Intel BLKDP67BG, BLKDP67BGB3, DP67BG Technical Product Specification
Intel® Desktop Board
DP67BG
Technical Product Specification
Order Number: G13848-001US
The Intel® Desktop Board DP67BG may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DP67BG Specification Update.
January 2011
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DP67BG Technical Product
Specification
This product specification applies to only the standard Intel® Desktop Board DP67BG with BIOS
identifier BGP6710J.86A.
Changes to this specification will be published in the Intel Desktop Board DP67BG Specification
Update before being incorporated into a revision of this document.
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®
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January 2011
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deviate from published specifications. Current characterized errata are available on request.
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Copyright © 2011 Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
®
Intel
Desktop Board DP67BG.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DP67BG and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DP67BG
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DP67BG Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 System Memory .............................................................................. 15
1.5.1 Memory Configurations ......................................................... 17
1.6 Intel® P67 Express Chipset ............................................................... 19
1.6.1 PCI Express x16 Graphics ...................................................... 19
1.6.2 USB ................................................................................... 19
1.6.3 SATA Interfaces ................................................................... 19
1.7 Real-Time Clock Subsystem .............................................................. 21
1.8 Legacy I/O Controller ....................................................................... 21
1.8.1 Consumer Infrared (CIR)....................................................... 21
1.9 Audio Subsystem............................................................................. 22
1.9.1 Audio Subsystem Software .................................................... 22
1.9.2 Audio Subsystem Components ............................................... 22
1.10 LAN Subsystem............................................................................... 24
1.10.1 Intel® 82579V Gigabit Ethernet Controller................................ 24
1.10.2 LAN Subsystem Software....................................................... 25
1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 25
1.11 Bluetooth*/WiFi Module (optional) ..................................................... 26
1.11.1 Bluetooth Technology (Module) .............................................. 26
1.11.2 WiFi 802.11 Wireless (Module) ............................................... 26
1.12 Hardware Management Subsystem .................................................... 27
1.12.1 Hardware Monitoring and Fan Control...................................... 27
1.12.2 Fan Monitoring..................................................................... 27
1.12.3 Chassis Intrusion and Detection.............................................. 27
1.12.4 Thermal Monitoring .............................................................. 28
1.13 Power Management ......................................................................... 29
1.13.1 ACPI................................................................................... 29
1.13.2 Hardware Support ................................................................ 32
1.14 Onboard Power and Reset Buttons ..................................................... 37
2 Technical Reference
2.1 Memory Resources .......................................................................... 39
2.1.1 Addressable Memory............................................................. 39
2.1.2 Memory Map........................................................................ 41
v
Intel Desktop Board DP67BG Technical Product Specification
2.2 Connectors and Headers................................................................... 41
2.2.1 Back Panel Connectors .......................................................... 42
2.2.2 Component-side Connectors and Headers ................................ 43
2.3 Jumper Block .................................................................................. 52
2.4 Mechanical Considerations ................................................................ 54
2.4.1 Form Factor......................................................................... 54
2.5 Electrical Considerations ................................................................... 55
2.5.1 Power Supply Considerations ................................................. 55
2.5.2 Fan Header Current Capability................................................ 56
2.5.3 Add-in Board Considerations .................................................. 56
2.6 Thermal Considerations .................................................................... 57
2.7 Reliability ....................................................................................... 59
2.8 Environmental ................................................................................ 59
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 61
3.2 BIOS Flash Memory Organization ....................................................... 62
3.3 Resource Configuration .................................................................... 62
3.3.1 PCI Autoconfiguration ........................................................... 62
3.4 System Management BIOS (SMBIOS)................................................. 63
3.5 Legacy USB Support ........................................................................ 63
3.6 BIOS Updates ................................................................................. 64
3.6.1 Language Support ................................................................ 64
3.6.2 Custom Splash Screen .......................................................... 65
3.7 BIOS Recovery................................................................................ 65
3.8 Boot Options................................................................................... 66
3.8.1 Optical Drive Boot ................................................................ 66
3.8.2 Network Boot....................................................................... 66
3.8.3 Booting Without Attached Devices........................................... 66
3.8.4 Changing the Default Boot Device During POST ........................ 66
3.9 Adjusting Boot Speed....................................................................... 67
3.9.1 Peripheral Selection and Configuration..................................... 67
3.9.2 BIOS Boot Optimizations ....................................................... 67
3.10 BIOS Security Features .................................................................... 68
3.11 BIOS Performance Features .............................................................. 69
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 71
4.2 BIOS Beep Codes ............................................................................ 71
4.3 Front-panel Power LED Blink Codes .................................................... 72
4.4 BIOS Error Messages ....................................................................... 72
4.5 Port 80h POST Codes ....................................................................... 73
vi
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 79
5.1.1 Safety Standards.................................................................. 79
5.1.2 European Union Declaration of Conformity Statement................ 80
5.1.3 Product Ecology Statements................................................... 81
5.1.4 EMC Regulations .................................................................. 265H83
86H5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 266H86
87H5.1.6 Regulatory Compliance Marks (Board Level) ............................. 267H87
88H5.2 Battery Disposal Information............................................................. 268H88
Figures
89H1. Major Board Components.................................................................. 269H11
90H2. Block Diagram ................................................................................ 270H13
91H3. Memory Channel and DIMM Configuration........................................... 271H18
92H4. Back Panel Audio Connectors ............................................................ 272H23
93H5. LAN Connector LED Locations............................................................ 273H25
94H6. Thermal Sensors and Fan Headers ..................................................... 274H28
95H7. Location of Diagnostic LEDs .............................................................. 275H35
96H8. Location of the Onboard Power and Reset Buttons................................ 276H37
97H9. Detailed System Memory Address Map ............................................... 277H40
98H10. Back Panel Connectors ..................................................................... 278H42
99H11. Component-side Connectors and Headers ........................................... 279H43
100H12. Connection Diagram for Front Panel Header ........................................ 280H49
101H13. Connection Diagram for Front Panel USB Headers ................................ 281H51
102H14. Location of the Jumper Block............................................................. 282H52
103H15. Board Dimensions ........................................................................... 283H54
104H16. Localized High Temperature Zones..................................................... 284H58
Tables
105H1. Feature Summary.............................................................................. 285H9
106H2. Components Shown in Figure 1 ......................................................... 286H12
107H3. Supported Memory Configurations ..................................................... 287H16
108H4. Audio Jack Support.......................................................................... 288H22
109H5. LAN Connector LED States................................................................ 289H25
110H6. Effects of Pressing the Power Switch .................................................. 290H29
111H7. Power States and Targeted System Power........................................... 291H30
112H8. Wake-up Devices and Events ............................................................ 292H31
113H9. Diagnostic LEDs .............................................................................. 293H36
114H10. System Memory Map ....................................................................... 294H41
115H11. Component-side Connectors and Headers Shown in Figure 11................ 295H44
116H12. IEEE 1394a Header.......................................................................... 296H45
117H13. Front Panel Audio Header ................................................................. 297H45
118H14. SATA Connectors............................................................................. 298H45
119H15. S/PDIF Header ................................................................................ 299H45
120H16. Chassis Intrusion Header.................................................................. 300H46
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Intel Desktop Board DP67BG Technical Product Specification
17. Processor, Front and Rear Chassis, and Auxiliary (4-Pin) Fan Headers ..... 46
18. Processor Core Power Connector........................................................ 48
19. Main Power Connector...................................................................... 48
20. Front Panel Header .......................................................................... 49
21. States for a One-Color Power LED...................................................... 50
22. States for a Two-Color Power LED...................................................... 50
23. BIOS Setup Configuration Jumper Settings.......................................... 53
24. Recommended Power Supply Current Values ....................................... 55
25. Fan Header Current Capability........................................................... 56
26. Thermal Considerations for Components ............................................. 58
27. Environmental Specifications............................................................. 59
28. BIOS Setup Program Menu Bar.......................................................... 62
29. BIOS Setup Program Function Keys.................................................... 62
30. AcceptableDrives/Media Types for BIOS Recovery ................................ 65
31. Boot Device Menu Options ................................................................ 66
32. Supervisor and User Password Functions............................................. 68
33. BIOS Beep Codes ............................................................................ 71
34. Front-panel Power LED Blink Codes.................................................... 72
35. BIOS Error Messages ....................................................................... 72
36. Port 80h POST Code Ranges.............................................................. 73
37. Port 80h POST Codes ....................................................................... 74
39. Safety Standards............................................................................. 79
40. EMC Regulations ............................................................................. 323H83
144H41. Regulatory Compliance Marks............................................................ 324H87
viii
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Audio Intel® High Definition Audio subsystem using the Realtek* ALC892 audio codec
Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CIR)
Peripheral
Interfaces
Wireless Module
BIOS
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
®
• Intel
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 +1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 32 GB of system memory with four DIMMs using 4 Gb
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
• Support for XMP memory
Intel
Hub (PCH)
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Fourteen USB 2.0 ports:
• Two Serial ATA (SATA) 6.0 Gb/s interfaces through the Intel P67 Express
• Four internal SATA 3.0 Gb/s interfaces through the Intel P67 Express Chipset
• One back panel eSATA port (red)
• Two IEEE 1394a ports:
• Separate module that provides both Bluetooth* and WiFi included with the
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
Core™ i7, Intel® Core™ i5, and Intel® Core™ i3 processors with up to 95
W TDP in an LGA1155 socket:
― 1 x16 PCIe 2.0 Graphics interface (operates in x8 mode when second slot
is populated)
― Two DDR3 memory channels
memory technology
®
P67 Express Chipset consisting of the Intel
― Eight ports are implemented with stacked back panel connectors (black)
― Six front panel ports implemented through three internal headers
®
Chipset with Intel
with Intel Rapid Storage Technology RAID support (black)
― One port via a back panel connector
― One port via a front-panel header (blue)
desktop board (optional)
®
BIOS resident in the SPI Flash device
and SMBIOS
Rapid Storage Technology RAID support (blue)
®
P67 Platform Controller
continued
9
Intel Desktop Board DP67BG Technical Product Specification
Table 1. Feature Summary (continued)
Instantly Available
PC Technology
LAN Support
Expansion
Capabilities
Hardware Monitor
Subsystem
• Support for PCI* Local Bus Specification Revision 2.2
• Support for PCI Express* Revision 2.0
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, CIR, and USB ports
Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel
Ethernet Controller
• Two PCI Express 2.0 x16
• Three PCI Express x1 bus add-in card connectors from the PCH
• Two Conventional PCI bus add-in card connectors from the PCH via PCI bridge
• Hardware monitoring and fan control through the Nuvoton I/O controller
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Four fan headers using PWM control
• Four fan sense inputs used to monitor fan activity
• Fan speed control using voltage control (4-pin fan headers front, rear, and
auxiliary) with selectable support in BIOS for 3 wire fans
• Support for Platform Environmental Control Interface (PECI)
®
82579V Gigabit
10
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DP67BG.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
11
Intel Desktop Board DP67BG Technical Product Specification
Table 2. Components Shown in Figure 1
Label Description
A PCI Express x1 bus add-in card connector
B Conventional PCI bus add-in card connector
C PCI Express 2.0 x16 connector (x8 electrical; x16 compatible)
D Front panel audio header
E Conventional PCI bus add-in card connector
F PCI Express x1 bus add-in card connector
G PCI Express 2.0 x16 bus add-in card connector
H Rear chassis fan header
I PCI Express x1 bus add-in card connector
J Back panel connectors
K 12 V processor core voltage connector (2 x 4 pin)
L LGA1155 processor socket
M Processor fan header
N DIMM 3 (Channel A DIMM 0)
O DIMM 1 (Channel A DIMM 1)
P DIMM 4 (Channel B DIMM 0)
Q DIMM 2 (Channel B DIMM 1)
R Alternate front panel power LED header
S Main power connector (2 x 12 pin)
T POST code LED display
U Onboard power button
V Onboard reset button
W Speaker
X Front chassis fan header
Y Battery
Z Intel P67 Express Chipset
AA SATA connectors (6)
BB Consumer IR transmitter (output) header
CC Consumer IR receiver (input) header
DD BIOS Setup configuration jumper block
EE Front panel USB 2.0 headers (3)
FF Chassis intrusion header
GG IEEE 1394a front panel header
HH Front panel header
II Diagnostic LEDs
JJ S/PDIF out header
KK Auxiliary fan header
12
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
13
Intel Desktop Board DP67BG Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port connector
• No floppy drive connector
• No PS/2 connectors
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DP67BG http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board DP67BG
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.4 Processor
The board is designed to support the Intel Core i7, Intel Core i5, and Intel Core i3
processors in an LGA1155 socket
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 95 W with margin to allow for greater than
150 W operation. The processors listed above are only supported when falling within
the wattage requirements of the Intel Desktop Board DP67BG. See the Intel web site
listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 55 for information on power supply requirements for this board.
14
Product Description
1.4.1 PCI Express x16 Graphics
The Intel Core i7, Intel Core i5, and Intel Core i3 processors in an LGA1155 socket
support discrete add in graphics cards via the PCI Express 2.0 x16 graphics connector:
• Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
direction (500 MB/s) per lane. The maximum theoretical bandwidth on the
interface is 8 GB/s in each direction, simultaneously,
when operating in x16 GEN2 mode
• Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (250 MB/s) per lane. The maximum theoretical bandwidth on the
interface is 4 GB/s in each direction, simultaneously,
operating in x16 GEN1 mode
For information about Refer to
PCI Express technology http://www.pcisig.com
.
.
for an aggregate of 16 GB/s
for an aggregate of 8 GB/s when
1.5 System Memory
The board has four DIMM sockets and supports the following memory features:
• 1.35 V DDR3 SDRAM DIMMs (New JEDEC Specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 32 GB maximum total system memory (using 4 Gb memory technology). Refer to
Section 2.1.1 on page 39 for information on the total amount of addressable
memory.
• Minimum total system memory: 1 GB using 512 MB x16 module
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 +1600 MHz, 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs
• XMP version 1.2 performance profile support for memory speeds above 1600 MHz
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
15
Intel Desktop Board DP67BG Technical Product Specification
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
SDRAM
Density
DIMM
Capacity Configuration
512 MB SS 1 Gbit 64 M x16/empty 4
1024 MB SS 1 Gbit 128 M x8/empty 8
1024 MB SS 2 Gbit 128 M x16/empty 4
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 128 M x16/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
(Note)
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
16
Product Description
1.5.1 Memory Configurations
The Intel Core i7, Intel Core i5, and Intel Core i3 processors support the following
types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
17
Intel Desktop Board DP67BG Technical Product Specification
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
The Intel Core i7, Intel Core i5, and Intel Core i3 processors require memory to be
populated in the DIMM 1 (Channel A, DIMM 0) socket.
For best memory performance always install memory into the blue DIMM memory
sockets if only installing two DIMMs in your configuration.
18
Product Description
1.6 Intel
The Intel P67 Express Chipset consisting of the Intel P67 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LAN, PCI, and PCIe
interfaces. The PCH is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel P67 Express Chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
®
P67 Express Chipset
1.6.1 USB
The board supports up to 14 USB 2.0 ports and two USB 3.0 ports.
The Intel P67 Express Chipset provides the USB controller for the 2.0 ports. The two
USB 3.0 ports are provided by the NEC* UPD720200 controller. The port arrangement
is as follows:
• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)
• Eight USB 2.0 ports are implemented with stacked back panel connectors (black)
• Six USB 2.0 front panel ports implemented through four internal headers
All 16 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports
are super-speed capable.
NOTES
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use a
shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 10, page 42
The location of the front panel USB headers Figure 11, page 43
1.6.2 SATA Interfaces
The board provides six SATA connectors through the PCH and one eSATA connector
through a Marvell controller, which support one device per connector:
• Two internal SATA 6.0 Gb/s connectors (blue)
• Four internal SATA 3.0 Gb/s connectors (black)
• One eSATA 3.0 Gb/s connector on the back panel for external connectivity (red)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6 Gb/s for two ports and 3 Gb/s for five ports. A point-to-point interface is used for
host to device connections.
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
19
Intel Desktop Board DP67BG Technical Product Specification
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Windows* XP, Windows Vista*, and Windows 7* operating
systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 11, page 43
.
1.6.2.1 SATA RAID
The board supports the following RAID (Redundant Array of Independent Drives)
levels via the PCH:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
RAID functionality is only supported when using drives connected to the six SATA
connectors (black) from the PCH.
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS.
Also, during Microsoft Windows XP installation, you must press F6 to install the RAID
drivers. See your Microsoft Windows XP documentation for more information about
installing drivers during installation. Both Microsoft Windows Vista and Microsoft
Windows 7 include the necessary RAID drivers for both AHCI and RAID without the
need to install separate RAID drivers using the F6 switch in the operating system
installation process.
20
Product Description
1.7 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail date and time values will be reset and the user will be
notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
1.8 Legacy I/O Controller
The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.8.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the
supported operating systems.
The CIR feature is made up of two separate pieces: the receiving (receiver) header,
and the output (emitter) header. The receiving header consists of a filtered translated
infrared input compliant with Microsoft CIR specifications, and also a “learning”
infrared input. This learning input is simply a high pass input which the computer can
use to “learn” to speak the infrared communication language of other user remotes.
The emitter header consists of two output ports which the PC can use to emulate
“learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to plug into Intel
Desktop Boards for this feature to work.
21
Intel Desktop Board DP67BG Technical Product Specification
1.9 Audio Subsystem
The board supports the Intel High Definition Audio subsystem based on the Realtek
ALC892 audio codec. The audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output for all back panel jacks
• Line out and Mic in functions for front panel audio jacks
• A signal-to-noise (S/N) ratio of 90 dB
Table 4 lists the supported functions of the front panel and back panel audio jacks.
Table 4. Audio Jack Support
Audio Jack
FP Green Default
FP Pink Default
Rear Blue Default
Rear Green Ctrl panel Default
Rear Pink Default Ctrl panel
Rear Black Default
Rear Orange Default
Microphone
Head-
phones
Front
Speaker Line In
Rear
Surround
Center/
Sub
Side
Surround
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 14
1.9.2 Audio Subsystem Components
The audio subsystem includes the following components:
• Intel P67 Express Chipset
• Realtek ALC892 audio codec
• Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x 5-
pin header that provides mic in and line out signals for front panel audio
connectors) (yellow)
• S/PDIF digital audio out header (1 x 4-pin header) (yellow)
• S/PDIF digital audio out connector on the back panel
• 5-port analog audio input/output stack on the back panel
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 4.
22
Item Description
A Rear surround
B S/PDIF out (optical)
C Center channel and LFE
(Subwoofer)
D Line in
E Line out/front speakers
F Mic in/side surround
Product Description
Figure 4. Back Panel Audio Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 11, page 43
The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 45
The back panel audio connectors Section 2.2.1, page 42
23
Intel Desktop Board DP67BG Technical Product Specification
1.10 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mbits/s)
• Intel P67 Express Chipset
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• Conventional PCI bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
1.10.1 Intel
The Intel 82579V Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) IEEE802.3az support [Low Power Idle (LPI) mode]
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
⎯ PCI Express-based interface for active state operation (S0) state
⎯ SMBUS for host and management traffic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility
• Provides lower power usage to meet Energy Star 5.0 and ErP specifications
®
82579V Gigabit Ethernet Controller
24
Product Description
1.10.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.10.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link LED (green)
B Data Rate LED (green/yellow)
Figure 5. LAN Connector LED Locations
Table 5 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 5. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/s data rate is selected.
Green 100 Mbits/s data rate is selected.
Yellow 1000 Mbits/s data rate is selected.
25
Intel Desktop Board DP67BG Technical Product Specification
1.11 Bluetooth*/WiFi Module (optional)
The WiFi/Bluetooth*module is supplemental hardware that is included with certain
Desktop Boards.
1.11.1 Bluetooth Technology (Module)
The Bluetooth Module enables the user to connect with a variety of Bluetooth enabled
devices. Driver support is provided by Microsoft operating systems like Microsoft Vista
and Microsoft Windows 7. The Bluetooth driver stack is supplied by Microsoft but
some Bluetooth enable devices might provide additional Bluetooth features and for
proper functioning of those features, will need their own supplied drivers installed.
• CSR Bluetooth module (BC0401PC08)
• Maximum data rate 3.0Mb/s
• Forward and backward compatibility with Bluetooth v1.1, v1.2, v2.0 and v2.1
• Integrated Antenna
• Operating system support (Windows XP, Vista and 7 both 32 bit and 64 bit)
For information about Refer to
Obtaining Bluetooth information and drivers http://msdn.microsoft.com/en-
us/library/aa362932(VS.85).aspx
1.11.2 WiFi 802.11 Wireless (Module)
The WiFi Module enables the user to connect with a variety of WiFi enabled networks,
access points and allows peer to peer connections. Driver support is provided by
Microsoft operating systems like Microsoft Vista and Microsoft Windows 7 with
additional support provided by the supplied WiFi driver included on the Driver DVD and
online.
• Ralink WiFi 802.11 (RT8070)
• Range up to 300 meters
• Supports the following:
⎯ IEEE 802.11B supports up to 11 Mb/s data rate
⎯ IEEE 802.11G supports up to 54 Mb/s data rate
⎯ IEEE 802.11N supports up to 150 Mb/s data rate
• Integrated Antenna
• Operating system support (Windows XP, Vista and 7 both 32 bit and 64 bit)
For information about Refer to
Obtaining WiFi information and drivers http://msdn.microsoft.com/en-
us/library/aa362932(VS.85).aspx
26
Product Description
1.12 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.12.1 Hardware Monitoring and Fan Control
The hardware monitoring and fan control subsystem is based on the Winbond
W83677HG-I device, which supports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +3.3 V, V_SM and +VCCP
• SMBus interface
1.12.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Control Center or third-party
software.
For information about Refer to
The functions of the fan headers Section 1.13.2.2, page 33
1.12.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 11, page 43
27
Intel Desktop Board DP67BG Technical Product Specification
1.12.4 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Rear chassis fan header
B Voltage regulator thermal diode
C Thermal diode, located on processor die
D Processor fan header
E Front chassis fan header
F Thermal diode, located on the Intel P67 Express
Chipset
G Auxiliary fan header
Figure 6. Thermal Sensors and Fan Headers
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