Intel BLKDP55KG - LG1156 MAX-16 GB DDR3 ATX Motherboard, DP55KG Technical Product Specification
Intel® Desktop Board
DP55KG
Technical Product Specification
September 2009
Order Number: E70713-001US
The Intel® Desktop Board DP55KG may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DP55KG Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Board DP55KG Technical Product
Specification
This product specification applies to only the standard Intel® Desktop Board DP55KG with BIOS
identifier KGIBX10J.86A.
Changes to this specification will be published in the Intel Desktop Board DP55KG Specification
Update before being incorporated into a revision of this document.
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®
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September 2009
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deviate from published specifications. Current characterized errata are available on request.
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Copyright © 2009, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
®
Intel
Desktop Board DP55KG.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DP55KG and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DP55KG
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DP55KG Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 System Memory .............................................................................. 15
1.5.1 Memory Configurations ......................................................... 16
1.6 Intel® P55 Express Chipset ............................................................... 18
1.6.1 USB ................................................................................... 18
1.6.2 SATA Interfaces ................................................................... 19
1.7 Discrete SATA Controller .................................................................. 20
1.7.1 eSATA Support .................................................................... 20
1.8 Real-Time Clock Subsystem .............................................................. 20
1.9 Legacy I/O Controller ....................................................................... 21
1.9.1 Consumer Infrared (CIR)....................................................... 21
1.10 Audio Subsystem............................................................................. 22
1.10.1 Audio Subsystem Software .................................................... 22
1.10.2 Audio Connectors and Headers ............................................... 22
1.10.3 8-Channel (7.1) Audio Subsystem........................................... 23
1.11 LAN Subsystem............................................................................... 24
1.11.1 Intel® 82578DC Gigabit Ethernet Controller.............................. 24
1.11.2 LAN Subsystem Software....................................................... 25
1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................. 25
1.12 Bluetooth* Technology Support......................................................... 26
1.13 Hardware Management Subsystem .................................................... 26
1.13.1 Hardware Monitoring and Fan Control...................................... 26
1.13.2 Fan Monitoring..................................................................... 27
1.13.3 Chassis Intrusion and Detection.............................................. 27
1.13.4 Thermal Monitoring .............................................................. 28
1.14 Power Management ......................................................................... 29
1.14.1 ACPI................................................................................... 29
1.14.2 Hardware Support ................................................................ 32
1.15 Onboard Power Button ..................................................................... 37
1.15.1 ENERGY STAR* 4.0 and 5.0, E-Standby, and
ErP Compliance.................................................................... 38
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Intel Desktop Board DP55KG Technical Product Specification
2 Technical Reference
2.1 Memory Resources .......................................................................... 39
2.1.1 Addressable Memory............................................................. 39
2.1.2 Memory Map........................................................................ 41
2.2 Connectors and Headers................................................................... 41
2.2.1 Back Panel Connectors .......................................................... 42
2.2.2 Component-side Connectors and Headers ................................ 43
2.3 Jumper Block .................................................................................. 53
2.4 Mechanical Considerations ................................................................ 55
2.4.1 Form Factor......................................................................... 55
2.5 Electrical Considerations ................................................................... 56
2.5.1 Power Supply Considerations ................................................. 56
2.5.2 Fan Header Current Capability................................................ 57
2.5.3 Add-in Board Considerations .................................................. 57
2.6 Thermal Considerations .................................................................... 58
2.7 Reliability ....................................................................................... 60
2.8 Environmental ................................................................................ 60
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 61
3.2 BIOS Flash Memory Organization ....................................................... 62
3.3 Resource Configuration .................................................................... 62
3.3.1 PCI Autoconfiguration ........................................................... 62
3.4 System Management BIOS (SMBIOS)................................................. 63
3.5 Legacy USB Support ........................................................................ 63
3.6 BIOS Updates ................................................................................. 64
3.6.1 Language Support ................................................................ 64
3.6.2 Custom Splash Screen .......................................................... 65
3.7 BIOS Recovery................................................................................ 65
3.8 Boot Options................................................................................... 66
3.8.1 Optical Drive Boot ................................................................ 66
3.8.2 Network Boot....................................................................... 66
3.8.3 Booting Without Attached Devices........................................... 66
3.8.4 Changing the Default Boot Device During POST ........................ 66
3.9 Adjusting Boot Speed....................................................................... 67
3.9.1 Peripheral Selection and Configuration..................................... 67
3.9.2 BIOS Boot Optimizations ....................................................... 67
3.10 BIOS Security Features .................................................................... 68
3.11 BIOS Performance Features .............................................................. 69
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 71
4.2 BIOS Beep Codes ............................................................................ 71
4.3 Front-panel Power LED Blink Codes .................................................... 72
4.4 BIOS Error Messages ....................................................................... 72
4.5 Port 80h POST Codes ....................................................................... 73
vi
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 79
5.1.1 Safety Standards.................................................................. 79
5.1.2 European Union Declaration of Conformity Statement................ 80
5.1.3 Product Ecology Statements................................................... 81
5.1.4 EMC Regulations .................................................................. 85
5.1.5 Product Certification Markings (Board Level)............................. 86
5.2 Battery Disposal Information............................................................. 87
Figures
1. Major Board Components.................................................................. 11
2. Block Diagram ................................................................................ 13
3. Memory Channel and DIMM Configuration........................................... 17
4. Back Panel Audio Connector Options .................................................. 23
5. LAN Connector LED Locations............................................................ 25
6. Thermal Sensors and Fan Headers ..................................................... 28
7. Locations of Indicator LEDs............................................................... 36
8. Location of the Onboard Power Button................................................ 37
9. Detailed System Memory Address Map ............................................... 40
10. Back Panel Connectors ..................................................................... 42
11. Component-side Connectors and Headers ........................................... 43
12. Connection Diagram for Front Panel Header ........................................ 50
13. Connection Diagram for Front Panel USB Headers ................................ 52
14. Connection Diagram for IEEE 1394a Header ........................................ 52
15. Location of the Jumper Block............................................................. 53
16. Board Dimensions ........................................................................... 55
17. Localized High Temperature Zones..................................................... 59
Tables
1. Feature Summary.............................................................................. 9
2. Components Shown in Figure 1 ......................................................... 12
3. Supported Memory Configurations ..................................................... 15
4. LAN Connector LED States................................................................ 25
5. Effects of Pressing the Power Switch .................................................. 29
6. Power States and Targeted System Power........................................... 30
7. Wake-up Devices and Events ............................................................ 31
8. System Memory Map ....................................................................... 41
9. Component-side Connectors and Headers Shown in Figure 11................ 44
10. Front Panel Audio Header ................................................................. 45
11. SATA Connectors............................................................................. 45
12. S/PDIF Header ................................................................................ 45
13. Chassis Intrusion Header.................................................................. 46
14. Processor, Front and Rear Chassis, and Auxiliary (4-Pin)
Fan Headers ................................................................................... 46
15. Processor Core Power Connector........................................................ 48
vii
Intel Desktop Board DP55KG Technical Product Specification
16. Main Power Connector...................................................................... 49
17. Front Panel Header .......................................................................... 50
18. States for a One-Color Power LED...................................................... 51
19. States for a Two-Color Power LED...................................................... 51
20. BIOS Setup Configuration Jumper Settings.......................................... 54
21. Recommended Power Supply Current Values ....................................... 56
22. Fan Header Current Capability........................................................... 57
23. Thermal Considerations for Components ............................................. 59
24. Environmental Specifications............................................................. 60
25. BIOS Setup Program Menu Bar.......................................................... 62
26. BIOS Setup Program Function Keys.................................................... 62
27. Acceptable Drives/Media Types for BIOS Recovery ............................... 65
28. Boot Device Menu Options ................................................................ 66
29. Supervisor and User Password Functions............................................. 68
30. BIOS Beep Codes ............................................................................ 71
31. Front-panel Power LED Blink Codes.................................................... 72
32. BIOS Error Messages ....................................................................... 72
33. Port 80h POST Code Ranges.............................................................. 73
34. Port 80h POST Codes ....................................................................... 74
35. Typical Port 80h POST Sequence........................................................ 77
36. Safety Standards............................................................................. 79
37. Lead-Free Board Markings ................................................................ 84
38. EMC Regulations ............................................................................. 85
39. Product Certification Markings ........................................................... 86
viii
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor
Processor
Memory
Chipset
Audio Intel® High Definition Audio subsystem using the Realtek* ALC889 audio codec
Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CIR)
Peripheral
Interfaces
Wireless Interface
BIOS
ATX (12.00 inches by 9.60 inches [304.80 millimeters by 243.84 millimeters])
®
• Intel
• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1600 MHz, DDR3 1333 MHz, and DDR3 1066 MHz DIMMs
• Support for 1 Gb and 2 Gb memory technology
• Support for up to 16 GB of system memory with four DIMMs using 2 Gb
• Support for non-ECC memory
• Support for 1.35 V low voltage JEDEC memory
Intel
Hub (PCH)
• Fourteen USB 2.0 ports:
• Eight internal Serial ATA (SATA) 3.0 Gb/s interfaces:
• Two back panel External Serial ATA (eSATA) 3.0 Gb/s ports (red) through a
• Two IEEE 1394a ports:
• Onboard Bluetooth module with a connector for an external antenna
• Intel
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
Core™ i7 and Intel® Core™ i5 processors in an LGA1156 socket:
― 1 x16 PCIe 2.0 Graphics interface (operates in x8 mode when second slot
is populated)
― 1 x8 PCIe 2.0 Graphics interface
― Two DDR3 memory channels
memory technology
®
P55 Express Chipset consisting of the Intel
― Eight ports are implemented with stacked back panel connectors
― Two internal headers support four additional ports
― One vertical connector
― One port used to connect the onboard Bluetooth* Module
― Six interfaces through Intel P55 PCH with RAID support (black)
― Two interfaces through a discrete Marvell* controller 88E6145 (blue)
discrete Marvell controller
― One port via a back panel connector
― One port via a front-panel header (blue)
®
BIOS resident in the SPI Flash device
and SMBIOS
®
P55 Platform Controller
continued
9
Intel Desktop Board DP55KG Technical Product Specification
Table 1. Feature Summary (continued)
Instantly Available
PC Technology
LAN Support
Expansion
Capabilities
Hardware Monitor
Subsystem
• Support for PCI* Local Bus Specification Revision 2.2
• Support for PCI Express* Revision 2.0
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, CIR, and USB ports
Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel
Ethernet Controller
• One PCI Express 2.0 x16 (x8 when the PCI Express x8 connector is used) bus
add-in card connector (blue)
• One PCI Express 2.0 x8 bus add-in card connector (blue)
• Two PCI Express x1 bus add-in card connectors from the PCH
• One PCI Express x4 bus add-in card connector from the PCH
• Two PCI conventional bus connectors from the PCH
• Hardware monitoring and fan control ASIC Heceta 6P
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Four fan headers using PWM control
• Four fan sense inputs used to monitor fan activity
• Fan speed control using voltage control (4-pin fan headers front, rear and Aux)
with selectable support in BIOS for 3 wire fans
• Support for Platform Environmental Control Interface (PECI)
®
82578DC Gigabit
10
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DP55KG.
Table 2 lists the components identified in Figure 1.
Figure 1. Major Board Components
11
Intel Desktop Board DP55KG Technical Product Specification
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A PCI Conventional bus add-in card connector
B PCI Express x4 bus add-in card connector
C PCI Conventional bus add-in card connector
D PCI Express x8 bus add-in card connector
E Front panel audio header
F S/PDIF out header
G PCI Express x1 bus add-in card connector
H Rear chassis fan header
I PCI Express x1 bus add-in card connector
J PCI Express x16 bus add-in card connector
K Battery
L Back panel connectors
M Vertical USB connector
N Processor core power connector (2 X 4)
O Processor fan header
P Processor LED (red)
Q Voltage Regulator LED (red)
R LGA1156 processor socket
S Post Code LED Display
T DIMM Channel A sockets (2)
U DIMM Channel B sockets (2)
V Onboard power button
W Standby power indicator LED (green)
X Main power connector
Y Front panel header
Z Front panel CIR receiver (input) header
AA Back panel CIR emitter (output) header
BB Alternate front panel power LED header
CC Front chassis fan header
DD Front panel USB headers (2)
EE IEEE 1394a front panel header
FF Intel P55 Platform Controller Hub (PCH)
GG BIOS Setup configuration jumper block
HH SATA connectors
II Chassis intrusion header
JJ Onboard Bluetooth module with external antenna
KK Piezo Speaker
LL Auxiliary PCI Express graphics power connector (SATA-style)
MM Auxiliary fan header
12
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
13
Intel Desktop Board DP55KG Technical Product Specification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port connector
• No floppy drive connector
• No serial port connector or header
• No PS/2 connectors
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DP55KG http://www.intel.com/products/motherboard/DP55KG/index.htm
Desktop Board Support http://support.intel.com/support/motherboards/desktop
Available configurations for the Intel
Desktop Board DP55KG
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://support.intel.com/support/motherboards/desktop/sb/CS-
Integration information http://www.intel.com/support/go/buildit
http://www.intel.com/products/motherboard/DP55KG/index.htm
025414.htm
1.4 Processor
The board is designed to support the Intel Core i7 and Intel Core i5 processors in an
LGA1156 socket
Other processors may be supported in the future. This board is designed to support
processors with a maximum wattage of 95 W with margin to allow for greater than
130 W. The processors listed above are only supported when falling within the
wattage requirements of the Intel Desktop Board DP55KG. See the Intel web site
listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 56 for information on power supply requirements for this board.
14
Product Description
1.5 System Memory
The board has four DIMM sockets and supports the following memory features:
• 1.35 V DDR3 SDRAM DIMMs (New JEDEC Specification)
• Two independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 16 GB maximum total system memory (with 2 Gb memory technology). Refer to
Section 2.1.1 on page 39 for information on the total amount of addressable
memory.
• Minimum total system memory: 1 GB using 512 MB x16 module
• Non-ECC DIMMs
• Serial Presence Detect
• DDR3 1600 MHz, 1333 MHz, and DDR3 1066 MHz SDRAM DIMMs
• XMP version 1.2 performance profile support for memory speeds above 1333 MHz
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Capacity
1024 MB SS 1 Gbit 128 M x 8/empty 8
2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16
2048 MB SS 2 Gbit 256 M x 8/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x 8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm
Configuration
(Note)
SDRAM
Density
025414.htm
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
15
Intel Desktop Board DP55KG Technical Product Specification
1.5.1 Memory Configurations
The Intel Core i7 and Intel Core i5 processors supports the following types of memory
organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
16
Figure 3 illustrates the memory channel and DIMM configuration.
Product Description
Figure 3. Memory Channel and DIMM Configuration
NOTE
For the system to boot, always install memory into the blue DIMM memory slots if
only installing two DIMMs in your configuration.
17
Intel Desktop Board DP55KG Technical Product Specification
1.6 Intel
®
P55 Express Chipset
The Intel P55 Express Chipset consisting of the Intel P55 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and
PCIe interfaces. The PCH is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel P55 Express Chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1 USB
The board supports up to fourteen USB 2.0 ports, supports EHCI, and has two internal
hubs (RMH) that allow the use of EHCI-compatible drivers.
The PCH provides the USB controller for all ports. The port arrangement is as follows:
• Eight ports are implemented with stacked back panel connectors
• Two internal headers that support four additional ports
• One onboard vertical USB connector that supports one port
• One port used to connect the onboard Bluetooth Module
For information about Refer to
The location of the USB connectors on the back panel Figure 10, page 42
The location of the front panel USB headers Figure 11, page 43
18
Product Description
1.6.2 SATA Interfaces
The board provides eight internal SATA connectors. Six connectors (black) are through
the PCH, which support one device per connector, and two additional connectors
(blue) from a discrete controller.
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
3 Gb/s per port. One device can be installed on each port for a maximum of eight
SATA devices. A point-to-point interface is used for host to device connections, unlike
Parallel ATA (PATA) IDE which supports a master/slave configuration and two devices
per channel.
For compatibility, the underlying SATA functionality is transparent to the operating
system. The SATA controller can operate in both legacy and native modes. In legacy
mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native
mode, standard PCI Conventional bus resource steering is used. Native mode is the
preferred mode for configurations using the Windows* XP, Windows Vista*, and
Windows 7* operating systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the SATA connectors Figure 11, page 43
.
1.6.2.1 SATA RAID
The board supports the following RAID (Redundant Array of Independent Drives)
levels via the PCH:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
RAID functionality is only supported when using drives connected to the six SATA
connectors (black) from the PCH.
NOTE
In order to use supported RAID features, you must first enable RAID in the BIOS.
Also, during Microsoft Windows XP installation, you must press F6 to install the RAID
drivers. See your Microsoft Windows XP documentation for more information about
installing drivers during installation. Both Microsoft Windows Vista and Microsoft
Windows 7 include the necessary RAID drivers for both AHCI and RAID without the
need to install separate RAID drivers using the F6 switch in the operating system
installation process.
19
Intel Desktop Board DP55KG Technical Product Specification
1.7 Discrete SATA Controller
The board includes a discrete Marvell 88E6145 SATA controller that provides two
internal SATA ports (blue) and two eSATA ports (red) on the back panel.
1.7.1 eSATA Support
The red eSATA connectors on the back panel can be used to connect an eSATA drive.
They can also be used for port replication, which allows the aggregation of multiple
hard drives on each of the eSATA ports. Figure 10 on page 42 shows the location of
the External SATA -compatible SATA ports on the back panel.
The Marvell 88E6145 controller uses the PCI Express bus for data transfer with a
theoreti
addition to the six SATA connectors of the PCH SATA interface.
To use the eSATA ports you must enable RAID support in the BIOS for the Marvell
discrete controller. The two internal ports can stay in the default IDE mode if RAID is
not required.
maximum transfer rate of 3 Gb/s per port. These connectors are in
cal
The discrete SATA interface supports the following RAID levels:
• RAID 0
• RAID 1
NOTE
The Marvell 88E6145 controller supports single drive non-RAID configurations as well
as RAID configurations. For RAID configurations, you must install the RAID drivers by
pressing F6 during operating system installation. See your operating system
installation documentation for more information about installing drivers during the
installation process.
1.8 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at
25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC power fail date and time values will be reset and the user will be
notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
20
Product Description
1.9 Legacy I/O Controller
The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.9.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the
supported operating systems.
The CIR feature is made up of two separate pieces: the receiving (receiver) header,
and the output (emitter) header. The receiving header consists of a filtered translated
infrared input compliant with Microsoft CIR specifications, and also a “learning”
infrared input. This learning input is simply a high pass input which the computer can
use to “learn” to speak the infrared communication language of other user remotes.
The emitter header consists of two output ports which the PC can use to emulate
“learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to plug into Intel
Desktop Boards for this feature to work.
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Intel Desktop Board DP55KG Technical Product Specification
1.10 Audio Subsystem
The board supports the Intel High Definition Audio subsystem based on the Realtek
ALC889 audio codec. The audio subsystem supports the following features:
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output for all back panel jacks
• Line out and Mic in functions for front panel audio jacks
• A signal-to-noise (S/N) ratio of 90 dB
1.10.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.3, page 14
1.10.2 Audio Connectors and Headers
The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include the
following:
• Front panel audio (a 2 x 5-pin header that provides mic in and line out signals for
front panel audio connectors) (yellow)
• S/PDIF audio header (1 x 4-pin header) (yellow)
For information about Refer to
The locations of the front panel audio header and S/PDIF audio header Figure 11, page 43
The signal names of the front panel audio header and S/PDIF header Table 10, page 45
The back panel audio connectors Section 2.2.1, page 42
22
Product Description
1.10.3 8-Channel (7.1) Audio Subsystem
The 8-channel (7.1) audio subsystem includes the following:
• Intel P55 PCH
• Realtek ALC889 audio codec
• Microphone input that supports a single dynamic, condenser, or electret
microphone
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A S/PDIF Optical input
B S/PDIF Optical output
C Surround left/right channel audio out/Retasking Jack
D Center channel and LFE (subwoofer) audio out/Retasking Jack
E Line in (Side Channel Surround) audio out/Retasking Jack
F Line out/Headphone (Stereo)/Retasking Jack
G Mic in
H Side Surround
Figure 4. Back Panel Audio Connector Options
For information about Refer to
The back panel audio connectors Section 2.2.1, page 42
23
Intel Desktop Board DP55KG Technical Product Specification
1.11 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82578DC Gigabit Ethernet Controller (10/100/1000 Mbits/s)
• Intel 82801IJR (PCH)
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• PCI Conventional bus power management
⎯ ACPI technology support
⎯ LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and drivers http://downloadcenter.intel.com
1.11.1 Intel
The Intel 82578DC Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• PCI Express link
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Transmit TCP segmentation
• Full device driver compatibility
• PCI Express power management support
®
82578DC Gigabit Ethernet Controller
24
Product Description
1.11.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers http://downloadcenter.intel.com
1.11.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below).
Item Description
A Link LED (green)
B Data Rate LED (green/yellow)
Figure 5. LAN Connector LED Locations
Table 4 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 4. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not established.
Link Green
Data Rate Green/Yellow
On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/s data rate is selected.
Green 100 Mbits/s data rate is selected.
Yellow 1000 Mbits/s data rate is selected.
25
Intel Desktop Board DP55KG Technical Product Specification
1.12 Bluetooth* Technology Support
The Bluetooth Module plus external antenna enables the user to connect with a variety
of Bluetooth enabled devices. Driver support is provided by Microsoft operating
systems like Microsoft Vista and Microsoft 7. The Bluetooth driver stack is supplied by
Microsoft but some Bluetooth enable devices might provide additional Bluetooth
features and for proper functioning of those features, will need their own supplied
drivers installed.
For information about Refer to
Obtaining Bluetooth information and drivers http://msdn.microsoft.com/en-
us/library/aa362932(VS.85).aspx
1.13 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.13.1 Hardware Monitoring and Fan Control
The features of the hardware monitoring and fan control include:
• Fan speed control controllers and sensors provided by the Hardware Monitoring
and Fan Control ASIC
• Thermal sensors in the processor and PCH
• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.1 V, and
+VCCP) to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all three fans, that can adjust the
fan speed or switch the fans on or off as needed
26
Product Description
1.13.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Desktop Control Center or third-party
software.
For information about Refer to
The functions of the fan headers Section 1.14.2.2, page 33
1.13.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chassis intrusion header Figure 11, page 43
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