Intel BX80619I73960X, Core i7-3960X, Core i7-3970X, Core i7-3930K, Core i7-3820 Datasheet

Intel® Core™ i7 Processor Family for the LGA-2011 Socket

Datasheet, Volume 1

Supporting Desktop Intel® Core™ i7-3960X and i7-3970X Extreme Edition Processor for the LGA-2011 Socket

Supporting Desktop Intel for the LGA-2011 Socket

This is volume 1 of 2.

November 2012

Core™ i7-39xxK and i7-38xx Processor Series

Reference Number: 326196-002

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PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

life sustaining, critical control or safety systems, or in nuclear facility applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

This document contains information on products in the design phase of development. The information here is subject to change without notice. Do not finalize a design with this information.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see

http://www.intel.com/products/ht/hyperthreading_more.htm.

Enhanced Intel SpeedStep® Technology - See the Processor Spec Finder

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor

Intel (VMM) and, for some uses, certain computer system software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible with all operating systems. Please check with your application vendor.

Intel

Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see

http://www.intel.com/technology/turboboost/.

Intel

Active Management Technology requires the platform to have an Intel® AMT-enabled chipset, network hardware and software, connection with a power source and a network connection.

64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel configurations. Consult with your system vendor for more information.

64 architecture. Performance will vary depending on your hardware and software

or contact your Intel representative for more information.

Δ Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor

family, not across different processor families. See http://www.intel.com/products/processor_number

C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the I2C bus/protocol and was developed

I by Intel. Implementations of the I

C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and

North American Philips Corporation.

Intel, Enhanced Intel SpeedStep Technology, Intel Core, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

for details.

2 Datasheet, Volume 1

Table of Contents

1Introduction..............................................................................................................9

1.1 Processor Feature Details ................................................................................... 10

1.1.1 Supported Technologies .......................................................................... 10

1.2 Interfaces ........................................................................................................ 11

1.2.1 System Memory Support ......................................................................... 11

1.2.2 PCI Express* ......................................................................................... 11

1.2.3 Direct Media Interface Gen 2 (DMI2)......................................................... 13

1.2.4 Platform Environment Control Interface (PECI)........................................... 13

1.3 Power Management Support ............................................................................... 13

1.3.1 Processor Package and Core States........................................................... 13

1.3.2 System States Support ........................................................................... 13

1.3.3 Memory Controller.................................................................................. 13

1.3.4 PCI Express* ......................................................................................... 13

1.4 Thermal Management Support ............................................................................ 14

1.5 Package Summary............................................................................................. 14

1.6 Terminology ..................................................................................................... 14

1.7 Related Documents ........................................................................................... 16

2Interfaces................................................................................................................ 17

2.1 System Memory Interface .................................................................................. 17

2.1.1 System Memory Technology Support ........................................................ 17

2.1.2 System Memory Timing Support............................................................... 17

2.2 PCI Express* Interface....................................................................................... 17

2.2.1 PCI Express* Architecture ....................................................................... 17

2.2.1.1 Transaction Layer ..................................................................... 18

2.2.1.2 Data Link Layer ........................................................................ 18

2.2.1.3 Physical Layer .......................................................................... 19

2.2.2 PCI Express* Configuration Mechanism ..................................................... 19

2.3 DMI2/PCI Express* Interface .............................................................................. 19

2.3.1 DMI2 Error Flow..................................................................................... 19

2.3.2 DMI2 Link Down..................................................................................... 20

2.4 Platform Environment Control Interface (PECI)...................................................... 20

3 Technologies ........................................................................................................... 21

3.1 Intel

3.2 Security Technologies ........................................................................................ 24

3.3 Intel

3.4 Intel

3.5 Enhanced Intel

3.6 Intel

Virtualization Technology (Intel® VT) ......................................................... 21

3.1.1 Intel

3.1.2 Intel

3.1.3 Intel

3.1.4 Intel

3.2.1 Intel

3.2.2 Execute Disable Bit................................................................................. 24

Hyper-Threading Technology (Intel® HT Technology).................................... 24

Turbo Boost Technology ........................................................................... 25

3.4.1 Intel

Advanced Vector Extensions (Intel® AVX) ................................................... 26

Virtualization Technology (Intel® VT) for Intel® 64

and IA-32 Intel

Virtualization Technology (Intel® VT) for Intel® 64

and IA-32 Intel

Virtualization Technology (Intel® VT) for

Directed I/O (Intel

3.1.3.1 Intel

3.1.3.2 Intel

Virtualization Technology Processor Extensions................................. 23

AES New Instructions (Intel® AES-NI) ............................................. 24

Turbo Boost Operating Frequency ................................................... 25

SpeedStep® Technology............................................................. 25

Architecture (Intel® VT-x) Objectives ............................... 21

Architecture (Intel® VT-x) Features .................................. 22

VT-d) Objectives ....................................................... 22

Virtualization Technology (Intel® VT) for

Directed I/O (Intel

Virtualization Technology (Intel® VT) for

Directed I/O (Intel

VT-d) Features Supported ............................. 23

VT-d) Processor Feature Additions.................. 23

Datasheet, Volume 1 3

4 Power Management .................................................................................................27

4.1 Advanced Configuration and Power Interface (ACPI) States Supported......................27

4.1.1 System States........................................................................................27

4.1.2 Processor Package and Core States ...........................................................27

4.1.3 Integrated Memory Controller States.........................................................29

4.1.4 DMI2 / PCI Express* Link States...............................................................29

4.1.5 G, S, and C State Combinations................................................................30

4.2 Processor Core / Package Power Management .......................................................30

4.2.1 Enhanced Intel

SpeedStep® Technology ..................................................30

4.2.2 Low-Power Idle States.............................................................................31

4.2.3 Requesting Low-Power Idle States ............................................................32

4.2.4 Core C-states .........................................................................................32

4.2.4.1 Core C0 State ...........................................................................33

4.2.4.2 Core C1/C1E State ....................................................................33

4.2.4.3 Core C3 State ...........................................................................33

4.2.4.4 Core C6 State ...........................................................................33

4.2.4.5 Core C7 State ..........................................................................33

4.2.4.6 C-State Auto-Demotion .............................................................33

4.2.5 Package C-States ...................................................................................34

4.2.5.1 Package C0 ..............................................................................35

4.2.5.2 Package C1/C1E........................................................................35

4.2.5.3 Package C2 State ......................................................................36

4.2.5.4 Package C3 State ......................................................................36

4.2.5.5 Package C6 State ......................................................................36

4.2.6 Package C-State Power Specifications........................................................37

4.3 System Memory Power Management ....................................................................37

4.3.1 CKE Power-Down....................................................................................37

4.3.2 Self Refresh ...........................................................................................38

4.3.2.1 Self Refresh Entry .....................................................................38

4.3.2.2 Self Refresh Exit .......................................................................38

4.3.2.3 DLL and PLL Shutdown...............................................................38

4.3.3 DRAM I/O Power Management..................................................................38

4.4 DMI2 / PCI Express* Power Management ..............................................................38

5 Thermal Management Specifications ........................................................................39

6 Signal Descriptions ..................................................................................................41

6.1 System Memory Interface ...................................................................................41

6.2 PCI Express* Based Interface Signals...................................................................42

6.3 DMI2 / PCI Express* Port 0 Signals ......................................................................44

6.4 Platform Environment Control Interface (PECI) Signal.............................................44

6.5 System Reference Clock Signals ..........................................................................44

6.6 JTAG and TAP Signals.........................................................................................45

6.7 Serial VID Interface (SVID) Signals ......................................................................45

6.8 Processor Asynchronous Sideband and Miscellaneous Signals...................................46

6.9 Processor Power and Ground Supplies ..................................................................48

7 Electrical Specifications ...........................................................................................49

7.1 Processor Signaling............................................................................................49

7.1.1 System Memory Interface Signal Groups....................................................49

7.1.2 PCI Express* Signals...............................................................................49

7.1.3 DMI2/PCI Express* Signals ......................................................................49

7.1.4 Platform Environmental Control Interface (PECI).........................................49

7.1.4.1 Input Device Hysteresis .............................................................50

7.1.5 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN) .........................50

7.1.5.1 PLL Power Supply......................................................................50

7.1.6 JTAG and Test Access Port (TAP) Signals....................................................51

7.1.7 Processor Sideband Signals......................................................................51

7.1.8 Power, Ground and Sense Signals .............................................................51

4 Datasheet, Volume 1

7.1.8.1 Power and Ground Lands ........................................................... 51

7.1.8.2 Decoupling Guidelines ............................................................... 52

7.1.8.3 Voltage Identification (VID)........................................................ 52

7.1.9 Reserved or Unused Signals..................................................................... 56

7.2 Signal Group Summary ...................................................................................... 56

7.3 Power-On Configuration (POC) Options................................................................. 59

7.4 Absolute Maximum and Minimum Ratings ............................................................. 60

7.4.1 Storage Conditions Specifications ............................................................. 60

7.5 DC Specifications .............................................................................................. 61

7.5.1 Voltage and Current Specifications............................................................ 61

7.5.2 Die Voltage Validation............................................................................. 63

7.5.2.1 V

7.5.3 Signal DC Specifications .......................................................................... 64

7.5.3.1 PCI Express* DC Specifications................................................... 69

7.5.3.2 DMI2 / PCI Express* DC Specifications ........................................ 69

7.5.3.3 Reset and Miscellaneous Signal DC Specifications.......................... 69

8 Processor Land Listing............................................................................................. 71

9 Package Mechanical Specifications ........................................................................ 119

Overshoot Specifications ...................................................... 63

Figures

1-1 Processor Platform Block Diagram Example........................................................... 10

1-2 PCI Express* Lane Partitioning and Direct Media Interface Gen 2 (DMI2) .................. 12

2-1 PCI Express* Layering Diagram........................................................................... 18

2-2 Packet Flow through the Layers........................................................................... 18

4-1 Idle Power Management Breakdown of the Processor Cores..................................... 31

4-2 Thread and Core C-State Entry and Exit .............................................................. 31

4-3 Package C-State Entry and Exit ........................................................................... 35

7-1 Input Device Hysteresis ..................................................................................... 50

7-2 VR Power-State Transitions................................................................................. 54

7-3 V

Overshoot Example Waveform ...................................................................... 63

Tables

1-1 Terminology ..................................................................................................... 14

1-2 Reference Documents ........................................................................................ 16

4-1 System States .................................................................................................. 27

4-2 Package C-State Support.................................................................................... 28

4-3 Core C-State Support......................................................................................... 28

4-4 System Memory Power States............................................................................. 29

4-5 DMI2/PCI Express* Link States ........................................................................... 29

4-6 G, S, and C State Combinations .......................................................................... 30

4-7 P_LVLx to MWAIT Conversion ............................................................................. 32

4-8 Coordination of Core Power States at the Package Level ......................................... 35

4-9 Package C-State Power Specifications .................................................................. 37

6-1 Memory Channel DDR0, DDR1, DDR2, DDR3......................................................... 41

6-2 Memory Channel Miscellaneous ........................................................................... 42

6-3 PCI Express* Port 1 Signals................................................................................ 42

6-4 PCI Express* Port 2 Signals................................................................................ 43

6-5 PCI Express* Port 3 Signals................................................................................ 43

6-6 PCI Express* Miscellaneous Signals ..................................................................... 44

Datasheet, Volume 1 5

6-7 DMI2 to Port 0 Signals........................................................................................44

6-8 PECI Signals .....................................................................................................44

6-9 System Reference Clock (BCLK{0/1}) Signals........................................................44

6-10 JTAG and TAP Signals.........................................................................................45

6-11 SVID Signals.....................................................................................................45

6-12 Processor Asynchronous Sideband Signals.............................................................46

6-13 Miscellaneous Signals .........................................................................................47

6-14 Power and Ground Signals ..................................................................................48

7-1 Power and Ground Lands ....................................................................................51

7-2 SVID Address Usage ..........................................................................................54

7-3 Voltage Identification Definition ...........................................................................55

7-4 Signal Description Buffer Types ...........................................................................56

7-5 Signal Groups ...................................................................................................57

7-6 Signals with On-Die Termination..........................................................................59

7-7 Power-On Configuration Option Lands...................................................................59

7-8 Processor Absolute Minimum and Maximum Ratings ...............................................60

7-9 Voltage Specification ..........................................................................................61

7-10 Current (Icc_Max and Icc_TDC) Specification.........................................................62

7-11 V

Overshoot Specifications...............................................................................63

7-12 DDR3 Signal DC Specifications.............................................................................64

7-13 PECI DC Specifications .......................................................................................65

7-14 System Reference Clock (BCLK{0/1}) DC Specifications..........................................66

7-15 SMBus DC Specifications.....................................................................................66

7-16 JTAG and TAP Signals DC Specifications................................................................67

7-17 Serial VID Interface (SVID) DC Specifications ........................................................67

7-18 Processor Asynchronous Sideband DC Specifications...............................................68

7-19 Miscellaneous Signals DC Specifications ................................................................69

8-1 Land Name .......................................................................................................72

8-2 Land Number ....................................................................................................95

6 Datasheet, Volume 1

Revision History

Revision

Number

001 • Initial Release November 2011

002

• Updated to clarify references to PCI Express*

•Added Intel

Core™ i7-3970X Processor Extreme Edition

Description Revision Date

November 2012

Datasheet, Volume 1 7

8 Datasheet, Volume 1

Introduction

1 Introduction

The Intel® Core™ i7 processor family for the LGA-2011 socket is the next generation of 64-bit, multi-core desktop processor built on 32-nanometer process technology. Based on the low-power/high performance Intel® Core™ i7 processor microarchitecture, the processor is designed for a two-chip platform as opposed to the traditional three-chip platforms (processor, MCH, and ICH). The two-chip platform consists of a processor and the Platform Controller Hub (PCH) and enables higher performance, easier validation, and improved x-y footprint. Refer to Figure 1-1 for a block diagram of the processor platform.

The processor features up to 40 lanes of PCI Express* links capable of up to 8.0 GT/s, and 4 lanes of DMI2/PCI Express* 2.0 interface with a peak transfer rate of 5.0 GT/s. The processor supports up to 46 bits of physical address space and 48 bits of virtual address space.

Included in this family of processors is an integrated memory controller (IMC) and integrated I/O (IIO) (such as PCI Express* and DMI2) on a single silicon die. This single die solution is known as a monolithic processor.

This document is Volume 1 of the datasheet for the Intel for the LGA-2011 socket. The complete datasheet consists of two volumes. This document provides DC electrical specifications, land and signal definitions, interface functional descriptions, power management descriptions, and additional feature information pertinent to the implementation and operation of the processor on its platform. Volume 2 provides register information. Refer to Section 1.7, “Related

Documents” for access to Volume 2.

Core™ i7 processor family

Note: Throughout this document, the Intel

socket may be referred to as “processor”.

Note: Throughout this document, the Desktop Intel

LGA-2011 socket refers to the i7-3930K.

Note: Throughout this document, the Desktop Intel

LGA-2011 socket refers to the i7-3820.

Note: Throughout this document, the Intel

referred to as “PCH”.

Core™ i7 processor family for the LGA-2011

X79 Chipset Platform Controller Hub may be

Core™ i7-39xxK processor series for the

Core™ i7-38xx processor series for the

Datasheet, Volume 1 9

Figure 1-1. Processor Platform Block Diagram Example

Processor

DDR3

PCH

DMI2

PCIe*

...

SATA

ethernet

BIOS

PCIe*

x16

PCIe*

x16

SCU Uplink

Note: if SCU Uplink is used, the x8 PCIe* device shown is limited to x4.

Introduction

1.1 Processor Feature Details

• Up to 6 Execution Cores

• Each core supports two threads (Intel 12 threads

• A 32-KB instruction and 32-KB data first-level cache (L1) for each core

• A 256-KB shared instruction/data mid-level (L2) cache for each core

• Up to 15 MB last level cache (LLC): up to 2.5 MB per core instruction/data last level cache (LLC), shared among all cores

1.1.1 Supported Technologies

•Intel® Virtualization Technology (Intel® VT)

•Intel

• Execute Disable Bit

•Intel

• Enhanced Intel

10 Datasheet, Volume 1

Virtualization Technology for Directed I/O (Intel® VT-d)

Virtualization Technology Intel® Core™ i7 processor family for the LGA-2011

socket Extensions

64 Architecture

Streaming SIMD Extensions 4.1 (Intel® SSE4.1)

Streaming SIMD Extensions 4.2 (Intel® SSE4.2)

Advanced Vector Extensions (Intel® AVX)

Hyper-Threading Technology (Intel® HT Technology)

Turbo Boost Technology

SpeedStep® Technology

Hyper-Threading Technology) for up to

Introduction

1.2 Interfaces

1.2.1 System Memory Support

• The processor supports 4 DDR3 channels with 1 unbuffered DIMM per channel

• Unbuffered DDR3 DIMMs supported

• Data burst length of eight cycles for all memory organization modes

• Memory DDR3 data transfer rates of 1066, 1333, and 1600 MT/s

• DDR3 UDIMM standard I/O Voltage of 1.5 V

• 1-Gb, 2-Gb, and 4-Gb DDR3 DRAM technologies supported for these devices:

— UDIMMs x8, x16

• Up to 2 ranks supported per memory channel, 1 or 2 ranks per DIMM

• Open with adaptive idle page close timer or closed page policy

• Command launch modes of 1n/2n

• Improved Thermal Throttling with dynamic CLTT

• Memory thermal monitoring support for DIMM temperature using two memory signals, MEM_HOT

1.2.2 PCI Express*

• Support for PCI Express* 2.0 (5.0 GT/s), PCI Express* (2.5 GT/s), and capable of up to PCI Express* 8.0 GT/s.

• Up to 40 lanes of PCI Express* interconnect for general purpose PCI Express devices capable of up to 8.0 GT/s speeds that are configurable for up to 10 independent ports.

• Negotiating down to narrower widths is supported, see Figure 1-2

— x16 port (Port 2 & Port 3) may negotiate down to x8, x4, x2, or x1

— x8 port (Port 1) may negotiate down to x4, x2, or x1

— x4 port (Port 0) may negotiate down to x2, or x1

— When negotiating down to narrower widths, there are caveats as to how lane

reversal is supported

• Address Translation Services (ATS) 1.0 support

• Hierarchical PCI-compliant configuration mechanism for downstream devices

• Traditional PCI style traffic (asynchronous snooped, PCI ordering)

• PCI Express* extended configuration space. The first 256 bytes of configuration space aliases directly to the PCI compatibility configuration space. The remaining portion of the fixed 4-KB block of memory-mapped space above that (starting at 100h) is known as extended configuration space.

• PCI Express* Enhanced Access Mechanism. Accessing the device configuration space in a flat memory mapped fashion.

Datasheet, Volume 1 11

Introduction

Transaction

Link

Physical

0…3

DMI

Port 0

DMI

4…7

Port 1b

Transaction

Link

Physical

0…3

Port 1a

Port 1 (IOU2)

PCIe

Por t 1a

8…11

Transaction

Link

Physical

0…3

Port 2

(IOU0)

PCIe

Por t 2b

Port 2a

Port 2d

Port 2c

X16

Port 2a

12..154…7 8…11

Transaction

Link

Physical

0…3

Port 3 (IOU1)

PCIe

Port 3b

Port 3a

Port 3d

Port 3c

X16

Port 3a

12..154…7

Transaction

Link

Physical

0…3

DMI

Port 0

DMI

4…7

Port 1b

Transaction

Link

Physical

0…3

Port 1a

Port 1 (IOU2)

PCIe

Por t 1a

8…11

Transaction

Link

Physical

0…3

Port 2

(IOU0)

PCIe

Por t 2b

Port 2a

Port 2d

Port 2c

X16

Port 2a

12..154…7 8…11

Transaction

Link

Physical

0…3

Port 2

(IOU0)

PCIe

Por t 2b

Port 2a

Port 2d

Port 2c

X16

Port 2a

12..154…7 8…11

Transaction

Link

Physical

0…3

Port 3

(IOU1)

PCIe

Port 3b

Port 3a

Port 3d

Port 3c

X16

Port 3a

12..154…7 8…11

Transaction

Link

Physical

0…3

Port 3

(IOU1)

PCIe

Port 3b

Port 3a

Port 3d

Port 3c

X16

Port 3a

12..154…7

• Supports receiving and decoding 64 bits of address from PCI Express*

— Memory transactions received from PCI Express* that go above the top of

physical address space (when Intel VT-d is enabled, the check would be against the translated HPA (Host Physical Address) address) are reported as errors by the processor.

— Outbound access to PCI Express* will always have address bits 63 to 46 cleared

• Re-issues Configuration cycles that have been previously completed with the Configuration Retry status

• Power Management Event (PME) functions

• Message Signaled Interrupt (MSI and MSI-X) messages

• Degraded Mode support and Lane Reversal support

• Static lane numbering reversal and polarity inversion support

Figure 1-2. PCI Express* Lane Partitioning and Direct Media Interface Gen 2 (DMI2)

12 Datasheet, Volume 1

Introduction

1.2.3 Direct Media Interface Gen 2 (DMI2)

• Serves as the chip-to-chip interface to the PCH

• The DMI2 port supports x4 link width and only operates in a x4 mode when in DMI2

• Operates at PCIe2 or PCIe1 speeds

• Transparent to software

• Processor and peer-to-peer writes and reads with 64-bit address support

• APIC and Message Signaled Interrupt (MSI) support. Will send Intel-defined “End of Interrupt” broadcast message when initiated by the processor.

• System Management Interrupt (SMI), SCI, and SERR error indication

• Static lane numbering reversal support

• Supports DMI2 virtual channels VC0, VC1, VCm, and VCp

1.2.4 Platform Environment Control Interface (PECI)

The PECI is a one-wire interface that provides a communication channel between a PECI client (the processor) and a PECI master (the PCH). Refer to the processor Thermal Mechanical Specification and Design Guide (see Section 1.7, “Related

Documents”) for additional details on PECI services available in the processor.

• Supports operation at up to 2 Mbps data transfers

• Link layer improvements to support additional services and higher efficiency over PECI 2.0 generation

• Services include processor thermal and estimated power information, control functions for power limiting, P-state and T-state control, and access for Machine Check Architecture registers and PCI configuration space (both within the processor package and downstream devices)

• Single domain (Domain 0) is supported

1.3 Power Management Support

1.3.1 Processor Package and Core States

• ACPI C-states as implemented by the following processor C-states

— Package: PC0, PC1/PC1E, PC2, PC3, PC6 (Package C7 is not supported) — Core: CC0, CC1, CC1E, CC3, CC6, CC7

• Enhanced Intel SpeedStep® Tec h no l og y

1.3.2 System States Support

• S0, S1, S3, S4, S5

1.3.3 Memory Controller

• Multiple CKE power down modes

• Multiple self-refresh modes

• Memory thermal monitoring using MEM_HOT_C01_N and MEM_HOT_C23_N Signals

1.3.4 PCI Express*

• L0s and L1 ASPM power management capability

Datasheet, Volume 1 13

1.4 Thermal Management Support

• Adaptive Thermal Monitor

• THERMTRIP_N and PROCHOT_N signal support

• On-Demand mode clock modulation

• Open Loop Thermal Throttling and Hybrid OLTT/CLTT support for system memory

• Fan speed control with DTS

• Two integrated SMBus masters for accessing thermal data from DIMMs

• New Memory Thermal Throttling features using MEM_HOT signals

1.5 Package Summary

The processor socket type is noted as LGA2011. The processor package is a 52.5 x 45 mm FC-LGA package (LGA2011). Refer to the processor Thermal Mechanical Specification and Design Guide (see Section 1.7, “Related Documents”) for the package mechanical specifications.

1.6 Terminology

Introduction

Table 1-1. Terminology (Sheet 1 of 3)

Term Description

ASPM

Cbo

DDR3

DMA Direct Memory Access

DMI Direct Media Interface

DMI2 Direct Media Interface Gen 2

DTS Digital Thermal Sensor

ECC Error Correction Code

Enhanced Intel SpeedStep

Execute Disable Bit

Functional Operation

Integrated Memory Controller (IMC)

Integrated I/O Controller (IIO)

64 Technology

Intel

Turbo Boost

Technolo g y

Tec h n o l o g y

Active State Power Management

Cache and Core Box. It is a term used for internal logic providing ring interface to LLC and Core.

Third generation Double Data Rate SDRAM memory technology that is the successor to DDR2 SDRAM

Allows the operating system to reduce power consumption when performance is not needed.

The Execute Disable bit allows memory to be marked as executable or non-executable, when combined with a supporting operating system. If code attempts to run in nonexecutable memory the processor raises an error to the operating system. This feature can prevent some classes of viruses or worms that exploit buffer overrun vulnerabilities and can thus help improve the overall security of the system. See the Intel Architectures Software Developer's Manuals for more detailed information.

Refers to the normal operating conditions in which all processor specifications, including DC, AC, system bus, signal quality, mechanical, and thermal, are satisfied.

A Memory Controller that is integrated in the processor die.

An I/O controller that is integrated in the processor die.

64-bit memory extensions to the IA-32 architecture. Further details on Intel 64 architecture and programming model can be found at

http://developer.intel.com/technology/intel64/.

Intel

Turbo Boost Technology is a way to automatically run the processor core faster than the marked frequency if the part is operating under power, temperature, and current specifications limits of the Thermal Design Power (TDP). This results in increased performance of both single and multi-threaded applications.

64 and IA-32

14 Datasheet, Volume 1

Introduction

Table 1-1. Terminology (Sheet 2 of 3)

Term Description

Virtualization

Intel Technology (Intel

VT-d

Intel

Integrated Heat Spreader (IHS)

Jitter Any timing variation of a transition edge or edges from the defined Unit Interval (UI).

IOV I/O Virtualization

LGA2011 Socket

LLC Last Level Cache

ME Management Engine

NCTF

Core™ i7

Intel processor family for the LGA-2011 socket

PCH

PCU Power Control Unit.

PCIe* PCI Express*

PECI Platform Environment Control Interface

Processor The 64-bit, single-core or multi-core component (package)

Processor Core

PCU Uncore Power Manager

Rank

SCI System Control Interrupt. Used in ACPI protocol.

SSE Intel

SKU

SMBus

Storage Conditions

TAC Thermal Averaging Constant

TDP Thermal Design Power

TSOD Thermal Sensor on DIMM

UDIMM Unbuffered Dual In-line Module

Processor virtualization which when used in conjunction with Virtual Machine Monitor software enables multiple, robust independent software environments inside a single

VT)

platform.

Intel

Virtualization Technology (Intel® VT) for Directed I/O. Intel VT-d is a hardware assist, under system software (Virtual Machine Manager or OS) control, for enabling I/O device virtualization. Intel VT-d also brings robust security by providing protection from errant DMAs by using DMA remapping, a key feature of Intel VT-d.

A component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

The 2011-land FC-LGA package mates with the system board through this surface mount, 2011-contact socket.

Non-Critical to Function: NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality.

Intel’s 32-nm processor design, follow-on to the 32-nm 2nd Generation Intel® Core™ processor family desktop design.

Platform Controller Hub. The next generation chipset with centralized platform capabilities including the main I/O interfaces along with display connectivity, audio features, power management, manageability, security and storage features.

The term “processor core” refers to Si die itself which can contain multiple execution cores. Each execution core has an instruction cache, data cache, and 256-KB L2 cache. All execution cores share the L3 cache. All DC and AC timing and signal integrity specifications are measured at the processor die (pads), unless otherwise noted.

A unit of DRAM corresponding four to eight devices in parallel, ignoring ECC. These devices are usually, but not always, mounted on a single side of a DDR3 DIMM.

Streaming SIMD Extensions (Intel® SSE)

A processor Stock Keeping Unit (SKU) to be installed in the platform. Electrical, power and thermal specifications for these SKU’s are based on specific use condition assumptions.

System Management Bus. A two-wire interface through which simple system and power management related devices can communicate with the rest of the system. It is based on the principals of the operation of the I2C* two-wire serial bus from Philips Semiconductor.

A non-operational state. The processor may be installed in a platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air. Under these conditions, processor landings should not be connected to any supply voltages, have any I/Os biased or receive any clocks. Upon exposure to “free air” (that is, unsealed packaging or a device removed from packaging material) the processor must be handled in accordance with moisture sensitivity labeling (MSL) as indicated on the packaging material.

Datasheet, Volume 1 15

Table 1-1. Terminology (Sheet 3 of 3)

Term Description

Signaling convention that is binary and unidirectional. In this binary signaling, one bit is sent for every edge of the forwarded clock, whether it be a rising edge or a falling edge. If

Unit Interval

VCCD_01, VCCD_23

x1 Refers to a Link or Port with one Physical Lane

x4 Refers to a Link or Port with four Physical Lanes

x8 Refers to a Link or Port with eight Physical Lanes

x16 Refers to a Link or Port with sixteen Physical Lanes

a number of edges are collected at instances t defined as:

= t n – t n – 1

Processor core power supply

Processor ground

Power supply for the processor system memory interface. VCCD is the generic term for VCCD_01, VCCD_23.

1.7 Related Documents

Refer to the following documents for additional information.

Table 1-2. Reference Documents

, t2, tn,...., t

Introduction

then the UI at instance “n” is

Document

Intel

Core™ i7 Processor Family for the LGA-2011 Socket Datasheet, Volume 2

Intel® Core™ i7 Processor Family for the LGA-2011 Socket Specification Update

Desktop Intel® Core™ i7 Processor Family for the LGA-2011 Socket Thermal Mechanical Specifications and Design Guide

Intel® X79 Express Chipset Datasheet

Intel® X79 Express Chipset Specification Update

Intel® X79 Express Chipset Thermal Mechanical Specifications and Design Guide

Advanced Configuration and Power Interface Specification 3.0 http://www.acpi.info

PCI Local Bus Specification http://www.pcisig.com/

PCI Express* Base Specification http://www.pcisig.com

System Management Bus (SMBus) Specification http://smbus.org/

DDR3 SDRAM Specification http://www.jedec.org

Intel

64 and IA-32 Architectures Software Developer's Manuals

• Volume 1: Basic Architecture

• Volume 2A: Instruction Set Reference, A-M

• Volume 2B: Instruction Set Reference, N-Z

• Volume 3A: System Programming Guide

• Volume 3B: System Programming Guide

64 and IA-32 Architectures Optimization Reference Manual

Intel

Virtualization Technology Specification for Directed I/O Architecture

Intel Specification

Document Number/

Location

326197

326198

326199

326200

326201

326202

specifications

http://www.intel.com/p roducts/processor/man uals/index.htm

http://download.intel.co m/technology/computin g/vptech/Intel(r)_VT_fo r_Direct_IO.pdf

16 Datasheet, Volume 1

Interfaces

2 Interfaces

This chapter describes the functional behaviors supported by the processor.

2.1 System Memory Interface

2.1.1 System Memory Technology Support

The Integrated Memory Controller (IMC) supports DDR3 protocols with four independent 64-bit memory channels and supports 1 unbuffered DIMM per channel.

2.1.2 System Memory Timing Support

The IMC supports the following DDR3 Speed Bin, CAS Write Latency (CWL), and command signal mode timings on the main memory interface:

• tCL = CAS Latency

• tRCD = Activate Command to READ or WRITE Command delay

• tRP = PRECHARGE Command Period

• CWL = CAS Write Latency

• Command Signal modes = 1n indicates a new command may be issued every clock and 2n indicates a new command may be issued every 2 clocks. Command launch mode programming depends on the transfer rate and memory configuration.

2.2 PCI Express* Interface

This section describes the PCI Express* interface capabilities of the processor. See the

PCI Express* Base Specification for details of PCI Express*.

Note: The processor is capable of up to 8.0 GT/s speeds.

2.2.1 PCI Express* Architecture

Compatibility with the PCI addressing model is maintained to ensure that all existing applications and drivers operate unchanged. The PCI Express configuration uses standard mechanisms as defined in the PCI Plug-and-Play specification.

The PCI Express architecture is specified in three layers — Transaction Layer, Data Link Layer, and Physical Layer. The partitioning in the component is not necessarily along these same boundaries. Refer to Figure 2-1 for the PCI Express Layering Diagram.

Datasheet, Volume 1 17

Figure 2-1. PCI Express* Layering Diagram

Transaction

Data Link

Physical

Logical Sub-Block

Electrical Sub-Block

RX TX

Transaction

Data Link

Physical

Logical Sub-Block

Electrical Sub-Block

RX TX

Transaction

Data Link

Physical

Logical Sub-Block

Electrical Sub-Block

RX TX

Transaction

Data Link

Physical

Logical Sub-Block

Electrical Sub-Block

RX TX

Framing

Sequence

Number

Header Date LCRCECRC Framing

Data Link Layer

Transaction Layer

Physical Layer

Framing

Sequence

Number

Header Date LCRCECRC Framing

Data Link Layer

Transaction Layer

Physical Layer

PCI Express uses packets to communicate information between components. Packets are formed in the Transaction and Data Link Layers to carry the information from the transmitting component to the receiving component. As the transmitted packets flow through the other layers, they are extended with additional information necessary to handle packets at those layers. At the receiving side, the reverse process occurs and packets get transformed from their Physical Layer representation to the Data Link Layer representation and finally (for Transaction Layer Packets) to the form that can be processed by the Transaction Layer of the receiving device.

Interfaces

Figure 2-2. Packet Flow through the Layers

2.2.1.1 Transaction Layer

The upper layer of the PCI Express architecture is the Transaction Layer. The Transaction Layer's primary responsibility is the assembly and disassembly of Transaction Layer Packets (TLPs). TLPs are used to communicate transactions, such as read and write, as well as certain types of events. The Transaction Layer also manages flow control of TLPs.

2.2.1.2 Data Link Layer

The middle layer in the PCI Express stack, the Data Link Layer, serves as an intermediate stage between the Transaction Layer and the Physical Layer. Responsibilities of Data Link Layer include link management, error detection, and error correction.

18 Datasheet, Volume 1

Interfaces

The transmission side of the Data Link Layer accepts TLPs assembled by the Transaction Layer, calculates and applies data protection code and TLP sequence number, and submits them to Physical Layer for transmission across the Link. The receiving Data Link Layer is responsible for checking the integrity of received TLPs and for submitting them to the Transaction Layer for further processing. On detection of TLP error(s), this layer is responsible for requesting retransmission of TLPs until information is correctly received, or the Link is determined to have failed. The Data Link Layer also generates and consumes packets which are used for Link management functions.

2.2.1.3 Physical Layer

The Physical Layer includes all circuitry for interface operation, including driver and input buffers, parallel-to-serial and serial-to-parallel conversion, PLL(s), and impedance matching circuitry. It also includes logical functions related to interface initialization and maintenance. The Physical Layer exchanges data with the Data Link Layer in an implementation-specific format, and is responsible for converting this to an appropriate serialized format and transmitting it across the PCI Express Link at a frequency and width compatible with the remote device.

2.2.2 PCI Express* Configuration Mechanism

The PCI Express link is mapped through a PCI-to-PCI bridge structure.

PCI Express extends the configuration space to 4096 bytes per-device/function, as compared to 256 bytes allowed by the Conventional PCI Specification. PCI Express configuration space is divided into a PCI-compatible region (which consists of the first 256 bytes of a logical device's configuration space) and an extended PCI Express region (which consists of the remaining configuration space). The PCI-compatible region can be accessed using either the mechanisms defined in the PCI specification or using the enhanced PCI Express configuration access mechanism described in the PCI Express Enhanced Configuration Mechanism section.

The PCI Express Host Bridge is required to translate the memory-mapped PCI Express configuration space accesses from the host processor to PCI Express configuration cycles. To maintain compatibility with PCI configuration addressing mechanisms, it is recommended that system software access the enhanced configuration space using 32-bit operations (32-bit aligned) only.

See the PCI Express* Base Specification for details of both the PCI-compatible and PCI Express Enhanced configuration mechanisms and transaction rules.

2.3 DMI2/PCI Express* Interface

Direct Media Interface 2 (DMI2) connects the processor to the Platform Controller Hub (PCH). DMI2 is similar to a four-lane PCI Express supporting a speed of 5 GT/s per lane. Refer to Section 6.3, “DMI2 / PCI Express* Port 0 Signals” for additional details.

Note: Only DMI2 x4 configuration is supported.

2.3.1 DMI2 Error Flow

DMI2 can only generate SERR in response to errors; never SCI, SMI, MSI, PCI INT, or GPE. Any DMI2 related SERR activity is associated with Device 0.

Datasheet, Volume 1 19

Interfaces

2.3.2 DMI2 Link Down

The DMI2 link going down is a fatal, unrecoverable error. If the DMI2 data link goes to data link down, after the link was up, then the DMI2 link hangs the system by not allowing the link to retrain to prevent data corruption. This is controlled by the PCH.

Downstream transactions that had been successfully transmitted across the link prior to the link going down may be processed as normal. No completions from downstream, non-posted transactions are returned upstream over the DMI2 link after a link down event.

2.4 Platform Environment Control Interface (PECI)

The Platform Environment Control Interface (PECI) uses a single wire for self-clocking and data transfer. The bus requires no additional control lines. The physical layer is a self-clocked one-wire bus that begins each bit with a driven, rising edge from an idle level near zero volts. The duration of the signal driven high depends on whether the bit value is a logic ‘0’ or logic ‘1’. PECI also includes variable data transfer rate established with every message. In this way, it is highly flexible even though underlying logic is simple.

The interface design was optimized for interfacing to Intel processor and chipset components in both single processor and multiple processor environments. The single wire interface provides low board routing overhead for the multiple load connections in the congested routing area near the processor and chipset components. Bus speed, error checking, and low protocol overhead provides adequate link bandwidth and reliability to transfer critical device operating conditions and configuration information. Refer to the processor Thermal Mechanical Specification and Design Guide (see

Section 1.7, “Related Documents”) for additional details regarding PECI and for a list of

supported PECI commands.

20 Datasheet, Volume 1

Technologies

3 Technologies

3.1 Intel® Virtualization Technology (Intel® VT)

Intel® Virtualization Technology (Intel® VT) makes a single system appear as multiple independent systems to software. This allows multiple, independent operating systems to run simultaneously on a single system. Intel VT comprises technology components to support virtualization of platforms based on Intel architecture microprocessors and chipsets.

• Intel Architecture (Intel® VT-x) adds hardware support in the processor to improve

the virtualization performance and robustness. Intel VT-x specifications and functional descriptions are included in the Intel Software Developer’s Manual, Volume 3B and is available at http://www.intel.com/

products/processor/manuals/index.htm

• Intel® Virtualization Technology (Intel® VT) for Directed I/O

(Intel

and improve I/O virtualization performance and robustness. The Intel VT-d specification and other Intel VT documents can be referenced at

http://www.intel.com/technology/virtualization/index.htm

Virtualization Technology (Intel® VT) for Intel® 64 and IA-32 Intel®

64 and IA-32 Architectures

VT-d) adds processor and uncore hardware implementations to support

3.1.1 Intel® Virtualization Technology (Intel® VT) for Intel® 64 and IA-32 Intel® Architecture (Intel® VT-x) Objectives

Intel VT-x provides hardware acceleration for virtualization of IA platforms. Virtual Machine Monitor (VMM) can use Intel VT-x features to provide improved reliable virtualized platform. By using Intel VT-x, a VMM is:

• Robust: VMMs no longer need to use para-virtualization or binary translation. This means that they will be able to run off-the-shelf operating systems and applications without any special steps.

• Enhanced: Intel VT enables VMMs to run 64-bit guest operating systems on IA x86 processors.

• More reliable: Due to the hardware support, VMMs can now be smaller, less complex, and more efficient. This improves reliability and availability and reduces the potential for software conflicts.

• More secure: The use of hardware transitions in the VMM strengthens the isolation of VMs and further prevents corruption of one VM from affecting others on the same system.

Datasheet, Volume 1 21

Technologies

3.1.2 Intel® Virtualization Technology (Intel® VT) for Intel® 64 and IA-32 Intel® Architecture (Intel® VT-x) Features

The processor core supports the following Intel VT-x features:

• Extended Page Tables (EPT)

— hardware assisted page table virtualization

— eliminates VM exits from guest OS to the VMM for shadow page-table

maintenance

• Virtual Processor IDs (VPID)

— Ability to assign a VM ID to tag processor core hardware structures (such as,

TLBs)

— This avoids flushes on VM transitions to give a lower-cost VM transition time

and an overall reduction in virtualization overhead.

• Guest Preemption Timer

— Mechanism for a VMM to preempt the execution of a guest OS after an amount

of time specified by the VMM. The VMM sets a timer value before entering a guest

— The feature aids VMM developers in flexibility and Quality of Service (QoS)

guarantees

• Descriptor-Table Exiting

— Descriptor-table exiting allows a VMM to protect a guest OS from internal

(malicious software based) attack by preventing relocation of key system data structures like IDT (interrupt descriptor table), GDT (global descriptor table), LDT (local descriptor table), and TSS (task segment selector).

— A VMM using this feature can intercept (by a VM exit) attempts to relocate

these data structures and prevent them from being tampered by malicious software.

3.1.3 Intel® Virtualization Technology (Intel® VT) for

Directed I/O (Intel

The key Intel VT-d objectives are abstraction and robustness. Hardware abstraction has two key benefits. First is partitioning hardware into configurable isolated environments called domains to which a subset of host physical memory is allocated. Second is greater flexibility in modifying hardware capability without direct operating system interference. Virtualization allows for the creation of one or more partitions on a single system. This could be multiple partitions in the same operating system, or there can be multiple operating system instances running on the same system. The VT-d architecture provides the flexibility to support multiple usage models and in turn complement Intel VT-x capability. This offers benefits such as system consolidation, legacy migration, activity partitioning, or security. The second objective is robustness. VT-d enables protected access to I/O devices from a given virtual machine so that it does not interfere with a different virtual machine on the same platform. Any errors or permission violation are trapped and hence the system is more robust.

22 Datasheet, Volume 1

VT-d) Objectives

Technologies

3.1.3.1 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel

The processor supports the following Intel VT-d features:

• Root entry, context entry, and default context

• Support for 4-K page sizes only

• Support for register-based fault recording only (for single entry only) and support for MSI interrupts for faults

— Support for fault collapsing based on Requester ID

• Support for both leaf and non-leaf caching

• Support for boot protection of default page table

— Support for non-caching of invalid page table entries

• Support for hardware based flushing of translated but pending writes and pending reads upon IOTLB invalidation

• Support for page-selective IOTLB invalidation

• Support for ARI (Alternative Requester ID – a PCI SIG ECR for increasing the function number count in a PCIe device) to support IOV devices

3.1.3.2 Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel

The following are new features supported in Intel VT-d on the processor:

• Improved invalidation architecture

• End point caching support (Address Translation Services)

• Interrupt remapping

• 2M/1G/512G super page support

VT-d) Features Supported

VT-d) Processor Feature Additions

3.1.4 Intel® Virtualization Technology Processor Extensions

The processor supports the following Intel VT Intel® Core™ i7 processor family for the LGA-2011 socket Extensions features:

• Large Intel VT-d Pages

— Adds 2 MB and 1 GB page sizes to Intel VT-d implementations

— Matches current support for Extended Page Tables (EPT)

— Ability to share CPU's EPT page-table (with super-pages) with Intel VT-d

— Benefits:

• Less memory foot-print for I/O page-tables when using super-pages

• Potential for improved performance – Due to shorter page-walks, allows hardware optimization for IOTLB

• Transition latency reductions expected to improve virtualization performance without the need for VMM enabling. This reduces the VMM overheads further and increase virtualization performance.

Datasheet, Volume 1 23

3.2 Security Technologies

3.2.1 Intel® AES New Instructions (Intel® AES-NI)

These instructions enable fast and secure data encryption and decryption using the Advanced Encryption Standard (AES), which is defined by FIPS Publication number

197. Since AES is the dominant block cipher, and it is deployed in various protocols, the new instructions will be valuable for a wide range of applications.

The architecture consists of six instructions that offer full hardware support for AES. Four instructions support the AES encryption and decryption, and the other two instructions support the AES key expansion. Together, they offer a significant increase in performance compared to pure software implementations.

The AES instructions have the flexibility to support all three standard AES key lengths, all standard modes of operation, and even some nonstandard or future variants.

Beyond improving performance, the AES instructions provide important security benefits. Since the instructions run in data-independent time and do not use lookup tables, they help in eliminating the major timing and cache-based attacks that threaten table-based software implementations of AES. In addition, these instructions make AES simple to implement, with reduced code size. This helps reducing the risk of inadvertent introduction of security flaws, such as difficult-to-detect side channel leaks.

Technologies

3.2.2 Execute Disable Bit

Intel's Execute Disable Bit functionality can help prevent certain classes of malicious buffer overflow attacks when combined with a supporting operating system:

• Allows the processor to classify areas in memory by where application code can execute and where it cannot.

• When a malicious worm attempts to insert code in the buffer, the processor disables code execution, preventing damage and worm propagation.

3.3 Intel® Hyper-Threading Technology (Intel® HT Technology)

The processor supports Intel® Hyper-Threading Technology (Intel® HT Technology) that allows an execution core to function as two logical processors. While some execution resources such as caches, execution units, and buses are shared, each logical processor has its own architectural state with its own set of general-purpose registers and control registers. This feature must be enabled using the BIOS and requires operating system support.

For more information on Intel Hyper-Threading Technology, see http://www.intel.com/

technology/platform-technology/hyper-threading/.

24 Datasheet, Volume 1

Technologies

3.4 Intel® Turbo Boost Technology

Intel Turbo Boost Technology is a feature that allows the processor to opportunistically and automatically run faster than its rated operating frequency if it is operating below power, temperature, and current limits. The result is increased performance in multithreaded and single threaded workloads. It should be enabled in the BIOS for the processor to operate with maximum performance.

3.4.1 Intel® Turbo Boost Operating Frequency

The processor’s rated frequency assumes that all execution cores are running an application at the thermal design power (TDP). However, under typical operation, not all cores are active. Therefore, most applications are consuming less than the TDP at the rated frequency. To take advantage of the available TDP headroom, the active cores can increase their operating frequency.

To determine the highest performance frequency amongst active cores, the processor takes the following into consideration:

• The number of cores operating in the C0 state.

• The estimated current consumption.

• The estimated power consumption.

•The temperature.

Any of these factors can affect the maximum frequency for a given workload. If the power, current, or thermal limit is reached, the processor will automatically reduce the frequency to stay with its TDP limit.

Note: Intel Turbo Boost Technology is only active if the operating system is requesting the P0

state. For more information on P-states and C-states, refer to Chapter 4, "Power

Management".

3.5 Enhanced Intel® SpeedStep® Technology

The processor supports Enhanced Intel SpeedStep Technology (EIST) as an advanced means of enabling very high performance while also meeting the power-conservation needs of the platform.

Enhanced Intel SpeedStep Technology builds upon that architecture using design strategies that include the following:

• Separation between Voltage and Frequency Changes. By stepping voltage up and down in small increments separately from frequency changes, the processor can reduce periods of system unavailability (which occur during frequency change). Thus, the system can transition between voltage and frequency states more often, providing improved power/performance balance.

• Clock Partitioning and Recovery. The bus clock continues running during state transition, even when the core clock and Phase-Locked Loop are stopped, which allows logic to remain active. The core clock can also restart more quickly under Enhanced Intel SpeedStep Technology.

For additional information on Enhanced Intel SpeedStep Technology, see Section 4.2.1.

Datasheet, Volume 1 25

Technologies

3.6 Intel® Advanced Vector Extensions (Intel® AVX)

Intel® Advanced Vector Extensions (Intel® AVX) is a new 256-bit vector SIMD extension of Intel Architecture. The introduction of Intel AVX starts with the 2nd Generation Intel parallel computation in general purpose applications like image, video, and audio processing, engineering applications such as 3D modeling and analysis, scientific simulation, and financial analysts.

Intel AVX is a comprehensive ISA extension of the Intel 64 Architecture. The main elements of Intel AVX are:

• Support for wider vector data (up to 256-bit) for floating-point computation

• Efficient instruction encoding scheme that supports 3 operand syntax and headroom for future extensions

• Flexibility in programming environment, ranging from branch handling to relaxed memory alignment requirements

• New data manipulation and arithmetic compute primitives, including broadcast, permute, fused-multiply-add, etc

The key advantages of Intel AVX are:

• Performance – Intel AVX can accelerate application performance using data parallelism and scalable hardware infrastructure across existing and new application domains:

— 256-bit vector data sets can be processed up to twice the throughput of 128-bit

data sets

— Application performance can scale up with number of hardware threads and

number of cores

• Power Efficiency – Intel AVX is extremely power efficient. Incremental power is insignificant when the instructions are unused or scarcely used. Combined with the high performance that it can deliver, applications that lend themselves heavily to using Intel AVX can be much more energy efficient and realize a higher performance-per-watt.

• Extensibility – Intel AVX has built-in extensibility for the future vector extensions:

— OS context management for vector-widths beyond 256 bits is streamlined

— Efficient instruction encoding allows unlimited functional enhancements:

• Compatibility – Intel AVX is backward compatible with previous ISA extensions including Intel SSE4:

— Existing Intel SSE applications/library can:

— Applications compiled with Intel AVX can inter-operate with existing Intel SSE

libraries

Core™ Processor Family Desktop. Intel AVX accelerates the trend of

• Vector width support beyond 256 bits

• 256-bit Vector Integer processing

• Additional computational and/or data manipulation primitives.

• Run unmodified and benefit from processor enhancements

• Recompile existing Intel SSE intrinsic using compilers that generate Intel AVX code

• Inter-operate with library ported to Intel AVX

26 Datasheet, Volume 1

Power Management

4 Power Management

This chapter provides information on the following power management topics:

• Advanced Configuration and Power Interface (ACPI) States

•System States

• Processor Core/Package States

• Integrated Memory Controller (IMC) and System Memory States

• Direct Media Interface Gen 2 (DMI2)/PCI Express* Link States

4.1 Advanced Configuration and Power Interface (ACPI) States Supported

The ACPI states supported by the processor are described in this section.

4.1.1 System States

Table 4-1. System States

State Description

G0/S0 Full On

G1/S3-Cold

G1/S4 Suspend-to-Disk (STD). All power lost (except wakeup on PCH).

G2/S5 Soft off. All power lost (except wakeup on PCH). Total reboot.

G3 Mechanical off. All power removed from system.

Suspend-to-RAM (STR). Context saved to memory (S3-Hot is not supported by the processor).

4.1.2 Processor Package and Core States

Ta b le 4 -2 lists the package C-state support as:

• the shallowest core C-state that allows entry into the package C-state

• the additional factors that will restrict the state from going any deeper

• the actions taken with respect to the Ring Vcc, PLL state, and LLC.

Datasheet, Volume 1 27

Tab le 4 - 3 lists the processor core C-states support.

Table 4-2. Package C-State Support

Power Management

Package C-State

PC0 – Active CC0 N/A No No 2

PC2 – Snoopable Idle

PC3 – Light Retention

PC6 – Deeper Retention

Notes:

1. Package C7 is not supported.

2. All package states are defined to be "E" states – such that they always exit back into the LFM point upon execution resume.

3. The mapping of actions for PC3, and PC6 are suggestions – microcode will dynamically determine which actions should be taken based on the desired exit latency parameters.

4. CC3/CC6 will all use a voltage below the VccMin operational point. The exact voltage selected will be a function of the snoop and interrupt response time requirements made by the devices (PCIe* and DMI) and the operating system.

Core

States

CC3–CC7

at least

one Core

in C3

CC6–CC7

Limiting Factors

• PCIe/PCH and Remote Socket Snoops

• PCIe/PCH and Remote Socket Accesses

• Interrupt response time requirement

• DMI Sidebands

• Configuration Constraints

•Core C-state

• Snoop Response Time

• Interrupt Response Time

• Non Snoop Response Time

•LLC ways open

• Snoop Response Time

• Non Snoop Response Time

• Interrupt Response Time

Retention and

PLL-Off

VccMin

Freq = MinFreq

PLL = ON

Vcc = retention

PLL = OFF

Vcc = retention

PLL = OFF

LLC

Fully

Flushed

No 2

No 2,3,4

Notes

Table 4-3. Core C-State Support

Core C-State Global Clock PLL L1/L2 Cache Core VCC Context

CC0 Running On Coherent Active Maintained

CC1 Stopped On Coherent Active Maintained

CC1E Stopped On Coherent Request LFM Maintained

CC3 Stopped On Flushed to LLC Request Retention Maintained

CC6 Stopped On Flushed to LLC Power Gate Flushed to LLC

CC7 Stopped Off Flushed to LLC Power Gate Flushed to LLC

28 Datasheet, Volume 1

Power Management

Notes:

4.1.3 Integrated Memory Controller States

Table 4-4. System Memory Power States

State Description

Power Up/Normal Operation CKE asserted. Active Mode, highest power consumption.

Opportunistic, per rank control after idle time:

• Active Power Down (APD) (default mode) — CKE de-asserted. Power savings in this mode, relative to active idle

state is about 55% of the memory power. Exiting this mode takes 3–5 DCLK cycles.

— CKE de-asserted. DLL-On. Also known as Fast CKE. Power savings in

this mode, relative to active idle state, is about 60% of the memory power. Exiting this mode takes 3–5 DCLK cycles.

— CKE de-asserted. DLL-Off. Also known as Slow CKE. Power savings in

this mode, relative to active idle state, is about 87% of the memory power. Exiting this mode takes 3–5 DCLK cycles until the first command is allowed and 16 cycles until first data is allowed.

— IBT-ON mode: Both CKE’s are de-asserted, the Input Buffer

Terminators (IBTs) are left “on”.

— IBT-OFF mode: Both CKE’s are de-asserted, the Input Buffer

Terminators (IBTs) are turned “off”.

occurs.

— Clock Stopped Power Down with IBT-On — Clock Stopped Power Down with IBT-Off

CKE Power Down

Self-Refresh

• Pre-charge Power Down Fast Exit (PPDF)

• Pre-charge Power Down Slow Exit (PPDS)

• Register CKE Power Down

CKE de-asserted. In this mode, no transactions are executed and the system memory consumes the minimum possible power. Self refresh modes apply to all memory channels for the processor.

• IO-MDLL Off: Option that sets the IO master DLL off when self refresh

• PLL Off: Option that sets the PLL off when self refresh occurs.

In addition, the register component found on registered DIMMs (RDIMMs) is complemented with the following power down states:

• Self Refresh

4.1.4 DMI2 / PCI Express* Link States

Table 4-5. DMI2/PCI Express* Link States

State Description

L0 Full on – Active transfer state.

1. L1 is only supported when the DMI2/PCI Express port is operating as a PCI Express port.

Datasheet, Volume 1 29

Lowest Active State Power Management (ASPM) - Longer exit latency.

4.1.5 G, S, and C State Combinations

Table 4-6. G, S, and C State Combinations

Power Management

Global (G)

State

G0 S0 C0 Full On On Full On

G0 S0 C1/C1E Auto-Halt On Auto-Halt

G0 S0 C3 Deep Sleep On Deep Sleep

G0 S0 C6/C7

G1 S3 Power off — Off, except RTC Suspend to RAM

G1 S4 Power off — Off, except RTC Suspend to Disk

G2 S5 Power off — Off, except RTC Soft Off

G3 NA Power off — Power off Hard off

Sleep

(S) State

Processor

Core

Processor

State

Deep Power

Down

System

Clocks

Description

Deep Power Down

4.2 Processor Core / Package Power Management

While executing code, Enhanced Intel SpeedStep® Technology optimizes the processor’s frequency and core voltage based on workload. Each frequency and voltage operating point is defined by ACPI as a P-state. When the processor is not executing code, it is idle. A low-power idle state is defined by ACPI as a C-state. In general, lower power C-states have longer entry and exit latencies.

4.2.1 Enhanced Intel® SpeedStep® Technology

The following are the key features of Enhanced Intel SpeedStep® Tec h no lo gy :

• Multiple frequency and voltage points for optimal performance and power efficiency. These operating points are known as P-states.

• Frequency selection is software controlled by writing to processor MSRs. The voltage is optimized based on temperature, leakage, power delivery loadline, and dynamic capacitance.

— If the target frequency is higher than the current frequency, VCC is ramped up

to an optimized voltage. This voltage is signaled by the SVID Bus to the voltage regulator. Once the voltage is established, the PLL locks on to the target frequency.

— If the target frequency is lower than the current frequency, the PLL locks to the

target frequency, then transitions to a lower voltage by signaling the target voltage on the SVID Bus.

— All active processor cores share the same frequency and voltage. In a multi-

core processor, the highest frequency P-state requested amongst all active cores is selected.

— Software-requested transitions are accepted at any time. The processor has a

new capability from the previous processor generation, it can preempt the previous transition and complete the new request without waiting for this request to complete.

• The processor controls voltage ramp rates internally to ensure glitch-free transitions.

• Because there is low transition latency between P-states, a significant number of transitions per-second are possible.

30 Datasheet, Volume 1

+ 90 hidden pages

Intel BX80619I73960X, Core i7-3960X, Core i7-3970X, Core i7-3930K, Core i7-3820 Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

Intel® Core™ i7 Processor Family for the LGA-2011 Socket

1 Introduction

1.1 Processor Feature Details

1.1.1 Supported Technologies

1.2 Interfaces

1.2.1 System Memory Support

1.2.2 PCI Express*

1.2.3 Direct Media Interface Gen 2 (DMI2)

1.2.4 Platform Environment Control Interface (PECI)

1.3 Power Management Support

1.3.1 Processor Package and Core States

1.3.2 System States Support

1.3.3 Memory Controller

1.3.4 PCI Express*

1.4 Thermal Management Support

1.5 Package Summary

1.6 Terminology

1.7 Related Documents

2 Interfaces

2.1 System Memory Interface

2.1.1 System Memory Technology Support

2.1.2 System Memory Timing Support

2.2 PCI Express* Interface

2.2.1 PCI Express* Architecture

2.2.1.1 Transaction Layer

2.2.1.2 Data Link Layer

2.2.1.3 Physical Layer

2.2.2 PCI Express* Configuration Mechanism

2.3 DMI2/PCI Express* Interface

2.3.1 DMI2 Error Flow

2.3.2 DMI2 Link Down

2.4 Platform Environment Control Interface (PECI)

3 Technologies

3.1 Intel® Virtualization Technology (Intel® VT)

3.1.1 Intel® Virtualization Technology (Intel® VT) for Intel® 64 and IA-32 Intel® Architecture (Intel® VT-x) Objectives

3.1.2 Intel® Virtualization Technology (Intel® VT) for Intel® 64 and IA-32 Intel® Architecture (Intel® VT-x) Features

3.1.4 Intel® Virtualization Technology Processor Extensions

3.2 Security Technologies

3.2.1 Intel® AES New Instructions (Intel® AES-NI)

3.2.2 Execute Disable Bit

3.3 Intel® Hyper-Threading Technology (Intel® HT Technology)

3.4 Intel® Turbo Boost Technology

3.4.1 Intel® Turbo Boost Operating Frequency

3.5 Enhanced Intel® SpeedStep® Technology

3.6 Intel® Advanced Vector Extensions (Intel® AVX)

4 Power Management

4.1 Advanced Configuration and Power Interface (ACPI) States Supported

4.1.1 System States

4.1.2 Processor Package and Core States

4.1.3 Integrated Memory Controller States

4.1.4 DMI2 / PCI Express* Link States

4.1.5 G, S, and C State Combinations

4.2 Processor Core / Package Power Management

4.2.1 Enhanced Intel® SpeedStep® Technology