Intel BLKNUC7I7BNB User Manual

Intel® NUC Board NUC7i5BNB and Intel® NUC Board NUC7i7BNB

Technical Product Specification

October 2017

Order Number: J59951-006

Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata, if any, are documented in Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB Specification Update.

Revision History

003

Spec change

June 2017

004

Spec change

June 2017

005

Spec change

June 2017

Revision Revision History Date

001 First release of the Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB

Technical Product Specification

002 Spec Change May 2017

006 Spec change October 2017

Disclaimer

This product specification applies to only the standard Intel NUC Board with BIOS identifier BNKBL357.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:

Learn About Intel

Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

Processor Numbers

March 2017

Board Identification Information

AA Revision

BIOS Revision

Notes

J31144-301

BNKBL357.86A

1,2

Device

Stepping

S-Spec Numbers

Intel Core i5

SR363

AA Revision

BIOS Revision

Notes

J31145-301

BNKBL357.86A

1,2

Device

Stepping

S-Spec Numbers

Intel Core i7

SR367

Product Name

Intel® NUC

Differentiating Features

NUC7i5BNK

Kit with power adapter

NUC7i5BNHX1

HDD kit with power adapter, 16GB Intel® Optane™ Module

NUC7i5BNHXF

HDD kit with power adapter, 16GB Intel® Optane™ Module, 1TB HDD,

NUC7i5BNKP

HDD k.it with power adapter, Intel® 600p M.2 NVMe SSD, 4GB DDR4NUC7i7BNHX1

HDD kit with power adapter, 32GB Intel® Optane™ Module

NUC7i7BNHXG

32GB Intel® Optane™ Module, 2TB HDD, 8GB DDR4-2400 SDRAM

[1]

NUC7i7BNKQ

Intel® 600p M.2 NVMe SSD, 8GB DDR4-2400 SDRAM

[1]

, Microsoft*

Basic Intel® NUC Board NUC7i5BNB Identification Information

Notes:

1. The AA number is found on a small label on the component side of the board.

2. The Intel® Core™ i5-7260U processor is used on this AA revision consisting of the following component:

Basic Intel® NUC Board NUC7i7BNB Identification Information

Notes:

1. The AA number is found on a small label on the component side of the board.

2. The Intel® Core™ i7-7567U processor is used on this AA revision consisting of the following component:

Product Identification Information

Intel® NUC Products NUC7i{x}BN{x} Identification Information

Board

NUC7i5BNH HDD kit with power adapter

NUC7i5BNB

J31144-xxx

NUC7i7BNH

NUC7i7BNB

J31145-xxx

Notes:

1. The maximum supported memory speed of the Intel NUC board NUC7i[x]BNB is 2133 MHz Memory modules of

higher speeds will be down-clocked to 2133 MHz

4GB DDR4-2400 SDRAM

2400 SDRAM

HDD kit with power adapter

Microsoft* Windows* 10 Home,

Windows* 10 Home

[1]

, Microsoft Windows 10 Home

[1]

, Microsoft Windows 10 Home

iii

Intel NUC Board NUC7i5BNB, Intel NUC Board NUC7i7BNB Technical Product Specification

Date

Type of Change

Description of Changes or Clarifications

May 2017

Specification

Remove reference to "RAID 0 auto replace" in the Intel® Rapid Storage

• Replace Figure 3 on page 21

June 2017

Specification

Revised step 3 of “Power Button Menu” section

June 2017

Specification

Corrected block diagram in Figure 3

October 2017

Specification

• Updated Product Identification table

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB.

Specification Changes or Clarifications

Change

June 2017 Specification

Change

Technology / SATA RAID section.

• Change all references of HDMI 2.0 to HDMI 2.0a:

• On page 15 in the audio section

• On page 25 in section 1.5.1.3

• On page 27 in section 1.5.1.5

• In the Thunderbolt 3 section (1.8) on page 30:

• The last sentence says “Item J in Figure 12 shows…” is changed to “Item A

in Figure 11 shows…”

• On page 3, change the Product Identification matrix to include 2 new rows for NUC7i5BNHX1 and NUC7i7BNHX1

• Updated section 1.5.1.7 “Integrated Audio Provided by the HDMI…” to change 192Khz/24 bit to “176.4kHz/24 bit

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See

http://www.intel.com/content/www/us/en/nuc/overview.html

for the latest documentation.

Preface

Chapter

Description

A description of the hardware used on Intel NUC Board NUC7i5BNB and Intel NUC Board 2

A map of the resources of the Intel NUC Board

The features supported by the BIOS Setup program

A description of the BIOS error messages, beep codes, and POST codes

A description of the Intel NUC kit NUC7i5BN[x] and Intel NUC kit NUC7i7BNH features

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Board NUC7i5BNB and Intel® NUC Board NUC7i7BNB.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel® NUC Board NUC7i5BNB and Intel® NUC Board NUC7i7BNB and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

NUC7i7BNB

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Intel NUC Board NUC7i5BNB, Intel NUC Board NUC7i7BNB Technical Product Specification

Gigabyte (1,073,741,824 bytes)

GB/s

Gigabytes per second

Gb/s

Gigabits per second

Kilobit (1024 bits)

kb/s

1000 bits per second

Megabyte (1,048,576 bytes)

Megabit (1,048,576 bits)

Mb/s

Megabits per second

TDP

Thermal Design Power

x.x V

Volts. Voltages are DC unless otherwise specified.

This symbol is used to indicate third-party brands and names that are the property of their respective

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)

KB Kilobyte (1024 bytes)

MB/s Megabytes per second

Xxh An address or data value ending with a lowercase h indicates a hexadecimal value.

owners.

Contents

Revision History ............................................................................................................... ii

Disclaimer .................................................................................................................................................................. ii

Board Identification Information ..................................................................................................................... iii

Product Identification Information ................................................................................................................. iii

Errata ........................................................................................................................................................................... iv

Preface ............................................................................................................................... v

Intended Audience ................................................................................................................................................. v

What This Document Contains ......................................................................................................................... v

Typographical Conventions ............................................................................................................................... v

Contents .......................................................................................................................... vii

1 Product Description ............................................................................................... 13

1.1 Overview ...................................................................................................................................................... 13

1.1.1 Feature Summary .................................................................................................................. 13

1.1.2 Board Layout (Top) ............................................................................................................... 15

1.1.3 Board Layout (Bottom) ........................................................................................................ 17

1.1.4 Block Diagram ......................................................................................................................... 19

1.2 Online Support .......................................................................................................................................... 20

1.3 Processor ..................................................................................................................................................... 20

1.4 System Memory ........................................................................................................................................ 21

1.5 Processor Graphics Subsystem .......................................................................................................... 23

1.5.1 Integrated Graphics .............................................................................................................. 23

1.6 USB ................................................................................................................................................................. 26

1.7 SATA Interface ........................................................................................................................................... 26

1.7.1 AHCI Mode ................................................................................................................................ 27

1.7.2 Intel® Rapid Storage Technology / SATA RAID ......................................................... 27

1.7.3 Intel® Next Generation Storage Acceleration ............................................................. 27

1.8 Thunderbolt 3 ............................................................................................................................................ 28

1.9 Real-Time Clock Subsystem ................................................................................................................ 28

1.10 Audio Subsystem ..................................................................................................................................... 28

1.10.1 Audio Subsystem Software ............................................................................................... 29

1.11 LAN Subsystem ......................................................................................................................................... 29

1.11.1 Intel® I219V Gigabit Ethernet Controller ..................................................................... 29

1.11.2 LAN Subsystem Software ................................................................................................... 30

1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................................................. 31

1.11.4 Wireless Network Module .................................................................................................. 32

1.12 Hardware Management Subsystem ................................................................................................. 32

1.12.1 Hardware Monitoring ........................................................................................................... 32

vii

1.12.2 Fan Monitoring ........................................................................................................................ 32

1.12.3 Thermal Solution ................................................................................................................... 32

1.13 Power Management ................................................................................................................................ 34

1.13.1 ACPI ............................................................................................................................................. 34

1.13.2 Hardware Support ................................................................................................................. 37

1.14 Intel Platform Security Technologies .............................................................................................. 39

1.14.1 Intel® Virtualization Technology ...................................................................................... 39

1.14.2 Intel® Platform Trust Technology ................................................................................... 39

2 Technical Reference ............................................................................................... 41

2.1 Memory Resources .................................................................................................................................. 41

2.1.1 Addressable Memory ........................................................................................................... 41

2.2 Connectors and Headers....................................................................................................................... 41

2.2.1 Front Panel Connectors ...................................................................................................... 42

2.2.2 Back Panel Connectors ....................................................................................................... 42

2.2.3 Headers and Connectors (Top) ........................................................................................ 43

2.2.4 Connectors and Headers (Bottom) ................................................................................. 44

2.3 BIOS Security Jumper ............................................................................................................................ 56

2.4 Mechanical Considerations .................................................................................................................. 59

2.4.1 Form Factor .............................................................................................................................. 59

2.5 Electrical Considerations ...................................................................................................................... 60

2.5.1 Power Supply Considerations .......................................................................................... 60

2.5.2 Fan Header Current Capability ......................................................................................... 60

2.6 Thermal Considerations ........................................................................................................................ 61

2.7 Reliability ..................................................................................................................................................... 66

2.8 Environmental ........................................................................................................................................... 66

3 Overview of BIOS Features ................................................................................... 67

3.1 Introduction ................................................................................................................................................ 67

3.2 BIOS Flash Memory Organization ..................................................................................................... 68

3.3 System Management BIOS (SMBIOS) .............................................................................................. 68

3.4 Legacy USB Support ............................................................................................................................... 68

3.5 BIOS Updates ............................................................................................................................................. 69

3.5.1 Language Support ................................................................................................................. 69

3.6 BIOS Recovery ........................................................................................................................................... 69

3.7 Boot Options .............................................................................................................................................. 71

3.7.1 Network Boot........................................................................................................................... 71

3.7.2 Booting Without Attached Devices ................................................................................ 71

3.7.3 Changing the Default Boot Device During POST ...................................................... 71

3.7.4 Power Button Menu .............................................................................................................. 72

3.8 Hard Disk Drive Password Security Feature .................................................................................. 73

3.9 BIOS Security Features .......................................................................................................................... 74

4 Error Messages and Blink Codes ......................................................................... 75

4.1 Front-panel Power LED Blink Codes ................................................................................................ 75

viii

Contents

4.2 BIOS Error Messages ............................................................................................................................... 75

5 Intel NUC Kit Features ........................................................................................... 76

5.1 Chassis Front Panel Features .............................................................................................................. 76

5.3 Chassis Rear Panel Features ................................................................................................................ 78

Figures

Figure 1. Major Board Components (Top) ....................................................................................................... 15

Figure 2. Major Board Components (Bottom) ................................................................................................ 17

Figure 3. Block Diagram ........................................................................................................................................... 19

Figure 4. Memory Channel and SO-DIMM Configuration.......................................................................... 22

Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ............................................................................... 29

Figure 6. LAN Connector LED Locations........................................................................................................... 31

Figure 7. Thermal Solution and Fan Header ................................................................................................... 33

Figure 8. Location of the Standby Power LED ............................................................................................... 38

Figure 9. Front Panel Connectors ........................................................................................................................ 42

Figure 10. Back Panel Connectors ...................................................................................................................... 42

Figure 11. Headers and Connectors (Top) ....................................................................................................... 43

Figure 12. Connectors and Headers (Bottom) ............................................................................................... 44

Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch) ............................................ 50

Figure 14. Connection Diagram for the Internal USB 2.0 Single-Port Header (1.25 mm Pitch) 54

Figure 15. Location of the CIR Sensor ............................................................................................................... 54

Figure 16. Location of the BIOS Security Jumper ........................................................................................ 57

Figure 17. Board Dimensions ................................................................................................................................ 59

Figure 18. Board Height Dimensions ................................................................................................................. 60

Figure 19. Localized High Temperature Zones ............................................................................................. 62

Figure 20. Installation Area of Thermal Pad for Intel NUC Kit NUC7i5BNK ...................................... 63

Figure 21. Installation area of Thermal Pad for Intel NUC Kit NUC7i5BNH/NUC7i7BNH ............ 64

Figure 22. Intel NUC Kit NUC7i5BNH/NUC7i7BNH Features – Front .................................................... 76

Figure 23. Intel NUC Kit NUC7i5BNK Features – Front ................................................................................ 77

Figure 24. Intel NUC Kit NUC7i5BNH/NUC7i7BNH Features – Rear ...................................................... 78

Figure 25. Intel NUC Kit NUC7i5BNK Features – Rear ................................................................................. 79

Tables

Table 1. Feature Summary ..................................................................................................................................... 13

Table 2. Components Shown in Figure 1 ......................................................................................................... 16

Table 3. Components Shown in Figure 2 ......................................................................................................... 18

Table 4. Supported Memory Configurations .................................................................................................. 21

Table 5. Unsupported Memory Configurations............................................................................................. 21

Table 6. DisplayPort Multi-Streaming Resolutions ...................................................................................... 24

Table 7. Multiple Display Configuration Maximum Resolutions ............................................................ 25

Table 8. Audio Formats Supported by the HDMI and Type C Interfaces ........................................... 25

Table 9. LAN Connector LED States ................................................................................................................... 31

Table 10. Effects of Pressing the Power Switch ............................................................................................ 34

Table 11. Power States and Targeted System Power ................................................................................. 35

Table 12. Wake-up Devices and Events ........................................................................................................... 36

Table 13. Headers and Connectors Shown in Figure 11 ........................................................................... 43

Table 14. Connectors and Headers Shown in Figure 12 ........................................................................... 45

Table 15. SATA Power Connector (1.25 mm pitch) ..................................................................................... 46

Contents

Table 16. Single-Port Internal USB 2.0 Header (1.25 mm pitch) ........................................................... 46

Table 17. M.2 2280 Module (key type M) Connector .................................................................................. 46

Table 18. Digital Microphone (DMICS) Array Connector (1.25 mm Pitch).......................................... 47

Table 19. Front Panel HDD LED Ring Connector (1.25 mm Pitch) ........................................................ 48

Table 20. CEC Header (1.25 mm pitch) ............................................................................................................. 48

Table 21. Front Panel Header (2.0 mm Pitch) ................................................................................................ 49

Table 22. States for a One-Color Power LED ................................................................................................. 50

Table 23. States for a Dual-Color Power LED ................................................................................................ 50

Table 24. SDXC Card Reader Connector .......................................................................................................... 52

Table 25. HDMI CEC expected behavior ............................................................................................................ 55

Table 26. Front Panel LED Ring Options .......................................................................................................... 55

Table 27. Fan Header Current Capability ......................................................................................................... 60

Table 28. Thermal Considerations for Components ................................................................................... 65

Table 29. Tcontrol Values for Components ................................................................................................... 65

Table 30. Environmental Specifications ........................................................................................................... 66

Table 31. Acceptable Drives/Media Types for BIOS Recovery ............................................................... 70

Table 32. Boot Device Menu Options ................................................................................................................ 71

Table 33. Master Key and User Hard Drive Password Functions ........................................................... 73

Table 34. Supervisor and User Password Functions................................................................................... 74

Table 35. Front-panel Power LED Blink Codes ............................................................................................. 75

Table 36. Components Shown in Figure 22 ................................................................................................... 76

Table 37. Components Shown in Figure 23 ................................................................................................... 77

Table 38. Components Shown in Figure 24 ................................................................................................... 78

Table 39. Components Shown in Figure 25 ................................................................................................... 79

4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

Processor

• A soldered-down 7

generation Intel® Core™ i5-7260U dual-core processor with up to a

Memory

• Two 260-pin 1.2 V DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM)

Graphics

• Integrated graphics support for processors with Intel® Graphics Technology:

Audio

• Intel® High Definition (Intel

HD) Audio via the HDMI v2.0 and Type-C interfaces through

Storage

• SATA ports:

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of Intel® NUC Board NUC7i5BNB and Intel® NUC Board NUC7i7BNB.

Table 1. Feature Summary

Form Factor

maximum 15 W TDP (if thermal margin available)

― Intel® Iris™ Plus Graphics 640 ― Integrated memory controller ― Integrated PCH

• A soldered-down 7

maximum 28 W TDP (if thermal margin available)

― Intel® Iris™ Plus Graphics 650 ― Integrated memory controller ― Integrated PCH

generation Intel® Core™ i7-7567U dual-core processor with up to a

sockets

• Support for DDR4 1866/2133 MHz SO-DIMMs

• Support for 4 Gb and 8 Gb memory technology

• Support for up to 32 GB of system memory with two SO-DIMMs using 8 Gb memory

technology

• Support for non-ECC memory

• Support for 1.2 V low voltage JEDEC memory only

Note: 2 Gb memory technology (SDRAM Density) is not compatible

― One High Definition Multimedia Interface* (HDMI*) back panel connector ― One Type C back panel connector

the processor

• Realtek HD Audio via a stereo microphone/headphone 3.5 mm jack on the front panel

• Digital microphone array (DMICS) connector (internal)

― One SATA 6.0 Gb/s port (black) for 2.5“ storage device

• One SATA 6.0 Gb/s port is reserved for an M.2 storage module supporting M.2 2242 and

M.2 2280 (key type M and B+M) modules

Note: Supports key type M and B+M (PCI Express* x1/x2/x4 and SATA)

continued

Peripheral Interfaces

• One USB 3.1 (Gen 2) port implemented via the external back panel Type C connector

• One M.2 connector supporting M.2 2242 and M.2 2280 (key type M and B+M) modules

• Intel

BIOS resident in the Serial Peripheral Interface (SPI) Flash device

• Suspend to RAM support

LAN

Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® I219V Gigabit Ethernet

Wireless

Intel® Dual Band Wireless-AC 8265

Table 1. Feature Summary (continued)

• USB 3.0 ports:

• USB 2.0 ports:

• Consumer Infrared (CIR)

Expansion Capabilities

• One Micro SDXC slot

• One Thunderbolt™ 3 via back panel Type C connector

BIOS

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and

Instantly Available PC Technology

Hardware Monitor Subsystem

• Wake on PCI Express, LAN, front panel, CIR, and USB ports

Controller

Hardware monitoring subsystem, based on a ITE Tech. IT8987E-VG embedded controller, including:

• Voltage sense to detect out of range power supply voltages

• Thermal sense to detect out of range thermal values

• One processor fan header

• Fan sense input used to monitor fan activity

• Fan speed control

• Two ports are implemented with external front panel connectors (one blue and one

orange charging capable)

• Two ports are implemented with external back panel connectors (blue)

• Two ports via two single-port internal 1x4 1.25 mm pitch headers (white)

• One port is reserved for the M.2 2230 Wireless module

System Management BIOS (SMBIOS)

• 802.11ac, Dual Band, 2x2 Wi-Fi + Bluetooth 4.2

• Maximum Transfer speed up to 867Mbps

• Supports Intel® Smart Connect Technology

1.1.2 Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB.

Product Description

Figure 1. Major Board Components (Top)

Type C connector

Processor fan header

Thermal solution

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Item from Figure 1 Description

C Battery

Product Description

1.1.3 Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB.

Figure 2. Major Board Components (Bottom)

Item from

Back panel connectors

Front panel header

Front panel LED ring connector

Intel Dual Band Wireless AC + Bluetooth 8265 module

Micro SDXC slot

Front panel single-port USB 2.0 header (1.25 mm pitch)

Front panel USB 3.0 connector (blue)

SATA 6.0 Gb/s connector

Front panel USB 3.0 connector (orange, charging)

SATA power connector (1.25 mm pitch)

Front panel power button

BIOS security jumper

Consumer electronics control (CEC) header

Table 3. Components Shown in Figure 2

Figure 2

C Digital microphone array connector

G M.2 connector (key type M and B+M) for 2242 and 2280 modules

J Consumer Infrared (CIR) sensor

O Front panel stereo microphone/headphone jack

S DDR4 SO-DIMM sockets

Description

1.1.4 Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Product Description

Figure 3. Block Diagram

To find information about…

Visit this World Wide Web site:

Intel NUC Board NUC7i5BNB and Intel NUC Board

http://www.intel.com/NUC

Intel NUC Support

http://www.intel.com/NUCSupport

Available configurations for Intel NUC Board

http://ark.intel.com

Product support page NUC7i5BNK

http://www.intel.com/content/www/us/en/support/boards-and-

Product support page NUC7i5BNH

http://www.intel.com/content/www/us/en/support/boards-and-

Product support page NUC7i7BNH

http://www.intel.com/content/www/us/en/support/boards-and-

BIOS and driver updates

http://downloadcenter.intel.com

Tested memory

http://www.intel.com/content/www/us/en/support/boards-and-

Integration information

http://www.intel.com/NUCSupport

Processor datasheet

http://ark.intel.com

1.2 Online Support

NUC7i7BNB

NUC7i5BNB and Intel NUC Board NUC7i7BNB

kits/intel-nuc-kits/intel-nuc-kit-nuc7i5bnk.html

kits/intel-nuc-kits/intel-nuc-kit-nuc7i5bnh.html

kits/intel-nuc-kits/intel-nuc-kit-nuc7i7bnh.html

BIOS and driver updates for NUC7i5BNK

BIOS and driver updates for NUC7i5BNH

BIOS and driver updates for NUC7i7BNH

https://downloadcenter.intel.com/product/95061

https://downloadcenter.intel.com/product/95067

https://downloadcenter.intel.com/product/95065

kits/000023165.html

1.3 Processor

A soldered-down 7th generation Intel® Core™ i5-7260U dual-core processor with up to a maximum 15 W TDP (if thermal margin is available).

• Intel® Iris™ Plus Graphics 640

• Integrated memory controller

• Integrated PCH

A soldered-down 7 maximum 28 W TDP (if thermal margin is available).

• Intel® Iris™ Plus Graphics 650

• Integrated memory controller

• Integrated PCH

generation Intel® Core™ i7-7567U dual-core processor with up to a

NOTE

There are specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 60 for information on power supply requirements.

Product Description

SO-DIMM Capacity

Configuration

SDRAM Density

SDRAM Organization Front-side/Back-side

Number of SDRAM Devices

2048 MB

4 Gbit

512 M x4/empty

4096 MB

4 Gbit

512 M x4/512 M x4

4096 MB

8 Gbit

1024 M x4/empty

8192 MB

4 Gbit

512 M x8/512 M x8

8192 MB

8 Gbit

1024 M x4/1024 M x4

16384 MB

8 Gbit

1024 M X8/1024 M x8

SO-DIMM Capacity

Configuration

SDRAM Density

SDRAM Organization Front-side/Back-side

Number of SDRAM Devices

1024 MB

1 Gbit

128 M x8/empty

2048 MB

1 Gbit

128 M x8/128 M x8

2048 MB

2 Gbit

256 M x8/empty

4096 MB

2 Gbit

256 M x8/256 M x8

1.4 System Memory

The board has two 260-pin SO-DIMM sockets and supports the following memory features:

• 1.2 V DDR4 SDRAM SO-DIMMs with gold plated contacts

• Two independent memory channels with interleaved mode support

• Unbuffered, single-sided or double-sided SO-DIMMs

• 32 GB maximum total system memory (with 8 Gb memory technology). Refer to Section 2.1.1

on page 41 for information on the total amount of addressable memory.

• Minimum recommended total system memory: 2048 MB

• Non-ECC SO-DIMMs

• Serial Presence Detect

• DDR4 1866/2133 MHz SDRAM SO-DIMMs

• Supports 4 Gb and 8Gb memory technology (SDRAM Density)

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency.

NOTE

Intel NUC Board NUC7i3BNB supports only 4 Gb and 8 Gb memory technologies (also referred to as “SDRAM density”). Table 4 lists the supported SO-DIMM configurations. Table 5

lists the SO-

DIMM configurations that are not supported.

Table 4. Supported Memory Configurations

(Note)

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

Table 5. Unsupported Memory Configurations

(Note)

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

For information about…

Refer to:

Tested Memory

http://www.intel.com/content/www/us/en/support/boards-and-

kits/000023165.html

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

Product Description

For information about

Refer to

HDMI technology

http://www.hdmi.org

1.5 Processor Graphics Subsystem

The NUC7i5BNB board supports graphics through Intel Iris™ Plus Graphics 640 and NUC7i7BNB board supports graphics through Intel Iris™ Plus Graphics 650.

1.5.1 Integrated Graphics

The board supports integrated graphics via the processor.

1.5.1.1 Intel® High Definition (Intel® HD) Graphics

The Intel Iris™ Plus graphics controller features the following:

• 3D Features

― DirectX* 12.1 support ― OpenGL* 5.0 support ― OpenCL* 2.1 support

• Next Generation Intel® Clear Video Technology HD support is a collection of video playback

and enhancement features that improve the end user’s viewing experience

• Encode/transcode HD content

• Playback of high definition content including Blu-ray* disc

• Superior image quality with sharper, more colorful images

• DirectX* Video Acceleration (DXVA) support for accelerating video processing

• Full AVC/VC1/MPEG2/HEVC HW Encode/Decode

• Intel

HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)

NOTE

Intel Quick Sync Video is enabled by an appropriate software application.

1.5.1.2 Video Memory Allocation

Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount). When memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses.

1.5.1.3 High Definition Multimedia Interface* (HDMI*)

The HDMI port supports standard, enhanced, or high definition video, plus multi-channel digital audio on a single cable. The port is compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats. The maximum supported resolution is 4096 x 2160 @ 60 Hz, 24bpp. The HDMI port is compliant with the HDMI 2.0 specification.

For information about

Refer to

DisplayPort technology

http://www.displayport.org

DisplayPort Usage Models

Monitor 1

Monitor 2

Monitor 3

3 Monitors

1920 x 1200 @ 60 Hz

1920 x 1080 @ 60 Hz

2 Monitors

2560 x 1600 @ 60 Hz

1.5.1.4 DisplayPort* via USB Type-C

DisplayPort is a digital communication interface that utilizes differential signaling to achieve a high bandwidth bus interface designed to support connections between PCs and monitors, projectors, and TV displays. DisplayPort is suitable for display connections between consumer electronics devices such as high definition optical disc players, set top boxes, and TV displays. The maximum supported resolution is 4096 x 2304 @ 60 Hz, 24bpp. DisplayPort via USB Type-C connector is compliant with the DisplayPort 1.2 specification.

DisplayPort output supports Multi-Stream Transport (MST) which allows for multiple independent video streams (daisy-chain connection with multiple monitors) over a single DisplayPort. This will require the use of displays that support DisplayPort 1.2 and allow for this feature.

1.5.1.4.1 DisplayPort 1.2 Multi-Stream Transport Daisy-Chaining

Table 6 lists the maximum resolutions available when using DisplayPort 1.2 Multi-Stream Transport.

Table 6. DisplayPort Multi-Streaming Resolutions

3 Monitors

(with DisplayPort 1.2 hub)

1920 x 1080 @ 60 Hz 1920 x 1080 @ 60 Hz 1920 x 1080 @ 60 Hz

1.5.1.5 Multiple DisplayPort and HDMI Configurations

Single Display

Dual Display

Single Display

For information about

Refer to

Audio Formats

HDMI

Type C

AC3 – Dolby* Digital

Yes

Dolby Digital Plus

Yes

LPCM, 176.4kHz/24 bit, 8 channel

Yes

Dolby True HD, DTS-HD Master Audio* (Lossless Blu-ray Disc Audio

Yes

Multiple DisplayPort and HDMI configurations feature the following:

• Two independent displays with 4K support  HDMI and Type C

• Single HDMI 2.0 with 4K support

• Single DisplayPort 1.2 with 4K support via Type C connector

• Collage Display

Table 7. Multiple Display Configuration Maximum Resolutions

Product Description

HDMI

4096 x 2160 @ 60 Hz 4096 x 2304 @ 60 Hz (USB Type C)

Note: Higher resolutions may be achievable but only at lower refresh rates

Multiple display maximum resolutions

Type C and HDMI

4096 x 2160 @ 60 Hz (HDMI)

https://wwwssl.intel.com/content/www/us/en/processors/core/CoreTechnicalResources.html

(Generic link)

DisplayPort via USB Type C

4096 x 2304 @ 60 Hz

1.5.1.6 High-bandwidth Digital Content Protection (HDCP)

HDCP is the technology for protecting high definition content against unauthorized copy or interception between a source (computer, digital set top boxes, etc.) and the sink (panels, monitor, and TVs). The PCH supports HDCP 2.2 for content protection over wired displays (USB Type-C and HDMI).

1.5.1.7 Integrated Audio Provided by the HDMI and Type C Interfaces

The HDMI and Type C interfaces from the PCH support audio. The processor supports two High Definition audio streams on two digital ports simultaneously.

Table 8 shows the specific audio technologies supported by the PCH.

Table 8. Audio Formats Supported by the HDMI and Type C Interfaces

DTS-HD* Yes Yes

Format)

For information about

Refer to

The location of the front panel USB headers

Figure 2, page 17

1.6 USB

The USB port arrangement is as follows:

• USB 3.1 Gen 2 Type C port implemented via the external back panel Type C connector

(maximum current is 3A):

• USB 3.0 ports (maximum current is 900 mA for each blue port, 1.5 A for the orange charging

port):

― Two ports are implemented with external front panel connectors (one blue and one

orange charging capable)

― Two ports are implemented with external back panel connectors (blue)

• USB 2.0 ports (maximum current is 500 mA for each port of the white header (1 A total):

― Two ports via two single-port internal 1x4 1.25 mm pitch headers (white) ― One port is reserved for the M.2 2230 Wireless module

All the USB ports are high-speed, full-speed, and low-speed capable.

NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.

The location of the USB connectors on the back panel Figure 9, page 42

1.7 SATA Interface

The board provides the following SATA interfaces:

• SATA ports: ― One SATA 6.0 Gb/s port for 2.5” storage device

• One SATA 6.0 Gb/s port is reserved for an M.2 storage module supporting M.2 2242 and

M.2 2280 (key type M and B+M) modules

The PCH provides independent SATA ports with a theoretical maximum transfer rate of 6 Gb/s. A point-to-point interface is used for host to device connections.

Product Description

1.7.1 AHCI Mode

The board supports AHCI storage mode.

NOTE

In order to use AHCI mode, AHCI must be enabled in the BIOS. Microsoft* Windows* 10 includes the necessary AHCI drivers without the need to install separate AHCI drivers during the operating system installation process; however, it is always good practice to update the AHCI drivers to the latest available by Intel.

1.7.2 Intel® Rapid Storage Technology / SATA RAID

The PCH supports Intel® Rapid Storage Technology, providing both AHCI and integrated RAID functionality. The RAID capability provides high-performance RAID 0 and 1 functionality on all SATA ports. Other RAID features include hot spare support and SMART alerting. Software components include an Option ROM for pre-boot configuration and boot functionality, a Microsoft Windows compatible driver, and a user interface for configuration and management of the RAID capability of the PCH.

NOTE

Intel Rapid Storage Technology / SATA RAID is only supported if an M.2 SATA SSD module is used with the onboard SATA interface. RAID is not available when using M.2 PCIe SSD module and onboard SATA interface.

1.7.3 Intel® Next Generation Storage Acceleration

Intel® Next Generation Storage Acceleration with Intel® Optane™ Technology is a disk caching solution that can provide improved computer system performance with improved power savings. It allows configuration of a computer system with the advantage of having HDDs for maximum storage capacity and with Intel® Optane™ Technology for improved system performance.

For more information on Intel® Optane™ Technology, go to

http://www.intel.com/content/www/us/en/architecture-and-technology/non-volatilememory.html

NOTE

In order to use supported RAID and Intel Next Generation Storage Acceleration with Intel® Optane™ Technology features, you must first enable RAID in the BIOS.

For information about

Refer to

Compatible Thunderbolt™ 3 devices

http://www.intel.com/content/www/us/en/support/boards-

1.8 Thunderbolt 3

The board supports Thunderbolt™ 3 with up to 40Gbps of data throughput, one 4k (60Hz) monitor output, USB3.1 (Gen 2) connection and charging capabilities up to 5V at 3A via the back panel USB Type-C connector. Item A in figure 11 shows the location of the rear panel USB TypeC port

Thunderbolt™ 3 information

and-kits/intel-nuc-kits/000023164.html

http://www.intel.com/Thunderbolt

1.9 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5 V STBY rail.

NOTE

If the battery and AC power fail, date and time values will be reset and the user will be notified during the POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 15 shows the location of the battery.

1.10 Audio Subsystem

The audio subsystem supports the following features:

• Digital microphone array (DMICS) connectors (internal)

• Analog line-out/Analog Headphone/Analog Microphone (front panel jack)

• Support for 44.1 kHz/48 kHz/96 kHz/192 kHz sample rates on all analog outputs

• Support for 44.1 kHz/48 kHz/96 kHz sample rates on all analog inputs

• Front Panel Audio Jack Support (see Figure 5 for 3.5 mm audio jack pin out):

― Speakers only (Stereo) ― Headphones only (Stereo) ― Microphone only (mono) ― Combo Headphone (Stereo)/Microphone (mono)

Pin Number

Pin Name

Description

Tip

Left Audio Out

Ring

Right Audio Out

Ring

Common/Ground

Sleeve

Audio In/MIC

For information about

Refer to

Obtaining Audio software and drivers

http://downloadcenter.intel.com

Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out

Product Description

NOTE

The analog circuit of the front panel audio connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (nonamplified) speakers are connected to this output.

1.10.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

1.11 LAN Subsystem

The LAN subsystem consists of the following:

• Intel I219V Gigabit Ethernet Controller (10/100/1000 Mb/s)

• RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interface between the Processor and the LAN controller

• Power management capabilities

― ACPI technology support ― LAN wake capabilities

• LAN subsystem software

1.11.1 Intel® I219V Gigabit Ethernet Controller

The Intel I219V Gigabit Ethernet Controller supports the following features:

• Compliant with the 1 Gb/s Ethernet 802.3, 802.3u, 802.3z, 802.3ab specifications

• Multi-speed operation: 10/100/1000 Mb/s

• Full-duplex operation at 10/100/1000 Mb/s; Half-duplex operation at 10/100 Mb/s

For information about

Refer to

• Flow control support compliant with the 802.3X specification as well as the specific operation

of asymmetrical flow control defined by 802.3z

• VLAN support compliant with the 802.3q specification

• Supports Jumbo Frames (up to 9 kB)

― IEEE 1588 supports (Precision Time Protocol)

• MAC address filters: perfect match unicast filters, multicast hash filtering, broadcast filter, and

promiscuous mode

1.11.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

Obtaining LAN software and drivers http://downloadcenter.intel.com

1.11.3 RJ-45 LAN Connector with Integrated LEDs

Item

Description

Link LED (Green)

Data Rate LED (Green/Yellow)

LED

LED Color

LED State

Condition

Off

LAN link is not established.

LAN link is established.

Off

10 Mb/s data rate is selected.

Green

100 Mb/s data rate is selected.

Yellow

1000 Mb/s data rate is selected.

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 6).

Figure 6. LAN Connector LED Locations

Table 9 describes the LED states when the board is powered up and the LAN subsystem is operating.

Table 9. LAN Connector LED States

Product Description

Link Green

Data Rate Green/Yellow

Blinking LAN activity is occurring.

For information about

Refer to

Full Specifications

http://intel.com/wireless

1.11.4 Wireless Network Module

The Intel Dual Band Wireless-AC 8265 module provides hi-speed wireless connectivity provided with the following capabilities:

• Compliant IEEE 802.11abgn, 802.11ac, 802.11d, 802.11e, 802.11i, 802.11h, 802.11w

specifications

• Maximum bandwidth of 867 Mbps

• Dual Mode Bluetooth* 4.0

• OS certified with Microsoft Windows 10

• Wi-Fi Direct* for peer to peer device connections

• Wi-Fi Miracast Source

• Authentication: WPA and WPA2, 802.1X (EAP-TLS, TTLS, PEAP, LEAP, EAP-FAST), EAP-SIM,

EAP-AKA

• Encryption: 64-bit and 128-bit WEP, AES-CCMP, TKIP, WPA2, AES-CCMP

Obtaining WLAN software and drivers http://downloadcenter.intel.com

1.12 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including thermal and voltage monitoring.

For information about Refer to

Wired for Management (WfM) Specification www.intel.com/design/archives/wfm/

1.12.1 Hardware Monitoring

The hardware monitoring and fan control subsystem is based on an ITE Tech. IT8987E-VG embedded controller, which supports the following:

• Processor and system ambient temperature monitoring

• Chassis fan speed monitoring

• Voltage monitoring of CPU IO Vcc (+Vccio), Memory Vcc (V_SM), CPU IN Vcc (+Vccp)

• SMBus interface

1.12.2 Fan Monitoring

Fan monitoring can be implemented using third-party software.

1.12.3 Thermal Solution

Figure 7 shows the location of the thermal solution and processor fan header.

Product Description

Item

Description

Thermal solution

A Processor fan header

Figure 7. Thermal Solution and Fan Header

Off

Less than four seconds

Power-on

Fail safe power-off

Sleep

Less than four seconds

Wake-up

Sleep

More than six seconds

Power-off

1.13 Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and Power Interface (ACPI)

• Hardware support:

― Power Input ― Instantly Available PC technology ― LAN wake capabilities ― Wake from USB ― WAKE# signal wake-up support ― Wake from S5 ― Wake from CIR ― +5 V Standby Power Indicator LED

1.13.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include:

• Plug and Play (including bus and device enumeration)

• Power management control of individual devices, add-in boards (some add-in boards may

require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achieving less than 15-watt system operation in the power-on/standby

sleeping state

• A Soft-off feature that enables the operating system to power-off the computer

• Support for multiple wake-up events (see Table 12 on page 36)

• Support for a front panel power and sleep mode switch

Table 10 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 10. Effects of Pressing the Power Switch

If the system is in this state… …and the power switch is pressed for …the system enters this state

(ACPI G2/G5 – Soft off)

On (ACPI G0 – working state)

(ACPI G0 – working state)

(ACPI G1 – sleeping state)

Note: Depending on power management settings in the operating system.

Less than four seconds

More than six seconds

(ACPI G0 – working state)

Soft-off/Standby (ACPI G1 – sleeping state)

(ACPI G2/G5 – Soft off)

(ACPI G0 – working state)

(ACPI G2/G5 – Soft off)

Note

Product Description

G1 – sleeping

S3 – Suspend to RAM.

No power

D3 – no power

Power < 5 W

(Note 2)

G1 – sleeping

S4 – Suspend to disk.

No power

D3 – no power

Power < 5 W

(Note 2)

G2/S5

S5 – Soft off. Context

No power

D3 – no power

Power < 5 W

(Note 2)

1.13.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 11 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 11. Power States and Targeted System Power

Global States

G0 – working state

state

G3 – mechanical off

AC power is disconnected from the computer.

Notes:

1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply.

2. Dependent on the standby power consumption of wake-up devices used in the system.

Sleeping States

S0 – working C0 – working D0 – working state. Full power > 30 W

Context saved to RAM.

Context saved to disk.

not saved. Cold boot is required.

No power to the system.

Processor States

No power D3 – no power for

Device States

except for wake-up logic.

wake-up logic, except when provided by battery or external source.

Targeted System

(Note 1)

Power

No power to the system. Service can be performed safely.

1.13.1.2 Wake-up Devices and Events

Table 12 lists the devices or specific events that can wake the computer from specific states.

Table 12. Wake-up Devices and Events

Devices/events that wake up the system… …from this sleep state Comments

Power switch S3, S4, S51

RTC alarm S3, S4, S51 Monitor to remain in sleep state

LAN S3, S4, S5

USB S3, S4, S5

WAKE# S3, S41 Via WAKE; monitor to remain in sleep

Consumer IR

Bluetooth N/A Wake from Bluetooth is not supported

Notes:

1. S4 implies operating system support only.

2. Will not wake from Deep S4/S5. USB S4/S5 Power is controlled by BIOS. USB S5 wake is controlled by BIOS. USB S4

wake is controlled by OS driver, not just BIOS option.

3. Windows 8.1 Fast startup will block wake from LAN, USB, and CIR from S5.

S3, S4, S5

1, 3

“S5 WOL after G3” must be supported;

monitor to remain in sleep state

1, 2, 3

Wake S4, S5 controlled by BIOS option

(not after G3)

state

1, 3

Will not wake when in Deep S4/S5 sleep state

NOTE

The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.

Product Description

1.13.2 Hardware Support

The board provides several power management hardware features, including:

• Wake from Power Button signal

• Instantly Available PC technology

• LAN wake capabilities

• Wake from USB (not after G3)

• WAKE# signal wake-up support

• Wake from S5

• Wake from CIR

• +5 V Standby Power Indicator LED

NOTE

The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.

1.13.2.1 Power Input

When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu.

1.13.2.2 Instantly Available PC Technology

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is only supplying Standby power, and the front panel LED will be amber or secondary color if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 12 on page 36 lists the devices and events that can wake the computer from the S3 state.

The use of Instantly Available PC technology requires operating system support and drivers for any installed M.2 add-in card.

1.13.2.3 LAN Wake Capabilities

LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.

1.13.2.4 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state (not after G3).

NOTE

Wake from USB requires the use of a USB peripheral that supports Wake from USB.

1.13.2.5 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3 or S4 state.

1.13.2.6 Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake from an ACPI S5 state.

1.13.2.7 Wake from Consumer IR

CIR activity wakes the computer from an ACPI S3, S4, or S5 state.

1.13.2.8 +5 V Standby Power Indicator LED

The standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 8 shows the location of the standby power LED.

CAUTION

If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.

Figure 8. Location of the Standby Power LED

Product Description

For information about

Refer to

Intel Virtualization Technology

http://www.intel.com/technology/virtualization/technology.htm

For information about

Refer to

1.14 Intel Platform Security Technologies

Intel platform security technologies provides tools and resources to help the user protect their information by creating a safer computing environment.

NOTE

Software with security capability is required to take advantage of Intel platform security technologies.

1.14.1 Intel® Virtualization Technology

Intel Virtualization Technology (Intel® VT) is a hardware-assisted technology that, when combined with software-based virtualization solutions, provides maximum system utilization by consolidating multiple environments into a single server or client.

NOTE

A processor with Intel VT does not guarantee that virtualization will work on your system. Intel VT requires a computer system with a chipset, BIOS, enabling software and/or operating system, device drivers, and applications designed for this feature.

1.14.2 Intel® Platform Trust Technology

Intel® Platform Trust Technology (Intel® PTT) is a platform functionality for credential storage and key management. Intel® PTT supports Microsoft* BitLocker* Drive Encryption for hard drive encryption and supports all Microsoft requirements for firmware Trusted Platform Module (fTPM)

2.0.

NOTE

Support for fTPM version 2.0 requires a UEFI-enabled operating system, such as Microsoft* Windows* 10.

CAUTION

BIOS recovery using the BIOS security jumper clears Intel® Platform Trust Technology (Intel® PTT) keys. These keys will not be restored after the BIOS recovery.

Intel Platform Trust Technology http://www.intel.com/content/dam/www/public/us/en/documents

/white-papers/enterprise-security-platform-trust-technologywhite-paper.pdf

2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory

The board utilizes 32 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 32 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following:

• BIOS/SPI Flash device (64 Mb)

• Local APIC (19 MB)

• Direct Media Interface (40 MB)

• PCI Express configuration space (256 MB)

• PCH base address registers PCI Express ports (up to 256 MB)

• Memory-mapped I/O that is dynamically allocated for M.2 add-in cards (256 MB)

• Integrated graphics shared memory (up to 512 MB; 64 MB by default)

The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just above the 4 GB boundary. All installed system memory can be used when there is no overlap of system addresses.

2.2 Connectors and Headers

CAUTION

Only the following connectors and headers have overcurrent protection: back panel and front panel USB.

The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves.

Furthermore, improper connection of USB header single wire connectors may eventually overload the overcurrent protection and cause damage to the board.

Item

Description

Item

Description

USB Type-C connector

This section describes the board’s connectors and headers. The connectors and headers can be divided into these groups:

• Front panel I/O connectors

• Back panel I/O connectors

2.2.1 Front Panel Connectors

Figure 9 shows the location of the front panel connectors for the board.

A Front panel power button B Front panel Stereo

microphone/headphone jack

C USB 3.0 ports (orange charging

capable) D USB 3.0 (blue) E CIR

Figure 9. Front Panel Connectors

2.2.2 Back Panel Connectors

Figure 10 shows the location of the back panel connectors for the board.

B USB 3.0 ports (blue) C LAN D HDMI connector E 12-19 V DC input jack

Figure 10. Back Panel Connectors

2.2.3 Headers and Connectors (Top)

Item from Figure 11

Description

USB Type-C connector

Processor fan header

Thermal solution

Figure 11 shows the location of the headers and connectors on the top-side of the board.

Technical Reference

Figure 11. Headers and Connectors (Top)

Table 13 lists the headers and connectors identified in Figure 11.

Table 13. Headers and Connectors Shown in Figure 11

C Battery and header

2.2.4 Connectors and Headers (Bottom)

Figure 12 shows the locations of the connectors and headers on the bottom-side of the board.

Figure 12. Connectors and Headers (Bottom)

Table 14 lists the connectors and headers identified in Figure 12.

Table 14. Connectors and Headers Shown in Figure 12

Technical Reference

Item from Figure 12

A Front panel header

B Digital microphone array connector

C Front panel LED ring connector

D Micro SDXC slot

E M.2 connector (key type M and B+M) for 2242 and 2280 modules

F Front panel single-port USB 2.0 header (1.25 mm pitch)

G Front panel single-port USB 2.0 header (1.25 mm pitch)

H SATA 6.0 Gb/s connector

I SATA power connector (1.25 mm pitch)

J BIOS security jumper

K Consumer electronics control (CEC) header

Description

Signal Name

+5 V DC

D- 3 D+ 4 Ground

Signal Name

3.3V

GND

3.3V

GND

3.3V

GND

SUSCLK(32kHz) (O)(0/3.3V)

PEDET (NC-PCIe/GND-SATA)

Connector Key

N/C

Connector Key

N/C

Connector Key

N/C

GND

2.2.4.1 Signal Tables for the Connectors and Headers

Table 15. SATA Power Connector (1.25 mm pitch)

1 +5 V

2 +5 V

3 +3.3 V

4 GND

5 GND

NOTE

Connector is Molex* part number 53398-0571, 1.25 mm pitch PicoBlade* header, surface mount, vertical, lead-free, 5 circuits.

Table 16. Single-Port Internal USB 2.0 Header (1.25 mm pitch)

NOTE

Connector is Molex part number 53398-0471, 1.25 mm pitch PicoBlade header, surface mount, vertical, lead-free, 4 circuits.

Table 17. M.2 2280 Module (key type M) Connector

62 Connector Key 63 Connector Key

continued

Table 17. M.2 2280 Module (key type M) Connector (continued)

Signal Name

PEWAKE# (I/O)(0/3.3V) or N/C

REFCLKP

CLKREQ# (I/O)(0/3.3V) or N/C

REFCLKN

PERST# (O)(0/3.3V) or N/C

GND

N/C

PETn0/SATA-A-

N/C

GND

N/C

PERp0/SATA-B-

N/C

PERn0/SATA-B+

DEVSLP (O)

GND

N/C

GND

N/C

PERp1

N/C

PERn1

N/C

GND

N/C

PETp2

3.3V

PERp2

3.3V

PERn2

3.3V

GND

3.3V

PETp3

DAS/DSS# (I/O)/LED1# (I)(0/3.3V)

PETn3

3.3V 5 PERn3

3.3V 3 GND 1 GND

Signal Name

+3.3 V DC (+3V3_DMIC)

Clock (DMIC_CLK)

Data (DMIC_DAT)

48 N/C 49 PETp0/SATA-A+

36 N/C 37 PETp1

34 N/C 35 PETn1

Technical Reference

22 N/C 23 PETn2

20 N/C 21 GND

8 N/C 9 GND

6 N/C 7 PERp3

Table 18. Digital Microphone (DMICS) Array Connector (1.25 mm Pitch)

1 Ground

NOTE

Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical, lead-free, 4 circuits.

Signal Name

+5VSB

Red HDD LED

Blue HDD LED

Signal Name

5VSTBY

GND 3 PWR_SWITCH#

HDMI_CEC

Table 19. Front Panel HDD LED Ring Connector (1.25 mm Pitch)

3 Green HDD LED

NOTE

Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical, lead-free, 4 circuits.

Table 20. CEC Header (1.25 mm pitch)

NOTE

Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical, lead-free, 4 circuits.

2.2.4.2 Add-in Card Connectors

Signal Name

Description

Signal Name

Description

HDD_POWER_LED

Pull-up resistor (750 Ω)

POWER_LED_MAIN

[Out] Front panel LED (main

HDD_LED#

[Out] Hard disk activity

POWER_LED_ALT

[Out] Front panel LED (alt

GROUND

Ground

POWER_SWITCH#

[In] Power switch

+5V_DC

Power

Key

No pin

The board supports M.2 2242 and 2280 (key type M) modules.

• Supports M.2 SSD SATA drives ― Maximum bandwidth is approximately 540 MB/s

• Supports M.2 SSD Gen 3 PCIe AHCI and NVMe drives (PCIe x1, x2, and x4) ― Using PCIe x4 M.2 SSD maximum bandwidth is approximately 4000 MB/s

2.2.4.3 Type C connector

The board has several features that are supported via the Type C connector.

• Supports USB 3.1 Gen 2.0 ― Maximum bandwidth is approximately 10 Gbit/s

• Supports Display port 1.2 ― Maximum bandwidth is approximately 17.28 Gbit/s

• Supports Thunderbolt 3 PCIe x4 connection ― Maximum bandwidth is approximately 40 Gbit/s

Technical Reference

2.2.4.4 Front Panel Header (2.0 mm Pitch)

This section describes the functions of the front panel header. Table 21 lists the signal names of the front panel header. Figure 13 is a connection diagram for the front panel header.

Table 21. Front Panel Header (2.0 mm Pitch)

to +5V

LED

7 RESET_SWITCH# [In] Reset switch 8 GROUND Ground

color)

LED State

Description

Off

Power off

Steady

Normal operation

Off

Power off

Secondary color blinking

Standby Primary color steady (white)

Normal operation

Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch)

2.2.4.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires a SATA hard drive or optical drive connected to an onboard SATA connector.

2.2.4.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST.

2.2.4.4.3 Power/Sleep LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 22 and Table 23 show the possible LED states.

Table 22. States for a One-Color Power LED

Blinking Standby

Table 23. States for a Dual-Color Power LED

LED State Description

(amber)

NOTE

The LED behavior shown in Table 22 is default – other patterns may be set via BIOS setup.

Technical Reference

2.2.4.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal.

Signal Name

Descriptive Name

DATA1

Serial Data 1

DATA0

Serial Data 0

GND

Ground

VDD

Power (3.3 V)

CMD

Command

DATA3

Serial Data 3

2.2.4.5 Micro SDXC Card Reader

The board has a micro Secure Digital (Micro SD) card reader that supports the Secure Digital eXtended Capacity (SDXC) format, 3.01 specification.

Table 24. SDXC Card Reader Connector

1 CD Card Detection

5 CLK Serial Clock

9 DATA2 Serial Data 2

NOTE

The Micro SDXC card reader is not supported in Microsoft* Windows* 7

Technical Reference

2.2.4.6 Power Supply Connector

The board has the following power supply connector:

• External Power Supply – the board can be powered through a 12-19 V DC connector on the

back panel. The back panel DC connector is compatible with a 5.5 mm/OD (outer diameter) and 2.5 mm/ID (inner diameter) plug, where the inner contact is +12-19 (±10%) V DC and the shell is GND. The maximum current rating is 10 A.

NOTE

2.2.4.6.1 Power Sensing Circuit

The board has a power sensing circuit that:

• Manages CPU power usage to maintain system power consumption below 65 W.

• Designed for use with 65 W AC-DC adapters.

External power voltage, 12-19 V DC, is dependent on the type of power brick used.

NOTE

It is recommended that you disable this feature (via BIOS option) when using an AC-DC adapter greater than 65 W.

Item

Description

2.2.4.7 Internal USB 2.0 Single-Port Header (1.25 mm Pitch)

Figure 14 is a connection diagram for the internal USB header.

NOTE

• The +5 V DC power on the USB header is fused.

• Use only an internal USB connector that conforms to the USB 2.0 specification for high-speed

USB devices.

Figure 14. Connection Diagram for the Internal

USB 2.0 Single-Port Header (1.25 mm Pitch)

2.2.4.8 Consumer Infrared (CIR) Sensor

The Consumer Infrared (CIR) sensor on the front panel provides features that are designed to comply with Microsoft Consumer Infrared usage models (RC-6).

The CIR feature is made up of the receiving sensor. The receiving sensor consists of a filtered translated infrared input compliant with Microsoft CIR specifications.

Customers are required to provide their own media center compatible remote or smart phone application for use with the Intel NUC. Figure 15 shows the location of the CIR sensor.

A CIR Sensor

Figure 15. Location of the CIR Sensor

Technical Reference

Activity

Current Status

Action

Expected Behavior

1,2

TV3

For information about

Refer to

HDMI CEC technology

http://www.hdmi.org/pdf/whitepaper/DesigningCECintoYourNextH

2.2.4.9 Consumer Electronics Control (CEC) Header

The board contains two mutually-exclusive methods for controlling HDMI CEC devices:

• External CEC adaptor connected via CEC connector (item K in Figure 12; pinout in Table 20)

• Onboard CEC control from the embedded controller via HDMI cable and BIOS setup. Expected

behavior is provided in Table 25 below.

Table 25. HDMI CEC expected behavior

Wake On TV Off Off TV on PC on

Standby by TV On On TV Standby PC sleep or power off4

Auto Turn Off TV (S0 -> S5) On On PC Shutdown TV standby3

Auto Turn On TV (S5 -> S0) Off Off PC On TV on3

Auto Turn Off TV (S0 -> S3) On On PC Sleep TV standby3

Auto Turn On TV (S3 -> S0) Off Off PC On TV on3

Notes:

1. HDMI CEC Control enabled in BIOS Setup and in TV setup, if necessary. Please consult your TV’s documentation.

2. Fast Boot and Deep S4/S5 disabled in BIOS Setup.

3. Results seen with Panasonic LED TV VIERA TH-40A400W. Other TVs may have different results due to variable implementations of

CEC features.

4. PC power off behavior dependent upon power button setting in operating system.

5. If using external CEC adaptor, onboard CEC control must be disabled in BIOS Setup.

NOTE

CEC Connector is Aces part number 50273-0047C-002, 1.25 mm pitch header, surface mount, vertical, lead-free, 4 circuits.

DMIProduct.pdf

2.2.4.10 Front Panel LED Ring

The board supports a front panel HDD LED ring which is connected through Item C shown in Figure 12. The Front panel HDD LED Ring is configurable within the bios under the Power tab within Advanced settings. Table 21 lists the signal names of the front panel LED ring connector. Table 26 lists the available settings for the front panel LED ring within BIOS.

Table 26. Front Panel LED Ring Options

Bios Option Possible Configurations

Front Panel HDD LED Ring Color Yellow, cyan, magenta, blue, red, green and white.

Front Panel HDD LED Ring Brightness

0%, 50% 100%

Front Panel HDD LED Ring Activity Indicator

None, Power indicator, HDD Activity or Software defined

2.2.4.11 Digital Microphone Array

The digital microphone array consists of dual front facing digital microphones located on either side of the front panel HDD LED ring to minimize acoustic interference. The digital microphone array is intended to be used with a digital assistant like Mircosoft’s Cortana*. Item L in Figure 12 shows the location of the digital microphone array connector. Table 18 lists the signal names of the DMIC connector. See Chapter ?? for the physical location of the DMIC array on the Intel NUC Kit NUC7i5BN[x] and Intel NUC Kit NUC7i7BNH chassis.

2.3 BIOS Security Jumper

CAUTION

Do not move a jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.

Figure 16 shows the location of the BIOS Security Jumper. The 3-pin jumper determines the BIOS Security program’s mode.

Table 20 describes the jumper settings for the three modes: normal, lockdown, and configuration.

Technical Reference

Figure 16. Location of the BIOS Security Jumper

Normal

1-2

The BIOS uses current configuration information and passwords for

Lockdown

2-3

The BIOS uses current configuration information and passwords for

Table 20 lists the settings for the jumper.

Table 20. BIOS Security Jumper Settings

Function/Mode Jumper Setting Configuration

Configuration None BIOS Recovery Update process if a matching *.bio file is found. Recovery

booting.

booting, except:

• All POST Hotkeys are suppressed (prompts are not displayed and keys are not accepted. For example, F2 for Setup, F10 for the Boot Menu).

• Power Button Menu is not available (see Section 3.7.4 Power Button Menu).

BIOS updates are not available except for automatic Recovery due to flash corruption.

Update can be cancelled by pressing the Esc key.

If the Recovery Update was cancelled or a matching *.bio file was not found, a Config Menu will be displayed. The Config Menu consists of the following (selected Power Button Menu options):

[1] Suppress this menu until the BIOS Security Jumper is replaced.

[2] Clear BIOS User and Supervisor Passwords.

See Section 3.7.4 Power Button Menu.

2.4 Mechanical Considerations

2.4.1 Form Factor

The board is designed to fit into a custom chassis. Figure 17 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters].

Technical Reference

Figure 17. Board Dimensions

Fan Header

Maximum Available Current

Figure 18 shows the height dimensions of the board.

Figure 18. Board Height Dimensions

2.5 Electrical Considerations

2.5.1 Power Supply Considerations

System power requirements will depend on actual system configurations chosen by the integrator, as well as end user expansion preferences. It is the system integrator’s responsibility to ensure an appropriate power budget for the system configuration is properly assessed based on the system-level components chosen.

2.5.2 Fan Header Current Capability

Table 27 lists the current capability of the fan header.

Table 27. Fan Header Current Capability

Processor fan .5 A

2.6 Thermal Considerations

CAUTION

Technical Reference

A chassis with a maximum internal ambient temperature of 50 oC at the processor fan inlet is recommended. If the internal ambient temperature exceeds 50 required to ensure components do not exceed their maximum case temperature.

C, further thermal testing is

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board.

All responsibility for determining the adequacy of any thermal or system design remains solely with the system integrator. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in shorter than expected product lifetime.

Item

Description

Figure 19 shows the locations of the localized high temperature zones.

A Processor voltage regulator area B Thermal solution

Figure 19. Localized High Temperature Zones

Technical Reference

A thermal pad has been installed for the bottom of the chassis to improve the thermal performance when using M.2 devices that operate at higher temperatures. If the thermal pad ever needs to be replaced, Figure 20 shows the installation area of the thermal pad for the Intel NUC Kit NUC7i5BNK.

Item Description

A Thermal Pad B Thermal Pad Installation Area

Figure 20. Installation Area of Thermal Pad for Intel NUC Kit NUC7i5BNK

Item

Description

Thermal Pad

Figure 21 shows the installation area of the thermal pad for the Intel NUC Kit NUC7i5BNH/NUC7i7BNH.

B Thermal Pad Installation Area

Figure 21. Installation area of Thermal Pad for Intel NUC Kit NUC7i5BNH/NUC7i7BNH

Technical Reference

Component

Maximum Case Temperature

Processor

For processor case temperature, see processor datasheets and processor

Component

Tcontrol

For information about

Refer to

Processor datasheets and specification updates

Section 1.2, page 20

Table 28 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.

Table 28. Thermal Considerations for Components

specification updates

To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 29. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components). When the component is dissipating less than TDP, the case temperature should be below the Maximum Case Temperature. The surface temperature at the geometric center of the component corresponds to Case Temperature.

It is important to note that the temperature measurement in the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is Tcontrol.

Table 29. Tcontrol Values for Components

Processor For processor case temperature, see processor datasheets and processor

specification updates

Temperature

Non-Operating

-40 °C to +60 °C

Operating

0 °C to +35 °C

Unpackaged

50 g trapezoidal waveform

Velocity change of 170 inches/s²

Packaged

Half sine 2 millisecond

<20

167 21-40

152

41-80

136

Vibration

Unpackaged

5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz

20 Hz to 500 Hz: 0.02 g² Hz (flat)

40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

2.7 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332 Issue 2, Method I, Case 3, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF for Intel NUC7i5BNB board is TBD. The MTBF for Intel NUC7i7BNB board is TBD.

2.8 Environmental

Table 30 lists the environmental specifications for the board.

Table 30. Environmental Specifications

Parameter Specification

The operating temperature of the board may be determined by measuring the air temperature from the junction of the heatsink fins and fan, next to the attachment screw, in a closed chassis, while the system is in operation.

Shock

Product Weight (pounds) Free Fall (inches) Velocity Change (inches/s²)

81-100 18 118

Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)

Note: Before attempting to operate this board, the overall temperature of the board must be above the minimum

operating temperature specified. It is recommended that the board temperature be at least room temperature before attempting to power on the board. The operating and non-operating environment must avoid condensing humidity.

3 Overview of BIOS Features

3.1 Introduction

The board uses Intel Visual BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the Visual BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support.

The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as BNKBL357.86A.

The Visual BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins.

NOTE

The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on page 56 shows how to put the board in configure mode.

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 64 Mb flash memory device.

3.3 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network.

The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:

• BIOS data, such as the BIOS revision level

• Fixed-system data, such as peripherals, serial numbers, and asset tags

• Resource data, such as memory size, cache size, and processor speed

• Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page.

3.4 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and

configure the BIOS Setup program and the maintenance menu.

4. POST completes.

5. The operating system loads. While the operating system is loading, USB keyboards and mice

are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.)

6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are

recognized by the operating system, and Legacy USB support from the BIOS is no longer used.

Overview of BIOS Features

For information about

Refer to

BIOS update utilities

http://www.intel.com/content/www/us/en/support/boards-an d-

To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installation instructions.

3.5 BIOS Updates

The BIOS can be updated using one of the following methods:

• Intel Express BIOS Update Utility, which enables automated updating while in the Windows

environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web.

• Intel Flash Memory Update Utility, which requires booting from DOS. Using this utility, the

BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM.

• Intel®

• Intel® Visual BIOS has an option to update the BIOS from a valid .bio file located on a hard

• Using Front Panel menu option

Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.

F7 switch during POST allows a user to select where the BIOS .bio file is located and

perform the update from that location/device. Similar to performing a BIOS Recovery without removing the BIOS configuration jumper.

disk or USB drive. Enter Intel Visual BIOS by pressing <F2> during POST.

NOTE

Review the instructions distributed with the upgrade utility before attempting a BIOS update.

kits/000005636.html

3.5.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the Intel web site for support.

3.6 BIOS Recovery

3.6

It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 31 lists the drives and media types that can and cannot be used

3.6

for BIOS recovery. The BIOS recovery media does not need to be made bootable.

3.6

Media Type

(Note)

Can be used for BIOS recovery?

Hard disk drive (connected to SATA or USB)

Yes

CD/DVD drive (connected to SATA or USB)

Yes

USB diskette drive (with a 1.4 MB diskette)

No (BIOS update file is bigger than 1.4 MB size limit)

For information about

Refer to

BIOS recovery

http://www.intel.com/support/motherboards/desktop/sb/cs-034524.htm

Table 31. Acceptable Drives/Media Types for BIOS Recovery

USB flash drive Yes

NOTE

Supported file systems for BIOS recovery:

• NTFS (sparse, compressed, or encrypted files are not supported)

• FAT32

• FAT16

• FAT12

• ISO 9660

Overview of BIOS Features

<Enter>

Exits the menu, and boots from the selected device

<Esc>

Exits the menu and boots according to the boot priority defined

3.7 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.

NOTE

Optical drives are not supported by the onboard SATA connectors. Optical drives are supported only via the USB interfaces.

3.7.1 Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.

3.7.2 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present:

• Video adapter

• Keyboard

• Mouse

3.7.3 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices. Table 32 lists the boot device menu options.

Table 32. Boot Device Menu Options

Boot Device Menu Function Keys Description

<↑> or <↓> Selects a default boot device

through BIOS setup

3.7.4 Power Button Menu

As an alternative to Back-to-BIOS Mode or normal POST Hotkeys, the user can use the power button to access a menu. The Power Button Menu is accessible via the following sequence:

1. System is in S4/S5 (not G3)

2. User pushes the power button and holds it down for 3 seconds

3. The front panel power button LED will change from Blue to Amber when the user can release

the power button.

4. User releases the power button before the 4-second shutdown override

If this boot path is taken, the BIOS will use default settings, ignoring settings in VPD where possible.

At the point where Setup Entry/Boot would be in the normal boot path, the BIOS will display the following prompt and wait for a keystroke:

[ESC] Normal Boot

[F2] Intel Visual BIOS

[F3] Disable Fast Boot

[F4] BIOS Recovery

[F7] Update BIOS

[F10] Enter Boot Menu

[F12] Network Boot

[F2] Enter Setup is displayed instead if Visual BIOS is not supported.

[F3] Disable Fast Boot is only displayed if at least one Fast Boot optimization is enabled.

[F9] Remote Assistance is only displayed if Remote Assistance is supported.

If an unrecognized key is hit, then the BIOS will beep and wait for another keystroke. If one of the listed hotkeys is hit, the BIOS will follow the indicated boot path. Password requirements must still be honored.

If Disable Fast Boot is selected, the BIOS will disable all Fast Boot optimizations and reset the system.

Overview of BIOS Features

Password Set

Password During Boot

Neither

None

Master only

None

User only

Master and User Set

Master or User

3.8 Hard Disk Drive Password Security Feature

The Hard Disk Drive Password Security feature blocks read and write accesses to the hard disk drive until the correct password is given. Hard Disk Drive Passwords are set in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3 resume, the system BIOS will automatically unlock drives on resume from S3. Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 19 characters in length.

The User hard disk drive password, when installed, will be required upon each power-cycle until the Master Key or User hard disk drive password is submitted.

The Master Key hard disk drive password, when installed, will not lock the drive. The Master Key hard disk drive password exists as an unlock override in the event that the User hard disk drive password is forgotten. Only the installation of the User hard disk drive password will cause a hard disk to be locked upon a system power-cycle.

Table 33 shows the effects of setting the Hard Disk Drive Passwords.

Table 33. Master Key and User Hard Drive Password Functions

During every POST, if a User hard disk drive password is set, POST execution will pause with the following prompt to force the user to enter the Master Key or User hard disk drive password:

Enter Hard Disk Drive Password:

Upon successful entry of the Master Key or User hard disk drive password, the system will continue with normal POST.

If the hard disk drive password is not correctly entered, the system will go back to the above prompt. The user will have three attempts to correctly enter the hard disk drive password. After the third unsuccessful hard disk drive password attempt, the system will halt with the message:

Hard Disk Drive Password Entry Error

A manual power cycle will be required to resume system operation.

NOTE

As implemented on Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB, Hard Disk Drive Password Security is only supported on either SATA port 0 (M.2 ) or SATA Port 1 (onboard SATA connector). The passwords are stored on the hard disk drive so if the drive is relocated to another computer that does not support Hard Disk Drive Password Security feature, the drive will not be accessible.

Currently, there is no industry standard for implementing Hard Disk Drive Password Security on AHCI or NVME drives. Hard drive encryption can still be implemented and does not require Hard Disk Drive Password Security.

Supervisor

Password to

Password

Neither

Can change all

None

Supervisor only

Can change all

Can change a

Supervisor Password

Supervisor

None

Supervisor and

Can change all

Can change a

Supervisor Password

Supervisor or

3.9 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions:

• The supervisor password gives unrestricted access to view and change all the Setup options

in the BIOS Setup program. This is the supervisor mode.

• The user password gives restricted access to view and change Setup options in the BIOS

Setup program. This is the user mode.

• If only the supervisor password is set, pressing the <Enter> key at the password prompt of

the BIOS Setup program allows the user restricted access to Setup.

• If both the supervisor and user passwords are set, users can enter either the supervisor

password or the user password to access Setup. Users have access to Setup respective to which password is entered.

• Setting the user password restricts who can boot the computer. The password prompt will be

displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer.

• For enhanced security, use different passwords for the supervisor and user passwords.

• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 20 characters in

length.

• To clear a set password, enter a blank password after entering the existing password.

Table 34 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen.

Table 34. Supervisor and User Password Functions

Password Set

User only N/A Can change all

user set

Note: If no password is set, any user can change all Setup options.

Mode

options

(Note)

User Mode Setup Options

options

limited number of options

options

limited number of options

(Note)

Enter Password Clear User Password

Enter Password

Enter Setup

User User

user

During Boot

user

Power-on

Solid on primary color. Indicates S0 state.

Default to On; can be disabled

S3 Standby

Blink alternate color .25 seconds on, .25 seconds off,

Default behavior; can be

Intel Ready Mode

Blink primary color, 1 second on, 1 second off,

Memory error

On-off (1.0 second each) three times, then 2.5-second

Thermal trip warning

Blink primary color .25 seconds on, .25 seconds off, .25 seconds on, .25 seconds off. This will result in a total of

Error Message

Explanation

CMOS Battery Low

The battery may be losing power. Replace the battery soon.

Memory Size Decreased

Memory size has decreased since the last boot. If no memory was No Boot Device Available

System did not find a device to boot.

4 Error Messages and Blink Codes

4.1 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 35).

Table 35. Front-panel Power LED Blink Codes

Type Pattern Note

via BIOS Setup

indefinitely. Indicates S3 state.

indefinitely.

BIOS update in progress Off when the update begins, then primary color on for

0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete.

pause (off), entire pattern repeats (blinks and pause) until the system is powered off.

16 blinks (blink for 8 seconds).

4.2 BIOS Error Messages

Table 30 lists the error messages and provides a brief description of each.

Table 30. BIOS Error Messages

CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been

corrupted. Run Setup to reset values.

changed via BIOS Setup

removed, then memory may be bad.

Kensington* Anti-Theft Key Lock Hole Micro SDXC Card Reader

Power Switch and Power LED

Speaker/Headset Jack

USB 3.0 Connectors

5 Intel NUC Kit Features

5.1 Chassis Front Panel Features

Intel NUC Board NUC7i5BNB board can be found integrated into Intel® NUC Kit NUC7i5BNH and Intel® NUC Kit NUC7i5BNK. Intel NUC Board NUC7i7BNB board can be found integrated into Intel® NUC Kit NUC7i7BNH. Figure 22 and Figure 23 shows the location of the features located on or near the front of the chassis.

Figure 22. Intel NUC Kit NUC7i5BNH/NUC7i7BNH Features – Front

Table 36 lists the components identified in Figure 22.

Table 36. Components Shown in Figure 22

Item from Figure 22 Description

Digital Microphone Array

Consumer Infrared Sensor

Regulatory Compliance and Battery Disposal Information

Figure 23

Micro SDXC Card Reader Digital Microphone Array

Speaker/Headset Jack

Consumer Infrared Sensor

Figure 23. Intel NUC Kit NUC7i5BNK Features – Front

Table 37 lists the components identified in Figure 23.

Table 37. Components Shown in Figure 23

Item from

Description

Power Switch and Power LED

USB 3.0 Connectors

Cooling Vents

Thunderbolt™ 3 via Type-C connector USB 3.0 Connectors

Ethernet Port

5.3 Chassis Rear Panel Features

Figure 24 shows the location of the features located on the rear of the chassis.

Figure 24. Intel NUC Kit NUC7i5BNH/NUC7i7BNH Features – Rear

Table 38 lists the components identified in Figure 24.

Table 38. Components Shown in Figure 24

Item from Figure 24 Description

19V DC Power Inlet

High Definition Multimedia Interface Connector

Regulatory Compliance and Battery Disposal Information

Figure 25

Cooling Vents

Thunderbolt™ 3 via Type-C connector USB 3.0 Connectors

Ethernet Port

High Definition Multimedia Interface Connector

Figure 25 shows the location of the features located on the rear of the chassis.

Figure 25. Intel NUC Kit NUC7i5BNK Features – Rear

Table 38 lists the components identified in Figure 25.

Table 39. Components Shown in Figure 25

Item from

Description

Kensington* Anti-Theft Key Lock Hole

19V DC Power Inlet

Intel BLKNUC7I7BNB User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1 Product Description

1.1 Overview

1.1.1 Feature Summary

1.1.2 Board Layout (Top)

1.1.3 Board Layout (Bottom)

1.1.4 Block Diagram

1.2 Online Support

1.3 Processor

1.4 System Memory

1.5 Processor Graphics Subsystem

1.5.1 Integrated Graphics

1.5.1.1 Intel® High Definition (Intel® HD) Graphics

1.5.1.2 Video Memory Allocation

1.5.1.3 High Definition Multimedia Interface* (HDMI*)

1.5.1.4 DisplayPort* via USB Type-C

1.5.1.4.1 DisplayPort 1.2 Multi-Stream Transport Daisy-Chaining

1.5.1.5 Multiple DisplayPort and HDMI Configurations

1.5.1.6 High-bandwidth Digital Content Protection (HDCP)

1.5.1.7 Integrated Audio Provided by the HDMI and Type C Interfaces

1.6 USB

1.7 SATA Interface

1.7.1 AHCI Mode

1.7.2 Intel® Rapid Storage Technology / SATA RAID

1.7.3 Intel® Next Generation Storage Acceleration

1.8 Thunderbolt 3

1.9 Real-Time Clock Subsystem

1.10 Audio Subsystem

1.10.1 Audio Subsystem Software

1.11 LAN Subsystem

1.11.1 Intel® I219V Gigabit Ethernet Controller

1.11.2 LAN Subsystem Software

1.11.3 RJ-45 LAN Connector with Integrated LEDs

1.11.4 Wireless Network Module

1.12 Hardware Management Subsystem

1.12.1 Hardware Monitoring

1.12.2 Fan Monitoring

1.12.3 Thermal Solution

1.13 Power Management

1.13.1 ACPI

1.13.1.1 System States and Power States

1.13.1.2 Wake-up Devices and Events

1.13.2 Hardware Support

1.13.2.1 Power Input

1.13.2.2 Instantly Available PC Technology

1.13.2.3 LAN Wake Capabilities

1.13.2.4 Wake from USB

1.13.2.5 WAKE# Signal Wake-up Support

1.13.2.6 Wake from S5

1.13.2.7 Wake from Consumer IR

1.13.2.8 +5 V Standby Power Indicator LED

1.14 Intel Platform Security Technologies

1.14.1 Intel® Virtualization Technology

1.14.2 Intel® Platform Trust Technology

2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory

2.2 Connectors and Headers

2.2.1 Front Panel Connectors

2.2.2 Back Panel Connectors

2.2.3 Headers and Connectors (Top)

2.2.4 Connectors and Headers (Bottom)

2.2.4.1 Signal Tables for the Connectors and Headers

2.2.4.2 Add-in Card Connectors

2.2.4.3 Type C connector

2.2.4.4 Front Panel Header (2.0 mm Pitch)

2.2.4.4.1 Hard Drive Activity LED Header

2.2.4.4.2 Reset Switch Header

2.2.4.4.3 Power/Sleep LED Header

2.2.4.4.4 Power Switch Header

2.2.4.5 Micro SDXC Card Reader

2.2.4.6 Power Supply Connector

2.2.4.6.1 Power Sensing Circuit

2.2.4.7 Internal USB 2.0 Single-Port Header (1.25 mm Pitch)

2.2.4.8 Consumer Infrared (CIR) Sensor

2.2.4.9 Consumer Electronics Control (CEC) Header

2.2.4.10 Front Panel LED Ring