Intel BLKD201GLY2 - SiS662 DDR2 533 VGA LAN PCI 2SATA Audio Mini ITX 10Pack Motherboard, BLKD201GLY2A, BOXD201GLY2, BOXD201GLY2A, D201GLY2 Technical Product Specification
Intel® Desktop Board
D201GLY2
Technical Product Specification
The Intel® Desktop Board D201GLY2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D201GLY2 Specification Update.
November 2007
Order Number: E18532-002US
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board D201GLY2 Technical Product
Specification
-002 Second release of the Intel® Desktop Board D201GLY2 Technical Product
Specification. Added active processor heat sink option.
This product specification applies to only standard Intel Desktop Board D201GLY2 with
BIOS identifier LY66210M.86A.
Changes to this specification will be published in the Intel Desktop Board D201GLY2
Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT
INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
September 2007
November 2007
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
®
desktop boards may contain design defects or errors known as errata, which may cause the product
Intel
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel
literature, may be obtained from:
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Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel, the Intel logo and Celeron are registered trademarks of Intel Corporation in the United States and
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* Other names and brands may be claimed as the property of others.
Copyright © 2007, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board D201GLY2. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
D201GLY2 and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Board D201GLY2
2 A map of the resources of the Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages and POST codes
®
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
#
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
iii
Intel Desktop Board D201GLY2 Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the
relative coordinates of its location on the board, and X is the instance of the particular part
at that general location. For example, J5J1 is a connector, located at 5J. It is the first
connector in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Manufacturing Options .......................................................... 11
1.1.3 Board Layout ....................................................................... 11
1.1.4 Block Diagram ..................................................................... 14
1.2 Online Support................................................................................ 15
1.3 Processor ....................................................................................... 15
1.4 System Memory .............................................................................. 16
1.5 Silicon Integrated Systems* Chipset .................................................. 17
1.5.1 Graphics Subsystem ............................................................. 17
1.5.2 USB ................................................................................... 17
1.5.3 IDE Support ........................................................................ 18
1.5.4 Real-Time Clock, CMOS SRAM, and Battery .............................. 19
1.6 S-Video Output (Optional) ................................................................ 23
1.7 Legacy I/O Controller ....................................................................... 23
1.7.1 Serial Port........................................................................... 24
1.7.2 Parallel Port......................................................................... 24
1.7.3 Keyboard and Mouse Interface ............................................... 24
1.8 Audio Subsystem............................................................................. 24
1.8.1 Audio Subsystem Software .................................................... 25
1.8.2 Audio Connectors ................................................................. 25
1.9 LAN Subsystem ............................................................................... 26
1.9.1 LAN Subsystem Software....................................................... 26
1.10 Hardware Management Subsystem .................................................... 27
1.10.1 Fan Monitoring..................................................................... 27
1.11 Power Management ......................................................................... 27
1.11.1 ACPI................................................................................... 28
1.11.2 Hardware Support ................................................................ 30
2 Technical Reference
2.1 Memory Map................................................................................... 35
2.2 Connectors and Headers................................................................... 36
2.2.1 Back Panel Connectors .......................................................... 37
2.2.2 Component-side Connectors and Headers ................................ 38
2.2.3 Front Panel USB Headers....................................................... 43
2.3 Jumper Blocks................................................................................. 44
2.3.1 Front Panel Audio Header/Jumper Block................................... 45
2.3.2 BIOS Setup Configuration Jumper Block .................................. 46
2.4 Mechanical Considerations ................................................................ 47
2.4.1 Form Factor......................................................................... 47
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Intel Desktop Board D201GLY2 Technical Product Specification
2.5 Electrical Considerations ................................................................... 48
2.5.1 DC Loading.......................................................................... 48
2.5.2 Add-in Board Considerations .................................................. 48
2.5.3 Fan Header Current Capability................................................ 49
2.5.4 Power Supply Considerations ................................................. 49
2.6 Thermal Considerations .................................................................... 50
2.7 Reliability ....................................................................................... 52
2.8 Environmental ................................................................................ 52
2.9 Regulatory Compliance..................................................................... 53
2.9.1 Safety Standards.................................................................. 53
2.9.2 European Union Declaration of Conformity Statement................ 54
2.9.3 Product Ecology Statements................................................... 56
2.9.4 EMC Regulations .................................................................. 60
2.9.5 Product Certification Markings (Board Level)............................. 62
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 63
3.2 BIOS Flash Memory Organization ....................................................... 64
3.3 Resource Configuration .................................................................... 64
3.3.1 PCI Autoconfiguration ........................................................... 64
3.3.2 PCI IDE Support................................................................... 65
3.4 System Management BIOS (SMBIOS)................................................. 65
3.5 Legacy USB Support ........................................................................ 66
3.6 BIOS Updates ................................................................................. 66
3.6.1 Language Support ................................................................ 67
3.6.2 Custom Splash Screen .......................................................... 67
3.7 Boot Options................................................................................... 67
3.7.1 CD-ROM Boot ...................................................................... 67
3.7.2 Network Boot....................................................................... 67
3.7.3 Booting Without Attached Devices........................................... 67
3.7.4 Changing the Default Boot Device During POST ........................ 68
3.8 Adjusting Boot Speed....................................................................... 68
3.8.1 Peripheral Selection and Configuration..................................... 68
3.8.2 BIOS Boot Optimizations ....................................................... 69
3.9 BIOS Security Features .................................................................... 70
4 Error Messages
4.1 BIOS Front-panel Power LED Codes.................................................... 71
4.2 BIOS Error Messages ....................................................................... 71
4.3 Port 80h POST Codes ....................................................................... 72
vi
Contents
Figures
1. Board Components .......................................................................... 11
2. Board Components, Including Optional Active Heatsink for
the Processor.................................................................................. 12
3. Block Diagram ................................................................................ 14
4. Back Panel Audio Connectors ............................................................ 25
5. LAN Connector LED Locations............................................................ 26
6. Location of the Standby Power Indicator LED....................................... 33
7. Back Panel Connectors ..................................................................... 37
8. Component-side Connectors and Headers ........................................... 38
9. Connection Diagram for Front Panel Header ........................................ 41
10. Connection Diagram for Front Panel USB Headers ................................ 43
11. Location of the Jumper Blocks ........................................................... 44
12. Board Dimensions ........................................................................... 47
13. Localized High Temperature Zones..................................................... 51
Tables
1. Feature Summary............................................................................ 10
2. Manufacturing Options ..................................................................... 11
3. Board Components Shown in Figure 1 and Figure 2 .............................. 13
4. Supported Memory Configurations ..................................................... 16
5. LAN Connector LED States ................................................................ 26
6. Effects of Pressing the Power Switch .................................................. 28
7. Power States and Targeted System Power........................................... 29
8. Wake-up Devices and Events ............................................................ 30
9. System Memory Map ....................................................................... 35
10. Back Panel Connectors Shown in Figure 7 ........................................... 37
11. Component-side Connectors and Headers Shown in Figure 8 ................. 39
12. Front Panel Audio Header ................................................................. 39
13. Chassis Fan Connector ..................................................................... 39
14. Main Power Connector...................................................................... 40
15. ATX12V Power Connector ................................................................. 40
16. Front Panel Header .......................................................................... 41
17. States for a One-Color Power LED ...................................................... 42
18. States for a Two-Color Power LED ...................................................... 42
19. Front Panel Audio Header/Jumper Block.............................................. 45
20. BIOS Setup Configuration Jumper Settings.......................................... 46
21. DC Loading Characteristics ............................................................... 48
22. Fan Header Current Capability........................................................... 49
23. MTBF Values ................................................................................... 52
24. Environmental Specifications............................................................. 52
25. Safety Standards............................................................................. 53
26. Lead-Free Board Markings ................................................................ 59
27. EMC Regulations ............................................................................. 60
28. Product Certification Markings ........................................................... 62
29. BIOS Setup Program Menu Bar .......................................................... 64
vii
Intel Desktop Board D201GLY2 Technical Product Specification
30. BIOS Setup Program Function Keys.................................................... 64
31. Boot Device Menu Options ................................................................ 68
32. Supervisor and User Password Functions............................................. 70
33. Front-panel Power LED Blink Codes .................................................... 71
34. BIOS Error Messages ....................................................................... 71
35. Port 80h POST Code Ranges.............................................................. 72
36. Port 80h POST Codes ....................................................................... 73
37. Typical Port 80h POST Sequence........................................................ 76
viii
1 Product Description
What This Chapter Contains
1.1 Overview........................................................................................ 10
1.2 Online Support................................................................................ 15
1.3 Processor ....................................................................................... 15
1.4 System Memory .............................................................................. 16
1.5 Silicon Integrated Systems* Chipset .................................................. 17
1.6 S-Video Output (Optional) ................................................................ 23
1.7 Legacy I/O Controller ....................................................................... 23
1.8 Audio Subsystem............................................................................. 24
1.9 LAN Subsystem ............................................................................... 26
1.10 Hardware Management Subsystem .................................................... 27
1.11 Power Management ......................................................................... 27
9
Intel Desktop Board D201GLY2 Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor Mini-ITX, compatible with microATX (6.75 inches by 6.75 inches
[171.45 millimeters by 171.45 millimeters])
Processor Support for the following:
• Soldered-down Intel
optional fan-based active heatsink
Memory
Chipset
Video Integrated SiS Mirage* 1 graphic engine
Audio ADI* AD1888 audio codec
Legacy I/O Control Winbond* W83627DHG-B based Legacy I/O controller for hardware management,
Peripheral
Interfaces
LAN Support 10/100 Mbits/sec LAN subsystem using Broadcom* LAN adapter device
BIOS Intel® BIOS resident in the 4-Mbit SPI Flash device
Expansion
Capabilities
Hardware Monitor
Subsystem
(controlled by
Winbond
W83627DHG-B
I/O controller)
• One 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) socket
• Support for DDR2 667 MHz, DDR2 533 MHz and DDR2 400 MHz DIMMs
(DDR 667 MHz validated to run at 533 MHz only)
• Support for up to 1 GB of system memory
• SiS* SiS662 Northbridge
• SiS SiS964 Southbridge
serial, parallel, and PS/2* ports
• Six USB 2.0 ports
• One serial port
• One parallel port
• Two Serial ATA interfaces
• One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support
• PS/2 keyboard and mouse ports
• One S-Video output port (optional)
• One PCI* Conventional bus connector
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Two fan connectors
• One fan sense input used to monitor fan activity
• Fan speed control
®
Celeron® processor with a 533 MHz system bus and
10
Product Description
1.1.2 Manufacturing Options
Table 2 describes the manufacturing options. Not every manufacturing option is
available in all marketing channels. Please contact your Intel representative to
determine which manufacturing options are available to you.
Table 2. Manufacturing Options
S-Video Output
Active Heatsink
for Processor
For information about Refer to
Available configurations for the Desktop Board D201GLY2 Section 1.2, page 15
Support for S-Video output. One S-Video output port located on the back panel.
Available fan-based active heatsink for the processor.
1.1.3 Board Layout
Figure 1 shows the location of the major components.
Figure 1. Board Components
11
Intel Desktop Board D201GLY2 Technical Product Specification
Figure 2 shows the location of the major components, i
ncluding the optional active
heatsink for the processor. Note that all remaining figures in this document show the
standard passive heatsink.
Figure 2. Board Components, Including Optional Active Heatsink
for the Processor
Table 3 lists the components identified in Figure 1 and Figure 2.
12
Table 3. Board Components Shown in Figure 1 and Figure 2
Product Description
Item/callout
from Figure 1
and Figure 2
A PCI Conventional bus add-in card connector
B Front panel USB headers
C Front panel audio header
D Back panel connectors
E Chassis fan header
F +12V power connector (ATX12V)
G Main power connector
H Intel Celeron processor
I DIMM Channel A socket
J SiS662 Northbridge
K Parallel ATA IDE connector
L SATA connectors [2]
M Front panel I/O header
N Battery
O SiS964 Southbridge
P BIOS Setup configuration jumper block
Descri
ption
13
Intel Desktop Board D201GLY2 Technical Product Specification
1.1.4 Block Diagram
Figure 3 is a block diagram of the major functional areas of the board.
Figure 3. Block Diagram
14
Product Description
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel® Desktop Board D201GLY2 http://www.intel.com/products/motherboard/D201GLY2/index.htm
Desktop Board Support http://support.intel.com/support/motherboards/desktop
Available configurations for the
Desktop Board D201GLY2
BIOS and driver updates http://downloadcenter.intel.com
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
http://www.intel.com/products/motherboard/D201GLY2/index.htm
025414.htm
1.3 Processor
The board is designed to support the Intel Celeron processor 200-series soldered down
with a 533 MHz system bus.
INTEGRATOR’S NOTE
#
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.2.2.1, page 40
15
Intel Desktop Board D201GLY2 Technical Product Specification
1.4 System Memory
The board has one 240-pin DIMM socket and supports the following memory features:
• 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 1 GB maximum total system memory
• Minimum total system memory: 128 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 533 or DDR2 400 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity Configuration
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
512 MB SS 1 Gbit 64 M x 16/empty 4
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
1024 MB SS 1 Gbit 128 M x 8/empty 8
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM)
and “SS” refers to single-sided memory modules (containing one row of SDRAM).
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
16
Product Description
1.5 Silicon Integrated Systems* Chipset
The Silicon Integrated Systems chipset consists of the following devices:
• SiS662 Northbridge
• SiS964 Southbridge
The SiS662 Northbridge is a centralized controller for the system bus and the memory
bus. The SiS662 Northbridge also provides integrated graphics capabilities supporting
3D, 2D, and display capabilities. The SiS964 Southbridge is a centralized controller for
the board’s I/O paths.
For information about Refer to
The Silicon Integrated Systems SiS662 Northbridge http://www.sis.com/
The Silicon Integrated Systems SiS964 Southbridge http://www.sis.com/
Resources used by the chipset Chapter 2
1.5.1 Graphics Subsystem
The board uses the integrated Mirage 1 graphic engine in the SiS662 Northbridge.
1.5.2 USB
The board supports up to six USB 2.0 ports, supports UHCI and EHCI, and uses UHCIand EHCI-compatible drivers.
The SiS964 Southbridge provides the USB controller for all ports. The port
arrangement is as follows:
• Two ports are implemented with dual stacked back panel connectors adjacent to
the audio connectors
• Four ports are routed to two separate front panel USB headers
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 7, page 37
The location of the front panel USB connectors Figure 8, page 38
17
Intel Desktop Board D201GLY2 Technical Product Specification
1.5.3 IDE Support
The board provides three IDE interface connectors:
• One parallel ATA IDE connector that supports two devices
• Two serial ATA IDE connectors that support one device per connector
1.5.3.1 Parallel ATA IDE Interface
The D201GLY2 board has one bus-mastering Parallel ATA IDE interface. The Parallel
ATA IDE interface supports the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to
16 MB/sec.
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is
device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The SiS964’s
ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer
rates up to 88 MB/sec.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce
reflections, noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives)
and ATA devices using the transfer modes.
For information about Refer to
The location of the Parallel ATA IDE connector Figure 8, page 38
1.5.3.2 Serial ATA Interfaces
The board’s Serial ATA controller offers two independent Serial ATA ports with a
theoretical maximum transfer rate of 1.5 Gbits/sec per port. One device can be
installed on each port for a maximum of two Serial ATA devices. A point-to-point
interface is used for host to device connections, unlike Parallel ATA IDE which supports
a master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP
operating system.
18
Product Description
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the Serial ATA IDE connectors Figure 8, page 38
1.5.4 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.
19
Intel Desktop Board D201GLY2 Technical Product Specification
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
20
Product Description
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYAZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
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Intel Desktop Board D201GLY2 Technical Product Specification
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей
должна проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
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Product Description
1.6 S-Video Output (Optional)
The D201GLY2 board supports S-Video output via 7-pin S-Video connector using
SiS307DV supporting both 4-pin S-Video and Composite output signals.
For information about Refer to
The Silicon Integrated Systems SiS307DV http://www.sis.com/
1.7 Legacy I/O Controller
The Winbond W83672DHG-B Legacy I/O controller provides the following features:
• One serial port
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional
bus systems
• PS/2-style mouse and keyboard interfaces
• Intelligent power management, including a programmable wake-up event interface
• PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
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