Intel BLKDX58OG, DX58OG Technical Product Specification
Intel® Desktop Board
DX58OG
Technical Product Specification
January 2012
Order Number: G13833-002
The Intel Desktop Board DX58OG may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DX58OG Specification Updates.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DX58OG Technical Product
Specification
-002 Specification changes January 2012
This product specification applies to only the standard Intel® Desktop Board DX58OG with BIOS
identifier SOX5820J.86A.
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DEATH MAY OCCUR.
®
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suitability of this product for other PC or embedded non-PC applications or other environments, such as
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desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
November 2010
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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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Copyright © 2010-2012, Intel Corporation. All rights reserved.
Board Identification Information
Basic Desktop Board DX58OG Identification Information
AA Revision BIOS Revision Notes
G10926-203 SOX5820J.86A 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The X58 Express Chipset used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel
®
Desktop Board DX58OG.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or Clarifications
January 2012 Specification
Changes
• Updated Table 2 on page 11 to correct an error in the
callouts.
• Updated Section 1.6.2 on page 21 to delete reference to
two red-colored eSATA connectors on the back panel.
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iii
Intel Desktop Board D410PT Technical Product Specification
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for Intel
Board DX58OG.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop
Board DX58OG and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on Intel Desktop Board DX58OG
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
®
Desktop
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DX58OG Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
GT/s Giga transfers per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
1 Product Description
1.1 Overview ........................................................................................ 11
1.1.1 Feature Summary
1.1.2 Board Layout
1.1.3 Block Diagram
1.2 Legacy Considerations ...................................................................... 16
1.3 Online Support ................................................................................ 16
1.4 Processor ....................................................................................... 16
1.5 System Memory
.............................................................................. 17
1.5.1 Memory Configurations
®
1.6 Intel
X58 Chipset ........................................................................... 20
1.6.1 USB ................................................................................... 20
1.6.2 Serial ATA Interfaces
1.7 Real-Time Clock Subsystem
1.8 Legacy I/O Controller
1.8.1 Consumer Infrared (CIR)
1.9 Audio Subsystem ............................................................................. 23
1.9.1 Audio Subsystem Software
1.9.2 Audio Connectors and Headers
1.10LAN Subsystem
1.10.1 Intel
............................................................................... 25
®
82567L Gigabit Ethernet Controller ................................ 25
1.10.2 LAN Subsystem Software ....................................................... 26
1.10.3 RJ-45 LAN Connector with Integrated LEDs
1.11Hardware Management Subsystem
1.11.1 Hardware Monitoring and Fan Control ...................................... 27
1.11.2 Fan Monitoring
1.11.3 Chassis Intrusion and Detection .............................................. 27
1.11.4 Thermal Monitoring
1.12Power Management
......................................................................... 29
1.12.1 ACPI ................................................................................... 29
1.12.2 Hardware Support
1.13Onboard Power and Reset Buttons
................................................................ 11
....................................................................... 13
..................................................................... 15
......................................................... 18
............................................................ 21
.............................................................. 22
....................................................................... 22
....................................................... 22
.................................................... 23
............................................... 24
.............................. 26
.................................................... 27
..................................................................... 27
.............................................................. 28
................................................................ 33
..................................................... 38
2 Technical Reference
2.1 Memory Resources
2.1.1 Addressable Memory ............................................................. 39
2.1.2 Memory Map ........................................................................ 41
2.2 Connectors and Headers ................................................................... 41
2.2.1 Back Panel Connectors
2.2.2 Component-side Connectors and Headers
2.3 Jumper Block
.................................................................................. 53
.......................................................................... 39
.......................................................... 42
................................ 43
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Intel Desktop Board DX58OG Technical Product Specification
2.4 Mechanical Considerations ................................................................ 55
2.4.1 Form Factor ......................................................................... 55
2.5 Electrical Considerations
2.5.1 Power Supply Considerations
................................................................... 56
................................................. 56
2.5.2 Fan Header Current Capability ................................................ 57
2.5.3 Add-in Board Considerations
2.6 Thermal Considerations
.................................................................... 57
.................................................. 57
2.7 Reliability ....................................................................................... 60
2.8 Environmental ................................................................................ 60
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 61
3.2 BIOS Flash Memory Organization
3.3 Resource Configuration
.................................................................... 62
3.3.1 PCI Autoconfiguration
3.4 System Management BIOS (SMBIOS) ................................................. 63
3.5 Legacy USB Support
3.6 BIOS Updates
................................................................................. 64
3.6.1 Language Support
........................................................................ 63
................................................................ 64
3.6.2 Custom Splash Screen
3.7 BIOS Recovery ................................................................................ 65
3.8 Boot Options ................................................................................... 66
3.8.1 Optical Drive Boot
................................................................ 66
3.8.2 Network Boot ....................................................................... 66
3.8.3 Booting Without Attached Devices........................................... 66
3.8.4 Changing the Default Boot Device During POST
3.9 Adjusting Boot Speed ....................................................................... 67
3.9.1 Peripheral Selection and Configuration ..................................... 67
3.9.2 BIOS Boot Optimizations
3.10BIOS Security Features
.................................................................... 68
3.11BIOS Performance Features
....................................................... 62
........................................................... 62
.......................................................... 65
........................ 66
....................................................... 67
.............................................................. 69
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 71
4.2 BIOS Beep Codes
4.3 Front-panel Power LED Blink Codes
4.4 BIOS Error Messages
4.5 Port 80h POST Codes
viii
............................................................................ 71
.................................................... 72
....................................................................... 72
....................................................................... 73
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ..................................................................... 79
5.1.1 Safety Standards .................................................................. 79
5.1.2 European Union Declaration of Conformity Statement
................ 80
5.1.3 Product Ecology Statements ................................................... 81
5.1.4 EMC Regulations
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance
5.1.6 Regulatory Compliance Marks (Board Level)
.................................................................. 83
................. 86
............................. 87
5.2 Battery Disposal Information ............................................................. 88
Figures
1. Major Board Components.................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration ........................................... 19
4. Back Panel Audio Connectors ............................................................ 24
5. LAN Connector LED Locations ............................................................ 26
6. Thermal Sensors and Fan Headers ..................................................... 28
7. Locations of Onboard LED Indicators .................................................. 37
8. Location of the Power and Reset Buttons ............................................ 38
9. Detailed System Memory Address Map ............................................... 40
10. Back Panel Connectors ..................................................................... 42
11. Component-side Connectors and Headers ........................................... 43
12. Connection Diagram for Front Panel Header ........................................ 50
13. Connection Diagram for Front Panel USB Headers ................................ 52
14. Location of the Jumper Block ............................................................. 53
15. Board Dimensions ........................................................................... 55
16. Localized High Temperature Zones ..................................................... 58
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Intel Desktop Board DX58OG Technical Product Specification
Tables
1. Specification Changes or Clarifications .................................................. iii
2. Feature Summary ............................................................................ 11
3. Components Shown in Figure 1 ......................................................... 14
4. Supported Memory Configurations ..................................................... 18
5. Audio Jack Support .......................................................................... 23
6. LAN Connector LED States ................................................................ 26
7. Effects of Pressing the Power Switch .................................................. 30
8. Power States and Targeted System Power ........................................... 31
9. Wake-up Devices and Events ............................................................ 32
10. System Memory Map ....................................................................... 41
11. Component-side Connectors and Headers Shown in Figure 11 ................ 44
12. Front Panel Audio Header ................................................................. 45
13. Serial ATA Connectors ...................................................................... 45
14. Front Panel IEEE 1394a Header ......................................................... 45
15. Chassis Intrusion Header .................................................................. 46
16. Front and Rear Chassis (3-Pin) Fan Headers
17. Processor and Rear Chassis 2 (4-Pin) Fan Headers
18. Auxiliary Front Panel Power/Sleep LED Header ..................................... 47
19. Processor Core Power Connector ........................................................ 48
20. Main Power Connector ...................................................................... 49
21. Auxiliary PCI Express Graphics Power Connector .................................. 49
22. Front Panel Header .......................................................................... 50
23. States for a One-Color Power LED ...................................................... 51
24. States for a Two-Color Power LED ...................................................... 51
25. BIOS Setup Configuration Jumper Settings .......................................... 54
26. Recommended Power Supply Current Values ....................................... 56
27. Fan Header Current Capability ........................................................... 57
28. Thermal Considerations for Components ............................................. 59
29. Environmental Specifications ............................................................. 60
30. BIOS Setup Program Menu Bar .......................................................... 62
31. BIOS Setup Program Function Keys .................................................... 62
32. Acceptable Drives/Media Types for BIOS Recovery
33. Boot Device Menu Options ................................................................ 66
34. Supervisor and User Password Functions ............................................. 68
35. BIOS Beep Codes ............................................................................ 71
36. Front-panel Power LED Blink Codes .................................................... 72
37. BIOS Error Messages ....................................................................... 72
38. Port 80h POST Code Ranges.............................................................. 73
39. Port 80h POST Codes ....................................................................... 74
40. Typical Port 80h POST Sequence ........................................................ 77
41. Safety Standards ............................................................................. 79
42. EMC Regulations ............................................................................. 83
43. Regulatory Compliance Marks ............................................................ 87
........................................ 46
............................... 46
............................... 65
x
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
Processor
Memory
Chipset
Audio Intel® High Definition Audio subsystem using the Realtek* ALC892 audio codec.
Legacy I/O Control Winbond W83677HG-I legacy I/O controller for Consumer Infrared (CIR)
Peripheral
Interfaces
BIOS
Instantly Available
PC Technology
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
®
• Intel
• Six 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and
• Support for up to 24 GB of system memory with 6 DIMMs using 4 Gb memory
• Support for ECC and non-ECC memory
• XMP version 1.2
Intel
• Intel
• Intel
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Twelve USB 2.0 ports:
• Eight internal SATA interfaces with RAID support:
• Two IEEE 1394a ports:
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Support for PCI Local Bus Specification Revision 2.2
• Support for PCI Express* Revision 2.0
• Suspend to RAM support
• Wake on PCI, front panel, CIR, and USB ports
Core™ i7 and Intel® Xeon® Processors in an LGA1366 socket
1066 MHz DIMMs.
― Speeds over 1600 Mhz via XMP profiles
technology
®
X58 Chipset, consisting of:
®
X58 I/O Hub (IOH)
®
82801IJR I/O Controller Hub (ICH10R)
― Six ports are implemented with stacked back panel connectors (black)
― Six front panel ports implemented through four internal headers
― Two SATA 6 Gb/s interfaces through Marvel 88SE9128 controller (blue)
― Six SATA 3 Gb/s interfaces through the ICH10R (black)
― One port via a back panel connector
― One port via an internal header for front panel cabling
®
BIOS resident in the Serial Peripheral Interface (SPI) Flash device
and System Management BIOS (SMBIOS)
continued
11
Intel Desktop Board DX58OG Technical Product Specification
Table 2. Feature Summary (continued)
LAN Support
Expansion
Capabilities
Hardware Monitor
Subsystem
Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel 82567L Gigabit
Ethernet Controller
• One Conventional PCI* bus add-in card connector (SMBus routed to the
Conventional PCI bus add-in card connector)
• Two PCI Express 2.0 x16 bus add-in card connectors
• Three PCI Express 1.1 x1 bus add-in card connectors
• Hardware monitoring and fan control ASIC Heceta 6P
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Four fan headers using PWM control
• Three fan sense inputs used to monitor fan activity
• Fan speed control using voltage control (4-pin fan headers front and rear)
• Support for Product Environmental Control Interface (PECI)
12
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DX58OG.
Figure 1. Major Board Components
Table 3 lists the components identified in Figure 1.
13
Intel Desktop Board DX58OG Technical Product Specification
Table 3. Components Shown in Figure 1
Item/callout
from Figure 1 Descript
A Front panel audio header
B PCI Express x1 bus connector
C PCI Express x1 bus connector
D Conventional PCI bus add-in card connector
E PCI Express x16 bus add-in card connector (Secondary)
F PCI Express x1 bus add-in card connector
G PCI Express x16 bus add-in card connector (Primary)
H Rear chassis fan header
I Intel 82X58 IO Hub (IOH)
J Back panel connectors
K Processor fan header
L Processor core power connector (2 x 4)
M LGA1366 processor socket
N DIMM 4 socket
O DIMM 1 socket
P DIMM 5 socket
Q DIMM 2 socket
R DIMM 6 socket
S DIMM 3 socket
T Main power connector (2 x 12)
U Front chassis fan header
V Intel 82801IJR I/O Controller Hub (ICH10R)
W SATA connectors (six 3 Gb/s interfaces (black) and two 6 Gb/s interfaces (blue))
X Chassis intrusion header
Y Piezoelectric speaker
Z Front panel USB headers (3)
AA Consumer IR receiver (input) header
BB Consumer IR emitter (output) header
CC BIOS Setup configuration jumper block
DD Front panel header
EE Auxiliary front panel power LED header
FF Post Code LED display
GG IEEE 1394a front panel header
HH Battery
II Onboard Reset button
JJ Onboard Power button
KK Auxilliary chassis fan header
LL Status LEDs
ion
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
15
Intel Desktop Board DX58OG Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port
• No floppy drive connector
• No serial port
• No PS/2 connectors
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DX58OG http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board DX58OG
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.4 Processor
The board is designed to support the Intel Core i7 and Intel Xeon Processors in an
LGA1366 socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 130 W. The processor listed above is only
supported when falling within the wattage requirements of the Intel Desktop Board
DX58OG. See the Intel web site listed below for the most up-to-date list of supported
processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
INTEGRATOR’S NOTE
#
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 56 for information on power supply requirements for this board.
16
Product Description
1.5 System Memory
The board has six DIMM sockets and supports the following memory features:
• 1.5 V, 1.3 V, and 1.25 V DDR3 SDRAM DIMMs
• Three independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 24 GB maximum total system memory. Refer to Section 2.1.1 on page 39 for
i
nformation on the total amount of addressable memory.
• Minimum total system memory: 1 GB
• ECC and non-ECC DIMMs
• Serial Presence Detect
• DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and 1066 MHz
SDRAM DIMMs
• XMP version 1.2 performance profile support for memory speeds above 1600 MHz
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
17
Intel Desktop Board DX58OG Technical Product Specification
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
SDRAM
Density
DIMM
Capacity Configuration
512 MB SS 1 Gbit 64 M x16/empty 4
1024 MB SS 1 Gbit 128 M x8/empty 8
1024 MB SS 2 Gbit 128 M x16/empty 4
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 128 M x16/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
(Note)
For information about… Refer to:
Tested Memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
1.5.1 Memory Configurations
The Intel Core i7 and Intel Xeon Processors support the following types of memory
organization:
• Tri/Dual channel (Interleaved) mode. This mode offers the highest
throughput for real world applications. Interleaving reduces overall memory
latency by accessing the DIMM memory sequentially. Data is spread amongst the
memory modules in an alternating pattern.
⎯ Three independent memory channels give two possible modes of interleaving:
• Tri-channel mode is enabled when identical matched memory modules are
installed in each of the three memory channels (blue connectors).
• Dual channel mode is enabled when two of the blue memory connectors are
populated with matched DIMMs.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the installed memory modules are not matched.
Technology and device width can vary from one channel to the other.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
18
Figure 3 illustrates the memory channel and DIMM configuration.
Product Description
Figure 3. Memory Channel and DIMM Configuration
19
Intel Desktop Board DX58OG Technical Product Specification
1.6 Intel
®
X58 Chipset
The Intel X58 chipset consists of the following devices:
• Intel 82X58 IOH with Direct Media Interface (DMI) interconnect
• Intel 82801IJR I/O Controller Hub (ICH10R)
The IOH component provides interfaces to the processor and the PCI Express graphics
connectors. The ICH10R is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel X58 chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1 USB
The board supports up to 14 USB ports. The port arrangement is as follows:
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Six USB 2.0 ports are implemented with stacked back panel connectors (black)
• Six USB 2.0 front panel ports implemented through three internal headers
The Intel X58 Express Chipset provides the USB controller for the 2.0 ports. The two
USB 3.0 ports are provided by the NEC* UPD720200 controller. All 14 USB ports are
high-speed, full-speed, and low-speed capable. The USB 3.0 ports are super-speed
capable.
For information about Refer to
The location of the USB connectors on the back panel Figure 10, page 42
The location of the front panel USB headers Figure 11, page 43
20
Product Description
1.6.2 Serial ATA Interfaces
The board provides eight SATA interfaces:
• Six 3 Gb/s interfaces through the ICH10R (black)
• Two SATA 6 Gb/s interfaces through the Marvel 88SE9128 controller (blue)
1.6.2.1 Serial ATA Support
The board’s Serial ATA controller offers eight independent Serial ATA ports. One
device can be installed on each port for a maximum of eight Serial ATA devices. A
point-to-point interface is used for host to device connections, unlike Parallel ATA IDE
which supports a master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard Conventional PCI bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP and
Windows Vista* operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the Serial ATA connectors Figure 11, page 43
.
1.6.2.2 Serial ATA RAID
The board supports the following RAID (Redundant Array of Independent Drives)
levels via the ICH10R:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS.
Also, during Microsoft Windows XP installation, you must press F6 to install the RAID
drivers. See your Microsoft Windows XP documentation for more information about
installing drivers during installation.
21
Intel Desktop Board DX58OG Technical Product Specification
1.7 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, Date and Time values will be reset and the user will
be notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.8 Legacy I/O Controller
The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.8.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models. Microsoft Windows Vista is the supported operating system
The CIR feature is made up of two separate pieces: the receiving (receiver) header,
and the output (emitter) header. The receiving header consists of a filtered translated
infrared input compliant with Microsoft CIR specifications, and also a “learning”
infrared input. This learning input is simply a high pass input which the computer can
use to “learn” to speak the infrared communication language of other user remotes.
The emitter header consists of two output ports which the PC can use to emulate
“learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to plug into Intel
Desktop Boards for this feature to work.
22
Product Description
1.9 Audio Subsystem
The onboard audio subsystem consists of the following:
• Intel 82801IJR (ICH10R)
• Realtek ALC888VC audio codec
• Back panel audio connectors
• Component-side audio headers/connectors:
⎯ Front panel audio header with support for Intel
HD Audio) and AC ’97 audio
The audio subsystem supports the following features:
• A signal-to-noise (S/N) ratio of 95 dB
• Independent 5.1 audio playback from back panel connectors and stereo playback
from the Intel High Definition Audio front panel header
®
High Definition Audio (Intel®
NOTE
Systems built with an AC ‘97 front panel will not be able to obtain the Microsoft
Windows Vista logo.
Table 5 lists the supported functions of the front panel and back panel audio jacks.
Table 5. Audio Jack Support
Audio Jack
FP Green Default
FP Pink Default
Rear Blue Default
Rear Green Ctrl panel Default
Rear Pink Default
Microphone
Head-
phones
Front
Speaker Line In
Side
Surround
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 16
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Intel Desktop Board DX58OG Technical Product Specification
1.9.2 Audio Connectors and Headers
The board contains audio connectors on the back panel and audio headers on the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front/back panel audio connectors are configurable through the audio device
drivers. The available configurable back panel audio ports are shown in Figure 4.
Item Description
A Line in
B Line out
C Mic in
Figure 4. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The location of the front panel audio header Figure 11, page 43
The signal names of the front panel audio header Table 12, page 45
The back panel audio connectors Section Error! Reference source
not found., page Error!
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24
1.10 LAN Subsystem
The Intel GbE LAN subsystem consists of the following:
• Intel 82567L Gigabit Ethernet Controller
(10/100/1000 Mbits/sec)
• Intel 82801IJR (ICH10R)
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between ICH10R and the LAN controller
• Conventional PCI bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
Product Description
1.10.1 Intel
The Intel 82567L Gigabit Ethernet Controller support the following features:
• PCI Express link
• 10/100/1000 IEEE 802.3 compliant
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Transmit TCP segmentation
• Full device driver compatibility
• PCI Express power management support
®
82567L Gigabit Ethernet Controller
25
Intel Desktop Board DX58OG Technical Product Specification
1.10.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.10.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 6 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 6. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring
Off 10 Mbits/sec data rate is selected.
Green 100 Mbits/sec data rate is selected.
Yellow 1000 Mbits/sec data rate is selected.
26
Product Description
1.11 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.11.1 Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
• Fan speed control controllers and sensors provided by the Hardware Monitoring
and Fan Control ASIC
• Thermal sensors in the processor, 82X58 IOH, and 82801IJR ICH10R
• Power supply monitoring of five voltages (+12 V, +5 V, +3.3 V, V_SM and +VCCP)
to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the
fan speed or switch the fans on or off as needed
1.11.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Control Center or third-party
software.
For information about Refer to
The functions of the fan headers Section 1.12.2.2, page 34
1.11.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 11, page 43
27
Intel Desktop Board DX58OG Technical Product Specification
1.11.4 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Rear chassis fan header
B Thermal diode, located on the IOH die
C Processor fan header
D Thermal diode, located on processor die
E Front chassis fan header
F Thermal diode, located on the ICH10R die
G Auxiliary chassis fan header
Figure 6. Thermal Sensors and Fan Headers
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