerance

-

0.2

-

mm

Weight

13

14.5

16

gr

3.6.10 Stereo Depth Module Power Sequence

Figure 3-6. Stereo Depth Module Power Sequence

3.3V

1.8V

3.6.11 Stereo Depth Module Storage and Powered Conditions

Table 3-27. Stereo Depth Module Storage and Powered Conditions

Condition

Description

Min

Max

Unit

Storage (Ambient), Not
Powered

Temperature (Sustained,
Controlled)

(1)

0

50 oC

Temperature (Short
Exposure)

(2)

-40

70 oC

Humidity

Temperature/ RH: 40oC / 90%

Case Temperature,
Powered

(3)(4)(5)

Temperature

0

50 oC

NOTE:

(1) Controlled conditions should be used for long term storage of product.
(2) Short exposure represents temporary max limits acceptable for transportation conditions.
(3) Case temperature limits must be met for all temperatures when powered.
(4) Case temperature is specified for the overall depth module

(5) Case temperature 0° minimum and lower temperatures is non-condensing

Component Specification

44 337029-009

3.7 Intel

®

RealSense™ Vision Processor D4 Board

The Vision Processor D4 Board enables an easy and quick option for system
integrators to integrate Vision Processor D4 into a system.

Table 3-28. Vision Processor D4 Board

Type

Description

USB Peripheral
Type-C

Connects to Host USB 3.1 Gen 1 port through USB Type-C connector and
cable

Note: When connecting to host system, connect Type-C connection to
the camera prior to connecting device to host system port.

Table 3-29. Vision Processor D4 Board Components

Components

Description

Vision Processor D4

Stereo Depth Processing ASIC

16Mb Serial Flash

Vision Processor D4 firmware storage

24MHz Crystal

Clock source for Vision Processor D4

Realtek* ISP with external serial flash

Color image signal processor

Depth Module Receptacle

50 pin receptacle for connection to Stereo Depth
Module

USB Type-C

USB peripheral connector for connection to Host
USB 2.0/USB 3.1 Gen 1 port

External Sensor Sync Connector

Interface to external sensor interrupts/sync signals

Voltage Regulators

DC to DC converters powering Vision Processor D4
Board and stereo depth module.

Mounting holes

Vision Processor D4 Board secure mounting

Figure 3-7. Vision Processor D4 Board (USB Peripheral Type-C)

Depth Module

Receptacle

External Sensor
Sync Connector

USB Type-C

Connector

Vision Processor D4

Component Specification

337029-009 45

3.7.1 Mechanical Dimensions

Table 3-30. Vision Processor D4 USB Type-C Board Mechanical Dimensions

Dimension

Min

Nominal

Max

Unit

Width

72.2

72.4

72.6

mm

Height

15.8

16

16.2

mm

Depth

3.74

3.94

4.14

mm

Weight

3.56

3.96

4.36

gr

3.7.2 Depth Module Receptacle

The Vision Processor D4 Board interface to stereo depth module is through 50 pin
receptacle on the board.

Table 3-31. Depth Module Receptacle Details

Parameter

Description

Diagram

Number of Contacts

50

Product Name

NOVASTACK* 35-P

Receptacle Assembly

Part Number

20709-050E

Manufacturer Website

www.i-pex.com

3.7.3 Flex and Rigid Interposer Interconnect

The high speed interposer at one end has the 50 pin depth module receptacle to
connect into 50 pin depth module plug on stereo depth module and at the other end
has the 50 pin depth module plug to connect into 50 pin depth module receptacle on
Vision Processor D4 Board. The high speed flex Interposer is custom developed and
procured by system integrator.

Component Specification

46 337029-009

Figure 3-8. Flex Interposer (Illustration)

Figure 3-9. Rigid Interposer (Illustration)

Component Specification

337029-009 47

Figure 3-10. Depth Module Receptacle and Plug Connector Pin Position

Table 3-32. Interposer Interconnect Signal Description

Position

ASIC Board/

Motherboard

Depth Module

Interconnect Description

1

RGB_RSTN_N

RGB_RSTN_N

RGB Sensor Reset

2

GND

GND

Ground

3

RGB_XCL

RGB_XCL

RGB Sensor Clock

4

RGB_MDP0

RGB_MDP0

RGB Sensor MIPI Data Lane 0 differential pair positive

5

GND

GND

Ground

6

RGB_MDN0

RGB_MDN0

RGB Sensor MIPI Data Lane 0 differential pair
negative

Component Specification

48 337029-009

Position

ASIC Board/

Motherboard

Depth Module

Interconnect Description

7

RGB_FSYNC

RGB_FSYNC

RGB Sensor Sync

8

GND

GND

Ground

9

RGB_STROBE

RGB_STROBE

RGB Sensor Strobe

10

RGB_MCP

RGB_MCP

RGB Sensor MIPI Clock differential pair positive

11

RGB_SDA

RGB_SDA

RGB Sensor I2C Bus Data

12

RGB_MCN

RGB_MCN

RGB Sensor MIPI Clock differential pair negative

13

RGB_SCL

RGB_SCL

RGB Sensor I2C Bus Clock

14

GND

GND

Ground

15

GND

GND

Ground

16

MDP0_L

MDP0_L

Left Imager MIPI Data Lane 0 differential pair positive

17

VDD18V

VDD18V

1.8V Power

18

MDN0_L

MDN0_L

Left Imager MIPI Data Lane 0 differential pair
negative

19

VDD18V

VDD18V

1.8V Power

20

GND

GND

Ground

21

LED_PSY

LED_PSY

Privacy LED control signal

22

MCP_L

MCP_L

Left Imager MIPI Clock differential pair positive

23

DVSYNC

DVSYNC

VSYNC

24

MCN_L

MCN_L

Left Imager MIPI Clock differential pair negative

25

NC

NC

No Connect

26

GND

GND

Ground

27

XVCLK_L

XVCLK_L

Clock to Left Imager

28

MDP1_L

MDP1_L

Left Imager MIPI Data Lane 1 differential pair positive

29

GND

GND

Ground

30

MDN1_L

MDN1_L

Left Imager MIPI Data Lane 1 differential pair
negative

31

ST_RST_N

ST_RST_N

Reset signal to Left and Right Imager

32

GND

GND

Ground

33

FF_RSTn

FF_RSTn

Laser Error

34

MDP0_R

MDP0_R

Right Imager MIPI Data Lane 0 differential pair
positive

35

GND

GND

Ground

36

MDN0_R

MDN0_R

Right Imager MIPI Data Lane 0 differential pair
negative

37

XVCLK_R

XVCLK_R

Clock to Right Imager

38

GND

GND

Ground

Component Specification

337029-009 49

Position

ASIC Board/

Motherboard

Depth Module

Interconnect Description

39

I2C_SCL

I2C_SCL

I2C Bus Clock

40

MCP_R

MCP_R

Right Imager MIPI Clock differential pair positive

41

I2C_SDA

I2C_SDA

I2C Bus Data

42

MCN_R

MCN_R

Right Imager MIPI Clock differential pair negative

43

LASER_PWM

LASER_PWM

IR Projector Control Signal

44

GND

GND

Ground

45

LASER_PWRDN

LASER_PWRDN

IR Projector Power Down

46

MDP1_R

MDP1_R

Right Imager MIPI Data Lane 1 differential pair
positive

47

LASER_PWM1

LASER_PWM1

IR Projector Control Signal

48

MDN1_R

MDN1_R

Right Imager MIPI Data Lane 1 differential pair
negative

49

FLAGB

FLAGB

IR Projector Fault Detect

50

GND

GND

Ground

51

GND

GND

Ground

52

VDD33V

VDD33V

3.3V power

Figure 3-11. Depth Module Connector Orientation and Pin Position

-

Vision Processor D4 Card

Stereo Depth Module

Pin Position 1

Pin Position 50

Pin Position 50

P/N 20709-050E

P/N 20708-050E

Pin Position 1

Table 3-33. Custom Flex Interposer Ordering Logistics

Vendor

Sales Contact

COCOM CONSUMER
ELECTRONICS LTD.

Janine Langdale
email: [e-mail]
(O) [phone]

Component Specification

50 337029-009

(M) [phone]

3.7.4 External Sensor Sync Connector

The external sensor connector provides the interface for external sensors to
synchronize to depth output.

Table 3-34. External Sensor Connector Details

Parameter

Description

Diagram

Number of Contacts

9

Product Name

9 Positions Header,

Shrouded Connector

Part Number

SM09B-SRSS-

TB(LF)(SN)

Manufacturer Website

www.jst-mfg.com

Table 3-35. External Sensor Sync Connector Pin List

Pin

Signal

Function

Description

1

GPIO3

GVSYNC0

Not Defined

2

GPIO4

GVSYNC1

IR Projector Power Down signal

3

GPIO5

GVSYNC2

External IR Projector Fault Detect

4

GPIO6

GVSYNC3

External IR Projector

5

Z_VSYNC

VSYNC

Depth VSYNC

6

LASER_PWM0

LASER PWM0

Laser control signal

7

LASER_PWM1

LASER PWM1

Laser control signal

8

VDD33V

Power

3.3V

9

GND

Ground

Ground

3.7.5 USB Peripheral Connector – Type-C

USB Type-C connector consists of 24 signal pins designed in a symmetrical way. The
connector z height is as low as 3mm and enables enhanced user experience by
allowing the USB Type-C plug to be plugged into a receptacle either right side up or
upside down. Interoperability between USB Type-C and legacy USB is possible through
standard legacy cable assemblies defined in USB Type-C Cable and Connector
specification.

Component Specification

337029-009 51

Recommend using a certified USB Type-C cable and connector for use with Intel®
RealSense™ Camera D400 Series products.

Figure 3-12. USB Type-C Receptacle Pin Map

Table 3-36. USB Peripheral Connector Pin List

Pin

Signal

Function

Description

A1

GND

Power Delivery

Ground

A2

TX1+

USB 3.1 Gen 1 Data

First SuperSpeed TX Differential Pair Positive

A3

TX1-

USB 3.1 Gen 1 Data

First SuperSpeed TX Differential Pair Negative

A4

VBUS

Power Delivery

5V

A5

CC1

Control

Configuration Channel 1

A6

D+

USB2.0 Data

USB 2.0 differential pair positive

A7

D-

USB2.0 Data

USB 2.0 differential pair negative

A8

SBU1

Sideband

Sideband Use Signal 1

A9

VBUS

Power Delivery

5V

A10

RX2-

USB 3.1 Gen 1 Data

Second SuperSpeed RX Differential Pair Negative

A11

RX2+

USB 3.1 Gen 1 Data

Second SuperSpeed RX Differential Pair Positive

A12

GND

Power Delivery

Ground

B1

GND

Power Delivery

Ground

B2

TX2+

USB 3.1 Gen 1 Data

Second SuperSpeed TX Differential Pair Positive

B3

TX2-

USB 3.1 Gen 1 Data

Second SuperSpeed TX Differential Pair Negative

B4

VBUS

Power Delivery

5V

B5

CC2

Control

Configuration Channel 2

B6

D+

USB 2.0 Data

USB 2.0 differential pair positive

B7

D-

USB 2.0 Data

USB 2.0 differential pair negative

B8

SBU2

Sideband

Sideband Use Signal 2

B9

VBUS

Power Delivery

5V

B10

RX1-

USB 3.1 Gen 1.0 Data

First SuperSpeed RX Differential Pair Negative

B11

RX1+

USB 3.1 Gen 1.0 Data

First SuperSpeed RX Differential Pair Positive

B12

GND

Power Delivery

Ground

Component Specification

52 337029-009

Table 3-37. Recommended USB Type C cable Assemblies Ordering Logistics

Vendor

Website/Part Number

Newnex Technology Corp.

http://www.newnex.com/realsense-3d-camera-connectivity.php

3.7.6 Color Image Signal Processor (ISP)

The color sensor data is sent to discrete Image Signal Processor (ISP) on the Vision
processor D4 Board for image adjustments, image scaling and processing functions to
help compensate for inherent inaccuracy in lens and sensor in providing a better
image quality. The processed color image is sent to the Vision Processor D4.

Table 3-38. ISP Properties

Parameter

ISP Properties

ISP Part Number on Vision Processor D4 Board

RTS5845

1M-bit Serial Flash for ISP

Winbond* W25X10CL or equivalent

Interface To Vision Processor D4

MIPI CSI-2, 2X Lanes

Interface To RGB Sensor

MIPI CSI-2, 1X Lane

3.7.7 Vision Processor D4 Board Power Requirements

The Vision Processor D4 Board is powered through VBUS power of the USB connector.
The Vision Processor D4 Board in turn power sources the stereo depth module.

Table 3-39. Vision Processor D4 Board Power Requirements

Parameter

Min

Nom

Max

Unit

VCC

Supply Voltage

4.75

5V

5.25V

V

ICC

Supply Current

700

mA

Supply Voltage Ramp Rate

0.5 5

ms

3.7.8 Vision Processor D4 Board Thermals

The Vision Processor D4 Board should be screw mounted on to a heat sink or a heat
dissipating structure element using screw forks on Board. Thermal conductive tape
(electrically non-conductive) should cover the entire back side area (non-component
side) of the ASIC Board for thermal transfer onto heat sink or heat dissipating
structure element.

Component Specification

337029-009 53

3.7.9 Vision Processor D4 Board Storage and Powered

Conditions

Table 3-40. Vision Processor D4 Board Storage and Powered Conditions

Condition

Description

Min

Max

Unit

Storage (Ambient), Not Powered

Temperature
(Sustained,
Controlled)

(1)

0

50 oC

Temperature
(Short
Exposure)

(2)

-40

70 oC

Humidity

Temperature/ RH: 40oC / 90%

Case Temperature, Powered

(3)(4)(5)

Temperature

0

50 oC

NOTE:

(1) Controlled conditions should be used for long term storage of product.
(2) Short exposure represents temporary max limits acceptable for transportation conditions.
(3) Case temperature limits must be met for all temperatures when powered.
(4) Case temperature is specified for the overall Vision Processor D4 Board
(5) Case temperature 0° minimum and lower temperatures is non-condensing

Component Specification

54 337029-009

3.7.10 Intel

®

RealSense™ Vision Processor D4 Board Product

Identifier and Material Code

Table 3-41. Vision Processor D4 Board Product Identifier and Material Code

Production

Product Identifier

Code-Manufacture

Configuration Code

Product Material Code

Vision Processor D4 Board

(1)

J32139-120

952019

Vision Processor D4 Board V2

(2)

K38178-100

999AFP

Vision Processor D4 Board V3

(3)

K94249-100

99A2NX

NOTE:

(1) The V1 ASIC (without IMU) is validated and supports all D400 depth modules.
(2) The V2 ASIC is intended for the D430 Module (Product Material Code #954010). Full

validation has been done on this combination. Support will be limited to D430 with the
V2 ASIC.

(3) The V3 ASIC is intended for the D450 Module. Full validation has been done on this

combination.

3.8 Intel

®

RealSense™ Depth Camera D400 Series

Figure 3-13. Intel® RealSenseTM Depth Camera D415

Figure 3-14. Intel® RealSense™ Depth Camera D435/D435i

Component Specification

337029-009 55

Figure 3-15. Intel® RealSense™ Depth Camera D455

Table 3-42. Depth Camera SKU properties

D400 series Depth

Cameras

Intel® RealSense™

Depth Camera

D415

Intel® RealSense™

Depth Camera

D435

Intel® RealSense™

Depth Camera

D435i

Intel® RealSense™

Depth Camera

D455

Depth module

Intel® RealSense™

Depth module D415

Intel® RealSense™

Depth module D430

Intel® RealSense™

Depth module D430

Intel® RealSense™

Depth module D450

Baseline

55mm

50mm

50mm

95mm

Left/Right Imagers

Type

Standard

Wide

Wide

Wide

Depth FOV HD

(degrees)

H:65±2 / V:40±1 /

D:72±2

H:87±3 / V:58±1 /

D:95±3

H:87±3 / V:58±1 /

D:95±3

H:87±3 / V:58±1 /

D:95±3

Depth FOV VGA

(degrees)

H:50±2 / V:40±1 /

D:61±2

H:75±3 / V:62±1 /

D:89±3

H:75±3 / V:62±1 /

D:89±3

H:75±3 / V:62±1 /

D:89±3

IR Projector

Standard

Wide

Wide

Wide

IR Projector FOV

H:67 / V:41 / D:75

H:90 / V:63 / D:99

H:90 / V:63 / D:99

H:90 / V:63 / D:99

Color Sensor

OV2740

OV2740

OV2740

OV9782

Color Camera FOV

H:69±1 /V:42±1

/D:77±1

H:69±1 /V:42±1

/D:77±1

H:69±1 /V:42±1

/D:77±1

H:87±3 /V:58±1

/D:95±3

IMU

NA

NA

6DoF

6DoF

NOTE: H – Horizontal FOV, V – Vertical FOV, D – Diagonal FOV, X – Length, Y – Breadth, Z –
Thickness

3.8.1 Depth Camera D400 Series Mechanical Dimensions

Table 3-43. Intel® RealSense™ Depth Camera D415 Mechanical Dimensions

Dimension

Min

Nominal

Max

Unit

Width

98.85

99

99.15

mm

Height

22.85

23

23.15

mm

Component Specification

56 337029-009

Depth

19.85

20

20.15

mm

Weight

68.4

72

75.6

gr

Flatness Tolerance

-

0.15

-

mm

Table 3-44. Intel® RealSense™ Depth Camera D435, D435i Mechanical Dimensions

Dimension

Min

Nominal

Max

Unit

Width

89.85

90

90.15

mm

Height

24.85

25

25.15

mm

Depth

24.85

25

25.15

mm

Weight

68.4

72

75.6

gr

Flatness Tolerance

-

0.15

-

mm

Table 3-45. Intel® RealSense™ Depth Camera D455 Mechanical Dimensions

Dimension

Min

Nominal

Max

Unit

Width

123.5

124

124.5

mm

Height

28.5

29

29.5

mm

Depth

25.5

26

26.5

mm

Weight

gr

Flatness Tolerance

-

0.2

-

mm

3.8.2 Depth Camera D400 Series Thermals

3.8.2.1 Depth Camera D400 Series Storage and Powered Conditions

Table 3-46. Depth Camera D400 Series Storage and Powered Conditions

Condition

Description

Min

Max

Unit

Storage (Ambient), Not
Powered

Temperature (Sustained,
Controlled)

(1)

0

50 oC

Temperature (Short
Exposure)

(2)

-40

70 oC

Humidity

Temperature/ RH: 40oC / 90%

Ambient, Powered

(3)(4)

Temperature

0

35 oC

Backside Case
Temperature, Powered

Temperature

0

44 oC

NOTE:

(1) Controlled conditions should be used for long term storage of product.
(2) Short exposure represents temporary max limits acceptable for transportation conditions

Component Specification

337029-009 57

(3) The camera ambient temperature when powered, 0 oC to 35 oC is the validated range in which

Intel® qualified the camera. This range is a standard range in which Intel® qualifies consumer
products. The camera internal thermal solution was designed to keep the internal components at
or below their max powered temperatures. As stated in Table 3-21, the projector temperature
and the projector’s operation below 60 oC is critical to the use of the projector for camera
operations (use of projector can be determined by application developer based on necessity in

usage model). The Intel® RealSense™ Depth Camera D400 Series camera can function above the

35 oC max ambient temperature when powered with degradation in performance and no
guarantee of the camera meeting the depth quality metric

(4) Ambient means environment while the camera is attached to a tripod using the camera’s tripod

screw attachment and is not connected to any mechanical or thermal material

3.8.2.2 Depth Camera D400 Series Thermal Solution Guidance

The Intel® RealSense™ Depth Camera D400 Series camera thermal solution was

designed taking into account the necessary thermal and mechanical aspects that goes
into producing a standalone peripheral camera. Those aspects include the
temperatures for all of the components associated with the module (projector, vision
processor, IMU and camera sensors) when powered.

The Intel® RealSense™ SDK 2.0 (https://github.com/IntelRealSense/librealsense)
provides temperature sensor readout based on Intel® RealSense™ camera

capabilities. The readouts should be used as a reference/guide, but not to be used as
a replacement for thermal solutions that comply with the temperatures of the camera.
If monitoring the temperature of the cameras is necessary due to thermal concern, it
is recommended to monitor librealsense temperature readouts from the application
level and act upon the temperatures if within < 5 oC of the max temperatures when
powered of the component temperatures that the SDK makes available.

In order to aid in development of thermal solution and heat dissipation, the
recommendations below provide some guidance to system integrators.

Recommendations to improve heat dissipation on the D400 Series Depth Cameras

Passive Cooling Recommendations:

• Mounting Bracket Material – Utilize mounting screws (2xM3 screws) and

material that is the same or similar in nature (equal or lower thermal
resistance or high conductivity) as the peripheral housing that the D400 Series
depth cameras are made out of. Material – Aluminum 6000 series.

• Increased Mating Surface – Mounting bracket mating surface with D400 series

depth camera can be increased by a factor of 2x. The larger the mounting
bracket mating surface to the depth camera the better.

o Reduction of mating surface imperfections, defects, roughness and

gaps is recommended. Any increase in defects in the material can
increase the thermal contact resistance reducing effectiveness of heat
dissipation of the thermal solution. Attachment options should
comprise of epoxy compounds or thermal tape/paste.

• Heat Sink – The addition of a heat sink can also improve heat dissipation from

the D400 series depth camera. Use of a material such as Aluminum 6000

Component Specification

58 337029-009

series or similar with equal or lower thermal resistance to the mating surface
is recommended.

Active Cooling Recommendations:

• While heat pipes and liquid cooling solutions offer great advantages, they also

increase the complexity of system integration substantially. The use of a fan
with direct air flow to the depth camera (back mounting surface 2xM3 screws)
is preferable.

3.8.3 Depth Camera D400 Series Product Identifier and Material

Code

Table 3-47. Depth Camera D400 Series Product Identifier and Material Code

Production

Product Identifier Code-

Manufacture Configuration

Code

Product Material

Code

Depth Camera D415

J72476-100

961443

Depth Camera D415 (Multi Pack)

J72476-100

962304

Depth Camera D435

J72479-100

961448

Depth Camera D435 (Multi Pack)

J72479-100

962305

Depth Camera D435i

K38179-100

999AFR

Depth Camera D435i (Multi Pack)

K38179-100

999AXG

Depth Camera D455

K83122-100

999WCT

Depth Camera D455 (Multi Pack)

K83122-100

999WCR

3.8.4 Camera Lens Cleaning Procedure

1. Do not use any chemical or water on the camera lens

2. Remove dust and dirt as much as possible from the lens with a lens blower

brush.

3. Wipe with a dry, clean micro-fiber cloth.

§§

Functional Specification

337029-009 59

4 Functional Specification

4.1 Vendor Identification (VID) and Device

Identification (DID)

Table 4-1. Vendor ID and Device ID Table

Depth Module/Depth Camera

Vendor ID

Device ID

Intel® RealSense™ Depth Module D400

8086

0x0AD1

Intel® RealSense™ Depth Module D410

8086

0x0AD2

Intel® RealSense™ Depth Module D415

8086

0x0AD3

Intel® RealSense™ Depth Camera D415

8086

0x0AD3

Intel® RealSense™ Depth Module D420

8086

0x0AF6

Intel® RealSense™ Depth Module D430

8086

0x0AD4

Intel® RealSense™ Depth Camera D435

8086

0x0B07

Intel® RealSense™ Depth Camera D435i

8086

0x0B3A

Intel® RealSense™ Depth Camera D455

8086

0x0B5C

4.2 Vision Processor D4 Data Streams

Intel® RealSense™ Vision Processor D4 Depth imaging system provides high quality
depth data to a host system. The depth data is generated with stereo vision
technology that is optionally assisted by an infrared projector. The imaging system
has the ability to syncronize with color stream.

Table 4-2. Image Formats (USB 3.1 Gen1)

Format

Resolution

Frame Rate

(FPS)

Comment

Z [16 bits]

1280x720

6,15,30

Depth

848X480

6,15,30,60,90

640x480

6,15,30,60,90

640x360

6,15,30,60,90

480x270

6,15,30,60,90

424x240

6,15,30,60,90

Y8 [8 bits]

1280x720

6,15,30

Luminance

Functional Specification

60 337029-009

Format

Resolution

Frame Rate

(FPS)

Comment

848X480

6,15,30,60,90

Left and Right Imager

640x480

6,15,30,60,90

640x360

6,15,30,60,90

480x270

6,15,30,60,90

424x240

6,15,30,60,90

UYVY [16 bits]

1280x720

6,15,30

Color Stream from Left Imager

(D400, D410 & D415)

848X480

6,15,30,60,90

640x480

6,15,30,60,90

640x360

6,15,30,60,90

480x270

6,15,30,60,90

424x240

6,15,30,60,90

YUY2 [16 bits]

1920x1080

6,15,30

Color Stream from RGB camera

(Camera D415 & D435/D435i)

1280x720

6,15,30

960x540

6,15,30,60

848x480

6,15,30,60

640x480

6,15,30,60

640x360

6,15,30,60

424x240

6,15,30,60

320x240

6,30,60

320x180

6,30,60

Calibration [24 bits]

1920x1080

15,25

D400/D410/D415

1280x800

15,25

D420/D430/D435/D435i

Intel® RealSense™

Self-Calibration

256x144

90

Intel® RealSense™ Self-

Calibration and Tare format

(D400 Series)

NOTE:

1. Depth and Color are mapped as separated interfaces. Each one of the interfaces is

working independent with the other interface (Virtual channel in MIPI and End Point in
USB).

2. To ensure USB 3.1 support, connect D400 series USB connector first prior to connecting

depth device to host system port.

3. USB 2.0 supports a subset of the resolution/frame rate given the bandwidth

requirements. Please refer to firmware release notes as part of firmware releases -

https://dev.intelrealsense.com/docs/firmware-releases

Table 4-3. Image Formats (USB 3.1 Gen1) – D455

Format

Resolution

Frame Rate (FPS)

Comment

Z [16 bits]

1280x720

5,15,30

Depth

Functional Specification

337029-009 61

Format

Resolution

Frame Rate (FPS)

Comment

848X480

5,15,30,60,90

640x480

5,15,30,60,90

640x360

5,15,30,60,90

480x270

5,15,30,60,90

424x240

5,15,30,60,90

Y8 [8 bits]

1280x720

5,15,30

Luminance

Left and Right Imager

848X480

5,15,30,60,90

640x480

5,15,30,60,90

640x360

5,15,30,60,90

480x270

5,15,30,60,90

424x240

5,15,30,60,90

UYVY [16 bits]

1280x720

5,15,30

Color Stream from Left

Imager

848X480

5,15,30,60,90

640x480

5,15,30,60,90

640x360

5,15,30,60,90

480x270

5,15,30,60,90

424x240

5,15,30,60,90

YUY2 [16 bits]

1280x800

5,15,30

Color Stream from RGB

camera

Calibration uses 1280x720

15,30 FPS

848x480

5,15,30,60

640x480

5,15,30,60

640x360

5,15,30,60,90

480x270

5,15,30,60,90

424x240

5,15,30,60,90

Calibration IR

Imager Y12I

[24 bits]

1280x800

15,25

Intel®

RealSense™

Self-

Calibration

256x144

90

Intel® RealSense™ Self-

Calibration and Tare

format

NOTE:

1. Depth and Color are mapped as separated interfaces. Each one of the interfaces is

working independent with the other interface (Virtual channel in MIPI and End Point in
USB).

2. To ensure USB 3.1 support, connect D400 series USB connector first prior to connecting

depth device to host system port.

3. USB 2.0 supports a subset of the resolution/frame rate given the bandwidth

requirements. Please refer to firmware release notes as part of firmware releases -

https://dev.intelrealsense.com/docs/firmware-releases

Functional Specification

62 337029-009

Table 4-4. Simultaneous Image Streams (USB 3.1 Gen1 & USB2.0)

Depth

Imager

Color

(Left

Imager)

D400/D410

Color
(RGB

Camera)

D415/D435/D435i/D455

IMU

D435i/D455
Comment

Z16

Y8

Gyro &

Accelerometer

Z16 UYVY

Gyro &

Accelerometer

Z16

Y8

YUV2

Gyro &
Accelerometer

Z16

YUV2

Gyro &

Accelerometer

NOTE:

1. RGB to depth hardware sync is only supported with the same frame rate for all streams.

2. For Depth and RGB camera simultaneous streaming, it is recommended to have color

resolution to be the same or higher than depth resolution.

3. USB 3.1 Gen1 supports all resolution/frame rate combinations in a typical dedicated USB port

configuration. On a USB hub with other devices (e.g. other RealSense cameras),
considerations regarding bandwidth requirements have to be taken. To ensure USB 3.1
support, connect D400 series USB connector first prior to connecting depth device to host
system port.

4. USB 2.0 supports a subset of the resolution/frame rate combinations given the bandwidth

requirements. Please refer to firmware release notes as part of firmware releases -

https://dev.intelrealsense.com/docs/firmware-releases

4.3 Depth Field of View (FOV)

The depth field of view is the common overlap of the individual left and right Imager
field of view for which Vision Processor D4 provides depth data

Table 4-5. Depth Field of View

Format

D400/D410/D415

D420/D430/D435/D435i/D455

Horizontal FOV (VGA 4:3)

48

74

Vertical FOV (VGA 4:3)

40

62

Diagonal FOV (4:3)

60

88

Horizontal FOV (HD 16:9)

64

86

Vertical FOV (HD 16:9)

41

57

Diagonal FOV (HD 16:9)

72

94

NOTE:

• Due to mechanical tolerances of +/-5%, Max and Min FOV values can vary from lens to

lens and module to module by ~ +/- 3 degrees.

Functional Specification

337029-009 63

• The Depth FOV specified is at 2 meters distance.

4.4 Depth Field of View at Distance (Z)

Depth Field of View (Depth FOV) at any distance (Z) can be calculated using the
equation

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



󰇝









 󰇞

Depth FOV = Depth Field of View

HFOV = Horizontal Field of View of Left Imager on Depth Module

B = Baseline

Z = Distance of Scene from Depth Module

Figure 4-1. Depth Field of View to Depth Map illustration

NOTES:

• As the scene distance from the depth module increases, the invalid depth band decreases

in the overall depth image. Overall depth image is invalid depth band plus valid depth
map.

Functional Specification

64 337029-009

4.5 Invalid Depth Band

The depth data generated with stereo vision uses the left imager as the reference for
stereo matching resulting in a non-overlap region in the field of view of left and right
imagers where we will not have depth data at the left edge of the frame. Closer
scenes result in a wider invalid depth band than scenes at larger distances.

Figure 4-2. Left Invalid Depth Band

The width of the invalid depth band can be calculated using the following equations:

In terms of horizontal FOV

󰇛

󰇜

 󰇛    󰇛





󰇜󰇜

󰇛󰇜   

In terms of focal length

󰇛

󰇜

   󰇛  󰇜

󰇛󰇜   

B= Baseline

Z= Distance of Scene from Depth Module

F= Focal length

HFOV= Horizontal Field of View of Left Imager on Depth Module

Functional Specification

337029-009 65

HRES= Horizontal Resolution

The equations stand valid for a base configuration of camera settings. Default camera
configuration in firmware may have settings optimized for depth performance that
may impact the actual width of invalid depth band when compared to the calculated
width of the invalid depth band from equations.

4.6 Minimum-Z Depth

The Minimum-Z Depth is the minimum distance from depth camera to scene for which
Vision Processor D4 provides depth data.

Table 4-6. Minimum-Z Depth

Resolution

D400/D410/D415

D420/D430

D450

Min-Z (mm)

Min-Z (mm)

Min-Z (mm)

1280x720

450

280

520

848X480

310

195

350

640x480

310

175

320

640x360

240

150

260

480x270

180

120

200

424x240

160

105

180

4.7 Depth Quality Specification

There are a set of standard metrics based on accuracy, data validity, and temporal
stability are used to quantify depth quality.

Although the module is designed for a certain depth FOV, the measurements are
taken within 80% of this FOV, defined as region of interest (ROI). This ROI will best
align with intended usage area and the optical parameters qualification field.

Table 4-7: Depth Quality Metric

METRIC

DEFINITION

(1)

Depth Accuracy

Measure the difference for valid pixels relative to a ground truth surface.

Fill Rate

Percentage of pixels that have a valid depth value.

Depth Standard Deviation

Measures the total spatial noise for each valid pixel relative to a best fit plane.

Pixel Temporal Noise

Measures the total temporal noise for each valid pixel relative to a best fit plane.

NOTES:

(1) Each measurement is taken from a predefined region of interest (ROI) which is within 80% of the depth

field of view (FOV).

Functional Specification

66 337029-009

Table 4-8: Depth Quality Metric Illustration

DEPTH ACCURACY AND DEPTH RMS ERROR

FILL RATE

Table 4-9. Depth Quality Specification

Metric

D400/D410/D415

(up to 2 Meters and

80% ROI, HD

Resolution)

D420/D430/D435/

D435i

(up to 2 Meters and

80% ROI, HD

Resolution)

D455

(up to 4 Meters and

80% ROI, HD

Resolution)

Z-accuracy (or absolute
error)

≤ 2%

≤ 2%

≤ 2%

Fill rate

≥ 99%

≥ 99%

≥ 99%

RMS Error (or Spatial
Noise)

≤ 2%

≤ 2%

≤ 2%

Temporal Noise

≤ 1%

≤ 1%

≤ 1%

NOTES:

1) The Depth Quality spec applies to depth modules that have been completely

integrated in overall system and has successfully completed the OEM calibration
process.

2) For Depth Quality metric definitions and test methodology, refer to white paper

“Intel® RealSense™ Camera Depth Testing Methodology”

3) Laser Power:

a) D410/D415/D430/D435/D435i - 150mW, Exposure: Auto Exposure

Functional Specification

337029-009 67

b) D455 – 360mW, Exposure: Auto Exposure

4.8 Depth Start Point (Ground Zero Reference)

The depth start point or the ground zero reference can be described as the starting
point or plane where depth = 0. For depth modules (D400, D410 & D415), this point
is referenced from front of lens or from backside of module. For depth cameras (D415,
D435/D435i, D455), this point is referenced from front of camera cover glass

Figure 4-3. Depth Module Depth Start Point Reference

Depth Start

Point

Front of Lens

Depth (Z)

Z”

D410 (Depth Module Side View)

Scene

Back of
Module

Z’

Table 4-10. Depth Module Depth Start Point

Depth Module

Front of Lens (Z’)

Back of Module (Z”)

D400/D410/D415

-0.1mm

4.3mm

D420/D430

-3.2mm

7.5mm

D450

-0.1mm

4.3mm

NOTES:

If depth measurement reference is front of lens, then |Z’| should be added to measured
value to determine Ground Truth. If depth measurement reference is back of module, then
|Z”| should be subtracted to determine Ground Truth.

Functional Specification

68 337029-009

Figure 4-4. Depth Camera Depth Start Point Reference

Depth Start

Point

Front Cover
Glass

Depth (Z)

Z’

D435 (Depth Camera Side View)

Scene

Table 4-11. Depth Cameras Depth Start Point

Depth Camera

Camera Front Glass (Z’)

D415

-1.1mm

D435/D435i

-4.2mm

D455

-4.55mm

NOTES:

If depth measurement reference is front cover glass, then |Z’| should be added to measured
value to determine Ground Truth.

Functional Specification

337029-009 69

4.8.1 Depth Origin X-Y Coordinates

The depth origin X-Y coordinates is the X-Y center of left imager.

Figure 4-5. Depth Module X-Y Depth Origin Reference

Table 4-12. Depth Module X-Y Depth Origin Coordinates

Depth Module

Left Alignment hole1 to Left imager Center

D400

8mm

D410

8mm

D415

8mm

D420

8mm

D430

8mm

NOTES:

1. Left alignment hole on bottom stiffener of depth module

2. Left alignment hole and left imager center is on depth module centerline.

Functional Specification

70 337029-009

Figure 4-6. Depth Camera X-Y Depth Origin Reference

Table 4-13. Depth Camera X-Y Depth Origin Coordinates

Depth Camera

From Centerline of ¼-201 To Left Imager

D415

20mm

D435/D435i

17.5mm

D455

47.5mm

NOTES:

1. Center of tripod mounting hole (1/4-20)

4.9 Depth Camera Functions

D4 exposes the following Depth image settings.

Table 4-14. Depth Camera Controls

Control

Description

Min

Max

Manual Exposure

(1)

(ms)

Control sensor exposure period
(400/410)

1

166

Manual Exposure

(1)

(ms)

Control sensor exposure period (430)

1

166

Manual gain

(1)

(Gain 1.0 = 16)

Control sensor digital gain.

16

248

Laser Power (on/off)
(On = 1)

Power to IR Projector

0

1

Manual Laser Power (mW)

Laser Power setting (30mW steps)

0

360

Functional Specification

337029-009 71

Control

Description

Min

Max

Auto Exposure Mode
(Enable = 1)

Auto Exposure Mode. When Auto
Exposure is enabled, Exposure and
Gain are set based on the environment
condition

0

1

Auto Exposure ROI

Perform Auto Exposure on a selected
ROI

T-0
L-0
B-1
R-1

T-719

L-1279

B-720

R-1280

Preset

Set Controls parameters based on
Camera Usage

Meta Data Control

Enable/Disable Metadata

0

1

NOTES:

(1) – Not supported in Auto Exposure Mode

T - Top, L – Left, B - Bottom, R – Right

4.10 Color Camera Functions

Table 4-15. RGB Exposed Controls

Control

Description

Min

Max

Auto-Exposure Mode

Automatically sets the exposure
time and gain for the frame.

0x1

0x8

Auto Exposure ROI

Perform Auto Exposure on a
selected ROI

T-0
L-0

B-1

R-1

T-1079
L-1919
B-1080

R­1920

Manual Exposure Time

Sets the absolute exposure time
when auto-exposure is disabled.

1

10000

Brightness

Sets the amount of brightness
applied when auto-exposure is
enabled.

-64

64

Contrast

Sets the amount of contrast based
on the brightness of the scene.

0

100

Gain

Sets the amount of gain applied to
the frame if auto-exposure is
disabled.

0

128

Hue

Sets the amount of hue adjustment
applied to the frame.

-180

180

Saturation

Sets the amount of saturation
adjustment applied to the frame.

0

100

Functional Specification

72 337029-009

Control

Description

Min

Max

Sharpness

Sets the amount of sharpening
adjustment applied to the frame.

0

100

Gamma

Sets amount of gamma correction
applied to the frame.

100

500

White Balance
Temperature Control

Sets the white balance when AWB is
disabled.

2800

6500

White Balance
Temperature Auto
(AWB)

Enables or disables the AWB
algorithm.

0

1

Power Line Frequency

Specified based on the local power
line frequency for flicker avoidance.

0

3

Backlight
Compensation

Sets a weighting amount based on
brightness to the frame.

0

1

Low Light Comp

Low Light Compensation

0

1

NOTES:

T - Top, L – Left, B - Bottom, R – Right

4.11 IMU Specifications

Table 4-16. IMU Specifications

Camera

Parameter

Properties

Intel® RealSense™

Depth Camera
D435i, Intel®

RealSense™ Depth

Camera D455

Intel® RealSense™

Depth Module
D430+Intel®

RealSense™ Vision

Processor D4 Board
V2

Degrees of Freedom

6

Acceleration Range

±4g

Accelerometer Sample Rate1

62.5, 250 (Hz)

Gyroscope Range

±1000 deg/s

Gyroscope Sample Rate2

200, 400 (Hz)

Sample Timestamp Accuracy

50 usec

NOTES:

1. The sample rate may differ from the absolute specified sample rate by ±5%.

It is advised to rely on the sample timestamp.

2. The sample rate may differ from the absolute specified sample rate by ±0.3%.

§§

Firmware

337029-009 73

5 Firmware

The firmware contains the operation instructions. Upon runtime, Vision Processor D4
loads the firmware and programs the component registers. If the Vision Processor D4
is configured for update or recovery, the unlocked R/W region of the firmware can be
changed.

5.1 Update

During a firmware update, the firmware utility will issue a device firmware update
command to the Vision Processor D4. The Vision Processor D4 will then reset into
firmware update mode. The firmware utility uses a single binary file to maintain the
firmware image. The firmware utility compares the firmware version installed on the
camera to the firmware version file to be updated. Based on the comparison, the
firmware utility will downgrade, upgrade, or skip if the versions match.

5.1.1 Update Limits

The firmware update engine does not allow infinite update cycles between older and
current versions of firmware. The engine will establish a baseline version of firmware
based on the latest firmware version installed. The engine will allow a return to a
previous version or baseline version of firmware up to 20 times. After the 20th
update, the engine will only allow an update to a firmware revision higher than the
baseline version.

5.2 Recovery

A read only boot sector is built into firmware which enables basic operation regardless
of the integrity of the operation instructions region. This ensures the imaging system
can function in the case of firmware not be written properly. When a firmware
recovery is required, the firmware utility will communicate with the recovery driver to
set the DFU pin low and reset the imaging system in recovery mode.

Firmware Recovery can also be externally triggered by having controllable interrupt
connected to the Vision Processor D4 DFU (Device Firmware Update) pin.

The firmware recovery sequence will be triggered by the firmware client utility. This
client utility will communicate through ACPI _DSM to trigger the controllable interrupt
(GPIO) at the appropriate times. The firmware recovery requires an ACPI _DSM
interface to control the interrupt GPIO in configuring to firmware recovery state. The
_DSM methods and BIOS use the Write to GPIO functions to set the controllable
interrupt.

§ §

Software

74 337029-009

6 Software

6.1 Intel

®

RealSense™ Software Development Kit 2.0

Intel® RealSense™ SDK 2.0 is a cross-platform library for working with Intel®
RealSense™ D400 Series. It is open source and available on

https://github.com/IntelRealSense/librealsense

The SDK at a minimum includes:

• Intel® RealSense™ Viewer - This application can be used view, record and

playback depth streams, set camera configurations and other controls.

• Depth Quality Tool - This application can be used to test depth quality,

including: distance to plane accuracy, Z accuracy, standard deviation of the Z
accuracy and fill rate.

• Debug Tools - These command line tools gather data and generate logs to

assist in debug of camera.

• Code Examples - Examples to demonstrate the use of SDK to include D400

Series camera code snippets into applications.

• Wrappers -Software wrappers supporting common programming languages

and environments such as ROS, Python, Matlab, node.js, LabVIEW, OpenCV,
PCL, .NET and more

§§

System Integration

337029-009 75

7 System Integration

The small size of the stereo depth module and the separate placement of Vision
Processor D4 provides system integrators flexibility to design into a wide range of
products. Because the camera uses stereo vision technology, it is crucial that the
stereo depth module does not flex throughout its service life. This creates unique
mechanical and thermal implementation guidance. This section explains how to
correctly integrate D4 depth camera into a system.

7.1 System Level Block Diagram

Figure 7-1. System Block Diagram

7.2 Vision Processor D4 System Integration

There are two options to integrate Vision Processor D4 into a system, either by
integration of Vision Processor D4 Board or having the Vision Processor D4 and
support components directly on the host processor motherboard. Vision Processor D4
Board simplifies system design and integration of the D4 depth camera system and
Vision Processor D4 on Motherboard allows for a space optimized implementation of
the D4 depth camera system.

7.2.1 Vision Processor D4 Board

The Vision Processor D4 Board has a standard USB Type-C connector and requires an
appropriate USB Type-C cable to connect to a standard USB 2.0/USB 3.1 Gen 1
external port.

System Integration

76 337029-009

Figure 7-2. Intel® RealSense™ Vision Processor D4 Board

USB3 Type-C

Connector

7.2.2 Vision Processor D4 on Motherboard

In the Vision Processor D4 on Motherboard option, Vision Processor D4 and support
components are directly placed on the host processor motherboard. The depth module
receptacle is on the host processor motherboard for connection to the stereo depth
module.

Figure 7-3. Vision Processor D4 on Motherboard (Illustration)

Stereo Depth Module

Host Processor SOC

Motherboard

Flex Interposer

D4

7.2.2.1 Firmware Update

SPI flash chip assembled onto the motherboard requires a bootable firmware image
for Vision Processor D4 to boot or to run the firmware update utility provided by Intel.

There are two options program flash with firmware image or to recover a corrupt
firmware image.

System Integration

337029-009 77

1. Pre-program SPI flash chip with firmware before assembly on to motherboard

or replace corrupt image with a good image SPI flash chip. The blank SPI flash
chip can pre-programmed using a compatible adapter (i.e. PA8QFN8D) and
supporting flash programmer.

2. A header or test points is connected in parallel to the SPI flash chip, then

programmed directly with an SPI flash programmer. Vision Processor D4 SPI
interface is put in high Z state by strapping EPGPIO4 pin to Ground when
programmed directly with an SPI flash programmer.

7.3 D4 Camera System Power Delivery

D4 camera system MUST keep stereo depth module and the Vision Processor D4 on
the same power rails. The stereo depth module holds a safety region in EEPROM that
is configured by firmware protected region. Keeping all components on the same rail
prevents malicious software reset of the stereo depth module without causing a reset
to the ASIC. By this protection we make sure that all the safety logic is kept locked as
long as the device is active. Ensure power delivery implementation recommendation in
Chapter 12 are followed in the design of D4 camera system.

Figure 7-4. D4 Camera System Power Scheme

Vision

Processor

D4

3.3V

1.8V

VDD

VBUS0 V 330

*AVDD

VPTX0VP DVDD

VDDPG

VDDPLL

VDDTS VDDPST

PMU_EN

FET

ISP

3.3V

1.8V

3.3V

1.8V

Stereo

Depth

Connector

0.9V

System Integration

78 337029-009

7.4 Vision Processor D4 Board for Integrated

Peripheral

In design of custom host processor motherboard with custom Vision Processor D4
Board for embedded applications, a low mechanical profile 10 pin USB 3.1 Gen 1
receptacle can be implemented on motherboard and Vision Processor D4 Board.

7.4.1 USB 3.1 Gen 1 Receptacle

Table 7-1. USB 3.1 Gen 1 Receptacle Characteristics

PROPERTY

DESCRIPTION

DIAGRAM

Shell Finish

Tin (Sn)

Lock

Yes

Ground Bar

Yes

Alignment Boss

No

Part Number

IPEX 20347-310E-12R

Table 7-2. USB 3.1 Gen 1 Receptacle Pin Out

POSITION

NAME

TYPE

DESCRIPTION

1

GND

-

Ground

2

USB3_SS

TX-

OUT

USB 3.1 Gen 1 Transmitter Negative

3

USB3_SS

TX+

OUT

USB 3.1 Gen 1 Transmitter Positive

4

GND

-

Ground

5

USB3_SS

RX-

IN

USB 3.1 Gen 1 Receiver Negative

6

USB3_SS

RX+

IN

USB 3.1 Gen 1 Receiver Positive

7

GND

-

Ground

8

DFU

IN

Device Firmware Update

9

3.3V

-

Supply Voltage, Connect to 3.3V

10

3.3V

-

Supply Voltage, Connect to 3.3V

7.4.2 USB 3.1 Gen 1 High Speed Cable Assembly

The high speed cable assembly is developed and procured by the system integrator.
The cable assembly design is specific to the system definition and must meet cable
assembly design specification.

Table 7-3. USB 3.1 Gen 1 Plug Characteristics

PROPERTY

DESCRIPTION

DIAGRAM

Shell Finish

Tin (Sn)

System Integration

337029-009 79

Friction Lock

Yes

Ground Bar

Yes

Plug Part Number

IPEX 2047-0103

Housing Part Number

IPEX 20346-010T-31

Table 7-4. Cable Assembly Specification

PROPERTY

DESCRIPTION

Cable Length

15 inches (max)

Controlled Impedance

85 Ohms with a tolerance of ± 10%.

Max Insertion Loss

<= 7.5 dB @2.5GHz

Cable Shielding

Each plug connected to the receptacle shield and GND bar.

The Transmit to receive pair crossover is expected on the Motherboard and not the
cable assembly. This is done to allow for flat cable assemblies.

7.4.3 Transmit to Receive Crossover

The host USB 3.1 Gen 1 transmit signals must be connected to the Vision Processor
D4 USB 3.1 Gen 1 receive signals. The host USB 3.1 Gen 1 receive signals must be
connected to the Vision Processor D4 USB 3.1 Gen 1 transmit signals. It is
recommended not to cross over the signals in the cable to allow cable wiring to be flat
and as thin as possible.

Figure 7-5. Host Motherboard USB 3.1 Gen 1 Routing

HOST PROCESSOR MOTHERBOARD

D4 Card

Note: Crossover happens on Host

Processor Motheboard

Receptacle Receptacle

USB3

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80 337029-009

7.4.4 Motherboard Receptacle

Table 7-5. Motherboard Receptacle Properties

PIN

WIRE DESCRIPTION

Shielding

Metal shielding, connected to GND plane.

Grounding

Two ground bar connections in addition to the connector GND.

It is recommended that the motherboard receptacle be grounded as well as ground
bar pads implemented.

Figure 7-6. Receptacle Ground Bar Motherboard Connections

7.4.5 Vision Processor D4 Board for Integrated Peripheral

Power Requirements

The Vision Processor D4 Board is powered by 5V from host processor motherboard
through USB 3.1 Gen 1 receptacle pins 9 and 10

Table 7-6. Vision Processor D4 Board as Embedded Peripheral Power Requirements

Parameter

Min

Nom

Max

Unit

VCC

Supply Voltage

+/-5%

5V V

ICC

Supply Current

700

mA

7.5 Thermals

The system thermal design must ensure the component case temperature are not
exceeded. Thermal models for Vision Processor D4 board and Depth modules are
available to conduct a thermal evaluation and validate the system thermal design.

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337029-009 81

Table 7-7. Vision Processor D4 Board – Component Power and TDP at Max Operating

Mode

(1)

Component

Power

TDP

Unit

Vision Processor D4

618

618

mW

Color Camera ISP

196.83

196.83

mW

Voltage Regulators/Other

491.64

491.64

mW

All Components

1306.47

1306.47

mW

Table 7-8. Stereo Depth Module (Standard) – Component Power and TDP at Max

Operating Mode

(1)

Component

Power

TDP

Unit

Left Imager

118.5

118.5

mW

Right Imager

118.5

118.5

mW

IR Projector

1296

946

(2)

mW

Color Sensor

118.5

118.5

mW

EEPROM + Thermal Sensor

4

4

mW

All Components

1655.5

1305.5

mW

Table 7-9. Stereo Depth Module (Wide) – Component Power and TDP at Max Operating

Mode

(1)

Component

Power

TDP

Unit

Left Imager

177

177

mW

Right Imager

177

177

mW

IR Projector

1620

1260

(2)

mW

EEPROM + Thermal Sensor

4

4

mW

All Components

1978

1618

mW

1. Max. Operating Mode – Depth Resolution 1280X720 30FPS, Color Resolution -

1920X1080p 30FPS

2. The IR projector TDP is lower than power due to a percentage of energy dissipated as

photonic emissions rather than heat.

3. Voltage Regulator power is included as part of the individual component power

Table 7-10. Vision Processor D4 Board Components – Case Temperature Limits (Still

Air)

Component

Min

Max

(1)

Unit

Vision Processor D4

0

85

◦

C

Color Camera ISP

0

70

◦

C

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82 337029-009

For the Depth Modules, case temperature is specified for the overall depth module and
the thermocouple test location is any point on bottom metal stiffener

Figure 7-7. Bottom Stiffener Depth Module D410

Figure 7-8. Bottom Stiffener Depth Module D430

7.6 Stereo Depth Module Flex

It is critical that stereo depth module does not experience flex during system
integration or during use after integration. Micron level flexing of the module can
render the calibration incorrect and will result in poor performance or nonfunctional
depth data. It is important for system designers to isolate the module from any
chassis flex the system may encounter. While the module has a reinforcement
housing, the housing is not intended to counter loads from chassis flex. The primary
function of the housing is to prevent loss of calibration from handling and operating
environments.

It is possible for the module to recover depth performance after experiencing

permanent deformation. However, the module’s ability to recover is dependent on the

amount of deformation experienced.

It is required, due to the high probability that some flex will be experienced by the
module during system integration, to perform OEM calibration procedure after the
stereo depth module is fully integrated into its final housing/location.

7.7 Stereo Depth Module Mounting Guidance

7.7.1 Screw Mount

The stereo depth module incorporates a screw hole and a screw fork for module
mounting. The stereo depth module should be mounted on a large heat sink or a heat
dissipating structure element using M1.6 screw at the screw hole and fork. The
recommended torque for both screws is 1.6Kgf*cm. Thermal interface material should
be used on backside region of IR projector and two stereo imagers between camera
module and heat sink or heat dissipating structure element for thermal transfer.

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337029-009 83

Figure 7-9. Stereo Depth Module Screw Mount

Screw Fork Screw Hole

7.7.2 Bracket Mount

The Stereo Depth module should be mounted on large heat sink or a heat dissipating
structure element using the bracket placed at the center of module. The bracket is
made up of 0.35mm thickness stainless steel. The bracket is secured to the heat sink
or structure element using two M1.6 screws with recommended torque of 1.6Kgf*cm.
The rectangular (400/410 bracket) or circular (430 bracket) cutout is for thermal
interface filler or as IR Projector opening when reversing bracket to mount. Thermal
interface material should be used on backside region of IR projector and two stereo
imagers between camera module and heat sink or heat dissipating structure element
for thermal transfer. The camera module should have a minimum of 0.2mm clearance
from all sides except for the area around bracket. It is not required to have screws at
the screw hole and screw fork at both ends of module when mounting camera module
using bracket.

Figure 7-10. Stereo Depth Module Bracket

400/410 Bracket 430 Bracket

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84 337029-009

Figure 7-11. Stereo Depth Module Bracket Mount

Figure 7-12. Stereo Depth Module Bracket Install

Bracket slides in from either length
side of stereo camera module

7.7.3 Stereo Depth Module Air gap

A minimum 0.3mm air gap is recommended between highest components on the
stereo depth module to the cover window

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337029-009 85

Figure 7-13. Stereo Depth Module Air Gap

7.8 Thermal Interface Material

Thermal interface material, specifically thermal paste/grease is recommended to be
inserted between the stereo depth module and the heat dissipating structure (heat
sink) to improve the thermal coupling between these two components. A thermal
paste with thermal conductivity in the 3-4W/mK range is recommended. This paste
must be applied in a thin layer on the back side of the IR projector and also under the
left and right imagers filling up the air gap under the Imagers.

7.9 Heat Sink

The heat sink or heat dissipating structure element used to mount stereo depth
module and ASIC Board should be a minimum of 2-3mm in thickness. It is advisable
to extend the heat sink by a few mm beyond the edges of the stereo depth module. It
is also recommended to have thermal fins on the back side of the heat dissipating
structure. In applications where weight is a concern, high thermal conductivity
graphite tape can be attached to the back side of the heat sink. This graphite tape
must be at least as big as the metal heat sink and extended out beyond the metal as
much as possible for optimal cooling. Heat sink metal must be a high conductivity
aluminum alloy or copper.
In cases where the module is expected to operate at high ambient temperatures,
additional airflow may be required to ensure temperature limits are not exceeded.
These are guidelines for thermal integration of the D4 camera in the system, however
actual testing or system level thermal modeling is recommended before finalizing
solution.

7.10 Cover Design and Material Guidance

The stereo depth module components must be covered to minimize dust and
humidity. The transparent cover material stack-up used must provide acceptable
transmission based on the component wavelengths. Anti-reflective coatings can help
increase the transmission of cover material. Cover material that reduces light
transmission can result in poor depth performance and will decrease the working
range of the camera. Nominally flat, non-distorting and low scattering cover material
should be used.

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86 337029-009

Table 7-11. Component Transmission

Component

Wavelength

Unit

Left and Right Imager (Intel®
RealSense™ D410/D430)

400 to 865 (Visible and Infrared) @ 98% transmission
rate or higher at all viewing and transmitting angles

nm

Left and Right Imager (Intel®
RealSense™ D400/D420)

Visible spectrum @ 98% transmission rate or higher at
all viewing and transmitting angles

nm

IR Projector

850nm ± 15 nm @ 98% transmission rate or higher at
all viewing and transmitting angles

nm

NOTES:

1. Higher transmissions @ 98% transmission rate or higher is recommended and not a

requirement.

2. Intel RealSense Camera 400-Series provides control over laser power and sensor

exposure. Minor loss of transmission due to cover material transmissivity might be
compensated by increasing exposure when less light is able to reach the sensors and by
increasing laser power for IR projector pattern projection loss.

3. Uncoated clear acrylic (plexiglass) plastic cover is an example for cover material

4. Anti-reflective coatings can help increase the transmission of cover material.

If different cover material is used in front of the cameras and the IR projector to
maximize transmission based on component wavelengths, cover design considerations
should ensure that the FOV of the cameras and FOP of the IR projector are not
impacted.

7.11 Gaskets

Gaskets are recommended for providing optical isolation and dust protection.
However, gaskets can impede FOV and place unwanted stress on the module or the
individual sensor lens holders.

Gasket static force can deform the cosmetic baffle/lens holder resulting in poor image
quality and permanent damage to the camera. Gaskets placed on the module stiffener
can transfer chassis flex into the camera module causing loss of depth data. Gasket
thickness has a large effect on the static force applied to the module surface. The
thinner the seal, the greater the static force applied. Once the gasket is compressed,
the static force will increase exponentially.

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337029-009 87

Figure 7-14. Illustration of Gasket Placement and Cover Material

7.11.1 Optical Isolation

It is recommended to isolate the left/right imagers and IR projector from each other
to prevent reflections off the cover material. Not properly isolating the cameras can
result in leakage light as shown in Figure 7-15. Example of Light Leakage Effects

To prevent light leakage, it is recommended to use a gasket material in between the
cover holes and the module. The gasket material needs to be compliant so that it does
not transmit chassis flex forces to the module.

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88 337029-009

Figure 7-15. Example of Light Leakage Effects

7.11.2 Dust Protection

Dust particles can accumulate over the camera lenses which can be visually
unappealing and degrade image quality.

7.12 Firmware Recovery

To support firmware recovery, a 3.3V controllable interrupt must be connected to the
Vision Processor D4 DFU (Device Firmware Update) pin

The ability to recovery the image system if the firmware becomes corrupted requires
D4 reset and DFU pin driven high for 160ms. The DFU pin should remain high when
D4 is out of reset for D4 to boot in DFU mode. The 160ms ensures that the DFU pin is
held high through the reset sequence.

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337029-009 89

Figure 7-16. Firmware Recovery Sequence

Sequence

Timing Diagram

Firmware

Recovery

Reset (PRSTN Pin)

DFU Pin

7.13 Calibration Support

It is required to have an accessible USB port to access the host system. The accessible
USB port would allow to stream images reliably to an external PC to determine
calibration parameters and to write back camera calibration parameters via the host
system

The USB port should be able to be configured in a mode where the USB port can
access the host. The access to USB port is required at manufacturing and not intended
to be available on shipped product or to end user.

7.14 Multi-Camera Hardware Sync

Intel® RealSense™ D400 Series supports hardware sync signal for multi-camera
configuration. For multiple cameras to be hardware synchronized as to capture at
identical times and frame rates, pins 5 (SYNC) and pins 9 (Ground) on external sensor
sync connector will need to be connected. The external sensor sync connector is on
Vision Processor D4 board and is accessible on Depth Cameras.

Figure 7-17. External Sensor Sync Connector Location on D4 Vision Processor D4 Board

External Sensor
Sync Connector

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90 337029-009

Figure 7-18. External Sensor Sync Connector Location on Depth Camera

D435/D435i/D455

External Sensor Sync Connector

For additional details on how to implement the multi-camera hardware sync feature,
please refer to multi-camera white paper at https://realsense.intel.com/intel-

realsense-downloads/#whitepaper.

7.15 Handling Conditions

Table 7-12. Electrostatic Discharge Caution

To provide a consistent ESD protection level during D4 system
assembly and rework, it is recommended that the JEDEC
JESD625-A requirements standard be incorporated into the ESD
environment controls.

§ §

Platform Design Guidelines

337029-009 91

8 Platform Design Guidelines

The Platform Design Guidelines has been developed to ensure maximum flexibility for
board designers while reducing the risk of board related issues. Design
recommendations are based on Intel's simulations and are strongly recommended.

8.1 Vision Processor D4 on Motherboard

This Design Guidelines provides Vision Processor D4 on motherboard implementation
recommendations for the Kaby Lake U/Y (7th Generation Intel® Core™ Processors)
and Cherry Trail T4 (Intel® Atom™ Z8000 Processor Series) platforms with 8/10 layer
Type 4 PCB.

Supported platform topologies are:

1. Vision Processor D4 with USB Host Interface

2. Vision Processor D4 with MIPI Host Interface

3. Vision Processor D4 on Board for USB Integrated Peripheral

Figure 8-1. Vision Processor D4 with USB Host Interface

MOTHERBOARD

Host SOC

USB 3.1 Gen1

Flex PCB

(2 sets of X2 MIPI)

D4 Vision

Processor

(2 sets of X2 MIPI)

(SL/MS)

DEPTH MODULE

Connector

Connector

Figure 8-2. Vision Processor D4 with MIPI Host Interface

MOTHERBOARD

Host SOC

X4 MIPI

(SL/MS)

Flex PCB

(2 sets of X2 MIPI)

D4 Vision

Processor

(2 sets of X2 MIPI)

(SL/MS)

DEPTH MODULE

Connector

Connector

Platform Design Guidelines

92 337029-009

Figure 8-3. Vision Processor D4 on Board for USB Integrated Peripheral

HOST SOC

USB 3.1

Gen 1

MOTHERBOARD

Flex PCB

(2 sets of X2 MIPI)

D4 Vision

Processor

2 sets of X2 MIPI

(SL/MS)

DEPTH MODULE

Connector

Connector

D4 Board

IPEXIPEX

8.2 Kaby Lake U and Kaby Lake Y platforms

8.2.1 Kaby Lake Platform Introduction

The Kaby Lake U platform consists of a Kaby Lake U processor plus a Kaby Lake
Platform Controller Hub (PCH) in the same Multi Chip Package (MCP). Similarly the
Kaby Lake Y platform consists of a Kaby Lake Y processor plus a Kaby Lake PCH in the
same Multi Chip Package (MCP).

Note: For Kaby Lake U/Y platform design guidelines, refer Kaby Lake U and Y
Platform Design Guide. (Doc# 561280)

8.2.2 Supported PCB Stack-Up and Routing Geometries

Refer to Kaby Lake U/Y Platform Design Guide for type 4 PCB stack up,
Breakout/Breakin geometries, Main Route stripline/microstrip geometries and Via
recommendations. It is strongly recommended to follow the given impedance criteria
in the design guide for the given interface.

Platform Design Guidelines

337029-009 93

8.2.3 Vision Processor D4 on Motherboard with USB Host

Interface

8.2.3.1 USB 3.1 Gen 1 Motherboard Routing

Figure 8-4. Host Processor - Vision Processor D4

D4

Table 8-1. Host Transmit – Vision Processor D4 Receive Routing Guidelines

Parameter

Breakout

(BO)

Main

Route

(MR)

Breakin

(BI)

Total Allowed Length

(L_BO + L_MR + L_BI)

Maximum
Segment Length
(Inches)

0.25

15-BO-BI

0.25

15

Maximum Allowed
Channel Insertion
loss (dB)

<=15 dB @2.5MHz

Table 8-2. Vision Processor D4 Transmit - Host Receive Routing Guidelines

Parameter

Breakout

(BO)

Main

Route

(MR)

Breakin

(BI)

Total Allowed Length

(L_BO + L_MR + L_BI)

Maximum
Segment Length
(Inches)

0.25

15-BO-BI

0.25

15

Maximum Allowed
Channel Insertion
loss (dB)

<=15 dB @2.5MHz

NOTES:

• Simulation results shows that overall 15 inch channel routing is good for USB 3.1 Gen 1

Vision Processor D4 to Host connection motherboard. This connection does not include any
connector or cable.

• All routing is recommended to be 85 ohm impedance.

Platform Design Guidelines

94 337029-009

• Breakout/Breakin should be maximum length of 250 mil for 85 ohm routing, if there is any

impedance variation due to narrow escape BGA breakout, the maximum routing length
should be 150mil.

• Maximum number of via count:4 (including package microvia)

• It is strongly recommended that overall channel loss is within -15dB for satisfactory

performance.

8.2.4 Vision Processor D4 on Motherboard with MIPI Host

Interface

8.2.4.1 MIPI Motherboard Routing

Figure 8-5. Vision Processor D4 Transmit - Host Receive

D4

Table 8-3. Vision Processor D4 Transmit – Host Receive Routing Guidelines

Parameter

Breakout

(BO)

Main

Route

(MR)

Breakin

(BI)

Total Allowed Length

(L_BO + L_MR + L_BI)

Maximum
Segment Length
(Inches)

0.25

15-BO-BI

0.25

15

Maximum Allowed
Channel Insertion
loss (dB)

<=5.5 dB @750MHz

NOTES:

• Maximum via count = 4 vias including the first micro-via from package ball.

• Minimum stripline breakout pair-to-pair spacing of 2.36 mils is allowed near package ball

out region with maximum length of 250 mils.

• Main route and Break-in nominal impedance is required to be consistent. Example: 85 ohm

main route and 85 ohm break-in. Mixture of nominal impedance is not recommended.

• Length matching within a differential pair is +/- 5 mils maximum.

Platform Design Guidelines

337029-009 95

• The maximum allowed channel insertion loss budget dictates the total allowed length. The

total insertion loss allowed for interconnect from the D4 package die bump to Kaby Lake
SoC package die bump is about 5.5dB at 750 MHz. It should be noted that though only the
insertion loss value at the fundamental frequency (750 MHz) is specified, the insertion loss
curve up to about 1.5 GHz should be well behaved with no strong resonance or ripple.

8.2.4.2 MIPI Motherboard Routing (Stereo Depth Module Transmit to

Vision Processor D4 Receive)

Figure 8-6. Stereo Depth Transmit - Vision Processor D4 Receive

D4

Depth

Module

Board Routing

Table 8-4. Stereo Depth Module Transmit - Vision Processor D4 Receive Routing

Guidelines

Parameter

Breakout

(BO)

Main Route

(MR)

Breakin

(BI)

Flex

Interposer

Length

(L_Cable)

Camera

Board

Length

(L_Camera)

Total Allowed Length

(L_MB + L_Cable +

L_Camera)

Maximum

Segment Length

(Inches)

0.25

15 –

L_Cable -

L_Camera –

BO - BI

0.25

15-L_MB­L_camera

L_Camera

(max ~2

inches)

15

Maximum

Allowed Channel

Insertion loss

(dB)

<=5.5 dB @750MHz

NOTES:

• Stereo depth module MIPI routing length are assumed to be 2 inches (max)

• Maximum via count = 3 vias including the first micro-via from package ball.

Platform Design Guidelines

96 337029-009

• Minimum stripline breakout pair-to-pair spacing of 2.36 mils is allowed near package ball

out region with maximum length of 250 mils.

• Main route and Break-in nominal impedance is required to be consistent. Example: 85 ohm

main route and 85 ohm break-in. Mixture of nominal impedance is not recommended.

• Length matching within a differential pair is +/- 5 mils maximum.

• No length match requirements for signals routed to different camera modules.

• The maximum allowed channel insertion loss budget dictates the total allowed length. The

total insertion loss allowed for interconnect from the package die bump to the connector on
the camera module is about 5.5dB at 750 MHz as shown in the table. This recommendation
allows the use of any cable type as long as the maximum allowed insertion loss is met. It
should be noted that though only the insertion loss value at the fundamental frequency
(750 MHz) is specified, the insertion loss curve up to about 1.5 GHz should be well behaved
with no strong resonance or ripple.

• Flex Interposer recommendation: 85-100ohm impedance with maximum length of 4-6

inches. The recommended interposer should be Flex PCB based design.

Figure 8-7. Flex Interposer PCB Stack-Up

8.2.5 Vision Processor D4 Board for Integrated Peripheral (USB

3.1 Gen 1 Host to Vision Processor D4 Routing)

Figure 8-8. USB 3.1 Gen 1 Host to Vision Processor D4 Topology

D4

Platform Design Guidelines

337029-009 97

Table 8-5. USB 3.1 Gen 1 Host to Vision Processor D4 Routing Guidelines

Vision Processor D4 Board

USB 3.1

Gen 1

Cable

Host Motherboard

Parameter

Breakout

(BO)

Main Route

(MR)

Breakin

(BI)

Cable

Length

(L_Cable)

Breakout

(BO)

Main Route

(MR)

Breakin

(BI)

Maximum

Segment

Length

(Inches)

0.25 2 0.25

15 (max)

0.25 5 0.25

Maximum

Allowed
Channel

Insertion loss

(dB)

<= 15 dB @ 2.5GHz

Max recommended USB 3.1 Gen 1 cable loss <= 7.5 dB @2.5GHz

NOTES:

• The maximum allowable motherboard routing of USB 3.1 Gen 1 signals on Host PCB should

be 5-6inch inch and routing on Vision Processor D4 Board should be 2-3inch.

• It is recommended that an 85 ohm common mode choke (CMC) be designed in line with

both the USB 3.1 Gen 1 signals. The CMC should be placed as close to the connector as
possible.

• It is required that a 0.1μF AC coupling capacitor is designed in series with both the USB 3.1

Gen 1 signals.

• The USB 3.1 Gen 1 cable assembly should have a differential impedance of 85 Ohms with a

tolerance of ± 10%.

• The max cable length should not exceed 15 inch with target loss of 7.5dB@2.5GHz

• Overall channel loss including cable should not exceed 15dB @2.5GHz

8.2.6 USB2.0 Design Guidelines (USB2 Host to Vision Processor

D4 Routing)

Figure 8-9. USB2.0 Host to Vision Processor D4

D4

Platform Design Guidelines

98 337029-009

Parameter

Breakout

(BO)

Main

Route

(MR)

Breakin

(BI)

Total Allowed Length

(L_BO + L_MR + L_BI)

Maximum
Segment Length
(Inches)

0.25

15-BO-BI

0.25

15

Maximum Allowed
Channel Insertion
loss (dB)

NOTES:

• Simulation results shows that overall 15 inch channel routing is good for USB2.0 D4 to Host

topology on motherboard. This topology does not include any connector or cable.

• All routing is recommended to be 85 ohm

• Breakout/breakin should be max of 250mil for 85ohm routing, if there is any impedance

variation due to narrow escape BGA breakout, the max routing should be 150mil.

• Maximum number of via count:4 (including package microvia)

• It is strongly recommended that overall channel loss to be within -15dB for

satisfactory performance

8.3 Cherry Trail T4 Platform

8.3.1 Cherry Trail T4 Platform Introduction

The Cherry Trail T4 is the Intel Architecture (IA) SoC that integrates the Intel

®

processor core, Graphics, Memory Controller, and I/O interfaces into a single system­on-chip solution.

Note: For Cherry Trail T4 platform design guidelines, refer Cherry Trail T4 Platform
Design Guide. (Doc# 537901)

Note: Cherry Trail platform supports 2 SoC skus, T3 and T4. The Vision Processor D4
platform design guidelines discussed in this chapter are only applicable to T4 based
Cherry Trail platform. For information on Cherry Trail T4 SoC, refer to Intel® Atom™
Z8000 Processor Series - External Design Specification (EDS) (Doc# 539071)

8.3.2 Vision Processor D4 Platform Design Guidelines

The Vision Processor D4 platform design guidelines on Cherry Trail T4 platform would
follow the same guidelines specified for Kaby Lake U and Y platforms.

8.3.2.1 Supported PCB Stack-Up and Routing Geometries

Refer to Cherry Trail T4 Platform Design Guide for Type 4 PCB stack up,
Breakout/Breakin routing geometry, Main Route stripline/microstrip geometry and Via
recommendations. It is strongly recommend to follow the given impedance criteria in
the design guide for the given interface.

§§

Regulatory Compliance

337029-009 99

9 Regulatory Compliance

9.1 System Laser Compliance

The Intel® RealSense™ D400 series certification is transferable to the system and no
system recertification is required. However, the following statements and labels must
be included in the user manual of the end product

9.1.1 Certification Statement

This product is classified as a Class 1 Laser Product under the EN/IEC 60825-1, Edition
3 (2014) internationally.

This product complies with FDA performance standards for laser products except for
conformance with IEC 60825-1 Ed. 3 as described in Laser Notice No. 56, dated May
8, 2019.

9.1.2 Explanatory Label

9.1.3 Cautionary Statements

System integrators should refer to their respective regulatory and
compliance owner to finalize regulatory requirements for a specific
geography.

Caution - Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

Regulatory Compliance

100 337029-009

• Do not power on the product if any external damage was

observed.

• Do not attempt to open any portion of this laser product. There

are no user serviceable parts.

• Invisible laser radiation when opened. Avoid direct exposure to

beam.

• There are no service/maintenance, modification, or disassembly

procedures for the stereo module and infrared projector. The
system integrator must either notify Intel or return modules
before any failure analysis is performed.

• Modification or service of the stereo module, specifically the

infrared projector, may cause the emissions to exceed Class 1.

• Do not try to update camera firmware that is not officially

released for specific camera module SKU and revision.

9.1.4 US FDA Accession Number

Table 9-1. U.S. FDA Accession Number

Component

U.S. FDA accession numbers

Intel® RealSense™ Depth Module
D410/D415/D430/D450

1420260

Intel® RealSense™ Depth Camera
D415/D435/D435i/D455

1420260

This accession number should be entered into Box B.1 of the Food and Drug
Administration (FDA) 2877 Declaration for Imported Electronic Products Subject to
Radiation Control Standards.

9.2 Regulatory Compliance

9.2.1 Manufacturer’s Information

Intel Corporation:
Attn: Corp. Quality
2200 Mission College Blvd,
Santa Clara, CA 95054-1549, USA

9.2.2 EU Single Place of Contact

Att. Corp Quality
Intel Deutschland GmbH
Am Campeon 10-12
Neubiberg, 85579 – Germany