Intel BLKDH67VR, DH67VR Technical Product Specification

Intel® Desktop Board DH67VR

Technical Product Specification

February 2011

Order Number: G27383-001US

The Intel Desktop Board DH67VR may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DH67VR Specification Update.

Revision History

Revision Revision History Date

-001 First release of the Intel® Desktop Board DH67VR Technical Product Specification

This product specification applies to only the standard Intel® Desktop Board DH67VR with BIOS identifier BLH6710H.86A.

Changes to this specification will be published in the Intel Desktop Board DH67VR Specification Update before being incorporated into a revision of this document.

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desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal

February 2011

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

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Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

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Preface

This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel Board DH67VR.

Intended Audience

The TPS is intended to provide detailed, technical information about Intel Desktop Board DH67VR and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on Intel Desktop Board DH67VR 2 A map of the resources of the Intel Desktop Board 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes 5 Regulatory compliance and battery disposal information

Desktop

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DH67VR Technical Product Specification

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mbit Megabit (1,048,576 bits) Mbits/s Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

Contents

1 Product Description

1.1 Overview.......................................................................................... 9

1.1.1 Feature Summary .................................................................. 9

1.1.2 Board Layout ....................................................................... 11

1.1.3 Block Diagram ..................................................................... 13

1.2 Legacy Considerations...................................................................... 14

1.3 Online Support................................................................................ 14

1.4 Processor ....................................................................................... 15

1.4.1 PCI Express x16 Graphics ...................................................... 15

1.5 System Memory .............................................................................. 16

1.5.1 Memory Configurations ......................................................... 17

1.6 Intel® H67 Express Chipset ............................................................... 19

1.7 Graphics Subsystem ........................................................................ 19

1.7.1 Integrated Graphics.............................................................. 19

1.7.2 USB ................................................................................... 21

1.8 SATA Interfaces .............................................................................. 22

1.9 Real-Time Clock Subsystem .............................................................. 23

1.10 Legacy I/O Controller....................................................................... 23

1.10.1 Consumer Infrared (CIR)....................................................... 23

1.11 Audio Subsystem............................................................................. 24

1.11.1 Audio Subsystem Software .................................................... 24

1.11.2 Audio Subsystem Components ............................................... 24

1.12 LAN Subsystem............................................................................... 26

1.12.1 Intel® 82579V Gigabit Ethernet Controller................................ 26

1.12.2 LAN Subsystem Software....................................................... 27

1.12.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27

1.13 Hardware Management Subsystem .................................................... 28

1.13.1 Hardware Monitoring............................................................. 28

1.13.2 Fan Monitoring..................................................................... 28

1.13.3 Chassis Intrusion and Detection.............................................. 28

1.13.4 Thermal Monitoring .............................................................. 29

1.14 Power Management ......................................................................... 30

1.14.1 ACPI................................................................................... 30

1.14.2 Hardware Support ................................................................ 32

2 Technical Reference

2.1 Memory Resources .......................................................................... 37

2.1.1 Addressable Memory............................................................. 37

2.1.2 Memory Map........................................................................ 39

2.2 Connectors and Headers................................................................... 39

2.2.1 Back Panel Connectors .......................................................... 40

2.2.2 Component-side Connectors and Headers ................................ 41

2.3 Jumper Block .................................................................................. 50

Intel Desktop Board DH67VR Technical Product Specification

2.4 Mechanical Considerations ................................................................ 52

2.4.1 Form Factor......................................................................... 52

2.5 Electrical Considerations ................................................................... 53

2.5.1 Power Supply Considerations ................................................. 53

2.5.2 Fan Header Current Capability................................................ 54

2.5.3 Add-in Board Considerations .................................................. 54

2.6 Thermal Considerations .................................................................... 54

2.7 Reliability ....................................................................................... 57

2.8 Environmental ................................................................................ 57

3 Overview of BIOS Features

3.1 Introduction ................................................................................... 59

3.2 BIOS Flash Memory Organization ....................................................... 60

3.3 Resource Configuration .................................................................... 60

3.3.1 PCI Autoconfiguration ........................................................... 60

3.4 System Management BIOS (SMBIOS)................................................. 61

3.5 Legacy USB Support ........................................................................ 61

3.6 BIOS Updates ................................................................................. 62

3.6.1 Language Support ................................................................ 62

3.6.2 Custom Splash Screen .......................................................... 63

3.7 BIOS Recovery................................................................................ 63

3.8 Boot Options................................................................................... 64

3.8.1 Optical Drive Boot ................................................................ 64

3.8.2 Network Boot....................................................................... 64

3.8.3 Booting Without Attached Devices........................................... 64

3.8.4 Changing the Default Boot Device During POST ........................ 64

3.9 Adjusting Boot Speed....................................................................... 65

3.9.1 Peripheral Selection and Configuration..................................... 65

3.9.2 BIOS Boot Optimizations ....................................................... 65

3.10 BIOS Security Features .................................................................... 66

3.11 BIOS Performance Features .............................................................. 67

4 Error Messages and Beep Codes

4.1 Speaker ......................................................................................... 69

4.2 BIOS Beep Codes ............................................................................ 69

4.3 Front-panel Power LED Blink Codes .................................................... 70

4.4 BIOS Error Messages ....................................................................... 70

4.5 Port 80h POST Codes ....................................................................... 71

Contents

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance..................................................................... 77

5.1.1 Safety Standards.................................................................. 77

5.1.2 European Union Declaration of Conformity Statement................ 78

5.1.3 Product Ecology Statements................................................... 79

5.1.4 EMC Regulations .................................................................. 81

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 84

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 85

5.2 Battery Disposal Information............................................................. 86

Figures

1. Major Board Components.................................................................. 11

2. Block Diagram ................................................................................ 13

3. Memory Channel and DIMM Configuration........................................... 18

4. Back Panel Audio Connectors ............................................................ 25

5. LAN Connector LED Locations............................................................ 27

6. Thermal Sensors and Fan Headers ..................................................... 29

7. Location of the Standby Power LED.................................................... 36

8. Detailed System Memory Address Map ............................................... 38

9. Back Panel Connectors ..................................................................... 40

10. Component-side Connectors and Headers ........................................... 41

11. Connection Diagram for Front Panel Header ........................................ 47

12. Connection Diagram for Front Panel USB 2.0 Headers........................... 49

13. Location of the Jumper Block............................................................. 50

14. Board Dimensions ........................................................................... 52

15. Localized High Temperature Zones..................................................... 55

Tables

1. Feature Summary.............................................................................. 9

2. Components Shown in Figure 1 ......................................................... 12

3. Supported Memory Configurations ..................................................... 16

4. HDMI Port Status Conditions ............................................................. 20

5. DVI Port Status Conditions................................................................ 20

6. Audio Jack Support.......................................................................... 24

7. LAN Connector LED States................................................................ 27

8. Effects of Pressing the Power Switch .................................................. 30

9. Power States and Targeted System Power........................................... 31

10. Wake-up Devices and Events ............................................................ 32

11. System Memory Map ....................................................................... 39

12. Component-side Connectors and Headers Shown in Figure 10................ 42

13. Front Panel Audio Header for Intel HD Audio........................................ 43

14. Front Panel Audio Header for AC ’97 Audio .......................................... 43

15. Front Panel USB Headers.................................................................. 43

16. SATA Connectors............................................................................. 44

17. S/PDIF Header ................................................................................ 44

vii

Intel Desktop Board DH67VR Technical Product Specification

18. Chassis Intrusion Header.................................................................. 44

19. Processor, Front, and Rear Chassis (4-Pin) Fan Headers....................... 44

20. Back Panel CIR Emitter (Output) Header............................................. 44

21. Front Panel CIR Receiver (Input) Header............................................. 45

22. Processor Core Power Connector........................................................ 46

23. Main Power Connector...................................................................... 46

24. Front Panel Header .......................................................................... 47

25. States for a One-Color Power LED...................................................... 48

26. States for a Two-Color Power LED...................................................... 48

27. Alternate Front Panel Power/Sleep LED Header .................................... 48

28. LPC Debug Header........................................................................... 49

29. BIOS Setup Configuration Jumper Settings.......................................... 51

30. Recommended Power Supply Current Values (High Power) .................... 53

31. Recommended Power Supply Current Values (Low Power)..................... 53

32. Fan Header Current Capability........................................................... 54

33. Thermal Considerations for Components ............................................. 56

34. Tcontrol Values for Components ........................................................ 56

35. Environmental Specifications............................................................. 57

36. BIOS Setup Program Menu Bar.......................................................... 60

37. BIOS Setup Program Function Keys.................................................... 60

38. AcceptableDrives/Media Types for BIOS Recovery ................................ 63

39. Boot Device Menu Options ................................................................ 64

40. Supervisor and User Password Functions............................................. 66

41. BIOS Beep Codes ............................................................................ 69

42. Front-panel Power LED Blink Codes.................................................... 70

43. BIOS Error Messages ....................................................................... 70

44. Port 80h POST Code Ranges.............................................................. 71

45. Port 80h POST Codes ....................................................................... 72

46. Typical Port 80h POST Sequence........................................................ 76

47. Safety Standards............................................................................. 77

48. EMC Regulations ............................................................................. 81

49. Regulatory Compliance Marks............................................................ 85

viii

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of the board.

Table 1. Feature Summary

Form Factor

Processor

Memory

Chipset

Graphics

Audio

Peripheral Interfaces

MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters])

• Intel

• Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets

• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs

• Support for 1 Gb, 2 Gb, and 4 Gb memory technology

• Support for up to 32 GB of system memory with four DIMMs using 4 Gb

• Support for non-ECC memory

• Support for 1.35 V low voltage JEDEC memory

Intel Controller Hub (PCH)

• Integrated graphics support for processors with Intel Graphics Technology:

• Discrete graphics support for PCI Express 2.0 x16 add-in graphics card

• 10-channel (7.1 + 2) Intel High Definition Audio via the Realtek ALC892 audio

• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)

• Twelve USB 2.0 ports:

Core™ i7, Intel® Core™ i5, and Intel® Core™ i3 processors with up to

95W TDP in an LGA1155 socket

― One PCI Express* 2.0 x16 graphics interface ― Integrated memory controller with dual channel DDR3 memory support ― Integrated graphics processing (processors with Intel

Technology)

― External graphics interface controller

memory technology

H67 Express Chipset consisting of the Intel

― High Definition Multimedia Interface* (HDMI*) ― DVI-I

codec

― Four ports are implemented with stacked back panel connectors (black) ― Eight front panel ports implemented through four internal headers

Two SATA 6.0 Gb/s interfaces through Intel H67 Express Chipset with

Rapid Storage Technology RAID support (blue)

Intel

Graphics

H67 Express Platform

continued

Intel Desktop Board DH67VR Technical Product Specification

Table 1. Feature Summary (continued)

Expansion Capabilities

BIOS

Instantly Available PC Technology

LAN Support

Legacy I/O Control Nuvoton W83677HG-i I/O controller for CIR and hardware management support

Hardware Monitor Subsystem

• One PCI Express 2.0 x16 add-in card connector

• Two PCI Express 2.0 x1 add-in card connectors

• One Conventional PCI bus connector

• Intel

BIOS resident in the SPI Flash device

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,

and SMBIOS

• Support for PCI* Local Bus Specification Revision 2.2

• Support for PCI Express* Revision 2.0

• Suspend to RAM support

• Wake on PCI, PCI Express, LAN, front panel, Consumer Infrared (CIR), and

USB ports

Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel Ethernet Controller

• Hardware monitoring through the Nuvoton I/O controller

• Voltage sense to detect out of range power supply voltages

• Thermal sense to detect out of range thermal values

• Three fan headers

• Two fan sense inputs used to monitor fan activity

• Fan speed control

82579V Gigabit

Product Description

1.1.2 Board Layout

Figure 1 shows the location of the major components on Intel Desktop Board DH67VR.

Figure 1. Major Board Components

Intel Desktop Board DH67VR Technical Product Specification

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Item/callout from Figure 1 Description

A PCI Conventional bus add-in card connector B PCI Express x1 add-in card connector C PCI Express x1 bus add-in card connector D PCI Express x16 bus add-in card connector E Back panel connectors F Processor core power connector (2 x 2) G Rear chassis fan header H LGA1155 processor socket I Processor fan header J DIMM 3 (Channel A DIMM 0) K DIMM 1 (Channel A DIMM 1) L DIMM 4 (Channel B DIMM 0) M DIMM 2 (Channel B DIMM 1) N Front chassis fan header O Chassis intrusion header P Low Pin Count (LPC) Debug header Q Consumer IR emitter (output) header R Consumer IR receiver (input) header S Main power connector (2 x 12) T Battery U Piezoelectric speaker V Intel H67 Express Chipset W SATA connectors X Front panel header Y Alternate front panel power LED header Z BIOS Setup configuration jumper block AA Front panel USB 2.0 headers (4) BB Standby power LED CC S/PDIF out header DD Front panel audio header

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

Product Description

Figure 2. Block Diagram

Intel Desktop Board DH67VR Technical Product Specification

1.2 Legacy Considerations

This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following:

• No parallel port connector

• No floppy drive connector

• No serial port connector or header

• No PS/2 connectors

• No PATA connector

1.3 Online Support

To find information about… Visit this World Wide Web site:

Intel Desktop Board DH67VR http://www.intel.com/products/motherboard/index.htm Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available configurations for Intel

Desktop Board DH67VR

Supported processors http://processormatch.intel.com Chipset information http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

Integration information http://www.intel.com/support/go/buildit

http://ark.intel.com

025414.htm

Product Description

1.4 Processor

The board is designed to support the Intel Core i7, Intel Core i5, and Intel Core i3 processors in an LGA1155 socket

Other processors may be supported in the future. This board is designed to support processors with a maximum wattage of 95 W Thermal Design Power (TDP). The processors listed above are only supported when falling within the wattage requirements of Intel Desktop Board DH67VR. See the Intel web site listed below for the most up-to-date list of supported processors.

For information about… Refer to:

Supported processors http://processormatch.intel.com

CAUTION

Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.

NOTE

This board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 53 for information on power supply requirements for this board.

1.4.1 PCI Express x16 Graphics

The Intel Core i7, Intel Core i5, and Intel Core i3 processors in an LGA1155 socket support discrete add in graphics cards via the PCI Express 2.0 x16 graphics connector:

• Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each

direction (500 MB/s) per lane. The maximum theoretical bandwidth on the interface is 8 GB/s in each direction, simultaneously,

when operating in x16 GEN2 mode

• Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each

direction (250 MB/s) per lane. The maximum theoretical bandwidth on the interface is 4 GB/s in each direction, simultaneously,

operating in x16 GEN1 mode

For information about Refer to

PCI Express technology http://www.pcisig.com

for an aggregate of 16 GB/s

for an aggregate of 8 GB/s when

Intel Desktop Board DH67VR Technical Product Specification

1.5 System Memory

The board has four DIMM sockets and supports the following memory features:

• 1.5 V DDR3 SDRAM DIMMs with gold plated contacts, with the option to raise the

voltage to support higher performance DDR3 SDRAM DIMMs.

• Support for 1.35V Low Voltage DDR3 (new JEDEC specification)

• Two independent memory channels with interleaved mode support

• Unbuffered, single-sided or double-sided DIMMs with the following restriction:

Double-sided DIMMs with x16 organization are not supported.

• 32 GB maximum total system memory (with 4 Gb memory technology). Refer to

Section 2.1.1 on page 37 for information on the total amount of addressable memory.

• Minimum recommended total system memory: 512 MB

• Non-ECC DIMMs

• Serial Presence Detect

• DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.

Table 3 lists the supported DIMM configurations.

Table 3. Supported Memory Configurations

SDRAM Density

DIMM Capacity Configuration

512 MB SS 1 Gbit 64 M x16/empty 4 1024 MB SS 1 Gbit 128 M x8/empty 8 1024 MB SS 2 Gbit 128 M x16/empty 4 2048 MB DS 1 Gbit 128 M x8/128 M x8 16 2048 MB SS 2 Gbit 128 M x16/empty 8 4096 MB DS 2 Gbit 256 M x8/256 M x8 16 4096 MB SS 4 Gbit 512 M x4/empty 8 8192 MB DS 4 Gbit 512 M x8/512 M x8 16

Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to

single-sided memory modules (containing one row of SDRAM).

For information about… Refer to:

Tested Memory http://support.intel.com/support/motherboards/desktop/sb/

(Note)

SDRAM Organization Front-side/Back-side

CS-025414.htm

Number of SDRAM Devices

Product Description

1.5.1 Memory Configurations

The Intel Core i7, Intel Core i5, and Intel Core i3 processors in the LGA1155 socket support the following types of memory organization:

• Dual channel (Interleaved) mode. This mode offers the highest throughput for

real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.

• Single channel (Asymmetric) mode. This mode is equivalent to single channel

bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.

• Flex mode. This mode provides the most flexible performance characteristics.

The bottommost DRAM memory (the memory that is lowest within the system memory map) is mapped to dual channel operation; the topmost DRAM memory (the memory that is nearest to the 8 GB address space limit), if any, is mapped to single channel operation. Flex mode results in multiple zones of dual and single channel operation across the whole of DRAM memory. To use flex mode, it is necessary to populate both channels.

For information about… Refer to:

Memory Configuration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-

011965.htm

Intel Desktop Board DH67VR Technical Product Specification

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

NOTE

The Intel Core i7, Intel Core i5, and Intel Core i3 processors require memory to be populated in the DIMM 1 (Channel A, DIMM 1) socket.

For best memory performance always install memory into the blue DIMM memory sockets if only installing two DIMMs in your configuration.

Product Description

1.6 Intel

Intel H67 Express Chipset with Direct Media Interface (DMI) interconnect provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and PCI Express interfaces. The Intel H67 Express Chipset is a centralized controller for the board’s I/O paths.

For information about Refer to

The Intel H67 chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2

H67 Express Chipset

1.7 Graphics Subsystem

The board supports graphics through either Intel Graphics Technology or a PCI Express 2.0 x16 add-in graphics card.

1.7.1 Integrated Graphics

The board supports integrated graphics through the Intel® Flexible Display Interface

(Intel

1.7.1.1 Intel

FDI) for processors with Intel Graphics Technology.

High Definition (Intel® HD) Graphics

The Intel HD graphics controller features the following:

• 3D Features ⎯ DirectX10.1 and OpenGL 3.0 compliant ⎯ DirectX 11.0* CS4.0 only ⎯ Shader Model 4.0

• Video ⎯ Hi-Definition content at up to 1080p resolution ⎯ Hardware accelerated MPEG-2, VC-1/WMV and H.264/AVC Hi-Definition video

formats

⎯ Intel ⎯ Blu-ray S3D via HDMI 1.4 ⎯ Dynamic Video Memory Technology (DVMT) 5.0 support ⎯ Support of up to 1.7 GB Video Memory with 4 GB and above system memory

HD Technology with Advanced Hardware Video Transcoding

configuration

Intel Desktop Board DH67VR Technical Product Specification

1.7.1.2 High Definition Multimedia Interface* (HDMI*)

The HDMI port supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. It is compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/96kHz audio of lossless audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The maximum supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant with the HDMI 1.3 specification and HDMI 1.4 specification only for Blu-ray S3D.

The HDMI port is enabled for POST whenever a monitor is attached, regardless of the VGA and DVI-I connector status.

Depending on the type of add-in card installed in the PCI Express x16 connector, the HDMI port will behave as described in Table 4.

Table 4. HDMI Port Status Conditions

PCI Express x16 Connector Status HDMI Port Status

No add-in card installed Enabled Non-video PCI Express x1 add-in card installed Enabled PCI Express x16 add-in card installed Enabled

Note: May require BIOS setup menu changes.

(Note)

1.7.1.3 Digital Visual Interface (DVI-I)

The DVI-I port supports both digital and analog DVI displays. The maximum supported resolution is 1900 x 1200 (WUXGA). The DVI port is compliant with the DVI 1.0 specification. DVI analog output can also be converted to VGA using a DVIVGA converter.

Depending on the type of add-in card installed in the PCI Express x16 connector, the DVI port will behave as described in Table 5.

Table 5. DVI Port Status Conditions

PCI Express x16 Connector Status

No add-in card installed Enabled Enabled Non-video PCI Express x1 add-in card

installed PCI Express x16 add-in card installed Disabled Enabled

Notes:

1. DVI analog output can also be converted to VGA with a DVI-VGA converter.

2. May require BIOS setup menu changes.

DVI Digital (DVI-D) Port Status

Enabled Enabled

DVI Analog (DVI-A) Port Status

(Note 1)

(Note 2)

Product Description

1.7.1.3.1 Analog Display (VGA)

DVI analog output can be converted to VGA with a DVI-VGA converter. The maximum supported resolution for VGA is 2048 x 1536 (QXGA).

The VGA port is enabled for POST whenever a monitor is attached, regardless of the HDMI and DVI-I connector status.

1.7.2 USB

The board supports up to 12 USB 2.0 ports and two USB 3.0 ports. The Intel H67 Express Chipset provides the USB controller for the 2.0 ports. The two

USB 3.0 ports are provided by the NEC* UPD720200 controller. The port arrangement is as follows:

• Two USB 3.0 ports are implemented with stacked back panel connectors (blue)

• Four USB 2.0 ports are implemented with stacked back panel connectors (black)

• Eight USB 2.0 front panel ports implemented through four internal headers

All 14 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports are super-speed capable.

NOTE

Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB connectors on the back panel Figure 9, page 40 The location of the front panel USB headers Figure 10, page 41

Intel Desktop Board DH67VR Technical Product Specification

1.8 SATA Interfaces

The board provides two SATA connectors through the PCH, which support one device per connector.

The PCH provides independent SATA ports with a theoretical maximum transfer rate of 6 Gb/s. A point-to-point interface is used for host to device connections.

The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP, Windows Vista*, and Windows 7* operating systems.

NOTE

Many SATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors.

For more information, see: http://www.serialata.org/

For information about Refer to

The location of the SATA connectors Figure 10, page 41

1.8.1.1 SATA RAID

The board supports Intel Rapid Storage Technology which provides the following RAID (Redundant Array of Independent Drives) levels via the Intel H67 Express Chipset:

• RAID 0 - data striping

• RAID 1 - data mirroring

• RAID 0+1 (or RAID 10) - data striping and mirroring

• RAID 5 - distributed parity

NOTE

In order to use supported RAID features, you must first enable RAID in the BIOS. Also, during Microsoft Windows XP installation, you must press F6 to install the RAID drivers. See your Microsoft Windows XP documentation for more information about installing drivers during installation. Both Microsoft Windows Vista and Microsoft Windows 7 include the necessary RAID drivers for both AHCI and RAID without the need to install separate RAID drivers using the F6 switch in the operating system installation process.

Product Description

1.9 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.

NOTE

If the battery and AC power fail, date and time values will be reset and the user will be notified during the POST.

When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.

1.10 Legacy I/O Controller

The I/O controller provides the following features:

• Consumer Infrared (CIR) headers

• Serial IRQ interface compatible with serialized IRQ support for PCI systems

• Intelligent power management, including a programmable wake-up event interface

• PCI power management support

The BIOS Setup program provides configuration options for the I/O controller.

1.10.1 Consumer Infrared (CIR)

The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the supported operating systems.

The CIR feature is made up of two separate pieces: the receiving (receiver) header, and the output (emitter) header. The receiving header consists of a filtered translated infrared input compliant with Microsoft CIR specifications, and also a “learning” infrared input. This learning input is simply a high pass input which the computer can use to “learn” to speak the infrared communication language of other user remotes. The emitter header consists of two output ports which the PC can use to emulate “learned” infrared commands in order to control external electronic hardware.

Customers are required to buy or create their own interface modules to connect to Intel Desktop Boards for this feature to work.

Intel Desktop Board DH67VR Technical Product Specification

1.11 Audio Subsystem

The board supports Intel HD Audio via the Realtek ALC892 audio codec. The audio subsystem supports the following features:

• Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type.

• A signal-to-noise (S/N) ratio of 97 dB

• Microphone input that supports a single dynamic, condenser, or electret

microphone

• Windows Vista Ultimate and Windows 7 Ultimate certification

Table 6 lists the supported functions of the front panel and back panel audio jacks.

Table 6. Audio Jack Support

Audio Jack

FP Green Default FP Pink Default Rear Blue Default Rear Green Ctrl panel Default Rear Pink Default Ctrl panel Rear Black Default Rear Orange Default

Microphone

Head-

phones

Front

Speaker Line In

Rear

Surround

Center/

Sub

Side

Surround

1.11.1 Audio Subsystem Software

The latest audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio software and drivers Section 1.3, page 14

1.11.2 Audio Subsystem Components

The audio subsystem includes the following components:

• Intel H67 Express Chipset

• Realtek ALC892 audio codec

• Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x 5-

pin header that provides mic in and line out signals for front panel audio connectors) (yellow)

• S/PDIF digital audio out header (1 x 4-pin header) (yellow)

• S/PDIF digital audio out connector on the back panel

• 5-port analog audio input/output stack on the back panel

Product Description

The back panel audio connectors are configurable through the audio device drivers. The available configurable back panel audio connectors are shown in Figure 4.

Item Description

A Rear surround B Center channel and LFE

(subwoofer) C S/PDIF out (optical) D Line in E Mic in/side surround F Line out/front speakers

Figure 4. Back Panel Audio Connectors



NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

For information about Refer to

The locations of the front panel audio header and S/PDIF audio header Figure 10, page 41 The signal names of the front panel audio header and S/PDIF audio header Section 2.2.2.1, page 43 The back panel audio connectors Section 2.2.1, page 40

Intel Desktop Board DH67VR Technical Product Specification

1.12 LAN Subsystem

The LAN subsystem consists of the following:

• Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mbits/s)

• Intel H67 Express Chipset

• RJ-45 LAN connector with integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interface between the PCH and the LAN controller

• PCI Conventional bus power management ⎯ ACPI technology support ⎯ LAN wake capabilities

• LAN subsystem software

For information about Refer to

LAN software and drivers http://downloadcenter.intel.com

1.12.1 Intel

The Intel 82579V Gigabit Ethernet Controller supports the following features:

• 10/100/1000 BASE-T IEEE 802.3 compliant

• Energy Efficient Ethernet (EEE) IEEE802.3az support [Low Power Idle (LPI) mode]

• Dual interconnect between the Integrated LAN Controller and the Physical Layer

(PHY):

⎯ PCI Express-based interface for active state operation (S0) state ⎯ SMBUS for host and management traffic (Sx low power state)

• Compliant to IEEE 802.3x flow control support

• 802.1p and 802.1q

• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

• Full device driver compatibility

82579V Gigabit Ethernet Controller

Product Description

1.12.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN software and drivers http://downloadcenter.intel.com

1.12.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below).

Item Description

A Link LED (Green) B Data Rate LED (Green/Yellow)

Figure 5. LAN Connector LED Locations

Table 7 describes the LED states when the board is powered up and the LAN subsystem is operating.

Table 7. LAN Connector LED States

LED LED Color LED State Condition

Off LAN link is not established.

Link Green

Data Rate Green/Yellow

On LAN link is established. Blinking LAN activity is occurring. Off 10 Mbits/s data rate is selected. Green 100 Mbits/s data rate is selected. Yellow 1000 Mbits/s data rate is selected.

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Intel BLKDH67VR, DH67VR Technical Product Specification

Specifications and Main Features

Frequently Asked Questions

User Manual