Intel BLKDP55WG - P55 LG1156 MAX-16 GB DDR3 ATX Motherboard, DP55WG Technical Product Specification

Intel® Desktop Board DP55WG
Technical Product Specification
September 2009
Order Number: E70715-001US
The Intel® Desktop Board DP55WG may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DP55WG Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DP55WG Technical Product Specification
This product specification applies to only the standard Intel® Desktop Board DP55WG with BIOS identifier KGIBX10J.86A.
Changes to this specification will be published in the Intel Desktop Board DP55WG Specification Update before being incorporated into a revision of this document.
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®
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desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
September 2009
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Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
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Copyright © 2009, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the
®
Intel
Desktop Board DP55WG.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop Board DP55WG and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DP55WG 2 A map of the resources of the Intel Desktop Board 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes 5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
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Intel Desktop Board DP55WG Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mbit Megabit (1,048,576 bits) Mbits/s Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 System Memory .............................................................................. 15
1.5.1 Memory Configurations ......................................................... 16
1.6 Intel® P55 Express Chipset ............................................................... 18
1.6.1 USB ................................................................................... 18
1.6.2 SATA Interfaces ................................................................... 18
1.7 Real-Time Clock Subsystem .............................................................. 19
1.8 Legacy I/O Controller ....................................................................... 20
1.8.1 Consumer Infrared (CIR)....................................................... 20
1.9 Audio Subsystem............................................................................. 21
1.9.1 Audio Subsystem Software .................................................... 21
1.9.2 Audio Connectors and Headers ............................................... 21
1.9.3 8-Channel (7.1) Audio Subsystem........................................... 22
1.10 LAN Subsystem............................................................................... 23
1.10.1 Intel® 82578DC Gigabit Ethernet Controller.............................. 23
1.10.2 LAN Subsystem Software....................................................... 24
1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 24
1.11 Hardware Management Subsystem .................................................... 25
1.11.1 Hardware Monitoring and Fan Control...................................... 25
1.11.2 Fan Monitoring..................................................................... 25
1.11.3 Chassis Intrusion and Detection.............................................. 25
1.11.4 Thermal Monitoring .............................................................. 26
1.12 Power Management ......................................................................... 27
1.12.1 ACPI................................................................................... 27
1.12.2 Hardware Support ................................................................ 30
1.13 Onboard Power Button ..................................................................... 35
1.13.1 ENERGY STAR* 4.0 and 5.0, E-Standby, and
ErP Compliance.................................................................... 36
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Intel Desktop Board DP55WG Technical Product Specification
2 Technical Reference
2.1 Memory Resources .......................................................................... 37
2.1.1 Addressable Memory............................................................. 37
2.1.2 Memory Map........................................................................ 39
2.2 Connectors and Headers................................................................... 39
2.2.1 Back Panel Connectors .......................................................... 40
2.2.2 Component-side Connectors and Headers ................................ 41
2.3 Jumper Block .................................................................................. 51
2.4 Mechanical Considerations ................................................................ 53
2.4.1 Form Factor......................................................................... 53
2.5 Electrical Considerations ................................................................... 54
2.5.1 Power Supply Considerations ................................................. 54
2.5.2 Fan Header Current Capability................................................ 55
2.5.3 Add-in Board Considerations .................................................. 55
2.6 Thermal Considerations .................................................................... 56
2.7 Reliability ....................................................................................... 58
2.8 Environmental ................................................................................ 58
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 59
3.2 BIOS Flash Memory Organization ....................................................... 60
3.3 Resource Configuration .................................................................... 60
3.3.1 PCI Autoconfiguration ........................................................... 60
3.4 System Management BIOS (SMBIOS)................................................. 61
3.5 Legacy USB Support ........................................................................ 61
3.6 BIOS Updates ................................................................................. 62
3.6.1 Language Support ................................................................ 62
3.6.2 Custom Splash Screen .......................................................... 63
3.7 BIOS Recovery................................................................................ 63
3.8 Boot Options................................................................................... 64
3.8.1 Optical Drive Boot ................................................................ 64
3.8.2 Network Boot....................................................................... 64
3.8.3 Booting Without Attached Devices........................................... 64
3.8.4 Changing the Default Boot Device During POST ........................ 64
3.9 Adjusting Boot Speed....................................................................... 65
3.9.1 Peripheral Selection and Configuration..................................... 65
3.9.2 BIOS Boot Optimizations ....................................................... 65
3.10 BIOS Security Features .................................................................... 66
3.11 BIOS Performance Features .............................................................. 67
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 69
4.2 BIOS Beep Codes ............................................................................ 69
4.3 Front-panel Power LED Blink Codes .................................................... 70
4.4 BIOS Error Messages ....................................................................... 70
4.5 Port 80h POST Codes ....................................................................... 71
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Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 77
5.1.1 Safety Standards.................................................................. 77
5.1.2 European Union Declaration of Conformity Statement................ 78
5.1.3 Product Ecology Statements................................................... 79
5.1.4 EMC Regulations .................................................................. 83
5.1.5 Product Certification Markings (Board Level)............................. 84
5.2 Battery Disposal Information............................................................. 85
Figures
1. Major Board Components.................................................................. 11
2. Block Diagram ................................................................................ 13
3. Memory Channel and DIMM Configuration........................................... 17
4. Back Panel Audio Connector Options .................................................. 22
5. LAN Connector LED Locations............................................................ 24
6. Thermal Sensors and Fan Headers ..................................................... 26
7. Locations of Indicator LEDs............................................................... 34
8. Location of the Onboard Power Button................................................ 35
9. Detailed System Memory Address Map ............................................... 38
10. Back Panel Connectors ..................................................................... 40
11. Component-side Connectors and Headers ........................................... 41
12. Connection Diagram for Front Panel Header ........................................ 48
13. Connection Diagram for Front Panel USB Headers ................................ 50
14. Connection Diagram for IEEE 1394a Header ........................................ 50
15. Location of the Jumper Block............................................................. 51
16. Board Dimensions ........................................................................... 53
17. Localized High Temperature Zones..................................................... 57
Tables
1. Feature Summary.............................................................................. 9
2. Components Shown in Figure 1 ......................................................... 12
3. Supported Memory Configurations ..................................................... 15
4. LAN Connector LED States................................................................ 24
5. Effects of Pressing the Power Switch .................................................. 27
6. Power States and Targeted System Power........................................... 28
7. Wake-up Devices and Events ............................................................ 29
8. System Memory Map ....................................................................... 39
9. Component-side Connectors and Headers Shown in Figure 11................ 42
10. IEEE 1394a Header.......................................................................... 43
11. Front Panel Audio Header ................................................................. 43
12. SATA Connectors............................................................................. 43
13. S/PDIF Header ................................................................................ 43
14. Chassis Intrusion Header.................................................................. 44
15. Processor, Front and Rear Chassis (4-Pin) Fan Headers ........................ 44
16. Processor Core Power Connector........................................................ 46
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Intel Desktop Board DP55WG Technical Product Specification
17. Main Power Connector...................................................................... 47
18. Front Panel Header .......................................................................... 48
19. States for a One-Color Power LED...................................................... 49
20. States for a Two-Color Power LED...................................................... 49
21. BIOS Setup Configuration Jumper Settings.......................................... 52
22. Recommended Power Supply Current Values ....................................... 54
23. Fan Header Current Capability........................................................... 55
24. Thermal Considerations for Components ............................................. 57
25. Environmental Specifications............................................................. 58
26. BIOS Setup Program Menu Bar.......................................................... 60
27. BIOS Setup Program Function Keys.................................................... 60
28. AcceptableDrives/Media Types for BIOS Recovery ................................ 63
29. Boot Device Menu Options ................................................................ 64
30. Supervisor and User Password Functions............................................. 66
31. BIOS Beep Codes ............................................................................ 69
32. Front-panel Power LED Blink Codes.................................................... 70
33. BIOS Error Messages ....................................................................... 70
34. Port 80h POST Code Ranges.............................................................. 71
35. Port 80h POST Codes ....................................................................... 72
36. Typical Port 80h POST Sequence........................................................ 75
37. Safety Standards............................................................................. 77
38. Lead-Free Board Markings ................................................................ 82
39. EMC Regulations ............................................................................. 83
40. Product Certification Markings ........................................................... 84
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1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Audio Intel® High Definition Audio subsystem using the Realtek* ALC889 audio codec Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CIR)
Peripheral Interfaces
BIOS
Instantly Available PC Technology
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
®
Intel
Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs
Support for 1 Gb and 2 Gb memory technology
Support for up to 16 GB of system memory with four DIMMs using 2 Gb
Support for non-ECC memory
Support for 1.35 V low voltage JEDEC memory
Intel Hub (PCH)
Fourteen USB 2.0 ports:
Six internal Serial ATA (SATA) 3.0 Gb/s interfaces through the Intel P55 PCH
Two IEEE 1394a ports:
Intel
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
Support for PCI* Local Bus Specification Revision 2.2
Support for PCI Express* Revision 2.0
Suspend to RAM support
Wake on PCI, PCI Express, LAN, front panel, CIR, and USB ports
Core™ i5 and Intel® Core™ i5 processors in an LGA1156 socket:
1 x16 PCIe 2.0 Graphics interface (operates in x8 mode when second slot
is populated)
1 x8 PCIe 2.0 Graphics interface Two DDR3 memory channels
memory technology
®
P55 Express Chipset consisting of the Intel
Eight ports are implemented with stacked back panel connectors Three internal headers support six additional ports
with RAID support (black)
One port via a back panel connector One port via a front-panel header (blue)
®
BIOS resident in the SPI Flash device
and SMBIOS
®
P55 Platform Controller
continued
9
Intel Desktop Board DP55WG Technical Product Specification
Table 1. Feature Summary (continued)
LAN Support
Expansion Capabilities
Hardware Monitor Subsystem
Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel Ethernet Controller
One PCI Express 2.0 x16 (x8 when the PCI Express x8 connector is used) bus
add-in card connector (blue)
One PCI Express 2.0 x8 bus add-in card connector (blue)
One PCI Express x4 bus add-in card connector from the PCH
Two PCI Express x1 bus add-in card connectors from the PCH
Two PCI conventional bus connectors from the PCH
Hardware monitoring and fan control ASIC Heceta 6P
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
Three fan headers using PWM control
Two fan sense inputs used to monitor fan activity
Fan speed control using voltage control for 4-pin fan headers (processor and
front and rear chassis) with selectable support in BIOS for 3 wire fans
Support for Platform Environmental Control Interface (PECI)
®
82578DC Gigabit
10
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DP55WG.
Table 2 lists the components identified in Figure 1.
Figure 1. Major Board Components
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Intel Desktop Board DP55WG Technical Product Specification
Table 2. Components Shown in Figure 1
Item/callout from Figure 1 Descript
A PCI bus connector B PCI Express 2.0 x4 connector C PCI bus connector D PCI Express 2.0 x8 connector E Front panel audio header F S/PDIF header G PCI Express 2.0 x1 connector H Rear chassis fan header I PCI Express 2.0 x1 connector J PCI Express 2.0 x16 connector K Battery L Back panel connectors M 12 V processor core voltage connector (2 x 4) N Processor fan header O Processor LED (red) P Voltage regulator LED (red) Q Processor socket R POST code LED display S DIMM Channel A socket T DIMM Channel B socket U Onboard power button V Standby power indicator LED (green) W Main power connector (2 x 12) X SATA drive activity LED (blue) Y Front panel header Z Back panel CIR emitter (output) header AA Front panel CIR receiver (input) header BB Alternate front panel power LED header CC Front chassis fan header DD USB 2.0 headers (2) EE IEEE 1394a header FF Intel P55 Express Chipset GG BIOS configuration jumper block HH Serial ATA connectors II Chassis intrusion header JJ USB 2.0 header KK Speaker LL Auxiliary PCI Express graphics power connector (SATA-style)
ion
12
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
13
Intel Desktop Board DP55WG Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following:
No parallel port connector
No floppy drive connector
No serial port connector or header
No PS/2 connectors
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DP55WG http://www.intel.com/products/motherboard/DP55WG/index.htm Desktop Board Support http://support.intel.com/support/motherboards/desktop Available configurations for the Intel
Desktop Board DP55WG Supported processors http://processormatch.intel.com Chipset information http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com Tested memory http://support.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://www.intel.com/products/motherboard/DP55WG/index.htm
025414.htm
1.4 Processor
The board is designed to support the Intel Core i7 and Intel Core i5 processors in an LGA1156 socket
Other processors may be supported in the future. This board is designed to support processors with a maximum wattage of 95 W with margin to allow for greater than 130 W. The processors listed above are only supported when falling within the wattage requirements of the Intel Desktop Board DP55WG. See the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 54 for information on power supply requirements for this board.
14
Product Description
1.5 System Memory
The board has four DIMM sockets and supports the following memory features:
1.35 V DDR3 SDRAM DIMMs (New JEDEC Specification)
Two independent memory channels with interleaved mode support
Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
16 GB maximum total system memory (with 2 Gb memory technology). Refer to
Section 2.1.1 on page 37 for information on the total amount of addressable memory.
Minimum total system memory: 1 GB using 512 MB x16 module
Non-ECC DIMMs
Serial Presence Detect
DDR3 1600 MHz, 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs
XMP version 1.2 performance profile support for memory speeds above 1333 MHz
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM Capacity
1024 MB SS 1 Gbit 128 M x 8/empty 8 2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16 2048 MB SS 2 Gbit 256 M x 8/empty 8 4096 MB DS 2 Gbit 256 M x8/256 M x 8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm
Configuration
(Note)
SDRAM Density
025414.htm
SDRAM Organization Front-side/Back-side
Number of SDRAM Devices
15
Intel Desktop Board DP55WG Technical Product Specification
1.5.1 Memory Configurations
The Intel Core i7 and Intel Core i5 processors supports the following types of memory organization:
Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
16
Figure 3 illustrates the memory channel and DIMM configuration.
Product Description
Figure 3. Memory Channel and DIMM Configuration
NOTE
For the system to boot, always install memory into the blue DIMM memory slots if only installing two DIMMs in your configuration.
17
Intel Desktop Board DP55WG Technical Product Specification
1.6 Intel
The Intel P55 Express Chipset consisting of the Intel P55 Express Platform Controller Hub (PCH) provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and PCIe interfaces. The PCH is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel P55 Express Chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2
®
P55 Express Chipset
1.6.1 USB
The board supports up to fourteen USB 2.0 ports, supports EHCI, and has two internal hubs (RMH) that allow the use of EHCI-compatible drivers.
The PCH provides the USB controller for all ports. The port arrangement is as follows:
Eight ports are implemented with stacked back panel connectors
Three internal headers that support six additional ports
For information about Refer to
The location of the USB connectors on the back panel Figure 10, page 40 The location of the front panel USB headers Figure 11, page 41
1.6.2 SATA Interfaces
The board provides six internal SATA connectors through the PCH, which support one device per connector.
The PCH provides independent SATA ports with a theoretical maximum transfer rate of 3 Gb/s per port. One device can be installed on each port for a maximum of six SATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA (PATA) IDE which supports a master/slave configuration and two devices per channel.
For compatibility, the underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP, Windows Vista*, and Windows 7* operating systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 11, page 41
.
18
Product Description
1.6.2.1 SATA RAID
The board supports the following RAID (Redundant Array of Independent Drives) levels via the PCH:
RAID 0 - data striping
RAID 1 - data mirroring
RAID 0+1 (or RAID 10) - data striping and mirroring
RAID 5 - distributed parity
RAID functionality is only supported when using drives connected to the six SATA connectors (black) from the PCH.
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS. Also, during Microsoft Windows XP installation, you must press F6 to install the RAID drivers. See your Microsoft Windows XP documentation for more information about installing drivers during installation. Both Microsoft Windows Vista and Microsoft Windows 7 include the necessary RAID drivers for both AHCI and RAID without the need to install separate RAID drivers using the F6 switch in the operating system installation process.
1.7 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail date and time values will be reset and the user will be notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
19
Intel Desktop Board DP55WG Technical Product Specification
1.8 Legacy I/O Controller
The I/O controller provides the following features:
Consumer Infrared (CIR) headers
Serial IRQ interface compatible with serialized IRQ support for PCI systems
Intelligent power management, including a programmable wake-up event interface
PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.8.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the supported operating systems.
The CIR feature is made up of two separate pieces: the receiving (receiver) header, and the output (emitter) header. The receiving header consists of a filtered translated infrared input compliant with Microsoft CIR specifications, and also a “learning” infrared input. This learning input is simply a high pass input which the computer can use to “learn” to speak the infrared communication language of other user remotes. The emitter header consists of two output ports which the PC can use to emulate “learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to plug into Intel Desktop Boards for this feature to work.
20
Product Description
1.9 Audio Subsystem
The board supports the Intel High Definition Audio subsystem based on the Realtek ALC889 audio codec. The audio subsystem supports the following features:
Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type.
Stereo input and output for all back panel jacks
Line out and Mic in functions for front panel audio jacks
A signal-to-noise (S/N) ratio of 90 dB
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 14
1.9.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio headers include the following:
Front panel audio (a 2 x 5-pin header that provides mic in and line out signals for
front panel audio connectors) (yellow)
S/PDIF audio header (1 x 4-pin header) (yellow)
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 11, page 41 The signal names of the front panel audio header and S/PDIF header Section 2.2, page 39 The back panel audio connectors Section 2.2.1, page 40
21
Intel Desktop Board DP55WG Technical Product Specification
1.9.3 8-Channel (7.1) Audio Subsystem
The 8-channel (7.1) audio subsystem includes the following:
Intel P55 PCH
Realtek ALC889 audio codec
Microphone input that supports a single dynamic, condenser, or electret
microphone
The back panel audio connectors are configurable through the audio device drivers. The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A S/PDIF Optical input B S/PDIF Optical output C Surround left/right channel audio out/Retasking Jack D Center channel and LFE (subwoofer) audio out/Retasking Jack E Line in (Side Channel Surround) audio out/Retasking Jack F Line out/Headphone (Stereo)/Retasking Jack G Mic in H Side Surround
Figure 4. Back Panel Audio Connector Options
For information about Refer to
The back panel audio connectors Section 2.2.1, page 40
22
1.10 LAN Subsystem
The LAN subsystem consists of the following:
Intel 82578DC Gigabit Ethernet Controller (10/100/1000 Mbits/s)
Intel 82801IJR (PCH)
RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
CSMA/CD protocol engine
LAN connect interface between the PCH and the LAN controller
PCI Conventional bus power management ACPI technology support LAN wake capabilities
LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
Product Description
1.10.1 Intel
The Intel 82578DC Gigabit Ethernet Controller supports the following features:
10/100/1000 BASE-T IEEE 802.3 compliant
PCI Express link
Compliant to IEEE 802.3x flow control support
802.1p and 802.1q
TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
Transmit TCP segmentation
Full device driver compatibility
PCI Express power management support
®
82578DC Gigabit Ethernet Controller
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Intel Desktop Board DP55WG Technical Product Specification
1.10.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.10.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below).
Item Description
A Link LED (green) B Data Rate LED (green/yellow)
Figure 5. LAN Connector LED Locations
Table 4 describes the LED states when the board is powered up and the LAN subsystem is operating.
Table 4. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established. Blinking LAN activity is occurring. Off 10 Mbits/s data rate is selected. Green 100 Mbits/s data rate is selected. Yellow 1000 Mbits/s data rate is selected.
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Product Description
1.11 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:
Fan monitoring and control
Thermal and voltage monitoring
Chassis intrusion detection
1.11.1 Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
Fan speed control controllers and sensors provided by the Hardware Monitoring and Fan Control ASIC
Thermal sensors in the processor and PCH
Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.1 V, and
+VCCP) to detect levels above or below acceptable values
Thermally monitored closed-loop fan control, for all three fans, that can adjust the fan speed or switch the fans on or off as needed
1.11.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Control Center or third-party software.
For information about Refer to
The functions of the fan headers Section 1.12.2.2, page 31
1.11.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 11, page 41
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Intel Desktop Board DP55WG Technical Product Specification
1.11.4 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Rear chassis fan header B Processor fan header C Thermal diode, located on processor die D Front chassis fan header E Thermal diode, located on the Intel P55 Express
Chipset
F Auxiliary fan header
Figure 6. Thermal Sensors and Fan Headers
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Product Description
1.12 Power Management
Power management is implemented at several levels, including:
Software support through Advanced Configuration and Power Interface (ACPI)
Hardware support: Power connector Fan headers LAN wake capabilities Instantly Available PC technology Wake from USB Power Management Event signal (PME#) wake-up support PCI Express WAKE# signal support
Wake from Consumer IR
1.12.1 ACPI
ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include:
Plug and Play (including bus and device enumeration)
Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state
A Soft-off feature that enables the operating system to power-off the computer
Support for multiple wake-up events (see Table 7 on page 29)
Support for a front panel power and sleep mode switch
Table 5 lists the system states based on how long the power switch is pressed, dependi
ng on how ACPI is configured with an ACPI-aware operating system.
Table 5. Effects of Pressing the Power Switch
If the system is in this state…
Off (ACPI G2/G5 – Soft off)
On (ACPI G0 – working state)
On (ACPI G0 – working state)
Sleep (ACPI G1 – sleeping state)
Sleep (ACPI G1 – sleeping state)
…and the power switch is pressed for
Less than four seconds Power-on
Less than four seconds Soft-off/Standby
More than six seconds Fail safe power-off
Less than four seconds Wake-up
More than six seconds Power-off
…the system enters this state
(ACPI G0 – working state)
(ACPI G1 – sleeping state)
(ACPI G2/G5 – Soft off)
(ACPI G0 – working state)
(ACPI G2/G5 – Soft off)
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