Intel BLKDX58OG, DX58OG Technical Product Specification

Intel® Desktop Board DX58OG

Technical Product Specification

January 2012

Order Number: G13833-002

The Intel Desktop Board DX58OG may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DX58OG Specification Updates.

Revision History

Revision Revision History Date

-001 First release of the Intel® Desktop Board DX58OG Technical Product Specification

-002 Specification changes January 2012

This product specification applies to only the standard Intel® Desktop Board DX58OG with BIOS identifier SOX5820J.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.

desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal

November 2010

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Intel, Core i7, and Xeon are registered trademarks of Intel Corporation in the U.S. and other countries.

* Other names and brands may be claimed as the property of others.

Board Identification Information

Basic Desktop Board DX58OG Identification Information

AA Revision BIOS Revision Notes

G10926-203 SOX5820J.86A 1,2 Notes:

1. The AA number is found on a small label on the component side of the board.

2. The X58 Express Chipset used on this AA revision consists of the following component:

Device Stepping S-Spec Numbers

Specification Changes or Clarifications

Table 1 indicates the Specification Changes or Specification Clarifications that apply to the Intel

Desktop Board DX58OG.

Table 1. Specification Changes or Clarifications

Date Type of Change Description of Changes or Clarifications

January 2012 Specification

Changes

• Updated Table 2 on page 11 to correct an error in the

callouts.

• Updated Section 1.6.2 on page 21 to delete reference to

two red-colored eSATA connectors on the back panel.

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See http://developer.intel.com/products/desktop/motherboard/index.htm for the latest documentation.

iii

Intel Desktop Board D410PT Technical Product Specification

Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel Board DX58OG.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel Desktop Board DX58OG and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on Intel Desktop Board DX58OG 2 A map of the resources of the Intel Desktop Board 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes 5 Regulatory compliance and battery disposal information

Desktop

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DX58OG Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second GT/s Giga transfers per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mbit Megabit (1,048,576 bits) Mbits/s Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

Contents

1 Product Description

1.1 Overview ........................................................................................ 11

1.1.1 Feature Summary

1.1.2 Board Layout

1.1.3 Block Diagram

1.2 Legacy Considerations ...................................................................... 16

1.3 Online Support ................................................................................ 16

1.4 Processor ....................................................................................... 16

1.5 System Memory

.............................................................................. 17

1.5.1 Memory Configurations

1.6 Intel

X58 Chipset ........................................................................... 20

1.6.1 USB ................................................................................... 20

1.6.2 Serial ATA Interfaces

1.7 Real-Time Clock Subsystem

1.8 Legacy I/O Controller

1.8.1 Consumer Infrared (CIR)

1.9 Audio Subsystem ............................................................................. 23

1.9.1 Audio Subsystem Software

1.9.2 Audio Connectors and Headers

1.10LAN Subsystem

1.10.1 Intel

............................................................................... 25

82567L Gigabit Ethernet Controller ................................ 25

1.10.2 LAN Subsystem Software ....................................................... 26

1.10.3 RJ-45 LAN Connector with Integrated LEDs

1.11Hardware Management Subsystem

1.11.1 Hardware Monitoring and Fan Control ...................................... 27

1.11.2 Fan Monitoring

1.11.3 Chassis Intrusion and Detection .............................................. 27

1.11.4 Thermal Monitoring

1.12Power Management

......................................................................... 29

1.12.1 ACPI ................................................................................... 29

1.12.2 Hardware Support

1.13Onboard Power and Reset Buttons

................................................................ 11

....................................................................... 13

..................................................................... 15

......................................................... 18

............................................................ 21

.............................................................. 22

....................................................................... 22

....................................................... 22

.................................................... 23

............................................... 24

.............................. 26

.................................................... 27

..................................................................... 27

.............................................................. 28

................................................................ 33

..................................................... 38

2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory ............................................................. 39

2.1.2 Memory Map ........................................................................ 41

2.2 Connectors and Headers ................................................................... 41

2.2.1 Back Panel Connectors

2.2.2 Component-side Connectors and Headers

2.3 Jumper Block

.................................................................................. 53

.......................................................................... 39

.......................................................... 42

................................ 43

vii

Intel Desktop Board DX58OG Technical Product Specification

2.4 Mechanical Considerations ................................................................ 55

2.4.1 Form Factor ......................................................................... 55

2.5 Electrical Considerations

2.5.1 Power Supply Considerations

................................................................... 56

................................................. 56

2.5.2 Fan Header Current Capability ................................................ 57

2.5.3 Add-in Board Considerations

2.6 Thermal Considerations

.................................................................... 57

.................................................. 57

2.7 Reliability ....................................................................................... 60

2.8 Environmental ................................................................................ 60

3 Overview of BIOS Features

3.1 Introduction ................................................................................... 61

3.2 BIOS Flash Memory Organization

3.3 Resource Configuration

.................................................................... 62

3.3.1 PCI Autoconfiguration

3.4 System Management BIOS (SMBIOS) ................................................. 63

3.5 Legacy USB Support

3.6 BIOS Updates

................................................................................. 64

3.6.1 Language Support

........................................................................ 63

................................................................ 64

3.6.2 Custom Splash Screen

3.7 BIOS Recovery ................................................................................ 65

3.8 Boot Options ................................................................................... 66

3.8.1 Optical Drive Boot

................................................................ 66

3.8.2 Network Boot ....................................................................... 66

3.8.3 Booting Without Attached Devices........................................... 66

3.8.4 Changing the Default Boot Device During POST

3.9 Adjusting Boot Speed ....................................................................... 67

3.9.1 Peripheral Selection and Configuration ..................................... 67

3.9.2 BIOS Boot Optimizations

3.10BIOS Security Features

.................................................................... 68

3.11BIOS Performance Features

....................................................... 62

........................................................... 62

.......................................................... 65

........................ 66

....................................................... 67

.............................................................. 69

4 Error Messages and Beep Codes

4.1 Speaker ......................................................................................... 71

4.2 BIOS Beep Codes

4.3 Front-panel Power LED Blink Codes

4.4 BIOS Error Messages

4.5 Port 80h POST Codes

viii

............................................................................ 71

.................................................... 72

....................................................................... 72

....................................................................... 73

Contents

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ..................................................................... 79

5.1.1 Safety Standards .................................................................. 79

5.1.2 European Union Declaration of Conformity Statement

................ 80

5.1.3 Product Ecology Statements ................................................... 81

5.1.4 EMC Regulations

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance

5.1.6 Regulatory Compliance Marks (Board Level)

.................................................................. 83

................. 86

............................. 87

5.2 Battery Disposal Information ............................................................. 88

Figures

1. Major Board Components.................................................................. 13

2. Block Diagram ................................................................................ 15

3. Memory Channel and DIMM Configuration ........................................... 19

4. Back Panel Audio Connectors ............................................................ 24

5. LAN Connector LED Locations ............................................................ 26

6. Thermal Sensors and Fan Headers ..................................................... 28

7. Locations of Onboard LED Indicators .................................................. 37

8. Location of the Power and Reset Buttons ............................................ 38

9. Detailed System Memory Address Map ............................................... 40

10. Back Panel Connectors ..................................................................... 42

11. Component-side Connectors and Headers ........................................... 43

12. Connection Diagram for Front Panel Header ........................................ 50

13. Connection Diagram for Front Panel USB Headers ................................ 52

14. Location of the Jumper Block ............................................................. 53

15. Board Dimensions ........................................................................... 55

16. Localized High Temperature Zones ..................................................... 58

Intel Desktop Board DX58OG Technical Product Specification

Tables

1. Specification Changes or Clarifications .................................................. iii

2. Feature Summary ............................................................................ 11

3. Components Shown in Figure 1 ......................................................... 14

4. Supported Memory Configurations ..................................................... 18

5. Audio Jack Support .......................................................................... 23

6. LAN Connector LED States ................................................................ 26

7. Effects of Pressing the Power Switch .................................................. 30

8. Power States and Targeted System Power ........................................... 31

9. Wake-up Devices and Events ............................................................ 32

10. System Memory Map ....................................................................... 41

11. Component-side Connectors and Headers Shown in Figure 11 ................ 44

12. Front Panel Audio Header ................................................................. 45

13. Serial ATA Connectors ...................................................................... 45

14. Front Panel IEEE 1394a Header ......................................................... 45

15. Chassis Intrusion Header .................................................................. 46

16. Front and Rear Chassis (3-Pin) Fan Headers

17. Processor and Rear Chassis 2 (4-Pin) Fan Headers

18. Auxiliary Front Panel Power/Sleep LED Header ..................................... 47

19. Processor Core Power Connector ........................................................ 48

20. Main Power Connector ...................................................................... 49

21. Auxiliary PCI Express Graphics Power Connector .................................. 49

22. Front Panel Header .......................................................................... 50

23. States for a One-Color Power LED ...................................................... 51

24. States for a Two-Color Power LED ...................................................... 51

25. BIOS Setup Configuration Jumper Settings .......................................... 54

26. Recommended Power Supply Current Values ....................................... 56

27. Fan Header Current Capability ........................................................... 57

28. Thermal Considerations for Components ............................................. 59

29. Environmental Specifications ............................................................. 60

30. BIOS Setup Program Menu Bar .......................................................... 62

31. BIOS Setup Program Function Keys .................................................... 62

32. Acceptable Drives/Media Types for BIOS Recovery

33. Boot Device Menu Options ................................................................ 66

34. Supervisor and User Password Functions ............................................. 68

35. BIOS Beep Codes ............................................................................ 71

36. Front-panel Power LED Blink Codes .................................................... 72

37. BIOS Error Messages ....................................................................... 72

38. Port 80h POST Code Ranges.............................................................. 73

39. Port 80h POST Codes ....................................................................... 74

40. Typical Port 80h POST Sequence ........................................................ 77

41. Safety Standards ............................................................................. 79

42. EMC Regulations ............................................................................. 83

43. Regulatory Compliance Marks ............................................................ 87

........................................ 46

............................... 46

............................... 65

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 2 summarizes the major features of the board.

Table 2. Feature Summary

Form Factor

Processor

Memory

Chipset

Audio Intel® High Definition Audio subsystem using the Realtek* ALC892 audio codec. Legacy I/O Control Winbond W83677HG-I legacy I/O controller for Consumer Infrared (CIR)

Peripheral Interfaces

BIOS

Instantly Available PC Technology

ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])

• Intel

• Six 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets

• Support for DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and

• Support for up to 24 GB of system memory with 6 DIMMs using 4 Gb memory

• Support for ECC and non-ECC memory

• XMP version 1.2

Intel

• Intel

• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)

• Twelve USB 2.0 ports:

• Eight internal SATA interfaces with RAID support:

• Two IEEE 1394a ports:

• Intel

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,

• Support for PCI Local Bus Specification Revision 2.2

• Support for PCI Express* Revision 2.0

• Suspend to RAM support

• Wake on PCI, front panel, CIR, and USB ports

Core™ i7 and Intel® Xeon® Processors in an LGA1366 socket

1066 MHz DIMMs.

― Speeds over 1600 Mhz via XMP profiles

technology

X58 Chipset, consisting of:

X58 I/O Hub (IOH)

82801IJR I/O Controller Hub (ICH10R)

― Six ports are implemented with stacked back panel connectors (black) ― Six front panel ports implemented through four internal headers

― Two SATA 6 Gb/s interfaces through Marvel 88SE9128 controller (blue) ― Six SATA 3 Gb/s interfaces through the ICH10R (black)

― One port via a back panel connector ― One port via an internal header for front panel cabling

BIOS resident in the Serial Peripheral Interface (SPI) Flash device

and System Management BIOS (SMBIOS)

continued

Intel Desktop Board DX58OG Technical Product Specification

Table 2. Feature Summary (continued)

LAN Support

Expansion Capabilities

Hardware Monitor Subsystem

Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel 82567L Gigabit Ethernet Controller

• One Conventional PCI* bus add-in card connector (SMBus routed to the

Conventional PCI bus add-in card connector)

• Two PCI Express 2.0 x16 bus add-in card connectors

• Three PCI Express 1.1 x1 bus add-in card connectors

• Hardware monitoring and fan control ASIC Heceta 6P

• Voltage sense to detect out of range power supply voltages

• Thermal sense to detect out of range thermal values

• Four fan headers using PWM control

• Three fan sense inputs used to monitor fan activity

• Fan speed control using voltage control (4-pin fan headers front and rear)

• Support for Product Environmental Control Interface (PECI)

Product Description

1.1.2 Board Layout

Figure 1 shows the location of the major components on Intel Desktop Board DX58OG.

Figure 1. Major Board Components

Table 3 lists the components identified in Figure 1.

Intel Desktop Board DX58OG Technical Product Specification

Table 3. Components Shown in Figure 1

Item/callout from Figure 1 Descript

A Front panel audio header B PCI Express x1 bus connector C PCI Express x1 bus connector D Conventional PCI bus add-in card connector E PCI Express x16 bus add-in card connector (Secondary) F PCI Express x1 bus add-in card connector G PCI Express x16 bus add-in card connector (Primary) H Rear chassis fan header I Intel 82X58 IO Hub (IOH) J Back panel connectors K Processor fan header L Processor core power connector (2 x 4) M LGA1366 processor socket N DIMM 4 socket O DIMM 1 socket P DIMM 5 socket Q DIMM 2 socket R DIMM 6 socket S DIMM 3 socket T Main power connector (2 x 12) U Front chassis fan header V Intel 82801IJR I/O Controller Hub (ICH10R) W SATA connectors (six 3 Gb/s interfaces (black) and two 6 Gb/s interfaces (blue)) X Chassis intrusion header Y Piezoelectric speaker Z Front panel USB headers (3) AA Consumer IR receiver (input) header BB Consumer IR emitter (output) header CC BIOS Setup configuration jumper block DD Front panel header EE Auxiliary front panel power LED header FF Post Code LED display GG IEEE 1394a front panel header HH Battery II Onboard Reset button JJ Onboard Power button KK Auxilliary chassis fan header LL Status LEDs

ion

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

Product Description

Figure 2. Block Diagram

Intel Desktop Board DX58OG Technical Product Specification

1.2 Legacy Considerations

This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following:

• No parallel port

• No floppy drive connector

• No serial port

• No PS/2 connectors

1.3 Online Support

To find information about… Visit this World Wide Web site:

Intel Desktop Board DX58OG http://www.intel.com/products/motherboard/index.htm Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available configurations for the Intel

Desktop Board DX58OG

Supported processors http://processormatch.intel.com Chipset information http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

Integration information http://www.intel.com/support/go/buildit

http://ark.intel.com

025414.htm

1.4 Processor

The board is designed to support the Intel Core i7 and Intel Xeon Processors in an LGA1366 socket.

Other processors may be supported in the future. This board is designed to support processors with a maximum wattage of 130 W. The processor listed above is only supported when falling within the wattage requirements of the Intel Desktop Board DX58OG. See the Intel web site listed below for the most up-to-date list of supported processors.

For information about… Refer to:

Supported processors http://processormatch.intel.com

CAUTION

Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.

INTEGRATOR’S NOTE

This board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 56 for information on power supply requirements for this board.

Product Description

1.5 System Memory

The board has six DIMM sockets and supports the following memory features:

• 1.5 V, 1.3 V, and 1.25 V DDR3 SDRAM DIMMs

• Three independent memory channels with interleaved mode support

• Unbuffered, single-sided or double-sided DIMMs with the following restriction:

Double-sided DIMMs with x16 organization are not supported.

• 24 GB maximum total system memory. Refer to Section 2.1.1 on page 39 for

nformation on the total amount of addressable memory.

• Minimum total system memory: 1 GB

• ECC and non-ECC DIMMs

• Serial Presence Detect

• DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and 1066 MHz

SDRAM DIMMs

• XMP version 1.2 performance profile support for memory speeds above 1600 MHz

 NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.

Intel Desktop Board DX58OG Technical Product Specification

Table 4 lists the supported DIMM configurations.

Table 4. Supported Memory Configurations

SDRAM Density

DIMM Capacity Configuration

512 MB SS 1 Gbit 64 M x16/empty 4 1024 MB SS 1 Gbit 128 M x8/empty 8 1024 MB SS 2 Gbit 128 M x16/empty 4 2048 MB DS 1 Gbit 128 M x8/128 M x8 16 2048 MB SS 2 Gbit 128 M x16/empty 8 4096 MB DS 2 Gbit 256 M x8/256 M x8 16 8192 MB DS 4 Gbit 512 M x8/512 M x8 16

Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to

single-sided memory modules (containing one row of SDRAM).

(Note)

For information about… Refer to:

Tested Memory http://www.intel.com/support/motherboards/desktop/sb/CS-

025414.htm

XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm

SDRAM Organization Front-side/Back-side

Number of SDRAM Devices

1.5.1 Memory Configurations

The Intel Core i7 and Intel Xeon Processors support the following types of memory organization:

• Tri/Dual channel (Interleaved) mode. This mode offers the highest

throughput for real world applications. Interleaving reduces overall memory latency by accessing the DIMM memory sequentially. Data is spread amongst the memory modules in an alternating pattern.

⎯ Three independent memory channels give two possible modes of interleaving:

• Tri-channel mode is enabled when identical matched memory modules are

installed in each of the three memory channels (blue connectors).

• Dual channel mode is enabled when two of the blue memory connectors are

populated with matched DIMMs.

• Single channel (Asymmetric) mode. This mode is equivalent to single channel

bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the installed memory modules are not matched. Technology and device width can vary from one channel to the other.

For information about… Refer to:

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-

011965.htm

Figure 3 illustrates the memory channel and DIMM configuration.

Product Description

Figure 3. Memory Channel and DIMM Configuration

Intel Desktop Board DX58OG Technical Product Specification

1.6 Intel

X58 Chipset

The Intel X58 chipset consists of the following devices:

• Intel 82X58 IOH with Direct Media Interface (DMI) interconnect

• Intel 82801IJR I/O Controller Hub (ICH10R)

The IOH component provides interfaces to the processor and the PCI Express graphics connectors. The ICH10R is a centralized controller for the board’s I/O paths.

For information about Refer to

The Intel X58 chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2

1.6.1 USB

The board supports up to 14 USB ports. The port arrangement is as follows:

• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)

• Six USB 2.0 ports are implemented with stacked back panel connectors (black)

• Six USB 2.0 front panel ports implemented through three internal headers

The Intel X58 Express Chipset provides the USB controller for the 2.0 ports. The two USB 3.0 ports are provided by the NEC* UPD720200 controller. All 14 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports are super-speed capable.

For information about Refer to

The location of the USB connectors on the back panel Figure 10, page 42 The location of the front panel USB headers Figure 11, page 43

Product Description

1.6.2 Serial ATA Interfaces

The board provides eight SATA interfaces:

• Six 3 Gb/s interfaces through the ICH10R (black)

• Two SATA 6 Gb/s interfaces through the Marvel 88SE9128 controller (blue)

1.6.2.1 Serial ATA Support

The board’s Serial ATA controller offers eight independent Serial ATA ports. One device can be installed on each port for a maximum of eight Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel.

For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard Conventional PCI bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows Vista* operating systems.



NOTE

Many Serial ATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors.

For more information, see: http://www.serialata.org/

For information about Refer to

The location of the Serial ATA connectors Figure 11, page 43

1.6.2.2 Serial ATA RAID

The board supports the following RAID (Redundant Array of Independent Drives) levels via the ICH10R:

• RAID 0 - data striping

• RAID 1 - data mirroring

• RAID 0+1 (or RAID 10) - data striping and mirroring

• RAID 5 - distributed parity



NOTE

In order to use supported RAID features, you must first enable RAID in the BIOS. Also, during Microsoft Windows XP installation, you must press F6 to install the RAID drivers. See your Microsoft Windows XP documentation for more information about installing drivers during installation.

Intel Desktop Board DX58OG Technical Product Specification

1.7 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.

 NOTE

If the battery and AC power fail, Date and Time values will be reset and the user will be notified during POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.8 Legacy I/O Controller

The I/O controller provides the following features:

• Consumer Infrared (CIR) headers

• Serial IRQ interface compatible with serialized IRQ support for PCI systems

• Intelligent power management, including a programmable wake-up event interface

• PCI power management support

The BIOS Setup program provides configuration options for the I/O controller.

1.8.1 Consumer Infrared (CIR)

The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer Infrared usage models. Microsoft Windows Vista is the supported operating system

The CIR feature is made up of two separate pieces: the receiving (receiver) header, and the output (emitter) header. The receiving header consists of a filtered translated infrared input compliant with Microsoft CIR specifications, and also a “learning” infrared input. This learning input is simply a high pass input which the computer can use to “learn” to speak the infrared communication language of other user remotes. The emitter header consists of two output ports which the PC can use to emulate “learned” infrared commands in order to control external electronic hardware.

Customers are required to buy or create their own interface modules to plug into Intel Desktop Boards for this feature to work.

Product Description

1.9 Audio Subsystem

The onboard audio subsystem consists of the following:

• Intel 82801IJR (ICH10R)

• Realtek ALC888VC audio codec

• Back panel audio connectors

• Component-side audio headers/connectors: ⎯ Front panel audio header with support for Intel

HD Audio) and AC ’97 audio

The audio subsystem supports the following features:

• A signal-to-noise (S/N) ratio of 95 dB

• Independent 5.1 audio playback from back panel connectors and stereo playback

from the Intel High Definition Audio front panel header

High Definition Audio (Intel®



NOTE

Systems built with an AC ‘97 front panel will not be able to obtain the Microsoft Windows Vista logo.

Table 5 lists the supported functions of the front panel and back panel audio jacks.

Table 5. Audio Jack Support

Audio Jack

FP Green Default FP Pink Default Rear Blue Default Rear Green Ctrl panel Default Rear Pink Default

Microphone

Head-

phones

Front

Speaker Line In

Side

Surround

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio software and drivers Section 1.3, page 16

Intel Desktop Board DX58OG Technical Product Specification

1.9.2 Audio Connectors and Headers

The board contains audio connectors on the back panel and audio headers on the component side of the board. The front panel audio header provides mic in and line out signals for the front panel. Microphone bias is supported for both the front and back panel microphone connectors.

The front/back panel audio connectors are configurable through the audio device drivers. The available configurable back panel audio ports are shown in Figure 4.

Item Description

A Line in B Line out C Mic in

Figure 4. Back Panel Audio Connectors



NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

For information about Refer to

The location of the front panel audio header Figure 11, page 43 The signal names of the front panel audio header Table 12, page 45 The back panel audio connectors Section Error! Reference source

not found., page Error! Bookmark not defined.

1.10 LAN Subsystem

The Intel GbE LAN subsystem consists of the following:

• Intel 82567L Gigabit Ethernet Controller (10/100/1000 Mbits/sec)

• Intel 82801IJR (ICH10R)

• RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interface between ICH10R and the LAN controller

• Conventional PCI bus power management ⎯ ACPI technology support ⎯ LAN wake capabilities

• LAN subsystem software

For information about Refer to

LAN software and drivers http://downloadcenter.intel.com

Product Description

1.10.1 Intel

The Intel 82567L Gigabit Ethernet Controller support the following features:

• PCI Express link

• 10/100/1000 IEEE 802.3 compliant

• Compliant to IEEE 802.3x flow control support

• 802.1p and 802.1q

• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

• Transmit TCP segmentation

• Full device driver compatibility

• PCI Express power management support

82567L Gigabit Ethernet Controller

Intel Desktop Board DX58OG Technical Product Specification

1.10.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN software and drivers http://downloadcenter.intel.com

1.10.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).

Item Description

A Link LED (Green) B Data Rate LED (Green/Yellow)

Figure 5. LAN Connector LED Locations

Table 6 describes the LED states when the board is powered up and the LAN subsystem is operating.

Table 6. LAN Connector LED States

LED LED Color LED State Condition

Off LAN link is not established.

Link Green

Data Rate Green/Yellow

On LAN link is established. Blinking LAN activity is occurring Off 10 Mbits/sec data rate is selected. Green 100 Mbits/sec data rate is selected. Yellow 1000 Mbits/sec data rate is selected.

Product Description

1.11 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:

• Fan monitoring and control

• Thermal and voltage monitoring

• Chassis intrusion detection

1.11.1 Hardware Monitoring and Fan Control

The features of the hardware monitoring and fan control include:

• Fan speed control controllers and sensors provided by the Hardware Monitoring and Fan Control ASIC

• Thermal sensors in the processor, 82X58 IOH, and 82801IJR ICH10R

• Power supply monitoring of five voltages (+12 V, +5 V, +3.3 V, V_SM and +VCCP)

to detect levels above or below acceptable values

• Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed

1.11.2 Fan Monitoring

Fan monitoring can be implemented using Intel® Desktop Control Center or third-party software.

For information about Refer to

The functions of the fan headers Section 1.12.2.2, page 34

1.11.3 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position.

For information about Refer to

The location of the chassis intrusion header Figure 11, page 43

Intel Desktop Board DX58OG Technical Product Specification

1.11.4 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.

Item Description

A Rear chassis fan header B Thermal diode, located on the IOH die C Processor fan header D Thermal diode, located on processor die E Front chassis fan header F Thermal diode, located on the ICH10R die G Auxiliary chassis fan header

Figure 6. Thermal Sensors and Fan Headers

Product Description

1.12 Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and Power Interface (ACPI)

• Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯ Wake from USB ⎯ Power Management Event signal (PME#) wake-up support ⎯ PCI Express WAKE# signal support ⎯ Wake from Consumer IR

1.12.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include:

• Plug and Play (including bus and device enumeration)

• Power management control of individual devices, add-in boards (some add-in

boards may require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state

• A Soft-off feature that enables the operating system to power-off the computer

• Support for multiple wake-up events (see Table 9 on page 32)

• Support for a front panel power and sleep mode switch

Intel Desktop Board DX58OG Technical Product Specification

Table 7 lists the system states based on how long the power switch is pressed, dependi

ng on how ACPI is configured with an ACPI-aware operating system.

Table 7. Effects of Pressing the Power Switch

If the system is in this state…

Off (ACPI G2/G5 – Soft off)

On (ACPI G0 – working state)

Sleep (ACPI G1 – sleeping state)

…and the power switch is pressed for

Less than four seconds Power-on

Less than four seconds Soft-off/Standby

More than six seconds Fail safe power-off

Less than four seconds Wake-up

More than six seconds Power-off

…the system enters this state

(ACPI G0 – working state)

(ACPI G1 – sleeping state)

(ACPI G2/G5 – Soft off)

(ACPI G0 – working state)

(ACPI G2/G5 – Soft off)

1.12.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Product Description

Table 8 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 8. Power States and Targeted System Power

Global States Sleeping States

G0 – working state

G1 – sleeping state

G2/S5 S5 – Soft off.

G3 – mechanical off

AC power is disconnected from the computer.

Notes:

1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis’ power supply.

2. Dependent on the standby power consumption of wake-up devices used in the system.

S0 – working C0 – working D0 – working

S1 – Processor stopped

S3 – Suspend to RAM. Context saved to RAM.

S4 – Suspend to disk. Context saved to disk.

Context not saved. Cold boot is required.

No power to the system.

Processor States

C1 – stop grant

No power D3 – no power

No power D3 – no power for

Device States

state. D1, D2, D3 –

device specification specific.

except for wake-up logic.

wake-up logic, except when provided by battery or external source.

Targeted System Power

Full power > 30 W

5 W < power < 52.5 W

Power < 5 W

No power to the system. Service can be performed safely.

(Note 1)

(Note 2)

Intel Desktop Board DX58OG Technical Product Specification

(

)

(

)

1.12.1.2 Wake-up Devices and Events

Table 9 lists the devices or specific events that can wake the computer from specific states.

Table 9. Wake-up Devices and Events

These devices/events can wake up the computer… …from this state

LAN S1, S3, S4, S5 PME# signal S1, S3, S4, S5 Power switch S1, S3, S4, S5 RTC alarm S1, S3, S4, S5 USB S1, S3 WAKE# S1, S3, S4, S5 Consumer IR S1, S3 (S4 and S5)

Note 1: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option

Note 2: Wake from S4 and S5 is optional by the specification.



to Power On will enable a wake-up event from LAN in the S5 state.

NOTE

Note 1

(Note 2)

The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.

Product Description

1.12.2 Hardware Support

CAUTION

Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.

The board provides several power management hardware features, including:

• Power connector

• Fan headers

• LAN wake capabilities

• Instantly Available PC technology

• Wake from USB

• PME# signal wake-up support

• WAKE# signal wake-up support

• Wake from Consumer IR

LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.



NOTE

The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.

1.12.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages.

When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu.

For information about Refer to

The location of the main power connector Figure 11, page 43 The signal names of the main power connector Table 20, page 49

Intel Desktop Board DX58OG Technical Product Specification

1.12.2.2 Fan Headers

The function/operation of the fan headers is as follows:

• The fans are on when the board is in the S0 or S1 state.

• The fans are off when the board is off or in the S3, S4, or S5 state.

• Each fan header is wired to a fan tachometer input of the hardware monitoring and

fan control ASIC

• All fan headers support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed

• All fan headers have a +12 V DC connection

• 4-pin fan headers are controlled by Pulse Width Modulation

• 3-pin fan headers (front and rear) are modulated by voltage control

For information about Refer to

The location of the fan headers Figure 11, page 43 The location of the fan headers and sensors for thermal monitoring Figure 6, page 28 The signal names of the fan headers Section 0, page 42

1.12.2.3 LAN Wake Capabilities

CAUTION

For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply.

LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. Depending on the LAN implementation, the board supports LAN wake capabilities with ACPI in the following ways:

• The PCI Express WAKE# signal

• The PCI bus PME# signal for PCI 2.3 compliant LAN designs ⎯ By Ping ⎯ Magic Packet

• The onboard LAN subsystem

Product Description

1.12.2.4 Instantly Available PC Technology

CAUTION

For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply.

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 9 on page 32 lists the devices and events that can wake the computer from the S3 state.

The board supports the PC boards that also support this specification can participate in power management and can be used to wake the computer.

The use of Instantly Available PC technology requires operating system support and PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers.

I Bus Power Management Interface Specification. Add-in

1.12.2.5 Wake from USB

USB bus activity wakes the computer from ACPI S1 or S3 states.



NOTE

Wake from USB requires the use of a USB peripheral that supports Wake from USB.

1.12.2.6 PME# Signal Wake-up Support

When the PME# signal on the Conventional PCI bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state (with Wake on PME enabled in the BIOS).

1.12.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S1, S3, S4, or S5 state.

1.12.2.8 Wake from Consumer IR

CIR activity wakes the computer from an ACPI S3, S4, or S5 state.

Intel Desktop Board DX58OG Technical Product Specification

1.12.2.9 Status LED Indicators

The status LEDs display various status indicators as defined below. Figure 7 shows the location of the LED indicators.

• The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off.

• The hard drive activity LED indicates activity of hard drives connected to the IOH and any external discrete controllers on the board.

• The CPU Hot and VR Hot LEDs are controlled by external circuitry.

• The Watch Dog Fire/Back to BIOS LED indicates when the watch dog timer fires to

reset the board. The BIOS will program this LED to flash as early as possible in the post. If the Back to BIOS button has been pressed, the BIOS will program this LED to be constantly on.

• The six initialization LEDs will flash when initialization activity starts and stay on when initialization is complete.

• The operating system LED changes to “constant on” just before the BIOS hands off control to the operating system (int 19).

CAUTION

If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.

Product Description

Item Description

A Operating system start B Hard drive initialization C USB initialization D Option ROM initialization E Video initialization F Memory initialization G CPU initialization H Hard drive activity I VR Hot J CPU Hot K Watch Dog Fire/Back to BIOS L +5 V standby power indicator

Figure 7. Locations of Onboard LED Indicators

Intel Desktop Board DX58OG Technical Product Specification

1.13 Onboard Power and Reset Buttons

The lighted onboard power button has the same behavior as the front panel power button connected via the front panel header. The onboard power button does NOT remove standby power. This button is intended for use at integration facilities for testing purposes. The power button on the front panel is recommended for all other instances of turning the computer on or off. To turn the computer off using the onboard power button, keep the button pressed down for three seconds.

The lighted onboard reset button can be used to reset the board. This button duplicates the function of the front panel reset button. Figure 8 shows the location of the onboard power and reset buttons.

Figure 8. Location of the Power and Reset Buttons

CAUTION

Electrostatic discharge (ESD) can damage components. The onboard power button should be used only at an ESD workstation using an antistatic wrist strap and a conductive foam pad. If such a station is not available, some ESD protection can be provided by wearing an antistatic wrist strap and attaching it to a metal part of the computer chassis.

Item Description

A Onboard power B Onboard reset

2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory

The board utilizes 24 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 24 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following:

• BIOS/SPI Flash device (16 Mbit)

• Local APIC (19 MB)

• Direct Media Interface (40 MB)

• Front side bus interrupts (17 MB)

• PCI Express configuration space (256 MB)

• IOH base address registers PCI Express ports (up to 256 MB)

• Memory-mapped I/O that is dynamically allocated for Conventional PCI and PCI

Express add-in cards (256 MB)

The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just above the 4 GB boundary. Figure 9 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

Intel Desktop Board DX58OG Technical Product Specification

Figure 9. Detailed System Memory Address Map

2.1.2 Memory Map

Table 10 lists the system memory map.

Table 10. System Memory Map

Address Range (decimal) Address Range (hex) Size Description

1024 K - 16777216 K 100000 - 600000000 16382 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS

640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS 639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by

512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory 0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory

Technical Reference

memory (open to the Conventional PCI bus). Dependent on video adapter used.

memory manager software)

2.2 Connectors and Headers

CAUTION

Only the following connectors and headers have overcurrent protection: back panel and front panel USB, as well as IEEE 1394a.

The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves.

Furthermore, improper connection of USB or 1394 header single wire connectors may eventually overload the overcurrent protection and cause damage to the board.

This section describes the board’s connectors. The connectors can be divided into these groups:

• Back panel I/O connectors

• Component-side I/O connectors and headers (see page 43)

Intel Desktop Board DX58OG Technical Product Specification

2.2.1 Back Panel Connectors

Figure 10 shows the location of the back panel connectors for the board.

Item Description

A Back to BIOS button B USB ports C LAN D USB ports E IEEE 1394a connector F USB ports G USB ports H Line in I Line out/front speakers Mic in/side

surround

J Mic in/side surround

Figure 10. Back Panel Connectors



NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

Technical Reference

2.2.2 Component-side Connectors and Headers

Figure 11 shows the locations of the component-side connectors and headers.

Figure 11. Component-side Connectors and Headers

Intel Desktop Board DX58OG Technical Product Specification

Table 11 lists the component-side connectors and headers identified in Figure 11.

Table 11. Component-side Connectors and Headers Shown in Figure 11

Item/callout from Figure 11 Descript

A Front panel audio header B PCI Express x1 connector C PCI Express x1 connector D Conventional PCI bus add-in card connector E PCI Express x16 bus add-in card connector (Secondary) F PCI Express x1 bus add-in card connector G PCI Express x16 bus add-in card connector (Primary) H Rear chassis fan header I Processor fan header J Processor core power connector (2 x 4) K Main power connector (2 x 12) L Front chassis fan header M SATA connectors (8) N Chassis intrusion header O Front panel USB header P Front panel USB header Q Front panel USB header R Consumer IR receiver (input) header S Consumer IR emitter (output) header T Front panel header U Auxiliary front panel power LED header V IEEE 1394a front panel header W Auxiliary chassis fan header

ion

Technical Reference

2.2.2.1 Signal Tables for the Connectors and Headers

Table 12. Front Panel Audio Header

Pin Signal Name Pin Signal Name

1 [Port 2] Left channel 2 Ground 3 [Port 2] Right channel 4 PRESENCE# (Dongle present) 5 [Port 1] Right channel 6 [Port 1] SENSE_RETURN 7 SENSE_SEND (Jack detection) 8 Key (no pin) 9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN

Table 13. Serial ATA Connectors

Pin Signal Name

1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground

Table 14. Front Panel IEEE 1394a Header

Pin Signal Name Pin Signal Name

1 Data A (positive) 2 Data A (negative) 3 Ground 4 Ground 5 Data B (positive) 6 Data B (negative) 7 +12V_DC 8 +12 V_DC 9 Key (no pin) 10 Ground

Note: The +12 V DC power on the IEEE 1394a header is fused.

Intel Desktop Board DX58OG Technical Product Specification

Table 15. Chassis Intrusion Header

Pin Signal Name

1 Intruder 2 Ground

Table 16. Front and Rear Chassis (3-Pin) Fan Headers

Pin Signal Name

1 Control 2 +12 V 3 Tach

Note: These fan headers use voltage variance control for fan speed.

(Note)

Table 17. Processor and Rear Chassis 2 (4-Pin) Fan Headers

Pin Signal Name

1 Ground 2 +12 V 3 FAN_TACH 4 FAN_CONTROL

Note: These fan headers use Pulse Width Modulation control for fan speed.

(Note)

Table 20. Back Panel CIR Emitter (Output) Header

Pin Signal Name

1 Emitter out 1 2 Emitter out 2 3 Ground 4 Key (no pin) 5 Jack detect 1 6 Jack detect 2

Table 21. Front Panel CIR Receiver (Input) Header

Pin Signal Name

1 Ground 2 LED 3 NC 4 Learn-in 5 5 V standby 6 VCC 7 Key (no pin) 8 CIR Input

Technical Reference

2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:

• PCI Express 2.0 x16: two PCI Express 2.0 x16 connectors supporting simultaneous transfer speeds up to 8 GB/sec of peak bandwidth per direction and up to 16 GB/sec concurrent bandwidth.

• PCI Express 1.1 x1: three PCI Express 1.1 x1 connectors. The x1 interface supports simultaneous transfer speeds up to 250 MB/sec of peak bandwidth per direction and up to 2 GB/sec concurrent bandwidth.

• Conventional PCI (rev 2.3 compliant) bus: one Conventional PCI bus add-in card connector. The SMBus is routed to the Conventional PCI bus connector. Conventional PCI bus add-in cards with SMBus support can access sensor data and other information residing on the board.

Note the following considerations for the Conventional PCI bus connector:

• The Conventional PCI bus connector is bus master capable.

• SMBus signals are routed to the Conventional PCI bus connector. This enables

Conventional PCI bus add-in boards with SMBus support to access sensor data on the board. The specific SMBus signals are as follows:

⎯ The SMBus clock line is connected to pin A40. ⎯ The SMBus data line is connected to pin A41.

2.2.2.3 Auxiliary Front Panel Power/Sleep LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header.

Table 18. Auxiliary Front Panel Power/Sleep LED Header

Pin Signal Name In/Out Description

1 HDR_BLNK_GRN Out Front panel green LED 2 Not connected 3 HDR_BLNK_YEL Out Front panel yellow LED

Intel Desktop Board DX58OG Technical Product Specification

2.2.2.4 Power Supply Connectors

The board has the following power supply connectors:

• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable on the rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24 unconnected.

• Processor core power – a 2 x 4 connector. This connector provides power directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting.

Table 19. Processor Core Power Connector

Pin Signal Name Pin Signal Name

1 Ground 2 +12 V 3 Ground 4 +12 V 5 Ground 6 +12 V 7 Ground 8 +12 V

Technical Reference

Table 20. Main Power Connector

Pin Signal Name Pin Signal Name

1 +3.3 V 13 +3.3 V 2 +3.3 V 14 -12 V 3 Ground 15 Ground 4 +5 V 16 PS-ON# (power supply remote on/off) 5 Ground 17 Ground 6 +5 V 18 Ground 7 Ground 19 Ground 8 PWRGD (Power Good) 20 No connect 9 +5 V (Standby) 21 +5 V 10 +12 V 22 +5 V 11 +12 V 12 2 x 12 connector detect

Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

(Note)

23 +5 V

(Note)

24 Ground

(Note)

Table 21. Auxiliary PCI Express Graphics Power Connector

Pin Signal Name

1 +12 V 2 1 x 4 connector detect 3 Ground 4 +5 V

For information about Refer to

Power supply considerations Section 2.5.1 on page 56

Intel Desktop Board DX58OG Technical Product Specification

2.2.2.5 Front Panel Header

This section describes the functions of the front panel header. Table 22 lists the signal names of the front panel header. Figure 12 is a connection diagram for the front panel header.

Table 22. Front Panel Header

Pin Signal

Hard Drive Activity LED Power LED 1 HD_PWR Out Hard disk LED

3 HDA# Out Hard disk active

Reset Switch On/Off Switch 5 Ground Ground 6 FPBUT_IN In Power switch 7 FP_RESET# In Reset switch 8 Ground Ground Power Not Connected 9 +5 V Power 10 N/C Not connected

In/ Out Description

pull-up to +5 V

LED

Pin Signal

2 HDR_BLNK_GRN Out Front panel green

4 HDR_BLNK_YEL Out Front panel yellow

In/ Out Description

LED

Figure 12. Connection Diagram for Front Panel Header

2.2.2.5.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the following:

• A Serial ATA hard drive or optical drive connected to an onboard Serial ATA connector

• A Parallel ATA IDE hard drive or optical drive connected to an onboard Parallel ATA IDE connector

Technical Reference

2.2.2.5.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST.

2.2.2.5.3 Power/Sleep LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 23 shows the possible states for a one-color LED. Table 24 shows the possible states for a two-color LED.

Table 23. States for a One-Color Power LED

LED State Description

Off Power off/sleeping Steady Green Running

Table 24. States for a Two-Color Power LED

LED State Description

Off Power off Steady Green Running Steady Yellow Sleeping

 NOTE

The colors listed in Table 23 and Table 24 are suggested colors only. Actual LED colors are chassis-specific.

2.2.2.5.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal.

Intel Desktop Board DX58OG Technical Product Specification

2.2.2.6 Front Panel USB Headers

Figure 13 is a connection diagram for the front panel USB headers.

INTEGRATOR’S NOTES

• The +5 V DC power on the USB headers is fused.

• Use only a front panel USB connector that conforms to the USB 2.0 specification

for high-speed USB devices.

Figure 13. Connection Diagram for Front Panel USB Headers

Technical Reference

2.3 Jumper Block

CAUTION

Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.

Figure 14 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup program’s mode. Table 25 describes the jumper settings for the three modes: normal and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match.

, configure, and recovery. When the jumper is set to configure mode

Figure 14. Location of the Jumper Block

Intel Desktop Board DX58OG Technical Product Specification

Table 25. BIOS Setup Configuration Jumper Settings

Function/Mode

Normal 1-2 The BIOS uses current configuration information and passwords for

Configure 2-3 After the POST runs, Setup runs automatically. The maintenance

Recovery None The BIOS attempts to recover the BIOS configuration. A recovery CD

Jumper Setting Configuration

booting.

menu is displayed.

Note that this Configure mode is the only way to clear the BIOS/CMOS settings. Press F9 (restore defaults) while in Configure mode to restore the BIOS/CMOS settings to their default values.

or flash drive is required.

Technical Reference

2.4 Mechanical Considerations

2.4.1 Form Factor

The board is designed to fit into an ATX-form-factor chassis. Figure 15 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by

243.84 millimeters]. Location of the I/O connectors and mounting holes are in

compliance with the ATX specification.

Figure 15. Board Dimensions

Intel Desktop Board DX58OG Technical Product Specification

2.5 Electrical Considerations

2.5.1 Power Supply Considerations

CAUTION

The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options.

Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the indicated parameters of the ATX form factor

specification.

• The potential relation between 3.3 VDC and +5 VDC power rails

• The current capability of the +5 VSB line

• All timing parameters

• All voltage tolerances

For example, for a system consisting of a supported 130 W processor (see section 1.4 on page 16 for a list of supported processors), 1 GB DDR3 RAM, one high end video card, one hard disk drive, one optical drive, and all board peripherals enabled, the minimum recommended power supply is 460 W. Table 26 lists the recommended power supply current values.

Table 26. Recommended Power Supply Current Values

Output Voltage 3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB Current 22 A 20 A 16 A 16 A 0.3 A 1.5 A

For information about Refer to

Selecting an appropriate power supply http://support.intel.com/support/motherboards/desktop/sb

/CS-026472.htm

Technical Reference

2.5.2 Fan Header Current Capability

CAUTION

The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation.

Table 27 lists the current capability of the fan headers.

Table 27. Fan Header Current Capability

Fan Header Maximum Available Current

Processor fan 2.0 A Front chassis fan 1.5 A Rear chassis fan 1.5 A Auxiliary chassis fan 2.0 A

2.5.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of current for each add-in board from the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board (all six expansion slots filled) must not exceed the system’s power supply +5 V maximum current or 14 A in total.

2.6 Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Use a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area.

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website:

http://developer.intel.com/design/motherbd/cooling.htm

All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.

Intel Desktop Board DX58OG Technical Product Specification

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 16) can reach a temperature of up to 85 an open chassis.

Figure 16 shows the locations of the localized high temperature zones.

C in

Figure 16. Localized High Temperature Zones

Item Description

A Processor voltage regulator area B Processor C Intel

82801IJR ICH10R

Technical Reference

Table 28 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.

Table 28. Thermal Considerations for Components

Component Maximum Case Temperature

Processor For processor case temperature, see processor datasheets and

processor specification updates

Intel 82X58 IOH 105 oC (under bias) Intel 82801IJR (ICH10R) 105 oC (under bias)

For information about Refer to

Processor datasheets and specification updates Section 1.3, page 16

Intel Desktop Board DX58OG Technical Product Specification

2.7 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements.

The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 82,351.2845 hours.

2.8 Environmental

Table 29 lists the environmental specifications for the board.

Table 29. Environmental Specifications

Parameter Specification Temperature

Non-Operating Operating Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/second² Packaged Half sine 2 millisecond Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 Vibration Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz 20 Hz to 500 Hz: 0.02 g² Hz (flat) Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat) 40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

-40 °C to +70 °C 0 °C to +55 °C

3 Overview of BIOS Features

3.1 Introduction

The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support.

The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as

When the BIOS Setup configuration jumper is set to configure mode and the computer is powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two match.

The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below.

Maintenance Main Advanced Performance Security Power Boot Exit

SOX5810J.86A.



NOTE

The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on page 53 shows how to put the board in configure mode.

Intel Desktop Board DX58OG Technical Product Specification

Table 30 lists the BIOS Setup program menu features.

Table 30. BIOS Setup Program Menu Bar

Maintenance Main Advanced Performance Security Power Boot Exit

Clears passwords and displays processor information

Displays processor and memory configuration

Configures advanced features available through the chipset

Configures Memory, Bus and Processor overrides

Sets passwords and security features

Configures power management features and power supply controls

Selects boot options

Saves or discards changes to Setup program options

Table 31 lists the function keys available for menu screens.

Table 31. BIOS Setup Program Function Keys

BIOS Setup Program Function Key

<←> or <→> <↑> or <↓> <Tab> Selects a field (Not implemented) <Enter> Executes command or selects the submenu <F9> Load the default configuration values for the current menu <F10> Save the current values and exits the BIOS Setup program <Esc> Exits the menu

Description

Selects a different menu screen (Moves the cursor left or right) Selects an item (Moves the cursor up or down)

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 16 Mbit (2048 KB) flash memory device.

3.3 Resource Configuration

3.3.1 PCI Autoconfiguration

The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having to configure the system. When a user turns on the system after adding a PCI card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card.

Overview of BIOS Features

3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network.

The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:

• BIOS data, such as the BIOS revision level

• Fixed-system data, such as peripherals, serial numbers, and asset tags

• Resource data, such as memory size, cache size, and processor speed

• Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page.

3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu.

4. POST completes.

5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.)

6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used.

7. Additional USB legacy feature options can be access by using Intel Integrator Toolkit.

Intel Desktop Board DX58OG Technical Product Specification

To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installation instructions.

3.6 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:

• Intel

Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.

Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web.

Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM.



NOTE

Review the instructions distributed with the upgrade utility before attempting a BIOS update.

For information about Refer to

BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb

/CS-022312.htm.

3.6.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the Intel web site for support.

Overview of BIOS Features

3.6.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen.



NOTE

If you add a custom splash screen, it will share space with the Intel branded logo.

For information about

Intel® Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/ Additional Intel® software tools http://developer.intel.com/design/motherbd/software.htm

Refer to

3.7 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 32 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable.

Table 32. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?

CD-ROM drive connected to the Serial ATA interface Yes USB removable drive (a USB Flash Drive, for example) Yes USB diskette drive (with a 1.44 MB diskette) No USB hard disk drive No

For information about Refer to

BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/

cs-023360.htm

Intel Desktop Board DX58OG Technical Product Specification

3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.

3.8.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the optical drive is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the optical drive, the system will attempt to boot from the next defined drive.

3.8.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.

3.8.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present:

• Video adapter

• Keyboard

• Mouse

3.8.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices (as set in the BIOS setup program’s Boot Device Priority Submenu). Table 33 lists the boot device menu options.

Table 33. Boot Device Menu Options

Boot Device Menu Function Keys Description

<↑> or <↓> <Enter> Exits the menu, saves changes, and boots from the selected

<Esc> Exits the menu without saving changes

Selects a default boot device

device

Overview of BIOS Features

3.9 Adjusting Boot Speed

These factors affect system boot speed:

• Selecting and configuring peripherals properly

• Optimized BIOS boot parameters

3.9.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:

• Choose a hard drive with parameters such as “power-up to data ready” in less than

eight seconds that minimizes hard drive startup delays.

• Select a CD-ROM drive with a fast initialization rate. This rate can influence POST

execution time.

• Eliminate unnecessary add-in adapter features, such as logo displays, screen

repaints, or mode changes in POST. These features may add time to the boot process.

• Try different monitors. Some monitors initialize and communicate with the BIOS

more quickly, which enables the system to boot more quickly.

3.9.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.

• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the

POST does not first seek a diskette drive, which saves about one second from the POST execution time.

• In the Peripheral Configuration submenu, disable the LAN device if it will not be

used. This can reduce up to four seconds of option ROM boot time.



NOTE

It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen.

This boot time may be so fast that some drives might be not be initialized at all. If this condition should occur, it is possible to introduce a programmable delay ranging from zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup program).

Intel Desktop Board DX58OG Technical Product Specification

3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions:

• The supervisor password gives unrestricted access to view and change all the

Setup options in the BIOS Setup program. This is the supervisor mode.

• The user password gives restricted access to view and change Setup options in the

BIOS Setup program. This is the user mode.

• If only the supervisor password is set, pressing the <Enter> key at the password

prompt of the BIOS Setup program allows the user restricted access to Setup.

• If both the supervisor and user passwords are set, users can enter either the

supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered.

• Setting the user password restricts who can boot the computer. The password

prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer.

• For enhanced security, use different passwords for the supervisor and user

passwords.

• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to

16 characters in length.

Table 34 shows the effects of setting the supervisor password and user password. T

his table is for reference only and is not displayed on the screen.

Table 34. Supervisor and User Password Functions

Password Set

Neither Can change all

Supervisor only

User only N/A Can change all

Supervisor and user set

Note: If no password is set, any user can change all Setup options.

Supervisor Mode

options Can change all

options

Can change all options

(Note)

User Mode

Can change all options

Can change a limited number of options

options Can change a

limited number of options

(Note)

Setup Options

None None None

Supervisor Password Supervisor None

Enter Password Clear User Password

Supervisor Password Enter Password

Password to Enter Setup

User User

Supervisor or user

Password During Boot

Supervisor or user

Overview of BIOS Features

3.11 BIOS Performance Features

The BIOS includes the following options to provide custom performance enhancements when using Intel Core i7 and Intel Xeon Processors.

• Processor frequency adjustment

• Processor voltage adjustment

• Memory clock adjustments

• Memory voltage adjustments

• QPI Bus voltage adjustment

• VTT voltage adjustment

Intel Desktop Board DX58OG Technical Product Specification

4 Error Messages and Beep Codes

4.1 Speaker

The board-mounted speaker provides audible error code (beep code) information during POST.

For information about Refer to

The location of the onboard speaker Figure 1, page 13

4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to beep an error message describing the problem (see Table 35).

Table 35. BIOS Beep Codes

Type Pattern Frequency

F2 Setup/F10 Boot Menu Prompt

BIOS update in progress None Video error On-off (1.0 second each) two times, then

Memory error On-off (1.0 second each) three times, then

Thermal trip warning Alternate high and low beeps (1.0 second each)

One 0.5 second beep when BIOS is ready to accept keyboard input

2.5-second pause (off), entire pattern repeats (beeps and pause) once and the BIOS will continue to boot.

2.5-second pause (off), entire pattern repeats (beeps and pause) until the system is powered off.

for eight beeps, followed by system shut down.

932 Hz

932 Hz When no VGA option ROM is found.

932 Hz

High beep 2000 Hz Low beep 1500 Hz

Intel Desktop Board DX58OG Technical Product Specification

4.3 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 36).

Table 36. Front-panel Power LED Blink Codes

Type Pattern Note

F2 Setup/F10 Boot Menu Prompt

BIOS update in progress Off when the update begins, then on for

Video error On-off (1.0 second each) two times, then

Memory error On-off (1.0 second each) three times, then

Thermal trip warning Each beep will be accompanied by the following

None

0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete.

When no VGA option ROM is

2.5-second pause (off), entire pattern repeats (blink and pause) until the system is powered off.

2.5-second pause (off), entire pattern repeats (blinks and pause) until the system is powered off.

blink pattern: .25 seconds on, .25 seconds off, .25 seconds on, .25 seconds off. This will result in a total of 16 blinks.

found.

4.4 BIOS Error Messages

Table 37 lists the error messages and provides a brief description of each.

Table 37. BIOS Error Messages

Error Message Explanation

CMOS Battery Low The battery may be losing power. Replace the battery soon. CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been

corrupted. Run Setup to reset values.

Memory Size Decreased Memory size has decreased since the last boot. If no memory

was removed, then memory may be bad.

No Boot Device Available System did not find a device to boot.

Error Messages and Beep Codes

4.5 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred.

Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The POST card can decode the port and display the contents on a medium such as a seven-segment display.



NOTE

The POST card must be installed in PCI bus connector 1.

The following tables provide information about the POST codes generated by the BIOS:

• Table 38 lists the Port 80h POST code ranges

• Table 39 lists the Port 80h POST codes themselves

• Table 40 lists the Port 80h POST sequence



NOTE

In the tables listed above, all POST codes and range values are listed in hexadecimal.

Table 38. Port 80h POST Code Ranges

Range Category/Subsystem

00 – 0F Debug codes: Can be used by any PEIM/driver for debug. 10 – 1F Host Processors: 1F is an unrecoverable CPU error. 20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected. 30 – 3F Recovery: 3F indicated recovery failure. 40 – 4F Reserved for future use. 50 – 5F I/O Busses: PCI, USB, ATA, etc. 5F is an unrecoverable error. Start with PCI. 60 – 6F Reserved for future use (for new busses). 70 – 7F Output Devices: All output consoles. 7F is an unrecoverable error. 80 – 8F Reserved for future use (new output console codes). 90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error. A0 – AF Reserved for future use (new input console codes). B0 – BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error. C0 – CF Reserved for future use. D0 – DF Boot device selection. E0 – FF E0 – EE: Miscellaneous codes. See Table 39.

EF: boot/S3 resume failure. F0 – FF: FF processor exception.

Intel Desktop Board DX58OG Technical Product Specification

Table 39. Port 80h POST Codes

POST Code Description of POST Operation

10 Power-on initialization of the host processor (Boot Strap Processor) 11 Host processor cache initialization (including APs) 12 Starting Application processor initialization 13 SMM initialization

21 Initializing a chipset component

22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 24 Programming timing parameters in the memory controller and the DIMMs 25 Configuring memory 26 Optimizing memory settings 27 Initializing memory, such as ECC init 29 Memory testing completed

50 Enumerating PCI busses 51 Allocating resources to PCI bus 52 Hot Plug PCI controller initialization 53 – 57 Reserved for PCI Bus

58 Resetting USB bus 59 Reserved for USB

5A Resetting PATA/SATA bus and all devices 5B Reserved for ATA

5C Resetting SMBus 5D Reserved for SMBus

70 Resetting the VGA controller 71 Disabling the VGA controller 72 Enabling the VGA controller

78 Resetting the console controller 79 Disabling the console controller 7A Enabling the console controller

Host Processor

Chipset

Memory

PCI Bus

USB

ATA/ATAPI/SATA

SMBus

Local Console

Remote Console

continued

Error Messages and Beep Codes

Table 39. Port 80h POST Codes (continued)

POST Code Description of POST Operation

90 Resetting keyboard 91 Disabling keyboard 92 Detecting presence of keyboard 93 Enabling the keyboard 94 Clearing keyboard input buffer 95 Instructing keyboard controller to run Self Test (PS/2 only)

98 Resetting mouse 99 Disabling mouse 9A Detecting presence of mouse 9B Enabling mouse

B0 Resetting fixed media B1 Disabling fixed media B2 Detecting presence of a fixed media (IDE hard drive detection etc.) B3 Enabling/configuring a fixed media

B8 Resetting removable media B9 Disabling removable media BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.) BC Enabling/configuring a removable media

Dy Trying boot selection y (y=0 to 15)

E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN

EFI_SW_PEI_PC_HANDOFF_TO_NEXT) E2 Permanent memory found E1, E3 Reserved for PEI/PEIMs

E4 Entered DXE phase E5 Started dispatching drivers E6 Started connecting drivers

Keyboard (USB)

Mouse (USB)

Fixed Media

Removable Media

BDS

PEI Core

DXE Core

continued

Intel Desktop Board DX58OG Technical Product Specification

Table 39. Port 80h POST Codes (continued)

POST Code Description of POST Operation

DXE Drivers

E7 Waiting for user input E8 Checking password E9 Entering BIOS setup EB Calling Legacy Option ROMs

Runtime Phase/EFI OS Boot

F4 Entering Sleep state F5 Exiting Sleep state F8 EFI boot service ExitBootServices ( ) has been called F9 EFI runtime service SetVirtualAddressMap ( ) has been called FA EFI runtime service ResetSystem ( ) has been called

PEIMs/Recovery

30 Crisis Recovery has initiated per user request 31 Crisis Recovery has initiated by software (corrupt flash) 34 Loading recovery capsule 35 Handing off control to the recovery capsule 3F Unable to recover

Table 40. Typical Port 80h POST Sequence

POST Code Description

21 Initializing a chipset component 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 25 Configuring memory 28 Testing memory 34 Loading recovery capsule E4 Entered DXE phase 12 Starting application processor initialization 13 SMM initialization 50 Enumerating PCI busses 51 Allocating resourced to PCI bus 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 95 Keyboard Self Test EB Calling Video BIOS 58 Resetting USB bus 5A Resetting PATA/SATA bus and all devices 92 Detecting the presence of the keyboard 90 Resetting keyboard 94 Clearing keyboard input buffer 5A Resetting PATA/SATA bus and all devices 28 Testing memory 90 Resetting keyboard 94 Clearing keyboard input buffer E7 Waiting for user input 01 INT 19 00 Ready to boot

Error Messages and Beep Codes

Intel Desktop Board DX58OG Technical Product Specification

5 Regulatory Compliance and Battery

Disposal Information

5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel Desktop Board DX58OG:

• Safety standards

• European Union Declaration of Conformity statement

• Product Ecology statements

• Electromagnetic Compatibility (EMC) standards

• Product certification markings

5.1.1 Safety Standards

The Intel Desktop Board DX58OG complies with the safety standards stated in Table 41 when correctly installed in a compatible host system.

Table 41. Safety Standards

Standard Title

CSA/UL 60950-1 Information Technology Equipment – Safety - Part 1: General

Requirements (USA and Canada)

EN 60950-1 Information Technology Equipment – Safety - Part 1: General

Requirements (European Union)

IEC 60950-1 Information Technology Equipment – Safety - Part 1: General

Requirements (International)

Intel Desktop Board DX58OG Technical Product Specification

5.1.2 European Union Declaration of Conformity

Statement

We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DX58OG is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).

The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC.

Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC, 2006/95/EC a 2002/95/EC.

Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC, 2006/95/EC & 2002/95/EC.

Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nõuetele.

Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC määräyksiä.

Français Ce produit est conforme aux exigences de la Directive Européenne 2004/108/EC, 2006/95/EC & 2002/95/EC.

Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC.

Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών 2004/108/EC, 2006/95/EC και 2002/95/EC.

Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai Irányelv előírásainak.

Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer 2004/108/EC, 2006/95/EC, & 2002/95/EC.

Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC, 2006/95/EC & 2002/95/EC.

Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un 2002/95/EC noteikumiem.

Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir 2002/95/EC nuostatas.

Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC, 2006/95/EC u 2002/95/EC.

Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC, 2006/95/EC & 2002/95/EC.

Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC, 206/95/EC i 2002/95/EC.

Regulatory Compliance and Battery Disposal Information

Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC.

Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC.

Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC.

Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC.

Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC yönergelerine uyar.

5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns and regulations.

5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly.

5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to selected locations for proper recycling.

Please consult the http://www.intel.com/intel/other/ehs/product_ecology details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc.

中文

作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program （英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰当的重复使用处理。

请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。

Deutsch

Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben.

Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der

http://www.intel.com/intel/other/ehs/product_ecology

for the

Intel Desktop Board DX58OG Technical Product Specification

Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha

implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado.

Consulte la http://www.intel.com/intel/other/ehs/product_ecology

para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envío, términos y condiciones, etc.

Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis

en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées.

Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expédition, les conditions générales, etc.

日本語

pour en

インテルでは、環境保護活動の一環として、使い終えたインテルブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクルプログラムを発足させました。

対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in

tel/other/ehs/product_ecology （英語）をご覧ください。

Malay

Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.

Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology

untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb.

Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o

Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada.

Consulte o site http://www.intel.com/intel/other/ehs/product_ecology

(em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc.

Regulatory Compliance and Battery Disposal Information

Russian

В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации.

Пожалуйста, обратитесь на веб-сайт

http://www.intel.com/intel/other/ehs/product_ecology

за информацией об этой

программе, принимаемых продуктах, местах приема, инструкциях об отправке, положениях и условиях и т.д.

Türkçe

Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur.

Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen

http://www.intel.com/intel/other/ehs/product_ecology

Web sayfasına gidin.

5.1.4 EMC Regulations

The Intel Desktop Board DX58OG complies with the EMC regulations stated in Table 42 when correctly installed in a compatible host system.

Table 42. EMC Regulations

Regulation Title

FCC 47 CFR Part 15, Subpart B

ICES-003 Interference-Causing Equipment Standard, Digital Apparatus. (Canada) EN55022 Limits and methods of measurement of Radio Interference Characteristics

EN55024 Information Technology Equipment – Immunity Characteristics Limits and

EN55022 Australian Communications Authority, Standard for Electromagnetic

CISPR 22 Limits and methods of measurement of Radio Disturbance Characteristics of

CISPR 24 Information Technology Equipment – Immunity Characteristics – Limits and

VCCI V-3, V-4 Voluntary Control for Interference by Information Technology Equipment.

KN-22, KN-24 Korean Communications Commission – Framework Act on

CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)

Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio Frequency Devices. (USA)

of Information Technology Equipment. (European Union)

methods of measurement. (European Union)

Compatibility. (Australia and New Zealand)

Information Technology Equipment. (International)

Methods of Measurement. (International)

(Japan)

Telecommunications and Radio Waves Act (South Korea)

Intel Desktop Board DX58OG Technical Product Specification

FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124

1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment to an outlet on a circuit other than the one to which the

receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications to the equipment not expressly approved by Intel

Corporation could void the user’s authority to operate the equipment. Tested to comply with FCC standards for home or office use.

Canadian Department of Communications Compliance Statement

This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications.

Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada.

Regulatory Compliance and Battery Disposal Information

Japan VCCI Statement

Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

Korea Class B Statement

Korea Class B Statement translation: This equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas..

Intel Desktop Board DX58OG Technical Product Specification

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP

Compliance

The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements.

Intel Desktop Board DH55PJ meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply:

• Energy Star v5.0, category D

• EPEAT*

• Korea e-Standby

• European Union Energy-related Products Directive 2009 (ErP)

For information about Refer to

ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/ Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02/

pg02100300.asp

European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s

ustainable-business/sustainable-productpolicy/ecodesign/index_en.htm

Regulatory Compliance and Battery Disposal Information

5.1.6 Regulatory Compliance Marks (Board Level)

Intel Desktop Board DH55PJ has the regulatory compliance marks shown in Table 43.

Table 43. Regulatory Compliance Marks

Description Mark

UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882.

FCC Declaration of Conformity logo mark for Class B equipment.

CE mark. Declaring compliance to the European Union (EU) EMC directive, Low Voltage directive, and RoHS directive.

Australian Communications Authority (ACA) and New Zealand Radio Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code number, N-232.

Japan VCCI (Voluntary Control Council for Interference) mark.

KCC (Korean Communications Commission) EMC certification mark. Includes adjacent KCC certification number: CPU-DX58OG (B).

Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025.

Printed wiring board manufacturer’s recognition mark. Consists of a unique UL recognized manufacturer’s logo, along with a flammability rating (solder side).

China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined to be 10 years.

V-0

Intel Desktop Board DX58OG Technical Product Specification

5.2 Battery Disposal Information

CAUTION

Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.

PRÉCAUTION

Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement.

FORHOLDSREGEL

Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning.

OBS!

Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning.

VIKTIGT!

Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna.

VARO

Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten mukaisesti.

VORSICHT

Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.

AVVERTIMENTO

Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

Regulatory Compliance and Battery Disposal Information

PRECAUCIÓN

Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.

WAARSCHUWING

Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

ATENÇÃO

Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região.

AŚCIAROŽZNAŚĆ

Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

UPOZORNÌNÍ

V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí.

Προσοχή

Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με τους κατά τόπο περιβαλλοντικούς κανονισμούς.

VIGYÁZAT

Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni.

Intel Desktop Board DX58OG Technical Product Specification

AWAS

Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.

OSTRZEŻENIE

Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.

PRECAUŢIE

Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului.

ВНИМАНИЕ

При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям.

UPOZORNENIE

Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.

POZOR

Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi

okoljevarstvenimi predpisi.

UYARI

Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

OСТОРОГА

Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

Regulatory Compliance and Battery Disposal Information

Intel BLKDX58OG, DX58OG Technical Product Specification

Specifications and Main Features

Frequently Asked Questions

User Manual