Intel BLKNUC7I7BNB User Manual

Intel® NUC Board NUC7i5BNB and Intel® NUC Board NUC7i7BNB
Technical Product Specification
October 2017
Order Number: J59951-006
Revision History
003
Spec change
June 2017
004
Spec change
June 2017
005
Spec change
June 2017
Revision Revision History Date
001 First release of the Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB
Technical Product Specification
002 Spec Change May 2017
006 Spec change October 2017
Disclaimer
This product specification applies to only the standard Intel NUC Board with BIOS identifier BNKBL357.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:
Learn About Intel
Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright  2017 Intel Corporation. All rights reserved.
®
Processor Numbers
March 2017
Board Identification Information
AA Revision
BIOS Revision
Notes
J31144-301
BNKBL357.86A
1,2
Device
Stepping
S-Spec Numbers
Intel Core i5
J1
SR363
AA Revision
BIOS Revision
Notes
J31145-301
BNKBL357.86A
1,2
Device
Stepping
S-Spec Numbers
Intel Core i7
J1
SR367
Product Name
Intel® NUC
Differentiating Features
NUC7i5BNK
Kit with power adapter
NUC7i5BNHX1
HDD kit with power adapter, 16GB Intel® Optane™ Module
NUC7i5BNHXF
HDD kit with power adapter, 16GB Intel® Optane™ Module, 1TB HDD,
NUC7i5BNKP
HDD k.it with power adapter, Intel® 600p M.2 NVMe SSD, 4GB DDR4­NUC7i7BNHX1
HDD kit with power adapter, 32GB Intel® Optane™ Module
NUC7i7BNHXG
32GB Intel® Optane™ Module, 2TB HDD, 8GB DDR4-2400 SDRAM
[1]
,
NUC7i7BNKQ
Intel® 600p M.2 NVMe SSD, 8GB DDR4-2400 SDRAM
[1]
, Microsoft*
Basic Intel® NUC Board NUC7i5BNB Identification Information
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Intel® Core™ i5-7260U processor is used on this AA revision consisting of the following component:
Basic Intel® NUC Board NUC7i7BNB Identification Information
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The Intel® Core™ i7-7567U processor is used on this AA revision consisting of the following component:
Product Identification Information
Intel® NUC Products NUC7i{x}BN{x} Identification Information
Board
NUC7i5BNH HDD kit with power adapter
NUC7i5BNB
J31144-xxx
NUC7i7BNH
NUC7i7BNB
J31145-xxx
Notes:
1. The maximum supported memory speed of the Intel NUC board NUC7i[x]BNB is 2133 MHz Memory modules of
higher speeds will be down-clocked to 2133 MHz
4GB DDR4-2400 SDRAM
2400 SDRAM
HDD kit with power adapter
Microsoft* Windows* 10 Home,
Windows* 10 Home
[1]
, Microsoft Windows 10 Home
[1]
, Microsoft Windows 10 Home
iii
Intel NUC Board NUC7i5BNB, Intel NUC Board NUC7i7BNB Technical Product Specification
Date
Type of Change
Description of Changes or Clarifications
May 2017
Specification
Remove reference to "RAID 0 auto replace" in the Intel® Rapid Storage
Replace Figure 3 on page 21
June 2017
Specification
Revised step 3 of “Power Button Menu” section
June 2017
Specification
Corrected block diagram in Figure 3
October 2017
Specification
Updated Product Identification table
Specification Changes or Clarifications
The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB.
Specification Changes or Clarifications
Change
June 2017 Specification
Change
Change
Change
Change
Technology / SATA RAID section.
• Change all references of HDMI 2.0 to HDMI 2.0a:
• On page 15 in the audio section
• On page 25 in section 1.5.1.3
• On page 27 in section 1.5.1.5
• In the Thunderbolt 3 section (1.8) on page 30:
The last sentence says “Item J in Figure 12 shows…” is changed to “Item A
in Figure 11 shows…”
On page 3, change the Product Identification matrix to include 2 new rows for NUC7i5BNHX1 and NUC7i7BNHX1
Updated section 1.5.1.7 “Integrated Audio Provided by the HDMI…” to change 192Khz/24 bit to “176.4kHz/24 bit
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See
http://www.intel.com/content/www/us/en/nuc/overview.html
for the latest documentation.
iv
Preface
Chapter
Description
1
A description of the hardware used on Intel NUC Board NUC7i5BNB and Intel NUC Board 2
A map of the resources of the Intel NUC Board
3
The features supported by the BIOS Setup program
4
A description of the BIOS error messages, beep codes, and POST codes
5
A description of the Intel NUC kit NUC7i5BN[x] and Intel NUC kit NUC7i7BNH features
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Board NUC7i5BNB and Intel® NUC Board NUC7i7BNB.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel® NUC Board NUC7i5BNB and Intel® NUC Board NUC7i7BNB and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
NUC7i7BNB
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel NUC Board NUC7i5BNB, Intel NUC Board NUC7i7BNB Technical Product Specification
GB
Gigabyte (1,073,741,824 bytes)
GB/s
Gigabytes per second
Gb/s
Gigabits per second
Kb
Kilobit (1024 bits)
kb/s
1000 bits per second
MB
Megabyte (1,048,576 bytes)
Mb
Megabit (1,048,576 bits)
Mb/s
Megabits per second
TDP
Thermal Design Power
x.x V
Volts. Voltages are DC unless otherwise specified.
*
This symbol is used to indicate third-party brands and names that are the property of their respective
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
KB Kilobyte (1024 bytes)
MB/s Megabytes per second
Xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
owners.
vi
Contents
Revision History ............................................................................................................... ii
Disclaimer .................................................................................................................................................................. ii
Board Identification Information ..................................................................................................................... iii
Product Identification Information ................................................................................................................. iii
Errata ........................................................................................................................................................................... iv
Preface ............................................................................................................................... v
Intended Audience ................................................................................................................................................. v
What This Document Contains ......................................................................................................................... v
Typographical Conventions ............................................................................................................................... v
Contents .......................................................................................................................... vii
1 Product Description ............................................................................................... 13
1.1 Overview ...................................................................................................................................................... 13
1.1.1 Feature Summary .................................................................................................................. 13
1.1.2 Board Layout (Top) ............................................................................................................... 15
1.1.3 Board Layout (Bottom) ........................................................................................................ 17
1.1.4 Block Diagram ......................................................................................................................... 19
1.2 Online Support .......................................................................................................................................... 20
1.3 Processor ..................................................................................................................................................... 20
1.4 System Memory ........................................................................................................................................ 21
1.5 Processor Graphics Subsystem .......................................................................................................... 23
1.5.1 Integrated Graphics .............................................................................................................. 23
1.6 USB ................................................................................................................................................................. 26
1.7 SATA Interface ........................................................................................................................................... 26
1.7.1 AHCI Mode ................................................................................................................................ 27
1.7.2 Intel® Rapid Storage Technology / SATA RAID ......................................................... 27
1.7.3 Intel® Next Generation Storage Acceleration ............................................................. 27
1.8 Thunderbolt 3 ............................................................................................................................................ 28
1.9 Real-Time Clock Subsystem ................................................................................................................ 28
1.10 Audio Subsystem ..................................................................................................................................... 28
1.10.1 Audio Subsystem Software ............................................................................................... 29
1.11 LAN Subsystem ......................................................................................................................................... 29
1.11.1 Intel® I219V Gigabit Ethernet Controller ..................................................................... 29
1.11.2 LAN Subsystem Software ................................................................................................... 30
1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................................................. 31
1.11.4 Wireless Network Module .................................................................................................. 32
1.12 Hardware Management Subsystem ................................................................................................. 32
1.12.1 Hardware Monitoring ........................................................................................................... 32
vii
1.12.2 Fan Monitoring ........................................................................................................................ 32
1.12.3 Thermal Solution ................................................................................................................... 32
1.13 Power Management ................................................................................................................................ 34
1.13.1 ACPI ............................................................................................................................................. 34
1.13.2 Hardware Support ................................................................................................................. 37
1.14 Intel Platform Security Technologies .............................................................................................. 39
1.14.1 Intel® Virtualization Technology ...................................................................................... 39
1.14.2 Intel® Platform Trust Technology ................................................................................... 39
2 Technical Reference ............................................................................................... 41
2.1 Memory Resources .................................................................................................................................. 41
2.1.1 Addressable Memory ........................................................................................................... 41
2.2 Connectors and Headers....................................................................................................................... 41
2.2.1 Front Panel Connectors ...................................................................................................... 42
2.2.2 Back Panel Connectors ....................................................................................................... 42
2.2.3 Headers and Connectors (Top) ........................................................................................ 43
2.2.4 Connectors and Headers (Bottom) ................................................................................. 44
2.3 BIOS Security Jumper ............................................................................................................................ 56
2.4 Mechanical Considerations .................................................................................................................. 59
2.4.1 Form Factor .............................................................................................................................. 59
2.5 Electrical Considerations ...................................................................................................................... 60
2.5.1 Power Supply Considerations .......................................................................................... 60
2.5.2 Fan Header Current Capability ......................................................................................... 60
2.6 Thermal Considerations ........................................................................................................................ 61
2.7 Reliability ..................................................................................................................................................... 66
2.8 Environmental ........................................................................................................................................... 66
3 Overview of BIOS Features ................................................................................... 67
3.1 Introduction ................................................................................................................................................ 67
3.2 BIOS Flash Memory Organization ..................................................................................................... 68
3.3 System Management BIOS (SMBIOS) .............................................................................................. 68
3.4 Legacy USB Support ............................................................................................................................... 68
3.5 BIOS Updates ............................................................................................................................................. 69
3.5.1 Language Support ................................................................................................................. 69
3.6 BIOS Recovery ........................................................................................................................................... 69
3.7 Boot Options .............................................................................................................................................. 71
3.7.1 Network Boot........................................................................................................................... 71
3.7.2 Booting Without Attached Devices ................................................................................ 71
3.7.3 Changing the Default Boot Device During POST ...................................................... 71
3.7.4 Power Button Menu .............................................................................................................. 72
3.8 Hard Disk Drive Password Security Feature .................................................................................. 73
3.9 BIOS Security Features .......................................................................................................................... 74
4 Error Messages and Blink Codes ......................................................................... 75
4.1 Front-panel Power LED Blink Codes ................................................................................................ 75
viii
Contents
4.2 BIOS Error Messages ............................................................................................................................... 75
5 Intel NUC Kit Features ........................................................................................... 76
5.1 Chassis Front Panel Features .............................................................................................................. 76
5.3 Chassis Rear Panel Features ................................................................................................................ 78
ix
Figures
Figure 1. Major Board Components (Top) ....................................................................................................... 15
Figure 2. Major Board Components (Bottom) ................................................................................................ 17
Figure 3. Block Diagram ........................................................................................................................................... 19
Figure 4. Memory Channel and SO-DIMM Configuration.......................................................................... 22
Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ............................................................................... 29
Figure 6. LAN Connector LED Locations........................................................................................................... 31
Figure 7. Thermal Solution and Fan Header ................................................................................................... 33
Figure 8. Location of the Standby Power LED ............................................................................................... 38
Figure 9. Front Panel Connectors ........................................................................................................................ 42
Figure 10. Back Panel Connectors ...................................................................................................................... 42
Figure 11. Headers and Connectors (Top) ....................................................................................................... 43
Figure 12. Connectors and Headers (Bottom) ............................................................................................... 44
Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch) ............................................ 50
Figure 14. Connection Diagram for the Internal USB 2.0 Single-Port Header (1.25 mm Pitch) 54
Figure 15. Location of the CIR Sensor ............................................................................................................... 54
Figure 16. Location of the BIOS Security Jumper ........................................................................................ 57
Figure 17. Board Dimensions ................................................................................................................................ 59
Figure 18. Board Height Dimensions ................................................................................................................. 60
Figure 19. Localized High Temperature Zones ............................................................................................. 62
Figure 20. Installation Area of Thermal Pad for Intel NUC Kit NUC7i5BNK ...................................... 63
Figure 21. Installation area of Thermal Pad for Intel NUC Kit NUC7i5BNH/NUC7i7BNH ............ 64
Figure 22. Intel NUC Kit NUC7i5BNH/NUC7i7BNH Features – Front .................................................... 76
Figure 23. Intel NUC Kit NUC7i5BNK Features – Front ................................................................................ 77
Figure 24. Intel NUC Kit NUC7i5BNH/NUC7i7BNH Features – Rear ...................................................... 78
Figure 25. Intel NUC Kit NUC7i5BNK Features – Rear ................................................................................. 79
Tables
Table 1. Feature Summary ..................................................................................................................................... 13
Table 2. Components Shown in Figure 1 ......................................................................................................... 16
Table 3. Components Shown in Figure 2 ......................................................................................................... 18
Table 4. Supported Memory Configurations .................................................................................................. 21
Table 5. Unsupported Memory Configurations............................................................................................. 21
Table 6. DisplayPort Multi-Streaming Resolutions ...................................................................................... 24
Table 7. Multiple Display Configuration Maximum Resolutions ............................................................ 25
Table 8. Audio Formats Supported by the HDMI and Type C Interfaces ........................................... 25
Table 9. LAN Connector LED States ................................................................................................................... 31
Table 10. Effects of Pressing the Power Switch ............................................................................................ 34
Table 11. Power States and Targeted System Power ................................................................................. 35
Table 12. Wake-up Devices and Events ........................................................................................................... 36
Table 13. Headers and Connectors Shown in Figure 11 ........................................................................... 43
Table 14. Connectors and Headers Shown in Figure 12 ........................................................................... 45
Table 15. SATA Power Connector (1.25 mm pitch) ..................................................................................... 46
x
Contents
Table 16. Single-Port Internal USB 2.0 Header (1.25 mm pitch) ........................................................... 46
Table 17. M.2 2280 Module (key type M) Connector .................................................................................. 46
Table 18. Digital Microphone (DMICS) Array Connector (1.25 mm Pitch).......................................... 47
Table 19. Front Panel HDD LED Ring Connector (1.25 mm Pitch) ........................................................ 48
Table 20. CEC Header (1.25 mm pitch) ............................................................................................................. 48
Table 21. Front Panel Header (2.0 mm Pitch) ................................................................................................ 49
Table 22. States for a One-Color Power LED ................................................................................................. 50
Table 23. States for a Dual-Color Power LED ................................................................................................ 50
Table 24. SDXC Card Reader Connector .......................................................................................................... 52
Table 25. HDMI CEC expected behavior ............................................................................................................ 55
Table 26. Front Panel LED Ring Options .......................................................................................................... 55
Table 27. Fan Header Current Capability ......................................................................................................... 60
Table 28. Thermal Considerations for Components ................................................................................... 65
Table 29. Tcontrol Values for Components ................................................................................................... 65
Table 30. Environmental Specifications ........................................................................................................... 66
Table 31. Acceptable Drives/Media Types for BIOS Recovery ............................................................... 70
Table 32. Boot Device Menu Options ................................................................................................................ 71
Table 33. Master Key and User Hard Drive Password Functions ........................................................... 73
Table 34. Supervisor and User Password Functions................................................................................... 74
Table 35. Front-panel Power LED Blink Codes ............................................................................................. 75
Table 36. Components Shown in Figure 22 ................................................................................................... 76
Table 37. Components Shown in Figure 23 ................................................................................................... 77
Table 38. Components Shown in Figure 24 ................................................................................................... 78
Table 39. Components Shown in Figure 25 ................................................................................................... 79
xi
4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)
Processor
A soldered-down 7
th
generation Intel® Core™ i5-7260U dual-core processor with up to a
Memory
Two 260-pin 1.2 V DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM)
Graphics
Integrated graphics support for processors with Intel® Graphics Technology:
Audio
Intel® High Definition (Intel
®
HD) Audio via the HDMI v2.0 and Type-C interfaces through
Storage
• SATA ports:

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of Intel® NUC Board NUC7i5BNB and Intel® NUC Board NUC7i7BNB.
Table 1. Feature Summary
Form Factor
maximum 15 W TDP (if thermal margin available)
Intel® Iris™ Plus Graphics 640 Integrated memory controllerIntegrated PCH
A soldered-down 7
maximum 28 W TDP (if thermal margin available)
Intel® Iris™ Plus Graphics 650 Integrated memory controllerIntegrated PCH
th
generation Intel® Core™ i7-7567U dual-core processor with up to a
sockets
Support for DDR4 1866/2133 MHz SO-DIMMs
Support for 4 Gb and 8 Gb memory technology
Support for up to 32 GB of system memory with two SO-DIMMs using 8 Gb memory
technology
Support for non-ECC memory
Support for 1.2 V low voltage JEDEC memory only
Note: 2 Gb memory technology (SDRAM Density) is not compatible
One High Definition Multimedia Interface* (HDMI*) back panel connectorOne Type C back panel connector
the processor
Realtek HD Audio via a stereo microphone/headphone 3.5 mm jack on the front panel
Digital microphone array (DMICS) connector (internal)
― One SATA 6.0 Gb/s port (black) for 2.5“ storage device
One SATA 6.0 Gb/s port is reserved for an M.2 storage module supporting M.2 2242 and
M.2 2280 (key type M and B+M) modules
Note: Supports key type M and B+M (PCI Express* x1/x2/x4 and SATA)
continued
13
Peripheral Interfaces
One USB 3.1 (Gen 2) port implemented via the external back panel Type C connector
One M.2 connector supporting M.2 2242 and M.2 2280 (key type M and B+M) modules
Intel
®
BIOS resident in the Serial Peripheral Interface (SPI) Flash device
Suspend to RAM support
LAN
Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® I219V Gigabit Ethernet
Wireless
Intel® Dual Band Wireless-AC 8265
Table 1. Feature Summary (continued)
USB 3.0 ports:
USB 2.0 ports:
• Consumer Infrared (CIR)
Expansion Capabilities
One Micro SDXC slot
One Thunderbolt™ 3 via back panel Type C connector
BIOS
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and
Instantly Available PC Technology
Hardware Monitor Subsystem
Wake on PCI Express, LAN, front panel, CIR, and USB ports
Controller
Hardware monitoring subsystem, based on a ITE Tech. IT8987E-VG embedded controller, including:
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
One processor fan header
Fan sense input used to monitor fan activity
Fan speed control
Two ports are implemented with external front panel connectors (one blue and one
orange charging capable)
• Two ports are implemented with external back panel connectors (blue)
Two ports via two single-port internal 1x4 1.25 mm pitch headers (white)
• One port is reserved for the M.2 2230 Wireless module
System Management BIOS (SMBIOS)
802.11ac, Dual Band, 2x2 Wi-Fi + Bluetooth 4.2
• Maximum Transfer speed up to 867Mbps
Supports Intel® Smart Connect Technology
14

1.1.2 Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB.
Product Description
Figure 1. Major Board Components (Top)
15
A
Type C connector
B
Processor fan header
D
Thermal solution
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item from Figure 1 Description
C Battery
16
Product Description

1.1.3 Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board NUC7i5BNB and Intel NUC Board NUC7i7BNB.
Figure 2. Major Board Components (Bottom)
17
Item from
A
Back panel connectors
B
Front panel header
D
Front panel LED ring connector
E
Intel Dual Band Wireless AC + Bluetooth 8265 module
F
Micro SDXC slot
H
Front panel single-port USB 2.0 header (1.25 mm pitch)
I
Front panel single-port USB 2.0 header (1.25 mm pitch)
K
Front panel USB 3.0 connector (blue)
L
SATA 6.0 Gb/s connector
M
Front panel USB 3.0 connector (orange, charging)
N
SATA power connector (1.25 mm pitch)
P
Front panel power button
Q
BIOS security jumper
R
Consumer electronics control (CEC) header
Table 3. Components Shown in Figure 2
Figure 2
C Digital microphone array connector
G M.2 connector (key type M and B+M) for 2242 and 2280 modules
J Consumer Infrared (CIR) sensor
O Front panel stereo microphone/headphone jack
S DDR4 SO-DIMM sockets
Description
18

1.1.4 Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.
Product Description
Figure 3. Block Diagram
19
To find information about…
Visit this World Wide Web site:
Intel NUC Board NUC7i5BNB and Intel NUC Board
http://www.intel.com/NUC
Intel NUC Support
http://www.intel.com/NUCSupport
Available configurations for Intel NUC Board
http://ark.intel.com
Product support page NUC7i5BNK
http://www.intel.com/content/www/us/en/support/boards-and-
Product support page NUC7i5BNH
http://www.intel.com/content/www/us/en/support/boards-and-
Product support page NUC7i7BNH
http://www.intel.com/content/www/us/en/support/boards-and-
BIOS and driver updates
http://downloadcenter.intel.com
Tested memory
http://www.intel.com/content/www/us/en/support/boards-and-
Integration information
http://www.intel.com/NUCSupport
Processor datasheet
http://ark.intel.com

1.2 Online Support

NUC7i7BNB
NUC7i5BNB and Intel NUC Board NUC7i7BNB
kits/intel-nuc-kits/intel-nuc-kit-nuc7i5bnk.html
kits/intel-nuc-kits/intel-nuc-kit-nuc7i5bnh.html
kits/intel-nuc-kits/intel-nuc-kit-nuc7i7bnh.html
BIOS and driver updates for NUC7i5BNK
BIOS and driver updates for NUC7i5BNH
BIOS and driver updates for NUC7i7BNH
https://downloadcenter.intel.com/product/95061
https://downloadcenter.intel.com/product/95067
https://downloadcenter.intel.com/product/95065
kits/000023165.html

1.3 Processor

A soldered-down 7th generation Intel® Core™ i5-7260U dual-core processor with up to a maximum 15 W TDP (if thermal margin is available).
Intel® Iris™ Plus Graphics 640
Integrated memory controller
Integrated PCH
A soldered-down 7 maximum 28 W TDP (if thermal margin is available).
Intel® Iris™ Plus Graphics 650
Integrated memory controller
Integrated PCH
th
generation Intel® Core™ i7-7567U dual-core processor with up to a
NOTE
There are specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 60 for information on power supply requirements.
20
Product Description
SO-DIMM Capacity
Configuration
SDRAM Density
SDRAM Organization Front-side/Back-side
Number of SDRAM Devices
2048 MB
SS
4 Gbit
512 M x4/empty
4
4096 MB
DS
4 Gbit
512 M x4/512 M x4
8
4096 MB
SS
8 Gbit
1024 M x4/empty
4
8192 MB
DS
4 Gbit
512 M x8/512 M x8
16
8192 MB
DS
8 Gbit
1024 M x4/1024 M x4
8
16384 MB
DS
8 Gbit
1024 M X8/1024 M x8
16
SO-DIMM Capacity
Configuration
SDRAM Density
SDRAM Organization Front-side/Back-side
Number of SDRAM Devices
1024 MB
SS
1 Gbit
128 M x8/empty
8
2048 MB
DS
1 Gbit
128 M x8/128 M x8
16
2048 MB
SS
2 Gbit
256 M x8/empty
8
4096 MB
DS
2 Gbit
256 M x8/256 M x8
16

1.4 System Memory

The board has two 260-pin SO-DIMM sockets and supports the following memory features:
1.2 V DDR4 SDRAM SO-DIMMs with gold plated contacts
Two independent memory channels with interleaved mode support
Unbuffered, single-sided or double-sided SO-DIMMs
32 GB maximum total system memory (with 8 Gb memory technology). Refer to Section 2.1.1
on page 41 for information on the total amount of addressable memory.
Minimum recommended total system memory: 2048 MB
Non-ECC SO-DIMMs
Serial Presence Detect
DDR4 1866/2133 MHz SDRAM SO-DIMMs
Supports 4 Gb and 8Gb memory technology (SDRAM Density)
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency.
NOTE
Intel NUC Board NUC7i3BNB supports only 4 Gb and 8 Gb memory technologies (also referred to as “SDRAM density”). Table 4 lists the supported SO-DIMM configurations. Table 5
lists the SO-
DIMM configurations that are not supported.
Table 4. Supported Memory Configurations
(Note)
Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.
Table 5. Unsupported Memory Configurations
(Note)
Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.
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For information about…
Refer to:
Tested Memory
http://www.intel.com/content/www/us/en/support/boards-and-
kits/000023165.html
Figure 4 illustrates the memory channel and SO-DIMM configuration.
Figure 4. Memory Channel and SO-DIMM Configuration
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Product Description
For information about
Refer to
HDMI technology
http://www.hdmi.org

1.5 Processor Graphics Subsystem

The NUC7i5BNB board supports graphics through Intel Iris™ Plus Graphics 640 and NUC7i7BNB board supports graphics through Intel Iris™ Plus Graphics 650.

1.5.1 Integrated Graphics

The board supports integrated graphics via the processor.
1.5.1.1 Intel® High Definition (Intel® HD) Graphics
The Intel Iris™ Plus graphics controller features the following:
3D Features
DirectX* 12.1 support OpenGL* 5.0 support OpenCL* 2.1 support
Next Generation Intel® Clear Video Technology HD support is a collection of video playback
and enhancement features that improve the end user’s viewing experience
Encode/transcode HD content
Playback of high definition content including Blu-ray* disc
Superior image quality with sharper, more colorful images
DirectX* Video Acceleration (DXVA) support for accelerating video processing
Full AVC/VC1/MPEG2/HEVC HW Encode/Decode
Intel
HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)
NOTE
Intel Quick Sync Video is enabled by an appropriate software application.
1.5.1.2 Video Memory Allocation
Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount). When memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses.
1.5.1.3 High Definition Multimedia Interface* (HDMI*)
The HDMI port supports standard, enhanced, or high definition video, plus multi-channel digital audio on a single cable. The port is compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats. The maximum supported resolution is 4096 x 2160 @ 60 Hz, 24bpp. The HDMI port is compliant with the HDMI 2.0 specification.
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For information about
Refer to
DisplayPort technology
http://www.displayport.org
DisplayPort Usage Models
Monitor 1
Monitor 2
Monitor 3
3 Monitors
1920 x 1200 @ 60 Hz
1920 x 1080 @ 60 Hz
1920 x 1080 @ 60 Hz
2 Monitors
2560 x 1600 @ 60 Hz
2560 x 1600 @ 60 Hz
1.5.1.4 DisplayPort* via USB Type-C
DisplayPort is a digital communication interface that utilizes differential signaling to achieve a high bandwidth bus interface designed to support connections between PCs and monitors, projectors, and TV displays. DisplayPort is suitable for display connections between consumer electronics devices such as high definition optical disc players, set top boxes, and TV displays. The maximum supported resolution is 4096 x 2304 @ 60 Hz, 24bpp. DisplayPort via USB Type-C connector is compliant with the DisplayPort 1.2 specification.
DisplayPort output supports Multi-Stream Transport (MST) which allows for multiple independent video streams (daisy-chain connection with multiple monitors) over a single DisplayPort. This will require the use of displays that support DisplayPort 1.2 and allow for this feature.
1.5.1.4.1 DisplayPort 1.2 Multi-Stream Transport Daisy-Chaining
Table 6 lists the maximum resolutions available when using DisplayPort 1.2 Multi-Stream Transport.
Table 6. DisplayPort Multi-Streaming Resolutions
3 Monitors
(with DisplayPort 1.2 hub)
1920 x 1080 @ 60 Hz 1920 x 1080 @ 60 Hz 1920 x 1080 @ 60 Hz
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