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Intel BLKDP67DE, BLKDP67DEB3, BOXDP67DE, BOXDP67DEB3, DP67DE Specification

Intel® Desktop Board DP67DE
Technical Product Specification
April 2012
Order Number: G14698-003
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DP67DE Technical Product Specification
-002 Update to the Board Identification Information section January 2012
-003 Update to the Board Identification Information section April 2012
This product specification applies to only the standard Intel® Desktop Board DP67DE with BIOS identifier BAP6710H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
®
All Intel computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.
desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
January 2011
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Intel, Core i7, Core i5, and Core i3 are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2011, 2012, Intel Corporation. All rights reserved.
Board Identification Information
Basic Desktop Board DP67DE Identification Information
AA Revision BIOS Revision Notes
G10217-203 BAP6710H.86A.0031 1,2 G10217-204 BAP6710H.86A.0031 1,2 G10217-300 BAP6710H.86A.0055 1,2 G10217-301 BAP6710H.86A.0055 1,2 G10217-302 BAP6710H.86A.0055 1,2 G10217-303 BAP6710H.86A.0070 1,2 G10217-304 BAP6710H.86A.0075 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
®
2. The Intel
Device Stepping S-Spec Numbers
82P67 Platform Controller Hub (PCH)
82P67 Platform Controller Hub (PCH)
82P67 PCH Express Chipset used on this AA revision consists of the following component:
B2
B3 SLJ4C
SLH84
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See http://developer.intel.com/products/desktop/motherboard/index.htm for the latest documentation.
iii
Intel Desktop Board DP67DE Technical Product Specification
iv
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel Board DP67DE.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop Board DP67DE and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on Intel Desktop Board DP67DE 2 A map of the resources of the Intel Desktop Board 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes 5 Regulatory compliance and battery disposal information
®
Desktop
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
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Intel Desktop Board DP67DE Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mbit Megabit (1,048,576 bits) Mbits/s Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
vi
Contents
Revision History
Board Identification Information ................................................................. iii
Errata ..................................................................................................... iii
Preface
Intended Audience
What This Document Contains .................................................................... v
Typographical Conventions ........................................................................ v
1Product Description
1.1Overview ........................................................................................ 11
1.1.1 Feature Summary ................................................................ 11
1.1.2 Board Layout ....................................................................... 13
1.1.3 Block Diagram ..................................................................... 15
1.2Legacy Considerations ...................................................................... 16
1.3Online Support ................................................................................ 16
1.4Processor ....................................................................................... 17
1.4.1 PCI Express x16 Graphics
1.5System Memory .............................................................................. 18
1.5.1 Memory Configurations ......................................................... 19
®
1.6Intel
1.6.1 USB ................................................................................... 21
1.7SATA Interfaces
1.8Real-Time Clock Subsystem .............................................................. 23
1.9Legacy I/O Controller ....................................................................... 23
1.9.1 Consumer Infrared (CIR) ....................................................... 24
1.10Audio Subsystem ............................................................................. 24
1.10.1Audio Subsystem Software
1.10.2Audio Subsystem Components ............................................... 25
1.11LAN Subsystem ............................................................................... 26
1.11.1Intel
1.11.2LAN Subsystem Software ....................................................... 27
1.11.3RJ-45 LAN Connector with Integrated LEDs
1.12Hardware Management Subsystem .................................................... 28
1.12.1Hardware Monitoring............................................................. 28
1.12.2Fan Monitoring
1.12.3Chassis Intrusion and Detection .............................................. 28
1.12.4Thermal Monitoring
1.13Power Management ......................................................................... 30
1.13.1ACPI ................................................................................... 30
1.13.2Hardware Support
P67 Express Chipset ............................................................... 21
................................................................................... v
...................................................... 17
.............................................................................. 22
.................................................... 25
®
82579V Gigabit Ethernet Controller ................................ 26
.............................. 27
..................................................................... 28
.............................................................. 29
................................................................ 32
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Intel Desktop Board DP67DE Technical Product Specification
2Technical Reference
2.1Memory Resources
2.1.1 Addressable Memory ............................................................. 37
2.1.2 Memory Map ........................................................................ 39
2.2Connectors and Headers ................................................................... 39
2.2.1 Back Panel Connectors
2.2.2 Component-side Connectors and Headers
2.3Jumper Block
.................................................................................. 50
2.4Mechanical Considerations
2.4.1 Form Factor ......................................................................... 52
2.5Electrical Considerations
2.5.1 Power Supply Considerations
2.5.2 Fan Header Current Capability ................................................ 54
2.5.3 Add-in Board Considerations
2.6Thermal Considerations
2.7Reliability ....................................................................................... 57
2.8Environmental ................................................................................ 57
.......................................................................... 37
.......................................................... 40
................................ 41
................................................................ 52
................................................................... 53
................................................. 53
.................................................. 54
.................................................................... 54
3Overview of BIOS Features
3.1Introduction ................................................................................... 59
3.2BIOS Flash Memory Organization
3.3Resource Configuration
.................................................................... 60
3.3.1 PCI Autoconfiguration
3.4System Management BIOS (SMBIOS) ................................................. 61
3.5Legacy USB Support
3.6BIOS Updates
................................................................................. 62
3.6.1 Language Support
........................................................................ 61
................................................................ 62
3.6.2 Custom Splash Screen
3.7BIOS Recovery ................................................................................ 63
3.8Boot Options ................................................................................... 64
3.8.1 Optical Drive Boot
................................................................ 64
3.8.2 Network Boot ....................................................................... 64
3.8.3 Booting Without Attached Devices........................................... 64
3.8.4 Changing the Default Boot Device During POST
3.9Adjusting Boot Speed ....................................................................... 65
3.9.1 Peripheral Selection and Configuration ..................................... 65
3.9.2 BIOS Boot Optimizations
3.10BIOS Security Features
.................................................................... 66
3.11BIOS Performance Features
....................................................... 60
........................................................... 60
.......................................................... 63
........................ 64
....................................................... 65
.............................................................. 67
4Error Messages and Beep Codes
4.1Speaker ......................................................................................... 69
4.2BIOS Beep Codes
4.3Front-panel Power LED Blink Codes
4.4BIOS Error Messages
4.5Port 80h POST Codes
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............................................................................ 69
.................................................... 70
....................................................................... 70
....................................................................... 71
Contents
5Regulatory Compliance and Battery Disposal Information
5.1Regulatory Compliance ..................................................................... 77
5.1.1 Safety Standards .................................................................. 77
5.1.2 European Union Declaration of Conformity Statement
................ 78
5.1.3 Product Ecology Statements ................................................... 79
5.1.4 EMC Regulations
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance
5.1.6 Regulatory Compliance Marks (Board Level)
.................................................................. 81
................. 84
............................. 85
5.2Battery Disposal Information ............................................................. 86
Figures
1. Major Board Components.................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration ........................................... 20
4. Back Panel Audio Connectors ............................................................ 25
5. LAN Connector LED Locations ............................................................ 27
6. Thermal Sensors and Fan Headers ..................................................... 29
7. Location of the Standby Power LED .................................................... 36
8. Detailed System Memory Address Map ............................................... 38
9. Back Panel Connectors ..................................................................... 40
10. Component-side Connectors and Headers ........................................... 41
11. Connection Diagram for Front Panel Header ........................................ 47
12. Connection Diagram for Front Panel USB 2.0 Headers ........................... 49
13. Location of the Jumper Block ............................................................. 50
14. Board Dimensions ........................................................................... 52
15. Localized High Temperature Zones ..................................................... 55
Tables
1. Feature Summary ............................................................................ 11
2. Components Shown in Figure 1 ......................................................... 14
3. Supported Memory Configurations ..................................................... 18
4. Audio Jack Support .......................................................................... 24
5. LAN Connector LED States ................................................................ 27
6. Effects of Pressing the Power Switch .................................................. 30
7. Power States and Targeted System Power ........................................... 31
8. Wake-up Devices and Events ............................................................ 32
9. System Memory Map ....................................................................... 39
10. Component-side Connectors and Headers Shown in Figure 10 ................ 42
11. IEEE 1394a Header .......................................................................... 43
12. Front Panel Audio Header for Intel HD Audio ........................................ 43
13. Front Panel Audio Header for AC ’97 Audio .......................................... 43
14. Front Panel USB 2.0 Headers ............................................................ 43
15. SATA Connectors ............................................................................. 44
16. S/PDIF Header ................................................................................ 44
17. Chassis Intrusion Header .................................................................. 44
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Intel Desktop Board DP67DE Technical Product Specification
18. Processor, Front, and Rear Chassis (4-Pin) Fan Headers ....................... 44
19. Back Panel CIR Emitter (Output) Header ............................................. 44
20. Front Panel CIR Receiver (Input) Header ............................................. 45
21. Processor Core Power Connector ........................................................ 46
22. Main Power Connector ...................................................................... 46
23. Front Panel Header .......................................................................... 47
24. States for a One-Color Power LED ...................................................... 48
25. States for a Two-Color Power LED ...................................................... 48
26. Alternate Front Panel Power/Sleep LED Header .................................... 48
27. BIOS Setup Configuration Jumper Settings .......................................... 51
28. Recommended Power Supply Current Values ....................................... 53
29. Fan Header Current Capability ........................................................... 54
30. Thermal Considerations for Components ............................................. 56
31. Tcontrol Values for Components ........................................................ 56
32. Environmental Specifications ............................................................. 57
33. BIOS Setup Program Menu Bar .......................................................... 60
34. BIOS Setup Program Function Keys .................................................... 60
35. AcceptableDrives/Media Types for BIOS Recovery ................................ 63
36. Boot Device Menu Options ................................................................ 64
37. Supervisor and User Password Functions ............................................. 66
38. BIOS Beep Codes ............................................................................ 69
39. Front-panel Power LED Blink Codes .................................................... 70
40. BIOS Error Messages ....................................................................... 70
41. Port 80h POST Code Ranges.............................................................. 71
42. Port 80h POST Codes ....................................................................... 72
43. Typical Port 80h POST Sequence ........................................................ 76
44. Safety Standards ............................................................................. 77
45. EMC Regulations ............................................................................. 81
46. Regulatory Compliance Marks ............................................................ 85
x
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Graphics Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
Audio
Peripheral Interfaces
MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
®
• Intel
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
Intel Controller Hub (PCH)
10-channel (7.1 + 2) Intel High Definition Audio via the Realtek ALC892 audio codec
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Fourteen USB 2.0 ports:
• Two SATA 6.0 Gb/s interfaces through Intel P67 Express Chipset with Intel
• Four Serial ATA (SATA) 3.0 Gb/s interfaces through Intel P67 Express Chipset
• Two IEEE 1394a ports:
Core™ i7, Intel® Core™ i5, and Intel® Core™ i3 processors with up to
95W TDP in an LGA1155 socket
― One PCI Express* 2.0 x16 graphics interface ― Integrated memory controller with dual channel DDR3 memory support
memory technology
®
P67 Express Chipset consisting of the Intel
― Six ports are implemented with stacked back panel connectors (black) ― Eight front panel ports implemented through four internal headers
Rapid Storage Technology RAID support (blue)
with Intel Rapid Storage Technology RAID support:
― Two internal SATA ports (black) ― One internal eSATA port (red) ― One back panel eSATA port (red)
― One port via a back panel connector ― One port via an internal header for front panel cabling
®
P67 Express Platform
®
continued
11
Intel Desktop Board DP67DE Technical Product Specification
Table 1. Feature Summary (continued)
Expansion Capabilities
BIOS
Instantly Available PC Technology
LAN Support
Legacy I/O Control Nuvoton W83677HG-i I/O controller for CIR and hardware management support
Hardware Monitor Subsystem
• One PCI Express 2.0 x16 add-in card connector
• Two PCI Express 2.0 x1 add-in card connectors
• One Conventional PCI bus connector
®
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
• Support for PCI* Local Bus Specification Revision 2.2
• Support for PCI Express* Revision 2.0
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, Consumer Infrared (CIR), and
Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel Ethernet Controller
• Hardware monitoring through the Nuvoton I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers
• Two fan sense inputs used to monitor fan activity
• Fan speed control
BIOS resident in the SPI Flash device
and SMBIOS
USB ports
®
82579V Gigabit
12
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DP67DE.
Figure 1. Major Board Components
13
Intel Desktop Board DP67DE Technical Product Specification
Table 2 lists the components identified in Figure 1.
Table 2. Components Shown in Figure 1
Item/callout from Figure 1 Descript
A PCI Conventional bus add-in card connector B PCI Express x1 add-in card connector C IEEE 1394a front panel header D PCI Express x1 bus add-in card connector E PCI Express x16 bus add-in card connector F Back panel connectors G Processor core power connector (2 x 2) H Rear chassis fan header I LGA1155 processor socket J Processor fan header K DIMM 3 (Channel A DIMM 0) L DIMM 1 (Channel A DIMM 1) M DIMM 4 (Channel B DIMM 0) N DIMM 2 (Channel B DIMM 1) O Front chassis fan header P Chassis intrusion header Q Low Pin Count (LPC) Debug header R Consumer IR emitter (output) header S Consumer IR receiver (input) header T Main power connector (2 x 12) U Battery V Piezoelectric speaker W Intel P67 Express Chipset X SATA connectors Y Front panel header Z Alternate front panel power LED header AA BIOS Setup configuration jumper block BB Front panel USB 2.0 headers (4) CC Standby power LED DD S/PDIF out header EE Front panel audio header
ion
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
15
Intel Desktop Board DP67DE Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following:
• No parallel port connector
• No floppy drive connector
• No serial port connector or header
• No PS/2 connectors
• No PATA connector
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DP67DE http://www.intel.com/products/motherboard/index.htm Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available configurations for Intel
Desktop Board DP67DE
Supported processors http://processormatch.intel.com Chipset information http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
16
Product Description
1.4 Processor
The board is designed to support the Intel Core i7, Intel Core i5, and Intel Core i3 processors in an LGA1155 socket
Other processors may be supported in the future. This board is designed to support processors with a maximum wattage of 95 W Thermal Design Power (TDP). The processors listed above are only supported when falling within the wattage requirements of Intel Desktop Board DP67DE. See the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 53 for information on power supply requirements for this board.
1.4.1 PCI Express x16 Graphics
The Intel Core i7, Intel Core i5, and Intel Core i3 processors in an LGA1155 socket support discrete add in graphics cards via the PCI Express 2.0 x16 graphics connector:
• Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
direction (500 MB/s) per lane. The maximum theoretical bandwidth on the interface is 8 GB/s in each direction, simultaneously, for an aggregate of 16 GB/s when operating in x16 GEN2 mode.
• Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (250 MB/s) per lane. The maximum theoretical bandwidth on the interface is 4 GB/s in each direction, simultaneously, for an aggregate of 8 GB/s when operating in x16 GEN1 mode.
For information about Refer to
PCI Express technology http://www.pcisig.com
17
Intel Desktop Board DP67DE Technical Product Specification
1.5 System Memory
The board has four DIMM sockets and supports the following memory features:
• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the
voltage to support higher performance DDR3 SDRAM DIMMs.
• Support for 1.35 V Low Voltage DDR3 (new JEDEC specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 32 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 37 for information on the total amount of addressable memory.
• Minimum recommended total system memory: 512 MB
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
SDRAM Density
DIMM Capacity Configuration
512 MB SS 1 Gbit 64 M x16/empty 4 1024 MB SS 1 Gbit 128 M x8/empty 8 1024 MB SS 2 Gbit 128 M x16/empty 4 2048 MB DS 1 Gbit 128 M x8/128 M x8 16 2048 MB SS 2 Gbit 128 M x16/empty 8 4096 MB DS 2 Gbit 256 M x8/256 M x8 16 4096 MB SS 4 Gbit 512 M x8/empty 8 8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb
(Note)
SDRAM Organization Front-side/Back-side
/CS-025414.htm
Number of SDRAM Devices
18
Product Description
1.5.1 Memory Configurations
The Intel Core i7, Intel Core i5, and Intel Core i3 processors in the LGA1155 socket support the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.
• Flex mode. This mode provides the most flexible performance characteristics.
The bottommost DRAM memory (the memory that is lowest within the system memory map) is mapped to dual channel operation; the topmost DRAM memory (the memory that is nearest to the 8 GB address space limit), if any, is mapped to single channel operation. Flex mode results in multiple zones of dual and single channel operation across the whole of DRAM memory. To use flex mode, it is necessary to populate both channels.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
19
Intel Desktop Board DP67DE Technical Product Specification
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
The Intel Core i7, Intel Core i5, and Intel Core i3 processors require memory to be populated in the DIMM 1 (Channel A, DIMM 1) socket.
For best memory performance always install memory into the blue DIMM memory sockets if only installing two DIMMs in your configuration.
20
Product Description
1.6 Intel
Intel P67 Express Chipset with Direct Media Interface (DMI) interconnect provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel P67 Express Chipset is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel P67 chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2
®
P67 Express Chipset
1.6.1 USB
The board supports up to 14 USB 2.0 ports and two USB 3.0 ports. The Intel P67 Express Chipset provides the USB controller for the 2.0 ports. The two
USB 3.0 ports are provided by the NEC* UPD720200 controller. The port arrangement is as follows:
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Six USB 2.0 ports are implemented with stacked back panel connectors (black)
• Eight USB 2.0 front panel ports implemented through four internal headers
All 16 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports are super-speed capable.
NOTES
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 9, page 40 The location of the front panel USB headers Figure 10, page 41
21
Intel Desktop Board DP67DE Technical Product Specification
1.7 SATA Interfaces
The board provides six SATA connectors through the PCH, which support one device per connector:
• Two internal SATA 6.0 Gb/s connectors (blue)
• Two internal SATA 3.0 Gb/s connectors (black)
• One internal eSATA 3.0 Gb/s connector (red)
• One eSATA 3.0 Gb/s connector on the back panel for external connectivity (red)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of 6 Gb/s for two ports and 3 Gb/s for four ports. A point-to-point interface is used for host to device connections.
The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP, Windows Vista*, and Windows 7* operating systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 10, page 41
.
22
Product Description
1.7.1.1 SATA RAID
The board supports Intel Rapid Storage Technology which provides the following RAID (Redundant Array of Independent Drives) levels via the Intel P67 Express Chipset:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS. Also, during Microsoft Windows XP installation, you must press F6 to install the RAID drivers. See your Microsoft Windows XP documentation for more information about installing drivers during installation. Both Microsoft Windows Vista and Microsoft Windows 7 include the necessary RAID drivers for both AHCI and RAID without the need to install separate RAID drivers using the F6 switch in the operating system installation process.
1.8 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be notified during the POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.9 Legacy I/O Controller
The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
23
Intel Desktop Board DP67DE Technical Product Specification
1.9.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the supported operating systems.
The CIR feature is made up of two separate pieces: the receiving (receiver) header, and the output (emitter) header. The receiving header consists of a filtered translated infrared input compliant with Microsoft CIR specifications, and also a “learning” infrared input. This learning input is simply a high pass input which the computer can use to “learn” to speak the infrared communication language of other user remotes. The emitter header consists of two output ports which the PC can use to emulate “learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to connect to Intel Desktop Boards for this feature to work.
1.10 Audio Subsystem
The board supports Intel HD Audio via the HDMI interface, DisplayPort interface, and Realtek ALC892 audio codec. The audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type.
• A signal-to-noise (S/N) ratio of 97 dB
• Microphone input that supports a single dynamic, condenser, or electret
microphone
• Windows Vista Ultimate and Windows 7 Ultimate certification
Table 4 lists the supported functions of the front panel and back panel audio jacks.
Table 4. Audio Jack Support
Audio Jack
FP Green Default FP Pink Default Rear Blue Default Rear Green Ctrl panel Default Rear Pink Default Ctrl panel Rear Black Default Rear Orange Default
Micro­phone
Head-
phones
Front
Speaker Line In
Rear
Surround
Center/
Sub
Side
Surround
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Product Description
1.10.1 Audio Subsystem Software
The latest audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 16
1.10.2 Audio Subsystem Components
The audio subsystem includes the following components:
• Intel H67 Express Chipset
• Realtek ALC892 audio codec
• Front panel audio header that supports Intel HD audio and AC ’97 audio
(a 2 x 5-pin header that provides mic in and line out signals for front panel audio connectors) (yellow)
• S/PDIF digital audio out header (1 x 4-pin header) (yellow)
• S/PDIF digital audio out connector on the back panel
• 5-port analog audio input/output stack on the back panel
The back panel audio connectors are configurable through the audio device drivers. The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A Rear surround B Center channel and LFE
(subwoofer) C S/PDIF out (optical) D Line in E Mic in/side surround F Line out/front speakers
Figure 4. Back Panel Audio Connectors
25
Intel Desktop Board DP67DE Technical Product Specification
NOTE
The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 10, page 41 The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 43 The back panel audio connectors Section 2.2.1, page 40
1.11 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mbits/s)
• Intel P67 Express Chipset
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• PCI Conventional bus power management ⎯ ACPI technology support ⎯ LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
1.11.1 Intel
®
82579V Gigabit Ethernet Controller
The Intel 82579V Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support [Low Power Idle (LPI) mode]
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
⎯ PCI Express-based interface for active state operation (S0) state ⎯ SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility
26
Product Description
1.11.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.11.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link LED (Green) B Data Rate LED (Green/Yellow)
Figure 5. LAN Connector LED Locations
Table 5 describes the LED states when the board is powered up and the LAN subsystem is operating.
Table 5. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established. Blinking LAN activity is occurring. Off 10 Mbits/s data rate is selected. Green 100 Mbits/s data rate is selected. Yellow 1000 Mbits/s data rate is selected.
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