Intel BLKNUC7I7BNB User Manual

0 (0)

Intel® NUC Board NUC7i5BNB and

Intel® NUC Board NUC7i7BNB

Technical Product Specification

October 2017

Order Number: J59951-006

Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata, if any, are documented in Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB Specification Update.

Revision History

Revision

Revision History

Date

 

 

 

001

First release of the Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB

March 2017

 

Technical Product Specification

 

 

 

 

002

Spec Change

May 2017

 

 

 

003

Spec change

June 2017

 

 

 

004

Spec change

June 2017

 

 

 

005

Spec change

June 2017

 

 

 

006

Spec change

October 2017

 

 

 

Disclaimer

This product specification applies to only the standard Intel NUC Board with BIOS identifier BNKBL357.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:

Learn About Intel® Processor Numbers

Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries. * Other names and brands may be claimed as the property of others.

Copyright 2017 Intel Corporation. All rights reserved.

Board Identification Information

Basic Intel® NUC Board NUC7i5BNB Identification Information

AA Revision

BIOS Revision

Notes

 

 

 

J31144-301

BNKBL357.86A

1,2

 

 

 

Notes:

 

 

1.The AA number is found on a small label on the component side of the board.

2.The Intel® Core™ i5-7260U processor is used on this AA revision consisting of the following component:

Device

Stepping

S-Spec Numbers

 

 

 

Intel Core i5

J1

SR363

 

 

 

Basic Intel® NUC Board NUC7i7BNB Identification Information

AA Revision

BIOS Revision

Notes

 

 

 

J31145-301

BNKBL357.86A

1,2

 

 

 

Notes:

 

 

1.The AA number is found on a small label on the component side of the board.

2.The Intel® Core™ i7-7567U processor is used on this AA revision consisting of the following component:

Device

Stepping

S-Spec Numbers

 

 

 

Intel Core i7

J1

SR367

 

 

 

Product Identification Information

Intel® NUC Products NUC7i{x}BN{x} Identification Information

Product Name

Intel® NUC

Differentiating Features

 

Board

 

 

 

 

NUC7i5BNK

 

Kit with power adapter

 

 

 

NUC7i5BNH

 

HDD kit with power adapter

 

 

 

NUC7i5BNHX1

NUC7i5BNB

HDD kit with power adapter, 16GB Intel® Optane™ Module

 

 

NUC7i5BNHXF

J31144-xxx

HDD kit with power adapter, 16GB Intel® Optane™ Module, 1TB HDD,

 

4GB DDR4-2400 SDRAM[1], Microsoft Windows 10 Home

 

 

NUC7i5BNKP

 

HDD k.it with power adapter, Intel® 600p M.2 NVMe SSD, 4GB DDR4-

 

 

2400 SDRAM[1], Microsoft Windows 10 Home

NUC7i7BNH

 

HDD kit with power adapter

 

 

 

NUC7i7BNHX1

 

HDD kit with power adapter, 32GB Intel® Optane™ Module

 

NUC7i7BNB

 

NUC7i7BNHXG

32GB Intel® Optane™ Module, 2TB HDD, 8GB DDR4-2400 SDRAM[1],

 

J31145-xxx

Microsoft* Windows* 10 Home,

 

 

 

NUC7i7BNKQ

 

Intel® 600p M.2 NVMe SSD, 8GB DDR4-2400 SDRAM[1], Microsoft*

 

 

Windows* 10 Home

 

 

 

Notes:

 

 

1.The maximum supported memory speed of the Intel NUC board NUC7i[x]BNB is 2133 MHz Memory modules of higher speeds will be down-clocked to 2133 MHz

iii

Intel NUC Board NUC7i5BNB, Intel NUC Board NUC7i7BNB Technical Product Specification

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB.

Specification Changes or Clarifications

Date

Type of Change

Description of Changes or Clarifications

 

 

 

May 2017

Specification

Remove reference to "RAID 0 auto replace" in the Intel® Rapid Storage

 

Change

Technology / SATA RAID section.

 

 

 

 

June 2017

Specification

Replace Figure 3 on page 21

 

Change

Change all references of HDMI 2.0 to HDMI 2.0a:

 

 

On page 15 in the audio section

 

 

On page 25 in section 1.5.1.3

 

 

On page 27 in section 1.5.1.5

 

 

In the Thunderbolt 3 section (1.8) on page 30:

 

 

The last sentence says “Item J in Figure 12 shows…” is changed to “Item A

 

 

 

in Figure 11 shows…”

 

 

On page 3, change the Product Identification matrix to include 2 new rows

 

 

 

for NUC7i5BNHX1 and NUC7i7BNHX1

 

 

 

June 2017

Specification

Revised step 3 of “Power Button Menu” section

 

Change

 

 

 

 

 

June 2017

Specification

Corrected block diagram in Figure 3

 

Change

 

 

 

 

 

 

October 2017

Specification

Updated Product Identification table

 

Change

Updated section 1.5.1.7 “Integrated Audio Provided by the HDMI…” to

 

 

 

change 192Khz/24 bit to “176.4kHz/24 bit

 

 

 

 

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.

iv

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Board NUC7i5BNB and Intel® NUC Board NUC7i7BNB.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel® NUC Board NUC7i5BNB and Intel® NUC Board NUC7i7BNB and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter

Description

 

 

1

A description of the hardware used on Intel NUC Board NUC7i5BNB and Intel NUC Board

 

NUC7i7BNB

 

 

2

A map of the resources of the Intel NUC Board

 

 

3

The features supported by the BIOS Setup program

 

 

4

A description of the BIOS error messages, beep codes, and POST codes

 

 

5

A description of the Intel NUC kit NUC7i5BN[x] and Intel NUC kit NUC7i7BNH features

 

 

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

v

Intel NUC Board NUC7i5BNB, Intel NUC Board NUC7i7BNB Technical Product Specification

Other Common Notation

#

Used after a signal name to identify an active-low signal (such as USBP0#)

 

 

GB

Gigabyte (1,073,741,824 bytes)

 

 

GB/s

Gigabytes per second

 

 

Gb/s

Gigabits per second

 

 

KB

Kilobyte (1024 bytes)

 

 

Kb

Kilobit (1024 bits)

 

 

kb/s

1000 bits per second

 

 

MB

Megabyte (1,048,576 bytes)

 

 

MB/s

Megabytes per second

 

 

Mb

Megabit (1,048,576 bits)

 

 

Mb/s

Megabits per second

 

 

TDP

Thermal Design Power

 

 

Xxh

An address or data value ending with a lowercase h indicates a hexadecimal value.

 

 

x.x V

Volts. Voltages are DC unless otherwise specified.

*This symbol is used to indicate third-party brands and names that are the property of their respective owners.

vi

Contents

Revision History...............................................................................................................

ii

Disclaimer ..................................................................................................................................................................

ii

Board Identification Information.....................................................................................................................

iii

Product Identification Information.................................................................................................................

iii

Errata...........................................................................................................................................................................

iv

Preface ...............................................................................................................................

 

v

Intended Audience.................................................................................................................................................

v

What This Document Contains.........................................................................................................................

v

Typographical Conventions ...............................................................................................................................

v

Contents ..........................................................................................................................

 

vii

1 Product Description ...............................................................................................

13

1.1

Overview ......................................................................................................................................................

13

 

1.1.1

Feature Summary ..................................................................................................................

13

 

1.1.2

Board Layout (Top) ...............................................................................................................

15

 

1.1.3

Board Layout (Bottom) ........................................................................................................

17

 

1.1.4

Block Diagram.........................................................................................................................

19

1.2

Online Support..........................................................................................................................................

20

1.3

Processor.....................................................................................................................................................

20

1.4

System Memory ........................................................................................................................................

21

1.5

Processor Graphics Subsystem..........................................................................................................

23

 

1.5.1

Integrated Graphics ..............................................................................................................

23

1.6

USB.................................................................................................................................................................

 

26

1.7

SATA Interface...........................................................................................................................................

26

 

1.7.1

AHCI Mode................................................................................................................................

27

 

1.7.2

Intel® Rapid Storage Technology / SATA RAID .........................................................

27

 

1.7.3

Intel® Next Generation Storage Acceleration.............................................................

27

1.8

Thunderbolt 3............................................................................................................................................

28

1.9

Real-Time Clock Subsystem................................................................................................................

28

1.10 Audio Subsystem .....................................................................................................................................

28

 

1.10.1

Audio Subsystem Software ...............................................................................................

29

1.11 LAN Subsystem.........................................................................................................................................

29

 

1.11.1

Intel® I219V Gigabit Ethernet Controller .....................................................................

29

 

1.11.2

LAN Subsystem Software...................................................................................................

30

 

1.11.3

RJ-45 LAN Connector with Integrated LEDs..............................................................

31

 

1.11.4

Wireless Network Module..................................................................................................

32

1.12 Hardware Management Subsystem .................................................................................................

32

 

1.12.1

Hardware Monitoring ...........................................................................................................

32

vii

 

1.12.2

Fan Monitoring........................................................................................................................

32

 

1.12.3

Thermal Solution...................................................................................................................

32

1.13

Power Management ................................................................................................................................

34

 

1.13.1

ACPI.............................................................................................................................................

34

 

1.13.2

Hardware Support.................................................................................................................

37

1.14

Intel Platform Security Technologies ..............................................................................................

39

 

1.14.1

Intel® Virtualization Technology......................................................................................

39

 

1.14.2 Intel® Platform Trust Technology ...................................................................................

39

2 Technical Reference...............................................................................................

41

2.1

Memory Resources ..................................................................................................................................

41

 

2.1.1

Addressable Memory...........................................................................................................

41

2.2

Connectors and Headers.......................................................................................................................

41

 

2.2.1

Front Panel Connectors ......................................................................................................

42

 

2.2.2

Back Panel Connectors .......................................................................................................

42

 

2.2.3

Headers and Connectors (Top)........................................................................................

43

 

2.2.4

Connectors and Headers (Bottom).................................................................................

44

2.3

BIOS Security Jumper ............................................................................................................................

56

2.4

Mechanical Considerations ..................................................................................................................

59

 

2.4.1

Form Factor..............................................................................................................................

59

2.5

Electrical Considerations ......................................................................................................................

60

 

2.5.1

Power Supply Considerations..........................................................................................

60

 

2.5.2

Fan Header Current Capability.........................................................................................

60

2.6

Thermal Considerations........................................................................................................................

61

2.7

Reliability .....................................................................................................................................................

66

2.8

Environmental ...........................................................................................................................................

66

3 Overview of BIOS Features...................................................................................

67

3.1

Introduction................................................................................................................................................

67

3.2

BIOS Flash Memory Organization .....................................................................................................

68

3.3

System Management BIOS (SMBIOS)..............................................................................................

68

3.4

Legacy USB Support ...............................................................................................................................

68

3.5

BIOS Updates.............................................................................................................................................

69

 

3.5.1

Language Support.................................................................................................................

69

3.6

BIOS Recovery ...........................................................................................................................................

69

3.7

Boot Options ..............................................................................................................................................

71

 

3.7.1

Network Boot...........................................................................................................................

71

 

3.7.2

Booting Without Attached Devices ................................................................................

71

 

3.7.3

Changing the Default Boot Device During POST......................................................

71

 

3.7.4

Power Button Menu..............................................................................................................

72

3.8

Hard Disk Drive Password Security Feature..................................................................................

73

3.9

BIOS Security Features ..........................................................................................................................

74

4 Error Messages and Blink Codes.........................................................................

75

4.1 Front-panel Power LED Blink Codes................................................................................................

75

viii

 

 

Contents

4.2

BIOS Error Messages...............................................................................................................................

75

5 Intel NUC Kit Features ...........................................................................................

76

5.1

Chassis Front Panel Features..............................................................................................................

76

5.3

Chassis Rear Panel Features................................................................................................................

78

ix

Figures

 

Figure 1. Major Board Components (Top) .......................................................................................................

15

Figure 2. Major Board Components (Bottom) ................................................................................................

17

Figure 3. Block Diagram...........................................................................................................................................

19

Figure 4. Memory Channel and SO-DIMM Configuration..........................................................................

22

Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ...............................................................................

29

Figure 6. LAN Connector LED Locations...........................................................................................................

31

Figure 7. Thermal Solution and Fan Header...................................................................................................

33

Figure 8. Location of the Standby Power LED ...............................................................................................

38

Figure 9. Front Panel Connectors........................................................................................................................

42

Figure 10. Back Panel Connectors ......................................................................................................................

42

Figure 11. Headers and Connectors (Top).......................................................................................................

43

Figure 12. Connectors and Headers (Bottom) ...............................................................................................

44

Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch) ............................................

50

Figure 14. Connection Diagram for the Internal USB 2.0 Single-Port Header (1.25 mm Pitch)54

Figure 15. Location of the CIR Sensor...............................................................................................................

54

Figure 16. Location of the BIOS Security Jumper ........................................................................................

57

Figure 17. Board Dimensions................................................................................................................................

59

Figure 18. Board Height Dimensions .................................................................................................................

60

Figure 19. Localized High Temperature Zones .............................................................................................

62

Figure 20. Installation Area of Thermal Pad for Intel NUC Kit NUC7i5BNK ......................................

63

Figure 21. Installation area of Thermal Pad for Intel NUC Kit NUC7i5BNH/NUC7i7BNH............

64

Figure 22. Intel NUC Kit NUC7i5BNH/NUC7i7BNH Features – Front ....................................................

76

Figure 23. Intel NUC Kit NUC7i5BNK Features – Front................................................................................

77

Figure 24. Intel NUC Kit NUC7i5BNH/NUC7i7BNH Features – Rear......................................................

78

Figure 25. Intel NUC Kit NUC7i5BNK Features – Rear .................................................................................

79

Tables

 

Table 1. Feature Summary.....................................................................................................................................

13

Table 2. Components Shown in Figure 1.........................................................................................................

16

Table 3. Components Shown in Figure 2.........................................................................................................

18

Table 4. Supported Memory Configurations..................................................................................................

21

Table 5. Unsupported Memory Configurations.............................................................................................

21

Table 6. DisplayPort Multi-Streaming Resolutions......................................................................................

24

Table 7. Multiple Display Configuration Maximum Resolutions ............................................................

25

Table 8. Audio Formats Supported by the HDMI and Type C Interfaces ...........................................

25

Table 9. LAN Connector LED States...................................................................................................................

31

Table 10. Effects of Pressing the Power Switch............................................................................................

34

Table 11. Power States and Targeted System Power.................................................................................

35

Table 12. Wake-up Devices and Events ...........................................................................................................

36

Table 13. Headers and Connectors Shown in Figure 11...........................................................................

43

Table 14. Connectors and Headers Shown in Figure 12...........................................................................

45

Table 15. SATA Power Connector (1.25 mm pitch).....................................................................................

46

x

 

Contents

Table 16. Single-Port Internal USB 2.0 Header (1.25 mm pitch) ...........................................................

46

Table 17. M.2 2280 Module (key type M) Connector..................................................................................

46

Table 18. Digital Microphone (DMICS) Array Connector (1.25 mm Pitch)..........................................

47

Table 19. Front Panel HDD LED Ring Connector (1.25 mm Pitch) ........................................................

48

Table 20. CEC Header (1.25 mm pitch).............................................................................................................

48

Table 21. Front Panel Header (2.0 mm Pitch)................................................................................................

49

Table 22. States for a One-Color Power LED .................................................................................................

50

Table 23. States for a Dual-Color Power LED ................................................................................................

50

Table 24. SDXC Card Reader Connector..........................................................................................................

52

Table 25. HDMI CEC expected behavior............................................................................................................

55

Table 26. Front Panel LED Ring Options..........................................................................................................

55

Table 27. Fan Header Current Capability.........................................................................................................

60

Table 28. Thermal Considerations for Components...................................................................................

65

Table 29. Tcontrol Values for Components ...................................................................................................

65

Table 30. Environmental Specifications...........................................................................................................

66

Table 31. Acceptable Drives/Media Types for BIOS Recovery ...............................................................

70

Table 32. Boot Device Menu Options................................................................................................................

71

Table 33. Master Key and User Hard Drive Password Functions...........................................................

73

Table 34. Supervisor and User Password Functions...................................................................................

74

Table 35. Front-panel Power LED Blink Codes .............................................................................................

75

Table 36. Components Shown in Figure 22 ...................................................................................................

76

Table 37. Components Shown in Figure 23 ...................................................................................................

77

Table 38. Components Shown in Figure 24 ...................................................................................................

78

Table 39. Components Shown in Figure 25 ...................................................................................................

79

xi

1 Product Description

1.1Overview

1.1.1Feature Summary

Table 1 summarizes the major features of Intel® NUC Board NUC7i5BNB and Intel® NUC Board NUC7i7BNB.

Table 1. Feature Summary

Form Factor

4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

 

 

Processor

• A soldered-down 7th generation Intel® Core™ i5-7260U dual-core processor with up to a

 

 

maximum 15 W TDP (if thermal margin available)

 

 

― Intel® Iris™ Plus Graphics 640

 

 

― Integrated memory controller

 

 

― Integrated PCH

 

• A soldered-down 7th generation Intel® Core™ i7-7567U dual-core processor with up to a

 

 

maximum 28 W TDP (if thermal margin available)

 

 

― Intel® Iris™ Plus Graphics 650

 

 

― Integrated memory controller

 

 

― Integrated PCH

 

 

Memory

• Two 260-pin 1.2 V DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM)

 

 

sockets

 

• Support for DDR4 1866/2133 MHz SO-DIMMs

 

• Support for 4 Gb and 8 Gb memory technology

 

• Support for up to 32 GB of system memory with two SO-DIMMs using 8 Gb memory

 

 

technology

 

• Support for non-ECC memory

 

• Support for 1.2 V low voltage JEDEC memory only

 

Note: 2 Gb memory technology (SDRAM Density) is not compatible

 

 

Graphics

• Integrated graphics support for processors with Intel® Graphics Technology:

 

 

― One High Definition Multimedia Interface* (HDMI*) back panel connector

 

 

― One Type C back panel connector

 

 

Audio

• Intel® High Definition (Intel® HD) Audio via the HDMI v2.0 and Type-C interfaces through

 

 

the processor

 

• Realtek HD Audio via a stereo microphone/headphone 3.5 mm jack on the front panel

 

• Digital microphone array (DMICS) connector (internal)

 

 

 

Storage

SATA ports:

 

 

― One SATA 6.0 Gb/s port (black) for 2.5“ storage device

 

One SATA 6.0 Gb/s port is reserved for an M.2 storage module supporting M.2 2242 and

 

 

M.2 2280 (key type M and B+M) modules

 

Note: Supports key type M and B+M (PCI Express* x1/x2/x4 and SATA)

 

 

 

 

 

continued

13

Table 1. Feature Summary (continued)

Peripheral Interfaces

• One USB 3.1 (Gen 2) port implemented via the external back panel Type C connector

 

USB 3.0 ports:

 

 

• Two ports are implemented with external front panel connectors (one blue and one

 

 

orange charging capable)

 

 

• Two ports are implemented with external back panel connectors (blue)

 

USB 2.0 ports:

 

 

• Two ports via two single-port internal 1x4 1.25 mm pitch headers (white)

 

 

• One port is reserved for the M.2 2230 Wireless module

 

Consumer Infrared (CIR)

 

 

Expansion Capabilities

• One M.2 connector supporting M.2 2242 and M.2 2280 (key type M and B+M) modules

 

• One Micro SDXC slot

 

• One Thunderbolt™ 3 via back panel Type C connector

 

 

BIOS

• Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device

 

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and

 

 

System Management BIOS (SMBIOS)

 

 

Instantly Available PC

• Suspend to RAM support

Technology

• Wake on PCI Express, LAN, front panel, CIR, and USB ports

 

 

LAN

Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® I219V Gigabit Ethernet

 

Controller

 

 

Hardware Monitor

Hardware monitoring subsystem, based on a ITE Tech. IT8987E-VG embedded controller,

Subsystem

including:

 

• Voltage sense to detect out of range power supply voltages

 

• Thermal sense to detect out of range thermal values

 

• One processor fan header

 

• Fan sense input used to monitor fan activity

 

Fan speed control

 

 

Wireless

Intel® Dual Band Wireless-AC 8265

 

• 802.11ac, Dual Band, 2x2 Wi-Fi + Bluetooth 4.2

 

• Maximum Transfer speed up to 867Mbps

 

• Supports Intel® Smart Connect Technology

 

 

 

14

Product Description

1.1.2Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB.

Figure 1. Major Board Components (Top)

15

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Item from Figure 1

Description

 

 

A

Type C connector

 

 

B

Processor fan header

 

 

C

Battery

 

 

D

Thermal solution

 

 

16

Product Description

1.1.3Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB.

Figure 2. Major Board Components (Bottom)

17

Table 3. Components Shown in Figure 2

Item from

 

Figure 2

Description

 

 

A

Back panel connectors

 

 

B

Front panel header

 

 

C

Digital microphone array connector

 

 

D

Front panel LED ring connector

 

 

E

Intel Dual Band Wireless AC + Bluetooth 8265 module

 

 

F

Micro SDXC slot

 

 

G

M.2 connector (key type M and B+M) for 2242 and 2280 modules

 

 

H

Front panel single-port USB 2.0 header (1.25 mm pitch)

 

 

I

Front panel single-port USB 2.0 header (1.25 mm pitch)

 

 

J

Consumer Infrared (CIR) sensor

 

 

K

Front panel USB 3.0 connector (blue)

 

 

L

SATA 6.0 Gb/s connector

 

 

M

Front panel USB 3.0 connector (orange, charging)

 

 

N

SATA power connector (1.25 mm pitch)

 

 

O

Front panel stereo microphone/headphone jack

 

 

P

Front panel power button

 

 

Q

BIOS security jumper

 

 

R

Consumer electronics control (CEC) header

 

 

S

DDR4 SO-DIMM sockets

 

 

18

Intel BLKNUC7I7BNB User Manual

Product Description

1.1.4Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Figure 3. Block Diagram

19

1.2Online Support

To find information about…

Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB

Intel NUC Support

Available configurations for Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB

Product support page NUC7i5BNK

Product support page NUC7i5BNH

Product support page NUC7i7BNH

BIOS and driver updates

BIOS and driver updates for NUC7i5BNK

BIOS and driver updates for NUC7i5BNH

BIOS and driver updates for NUC7i7BNH

Tested memory

Integration information

Processor datasheet

Visit this World Wide Web site:

http://www.intel.com/NUC

http://www.intel.com/NUCSupport

http://ark.intel.com

http://www.intel.com/content/www/us/en/support/boards-and- kits/intel-nuc-kits/intel-nuc-kit-nuc7i5bnk.html

http://www.intel.com/content/www/us/en/support/boards-and- kits/intel-nuc-kits/intel-nuc-kit-nuc7i5bnh.html

http://www.intel.com/content/www/us/en/support/boards-and- kits/intel-nuc-kits/intel-nuc-kit-nuc7i7bnh.html

http://downloadcenter.intel.com https://downloadcenter.intel.com/product/95061 https://downloadcenter.intel.com/product/95067 https://downloadcenter.intel.com/product/95065

http://www.intel.com/content/www/us/en/support/boards-and- kits/000023165.html

http://www.intel.com/NUCSupport http://ark.intel.com

1.3Processor

A soldered-down 7th generation Intel® Core™ i5-7260U dual-core processor with up to a maximum 15 W TDP (if thermal margin is available).

Intel® Iris™ Plus Graphics 640

Integrated memory controller

Integrated PCH

A soldered-down 7th generation Intel® Core™ i7-7567U dual-core processor with up to a maximum 28 W TDP (if thermal margin is available).

Intel® Iris™ Plus Graphics 650

Integrated memory controller

Integrated PCH

NOTE

There are specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 60 for information on power supply requirements.

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Product Description

1.4System Memory

The board has two 260-pin SO-DIMM sockets and supports the following memory features:

1.2 V DDR4 SDRAM SO-DIMMs with gold plated contacts

Two independent memory channels with interleaved mode support

Unbuffered, single-sided or double-sided SO-DIMMs

32 GB maximum total system memory (with 8 Gb memory technology). Refer to Section 2.1.1 on page 41 for information on the total amount of addressable memory.

Minimum recommended total system memory: 2048 MB

Non-ECC SO-DIMMs

Serial Presence Detect

DDR4 1866/2133 MHz SDRAM SO-DIMMs

Supports 4 Gb and 8Gb memory technology (SDRAM Density)

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency.

NOTE

Intel NUC Board NUC7i3BNB supports only 4 Gb and 8 Gb memory technologies (also referred to as “SDRAM density”). Table 4 lists the supported SO-DIMM configurations. Table 5 lists the SODIMM configurations that are not supported.

Table 4. Supported Memory Configurations

SO-DIMM

 

SDRAM

SDRAM Organization

Number of SDRAM

Capacity

Configuration (Note)

Density

Front-side/Back-side

Devices

2048 MB

SS

4 Gbit

512 M x4/empty

4

4096 MB

DS

4 Gbit

512 M x4/512 M x4

8

4096 MB

SS

8 Gbit

1024 M x4/empty

4

8192 MB

DS

4 Gbit

512 M x8/512 M x8

16

8192 MB

DS

8 Gbit

1024 M x4/1024 M x4

8

16384 MB

DS

8 Gbit

1024 M X8/1024 M x8

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Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

Table 5. Unsupported Memory Configurations

SO-DIMM

 

SDRAM

SDRAM Organization

Number of SDRAM

Capacity

Configuration (Note)

Density

Front-side/Back-side

Devices

1024 MB

SS

1 Gbit

128 M x8/empty

8

2048 MB

DS

1 Gbit

128 M x8/128 M x8

16

2048 MB

SS

2 Gbit

256 M x8/empty

8

4096 MB

DS

2 Gbit

256 M x8/256 M x8

16

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

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For information about…

Refer to:

 

 

Tested Memory

http://www.intel.com/content/www/us/en/support/boards-and-

 

kits/000023165.html

 

 

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

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Product Description

1.5Processor Graphics Subsystem

The NUC7i5BNB board supports graphics through Intel Iris™ Plus Graphics 640 and NUC7i7BNB board supports graphics through Intel Iris™ Plus Graphics 650.

1.5.1Integrated Graphics

The board supports integrated graphics via the processor.

1.5.1.1Intel® High Definition (Intel® HD) Graphics

The Intel Iris™ Plus graphics controller features the following:

3D Features

DirectX* 12.1 support

OpenGL* 5.0 support

OpenCL* 2.1 support

Next Generation Intel® Clear Video Technology HD support is a collection of video playback and enhancement features that improve the end user’s viewing experience

Encode/transcode HD content

Playback of high definition content including Blu-ray* disc

Superior image quality with sharper, more colorful images

DirectX* Video Acceleration (DXVA) support for accelerating video processing

Full AVC/VC1/MPEG2/HEVC HW Encode/Decode

Intel HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)

NOTE

Intel Quick Sync Video is enabled by an appropriate software application.

1.5.1.2Video Memory Allocation

Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount). When memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses.

1.5.1.3High Definition Multimedia Interface* (HDMI*)

The HDMI port supports standard, enhanced, or high definition video, plus multi-channel digital audio on a single cable. The port is compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats. The maximum supported resolution is 4096 x 2160 @ 60 Hz, 24bpp. The HDMI port is compliant with the HDMI 2.0 specification.

For information about

Refer to

 

 

HDMI technology

http://www.hdmi.org

 

 

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1.5.1.4DisplayPort* via USB Type-C

DisplayPort is a digital communication interface that utilizes differential signaling to achieve a high bandwidth bus interface designed to support connections between PCs and monitors, projectors, and TV displays. DisplayPort is suitable for display connections between consumer electronics devices such as high definition optical disc players, set top boxes, and TV displays. The maximum supported resolution is 4096 x 2304 @ 60 Hz, 24bpp. DisplayPort via USB Type-C connector is compliant with the DisplayPort 1.2 specification.

DisplayPort output supports Multi-Stream Transport (MST) which allows for multiple independent video streams (daisy-chain connection with multiple monitors) over a single DisplayPort. This will require the use of displays that support DisplayPort 1.2 and allow for this feature.

For information about

Refer to

 

 

DisplayPort technology

http://www.displayport.org

 

 

1.5.1.4.1DisplayPort 1.2 Multi-Stream Transport Daisy-Chaining

Table 6 lists the maximum resolutions available when using DisplayPort 1.2 Multi-Stream Transport.

Table 6. DisplayPort Multi-Streaming Resolutions

DisplayPort Usage Models

Monitor 1

Monitor 2

Monitor 3

 

 

 

 

3 Monitors

1920 x 1200 @ 60 Hz

1920 x 1080 @ 60 Hz

1920 x 1080 @ 60 Hz

 

 

 

 

2 Monitors

2560 x 1600 @ 60 Hz

2560 x 1600 @ 60 Hz

 

 

 

 

 

3 Monitors

1920 x 1080 @ 60 Hz

1920 x 1080 @ 60 Hz

1920 x 1080 @ 60 Hz

(with DisplayPort 1.2 hub)

 

 

 

 

 

 

 

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