The Intel® Desktop Board DQ57TML may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DQ57TML Specification Update.
June 2010
Page 2
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DQ57TML Technical Product
Specification
This product specification applies to only the standard Intel® Desktop Board DQ57TML with BIOS
identifier TMIBX10H.86A.
Changes to this specification will be published in the Intel Desktop Board DQ57TML Specification
Update before being incorporated into a revision of this document.
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WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
®
All Intel
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suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
June 2010
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
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to any such patents, trademarks, copyrights, or other intellectual property rights.
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Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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Copies of documents which have an ordering number and are referenced in this document, or other Intel
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* Other names and brands may be claimed as the property of others.
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
®
Intel
Desktop Board DQ57TML.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DQ57TML and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DQ57TML
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
A Conventional PCI bus add-in card connector
B PCI Express x1 add-in card connector
C Battery
D PCI Express x1 add-in card connector
E Piezoelectric speaker
F PCI Express x16 add-in card connector
G Back panel connectors
H 12 V internal power connector (ATX12V)
I Rear chassis fan header
J LGA1156 processor socket
K Processor fan header
L DIMM Channel A sockets (2)
M DIMM Channel B sockets (2)
N Front chassis fan header
O Chassis intrusion header
P Diskette drive connector
Q Main power connector (2 x 12)
R SATA connectors
S Alternate front panel power LED header
T Front panel header
U Standby power LED
V Front panel USB header (with Intel Z-U130 USB Solid-State Drive, or compatible
device, support)
W Intel ME “M” state LED
X Intel Q57 Express Chipset
Y Front panel USB headers (3)
Z BIOS setup configuration jumper block
AA Intel® Management Engine BIOS Extension (Intel® MEBx) Reset header
BB Intel Remote PC Assist header
CC Serial port header
DD S/PDIF header
EE Front panel audio header
FF Internal mono speaker header
ion
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1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board DQ57TML
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.4 Processor
The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, Intel
Pentium processors, and Intel Xeon processor 3400 series in an LGA1156 socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum TDP of 95 W. See the Intel web site listed below for the
most up-to-date list of supported processors.
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.6.1 on page 61 for information on power supply requirements for this board.
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Product Description
1.5 Intel
®
Q57 Express Chipset
The Intel Q57 Express Chipset consisting of the Intel Q57 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network,
display, Conventional PCI, and PCI Express x1 interfaces. The PCH is a centralized
controller for the board’s I/O paths.
For information about Refer to
The Intel Q57 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6 System Memory
The board has four DIMM sockets and supports the following memory features:
• Two independent memory channels with interleaved mode support
• Support for non-ECC, unbuffered, single-sided or double-sided DIMMs with x8
organization
•Support for unbuffered ECC memory when used with an Intel Xeon processor
3400 series
•16 GB maximum total system memory (with 2 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
• Minimum total system memory: 1 GB using 1 Gb x8 module
• Serial Presence Detect
• DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
The Intel Core i7, Intel Core i5, Intel Core i3, Intel Pentium processors, and Intel Xeon
processors 3400 series support the following types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
Figure 3 illustrates the memory channel and DIMM configuration.
Product Description
Figure 3. Memory Channel and DIMM Configuration
NOTE
When using a processor without Intel Graphics Technology, there must always be
memory installed into any or both of the DIMM 0 (blue) memory sockets for the
system to boot.
The board supports system graphics through either Intel Graphics Technology or a
PCI Express 2.0 x16 add-in graphics card.
1.7.1 Integrated Graphics
The board supports integrated graphics through the Intel® Flexible Display Interface
®
(Intel
1.7.1.1 Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x
1536 (QXGA) at a 75 Hz refresh rate.
The VGA port is enabled for POST whenever a monitor is attached, regardless of the
DVI-D connector status.
1.7.1.2 Digital Visual Interface (DVI-D)
FDI) for processors with Intel Graphics Technology.
The DVI-D port supports only digital DVI displays. The maximum supported resolution
is 2048 x 1536 at 75 Hz refresh (QXGA). The DVI-D port is compliant with the
DVI 1.0 specification.
1.7.2 PCI Express x16 Graphics
The Intel Core i7, Intel Core i5, Intel Core i3, Intel Pentium processors, and Intel Xeon
processors 3400 series in an LGA1156 socket support discrete add in graphics cards
through the PCI Express 2.0 x16 graphics connector:
•Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
direction (500 MB/s) per lane. Maximum theoretical bandwidth on interface is
8 GB/s in each direction, simultaneously, when operating in x16 mode.
•Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (250 MB/s) per lane. Maximum theoretical bandwidth on interface is
4 GB/s in each direction, simultaneously, when operating in x16 mode.
For information about Refer to
PCI Express technology http://www.pcisig.com
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Product Description
1.8 USB
The board supports up to twelve USB 2.0 ports through two EHCI host controllers on
the PCH that allow the use of EHCI-compatible drivers.
The port arrangement is as follows:
• Four ports are implemented with stacked back panel connectors
• Eight front panel ports are implemented through four dual-port internal headers;
one header supports an Intel Z-U130 USB Solid-State Drive (or compatible device)
For information about Refer to
The location of the USB connectors on the back panel Figure 10, page 44
The location of the front panel USB headers Figure 11, page 45
1.9 SATA Interfaces
The board provides four SATA connectors through the PCH, which support one device
per connector.
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
3 Gb/s per port. A point-to-point interface is used for host to device connections.
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Windows* XP, Windows Vista*, and Windows 7* operating
systems.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 11, page 45
.
1.9.1.1 Serial ATA RAID
The board supports the Intel Rapid Storage Technology (Intel RST) which provides the
following RAID (Redundant Array of Independent Drives) levels:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
The board incorporates the Intel® Rapid Recover Technology (Intel® RRT). Intel Rapid
Recover Technology is a feature of Intel Rapid Storage Technology. It uses RAID 1
(mirroring) functionality to copy data from a designated master drive to a designated
recovery drive. The master drive data can be copied to the recovery drive either
continuously or on request.
When using the continuous update policy, changes made to the data on the master
drive while the recovery drive is disconnected or offline are automatically copied to the
recovery drive when it is reconnected. When using the on request update policy, the
master drive data can be restored to a previous state by copying the data on the
recovery drive back to the master drive.
The Legacy I/O Controller provides the following features:
• One serial port header
• One diskette drive connector
• One parallel port connector on the back panel
• PS/2 keyboard/mouse port on the back panel
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional
bus systems
• Intelligent power management, including a programmable wake-up event interface
• PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the Legacy I/O controller.
1.10.1 Serial Port
The serial port is implemented as a 10-pin header on the board. The serial port
supports data transfers at speeds up to 115.2 kbits/s with BIOS support.
For information about Refer to
The location of the serial port header Figure 11, page 45
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Product Description
1.11 Audio Subsystem
The board supports Intel High Definition Audio through the Realtek ALC662-VC audio
codec.
The Realtek ALC662-VC-based audio subsystem supports the following features:
• 6-channel audio with independent multi-streaming stereo.
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output through back panel jacks
• Headphone and Mic in functions for front panel audio jacks
• S/PDIF audio header
• A signal-to-noise (S/N) ratio of 90 dB
NOTE
Systems built with an AC ‘97 audio front panel will not be able to obtain the Microsoft
Windows Vista logo.
Table 4 lists the supported functions of the front panel and back panel audio jacks.
Table 4. Audio Jack Retasking Support
Audio Jack
FP Green Default
FP Pink Default
Rear Blue Default
Rear Green Ctrl panel Default
Rear Pink Default
Microphone
Head-
phones
Front
Speaker Line In
Mic In
1.11.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 14
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include the
following:
•Front panel audio (a 2 x 5-pin header that provides headphone and mic in signals
for front panel audio connectors) (yellow)
• S/PDIF audio header (1 x 4-pin header) (yellow)
• Internal mono speaker header (1 x 2-pin header) (yellow)
For information about Refer to
The locations of the front panel audio header, S/PDIF header, and
internal mono speaker header
The signal names of the front panel audio header Table 16 and Table 18, page 48
The signal names of the S/PDIF header Table 14, page 48
The signal names of the internal mono speaker header Table 15, page 48
The back panel audio connectors Section 2.2.1, page 44
Figure 11, page 45
1.11.2.1 Analog Audio Connectors
The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A Audio line in
B Audio line out
C Mic in
Figure 4. Back Panel Audio Connectors
The back panel audio connectors are configurable through the audio device drivers.
For information about Refer to
The back panel audio connectors Section 2.2.1, page 44
The front panel headphone output is supported using a separate audio channel pair
allowing multi-streaming audio configurations such as stereo audio conferencing
(through a front panel headset).
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Product Description
1.11.2.2 S/PDIF Header
The S/PDIF header allows connections to coaxial or optical dongles for digital audio
output.
1.11.2.3 Internal Mono Speaker Header
The internal mono speaker header allows connection to an internal, low-power speaker
for basic system sound capability. The subsystem is capable of driving a speaker load
of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link/Activity LED (green)
B Link Speed LED (green/yellow)
Figure 5. LAN Connector LED Locations
Table 5 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 5. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link/Activity Green
Link Speed Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/s data rate is selected or negotiated.
Green 100 Mbits/s data rate is selected or negotiated.
Yellow 1000 Mbits/s data rate is selected or negotiated.
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Product Description
1.13 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with power applied through the
power supply 5V STBY rail.
NOTE
If the battery and AC power fail date and time values will be reset and the user will be
notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Rear chassis fan header
B Thermal diode, located on processor die
C Processor fan header
D Front chassis fan header
Figure 6. Thermal Sensors and Fan Headers
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Product Description
1.15 Platform Management and Security
In addition to Intel AMT the Intel DQ57TML Desktop Board integrates several functions
designed to manage the system and lower the total cost of ownership (TCO) of the
system. These system management functions are designed to report errors, diagnose
the system, and recover from system lockups without the aid of an external
microcontroller.
1.15.1 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.15.1.1 Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
•Intel Quiet System Technology, delivering acoustically-optimized thermal
management
•Thermal sensors in the processor and PCH, as well as near the CPU voltage
regulators and system memory
•Monitoring of five system voltages (+5 V, +12 V, +3.3 V, Memory V-SM and
+V
CCP) to detect levels above or below acceptable values
•Thermally monitored closed-loop fan control for all three fans that can adjust fan
speed as needed
1.15.1.2 Fan Monitoring
Fan monitoring can be observed through the BIOS setup user interface, Intel® Desktop
Utilities or third-party software.
For information about Refer to
The functions of the fan headers Section 1.16.2.2, page 38
1.15.1.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 11, page 45
Intel® vPro™ Technology is a set of processor and platform capabilities designed to
enable greater proactive security, enhanced maintenance, and improved remote
management both inside and outside the corporate firewall. These include:
• Intel Active Management Technology (Intel AMT)
• Intel Virtualization Technology (Intel VT)
• Intel Trusted Execution Technology (Intel TXT)
• Intel Virtualization Technology for Directed I/O (Intel VT-d)
• Intel Remote PC Assist (Intel RPAT) / Intel Fast Call for Help
• Intel Trusted Platform Module (Intel TPM)
1.15.2.1 Intel
®
Active Management Technology
(Intel® AMT)
Intel Active Management Technology (Intel AMT) offers IT organizations tamperresistant and persistent management capabilities. Specifically, Intel
hardware-based solution that uses out of band communication to manage access to
client systems in addition to offering encrypted and persistent asset management and
remote diagnostics and/or recovery capabilities for networked platforms. With Intel
AMT, IT organizations can easily get accurate platform information, and can perform
remote updating, diagnostics, debugging and repair of a system, regardless of the
state of the operating system or the power state of the system.
The Intel Active Management Technology subsystem consists of:
• Intel ME microcontroller embedded in the Intel Q57 PCH
• Intel 82578DM Gigabit (10/100/1000 Mbits/s) Ethernet LAN controller
• BIOS/SPI Flash (64 Mbits)
• On-board Intel ME “M” state status LED
NOTE
Software with AMT capability is required to take advantage of Intel AMT platform
management capabilities.
AMT is a
1.15.2.1.1 Intel AMT Features
The key features of Intel AMT include:
•Secure Out of Band (OOB) system management that allows remote management
of PCs regardless of system power or operating system state.
⎯ SSL 3.1/TLS encryption
⎯ HTTP authentication
⎯ TCP/IP
⎯ HTTP web GUI
⎯ XML/SOAP API
⎯ Web Services for Management (WS-MAN) protocol support
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Product Description
•Remote troubleshooting and recovery that can significantly reduce desk-side visits
and potentially increasing efficiency of IT technical staff.
⎯ System event log
⎯ IDE Redirection (IDE-R) or PXE boot: remote CD or network drive boot
⎯ Serial over LAN
⎯ OOB diagnostics
⎯ Remote control
⎯ Operating system repair
• Proactive alerting that decreases downtime and minimizes time to repair.
⎯ Programmable policies
⎯ Operating system lock-up alert
⎯ Boot failure alert
⎯ Hardware failure alerts
• Third party non-volatile storage that prevents users from removing critical
inventory, remote control, or virus protection agents.
⎯ Nonvolatile storage for agents
⎯ Tamper-resistant
• Remote hardware and software asset tracking that eliminates time-consuming
manual inventory tracking, which also reduces asset accounting costs.
⎯ E-Asset Tag
⎯ HW/SW inventory
• System Defense 2. In addition to the in-bound and out-bound packet filtering of
the previous generation, System Defense 2 is an Intel AMT feature that uses
advanced heuristics to help protect against the propagation of worms through the
use of preset packet filters. The number of new connections made to a specific
port or IP address are counted over a specific time window. If a preset threshold is
exceeded, it will alert the Management Console and suspend the client’s network
activity until the system can be remediated.
•Remote Configuration (RCFG) minimizes the cost to deploy Intel AMT by
eliminating the need for IT personnel to touch each client system prior to
configuration. Remote Configuration consists of a single OEM BIOS/Firmware
image that provides the Intel AMT client with information to authenticate
connections and allows it to remotely perform a secure setup procedure. IT
departments must acquire an appropriate Intel AMT-trusted certificate as well as
use a remote management application that supports Remote Configuration.
Remote Configuration also requires the use of automatic IP addressing (DHCP).
•KVM (Keyboard-Video-Mouse) Redirection allows an IT administrator to remotely
control a user’s keyboard without having to rely on third-party software
applications. The user retains the ability to allow or discontinue the remote access
through on-screen pop-up windows.
NOTE
KVM Redirection requires the use of an Intel® processor with integrated
graphics.
NOTE
KVM Redirection requires enabling a new feature of the Intel® Q57 PCH Express
Chipset called the Rate Matching Hub (RMH). However, use of the RMH may
interfere with the operation of some legacy USB devices and require the user to
disable the RMH. This is done by enabling USB Backwards Compatibility Mode
in the BIOS Setup under Configuration / On-Board Devices / USB. This will, in
turn, disable KVM Redirection. USB Backwards Compatibility Mode is disabled
by default.
•PC Alarm Clock can wake the PC at scheduled times to run resource-intensive tasks
during off hours, improving security and performance of the platform.
Intel Virtualization Technology (Intel VT) is a processor technology that enables a
platform to run multiple operating systems and applications as independent machines,
allowing one computer system to function as multiple "virtual" systems. It also
provides the “assisted hardware virtualization” required by some operating systems for
backward compatibility, such as Windows XP Mode for Windows 7.
NOTE
Requires an Intel processor that supports Intel VT.
1.15.2.3 Intel
®
Virtualization Technology (Intel® VT)
®
Virtualization Technology for Directed I/O
(Intel® VT-d)
Intel Virtualization Technology for Directed I/O (Intel VT-d) compliments Intel VT by
providing the ability to isolate and restrict device accesses to the resources owned by
the virtual partition managing the device.
NOTE
Requires an Intel processor that supports Intel VT.
1.15.2.4 Intel
Intel Trusted Execution Technology (Intel TXT) helps protect the platform against
software-based attacks and preserves the confidentiality and integrity of the data
created and stored on the system. It accomplishes this by using a measured launch
and leveraging Intel VT to produce a protected environment for the execution of
sensitive applications.
NOTE
Requires an Intel processor that supports Intel TXT.
1.15.2.5 Intel
®
Trusted Execution Technology (Intel® TXT)
®
Remote PC Assist (Intel® RPAT) and Intel® Fast Call
for Help
Intel Remote PC Assist (Intel RPAT) provides a means for on-demand, reactive
maintenance for small and medium businesses. Out of band, it is activated by
pressing function key <F9> during the system’s Power On Self Test (POST).
Optionally, an integrator may chose to supply an external button connected to the
RPAT header that will serve the same function. To utilize Intel RPAT technology from
the desktop requires the installation of the Intel RPAT Client Agent, available for
download from Intel’s World Wide Web site.
Intel Fast Call for Help supplies remote maintenance connectivity for the Enterprise
user inside or outside the corporate firewall. Coupled with your enterprise’s
Management Presence Server, it provides both reactive and proactive maintenance.
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Product Description
Inside the firewall, this feature adapts Client Initiated Local Access (CILA); outside the
firewall it uses Client Initiated Remote Access (CIRA). This service is triggered in the
same manner as Intel RPAT.
Many of the features of Intel AMT are available with Intel RPAT and Intel Fast Call for
Help. These include Serial-over-LAN, IDE Redirection, KVM Redirection and PC Alarm
Clock.
NOTE
Intel Remote PC Assist Technology requires a vPro technology-enabled computer that
has an Intel Remote PC Assist Technology-enabled BIOS, a connection with a power
source and the Internet. This service operates via a wired LAN connection only and
requires a direct Internet connection (no proxy server) with the ability to connect to
external Internet locations (locations outside the local network). A remote service
provider supporting the Intel Remote PC Assist Technology must be used to perform
remote management. The Intel
®
Remote PC Assist Wizard application and third party
remote management software tools supporting Intel Remote PC Assist Technology
must be deployed on the target computer running one of the supported operating
systems in order to perform remote management operations. Use of the technology
may require configuration by the purchaser. Intel Remote PC Assist Technology is not
available in all geographies or on all computer systems.
For information about Refer to
The location of the Intel RPAT header Figure 11, page 45
Intel Remote PC Assist Technology http://www.intel.com/technology/product/remotepcassist.htm
1.15.2.6 Trusted Platform Module (TPM)
The Nuvoton WPCT210 TPM version 1.2 revision 103 component is specifically
designed to enhance platform security above-and-beyond the capabilities of today’s
software by providing a protected space for key operations and other security critical
tasks. Using both hardware and software, the TPM protects encryption and signature
keys at their most vulnerable stages—operations when the keys are being used
unencrypted in plain-text form. The TPM is specifically designed to shield unencrypted
keys and platform authentication information from software-based attacks.
For information about Refer to
Nuvoton TPM version 1.2 http://www.nuvoton-usa.com/
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
⎯ Power connector
⎯ Fan headers
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Wake from USB
⎯ Power Management Event signal (PME#) wake-up support
⎯ PCI Express WAKE# signal support
⎯ Wake from serial port
1.16.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with this board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
•Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 9 on page 36)
• Support for a front panel power and sleep mode switch
Table 7 lists the system states based on how long the power switch is pressed,
dependi
ng on how ACPI is configured with an ACPI-aware operating system.
Table 7. Effects of Pressing the Power Switch
If the system is in this
state…
Off
(ACPI G2/G5 – Soft off)
On
(ACPI G0 – working state)
On
(ACPI G0 – working state)
Sleep
(ACPI G1 – sleeping state)
Sleep
(ACPI G1 – sleeping state)
Note: System can only enter Standby state if power switch action is properly configured by the
operating system.
…and the power switch is
pressed for
Less than four seconds Power-on
Less than four seconds Soft-off/Standby (note)
More than six seconds Fail safe power-off
Less than four seconds Wake-up
More than six seconds Power-off
…the system enters this state
(ACPI G0 – working state)
(ACPI G1 – sleeping state)
(ACPI G2/G5 – Soft off)
(ACPI G0 – working state)
(ACPI G2/G5 – Soft off)
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Product Description
1.16.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 8 lists the power states supported by the board along with the associated
system power targets. See the AC
various system and power states.
Table 8. Power States and Targeted System Power
PI specification for a complete description of the
Global States Sleeping States
G0 – working
state
G1 – sleeping
state
G1 – sleeping
state
G1 – sleeping
state
G2/S5 S5 – Soft off.
G3 –
mechanical off
AC power is
disconnected
from the
computer.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
S0 – working C0 – working D0 – working
S1 – Processor
stopped
S3 – Suspend to
RAM. Context
saved to RAM.
S4 – Suspend to
disk. Context
saved to disk.
Context not saved.
Cold boot is
required.
No power to the
system.
Processor
States
C1 – stop
grant
No power D3 – no power
No power D3 – no power
No power D3 – no power
No power D3 – no power for
Device States
state.
D1, D2, D3 –
device
specification
specific.
except for
wake-up logic.
except for
wake-up logic.
except for
wake-up logic.
wake-up logic,
except when
provided by
battery or
external source.
Targeted System
Power
Full power > 30 W
5 W < power < 52.5 W
Power < 5 W
Power < 5 W
Power < 5 W
No power to the system.
Service can be performed
safely.
Table 9 lists the devices or specific events that can wake the computer from specific
states.
Table 9. Wake-up Devices and Events
These devices/events can wake up the computer… …from this state
Power switch S1, S3, S4, S5
RTC alarm S1, S3, S4, S5
LAN S1, S3, S4, S5
USB S1, S3
PME# signal S1, S3, S4, S5
WAKE# signal S1, S3, S4, S5
Serial port S1, S3
Notes:
• S4 implies operating system support only.
• USB ports are turned off during S4/S5 states.
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
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Product Description
1.16.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB
• PME# signal wake-up support
• WAKE# signal wake-up support
• Wake from serial port
• +5 V Standby Power Indicator LED
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.
1.16.2.1 Power Connector
ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.
For information about Refer to
The location of the main power connector Figure 11, page 45
The signal names of the main power connector Table 27, page 53
The function/operation of the fan headers is as follows:
• The fans are on when the board is in the S0 or S1 state
• The fans are off when the board is in the S3, S4, or S5 state
• Each fan header is wired to a fan tachometer input of the hardware monitoring and
fan control ASIC
•All fan headers support closed-loop fan control that can adjust the fan speed or
switch the fan on or off as needed
• All fan headers have a +12 V DC connection
• 4-pin fan headers are controlled by Pulse Width Modulation
• The front fan and rear fan headers also support linear fan control on 3-wire fans
For information about Refer to
The location of the fan headers Figure 11, page 45
The location of the fan headers and sensors for thermal monitoring Figure 6, page 26
1.16.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable
of providing adequate +5 V standby current. Failure to provide adequate standby
current when implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem monitors network traffic at the Media Independent Interface.
Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal
that powers up the computer.
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Product Description
1.16.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off and the front panel power LED will behave as configured by the
BIOS “S3 State Indicator” option). When signaled by a wake-up device or event, the
system quickly returns to its last known wake state. Table 9 on page 36 lists the
devices and events that can wake the computer from the S3 state.
The board supports the PC
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers.
I Bus Power Management Interface Specification. Add-in
1.16.2.5 Wake from USB
USB bus activity wakes the computer from ACPI S1 or S3 states.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB
and is supported by the operating system.
1.16.2.6 PME# Signal Wake-up Support
When the PME# signal on the Conventional PCI bus is asserted, the computer wakes
from an ACPI S1, S3, S4, or S5 state.
1.16.2.7 WAKE# Signal Wake-up Support
When the WAKE# signal on a PCI Express add-in card is asserted, the computer wakes
from an ACPI S1, S3, S4, or S5 state.
1.16.2.8 Wake from Serial Port
Serial port activity wakes the computer from an ACPI S1 or S3 state.
The green +5 V standby power indicator LED shows that power is still present even
when the computer appears to be off. Figure 8 shows the location of the Standby
Power indicator LED on the board.
CAUTION
If AC power has been switched off and the standby power indicators are still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
Figure 8. Location of the Standby Power LED (Green)
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2 Technical Reference
2.1 Memory Resources
2.1.1 Addressable Memory
The board utilizes 16 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM
(total system memory). On a system that has 16 GB of system memory installed, it is
not possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
• BIOS/SPI Flash device (64 Mbit)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• Front side bus interrupts (17 MB)
• PCI Express configuration space (256 MB)
• PCH base address registers PCI Express ports (up to 256 MB)
• Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI
Express add-in cards (256 MB)
The board provides the capability to reclaim the physical memory overlapped by the
memory mapped I/O logical address space. The board remaps physical memory from
the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical
address range located just above the 4 GB boundary. Figure 9 shows a schematic of
the system memory map. All installed system memory can be used when there is no
overlap of system addresses.
Address Range (decimal) Address Range (hex) Size Description
1024 K - 16777216 K 100000 - 3FFFFFFFF 16382 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
Technical Reference
memory (open to the PCI
Conventional bus). Dependent on
video adapter used.
memory manager software)
2.2 Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: Back panel
and front panel USB, PS/2, and IEEE 1394a (optional).
The other internal connectors and headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors or headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB header single wire connectors may
eventually overload the overcurrent protection and cause damage to the board.
This section describes the board’s connectors. The connectors can be divided into
these groups:
• Back panel I/O connectors
• Component-side I/O connectors and headers (see page 45)
Figure 10 shows the location of the back panel connectors for the board.
Item Description
A PS/2 keyboard/mouse port
B USB ports
C VGA output
D Parallel port
E DVI-D output
F LAN
G USB ports
H Audio line in
I Mic in
J Audio line out
Figure 10. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
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Technical Reference
2.2.2 Component-side Connectors and Headers
Figure 11 shows the locations of the component-side connectors and headers.
Figure 11. Component-side Connectors and Headers
Table 11 lists the component-side connectors and headers identified in Figure 11.
Table 11. Component-side Connectors and Headers Shown in Figure 11
Item/callout
from Figure 11 Descript
A PCI Conventional bus add-in card connector
B PCI Express x1 bus add-in card connector
C PCI Express x1 bus add-in card connector
D PCI Express x16 bus add-in card connector
E 12 V internal power connector (ATX12V)
F Rear chassis fan header
G Processor fan header
H Front chassis fan header
I Chassis intrusion header
J Diskette drive connector
K Main power connector (2 x 12)
L SATA connectors
M Alternate front panel power LED header
N Front panel header
O Front panel USB header (with Intel Z-U130 USB Solid-State Drive, or compatible
device, support)
P Front panel USB headers (3)
Q Intel Remote PC Assist header
R Serial port header
S S/PDIF header
T Front panel audio header
U Internal mono speaker header
ion
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Technical Reference
2.2.2.1 Signal Tables for the Connectors and Headers
Table 12. Serial Port Header
Pin Signal Name Pin Signal Name
1 DCD (Data Carrier Detect) 2 RXD# (Receive Data)
3 TXD# (Transmit Data) 4 DTR (Data Terminal Ready)
5 Ground 6 DSR (Data Set Ready)
7 RTS (Request To Send) 8 CTS (Clear To Send)
9 RI (Ring Indicator) 10 Key (no pin)
Table 13. Parallel Port Header
Pin Standard Signal Name ECP Signal Name EPP Signal Name
The board has the following add-in card connectors:
•One PCI Express 2.0 x16: this connector supports simultaneous transfer speeds of
up to 8 GB/s of peak bandwidth per direction.
•Two PCI Express 2.0 x1: each of these connectors support simultaneous transfer
speeds of up to 500 MB/s of peak bandwidth per direction.
•One Conventional PCI (rev 2.3 compliant) connector.
Note the following considerations for the Conventional PCI bus connector:
• The Conventional PCI bus connector is bus master capable.
• SMBus signals are routed to the Conventional PCI bus connector. This enables
Conventional PCI bus add-in boards with SMBus support to access sensor data on
the desktop board. The specific SMBus signals are as follows:
⎯ The SMBus clock line is connected to pin A40.
⎯ The SMBus data line is connected to pin A41.
2.2.2.3 Power Supply Connectors
The board has the following power supply connectors:
•Main power – a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, pins 11, 12, 23, and
24 must remain unconnected.
•Processor core power – a 2 x 2 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
CAUTION
If a high power (75 W or greater) add-in card is installed in the PCI Express x16
connector, that card must also be connected directly to the power supply. Failure to
do so may cause damage to the board and the add-in card.
Table 26. Processor Core Power Connector
Pin Signal Name Pin Signal Name
1 Ground 2 Ground
3 +12 V 4 +12 V
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Technical Reference
Table 27. Main Power Connector
Pin Signal Name Pin Signal Name
1 +3.3 V 13 +3.3 V
2 +3.3 V 14 −12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 −5 V (obsolete)
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
(Note)
(Note)
23 +5 V
24 Ground
11 +12 V
12 +3.3 V 2 x 12 connector detect
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
(Note)
(Note)
For information about Refer to
Power supply considerations Section 2.6.1 on page 61
This section describes the functions of the front panel header. Table 28 lists the signal
names of the front panel header. Figure 12 is a connection diagram for the front panel
header.
Table 28. Front Panel Header
Pin Signal
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED
3 HDA# Out Hard disk active
Reset Switch On/Off Switch
5 Ground Ground 6 PWR# In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected
In/
Out Description
pull-up to +5 V
LED
Pin Signal
2 FP_LED+ Out Front panel green
4 FP_LED−Out Front panel yellow
In/
Out Description
LED
LED
Figure 12. Connection Diagram for Front Panel Header
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Technical Reference
2.2.2.4.1 Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires one of the
following:
• SATA storage device connected to an onboard SATA connector
• PATA storage device connected to the onboard PATA connector
• Intel Z-U130 USB Solid State Drive (or compatible device) connected to one of the
front panel USB headers
2.2.2.4.2 Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.4.3 Power LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 29 shows the default
states for thi
s LED. More options are available through BIOS setup.
Table 29. States for a One-Color Power LED
LED State Description
Off Power off/sleeping
Steady Lit Running
Blink Standby
2.2.2.4.4 Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
2.2.2.5 Alternate Front Panel Power LED Header
Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 30. Alternate Front Panel Power LED Header
Pin Signal Name In/Out Description
1 FP_LED+ Out FP_LED+
2 Not connected
3 FP_LED− Out FP_LED−
Figure 13 is a connection diagram for the front panel USB headers.
NOTE
• The +5 V DC power on the USB headers is fused.
• Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.
Figure 13. Connection Diagram for Front Panel USB Headers
Figure 13. Connection Diagram for Front Panel USB Header
(with Intel Z-U130 USB Solid-State Drive, or Compatible Device, Support)
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Technical Reference
2.3 BIOS Configuration Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 14 shows the location of the jumper block. The 3-pin jumper block determines
the BIOS Setup program’s mode. Table 31 describes the jumper settings for the three
modes: normal, configure, and recovery.
The BIOS uses current configuration information and
passwords for booting.
After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
Note that this Configure mode is the only way to clear the
BIOS/CMOS settings. Press F9 (restore defaults) while in
Configure mode to restore the BIOS/CMOS settings to their
default values.
Recovery None
The BIOS attempts to recover the BIOS configuration. A
recovery CD or USB flash drive is required.
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Technical Reference
2.4 Intel
(Intel
The Intel® MEBX reset header (see Figure 15) allows you to reset the Intel AMT
configuration to the factory defaults. Momentarily shorting pins 1 and 2 with a jumper
(not supplied) will accomplish the following:
• Return all Intel ME parameters to their default values.
• Delete any user entered information, including PID/PPS and user entered Hash
Certificates. USB key and remote configuration data will be removed if the
parameters are not default parameters.
•Reset the Intel MEBX password to the default value (admin).
®
Management Engine BIOS Extension
®
MEBx) Reset Header
Table 32. Intel MEBx Reset Header Signals
Pin Function
1 PCH.AK24 (PCH_RTCRST_PULLUP)
2 Ground
3 No connection
The board is designed to fit into a microATX form-factor chassis. Figure 16 illustrates
the mechanical form factor for the board. Dimensions are given in inches
[millimeters]. The outer dimensions are 9.60 inches by 9.60 inches
[243.84 millimeters by 243.84 millimeters]. Location of the I/O connectors and
mounting holes are in compliance with the ATX specification.
60
Figure 16. Board Dimensions
Page 61
Technical Reference
2.6 Electrical Considerations
2.6.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
• The potential relation between 3.3 VDC and +5 VDC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances
For example, for a system consisting of a supported 95 W processor (see Section 1.4
on page 14 for information on supported processors), 2 GB DDR3 RAM, one high end
video card, one hard disk drive, one optical drive, and all board peripherals enabled,
the minimum recommended power supply is 460 W. Table 33 lists the recommended
power supply current values.
Table 33. Recommended Power Supply Current Values
Output Voltage 3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB
Current 22 A 20 A 16 A 16 A 0.3 A 1.5 A
For information about Refer to
Selecting an appropriate power supply http://www.intel.com/support/motherboards/desktop/sb/C
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 34 lists the current capability of the fan headers.
Table 34. Fan Header Current Capability
Fan Header Maximum Available Current
Processor fan 2.0 A
Front chassis fan 1.5 A
Rear chassis fan 1.5 A
2.6.3 Add-in Board Considerations
The board is designed to provide 2 A (average) of current for each add-in board from
the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board
(all expansion slots filled) must not exceed the system’s power supply +5 V maximum
current.
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Technical Reference
2.7 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan
inlet is required. Use of a processor heat sink that provides omni-directional airflow to
maintain required airflow across the processor voltage regulator area is highly
recommended. For a list of chassis that have been tested with Intel desktop boards
please refer to the following website:
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
The ambient temperature must not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.9.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit.
Figure 17 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel Q57 Express Chipset
Figure 17. Localized High Temperature Zones
Table 35 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 35. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel Q57 Express Chipset 111 oC (under bias)
For information about Refer to
Processor datasheets and specification updates Section 1.3, page 14
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Technical Reference
2.8 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia Issue 2,
Method I Case 3 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to
estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is
253,261 hours.
2.9 Environmental
Table 36 lists the environmental specifications for the board.
Table 36. Environmental Specifications
Parameter Specification
Temperature
Non-Operating
Operating
Shock Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
The board uses an Intel BIOS that is stored in a 64 Mbit (8,192 KB) Serial Peripheral
Interface Flash Memory (SPI Flash) device which can be updated using a set of
utilities. The SPI Flash contains the BIOS Setup program, POST, LAN EEPROM
information, Plug and Play support, and other firmware.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as TMIBX10H.86A.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.
Maintenance Main Configuration Performance Security Power Boot Intel ME Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 57 shows how to put the board in configure mode.
Table 37 lists the BIOS Setup program menu features.
Table 37. BIOS Setup Program Menu Bar
Maintenance Main
Clears
passwords
and displays
processor
Displays
processor and
memory
configuration
information
Configuration
Configures
advanced
features
available
through the
chipset
Performance
Configures
Memory and
Processor
overrides
Security Power
Sets
passwords
and
security
features
Configures
power
management
features
Table 38 lists the function keys available for menu screens.
Table 38. BIOS Setup Program Function Keys
Boot Intel ME Exit
Selects
boot
options
Configure
Intel ME
and Intel
AMT
settings
Saves or
discards
changes to
Setup
program
options
BIOS Setup Program
Function Key
<←> or <→>
<↑> or <↓>
<Tab> Selects sub-items within a field (i.e., date/time)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
Description
Selects a different menu screen (Moves the cursor left or right)
Selects an item (Moves the cursor up or down)
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Overview of BIOS Features
3.2 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
3.3 Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating
system’s USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.
®
Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB drive), or an optical drive.
®
F7 switch allows a user to select where the BIOS .bio file is located and
perform the update from that location/device. Similar to performing a BIOS
Recovery without removing the BIOS configuration jumper.
022312.htm.
3.4.1 Language Support
The BIOS Setup program and help messages are supported in US English.
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Overview of BIOS Features
3.4.2 Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is
available from Intel can be used to create a custom splash screen.
It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 39 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootabl
level.
e however, it must contain the motherboard .bio file at the root
Table 39. Acceptable Drives/Media Types for BIOS Recovery
Media Type Can be used for BIOS recovery?
Optical drive connected to the SATA interface Yes
USB removable drive (a USB Flash Drive, for example) Yes
USB diskette drive (with a 1.44 MB diskette) No
USB hard disk drive No
Legacy diskette drive (with a 1.44 MB diskette) connected to the
In the BIOS Setup program, the user can choose to boot from a hard drive, optical
drive, removable drive, or the network. The default setting is for the optical drive to
be the first boot device, the hard drive second, removable drive third, and the network
fourth.
3.6.1 Optical Drive Boot
Booting from the optical drive is supported in compliance to the El Torito bootable
CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the
optical drive is listed as a boot device. Boot devices are defined in priority order.
Accordingly, if there is not a bootable CD in the optical drive, the system will attempt
to boot from the next defined drive.
3.6.2 Network Boot
The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.6.3 Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
• Video adapter
• Keyboard
• Mouse
3.6.4 Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices. Table 40 lists the boot device menu
options.
Table 40. Boot Device Menu Options
Boot Device Menu Function Keys Description
<↑> or <↓>
<Enter> Exits the menu, and boots from the selected device
<Esc> Exits the menu and boots according to the boot priority
Selects a default boot device
defined through BIOS setup
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Overview of BIOS Features
3.7 Hard Disk Drive Password Security Feature
The Hard Disk Drive Password Security feature blocks read and write accesses to the
hard disk drive until the correct password is given. Hard Disk Drive Passwords are set
in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3
resume, the system BIOS will automatically unlock drives on resume from S3.
The User hard disk drive password, when installed, will be required upon each powercycle until the Master Key or User hard disk drive password is submitted.
The Master Key hard disk drive password, when installed, will not lock the drive. The
Master Key hard disk drive password exists as an unlock override in the event that the
User hard disk drive password is forgotten. Only the installation of the User hard disk
drive password will cause a hard disk to be locked upon a system power-cycle.
Table 41 shows the effects of setting the Hard Disk Drive Passwords.
Table 41. Master Key and User Hard Drive Password Functions
Password Set Password During Boot
Neither None
Master only None
User only User only
Master and User Set Master or User
During every POST, if a User hard disk drive password is set, POST execution will
pause with the following prompt to force the user to enter the Master Key or User hard
disk drive password:
Enter Hard Disk Drive Password:
Upon successful entry of the Master Key or User hard disk drive password, the system
will continue with normal POST.
If the hard disk drive password is not correctly entered, the system will go back to the
above prompt. The user will have three attempts to correctly enter the hard disk drive
password. After the third unsuccessful hard disk drive password attempt, the system
will halt with the message:
Hard Disk Drive Password Entry Error
A manual power cycle will be required to resume system operation.
NOTE
As implemented on DQ57TML, Hard Disk Drive Password Security is only supported on
SATA port 0. The passwords are stored on the hard disk drive so if the drive is
relocated to another SATA port or computer that does not support Hard Disk Drive
Password Security feature, the drive will not be accessible.
Hard Disk Drive Password Security is not supported in PCH RAID mode. Secured hard
disk drives attached to the system when the system is in PCH RAID mode will not be
accessible due to the disabling of BIOS Hard Disk Drive Password support.
3.8 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
•The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
•The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
•If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
•If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
•Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
•For enhanced security, use different passwords for the supervisor and user
passwords.
•Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
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Overview of BIOS Features
Table 42 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 42. Supervisor and User Password Functions
Password
Set
Neither Can change all
Supervisor
only
User only N/A Can change all
Supervisor
and user set
Note: If no password is set, any user can change all Setup options.
The board-mounted piezoelectric speaker provides audible error code (beep code)
information during POST.
For information about Refer to
The location of the onboard speaker Figure 1, page 11
4.2 BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS causes the board’s
piezoelectric speaker to beep an error message describing the problem (see Table 43).
Table 43. BIOS Beep Codes
Type Pattern Frequency/Comments
F2 Setup/F10 Boot Menu
Prompt
BIOS update in progress None
Video error (no add-in
graphics card installed)
Memory error On-off (1.0 second each) three times, then
Thermal trip warning Alternate high and low beeps (1.0 second each)
One 0.5 second beep when BIOS is ready to
accept keyboard input
On-off (1.0 second each) two times, then
2.5-second pause (off), entire pattern repeats
(beeps and pause) once and the BIOS will
continue to boot.
2.5-second pause (off), entire pattern repeats
(beeps and pause) until the system is powered
off.
for eight beeps, followed by system shut down.
932 Hz
932 Hz
For processors requiring an
add-in graphics card
Whenever a recoverable error occurs during POST, the BIOS causes the board’s front
panel power LED to blink an error message describing the problem (see Table 44).
Table 44. Front-panel Power LED Blink Codes
Type Pattern Note
F2 Setup/F10 Boot Menu
Prompt
BIOS update in progress Off when the update begins, then on for
Video error (no add-in
graphics card installed)
Memory error On-off (1.0 second each) three times, then
Thermal trip warning Each beep will be accompanied by the following
None
0.5 seconds, then off for 0.5 seconds. The
pattern repeats until the BIOS update is
complete.
On-off (1.0 second each) two times, then
2.5-second pause (off), entire pattern repeats
(blink and pause) until the system is powered
off.
2.5-second pause (off), entire pattern repeats
(blinks and pause) until the system is powered
off.
blink pattern: .25 seconds On, .25 seconds Off,
.25 seconds On, .25 seconds Off. This will result
in a total of 16 blinks.
For processors requiring an
add-in graphics card
4.4 BIOS Error Messages
Table 45 lists the error messages and provides a brief description of each.
Table 45. BIOS Error Messages
Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.
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Error Messages and Beep Codes
4.5 Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display.
NOTE
The POST card must be installed in the PCI bus connector.
The following tables provide information about the POST codes generated by the
BIOS:
• Table 46 lists the Port 80h POST code ranges
• Table 47 lists the Port 80h POST codes themselves
• Table 48 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 46. Port 80h POST Code Ranges
Range Category/Subsystem
00 – 0F Debug codes: Can be used by any PEIM/driver for debug.
10 – 1F Host Processors: 1F is an unrecoverable CPU error.
20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 – 3F Recovery: 3F indicated recovery failure.
40 – 4F Reserved for future use.
50 – 5F I/O Busses: PCI, USB, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 – 6F Reserved for future use (for new busses).
70 – 7F Output Devices: All output consoles. 7F is an unrecoverable error.
80 – 8F Reserved for future use (new output console codes).
90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 – AF Reserved for future use (new input console codes).
B0 – BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 – CF Reserved for future use.
D0 – DF Boot device selection.
E0 – FF E0 – EE: Miscellaneous codes. See Table 47.
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
24 Programming timing parameters in the memory controller and the DIMMs
25 Configuring memory
26 Optimizing memory settings
27 Initializing memory, such as ECC init
29 Memory testing completed
50 Enumerating PCI busses
51 Allocating resources to PCI bus
52 Hot Plug PCI controller initialization
53 – 57 Reserved for PCI Bus
58 Resetting USB bus
59 Reserved for USB
5A Resetting PATA/SATA bus and all devices
5B Reserved for ATA
5C Resetting SMBus
5D Reserved for SMBus
70 Resetting the VGA controller
71 Disabling the VGA controller
72 Enabling the VGA controller
78 Resetting the console controller
79 Disabling the console controller
7A Enabling the console controller
Host Processor
Chipset
Memory
PCI Bus
USB
ATA/ATAPI/SATA
SMBus
Local Console
Remote Console
continued
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Error Messages and Beep Codes
Table 47. Port 80h POST Codes (continued)
POST Code Description of POST Operation
90 Resetting keyboard
91 Disabling keyboard
92 Detecting presence of keyboard
93 Enabling the keyboard
94 Clearing keyboard input buffer
95 Instructing keyboard controller to run Self Test (PS/2 only)
B0 Resetting fixed media
B1 Disabling fixed media
B2 Detecting presence of a fixed media (hard drive detection etc.)
B3 Enabling/configuring a fixed media
B8 Resetting removable media
B9 Disabling removable media
BA Detecting presence of a removable media (CD-ROM detection, etc.)
BC Enabling/configuring a removable media
DyTrying boot selection y (y=0 to 15)
E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2 Permanent memory found
E1, E3 Reserved for PEI/PEIMs
E4 Entered DXE phase
E5 Started dispatching drivers
E6 Started connecting drivers
E7 Waiting for user input
E8 Checking password
E9 Entering BIOS setup
EB Calling Legacy Option ROMs
F4 Entering Sleep state
F5 Exiting Sleep state
F8 EFI boot service ExitBootServices ( ) has been called
F9 EFI runtime service SetVirtualAddressMap ( ) has been called
FA EFI runtime service ResetSystem ( ) has been called
30 Crisis Recovery has initiated per user request
31 Crisis Recovery has initiated by software (corrupt flash)
34 Loading recovery capsule
35 Handing off control to the recovery capsule
3F Unable to recover
Runtime Phase/EFI OS Boot
DXE Drivers
PEIMs/Recovery
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Table 48. Typical Port 80h POST Sequence
POST Code Description
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
25 Configuring memory
28 Testing memory
34 Loading recovery capsule
E4 Entered DXE phase
12 Starting application processor initialization
13 SMM initialization
50 Enumerating PCI busses
51 Allocating resourced to PCI bus
92 Detecting the presence of the keyboard
90 Resetting keyboard
94 Clearing keyboard input buffer
95 Keyboard Self Test
EB Calling Video BIOS
58 Resetting USB bus
5A Resetting PATA/SATA bus and all devices
92 Detecting the presence of the keyboard
90 Resetting keyboard
94 Clearing keyboard input buffer
5A Resetting PATA/SATA bus and all devices
28 Testing memory
90 Resetting keyboard
94 Clearing keyboard input buffer
E7 Waiting for user input
01 INT 19
00 Ready to boot
We, Intel Corporation, declare under our sole responsibility that the product Intel®
Desktop Board DQ57TML is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC
(ROHS Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC,
2006/95/EC, and 2002/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC,
2006/95/EC a 2002/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC, 2006/95/EC & 2002/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC, 2006/95/EC & 2002/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja
2002/95/EC kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC
määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC, 2006/95/EC & 2002/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC, 2006/95/EC & 2002/95/EC.
ΕλληνικάΤο παρόνπροϊόνακολουθείτιςδιατάξειςτωνΕυρωπαϊκώνΟδηγιών
2004/108/EC, 2006/95/EC και 2002/95/EC.
Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai
Irányelv előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC, 2006/95/EC, & 2002/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,
2006/95/EC & 2002/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un
2002/95/EC noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir
2002/95/EC nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC, 2006/95/EC u 2002/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC, 2006/95/EC & 2002/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC, 206/95/EC i 2002/95/EC.
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Regulatory Compliance and Battery Disposal Information
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC,
2006/95/EC & 2002/95/EC.
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC,
2006/95/EC & 2002/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC, 2006/95/EC a 2002/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC,
2006/95/EC in 2002/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC,
2006/95/EC & 2002/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC
yönergelerine uyar.
5.1.3 Product Ecology Statements
The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1 Disposal Considerations
This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2 Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intel’s branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
中文
作为其对环境责任之承诺的部分,英特尔已实施 Intel Product Recycling Program
(英特尔产品回收计划),以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作
恰当的重复使用处理。
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für
ordnungsgemäßes Recycling zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology
para ver los detalles
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envío, términos y condiciones, etc.
Français
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en œuvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits usés en les retournant à des adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology
savoir plus sur ce programme, à savoir les produits concernés, les adresses
disponibles, les instructions d'expédition, les conditions générales, etc.
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology
untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology
(em Inglês)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponíveis, as instruções de envio, os termos e condições, etc.
88
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Regulatory Compliance and Battery Disposal Information
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана
программа утилизации продукции Intel (Product Recycling Program) для
предоставления конечным пользователям марок продукции Intel возможности
возврата используемой продукции в специализированные пункты для должной
утилизации.
программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya
koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
The Intel Desktop Board DQ57TML complies with the EMC regulations stated in
Table 50 when correctly installed in a compatible host system.
Table 50. EMC Regulations
Regulation Title
FCC 47 CFR Part 15,
Subpart B
ICES-003 Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022 Limits and methods of measurement of Radio Interference Characteristics
EN55024 Information Technology Equipment – Immunity Characteristics Limits and
EN55022 Australian Communications Authority, Standard for Electromagnetic
CISPR 22 Limits and methods of measurement of Radio Disturbance Characteristics of
CISPR 24 Information Technology Equipment – Immunity Characteristics – Limits and
VCCI V-3, V-4 Voluntary Control for Interference by Information Technology Equipment.
KN-22, KN-24 Korean Communications Commission – Framework Act on
CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
Frequency Devices. (USA)
of Information Technology Equipment. (European Union)
methods of measurement. (European Union)
Compatibility. (Australia and New Zealand)
Information Technology Equipment. (International)
Methods of Measurement. (International)
(Japan)
Telecommunications and Radio Waves Act (South Korea)
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.
For questions related to the EMC performance of this product, contact:
Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the
following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to an outlet on a circuit other than the one to which the
receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel
Corporation could void the user’s authority to operate the equipment.
Tested to comply with FCC standards for home or office use.
Canadian Department of Communications Compliance Statement
This digital apparatus does not exceed the Class B limits for radio noise emissions from
digital apparatus set out in the Radio Interference Regulations of the Canadian
Department of Communications.
Le présent appareil numerique német pas de bruits radioélectriques dépassant les
limites applicables aux appareils numériques de la classe B prescrites dans le
Réglement sur le broullage radioélectrique édicté par le ministére des Communications
du Canada.
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Japan VCCI Statement
Japan VCCI Statement translation: This is a Class B product based on the standard of
the Voluntary Control Council for Interference from Information Technology Equipment
(VCCI). If this is used near a radio or television receiver in a domestic environment, it
may cause radio interference. Install and use the equipment according to the
instruction manual.
Korea Class B Statement
Korea Class B Statement translation: This equipment is for home use, and has
acquired electromagnetic conformity registration, so it can be used not only in
residential areas, but also other areas..
The US Department of Energy and the US Environmental Protection Agency have
continually revised the ENERGY STAR requirements. Intel has worked directly with
these two governmental agencies in the definition of new requirements.
Intel Desktop Board DQ57TML meets the following program requirements in an
adequate system configuration, including appropriate selection of an efficient power
supply:
• Energy Star v5.0, category A
• EPEAT*
• Korea e-Standby
• European Union Energy-related Products Directive 2009 (ErP)
For information about Refer to
ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar
Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/
Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02/
pg02100300.asp
European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s
Regulatory Compliance and Battery Disposal Information
5.1.6 Regulatory Compliance Marks (Board Level)
Intel Desktop Board DQ57TML has the regulatory compliance marks shown in
Table 51.
Table 51. Regulatory Compliance Marks
Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel Desktop Boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment.
CE mark. Declaring compliance to the European Union (EU) EMC directive,
Low Voltage directive, and RoHS directive.
Australian Communications Authority (ACA) and New Zealand Radio Spectrum
Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code
number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique
UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Desktop Boards and associated collateral. The color
of the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined
to be 10 years.
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRÉCAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
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PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYÁZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей
должна проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
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