Intel BLKDP965LTCK - Conroe LGA775 1066 800FSB DDR2 Audio Lan SATA ATX 10Pack Motherboard, DP965LT, BOXDP965LTCK Specification

Intel® Desktop Board DP965LT
Technical Product Specification
The Intel® Desktop Board DP965LT may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DP965LT Specification Update.
September 2006
Order Number: D56017-002US
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DP965LT Technical Product Specification.
-002 Second release of the Intel® Desktop Board DP965LT Technical Product Specification. Changes in the following areas:
Updated supported processors in
Updated supported total memory in
Listed specific SPD timings for DDR2 800 DIMMs in Section
Updated supported memory configurations in
Added Integrator’s Note to Section
Channel A, DIMM 0 always be populated.
Revisions to Section
retasking support.
Added a new subsection, DC Loading, within Section
subsection includes
Updated component maximum temperature values in
Added Chapter 5. Moved battery disposal information from Chapter 1
to Chapter 5. Moved regulatory compliance information from Chapter 2 to Chapter 5.
Table 30, DC Loading Characteristics.
June 2006
September 2006
Table 1 and Section 1.3.
Table 1 and Section 1.4.
1.4.
Table 3.
1.4.1 regarding requirement that
1.7, Audio Subsystem, to clarify audio jack
2.10. New
Table 32.
ii
Disclaimer
This product specification applies to only the standard Intel® Desktop Board DP965LT with BIOS identifier MQ96510A.86A.
Changes to this specification will be published in the Intel Desktop Board DP965LT Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
®
desktop boards may contain design defects or errors known as errata, which may cause the product
Intel to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from:
Intel Corporation P.O. Box 5937 Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777, Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel, the Intel logo, Pentium, and Celeron are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2006, Intel Corporation. All rights reserved.
iii
Intel Desktop Board DP965LT Technical Product Specification
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board DP965LT. It describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board DP965LT and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
®
Chapter Description
1 A description of the hardware used on the board 2 A map of the resources of the bard 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes 5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
#
Integrator’s notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
v
Intel Desktop Board DP965LT Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1,073,741,824 bits) KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/sec 1000 bits per second MB Megabyte (1,048,576 bytes) MB/sec Megabytes per second Mbit Megabit (1,048,576 bits) Mbit/sec Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
1 Product Description
1.1 Overview........................................................................................ 12
1.1.1 Feature Summary ................................................................ 12
1.1.2 Board Layout ....................................................................... 14
1.1.3 Block Diagram ..................................................................... 16
1.2 Online Support................................................................................ 17
1.3 Processor ....................................................................................... 17
1.4 System Memory .............................................................................. 18
1.4.1 Memory Configurations ......................................................... 20
1.5 Intel® P965 Express Chipset ............................................................. 26
1.5.1 USB ................................................................................... 26
1.5.2 Serial ATA Interfaces ............................................................ 26
1.5.3 Parallel IDE Interface ............................................................ 27
1.5.4 Real-Time Clock, CMOS SRAM, and Battery .............................. 28
1.6 Legacy I/O Controller ....................................................................... 28
1.6.1 Serial Port........................................................................... 28
1.6.2 Parallel Port......................................................................... 28
1.6.3 Diskette Drive Controller ....................................................... 29
1.6.4 Keyboard and Mouse Interface ............................................... 29
1.7 Audio Subsystem............................................................................. 30
1.7.1 Audio Subsystem Software .................................................... 30
1.7.2 Audio Connectors and Headers ............................................... 31
1.8 LAN Subsystem ............................................................................... 32
1.8.1 Intel® 82566DC Gigabit Ethernet Controller ............................. 32
1.8.2 LAN Subsystem Software....................................................... 33
1.8.3 RJ-45 LAN Connector with Integrated LEDs .............................. 33
1.9 Hardware Management Subsystem .................................................... 34
1.9.1 Hardware Monitoring and Fan Control...................................... 34
1.9.2 Fan Monitoring..................................................................... 34
1.9.3 Chassis Intrusion and Detection.............................................. 34
1.9.4 Thermal Monitoring .............................................................. 35
1.10 Power Management ......................................................................... 36
1.10.1 ACPI .................................................................................. 36
1.10.2 Hardware Support ................................................................ 38
2 Technical Reference
2.1 Memory Map................................................................................... 43
2.1.1 Addressable Memory............................................................. 43
2.2 DMA Channels................................................................................. 45
2.3 Fixed I/O Map ................................................................................. 46
2.4 PCI Configuration Space Map ............................................................ 47
2.5 Interrupts ...................................................................................... 48
2.6 PCI Interrupt Routing Map ................................................................ 49
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Intel Desktop Board DP965LT Technical Product Specification
2.7 Connectors and Headers................................................................... 50
2.7.1 Back Panel Connectors .......................................................... 51
2.7.2 Component-side Connectors and Headers ................................ 52
2.8 Jumper Block .................................................................................. 60
2.9 Mechanical Considerations ................................................................ 61
2.9.1 Form Factor......................................................................... 61
2.9.2 I/O Shield ........................................................................... 62
2.10 Electrical Considerations................................................................... 63
2.10.1 DC Loading.......................................................................... 63
2.10.2 Fan Header Current Capability................................................ 63
2.10.3 Add-in Board Considerations .................................................. 64
2.10.4 Power Supply Considerations ................................................. 64
2.11 Thermal Considerations.................................................................... 65
2.12 Reliability....................................................................................... 67
2.13 Environmental ................................................................................ 67
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 69
3.2 BIOS Flash Memory Organization ....................................................... 70
3.3 Resource Configuration .................................................................... 70
3.3.1 PCI Autoconfiguration ........................................................... 70
3.3.2 PCI IDE Support................................................................... 71
3.4 System Management BIOS (SMBIOS)................................................. 71
3.5 Legacy USB Support ........................................................................ 72
3.6 BIOS Updates ................................................................................. 72
3.6.1 Language Support ................................................................ 73
3.6.2 Custom Splash Screen .......................................................... 73
3.7 BIOS Recovery................................................................................ 73
3.8 Boot Options................................................................................... 74
3.8.1 CD-ROM Boot ...................................................................... 74
3.8.2 Network Boot....................................................................... 74
3.8.3 Booting Without Attached Devices........................................... 74
3.8.4 Changing the Default Boot Device During POST ........................ 74
3.9 Adjusting Boot Speed....................................................................... 75
3.9.1 Peripheral Selection and Configuration..................................... 75
3.9.2 BIOS Boot Optimizations ....................................................... 75
3.10 BIOS Security Features .................................................................... 76
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 77
4.2 BIOS Beep Codes ............................................................................ 77
4.3 BIOS Error Messages ....................................................................... 77
4.4 Port 80h POST Codes ....................................................................... 78
viii
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 83
5.1.1 Safety Regulations................................................................ 83
5.1.2 European Union Declaration of Conformity Statement................ 84
5.1.3 Product Ecology Statements................................................... 86
5.1.4 EMC Regulations .................................................................. 89
5.1.5 Product Certification Markings (Board Level)............................. 90
5.2 Battery Disposal Information............................................................. 91
Figures
1. Major Board Components.................................................................. 14
2. Block Diagram ................................................................................ 16
3. Memory Channel and DIMM Configuration........................................... 21
4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs............ 22
5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs ......... 22
6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs ........... 23
7. Single Channel (Asymmetric) Mode Configuration with One DIMM .......... 24
8. Single Channel (Asymmetric) Mode Configuration with Three DIMMs....... 24
9. Flex Mode Configuration with Two DIMMs............................................ 25
10. LAN Connector LED Locations ............................................................ 33
12. Thermal Sensors and Fan Headers ..................................................... 35
13. Location of the Standby Power Indicator LED ....................................... 41
14. Detailed System Memory Address Map ............................................... 44
15. Back Panel Connectors ..................................................................... 51
16. Component-side Connectors and Headers ........................................... 52
17. Connection Diagram for Front Panel Header ........................................ 57
18. Connection Diagram for Front Panel USB Headers ................................ 59
19. Connection Diagram for IEEE 1394a Header ........................................ 59
20. Location of the Jumper Block............................................................. 60
21. Board Dimensions ........................................................................... 61
22. I/O Shield Dimensions...................................................................... 62
23. Localized High Temperature Zones..................................................... 66
Tables
1. Feature Summary............................................................................ 12
2. Board Components Shown in Figure 1 ................................................ 15
3. Supported Memory Configurations ..................................................... 18
4. Memory Operating Frequencies ......................................................... 19
5. Audio Jack Retasking Support ........................................................... 30
6. LAN Connector LED States ................................................................ 33
7. Effects of Pressing the Power Switch .................................................. 36
8. Power States and Targeted System Power........................................... 37
9. Wake-up Devices and Events ............................................................ 38
10. System Memory Map ....................................................................... 45
11. DMA Channels................................................................................. 45
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Intel Desktop Board DP965LT Technical Product Specification
12. I/O Map ......................................................................................... 46
13. PCI Configuration Space Map ............................................................ 47
14. Interrupts ...................................................................................... 48
15. PCI Interrupt Routing Map ................................................................ 49
16. Component-side Connectors and Headers Shown in Figure 16................ 53
17. HD Audio Link Header ...................................................................... 54
18. Front Panel Audio Header ................................................................. 54
19. Serial ATA Connectors ...................................................................... 54
20. Serial Port Header ........................................................................... 54
21. Chassis Intrusion Header .................................................................. 55
22. Front and Rear Chassis Fan Headers .................................................. 55
23. Processor and Auxiliary Rear Chassis Fan Headers............................... 55
24. Processor Core Power Connector........................................................ 56
25. Main Power Connector...................................................................... 56
26. Front Panel Header .......................................................................... 57
27. States for a One-Color Power LED ...................................................... 58
28. States for a Two-Color Power LED ...................................................... 58
29. BIOS Setup Configuration Jumper Settings.......................................... 60
30. DC Loading Characteristics ............................................................... 63
31. Fan Header Current Capability........................................................... 63
32. Thermal Considerations for Components ............................................. 66
33. Desktop Board DP965LT Environmental Specifications........................... 67
34. BIOS Setup Program Menu Bar .......................................................... 70
35. BIOS Setup Program Function Keys.................................................... 70
36. Acceptable Drives/Media Types for BIOS Recovery ............................... 73
37. Boot Device Menu Options ................................................................ 74
38. Supervisor and User Password Functions............................................. 76
39. Beep Codes .................................................................................... 77
40. BIOS Error Messages ....................................................................... 77
41. Port 80h POST Code Ranges.............................................................. 78
42. Port 80h POST Codes ....................................................................... 79
43. Typical Port 80h POST Sequence........................................................ 82
44. Safety Regulations........................................................................... 83
45. Lead-Free Board Markings ................................................................ 88
46. EMC Regulations ............................................................................. 89
47. Product Certification Markings ........................................................... 90
x
1 Product Description
What This Chapter Contains
1.1 Overview........................................................................................ 12
1.2 Online Support................................................................................ 17
1.3 Processor ....................................................................................... 17
1.4 System Memory .............................................................................. 18
1.5 Intel® P965 Express Chipset ............................................................. 26
1.6 Legacy I/O Controller ....................................................................... 28
1.7 Audio Subsystem............................................................................. 30
1.8 LAN Subsystem ............................................................................... 32
1.9 Hardware Management Subsystem .................................................... 34
1.10 Power Management ......................................................................... 36
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Intel Desktop Board DP965LT Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Desktop Board DP965LT.
Table 1. Feature Summary
Form Factor ATX (11.60 inches by 9.60 inches [294.64 millimeters by 243.84 millimeters]) Processor Support for the following:
®
Intel
Intel
Intel
Intel
Intel
Memory
Chipset
Audio 6-channel (5.1) audio subsystem using the SigmaTel* STAC9227 audio codec Legacy I/O Control Legacy I/O controller for diskette drive, serial, parallel, and PS/2* ports USB Support for USB 2.0 devices
Peripheral Interfaces
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel® 82566DC
BIOS
Instantly Available PC Technology
Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
Support for DDR2 800, DDR2 667, or DDR2 533 MHz DIMMs
Support for up to 8 GB of system memory using DDR2 667 or DDR2 533
Support for up to 4 GB of system memory using DDR2 800 DIMMs
Intel
Intel
Intel
10 USB ports
Two IEEE-1394a interfaces: one back panel connector and one front-panel
Four Serial ATA IDE interfaces
One Parallel ATA IDE interface with UDMA 33, ATA-66/100/133 support
One diskette drive interface
One serial port
One parallel port
Gigabit Ethernet Controller
Intel
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
Support for PCI Local Bus Specification Revision 2.3
Support for PCI Express* Revision 1.0a
Suspend to RAM support
Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
Core™2 Extreme processor in an LGA775 socket with a 1066 MHz
system bus
®
Core™2 Duo processor in an LGA775 socket with a 1066 or 800 MHz
system bus
®
Pentium® D processor in an LGA775 socket with an 800 or 533 MHz
system bus
®
Pentium® 4 processor in an LGA775 socket with an 800 or 533 MHz
system bus
®
Celeron® D processor in an LGA775 socket with a 533 MHz system bus
DIMMs
®
P965 Express Chipset, consisting of:
®
82P965 Memory Controller Hub (MCH)
®
82801HB I/O Controller Hub (ICH8)
header
®
BIOS (resident in the SPI Flash device)
and SMBIOS
continued
12
Table 1. Feature Summary (continued)
Expansion Capabilities
Hardware Monitor Subsystem
For information about Refer to
Available configurations for the Desktop Board DP965LT Section 1.2, page 17
One PCI Express x16 bus add-in card connector
Three PCI Express x1 bus add-in card connectors
Three PCI Conventional* bus connectors
®
Intel
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
Four fan headers
Three fan sense inputs used to monitor fan activity
Quiet System Technology for acoustically-optimized thermal
management
Product Description
13
Intel Desktop Board DP965LT Technical Product Specification
1.1.2 Board Layout
Figure 1 shows the location of the major components.
Table 2 lists the components identified in Figure 1.
14
Figure 1. Major Board Components
Table 2. Board Components Shown in Figure 1
Item/callout from
Figure 1 Description
A Rear chassis fan header B PCI Express x1 connector C PCI Express x1 connector D High Definition Audio Link header E PCI Conventional bus add-in card connector F Front panel audio header G PCI Conventional bus add-in card connector H PCI Express x1 connector
I PCI Express x16 connector
J Back panel connectors K Processor core power connector L Rear chassis fan connector M LGA775 processor socket N Intel 82P965 MCH O Processor fan header P DIMM Channel A sockets Q Serial port header R DIMM Channel B sockets S Diskette drive connector T Main Power connector U Battery V Front chassis fan header
W Chassis intrusion header
X Intel 82801HB I/O Controller Hub (ICH8) Y BIOS Setup configuration jumper block Z Auxiliary front panel power LED header
AA Front panel header BB Serial ATA connectors [4] CC Speaker DD Parallel ATE IDE connector EE Front panel USB headers [2]
FF IEEE-1394a header
GG PCI Conventional bus add-in card connector
Product Description
15
Intel Desktop Board DP965LT Technical Product Specification
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
PCI Express x1 Slot 1
PCI Express x1 Slot 2
PCI Express x1 Slot 3
Parallel ATA
IDE
Connector
LGA775
Processor
Socket
Intel P965 Express Chipset
PCI Express
x16 Interface
PCI Express
x16
Connector
Channel A DIMMs (2)
PCI Express x1 Interface
Parallel ATA
IDE
Controller
System Bus
(1066/800/533
MHz)
Intel 82P965
Memory
Controller Hub
(MCH)
Dual-Channel
Memory Bus
SMBus
Gigabit Ethernet
Controller
USB
Legacy
I/O
Controller
LPC Bus
Intel 82801HB
I/O Controller Hub
(ICH8)
DMI Interconnect
Serial ATA
IDE Interface
Back Panel/Front
USB Ports
Serial Port Parallel Port PS/2 Mouse
PS/2 Keyboard
Diskette Drive
Peripheral
Interface (SPI)
Flash Device
Serial ATA IDE
Connectors (4)
LAN
Connector
Panel
Connector
Serial
Channel B
DIMMs (2)
IEEE-1394a
Connector/Header
PCI Slot 1
PCI Slot 2
PCI Slot 3
IEEE-1394a
Controller
PCI Bus
PCI Bus
High Definition Audio Link
SMBus
Figure 2. Block Diagram
Audio
Codec
Mic In
Line Out
Line In/Retasking Jack
Line Out/Retasking Jack
Mic In/Retasking Jack
High Definition
Audio Link
Header
OM18402
16
Product Description
1.2 Online Support
To find information about… Visit this World Wide Web site:
Intel® Desktop Board DP965LT under “Desktop Board Products” or “Desktop Board Support”
Available configurations for the Desktop Board DP965LT
Processor data sheets http://www.intel.com/products/index.htm ICH8 addressing http://developer.intel.com/design/chipsets/datashts Audio software and utilities http://www.intel.com/design/motherbd LAN software and drivers http://www.intel.com/design/motherbd
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop http://developer.intel.com/design/motherbd/lt/lt_available.htm
1.3 Processor
The board is designed to support the following processors:
Intel Core 2 Extreme processor in an LGA775 socket with a 1066 MHz system bus
Intel Core 2 Duo processor in an LGA775 socket with a 1066 or 800 MHz
system bus
Intel Pentium D processor in an LGA775 processor socket with an 800 or 533 MHz
system bus
Intel Pentium 4 processor in an LGA775 processor socket with an 800 or 533 MHz
system bus
Intel Celeron D processor in an LGA775 processor socket with a 533 MHz
system bus
See the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://www.intel.com/design/motherbd/lt/lt_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the board, the processor, and the power supply.
INTEGRATOR’S NOTE
#
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.7.2.2, page 56
17
Intel Desktop Board DP965LT Technical Product Specification
1.4 System Memory
The board has four DIMM sockets and support the following memory features:
1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
8 GB maximum total system memory using DDR2 667 or DDR2 533 DIMMs;
4 GB maximum total system memory using DDR2 800 DIMMs. Refer to Section
2.1.1 on page 43 for information on the total amount of addressable
memory.
Minimum total system memory: 128 MB
Non-ECC DIMMs
Serial Presence Detect
DDR2 800, DDR2 667, or DDR2 533 MHz SDRAM DIMMs
DDR2 800 DIMMs with SPD timings of only 5-5-5 or 6-6-6 (tCL-tRCD-tRP)
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM Type
DDR2 533 256 Mbit 128 MB 512 MB 2 GB DDR2 533 512 Mbit 256 MB 1 GB 4 GB DDR2 533 1 Gbit 512 MB 2 GB 8 GB DDR2 667 256 Mbit 128 MB 512 MB 2 GB DDR2 667 512 Mbit 256 MB 1 GB 4 GB DDR2 667 1 Gbit 512 MB 2 GB 8 GB DDR2 800 256 Mbit 128 MB 512 MB 2 GB DDR2 800 512 Mbit 256 MB 1 GB 4 GB
SDRAM Technology
Smallest usable DIMM (one x16 Single-sided DIMM)
Largest usable DIMM (one x8 Double-sided DIMM)
Maximum capacity with four identical x8 Double-sided DIMMs
18
Product Description
NOTE
Regardless of the DIMM type used, the memory frequency will either be equal to or less than the processor system bus frequency. For example, if DDR2 800 memory is used with a 533 MHz system bus frequency processor, the memory will operate at 533 MHz.
Table 4 lists the resulting operating memory frequencies based on the
combination of DIMMs and processors.
Table 4. Memory Operating Frequencies
DIMM Type Processor system bus frequency Resulting memory frequency
DDR2 533 533 MHz 533 MHz DDR2 533 800 MHz 533 MHz DDR2 533 1066 MHz 533 MHz DDR2 667 533 MHz 533 MHz DDR2 667 800 MHz 667 MHz DDR2 667 1066 MHz 667 MHz DDR2 800 533 MHz 533 MHz DDR2 800 800 MHz 800 MHz DDR2 800 1066 MHz 800 MHz
19
Intel Desktop Board DP965LT Technical Product Specification
1.4.1 Memory Configurations
The Intel 82P965 MCH supports the following types of memory organization:
Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.
Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system memory map) is mapped to dual channel operation; the topmost DRAM memory (the memory that is nearest to the 8 GB address space limit), if any, is mapped to single channel operation. Flex mode results in multiple zones of dual and single channel operation across the whole of DRAM memory. To use flex mode, it is necessary to populate both channels.
20
Product Description
Figure 3 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black.
Figure 3. Memory Channel and DIMM Configuration
INTEGRATOR’S NOTE
#
Regardless of the memory configuration used (dual channel, single channel, or flex mode), DIMM 0 of Channel A must always be populated. This is a requirement of the ICH8 Manageability Engine feature.
21
Intel Desktop Board DP965LT Technical Product Specification
1.4.1.1 Dual Channel (Interleaved) Mode Configurations
Figure 4 shows a dual channel configuration using two DIMMs. In this example, the DIMM0 (blue) sockets of both channels are populated with identical DIMMs.
1 GB
Channel A, DIMM 0 Channel A, DIMM 1
1 GB
Channel B, DIMM 0 Channel B, DIMM 1
OM18339
Figure 4. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
Figure 5 shows a dual channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B.
512 MB
1 GB
512 MB
Channel A, DIMM 0 Channel A, DIMM 1
1 GB
Figure 5. Dual Channel (Interleaved) Mode Configuration with Three DIMMs
22
Channel B, DIMM 0 Channel B, DIMM 1
OM18340
Product Description
Figure 6 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels.
512 MB
1 GB
1 GB
512 MB
1 GB
Channel A, DIMM 0 Channel A, DIMM 1
Channel B, DIMM 0 Channel B, DIMM 1
OM18341
Figure 6. Dual Channel (Interleaved) Mode Configuration with Four DIMMs
23
Intel Desktop Board DP965LT Technical Product Specification
1.4.1.2 Single Channel (Asymmetric) Mode Configurations
NOTE
Dual channel (Interleaved) mode configurations provide the highest memory throughput.
Figure 7 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated.
1 GB
Channel A, DIMM 0 Channel A, DIMM 1
Channel B, DIMM 0 Channel B, DIMM 1
OM18344
Figure 7. Single Channel (Asymmetric) Mode Configuration with One DIMM
Figure 8 shows a single channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B.
512 MB
1 GB
1 GB
Channel A, DIMM 0 Channel A, DIMM 1
Figure 8. Single Channel (Asymmetric) Mode Configuration with Three
24
1 GB
DIMMs
Channel B, DIMM 0 Channel B, DIMM 1
OM18343
Product Description
1.4.1.3 Flex Mode Configuration
NOTE
The use of flex mode requires DIMMs to be installed in both channels.
Figure 9 shows a flex mode configuration using two DIMMs. The operation is as follows:
The 512 MB DIMM in the Channel A, DIMM 0 socket and the lower 512 MB of the
DIMM in the Channel B, DIMM 0 socket operate together in dual channel mode.
The remaining (upper) 512 MB of the DIMM in Channel B operates in single
channel mode.
512 MB
1 GB
Figure 9. Flex Mode Configuration with Two DIMMs
Channel A, DIMM 0 Channel A, DIMM 1
Channel B, DIMM 0 Channel B, DIMM 1
OM18404
25
Intel Desktop Board DP965LT Technical Product Specification
1.5 Intel® P965 Express Chipset
The Intel P965 Express chipset consists of the following devices:
Intel 82P965 Memory Controller Hub (MCH) with Direct Media Interface (DMI)
interconnect
Intel 82801HB I/O Controller Hub (ICH8) with DMI interconnect The MCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The ICH8 is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel P965 Express chipset http://developer.intel.com/ Resources used by the chipset Chapter 2
1.5.1 USB
The board supports up to 10 USB 2.0 ports, supports UHCI and EHCI, and uses UHCI­and EHCI-compatible drivers.
The ICH8 provides the USB controller for all ports. The port arrangement is as follows:
Six ports are implemented with stacked back panel connectors
Four ports are routed to two separate front panel USB headers
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 15, page 51 The location of the front panel USB headers Figure 16, page 52
1.5.2 Serial ATA Interfaces
The board provides six Serial ATA (SATA) connectors, which support one device per connector.
1.5.2.1 Serial ATA Support
The ICH8’s Serial ATA controller offers six independent Serial ATA ports with a theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed on each port for a maximum of six Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
26
Product Description
and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP and Windows 2000 operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power supplies equipped with low-voltage power connectors.
For more information, see:
For information about Refer to
The location of the Serial ATA connectors Figure 16, page 52
http://www.serialata.org/
1.5.3 Parallel IDE Interface
The Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes:
Programmed I/O (PIO): processor controls data transfer.
8237-style DMA: DMA offloads the processor, supporting transfer rates of up to
16 MB/sec.
Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 33 MB/sec.
ATA-66: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
ATA-100: DMA protocol on IDE bus allows host and target throttling. The ATA-100
logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.
ATA-133: DMA protocol on IDE bus allows host and target throttling. The ATA-133
logic is designed to achieve read transfer rates up to 133 MB/sec and write transfer rates in excess of 100 MB/sec.
NOTE
ATA-66, ATA-100, and ATA-133 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices. The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.
For information about Refer to
The location of the Parallel ATA IDE connector Figure 16, page 52
27
Intel Desktop Board DP965LT Technical Product Specification
1.5.4 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one.
1.6 Legacy I/O Controller
Figure 1 on page 14 shows the location of the battery.
The I/O controller provides the following features:
One serial port
One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
Serial IRQ interface compatible with serialized IRQ support for PCI systems
PS/2-style mouse and keyboard interfaces
Interface for one 1.44 MB or 2.88 MB diskette drive
Intelligent power management, including a programmable wake-up event interface
PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.6.1 Serial Port
The board has one serial port header located on the component side of the board. The serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port header Figure 16, page 52 The signal names of the serial port header Table 20, page 54
1.6.2 Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup program to set the parallel port mode.
For information about Refer to
The location of the parallel port connector Figure 15, page 51
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Product Description
1.6.3 Diskette Drive Controller
The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the diskette drive interface.
For information about Refer to
The location of the diskette drive connector Figure 16, page 52
1.6.4 Keyboard and Mouse Interface
The PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected.
For information about Refer to
The location of the keyboard and mouse connectors Figure 15, page 51
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