Intel BLKDH61WWB3, BOXDH61WWB3, DH61WW Technical Product Specification
Intel® Desktop Board
DH61WW
Technical Product Specification
Part Number: G23564-003
The Intel® Desktop Board DH61WW may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DH61WW Specification Update.
March 2012
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DH61WW Technical Product
Specification
-002 Second release of the Intel® Desktop Board DH61WW Technical Product
Specification
-003 Updated maximum memory supported from 8 GB to 16 GB March 2012
Disclaimer
This product specification applies to only the standard Intel® Desktop Board DH61WW with BIOS
identifier BEH6110H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
®
All Intel
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
February 2011
May 2011
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Intel, Intel Core, and Pentium are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2011, 2012, Intel Corporation. All rights reserved.
ii
Board Identification Information
Basic Desktop Board DH61WW Identification Information
AA Revision BIOS Revision Notes
G23116-202 BEH6110H.86A.0016 1,2
G23116-203 BEH6110H.86A.0016 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The H61 processor used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
82H61 B3 SLJ4B
Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that
apply to the Intel
®
Desktop Board DH61WW.
Specification Changes or Clarifications
Date Type of Change Description of Change or Clarification
May 2011 Spec Clarifications
March 2012 Spec Clarification Updated maximum memory supported from 8 GB to 16 GB
• The Intel H61 Express Chipset does not support RAID.
The following sections of this manual have been updated:
― Reference to RAID in Table 1. Feature Summary has
been deleted
ction 1.9.1.1 Serial ATA RAID has been deleted
― Se
― Section 1.9.1.2 Intel
been deleted
― The Caution in Section 3.1 Introduction has been
deleted
• The maximum memory supported changed from 1
8 GB in the following sections of this manual:
― Table 1. Feature Summary
― Section 1.6 System Memory
― Section 2.1.1 Addressable Memory
― Figure 8. Detailed System Memory Address Map
― Tabl
• The Korean Certification mark has changed. The following
sections of this manual have been updated:
― Section 5.1.4 EMC Regulations. The Korean Class B
― Section 5.1.6 Regulatory Compliance Marks (Board
e 9. System Memory Map
Statement translation has been updated.
). The new Korean Certification mark has been
Level
added.
®
Rapid Recover Technology has
6 GB to
iii
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
®
Intel
Desktop Board DH61WW.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DH61WW and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DH61WW
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DH61WW Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
Revision History
Disclaimer ............................................................................................... ii
Board Identification Information ................................................................. iii
Specification Changes or Clarifications ......................................................... iii
Errata .................................................................................................... iv
Preface
Intended Audience
What This Document Contains .................................................................... v
Typographical Conventions ........................................................................ v
1 Product Description
1.1 Overview ........................................................................................ 11
1.1.1 Feature Summary ................................................................ 11
1.1.2 Board Layout ....................................................................... 13
1.1.3 Block Diagram ..................................................................... 15
1.2 Legacy Considerations ...................................................................... 16
1.3 Online Support ................................................................................ 16
1.4 Processor ....................................................................................... 16
1.5 Intel
1.6 System Memory .............................................................................. 17
1.7 Graphics Subsystem ........................................................................ 20
1.8 USB ............................................................................................... 21
1.9 SATA Interfaces
1.10Legacy I/O Controller ....................................................................... 22
1.11Audio Subsystem ............................................................................. 23
1.12LAN Subsystem ............................................................................... 26
1.13Real-Time Clock Subsystem .............................................................. 28
1.14Thermal Monitoring .......................................................................... 29
1.15Platform Management and Security
®
H61 Express Chipset ............................................................... 17
1.6.1 Memory Configurations ......................................................... 18
1.7.1 Integrated Graphics .............................................................. 20
1.7.2 PCI Express x16 Graphics ...................................................... 20
1.10.1 Serial Port ........................................................................... 22
1.11.1 Audio Subsystem Software
1.11.2 Audio Headers and Connectors ............................................... 24
1.12.1 Intel
1.12.2 LAN Subsystem Software ....................................................... 26
1.12.3 RJ-45 LAN Connector with Integrated LEDs
1.15.1 Hardware Management Subsystem ......................................... 30
1.15.2 Hardware Monitoring............................................................. 30
................................................................................... v
.............................................................................. 21
.................................................... 24
®
82579V Gigabit Ethernet Controller ................................ 26
.............................. 27
.................................................... 30
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Intel Desktop Board DH61WW Technical Product Specification
1.16Power Management ......................................................................... 31
1.16.1 ACPI ................................................................................... 31
1.16.2 Hardware Support
................................................................ 34
2 Technical Reference
2.1 Memory Resources
2.1.1 Addressable Memory ............................................................. 38
2.1.2 Memory Map ........................................................................ 40
2.2 Connectors and Headers ................................................................... 40
2.2.1 Back Panel Connectors
2.2.2 Component-side Connectors and Headers
2.3 BIOS Configuration Jumper Block ....................................................... 51
2.4 Mechanical Considerations
2.4.1 Form Factor ......................................................................... 53
2.5 Electrical Considerations
2.5.1 Power Supply Considerations
2.5.2 Fan Header Current Capability ................................................ 55
2.5.3 Add-in Board Considerations
2.6 Thermal Considerations
2.7 Reliability ....................................................................................... 58
2.8 Environmental ................................................................................ 58
.......................................................................... 38
.......................................................... 41
................................ 42
................................................................ 53
................................................................... 54
................................................. 54
.................................................. 55
.................................................................... 56
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 59
3.2 System Management BIOS (SMBIOS) ................................................. 61
3.3 Legacy USB Support
3.4 BIOS Updates
3.4.1 Language Support
3.4.2 Custom Splash Screen
3.5 BIOS Recovery ................................................................................ 63
3.6 Boot Options ................................................................................... 64
3.6.1 Optical Drive Boot
3.6.2 Network Boot ....................................................................... 64
3.6.3 Booting Without Attached Devices........................................... 64
3.6.4 Changing the Default Boot Device During POST
................................................................................. 62
........................................................................ 61
................................................................ 62
.......................................................... 63
................................................................ 64
........................ 64
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 65
4.2 BIOS Beep Codes
4.3 Front-panel Power LED Blink Codes
4.4 BIOS Error Messages
4.5 Port 80h POST Codes
............................................................................ 65
.................................................... 66
....................................................................... 66
....................................................................... 67
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ..................................................................... 73
5.1.1 Safety Standards .................................................................. 73
5.1.2 European Union Declaration of Conformity Statement
5.1.3 Product Ecology Statements ................................................... 75
................ 74
viii
Contents
5.1.4 EMC Regulations .................................................................. 77
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance
5.1.6 Regulatory Compliance Marks (Board Level)
............................. 81
................. 80
5.2 Battery Disposal Information ............................................................. 82
Figures
1. Major Board Components.................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration ........................................... 19
4. Back Panel Audio Connector Options .................................................. 25
5. LAN Connector LED Locations ............................................................ 27
6. Thermal Sensors and Fan Headers ..................................................... 29
7. Location of the Standby Power LED (Green) ........................................ 37
8. Detailed System Memory Address Map ............................................... 39
9. Back Panel Connectors ..................................................................... 41
10. Component-side Connectors and Headers ........................................... 42
11. Connection Diagram for Front Panel Header ........................................ 48
12. Connection Diagram for Front Panel USB Headers ................................ 50
13. Location of the Jumper Block ............................................................. 51
14. Board Dimensions ........................................................................... 53
15. Localized High Temperature Zones ..................................................... 57
Tables
1. Feature Summary ............................................................................ 11
2. Components Shown in Figure 1 ......................................................... 14
3. Supported Memory Configurations ..................................................... 18
4. Audio Jack Support .......................................................................... 23
5. LAN Connector LED States ................................................................ 27
6. Effects of Pressing the Power Switch .................................................. 31
7. Power States and Targeted System Power ........................................... 32
8. Wake-up Devices and Events ............................................................ 33
9. System Memory Map ....................................................................... 40
10. Component-side Connectors and Headers Shown in Figure 10 ................ 43
11. TPM Header .................................................................................... 44
12. Serial Port Header ........................................................................... 44
13. S/PDIF Header ................................................................................ 44
14. Front Panel Audio Header for Intel HD Audio ........................................ 45
15. Front Panel Audio Header for AC ’97 Audio
16. Front Panel USB Header ................................................................... 45
17. SATA Connectors ............................................................................. 45
18. Chassis Intrusion Header .................................................................. 46
19. Fan Headers ................................................................................... 46
20. Processor Core Power Connector ........................................................ 47
21. Main Power Connector ...................................................................... 47
22. Front Panel Header .......................................................................... 48
.......................................... 45
ix
Intel Desktop Board DH61WW Technical Product Specification
23. States for a One-Color Power LED ...................................................... 49
24. LPC Debug Header ........................................................................... 50
25. BIOS Setup Configuration Jumper Settings .......................................... 52
26. Recommended Power Supply Current Values ....................................... 54
27. Fan Header Current Capability ........................................................... 55
28. Thermal Considerations for Components ............................................. 57
29. Environmental Specifications ............................................................. 58
30. BIOS Setup Program Menu Bar .......................................................... 60
31. BIOS Setup Program Function Keys .................................................... 60
32. Acceptable Drives/Media Types for BIOS Recovery
............................... 63
33. Boot Device Menu Options ................................................................ 64
34. BIOS Beep Codes ............................................................................ 65
35. Front-panel Power LED Blink Codes .................................................... 66
36. BIOS Error Messages ....................................................................... 66
37. Port 80h POST Code Ranges.............................................................. 67
38. Port 80h POST Codes ....................................................................... 68
39. Typical Port 80h POST Sequence ........................................................ 72
40. Safety Standards ............................................................................. 73
41. EMC Regulations ............................................................................. 77
42. Regulatory Compliance Marks ............................................................ 81
x
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Chipset
Memory
Graphics
Audio
MicroATX (9.60 inches by 7.80 inches [243.84 millimeters by
198.12 millimeters])
®
• Intel
Intel
Hub (PCH)
• Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 16 GB of system memory with two DIMMs using 4 Gb
• Support for non-ECC memory
• Integrated graphics support for processors with Intel
• Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
• Intel
Core™ i7, Intel® Core™ i5, Intel® Core™ i3, and Intel® Pentium®
processors in an LGA1155 socket with up to 95 W TDP:
― Integrated graphics processing (processors with Intel
Technology)
― External graphics interface controller
― Integrated memory controller
®
H61 Express Chipset consisting of the Intel
memory technology
®
High Definition Audio:
― Realtek* ALC892 audio codec
― S/PDIF audio header
― Front panel audio header
®
Graphics
®
H61 Platform Controller
®
Graphics Technology
continued
11
Intel Desktop Board DH61WW Technical Product Specification
Table 1. Feature Summary (continued)
Peripheral
Interfaces
Legacy I/O Control
BIOS
Instantly Available
PC Technology
LAN Support Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82579V Gigabit
Expansion
Capabilities
Hardware Monitor
Subsystem
• Six USB ports:
― Four USB 2.0 ports are implemented with stacked back panel connectors
― Two USB 2.0 front panel ports are implemented through one dual-port
internal header
• Four SATA interfaces through the Intel H61 Express Chipset
• One serial port header
• One parallel port connector on the back panel
• One PS/2* keyboard/mouse port on back panel
• Nuvoton* W83677HG-i Super I/O controller for hardware management and
serial port, parallel port, and PS/2 support
®
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Support for PCI* Local Bus Specification Revision 2.2
• Support for PCI Express*
• Suspend to RAM support
• Wake on Conventional PCI, PCI Express, LAN, front panel, serial, PS/2, and
Ethernet Controller
• One PCI Express 2.0 x16 add-in card connector
• One PCI Express 2.0 x1 add-in card connector
• One Conventional PCI bus connector
• Hardware monitoring through the Nuvoton Super I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Two fan headers
• Two fan sense inputs used to monitor fan activity
• Fan speed control
BIOS resident in the SPI Flash device
and SMBIOS
USB ports
12
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board
DH61WW.
Product Description
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
13
Intel Desktop Board DH61WW Technical Product Specification
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Descript
A Conventional PCI bus add-in card connector
B Chassis intrusion header
C S/PDIF header
D PCI Express x1 add-in card connector
E Battery
F PCI Express x16 add-in card connector
G Back panel connectors
H Standby power LED
I 12 V internal power connector (ATX12V)
J Rear chassis fan header
K Piezoelectric speaker
L LGA1155 processor socket
M Processor fan header
N Low Pin Count (LPC) Debug header
O DIMM 1 (Channel A DIMM 1)
P DIMM 2 (Channel B DIMM 1)
Q Trusted Platform Module (TPM) header
R Main power connector (2 x 12)
S SATA connectors
T BIOS setup configuration jumper block
U Front panel header
V Intel H61 Express Chipset
W Serial port header
X Front panel USB 2.0 headers
Y Front panel audio header
ion
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
15
Intel Desktop Board DH61WW Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No Parallel ATA (PATA) IDE drive connector
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DH61WW http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board DH61WW
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.4 Processor
The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, and
Intel Pentium processors in an LGA1155 socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum TDP of 95 W. See the Intel web site listed below for the
most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 54 for information on power supply requirements for this board.
16
Product Description
1.5 Intel
The Intel H61 Express Chipset consisting of the Intel H61 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network,
display, and PCI Express. The PCH is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel H61 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
®
H61 Express Chipset
1.6 System Memory
The board has two DIMM sockets and supports the following memory features:
• Two independent memory channels with interleaved mode support
• Supports 1.2 V – 1.8 V DIMM memory voltage
• Support for non-ECC, unbuffered, single-sided or double-sided DIMMs with x8
organization
• 16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 38 for information on the total amount of addressable
memory.
• Minimum total system memory: 1 GB using 1 Gb x8 module
• Serial Presence Detect
• DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
17
Intel Desktop Board DH61WW Technical Product Specification
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Capacity
512 MB SS 1 Gbit 64 M x16/empty 4
1024 MB SS 1 Gbit 128 M x8/empty 8
1024 MB SS 2 Gbit 128 M x16/empty 4
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 128 M x16/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
Configuration
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
(Note)
SDRAM
025414.htm
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
1.6.1 Memory Configurations
The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors support the
following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
18
Figure 3 illustrates the memory channel and DIMM configuration.
Product Description
Figure 3. Memory Channel and DIMM Configuration
19
Intel Desktop Board DH61WW Technical Product Specification
1.7 Graphics Subsystem
The board supports system graphics through either Intel Graphics Technology or a
PCI Express 2.0 x16 add-in graphics card.
1.7.1 Integrated Graphics
The board supports integrated graphics through the Intel® Flexible Display Interface
®
(Intel
1.7.1.1 Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x
1536 (QXGA) at a 75 Hz refresh rate. The VGA port is enabled for POST whenever a
monitor is attached, regardless of the DVI-D connector status.
1.7.2 PCI Express x16 Graphics
The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an
LGA1155 socket support discrete add in graphics cards through the PCI Express 2.0
x16 graphics connector:
• Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
• Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
For information about Refer to
PCI Express technology http://www.pcisig.com
FDI) for processors with Intel Graphics Technology.
direction (500 MB/s) per lane. Maximum theoretical bandwidth on interface is
8 GB/s in each direction, simultaneously, when operating in x16 mode.
direction (250 MB/s) per lane. Maximum theoretical bandwidth on interface is
4 GB/s in each direction, simultaneously, when operating in x16 mode.
20
Product Description
1.8 USB
The board supports up to six USB 2.0 ports. The port arrangement is as follows:
• Four USB 2.0 ports are implemented with stacked back panel connectors (black)
• Two USB 2.0 front panel ports are implemented through one dual-port internal
header
All six USB ports are high-speed, full-speed, and low-speed capable.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 41
The location of the front panel USB headers Figure 10, page 42
1.9 SATA Interfaces
The board provides four 3 Gb/s SATA connectors, which support one device per
connector.
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Windows* XP, Windows Vista*, and Windows 7* operating
systems.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 10, page 42
.
21
Intel Desktop Board DH61WW Technical Product Specification
1.10 Legacy I/O Controller
The Legacy I/O Controller provides the following features:
• One serial port
• One back panel parallel port (with Extended Capabilities Port (ECP) and Enhanced
Parallel Port (EPP) support
• PS/2-style keyboard/mouse interface on the back panel
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional
bus systems
• Intelligent power management, including a programmable wake-up event interface
• Conventional PCI bus power management support
The BIOS Setup program provides configuration options for the Legacy I/O controller.
1.10.1 Serial Port
The serial port is implemented as a 10-pin header on the board. The serial port
supports data transfers at speeds up to 115.2 kbits/s with BIOS support.
For information about Refer to
The location of the serial port header Figure 10, page 42
22
Product Description
1.11 Audio Subsystem
The board supports Intel High Definition Audio through the Realtek ALC892 audio
codec interface.
The Realtek ALC892-based audio subsystem supports the following features:
• 6+2-channel audio with independent multi-streaming stereo.
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output through back panel jacks
• Headphone and Mic in functions for front panel audio jacks
• S/PDIF audio header
• A signal-to-noise (S/N) ratio of 90 dB
Table 4 lists the supported functions of the front panel and back panel audio jacks.
Table 4. Audio Jack Support
Audio Jack
FP Green Default
FP Pink Default
Rear Blue Default
Rear Green Ctrl panel Default
Rear Pink Default
Microphone
Head-
phones
Line Out
(Front
Speakers)
Line In
(Surround)
Mic In
(Center/Sub)
23
Intel Desktop Board DH61WW Technical Product Specification
1.11.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 16
1.11.2 Audio Headers and Connectors
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include the
following:
• Front panel audio (a 2 x 5-pin header that provides headphone and mic in signals
for front panel audio connectors) (yellow)
• S/PDIF audio header (1 x 4-pin header) (yellow)
For information about Refer to
The locations of the front panel audio header, S/PDIF header, and
internal mono speaker header
The signal names of the front panel audio header Table 14 and Table 15, page 45
The signal names of the S/PDIF header Table 13, page 44
The back panel audio connectors Section 2.2.1, page 41
Figure 10, page 42
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1.11.2.1 Analog Audio Connectors
The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A Line in
B Line out/front speakers
C Mic in/side surround
Figure 4. Back Panel Audio Connector Options
Product Description
The back panel audio connectors are configurable through the audio device drivers.
For information about Refer to
The back panel audio connectors Section 2.2.1, page 41
The front panel headphone output is supported using a separate audio channel pair
allowing multi-streaming audio configurations such as simultaneous 5.1 surround
playback and stereo audio conferencing (through back panel speakers and a front
panel headset, respectively).
1.11.2.2 S/PDIF Header
The S/PDIF header allows connections to coaxial or optical dongles for digital audio
output.
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Intel Desktop Board DH61WW Technical Product Specification
1.12 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mbits/s)
• Intel H61 Express Chipset
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• PCI Conventional bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
1.12.1 Intel
The Intel 82579V Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support [Low Power Idle (LPI) mode]
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
⎯ PCI Express-based interface for active state operation (S0) state
⎯ SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility
®
82579V Gigabit Ethernet Controller
1.12.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers Section 1.3, page 16
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