Intel DQ57TM, DQ57TML, BLKDQ57TM Specification
Intel® Desktop Board
DQ57TML
Technical Product Specification
Order Number: E98643-001US
The Intel® Desktop Board DQ57TML may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DQ57TML Specification Update.
June 2010
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DQ57TML Technical Product
Specification
This product specification applies to only the standard Intel® Desktop Board DQ57TML with BIOS
identifier TMIBX10H.86A.
Changes to this specification will be published in the Intel Desktop Board DQ57TML Specification
Update before being incorporated into a revision of this document.
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®
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desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
June 2010
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deviate from published specifications. Current characterized errata are available on request.
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Copyright © 2010, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
®
Intel
Desktop Board DQ57TML.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DQ57TML and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DQ57TML
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DQ57TML Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 Intel® Q57 Express Chipset............................................................... 15
1.6 System Memory .............................................................................. 15
1.6.1 Memory Configurations ......................................................... 16
1.7 Graphics Subsystem ........................................................................ 18
1.7.1 Integrated Graphics.............................................................. 18
1.7.2 PCI Express x16 Graphics ...................................................... 18
1.8 USB............................................................................................... 19
1.9 SATA Interfaces .............................................................................. 19
1.10 Legacy I/O Controller....................................................................... 20
1.10.1 Serial Port ........................................................................... 20
1.11 Audio Subsystem............................................................................. 21
1.11.1 Audio Subsystem Software .................................................... 21
1.11.2 Audio Headers and Connectors ............................................... 22
1.12 LAN Subsystem............................................................................... 23
1.12.1 Intel® 82578DM Gigabit Ethernet Controller ............................. 23
1.12.2 LAN Subsystem Software....................................................... 23
1.12.3 RJ-45 LAN Connector with Integrated LEDs .............................. 24
1.13 Real-Time Clock Subsystem .............................................................. 25
1.14 Thermal Monitoring.......................................................................... 26
1.15 Platform Management and Security.................................................... 27
1.15.1 Hardware Management Subsystem ......................................... 27
1.15.2 Intel® vPro™ Technology....................................................... 28
1.16 Power Management ......................................................................... 34
1.16.1 ACPI................................................................................... 34
1.16.2 Hardware Support ................................................................ 37
2 Technical Reference
2.1 Memory Resources .......................................................................... 41
2.1.1 Addressable Memory............................................................. 41
2.1.2 Memory Map........................................................................ 43
2.2 Connectors and Headers................................................................... 43
2.2.1 Back Panel Connectors .......................................................... 44
2.2.2 Component-side Connectors and Headers ................................ 45
2.3 BIOS Configuration Jumper Block....................................................... 57
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Intel Desktop Board DQ57TML Technical Product Specification
2.4 Intel® Management Engine BIOS Extension (Intel® MEBx)
Reset Header.................................................................................. 59
2.5 Mechanical Considerations ................................................................ 60
2.5.1 Form Factor......................................................................... 60
2.6 Electrical Considerations ................................................................... 61
2.6.1 Power Supply Considerations ................................................. 61
2.6.2 Fan Header Current Capability................................................ 62
2.6.3 Add-in Board Considerations .................................................. 62
2.7 Thermal Considerations .................................................................... 63
2.8 Reliability ....................................................................................... 65
2.9 Environmental ................................................................................ 65
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 67
3.2 System Management BIOS (SMBIOS)................................................. 69
3.3 Legacy USB Support ........................................................................ 69
3.4 BIOS Updates ................................................................................. 70
3.4.1 Language Support ................................................................ 70
3.4.2 Custom Splash Screen .......................................................... 71
3.5 BIOS Recovery................................................................................ 71
3.6 Boot Options................................................................................... 72
3.6.1 Optical Drive Boot ................................................................ 72
3.6.2 Network Boot....................................................................... 72
3.6.3 Booting Without Attached Devices........................................... 72
3.6.4 Changing the Default Boot Device During POST ........................ 72
3.7 Hard Disk Drive Password Security Feature ......................................... 73
3.8 BIOS Security Features .................................................................... 74
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 77
4.2 BIOS Beep Codes ............................................................................ 77
4.3 Front-panel Power LED Blink Codes .................................................... 78
4.4 BIOS Error Messages ....................................................................... 78
4.5 Port 80h POST Codes ....................................................................... 79
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 85
5.1.1 Safety Standards.................................................................. 85
5.1.2 European Union Declaration of Conformity Statement................ 86
5.1.3 Product Ecology Statements................................................... 87
5.1.4 EMC Regulations .................................................................. 89
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 92
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 93
5.2 Battery Disposal Information............................................................. 94
vi
Contents
Figures
1. Major Board Components.................................................................. 11
2. Block Diagram ................................................................................ 13
3. Memory Channel and DIMM Configuration........................................... 17
4. Back Panel Audio Connectors ............................................................ 22
5. LAN Connector LED Locations............................................................ 24
6. Thermal Sensors and Fan Headers ..................................................... 26
7. Location of the Intel ME “M” State LED ............................................... 31
8. Location of the Standby Power LED (Green) ........................................ 40
9. Detailed System Memory Address Map ............................................... 42
10. Back Panel Connectors ..................................................................... 44
11. Component-side Connectors and Headers ........................................... 45
12. Connection Diagram for Front Panel Header ........................................ 54
13. Connection Diagram for Front Panel USB Headers ................................ 56
14. Location of the Jumper Block............................................................. 57
15. Intel MEBx Reset Header .................................................................. 59
16. Board Dimensions ........................................................................... 60
17. Localized High Temperature Zones..................................................... 64
Tables
1. Feature Summary.............................................................................. 9
2. Components Shown in Figure 1 ......................................................... 12
3. Supported Memory Configurations ..................................................... 15
4. Audio Jack Retasking Support ........................................................... 21
5. LAN Connector LED States................................................................ 24
6. Intel ME “M” State LED Behavior........................................................ 31
7. Effects of Pressing the Power Switch
8. Power States and Targeted System Power
9. Wake-up Devices and Events ............................................................ 36
10. System Memory Map ....................................................................... 43
11. Component-side Connectors and Headers Shown in Figure 11................ 46
12. Serial Port Header ........................................................................... 47
13. Parallel Port Header ......................................................................... 47
14. S/PDIF Header ................................................................................ 48
15. Internal Mono Speaker Header .......................................................... 48
16. Front Panel Audio Header for Intel HD Audio........................................ 48
17. Front Panel IEEE 1394a Header (optional)........................................... 48
18. Front Panel Audio Header for AC ’97 Audio
19. Front Panel USB Header ................................................................... 49
20. SATA Connectors............................................................................. 49
21. Chassis Intrusion Header.................................................................. 50
22. Processor (4-Pin) Fan Header............................................................ 50
23. Front and Rear Chassis Fan Headers .................................................. 50
24. Intel Remote PC Assist Technology Header.......................................... 50
25. Diskette Drive Connector.................................................................. 51
26. Processor Core Power Connector........................................................ 52
.................................................. 34
........................................... 35
.......................................... 49
vii
Intel Desktop Board DQ57TML Technical Product Specification
27. Main Power Connector...................................................................... 53
28. Front Panel Header .......................................................................... 54
29. States for a One-Color Power LED...................................................... 55
30. Alternate Front Panel Power LED Header............................................. 55
31. BIOS Setup Configuration Jumper Settings
.......................................... 58
32. Intel MEBx Reset Header Signals ....................................................... 59
33. Recommended Power Supply Current Values ....................................... 61
34. Fan Header Current Capability........................................................... 62
35. Thermal Considerations for Components
............................................. 64
36. Environmental Specifications............................................................. 65
37. BIOS Setup Program Menu Bar.......................................................... 68
38. BIOS Setup Program Function Keys
39. Acceptable Drives/Media Types for BIOS Recovery
.................................................... 68
............................... 71
40. Boot Device Menu Options ................................................................ 72
41. Master Key and User Hard Drive Password Functions ............................ 73
42. Supervisor and User Password Functions............................................. 75
43. BIOS Beep Codes ............................................................................ 77
44. Front-panel Power LED Blink Codes.................................................... 78
45. BIOS Error Messages ....................................................................... 78
46. Port 80h POST Code Ranges.............................................................. 79
47. Port 80h POST Codes ....................................................................... 80
48. Typical Port 80h POST Sequence........................................................ 83
49. Safety Standards............................................................................. 85
50. EMC Regulations ............................................................................. 89
51. Regulatory Compliance Marks............................................................ 93
viii
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Chipset
Memory
Graphics
Audio
Peripheral
Interfaces
Legacy I/O Control
MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
®
• Intel
Intel
Hub (PCH)
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb and 2 Gb memory technology
• Support for up to 16 GB of system memory with four DIMMs using 2 Gb
• Support for non-ECC memory
• Support for unbuffered ECC memory with Intel Xeon processor 3400 series
• Integrated graphics support for processors with Intel
• Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
• Intel
• Twelve USB 2.0 ports:
• Four SATA interfaces through the Intel Q57 Express Chipset with Intel
• Two IEEE 1394a ports via internal headers for front panel cabling (optional)
• One serial port header
• One parallel port on the back panel
• One diskette drive connector
• One PS/2* keyboard/mouse port on the back panel
• Nuvoton* W83677 Super I/O controller for hardware management and serial
Core™ i7, Intel® Core™ i5, Intel® Core™ i3, Intel® Pentium® processors,
and Intel
― Integrated graphics processing (processors with Intel
― External graphics interface controller
― Integrated memory controller
memory technology
― DVI-D
― VGA
― Realtek* ALC662 audio codec
― S/PDIF audio header
― Four ports are implemented with stacked back panel connectors
― Eight front panel ports are implemented through four dual-port internal
Storage Technology (Intel
port, parallel port, PS/2, and diskette drive support
®
Xeon® processor 3400 series in an LGA1156 socket:
Technology)
®
Q57 Express Chipset consisting of the Intel
®
High Definition Audio:
headers; one header supports a Intel
compatible device
®
RST) RAID support
®
Graphics
®
Q57 Platform Controller
®
Graphics Technology:
®
Z-U130 USB Solid-State Drive (or
®
Rapid
continued
9
Intel Desktop Board DQ57TML Technical Product Specification
Table 1. Feature Summary (continued)
®
BIOS
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
Instantly Available
PC Technology
• Support for PCI* Local Bus Specification Revision 2.2
• Support for PCI Express*
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, serial, and USB ports
LAN Support Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82578DM Gigabit
Ethernet Controller
Expansion
Capabilities
• One PCI Express 2.0 x16 add-in card connector
• Two PCI Express 2.0 x1 add-in card connectors
• One Conventional PCI bus connector
Hardware Monitor
• Intel
Subsystem
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers using PWM control
• 4-pin headers for processor, front, and rear fans
• 4-wire and 3-wire (linear) fan speed control support for front and rear fans
• Support for Platform Environmental Control Interface (PECI)
Intel® vPro™
Technology
• Intel
• Intel
• Intel
• Intel
• Intel
• Intel
• Intel
BIOS resident in the SPI Flash device
and SMBIOS
®
Quiet System Technology (Intel® QST) implemented through Intel®
Management Engine (Intel
®
Active Management Technology (Intel® AMT) 6.0
®
Trusted Execution Technology (Intel® TXT)
®
Remote PC Assist (Intel® RPAT)
®
Fast Call for Help
®
Virtualization Technology (Intel® VT)
®
Virtualization Technology for Directed I/O (Intel® VT-d)
®
Trusted Platform Module (Intel® TPM)
®
ME) in the Intel Q57 PCH
10
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board
DQ57TML.
Product Description
Table 2 lists the components identified in Figure 1.
Figure 1. Major Board Components
11
Intel Desktop Board DQ57TML Technical Product Specification
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Descript
A Conventional PCI bus add-in card connector
B PCI Express x1 add-in card connector
C Battery
D PCI Express x1 add-in card connector
E Piezoelectric speaker
F PCI Express x16 add-in card connector
G Back panel connectors
H 12 V internal power connector (ATX12V)
I Rear chassis fan header
J LGA1156 processor socket
K Processor fan header
L DIMM Channel A sockets (2)
M DIMM Channel B sockets (2)
N Front chassis fan header
O Chassis intrusion header
P Diskette drive connector
Q Main power connector (2 x 12)
R SATA connectors
S Alternate front panel power LED header
T Front panel header
U Standby power LED
V Front panel USB header (with Intel Z-U130 USB Solid-State Drive, or compatible
device, support)
W Intel ME “M” state LED
X Intel Q57 Express Chipset
Y Front panel USB headers (3)
Z BIOS setup configuration jumper block
AA Intel® Management Engine BIOS Extension (Intel® MEBx) Reset header
BB Intel Remote PC Assist header
CC Serial port header
DD S/PDIF header
EE Front panel audio header
FF Internal mono speaker header
ion
12
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
13
Intel Desktop Board DQ57TML Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No Parallel ATA (PATA) IDE drive connector
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DQ57TML http://www.intel.com/products/desktop/motherboards/DQ57TML/DQ
57TML-overview.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board DQ57TML
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.4 Processor
The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, Intel
Pentium processors, and Intel Xeon processor 3400 series in an LGA1156 socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum TDP of 95 W. See the Intel web site listed below for the
most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.6.1 on page 61 for information on power supply requirements for this board.
14
Product Description
1.5 Intel
®
Q57 Express Chipset
The Intel Q57 Express Chipset consisting of the Intel Q57 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network,
display, Conventional PCI, and PCI Express x1 interfaces. The PCH is a centralized
controller for the board’s I/O paths.
For information about Refer to
The Intel Q57 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6 System Memory
The board has four DIMM sockets and supports the following memory features:
• Two independent memory channels with interleaved mode support
• Support for non-ECC, unbuffered, single-sided or double-sided DIMMs with x8
organization
• Support for unbuffered ECC memory when used with an Intel Xeon processor
3400 series
• 16 GB maximum total system memory (with 2 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
• Minimum total system memory: 1 GB using 1 Gb x8 module
• Serial Presence Detect
• DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Capacity
1024 MB SS 1 Gbit 1 Gb x8/empty 8
2048 MB DS 1 Gbit 1 Gb x8/1 Gb x8 16
2048 MB SS 2 Gbit 2 Gb x8/empty 8
4096 MB DS 2 Gbit 2 Gb x8/2 Gb x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
Configuration
(Note)
SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
15
Intel Desktop Board DQ57TML Technical Product Specification
For information about… Refer to:
Tested Memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
1.6.1 Memory Configurations
The Intel Core i7, Intel Core i5, Intel Core i3, Intel Pentium processors, and Intel Xeon
processors 3400 series support the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
16
Figure 3 illustrates the memory channel and DIMM configuration.
Product Description
Figure 3. Memory Channel and DIMM Configuration
NOTE
When using a processor without Intel Graphics Technology, there must always be
memory installed into any or both of the DIMM 0 (blue) memory sockets for the
system to boot.
17
Intel Desktop Board DQ57TML Technical Product Specification
1.7 Graphics Subsystem
The board supports system graphics through either Intel Graphics Technology or a
PCI Express 2.0 x16 add-in graphics card.
1.7.1 Integrated Graphics
The board supports integrated graphics through the Intel® Flexible Display Interface
®
(Intel
1.7.1.1 Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x
1536 (QXGA) at a 75 Hz refresh rate.
The VGA port is enabled for POST whenever a monitor is attached, regardless of the
DVI-D connector status.
1.7.1.2 Digital Visual Interface (DVI-D)
FDI) for processors with Intel Graphics Technology.
The DVI-D port supports only digital DVI displays. The maximum supported resolution
is 2048 x 1536 at 75 Hz refresh (QXGA). The DVI-D port is compliant with the
DVI 1.0 specification.
1.7.2 PCI Express x16 Graphics
The Intel Core i7, Intel Core i5, Intel Core i3, Intel Pentium processors, and Intel Xeon
processors 3400 series in an LGA1156 socket support discrete add in graphics cards
through the PCI Express 2.0 x16 graphics connector:
• Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
direction (500 MB/s) per lane. Maximum theoretical bandwidth on interface is
8 GB/s in each direction, simultaneously, when operating in x16 mode.
• Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (250 MB/s) per lane. Maximum theoretical bandwidth on interface is
4 GB/s in each direction, simultaneously, when operating in x16 mode.
For information about Refer to
PCI Express technology http://www.pcisig.com
18
Product Description
1.8 USB
The board supports up to twelve USB 2.0 ports through two EHCI host controllers on
the PCH that allow the use of EHCI-compatible drivers.
The port arrangement is as follows:
• Four ports are implemented with stacked back panel connectors
• Eight front panel ports are implemented through four dual-port internal headers;
one header supports an Intel Z-U130 USB Solid-State Drive (or compatible device)
For information about Refer to
The location of the USB connectors on the back panel Figure 10, page 44
The location of the front panel USB headers Figure 11, page 45
1.9 SATA Interfaces
The board provides four SATA connectors through the PCH, which support one device
per connector.
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
3 Gb/s per port. A point-to-point interface is used for host to device connections.
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Windows* XP, Windows Vista*, and Windows 7* operating
systems.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 11, page 45
.
1.9.1.1 Serial ATA RAID
The board supports the Intel Rapid Storage Technology (Intel RST) which provides the
following RAID (Redundant Array of Independent Drives) levels:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
19
Intel Desktop Board DQ57TML Technical Product Specification
1.9.1.2 Intel
®
Rapid Recover Technology
The board incorporates the Intel® Rapid Recover Technology (Intel® RRT). Intel Rapid
Recover Technology is a feature of Intel Rapid Storage Technology. It uses RAID 1
(mirroring) functionality to copy data from a designated master drive to a designated
recovery drive. The master drive data can be copied to the recovery drive either
continuously or on request.
When using the continuous update policy, changes made to the data on the master
drive while the recovery drive is disconnected or offline are automatically copied to the
recovery drive when it is reconnected. When using the on request update policy, the
master drive data can be restored to a previous state by copying the data on the
recovery drive back to the master drive.
For information about Refer to
Intel Rapid Recovery Technology http://www.intel.com/support/chipsets/
imsm/sb/CS-026142.htm
1.10 Legacy I/O Controller
The Legacy I/O Controller provides the following features:
• One serial port header
• One diskette drive connector
• One parallel port connector on the back panel
• PS/2 keyboard/mouse port on the back panel
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional
bus systems
• Intelligent power management, including a programmable wake-up event interface
• PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the Legacy I/O controller.
1.10.1 Serial Port
The serial port is implemented as a 10-pin header on the board. The serial port
supports data transfers at speeds up to 115.2 kbits/s with BIOS support.
For information about Refer to
The location of the serial port header Figure 11, page 45
20
Product Description
1.11 Audio Subsystem
The board supports Intel High Definition Audio through the Realtek ALC662-VC audio
codec.
The Realtek ALC662-VC-based audio subsystem supports the following features:
• 6-channel audio with independent multi-streaming stereo.
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output through back panel jacks
• Headphone and Mic in functions for front panel audio jacks
• S/PDIF audio header
• A signal-to-noise (S/N) ratio of 90 dB
NOTE
Systems built with an AC ‘97 audio front panel will not be able to obtain the Microsoft
Windows Vista logo.
Table 4 lists the supported functions of the front panel and back panel audio jacks.
Table 4. Audio Jack Retasking Support
Audio Jack
FP Green Default
FP Pink Default
Rear Blue Default
Rear Green Ctrl panel Default
Rear Pink Default
Microphone
Head-
phones
Front
Speaker Line In
Mic In
1.11.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 14
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Intel Desktop Board DQ57TML Technical Product Specification
1.11.2 Audio Headers and Connectors
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include the
following:
• Front panel audio (a 2 x 5-pin header that provides headphone and mic in signals
for front panel audio connectors) (yellow)
• S/PDIF audio header (1 x 4-pin header) (yellow)
• Internal mono speaker header (1 x 2-pin header) (yellow)
For information about Refer to
The locations of the front panel audio header, S/PDIF header, and
internal mono speaker header
The signal names of the front panel audio header Table 16 and Table 18, page 48
The signal names of the S/PDIF header Table 14, page 48
The signal names of the internal mono speaker header Table 15, page 48
The back panel audio connectors Section 2.2.1, page 44
Figure 11, page 45
1.11.2.1 Analog Audio Connectors
The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A Audio line in
B Audio line out
C Mic in
Figure 4. Back Panel Audio Connectors
The back panel audio connectors are configurable through the audio device drivers.
For information about Refer to
The back panel audio connectors Section 2.2.1, page 44
The front panel headphone output is supported using a separate audio channel pair
allowing multi-streaming audio configurations such as stereo audio conferencing
(through a front panel headset).
22
Product Description
1.11.2.2 S/PDIF Header
The S/PDIF header allows connections to coaxial or optical dongles for digital audio
output.
1.11.2.3 Internal Mono Speaker Header
The internal mono speaker header allows connection to an internal, low-power speaker
for basic system sound capability. The subsystem is capable of driving a speaker load
of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).
1.12 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82578DM Gigabit Ethernet Controller (10/100/1000 Mbits/s)
• RJ-45 LAN connector with integrated status LEDs
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
1.12.1 Intel
The Intel 82578DM Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• PCI Express link
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Transmit TCP segmentation
• Full device driver compatibility
• PCI Express power management support
• Intel AMT 6.0
®
82578DM Gigabit Ethernet Controller
1.12.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
23
Intel Desktop Board DQ57TML Technical Product Specification
1.12.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link/Activity LED (green)
B Link Speed LED (green/yellow)
Figure 5. LAN Connector LED Locations
Table 5 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 5. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link/Activity Green
Link Speed Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/s data rate is selected or negotiated.
Green 100 Mbits/s data rate is selected or negotiated.
Yellow 1000 Mbits/s data rate is selected or negotiated.
24
Product Description
1.13 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with power applied through the
power supply 5V STBY rail.
NOTE
If the battery and AC power fail date and time values will be reset and the user will be
notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
25
Intel Desktop Board DQ57TML Technical Product Specification
1.14 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Rear chassis fan header
B Thermal diode, located on processor die
C Processor fan header
D Front chassis fan header
Figure 6. Thermal Sensors and Fan Headers
26
Product Description
1.15 Platform Management and Security
In addition to Intel AMT the Intel DQ57TML Desktop Board integrates several functions
designed to manage the system and lower the total cost of ownership (TCO) of the
system. These system management functions are designed to report errors, diagnose
the system, and recover from system lockups without the aid of an external
microcontroller.
1.15.1 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.15.1.1 Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
• Intel Quiet System Technology, delivering acoustically-optimized thermal
management
• Thermal sensors in the processor and PCH, as well as near the CPU voltage
regulators and system memory
• Monitoring of five system voltages (+5 V, +12 V, +3.3 V, Memory V-SM and
+V
CCP) to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control for all three fans that can adjust fan
speed as needed
1.15.1.2 Fan Monitoring
Fan monitoring can be observed through the BIOS setup user interface, Intel® Desktop
Utilities or third-party software.
For information about Refer to
The functions of the fan headers Section 1.16.2.2, page 38
1.15.1.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 11, page 45
27
Intel Desktop Board DQ57TML Technical Product Specification
1.15.2 Intel® vPro™ Technology
Intel® vPro™ Technology is a set of processor and platform capabilities designed to
enable greater proactive security, enhanced maintenance, and improved remote
management both inside and outside the corporate firewall. These include:
• Intel Active Management Technology (Intel AMT)
• Intel Virtualization Technology (Intel VT)
• Intel Trusted Execution Technology (Intel TXT)
• Intel Virtualization Technology for Directed I/O (Intel VT-d)
• Intel Remote PC Assist (Intel RPAT) / Intel Fast Call for Help
• Intel Trusted Platform Module (Intel TPM)
1.15.2.1 Intel
®
Active Management Technology
(Intel® AMT)
Intel Active Management Technology (Intel AMT) offers IT organizations tamperresistant and persistent management capabilities. Specifically, Intel
hardware-based solution that uses out of band communication to manage access to
client systems in addition to offering encrypted and persistent asset management and
remote diagnostics and/or recovery capabilities for networked platforms. With Intel
AMT, IT organizations can easily get accurate platform information, and can perform
remote updating, diagnostics, debugging and repair of a system, regardless of the
state of the operating system or the power state of the system.
The Intel Active Management Technology subsystem consists of:
• Intel ME microcontroller embedded in the Intel Q57 PCH
• Intel 82578DM Gigabit (10/100/1000 Mbits/s) Ethernet LAN controller
• BIOS/SPI Flash (64 Mbits)
• On-board Intel ME “M” state status LED
NOTE
Software with AMT capability is required to take advantage of Intel AMT platform
management capabilities.
AMT is a
1.15.2.1.1 Intel AMT Features
The key features of Intel AMT include:
• Secure Out of Band (OOB) system management that allows remote management
of PCs regardless of system power or operating system state.
⎯ SSL 3.1/TLS encryption
⎯ HTTP authentication
⎯ TCP/IP
⎯ HTTP web GUI
⎯ XML/SOAP API
⎯ Web Services for Management (WS-MAN) protocol support
28
Product Description
• Remote troubleshooting and recovery that can significantly reduce desk-side visits
and potentially increasing efficiency of IT technical staff.
⎯ System event log
⎯ IDE Redirection (IDE-R) or PXE boot: remote CD or network drive boot
⎯ Serial over LAN
⎯ OOB diagnostics
⎯ Remote control
⎯ Operating system repair
• Proactive alerting that decreases downtime and minimizes time to repair.
⎯ Programmable policies
⎯ Operating system lock-up alert
⎯ Boot failure alert
⎯ Hardware failure alerts
• Third party non-volatile storage that prevents users from removing critical
inventory, remote control, or virus protection agents.
⎯ Nonvolatile storage for agents
⎯ Tamper-resistant
• Remote hardware and software asset tracking that eliminates time-consuming
manual inventory tracking, which also reduces asset accounting costs.
⎯ E-Asset Tag
⎯ HW/SW inventory
• System Defense 2. In addition to the in-bound and out-bound packet filtering of
the previous generation, System Defense 2 is an Intel AMT feature that uses
advanced heuristics to help protect against the propagation of worms through the
use of preset packet filters. The number of new connections made to a specific
port or IP address are counted over a specific time window. If a preset threshold is
exceeded, it will alert the Management Console and suspend the client’s network
activity until the system can be remediated.
• Remote Configuration (RCFG) minimizes the cost to deploy Intel AMT by
eliminating the need for IT personnel to touch each client system prior to
configuration. Remote Configuration consists of a single OEM BIOS/Firmware
image that provides the Intel AMT client with information to authenticate
connections and allows it to remotely perform a secure setup procedure. IT
departments must acquire an appropriate Intel AMT-trusted certificate as well as
use a remote management application that supports Remote Configuration.
Remote Configuration also requires the use of automatic IP addressing (DHCP).
29
Intel Desktop Board DQ57TML Technical Product Specification
• KVM (Keyboard-Video-Mouse) Redirection allows an IT administrator to remotely
control a user’s keyboard without having to rely on third-party software
applications. The user retains the ability to allow or discontinue the remote access
through on-screen pop-up windows.
NOTE
KVM Redirection requires the use of an Intel® processor with integrated
graphics.
NOTE
KVM Redirection requires enabling a new feature of the Intel® Q57 PCH Express
Chipset called the Rate Matching Hub (RMH). However, use of the RMH may
interfere with the operation of some legacy USB devices and require the user to
disable the RMH. This is done by enabling USB Backwards Compatibility Mode
in the BIOS Setup under Configuration / On-Board Devices / USB. This will, in
turn, disable KVM Redirection. USB Backwards Compatibility Mode is disabled
by default.
• PC Alarm Clock can wake the PC at scheduled times to run resource-intensive tasks
during off hours, improving security and performance of the platform.
For information about Refer to
Intel Active Management Technology (Intel AMT)
http://www.intel.com/technology/platformtechnology/intel-amt/index.htm
1.15.2.1.2 Intel AMT Software and Drivers
Intel AMT software and drivers are available from Intel’s World Wide Web site. The
package usually consists of the following components:
• Intel
®
Management Engine Interface (Intel® ME Interface)
• Serial Over LAN (SOL) driver
• Local Manageability Service (LMS)
• User Notification Service (UNS)
®
ME WMI provider
®
Active Management Technology NAC Posture Plug-in
®
Control Center
®
Management and Security Status Application
®
Remote PC Assist Technology Client Agent
• Intel
• Intel
• Intel
• Intel
• Intel
For information about Refer to
Obtaining Intel AMT software and drivers Section 1.3, page 14
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