Page 1
Intel® Desktop Board
D102GGC2
Technical Product Specification
The Intel® Desktop Board D102GGC2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D102GGC2 Specification Update.
April 2006
Order Number: D44278-001US
Page 2
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board D102GGC2 Technical Product
Specification.
This product specification applies to only standard Intel Desktop Board D102GGC2 with BIOS
identifier GC11020M.86A.
Changes to this specification will be published in the Intel Desktop Board D102GGC2
Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED
BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH
PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN
MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not
provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other
intellectual property rights.
April 2006
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.”
Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them.
®
Intel
desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other
countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2006, Intel Corporation. All rights reserved.
Page 3
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors,
®
power and environmental requirements, and the BIOS for the Intel
describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
D102GGC2 and its components to the vendors, system integrators, and other engineers and
technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Board D102GGC2
2 A map of the resources of the Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
Desktop Board D102GGC2. It
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
#
Integrator’s notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
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Intel Desktop Board D102GGC2 Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the board, and X is the instance of the particular part at that
general location. For example, J5J1 is a connector, located at 5J. It is the first connector in
the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
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Contents
1 Product Description
1.1 Overview......................................................................................................................10
1.1.1 Feature Summary..........................................................................................10
1.1.2 Manufacturing Options ..................................................................................11
1.1.3 Board Layout.................................................................................................12
1.1.4 Block Diagram...............................................................................................14
1.2 Online Support.............................................................................................................15
1.3 Processor.....................................................................................................................15
1.4 System Memory...........................................................................................................16
1.5 ATI Radeon* Xpress 200 Chipset................................................................................17
1.5.1 Graphics Subsystem .....................................................................................17
1.5.2 Firmware Hub (FWH) ....................................................................................17
1.5.3 USB...............................................................................................................17
1.5.4 IDE Support...................................................................................................18
1.5.5 Real-Time Clock, CMOS SRAM, and Battery................................................20
1.6 PCI Express* Connectors ............................................................................................24
1.7 Legacy I/O Controller...................................................................................................24
1.7.1 Serial Port......................................................................................................24
1.7.2 Parallel Port...................................................................................................25
1.7.3 Diskette Drive Controller................................................................................25
1.7.4 Keyboard and Mouse Interface .....................................................................25
1.8 High Definition Audio Subsystem.................................................................................26
1.8.1 Audio Subsystem Software ...........................................................................26
1.8.2 Audio Connectors..........................................................................................27
1.9 LAN Subsystem ...........................................................................................................28
1.9.1 LAN Subsystem Software..............................................................................28
1.10 Hardware Management Subsystem.............................................................................29
1.10.1 Fan Monitoring...............................................................................................29
1.10.2 Chassis Intrusion and Detection....................................................................29
1.11 Power Management.....................................................................................................29
1.11.1 ACPI..............................................................................................................30
1.11.2 Hardware Support .........................................................................................32
2 Technical Reference
2.1 Memory Map................................................................................................................37
2.2 DMA Channels.............................................................................................................38
2.3 Fixed I/O Map...............................................................................................................39
2.4 Interrupts......................................................................................................................40
2.5 PCI Configuration Space Map......................................................................................41
2.6 PCI Conventional Interrupt Routing Map .....................................................................41
2.7 Connectors...................................................................................................................42
2.7.1 Back Panel Connectors.................................................................................43
2.7.2 Component-side Connectors.........................................................................44
2.7.3 Front Panel USB Connectors........................................................................50
2.8 Jumper Block ...............................................................................................................51
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Intel Desktop Board D102GGC2 Technical Product Specification
2.9 Mechanical Considerations..........................................................................................52
2.9.1 Form Factor...................................................................................................52
2.9.2 I/O Shield.......................................................................................................53
2.10 Electrical Considerations..............................................................................................54
2.10.1 DC Loading....................................................................................................54
2.10.2 Add-in Board Considerations.........................................................................54
2.10.3 Fan Connector Current Capability.................................................................55
2.10.4 Power Supply Considerations .......................................................................55
2.11 Thermal Considerations...............................................................................................56
2.12 Reliability......................................................................................................................58
2.13 Environmental..............................................................................................................59
2.14 Regulatory Compliance................................................................................................60
2.14.1 Safety Regulations ........................................................................................60
2.14.2 European Union Declaration of Conformity Statement..................................60
2.14.3 Product Ecology Statements.........................................................................62
2.14.4 EMC Regulations...........................................................................................65
2.14.5 Product Certification Markings (Board Level)................................................66
3 Overview of BIOS Features
3.1 Introduction ..................................................................................................................67
3.2 BIOS Flash Memory Organization ...............................................................................68
3.3 Resource Configuration ...............................................................................................68
3.3.1 PCI Autoconfiguration....................................................................................68
3.3.2 PCI IDE Support............................................................................................68
3.4 System Management BIOS (SMBIOS) ........................................................................69
3.5 Legacy USB Support....................................................................................................69
3.6 BIOS Updates..............................................................................................................70
3.6.1 Language Support.........................................................................................70
3.6.2 Custom Splash Screen..................................................................................70
3.7 Boot Options ................................................................................................................71
3.7.1 CD-ROM Boot ...............................................................................................71
3.7.2 Network Boot.................................................................................................71
3.7.3 Booting Without Attached Devices................................................................71
3.7.4 Changing the Default Boot Device During POST..........................................71
3.8 Adjusting Boot Speed...................................................................................................72
3.8.1 Peripheral Selection and Configuration.........................................................72
3.8.2 BIOS Boot Optimizations...............................................................................72
3.9 BIOS Security Features ...............................................................................................73
4 Error Messages and Beep Codes
4.1 Speaker ....................................................................................................................... 75
4.2 BIOS Beep Codes........................................................................................................75
4.3 BIOS Error Messages..................................................................................................75
4.4 Port 80h POST Codes .................................................................................................76
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Figures
1. Board Components......................................................................................................12
2. Block Diagram..............................................................................................................14
3. Front/Back Panel Audio Connector Options for High Definition Audio Subsystem......27
4. LAN Connector LED Locations....................................................................................28
5. Location of the Standby Power Indicator LED .............................................................35
6. Back Panel Connectors................................................................................................43
7. Component-side Connectors .......................................................................................44
8. Connection Diagram for Front Panel Connector..........................................................49
9. Connection Diagram for Front Panel USB Connectors................................................50
10. Location of the Jumper Block.......................................................................................51
11. Board Dimensions........................................................................................................52
12. I/O Shield Dimensions..................................................................................................53
13. Processor Heatsink for Omni-directional Airflow..........................................................56
14. Localized High Temperature Zones.............................................................................57
Tables
1. Feature Summary ........................................................................................................10
2. Manufacturing Options.................................................................................................11
3. Board Components Shown in Figure 1........................................................................13
4. Supported Memory Configurations ..............................................................................16
5. LAN Connector LED States .........................................................................................28
6. Effects of Pressing the Power Switch ..........................................................................30
7. Power States and Targeted System Power .................................................................31
8. Wake-up Devices and Events......................................................................................31
9. System Memory Map ...................................................................................................37
10. DMA Channels.............................................................................................................38
11. I/O Map ........................................................................................................................39
12. Interrupts......................................................................................................................40
13. PCI Configuration Space Map......................................................................................41
14. PCI Interrupt Routing Map ...........................................................................................41
15. Back Panel Connectors Shown in Figure 6..................................................................43
16. Component-side Connectors Shown in Figure 7 .........................................................45
17. Front Panel Audio Connector.......................................................................................45
18. Chassis Intrusion Connector........................................................................................46
19. Serial ATA Connectors.................................................................................................46
20. Processor Fan Connector............................................................................................46
21. Chassis Fan Connectors..............................................................................................46
22. Main Power Connector.................................................................................................47
23. ATX12V Power Connector...........................................................................................47
24. Auxiliary Front Panel Power/Sleep LED Connector.....................................................48
25. Front Panel Connector.................................................................................................48
26. States for a One-Color Power LED..............................................................................49
27. States for a Two-Color Power LED..............................................................................49
28. BIOS Setup Configuration Jumper Settings.................................................................51
29. DC Loading Characteristics .........................................................................................54
30. Fan Connector Current Capability................................................................................55
31. Thermal Considerations for Components ....................................................................58
Contents
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Intel Desktop Board D102GGC2 Technical Product Specification
32. Environmental Specifications.......................................................................................59
33. Safety Regulations.......................................................................................................60
34. Lead-Free Board Markings ..........................................................................................64
35. EMC Regulations.........................................................................................................65
36. Product Certification Markings.....................................................................................66
37. BIOS Setup Program Menu Bar...................................................................................68
38. BIOS Setup Program Function Keys............................................................................68
39. Boot Device Menu Options ..........................................................................................71
40. Supervisor and User Password Functions...................................................................73
41. Beep Codes .................................................................................................................75
42. BIOS Error Messages..................................................................................................75
43. Port 80h POST Code Ranges......................................................................................76
44. Port 80h POST Codes .................................................................................................77
45. Typical Port 80h POST Sequence...............................................................................80
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1 Product Description
What This Chapter Contains
1.1 Overview......................................................................................................................10
1.2 Online Support.............................................................................................................15
1.3 Processor.....................................................................................................................15
1.4 System Memory...........................................................................................................16
1.5 ATI Radeon* Xpress 200 Chipset................................................................................17
1.6 PCI Express* Connectors ............................................................................................24
1.7 Legacy I/O Controller...................................................................................................24
1.8 High Definition Audio Subsystem.................................................................................26
1.9 LAN Subsystem ...........................................................................................................28
1.10 Hardware Management Subsystem.............................................................................29
1.11 Power Management.....................................................................................................29
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Intel Desktop Board D102GGC2 Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Video
Audio
Legacy I/O Control
USB
Peripheral
Interfaces
LAN Support
BIOS
Expansion
Capabilities
Instantly Available
PC Technology
Hardware Monitor
Subsystem
(controlled by SMSC
SCH5017 I/O
controller)
microATX (9.60 inches by 8.60 inches [243.84 millimeters by 218.44 millimeters])
Support for the following:
®
• Intel
• Intel
• Intel
• Two 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 533 MHz and DDR2 400 MHz DIMMs
• Support for up to 2 GB of system memory
• ATI Radeon* Xpress 200 Northbridge
• ATI IXP 450 Southbridge
• 4 Mbit Firmware Hub (FWH)
ATI Radeon X300 integrated graphics
High Definition Audio subsystem using the Realtek ALC883 audio codec
SMSC SCH5017 Legacy I/O controller for hardware management, diskette drive,
serial, parallel, and PS/2* ports
Support for USB 2.0 devices
• Eight USB ports
• One serial port
• One parallel port
• Four Serial ATA interfaces
• Two Parallel ATA IDE interfaces with UDMA 33, ATA-66/100 support
• One diskette drive interface
• PS/2 keyboard and mouse ports
10/100 Mbits/sec LAN subsystem using the Realtek 8101L LAN adapter device
Intel
• Two PCI Conventional* bus connectors
• One PCI Express* x1 bus add-in card connector
• One PCI Express x16 bus add-in card connector
• Support for PCI Local Bus Specification Revision 2.2
• Support for PCI Express Revision 1.0a
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan connectors
• Three fan sense inputs used to monitor fan activity
• Fan speed control
Pentium® D processor in an LGA775 socket with an 800 or 533 MHz
system bus
®
Pentium® 4 processor in an LGA775 socket with an 800 or 533 MHz
system bus
®
Celeron® D processor in an LGA775 socket with a 533 MHz system bus
®
BIOS resident in the 4 Mbit FWH
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Product Description
1.1.2 Manufacturing Options
Table 2 describes the manufacturing options. Not every manufacturing option is available in all
marketing channels. Please contact your Intel representative to determine which manufacturing
options are available to you.
Table 2. Manufacturing Options
SATA RAID
For information about Refer to
Available configurations for the Desktop Board D102GGC2 Section 1.1.4, page 14
Support for RAID 0 (data striping) and RAID 1 (data mirroring) on the SATA ports
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Intel Desktop Board D102GGC2 Technical Product Specification
1.1.3 Board Layout
Figure 1 shows the location of the major components.
DD
CC
BB
AA
W
A
DC
B
E
F
G
H
Z
Y
X
I
J
V
U
T RS
Figure 1. Board Components
Table 3 lists the components identified in Figure 1.
K
L
O N MPQ
OM18247
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Table 3. Board Components Shown in Figure 1
Item/callout
from Figure 1 Description
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
AA
BB
CC
DD
Front panel audio connector
Audio codec
PCI Express x16 add-in card connector
Ethernet device
Back panel connectors
+12V power connector (ATX12V)
Rear chassis fan connector
LGA775 processor socket
ATI Radeon Xpress 200 Northbridge
DIMM Channel A sockets [2]
Processor fan connector
Chassis intrusion connector
Legacy I/O controller
Main power connector
Diskette drive connector
Parallel ATE IDE connectors [2]
Battery
Front chassis fan connector
Serial ATA connectors [4]
Auxiliary front panel power LED connector
Front panel connector
4 Mbit Firmware Hub (FWH)
IXP 450 Southbridge
Speaker
Front panel USB connector
BIOS Setup configuration jumper block
PCI Conventional bus add-in card connectors [2]
Front panel USB connector
PCI Express x1 bus add-in card connector
Standby power indicator LED
Product Description
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Intel Desktop Board D102GGC2 Technical Product Specification
1.1.4 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
PCI Express x1 Slot 1 PCI Express x1 Interface
Parallel ATA
IDE Connectors (2)
Parallel ATA
IDE Interface
SMSC
SCH5017
Legacy
I/O
Controller
USB
Back Panel/
Front Panel
USB Ports
Serial Port
Parallel Port
PS/2 Mouse
PS/2 Keyboard
LGA775
Processor Socket
VGA
Port
Channel A
DIMMs (2)
PCI Slot 1
PCI Slot 2
System Bus
(800/533 MHz)
ATI Radeon Xpress 200
Northbridge
Display Interface
Memory Bus
PCI Bus
SMBus
SMBus
PCI Express x4
Diskette Drive
Connector
LPC Bus
ATI IXP 450
Interface
Southbridge
High Definition Audio Link
Realtek
ALC883
Audio
Codec
PCI Bus
Realtek
8101L
LAN Controller
Serial ATA
IDE Interface
Line In or Rear Left/Right Out
Line Out or Front Left/Right Out
Mic In or Center/LFE Out
Line Out [Front Panel]
Mic In [Front Panel]
4 Mbit
Firmware Hub
(FWH)
LAN
Connector
Serial ATA IDE
Connectors (4)
= connector or socket
14
Figure 2. Block Diagram
OM18294
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1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board D102GGC2 under
“Desktop Board Products” or “Desktop
Board Support”
Available configurations for the Desktop
Board D102GGC2
Processor data sheets http://www.intel.com/products/index.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
http://developer.intel.com/design/motherbd/gc2/gc2_available.htm
1.3 Processor
The board is designed to support the following processors:
• Intel Pentium
• Intel Pentium
• Intel Celeron D processor in an LGA775 processor socket with a 533 MHz system bus
For information about… Refer to:
Supported processors for the
D102GGC2 board
D processor in an LGA775 processor socket with an 800 or 533 MHz system bus
4 processor in an LGA775 processor socket with an 800 or 533 MHz system bus
http://www.intel.com/design/motherbd/gc2/gc2_documentation.htm
Product Description
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the
board, the processor, and the power supply.
INTEGRATOR’S NOTE
#
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.7.2.1, page 47
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Intel Desktop Board D102GGC2 Technical Product Specification
1.4 System Memory
The board has two 240-pin DIMM sockets and supports the following memory features:
• 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
• 2 GB maximum total system memory.
• Minimum total system memory: 128 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 533 or DDR2 400 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be
populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows
the BIOS to read the SPD data and program the chipset to accurately configure memory settings
for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly
configure the memory settings, but performance and reliability may be impacted or the DIMMs
may not function under the determined frequency.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
512 MB SS 1 Gbit 64 M x 16/empty 4
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
1024 MB SS 1 Gbit 128 M x 8/empty 8
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers
to single-sided memory modules (containing one row of SDRAM).
Configuration
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
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Product Description
1.5 ATI Radeon* Xpress 200 Chipset
The ATI Radeon Xpress 200 chipset consists of the following devices:
• ATI Radeon Xpress 200 Northbridge
• IXP 450 Southbridge
The ATI Radeon Xpress 200 Northbridge is a centralized controller for the system bus, the memory
bus, and the PCI Express bus. The ATI Radeon Xpress 200 Northbridge also provides integrated
graphics capabilities supporting 3D, 2D and display capabilities. The IXP 450 is a centralized
controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS.
For information about Refer to
The ATI Radeon Xpress 200 Northbridge http://www.ati.com/
The IXP 450 Southbridge http://www.ati.com/
Resources used by the chipset Chapter 2
1.5.1 Graphics Subsystem
The board contains two separate, mutually exclusive graphics options. Either the integrated
graphics processor (based on the ATI Radeon X300 core contained within the ATI Radeon
Xpress 200 Northbridge) is used, or a PCI Express x16 add-in card can be used.
1.5.2 Firmware Hub (FWH)
The Firmware Hub provides the nonvolatile storage of the Intel BIOS.
1.5.3 USB
The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and
EHCI-compatible drivers.
The IXP 450 Southbridge provides the USB controller for all ports. The port arrangement is as
follows:
• Four ports are implemented with dual stacked back panel connectors adjacent to the audio
connectors
• Four ports are routed to two separate front panel USB connectors
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the
requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 6, page 43
The location of the front panel USB connectors Figure 7, page 44
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Intel Desktop Board D102GGC2 Technical Product Specification
1.5.4 IDE Support
The board provides six IDE interface connectors:
• Two parallel ATA IDE connector that supports two devices
• Four serial ATA IDE connectors that support one device per connector
1.5.4.1 Parallel ATE IDE Interface
The IXP 450’s Parallel ATA IDE controller has two bus-mastering Parallel ATA IDE interfaces.
The Parallel ATA IDE interfaces support the following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The IXP 450’s
ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to
88 MB/sec.
• ATA-133: DMA protocol on IDE bus allows host and target throttling. The IXP 450’s
ATA-133 logic is designed to achieve read transfer rates up to 133 MB/sec and write transfer
rates in excess of 100 MB/sec.
NOTE
ATA-66, ATA-100, and ATA-133 are faster timings and require a specialized cable to reduce
reflections, noise, and inductive coupling.
The Parallel ATA IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA
devices using the transfer modes.
For information about Refer to
The location of the Parallel ATA IDE connectors Figure 7, page 44
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Product Description
1.5.4.2 Serial ATA Interfaces
The IXP 450’s Serial ATA controller offers four independent Serial ATA ports with a theoretical
maximum transfer rate of 150 MB/s per port. One device can be installed on each port for a
maximum of four Serial ATA devices. A point-to-point interface is used for host to device
connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices
per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system.
The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard
IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for configurations
using the Windows* XP and Windows 2000 operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power
supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the Serial ATA IDE connectors Figure 7, page 44
1.5.4.3 Serial ATA RAID (Optional)
As a manufacturing option, the board’s Serial ATA controller supports the following RAID
(Redundant Array of Independent Drives) levels:
• RAID 0 - data striping. Multiple physical drives can be teamed together to create one logical
drive. As data is written or retrieved from the logical drive, both drives operate in parallel, thus
increasing the throughput. The Serial ATA controller allows for more than two drives to be
used in a RAID 0 configuration.
• RAID 1 - data mirroring. Multiple physical drives maintain duplicate sets of all data on
separate disk drives. Level 1 provides the highest data reliability because two complete copies
of all information are maintained. The Serial ATA controller allows for two or four drives to
be used in a RAID 1 configuration.
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Intel Desktop Board D102GGC2 Technical Product Specification
1.5.5 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS
RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS
RAM (for example, the date and time) might not be accurate. Replace the battery with an
equivalent one. Figure 1 on page 12 shows the location of the battery.
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled
where possible. Disposal of used batteries must be in accordance with local environmental
regulations.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées
doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit
respecter les réglementations locales en vigueur en matière de protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt
genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende
miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i
henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de
lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista.
Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch
denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden.
Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.
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Product Description
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo
pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate,
seguire le istruzioni del produttore.
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas
iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de
las pilas usadas, siga igualmente las instrucciones del fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij.
Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte
batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias
devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de
acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны,
па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з
мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly
být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η µπαταρία αντικατασταθεί από µία λανθασµένου
τύπου. Οι µπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των
χρησιµοποιηµένων µπαταριών πρέπει να γίνεται σύµφωνα µε τους κατά τόπο περιβαλλοντικούς
κανονισµούς.
VIGYAZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint
újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell
kiselejtezni.
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Intel Desktop Board D102GGC2 Technical Product Specification
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya
dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar
tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte
baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony
środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie
reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale
privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей должна
проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať
v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
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Product Description
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей
має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
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Intel Desktop Board D102GGC2 Technical Product Specification
1.6 PCI Express* Connectors
The board provides the following PCI Express connectors:
• One PCI Express x16 connector supporting simultaneous transfer speeds up to 8 GBytes/sec
• One PCI Express x1 connector. The x1 interface supports simultaneous transfer speeds up to
500 MBytes/sec
The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the
underlying PCI Express architecture is compatible with PCI Conventional compliant operating
systems. Additional features of the PCI Express interface include the following:
• Support for the PCI Express enhanced configuration mechanism
• Automatic discovery, link training, and initialization
• Support for Active State Power Management (ASPM)
• SMBus 2.0 support
• Wake# signal supporting wake events from ACPI S1, S3, S4, or S5
• Software compatible with the PCI Power Management Event (PME) mechanism defined in the
PCI Power Management Specification Rev. 1.1
1.7 Legacy I/O Controller
The SMSC SCH5017 Legacy I/O controller provides the following features:
• One serial port
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems
• PS/2-style mouse and keyboard interfaces
• Interface for one 1.44 MB or 2.88 MB diskette drive
• Intelligent power management, including a programmable wake-up event interface
• PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.7.1 Serial Port
The Serial port A connector is located on the back panel. The serial port supports data transfers at
speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port A connector Figure 6, page 43
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Product Description
1.7.2 Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup
program to set the parallel port mode.
For information about Refer to
The location of the parallel port connector Figure 6, page 43
1.7.3 Diskette Drive Controller
The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the
diskette drive interface.
For information about Refer to
The location of the diskette drive connector Figure 7, page 44
1.7.4 Keyboard and Mouse Interface
PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2
connector. Power to the computer should be turned off before a keyboard or mouse is connected or
disconnected.
For information about Refer to
The location of the keyboard and mouse connectors Figure 6, page 43
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Intel Desktop Board D102GGC2 Technical Product Specification
1.8 High Definition Audio Subsystem
The board includes a flexible 6-channel audio subsystem based on a High Definition Audio
interface. The audio subsystem features:
• ATI IXP 450 Southbridge
• Realtek ALC883 audio codec
• Impedance sensing capability for jack re-tasking
• S/N (signal-to-noise) ratio of 90 dB
• Microphone input supporting:
⎯ Stereo microphone
⎯ Microphone boost
INTEGRATOR’S NOTE
#
For the front panel jack sensing and automatic retasking feature to function, a front panel daughter
card that is designed for High Definition Audio must be used. Otherwise, an AC ’97 style audio
front panel connector will be assumed and the Line Out and Mic In functions will be permanent.
1.8.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.1.4, page 14
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Product Description
1.8.2 Audio Connectors
The board contains audio connector on both the back panel and the component side of the board.
The front panel audio connector is a 2 x 5-pin connector that provides mic in and line out signals
for front panel audio connectors.
The audio subsystem connectors are shown in Figure 3.
Back Panel
Audio Connectors
Line In or
Rear Left/Right Out
Line Out or
Front Left/Right Out
Mic In or
Center/LFE (Subwoofer) Out
OM18246
Line Out
Front Panel
Audio Connectors
Mic In
Figure 3. Front/Back Panel Audio Connector Options for High Definition Audio Subsystem
For information about Refer to
The location of the front panel audio connector Figure 7, page 44
The signal names of the front panel audio connector Table 17, page 45
The back panel audio connectors Figure 6, page 43
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Intel Desktop Board D102GGC2 Technical Product Specification
1.9 LAN Subsystem
The LAN subsystem consists of the following:
• Realtek 8101L LAN adapter device for 10/100 Mbits/sec Ethernet LAN connectivity
• RJ-45 LAN connector with integrated status LEDs
• Programmable transit threshold
• Configurable EEPROM that contains the MAC address
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4).
Green LED
Figure 4. LAN Connector LED Locations
Yellow LED
OM15076
Table 5 describes the LED states when the board is powered up and the 10/100 Mbits/sec LAN
subsystem is operating.
Table 5. LAN Connector LED States
LED Color LED State Condition
Green
Off LAN link is not established.
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/sec data rate is selected. Yellow
On 100 Mbits/sec data rate is selected.
1.9.1 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers Section 1.1.4, page 14
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Product Description
1.10 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired for
Management (WfM) specification. The SMSC SCH5017 I/O controller is used to implement
hardware monitoring and fan control. The features of the SMSC SCH5017 I/O controller include:
• Internal ambient temperature sensor
• Two remote thermal diode sensors for direct monitoring of processor temperature and ambient
temperature sensing
• Power supply monitoring of five voltages (+5 V, +5 V standby, +VCCP, and +12 V) to detect
levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or
switch the fans on or off as needed
• SMBus interface
1.10.1 Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Utilities, LANDesk* software, or thirdparty software.
For information about Refer to
The functions of the fan connectors Section 1.11.2.2, page 33
1.10.2 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is removed. The
security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion
connector. When the chassis cover is removed, the mechanical switch is in the closed position.
For information about Refer to
The location of the chassis intrusion connector Figure 7, page 44
The signal names of the chassis intrusion connector Table 18, page 46
1.11 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
⎯ Power connector
⎯ Fan connectors
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Resume on Ring
⎯ Wake from USB
⎯ Wake from PS/2 devices
⎯ Power Management Event signal (PME#) wake-up support
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Intel Desktop Board D102GGC2 Technical Product Specification
1.11.1 ACPI
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with this board requires an operating system that
provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in boards may
require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 8 on page 31)
• Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed, depending on how
ACPI is configured with an ACPI-aware operating system.
Table 6. Effects of Pressing the Power Switch
If the system is in this state…
Off
(ACPI G2/G5 – Soft off)
On
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
Sleep
(ACPI G1 – sleeping state)
…and the power sw itch is
pressed for
Less than four seconds Power-on
Less than four seconds Soft-off/Standby
More than four seconds Fail safe power-off
Less than four seconds Wake-up
More than four seconds Power-off
…the system enters this state
(ACPI G0 – working state)
(ACPI G1 – sleeping state)
(ACPI G2/G5 – Soft off)
(ACPI G0 – working state)
(ACPI G2/G5 – Soft off)
1.11.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
Table 7 lists the power states supported by the board along with the associated system power
targets. See the ACPI specification for a complete description of the various system and power
states.
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Product Description
Table 7. Power States and Targeted System Power
Global States Sleeping States
G0 – working
S0 – working C0 – working D0 – working state. Full power > 30 W
state
G1 – sleeping
state
G1 – sleeping
state
S1 – Processor
stopped
S3 – Suspend to
RAM. Context
saved to RAM.
G1 – sleeping
state
S4 – Suspend to
disk. Context
saved to disk.
G2/S5 S5 – Soft off.
Context not saved.
Cold boot is
required.
G3 –
mechanical off
No power to the
system.
AC power is
disconnected
from the
computer.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered
by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
Processor
States
C1 – stop
grant
Device States
D1, D2, D3 – device
specification
specific.
No power D3 – no power
except for wake-up
logic.
No power D3 – no power
except for wake-up
logic.
No power D3 – no power
except for wake-up
logic.
No power D3 – no power for
wake-up logic,
except when
provided by battery
or external source.
Targeted System
(Note 1)
Power
5 W < power < 52.5 W
Power < 5 W
Power < 5 W
Power < 5 W
(Note 2)
(Note 2)
(Note 2)
No power to the system.
Service can be
performed safely.
1.11.1.2 Wake-up Devices and Events
Table 8 lists the devices or specific events that can wake the computer from specific states.
Table 8. Wake-up Devices and Events
These devices/events can wake up the computer… …from this state
LAN S1, S3, S4, S5
Modem (back panel Serial Port A) S1, S3
PME# signal S1, S3, S4, S5
Power switch S1, S3, S4, S5
PS/2 devices S1, S3
RTC alarm S1, S3, S4, S5
USB S1, S3
WAKE# signal S1, S3, S4, S5
Note: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On
will enable a wake-up event from LAN in the S5 state.
(Note)
(Note)
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Intel Desktop Board D102GGC2 Technical Product Specification
NOTE
The use of these wake-up events from an ACPI state requires an operating system that provides full
ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake
events.
1.11.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and
Instantly Available PC technology features are used. Failure to do so can damage the power
supply. The total amount of standby current required depends on the wake devices supported and
manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan connectors
• LAN wake capabilities
• Instantly Available PC technology
• Resume on Ring
• Wake from USB
• Wake from PS/2 keyboard
• PME# signal wake-up support
• WAKE# signal wake-up support
LAN wake capabilities and Instantly Available PC technology require power from the +5 V
standby line.
Resume on Ring enables telephony devices to access the computer when it is in a power-managed
state. The method used depends on the type of telephony device (external or internal).
NOTE
The use of Resume on Ring and Wake from USB technologies from an ACPI state requires an
operating system that provides full ACPI support.
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Product Description
1.11.2.1 Power Connector
ATX12V-compliant power supplies can turn off the system power through system control. When
an ACPI-enabled system receives the correct command, the power supply removes all non-standby
voltages.
When resuming from an AC power failure, the computer returns to the power state it was in before
power was interrupted (on or off). The computer’s response can be set using the Last Power State
feature in the BIOS Setup program’s Boot menu.
For information about Refer to
The location of the main power connector Figure 7, page 44
The signal names of the main power connector Table 22, page 47
1.11.2.2 Fan Connectors
The function/operation of the fan connectors is as follows:
• The fans are on when the board is in the S0 or S1 state.
• The fans are off when the board is off or in the S3, S4, or S5 state.
• Each fan connector is wired to a fan tachometer input of the SMSC SCH5017 I/O controller.
• All fan connectors support closed-loop fan control that can adjust the fan speed or switch the
fan on or off as needed.
• All fan connectors have a +12 V DC connection.
For information about Refer to
The signal names of the processor fan connector Table 20, page 46
The signal names of the chassis fan connectors Table 21, page 46
1.11.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable of
providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network. The LAN
network adapter monitors network traffic at the Media Independent Interface. Upon detecting a
Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.
Depending on the LAN implementation, the board supports LAN wake capabilities with ACPI in
the following ways:
• The PCI Express WAKE# signal
• The PCI Conventional bus PME# signal for PCI 2.2 compliant LAN designs
• The onboard LAN subsystem
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Intel Desktop Board D102GGC2 Technical Product Specification
1.11.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must be capable
of providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing Instantly Available PC technology can damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM)
sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off,
and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a
wake-up device or event, the system quickly returns to its last known wake state. Table 8 on
page 31 lists the devices and events that can wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in boards that
also support this specification can participate in power management and can be used to wake the
computer.
The use of Instantly Available PC technology requires operating system support and PCI 2.2
compliant add-in cards, PCI Express add-in cards, and drivers.
1.11.2.5 Resume on Ring
The operation of Resume on Ring can be summarized as follows:
• Resumes operation from ACPI S1 or S3 states
• Detects incoming call similarly for external and internal modems
• Requires modem interrupt be unmasked for correct operation
1.11.2.6 Wake from USB
USB bus activity wakes the computer from ACPI S1 or S3 states.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.11.2.7 Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S1 or S3 state.
1.11.2.8 PME# Signal Wake-up Support
When the PME# signal on the PCI Conventional bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS).
1.11.2.9 WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state.
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Product Description
1.11.2.10 +5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the computer
appears to be off. Figure 5 shows the location of the standby power indicator LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit, disconnect the power
cord before installing or removing any devices connected to the board. Failure to do so could
damage the board and any attached devices.
CR1
OM19010
Figure 5. Location of the Standby Power Indicator LED
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Intel Desktop Board D102GGC2 Technical Product Specification
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2 Technical Reference
What This Chapter Contains
2.1 Memory Map................................................................................................................37
2.2 DMA Channels.............................................................................................................38
2.3 Fixed I/O Map...............................................................................................................39
2.4 Interrupts......................................................................................................................40
2.5 PCI Configuration Space Map......................................................................................41
2.6 PCI Conventional Interrupt Routing Map .....................................................................41
2.7 Connectors...................................................................................................................42
2.8 Jumper Block ...............................................................................................................51
2.9 Mechanical Considerations..........................................................................................52
2.10 Electrical Considerations..............................................................................................54
2.11 Thermal Considerations...............................................................................................56
2.12 Reliability......................................................................................................................58
2.13 Environmental..............................................................................................................59
2.14 Regulatory Compliance................................................................................................60
2.1 Memory Map
Table 9 lists the system memory map.
Table 9. System Memory Map
Address Range (decimal) Address Range (hex) Size Description
1024 K - 4194304 K 100000 - FFFFFFFF 4095 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E8000 - EFFFF 32 KB Reserved
800 K - 896 K C8000 – E7FFF 128 KB Potential available high DOS
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
memory (open to the PCI
Conventional bus). Dependent on
video adapter used.
memory manager software)
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Intel Desktop Board D102GGC2 Technical Product Specification
2.2 DMA Channels
Table 10. DMA Channels
DMA Channel Number Data Width System Resource
0 8 or 16 bits Open
1 8 or 16 bits Parallel port
2 8 or 16 bits Diskette drive
3 8 or 16 bits Parallel port (for ECP or EPP)
4 8 or 16 bits DMA controller
5 16 bits Open
6 16 bits Open
7 16 bits Open
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2.3 Fixed I/O Map
Table 11. I/O Map
Address (hex) Size Description
0000 - 00FF 256 bytes Used by the Desktop Board D102GGC2. Refer to the
0170 - 0177 8 bytes Secondary Parallel ATA IDE channel command block
01F0 - 01F7 8 bytes Primary Parallel ATA IDE channel command block
0228 - 022F
0278 - 027F
02E8 - 02EF
02F8 - 02FF
0374 - 0377 4 bytes Secondary Parallel ATA IDE channel control block
0377, bits 6:0 7 bits Secondary IDE channel status port
0378 - 037F 8 bytes LPT1
03E8 - 03EF 8 bytes COM3
03F0 - 03F5 6 bytes Diskette channel
03F6 – 03F7 1 byte Primary Parallel ATA IDE channel control block
03F8 - 03FF 8 bytes COM1
04D0 - 04D1 2 bytes Edge/level triggered PIC
LPTn + 400 8 bytes ECP port, LPTn base address + 400h
0CF8 - 0CFB
0CF9
0CFC - 0CFF 4 bytes PCI Conventional bus configuration data register
FB00 – FB07 8 bytes Primary Parallel ATA IDE bus master registers
FB08 – FB0F 8 bytes Secondary Parallel ATA IDE bus master registers
Notes:
1. Default, but can be changed to another address range
2. Dword access only
3. Byte access only
(Note 1)
8 bytes LPT3
(Note 1)
8 bytes LPT2
(Note 1)
8 bytes COM4
(Note 1)
8 bytes COM2
(Note 2)
4 bytes PCI Conventional bus configuration address register
(Note 3)
1 byte Reset control register
Technical Reference
IXP 450 data sheet for dynamic addressing information.
NOTE
Some additional I/O addresses are not available due to IXP 450 address aliasing. The IXP 450
data sheet provides more information on address aliasing.
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Intel Desktop Board D102GGC2 Technical Product Specification
2.4 Interrupts
The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the
Advanced Programmable Interrupt Controller (APIC) portion of the IXP 450 Southbridge
component. The PIC is supported in Windows 98 SE and Windows ME and uses the first
16 interrupts. The APIC is supported in Windows 2000 and Windows XP and supports a total of
24 interrupts.
Table 12. Interrupts
IRQ System Resource
NMI I/O channel check
0 Reserved, interval timer
1 Reserved, keyboard buffer full
2 Reserved, cascade interrupt from slave PIC
3 COM2
4 COM1
5 LPT2 (Plug and Play option)/User available
6 Diskette drive
7 LPT1
8 Real-time clock
9 User available
10 User available
11 User available
12 Onboard mouse port (if present, else user available)
13 Reserved, math coprocessor
14 Primary IDE/Serial ATA (if present, else user available)
15 Secondary IDE/Serial ATA (if present, else user available)
(Note 2)
16
17
18
19
20
21
22
23
Notes:
1. Default, but can be changed to another IRQ.
2. Available in APIC mode only.
User available (through PIRQA)
(Note 2)
User available (through PIRQB)
(Note 2)
User available (through PIRQC)
(Note 2)
User available (through PIRQD)
(Note 2)
User available (through PIRQE)
(Note 2)
User available (through PIRQF)
(Note 2)
User available (through PIRQG)
(Note 2)
User available (through PIRQH)
(Note 1)
(Note 1)
(Note 1)
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2.5 PCI Configuration Space Map
Table 13. PCI Configuration Space Map
Bus
Number (hex)
00 00 00 ATI Host Bridge
00 02 00 ATI PCI Express x16 port Bridge
00 06 00 ATI PCI Express x1 port Bridge
00 11 00 ATI IDE controller
00 12 00 ATI IDE controller
00 13 00 ATI USB OHCI controller 1
00 13 01 ATI USB OHCI controller 2
00 13 02 ATI USB OHCI controller 3
00 14 00 ATI SMBus controller
00 14 01 ATI IDE controller
00 14 02 ATI Azalia controller
00 14 03 ATI ISA bridge
00 14 04 ATI Decode PCI/PCI bridge
01 05 00 ATI VGA controller
(Notes 1 and 3)
01
(Notes 2 and 3)
02
(Note 3)
02
03
03
Notes:
1. Present only when a PCI Express x16 graphics card is installed.
2. Present only when a PCI Express x1 add-in card is installed.
3. Bus number is dynamic and can change based on add-in cards used.
02 00 Ethernet controller
(Note 3)
03 00 PCI Conventional bus connector 1
(Note 3)
04 00 PCI Conventional bus connector 2
Device
Number (hex)
Function
Number (hex) Description
PCI Express x16 connector
PCI Express x1 connector
Technical Reference
(Note 1)
(Note 2)
2.6 PCI Conventional Interrupt Routing Map
Table 14 lists how the PIRQ signals are routed.
Table 14. PCI Interrupt Routing Map
PCI Interrupt Source
PCI bus connector 1 INTA INTB INTC INTD
PCI bus connector 2 INTB INTC INTD INTA
Realtek LAN INTF
IXP 450 PIRQ Signal Name
PIRQA PIRQB PIRQC PIRQD PIRQE PIRQF PIRQG PIRQH
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Intel Desktop Board D102GGC2 Technical Product Specification
2.7 Connectors
CAUTION
Only the following connectors have overcurrent protection: back panel USB, front panel USB, and
PS/2.
The other internal connectors are not overcurrent protected and should connect only to devices
inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors
to power devices external to the computer’s chassis. A fault in the load presented by the external
devices could cause damage to the computer, the power cable, and the external devices themselves.
This section describes the board’s connectors. The connectors can be divided into these groups:
• Back panel I/O connectors (see page 43)
• Component-side I/O connectors (see page 44)
42
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2.7.1 Back Panel Connectors
Figure 6 shows the location of the back panel connectors. The back panel connectors are
color-coded. The figure legend (Table 15) lists the colors used (when applicable).
A
B
GC
Technical Reference
I
FD E
H J
Figure 6. Back Panel Connectors
Table 15. Back Panel Connectors Shown in Figure 6
Item/callout
from Figure 6 Description
A
B
C
D
E
F
G
H Line in or Rear Left/Right Out
I
J Mic in or Center/LFE (Subwoofer) Out
NOTE
PS/2 mouse port (Green)
PS/2 keyboard port (Purple)
Parallel port (Burgundy)
Serial port A (Teal)
VGA port
USB ports [4]
LAN
Line out or Front Left/Right Out
The back panel audio line out connector is designed to power headphones or amplified speakers
only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
OM18248
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Intel Desktop Board D102GGC2 Technical Product Specification
2.7.2 Component-side Connectors
Figure 7 shows the locations of the component-side connectors.
CA B
E FD
10
192
1
3
24
G
13
271
V
U
T
10
271
10
291
1
S OPQ
1
1
1
1
13
2
1
2
1
40 39
40
2
1
39 33
KL JMNR
Figure 7. Component-side Connectors
Table 16 lists the component-side connectors identified in Figure 7.
1324
1
1
1
4
1
OM19009
H
I
44
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Table 16. Component-side Connectors Shown in Figure 7
Item/callout
from Figure 7 Description
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
PCI Conventional bus add-in card connector 2
PCI Conventional bus add-in card connector 1
Front panel audio connector
PCI Express x1 bus add-in card connector
PCI Express x16 add-in card connector
Rear chassis fan connector
+12V power connector (ATX12V)
Processor fan connector
Chassis intrusion connector
Main power connector
Diskette drive connector
Primary parallel ATA IDE connector
Secondary parallel ATA IDE connector
Serial ATA connector 1
Front chassis fan connector
Serial ATA connector 2
Serial ATA connector 4
Serial ATA connector 3
Auxiliary front panel power LED connector
Front panel connector
Front panel USB connector
Front panel USB connector
Technical Reference
Table 17. Front Panel Audio Connector
Pin Signal Name Pin Signal Name
1 Port F Left Channel 2 Ground
3 Port F Right Channel 4 Presence# (dongle present)
5 Port E Right Channel 6 Port F Sense return
7 Port E and Port F
Sense send (jack detection)
9 Port E Left Channel 10 Port E Sense return
INTEGRATOR’S NOTE
#
The front panel audio connector is colored yellow.
(jack detection)
8 Key
(jack detection)
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Intel Desktop Board D102GGC2 Technical Product Specification
Table 18. Chassis Intrusion Connector
Pin Signal Name
1 Intruder
2 Ground
Table 19. Serial ATA Connectors
Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
Table 20. Processor Fan Connector
Pin Signal Name
1 Ground
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
Table 21. Chassis Fan Connectors
Pin Signal Name
1 Control
2 +12 V
3 Tach
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Technical Reference
2.7.2.1 Power Supply Connectors
The board has three power supply connectors:
• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors
previously used on Intel Desktop boards. The board supports the use of ATX12V power
supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a
2 x 10 main power cable, attach that cable on the rightmost pins of the main power connector,
leaving pins 11, 12, 23, and 24 unconnected.
• ATX12V power – a 2 x 2 connector. This connector provides power directly to the processor
voltage regulator and must always be used. Failure to do so will prevent the board from
booting.
Table 22. Main Power Connector
Pin Signal Name Pin Signal Name
1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V
12 2 x 12 connector detect
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
(Note)
23 +5 V
(Note)
24 Ground
(Note)
(Note)
Table 23. ATX12V Power Connector
Pin Signal Name Pin Signal Name
1 Ground 2 Ground
3 +12 V 4 +12 V
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Intel Desktop Board D102GGC2 Technical Product Specification
2.7.2.2 Add-in Card Connectors
The board has the following add-in card connectors:
• PCI Express x16: one connector supporting simultaneous transfer speeds up to 8 GBytes/sec.
• PCI Express x1: one PCI Express x1 connector. The x1 interface supports simultaneous
transfer speeds up to 500 MBytes/sec.
• PCI Conventional (rev 2.3 compliant) bus: two PCI Conventional bus add-in card connectors.
The SMBus is routed to PCI Conventional bus connector 2 only (ATX expansion slot 6). PCI
Conventional bus add-in cards with SMBus support can access sensor data and other
information residing on the board.
Note the following considerations for the PCI Conventional bus connectors:
• All of the PCI Conventional bus connectors are bus master capable.
• SMBus signals are routed to PCI Conventional bus connector 2. This enables PCI
Conventional bus add-in boards with SMBus support to access sensor data on the board. The
specific SMBus signals are as follows:
⎯ The SMBus clock line is connected to pin A40.
2.7.2.3 Auxiliary Front Panel Power/Sleep LED Connector
Pins 1 and 3 of this connector duplicate the signals on pins 2 and 4 of the front panel connector.
Table 24. Auxiliary Front Panel Power/Sleep LED Connector
Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED
2.7.2.4 Front Panel Connector
This section describes the functions of the front panel connector. Table 25 lists the signal names of
the front panel connector. Figure 8 is a connection diagram for the front panel connector.
Table 25. Front Panel Connector
Pin Signal In/Out Description Pin Signal In/Out Description
Hard Drive Activity LED
[Orange]
1 HD_PWR Out Hard disk LED
pull-up to +5 V
3 HAD# Out Hard disk active
LED
Reset Switch
[Blue]
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected
2 HDR_BLNK_
GRN
4 HDR_BLNK_
YEL
Power LED
[Green]
Out Front panel green
LED
Out Front panel yellow
LED
On/Off Switch
[Red]
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Technical Reference
Hard Drive
Activity LED
Reset
Switch
+5 V DC
Single-colored
Orange Blue
+
−
2
1
4
3
6
5
8
7
9
Green Red
Power LED
+
−
Power
Switch
N/C
Dual-colored
Power LED
−
+
OM18249
Figure 8. Connection Diagram for Front Panel Connector
2.7.2.4.1 Hard Drive Activity LED Connector [Orange]
Pins 1 and 3 [Orange] can be connected to an LED to provide a visual indicator that data is being
read from or written to a hard drive. Proper LED function requires one of the following:
• A Serial ATA hard drive connected to an onboard Serial ATA connector
• An IDE hard drive connected to an onboard IDE connector
2.7.2.4.2 Reset Switch Connector [Blue]
Pins 5 and 7 [Blue] can be connected to a momentary single pole, single throw (SPST) type switch
that is normally open. When the switch is closed, the board resets and runs the POST.
2.7.2.4.3 Power/Sleep LED Connector [Green]
Pins 2 and 4 [Green] can be connected to a one- or two-color LED. Table 26 shows the possible
states for a one-color LED. Table 27 shows the possible states for a two-color LED.
Table 26. States for a One-Color Power LED
LED State Description
Off Power off/sleeping
Steady Green Running
Table 27. States for a Two-Color Power LED
LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping
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Intel Desktop Board D102GGC2 Technical Product Specification
NOTE
The colors listed in Table 26 and Table 27 are suggested colors only. Actual LED colors are
product- or customer-specific.
2.7.2.4.4 Power Switch Connector [Red]
Pins 6 and 8 [Red] can be connected to a front panel momentary-contact power switch. The switch
must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or
off. (The time requirement is due to internal debounce circuitry on the board.) At least two
seconds must pass before the power supply will recognize another on/off signal.
2.7.3 Front Panel USB Connectors
Figure 9 is a connection diagram for the front panel USB connectors.
INTEGRATOR’S NOTES
#
• The +5 V DC power on the USB connector is fused.
• Pins 1, 3, 5, and 7 comprise one USB port.
• Pins 2, 4, 6, and 8 comprise one USB port.
• Use only a front panel USB connector that conforms to the USB 2.0 specification for high-
speed USB devices.
One
USB
Port
Power
(+5 V DC)
D−
D+
Ground
Key (no pin)
2
1
4
3
6
5
8
7
10
Power
(+5 V DC)
D−
D+
Ground
No Connect
One
USB
Port
OM15963
Figure 9. Connection Diagram for Front Panel USB Connectors
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Technical Reference
2.8 Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the power cord
from the computer before changing a jumper setting. Otherwise, the board could be damaged.
Figure 10 shows the location of the jumper block. The jumper block determines the BIOS Setup
program’s mode. Table 28 describes the jumper settings for the three modes: normal, configure, and
recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS
compares the processor version and the microcode version in the BIOS and reports if the two match.
1
3
Figure 10. Location of the Jumper Block
Table 28. BIOS Setup Configuration Jumper Settings
Function/Mode Jumper Setting Configuration
Normal 1-2
Configure 2-3
Recovery None
1
3
1
3
1
3
The BIOS uses current configuration information and
passwords for booting.
After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
The BIOS attempts to recover the BIOS configuration. A
recovery diskette is required.
OM19011
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Intel Desktop Board D102GGC2 Technical Product Specification
2.9 Mechanical Considerations
2.9.1 Form Factor
The board is designed to fit into either a microATX or an ATX-form-factor chassis. Figure 11
illustrates the mechanical form factor of the board. Dimensions are given in inches [millimeters].
The outer dimensions are 9.60 inches by 8.60 inches [243.84 millimeters by 218.44 millimeters].
Location of the I/O connectors and mounting holes are in compliance with the ATX specification.
1.00
6.50
[165.10]
6.10
[154.94]
[45.72]
0.00
5.20
[132.08]
0.00
2.10
[53.34]
3.15
[80.01]
Figure 11. Board Dimensions
6.45
[163.83]
OM19012
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Technical Reference
2.9.2 I/O Shield
The back panel I/O shield for the board must meet specific dimension and material requirements.
Systems based on this board need the back panel I/O shield to pass certification testing.
Figure 12 shows the I/O shield. Dimensions are given in millimeters [inches].
The figure also indicates the position of each cutout. Additional design considerations for I/O
shields relative to chassis requirements are described in the ATX specification.
NOTE
The I/O shield drawing in this document is for reference only. An I/O shield compliant with the
ATX chassis specification 2.03 is available from Intel.
162.3 REF
[6.390]
20 ± 0.254 TYP
1.55 REF
[0.061]
[0.787 ± 0.10]
159.2 ± 0.12
[6.268 ± 0.005]
1.6 ± 0.12
[0.063 ± 0.005]
7.01
[0.276]
0.00
[0.00]
12.04
[0.474]
22.45
[0.884]
Ø 1.00
[0.039]
11.81
[0.465]
8x R 0.5 MIN
146.88
[5.783]
A
11.81
[0.465]
14.17
[0.558]
A
0.00
[0.00]
8.805
[0.347]
20.283
[0.799]
26.91
[1.059]
56.31
[2.217]
93.74
[3.690]
113.63
[4.473]
Pictorial View
Scale 1.000
Figure 12. I/O Shield Dimensions
53
OM18251
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Intel Desktop Board D102GGC2 Technical Product Specification
2.10 Electrical Considerations
2.10.1 DC Loading
Table 29 lists the DC loading characteristics of the board. This data is based on a DC analysis of
all active components within the board that impact its power delivery subsystems. The analysis
does not include PCI add-in cards. Minimum values assume a light load placed on the board that is
similar to an environment with no applications running and no USB current draw. Maximum
values assume a load placed on the board that is similar to a heavy gaming environment with a
500 mA current draw per USB port. These calculations are not based on specific processor values
or memory configurations but are based on the minimum and maximum current draw possible from
the board’s power delivery subsystems to the processor, memory, and USB ports.
Use the datasheets for add-in cards, such as PCI, to determine the overall system power
requirements. The selection of a power supply at the system level is dependent on the system’s
usage model and not necessarily tied to a particular processor speed.
Table 29. DC Loading Characteristics
DC Current at:
Mode DC Power +3.3 V +5 V +12 V -12 V +5 VSB
Minimum loading 250 W 3.09 A 2.89 A 18.12 A 0.05 A 1.84 A
Maximum loading 490 W 22.86 A 19.25 A 25.38 A 0.10 A 2.30 A
2.10.2 Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for each add-in board. The total
+5 V current draw for the board is as follows: a fully loaded D102GGC2 board (all three
expansion slots and the PCI Express x16 add-in card connector filled) must not exceed 8 A.
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2.10.3 Fan Connector Current Capability
CAUTION
The processor fan must be connected to the processor fan connector, not to a chassis fan
connector. Connecting the processor fan to a chassis fan connector may result in onboard
component damage that will halt fan operation.
Table 30 lists the current capability of the fan connectors.
Table 30. Fan Connector Current Capability
Fan Connector Maximum Available Current
Processor fan 3000 mA
Front chassis fan 1500 mA
Rear chassis fan 1500 mA
2.10.4 Power Supply Considerations
Technical Reference
CAUTION
The +5 V standby line for the power supply must be capable of providing adequate +5 V standby
current. Failure to do so can damage the power supply. The total amount of standby current
required depends on the wake devices supported and manufacturing options.
System integrators should refer to the power usage values listed in Table 29 when selecting a power
supply for use with the board.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the following recommendations found in the indicated
sections of the ATX form factor specification.
• The potential relation between 3.3 VDC and +5 VDC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances
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Intel Desktop Board D102GGC2 Technical Product Specification
2.11 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a
requirement. Use a processor heatsink that provides omni-directional airflow (similar to the type
shown in Figure 13) to maintain required airflow across the processor voltage regulator area.
OM16996
Figure 13. Processor Heatsink for Omni-directional Airflow
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have
been tested with Intel desktop boards please refer to the following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design remains solely with
the reader. Intel makes no warranties or representations that merely following the instructions
presented in this document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the board’s maximum operating temperature.
Failure to do so could cause components to exceed their maximum case temperature and
malfunction. For information about the maximum operating temperature, see the environmental
specifications in Section 2.13.
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Technical Reference
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in damage to the voltage regulator circuit. The processor voltage regulator area
(item A in Figure 14) can reach a temperature of up to 85
Figure 14 shows the locations of the localized high temperature zones.
o
C in an open chassis.
A
B
D C
Item Description
A Processor voltage regulator area
B Processor
C ATI Radeon Xpress 200 Northbridge
D IXP 450 Southbridge
Figure 14. Localized High Temperature Zones
57
OM19013
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Intel Desktop Board D102GGC2 Technical Product Specification
Table 31 provides maximum case temperatures for the components that are sensitive to thermal
changes. The operating temperature, current load, or operating frequency could affect case
temperatures. Maximum case temperatures are important when considering proper airflow to cool
the board.
Table 31. Thermal Considerations for Components
Component Maximum Case Temperature
Intel Pentium 4 processor For processor case temperature, see processor datasheets and
processor specification updates
ATI Radeon Xpress 200 Northbridge 95 oC
IXP 450 Southbridge 85 oC
For information about Refer to
Intel Pentium 4 processor datasheets and specification updates Section 1.1.4, page 14
2.12 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the D102GGC2 board is
98,977 hours.
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2.13 Environmental
Table 32 lists the environmental specifications for the board.
Table 32. Environmental Specifications
Parameter Specification
Temperature
Non-Operating
Operating
Shock
Unpackaged 50 g tr apezoidal waveform
Velocity change of 170 inches/second
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
-40 °C to +70 °C
0 °C to +55 °C
Technical Reference
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Intel Desktop Board D102GGC2 Technical Product Specification
2.14 Regulatory Compliance
This section contains the following regulatory compliance information for Desktop Board
D102GGC2:
• Safety regulations
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) regulations
• Product certification markings
2.14.1 Safety Regulations
Desktop Board D102GGC2 complies with the safety regulations stated in Table 33 when correctly
installed in a compatible host system.
Table 33. Safety Regulations
Regulation Title
UL 60950-1:2003/
CSA C22.2 No. 60950-1-03
EN 60950-1:2002 Information Technology Equipment – Safety - Part 1: General
IEC 60950-1:2001, First Edition Information Technology Equipment – Safety - Part 1: General
Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
Requirements (European Union)
Requirements (International)
2.14.2 European Union Declaration of Conformity Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board
D102GGC2 is in conformity with all applicable essential requirements necessary for CE marking,
following the provisions of the European Council Directive 89/336/EEC (EMC Directive) and
Council Directive 73/23/EEC (Safety/Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for distribution within all
member states of the EU with no restrictions.
This product follows the provisions of the European Directives 89/336/EEC and 73/23/EEC.
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Technical Reference
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 89/336/EEC a 73/23/EEC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 89/336/EEC &
73/23/EEC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief 89/336/EEC &
73/23/EEC.
Eesti Antud toode vastab Euroopa direktiivides 89/336/EEC ja 73/23/EEC kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 89/336/EEC & 73/23/EEC määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne 89/336/EEC &
73/23/EEC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 89/336/EEC &
73/23/EEC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών 89/336/ΕΟΚ και
73/23/ΕΟΚ.
Magyar E termék megfelel a 89/336/EEC és 73/23/EEC Európai Irányelv előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer 89/336/ EEC &
73/23/EEC.
Italiano Questo prodotto è conforme alla Direttiva Europea 89/336/EEC & 73/23/EEC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 89/336/EEC un 73/23/EEC noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 89/336/EEC ir 73/23/EEC nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 89/336/EEC u
73/23/EEC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 89/336/ EEC &
73/23/EEC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
89/336/EWG i 73/23/EWG.
Portuguese Este produto cumpre com as normas da Diretiva Européia 89/336/EEC &
73/23/EEC.
Español Este producto cumple con las normas del Directivo Europeo 89/336/EEC & 73/23/EEC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 89/336/EEC a
73/23/EEC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 89/336/EGS in 73/23/EGS.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 89/336/EEC & 73/23/EEC.
Türkçe Bu ürün, Avrupa Birliği’nin 89/336/EEC ve 73/23/EEC yönergelerine uyar.
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Intel Desktop Board D102GGC2 Technical Product Specification
2.14.3 Product Ecology Statements
The following information is provided to address worldwide product ecology concerns and
regulations.
2.14.3.1 Disposal Considerations
This product contains the following materials that may be regulated upon disposal: lead solder on
the printed wiring board assembly.
2.14.3.2 Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the Intel Product
Recycling Program to allow retail consumers of Intel’s branded products to return used products to
select locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
for the details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
中文
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program
（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作
恰当的重复使用处理。
请参考http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel ProduktRecyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten
ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling
zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren
Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa
de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel
devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
los detalles del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envío, términos y condiciones, etc.
62
para ver
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Technical Reference
Français
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le
programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour
permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des
adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
pour en savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les
instructions d'expédition, les conditions générales, etc.
日本語
インテルでは、環境保護活動の一環として、使い終えたインテル
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル
プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、
http://www.intel.com/intel/
other/ehs/product_ecology/Recycling_Program.htm （英語）をご覧ください。
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah
melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit
produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula
dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
untuk
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o Programa de
Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para
locais selecionados, onde esses produtos são reciclados de maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os
locais disponíveis, as instruções de envio, os termos e condições, etc.
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана программа
утилизации продукции Intel (Product Recycling Program) для предоставления конечным
пользователям марок продукции Intel возможности возврата используемой продукции в
специализированные пункты для должной утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
за информацией
об этой программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
(em
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Intel Desktop Board D102GGC2 Technical Product Specification
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı
kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini
amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil
bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology/Recycling_Program.htm
Web sayfasına gidin.
2.14.3.3 Lead Free Desktop Board
This desktop board is lead free although certain discrete components used on the board contain a
small amount of lead which is necessary for component performance and/or reliability. This
desktop board is referred to as “Lead-free second level interconnect.” The board substrate and the
solder connections from the board to the components (second-level connections) are all lead free.
Table 34 shows the various forms of the “Lead-Free 2
the board and accompanying collateral.
nd
Level Interconnect” mark as it appears on
Table 34. Lead-Free Board Markings
Description Mark
Lead-Free 2
Interconnect:
used to identify electrical and
electronic assemblies and
components in which the lead (Pb)
concentration level in the desktop
board substrate and the solder
connections from the board to the
components (second-level
interconnect) is not greater than
0.1% by weight (1000 ppm).
nd
Level
This symbol is
or
or
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Technical Reference
2.14.4 EMC Regulations
Desktop Board D102GGC2 complies with the EMC regulations stated in Table 35 when correctly
installed in a compatible host system.
Table 35. EMC Regulations
Regulation Title
FCC Class B Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B,
Radio Frequency Devices. (USA)
ICES-003 (Class B) Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022: 1998 (Class B) Limits and methods of measurement of Radio Interference Characteristics of
Information Technology Equipment. (European Union)
EN55024: 1998 Information Technology Equipment – Immunity Characteristics Limits and
methods of measurement. (European Union)
AS/NZS CISPR 22
(Class B)
CISPR 22, 3rd Edition,
(Class B)
CISPR 24: 1997 Information Technology Equipment – Immunity Characteristics – Limits and
VCCI (Class B) Voluntary Control for Interference by Information Technology Equipment.
Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
Limits and methods of measurement of Radio Disturbance Characteristics of
Information Technology Equipment. (International)
Methods of Measurement. (International)
(Japan)
Japanese Kanji statement translation: this is a Class B product based on the standard of the
Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If
this is used near a radio or television receiver in a domestic environment, it may cause radio
interference. Install and use the equipment according to the instruction manual.
Korean Class B statement translation: this is household equipment that is certified to comply with
EMC requirements. You may use this equipment in residential environments and other nonresidential environments.
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Intel Desktop Board D102GGC2 Technical Product Specification
2.14.5 Product Certification Markings (Board Level)
Desktop Board D102GGC2 has the product certification markings shown in Table 36:
Table 36. Product Certification Markings
Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel desktop boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment. Includes
Intel name and D102GGC2 model designation.
CE mark. Declaring compliance to European Union (EU) EMC directive
(89/336/EEC) and Low Voltage directive (73/23/EEC).
Australian Communications Authority (ACA) C-tick mark. Includes adjacent
Intel supplier code number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea MIC (Ministry of Information and Communication) mark. Includes
adjacent MIC certification number: CPU-D102GGC2
For information about MIC certification, go to
http://support.intel.com/support/motherboards/desktop/
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique UL
recognized manufacturer’s logo, along with a flammability rating (solder side).
V-0
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3 Overview of BIOS Features
What This Chapter Contains
3.1 Introduction ..................................................................................................................67
3.2 BIOS Flash Memory Organization ...............................................................................68
3.3 Resource Configuration ...............................................................................................68
3.4 System Management BIOS (SMBIOS) ........................................................................69
3.5 Legacy USB Support....................................................................................................69
3.6 BIOS Updates..............................................................................................................70
3.7 Boot Options ................................................................................................................71
3.8 Adjusting Boot Speed...................................................................................................72
3.9 BIOS Security Features ...............................................................................................73
3.1 Introduction
The boards use an Intel BIOS that is stored in the Firmware Hub (FWH) and can be updated using a
disk-based program. The FWH contains the BIOS Setup program, POST, the PCI autoconfiguration utility, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision code. The
initial production BIOSs are identified as GC11020M.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer is poweredup, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the
two match.
The BIOS Setup program can be used to view and change the BIOS settings for the computer. The
BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST)
memory test begins and before the operating system boot begins. The menu bar is shown below.
Maintenance Main Advanced Security Power Boot Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode. Section 2.8 on
page 51 shows how to put the board in configure mode.
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Intel Desktop Board D102GGC2 Technical Product Specification
Table 37 lists the BIOS Setup program menu features.
Table 37. BIOS Setup Program Menu Bar
Maintenance Main Advanced Security Power Boot Exit
Clears
passwords and
displays
processor
information
Displays
processor
and memory
configuration
Configures
advanced
features
available
through the
chipset
Sets
passwords
and security
features
Table 38 lists the function keys available for menu screens.
Table 38. BIOS Setup Program Function Keys
BIOS Setup Program Function Key Description
<←> or <→>
<↑> or <↓>
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
Selects a different menu screen (Moves the cursor left or right)
Selects an item (Moves the cursor up or down)
Configures
power
management
features and
power supply
controls
Selects boot
options
Saves or
discards
changes to
Setup
program
options
3.2 BIOS Flash Memory Organization
The Firmware Hub (FWH) includes a 4 Mbit (512 KB) flash memory device.
3.3 Resource Configuration
3.3.1 PCI Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards.
Autoconfiguration lets a user insert or remove PCI cards without having to configure the system.
When a user turns on the system after adding a PCI card, the BIOS automatically configures
interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are
considered to be available for use by the add-in card.
3.3.2 PCI IDE Support
If you select Auto in the BIOS Setup program, the BIOS automatically sets up the
PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives
up to ATA-66/100/133 and recognizes any ATAPI compliant devices, including CD-ROM drives,
tape drives, and Ultra DMA drives. The interface also supports second-generation SATA drives.
The BIOS determines the capabilities of each drive and configures them to optimize capacity and
performance. To take advantage of the high capacities typically available today, hard drives are
automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4, depending
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Overview of BIOS Features
on the capability of the drive. You can override the auto-configuration options by specifying
manual configuration in the BIOS Setup program.
To use ATA-66/100 features the following items are required:
• An ATA-66/100 peripheral device
• An ATA-66/100 compatible cable
• ATA-66/100 operating system device drivers
NOTE
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master device. For
example, do not connect an ATA hard drive as a slave to an ATAPI CD-ROM drive.
3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in
a managed network.
The main component of SMBIOS is the Management Information Format (MIF) database, which
contains information about the computing system and its components. Using SMBIOS, a system
administrator can obtain the system types, capabilities, operational status, and installation dates for
system components. The MIF database defines the data and provides the method for accessing this
information. The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems, such as Windows NT*, require an additional interface for
obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such
operating systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information.
3.5 Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating system’s USB
drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and
to install an operating system that supports USB.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and
configure the BIOS Setup program and the maintenance menu.
4. POST completes.
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Intel Desktop Board D102GGC2 Technical Product Specification
5. The operating system loads. While the operating system is loading, USB keyboards and mice
are recognized and may be used to configure the operating system.
6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are
recognized by the operating system, and Legacy USB support from the BIOS is no longer used.
To install an operating system that supports USB, follow the operating system’s installation
instructions.
3.6 BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on the Intel
World Wide Web site:
• Intel
• Intel
®
Express BIOS Update utility, which enables automated updating while in the Windows
environment. Using this utility, the BIOS can be updated from a file on a hard disk, a 1.44 MB
diskette, or a CD-ROM, or from the file location on the Web.
®
Flash Memory Update Utility, which requires creation of a boot diskette and manual
rebooting of the system. Using this utility, the BIOS can be updated from a file on a 1.44 MB
diskette (from a legacy diskette drive or an LS-120 diskette drive) or a CD-ROM.
Both utilities verify that the updated BIOS matches the target system to prevent accidentally
installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
For information about Refer to
The Intel World Wide Web site Section 1.1.4, page 14
3.6.1 Language Support
The BIOS Setup program and help messages are supported in US English. Additional languages
are available in the Integrator’s Toolkit utility. Check the Intel website for details.
3.6.2 Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented
with a custom splash screen. The Integrator’s Toolkit that is available from Intel can be used to
create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
For information about Refer to
The Intel World Wide Web site Section 1.1.4, page 14
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Overview of BIOS Features
3.7 Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives,
CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device,
the hard drive second, and the ATAPI CD-ROM third. The fourth device is disabled.
3.7.1 CD-ROM Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format
specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-ROM is listed as a
boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD
in the CD-ROM drive, the system will attempt to boot from the next defined drive.
3.7.2 Network Boot
The network can be selected as a boot device. This selection allows booting from the onboard LAN
or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key
during POST, the User Access Level in the BIOS Setup program's Security menu must be
set to Full.
3.7.3 Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing the POST, the
operating system loader is invoked even if the following devices are not present:
• Video adapter
• Keyboard
• Mouse
3.7.4 Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu
displays the list of available boot devices (as set in the BIOS setup program’s Boot Device Priority
Submenu). Table 39 lists the boot device menu options.
Table 39. Boot Device Menu Options
Boot Device Menu Function Keys Description
<↑> or <↓>
<Enter> Exits the menu, saves changes, and boots from the selected device
<Esc> Exits the menu without saving changes
Selects a default boot device
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Intel Desktop Board D102GGC2 Technical Product Specification
3.8 Adjusting Boot Speed
These factors affect system boot speed:
• Selecting and configuring peripherals properly
• Optimized BIOS boot parameters
3.8.1 Peripheral Selection and Configuration
The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” less than eight seconds,
that minimize hard drive startup delays.
• Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode
changes in POST. These features may add time to the boot process.
• Try different monitors. Some monitors initialize and communicate with the BIOS more
quickly, which enables the system to boot more quickly.
3.8.2 BIOS Boot Optimizations
Use of the following BIOS Setup program settings reduces the POST execution time.
• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the POST does
not first seek a diskette drive, which saves about one second from the POST execution time.
• In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This
can reduce up to four seconds of option ROM boot time.
NOTE
It is possible to optimize the boot process to the point where the system boots so quickly that the
Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives
with minimum initialization times can also contribute to a boot time that might be so fast that
necessary logo screens and POST messages cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If this condition
should occur, it is possible to introduce a programmable delay ranging from three to 30 seconds
(using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration Submenu
of the BIOS Setup program).
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Overview of BIOS Features
3.9 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program and who can
boot the computer. A supervisor password and a user password can be set for the BIOS Setup
program and for booting the computer, with the following restrictions:
• The supervisor password gives unrestricted access to view and change all the Setup options in
the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the BIOS Setup
program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password prompt of the
BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the supervisor password
or the user password to access Setup. Users have access to Setup respective to which password
is entered.
• Setting the user password restricts who can boot the computer. The password prompt will be
displayed before the computer is booted. If only the supervisor password is set, the computer
boots without asking for a password. If both passwords are set, the user can enter either
password to boot the computer.
• For enhanced security, use different passwords for the supervisor and user passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in
length.
Table 40 shows the effects of setting the supervisor password and user password. This table is for
reference only and is not displayed on the screen.
Table 40. Supervisor and User Password Functions
Password Set
Neither Can change all
Supervisor
only
User only N/A Can change all
Supervisor
and user set
Note: If no password is set, any user can change all Setup options.
Supervisor
Mode
(Note)
options
Can change all
options
Can change all
options
User Mode Setup Options
Can change all
options
Can change a
limited number
of options
options
Can change a
limited number
of options
(Note)
None None None
Supervisor Password Supervisor None
Enter Password
Clear User Password
Supervisor Password
Enter Password
Password to
Enter Setup
User User
Supervisor or
user
Password
During Boot
Supervisor or
user
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Intel Desktop Board D102GGC2 Technical Product Specification
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4 Error Messages and Beep Codes
What This Chapter Contains
4.1 Speaker ....................................................................................................................... 75
4.2 BIOS Beep Codes........................................................................................................75
4.3 BIOS Error Messages..................................................................................................75
4.4 Port 80h POST Codes .................................................................................................76
4.1 Speaker
The board-mounted speaker provides audible error code (beep code) information during POST.
For information about Refer to
The location of the onboard speaker Figure 1, page 12
4.2 BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS displays an error message describing
the problem (see Table 41).
Table 41. Beep Codes
Type Pattern Frequency
Memory error Three long beeps 1280 Hz
Thermal warning Four alternating beeps:
High tone, low tone, high tone, low tone
High tone: 2000 Hz
Low tone: 1600 Hz
4.3 BIOS Error Messages
Table 42 lists the error messages and provides a brief description of each.
Table 42. BIOS Error Messages
Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have
been corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory was
removed then memory may be bad.
No Boot Device Available System did not find a device to boot.
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Intel Desktop Board D102GGC2 Technical Product Specification
4.4 Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST-codes) to I/O port 80h. If
the POST fails, execution stops and the last POST code generated is left at port 80h. This code is
useful for determining the point where an error occurred.
Displaying the POST-codes requires a PCI bus add-in card, often called a POST card. The POST
card can decode the port and display the contents on a medium such as a seven-segment display.
NOTE
The POST card must be installed in PCI bus connector 1.
The following tables provide information about the POST codes generated by the BIOS:
• Table 43 lists the Port 80h POST code ranges
• Table 44 lists the Port 80h POST codes themselves
• Table 45 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 43. Port 80h POST Code Ranges
Range Category/Subsystem
00 – 0F Debug codes: Can be used by any PEIM/driver for debug.
10 – 1F Host Processors: 1F is an unrecoverable CPU error.
20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 – 3F Recovery: 3F indicated recovery failure.
40 – 4F Reserved for future use.
50 – 5F I/O Busses: PCI, USB, ISA, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 – 6F Reserved for future use (for new busses).
70 – 7F Output Devices: All output consoles. 7F is an unrecoverable error.
80 – 8F Reserved for future use (new output console codes).
90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 – AF Reserved for future use (new input console codes).
B0 – BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 – CF Reserved for future use.
D0 – DF Boot device selection.
E0 – FF F0 – FF: FF processor exception.
E0 – EE: Miscellaneous codes. See Table 44.
EF boot/S3: resume failure.
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Error Messages and Beep Codes
Table 44. Port 80h POST Codes
POST Code Description of POST Operation
10 Power-on initialization of the host processor (Boot Strap Processor)
11 Host processor Cache initialization (including APs)
12 Starting Application processor initialization
13 SMM initialization
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
24 Programming timing parameters in the memory controller and the DIMMs
25 Configuring memory
26 Optimizing memory settings
27 Initializing memory, such as ECC init
28 Testing memory
50 Enumerating PCI busses
51 Allocating resources to PCI bus
52 Hot Plug PCI controller initialization
53 – 57 Reserved for PCI Bus
58 Resetting USB bus
59 Reserved for USB
5A Resetting PATA/SATA bus and all devices
5B Reserved for ATA
5C Resetting SMBUS
5D Reserved for SMBUS
70 Resetting the VGA controller
71 Disabling the VGA controller
72 Enabling the VGA controller
78 Resetting the console controller
79 Disabling the console controller
7A Enabling the console controller
Host Processor
Chipset
Memory
PCI Bus
USB
ATA/ATAPI/SATA
SMBus
Local Console
Remote Console
continued
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Intel Desktop Board D102GGC2 Technical Product Specification
Table 44. Port 80h POST Codes (continued)
POST Code Description of POST Operation
90 Resetting keyboard
91 Disabling keyboard
92 Detecting presence of keyboard
93 Enabling keyboard
94 Clearing keyboard input buffer
95 Instructing keyboard controller to run Self Test (PS2 only)
98 Resetting mouse
99 Disabling mouse
9A Detecting presence of mouse
9B Enabling mouse
B0 Resetting fixed media
B1 Disabling fixed media
B2 Detecting presence of a fixed media (IDE hard drive detect ion etc.)
B3 Enabling/configuring a fixed media
B8 Resetting removable media
B9 Disabling removable media
BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.)
BC Enabling/configuring a removable media
Dy Trying boot selection y (y=0 to 15)
E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2 Permanent memory found
E1, E3 Reserved for PEI/PEIMs
E4 Entered DXE phase
E5 Started dispatching drivers
E6 Started connecting drivers
Keyboard (PS2 or USB)
Mouse (PS2 or USB)
Fixed Media
Removable media
PEI Core
DXE Core
BDS
continued
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Table 44. Port 80h POST Codes (continued)
POST Code Description of POST Operation
E7 Waiting for user input
E8 Checking password
E9 Entering BIOS setup
EA TBD – Flash Update
EB Calling Legacy Option ROMs
EE TBD – Calling INT 19. One beep unless silent boot is enabled
EF TBD – Unrecoverable Boot failure/S3 resume failure
Runtime Phase/EFI OS Boot
F4 Entering Sleep state
F5 Exiting Sleep state
F8 EFI boot service ExitBootServices ( ) has been called
F9 EFI runtime service SetVirtualAddressMap ( ) has been called
FA EFI runtime service ResetSystem ( ) has been called
30 Crisis Recovery has initiated per User request
31 Crisis Recovery has initiated by software (corrupt flash)
34 Loading recovery capsule
35 Handing off control to the recovery capsule
3F Unable to recover
DXE Drivers
PEIMs/Recovery
Error Messages and Beep Codes
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Intel Desktop Board D102GGC2 Technical Product Specification
Table 45. Typical Port 80h POST Sequence
POST Code Description
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
25 Configuring memory
28 Testing memory
34 Loading recovery capsule
E4 Entered DXE phase
12 Starting Application processor initialization
13 SMM initialization
50 Enumerating PCI busses
51 Allocating resourced to PCI bus
92 Detecting the presence of the keyboard
90 Resetting keyboard
94 Clearing keyboard input buffer
95 Keyboard Self Test
EB Calling Video BIOS
58 Resetting USB bus
5A Resetting PATA/SATA bus and all devices
92 Detecting the presence of the keyboard
90 Resetting keyboard
94 Clearing keyboard input buffer
5A Resetting PATA/SATA bus and all devices
28 Testing memory
90 Resetting keyboard
94 Clearing keyboard input buffer
E7 Waiting for user input
01 INT 19
00 Ready to boot
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