INTEL INTEL D455 User guide

Document Number: 337029-009
Intel® RealSense
Product Family D400 Series
Datasheet
Intel® RealSense™ Vision Processor D4, Intel® RealSense™ Vision Processor D4 Board, Intel® RealSense™ Vision Processor D4 Board V2, Intel® RealSense™ Vision Processor D4 Board V3, Intel® RealSense™ Depth Module D400, Intel® RealSense™ Depth Module D410, Intel® RealSense™ Depth Module D415, Intel® RealSense™ Depth Camera D415, Intel® RealSense™ Depth Module D420, Intel® RealSense™ Depth Module D430, Intel® RealSense™ Depth Module D450, Intel® RealSense™ Depth Camera D435, Intel® RealSense™ Depth Camera D435i, Intel®
RealSense™ Depth Camera D455
Revision 009
June 2020
2 337029-009
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Description and Features
337029-009 3
Contents
1 Description and Features .................................................................................. 14
2 Introduction .................................................................................................... 15
2.1 Purpose and Scope of this Document ....................................................... 15
2.2 Terminology ......................................................................................... 15
2.3 Stereo Vision Depth Technology Overview ................................................ 16
2.4 Camera System Block Diagram ............................................................... 18
2.5 Intel® RealSense™ Depth Module D400 series Product SKUs ...................... 19
2.6 Intel® RealSense™ Depth Camera D400 series Product SKUs ..................... 20
3 Component Specification .................................................................................. 21
3.1 Vision Processor D4 Camera System Components ..................................... 21
3.2 Host Processor ..................................................................................... 21
3.3 Intel® RealSense™ Vision Processor D4 ................................................... 21
3.3.1 Vision Processor D4 Features .................................................... 21
3.3.2 Vision Processor D4 Signal Description ....................................... 22
3.3.3 Vision Processor D4 Package Mechanical Attributes ...................... 27
3.3.4 Vision Processor D4 Power Requirements .................................... 33
3.3.5 Vision Processor D4 Power Sequencing ....................................... 33
3.3.6 Vision Processor D4 Spec Code .................................................. 34
3.3.7 Vision Processor D4 Storage and Operating Conditions ................. 34
3.3.8 Vision Processor D4 Thermals ................................................... 35
3.4 Clock ................................................................................................... 35
3.5 Serial (SPI) Flash Memory ...................................................................... 35
3.6 Stereo Depth Module ............................................................................. 35
3.6.1 Left and Right Imagers ............................................................. 37
3.6.2 Infrared Projector .................................................................... 38
3.6.3 Color Sensor ........................................................................... 39
3.6.4 Depth Module Connector .......................................................... 40
3.6.5 Stereo Depth Module Label ....................................................... 40
3.6.6 Stiffener ................................................................................. 41
3.6.7 Temperature Sensor ................................................................ 41
3.6.8 Other Stereo Depth Module Components .................................... 41
3.6.9 Mechanical Dimensions ............................................................. 42
3.6.10 Stereo Depth Module Power Sequence........................................ 43
3.6.11 Stereo Depth Module Storage and Powered Conditions ................. 43
3.7 Intel® RealSense™ Vision Processor D4 Board .......................................... 44
3.7.1 Mechanical Dimensions ............................................................. 45
3.7.2 Depth Module Receptacle .......................................................... 45
3.7.3 Flex and Rigid Interposer Interconnect ....................................... 45
3.7.4 External Sensor Sync Connector ................................................ 50
3.7.5 USB Peripheral Connector – Type-C ........................................... 50
3.7.6 Color Image Signal Processor (ISP) ............................................ 52
3.7.7 Vision Processor D4 Board Power Requirements .......................... 52
3.7.8 Vision Processor D4 Board Thermals .......................................... 52
3.7.9 Vision Processor D4 Board Storage and Powered Conditions .......... 53
3.7.10 Intel® RealSense™ Vision Processor D4 Board Product Identifier and
Material Code .......................................................................... 54
3.8 Intel® RealSense™ Depth Camera D400 Series ......................................... 54
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3.8.1 Depth Camera D400 Series Mechanical Dimensions ..................... 55
3.8.2 Depth Camera D400 Series Thermals ......................................... 56
3.8.3 Depth Camera D400 Series Product Identifier and Material Code ... 58
3.8.4 Camera Lens Cleaning Procedure ............................................... 58
4 Functional Specification .................................................................................... 59
4.1 Vendor Identification (VID) and Device Identification (DID) ........................ 59
4.2 Vision Processor D4 Data Streams .......................................................... 59
4.3 Depth Field of View (FOV) ...................................................................... 62
4.4 Depth Field of View at Distance (Z) ......................................................... 63
4.5 Invalid Depth Band ............................................................................... 64
4.6 Minimum-Z Depth ................................................................................. 65
4.7 Depth Quality Specification .................................................................... 65
4.8 Depth Start Point (Ground Zero Reference) .............................................. 67
4.8.1 Depth Origin X-Y Coordinates .................................................... 69
4.9 Depth Camera Functions ........................................................................ 70
4.10 Color Camera Functions ......................................................................... 71
4.11 IMU Specifications ................................................................................. 72
5 Firmware ........................................................................................................ 73
5.1 Update ................................................................................................ 73
5.1.1 Update Limits .......................................................................... 73
5.2 Recovery ............................................................................................. 73
6 Software ......................................................................................................... 74
6.1 Intel® RealSense™ Software Development Kit 2.0 ..................................... 74
7 System Integration .......................................................................................... 75
7.1 System Level Block Diagram .................................................................. 75
7.2 Vision Processor D4 System Integration ................................................... 75
7.2.1 Vision Processor D4 Board ........................................................ 75
7.2.2 Vision Processor D4 on Motherboard .......................................... 76
7.3 D4 Camera System Power Delivery ......................................................... 77
7.4 Vision Processor D4 Board for Integrated Peripheral .................................. 78
7.4.1 USB 3.1 Gen 1 Receptacle ........................................................ 78
7.4.2 USB 3.1 Gen 1 High Speed Cable Assembly ................................ 78
7.4.3 Transmit to Receive Crossover .................................................. 79
7.4.4 Motherboard Receptacle ........................................................... 80
7.4.5 Vision Processor D4 Board for Integrated Peripheral Power
Requirements .......................................................................... 80
7.5 Thermals ............................................................................................. 80
7.6 Stereo Depth Module Flex ...................................................................... 82
7.7 Stereo Depth Module Mounting Guidance ................................................. 82
7.7.1 Screw Mount ........................................................................... 82
7.7.2 Bracket Mount ......................................................................... 83
7.7.3 Stereo Depth Module Air gap ..................................................... 84
7.8 Thermal Interface Material ..................................................................... 85
7.9 Heat Sink ............................................................................................. 85
7.10 Cover Design and Material Guidance ....................................................... 85
7.11 Gaskets ............................................................................................... 86
7.11.1 Optical Isolation ...................................................................... 87
7.11.2 Dust Protection ....................................................................... 88
7.12 Firmware Recovery ............................................................................... 88
Description and Features
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7.13 Calibration Support ............................................................................... 89
7.14 Multi-Camera Hardware Sync ................................................................. 89
7.15 Handling Conditions .............................................................................. 90
8 Platform Design Guidelines ............................................................................... 91
8.1 Vision Processor D4 on Motherboard ....................................................... 91
8.2 Kaby Lake U and Kaby Lake Y platforms .................................................. 92
8.2.1 Kaby Lake Platform Introduction ................................................ 92
8.2.2 Supported PCB Stack-Up and Routing Geometries ....................... 92
8.2.3 Vision Processor D4 on Motherboard with USB Host Interface ........ 93
8.2.4 Vision Processor D4 on Motherboard with MIPI Host Interface ....... 94
8.2.5 Vision Processor D4 Board for Integrated Peripheral (USB 3.1 Gen 1
Host to Vision Processor D4 Routing) ......................................... 96
8.2.6 USB2.0 Design Guidelines (USB2 Host to Vision Processor D4
Routing) ................................................................................. 97
8.3 Cherry Trail T4 Platform ......................................................................... 98
8.3.1 Cherry Trail T4 Platform Introduction ......................................... 98
8.3.2 Vision Processor D4 Platform Design Guidelines ........................... 98
9 Regulatory Compliance ..................................................................................... 99
9.1 System Laser Compliance ...................................................................... 99
9.1.1 Certification Statement............................................................. 99
9.1.2 Explanatory Label .................................................................... 99
9.1.3 Cautionary Statements ............................................................. 99
9.1.4 US FDA Accession Number ....................................................... 100
9.2 Regulatory Compliance ......................................................................... 100
9.2.1 Manufacturer’s Information ...................................................... 100
9.2.2 EU Single Place of Contact ....................................................... 100
9.2.3 NRTL Statement ..................................................................... 101
9.2.4 FCC Part 15 Declaration of Conformity ...................................... 101
9.2.5 Canada ................................................................................. 102
9.2.6 European Directives ................................................................ 102
9.2.7 Japan .................................................................................... 102
9.2.8 South Korea ........................................................................... 102
9.3 Ecology Compliance ............................................................................. 103
9.3.1 China RoHS Declaration ........................................................... 103
9.3.2 Waste Electrical and Electronic Equipment (WEEE) ...................... 105
10 Mechanical Drawings ....................................................................................... 106
11 Connector Drawings ........................................................................................ 115
12 Appendix A – Vision Processor D4 on Motherboard Schematic Checklist ................. 117
12.1 Power Delivery .................................................................................... 124
13 Appendix B- Cover Material .............................................................................. 127
Figures
Figure 2-1. Active Infrared (IR) Stereo Vision Technology ......................................................... 17
Figure 2-2. Depth Measurement (Z) versus Range (R) .............................................................. 17
Figure 2-3. Vision Processor D4 Camera System Block Diagram ................................................ 18
Figure 3-1. Vision Processor D4 Package Drawing .................................................................... 29
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Figure 3-2. Vision Processor D4 Ball-out ................................................................................. 30
Figure 3-3. Vision Processor D4 Power Sequencing .................................................................. 34
Figure 3-4. Stereo Depth Module (Intel® RealSense™ Depth Module D410)................................. 36
Figure 3-5. Stereo Depth Module (Intel® RealSense™ Depth Module D430)................................. 36
Figure 3-6. Stereo Depth Module Power Sequence ................................................................... 43
Figure 3-7. Vision Processor D4 Board (USB Peripheral Type-C)................................................. 44
Figure 3-8. Flex Interposer (Illustration) ................................................................................. 46
Figure 3-9. Rigid Interposer (Illustration) ............................................................................... 46
Figure 3-10. Depth Module Receptacle and Plug Connector Pin Position ...................................... 47
Figure 3-11. Depth Module Connector Orientation and Pin Position ............................................. 49
Figure 3-12. USB Type-C Receptacle Pin Map .......................................................................... 51
Figure 3-13. Intel® RealSenseTM Depth Camera D415 ............................................................... 54
Figure 3-14. Intel® RealSense™ Depth Camera D435/D435i ..................................................... 54
Figure 3-15. Intel® RealSense™ Depth Camera D455 ............................................................... 55
Figure 4-1. Depth Field of View to Depth Map illustration .......................................................... 63
Figure 4-2. Left Invalid Depth Band ....................................................................................... 64
Figure 4-3. Depth Module Depth Start Point Reference ............................................................. 67
Figure 4-4. Depth Camera Depth Start Point Reference ............................................................ 68
Figure 4-5. Depth Module X-Y Depth Origin Reference .............................................................. 69
Figure 4-6. Depth Camera X-Y Depth Origin Reference ............................................................. 70
Figure 7-1. System Block Diagram ......................................................................................... 75
Figure 7-2. Intel® RealSense™ Vision Processor D4 Board ........................................................ 76
Figure 7-3. Vision Processor D4 on Motherboard (Illustration) ................................................... 76
Figure 7-4. D4 Camera System Power Scheme ........................................................................ 77
Figure 7-5. Host Motherboard USB 3.1 Gen 1 Routing .............................................................. 79
Figure 7-6. Receptacle Ground Bar Motherboard Connections .................................................... 80
Figure 7-7. Bottom Stiffener Depth Module D410 ..................................................................... 82
Figure 7-8. Bottom Stiffener Depth Module D430 ..................................................................... 82
Figure 7-9. Stereo Depth Module Screw Mount ........................................................................ 83
Figure 7-10. Stereo Depth Module Bracket .............................................................................. 83
Figure 7-11. Stereo Depth Module Bracket Mount .................................................................... 84
Figure 7-12. Stereo Depth Module Bracket Install .................................................................... 84
Figure 7-13. Stereo Depth Module Air Gap .............................................................................. 85
Figure 7-14. Illustration of Gasket Placement and Cover Material ............................................... 87
Figure 7-15. Example of Light Leakage Effects......................................................................... 88
Figure 7-16. Firmware Recovery Sequence ............................................................................. 89
Figure 7-17. External Sensor Sync Connector Location on D4 Vision Processor D4 Board .............. 89
Figure 7-18. External Sensor Sync Connector Location on Depth Camera D435/D435i/D455 ......... 90
Figure 8-1. Vision Processor D4 with USB Host Interface .......................................................... 91
Figure 8-2. Vision Processor D4 with MIPI Host Interface .......................................................... 91
Figure 8-3. Vision Processor D4 on Board for USB Integrated Peripheral ..................................... 92
Figure 8-4. Host Processor - Vision Processor D4 ..................................................................... 93
Figure 8-5. Vision Processor D4 Transmit - Host Receive ......................................................... 94
Figure 8-6. Stereo Depth Transmit - Vision Processor D4 Receive .............................................. 95
Figure 8-7. Flex Interposer PCB Stack-Up ............................................................................... 96
Figure 8-8. USB 3.1 Gen 1 Host to Vision Processor D4 Topology ............................................... 96
Figure 8-9. USB2.0 Host to Vision Processor D4 ....................................................................... 97
Figure 9-1. NRTL Certifications ............................................................................................. 101
Figure 10-1. Intel® RealSense™ Depth Module D400 ............................................................... 106
Figure 10-2. Intel® RealSense™ Depth Module D410 ............................................................... 107
Figure 10-3. Intel® RealSense™ Depth Module D415 ............................................................... 108
Figure 10-4. Intel® RealSense™ Depth Module D420 ............................................................... 109
Figure 10-5. Intel® RealSense™ Depth Module D430 ............................................................... 110
Figure 10-6. Vision Processor D4 Board USB Type-C (Intel® RealSense™ Vision Processor D4 Board)
.................................................................................................................... 111
Description and Features
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Figure 10-7. Intel® RealSense™ Depth Camera D415 .............................................................. 112
Figure 10-8. Intel® RealSense™ Depth Camera D435/D435i .................................................... 113
Figure 10-9. Intel® RealSense™ Depth Camera D455 .............................................................. 114
Figure 11-1. Receptacle Mechanical Drawing (50 Pin Depth Module Receptacle).......................... 115
Figure 11-2. Plug Mechanical Drawing (50 pin Depth Module Plug) ............................................ 116
Figure 12-1. Vision Processor D4 Laser PWM Reference Platform Schematic ............................... 124
Figure 12-2. Vision Processor D4 24MHz Crystal Clock Reference Platform Schematic .................. 124
Figure 12-3. DC-DC Reference Platform Schematic (3.3V, 1.8V, 0.9V) ....................................... 125
Figure 12-4. Vision Processor D4 VDD_PG and AVDD Reference Platform Schematic ................... 126
Tables
Table 2-1. Depth Module Product SKU Descriptions .................................................................. 19
Table 2-2. Depth Camera Product SKU Descriptions ................................................................. 20
Table 3-1. Component Descriptions ........................................................................................ 21
Table 3-2. Vision Processor D4 Signal Descriptions .................................................................. 22
Table 3-3. Hardware Straps .................................................................................................. 27
Table 3-4. Vision Processor D4 Package Mechanical Attributes ................................................... 28
Table 3-5. Vision Processor D4 Ball-out by Signal Name ........................................................... 30
Table 3-6. Vision Processor D4 Power Requirements ................................................................ 33
Table 3-7. Vision Processor D4 Power Sequencing Timing Parameters ........................................ 33
Table 3-8. Vision Processor D4 SPEC Code .............................................................................. 34
Table 3-9. Vision Processor D4 Storage and Operating Conditions .............................................. 34
Table 3-10. Stereo Depth Module........................................................................................... 35
Table 3-11. Stereo Depth Module SKU Properties ..................................................................... 36
Table 3-12. Standard Left and Right Imager Properties ............................................................ 37
Table 3-13. Wide Left and Right Imager Properties .................................................................. 37
Table 3-14. Standard Infrared Projector Parameters ................................................................ 38
Table 3-15. Wide Infrared Projector Parameters ...................................................................... 38
Table 3-16. Color Sensor Properties ....................................................................................... 39
Table 3-17. Depth Module 50-pin Connector Plug Details .......................................................... 40
Table 3-18. Stereo Depth Module Product Labeling .................................................................. 40
Table 3-19. Stereo Depth Module Label Fields ......................................................................... 40
Table 3-20. Intel® RealSense™ Depth Module D400 Series Product Identifier Code and Product
Material Code .................................................................................................. 41
Table 3-21. Other Stereo Depth Module Components ............................................................... 41
Table 3-22. Intel® RealSense™ Depth Module D400 Mechanical Dimensions ............................... 42
Table 3-23. Intel® RealSense™ Depth Module D410 Mechanical Dimensions ............................... 42
Table 3-24. Intel® RealSense™ Depth Module D415 Mechanical Dimensions ............................... 42
Table 3-25. Intel® RealSense™ Depth Module D420 Mechanical Dimensions ............................... 42
Table 3-26. Intel® RealSense™ Depth Module D430 Mechanical Dimensions ............................... 43
Table 3-27. Stereo Depth Module Storage and Powered Conditions ............................................ 43
Table 3-28. Vision Processor D4 Board .................................................................................. 44
Table 3-29. Vision Processor D4 Board Components ................................................................. 44
Table 3-30. Vision Processor D4 USB Type-C Board Mechanical Dimensions ................................ 45
Table 3-31. Depth Module Receptacle Details .......................................................................... 45
Table 3-32. Interposer Interconnect Signal Description............................................................ 47
Table 3-33. Custom Flex Interposer Ordering Logistics ............................................................. 49
Table 3-34. External Sensor Connector Details ........................................................................ 50
Table 3-35. External Sensor Sync Connector Pin List ................................................................ 50
Table 3-36. USB Peripheral Connector Pin List ......................................................................... 51
Table 3-37. Recommended USB Type C cable Assemblies Ordering Logistics ............................... 52
Table 3-38. ISP Properties .................................................................................................... 52
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Table 3-39. Vision Processor D4 Board Power Requirements ..................................................... 52
Table 3-40. Vision Processor D4 Board Storage and Powered Conditions ..................................... 53
Table 3-41. Vision Processor D4 Board Product Identifier and Material Code ................................ 54
Table 3-42. Depth Camera SKU properties .............................................................................. 55
Table 3-43. Intel® RealSense™ Depth Camera D415 Mechanical Dimensions ............................... 55
Table 3-44. Intel® RealSense™ Depth Camera D435, D435i Mechanical Dimensions .................... 56
Table 3-45. Intel® RealSense™ Depth Camera D455 Mechanical Dimensions ............................... 56
Table 3-46. Depth Camera D400 Series Storage and Powered Conditions ................................... 56
Table 3-47. Depth Camera D400 Series Product Identifier and Material Code .............................. 58
Table 4-1. Vendor ID and Device ID Table .............................................................................. 59
Table 4-2. Image Formats (USB 3.1 Gen1) ............................................................................. 59
Table 4-3. Image Formats (USB 3.1 Gen1) – D455 .................................................................. 60
Table 4-4. Simultaneous Image Streams (USB 3.1 Gen1 & USB2.0) ........................................... 62
Table 4-5. Depth Field of View ............................................................................................... 62
Table 4-6. Minimum-Z Depth ................................................................................................ 65
Table 4-7: Depth Quality Metric ............................................................................................. 65
Table 4-8: Depth Quality Metric Illustration ............................................................................. 66
Table 4-9. Depth Quality Specification .................................................................................... 66
Table 4-10. Depth Module Depth Start Point .......................................................................... 67
Table 4-11. Depth Cameras Depth Start Point ........................................................................ 68
Table 4-12. Depth Module X-Y Depth Origin Coordinates.......................................................... 69
Table 4-13. Depth Camera X-Y Depth Origin Coordinates ......................................................... 70
Table 4-14. Depth Camera Controls ....................................................................................... 70
Table 4-15. RGB Exposed Controls ......................................................................................... 71
Table 4-16. IMU Specifications .............................................................................................. 72
Table 7-1. USB 3.1 Gen 1 Receptacle Characteristics................................................................ 78
Table 7-2. USB 3.1 Gen 1 Receptacle Pin Out .......................................................................... 78
Table 7-3. USB 3.1 Gen 1 Plug Characteristics ......................................................................... 78
Table 7-4. Cable Assembly Specification ................................................................................. 79
Table 7-5. Motherboard Receptacle Properties ......................................................................... 80
Table 7-6. Vision Processor D4 Board as Embedded Peripheral Power Requirements .................... 80
Table 7-7. Vision Processor D4 Board – Component Power and TDP at Max Operating Mode
(1)
....... 81
Table 7-8. Stereo Depth Module (Standard) – Component Power and TDP at Max Operating Mode
(1)
..................................................................................................................... 81
Table 7-9. Stereo Depth Module (Wide) – Component Power and TDP at Max Operating Mode
(1)
.... 81
Table 7-10. Vision Processor D4 Board Components – Case Temperature Limits (Still Air) ............ 81
Table 7-11. Component Transmission ..................................................................................... 86
Table 7-12. Electrostatic Discharge Caution ............................................................................ 90
Table 8-1. Host Transmit – Vision Processor D4 Receive Routing Guidelines ................................ 93
Table 8-2. Vision Processor D4 Transmit - Host Receive Routing Guidelines ................................ 93
Table 8-3. Vision Processor D4 Transmit – Host Receive Routing Guidelines ................................ 94
Table 8-4. Stereo Depth Module Transmit - Vision Processor D4 Receive Routing Guidelines ........ 95
Table 8-5. USB 3.1 Gen 1 Host to Vision Processor D4 Routing Guidelines ................................. 97
Table 9-1. U.S. FDA Accession Number.................................................................................. 100
Table 12-1. Vision Processor D4 on Motherboard Schematic Checklist ....................................... 117
Table 12-2. Vision Processor D4 Decoupling and Filter Requirements ........................................ 126
Table 13-1. Example: Cover Material Parameters .................................................................... 127
Description and Features
337029-009 9
Revision History
Document Number
Revision Number
Description
Revision Date
337029
001
Initial release
January 2018
002
Tracking Module 1 removal, NRTL
certification, 7.2.2.1 Firmware Update
March 2018
003
Added USB2.0 support
Removed VBUS0 from Table 3 6.Vision
Processor D4 Power Requirements
Table 3 12. Standard Left and Right
Imager Properties
Table 3 13. Wide Left and Right
Imager Properties
Table 3 9. Vision Processor D4 Storage
and Operating Conditions
Table 3 27 Stereo Depth Module
Storage and Operating Conditions
Table 3 38. Vision Processor D4 Board
Storage and Operating Conditions
Table 3 44. Depth Camera D400 Series
Storage and Operating Conditions
Table 4 3. Image Formats (USB 2.0)
Table 4 5. Simultaneous Image
Streams (USB3.1 Gen1, USB 2.0)
4.7 Depth Origin Point (Ground Truth
Zero)
7.14 Multi-Camera hardware sync for
multi-camera configuration
July 2018
10 337029-009
Document Number
Revision Number
Description
Revision Date
004
Description and Features
Terminology
Table 2-2. Depth Camera Product SKU
Descriptions
Table 3-11. Stereo Depth Module SKU
Properties
Table 3-33. Custom Flex Interposer
Ordering Logistics
Table 3-35. External Sensor Sync
Connector Pin List
Table 3-42. Depth Camera SKU
properties
Table 3-47. Depth Camera D400 Series
Product Identifier and Material Code
Table 4-1. Vendor ID and Device ID
Table
Table 4-2. Image Formats (USB 3.1
Gen1)
Table 4-3. Image Formats (USB 2.0)
Table 4-9. Depth Quality Specification
Section 4-12 IMU Specification
November 2018
005
Table 3-11. Stereo Depth Module SKU
Properties
Table 3-42. Depth Camera SKU
Properties
Table 4-4. Simultaneous Image
Streams (USB 3.1 Gen 1 & USB
2.0)
Table 4-18. IMU Specifications
January 2019
006
Table 3-28. Vision Processor D4 Board
Table 4-2. Image Formats (USB 3.1
Gen1)
Table 4-4. Simultaneous Image
Streams (USB 3.1 Gen1 & USB 2.0)
Table 4-17. RGB Exposed Controls
Figure 10-7. Intel® RealSense™ Depth
Camera D415
Figure 10-8. Intel® RealSense™ Depth
Camera D435/D435i
Figure 4-1. Depth Field of View to
Depth Map illustration
June 2019
Description and Features
337029-009 11
Document Number
Revision Number
Description
Revision Date
007
Table 3-19. Stereo Depth Module
Label Fields
Table 3 43. Intel® RealSense Depth
Camera D415 Mechanical Dimensions
Table 3 44. Intel® RealSense Depth
Camera D435, D435i Mechanical Dimensions
Table 4-9. Depth Quality Specification
Section 7.6. Stereo Depth Module Flex
Remove Table 7-11. Bracket Ordering
Logistics
October 2019
12 337029-009
Document Number
Revision Number
Description
Revision Date
008
Support for Intel® RealSense™ Vision
Processor D4 Board V2 (IMU version for MM#954010)
Table 2-1. Depth Module Product SKU
Descriptions
Table 3-9. Vision Processor D4 Storage
and Operating Conditions
Table 3-15. Wide Infrared Projector
Parameters
Table 3-27. Stereo Depth Module
Storage and Powered Conditions
Table 3-37. Recommended USB Type C
cable Assemblies Ordering Logistics
Table 3-40. Vision Processor D4 Board
Storage and Powered Conditions
Table 3-41. Vision Processor D4 Board
Product Identifier and Material Code
Table 3-45. Depth Camera D400 Series
Storage and Powered Conditions
Table 4-2. Image Formats (USB 3.1
Gen 1)
Table 4-15. RGB Exposed Controls
Table 4-16. IMU Specifications
Table 7-10. Vision Processor D4 Board
Components – Case Temperature Limits (Still Air)
Table 13-1. Example: Cover Material
Parameters
Section 1. Description and Features
Section 3.6.7. Temperature Sensor
Section 3.7.5. USB Peripheral
Connector – Type-C
Section 3.8.2.2. Depth Camera D400
Series Thermal Solution Guidance
Remove Table 4-3. Image Formats
(USB 2.0)
Remove Section 4.8. Measured Power
April 2020
Description and Features
337029-009 13
Document Number
Revision Number
Description
Revision Date
009
Section 1. Description and Features
Section 3.8.4. Camera Lens Cleaning
Procedure
Section 9. Regulatory Compliance
Table 2-2. Depth Camera Product SKU
Descriptions
Table 3-42. Depth Camera SKU
properties
Table 3-45. Intel® RealSense™ Depth
Camera D455 Mechanical Dimensions
Table 3-47. Depth Camera D400 Series
Product Identifier and Material Code
Table 4-3. Image Formats (USB 3.1
Gen1) – D455
Table 4-1. Vendor ID and Device ID
Table
Table 4-4. Simultaneous Image
Streams (USB 3.1 Gen1 & USB2.0)
Table 4-5. Depth Field of View
Table 4-6. Minimum-Z Depth
Table 4-9. Depth Quality Specification
Table 4-13. Depth Camera X-Y Depth
Origin Coordinates
Table 4-11. Depth Cameras Depth
Start Point
Table 4-16. IMU Specifications
Figure 3-15. Intel® RealSense™ Depth
Camera D455
Figure 10-9. Intel® RealSense™ Depth
Camera D455
June 2020
§ §
Description and Features
Datasheet 14
1 Description and Features
Description
The Intel® RealSense
TM
D400 series is a stereo vision depth camera system. The subsystem assembly contains stereo depth module and vision processor with USB 2.0/USB 3.1 Gen 1 or MIPI1 connection to host processor.
The small size and ease of integration of the camera sub system provides system integrators flexibility to design into a wide range of products.
The Intel® RealSenseTM D400 series also offers complete depth cameras integrating vision processor, stereo depth module, RGB sensor with color image signal processing and Inertial Measurement Unit2 (IMU). The depth cameras are designed for easy setup and portability making them ideal for makers, educators, hardware prototypes and software development.
The Intel® RealSenseTM D400 series is supported with cross­platform and open source Intel® RealSense™ SDK 2.0
Usages/Markets
Drones
Robots
Home and Surveillance
Virtual Reality
PC Peripherals
Minimum System Requirements
USB 2.0/USB 3.1 Gen 1 Ubuntu*16.xx/Windows*10
Intel® RealSense™ Depth Camera D415 Features
Intel® RealSense™ Vision Processor D4
Up to 1280x720 active stereo depth resolution
Up to 1920x1080 RGB resolution
Depth Diagonal Field of View over 70°
Dual rolling shutter sensors for up to 90 FPS depth
streaming
Range 0.3m to over 10m (Varies with lighting conditions)
Intel® RealSense™ Depth Camera D435/D435i Features
Intel® RealSense™ Vision Processor D4
Up to 1280x720 active stereo depth resolution
Up to 1920x1080 RGB resolution
Depth Diagonal Field of View over 90°
Dual global shutter sensors for up to 90 FPS depth
streaming
Range 0.2m to over 10m (Varies with lighting conditions)
Intel® RealSense™ Depth Camera D435i includes Inertial
Measurement Unit (IMU) for 6 degrees of freedom (6DoF) data
Intel® RealSense™ Depth Camera D455 Features
Intel® RealSense™ Vision Processor D4
Up to 1280x720 active stereo depth resolution
Up to 1280x800 RGB resolution
Diagonal Field of View over 90°
Dual global shutter sensors for up to 90 FPS depth
streaming
RGB global shutter sensor for up to 90 FPS
Range 0.4m to over 10m (Varies with lighting conditions)
Intel® RealSense™ Depth Camera D455 includes Inertial
Measurement Unit (IMU) for 6 degrees of freedom (6DoF) data
Features
2nd Generation Stereo Depth Camera System
2nd Generation dedicated Intel® RealSense™ Vision
Processor D4 with advanced algorithms
Infrared (IR) Laser Projector System (Class 1)
Full HD resolution Image sensors
Active Power Management
Selection of Stereo Depth Module options to meet your
usage requirements
1. MIPI is not currently supported. Please contact your
Intel representative on MIPI enablement timelines.
2. Module and Camera SKU dependent
§ §
Introduction
337029-009 15
2 Introduction
2.1 Purpose and Scope of this Document
This document captures the specifications and the designin details for the Intel® RealSense™ D400 series family of products. This document provides information
necessary to understand and implement an Intel® RealSense™ D400 series based camera system.
Note: Intel® RealSenseD400 series is alternately referred as D4 Camera System in this document. Intel® RealSense™ Vision Processor D4 is alternately referred as “D4” in this document.
2.2 Terminology
Term
Description
6DOF
Six degrees of freedom (6DoF) refers to the freedom of movement of a rigid body in three-dimensional space. Forward/back, up/down, left/right, pitch, yaw, roll
Stereo Depth Baseline
The distance between the center of the left and right imagers in a stereo camera
MIPI CSI-2
The Camera Serial Interface (CSI) is a specification of the Mobile Industry Processor Interface (MIPI) Alliance and CSI-2 is the 2nd generation specification defining the interface between a camera and a host processor
Depth
Depth video streams are like color video streams except each pixel has a value representing the distance away from the camera instead of color information
D4 (DS5)
If the term D4 is used alone, it refers to the entire D4 camera system consisting of various modules and components.
If the term D4 is used with an appropriate qualifier (i.e. D4 Vision Processor, D4 Vision Processor Board), it refers to the specific module or component within the D4 camera system.
FOV
Field Of View (FOV) describes the angular extent of a given scene that is imaged by a camera. A camera's FOV can be measured horizontally, vertically, or diagonally
Host System
Computer or SOC connected to D4 camera
I2C
I²C (Inter-Integrated Circuit), pronounced I-squared-C, is a multi-master, multi-slave, single-ended, serial computer bus invented by Philips Semiconductor (now NXP Semiconductors). It is typically used to allow easy control and data communication between components.
IR Projector
This refers to the source of infrared (IR) light used for illuminating a scene, object, or person to collect depth data.
Introduction
16 337029-009
Term
Description
Imagers
Depth camera system uses a pair of cameras referred as imagers to calculate depth. They are identical cameras configured with identical settings.
Image Signal Processor (ISP)
Image processing functions to enhance color image quality
Left imager
From the perspective of the stereo camera looking out at the world, the left imager is on the left side of the camera module. Thus, when the user is facing the D4 camera, the left imager is actually on the right side of the camera module.
Lens
This refers to the optical component of an imager in the D4 camera. Its purpose is to focus the incoming light rays onto the CMOS chip in the imager.
MIPI
MIPI (Mobile Industry Processor Interface) is a global, open membership organization that develops interface specifications for the mobile ecosystem
Platform camera
This refers to the two-dimensional (2D) color camera on platform
System On Chip (SoC)
Integrated circuit (IC) that integrates all components of a computer
Stereo Depth Module
This refers to a stiffened module containing at least two imagers. The distance between the imagers, which is referred to as the baseline or intraocular spacing, is typically in the range of 20 mm to 70 mm.
Stereo camera
This refers to a pair of imagers looking at the same subject from slightly different perspectives. The difference in the perspectives is used to generate a depth map by calculating a numeric value for the distance from the imagers to every point in the scene.
SKU
Stock Keeping Unit (SKU) is a unique identifier for distinct products. It is often used in the scope of naming different versions of a device
TBD
To Be Determined. In the context of this document, information will be available in a later revision.
2.3 Stereo Vision Depth Technology Overview
The Intel® RealSense™ D400 series depth camera uses stereo vision to calculate depth. The stereo vision implementation consists of a left imager, right imager, and an optional infrared projector. The infrared projector projects non-visible static IR pattern to improve depth accuracy in scenes with low texture. The left and right imagers capture the scene and sends imager data to the depth imaging (vision) processor, which calculates depth values for each pixel in the image by correlating points on the left image to the right image and via shift between a point on the Left image and the Right image. The depth pixel values are processed to generate a depth frame. Subsequent depth frames create a depth video stream.
Introduction
337029-009 17
Figure 2-1. Active Infrared (IR) Stereo Vision Technology
Image
Sensors
IR Projector
1) Capture
2) Search
3) Depth
The depth pixel value is a measurement from the parallel plane of the imagers and not the absolute range as illustrated.
Figure 2-2. Depth Measurement (Z) versus Range (R)
Introduction
18 337029-009
2.4 Camera System Block Diagram
The camera system has two main components, Vision processor D4 and Depth module. The Vision processor D4 is either on the host processor motherboard or on a discrete board with either USB2.0/USB 3.1 Gen1 or MIPI connection to the host processor. The Depth module incorporates left and right imagers for stereo vision with the optional IR projector and RGB color sensor. The RGB color sensor data is sent to vision processor D4 via the color Image Signal Processor (ISP) on Host Processor motherboard or D4 Board.
Figure 2-3. Vision Processor D4 Camera System Block Diagram
Introduction
337029-009 19
2.5 Intel
®
RealSense™ Depth Module D400 series
Product SKUs
Table below describes main components that make up the different depth module SKUs
Table 2-1. Depth Module Product SKU Descriptions
Component
Subcomponent
D400
D410
D415
D420
D430
D450
Intel® RealSense™
Vision Processor D4
-
√ √ √ √ √
Intel® RealSense™
Vision Processor D4
Board
-
X
Intel® RealSense™
Vision Processor D4
Board V2 (IMU
Version)
-
X X X
X √ X
Intel® RealSense™
Vision Processor D4
Board V3 (IMU
Version)
-
X X X X X
Intel® RealSense™
Depth Module
Standard Stereo Imagers
X X X Wide Stereo Imagers
X X X √ √
Standard Infrared
Projector
X √ √ X X
X
Wide Infrared Projector
X X X X √
RGB color sensor
X X √ X X
D400 - Intel® RealSense™ Depth Module D400 D410 - Intel® RealSenseTM Depth Module D410 D415 - Intel® RealSenseTM Depth Module D415 D420 - Intel® RealSenseTM Depth Module D420 D430 - Intel® RealSenseTM Depth Module D430 D450 - Intel® RealSenseTM Depth Module D450
Introduction
20 337029-009
2.6 Intel
®
RealSense™ Depth Camera D400 series
Product SKUs
Table below describes main components that make up the different camera SKUs:
Table 2-2. Depth Camera Product SKU Descriptions
Component
Subcomponent
Intel®
RealSenseTM
Depth
Camera
D415
Intel®
RealSenseTM
Depth
Camera
D435
Intel®
RealSenseTM
Depth
Camera
D435i
Intel®
RealSenseTM
Depth
Camera
D455
Intel®
RealSense™
Vision
Processor D4
- √ √ √ √
Intel®
RealSense™
Depth
Module
Standard Stereo
Imagers
√ X X
X
Wide Stereo
Imagers
X √ √
Standard Infrared
Projector
√ X X
X
Wide Infrared
Projector
X √ √
RGB color sensor
√ √ √
Inertial Measurement Unit (IMU)
X X √
§ §
Component Specification
337029-009 21
3 Component Specification
3.1 Vision Processor D4 Camera System Components
Table 3-1. Component Descriptions
Component
Description
Host Processor
Host Processor that receives Depth and other data streams from Vision Processor D4
Vision Processor D4 (DS5 ASIC)
Depth Imaging Processor with USB 2.0/USB 3.1 Gen 1 or MIPI interface connection to Host Processor Clock
24MHz clock source for Vision Processor D4
Serial Flash Memory
SPI 16Mb Serial Flash memory for firmware storage
Stereo Depth Module
Camera module with left and Right Imager, Color Sensor, IR projector enclosed in a stiffener
Power Delivery
Circuitry on motherboard/Vision processor D4 Board to deliver and manage power to Vision Processor D4 and Stereo Depth Module.
Stereo Depth Connector and Interposer
50 pin connector on motherboard/Vision Processor D4 Board and Stereo Depth module with interposer for connection
(†) SKU dependent
3.2 Host Processor
The host processor interface to Vision Processor D4 is either USB 2.0/USB 3.1 Gen 1 or MIPI. To ensure the best of quality of service, the Vision Processor D4 must be connected to a dedicated USB 3.1 Gen 1 root port within the host processor system.
3.3 Intel
®
RealSense™ Vision Processor D4
The primary function of Vision Processor D4 is to perform depth stereo vision processing. The Vision Processor D4 on Host Processor motherboard or on Vision Processor D4 Board communicates to the host processor through USB2.0/USB 3.1 Gen 1 or MIPI and receives sensor data from stereo depth module. The Vision Processor D4 supports MIPI CSI-2 channels for connection to image sensors.
3.3.1 Vision Processor D4 Features
28nm Process Technology.
Component Specification
22 337029-009
5 MIPI camera ports with each MIPI lane capable of handling data transfers of up
to 750 Mbps.
USB2.0/USB 3.1 Gen 1 or MIPI interface to host system.
Image rectification for camera optics and alignment compensation
IR Projector (Laser) controls
Serial Peripheral Interface for fast data transfer with external SPI flash.
Integrated I2C ports
General purpose Input Output pins
Active power gating
3.3.2 Vision Processor D4 Signal Description
Table 3-2. Vision Processor D4 Signal Descriptions
RESERVED – Signal reserved for future usage
IO Type- Input Output Buffer type
A – Analog
I – Input
O - Output
Signal Name
Description
IO
Type
After
RESET
Host MIPI
H_DATAP0 H_DATAN0
Host MIPI Data Lane 0 Differential Pair
A
I
H_DATAP1 H_DATAN1
Host MIPI Data Lane 1 Differential Pair
A
I
H_DATAP2 H_DATAN2
Host MIPI Data Lane 2 Differential Pair
A
I
H_DATAP3 H_DATAN3
Host MIPI Data Lane 3 Differential Pair
A
I
H_CLKP H_CLKN
Host MIPI Clock Differential Transmit Pair
A
I
H_SDA H_SCL
Host I2C Bus Data and Clock
I/O
IO
H_REXT
Host MIPI External Reference 6.04K 1% resistor pull down to ground)
A
I
Imager A MIPI
A_DATAP0 A_DATAN0
Imager A MIPI Data Lane 0 Differential Receive Pair
A
I
A_DATAP1 A_DATAN1
Imager A MIPI Data Lane 1 Differential Receive Pair
A
I
Component Specification
337029-009 23
Signal Name
Description
IO
Type
After
RESET
A_CLKP A_CKLN
Imager A MIPI Clock Differential Receive Pair
A
I
A_SDA A_SCL
Imager A I2C Bus Data and Clock
I/O
IO
A_RCLK
Imager A Reference Clock
I/O
O
A_PDOWN
(RESERVED) Imager A Power Down Signal
I/O
O
A_VSYNC
Imager A Vertical/Frame Sync
I/O
I
A_RESETN
Imager A Reset
I/O
O
A_REXT
Imager A MIPI External Reference (6.04K 1% resistor pull down to ground)
A
I
Imager B MIPI
B_DATAP0 B_DATAN0
(RESERVED) Imager B MIPI Data Lane 0 Differential Receive Pair
A
I
B_DATAP1 B_DATAN1
(RESERVED) Imager B MIPI Data Lane 1 Differential Receive Pair
A
I
B_CLKP B_CKLN
(RESERVED) Imager B MIPI Clock Differential Receive Pair
A
I
B_SDA B_SCL
(RESERVED) Imager B I2C Bus Data and Clock
I/O
IO
B_RCLK
(RESERVED) Imager B Reference Clock
I/O
O
B_PDOWN
(RESERVED) Imager B Power Down
I/O
O
B_VSYNC
(RESERVED) Imager B Vertical/Frame Sync
I/O
I
B_RESETN
(RESERVED) Imager B Reset
I/O
O
B_REXT
Imager B MIPI External Reference (6.04K 1% resistor pull down to ground)
A
I
Imager M MIPI
M_DATAP0 M_DATAN0
Imager M MIPI Data Lane 0 Differential Receive Pair
A
I
M_DATAP1 M_DATAN1
Imager M MIPI Data Lane 1 Differential Receive Pair
A
I
M_CLKP M_CKLN
Imager M MIPI Clock Differential Receive Pair
A
I
M_SDA M_SCL
Imager M I2C Bus Data and Clock
I/O
IO
M_RCLK
Imager M Reference Clock
I/O
O
M_PDOWN
(RESERVED) Imager M Power Down
I/O
O
M_VSYNC
Imager M Vertical/Frame Sync
I/O
I
Component Specification
24 337029-009
Signal Name
Description
IO
Type
After
RESET
M_RESETN
Imager M Reset
I/O
O
M_REXT
Imager M MIPI External Reference (6.04K 1% resistor pull down to ground)
A
I
Imager Y MIPI
Y_DATAP0 Y_DATAN0
Imager Y MIPI Data Lane 0 Differential Receive Pair
A
I
Y_DATAP1 Y_DATAN1
Imager Y MIPI Data Lane 1 Differential Receive Pair
A
I
Y_CLKP Y_CKLN
Imager Y MIPI Clock Differential Receive Pair
A
I
Y_SDA Y_SCL
Imager Y I2C Bus Data and Clock
I/O
IO
Y_RCLK
Imager Y Reference Clock
I/O
O
Y_PDOWN
(RESERVED) Imager Y Power Down
I/O
O
Y_VSYNC
Imager Y Vertical/Frame Sync
I/O
I
Y_RESETN
Imager Y Reset
I/O
O
Y_REXT
Imager Y MIPI External Reference (6.04K 1% resistor pull down to ground)
A
I
Imager Z MIPI
Z_DATAP0 Z_DATAN0
(RESERVED) Imager Z MIPI Data Lane 0 Differential Receive Pair
A
I
Z_DATAP1 Z_DATAN1
(RESERVED) Imager Z MIPI Data Lane 1 Differential Receive Pair
A
I
Z_CLKP Z_CKLN
(RESERVED) Imager Z MIPI Clock differential Receive Pair
A
I
Z_SDA Z_SCL
(RESERVED) Imager Z I2C Bus Data and Clock
I/O
IO
Z_RCLK
(RESERVED) Imager Z Reference Clock
I/O
O
Z_PDOWN
(RESERVED) Imager Z Power Down
I/O
O
Z_VSYNC
Depth Vertical/Frame Sync
I/O
O
Z_RESETN
(RESERVED) Imager Z Reset
I/O
O
Z_REXT
Imager Z MIPI External Reference (6.04K 1% resistor pull down to ground)
A
I
Serial Peripheral Interconnect (SPI)
SPI_DI
SPI Data Input
I/O
I
SPI_DO
SPI Data Output
I/O
O
SPI_CLK
SPI Clock
O
O
Component Specification
337029-009 25
Signal Name
Description
IO
Type
After
RESET
SPI_CS
SPI Chip Select
O
O
SPI_WP
Flash Write Protect
O
O
General Purpose Input Output (GPIO)
GPIO[0]
(RESERVED) Not Defined
I/O
I
GPIO[1]
(RESERVED) Not Defined
I/O
I
GPIO[2]
Laser PWM – Controls Laser Power for IR projector on Stereo Module
I/O
O
GPIO[3]
(RESERVED) Not Defined
I/O
I
GPIO[4]
(RESERVED) Not Defined
I/O
I
GPIO[5]
(RESERVED) Not Defined
I/O
I
GPIO[6]
(RESERVED) Not Defined
I/O
I
GPIO[7]
(RESERVED) Not Defined
I/O
I/O
EGPIO[0]
(RESERVED) Not Defined
I/O
I/O
EGPIO[1]
(RESERVED) Not Defined
I/O
I/O
EGPIO[2]
(RESERVED) Not Defined
I/O
I/O
EGPIO[3]
Laser_PWRDN - IR projector Power Down Signal
I/O
O
EGPIO[4]
(RESERVED) Not Defined
I/O
I/O
EGPIO[5]
FLAGB – IR Projector Fault Detect
I/O
I
EGPIO[6]
(RESERVED) Not Defined
I/O
I/O
EGPIO[7]
(RESERVED) Not Defined
I/O
I/O
EGPIO[8]
ISP_FCS (Color ISP)
I/O
O
EGPIO[9]
(RESERVED) Not Defined
I/O
I/O
EGPIO[10]
(RESERVED) Not Defined
I/O
I/O
EGPIO[11]
(RESERVED) Not Defined
I/O
I/O
EGPIO[12]
(RESERVED) Not Defined
I/O
I/O
EGPIO[13]
(RESERVED) - For Intel test purpose only
I/O
I/O
Miscellaneous
LD_ON_OUT_XX
(RESERVED) Laser Enable
O
O
MODSTROB
(RESERVED) Modulation current strobe
O
O
MODSIGN
(RESERVED) Modulation current sign
O
O
LD_ERR
Laser Error (Active High)
I
I
CLKXI
24MHz XTAL
I
I
CLKXO
24MHz XTAL
I
I
PRSTN
D4 Reset
I
I
CW_CSR_PRSTn
Hardware reset without debug port reset
I/O
I
Component Specification
26 337029-009
Signal Name
Description
IO
Type
After
RESET
PMU_PWR_EN
Switchable domain (VDD_PG) power control signal
I/O
O
DFU
Dynamic FW update, used for FW recovery
I/O
I
ISP_SCL ISP_SDA
I2C Bus Data and Clock
I/O
IO
VQPSQ
(RESERVED) – For Intel test purpose only
O
O
VQPSM
(RESERVED) – For Intel test purpose only
O
O
REFPADCLKP
(RESERVED) – For Intel test purpose only
I
I
REFPADCLKM
(RESERVED) – For Intel test purpose only
I
I
JTAG
TDI
Test Data Input
I/O
I
TDO
Test Data Output
I/O
O
TCLK
Test Clock Input
I/O
I
TMS
Test Mode Select
I/O
I
TRSTN
Test Reset
I/O
I
USB
USB_RXP
USB 3.1 Gen 1 receive, positive side
A
I
USB_RXN
USB 3.1 Gen 1 receive, negative side
A
I
USB_TXP
USB 3.1 Gen 1 Transmit, positive side
A
O
USB_TXN
USB 3.1 Gen 1 Transmit, negative side
A
O
USB_DP
USB 2.0 D+ line
A
IO
USB_DN
USB 2.0 D- line
A
IO
USB_ID
Mini-receptacle identifier and test point
USB_RESREF
Reference Resistor input. 200 Ohm 1%
A
I
Power and Ground
VDD
0.9V (Core Voltage)
Power
VDD_PG
0.9V (Switched Core Voltage)
Power
USB_DVDD
0.9V (USB Core Voltage)
Power
VPTX0
0.9V (USB Core Voltage)
Power
VP
0.9V (USB Core Voltage)
Power
*_AVDD
1.8V (MIPI Core and IO Voltage)
Power
VDDPLL
0.9V (PLL Voltage)
Power
VDDTS
1.8V (Temperature Sensor Voltage)
Power
VDDPST18
1.8V (IO Voltage)
Power
USB_VDD330
3.3V (USB Core Voltage)
Power
Component Specification
337029-009 27
Signal Name
Description
IO
Type
After
RESET
VBUS0
3.3V (VBUS power monitor)
Power
VSS
Ground
GND
*_AGND
Ground
GND
Table 3-3. Hardware Straps
Pin
Boot Load
HW/FW
Description
EPGPIO0
No
FW
USB connection type: 0: Peripheral (default)
1: Integrated
EGPIO4
Yes
HW
SPI Interface: 0: SPI on “Z” 1: SPI connected (default)
EPGPIO7
Yes
FW
Flash 00: 64Mbit 01: 8Mbit 10: 16 Mbit (default) 11: 32 Mbit
EPGPIO8
EPGPIO9
No
FW
Host interface:
0: USB (default) 1: MIPI
EPGPIO10
No
FW
Board version [0] (default: 0)
EPGPIO11
No
FW
Board version [1] (default: 0)
EPGPIO12
No
FW
Board version [2] (default: 0)
DFU
Yes
HW
Go to DFU 0: Disabled (default) 1: Go to DFU mode (Recovery)
NOTES:
Boot Load – Read during Boot
Hardware (HW) Strap – External hardware pin state directly configures D4 functionality
Firmware (FW) Strap – External hardware pin state is read by firmware and firmware
configures D4 functionality
3.3.3 Vision Processor D4 Package Mechanical Attributes
Table below provides an overview of the mechanical attributes of the package.
Component Specification
28 337029-009
Table 3-4. Vision Processor D4 Package Mechanical Attributes
Pin
Boot Load
HW/FW
Package Technology
Package Type
FlipChip CSP (Chip Scale Package)
Interconnect
Ball Grid Array (BGA) Ball
Lead Free
Yes
Halogenated Flame Retardant Free
Yes
Package Configuration
Solder Ball Composition
SAC125Ni
Ball/Pin Count
225 solder balls
Grid Array Pattern
15 x 15
Package Dimensions
Nominal Package Size (mm)
6.40 x 6.40
Min Ball/Pin pitch (mm)
0.42
Weight ~1 gm
Component Specification
337029-009 29
Figure 3-1. Vision Processor D4 Package Drawing
Component Specification
30 337029-009
Figure 3-2. Vision Processor D4 Ball-out
A B C D E F G H J K L M N P R
15
VSS
Y_DATAN0
Y_REXT Y_SCL GPIO_0 GPIO_1 GPIO_5 GPIO_6
MODSTROB
TMS TRSTN SPI_WPN SPI_MISO
CW_CSR_RSTN
VSS
15
14
Y_CLKN Y_CLKP
Y_DATAP0
Y_RCLK Y_SDA
Y_RESETN
GPIO_2 GPIO_3
MODSIGN
TCLK TDO SPI_CLK SPI_MOSI
Z_RESETN
Z_VSYNC
14
13
Y_DATAN1 Y_DATAP1
VSS VSS
Y_PDOWN
Y_VSYNC GPIO_4 GPIO_7 LD_ERR
LD_ON_OUT_XX
TDI SPI_CS Z_SDA
Z_DATAP0
Z_RCLK
13
12
B_DATAN0
B_SCL B_SDA Y_AVDD V SS VSS
VDDPST18_LEFT
VSS VSS
VDDPST18_LEFT
VSS VSS Z_SCL Z_CLKP
Z_DATAN0
12
11
B_CLKN
B_DATAP0
B_REXT VSS VSS VSS V DD VDD V DD VSS VS S Z_AVDD
Z_PDOWN Z_DATAP1
Z_CLKN
11
10
B_DATAN1
B_CLKP
B_RESETN
B_AVDD VDD_PG VDD_PG V DD_PG V DD VDD VDD_PG VDD_PG ISP _SCL Z_REXT
M_DATAP1 Z_DATAN1
10
9
H_DATAN3 B_DATAP1 B_PDOWN
VSS V DD_PG VDD_PG VDD_PG VSS VSS VDD_PG VDD_PG VSS ISP_SDA M_CLKP
M_DATAN1
9
8
H_DATAN2 H_DATAP3
B_VSYNC VSS VSS VDD_PG VDD_PG VSS VSS VSS VSS VSS V SS
M_DATAP0
M_CLKN
8
7
H_CLKN
H_DATAP2
B_RCLK H_AVDD V SS VSS V SS VSS V SS VDD_PG V DD_PG M_AVDD
M_RESETN M_PDOWN M_DATAN 0
7
6
H_DATAN1
H_CLKP H_AVDD
REFPADCLKP REFPADCLKM
VSS VDD V DD VSS VDD_PG VDD_PG M_REXT
M_VSYNC
M_SDA M_RCLK
6
5
H_DATAN0 H_DATAP1
H_REXT VP USB_ID VDD VDD VDD VSS VSS VSS V SS VSS
A_DATAP1
M_SCL
5
4
H_SCL
H_DATAP0
USB_VDD330
VPTX0
USB_RESREF
USB_DVDD
VSS VSS
VDDPST18_RIGHT
VSS VSS A_AVDD A_REXT A_CLKP
A_DATAN1
4
3
USB_RXN H_SDA PRSTN USB_DP EGPIO_1 EGPIO_11 VDDTS VSSTS
VDDPST18_RIGHT
PMU_PWR_EN
VQPSQ VQPSM
A_PDOWN A_DATAP0
A_CLKN
3
2
USB_TXN USB_RXP DFU USB_DN EGPIO_9 EGPIO_13 VDDPLL VSSPLL EGPIO_5 EGPIO_12 EGPIO_3 EGPIO_4 A _SCL A_RCLK
A_DATAN0
2
1
VSS USB_TXP VBUS0 EGPIO_6 EGPIO_7 EGPIO_8 CLK_XIN
CLK_XOUT
EGPIO_10 EGPIO_2 EGPIO_0 A _VSYNC A_SDA
A_RESETN
VSS
1
A B C D E F G H J K L M N P R
Table 3-5. Vision Processor D4 Ball-out by Signal Name
Ball
Name
Ball
Name
Ball
Name
A01
H_AGND
B01
USB_TXP
C01
VBUS0
A02
USB_TXN
B02
USB_RXP
C02
DFU
A03
USB_RXN
B03
H_SDA
C03
PRSTN
A04
H_SCL
B04
H_DATAP0
C04
USB_VDD330
A05
H_DATAN0
B05
H_DATAP1
C05
H_REXT
A06
H_DATAN1
B06
H_CLKP
C06
H_AVDD
A07
H_CLKN
B07
H_DATAP2
C07
B_RCLK
Component Specification
337029-009 31
Ball
Name
Ball
Name
Ball
Name
A08
H_DATAN2
B08
H_DATAP3
C08
B_VSYNC
A09
H_DATAN3
B09
B_DATAP1
C09
B_PDOWN
A10
B_DATAN1
B10
B_CLKP
C10
B_RESETN
A11
B_CLKN
B11
B_DATAP0
C11
B_REXT
A12
B_DATAN0
B12
B_SCL
C12
B_SDA
A13
Y_DATAN1
B13
Y_DATAP1
C13
Y_AGND
A14
Y_CLKN
B14
Y_CLKP
C14
Y_DATAP0
A15
Y_AGND
B15
Y_DATAN0
C15
Y_REXT
D01
EGPIO_6
E01
EGPIO_7
F01
EGPIO_8
D02
USB_DN
E02
EGPIO_9
F02
EGPIO_13
D03
USB_DP
E03
EGPIO_1
F03
EGPIO_11
D04
VPTX0
E04
USB_RESREF
F04
USB_DVDD
D05
VP
E05
USB_ID
F05
VDD
D06
REFPADCLKP
E06
REFPADCLKM
F06
VSS
D07
H_AVDD
E07
H_AGND
F07
VSS
D08
B_AGND
E08
VSS
F08
VDD_PG
D09
B_AGND
E09
VDD_PG
F09
VDD_PG
D10
B_AVDD
E10
VDD_PG
F10
VDD_PG
D11
VSS
E11
VSS
F11
VSS
D12
Y_AVDD
E12
VSS
F12
VSS
D13
VSS
E13
Y_PDOWN
F13
Y_VSYNC
D14
Y_RCLK
E14
Y_SDA
F14
Y_RESETN
D15
Y_SCL
E15
GPIO_0
F15
GPIO_1
G01
CLK_XIN
H01
CLK_XOUT
J01
EGPIO_10
G02
VDDPLL
H02
VSSPLL
J02
EGPIO_5
G03
VDDTS
H03
VSSTS
J03
VDDPST18_RIGHT
G04
VSS
H04
VSS
J04
VDDPST18_RIGHT
G05
VDD
H05
VDD
J05
VSS
G06
VDD
H06
VDD
J06
VSS
G07
VSS
H07
VSS
J07
VSS
G08
VDD_PG
H08
VSS
J08
VSS
G09
VDD_PG
H09
VSS
J09
VSS
G10
VDD_PG
H10
VDD
J10
VDD
G11
VDD
H11
VDD
J11
VDD
G12
VDDPST18_LEFT
H12
VSS
J12
VSS
Component Specification
32 337029-009
Ball
Name
Ball
Name
Ball
Name
G13
GPIO_4
H13
GPIO_7
J13
LD_ERR
G14
GPIO_2
H14
GPIO_3
J14
MODSIGN
G15
GPIO_5
H15
GPIO_6
J15
MODSTROB
K01
EGPIO_2
L01
EGPIO_0
M01
A_VSYNC
K02
EGPIO_12
L02
EGPIO_3
M02
EGPIO_4
K03
PMU_PWR_EN
L03
VQPSQ
M03
VQPSM
K04
VSS
L04
VSS
M04
A_AVDD
K05
VSS
L05
VSS
M05
VSS
K06
VDD_PG
L06
VDD_PG
M06
M_REXT
K07
VDD_PG
L07
VDD_PG
M07
M_AVDD
K08
VSS
L08
VSS
M08
M_AGND
K09
VDD_PG
L09
VDD_PG
M09
M_AGND
K10
VDD_PG
L10
VDD_PG
M10
ISP_SCL
K11
VSS
L11
VSS
M11
Z_AVDD
K12
VDDPST18_LEFT
L12
VSS
M12
VSS
K13
LD_ON_OUT_XX
L13
TDI
M13
SPI_CS
K14
TCLK
L14
TDO
M14
SPI_CLK
K15
TMS
L15
TRSTN
M15
SPI_WPN
N01
A_SDA
P01
A_RESETN
R01
A_AGND
N02
A_SCL
P02
A_RCLK
R02
A_DATAN0
N03
A_PDOWN
P03
A_DATAP0
R03
A_CLKN
N04
A_REXT
P04
A_CLKP
R04
A_DATAN1
N05
A_AGND
P05
A_DATAP1
R05
M_SCL
N06
M_VSYNC
P06
M_SDA
R06
M_RCLK
N07
M_RESETN
P07
M_PDOWN
R07
M_DATAN0
N08
VSS
P08
M_DATAP0
R08
M_CLKN
N09
ISP_SDA
P09
M_CLKP
R09
M_DATAN1
N10
Z_REXT
P10
M_DATAP1
R10
Z_DATAN1
N11
Z_PDOWN
P11
Z_DATAP1
R11
Z_CLKN
N12
Z_SCL
P12
Z_CLKP
R12
Z_DATAN0
N13
Z_SDA
P13
Z_DATAP0
R13
Z_RCLK
N14
SPI_MOSI
P14
Z_RESETN
R14
Z_VSYNC
N15
SPI_MISO
P15
CW_CSR_RSTN
R15
Z_AGND
Component Specification
337029-009 33
3.3.4 Vision Processor D4 Power Requirements
The Vision Processor D4 requires the following power supplies for operation.
Table 3-6. Vision Processor D4 Power Requirements
Voltage Ball Name
Min.
(V)
Nominal
(V)
Max.
(V)
Peak Current
(Icc)
VDD
0.85
0.9
0.95
0.4A
VDD_PG
0.85
0.9
0.95
1.6A
USB_DVDD
0.81
0.9
0.99
0.2A
VPTX0
0.81
0.9
0.99
0.2A
VP
0.81
0.9
0.99
0.2A
*AVDD
1.71
1.8
1.89
0.2A
VDDPLL
0.85
0.9
0.95
0.2A
VDDTS
1.71
1.8
1.89
0.2A
VDDPST18 (Left and
Right)
1.71
1.8
1.89
0.2A
USB_VDD330
3.13
3.3
3.46
0.2A
3.3.5 Vision Processor D4 Power Sequencing
The timing requirement for power sequencing is listed below and shown in the following figure.
Hold Vision Processor D4 in reset
Ramp up power in the 3.3V
Ramp up power in the 0.9V
Ramp up power in the 1.8V
Release Vision Processor D4 Reset
Table 3-7. Vision Processor D4 Power Sequencing Timing Parameters
Parameter
Value
Units
Label
0.9V stable to 3.3V stable
>=50
us
T1
PMU_PWR_EN to 0.9V Stable
>=50
us
T2
1.8V stable to 0.9V Stable
>=50
us
T3
PRSTN (D4 RESET) assertion to 1.8V stable
15
us
T4
Component Specification
34 337029-009
Figure 3-3. Vision Processor D4 Power Sequencing
Note: Vision Processor D4 has no specific power down sequence requirement.
3.3.6 Vision Processor D4 Spec Code
The spec code is an identification mark printed on Vision Processor D4.
Table 3-8. Vision Processor D4 SPEC Code
Vision Processor D4
SPEC CODE
Production (Shipped in Tape and Reel)
SLLY5
Production (Shipped in Tray)
SLM6B
3.3.7 Vision Processor D4 Storage and Operating Conditions
Table 3-9. Vision Processor D4 Storage and Operating Conditions
Condition
Description
Min
Max
Unit
Storage (Still Air), Not Operating
Temperature (Sustained, Controlled)
(1)
0
85 oC
Component Specification
337029-009 35
Temperature (Short Exposure)
(2)
-40
85 oC
Humidity
Temperature/ RH: 40oC / 90%
Operating, Component Case Temperature
(3)
Temperature
0
85 oC
NOTE:
(1) Controlled conditions should be used for long term storage of product. (2) Short exposure represents temporary max limits acceptable for transportation conditions.
(3) Component case temperature limits must be met during operation.
3.3.8 Vision Processor D4 Thermals
The thermal design should be such that Vision Processor D4 does not exceed component case temperature limit. Care must also be taken to make sure that the Vision Processor D4 heat is not transferred to other components of the imaging system or stereo depth module. It will be best to thermally isolate Vision Processor D4 from the stereo depth module.
3.4 Clock
Vision Processor D4 requires a single 24 MHz clock oscillator. All clocks required by stereo depth module are generated by Vision Processor D4.
3.5 Serial (SPI) Flash Memory
Vision Processor D4 requires 16Mbit Serial Flash Memory for its firmware storage. The recommended part number is IS25WP016 (www.issi.com) or equivalent
3.6 Stereo Depth Module
The stereo depth module components are described in Table 3-10. The stereo depth printed circuit board and components are encapsulated in a common metal stiffener.
Table 3-10. Stereo Depth Module
Component
Description
Left and Right Imagers
2 HD image sensors
Infrared (IR) Projector
Class 1 laser compliant (optional)
Color Sensor
1080p RGB image sensor (optional)
Depth Module Connector
50 pin connector plug
Privacy LED
Indicator when stereo module is streaming data (optional)
Stiffener
Reinforcement housing to keep imagers aligned
Label
Manufacture and product identifier information
Component Specification
36 337029-009
Other Components
Laser Driver, EEPROM, Voltage Regulators, etc.
Figure 3-4. Stereo Depth Module (Intel® RealSense™ Depth Module D410)
Right
Imager
Left
Imager
IR
Projector
Camera
Connector
Module
Label
Figure 3-5. Stereo Depth Module (Intel® RealSense™ Depth Module D430)
Right Imager Left ImagerIR Projector
Camera
Connector
Module Label
Table 3-11. Stereo Depth Module SKU Properties
Stereo Module
Intel®
RealSense™
Depth Module
D400
Intel®
RealSense™
Depth Module
D410
Intel®
RealSense
Depth Module
D415
Intel®
RealSense™
Depth Module
D420
Intel®
RealSense™
Depth Module
D430
Baseline
55mm
55mm
55mm
50mm
50mm
Left/Right
Imagers Type
Standard
Standard
Standard
Wide
Wide
Depth FOV HD
(degrees)
H:65±2 /
V:40±1 /
D:72±2
H:65±2 /
V:40±1 /
D:72±2
H:65±2 /
V:40±1 /
D:72±2
H:87±3 /
V:58±1 /
D:95±3
H:87±3 /
V:58±1 /
D:95±3
Depth FOV VGA
(degrees)
H:50±2 /
V:40±1 /
D:61±2
H:50±2 /
V:40±1 /
D:61±2
H:50±2 /
V:40±1 /
D:61±2
H:75±3 /
V:62±1 /
D:89±3
H:75±3 /
V:62±1 /
D:89±3
IR Projector
-
Standard
Standard
-
Wide
IR Projector FOV
-
H:67 / V:41 /
D:75
H:67 / V:41 /
D:75
-
H:90 / V:63 /
D:99
Color Sensor
-
-
OV2740
-
-
Color Camera
FOV
-
-
H:69±1/
V:42±1 /
D:77±1
-
-
Component Specification
337029-009 37
Module
Dimensions
(mm)
X=74.7mm
Y=10mm
Z=4.7mm
X=74.7mm
Y=10mm
Z=4.7mm
X=83.7mm
Y=10mm
Z=4.7mm
X=70.7mm
Y=14mm
Z=10.53mm
X=70.7mm
Y=14mm
Z=10.53mm
NOTE:
H – Horizontal FOV, V – Vertical FOV, D – Diagonal FOV, X Length, Y Breadth, Z
Thickness
Depth FOV specified at 2 meters
Due to mechanical tolerances of +/-5%, Max and Min FOV values can vary from lens to
lens and module to module by ~ +/- 3 degrees.
3.6.1 Left and Right Imagers
The stereo depth module has two camera sensors referred here as imagers, they are identical parts and are configured with identical settings. The imagers are labeled “left” and “right” from the perspective of the camera module looking outward. The stereo imager pairs are referred as Standard or Wide based on imager field of view.
Table 3-12. Standard Left and Right Imager Properties
Parameter
Camera Sensor Properties
Image Sensor
OmniVision OV2740
Active Pixels
1920 × 1080
Sensor Aspect Ratio
16:9
Format
10-bit RAW
F Number
f/2.0
Focal Length
1.88mm
Filter Type
IR Cut – D400, None – D410, D415, Camera D415
Focus
Fixed
Shutter Type
Rolling Shutter
Signal Interface
MIPI CSI-2, 2X Lanes
Horizontal Field of View
69.4o
Vertical Field of View
42.5o
Diagonal Field of View
77o
Distortion
<=1.5%
Table 3-13. Wide Left and Right Imager Properties
Parameter
Camera Sensor Properties
Image Sensor
OmniVision OV9282
Active Pixels
1280 X 800
Sensor Aspect Ratio
8:5
Component Specification
38 337029-009
Parameter
Camera Sensor Properties
Format
10-bit RAW
F Number
f/2.0
Focal Length
1.93mm
Filter Type
IR Cut – D420, None – D430, D435/D435i
Focus
Fixed
Shutter Type
Global Shutter
Signal Interface
MIPI CSI-2, 2X Lanes
Horizontal Field of View
91.2o
Vertical Field of View
65.5o
Diagonal Field of View
100.6o
Distortion
<=1.5%
3.6.2 Infrared Projector
The infrared projector improves the ability of the stereo camera system to determine depth by projecting a static infrared pattern on the scene to increase texture on low texture scenes. The infrared projector meets class 1 laser safety under normal operation. The power delivery and laser safety circuits are on the stereo depth module. The infrared projector is referred as Standard or Wide based on field of projection.
Table 3-14. Standard Infrared Projector Parameters
Parameter
Properties
Projector
Infrared
Pattern Type
Static
Illuminating Component
Vertical-cavity surface-emitting laser (VCSEL) + Optics
Laser Controller
PWM
Optical Power
360mW average, 440mW peak
Laser Wavelength
850nm ± 10 nm nominal @ 20°C
Laser Compliance
Class 1, IEC 60825-1:2007 Edition 2, IEC 60825-1:2014 Edition 3
Horizontal Field of Projection
64°±3°
Vertical Field of Projection
41°±3°
Diagonal Field of Projection
72°±3°
Table 3-15. Wide Infrared Projector Parameters
Parameter
Properties
Projector
Infrared
Component Specification
337029-009 39
Parameter
Properties
Pattern Type
Static
Illuminating Component
Vertical-cavity surface-emitting laser (VCSEL) + optics
Laser Controller
PWM
Optical Power
360mW average, 4.25W peak
Laser Wavelength
850nm ± 10 nm nominal @ 20°C
Laser Compliance
Class 1, IEC 60825-1:2007 Edition 2, IEC 60825-1:2014 Edition 3
Horizontal Field of Projection
90°±3°
Vertical Field of Projection
63°±3°
Diagonal Field of Projection
99°±3°
3.6.3 Color Sensor
The color sensor on the stereo depth module in addition to color image provides texture information. Usages for the texture information include overlay on a depth image to create a color point cloud and overlay on a 3d model for reconstruction.
Table 3-16. Color Sensor Properties
Parameter
Camera Sensor Properties
Image Sensor
OmniVision OV2740
Color Image Signal Processor
Discrete
Active Pixels
1920 X 1080
Sensor Aspect Ratio
16:9
Format
10-bit RAW RGB
F Number
f/2.0
Focal Length
1.88mm
Filter Type
IR Cut Filter
Focus
Fixed
Shutter Type
Rolling Shutter
Signal Interface
MIPI CSI-2, 1 Lane
Horizontal Field of View
69.4o
Vertical Field of View
42.5o
Diagonal Field of View
77o
Distortion
<=1.5%
Component Specification
40 337029-009
3.6.4 Depth Module Connector
The depth module connector provides signal and power interface to the stereo depth module. The connector on stereo depth module is a 50-pin connector plug.
Table 3-17. Depth Module 50-pin Connector Plug Details
Parmeter
Description
Diagram
Number of Contacts
50
Product Name
NOVASTACK 35-P
Plug Assembly
Part Number
20708-050E
Manufacturer Website
www.i-pex.com
3.6.5 Stereo Depth Module Label
Table 3-18. Stereo Depth Module Product Labeling
For illustration purpose only, subject to
change
Dimension
Value
Unit
A
Label Width
17
mm
B
Label Height
6.9
mm
C
Scan Code Width
5
mm
D
Scan Code Height
5
mm
Scan Code Format
XXXXXXXXXXXXOOOOOOXXXXXX-XXX
Table 3-19. Stereo Depth Module Label Fields
Group
Field
Description
Type
Company
Intel
Manufacturer
Static
Model Number
RealSenseTM Camera 4XX
Camera Model Number
Static
Product Assembly Number
XXXXXX
Product Identifier Code
Static
-XXX
Manufacture Configuration Code
Dynamic OOOOOO
Product Material Code
Static
Serial Number
XXXXXXXXXXXX
Manufacture Unit Code
Dynamic
Component Specification
337029-009 41
Note: Product Material Code (MM code) within the QR code on the label of the device will read “000000”. The QR code MM code will be zero.
Table 3-20. Intel® RealSense™ Depth Module D400 Series Product Identifier Code and
Product Material Code
Production
Product Identifier Code-
Manufacture Configuration Code
Product Material Code
Depth Module D400
J32082-100
951934
Depth Module D410
J32106-100
951913
Depth Module D415
J32114-100
952000
Depth Module D420
J51355-100
956826
Depth Module D430
J42086-100
954010
3.6.6 Stiffener
The stiffener maintains the precise alignment of the camera sensors and assists in subassembly rigidity. The stiffener consists of a bottom and a top plate. The stiffener is of stainless steel grade AISI 304.
3.6.7 Temperature Sensor
The stereo depth module is equipped with a thermal sensor that is used for laser safety control (IR Projector). The Intel® RealSense™ SDK 2.0 library provides access to the thermal sensor readouts. Temperature information does not reflect the ambient temperature of the module.
3.6.8 Other Stereo Depth Module Components
Table 3-21. Other Stereo Depth Module Components
Component
Description
Laser (IR Projector) Driver
The depth module implements a laser driver which controls the infrared laser within the infrared projector system.
Laser (IR projector) Thermal Control
The depth module implements a laser safety control circuit that adjusts laser drive output. When laser power and depth streaming is enabled and if stereo depth module temperature is >60°C, laser power is halved. If temperature is not lowered below temperature limit within a certain interval, the laser is shut off.
EEPROM
The depth module implements flash memory for storing the calibration data.
Fork/Screw Mount
Secure placement and mounting to system/chassis/heat sink
Component Specification
42 337029-009
Voltage Regulators
The stereo depth module implements DC to DC voltage converters
3.6.9 Mechanical Dimensions
Table 3-22. Intel® RealSense™ Depth Module D400 Mechanical Dimensions
Dimension
Min
Nominal
Max
Unit
Width
74.5
74.7
74.9
mm
Height
9.8
10
10.2
mm
Depth
4.5
4.7
4.9
mm
Flatness Tolerance
-
0.2
-
mm
Weight
6.5
7.2
8
gr
Table 3-23. Intel® RealSense™ Depth Module D410 Mechanical Dimensions
Dimension
Min
Nominal
Max
Unit
Width
74.5
74.7
74.9
mm
Height
9.8
10
10.2
mm
Depth
4.5
4.7
4.9
mm
Flatness Tolerance
-
0.2
-
mm
Weight
7.3
8.1
8.9
gr
Table 3-24. Intel® RealSense™ Depth Module D415 Mechanical Dimensions
Dimension
Min
Nominal
Max
Unit
Width
89.5
89.7
89.9
mm
Height
9.8
10
10.2
mm
Depth
4.5
4.7
4.9
mm
Flatness Tolerance
TBD
mm
Weight
TBD
gr
Table 3-25. Intel® RealSense™ Depth Module D420 Mechanical Dimensions
Dimension
Min
Nominal
Max
Unit
Width
70.5
70.7
70.9
mm
Height
13.8
14
14.2
mm
Depth
10.33
10.53
10.73
mm
Flatness Tolerance
-
0.2
-
mm
Weight
TBD
gr
Component Specification
337029-009 43
Table 3-26. Intel® RealSense™ Depth Module D430 Mechanical Dimensions
Dimension
Min
Nominal
Max
Unit
Width
70.5
70.7
70.9
mm
Height
13.8
14
14.2
mm
Depth
10.33
10.53
10.73
mm
Flatness Tolerance
-
0.2
-
mm
Weight
13
14.5
16
gr
3.6.10 Stereo Depth Module Power Sequence
Figure 3-6. Stereo Depth Module Power Sequence
3.3V
1.8V
3.6.11 Stereo Depth Module Storage and Powered Conditions
Table 3-27. Stereo Depth Module Storage and Powered Conditions
Condition
Description
Min
Max
Unit
Storage (Ambient), Not Powered
Temperature (Sustained, Controlled)
(1)
0
50 oC
Temperature (Short Exposure)
(2)
-40
70 oC
Humidity
Temperature/ RH: 40oC / 90%
Case Temperature, Powered
(3)(4)(5)
Temperature
0
50 oC
NOTE:
(1) Controlled conditions should be used for long term storage of product. (2) Short exposure represents temporary max limits acceptable for transportation conditions. (3) Case temperature limits must be met for all temperatures when powered. (4) Case temperature is specified for the overall depth module
(5) Case temperature 0° minimum and lower temperatures is non-condensing
Component Specification
44 337029-009
3.7 Intel
®
RealSense™ Vision Processor D4 Board
The Vision Processor D4 Board enables an easy and quick option for system integrators to integrate Vision Processor D4 into a system.
Table 3-28. Vision Processor D4 Board
Type
Description
USB Peripheral Type-C
Connects to Host USB 3.1 Gen 1 port through USB Type-C connector and cable
Note: When connecting to host system, connect Type-C connection to the camera prior to connecting device to host system port.
Table 3-29. Vision Processor D4 Board Components
Components
Description
Vision Processor D4
Stereo Depth Processing ASIC
16Mb Serial Flash
Vision Processor D4 firmware storage
24MHz Crystal
Clock source for Vision Processor D4
Realtek* ISP with external serial flash
Color image signal processor
Depth Module Receptacle
50 pin receptacle for connection to Stereo Depth Module
USB Type-C
USB peripheral connector for connection to Host USB 2.0/USB 3.1 Gen 1 port
External Sensor Sync Connector
Interface to external sensor interrupts/sync signals
Voltage Regulators
DC to DC converters powering Vision Processor D4 Board and stereo depth module.
Mounting holes
Vision Processor D4 Board secure mounting
Figure 3-7. Vision Processor D4 Board (USB Peripheral Type-C)
Depth Module
Receptacle
External Sensor Sync Connector
USB Type-C
Connector
Vision Processor D4
Component Specification
337029-009 45
3.7.1 Mechanical Dimensions
Table 3-30. Vision Processor D4 USB Type-C Board Mechanical Dimensions
Dimension
Min
Nominal
Max
Unit
Width
72.2
72.4
72.6
mm
Height
15.8
16
16.2
mm
Depth
3.74
3.94
4.14
mm
Weight
3.56
3.96
4.36
gr
3.7.2 Depth Module Receptacle
The Vision Processor D4 Board interface to stereo depth module is through 50 pin receptacle on the board.
Table 3-31. Depth Module Receptacle Details
Parameter
Description
Diagram
Number of Contacts
50
Product Name
NOVASTACK* 35-P
Receptacle Assembly
Part Number
20709-050E
Manufacturer Website
www.i-pex.com
3.7.3 Flex and Rigid Interposer Interconnect
The high speed interposer at one end has the 50 pin depth module receptacle to connect into 50 pin depth module plug on stereo depth module and at the other end has the 50 pin depth module plug to connect into 50 pin depth module receptacle on Vision Processor D4 Board. The high speed flex Interposer is custom developed and procured by system integrator.
Component Specification
46 337029-009
Figure 3-8. Flex Interposer (Illustration)
Figure 3-9. Rigid Interposer (Illustration)
Component Specification
337029-009 47
Figure 3-10. Depth Module Receptacle and Plug Connector Pin Position
Table 3-32. Interposer Interconnect Signal Description
Position
ASIC Board/
Motherboard
Depth Module
Interconnect Description
1
RGB_RSTN_N
RGB_RSTN_N
RGB Sensor Reset
2
GND
GND
Ground
3
RGB_XCL
RGB_XCL
RGB Sensor Clock
4
RGB_MDP0
RGB_MDP0
RGB Sensor MIPI Data Lane 0 differential pair positive
5
GND
GND
Ground
6
RGB_MDN0
RGB_MDN0
RGB Sensor MIPI Data Lane 0 differential pair negative
Component Specification
48 337029-009
Position
ASIC Board/
Motherboard
Depth Module
Interconnect Description
7
RGB_FSYNC
RGB_FSYNC
RGB Sensor Sync
8
GND
GND
Ground
9
RGB_STROBE
RGB_STROBE
RGB Sensor Strobe
10
RGB_MCP
RGB_MCP
RGB Sensor MIPI Clock differential pair positive
11
RGB_SDA
RGB_SDA
RGB Sensor I2C Bus Data
12
RGB_MCN
RGB_MCN
RGB Sensor MIPI Clock differential pair negative
13
RGB_SCL
RGB_SCL
RGB Sensor I2C Bus Clock
14
GND
GND
Ground
15
GND
GND
Ground
16
MDP0_L
MDP0_L
Left Imager MIPI Data Lane 0 differential pair positive
17
VDD18V
VDD18V
1.8V Power
18
MDN0_L
MDN0_L
Left Imager MIPI Data Lane 0 differential pair negative
19
VDD18V
VDD18V
1.8V Power
20
GND
GND
Ground
21
LED_PSY
LED_PSY
Privacy LED control signal
22
MCP_L
MCP_L
Left Imager MIPI Clock differential pair positive
23
DVSYNC
DVSYNC
VSYNC
24
MCN_L
MCN_L
Left Imager MIPI Clock differential pair negative
25
NC
NC
No Connect
26
GND
GND
Ground
27
XVCLK_L
XVCLK_L
Clock to Left Imager
28
MDP1_L
MDP1_L
Left Imager MIPI Data Lane 1 differential pair positive
29
GND
GND
Ground
30
MDN1_L
MDN1_L
Left Imager MIPI Data Lane 1 differential pair negative
31
ST_RST_N
ST_RST_N
Reset signal to Left and Right Imager
32
GND
GND
Ground
33
FF_RSTn
FF_RSTn
Laser Error
34
MDP0_R
MDP0_R
Right Imager MIPI Data Lane 0 differential pair positive
35
GND
GND
Ground
36
MDN0_R
MDN0_R
Right Imager MIPI Data Lane 0 differential pair negative
37
XVCLK_R
XVCLK_R
Clock to Right Imager
38
GND
GND
Ground
Component Specification
337029-009 49
Position
ASIC Board/
Motherboard
Depth Module
Interconnect Description
39
I2C_SCL
I2C_SCL
I2C Bus Clock
40
MCP_R
MCP_R
Right Imager MIPI Clock differential pair positive
41
I2C_SDA
I2C_SDA
I2C Bus Data
42
MCN_R
MCN_R
Right Imager MIPI Clock differential pair negative
43
LASER_PWM
LASER_PWM
IR Projector Control Signal
44
GND
GND
Ground
45
LASER_PWRDN
LASER_PWRDN
IR Projector Power Down
46
MDP1_R
MDP1_R
Right Imager MIPI Data Lane 1 differential pair positive
47
LASER_PWM1
LASER_PWM1
IR Projector Control Signal
48
MDN1_R
MDN1_R
Right Imager MIPI Data Lane 1 differential pair negative
49
FLAGB
FLAGB
IR Projector Fault Detect
50
GND
GND
Ground
51
GND
GND
Ground
52
VDD33V
VDD33V
3.3V power
Figure 3-11. Depth Module Connector Orientation and Pin Position
-
Vision Processor D4 Card
Stereo Depth Module
Pin Position 1
Pin Position 50
Pin Position 50
P/N 20709-050E
P/N 20708-050E
Pin Position 1
Table 3-33. Custom Flex Interposer Ordering Logistics
Vendor
Sales Contact
COCOM CONSUMER ELECTRONICS LTD.
Janine Langdale email: Janine.Langdale@cc-e.co.uk (O) +44 (0) 1444 461620
Component Specification
50 337029-009
(M) +44 (0) 7905 692131
3.7.4 External Sensor Sync Connector
The external sensor connector provides the interface for external sensors to synchronize to depth output.
Table 3-34. External Sensor Connector Details
Parameter
Description
Diagram
Number of Contacts
9
Product Name
9 Positions Header,
Shrouded Connector
Part Number
SM09B-SRSS-
TB(LF)(SN)
Manufacturer Website
www.jst-mfg.com
Table 3-35. External Sensor Sync Connector Pin List
Pin
Signal
Function
Description
1
GPIO3
GVSYNC0
Not Defined
2
GPIO4
GVSYNC1
IR Projector Power Down signal
3
GPIO5
GVSYNC2
External IR Projector Fault Detect
4
GPIO6
GVSYNC3
External IR Projector
5
Z_VSYNC
VSYNC
Depth VSYNC
6
LASER_PWM0
LASER PWM0
Laser control signal
7
LASER_PWM1
LASER PWM1
Laser control signal
8
VDD33V
Power
3.3V
9
GND
Ground
Ground
3.7.5 USB Peripheral Connector – Type-C
USB Type-C connector consists of 24 signal pins designed in a symmetrical way. The connector z height is as low as 3mm and enables enhanced user experience by allowing the USB Type-C plug to be plugged into a receptacle either right side up or upside down. Interoperability between USB Type-C and legacy USB is possible through standard legacy cable assemblies defined in USB Type-C Cable and Connector specification.
Component Specification
337029-009 51
Recommend using a certified USB Type-C cable and connector for use with Intel® RealSense™ Camera D400 Series products.
Figure 3-12. USB Type-C Receptacle Pin Map
Table 3-36. USB Peripheral Connector Pin List
Pin
Signal
Function
Description
A1
GND
Power Delivery
Ground
A2
TX1+
USB 3.1 Gen 1 Data
First SuperSpeed TX Differential Pair Positive
A3
TX1-
USB 3.1 Gen 1 Data
First SuperSpeed TX Differential Pair Negative
A4
VBUS
Power Delivery
5V
A5
CC1
Control
Configuration Channel 1
A6
D+
USB2.0 Data
USB 2.0 differential pair positive
A7
D-
USB2.0 Data
USB 2.0 differential pair negative
A8
SBU1
Sideband
Sideband Use Signal 1
A9
VBUS
Power Delivery
5V
A10
RX2-
USB 3.1 Gen 1 Data
Second SuperSpeed RX Differential Pair Negative
A11
RX2+
USB 3.1 Gen 1 Data
Second SuperSpeed RX Differential Pair Positive
A12
GND
Power Delivery
Ground
B1
GND
Power Delivery
Ground
B2
TX2+
USB 3.1 Gen 1 Data
Second SuperSpeed TX Differential Pair Positive
B3
TX2-
USB 3.1 Gen 1 Data
Second SuperSpeed TX Differential Pair Negative
B4
VBUS
Power Delivery
5V
B5
CC2
Control
Configuration Channel 2
B6
D+
USB 2.0 Data
USB 2.0 differential pair positive
B7
D-
USB 2.0 Data
USB 2.0 differential pair negative
B8
SBU2
Sideband
Sideband Use Signal 2
B9
VBUS
Power Delivery
5V
B10
RX1-
USB 3.1 Gen 1.0 Data
First SuperSpeed RX Differential Pair Negative
B11
RX1+
USB 3.1 Gen 1.0 Data
First SuperSpeed RX Differential Pair Positive
B12
GND
Power Delivery
Ground
Component Specification
52 337029-009
Table 3-37. Recommended USB Type C cable Assemblies Ordering Logistics
Vendor
Website/Part Number
Newnex Technology Corp.
http://www.newnex.com/realsense-3d-camera-connectivity.php
3.7.6 Color Image Signal Processor (ISP)
The color sensor data is sent to discrete Image Signal Processor (ISP) on the Vision processor D4 Board for image adjustments, image scaling and processing functions to help compensate for inherent inaccuracy in lens and sensor in providing a better image quality. The processed color image is sent to the Vision Processor D4.
Table 3-38. ISP Properties
Parameter
ISP Properties
ISP Part Number on Vision Processor D4 Board
RTS5845
1M-bit Serial Flash for ISP
Winbond* W25X10CL or equivalent
Interface To Vision Processor D4
MIPI CSI-2, 2X Lanes
Interface To RGB Sensor
MIPI CSI-2, 1X Lane
3.7.7 Vision Processor D4 Board Power Requirements
The Vision Processor D4 Board is powered through VBUS power of the USB connector. The Vision Processor D4 Board in turn power sources the stereo depth module.
Table 3-39. Vision Processor D4 Board Power Requirements
Parameter
Min
Nom
Max
Unit
VCC
Supply Voltage
4.75
5V
5.25V
V
ICC
Supply Current
700
mA
Supply Voltage Ramp Rate
0.5 5
ms
3.7.8 Vision Processor D4 Board Thermals
The Vision Processor D4 Board should be screw mounted on to a heat sink or a heat dissipating structure element using screw forks on Board. Thermal conductive tape (electrically non-conductive) should cover the entire back side area (non-component side) of the ASIC Board for thermal transfer onto heat sink or heat dissipating structure element.
Component Specification
337029-009 53
3.7.9 Vision Processor D4 Board Storage and Powered
Conditions
Table 3-40. Vision Processor D4 Board Storage and Powered Conditions
Condition
Description
Min
Max
Unit
Storage (Ambient), Not Powered
Temperature (Sustained, Controlled)
(1)
0
50 oC
Temperature (Short Exposure)
(2)
-40
70 oC
Humidity
Temperature/ RH: 40oC / 90%
Case Temperature, Powered
(3)(4)(5)
Temperature
0
50 oC
NOTE:
(1) Controlled conditions should be used for long term storage of product. (2) Short exposure represents temporary max limits acceptable for transportation conditions. (3) Case temperature limits must be met for all temperatures when powered. (4) Case temperature is specified for the overall Vision Processor D4 Board (5) Case temperature 0° minimum and lower temperatures is non-condensing
Component Specification
54 337029-009
3.7.10 Intel
®
RealSense™ Vision Processor D4 Board Product
Identifier and Material Code
Table 3-41. Vision Processor D4 Board Product Identifier and Material Code
Production
Product Identifier
Code-Manufacture
Configuration Code
Product Material Code
Vision Processor D4 Board
(1)
J32139-120
952019
Vision Processor D4 Board V2
(2)
K38178-100
999AFP
Vision Processor D4 Board V3
(3)
K94249-100
99A2NX
NOTE:
(1) The V1 ASIC (without IMU) is validated and supports all D400 depth modules. (2) The V2 ASIC is intended for the D430 Module (Product Material Code #954010). Full
validation has been done on this combination. Support will be limited to D430 with the V2 ASIC.
(3) The V3 ASIC is intended for the D450 Module. Full validation has been done on this
combination.
3.8 Intel
®
RealSense™ Depth Camera D400 Series
Figure 3-13. Intel® RealSenseTM Depth Camera D415
Figure 3-14. Intel® RealSense™ Depth Camera D435/D435i
Component Specification
337029-009 55
Figure 3-15. Intel® RealSense™ Depth Camera D455
Table 3-42. Depth Camera SKU properties
D400 series Depth
Cameras
Intel® RealSense™
Depth Camera
D415
Intel® RealSense™
Depth Camera
D435
Intel® RealSense™
Depth Camera
D435i
Intel® RealSense™
Depth Camera
D455
Depth module
Intel® RealSense™
Depth module D415
Intel® RealSense™
Depth module D430
Intel® RealSense™
Depth module D430
Intel® RealSense™
Depth module D450
Baseline
55mm
50mm
50mm
95mm
Left/Right Imagers
Type
Standard
Wide
Wide
Wide
Depth FOV HD
(degrees)
H:65±2 / V:40±1 /
D:72±2
H:87±3 / V:58±1 /
D:95±3
H:87±3 / V:58±1 /
D:95±3
H:87±3 / V:58±1 /
D:95±3
Depth FOV VGA
(degrees)
H:50±2 / V:40±1 /
D:61±2
H:75±3 / V:62±1 /
D:89±3
H:75±3 / V:62±1 /
D:89±3
H:75±3 / V:62±1 /
D:89±3
IR Projector
Standard
Wide
Wide
Wide
IR Projector FOV
H:67 / V:41 / D:75
H:90 / V:63 / D:99
H:90 / V:63 / D:99
H:90 / V:63 / D:99
Color Sensor
OV2740
OV2740
OV2740
OV9782
Color Camera FOV
H:69±1 /V:42±1
/D:77±1
H:69±1 /V:42±1
/D:77±1
H:69±1 /V:42±1
/D:77±1
H:87±3 /V:58±1
/D:95±3
IMU
NA
NA
6DoF
6DoF
NOTE: H – Horizontal FOV, V Vertical FOV, D Diagonal FOV, X Length, Y Breadth, Z – Thickness
3.8.1 Depth Camera D400 Series Mechanical Dimensions
Table 3-43. Intel® RealSense™ Depth Camera D415 Mechanical Dimensions
Dimension
Min
Nominal
Max
Unit
Width
98.85
99
99.15
mm
Height
22.85
23
23.15
mm
Component Specification
56 337029-009
Depth
19.85
20
20.15
mm
Weight
68.4
72
75.6
gr
Flatness Tolerance
-
0.15
-
mm
Table 3-44. Intel® RealSense™ Depth Camera D435, D435i Mechanical Dimensions
Dimension
Min
Nominal
Max
Unit
Width
89.85
90
90.15
mm
Height
24.85
25
25.15
mm
Depth
24.85
25
25.15
mm
Weight
68.4
72
75.6
gr
Flatness Tolerance
-
0.15
-
mm
Table 3-45. Intel® RealSense™ Depth Camera D455 Mechanical Dimensions
Dimension
Min
Nominal
Max
Unit
Width
123.5
124
124.5
mm
Height
28.5
29
29.5
mm
Depth
25.5
26
26.5
mm
Weight
gr
Flatness Tolerance
-
0.2
-
mm
3.8.2 Depth Camera D400 Series Thermals
3.8.2.1 Depth Camera D400 Series Storage and Powered Conditions
Table 3-46. Depth Camera D400 Series Storage and Powered Conditions
Condition
Description
Min
Max
Unit
Storage (Ambient), Not Powered
Temperature (Sustained, Controlled)
(1)
0
50 oC
Temperature (Short Exposure)
(2)
-40
70 oC
Humidity
Temperature/ RH: 40oC / 90%
Ambient, Powered
(3)(4)
Temperature
0
35 oC
Backside Case Temperature, Powered
Temperature
0
44 oC
NOTE:
(1) Controlled conditions should be used for long term storage of product. (2) Short exposure represents temporary max limits acceptable for transportation conditions
Component Specification
337029-009 57
(3) The camera ambient temperature when powered, 0 oC to 35 oC is the validated range in which
Intel® qualified the camera. This range is a standard range in which Intel® qualifies consumer products. The camera internal thermal solution was designed to keep the internal components at or below their max powered temperatures. As stated in Table 3-21, the projector temperature and the projector’s operation below 60 oC is critical to the use of the projector for camera operations (use of projector can be determined by application developer based on necessity in
usage model). The Intel® RealSense™ Depth Camera D400 Series camera can function above the
35 oC max ambient temperature when powered with degradation in performance and no guarantee of the camera meeting the depth quality metric
(4) Ambient means environment while the camera is attached to a tripod using the camera’s tripod
screw attachment and is not connected to any mechanical or thermal material
3.8.2.2 Depth Camera D400 Series Thermal Solution Guidance
The Intel® RealSense™ Depth Camera D400 Series camera thermal solution was
designed taking into account the necessary thermal and mechanical aspects that goes into producing a standalone peripheral camera. Those aspects include the temperatures for all of the components associated with the module (projector, vision processor, IMU and camera sensors) when powered.
The Intel® RealSense™ SDK 2.0 (https://github.com/IntelRealSense/librealsense) provides temperature sensor readout based on Intel® RealSense™ camera
capabilities. The readouts should be used as a reference/guide, but not to be used as a replacement for thermal solutions that comply with the temperatures of the camera. If monitoring the temperature of the cameras is necessary due to thermal concern, it is recommended to monitor librealsense temperature readouts from the application level and act upon the temperatures if within < 5 oC of the max temperatures when powered of the component temperatures that the SDK makes available.
In order to aid in development of thermal solution and heat dissipation, the recommendations below provide some guidance to system integrators.
Recommendations to improve heat dissipation on the D400 Series Depth Cameras
Passive Cooling Recommendations:
Mounting Bracket Material – Utilize mounting screws (2xM3 screws) and
material that is the same or similar in nature (equal or lower thermal resistance or high conductivity) as the peripheral housing that the D400 Series depth cameras are made out of. Material – Aluminum 6000 series.
Increased Mating Surface – Mounting bracket mating surface with D400 series
depth camera can be increased by a factor of 2x. The larger the mounting bracket mating surface to the depth camera the better.
o Reduction of mating surface imperfections, defects, roughness and
gaps is recommended. Any increase in defects in the material can increase the thermal contact resistance reducing effectiveness of heat dissipation of the thermal solution. Attachment options should comprise of epoxy compounds or thermal tape/paste.
Heat Sink – The addition of a heat sink can also improve heat dissipation from
the D400 series depth camera. Use of a material such as Aluminum 6000
Component Specification
58 337029-009
series or similar with equal or lower thermal resistance to the mating surface is recommended.
Active Cooling Recommendations:
While heat pipes and liquid cooling solutions offer great advantages, they also
increase the complexity of system integration substantially. The use of a fan with direct air flow to the depth camera (back mounting surface 2xM3 screws) is preferable.
3.8.3 Depth Camera D400 Series Product Identifier and Material
Code
Table 3-47. Depth Camera D400 Series Product Identifier and Material Code
Production
Product Identifier Code-
Manufacture Configuration
Code
Product Material
Code
Depth Camera D415
J72476-100
961443
Depth Camera D415 (Multi Pack)
J72476-100
962304
Depth Camera D435
J72479-100
961448
Depth Camera D435 (Multi Pack)
J72479-100
962305
Depth Camera D435i
K38179-100
999AFR
Depth Camera D435i (Multi Pack)
K38179-100
999AXG
Depth Camera D455
K83122-100
999WCT
Depth Camera D455 (Multi Pack)
K83122-100
999WCR
3.8.4 Camera Lens Cleaning Procedure
1. Do not use any chemical or water on the camera lens
2. Remove dust and dirt as much as possible from the lens with a lens blower
brush.
3. Wipe with a dry, clean micro-fiber cloth.
§§
Functional Specification
337029-009 59
4 Functional Specification
4.1 Vendor Identification (VID) and Device
Identification (DID)
Table 4-1. Vendor ID and Device ID Table
Depth Module/Depth Camera
Vendor ID
Device ID
Intel® RealSense™ Depth Module D400
8086
0x0AD1
Intel® RealSense™ Depth Module D410
8086
0x0AD2
Intel® RealSense™ Depth Module D415
8086
0x0AD3
Intel® RealSense™ Depth Camera D415
8086
0x0AD3
Intel® RealSense™ Depth Module D420
8086
0x0AF6
Intel® RealSense™ Depth Module D430
8086
0x0AD4
Intel® RealSense™ Depth Camera D435
8086
0x0B07
Intel® RealSense™ Depth Camera D435i
8086
0x0B3A
Intel® RealSense™ Depth Camera D455
8086
0x0B5C
4.2 Vision Processor D4 Data Streams
Intel® RealSense Vision Processor D4 Depth imaging system provides high quality depth data to a host system. The depth data is generated with stereo vision technology that is optionally assisted by an infrared projector. The imaging system has the ability to syncronize with color stream.
Table 4-2. Image Formats (USB 3.1 Gen1)
Format
Resolution
Frame Rate
(FPS)
Comment
Z [16 bits]
1280x720
6,15,30
Depth
848X480
6,15,30,60,90
640x480
6,15,30,60,90
640x360
6,15,30,60,90
480x270
6,15,30,60,90
424x240
6,15,30,60,90
Y8 [8 bits]
1280x720
6,15,30
Luminance
Functional Specification
60 337029-009
Format
Resolution
Frame Rate
(FPS)
Comment
848X480
6,15,30,60,90
Left and Right Imager
640x480
6,15,30,60,90
640x360
6,15,30,60,90
480x270
6,15,30,60,90
424x240
6,15,30,60,90
UYVY [16 bits]
1280x720
6,15,30
Color Stream from Left Imager
(D400, D410 & D415)
848X480
6,15,30,60,90
640x480
6,15,30,60,90
640x360
6,15,30,60,90
480x270
6,15,30,60,90
424x240
6,15,30,60,90
YUY2 [16 bits]
1920x1080
6,15,30
Color Stream from RGB camera
(Camera D415 & D435/D435i)
1280x720
6,15,30
960x540
6,15,30,60
848x480
6,15,30,60
640x480
6,15,30,60
640x360
6,15,30,60
424x240
6,15,30,60
320x240
6,30,60
320x180
6,30,60
Calibration [24 bits]
1920x1080
15,25
D400/D410/D415
1280x800
15,25
D420/D430/D435/D435i
Intel® RealSense™
Self-Calibration
256x144
90
Intel® RealSense™ Self-
Calibration and Tare format
(D400 Series)
NOTE:
1. Depth and Color are mapped as separated interfaces. Each one of the interfaces is
working independent with the other interface (Virtual channel in MIPI and End Point in USB).
2. To ensure USB 3.1 support, connect D400 series USB connector first prior to connecting
depth device to host system port.
3. USB 2.0 supports a subset of the resolution/frame rate given the bandwidth
requirements. Please refer to firmware release notes as part of firmware releases -
https://dev.intelrealsense.com/docs/firmware-releases
Table 4-3. Image Formats (USB 3.1 Gen1) – D455
Format
Resolution
Frame Rate (FPS)
Comment
Z [16 bits]
1280x720
5,15,30
Depth
Functional Specification
337029-009 61
Format
Resolution
Frame Rate (FPS)
Comment
848X480
5,15,30,60,90
640x480
5,15,30,60,90
640x360
5,15,30,60,90
480x270
5,15,30,60,90
424x240
5,15,30,60,90
Y8 [8 bits]
1280x720
5,15,30
Luminance
Left and Right Imager
848X480
5,15,30,60,90
640x480
5,15,30,60,90
640x360
5,15,30,60,90
480x270
5,15,30,60,90
424x240
5,15,30,60,90
UYVY [16 bits]
1280x720
5,15,30
Color Stream from Left
Imager
848X480
5,15,30,60,90
640x480
5,15,30,60,90
640x360
5,15,30,60,90
480x270
5,15,30,60,90
424x240
5,15,30,60,90
YUY2 [16 bits]
1280x800
5,15,30
Color Stream from RGB
camera
Calibration uses 1280x720
15,30 FPS
848x480
5,15,30,60
640x480
5,15,30,60
640x360
5,15,30,60,90
480x270
5,15,30,60,90
424x240
5,15,30,60,90
Calibration IR
Imager Y12I
[24 bits]
1280x800
15,25
Intel®
RealSense™
Self-
Calibration
256x144
90
Intel® RealSense™ Self-
Calibration and Tare
format
NOTE:
1. Depth and Color are mapped as separated interfaces. Each one of the interfaces is
working independent with the other interface (Virtual channel in MIPI and End Point in USB).
2. To ensure USB 3.1 support, connect D400 series USB connector first prior to connecting
depth device to host system port.
3. USB 2.0 supports a subset of the resolution/frame rate given the bandwidth
requirements. Please refer to firmware release notes as part of firmware releases -
https://dev.intelrealsense.com/docs/firmware-releases
Functional Specification
62 337029-009
Table 4-4. Simultaneous Image Streams (USB 3.1 Gen1 & USB2.0)
Depth
Imager
Color
(Left
Imager)
D400/D410
Color (RGB
Camera)
D415/D435/D435i/D455
IMU
D435i/D455 Comment
Z16
Y8
Gyro &
Accelerometer
Z16 UYVY
Gyro &
Accelerometer
Z16
Y8
YUV2
Gyro & Accelerometer
Z16
YUV2
Gyro &
Accelerometer
NOTE:
1. RGB to depth hardware sync is only supported with the same frame rate for all streams.
2. For Depth and RGB camera simultaneous streaming, it is recommended to have color
resolution to be the same or higher than depth resolution.
3. USB 3.1 Gen1 supports all resolution/frame rate combinations in a typical dedicated USB port
configuration. On a USB hub with other devices (e.g. other RealSense cameras), considerations regarding bandwidth requirements have to be taken. To ensure USB 3.1 support, connect D400 series USB connector first prior to connecting depth device to host system port.
4. USB 2.0 supports a subset of the resolution/frame rate combinations given the bandwidth
requirements. Please refer to firmware release notes as part of firmware releases -
https://dev.intelrealsense.com/docs/firmware-releases
4.3 Depth Field of View (FOV)
The depth field of view is the common overlap of the individual left and right Imager field of view for which Vision Processor D4 provides depth data
Table 4-5. Depth Field of View
Format
D400/D410/D415
D420/D430/D435/D435i/D455
Horizontal FOV (VGA 4:3)
48
74
Vertical FOV (VGA 4:3)
40
62
Diagonal FOV (4:3)
60
88
Horizontal FOV (HD 16:9)
64
86
Vertical FOV (HD 16:9)
41
57
Diagonal FOV (HD 16:9)
72
94
NOTE:
Due to mechanical tolerances of +/-5%, Max and Min FOV values can vary from lens to
lens and module to module by ~ +/- 3 degrees.
Functional Specification
337029-009 63
The Depth FOV specified is at 2 meters distance.
4.4 Depth Field of View at Distance (Z)
Depth Field of View (Depth FOV) at any distance (Z) can be calculated using the equation
 

󰇝

 󰇞
Depth FOV = Depth Field of View
HFOV = Horizontal Field of View of Left Imager on Depth Module
B = Baseline
Z = Distance of Scene from Depth Module
Figure 4-1. Depth Field of View to Depth Map illustration
NOTES:
As the scene distance from the depth module increases, the invalid depth band decreases
in the overall depth image. Overall depth image is invalid depth band plus valid depth map.
Functional Specification
64 337029-009
4.5 Invalid Depth Band
The depth data generated with stereo vision uses the left imager as the reference for stereo matching resulting in a non-overlap region in the field of view of left and right imagers where we will not have depth data at the left edge of the frame. Closer scenes result in a wider invalid depth band than scenes at larger distances.
Figure 4-2. Left Invalid Depth Band
The width of the invalid depth band can be calculated using the following equations:
In terms of horizontal FOV
󰇛
󰇜
 󰇛    󰇛

󰇜󰇜
󰇛󰇜   
In terms of focal length
󰇛
󰇜
   󰇛  󰇜
󰇛󰇜   
B= Baseline
Z= Distance of Scene from Depth Module
F= Focal length
HFOV= Horizontal Field of View of Left Imager on Depth Module
Functional Specification
337029-009 65
HRES= Horizontal Resolution
The equations stand valid for a base configuration of camera settings. Default camera configuration in firmware may have settings optimized for depth performance that may impact the actual width of invalid depth band when compared to the calculated width of the invalid depth band from equations.
4.6 Minimum-Z Depth
The Minimum-Z Depth is the minimum distance from depth camera to scene for which Vision Processor D4 provides depth data.
Table 4-6. Minimum-Z Depth
Resolution
D400/D410/D415
D420/D430
D450
Min-Z (mm)
Min-Z (mm)
Min-Z (mm)
1280x720
450
280
520
848X480
310
195
350
640x480
310
175
320
640x360
240
150
260
480x270
180
120
200
424x240
160
105
180
4.7 Depth Quality Specification
There are a set of standard metrics based on accuracy, data validity, and temporal stability are used to quantify depth quality.
Although the module is designed for a certain depth FOV, the measurements are taken within 80% of this FOV, defined as region of interest (ROI). This ROI will best align with intended usage area and the optical parameters qualification field.
Table 4-7: Depth Quality Metric
METRIC
DEFINITION
(1)
Depth Accuracy
Measure the difference for valid pixels relative to a ground truth surface.
Fill Rate
Percentage of pixels that have a valid depth value.
Depth Standard Deviation
Measures the total spatial noise for each valid pixel relative to a best fit plane.
Pixel Temporal Noise
Measures the total temporal noise for each valid pixel relative to a best fit plane.
NOTES:
(1) Each measurement is taken from a predefined region of interest (ROI) which is within 80% of the depth
field of view (FOV).
Functional Specification
66 337029-009
Table 4-8: Depth Quality Metric Illustration
DEPTH ACCURACY AND DEPTH RMS ERROR
FILL RATE
Table 4-9. Depth Quality Specification
Metric
D400/D410/D415
(up to 2 Meters and
80% ROI, HD
Resolution)
D420/D430/D435/
D435i
(up to 2 Meters and
80% ROI, HD
Resolution)
D455
(up to 4 Meters and
80% ROI, HD
Resolution)
Z-accuracy (or absolute error)
≤ 2%
≤ 2%
≤ 2%
Fill rate
≥ 99%
≥ 99%
≥ 99%
RMS Error (or Spatial Noise)
≤ 2%
≤ 2%
≤ 2%
Temporal Noise
≤ 1%
≤ 1%
≤ 1%
NOTES:
1) The Depth Quality spec applies to depth modules that have been completely
integrated in overall system and has successfully completed the OEM calibration process.
2) For Depth Quality metric definitions and test methodology, refer to white paper
“Intel® RealSense™ Camera Depth Testing Methodology”
3) Laser Power:
a) D410/D415/D430/D435/D435i - 150mW, Exposure: Auto Exposure
Functional Specification
337029-009 67
b) D455 – 360mW, Exposure: Auto Exposure
4.8 Depth Start Point (Ground Zero Reference)
The depth start point or the ground zero reference can be described as the starting point or plane where depth = 0. For depth modules (D400, D410 & D415), this point is referenced from front of lens or from backside of module. For depth cameras (D415, D435/D435i, D455), this point is referenced from front of camera cover glass
Figure 4-3. Depth Module Depth Start Point Reference
Depth Start
Point
Front of Lens
Depth (Z)
Z”
D410 (Depth Module Side View)
Scene
Back of Module
Z’
Table 4-10. Depth Module Depth Start Point
Depth Module
Front of Lens (Z’)
Back of Module (Z”)
D400/D410/D415
-0.1mm
4.3mm
D420/D430
-3.2mm
7.5mm
D450
-0.1mm
4.3mm
NOTES:
If depth measurement reference is front of lens, then |Z’| should be added to measured value to determine Ground Truth. If depth measurement reference is back of module, then |Z”| should be subtracted to determine Ground Truth.
Functional Specification
68 337029-009
Figure 4-4. Depth Camera Depth Start Point Reference
Depth Start
Point
Front Cover Glass
Depth (Z)
Z’
D435 (Depth Camera Side View)
Scene
Table 4-11. Depth Cameras Depth Start Point
Depth Camera
Camera Front Glass (Z’)
D415
-1.1mm
D435/D435i
-4.2mm
D455
-4.55mm
NOTES:
If depth measurement reference is front cover glass, then |Z’| should be added to measured value to determine Ground Truth.
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337029-009 69
4.8.1 Depth Origin X-Y Coordinates
The depth origin X-Y coordinates is the X-Y center of left imager.
Figure 4-5. Depth Module X-Y Depth Origin Reference
Table 4-12. Depth Module X-Y Depth Origin Coordinates
Depth Module
Left Alignment hole1 to Left imager Center
D400
8mm
D410
8mm
D415
8mm
D420
8mm
D430
8mm
NOTES:
1. Left alignment hole on bottom stiffener of depth module
2. Left alignment hole and left imager center is on depth module centerline.
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70 337029-009
Figure 4-6. Depth Camera X-Y Depth Origin Reference
Table 4-13. Depth Camera X-Y Depth Origin Coordinates
Depth Camera
From Centerline of ¼-201 To Left Imager
D415
20mm
D435/D435i
17.5mm
D455
47.5mm
NOTES:
1. Center of tripod mounting hole (1/4-20)
4.9 Depth Camera Functions
D4 exposes the following Depth image settings.
Table 4-14. Depth Camera Controls
Control
Description
Min
Max
Manual Exposure
(1)
(ms)
Control sensor exposure period (400/410)
1
166
Manual Exposure
(1)
(ms)
Control sensor exposure period (430)
1
166
Manual gain
(1)
(Gain 1.0 = 16)
Control sensor digital gain.
16
248
Laser Power (on/off) (On = 1)
Power to IR Projector
0
1
Manual Laser Power (mW)
Laser Power setting (30mW steps)
0
360
Functional Specification
337029-009 71
Control
Description
Min
Max
Auto Exposure Mode (Enable = 1)
Auto Exposure Mode. When Auto Exposure is enabled, Exposure and Gain are set based on the environment condition
0
1
Auto Exposure ROI
Perform Auto Exposure on a selected ROI
T-0 L-0 B-1 R-1
T-719
L-1279
B-720
R-1280
Preset
Set Controls parameters based on Camera Usage
Meta Data Control
Enable/Disable Metadata
0
1
NOTES:
(1) – Not supported in Auto Exposure Mode
T - Top, L – Left, B - Bottom, R – Right
4.10 Color Camera Functions
Table 4-15. RGB Exposed Controls
Control
Description
Min
Max
Auto-Exposure Mode
Automatically sets the exposure time and gain for the frame.
0x1
0x8
Auto Exposure ROI
Perform Auto Exposure on a selected ROI
T-0 L-0
B-1
R-1
T-1079 L-1919 B-1080
R­1920
Manual Exposure Time
Sets the absolute exposure time when auto-exposure is disabled.
1
10000
Brightness
Sets the amount of brightness applied when auto-exposure is enabled.
-64
64
Contrast
Sets the amount of contrast based on the brightness of the scene.
0
100
Gain
Sets the amount of gain applied to the frame if auto-exposure is disabled.
0
128
Hue
Sets the amount of hue adjustment applied to the frame.
-180
180
Saturation
Sets the amount of saturation adjustment applied to the frame.
0
100
Functional Specification
72 337029-009
Control
Description
Min
Max
Sharpness
Sets the amount of sharpening adjustment applied to the frame.
0
100
Gamma
Sets amount of gamma correction applied to the frame.
100
500
White Balance Temperature Control
Sets the white balance when AWB is disabled.
2800
6500
White Balance Temperature Auto (AWB)
Enables or disables the AWB algorithm.
0
1
Power Line Frequency
Specified based on the local power line frequency for flicker avoidance.
0
3
Backlight Compensation
Sets a weighting amount based on brightness to the frame.
0
1
Low Light Comp
Low Light Compensation
0
1
NOTES:
T - Top, L – Left, B - Bottom, R – Right
4.11 IMU Specifications
Table 4-16. IMU Specifications
Camera
Parameter
Properties
Intel® RealSense™
Depth Camera D435i, Intel®
RealSense™ Depth
Camera D455
Intel® RealSense™
Depth Module D430+Intel®
RealSense™ Vision
Processor D4 Board V2
Degrees of Freedom
6
Acceleration Range
±4g
Accelerometer Sample Rate1
62.5, 250 (Hz)
Gyroscope Range
±1000 deg/s
Gyroscope Sample Rate2
200, 400 (Hz)
Sample Timestamp Accuracy
50 usec
NOTES:
1. The sample rate may differ from the absolute specified sample rate by ±5%.
It is advised to rely on the sample timestamp.
2. The sample rate may differ from the absolute specified sample rate by ±0.3%.
§§
Firmware
337029-009 73
5 Firmware
The firmware contains the operation instructions. Upon runtime, Vision Processor D4 loads the firmware and programs the component registers. If the Vision Processor D4 is configured for update or recovery, the unlocked R/W region of the firmware can be changed.
5.1 Update
During a firmware update, the firmware utility will issue a device firmware update command to the Vision Processor D4. The Vision Processor D4 will then reset into firmware update mode. The firmware utility uses a single binary file to maintain the firmware image. The firmware utility compares the firmware version installed on the camera to the firmware version file to be updated. Based on the comparison, the firmware utility will downgrade, upgrade, or skip if the versions match.
5.1.1 Update Limits
The firmware update engine does not allow infinite update cycles between older and current versions of firmware. The engine will establish a baseline version of firmware based on the latest firmware version installed. The engine will allow a return to a previous version or baseline version of firmware up to 20 times. After the 20th update, the engine will only allow an update to a firmware revision higher than the baseline version.
5.2 Recovery
A read only boot sector is built into firmware which enables basic operation regardless of the integrity of the operation instructions region. This ensures the imaging system can function in the case of firmware not be written properly. When a firmware recovery is required, the firmware utility will communicate with the recovery driver to set the DFU pin low and reset the imaging system in recovery mode.
Firmware Recovery can also be externally triggered by having controllable interrupt connected to the Vision Processor D4 DFU (Device Firmware Update) pin.
The firmware recovery sequence will be triggered by the firmware client utility. This client utility will communicate through ACPI _DSM to trigger the controllable interrupt (GPIO) at the appropriate times. The firmware recovery requires an ACPI _DSM interface to control the interrupt GPIO in configuring to firmware recovery state. The _DSM methods and BIOS use the Write to GPIO functions to set the controllable interrupt.
§ §
Software
74 337029-009
6 Software
6.1 Intel
®
RealSense™ Software Development Kit 2.0
Intel® RealSense™ SDK 2.0 is a cross-platform library for working with Intel® RealSense™ D400 Series. It is open source and available on
https://github.com/IntelRealSense/librealsense
The SDK at a minimum includes:
Intel® RealSense™ Viewer - This application can be used view, record and
playback depth streams, set camera configurations and other controls.
Depth Quality Tool - This application can be used to test depth quality,
including: distance to plane accuracy, Z accuracy, standard deviation of the Z accuracy and fill rate.
Debug Tools - These command line tools gather data and generate logs to
assist in debug of camera.
Code Examples - Examples to demonstrate the use of SDK to include D400
Series camera code snippets into applications.
Wrappers -Software wrappers supporting common programming languages
and environments such as ROS, Python, Matlab, node.js, LabVIEW, OpenCV, PCL, .NET and more
§§
System Integration
337029-009 75
7 System Integration
The small size of the stereo depth module and the separate placement of Vision Processor D4 provides system integrators flexibility to design into a wide range of products. Because the camera uses stereo vision technology, it is crucial that the stereo depth module does not flex throughout its service life. This creates unique mechanical and thermal implementation guidance. This section explains how to correctly integrate D4 depth camera into a system.
7.1 System Level Block Diagram
Figure 7-1. System Block Diagram
7.2 Vision Processor D4 System Integration
There are two options to integrate Vision Processor D4 into a system, either by integration of Vision Processor D4 Board or having the Vision Processor D4 and support components directly on the host processor motherboard. Vision Processor D4 Board simplifies system design and integration of the D4 depth camera system and Vision Processor D4 on Motherboard allows for a space optimized implementation of the D4 depth camera system.
7.2.1 Vision Processor D4 Board
The Vision Processor D4 Board has a standard USB Type-C connector and requires an appropriate USB Type-C cable to connect to a standard USB 2.0/USB 3.1 Gen 1 external port.
System Integration
76 337029-009
Figure 7-2. Intel® RealSense™ Vision Processor D4 Board
USB3 Type-C
Connector
7.2.2 Vision Processor D4 on Motherboard
In the Vision Processor D4 on Motherboard option, Vision Processor D4 and support components are directly placed on the host processor motherboard. The depth module receptacle is on the host processor motherboard for connection to the stereo depth module.
Figure 7-3. Vision Processor D4 on Motherboard (Illustration)
Stereo Depth Module
Host Processor SOC
Motherboard
Flex Interposer
D4
7.2.2.1 Firmware Update
SPI flash chip assembled onto the motherboard requires a bootable firmware image for Vision Processor D4 to boot or to run the firmware update utility provided by Intel.
There are two options program flash with firmware image or to recover a corrupt firmware image.
System Integration
337029-009 77
1. Pre-program SPI flash chip with firmware before assembly on to motherboard
or replace corrupt image with a good image SPI flash chip. The blank SPI flash chip can pre-programmed using a compatible adapter (i.e. PA8QFN8D) and supporting flash programmer.
2. A header or test points is connected in parallel to the SPI flash chip, then
programmed directly with an SPI flash programmer. Vision Processor D4 SPI interface is put in high Z state by strapping EPGPIO4 pin to Ground when programmed directly with an SPI flash programmer.
7.3 D4 Camera System Power Delivery
D4 camera system MUST keep stereo depth module and the Vision Processor D4 on the same power rails. The stereo depth module holds a safety region in EEPROM that is configured by firmware protected region. Keeping all components on the same rail prevents malicious software reset of the stereo depth module without causing a reset to the ASIC. By this protection we make sure that all the safety logic is kept locked as long as the device is active. Ensure power delivery implementation recommendation in Chapter 12 are followed in the design of D4 camera system.
Figure 7-4. D4 Camera System Power Scheme
Vision
Processor
D4
3.3V
1.8V
VDD
VBUS0 V 330
*AVDD
VPTX0VP DVDD
VDDPG
VDDPLL
VDDTS VDDPST
PMU_EN
FET
ISP
3.3V
1.8V
3.3V
1.8V
Stereo
Depth
Connector
0.9V
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78 337029-009
7.4 Vision Processor D4 Board for Integrated
Peripheral
In design of custom host processor motherboard with custom Vision Processor D4 Board for embedded applications, a low mechanical profile 10 pin USB 3.1 Gen 1 receptacle can be implemented on motherboard and Vision Processor D4 Board.
7.4.1 USB 3.1 Gen 1 Receptacle
Table 7-1. USB 3.1 Gen 1 Receptacle Characteristics
PROPERTY
DESCRIPTION
DIAGRAM
Shell Finish
Tin (Sn)
Lock
Yes
Ground Bar
Yes
Alignment Boss
No
Part Number
IPEX 20347-310E-12R
Table 7-2. USB 3.1 Gen 1 Receptacle Pin Out
POSITION
NAME
TYPE
DESCRIPTION
1
GND
-
Ground
2
USB3_SS
TX-
OUT
USB 3.1 Gen 1 Transmitter Negative
3
USB3_SS
TX+
OUT
USB 3.1 Gen 1 Transmitter Positive
4
GND
-
Ground
5
USB3_SS
RX-
IN
USB 3.1 Gen 1 Receiver Negative
6
USB3_SS
RX+
IN
USB 3.1 Gen 1 Receiver Positive
7
GND
-
Ground
8
DFU
IN
Device Firmware Update
9
3.3V
-
Supply Voltage, Connect to 3.3V
10
3.3V
-
Supply Voltage, Connect to 3.3V
7.4.2 USB 3.1 Gen 1 High Speed Cable Assembly
The high speed cable assembly is developed and procured by the system integrator. The cable assembly design is specific to the system definition and must meet cable assembly design specification.
Table 7-3. USB 3.1 Gen 1 Plug Characteristics
PROPERTY
DESCRIPTION
DIAGRAM
Shell Finish
Tin (Sn)
System Integration
337029-009 79
Friction Lock
Yes
Ground Bar
Yes
Plug Part Number
IPEX 2047-0103
Housing Part Number
IPEX 20346-010T-31
Table 7-4. Cable Assembly Specification
PROPERTY
DESCRIPTION
Cable Length
15 inches (max)
Controlled Impedance
85 Ohms with a tolerance of ± 10%.
Max Insertion Loss
<= 7.5 dB @2.5GHz
Cable Shielding
Each plug connected to the receptacle shield and GND bar.
The Transmit to receive pair crossover is expected on the Motherboard and not the cable assembly. This is done to allow for flat cable assemblies.
7.4.3 Transmit to Receive Crossover
The host USB 3.1 Gen 1 transmit signals must be connected to the Vision Processor D4 USB 3.1 Gen 1 receive signals. The host USB 3.1 Gen 1 receive signals must be connected to the Vision Processor D4 USB 3.1 Gen 1 transmit signals. It is recommended not to cross over the signals in the cable to allow cable wiring to be flat and as thin as possible.
Figure 7-5. Host Motherboard USB 3.1 Gen 1 Routing
HOST PROCESSOR MOTHERBOARD
D4 Card
Note: Crossover happens on Host
Processor Motheboard
Receptacle Receptacle
USB3
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80 337029-009
7.4.4 Motherboard Receptacle
Table 7-5. Motherboard Receptacle Properties
PIN
WIRE DESCRIPTION
Shielding
Metal shielding, connected to GND plane.
Grounding
Two ground bar connections in addition to the connector GND.
It is recommended that the motherboard receptacle be grounded as well as ground bar pads implemented.
Figure 7-6. Receptacle Ground Bar Motherboard Connections
7.4.5 Vision Processor D4 Board for Integrated Peripheral
Power Requirements
The Vision Processor D4 Board is powered by 5V from host processor motherboard through USB 3.1 Gen 1 receptacle pins 9 and 10
Table 7-6. Vision Processor D4 Board as Embedded Peripheral Power Requirements
Parameter
Min
Nom
Max
Unit
VCC
Supply Voltage
+/-5%
5V V
ICC
Supply Current
700
mA
7.5 Thermals
The system thermal design must ensure the component case temperature are not exceeded. Thermal models for Vision Processor D4 board and Depth modules are available to conduct a thermal evaluation and validate the system thermal design.
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337029-009 81
Table 7-7. Vision Processor D4 Board – Component Power and TDP at Max Operating
Mode
(1)
Component
Power
TDP
Unit
Vision Processor D4
618
618
mW
Color Camera ISP
196.83
196.83
mW
Voltage Regulators/Other
491.64
491.64
mW
All Components
1306.47
1306.47
mW
Table 7-8. Stereo Depth Module (Standard) – Component Power and TDP at Max
Operating Mode
(1)
Component
Power
TDP
Unit
Left Imager
118.5
118.5
mW
Right Imager
118.5
118.5
mW
IR Projector
1296
946
(2)
mW
Color Sensor
118.5
118.5
mW
EEPROM + Thermal Sensor
4
4
mW
All Components
1655.5
1305.5
mW
Table 7-9. Stereo Depth Module (Wide) – Component Power and TDP at Max Operating
Mode
(1)
Component
Power
TDP
Unit
Left Imager
177
177
mW
Right Imager
177
177
mW
IR Projector
1620
1260
(2)
mW
EEPROM + Thermal Sensor
4
4
mW
All Components
1978
1618
mW
1. Max. Operating Mode – Depth Resolution 1280X720 30FPS, Color Resolution -
1920X1080p 30FPS
2. The IR projector TDP is lower than power due to a percentage of energy dissipated as
photonic emissions rather than heat.
3. Voltage Regulator power is included as part of the individual component power
Table 7-10. Vision Processor D4 Board Components – Case Temperature Limits (Still
Air)
Component
Min
Max
(1)
Unit
Vision Processor D4
0
85
C
Color Camera ISP
0
70
C
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For the Depth Modules, case temperature is specified for the overall depth module and the thermocouple test location is any point on bottom metal stiffener
Figure 7-7. Bottom Stiffener Depth Module D410
Figure 7-8. Bottom Stiffener Depth Module D430
7.6 Stereo Depth Module Flex
It is critical that stereo depth module does not experience flex during system integration or during use after integration. Micron level flexing of the module can render the calibration incorrect and will result in poor performance or nonfunctional depth data. It is important for system designers to isolate the module from any chassis flex the system may encounter. While the module has a reinforcement housing, the housing is not intended to counter loads from chassis flex. The primary function of the housing is to prevent loss of calibration from handling and operating environments.
It is possible for the module to recover depth performance after experiencing
permanent deformation. However, the module’s ability to recover is dependent on the
amount of deformation experienced.
It is required, due to the high probability that some flex will be experienced by the module during system integration, to perform OEM calibration procedure after the stereo depth module is fully integrated into its final housing/location.
7.7 Stereo Depth Module Mounting Guidance
7.7.1 Screw Mount
The stereo depth module incorporates a screw hole and a screw fork for module mounting. The stereo depth module should be mounted on a large heat sink or a heat dissipating structure element using M1.6 screw at the screw hole and fork. The recommended torque for both screws is 1.6Kgf*cm. Thermal interface material should be used on backside region of IR projector and two stereo imagers between camera module and heat sink or heat dissipating structure element for thermal transfer.
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Figure 7-9. Stereo Depth Module Screw Mount
Screw Fork Screw Hole
7.7.2 Bracket Mount
The Stereo Depth module should be mounted on large heat sink or a heat dissipating structure element using the bracket placed at the center of module. The bracket is made up of 0.35mm thickness stainless steel. The bracket is secured to the heat sink or structure element using two M1.6 screws with recommended torque of 1.6Kgf*cm. The rectangular (400/410 bracket) or circular (430 bracket) cutout is for thermal interface filler or as IR Projector opening when reversing bracket to mount. Thermal interface material should be used on backside region of IR projector and two stereo imagers between camera module and heat sink or heat dissipating structure element for thermal transfer. The camera module should have a minimum of 0.2mm clearance from all sides except for the area around bracket. It is not required to have screws at the screw hole and screw fork at both ends of module when mounting camera module using bracket.
Figure 7-10. Stereo Depth Module Bracket
400/410 Bracket 430 Bracket
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Figure 7-11. Stereo Depth Module Bracket Mount
Figure 7-12. Stereo Depth Module Bracket Install
Bracket slides in from either length side of stereo camera module
7.7.3 Stereo Depth Module Air gap
A minimum 0.3mm air gap is recommended between highest components on the stereo depth module to the cover window
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Figure 7-13. Stereo Depth Module Air Gap
7.8 Thermal Interface Material
Thermal interface material, specifically thermal paste/grease is recommended to be inserted between the stereo depth module and the heat dissipating structure (heat sink) to improve the thermal coupling between these two components. A thermal paste with thermal conductivity in the 3-4W/mK range is recommended. This paste must be applied in a thin layer on the back side of the IR projector and also under the left and right imagers filling up the air gap under the Imagers.
7.9 Heat Sink
The heat sink or heat dissipating structure element used to mount stereo depth module and ASIC Board should be a minimum of 2-3mm in thickness. It is advisable to extend the heat sink by a few mm beyond the edges of the stereo depth module. It is also recommended to have thermal fins on the back side of the heat dissipating structure. In applications where weight is a concern, high thermal conductivity graphite tape can be attached to the back side of the heat sink. This graphite tape must be at least as big as the metal heat sink and extended out beyond the metal as much as possible for optimal cooling. Heat sink metal must be a high conductivity aluminum alloy or copper. In cases where the module is expected to operate at high ambient temperatures, additional airflow may be required to ensure temperature limits are not exceeded. These are guidelines for thermal integration of the D4 camera in the system, however actual testing or system level thermal modeling is recommended before finalizing solution.
7.10 Cover Design and Material Guidance
The stereo depth module components must be covered to minimize dust and humidity. The transparent cover material stack-up used must provide acceptable transmission based on the component wavelengths. Anti-reflective coatings can help increase the transmission of cover material. Cover material that reduces light transmission can result in poor depth performance and will decrease the working range of the camera. Nominally flat, non-distorting and low scattering cover material should be used.
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Table 7-11. Component Transmission
Component
Wavelength
Unit
Left and Right Imager (Intel® RealSense™ D410/D430)
400 to 865 (Visible and Infrared) @ 98% transmission rate or higher at all viewing and transmitting angles
nm
Left and Right Imager (Intel® RealSense™ D400/D420)
Visible spectrum @ 98% transmission rate or higher at all viewing and transmitting angles
nm
IR Projector
850nm ± 15 nm @ 98% transmission rate or higher at all viewing and transmitting angles
nm
NOTES:
1. Higher transmissions @ 98% transmission rate or higher is recommended and not a
requirement.
2. Intel RealSense Camera 400-Series provides control over laser power and sensor
exposure. Minor loss of transmission due to cover material transmissivity might be compensated by increasing exposure when less light is able to reach the sensors and by increasing laser power for IR projector pattern projection loss.
3. Uncoated clear acrylic (plexiglass) plastic cover is an example for cover material
4. Anti-reflective coatings can help increase the transmission of cover material.
If different cover material is used in front of the cameras and the IR projector to maximize transmission based on component wavelengths, cover design considerations should ensure that the FOV of the cameras and FOP of the IR projector are not impacted.
7.11 Gaskets
Gaskets are recommended for providing optical isolation and dust protection. However, gaskets can impede FOV and place unwanted stress on the module or the individual sensor lens holders.
Gasket static force can deform the cosmetic baffle/lens holder resulting in poor image quality and permanent damage to the camera. Gaskets placed on the module stiffener can transfer chassis flex into the camera module causing loss of depth data. Gasket thickness has a large effect on the static force applied to the module surface. The thinner the seal, the greater the static force applied. Once the gasket is compressed, the static force will increase exponentially.
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Figure 7-14. Illustration of Gasket Placement and Cover Material
7.11.1 Optical Isolation
It is recommended to isolate the left/right imagers and IR projector from each other to prevent reflections off the cover material. Not properly isolating the cameras can result in leakage light as shown in Figure 7-15. Example of Light Leakage Effects
To prevent light leakage, it is recommended to use a gasket material in between the cover holes and the module. The gasket material needs to be compliant so that it does not transmit chassis flex forces to the module.
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Figure 7-15. Example of Light Leakage Effects
7.11.2 Dust Protection
Dust particles can accumulate over the camera lenses which can be visually unappealing and degrade image quality.
7.12 Firmware Recovery
To support firmware recovery, a 3.3V controllable interrupt must be connected to the Vision Processor D4 DFU (Device Firmware Update) pin
The ability to recovery the image system if the firmware becomes corrupted requires D4 reset and DFU pin driven high for 160ms. The DFU pin should remain high when D4 is out of reset for D4 to boot in DFU mode. The 160ms ensures that the DFU pin is held high through the reset sequence.
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Figure 7-16. Firmware Recovery Sequence
Sequence
Timing Diagram
Firmware
Recovery
Reset (PRSTN Pin)
DFU Pin
7.13 Calibration Support
It is required to have an accessible USB port to access the host system. The accessible USB port would allow to stream images reliably to an external PC to determine calibration parameters and to write back camera calibration parameters via the host system
The USB port should be able to be configured in a mode where the USB port can access the host. The access to USB port is required at manufacturing and not intended to be available on shipped product or to end user.
7.14 Multi-Camera Hardware Sync
Intel® RealSense™ D400 Series supports hardware sync signal for multi-camera configuration. For multiple cameras to be hardware synchronized as to capture at identical times and frame rates, pins 5 (SYNC) and pins 9 (Ground) on external sensor sync connector will need to be connected. The external sensor sync connector is on Vision Processor D4 board and is accessible on Depth Cameras.
Figure 7-17. External Sensor Sync Connector Location on D4 Vision Processor D4 Board
External Sensor Sync Connector
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Figure 7-18. External Sensor Sync Connector Location on Depth Camera
D435/D435i/D455
External Sensor Sync Connector
For additional details on how to implement the multi-camera hardware sync feature, please refer to multi-camera white paper at https://realsense.intel.com/intel-
realsense-downloads/#whitepaper.
7.15 Handling Conditions
Table 7-12. Electrostatic Discharge Caution
To provide a consistent ESD protection level during D4 system assembly and rework, it is recommended that the JEDEC JESD625-A requirements standard be incorporated into the ESD environment controls.
§ §
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8 Platform Design Guidelines
The Platform Design Guidelines has been developed to ensure maximum flexibility for board designers while reducing the risk of board related issues. Design recommendations are based on Intel's simulations and are strongly recommended.
8.1 Vision Processor D4 on Motherboard
This Design Guidelines provides Vision Processor D4 on motherboard implementation recommendations for the Kaby Lake U/Y (7th Generation Intel® Core™ Processors) and Cherry Trail T4 (Intel® Atom™ Z8000 Processor Series) platforms with 8/10 layer Type 4 PCB.
Supported platform topologies are:
1. Vision Processor D4 with USB Host Interface
2. Vision Processor D4 with MIPI Host Interface
3. Vision Processor D4 on Board for USB Integrated Peripheral
Figure 8-1. Vision Processor D4 with USB Host Interface
MOTHERBOARD
Host SOC
USB 3.1 Gen1
Flex PCB
(2 sets of X2 MIPI)
D4 Vision
Processor
(2 sets of X2 MIPI)
(SL/MS)
DEPTH MODULE
Connector
Connector
Figure 8-2. Vision Processor D4 with MIPI Host Interface
MOTHERBOARD
Host SOC
X4 MIPI
(SL/MS)
Flex PCB
(2 sets of X2 MIPI)
D4 Vision
Processor
(2 sets of X2 MIPI)
(SL/MS)
DEPTH MODULE
Connector
Connector
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Figure 8-3. Vision Processor D4 on Board for USB Integrated Peripheral
HOST SOC
USB 3.1
Gen 1
MOTHERBOARD
Flex PCB
(2 sets of X2 MIPI)
D4 Vision
Processor
2 sets of X2 MIPI
(SL/MS)
DEPTH MODULE
Connector
Connector
D4 Board
IPEXIPEX
8.2 Kaby Lake U and Kaby Lake Y platforms
8.2.1 Kaby Lake Platform Introduction
The Kaby Lake U platform consists of a Kaby Lake U processor plus a Kaby Lake Platform Controller Hub (PCH) in the same Multi Chip Package (MCP). Similarly the Kaby Lake Y platform consists of a Kaby Lake Y processor plus a Kaby Lake PCH in the same Multi Chip Package (MCP).
Note: For Kaby Lake U/Y platform design guidelines, refer Kaby Lake U and Y Platform Design Guide. (Doc# 561280)
8.2.2 Supported PCB Stack-Up and Routing Geometries
Refer to Kaby Lake U/Y Platform Design Guide for type 4 PCB stack up, Breakout/Breakin geometries, Main Route stripline/microstrip geometries and Via recommendations. It is strongly recommended to follow the given impedance criteria in the design guide for the given interface.
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8.2.3 Vision Processor D4 on Motherboard with USB Host
Interface
8.2.3.1 USB 3.1 Gen 1 Motherboard Routing
Figure 8-4. Host Processor - Vision Processor D4
D4
Table 8-1. Host Transmit – Vision Processor D4 Receive Routing Guidelines
Parameter
Breakout
(BO)
Main
Route
(MR)
Breakin
(BI)
Total Allowed Length
(L_BO + L_MR + L_BI)
Maximum Segment Length (Inches)
0.25
15-BO-BI
0.25
15
Maximum Allowed Channel Insertion loss (dB)
<=15 dB @2.5MHz
Table 8-2. Vision Processor D4 Transmit - Host Receive Routing Guidelines
Parameter
Breakout
(BO)
Main
Route
(MR)
Breakin
(BI)
Total Allowed Length
(L_BO + L_MR + L_BI)
Maximum Segment Length (Inches)
0.25
15-BO-BI
0.25
15
Maximum Allowed Channel Insertion loss (dB)
<=15 dB @2.5MHz
NOTES:
Simulation results shows that overall 15 inch channel routing is good for USB 3.1 Gen 1
Vision Processor D4 to Host connection motherboard. This connection does not include any connector or cable.
All routing is recommended to be 85 ohm impedance.
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Breakout/Breakin should be maximum length of 250 mil for 85 ohm routing, if there is any
impedance variation due to narrow escape BGA breakout, the maximum routing length should be 150mil.
Maximum number of via count:4 (including package microvia)
It is strongly recommended that overall channel loss is within -15dB for satisfactory
performance.
8.2.4 Vision Processor D4 on Motherboard with MIPI Host
Interface
8.2.4.1 MIPI Motherboard Routing
Figure 8-5. Vision Processor D4 Transmit - Host Receive
D4
Table 8-3. Vision Processor D4 Transmit – Host Receive Routing Guidelines
Parameter
Breakout
(BO)
Main
Route
(MR)
Breakin
(BI)
Total Allowed Length
(L_BO + L_MR + L_BI)
Maximum Segment Length (Inches)
0.25
15-BO-BI
0.25
15
Maximum Allowed Channel Insertion loss (dB)
<=5.5 dB @750MHz
NOTES:
Maximum via count = 4 vias including the first micro-via from package ball.
Minimum stripline breakout pair-to-pair spacing of 2.36 mils is allowed near package ball
out region with maximum length of 250 mils.
Main route and Break-in nominal impedance is required to be consistent. Example: 85 ohm
main route and 85 ohm break-in. Mixture of nominal impedance is not recommended.
Length matching within a differential pair is +/- 5 mils maximum.
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The maximum allowed channel insertion loss budget dictates the total allowed length. The
total insertion loss allowed for interconnect from the D4 package die bump to Kaby Lake SoC package die bump is about 5.5dB at 750 MHz. It should be noted that though only the insertion loss value at the fundamental frequency (750 MHz) is specified, the insertion loss curve up to about 1.5 GHz should be well behaved with no strong resonance or ripple.
8.2.4.2 MIPI Motherboard Routing (Stereo Depth Module Transmit to
Vision Processor D4 Receive)
Figure 8-6. Stereo Depth Transmit - Vision Processor D4 Receive
D4
Depth
Module
Board Routing
Table 8-4. Stereo Depth Module Transmit - Vision Processor D4 Receive Routing
Guidelines
Parameter
Breakout
(BO)
Main Route
(MR)
Breakin
(BI)
Flex
Interposer
Length
(L_Cable)
Camera
Board
Length
(L_Camera)
Total Allowed Length
(L_MB + L_Cable +
L_Camera)
Maximum
Segment Length
(Inches)
0.25
15 –
L_Cable -
L_Camera –
BO - BI
0.25
15-L_MB­L_camera
L_Camera
(max ~2
inches)
15
Maximum
Allowed Channel
Insertion loss
(dB)
<=5.5 dB @750MHz
NOTES:
Stereo depth module MIPI routing length are assumed to be 2 inches (max)
Maximum via count = 3 vias including the first micro-via from package ball.
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Minimum stripline breakout pair-to-pair spacing of 2.36 mils is allowed near package ball
out region with maximum length of 250 mils.
Main route and Break-in nominal impedance is required to be consistent. Example: 85 ohm
main route and 85 ohm break-in. Mixture of nominal impedance is not recommended.
Length matching within a differential pair is +/- 5 mils maximum.
No length match requirements for signals routed to different camera modules.
The maximum allowed channel insertion loss budget dictates the total allowed length. The
total insertion loss allowed for interconnect from the package die bump to the connector on the camera module is about 5.5dB at 750 MHz as shown in the table. This recommendation allows the use of any cable type as long as the maximum allowed insertion loss is met. It should be noted that though only the insertion loss value at the fundamental frequency (750 MHz) is specified, the insertion loss curve up to about 1.5 GHz should be well behaved with no strong resonance or ripple.
Flex Interposer recommendation: 85-100ohm impedance with maximum length of 4-6
inches. The recommended interposer should be Flex PCB based design.
Figure 8-7. Flex Interposer PCB Stack-Up
8.2.5 Vision Processor D4 Board for Integrated Peripheral (USB
3.1 Gen 1 Host to Vision Processor D4 Routing)
Figure 8-8. USB 3.1 Gen 1 Host to Vision Processor D4 Topology
D4
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Table 8-5. USB 3.1 Gen 1 Host to Vision Processor D4 Routing Guidelines
Vision Processor D4 Board
USB 3.1
Gen 1
Cable
Host Motherboard
Parameter
Breakout
(BO)
Main Route
(MR)
Breakin
(BI)
Cable
Length
(L_Cable)
Breakout
(BO)
Main Route
(MR)
Breakin
(BI)
Maximum
Segment
Length
(Inches)
0.25 2 0.25
15 (max)
0.25 5 0.25
Maximum
Allowed Channel
Insertion loss
(dB)
<= 15 dB @ 2.5GHz
Max recommended USB 3.1 Gen 1 cable loss <= 7.5 dB @2.5GHz
NOTES:
The maximum allowable motherboard routing of USB 3.1 Gen 1 signals on Host PCB should
be 5-6inch inch and routing on Vision Processor D4 Board should be 2-3inch.
It is recommended that an 85 ohm common mode choke (CMC) be designed in line with
both the USB 3.1 Gen 1 signals. The CMC should be placed as close to the connector as possible.
It is required that a 0.1μF AC coupling capacitor is designed in series with both the USB 3.1
Gen 1 signals.
The USB 3.1 Gen 1 cable assembly should have a differential impedance of 85 Ohms with a
tolerance of ± 10%.
The max cable length should not exceed 15 inch with target loss of 7.5dB@2.5GHz
Overall channel loss including cable should not exceed 15dB @2.5GHz
8.2.6 USB2.0 Design Guidelines (USB2 Host to Vision Processor
D4 Routing)
Figure 8-9. USB2.0 Host to Vision Processor D4
D4
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98 337029-009
Parameter
Breakout
(BO)
Main
Route
(MR)
Breakin
(BI)
Total Allowed Length
(L_BO + L_MR + L_BI)
Maximum Segment Length (Inches)
0.25
15-BO-BI
0.25
15
Maximum Allowed Channel Insertion loss (dB)
NOTES:
Simulation results shows that overall 15 inch channel routing is good for USB2.0 D4 to Host
topology on motherboard. This topology does not include any connector or cable.
All routing is recommended to be 85 ohm
Breakout/breakin should be max of 250mil for 85ohm routing, if there is any impedance
variation due to narrow escape BGA breakout, the max routing should be 150mil.
Maximum number of via count:4 (including package microvia)
It is strongly recommended that overall channel loss to be within -15dB for
satisfactory performance
8.3 Cherry Trail T4 Platform
8.3.1 Cherry Trail T4 Platform Introduction
The Cherry Trail T4 is the Intel Architecture (IA) SoC that integrates the Intel
®
processor core, Graphics, Memory Controller, and I/O interfaces into a single system­on-chip solution.
Note: For Cherry Trail T4 platform design guidelines, refer Cherry Trail T4 Platform Design Guide. (Doc# 537901)
Note: Cherry Trail platform supports 2 SoC skus, T3 and T4. The Vision Processor D4 platform design guidelines discussed in this chapter are only applicable to T4 based Cherry Trail platform. For information on Cherry Trail T4 SoC, refer to Intel® Atom™ Z8000 Processor Series - External Design Specification (EDS) (Doc# 539071)
8.3.2 Vision Processor D4 Platform Design Guidelines
The Vision Processor D4 platform design guidelines on Cherry Trail T4 platform would follow the same guidelines specified for Kaby Lake U and Y platforms.
8.3.2.1 Supported PCB Stack-Up and Routing Geometries
Refer to Cherry Trail T4 Platform Design Guide for Type 4 PCB stack up, Breakout/Breakin routing geometry, Main Route stripline/microstrip geometry and Via recommendations. It is strongly recommend to follow the given impedance criteria in the design guide for the given interface.
§§
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9 Regulatory Compliance
9.1 System Laser Compliance
The Intel® RealSense™ D400 series certification is transferable to the system and no system recertification is required. However, the following statements and labels must be included in the user manual of the end product
9.1.1 Certification Statement
This product is classified as a Class 1 Laser Product under the EN/IEC 60825-1, Edition 3 (2014) internationally.
This product complies with FDA performance standards for laser products except for conformance with IEC 60825-1 Ed. 3 as described in Laser Notice No. 56, dated May 8, 2019.
9.1.2 Explanatory Label
9.1.3 Cautionary Statements
System integrators should refer to their respective regulatory and compliance owner to finalize regulatory requirements for a specific geography.
Caution - Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure.
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Do not power on the product if any external damage was
observed.
Do not attempt to open any portion of this laser product. There
are no user serviceable parts.
Invisible laser radiation when opened. Avoid direct exposure to
beam.
There are no service/maintenance, modification, or disassembly
procedures for the stereo module and infrared projector. The system integrator must either notify Intel or return modules before any failure analysis is performed.
Modification or service of the stereo module, specifically the
infrared projector, may cause the emissions to exceed Class 1.
Do not try to update camera firmware that is not officially
released for specific camera module SKU and revision.
9.1.4 US FDA Accession Number
Table 9-1. U.S. FDA Accession Number
Component
U.S. FDA accession numbers
Intel® RealSense™ Depth Module D410/D415/D430/D450
1420260
Intel® RealSense™ Depth Camera D415/D435/D435i/D455
1420260
This accession number should be entered into Box B.1 of the Food and Drug Administration (FDA) 2877 Declaration for Imported Electronic Products Subject to Radiation Control Standards.
9.2 Regulatory Compliance
9.2.1 Manufacturer’s Information
Intel Corporation: Attn: Corp. Quality 2200 Mission College Blvd, Santa Clara, CA 95054-1549, USA
9.2.2 EU Single Place of Contact
Att. Corp Quality Intel Deutschland GmbH Am Campeon 10-12 Neubiberg, 85579 – Germany
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