Intel BLKNUC7I3DNHNC Product Data Sheet

Intel® NUC Board/Kit NUC7i3DN

Technical Product Specification

Intel® NUC Board NUC7i3DN may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata, if any, are documented in Intel NUC Board NUC7i3DN Specification Update.

June 2018

Revision History

Revision

Revision History

Date

100

First release of the Intel NUC Board/Kit NUC7i3DN Technical Product Specification

September 2017

101

Additional Specifications

September 2017

102

Clarifying Specifications

October 2017

103

Additional Explanations

January 2018

104

Added Clarifications

February 2018

105

Added clarifications for supported technologies

June 2018

Disclaimer

This product specification applies to only the standard Intel NUC Board with BIOS identifier DNKBLi30.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or

incompatibilities arising from future changes to them. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each

processor family, not across different processor families: Go to:

Learn About Intel® Processor Numbers

Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.

Board Identification Information

AA Revision

BIOS Revision

Notes

J71837-50X

DNKBLi30.86A.0044

1,2

Device

Stepping

S-Spec Numbers

Intel Core i3

SR343

Product Name

Intel® NUC Board

NUC7i3DNKE

NUC7i3DNB

NUC7i3DNHE

NUC7i3DNBE

Date

Type of Change

Description of Changes or Clarifications

2/2/2018

Clarification

Pin 1 designator on board silkscreen is incorrect for the following headers and connectors: USB 2.0, HDMI CEC, Serial Port, SATA Power, and eDP. The pinout information and pin 1 designators in the TPS are correct for these headers.

Basic Intel® NUC Board NUC7i3DNBE Identification Information

Notes:

1. The AA number is found on a small label on the component side of the board.

2. The Intel® Core™ i3-7100U processor is used on this AA revision consisting of the following component:

Production Identification Information

Intel® NUC Products NUC7i3DN{x} Identification Information

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Board/Kit NUC7i3DN.

Specification Changes or Clarifications

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See

http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.

iii

Intel NUC Board/Kit NUC7i3DN Technical Product Specification

Chapter

Description

A description of the hardware used on Intel® NUC Board NUC7i3DNBE

A map of the resources of the Intel® NUC Board

The features supported by the BIOS Setup program

A description of the BIOS error messages, beep codes, and POST codes

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Board/Kits NUC7i3DN. Some features are only available on Kit SKUs.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel® NUC Board/Kit NUC7i3DN and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Other Common Notation

Used after a signal name to identify an active-low signal (such as USBP0#)

Gigabyte (1,073,741,824 bytes)

GB/s

Gigabytes per second

Gb/s

Gigabits per second

Kilobyte (1024 bytes)

Kilobit (1024 bits)

kb/s

1000 bits per second

Megabyte (1,048,576 bytes)

MB/s

Megabytes per second

Megabit (1,048,576 bits)

Mb/s

Megabits per second

TDP

Thermal Design Power

xxh

An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V

Volts. Voltages are DC unless otherwise specified.

x.x A

Amperes.

This symbol is used to indicate third-party brands and names that are the property of their respective owners.

Contents

Revision History ............................................................................................................... ii

Disclaimer .................................................................................................................................................................. ii

Board Identification Information ..................................................................................................................... iii

Errata ........................................................................................................................................................................... iii

Preface .............................................................................................................................. iv

Intended Audience ................................................................................................................................................ iv

What This Document Contains ........................................................................................................................ iv

Typographical Conventions .............................................................................................................................. iv

Contents .......................................................................................................................... vii

1 Product Description ............................................................................................... 13

1.1 Overview ...................................................................................................................................................... 13

1.1.1 Feature Summary .................................................................................................................. 13

1.1.2 Board Layout (Top) ............................................................................................................... 15

1.1.3 Board Layout (Bottom) ........................................................................................................ 16

1.1.4 Block Diagram ......................................................................................................................... 18

1.2 Online Support .......................................................................................................................................... 19

1.3 Processor ..................................................................................................................................................... 19

1.4 System Memory ........................................................................................................................................ 19

1.5 Processor Graphics Subsystem .......................................................................................................... 22

1.5.1 Integrated Graphics .............................................................................................................. 22

1.6 USB ................................................................................................................................................................. 26

1.7 SATA Interface ........................................................................................................................................... 26

1.7.1 AHCI Mode ................................................................................................................................ 26

1.7.2 NVMe........................................................................................................................................... 27

1.7.3 Intel® Rapid Storage Technology / SATA RAID ......................................................... 27

1.7.4 Intel® Next Generation Storage Acceleration ............................................................. 27

Real-Time Clock Subsystem ........................................................................................................................... 28

1.8 Audio Subsystem Software .................................................................................................................. 28

1.8.1 Audio Subsystem Software ............................................................................................... 28

1.9 LAN Subsystem ......................................................................................................................................... 29

1.9.1 Intel® I219LM Gigabit Ethernet Controller .................................................................. 29

1.9.2 RJ-45 LAN Connector with Integrated LEDs .............................................................. 30

1.9.3 Wireless Network Module .................................................................................................. 30

1.10 Hardware Management Subsystem ................................................................................................. 31

1.10.1 Hardware Monitoring ........................................................................................................... 31

1.10.2 Fan Monitoring ........................................................................................................................ 31

1.10.3 Thermal Solution ................................................................................................................... 31

1.11 Power Management ................................................................................................................................ 32

vii

Intel NUC Board/Kit NUC7i3DN Technical Product Specification

1.11.1 ACPI ............................................................................................................................................. 32

1.11.2 Hardware Support ................................................................................................................. 34

1.12 Intel® Platform Security Technologies ............................................................................................ 36

2 Technical Reference ............................................................................................... 39

2.1 Memory Resources .................................................................................................................................. 39

2.1.1 Addressable Memory ........................................................................................................... 39

2.2 Connectors and Headers....................................................................................................................... 39

2.2.1 Front Panel Connectors ...................................................................................................... 40

2.2.2 Back Panel Connectors ....................................................................................................... 40

2.2.3 Connectors and Headers (Top) ........................................................................................ 41

2.2.4 Connectors and Headers (Bottom) ................................................................................. 42

2.3 BIOS Security Jumper ............................................................................................................................ 53

2.4 Intel® Management Engine BIOS Extension (Intel® MEBX) Reset Header ......................... 55

2.5 Mechanical Considerations .................................................................................................................. 57

2.5.1 Form Factor .............................................................................................................................. 57

2.6 Electrical Considerations ...................................................................................................................... 59

2.6.1 Power Supply Considerations .......................................................................................... 59

2.6.2 Fan Header Current Capability ......................................................................................... 60

2.7 Thermal Considerations ........................................................................................................................ 61

2.8 Reliability ..................................................................................................................................................... 65

2.9 Environmental ........................................................................................................................................... 65

3 Overview of BIOS Features ................................................................................... 67

3.1 Introduction ................................................................................................................................................ 67

3.2 BIOS Flash Memory Organization ..................................................................................................... 67

3.3 System Management BIOS (SMBIOS) .............................................................................................. 67

3.4 Legacy USB Support ............................................................................................................................... 68

3.5 BIOS Updates ............................................................................................................................................. 68

3.5.1 Language Support ................................................................................................................. 69

3.5.2 BIOS Recovery ......................................................................................................................... 69

3.6 Boot Options .............................................................................................................................................. 70

3.6.1 Network Boot........................................................................................................................... 70

3.6.2 Booting Without Attached Devices ................................................................................ 70

3.6.3 Changing the Default Boot Device during POST ...................................................... 70

3.6.4 Power Button Menu .............................................................................................................. 71

3.7 Hard Disk Drive Password Security Feature .................................................................................. 72

3.8 BIOS Security Features .......................................................................................................................... 73

4 Error Messages and Blink Codes ......................................................................... 75

4.1 Front-panel Power LED Blink Codes ................................................................................................ 75

4.2 BIOS Error Messages ............................................................................................................................... 75

viii

Figures

Figure 1. Major Board Components (Top) .............................................................................................. 15

Figure 2. Major Board Components (Bottom) ....................................................................................... 16

Figure 3. Block Diagram .................................................................................................................................. 18

Figure 4. Memory Channel and SO-DIMM Configuration................................................................. 21

Figure 5. eDP Connector on Bottom-side of the Board .................................................................... 24

Figure 6. LAN Connector LED Locations.................................................................................................. 30

Figure 7. Thermal Solution and Fan Header .......................................................................................... 31

Figure 8. Location of the Standby Power LED ...................................................................................... 35

Figure 9. Front Panel Connectors ............................................................................................................... 40

Figure 10. Back Panel Connectors ............................................................................................................. 40

Figure 11. Connectors and Headers (Top) .............................................................................................. 41

Figure 12. Connectors and Headers (Bottom) ...................................................................................... 42

Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch) ................................... 50

Figure 14. Connection Diagram for the Internal Power Supply Connector .............................. 52

Figure 15. Location of the BIOS Security Jumper ............................................................................... 53

Figure 16. Intel MEBX Reset Header ......................................................................................................... 56

Figure 17. Board Dimensions ....................................................................................................................... 57

Figure 18. Board Height Dimensions ........................................................................................................ 58

Figure 19. Localized High Temperature Zones .................................................................................... 62

Figure 20. Installation Area of the Thermal Pad .................................................................................. 63

Contents

Intel NUC Board/Kit NUC7i3DN Technical Product Specification

Tables

Table 1. Feature Summary .............................................................................................................................. 13

Table 2. Components Shown in Figure 2 ................................................................................................. 17

Table 3. Supported Memory Configurations .......................................................................................... 20

Table 4. Unsupported Memory Configurations ..................................................................................... 20

Table 5. LAN Connector LED States ........................................................................................................... 30

Table 6. Effects of Pressing the Power Switch ....................................................................................... 32

Table 7. Power States and Targeted System Power ............................................................................ 33

Table 8. Wake-up Devices and Events ...................................................................................................... 34

Table 9. Connectors and Headers Shown in Figure 11 ...................................................................... 41

Table 10. Connectors and Headers Shown in Figure 12 .................................................................... 43

Table 11. SATA Power Header (1.25 mm pitch) .................................................................................... 44

Table 12. Internal USB 2.0 Header (1.25 mm pitch) ............................................................................ 44

Table 13. Internal USB 3.0 Header (1.25 mm pitch) ............................................................................. 45

Table 14. Serial Port Header (1.25 mm pitch) ......................................................................................... 45

Table 15. HDMI CEC Header (1.25 mm pitch) .......................................................................................... 46

Table 16. M.2 2280 Module (Mechanical Key M) Connector ............................................................ 46

Table 17. M.2 2230 Module (Mechanical Key E) Connector ............................................................. 47

Table 18. 40-Pin eDP Connector ................................................................................................................. 49

Table 19. Front Panel Header (2.0 mm Pitch)......................................................................................... 50

Table 20. States for a One-Color Power LED .......................................................................................... 51

Table 21. States for a Dual-Color Power LED ......................................................................................... 51

Table 22. 12-24 V Internal Power Supply Connector ......................................................................... 52

Table 23. BIOS Security Jumper Settings ................................................................................................ 54

Table 24. Intel MEBX Reset Header Signals ............................................................................................ 56

Table 25. Power Budget for Assessing the DC-to-DC Circuit’s Power Rating (worst case:

Embedded board in 3rd party chassis) ............................................................................................... 59

Table 26. Fan Header Current Capability ................................................................................................. 60

Table 27. Thermal Considerations for Components ........................................................................... 64

Table 28. Tcontrol Values for Components ............................................................................................ 64

Table 29. Environmental Specifications ................................................................................................... 65

Table 30. Acceptable Drives/Media Types for BIOS Recovery ........................................................ 69

Table 31. Boot Device Menu Options ........................................................................................................ 70

Table 32. Master Key and User Hard Drive Password Functions ................................................... 72

Table 33. Supervisor and User Password Functions ........................................................................... 73

Table 34. Front-panel Power LED Blink Codes ...................................................................................... 75

Table 35. BIOS Error Messages .................................................................................................................... 75

Contents

Form Factor

4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

Processor

Intel® NUC Board NUC7i3DNBE has a soldered-down 7th generation Intel® Core™ i3-7100U dual-core processor with up to 15 W TDP

― Intel® HD Graphics 620 ― Integrated memory controller ― Integrated PCH

Memory

Two 260-pin 1.2 V DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM) sockets

― Support for DDR4 1866/2133 MHz SO-DIMMs ― Support for 4 Gb and 8 Gb memory technology ― Support for up to 32 GB of system memory with two SO-DIMMs using 8 Gb memory

technology

― Support for non-ECC memory ― Support for 1.2 V low voltage JEDEC memory only

Note: 2 Gb memory technology (SDRAM Density) is not compatible

Graphics

Integrated graphics support for processors with Intel® Graphics Technology:

― Two High Definition Multimedia Interface* 2.0a (HDMI*) back panel connectors ― Flat panel displays via the internal Embedded DisplayPort* 1.4 (eDP) connector

Audio

Intel® High Definition (Intel® HD) Audio via the HDMI v2.0a interface through the processor

Storage

SATA ports:

― One SATA 6.0 Gb/s port (blue) ― One SATA 6.0 Gb/s port is reserved for an M.2 2280 module

Note: Intel® NUC Board NUC7i3DNBE supports key type M (PCI Express* x1/x2/x4 and SATA)

Peripheral Interfaces

USB 3.0 ports:

― Two ports are implemented with external front panel connectors (blue) ― Two ports are implemented with external back panel connectors (blue) ― One port is implemented with an internal 1x10 1.25mm pitch header (white)

USB 2.0 ports:

― Two ports via two single-port internal 1x4 1.25 mm pitch headers (white) ― One port is reserved for an M.2 2230 Module (key type E)

Serial Port 1x9 1.25mm pitch header(black) HDMI CEC 1x4 1.25 mm pitch header (black)

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of Intel® NUC Board NUC7i3DNBE.

Table 1. Feature Summary

continued

Intel NUC Board/Kit NUC7i3DN Technical Product Specification

Expansion Capabilities

One M.2 Module supporting M.2 2280 (key type M)

One M.2 Module supporting M.2 2230 (key type E)

BIOS

Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device

Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and System Management BIOS (SMBIOS)

LAN

Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® I219LM Gigabit Ethernet Controller

Hardware Monitor Subsystem

Hardware monitoring subsystem, based on ITE Tech. ITE8987E-VG embedded controller, including:

Voltage sense to detect out of range power supply voltages

Thermal sense to detect out of range thermal values

One processor fan header

Fan sense input used to monitor fan activity

Fan speed control

Wireless (Kit only)

Intel® Dual Band Wireless-AC 8265

― 802.11ac, Dual Band, 2x2 Wi-Fi + Bluetooth v4.2 ― Maximum Transfer speed up to 867 Mbps

Supports Intel® Smart Connect Technology

Additional Features

Intel® Platform Trust Technology

Table 1. Feature Summary (continued)

1.1.2 Board Layout (Top)

Item from Figure 1

Description

Thermal Solution

Processor Fan Header

SPI D Battery Header

eDP Connector

DC Internal Power Connector

Figure 1 shows the location of the major components on the top-side of Intel NUC Board NUC7i3DNBE.

Product Description

Table 2. Components Shown in Figure 1

Figure 1. Major Board Components (Top)

Intel NUC Board/Kit NUC7i3DN Technical Product Specification

1.1.3 Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board NUC7i3DNBE.

Figure 2. Major Board Components (Bottom)

Table 2. Components Shown in Figure 2

Item from Figure 2

Description

12-24 V DC Input Jack

HDMI 2.0a Port 1 with HDCP 2.2 Support and Built-In CEC Support

LAN Connector

Back Panel USB 3.0

HDMI 2.0a Port 2

Serial Port Header

M.2 2230 Module Connector (Key Type E) (Wireless card on Kit only)

HDMI CEC

SATA Power Header

USB 2.0 Header

M.2 2280 Module Connector (Key Type M)

Intel® Management Engine BIOS Extension (Intel® MEBX) Reset Header

Front Panel USB 3.0

SATA 6.0 Gb/s Connector

Front Panel USB 3.0

USB 3.0 Header

Front Panel Power Button

BIOS Security Header

Front Panel Header

Standby Power LED

DDR4 SO-DIMM 2 Socket

DDR4 SO-DIMM 1 Socket

Product Description

Intel NUC Board/Kit NUC7i3DN Technical Product Specification

1.1.4 Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Figure 3. Block Diagram

Product Description

To find information about…

Visit this World Wide Web site:

Intel NUC Board/Kit NUC7i3DN

http://www.intel.com/NUC

Intel NUC Board/Kit Support

http://www.intel.com/NUCSupport

High level details for Intel NUC Board/Kit NUC7i3DN

http://ark.intel.com

BIOS and driver updates

http://downloadcenter.intel.com

Tested memory

http://www.intel.com/NUCSupport

Integration information

http://www.intel.com/NUCSupport

Processor datasheet

http://ark.intel.com

1.2 Online Support

1.3 Processor

Intel NUC Board NUC7i3DNBE has a soldered-down 7th generation Intel Core i3-7100U dual-core processor with up to 15 W TDP:

 Intel® HD Graphics 620  Integrated memory controller  Integrated PCH

NOTE

There are specific requirements for providing power to the processor. Refer to Section 2.6.1 on page 59 for information on power supply requirements.

1.4 System Memory

The board has two 260-pin SO-DIMM sockets and supports the following memory features:

 1.2 V DDR4 SDRAM SO-DIMMs with gold plated contacts  Two independent memory channels with interleaved mode support  Unbuffered, single-sided or double-sided SO-DIMMs  32 GB maximum total system memory (with 8 Gb memory technology). Refer to Section 2.1.1

on page 39 for information on the total amount of addressable memory.

 Minimum recommended total system memory: 2048 MB  Non-ECC SO-DIMMs  Serial Presence Detect  DDR4 1866/2133 MHz SDRAM SO-DIMMs  Supports 4 Gb and 8 Gb memory technology (SDRAM Density)

Intel NUC Board/Kit NUC7i3DN Technical Product Specification

SO-DIMM Capacity

Configuration

(Note)

SDRAM Density

SDRAM Organization Front-side/Back-side

Number of SDRAM Devices

2048 MB

4 Gbit

512 M x4/empty

4096 MB

4 Gbit

512 M x4/512 M x4

4096 MB

8 Gbit

1024 M x4/empty

8192 MB

4 Gbit

512 M x8/512 M x8

8192 MB

8 Gbit

1024 M x4/1024 M x4

16384 MB

8 Gbit

1024 M X8/1024 M x8

SO-DIMM Capacity

Configuration

(Note)

SDRAM Density

SDRAM Organization Front-side/Back-side

Number of SDRAM Devices

1024 MB

1 Gbit

128 M x8/empty

2048 MB

1 Gbit

128 M x8/128 M x8

2048 MB

2 Gbit

256 M x8/empty

4096 MB

2 Gbit

256 M x8/256 M x8

For information about…

Refer to:

Tested Memory

http://www.intel.com/NUCSupport

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency.

NOTE

Intel NUC Board NUC7i3DNBE supports only 4 Gb and 8 Gb memory technologies (also referred to as “SDRAM density”). Table 3 lists the supported SO-DIMM configurations. Table 4 lists the SO- DIMM configurations that are not supported.

Table 3. Supported Memory Configurations

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

Table 4. Unsupported Memory Configurations

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Product Description

Figure 4. Memory Channel and SO-DIMM Configuration

Intel NUC Board/Kit NUC7i3DN Technical Product Specification

For information about

Refer to

HDMI technology

http://www.hdmi.org

1.5 Processor Graphics Subsystem

The board supports graphics through Intel® HD Graphics 620.

1.5.1 Integrated Graphics

The board supports integrated graphics via the processor.

1.5.1.1 Intel® High Definition (Intel® HD) Graphics

The Intel® HD Graphics 620 controller features the following:

 3D Features

 DirectX* 12 support  OpenGL* 4.4 support

 Display

 Supports eDP flat panel displays up to 3840 x 2160 at 60 Hz  Supports HDMI displays up to 4096 x 2160 at 60 Hz

 Next Generation Intel® Clear Video Technology HD support is a collection of video playback

and enhancement features that improve the end user’s viewing experience

 Encode/transcode HD content  Playback of high definition content including Blu-ray* disc  Superior image quality with sharper, more colorful images  DirectX* Video Acceleration (DXVA) support for accelerating video processing  Full AVC/VC1/MPEG2/HEVC/VP8/JPEG HW Decode  Intel HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)  HDR 10 (High Dynamic Range 10 bit)  HDCP (High-bandwidth Digital Content Protection) 2.2

NOTE

Intel Quick Sync Video is enabled by an appropriate software application.

HDMI 2.0a enabled by a LSPCON (DisplayPort 1.2 to HDMI 2.0a controller). Stereo 3D (S3D) technology is not supported.

1.5.1.2 High Definition Multimedia Interface* (HDMI*)

The HDMI ports are HDMI 2.0a specification compliant and support standard, enhanced, or high definition video, plus multi-channel digital audio on a single cable. The port is compatible with all ATSC and DVB HDTV standards and supports eight full range channels of lossless audio formats. The system can support up to two displays at the maximum supported resolution of 4096 x 2160 @ 60 Hz, 24bpp.

Product Description

For information about

Refer to

HDMI CEC feature on NUC

https://www.intel.com/content/www/us/en/support/arti cles/000023500/mini-pcs/intel-nuc-kits.html

1.5.1.2.1 Integrated Audio Provided by the HDMI Interfaces

The following audio technologies are supported by the HDMI 2.0a interface:

 AC3 – Dolby* Digital  Dolby Digital Plus  DTS-HD*  192kHz/16-bit or 176.4 kHz/24-bit, 32 Channel  Dolby True HD, DTS-HD Master Audio* (Lossless Blu-ray Disc* Audio Format)

1.5.1.3 High-bandwidth Digital Content Protection (HDCP)

HDMI Port 1 supports HDCP 2.2. HDCP is the technology for protecting high definition content against unauthorized copy or interception between a source (computer, digital set top boxes, etc.) and the sink (panels, monitor, and TVs). The PCH supports HDCP 2.2 for content protection over wired displays.

1.5.1.4 HDMI Consumer Electronics Control (CEC)

The system provides built-in HDMI CEC support on port 1 (refer to Figure 2), as well as a header for 3rd party HDMI CEC daughtercard support on HDMI port 2. The built-in HDMI CEC feature is OS agnostic and supports bi-directional power on/off control between the system and the attached display, as well as automatic HDMI input port detection from the display. This feature can be enabled and configured in BIOS Setup (Advanced → Display tab). Additional HDMI CEC capabilities can be implemented on HDMI port 2 using a 3rd party daughtercard, which allows bidirectional power on/off control and other capabilities as supported by the daughtercard, such as the use of the media buttons on the display’s remote controller.

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