Intel BLKNUC7I3BNB User Manual

Intel® NUC Board NUC7i3BNB

Technical Product Specification

January 2017

Order Number: J52707-001

Intel NUC Board NUC7i3BNB may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata, if any, are documented in Intel NUC Board NUC7i3BNB Specification Update.

Revision History

Revision

Revision History

Date

001

First release of the Intel NUC Board NUC7i3BNB Technical Product Specification

January 2017

Disclaimer

This product specification applies to only the standard Intel NUC Board with BIOS identifier BNKBL357.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or

incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:

Learn About Intel® Processor Numbers

Intel NUC may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Intel, the Intel logo, Intel NUC and Intel Core are trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

The terms HDMI and HDMI High-Definition Multimedia Interface, and the HDMI Logo are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries

DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association (VESA®) in

the United States and other countries

Board Identification Information

AA Revision

BIOS Revision

Notes

J22859-302

BNKBL357.86A

1,2

Device

Stepping

S-Spec Numbers

Intel Core i3

SR343

Intel Core i3

SR2ZW

Product Name

Intel® NUC Board

Intel® NUC Kit NUC7i3BNK

NUC7i3BNB Intel® NUC Kit NUC7i3BNH

Date

Type of Change

Description of Changes or Clarifications

Basic Intel® NUC Board NUC7i3BNB Identification Information

Notes:

1. The AA number is found on a small label on the component side of the board.

2. The Intel® Core™ i3-7100U processor used on this AA revision consists of one of the following components:

Product Identification Information

Intel® NUC Products NUC7i3BN{x} Identification Information

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Board NUC7i3BNB.

Specification Changes or Clarifications

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See

http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.

iii

Intel NUC Board NUC7i3BNB Technical Product Specification

Chapter

Description

A description of the hardware used on Intel NUC Board NUC7i3BNB

A map of the resources of the Intel NUC Board

The features supported by the BIOS Setup program

A description of the BIOS error messages, beep codes, and POST codes

The features of the Intel NUC kit NUC7i3BNK and NUC7i3BNH

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Board NUC7i3BNB.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel® NUC Board NUC7i3BNB and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Other Common Notation

Used after a signal name to identify an active-low signal (such as USBP0#)

Gigabyte (1,073,741,824 bytes)

GB/s

Gigabytes per second

Gb/s

Gigabits per second

Kilobyte (1024 bytes)

Kilobit (1024 bits)

kb/s

1000 bits per second

Megabyte (1,048,576 bytes)

MB/s

Megabytes per second

Megabit (1,048,576 bits)

Mb/s

Megabits per second

TDP

Thermal Design Power

Xxh

An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V

Volts. Voltages are DC unless otherwise specified.

This symbol is used to indicate third-party brands and names that are the property of their respective owners.

Contents

Revision History ............................................................................................................... ii

Disclaimer .................................................................................................................................................................. ii

Board Identification Information ..................................................................................................................... iii

Product Identification Information ................................................................................................................. iii

Errata ........................................................................................................................................................................... iii

Preface .............................................................................................................................. iv

Intended Audience ................................................................................................................................................ iv

What This Document Contains ........................................................................................................................ iv

Typographical Conventions .............................................................................................................................. iv

Contents .......................................................................................................................... vii

1 Product Description ............................................................................................... 13

1.1 Overview ...................................................................................................................................................... 13

1.1.1 Feature Summary .................................................................................................................. 13

1.1.2 Board Layout (Top) ............................................................................................................... 15

1.1.3 Board Layout (Bottom) ........................................................................................................ 17

1.1.4 Block Diagram ......................................................................................................................... 19

1.2 Online Support .......................................................................................................................................... 20

1.3 Processor ..................................................................................................................................................... 20

1.4 System Memory ........................................................................................................................................ 21

1.5 Processor Graphics Subsystem .......................................................................................................... 23

1.5.1 Integrated Graphics .............................................................................................................. 23

1.6 USB ................................................................................................................................................................. 26

1.7 SATA Interface ........................................................................................................................................... 26

1.7.1 AHCI Mode ................................................................................................................................ 27

1.7.2 Intel® Rapid Storage Technology / SATA RAID ......................................................... 27

1.7.3 Intel® Next Generation Storage Acceleration ............................................................. 27

1.8 Real-Time Clock Subsystem ................................................................................................................ 28

1.9 Audio Subsystem ..................................................................................................................................... 28

1.9.1 Audio Subsystem Software ............................................................................................... 29

1.10 LAN Subsystem ......................................................................................................................................... 29

1.10.1 Intel® I219V Gigabit Ethernet Controller ..................................................................... 29

1.10.2 LAN Subsystem Software ................................................................................................... 29

1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................................................. 30

1.10.4 Wireless Network Module .................................................................................................. 31

1.11 Hardware Management Subsystem ................................................................................................. 31

1.11.1 Hardware Monitoring ........................................................................................................... 31

1.11.2 Fan Monitoring ........................................................................................................................ 31

vii

1.11.3 Thermal Solution ................................................................................................................... 31

1.12 Power Management ................................................................................................................................ 33

1.12.1 ACPI ............................................................................................................................................. 33

1.12.2 Hardware Support ................................................................................................................. 36

1.13 Intel Platform Security Technologies .............................................................................................. 38

1.13.1 Intel® Virtualization Technology ...................................................................................... 38

1.13.2 Intel® Platform Trust Technology ................................................................................... 38

2 Technical Reference ............................................................................................... 39

2.1 Memory Resources .................................................................................................................................. 39

2.1.1 Addressable Memory ........................................................................................................... 39

2.2 Connectors and Headers....................................................................................................................... 39

2.2.1 Front Panel Connectors ...................................................................................................... 40

2.2.2 Back Panel Connectors ....................................................................................................... 40

2.2.3 Headers and Connectors (Top) ........................................................................................ 41

2.2.4 Connectors and Headers (Bottom) ................................................................................. 42

2.3 BIOS Security Jumper ............................................................................................................................ 53

2.4 Mechanical Considerations .................................................................................................................. 55

2.4.1 Form Factor .............................................................................................................................. 55

2.5 Electrical Considerations ...................................................................................................................... 56

2.5.1 Power Supply Considerations .......................................................................................... 56

2.5.2 Fan Header Current Capability ......................................................................................... 56

2.6 Thermal Considerations ........................................................................................................................ 57

2.7 Reliability ..................................................................................................................................................... 62

2.8 Environmental ........................................................................................................................................... 62

3 Overview of BIOS Features ................................................................................... 63

3.1 Introduction ................................................................................................................................................ 63

3.2 BIOS Flash Memory Organization ..................................................................................................... 64

3.3 System Management BIOS (SMBIOS) .............................................................................................. 64

3.4 Legacy USB Support ............................................................................................................................... 64

3.5 BIOS Updates ............................................................................................................................................. 65

3.5.1 Language Support ................................................................................................................. 65

3.6 BIOS Recovery ........................................................................................................................................... 65

3.7 Boot Options .............................................................................................................................................. 67

3.7.1 Network Boot........................................................................................................................... 67

3.7.2 Booting Without Attached Devices ................................................................................ 67

3.7.3 Changing the Default Boot Device During POST ...................................................... 67

3.7.4 Power Button Menu .............................................................................................................. 68

3.8 Hard Disk Drive Password Security Feature .................................................................................. 69

3.9 BIOS Security Features .......................................................................................................................... 70

4 Error Messages and Blink Codes ......................................................................... 71

4.1 Front-panel Power LED Blink Codes ................................................................................................ 71

4.2 BIOS Error Messages ............................................................................................................................... 71

viii

Contents

5 Intel NUC Kit Features ........................................................................................... 72

5.1 Chassis Front Panel Features .............................................................................................................. 72

5.3 Chassis Rear Panel Features ................................................................................................................ 74

Figures

Figure 1. Major Board Components (Top) ....................................................................................................... 15

Figure 2. Major Board Components (Bottom) ................................................................................................ 17

Figure 3. Block Diagram ........................................................................................................................................... 19

Figure 4. Memory Channel and SO-DIMM Configuration.......................................................................... 22

Figure 5. 4-Pin 3.5 mm (1/8 inch) Audio Jack Pin Out ............................................................................... 28

Figure 6. LAN Connector LED Locations........................................................................................................... 30

Figure 7. Thermal Solution and Fan Header ................................................................................................... 32

Figure 8. Location of the Standby Power LED ............................................................................................... 37

Figure 9. Front Panel Connectors ........................................................................................................................ 40

Figure 10. Back Panel Connectors ...................................................................................................................... 40

Figure 11. Headers and Connectors (Top) ....................................................................................................... 41

Figure 12. Connectors and Headers (Bottom) ............................................................................................... 42

Figure 13. Connection Diagram for Front Panel Header (2.0 mm Pitch) ............................................ 47

Figure 14. Connection Diagram for the Internal USB 2.0 Single-Port Header (1.25 mm Pitch) 51

Figure 15. Location of the CIR Sensor ............................................................................................................... 51

Figure 16. Location of the BIOS Security Jumper ........................................................................................ 53

Figure 17. Board Dimensions ................................................................................................................................ 55

Figure 18. Board Height Dimensions ................................................................................................................. 56

Figure 19. Localized High Temperature Zones ............................................................................................. 58

Figure 20. Installation Area of Thermal Pad for Intel NUC Kit NUC7i3BNK ...................................... 59

Figure 21. Installation area of Thermal Pad for Intel NUC Kit NUC7i3BNH ....................................... 60

Figure 22. Intel NUC Kit NUC7i3BNH Features – Front ............................................................................... 72

Figure 23. Intel NUC Kit NUC7i3BNK Features – Front ................................................................................ 73

Figure 24. Intel NUC Kit NUC7i3BNH Features – Rear ................................................................................. 74

Figure 25. Intel NUC Kit NUC7i3BNK Features – Rear ................................................................................. 75

Tables

Table 1. Feature Summary ..................................................................................................................................... 13

Table 2. Components Shown in Figure 1 ......................................................................................................... 16

Table 3. Components Shown in Figure 2 ......................................................................................................... 18

Table 4. Supported Memory Configurations .................................................................................................. 21

Table 5. Unsupported Memory Configurations............................................................................................. 21

Table 6. DisplayPort Multi-Streaming Resolutions ...................................................................................... 24

Table 7. Multiple Display Configuration Maximum Resolutions ............................................................ 25

Table 8. Audio Formats Supported by the HDMI and USB Type-C Interfaces ................................. 25

Table 9. LAN Connector LED States ................................................................................................................... 30

Table 10. Effects of Pressing the Power Switch ............................................................................................ 33

Table 11. Power States and Targeted System Power ................................................................................. 34

Table 12. Wake-up Devices and Events ........................................................................................................... 35

Table 13. Headers and Connectors Shown in Figure 11 ........................................................................... 41

Table 14. Connectors and Headers Shown in Figure 12 ........................................................................... 43

Table 15. SATA Power Connector (1.25 mm pitch) ..................................................................................... 44

Contents

Table 16. Single-Port Internal USB 2.0 Header (1.25 mm pitch) ........................................................... 44

Table 17. M.2 2280 Module (key type M) Connector .................................................................................. 44

Table 18. Digital Microphone (DMICS) Array Connector (1.25 mm Pitch).......................................... 45

Table 19. Front Panel HDD LED Ring Connector (1.25 mm Pitch) ........................................................ 46

Table 20. CEC Header (1.25 mm pitch) ............................................................................................................. 46

Table 21. Front Panel Header (2.0 mm Pitch) ................................................................................................ 47

Table 22. States for a One-Color Power LED ................................................................................................. 48

Table 23. States for a Dual-Color Power LED ................................................................................................ 48

Table 24. SDXC Card Reader Connector .......................................................................................................... 49

Table 25. HDMI CEC expected behavior ............................................................................................................ 52

Table 26. Front Panel LED Ring ........................................................................................................................... 52

Table 27. BIOS Security Jumper Settings ........................................................................................................ 54

Table 28. Fan Header Current Capability ......................................................................................................... 56

Table 29. Thermal Considerations for Components ................................................................................... 61

Table 30. Tcontrol Values for Components ................................................................................................... 61

Table 31. Environmental Specifications ........................................................................................................... 62

Table 32. Acceptable Drives/Media Types for BIOS Recovery ............................................................... 65

Table 33. Boot Device Menu Options ................................................................................................................ 67

Table 34. Master Key and User Hard Drive Password Functions ........................................................... 69

Table 35. Supervisor and User Password Functions................................................................................... 70

Table 36. Front-panel Power LED Blink Codes ............................................................................................. 71

Table 37. Components Shown in Figure 22 ................................................................................................... 72

Table 38. Components Shown in Figure 23 ................................................................................................... 73

Table 39. Components Shown in Figure 24 ................................................................................................... 74

Table 40. Components Shown in Figure 25 ................................................................................................... 75

Form Factor

4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

Processor

 A soldered-down 7

generation Intel® Core™ i3-7100U dual-core processor with up to a

maximum 15 W TDP (if thermal margin available)

― Intel® HD Graphics 620 ― Integrated memory controller ― Integrated PCH

Memory

 Two 260-pin 1.2 V DDR4 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM)

sockets

 Support for DDR4 1866/2133 MHz SO-DIMMs  Support for 4 Gb and 8 Gb memory technology  Support for up to 32 GB of system memory with two SO-DIMMs using 8 Gb memory

technology

 Support for non-ECC memory  Support for 1.2 V low voltage JEDEC memory only

Note: 2 Gb memory technology (SDRAM Density) is not supported

Graphics

 Integrated graphics support for processors with Intel® Graphics Technology:

― One High Definition Multimedia Interface* (HDMI*) back panel connector ― One USB Type-C back panel connector

Audio

 Intel® High Definition (Intel

HD) Audio via the HDMI v2.0 and USB Type-C interfaces

through the processor

 Realtek HD Audio via a stereo microphone/headphone 3.5 mm jack on the front panel  Digital microphone array (DMICS) connector (internal)

Storage

 SATA ports:

― One SATA 6.0 Gb/s port (black) for 2.5“ storage device

 One SATA 6.0 Gb/s port is reserved for an M.2 storage module supporting M.2 2242 and

M.2 2280 (key type M and B+M) modules

Note: Supports key type M (PCI Express* x1/x2/x4 and SATA)

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of Intel® NUC Board NUC7i3BNB.

Table 1. Feature Summary

continued

Peripheral Interfaces

 One USB 3.1 (Gen 2) port implemented via the external back panel USB Type-C

connector

 USB 3.0 ports:

 Two ports are implemented with external front panel connectors (one blue and one

orange charging capable)

 Two ports are implemented with external back panel connectors (blue)

 USB 2.0 ports:

 Two ports via two single-port internal 1x4 1.25 mm pitch headers (white)  One port is reserved for the M.2 2230 Wireless module

 Consumer Infrared (CIR)

Expansion Capabilities

 One M.2 connector supporting M.2 2242 and M.2 2280 (key type M and B+M) modules  One Micro SDXC slot

Note: The Micro SDXC card reader is not supported in Microsoft* Windows* 7

BIOS

 Intel

BIOS resident in the Serial Peripheral Interface (SPI) Flash device

 Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and

System Management BIOS (SMBIOS)

Instantly Available PC Technology

 Suspend to RAM support  Wake on PCI Express, LAN, front panel, CIR, and USB ports

LAN

Gigabit (10/100/1000 Mb/s) LAN subsystem using the Intel® I219V Gigabit Ethernet Controller

Hardware Monitor Subsystem

Hardware monitoring subsystem, based on a ITE Tech. IT8987E-VG embedded controller, including:

 Voltage sense to detect out of range power supply voltages  Thermal sense to detect out of range thermal values  One processor fan header  Fan sense input used to monitor fan activity  Fan speed control

Wireless

Intel® Dual Band Wireless-AC 8265

 802.11ac, Dual Band, 2x2 Wi-Fi + Bluetooth 4.2  Maximum Transfer speed up to 867Mbps  Supports Intel® Smart Connect Technology

Table 1. Feature Summary (continued)

1.1.2 Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel NUC Board NUC7i3BNB.

Product Description

Figure 1. Major Board Components (Top)

Item from Figure 1

Description

USB Type-C connector

Processor fan header

Battery

Thermal solution

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Product Description

1.1.3 Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC Board NUC7i3BNB.

Figure 2. Major Board Components (Bottom)

Item from Figure 2

Description

Back panel connectors

Front panel header

Digital microphone array connector

Front panel LED ring connector

Intel Dual Band Wireless AC + Bluetooth 8265 module

Micro SDXC slot

M.2 connector (key type M and B+M) for 2242 and 2280 modules

Front panel single-port USB 2.0 header (1.25 mm pitch)

Consumer Infrared (CIR) sensor

Front panel USB 3.0 connector (blue)

SATA 6.0 Gb/s connector

Front panel USB 3.0 connector (orange, charging)

SATA power connector (1.25 mm pitch)

Front panel stereo microphone/headphone jack

Front panel power button

BIOS security jumper

Consumer electronics control (CEC) header

DDR4 SO-DIMM sockets

Table 3. Components Shown in Figure 2

1.1.4 Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Product Description

Figure 3. Block Diagram

To find information about…

Visit this World Wide Web site:

Intel NUC Board NUC7i3BNB

http://www.intel.com/NUC

Intel NUC Support

http://www.intel.com/NUCSupport

Available configurations for Intel NUC Board NUC7i3BNB

http://ark.intel.com

Product support page NUC7i3BNK

http://www.intel.com/content/www/us/en/support/boards-andkits/intel-nuc-kits/intel-nuc-kit-nuc7i3bnk.html

Product support page NUC7i3BNH

http://www.intel.com/content/www/us/en/support/boards-andkits/intel-nuc-kits/intel-nuc-kit-nuc7i3bnh.html

BIOS and driver updates

http://downloadcenter.intel.com

BIOS and driver updates for NUC7i3BNK

https://downloadcenter.intel.com/product/95069

BIOS and driver updates for NUC7i3BNH

https://downloadcenter.intel.com/product/95066

Tested memory

http://www.intel.com/content/www/us/en/support/boards-andkits/000020648.html

Integration information

http://www.intel.com/NUCSupport

Processor datasheet

http://ark.intel.com

1.2 Online Support

1.3 Processor

A soldered-down 7th generation Intel® Core™ i3-7100U dual-core processor with up to a maximum 15 W TDP (if thermal margin is available).

 Intel® HD Graphics 620  Integrated memory controller  Integrated PCH

NOTE

There are specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 56 for information on power supply requirements.

Product Description

SO-DIMM Capacity

Configuration

(Note)

SDRAM Density

SDRAM Organization Front-side/Back-side

Number of SDRAM Devices

2048 MB

4 Gbit

512 M x4/empty

4096 MB

4 Gbit

512 M x4/512 M x4

4096 MB

8 Gbit

1024 M x4/empty

8192 MB

4 Gbit

512 M x8/512 M x8

8192 MB

8 Gbit

1024 M x4/1024 M x4

16384 MB

8 Gbit

1024 M X8/1024 M x8

SO-DIMM Capacity

Configuration

(Note)

SDRAM Density

SDRAM Organization Front-side/Back-side

Number of SDRAM Devices

1024 MB

1 Gbit

128 M x8/empty

2048 MB

1 Gbit

128 M x8/128 M x8

2048 MB

2 Gbit

256 M x8/empty

4096 MB

2 Gbit

256 M x8/256 M x8

For information about…

Refer to:

Tested Memory

http://www.intel.com/content/www/us/en/support/boards-andkits/000020648.html

1.4 System Memory

The board has two 260-pin SO-DIMM sockets and supports the following memory features:

 1.2 V DDR4 SDRAM SO-DIMMs with gold plated contacts  Two independent memory channels with interleaved mode support  Unbuffered, single-sided or double-sided SO-DIMMs  32 GB maximum total system memory (with 8 Gb memory technology). Refer to Section 2.1.1

on page 39 for information on the total amount of addressable memory.

 Minimum recommended total system memory: 2048 MB  Non-ECC SO-DIMMs  Serial Presence Detect  DDR4 1866/2133 MHz SDRAM SO-DIMMs

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency.

NOTE

Intel NUC Board NUC7i3BNB supports only 4 Gb and 8 Gb memory technologies (also referred to as “SDRAM density”). Table 4 lists the supported SO-DIMM configurations. Table 5 lists the SO- DIMM configurations that are not supported.

Table 4. Supported Memory Configurations

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

Table 5. Unsupported Memory Configurations

Note: “DS” refers to double-sided memory modules and “SS” refers to single-sided memory modules.

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

Product Description

For information about

Refer to

HDMI technology

http://www.hdmi.org

1.5 Processor Graphics Subsystem

The board supports graphics through Intel HD Graphics.

1.5.1 Integrated Graphics

The board supports integrated graphics via the processor.

1.5.1.1 Intel® High Definition (Intel® HD) Graphics

The Intel HD graphics controller features the following:

 3D Features

― DirectX* 12.1 support ― OpenGL* 5.0 support ― OpenCL* 2.1 support

 Next Generation Intel® Clear Video Technology HD support is a collection of video playback

and enhancement features that improve the end user’s viewing experience

 Encode/transcode HD content  Playback of high definition content including Blu-ray* disc  Superior image quality with sharper, more colorful images  DirectX* Video Acceleration (DXVA) support for accelerating video processing  Full AVC/VC1/MPEG2/HEVC HW Encode/Decode  Intel HD Graphics with Advanced Hardware Video Transcoding (Intel® Quick Sync Video)

NOTE

Intel Quick Sync Video is enabled by an appropriate software application.

1.5.1.2 Video Memory Allocation

Intel® Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount). When memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses.

1.5.1.3 High Definition Multimedia Interface* (HDMI*)

The HDMI port supports standard, enhanced, or high definition video, plus multi-channel digital audio on a single cable. The port is compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats. The maximum supported resolution is 4096 x 2160 @ 60 Hz, 24bpp. The HDMI port is compliant with the HDMI 2.0 specification.

+ 52 hidden pages