Intel DH67CF, BOXDH67CF, BOXDH67CFB3 Specification
Intel® Desktop Board
DH67CF
Technical Product Specification
April 2012
Order Number: G15488-002
The Intel Desktop Board DH67CF may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DH67CF Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DH67CF Technical Product
Specification
-002 Updated the Board Identification Information section April 2012
This product specification applies to only the standard Intel® Desktop Board with BIOS identifier
BLH6710H.86A.
Changes to this specification will be published in the Intel Desktop Board DH67CF Specification
Update before being incorporated into a revision of this document.
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WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
®
All Intel
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
January 2011
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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* Other names and brands may be claimed as the property of others.
Copyright © 2011, 2012, Intel Corporation. All rights reserved.
Board Identification Information
Basic Desktop Board DH67CF Identification Information
AA Revision BIOS Revision Notes
G10215-201 BLH6710.86A.0078 1,2
G10215-202 BLH6710.86A.0078 1,2
G10215-207 BLH6710.86A.0146 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
®
2. The Intel
Device Stepping S-Spec Numbers
82H67 Platform Controller
Hub (PCH)
82H67 Platform Controller
Hub (PCH)
82H67 PCH Express Chipset used on this AA revision consists of the following component:
B2
B3 SLJ49
SLH82
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iii
Intel Desktop Board DH67CF Technical Product Specification
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel
Board DH67CF.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DH67CF and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on Intel Desktop Board DH67CF
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
®
Desktop
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DH67CF Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
Revision History
Board Identification Information ................................................................. iii
Errata ..................................................................................................... iii
Preface
Intended Audience
What This Document Contains .................................................................... v
Typographical Conventions ........................................................................ v
1 Product Description
1.1 Overview ........................................................................................ 11
1.1.1 Feature Summary ................................................................ 11
1.1.2 Board Layout ....................................................................... 13
1.1.3 Block Diagram ..................................................................... 15
1.2 Legacy Considerations ...................................................................... 16
1.3 Online Support ................................................................................ 16
1.4 Processor ....................................................................................... 17
1.4.1 PCI Express x16 Graphics
1.5 System Memory .............................................................................. 18
1.5.1 Memory Configurations ......................................................... 19
®
1.6 Intel
1.7 Graphics Subsystem ........................................................................ 21
1.7.1 Integrated Graphics .............................................................. 21
1.7.2 USB ................................................................................... 24
1.8 SATA Interfaces
1.9 Real-Time Clock Subsystem .............................................................. 26
1.10Legacy I/O Controller ....................................................................... 26
1.10.1 Consumer Infrared (CIR) ....................................................... 26
1.11Audio Subsystem ............................................................................. 27
1.11.1 Audio Subsystem Software
1.11.2 Audio Subsystem Components ............................................... 27
1.12LAN Subsystem ............................................................................... 29
1.12.1 Intel
1.12.2 LAN Subsystem Software ....................................................... 30
1.12.3 RJ-45 LAN Connector with Integrated LEDs
1.13Hardware Management Subsystem .................................................... 31
1.13.1 Hardware Monitoring............................................................. 31
1.13.2 Fan Monitoring
1.13.3 Chassis Intrusion and Detection .............................................. 31
1.13.4 Thermal Monitoring
H67 Express Chipset ............................................................... 21
................................................................................... v
...................................................... 17
.............................................................................. 25
.................................................... 27
®
82579V Gigabit Ethernet Controller ................................ 29
.............................. 30
..................................................................... 31
.............................................................. 32
vii
Intel Desktop Board DH67CF Technical Product Specification
1.14Power Management ......................................................................... 33
1.14.1 ACPI ................................................................................... 33
1.14.2 Hardware Support
................................................................ 35
2 Technical Reference
2.1 Memory Resources
2.1.1 Addressable Memory ............................................................. 41
2.1.2 Memory Map ........................................................................ 43
2.2 Connectors and Headers ................................................................... 43
2.2.1 Back Panel Connectors
2.2.2 Component-side Connectors and Headers
2.3 Jumper Block
.................................................................................. 53
2.4 Mechanical Considerations
2.4.1 Form Factor ......................................................................... 55
2.5 Electrical Considerations
2.5.1 Power Supply Considerations
2.5.2 Fan Header Current Capability ................................................ 57
2.5.3 Add-in Board Considerations
2.6 Thermal Considerations
2.7 Reliability ....................................................................................... 60
2.8 Environmental ................................................................................ 60
.......................................................................... 41
.......................................................... 44
................................ 45
................................................................ 55
................................................................... 56
................................................. 56
.................................................. 57
.................................................................... 57
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 61
3.2 BIOS Flash Memory Organization
....................................................... 62
3.3 System Management BIOS (SMBIOS) ................................................. 63
3.4 Legacy USB Support
3.5 BIOS Updates
................................................................................. 64
3.5.1 Language Support
3.5.2 Custom Splash Screen
........................................................................ 63
................................................................ 64
.......................................................... 65
3.6 BIOS Recovery ................................................................................ 65
3.7 Boot Options ................................................................................... 66
3.7.1 Optical Drive Boot
................................................................ 66
3.7.2 Network Boot ....................................................................... 66
3.7.3 Booting Without Attached Devices........................................... 66
3.7.4 Changing the Default Boot Device During POST
........................ 66
3.8 Adjusting Boot Speed ....................................................................... 67
3.8.1 Peripheral Selection and Configuration ..................................... 67
3.8.2 BIOS Boot Optimizations
3.9 BIOS Security Features
.................................................................... 68
....................................................... 67
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 69
4.2 BIOS Beep Codes
4.3 Front-panel Power LED Blink Codes
4.4 BIOS Error Messages
4.5 Port 80h POST Codes
............................................................................ 69
.................................................... 70
....................................................................... 70
....................................................................... 71
viii
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ..................................................................... 77
5.1.1 Safety Standards .................................................................. 77
5.1.2 European Union Declaration of Conformity Statement
................ 78
5.1.3 Product Ecology Statements ................................................... 79
5.1.4 EMC Regulations
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance
5.1.6 Regulatory Compliance Marks (Board Level)
.................................................................. 81
................. 84
............................. 85
5.2 Battery Disposal Information ............................................................. 86
Figures
1. Major Board Components.................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration ........................................... 20
4. Back Panel Audio Connectors ............................................................ 28
5. LAN Connector LED Locations ............................................................ 30
6. Thermal Sensors and Fan Headers ..................................................... 32
7. Location of the Standby Power LED .................................................... 39
8. Detailed System Memory Address Map ............................................... 42
9. Back Panel Connectors ..................................................................... 44
10. Component-side Connectors and Headers ........................................... 45
11. Connection Diagram for Front Panel Header ........................................ 50
12. Connection Diagram for Front Panel USB 2.0 Headers ........................... 52
13. Location of the Jumper Block ............................................................. 53
14. Board Dimensions ........................................................................... 55
15. Localized High Temperature Zones ..................................................... 58
Tables
1. Feature Summary ............................................................................ 11
2. Components Shown in Figure 1 ......................................................... 14
3. Supported Memory Configurations ..................................................... 18
4. HDMI Port Status Conditions ............................................................. 22
5. DVI Port Status Conditions ................................................................ 22
6. Audio Jack Support .......................................................................... 27
7. LAN Connector LED States ................................................................ 30
8. Effects of Pressing the Power Switch .................................................. 33
9. Power States and Targeted System Power ........................................... 34
10. Wake-up Devices and Events ............................................................ 35
11. System Memory Map ....................................................................... 43
12. Component-side Connectors and Headers Shown in Figure 10 ................ 46
13. Front Panel Audio Header for Intel HD Audio ........................................ 47
14. Front Panel Audio Header for AC ’97 Audio .......................................... 47
15. Front Panel USB 2.0 Headers ............................................................ 47
16. SATA Connectors ............................................................................. 47
17. S/PDIF Header ................................................................................ 48
ix
Intel Desktop Board DH67CF Technical Product Specification
18. Chassis Intrusion Header .................................................................. 48
19. Processor and System (4-Pin) Fan Headers ........................................ 48
20. Back Panel CIR Emitter (Output) Header ............................................. 48
21. Front Panel CIR Receiver (Input) Header ............................................. 48
22. Processor Core Power Connector ........................................................ 49
23. Main Power Connector ...................................................................... 49
24. Front Panel Header .......................................................................... 50
25. States for a One-Color Power LED ...................................................... 51
26. States for a Two-Color Power LED ...................................................... 51
27. Alternate Front Panel Power/Sleep LED Header .................................... 51
28. BIOS Setup Configuration Jumper Settings .......................................... 54
29. Recommended Power Supply Current Values ....................................... 56
30. Fan Header Current Capability ........................................................... 57
31. Thermal Considerations for Components ............................................. 59
32. Tcontrol Values for Components ........................................................ 59
33. Environmental Specifications ............................................................. 60
34. BIOS Setup Program Menu Bar .......................................................... 62
35. BIOS Setup Program Function Keys .................................................... 62
36. AcceptableDrives/Media Types for BIOS Recovery ................................ 65
37. Boot Device Menu Options ................................................................ 66
38. Supervisor and User Password Functions ............................................. 68
39. BIOS Beep Codes ............................................................................ 69
40. Front-panel Power LED Blink Codes .................................................... 70
41. BIOS Error Messages ....................................................................... 70
42. Port 80h POST Code Ranges.............................................................. 71
43. Port 80h POST Codes ....................................................................... 72
44. Typical Port 80h POST Sequence ........................................................ 76
45. Safety Standards ............................................................................. 77
46. EMC Regulations ............................................................................. 81
47. Regulatory Compliance Marks ............................................................ 85
x
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Graphics
Audio
Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters])
®
• Intel
• Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two DIMMs using 4 Gb
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
Intel
Controller Hub (PCH)
• Integrated graphics support for processors with Intel Graphics Technology:
• Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
• 10-channel (8+2) Intel High Definition audio via the Realtek* ALC892 audio
• 8-channel (7.1) Intel High Definition Audio via the HDMI interface and the
Core™ i7, Intel® Core™ i5, and Intel Core™ i3 processors with up to
65W TDP in an LGA1155 socket
― One PCI Express* 2.0 x16 graphics interface
― Integrated memory controller with dual channel DDR3 memory support
― Integrated graphics processing (processors with Intel
Technology)
memory technology
®
H67 Express Chipset consisting of the Intel
― High Definition Multimedia Interface* (HDMI*)
― DVI-I
― DisplayPort*
codec
DisplayPort interface
®
Graphics
®
H67 Express Platform
continued
11
Intel Desktop Board DH67CF Technical Product Specification
Table 1. Feature Summary (continued)
Peripheral
Interfaces
Expansion
Capabilities
BIOS
Instantly Available
PC Technology
LAN Support
Legacy I/O Control Nuvoton W83677HG-i I/O controller for CIR, and hardware management support
Hardware Monitor
Subsystem
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Ten USB 2.0 ports:
― Four ports are implemented with stacked back panel connectors (black)
― Six front panel ports implemented through three internal headers
• Two SATA 6.0 Gb/s interfaces through Intel H67 Express Chipset with Intel
Rapid Storage Technology RAID support (blue)
• Three Serial ATA (SATA) 3.0 Gb/s interfaces through Intel H67 Express Chipset
with Intel Rapid Storage Technology RAID support:
― One internal SATA ports (black)
― One internal eSATA port (red)
― One back panel eSATA port (red)
• One PCI Express 2.0 x16 add-in card connector
®
• Intel
BIOS resident in the Serial Peripheral Interface (SPI) Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and System Management BIOS (SMBIOS)
• Support for PCI* Local Bus Specification Revision 2.2
• Support for PCI Express* Revision 2.0
• Suspend to RAM support
• Wake on PCI Express, LAN, front panel, Consumer Infrared (CIR), and USB
ports
Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel
Ethernet Controller
• Hardware monitoring through the Nuvoton I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Two fan headers
• Two fan sense inputs used to monitor fan activity
• Fan speed control
®
82579V Gigabit
®
12
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DH67CF.
Figure 1. Major Board Components
13
Intel Desktop Board DH67CF Technical Product Specification
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Descript
A Back panel connectors
B Processor core power connector (2 x 2)
C Front panel USB 2.0 header
D BIOS Setup configuration jumper block
E SATA connectors
F Intel H67 Express Chipset
G Front panel USB 2.0 header
H Front panel USB 2.0 header
I Main power connector (2 x 12)
J Front panel header
K DIMM 1 (Channel A DIMM 1)
L DIMM 2 (Channel B DIMM 1)
M Alternate front panel power LED header
N Piezoelectric speaker
O Standby power LED
P Processor fan header
Q Consumer IR receiver (input) header
R S/PDIF out header
S LGA1155 processor socket
T Consumer IR emitter (output) header
U Low Pin Count (LPC) Debug header
V PCI Express x16 bus add-in card connector
W Chassis intrusion header
X System fan header
Y Front panel audio header
Z Battery
ion
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
15
Intel Desktop Board DH67CF Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port connector
• No floppy drive connector
• No serial port connector or header
• No PS/2 connectors
• No PATA connector
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DH67CF http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for Intel
Desktop Board DH67CF
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
16
Product Description
1.4 Processor
The board is designed to support the Intel Core i7, Intel Core i5, and Intel Core i3
processors in an LGA1155 socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 65 W Thermal Design Power (TDP). The
processors listed above are only supported when falling within the wattage
requirements of Intel Desktop Board DH67CF. See the Intel web site listed below for
the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 56 for information on power supply requirements for this board.
1.4.1 PCI Express x16 Graphics
The Intel Core i7, Intel Core i5, and Intel Core i3 processors in an LGA1155 socket
support discrete add in graphics cards via the PCI Express 2.0 x16 graphics connector:
• Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
direction (500 MB/s) per lane. The maximum theoretical bandwidth on the
interface is 8 GB/s in each direction, simultaneously, for an aggregate of 16 GB/s
when operating in x16 GEN2 mode.
• Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (250 MB/s) per lane. The maximum theoretical bandwidth on the
interface is 4 GB/s in each direction, simultaneously, for an aggregate of 8 GB/s
when operating in x16 GEN1 mode.
For information about Refer to
PCI Express technology http://www.pcisig.com
17
Intel Desktop Board DH67CF Technical Product Specification
1.5 System Memory
The board has two DIMM sockets and supports the following memory features:
• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
• Support for 1.35V Low Voltage DDR3 (new JEDEC specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
• Minimum recommended total system memory: 512 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Capacity
512 MB SS 1 Gbit 1 Gb x16/empty 4
1024 MB SS 1 Gbit 1 Gb x8/empty 8
2048 MB DS 1 Gbit 1 Gb x8/1 Gb x8 16
2048 MB SS 2 Gbit 2 Gb x8/empty 8
4096 MB DS 2 Gbit 2 Gb x8/2 Gb x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
Configuration
(Note)
SDRAM
Density
SDRAM Organization
Front-side/Back-side
/CS-025414.htm
Number of SDRAM
Devices
18
Product Description
1.5.1 Memory Configurations
The Intel Core i7, Intel Core i5, and Intel Core i3 processors in the LGA1155 socket
support the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
19
Intel Desktop Board DH67CF Technical Product Specification
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
The Intel Core i7, Intel Core i5, and Intel Core i3 processors require memory to be
populated in the DIMM 1 (Channel A, DIMM 1) socket.
20
Product Description
1.6 Intel
Intel H67 Express Chipset with Direct Media Interface (DMI) interconnect provides
interfaces to the processor and the USB, SATA, LPC, LAN and PCI Express interfaces.
The Intel H67 Express Chipset is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel H67 chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
®
H67 Express Chipset
1.7 Graphics Subsystem
The board supports graphics through either Intel Graphics Technology or a PCI
Express 2.0 x16 add-in graphics card.
1.7.1 Integrated Graphics
The board supports integrated graphics through the Intel® Flexible Display Interface
®
(Intel
NOTE
If using a processor with integrated graphics, the board will support only two of the
integrated graphics interfaces simultaneously: DisplayPort, DVI-I, DVI-D. Also, during
the Power On Self Test (POST), the board will not output to the DisplayPort if DVI-I or
DVI-D is used concurrently with DisplayPort.
FDI) for processors with Intel Graphics Technology.
1.7.1.1 Intel
The Intel HD graphics controller features the following:
• 3D Features
⎯ DirectX10.1 and OpenGL 3.0 compliant
⎯ DirectX 11.0* CS4.0 only
⎯ Shader Model 4.0
• Video
⎯ Hi-Definition content at up to 1080p resolution
⎯ Hardware accelerated MPEG-2, VC-1/WMV and H.264/AVC Hi-Definition video
formats
⎯ Intel
⎯ Blu-ray S3D via HDMI 1.4
®
High Definition (Intel® HD) Graphics
®
HD Technology with Advanced Hardware Video Transcoding
21
Intel Desktop Board DH67CF Technical Product Specification
⎯ Dynamic Video Memory Technology (DVMT) 5.0 support
⎯ Support of up to 1.7 GB Video Memory with 4 GB and above system memory
configuration
1.7.1.2 High Definition Multimedia Interface* (HDMI*)
The HDMI port supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. It is compatible with all ATSC and DVB HDTV
standards and supports eight full range channels at 24-bit/96 kHz audio of lossless
audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The maximum
supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant with the
HDMI 1.4 specification.
The HDMI port is enabled for POST whenever a monitor is attached, regardless of the
VGA and DVI-I connector status.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
HDMI port will behave as described in Table 4.
Table 4. HDMI Port Status Conditions
PCI Express x16 Connector Status HDMI Port Status
No add-in card installed Enabled
Non-video PCI Express x1 add-in card installed Enabled
PCI Express x16 add-in card installed Enabled
Note: May require BIOS setup menu changes.
(Note)
1.7.1.3 Digital Visual Interface (DVI-I)
The DVI-I port supports both digital and analog DVI displays. The maximum
supported resolution is 1900 x 1200 (WUXGA). The DVI port is compliant with the
DVI 1.0 specification. DVI analog output can also be converted to VGA using a DVIVGA converter.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
DVI port will behave as described in Table 5.
Table 5. DVI Port Status Conditions
PCI Express x16 Connector Status
No add-in card installed Enabled Enabled
Non-video PCI Express x1 add-in card
installed
PCI Express x16 add-in card installed Enabled Enabled
Notes:
1. DVI analog output can also be converted to VGA with a DVI-VGA converter.
2. May require BIOS setup menu changes.
DVI Digital (DVI-D)
Port Status
Enabled Enabled
DVI Analog (DVI-A)
Port Status
(Note 1)
(Note 2)
22
Product Description
1.7.1.3.1 Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x
1536 (QXGA).
The VGA port is enabled for POST whenever a monitor is attached, regardless of the
HDMI and DVI-I connector status.
1.7.1.4 DisplayPort*
DisplayPort is a digital communication interface that utilizes differential signaling to
achieve a high bandwidth bus interface designed to support connections between PCs
and monitors, projectors, and TV displays. DisplayPort output can also be converted to
HDMI* using a DisplayPort-HDMI converter.
DisplayPort’s maximum supported display resolution is 2560 x 1600 at 60 Hz refresh
with a 16:10 aspect ratio (WQXGA). DisplayPort 1.1 adds support for High Bandwidth
Digital Content Protection (HDCP) version 1.3. HDCP support enables viewing of
protected content from Blu-ray Disc* and HD-DVD optical media over DisplayPort 1.1
connections.
Table 6. DisplayPort Status Conditions
PCI Express x16 Connector Status DisplayPort Status
No add-in card installed Enabled
Non-video PCI Express x1 add-in card installed Enabled
PCI Express x16 add-in card installed Enabled
Note: May require BIOS setup menu changes.
For information about Refer to
DisplayPort technology http://www.displayport.org
(Note)
23
Intel Desktop Board DH67CF Technical Product Specification
1.7.2 USB
The board supports up to 10 USB 2.0 ports and two USB 3.0 ports.
The Intel H67 Express Chipset provides the USB controller for the 2.0 ports. The two
USB 3.0 ports are provided by the NEC UPD720200 controller. The port arrangement
is as follows:
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Four USB 2.0 ports are implemented with stacked back panel connectors (black)
• Six USB 2.0 front panel ports implemented through three internal headers
All 12 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports
are super-speed capable.
NOTES
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 44
The location of the front panel USB headers Figure 10, page 45
24
Product Description
1.8 SATA Interfaces
The board provides five SATA connectors through the PCH, which support one device
per connector:
• Two internal SATA 6.0 Gb/s connectors (blue)
• One internal SATA 3.0 Gb/s connector (black)
• One internal eSATA 3.0 Gb/s connector (red)
• One eSATA 3.0 Gb/s connector on the back panel for external connectivity (red)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6 Gb/s for two ports and 3 Gb/s for three ports. A point-to-point interface is used for
host to device connections.
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Windows* XP, Windows Vista*, and Windows 7* operating
systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 10, page 45
.
1.8.1.1 SATA RAID
The board supports Intel Rapid Storage Technology which provides the following RAID
(Redundant Array of Independent Drives) levels via the Intel H67 Express Chipset:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS.
Also, during Microsoft Windows XP installation, you must press F6 to install the RAID
drivers. See your Microsoft Windows XP documentation for more information about
installing drivers during installation. Both Microsoft Windows Vista and Microsoft
Windows 7 include the necessary RAID drivers for both AHCI and RAID without the
need to install separate RAID drivers using the F6 switch in the operating system
installation process.
25
Intel Desktop Board DH67CF Technical Product Specification
1.9 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be
notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.10 Legacy I/O Controller
The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.10.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the
supported operating systems.
The CIR feature is made up of two separate pieces: the receiving (receiver) header,
and the output (emitter) header. The receiving header consists of a filtered translated
infrared input compliant with Microsoft CIR specifications, and also a “learning”
infrared input. This learning input is simply a high pass input which the computer can
use to “learn” to speak the infrared communication language of other user remotes.
The emitter header consists of two output ports which the PC can use to emulate
“learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to connect to
Intel Desktop Boards for this feature to work.
26
Product Description
1.11 Audio Subsystem
The board supports Intel HD Audio via the Realtek ALC892 audio codec. The audio
subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• A signal-to-noise (S/N) ratio of 97 dB
• Microphone input that supports a single dynamic, condenser, or electret
microphone
• Windows Vista Ultimate and Windows 7 Ultimate certification
Table 7 lists the supported functions of the front panel and back panel audio jacks.
Table 7. Audio Jack Support
Audio Jack
FP Green Default
FP Pink Default
Rear Blue Default
Rear Green Ctrl panel Default
Rear Pink Default Ctrl Panel
Rear Black Default
Rear Orange Default
Microphone
Head-
phones
Front
Speaker Line In
Rear
Surround
Center/
Sub
Side
Surround
1.11.1 Audio Subsystem Software
The latest audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 16
1.11.2 Audio Subsystem Components
The audio subsystem includes the following components:
• Intel H67 Express Chipset
• Realtek ALC892 audio codec
• Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x 5-
pin header that provides mic in and line out signals for front panel audio
connectors) (yellow)
• S/PDIF digital audio out header (1 x 4-pin header) (yellow)
• S/PDIF digital audio out connector on the back panel
• 5-port analog audio input/output stack on the back panel
27
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