Intel BLKDQ965WCEKR, DQ965WC Technical Product Specification
Intel® Desktop Board
DQ965WC
Technical Product Specification
The Intel® Desktop Board DQ965WC may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DQ965WC Specification Update.
September 2006
Order Number: D56018-001US
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DQ965WC Technical Product
Specification.
This product specification applies to only the standard Intel® Desktop Board DQ965WC with
BIOS identifier CO96510J.86A.
Changes to this specification will be published in the Intel Desktop Board DQ965WC Specification
Update before being incorporated into a revision of this document.
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or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
®
desktop boards may contain design defects or errors known as errata, which may cause the product
Intel
to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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Copyright © 2006, Intel Corporation. All rights reserved.
September 2006
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board DQ965WC. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DQ965WC and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
®
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
#
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DQ965WC Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#).
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1, 073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Board Layout ....................................................................... 12
1.1.3 Block Diagram ..................................................................... 14
1.2 Online Support................................................................................ 15
1.3 Processor ....................................................................................... 15
1.4 System Memory .............................................................................. 16
1.4.1 Memory Configurations ......................................................... 18
1.5 Intel® Virtualization Technology (Intel® VT) ........................................ 23
1.6 Intel® vPro™ Technology Support...................................................... 24
1.7 Intel® Q965 Express Chipset............................................................. 25
1.7.1 Intel Q965 Graphics Subsystem ............................................. 25
1.7.2 USB ................................................................................... 28
1.7.3 Serial ATA Interfaces ............................................................ 28
1.7.4 Real-Time Clock, CMOS SRAM, and Battery.............................. 29
1.8 Audio Subsystem ............................................................................ 30
1.8.1 Audio Subsystem Software .................................................... 30
1.8.2 Audio Connectors and Headers............................................... 31
1.9 LAN Subsystem............................................................................... 32
1.9.1 Intel® 82566DM Gigabit Ethernet Controller............................. 32
1.9.2 LAN Subsystem Software ...................................................... 32
1.9.3 RJ-45 LAN Connector with Integrated LEDs .............................. 33
1.9.4 Intel® Active Management Technology (Intel® AMT)
with System Defense Feature.................................................
1.9.5 Alert Standard Format (ASF) 2.0 Support ................................ 34
1.10 Hardware Management Subsystem .................................................... 35
1.10.1 Hardware Monitoring and Fan Control...................................... 35
1.10.2 Fan Monitoring..................................................................... 35
1.10.3 Chassis Intrusion and Detection ............................................. 35
1.10.4 Thermal Monitoring .............................................................. 36
1.11 Power Management ......................................................................... 37
1.11.1 ACPI .................................................................................. 37
1.11.2 Hardware Support ................................................................ 39
1.12 Trusted Platform Module (TPM).......................................................... 44
33
2 Technical Reference
2.1 Memory Map................................................................................... 45
2.1.1 Addressable Memory............................................................. 45
2.2 DMA Channels................................................................................. 47
2.3 Fixed I/O Map ................................................................................. 48
2.4 PCI Configuration Space Map ............................................................ 49
2.5 Interrupts ...................................................................................... 50
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Intel Desktop Board DQ965WC Technical Product Specification
2.6 PCI Interrupt Routing Map ................................................................ 51
2.7 Connectors and Headers................................................................... 52
2.7.1 Back Panel Connectors.......................................................... 53
2.7.2 Component-side Connectors and Headers ................................ 54
2.8 Jumper Block .................................................................................. 61
2.9 Mechanical Considerations ................................................................ 62
2.9.1 Form Factor......................................................................... 62
2.9.2 I/O Shield ........................................................................... 63
2.10 Electrical Considerations................................................................... 64
2.10.1 DC Loading.......................................................................... 64
2.10.2 Fan Header Current Capability................................................ 64
2.10.3 Add-in Board Considerations .................................................. 64
2.10.4 Power Supply Considerations ................................................. 65
2.11 Thermal Considerations.................................................................... 66
2.12 Reliability....................................................................................... 68
2.13 Environmental ................................................................................ 69
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 71
3.2 BIOS Flash Memory Organization....................................................... 72
3.3 Resource Configuration .................................................................... 72
3.3.1 PCI Autoconfiguration ........................................................... 72
3.4 System Management BIOS (SMBIOS)................................................. 73
3.5 Legacy USB Support ........................................................................ 73
3.6 BIOS Updates ................................................................................. 74
3.6.1 Language Support ................................................................ 74
3.6.2 Custom Splash Screen .......................................................... 74
3.7 BIOS Recovery................................................................................ 75
3.8 Boot Options................................................................................... 75
3.8.1 CD-ROM Boot ...................................................................... 75
3.8.2 Network Boot....................................................................... 75
3.8.3 Booting Without Attached Devices .......................................... 76
3.8.4 Changing the Default Boot Device During POST ........................ 76
3.9 Adjusting Boot Speed....................................................................... 76
3.9.1 Peripheral Selection and Configuration .................................... 76
3.9.2 BIOS Boot Optimizations ....................................................... 77
3.10 BIOS Security Features .................................................................... 78
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 79
4.2 BIOS Beep Codes ............................................................................ 79
4.3 BIOS Error Messages ....................................................................... 79
4.4 Port 80h POST Codes ....................................................................... 80
vi
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 85
5.1.1 Safety Regulations ............................................................... 85
5.1.2 European Union Declaration of Conformity Statement................ 86
5.1.3 Product Ecology Statements .................................................. 88
5.1.4 EMC Regulations .................................................................. 91
5.1.5 Product Certification Markings (Board Level) ............................ 92
5.2 Battery Disposal Information............................................................. 93
Figures
1. Major Board Components ................................................................. 12
2. Block Diagram ................................................................................ 14
3. Memory Channel Configuration and DIMM Configuration ....................... 18
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs............ 19
5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 19
6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs........... 20
7. Single Channel (Asymmetric) Mode Configuration with One DIMM .......... 21
8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 21
9. Flex Mode Configuration with Two DIMMs ........................................... 22
10. Front/Back Panel Audio Connector Options.......................................... 31
11. LAN Connector LED Locations............................................................ 33
12. Thermal Sensors and Fan Headers ..................................................... 36
13. Location of the Onboard Power Indicator LEDs..................................... 43
14. Detailed System Memory Address Map ............................................... 46
15. Back Panel Connectors ..................................................................... 53
16. Component-side Connectors and Headers ........................................... 54
17. Connection Diagram for Front Panel Header ........................................ 58
18. Connection Diagram for Front Panel USB Headers ................................ 60
19. Connection Diagram for IEEE 1394a Header........................................ 60
20. Location of the Jumper Block ............................................................ 61
21. Board Dimensions ........................................................................... 62
22. I/O Shield Dimensions...................................................................... 63
23. Localized High Temperature Zones..................................................... 67
Tables
1. Feature Summary............................................................................ 10
2. Board Components Shown in Figure 1 ................................................ 13
3. Supported Memory Configurations ..................................................... 16
4. Memory Operating Frequencies ......................................................... 17
5. DVI Port Status Conditions................................................................ 27
6. Audio Jack Retasking Support ........................................................... 30
7. LAN Connector LED States ................................................................ 33
8. Effects of Pressing the Power Switch .................................................. 37
9. Power States and Targeted System Power .......................................... 38
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Intel Desktop Board DQ965WC Technical Product Specification
10. Wake-up Devices and Events ............................................................ 39
11. System Memory Map ....................................................................... 47
12. DMA Channels................................................................................. 47
13. I/O Map ......................................................................................... 48
14. PCI Configuration Space Map ............................................................ 49
15. Interrupts ...................................................................................... 50
16. PCI Interrupt Routing Map ................................................................ 51
17. Component-side Connectors and Headers Shown in Figure 16................ 55
18. Front and Rear Chassis Fan Headers .................................................. 55
19. Processor Fan Header ...................................................................... 55
20. Chassis Intrusion Header .................................................................. 55
21. Serial ATA Connectors...................................................................... 56
22. High Definition Audio Link Header ...................................................... 56
23. Front Panel Audio Header ................................................................. 56
24. Processor Core Power Connector........................................................ 57
25. Main Power Connector...................................................................... 57
26. Front Panel Header .......................................................................... 58
27. States for a One-Color Power LED...................................................... 59
28. States for a Two-Color Power LED...................................................... 59
29. Auxiliary Front Panel Power LED Header ............................................. 59
30. BIOS Setup Configuration Jumper Settings.......................................... 61
31. DC Loading Characteristics ............................................................... 64
32. Fan Header Current Capability........................................................... 64
33. Thermal Considerations for Components ............................................. 68
34. Desktop Board DQ965WC Environmental Specifications ........................ 69
35. BIOS Setup Program Menu Bar.......................................................... 72
36. BIOS Setup Program Function Keys ................................................... 72
37. Acceptable Drives/Media Types for BIOS Recovery ............................... 75
38. Boot Device Menu Options ................................................................ 76
39. Supervisor and User Password Functions ............................................ 78
40. Beep Codes .................................................................................... 79
41. BIOS Error Messages ....................................................................... 79
42. Port 80h POST Code Ranges ............................................................. 80
43. Port 80h POST Codes ....................................................................... 81
44. Typical Port 80h POST Sequence ....................................................... 84
45. Safety Regulations........................................................................... 85
46. Lead-Free Board Markings ................................................................ 90
47. EMC Regulations ............................................................................. 91
48. Product Certification Markings ........................................................... 92
viii
1 Product Description
What This Chapter Contains
1.1 Overview........................................................................................ 10
1.2 Online Support................................................................................ 15
1.3 Processor ....................................................................................... 15
1.4 System Memory .............................................................................. 16
1.5 Intel® Virtualization Technology ........................................................ 23
1.6 Intel® vPro™ Technology Support...................................................... 24
1.7 Intel® Q965 Express Chipset............................................................. 25
1.8 Audio Subsystem ............................................................................ 30
1.9 LAN Subsystem............................................................................... 32
1.10 Hardware Management Subsystem .................................................... 35
1.11 Power Management ......................................................................... 37
1.12 Trusted Platform Module (TPM).......................................................... 44
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Intel Desktop Board DQ965WC Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Desktop Board DQ965WC.
Table 1. Feature Summary
Form Factor picoBTX Form Factor (8.00 inches by 10.50 inches [203.20 millimeters by
266.70 millimeters])
Processor Support for the following:
®
• Intel
• Intel
• Intel
• Intel
Memory
Chipset
Video Intel® GMA 3000 onboard graphics subsystem
Audio 6-channel (5.1) audio subsystem using the SigmaTel* STAC9227 audio codec
USB Support for USB 2.0 devices
Peripheral
Interfaces
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82566DM
BIOS
Trusted Platform
Module (TPM),
revision 1.2
• Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR2 800, DDR2 667, or DDR2 533 MHz DIMMs
• Support for up to 8 GB of system memory using DDR2 667 or DDR2 533
• Support for up to 4 GB of system memory using DDR2 800 DIMMs
Intel
• Intel
• Intel
• 10 USB ports
• Two IEEE-1394a interfaces: one back panel connector and one front-panel
• Four Serial ATA interfaces
Gigabit Ethernet Controller
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
A component that enhances platform security
Core™2 Duo processor in an LGA775 socket with a 1066 or 800 MHz
system bus
®
Pentium® D processor in an LGA775 socket with an 800 or 533 MHz
system bus
®
Pentium® 4 processor in an LGA775 socket with an 800 or 533 MHz
system bus
®
Celeron® D processor in an LGA775 socket with a 533 MHz system bus
DIMMs
®
Q965 Express Chipset, consisting of:
®
82Q965 Graphics Memory Controller Hub (GMCH)
®
82801HO I/O Controller Hub (ICH8DO)
header
®
BIOS (resident in the SPI Flash device)
and SMBIOS
continued
10
Table 1. Feature Summary (continued)
Instantly Available
PC Technology
Expansion
Capabilities
Hardware Monitor
Subsystem
Intel® vPro™
Technology
support
• Support for PCI Local Bus Specification Revision 2.3
• Support for PCI Express* Revision 1.0a
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, and USB ports
One PCI Express x16 bus add-in card connector
®
• Intel
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers
• Three fan sense inputs used to monitor fan activity
Provides remote management, improved security, and energy-efficient
performance
Quiet System Technology implemented through the ICH8
Manageability Engine
For information about Refer to
Available configurations for the Desktop Board DQ965WC Section 1.2, page 15
Product Description
11
Intel Desktop Board DQ965WC Technical Product Specification
1.1.2 Board Layout
Figure 1 shows the location of the major components.
Table 2 lists the components identified in Figure 1.
12
Figure 1. Major Board Components
Table 2. Board Components Shown in Figure 1
Item/callout
from
Figure 1 Description
A Front panel audio header
B Back panel connectors
C Battery
D IEEE-1394a front panel header
E Front panel USB headers [2]
F PCI Express x16 connector
G Main Power connector
H Front chassis fan header
I Intel 82801HO I/O Controller Hub (ICH8DO)
J BIOS Setup configuration jumper block
K Chassis intrusion header
L Front panel header
M Auxiliary front panel power LED header
N Processor fan header
O LGA775 processor socket
P Intel 82Q965 GMCH
Q DIMM Channel A sockets
R Processor core power connector
S Speaker
T DIMM Channel B sockets
U Serial ATA connectors [4]
V Rear chassis fan header
W High Definition Audio header
Product Description
13
Intel Desktop Board DQ965WC Technical Product Specification
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
LGA775
Processor
Socket
PCI Express
x16 Connector
PCI Express
x16 Interface
Display
Interface
VGA
Port
DVI
Port
Channel A
DIMMs (2)
System Bus
(1066/800/533
MHz)
Intel Q965 Express Chipset
Intel 82Q965
Graphics and
Memory
Controller Hub
(GMCH)
Dual-Channel
Memory Bus
SMBus
Gigabit Ethernet
Controller
LPC Bus
PCI Express
x1 Interface
Intel 82801HO
I/O Controller Hub
(ICH8DO)
DMI Interconnect
USB
Serial ATA
IDE Interface
Component
Back Panel/Front
USB Ports
Peripheral
Interface (SPI)
Flash Device
Serial ATA IDE
Connectors (4)
LAN
Connector
TPM
Panel
Serial
Channel B
DIMMs (2)
IEEE-1394a
Connector/Header
IEEE-1394a
Controller
PCI
Bus
Figure 2. Block Diagram
High Definition Audio Link
Audio
Codec
Mic In
Line Out
Line In/Retasking Jack
Line Out/Retasking Jack
Mic In/Retasking Jack
High Definition
Audio Link
Header
OM18485
14
Product Description
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel® Desktop Board DQ965WC
under “Desktop Board Products” or
“Desktop Board Support”
Available configurations for the
Desktop Board DQ965WC
Processor data sheets http://www.intel.com/products/index.htm
ICH8DO addressing http://developer.intel.com/design/chipsets/datashts
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
Supported video modes http://www.intel.com/design/motherbd/wc/wc_documentation.htm
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
http://developer.intel.com/design/motherbd/wc/wc_available.htm
1.3 Processor
The board is designed to support the following processors:
• Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz
system bus
• Intel Pentium D processor in an LGA775 processor socket with an 800 or 533 MHz
system bus
• Intel Pentium 4 processor in an LGA775 processor socket with an 800 or 533 MHz
system bus
• Intel Celeron D processor in an LGA775 processor socket with a 533 MHz
system bus
See the Intel web site listed below for the most up-to-date list of supported
processors.
For information about… Refer to:
Supported processors http://www.intel.com/design/motherbd/wc/wc_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can
damage the board, the processor, and the power supply.
INTEGRATOR’S NOTE
#
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.7.2.2, page 57
15
Intel Desktop Board DQ965WC Technical Product Specification
1.4 System Memory
The board has four DIMM sockets and supports the following memory features:
• 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
• 8 GB maximum total system memory using DDR2 667 or DDR2 533 DIMMs;
4 GB maximum total system memory using DDR2 800 DIMMs. Refer to
Section
memory.
• Minimum total system memory: 512 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR2 800, DDR2 667, or DDR2 533 MHz SDRAM DIMMs
• DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
NOTE
2.1.1 on page 45 for information on the total amount of addressable
A minimum of 512 MB of system memory is required to fully enable both the onboard
graphics and the manageability engine.
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This enables the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Type
DDR2 533 256 Mbit 128 MB 512 MB 2 GB
DDR2 533 512 Mbit 256 MB 1 GB 4 GB
DDR2 533 1 Gbit 512 MB 2 GB 8 GB
DDR2 667 256 Mbit 128 MB 512 MB 2 GB
DDR2 667 512 Mbit 256 MB 1 GB 4 GB
DDR2 667 1 Gbit 512 MB 2 GB 8 GB
DDR2 800 256 Mbit 128 MB 512 MB 2 GB
DDR2 800 512 Mbit 256 MB 1 GB 4 GB
SDRAM
Technology
Smallest usable
DIMM (one x16
Single-sided
DIMM)
Largest usable
DIMM (one x8
Double-sided
DIMM)
Maximum capacity
with four identical
x8 Double-sided
DIMMs
16
Product Description
NOTE
Regardless of the DIMM type used, the memory frequency will either be equal to or
less than the processor system bus frequency. For example, if DDR2 800 memory is
used with a 533 MHz system bus frequency processor, the memory will operate at
533 MHz.
Table 4 lists the resulting operating memory frequencies based on the
combination of DIMMs and processors.
Table 4. Memory Operating Frequencies
DIMM Type Processor system bus frequency Resulting memory frequency
DDR2 533 533 MHz 533 MHz
DDR2 533 800 MHz 533 MHz
DDR2 533 1066 MHz 533 MHz
DDR2 667 533 MHz 533 MHz
DDR2 667 800 MHz 667 MHz
DDR2 667 1066 MHz 667 MHz
DDR2 800 533 MHz 533 MHz
DDR2 800 800 MHz 800 MHz
DDR2 800 1066 MHz 800 MHz
17
Intel Desktop Board DQ965WC Technical Product Specification
1.4.1 Memory Configurations
The Intel 82Q965 GMCH supports the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system
memory map) is mapped to dual channel operation; the topmost DRAM memory
(the memory that is nearest to the 8 GB address space limit), if any, is mapped to
single channel operation. Flex mode results in multiple zones of dual and single
channel operation across the whole of DRAM memory. To use flex mode, it is
necessary to populate both channels.
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels
are black.
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
Figure 3. Memory Channel Configuration and DIMM Configuration
INTEGRATOR’S NOTE
#
Regardless of the memory configuration used (dual channel, single channel, or flex
mode), DIMM 0 of Channel A must always be populated. This is a requirement of the
ICH8 Manageability Engine feature.
OM18356
18
Product Description
1.4.1.1 Dual Channel (Interleaved) Mode Configurations
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the
DIMM0 (blue) sockets of both channels are populated with identical DIMMs.
1 GB
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM18357
Figure 4. Dual Channel (Interleaved) Mode Configuration
with Two DIMMs
Figure 5 shows a dual channel configuration using three DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A equal the capacity of the single
DIMM in the DIMM0 (blue) socket of Channel B.
256 MB
256 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
Figure 5. Dual Channel (Interleaved) Mode Configuration
19
with Three DIMMs
OM18358
Intel Desktop Board DQ965WC Technical Product Specification
Figure 6 shows a dual channel configuration using four DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A equal the combined capacity of the
two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of
both channels.
256 MB
512 MB
256 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
Figure 6. Dual Channel (Interleaved) Mode Configuration
with Four DIMMs
OM18359
20
Product Description
1.4.1.2 Single Channel (Asymmetric) Mode Configurations
NOTE
Dual channel (Interleaved) mode configurations provide the highest memory
throughput.
Figure 7 shows a single channel configuration using one DIMM. In this example, only
the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated.
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
OM18360
Figure 7. Single Channel (Asymmetric) Mode Configuration
with One DIMM
Figure 8 shows a single channel configuration using three DIMMs. In this example, the
combined capacity of the two DIMMs in Channel A does not equal the capacity of the
single DIMM in the DIMM0 (blue) socket of Channel B.
256 MB
512 MB
512 MB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
Figure 8. Single Channel (Asymmetric) Mode Configuration
21
with Three DIMMs
OM18361
Intel Desktop Board DQ965WC Technical Product Specification
1.4.1.3 Flex Mode Configuration
NOTE
The use of flex mode requires DIMMs to be installed in both channels.
Figure 9 shows a flex mode configuration using two DIMMs. The operation is as
follows:
• The 512 MB DIMM in the Channel A, DIMM 0 socket and the lower 512 MB of the
DIMM in the Channel B, DIMM 0 socket operate together in dual channel mode.
• The remaining (upper) 512 MB of the DIMM in Channel B operates in single channel
mode.
512 MB
1 GB
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
Figure 9. Flex Mode Configuration with Two DIMMs
OM18406
22
Product Description
1.5 Intel® Virtualization Technology (Intel® VT)
Virtualization is a proven technology that enables one computer to function as multiple
“virtual” systems. It enables multiple operating systems and application stacks to be
hosted in logically isolated partitions — also known as virtual machines. Partitions are
independent virtualized environments within the same PC with shared, prioritized
access to system hardware. Platform resources, such as processors, memory,
storage, and network adapters can be allocated and prioritized for the different
partitions to meet specific business and application requirements.
®
Intel
virtualization processes and a new, dedicated space in the software stack for an Intel
Lightweight Virtual Machine Monitor (Intel
and prioritizes each partition’s access to the system hardware.
Intel provides the virtualization capability within Intel Virtualization Technologyenabled processors and validated chipsets. An Intel Virtualization Technology-enabled
BIOS is also needed. Standard memory, storage, and graphics cards work with the
Intel Virtualization Technology solution. However, because the quality and amount of
such system resources directly affect virtualization performance, it is advisable to be
generous in these areas. Using an Intel
ensures the ability to take advantage of the advanced security and manageability
capabilities of Intel Virtualization Technology.
Virtualization Technology (Intel® VT) offers silicon-level support for core
®
LVMM) — a software layer that controls
®
network adapter and compatible driver
®
A Virtual Machine Monitor enabled for Intel Virtualization Technology, such as
Intel LVMM, is also required. Intel LVMM is available to Independent Software Vendors
(ISVs). After the system hardware and VMM are in place, Intel Virtualization
Technology-enabled applications will need to be installed to take advantage of the
built-in hardware capabilities of Intel Virtualization Technology and the virtualization
enhancement of Intel LVMM.
For information about Refer to
Intel Virtualization Technology http://www.intel.com/go/dovirtualization/
INTEGRATOR’S NOTE
#
Intel Virtualization Technology-based platforms require system hardware, virtualization
software, and applications that are enabled for Intel Virtualization Technology.
Individual PC manufacturers will determine whether to ship their platforms with Intel
Virtualization Technology enabled or disabled by default. Also, each PC manufacturer
may choose to ship Intel LVMM already installed on their platforms or on separate
CD-ROMs.
23
Intel Desktop Board DQ965WC Technical Product Specification
1.6 Intel® vPro™ Technology Support
The board supports Intel vPro technology, Intel’s platform for the digital office.
Intel vPro technology with Active Management Technology provides remote
management, improved security, and energy-efficient performance.
The management engine microcontroller in the Intel Q965 Express Chipset provides
remote hardware management capabilities regardless of the state of the operating
system. The embedded packet filters and sensors in ICH8DO provide enhanced
security features customizable through third party applications.
INTEGRATOR’S NOTE
#
In addition to the hardware support on the board (the Intel 82801HO ICH8DO and the
Intel 82566DM Gigabit Ethernet Controller), Intel vPro technology requires the use of
an Intel Core 2 Duo processor and compatible third-party applications.
For information about Refer to
Intel vPro technology and compatible third-party applications http://www.intel.com/vpro/
24
Product Description
1.7 Intel® Q965 Express Chipset
The Intel Q965 Express chipset consists of the following devices:
• Intel 82Q965 Graphics and Memory Controller Hub (GMCH) with Direct Media
Interface (DMI) interconnect
• Intel 82801HO I/O Controller Hub (ICH8DO) with DMI interconnect
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The component also provides integrated graphics capabilities
supporting 3D, 2D and display capabilities. The ICH8DO is a centralized controller for
the board’s I/O paths.
For information about Refer to
The Intel Q965 Express chipset http://developer.intel.com/
Resources used by the chipset Chapter 2
1.7.1 Intel Q965 Graphics Subsystem
The Intel Q965 Express chipset contains two separate, mutually exclusive graphics
options. Either the GMA 3000 graphics controller (contained within the 82Q965
GMCH) is used, or a PCI Express x16 add-in card can be used. When a PCI Express
x16 add-in card is installed, the GMA 3000 graphics controller is disabled.
1.7.1.1 Intel® GMA 3000 Graphics Controller
The Intel GMA 3000 graphics controller features the following:
• 667 MHz core frequency
• High performance 3-D setup and render engine
• High quality texture engine
⎯ DX9.0c* and OpenGL* 1.4 + extensions compliant
⎯ Vertex Shader Model 2.0 / 3.0 (Software Only)
⎯ Hardware Pixel Shader 2.0
⎯ 32-bit and 16-bit Full Precision Floating Point Operations
⎯ Up to eight Multiple Render Targets (MRTs)
⎯ Occlusion Query
⎯ 128-bit floating point texture formats
⎯ Bilinear, Trilinear, and Anisotropic MipMap filtering
⎯ Shadow maps and double sided stencils
⎯ Alpha and luminance maps
⎯ Texture color-keying/chroma-keying
⎯ Cubic environment reflection mapping
⎯ Enhanced texture blending functions
• 3D Graphics Rendering enhancements
⎯ 1.3 dual texture GigaPixel/sec fill rate
⎯ 16 and 32 bit color
25
Intel Desktop Board DQ965WC Technical Product Specification
⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz
⎯ Vertex cache
⎯ Anti-aliased lines
⎯ OpenGL version 1.5 support with vertex buffer and EXT_Shadow extensions
• 2D Graphics enhancements
⎯ 8, 16, and 32 bit color
⎯ Optimized 256-bit BLT engine
⎯ Color space conversion
⎯ Anti-aliased lines
• Video
⎯ Hardware motion compensation for MPEG2 and HD video
⎯ Software DVD at 30 fps full screen
⎯ Motion adaptive de-interlacing
• Display
⎯ Integrated 24-bit 400 MHz RAMDAC
⎯ Up to 2048 x 1536 at 75 Hz refresh (QXGA)
⎯ DVI specification 1.0 compliant
⎯ Dual independent display options with digital display
⎯ 180-degree hardware screen rotation
⎯ Hardware color cursor support
⎯ Supports TMDS transmitters or TV-out encoders
⎯ HDCP support
⎯ DDC2B compliant interface with Advanced Digital Display 2 card or Media
Expansion Card (ADD2/MEC), support for TV-out/TV-in and DVI digital display
connections
⎯ Supports flat panels up to 2048 x 1536 at 75 Hz (when in dual-channel mode)
or digital CRT/HDTV at 1920 x 1080 at 85 Hz (with ADD2/MEC)
⎯ Two multiplexed SDVO port interfaces with 270 MHz pixel clocks using an
ADD2/MEC card
• Dynamic Video Memory Technology (DVMT) support up to 256 MB
• Intel
®
Zoom Utility
1.7.1.2 Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through highly efficient
memory utilization. DVMT ensures the most efficient use of available system memory
for maximum 2-D/3-D graphics performance. Up to 256 MB of system memory can be
allocated to DVMT on systems that have 512 MB or more of total system memory
installed. DVMT returns system memory back to the operating system when the
additional system memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the
BIOS Setup program) for compatibility with legacy applications. An example of this
would be when using VGA graphics under DOS. Once loaded, the operating system
and graphics drivers allocate additional system memory to the graphics buffer as
needed for performing graphics functions.
26
Product Description
NOTE
The use of DVMT requires operating system driver support.
1.7.1.3 Configuration Modes
A list of supported modes for the Intel GMA 3000 graphics controller is available as a
downloadable document.
For information about Refer to
Supported video modes for the board Section 1.2, page 15
1.7.1.4 Digital Video Interface (DVI)
The DVI port supports only DVI-D displays. If a DVI-I display is connected, only the
digital signal will be displayed. The maximum supported resolution is 1600 x 1200 at
60 Hz. The DVI port is compliant with the DVI 1.0 specification.
Depending on the type of add-in card installed in the PCI Express x16 connector, the
DVI port will behave as described in
Table 5.
Table 5. DVI Port Status Conditions
PCI Express x16 connector status DVI port status
No add-in card installed Enabled
Non-video PCI Express x1 add-in card installed Enabled
PCI Express x4, x8, or 16 add-in card installed Disabled
ADD2 or MEC card installed Disabled
1.7.1.5 Advanced Digital Display (ADD2/MEC) Card Support
The GMCH routes two multiplexed SDVO ports that are each capable of driving up to a
200 MHz pixel clock to the PCI Express x16 connector. The SDVO ports can be paired
for a dual channel configuration to support up to a 400 MHz pixel clock. When an
ADD2/MEC card is detected, the Intel GMA 3000 graphics controller is enabled and the
PCI Express x16 connector is configured for SDVO mode. SDVO mode enables the
SDVO ports to be accessed by the ADD2/MEC card. An ADD2/MEC card can either be
configured to support simultaneous display with the primary VGA display or can be
configured to support dual independent display as an extended desktop configuration
with different color depths and resolutions. ADD2/MEC cards can be designed to
support the following configurations:
• TV-Out (composite video)
• Transition Minimized Differential Signaling (TMDS) for DVI 1.0
• Low Voltage Differential Signaling (LVDS)
• Single device operating in dual channel mode
• VGA output
• HDTV output
• HDMI/UDI support (when used with the HD Audio Link)
27
Intel Desktop Board DQ965WC Technical Product Specification
1.7.2 USB
The board supports up to 10 USB 2.0 ports, supports UHCI and EHCI, and uses UHCIand EHCI-compatible drivers.
The ICH8DO provides the USB controller for all ports. The port arrangement is as
follows:
• Six ports are implemented with stacked back panel connectors
• Four ports are routed to two separate front panel USB headers
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 15, page 53
The location of the front panel USB headers Figure 16, page 54
1.7.3 Serial ATA Interfaces
The board provides four Serial ATA (SATA) connectors, which support one device per
connector.
1.7.3.1 Serial ATA Support
The ICH8DO’s Serial ATA controller offers four independent Serial ATA ports with a
theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed
on each port for a maximum of four Serial ATA devices. A point-to-point interface is
used for host to device connections, unlike Parallel ATA IDE which supports a
master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP and
Windows 2000 operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or
power supplies equipped with low-voltage power connectors.
For more information, see:
For information about Refer to
The location of the Serial ATA connectors Figure 16, page 54
http://www.serialata.org/
28
Product Description
1.7.3.2 Serial ATA RAID
The ICH8DO supports the following RAID (Redundant Array of Independent Drives)
levels:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
1.7.4 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one.
Figure 1 on page 12 shows the location of the battery.
29
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