Intel D845WN, BOXD845HV - 845 Pga478 Max-3GB Sdr Matx3pci Agp4x Cnr Snd Ata100 400mhz, BOXD845WN Technical Product Specification

Intel® Desktop Board D845HV/D845WN
Technical Product Specification
The Intel® Desktop Boards D845HV/D845WN may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board D845HV/D845WN Specification Update.
August 2001 Order Number: A65136-001
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board D845HV/D845WN Technical Product Specification.
This product specification applies to only standard D845HV and D845WN boards with BIOS identifier HV84510A.86A.
Changes to this specification will be published in the Intel Desktop Board D845HV/D845WN Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERM S AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTE L ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRA NT IES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANT ABILITY, OR INFRINGEMENT OF ANY PA T ENT, COPYRIGHT, OR OTHE R INTELLECTUAL PROPERTY RIGHT.
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Intel products are not int ended f or use in medical, life s aving, or life sustai ni ng appl i cations or for any other application in which the failure of the Intel product could create a si tuation where personal injury or death may occur.
Intel may make changes t o specifications, product descriptions, and plans at any time, wi thout notice. The Intel
product to deviate from publi shed specifications. Current characterized errat a are available on request. Contact your local Int el sales office or your dis tributor to obtain the lates t specifications before placing your product order. Copies of documents whic h hav e an orderi ng number and are referenced in this document , or other Intel literature, m ay be
obtained from: Intel Corporation
P.O. Box 5937 Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel and Pentium are trademark s or registered trademarks of Intel Corporation or its subsidiaries in the United St ates and other countries.
Copyright 2001, Intel Corporation. All rights reserved.
®
Desktop Boards D845HV and D845WN may contain design defects or errors known as errata that may cause the
Other names and brands may be claim ed as the property of others.
August 2001
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
®
power and environmental requirements, and the BIOS for these Intel and D845WN. It describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the D845HV and D845WN boards and their components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Desktop Boards: D845HV
Chapter Description
1 A description of the hardware used on the D845HV and D845WN boards 2 A map of the resources of the boards 3 The features supported by the BIOS Setup program 4 The contents of the BIOS Setup program’s menus and submenus
5 A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
iii
Intel Desktop Board D845HV/D845WN Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#) (NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the D845HV and D845WN boards, and X is the instance of the particular part at that general location. For example, J5J1 is a connector, located at 5J. It is
the first connector in the 5J area. GB Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/sec 1000 bits per second MB Megabyte (1,048,576 bytes) MB/sec Megabytes per second Mbit Megabit (1,048,576 bits) Mbit/sec Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified.
This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Board Differences.......................................................................................................11
1.2 Overview....................................................................................................................12
1.2.1 Feature Summary ........................................................................................12
1.2.2 Manufacturing Options.................................................................................13
1.2.3 Board Layouts..............................................................................................14
1.2.4 Block Diagram..............................................................................................16
1.3 Online Support ...........................................................................................................17
1.4 Operating System Support.........................................................................................17
1.5 Design Specifications .................................................................................................18
1.6 Processor...................................................................................................................21
1.7 System Memory .........................................................................................................22
1.8 Intel® 845 Chipset.......................................................................................................24
1.8.1 AGP.............................................................................................................25
1.8.2 USB..............................................................................................................25
1.8.3 IDE Support .................................................................................................27
1.8.4 Real-Time Clock, CMOS SRAM, and Battery...............................................28
®
1.8.5 Intel
1.9 I/O Controller..............................................................................................................29
1.9.1 Serial Ports..................................................................................................29
1.9.2 Infrared Support...........................................................................................30
1.9.3 Parallel Port..................................................................................................30
1.9.4 Diskette Drive Controller ..............................................................................31
1.9.5 Keyboard and Mouse Interface....................................................................31
1.9.6 I/O Controller Option....................................................................................31
1.10 Audio Subsystem (Optional).......................................................................................32
1.10.1 Audio Connectors.........................................................................................33
1.10.2 Audio Subsystem Software..........................................................................33
1.11 LAN Subsystem (Optional).........................................................................................34
1.11.1 Intel® 82562ET Platform LAN Connect Device.............................................34
1.11.2 RJ-45 LAN Connector with Integrated LEDs ................................................34
1.11.3 LAN Subsystem Software............................................................................35
1.12 CNR (Optional)...........................................................................................................35
1.13 Hardware Management Subsystem............................................................................36
1.13.1 Hardware Monitor Component (Optional).....................................................36
1.13.2 Fan Monitoring.............................................................................................36
1.13.3 Chassis Intrusion and Detection...................................................................37
1.14 Power Management ...................................................................................................37
1.14.1 ACPI.............................................................................................................37
1.14.2 Hardware Support........................................................................................41
82802AB 4 Mbit Firmware Hub (FWH)...............................................29
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Intel Desktop Board D845HV/D845WN Technical Product Specification
2 Technical Reference
2.1 Introduction.................................................................................................................45
2.2 Memory Map..............................................................................................................45
2.3 I/O Map .....................................................................................................................46
2.4 DMA Channels...........................................................................................................48
2.5 PCI Configuration Space Map....................................................................................48
2.6 Interrupts....................................................................................................................49
2.7 PCI Interrupt Routing Map ..........................................................................................49
2.8 Connectors.................................................................................................................51
2.8.1 Back Panel Connectors................................................................................52
2.8.2 Internal I/O Connectors................................................................................55
2.8.3 External I/O Connectors...............................................................................68
2.9 Jumper Blocks............................................................................................................72
2.9.1 Front Panel Audio Connector/Jumper Block.................................................72
2.9.2 BIOS Setup Configuration Jumper Block......................................................73
2.10 Mechanical Considerations.........................................................................................74
2.10.1 D845HV Form Factor...................................................................................74
2.10.2 D845WN Form Factor..................................................................................75
2.10.3 I/O Shield.....................................................................................................76
2.11 Electrical Considerations............................................................................................78
2.11.1 Power Consumption.....................................................................................78
2.11.2 Add-in Board Considerations........................................................................78
2.11.3 Standby Current Requirements....................................................................79
2.11.4 Fan Connector Current Capability................................................................80
2.11.5 Power Supply Considerations ......................................................................80
2.12 Thermal Considerations..............................................................................................81
2.13 Reliability....................................................................................................................83
2.14 Environmental ............................................................................................................83
2.15 Regulatory Compliance..............................................................................................84
2.15.1 Safety Regulations.......................................................................................84
2.15.2 EMC Regulations.........................................................................................84
2.15.3 Product Certification Markings (Board Level) ...............................................85
3 Overview of BIOS Features
3.1 Introduction.................................................................................................................87
3.2 BIOS Flash Memory Organization..............................................................................88
3.3 Resource Configuration ..............................................................................................88
3.3.1 PCI Autoconfiguration..................................................................................88
3.3.2 PCI IDE Support...........................................................................................88
3.4 System Management BIOS (SMBIOS).......................................................................89
3.5 Legacy USB Support..................................................................................................89
3.6 BIOS Updates ............................................................................................................90
3.6.1 Language Support........................................................................................91
3.6.2 Custom Splash Screen.................................................................................91
3.7 Recovering BIOS Data...............................................................................................91
vi
3.8 Boot Options...............................................................................................................92
3.8.1 CD-ROM and Network Boot.........................................................................92
3.8.2 Booting Without Attached Devices...............................................................92
3.9 Fast Booting Systems with Intel® Rapid BIOS Boot....................................................92
3.9.1 Peripheral Selection and Configuration........................................................92
3.9.2 Intel Rapid BIOS Boot..................................................................................93
3.10 BIOS Security Features..............................................................................................94
4 BIOS Setup Program
4.1 Introduction.................................................................................................................95
4.2 Maintenance Menu.....................................................................................................96
4.2.1 Extended Configuration Submenu................................................................97
4.3 Main Menu..................................................................................................................98
4.4 Advanced Menu..........................................................................................................99
4.4.1 PCI Configuration Submenu.......................................................................100
4.4.2 Boot Configuration Submenu .....................................................................101
4.4.3 Peripheral Configuration Submenu.............................................................102
4.4.4 IDE Configuration Submenu.......................................................................104
4.4.5 Diskette Configuration Submenu ................................................................107
4.4.6 Event Log Configuration Submenu.............................................................108
4.4.7 Video Configuration Submenu....................................................................109
4.5 Security Menu..........................................................................................................110
4.6 Power Menu.............................................................................................................111
4.6.1 ACPI Submenu ..........................................................................................112
4.7 Boot Menu................................................................................................................113
4.7.1 Boot Device Priority Submenu....................................................................114
4.7.2 Hard Disk Drives Submenu........................................................................115
4.7.3 Removable Devices Submenu...................................................................115
4.7.4 ATAPI CD-ROM Drives Submenu..............................................................116
4.8 Exit Menu.................................................................................................................117
Contents
5 Error Messages and Beep Codes
5.1 BIOS Error Messages...............................................................................................119
5.2 Port 80h POST Codes..............................................................................................121
5.3 Bus Initialization Checkpoints...................................................................................125
5.4 Speaker (Optional) ...................................................................................................126
5.5 BIOS Beep Codes....................................................................................................126
Figures
1. D845HV Board Components......................................................................................14
2. D845WN Board Components.....................................................................................15
3. Block Diagram............................................................................................................16
4. Intel 845 Chipset Block Diagram.................................................................................24
5. USB Port Configuration for Boards with the SMSC LPC47M142 I/O Controller..........26
6. USB Port Configuration for Boards with the SMSC LPC47M132 I/O Controller..........27
7. Audio Subsystem Block Diagram................................................................................32
8. ICH2 and CNR Signal Interface..................................................................................35
9. Location of the Optional Standby Power Indicator LED..............................................44
vii
Intel Desktop Board D845HV/D845WN Technical Product Specification
10. Back Panel Connectors..............................................................................................52
11. Audio Connectors.......................................................................................................56
12. Power and Hardware Control Connectors..................................................................58
13. D845HV Add-in Board and Peripheral Interface Connectors......................................61
14. D845WN Add-in Board and Peripheral Interface Connectors.....................................62
15. External I/O Connectors.............................................................................................68
16. Location of the Jumper Block.....................................................................................72
17. D845HV Board Dimensions........................................................................................74
18. D845WN Board Dimensions.......................................................................................75
19. I/O Shield Dimensions (for boards with the LAN Subsystem).....................................76
20. I/O Shield Dimensions (for boards without the LAN Subsystem)................................77
21. Localized High Temperature Zones............................................................................82
Tables
1. Summary of Board Differences...................................................................................11
2. Feature Summary.......................................................................................................12
3. Manufacturing Options ...............................................................................................13
4. Specifications.............................................................................................................18
5. Supported Processors................................................................................................21
6. Supported Memory Configurations.............................................................................23
7. LAN Connector LED States........................................................................................34
8. Effects of Pressing the Power Switch.........................................................................38
9. Power States and Targeted System Power................................................................39
10. Wake-up Devices and Events.....................................................................................40
11. Fan Connector Function/Operation.............................................................................42
12. System Memory Map..................................................................................................45
13. I/O Map ......................................................................................................................46
14. DMA Channels...........................................................................................................48
15. PCI Configuration Space Map....................................................................................48
16. Interrupts....................................................................................................................49
17. PCI Interrupt Routing Map ..........................................................................................50
18. PS/2 Mouse/Keyboard Connector..............................................................................53
19. USB Connectors.........................................................................................................53
20. Parallel Port Connector...............................................................................................53
21. Serial Port A Connector..............................................................................................54
22. LAN Connector (optional)...........................................................................................54
23. Audio Line In Connector (Optional).............................................................................54
24. Audio Line Out Connector (Optional)..........................................................................54
25. Mic In Connector (Optional)........................................................................................54
26. Telephony Connector (Optional).................................................................................57
27. Auxiliary Line In Connector (Optional) ........................................................................57
28. ATAPI CD-ROM Connector (Optional) .......................................................................57
29. ATX12V Power Connector..........................................................................................59
30. Rear Chassis Fan Connector .....................................................................................59
31. Processor Fan Connector...........................................................................................59
32. Main Power Connector...............................................................................................60
33. Chassis Intrusion Connector.......................................................................................60
viii
Contents
34. Front Chassis Fan Connector (Optional)....................................................................60
35. CNR Connector..........................................................................................................63
36. PCI Bus Connectors...................................................................................................64
37. AGP Connector..........................................................................................................65
38. Diskette Drive Connector............................................................................................66
39. PCI IDE Connectors...................................................................................................67
40. SCSI LED Connector (Optional) .................................................................................67
41. Front Panel Audio Connector .....................................................................................69
42. Serial Port B Connector (Optional) .............................................................................69
43. Front Panel USB Connector.......................................................................................69
44. Auxiliary Front Panel Power/Sleep/Message-Waiting LED Connector........................69
45. Front Panel Connector ...............................................................................................70
46. States for a One-Color Power LED.............................................................................71
47. States for a Two-Color Power LED.............................................................................71
48. Front Panel Audio Connector / Jumper Block.............................................................73
49. BIOS Setup Configuration Jumper Settings ................................................................73
50. Power Usage..............................................................................................................78
51. Standby Current Requirements..................................................................................79
52. Fan Connector Current Capability ..............................................................................80
53. Thermal Considerations for Components...................................................................82
54. D845HV/D845WN Board Environmental Specifications..............................................83
55. Safety Regulations.....................................................................................................84
56. EMC Regulations........................................................................................................84
57. Supervisor and User Password Functions..................................................................94
58. BIOS Setup Program Menu Bar.................................................................................95
59. BIOS Setup Program Function Keys ..........................................................................96
60. Maintenance Menu.....................................................................................................96
61. Extended Configuration Submenu..............................................................................97
62. Main Menu..................................................................................................................98
63. Advanced Menu..........................................................................................................99
64. PCI Configuration Submenu.....................................................................................100
65. Boot Configuration Submenu....................................................................................101
66. Peripheral Configuration Submenu...........................................................................102
67. IDE Configuration Submenu.....................................................................................104
68. Primary/Secondary IDE Master/Slave Submenus .....................................................105
69. Diskette Configuration Submenu..............................................................................107
70. Event Log Configuration Submenu...........................................................................108
71. Video Configuration Submenu..................................................................................109
72. Security Menu..........................................................................................................110
73. Power Menu.............................................................................................................111
74. ACPI Submenu.........................................................................................................112
75. Boot Menu................................................................................................................113
76. Boot Device Priority Submenu..................................................................................114
77. Hard Disk Drives Submenu ......................................................................................115
78. Removable Devices Submenu..................................................................................115
79. ATAPI CD-ROM Drives Submenu............................................................................116
80. Exit Menu.................................................................................................................117
81. BIOS Error Messages...............................................................................................119
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Intel Desktop Board D845HV/D845WN Technical Product Specification
82. Uncompressed INIT Code Checkpoints....................................................................121
83. Boot Block Recovery Code Checkpoints ..................................................................121
84. Runtime Code Uncompressed in F000 Shadow RAM ..............................................122
85. Bus Initialization Checkpoints...................................................................................125
86. Upper Nibble High Byte Functions............................................................................125
87. Lower Nibble High Byte Functions............................................................................126
88. Beep Codes..............................................................................................................127
x
1 Product Description
What This Chapter Contains
1.1 Board Differences.......................................................................................................11
1.2 Overview....................................................................................................................12
1.3 Online Support ...........................................................................................................17
1.4 Operating System Support.........................................................................................17
1.5 Design Specifications .................................................................................................18
1.6 Processor...................................................................................................................21
1.7 System Memory .........................................................................................................22
1.8 Intel® 845 Chipset.......................................................................................................24
1.9 I/O Controller..............................................................................................................29
1.10 Audio Subsystem (Optional).......................................................................................32
1.11 LAN Subsystem (Optional).........................................................................................34
1.12 CNR (Optional)...........................................................................................................35
1.13 Hardware Management Subsystem............................................................................36
1.14 Power Management ...................................................................................................37
1.1 Board Differences
This TPS describes these Intel® Desktop boards: D845HV and D845WN. The boards are identical with the exception of the items listed below. Table 1 summarizes the differences between these boards.
Table 1. Summary of Board Differences
D845HV
D845WN
NOTE
Most of the illustrations in this document show only the D845HV board. When there are significant differences between the two boards, illustrations of both boards are provided.
microATX Form Factor (9.60 inches by 9.60 inches)
Three PCI bus connectors
Refer also to Table 3, page 13 for a list of manufacturing options specific to D845HV board only
ATX Form Factor (12.00 inches by 9.60 inches)
Six PCI bus connectors
11
Intel Desktop Board D845HV/D845WN Technical Product Specification
1.2 Overview
1.2.1 Feature Summary
Table 2 summarizes the D845HV and D845WN boards’ major features.
Table 2. Feature Summary
Form Factor
Processor
Memory (Refer also to Table 3, page 13)
Chipset
Video I/O Control
(Refer also to Table 3, page 13)
Peripheral Interfaces (Refer also to Table 3, page 13)
Expansion Capabilities
BIOS
D845HV: microATX (9.60 inches by 9.60 inches) D845WN: ATX (12.00 inches by 9.60 inches)
Support for an Intel
400 MHz system bus
Three 168-pin SDRAM Dual Inline Memory Module (DIMM) sockets
Support for single-sided or double-sided DIMMs (PC133 only)
Support for up to 3 GB system memory
NOTE:
The D845HV/D845WN boards have been designed to support DIMMs
®
Pentium® 4 processor in an mPGA478 socket
based on 512 Mbit technology for a maximum onboard capacity of up to 3 GB, but this technology has not been validated on this board. Please refer to the following Intel web sites. For the D845HV board:
http://developer.intel.com/design/motherbd/hv/hv_mem.htm
For the D845WN board:
http://developer.intel.com/design/motherbd/wn/wn_mem.htm
Intel® 845 Chipset, consisting of:
®
Intel
Intel
Intel
AGP connector supporting 1.5 V 4X AGP cards SMSC LPC47M142 LPC Bus I/O controller
Up to seven Universal Serial Bus (USB) ports
Two serial ports
One parallel port
IrDA
Two IDE interfaces with UDMA 33, ATA-66/100 support
One diskette drive interface
PS/2
Three fan connectors
D845HV: Three PCI bus add-in card connectors (SMBus routed to PCI bus
D845WN: Six PCI bus add-in card connectors (SMBus routed to PCI bus
Intel/AMI BIOS (resident in the Intel 82802AB 4 Mbit FWH)
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
82845 Memory Controller Hub (MCH)
®
82801BA I/O Controller Hub (ICH2)
®
82802AB 4 Mbit Firmware Hub (FWH)
-compliant infrared port
keyboard and mouse ports
connector 1)
connector 1)
and SMBIOS
continued
12
Table 2. Feature Summary (continued)
Instantly Available PC Technology
Support for PCI Local Bus Specification Revision 2.2
Suspend to RAM support
Wake on PCI, CNR, RS-232, front panel, PS/2 devices, and USB ports
For information about Refer to
The board’s compliance level with ACPI, Plug and Play, and SMBIOS. Section 1.4, page 17
1.2.2 Manufacturing Options
Table 3 describes the D845HV and D845WN boards’ manufacturing options. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you.
Table 3. Manufacturing Options
Audio CNR
LAN Hardware Monitor
Subsystem
The items listed below are component changes for an alternate configuration of the D845HV board
Delete the auxiliary front panel power/sleep/message-waiting LED connector (shown on page 68)
Delete the front chassis fan connector (shown on page 58)
Delete the Mic-in pre-amp for boards equipped with the audio subsystem (described on page 32)
Delete the SCSI hard drive activity LED connector (shown on pages 61 and 62)
Delete the serial port B connector (shown on page 68)
Delete the standby power indicator LED (shown on page 44)
Delete the third DIMM socket (shown on pages 14 and 15)
Delete the two USB connectors adjacent to the PS/2 connectors on the back panel (shown on page 52)
Delete the 47 Ω inductive speaker (described on page 126)
Replace I/O controller with SMSC LPC47M132 LPC bus I/O controller (functionally equivalent to SMSC
LPC47M142 LPC bus I/O controller but without an integrated USB hub) (described on page 31)
Audio subsyst em for AC 97 processing usi ng the Analog Devices AD1885 codec One Communication and Networking Riser (CNR) connector (slot shared with
PCI bus connector 3 on the D845HV board and with PCI bus connector 6 on the D845WN board)
®
Intel
82562ET 10/100 Mbit/sec Platform LAN Connect (PLC) device
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
Two fan sense inputs used to monitor fan activity
Product Description
For information about Refer to
Available configurations of the D845HV and D845WN boards Section 1.3, page 17
NOTE
The LAN and the CNR manufacturing options are mutually exclusive.
13
Intel Desktop Board D845HV/D845WN Technical Product Specification
1.2.3 Board Layouts
Figure 1 shows the location of the major components on the D845HV board.
CA
B
D
S
R
Q
P
O
N
A Audio codec (optional) K Diskette drive connector B Intel 82562ET PLC Device (optional) L IDE connectors C AGP connector M Speaker (optional) D Back panel connectors N Intel 82801BA I/O Controller Hub (ICH2) E +12V power connector (ATX12V) O Intel 82802AB 4 Mbit Firmware Hub (FWH) F Intel 82845 Memory Controller Hub (MCH) P Front panel connector G mPGA478 processor socket Q Battery H DIMM sockets R PCI bus add-in card connectors I I/O Controller S CNR connector (optional) J Power Connector
L
J
KM
OM11427
E
F
G
H
I
14
Figure 1. D845HV Board Components
Figure 2 shows the location of the major components on the D845WN board.
Product Description
CA
B
D
S
R
Q
P
O
N
A Audio codec (optional) K Diskette drive connector B Intel 82562ET PLC Device (optional) L IDE connectors C AGP connector M Speaker (optional) D Back panel connectors N Intel 82801BA I/O Controller Hub (ICH2) E +12V power connector (ATX12V) O Intel 82802AB 4 Mbit Firmware Hub (FWH) F Intel 82845 Memory Controller Hub (MCH) P Front panel connector G mPGA478 processor socket Q Battery H DIMM sockets R PCI bus add-in card connectors I I/O Controller S CNR connector (optional) J Power Connector
L
J
KM
OM11426
E
F
G
H
I
15
Figure 2. D845WN Board Components
Intel Desktop Board D845HV/D845WN Technical Product Specification
1.2.4 Block Diagram
Figure 3 is a block diagram of the major functional areas of the D845HV and D845WN boards.
mPGA478
Processor Socket
AGP
Interface
4X AGP
Connector
(1.5 V only)
= connector or sock et
Primary/
Secondary IDE
System Bus
(400 MHz)
82845 Memory
Controller Hub
(MCH)
SDRAM
Bus
UDMA 33 and
ATA-66/100
845 Chipset
AHA
Bus
USB
LPC I/O
Controller
USB
82801BA
I/O Controller Hub
(ICH2)
LPC
Bus
Physical
Layer
Interface
(optional)
Back Panel
USB Ports (2)
Front Panel
USB Ports (2)
Serial Ports Parallel Port PS/2 Mouse
PS/2 Keyboard
Infrared Port
Diskette Drive
Connector
82802AB 4 Mbit
Firmware Hub
(FWH)
LAN
Connector
(optional)
DIMM Banks (3)
PCI Slot 1
PCI Slot 2
PCI Slot 3
PCI Slot 4
PCI Slot 5
PCI Slot 6
PCI Bus
D845WN
Only
SMBus
Hardware
Monitor
(optional)
Figure 3. Block Diagram
CSMA/CD
Unit Interface
USB
AC Link
AD1885
Audio Codec
(optional)
USB
CNR
Connector
(optional)
Line In
Line Out
Mic In
Auxiliary Line In
CD-ROM
Telephony
Back Panel
USB Ports (2)
OM12274
16
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel’s D845HV and D845WN boards under “Product Info” or “Customer Support”
Available configurations for the D845HV board
Available configurations for the D845WN board
Processor data sheets http://www.intel.com/design/litcentr Proper date access in systems with
Intel® desktop boards
ICH2 addressing http://developer.intel.com/design/chipsets/datashts Custom splash screens http://intel.com/design/motherbd/gen_indx.htm Audio software and utilities http://www.intel.com/design/motherbd LAN software and drivers http://www.intel.com/design/motherbd
Product Description
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop http://developer.intel.com/design/motherbd/hv/hv_available.htm
http://developer.intel.com/design/motherbd/wn/wn_available.htm
http://support.intel.com/support/year2000
1.4 Operating System Support
The D845HV and D845WN boards support drivers for all of the onboard hardware and subsystems under the following operating systems:
Microsoft Windows
Windows ME
2000
Windows NT
Windows
Windows XP
For information about Refer to
Supported drivers Section 1.3
NOTE
Third party vendors may offer other drivers.
98SE
4.0
17
Intel Desktop Board D845HV/D845WN Technical Product Specification
1.5 Design Specifications
Table 4 lists the specifications applicable to the D845HV and D845WN boards.
Table 4. Specifications
Reference Name
AC ’97
ACPI
AGP
AMI BIOS
ATA/ ATAPI-5
ATX
ATX12V
CNR
Specification Title
Audio Codec ’97
Advanced Configuration and Power Interface Specification
Accelerated Graphics Port Interface Specification
American Megatrends BIOS Specification
Information Technology-AT Attachment with Packet Interface - 5 (
ATA/ATAPI-5)
ATX Specification
ATX / ATX12V Power Supply Design Guide
Communication and Network Riser (CNR) Specification
Version, Revision Date, and Ownership
Revision 2.2, September 2000, Intel Corporation.
Version 2.0, July 27, 2000, Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix Technologies Limited, and Toshiba Corporation.
Revision 2.0, May 4, 1998, Intel Corporation.
AMIBIOS 99, 1999, American Megatrends, Inc.
Revision 3, February 29, 2000, Contact: T13 Chair, Seagate Technology.
Version 2.03, December 1998, Intel Corporation.
Version 1.1, August 2000, Intel Corporation.
Revision 1.1, October 18, 2000, Intel Corporation.
The information is
available from… ftp://download.intel.com/ial/
scalableplatforms/ac97r22.pdf
http://www.teleport.com/~acpi/
http://www.agpforum.org/
http://www.amij.com/amibios/ bios.platforms.desktop.html
http://www.t13.org
http://www.formfactors.org/ developer/specs/atx/ atxspecs.htm
http://www.formfactors.org/dev eloper/specs/atx/ atxspecs.htm
http://developer.intel.com/ technology/cnr/index.htm
continued
18
Table 4. Specifications (continued)
Reference Name
EPP
El Torito
IrDA
LPC
MicroATX
PCI
Plug and Play
PXE
Specification Title
IEEE Std 1284.1-1997
(Enhanced Parallel Port)
Bootable CD-ROM Format Specification
IrDA Serial Physical Layer Specification
Low Pin Count Interface Specification
microATX Motherboard Interface Specification
PCI Local Bus Specification
PCI Bus Power Management Interface Specification
Plug and Play BIOS Specification
Preboot Execution Environment
Version, Revision Date and Ownership
Version 1.7, 1997, Institute of Electrical and Electronic Engineers.
Version 1.0, January 25, 1995, Phoenix Technologies Limited and International Business Machines Corporation.
Version 1.3, October 15, 1998, Infrared Data Association.
Version 1.0, September 29, 1997, Intel Corporation.
Version 1.0, December 1997, Intel Corporation.
Version 2.2, December 18, 1998, PCI Special Interest Group.
Version 1.1, December 18, 1998, PCI Special Interest Group.
Version 1.0a, May 5, 1994, Compaq Computer Corporation, Phoenix Technologies Limited, and Intel Corporation.
Version 2.1, September 1999, Intel Corporation.
Product Description
The information is
available from… http://standards.ieee.org/
reading/ieee/std_public/ description/busarch/
1284.1-1997_desc.html http://www.phoenix.com/
PlatSS/products/specs.html
http://www.irda.org/ standards/ specifications.asp
http://www.intel.com/ design/chipsets/industry/ lpc.htm
http://www.formfactors.org/ developer/specs/microatx/ microatxspecs.htm
http://www.pcisig.com/
http://www.pcisig.com/
http://www.microsoft.com/ hwdev/respec/ pnpspecs.htm
ftp://download.intel.com/ial/ wfm/pxespec.pdf
continued
19
Intel Desktop Board D845HV/D845WN Technical Product Specification
Table 4. Specifications (continued)
Reference Name
SDRAM
SFX
SMBIOS
UHCI
USB
WfM
Specification Title
PC SDRAM Unbuffered DIMM Specification
PC SDRAM Specification
PC Serial Presence Detect (SPD) Specification
SFX/SFX12V Power Supply Design Guide
System Management BIOS
Universal Host Controller Interface Design Guide
Universal Serial Bus Specification
Wired for Management Baseline
Version, Revision Date and Ownership
Revision 1.0, February 1998, Intel Corporation.
Revision 1.7, November 1999, Intel Corporation.
Revision 1.2B, November 1999, Intel Corporation.
Revision 2.0, May 2001, Intel Corporation.
Version 2.3.1, March 16, 1999, American Megatrends Incorporated, Award Software International Incorporated, Compaq Computer Corporation, Dell Computer Corporation, Hewlett-Packard Company, Intel Corporation, International Business Machines Corporation, Phoenix Technologies Limited, and SystemSoft Corporation.
Revision 1.1, March 1996, Intel Corporation.
Version 1.1, September 23, 1998, Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, and NEC Corporation.
Version 2.0, December 18, 1998, Intel Corporation.
The information is
available from… http://www.intel.com/
technology/memory
http://www.intel.com/ technology/memory
http://www.intel.com/ technology/memory
http://www.formfactors.org /developer/specs/sfx/ sfx12v.pdf
http://www.dmtf.org/ download/standards/ DSP0119.pdf
http://www.usb.org/ developers
http://www.usb.org/ developers
http://developer.intel.com/ ial/WfM/wfmspecs.htm
20
Product Description
1.6 Processor
CAUTION
Use only the processors listed below. Use of unsupported processors can damage the board, the
®
processor, and the power supply. See the Intel Update for the most up-to-date list of supported processors for these boards.
The D845HV and D845WN boards support a single Pentium 4 processor (in an mPGA478 socket) with a system bus of 400 MHz. The D845HV and D845WN boards support the processors listed in Table 5. All supported onboard memory can be cached, up to the cachability limit of the
processor. See the processor’s data sheet for cachability limits.
Table 5. Supported Processors
Type Designation System Bus L2 Cache Size
Pentium 4 processor 1.4, 1.5, 1.6, 1.7, 1.8,
1.9, and 2.0 GHz
Desktop Board D845HV/D845WN Specification
400 MHz 256 KB
NOTE
Use only ATX12V- or SFX12V-compliant power supplies with the D845HV and D845WN boards. ATX12V and SFX12V power supplies have an additional power lead that provides required supplemental power for the Intel Pentium
4
processor. Always connect the 20-pin and 4-pin leads of ATX12V and SFX12V power supplies to the corresponding connectors on the D845HV and D845WN boards, otherwise the board will not boot.
Do not use a standard ATX power supply. The board will not boot with a standard ATX power supply.
For information about Refer to
Processor support Section 1.3, page 17 Processor usage Section 1.3, page 17 Power supply connectors Section 2.8.2.3, page 58
21
Intel Desktop Board D845HV/D845WN Technical Product Specification
1.7 System Memory
CAUTION
Before installing or removing memory, make sure that AC power is disconnected by unplugging the power cord from the computer. Failure to do so could damage the memory and the board.
NOTE
Remove the AGP video card before installing or upgrading memory to avoid interference with the memory retention mechanism.
NOTE
The D845HV/D845WN boards have been designed to support DIMMs based on 512 Mbit technology for a maximum onboard capacity of up to 3 GB, but this technology has not been validated on this board. Please refer to the following Intel web sites for the latest lists of tested memory. For the D845HV board:
http://developer.intel.com/design/motherbd/hv/hv_mem.htm
For the D845WN board:
http://developer.intel.com/design/motherbd/wn/wn_mem.htm
NOTE
To be fully compliant with all applicable Intel® SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.
The D845HV and D845WN boards both have three DIMM sockets and support the following memory features:
3.3 V (only) 168-pin SDRAM DIMMs with gold-plated contacts
Unbuffered single-sided or double-sided DIMMs
Maximum total system memory: 3 GB; minimum total system memory: 32 MB
133 MHz SDRAM DIMMs only
Serial Presence Detect (SPD)
Suspend to RAM
Non-ECC and ECC DIMMs
NOTE
For ECC functionality, all installed DIMMs must be ECC. If both ECC and non-ECC DIMMs are used, ECC will not function.
22
Product Description
For information about Refer to
Obtaining the
PC Serial Presence Detect (SPD) Specification
Section 1.5, page 18
Table 6 lists the supported DIMM configurations.
Table 6. Supported Memory Configurations
DIMM Capacity
32 MB SS 64 Mbit 4 M x 16/empty 4 64 MB DS 64 Mbit 4 M x 16/4 M x 16 8 64 MB SS 64 Mbit 8 M x 8/empty 8 64 MB SS 128 Mbit 8 M x 16/empty 4 96 MB DS 64 Mbit 8 M x 8/4 M x 16 12 96 MB DS 128/64 Mbit 8 M x 16/4 M x 16 8 128 MB DS 64 Mbit 8 M x 8/8 M x 8 16 128 MB DS 128 Mbit 8 M x 16/8 M x 16 8 128 MB SS 128 Mbit 16 M x 8/empty 8 128 MB SS 256 Mbit 16 M x 16/empty 4 192 MB DS 128 Mbit 16 M x 8/8 M x 16 12 192 MB DS 128/64 Mbit 16 M x 8/8 M x 8 16 256 MB DS 128 Mbit 16 M x 8/16 M x 8 16 256 MB DS 256 Mbit 16 M x 16/16 M x 16 8 256 MB SS 256 Mbit 32 M x 8/empty 8 512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
Notes:
1. If the number of SDRAM devices is greater than nine, the DIMM will be double sided.
2. Front side population/back s i de popul ation indicated for SDRAM dens i ty and SDRAM organization.
3. In the second column, “DS” refers to double-sided memory m odul es (containing two rows of SDRAM ) and “S S” refers
to single-sided memory modul es (containing one row of SDRAM).
Number of Sides
SDRAM Density
SDRAM Organization Front-side/Back-side
Number of SDRAM devices
(Notes 1 and 2)
(Notes 1 and 2)
(Note 1)
(Notes 1 and 2)
(Notes 1 and 2) (Notes 1 and 2) (Notes 1 and 2)
(Notes 1 and 2)
(Notes 1 and 2)
NOTE
For D845HV boards with two DIMM sockets, the maximum total system memory is 2 GB.
23
Intel Desktop Board D845HV/D845WN Technical Product Specification
1.8 Intel® 845 Chipset
The Intel 845 chipset consists of the following devices:
Intel 82845 Memory Controller Hub (MCH) with Accelerated Hub Architecture (AHA) bus
Intel 82801BA I/O Controller Hub (ICH2) with AHA bus
Intel 82802AB Firmware Hub (FWH)
The MCH is a centralized controller for the system bus, the memory bus, the AGP bus, and the
Accelerated Hub Architecture interface. The ICH2 is a centralized controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS. The component combination provides the chipset interfaces as shown in Figure 4.
UDMA 33
ATA-66/100
System Bus
Network
USB
845 Chipset
82845
Memory Controller
Hub (MCH)
AGP
Interface
SDRAM
Bus
AHA
Bus
82801BA
I/O Controller Hub
(ICH2)
82802AB 4 Mbit
Firmware Hub
(FWH)
LPC Bus
AC LinkPCI BusSMBus
OM12275
Figure 4. Intel 845 Chipset Block Diagram
For information about Refer to
The Intel 845 chipset http://developer.intel.com Resources used by the chipset Chapter 2
24
Product Description
1.8.1 AGP
NOTE
The AGP connector is keyed for 1.5 V AGP cards only. Do not attempt to install a legacy 3.3 V AGP card. The AGP connector is not mechanically compatible with legacy 3.3 V AGP cards.
The AGP connector supports AGP add-in cards with 1.5 V Switching Voltage Level (SVL). Legacy 3.3 V AGP cards are not supported.
For information about Refer to
The location of the AGP connector Figure 1, page 14 The signal names of the AGP connector Table 37, page 65
AGP is a high-performance interface for graphics-intensive applications, such as 3D applications. While based on the PCI Local Bus Specification, Rev. 2.1, AGP is independent of the PCI bus and is intended for exclusive use with graphical display devices. AGP overcomes certain limitations of the PCI bus related to handling large amounts of graphics data with the following features:
Pipelined memory read and write operations that hide memory access latency
Demultiplexing of address and data on the bus for nearly 100 percent efficiency
For information about Refer to
Obtaining the
Accelerated Graphics Port Interface Specification
Section 1.5, page 18
1.8.2 USB
There are two USB configurations, depending on which I/O controller is used on the board, as follows:
The USB configuration for boards with the SMSC LPC47M142 I/O controller is described in
Section 1.8.2.1
The USB configuration for boards with the SMSC LPC47M132 I/O controller is described in
Section 1.8.2.2
The D845HV and D845WN boards fully support UHCI and use UHCI-compatible software drivers.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.
25
Intel Desktop Board D845HV/D845WN Technical Product Specification
1.8.2.1 USB Configuration for Boards with the SMSC LPC47M142 I/O Controller
The D845HV/D845WN boards support up to seven USB ports, as shown in Figure 5. The ICH2 provides three external ports: two ports are implemented with stacked back panel connectors and the other port is accessible through a CNR add-in card. The SMSC LPC47M142 I/O controller provides four external ports: two ports implemented with stacked back panel connectors and two ports routed to the front panel USB connector.
For more than seven USB devices, an external hub can be connected to any of the ports.
Back panel USB c onnectors adjacent to the audio c onnectors
USB port accessible through a USB connector on an optional CNR add-in card
Back panel USB c onnectors adjacent to the PS/2 connectors
Front panel USB connector
OM12388
82801BA
I/O Controller Hub
(ICH2)
USB
SMSC LPC47M142
LPC Bus
I/O Controller
USB ports (2)
USB
CNR connector
USB ports (2)
USB
USB ports (2)
Figure 5. USB Port Configuration for Boards with the SMSC LPC47M142 I/O Controller
For information about Refer to
The location of the USB connectors on the back panel Figure 10, page 52 The signal names of the back panel USB connectors Table 19, page 53 The location of the front panel USB connector Figure 15, page 68 The signal names of the front panel USB connector Table 43, page 69 The USB specification and UHCI Section 1.5, page 18
1.8.2.2 USB Configuration for Boards with the SMSC LPC47M132 I/O Controller
D845HV boards equipped with the optional SMSC LPC47M132 I/O controller support up to four USB ports, as shown in Figure 6. The ICH2 provides four external ports: two ports are implemented with stacked back panel connectors and two are accessible through the front panel USB connector.
For more than four USB devices, an external hub can be connected to any of the ports.
26
Product Description
82801BA
I/O Controller Hub
(ICH2)
Figure 6. USB Port Configuration for Boards with the SMSC LPC47M132 I/O Controller
For information about Refer to
The location of the USB connectors on the back panel Figure 10, page 52 The signal names of the back panel USB connectors Table 19, page 53 The location of the front panel USB connector Figure 15, page 68 The signal names of the front panel USB connector Table 43, page 69 The USB specification and UHCI Section 1.5, page 18
USB
USB ports (2)
USB ports (2) Front panel USB connector
Back panel USB connectors adjacent to the audio connectors
1.8.3 IDE Support
1.8.3.1 IDE Interfaces
The ICH2’s IDE controller has two independent bus-mastering IDE interfaces that can be independently enabled. The IDE interfaces support the following modes:
Programmed I/O (PIO): processor controls data transfer.
8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH2’s ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.
OM12389
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling.
The IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes listed in Section 4.4.4.1 on page 105.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.
27
Intel Desktop Board D845HV/D845WN Technical Product Specification
The D845HV and D845WN boards support Laser Servo (LS-120) diskette technology through the IDE interfaces. An LS-120 drive can be configured as a boot device by setting the BIOS Setup
program’s Boot menu to one of the following:
ARMD-FDD (ATAPI removable media device – floppy disk drive)
ARMD-HDD (ATAPI removable media device – hard disk drive)
For information about Refer to
The location of the IDE connectors Figure 13, page 61 The signal names of the IDE connectors Table 39, page 67
BIOS Setup program’s Boot menu Table 75, page 113
1.8.3.2 SCSI Hard Drive Activity LED Connector (Optional)
The SCSI hard drive activity LED connector is a 1 x 2-pin connector that allows an add-in SCSI controller to use the same LED as the onboard IDE controller. For proper operation, this connector should be wired to the LED output of the add-in SCSI controller. The LED indicates when data is being read from, or written to, both the add-in SCSI controller and the IDE controller.
For information about Refer to
The location of the SCSI hard drive activity LED connector Figure 13, page 61, or
Figure 14, page 62
The signal names of the SCSI hard drive activity LED connector Table 40, page 67
1.8.4 Real-Time Clock, CMOS SRAM, and Battery
The real-time clock provides a time-of-day clock and a multicentury calendar with alarm features. The real-time clock supports 256 bytes of battery-backed CMOS SRAM in two banks that are reserved for BIOS use.
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
The time, date, and CMOS values can be specified in the BIOS Setup program. The CMOS values can be returned to their defaults by using the BIOS Setup program.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on.
For information about Refer to
Proper date access in systems with D845HV and D845WN boards Section 1.3, page 17
28
®
1.8.5 Intel
The FWH provides the following:
System BIOS program
Logic that enables protection for storing and updating of platform information
82802AB 4 Mbit Firmware Hub (FWH)
1.9 I/O Controller
The SMSC LPC47M142 I/O controller provides the following features:
Two serial ports
One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
Serial IRQ interface compatible with serialized IRQ support for PCI systems
PS/2-style mouse and keyboard interfaces
Interface for one 1.2 MB or 1.44 MB diskette drive
Intelligent power management, including a programmable wake-up event interface
PCI power management support
Two fan tachometer inputs
Integrated USB hub
IrDA compliant infrared port
Product Description
The BIOS Setup program provides configuration options for the I/O controller.
NOTE
For the D845HV board only, there is a manufacturing option for an SMSC LPC47M132 I/O controller. This optional I/O controller provides identical functionality to the standard I/O controller, minus the integrated USB hub.
For information about Refer to
SMSC LPC47M142 I/O controller http://www.smsc.com
1.9.1 Serial Ports
The D845HV and D845WN boards have two serial port connectors. Serial port A is located on the back panel. Serial port B is accessible using a connector located near the main power connector.
The serial ports’ NS16C550-compatible UART supports data transfers at speeds up to
115.2 kbits/sec with BIOS support. The serial ports can be assigned as COM1 (3F8h), COM2 (2F8h), COM3 (3E8h), or COM4 (2E8h).
NOTE
The operation of serial port B and the infrared port are mutually exclusive. When serial port B is enabled in the BIOS Setup program, the IR option is disabled.
29
Intel Desktop Board D845HV/D845WN Technical Product Specification
NOTE
For the D845HV board only, there is a manufacturing option that omits the connector for Serial port B.
For information about Refer to
The location of the serial port A connector Figure 10, page 52 The signal names of the serial port A connector Table 21, page 54 The location of the serial port B connector Figure 15, page 68 The signal names of the serial port B connector Table 42, page 69
1.9.2 Infrared Support
On the front panel connector, there are four pins that support devices compliant with the IrDA Serial Infrared Physical Layer Specification, version 1.3. In the BIOS Setup program, infrared
support is disabled by default. The IR connection can be used to transfer files to or from portable devices like laptops, PDAs, and printers. The Infrared Data Association (IrDA) specification supports data transfers of up to 115.2 kbits/sec at a distance of 1 meter.
NOTE
The infrared port operates in half duplex mode only.
NOTE
The operation of the infrared port and serial port B are mutually exclusive. When the IR option is enabled in the BIOS Setup program, serial port B is disabled.
For information about Refer to
The location of the front panel connector Figure 15, page 68 The signal names of the infrared port on the front panel connector Table 45, page 70 The IrDA specification Section 1.5, page 18
1.9.3 Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. In the BIOS Setup program, the parallel port can be set to the following modes:
Output only (PC AT
Bi-directional (PS/2 compatible)
EPP
ECP
For information about Refer to
The location of the parallel port connector Figure 10, page 52 The signal names of the parallel port connector Table 20, page 53
Setting the parallel port’s mode Table 66, page 102
-compatible mode)
30
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