Instrumentarium Dental OP-300 Service manual

ENGLISH

ORTHOPANTOMOGRAPH® OP300

3D Dental X-Ray System

Service Manual

210986 rev. 2

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ORTHOPANTOMOGRAPH® OP300

ORTHOPANTOMOGRAPH®/ INSTRUMENTARIUM DENTAL™/ CLINIVIEW™ is a registered trademark/ a common law trademark of Instrumentarium Dental, PaloDEx Group Oy.

U.S. patents US6731717, US6829326 and USRE41197. Finnish patents 114383.

Documentation, trademark and the software are copyrighted with all rights reserved. Under the copyright laws the documentation may not be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine readable form in whole or part, without the prior written permission of Instrumentarium Dental.

The original language of this manual is English.

Instrumentarium Dental reserves the right to make changes in specification and features shown herein, or discontinue the product described at any time without notice or obligation. Contact your Instrumentarium Dental representative for the most current information.

Manufacturer Instrumentarium Dental, PaloDEx Group Oy

Nahkelantie 160 (P.O. Box 20) FI-04300 Tuusula FINLAND Tel. +358 10 270 2000 Fax. +358 10 270 2230

For service, contact your local distributor.

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ORTHOPANTOMOGRAPH® OP300

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Table of Contents

1 Introduction..................................................................................................................1

1.1 ORTHOPANTOMOGRAPH® OP300 .................................................................... 1

1.2 References............................................................................................................ 2

1.3 Intended use ......................................................................................................... 2

1.4 Associated documentation .................................................................................... 3

1.5 Abbreviations used in this manual ........................................................................ 3

1.6 Warnings and precautions .................................................................................... 3

1.6.1 Warnings for cross infection....................................................................... 3

1.6.2 Warnings to be observed during installation and service...........................4

1.6.2.1 Cautions for Electrostatic discharge ............................................ 5

1.6.3 General warnings .......................................................................................6

1.7 Unauthorized Modifications................................................................................... 9

1.8 Disclaimer ............................................................................................................. 9

1.9 Disposal ................................................................................................................ 9

2 Unit description ......................................................................................................... 11

2.1 Main parts and controls....................................................................................... 11

2.2 Patient positioning lights ..................................................................................... 13

2.3 Patient positioning panel .....................................................................................16

2.3.1 Cephalometric unit (optional) ................................................................... 16

2.4 Main control panel............................................................................................... 17

2.5 Unit identification labels ...................................................................................... 18

2.6 Unit movements ..................................................................................................19

2.7 Finger guards ...................................................................................................... 21

2.8 Emergency stop switch ....................................................................................... 22

3 Electrical description ................................................................................................ 23

3.1 Circuit boards ......................................................................................................23

3.2 Electrical component location ............................................................................. 25

3.3 List of circuit boards and electric devices............................................................ 28

3.4 Schematic diagrams............................................................................................ 31

3.5 Circuit board descriptions.................................................................................... 45

3.5.1 R3210 CPU (Central Processing Unit)..................................................... 45

3.5.2 CEPH R3210............................................................................................ 46

3.5.3 R3300 IO1 (Input/Output 1)...................................................................... 47

3.5.4 R3400 NGEO IO2 (Input/Output 2 Board) ...............................................48

3.5.5 R3700 X-Ray power supply ..................................................................... 50

3.5.6 R3800 X-Ray generator ........................................................................... 51

3.5.7 R5100 3-Phase stepper driver ................................................................. 53

3.5.8 R5300 Panel raw power supply ............................................................... 54

3.5.9 EA100 Power distribution board............................................................... 55

3.5.10 EA200 Connector board........................................................................... 57

3.5.11 EA300 Connector board........................................................................... 59

3.5.12 EB100 Rotator opto board ....................................................................... 59

3.5.13 EB200 Head support board ..................................................................... 61

3.5.14 EC100 Pan sensor connector board ........................................................ 61

3.5.15 ED100 Pan sensor connector board ........................................................ 63

3.5.16 ED200 Ceph sensor connector board...................................................... 64

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3.5.17 EE100 Ceph encoder opto board............................................................. 65

3.5.18 EE200 Ceph sensor connector board ...................................................... 66

3.5.19 EG100 Dual opto board ........................................................................... 67

3.5.20 EG200 Interface board............................................................................. 68

3.5.21 EG400 Panel power supply...................................................................... 70

3.5.22 Panoramic sensor (CMOS) ...................................................................... 71

3.5.23 3D sensor (CMOS)................................................................................... 71

3.5.24 Ethernet switch/router .............................................................................. 72

3.5.25 EC400 Collimator opto board (MFOV only) ............................................. 73

3.6 Replacing the boards ..........................................................................................74

3.7 Modification of external warning light circuitry for 230V ...................................... 76

4 Firmware description ................................................................................................ 79

4.1 Overview .............................................................................................................79

4.2 Detailed View ......................................................................................................80

4.3 Operating modes................................................................................................. 81

4.4 Firmware states................................................................................................... 82

5 Hardware operation................................................................................................... 87

5.1 Emergency stop ..................................................................................................87

5.2 Movements.......................................................................................................... 88

5.3 Rotation movement .............................................................................................88

5.4 X-movement........................................................................................................89

5.5 Y-movement........................................................................................................90

5.6 Z-movement ........................................................................................................91

5.7 Chin rest movement ............................................................................................ 92

5.8 Collimator movement ..........................................................................................93

5.9 Collimator MFOV movement............................................................................... 94

5.10 Pan sensor movement ........................................................................................ 95

5.11 Secondary collimator movement......................................................................... 96

5.12 Ceph sensor movement ...................................................................................... 97

5.13 Positioning lights ................................................................................................. 98

5.14 Positioning lights MFOV...................................................................................... 99

5.15 Imaging chain.................................................................................................... 100

5.15.1 3D imaging chain ................................................................................... 100

5.15.2 Panoramic imaging chain....................................................................... 101

5.15.3 Cephalometric imaging chain................................................................. 102

5.15.4 Exposure control .................................................................................... 103

5.15.5 Exposure warning light........................................................................... 104

6 The s2terminal and service functions ................................................................... 105

6.1 Opening the s2Terminal.................................................................................... 106

6.2 s2terminal commands ....................................................................................... 107

6.3 Unit state commands ........................................................................................ 109

6.4 Unit service commands..................................................................................... 111

7 Error Codes and Trouble Shooting........................................................................113

7.1 Initial actions ..................................................................................................... 113

7.2 Checking the unit .............................................................................................. 113

7.3 Reporting problems to technical support........................................................... 116

7.4 Error code descriptions ..................................................................................... 119

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7.4.1 Error 4 Rotator home position was not found......................................... 119

7.4.2 Error 5 Exposure was taking too long and a timeout occured................ 120

7.4.3 Error 6 Generator failure ........................................................................120

7.4.4 Error 9 R3300 IO1 board is not functioning ........................................... 121

7.4.5 Error 12 R3400 IO2 board is not functioning ......................................... 122

7.4.6 Error 13 Configuration data was lost ..................................................... 122

7.4.7 Error 21 Calibration data receive timeout............................................... 123

7.4.8 Error 22 Reading data from the 3D sensor failed................................... 123

7.4.9 Error 23 Configuration data is invalid ..................................................... 124

7.4.10 Error 24 Voltage (kV) failure in R3800 X-ray generator ......................... 124

7.4.11 Error 25 Current (mA) failure in R3800 X-ray generator ........................ 124

7.4.12 Error 26 Preheat failure in R3800 X-ray generator ................................125

7.4.13 Error 27 Rotation encoder failure ........................................................... 125

7.4.14 Error 29 Error in sensor clocking signal ................................................. 125

7.4.15 Error 30 CPU firmware is corrupted ....................................................... 126

7.4.16 Error 31 CPU board’s memory test failed ..............................................126

7.4.17 Error 32 Movement of Z-motor failed ..................................................... 126

7.4.18 Error 33 Movement of C (collimator) motor failed .................................. 127

7.4.19 Error 34 Movement of D (sensor) motor failed....................................... 128

7.4.20 Error 35 Movement of J (chin support) motor failed............................... 129

7.4.21 Error 36 Movement of N motor failed ..................................................... 130

7.4.22 Error 37 Movement of R (Rotation) motor failed .................................... 131

7.4.23 Error 38 Movement of X motor failed ..................................................... 132

7.4.24 Error 39 Movement of Y motor failed ..................................................... 133

7.4.25 Error 40 Movement of S (secondary collimator) motor failed................. 134

7.4.26 Error 41 Movement of T (cephalostat sensor) motor failed.................... 135

7.4.27 Error 42 Ceph IO board is not functioning.............................................. 136

7.4.28 Error 43 Serial IO board error ................................................................ 137

7.4.29 Error 45 No X-rays detected on cephalostat sensor .............................. 137

7.4.30 Error 46 Emergency stop button is pressed........................................... 138

7.4.31 Error 47 Button stuck ............................................................................. 139

7.4.32 Error 48 Internal failure .......................................................................... 139

7.4.33 Error 49 Reading panoramic sensor data failed..................................... 140

7.4.34 Error 50 Reading cephalostat sensor data failed ................................... 141

7.4.35 Error 51 Cephalostat sensor missing ..................................................... 142

7.4.36 Error 52 Movement of L-motor failed .....................................................143

7.4.37 Error 100 Internal communication bus error........................................... 144

7.4.38 Error 101 Incorrect internal message format.......................................... 144

7.4.39 GUI Error 103 External GUI not connected............................................ 145

7.4.40 GUI Error 104 Failed to validate calibration data ................................... 145

7.5 Warnings and notifications ................................................................................ 146

7.6 Hardware trouble shooting ................................................................................ 152

7.6.1 Internal and external LANs .................................................................... 152

7.6.1.1 No Ethernet connection between the unit and the workstation 152

7.6.1.2 Connection between the workstation and

X-ray unit is lost from time to time ...........................................153

7.6.1.3 No connection to R3300, R3400 and GUI PC ........................ 153

7.6.1.4 No connection to the R3300 .................................................... 153

7.6.1.5 No connections to the R3400 .................................................. 154

7.6.2 Power distribution (mains) ..................................................................... 154

7.6.2.1 Nothing happens when the X-ray unit is switched on .............. 154

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7.6.2.2 No X-rays................................................................................. 155

7.6.3 Power distribution (low voltages) .......................................................... 155

7.6.3.1 Nothing happens when the X-ray unit is switched on .............. 155

7.6.3.2 X-, Y- or rotator not working..................................................... 156

7.6.3.3 N-, Collimator- or sensor swap not working............................. 157

7.6.3.4 CEPH sensor or secondary collimator not working .................158

7.6.3.5 The panorama imaging not working ........................................ 158

7.6.3.6 The 3D imaging not working.................................................... 158

7.6.3.7 The CEPH imaging not working............................................... 159

7.6.3.8 R3210, R3300 or R3400 does not operate.............................. 159

7.6.4 3D imaging ............................................................................................159

7.6.4.1 3D sensor is not recognized .................................................... 159

7.6.4.2 Generally poor image quality................................................... 160

7.6.4.3 Horizontal bars in projection image ......................................... 160

7.6.4.4 Reduced gray scale................................................................. 160

7.6.4.5 Shadows on the projection image............................................ 160

7.6.5 Panorama imaging ................................................................................160

7.6.5.1 PAN sensor is not recognized ................................................. 160

7.6.5.2 Image is messy........................................................................161

7.6.5.3 Image is too dark or light ......................................................... 161

7.6.6 CEPH imaging ....................................................................................... 161

7.6.6.1 CEPH sensor is not recognized...............................................161

7.6.6.2 Image is messy........................................................................161

7.6.6.3 Image is too dark or light ......................................................... 161

7.6.7 Exposure control ...................................................................................161

7.6.7.1 Exposure does not start when the exposure switch is pressed161

7.6.7.2 Exposure sequence starts but no X-rays are generated .........163

7.6.8 X-ray generation .................................................................................... 164

7.6.8.1 No X-rays generated................................................................ 164

7.6.8.2 Images too dark or too light (Wrong dose generated) ............. 165

7.6.9 Motion control ........................................................................................167

7.6.10 Z-Motion control .................................................................................... 168

7.6.10.1 Main support up/down (Z) movement does not work............... 168

7.6.10.2 Main support movement only works in one direction............... 169

7.7 Calibration program numbers............................................................................ 171

7.8 Imaging program numbers ................................................................................ 172

8 Maintenance procedure .......................................................................................... 175

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1 Introduction

1.1 ORTHOPANTOMOGRAPH® OP300

INSTRUMENTARIUM DENTAL™ ORTHOPANTOMOGRAPH® OP300 x-ray unit (hereafter called “OP300”) is a dental x-ray system for producing high quality digital images of dentition, TM-joints and skull. In order to take images with OP300 you need a suitable PC hardware connected to the OP300 unit and CLINIVIEW™ software (or suitable third party software via TWAIN driver) to capture and manage images.

OP300 performs the following procedures:

Panoramic

• Standard panoramic

• Pediatric panoramic

• Wide arch panoramic

• Bitewing

• TMJ, PA projection

• Ortho TMJ, axial corrected lateral projection

• Maxillary sinus

• Ortho Zone enhanced panoramic

• Orthogonal panoramic

Cephalometric (optional)

• Cephalometric lateral projection

• Cephalometric pediatric lateral projection

• Cephalometric postero-anterior (PA) projection

• Reverse Towne projection

• Waters view

• Carpus program (optional) (Not available in USA and Canada)

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1 Introduction

3D SFOV (optional) H x W

• 61x41 mm Field of View

• 61x78 mm Field of View

3D MFOV (Maxio) (optional) H x W

• MFOV (Maxio) 50 x 50 mm Field of View

• MFOV (Maxio) 61 x 78 mm Field of View

• MFOV (Maxio) 78 x 78 mm Field of View

• MFOV (Maxio) 78 x 150 mm Field of View

• MFOV (Maxio) 130 x 150 mm Field of View (optional)

1.2 References

The following instructions are delivered with in the OP300 installation manual:

• Firmware update instructions

• Calibration instructions

• Cephalostat upgrade instructions

• Cephalostat side changing instructions

The following instructions are separate and can be ordered from customer service:

• 3D upgrade instructions are delivered with the 3D upgrade kit.

1.3 Intended use

OP300 must only be used and operated by dentist and other qualified professionals. OP300 must only be used to take panoramic, cephalometric and 3D images of the dento-maxillofacial complex of the human skull. It must not be used to take images of any other part of the human body.

Panoramic and 3D exposures should not be used if conventional intraoral radiographic images (bitewing exposures) would be sufficient.

Cone beam computed tomography images are not adequate for the analysis of soft tissue.

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CAUTION! USA only: Federal law restricts this device to sale by or on the order of a dentist or other qualified professional.

1.4 Associated documentation

• OP300 user manual

• OP300 installation manual

• The CLINIVIEW™ software user manual

• The CLINIVIEW™ software installation manual

• The user manual supplied with the dental imaging software

• The installation manual supplied with the dental imaging software

• The user manual supplied with the 3D imaging software

1 Introduction

• The installation manual supplied with the 3D imaging software

1.5 Abbreviations used in this manual

FOV = Field Of View. The cylindrical 3D volume that is reconstructed by the system.

ROI = Region Of Interest. The anatomical area or region of the patient that you are interested to examine.

FH = Frankfort-Horizontal

H = Horizontal

ADC = Automatic Dose rate Control

1.6 Warnings and precautions

1.6.1 Warnings for cross infection

Always use available disposable protective covers with the patient positioning accessories:

• Bite fork cover

• Chin support cover

• Head support cover

• Nose support cover

• Ear holder cover

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1 Introduction

1.6.2 Warnings to be observed during installation and service

Before attempting to service the device make sure that you know how to operate it. Read the user’s manual.

Read and familiarize yourself with the warnings and precautions listed in the user’s manual.

Only use original spare parts from the manufacturer when repairing the device or replacing parts.

Warning - Radiation Safety

Before servicing the unit familiarize yourself with local and national radiation safety standards and requirements relating to dental x-ray equipment.

Warning - Electrical Safety

Disconnect the unit from the main power supply before removing any covers.

Disconnect the unit from the main power supply before repairing or replacing mechanical parts or installing accessories. Be careful when operating the unit not to get body parts or clothing trapped between moving parts.

AES exposure settings shall be checked by the operator before taking exposures.Disconnect the unit from the mains power connection before servicing the unit, e.g. replacing circuit boards or other electrical components.

If there are capacitors on a circuit board or electrical device wait ten (10) minutes, after disconnecting the unit from the power supply, before handling the board or device.

If you have to leave the unit unattended with covers removed during servicing or maintenance, disconnect the unit from main power supply so that anyone who inadvertantly touches the unit does not receive an electric shock.

This unit should only be used in areas that are provided with a protective earth connection to ensure an equipotential ground connection.

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1 Introduction

Warning - Explosion hazard

Some disinfectants and cleaning agents may vaporize to form an explosive vapour. If such disinfectants and cleaning agents are used the vapour should be allowed to disperse before switching the unit on.

Warning - Cleaning the unit

Switch the unit off and disconnect it from the main power supply before cleaning or disinfecting the unit. The aperture plate and the tube housing are made of lead (Pb), which is a toxic material. Do not touch it with your bare hands.

The installer must ensure that:

• The fixing screws are suitable for the wall material.

• The wall for fixing the unit is strong enough for attaching the unit. It must withstand loads of 5000N or more.

• Pull out strength of the screws is 5000N or more.

• The wall fixing screws are adequately tightened.

To avoid the unit from tipping over, fix the unit with floor bolts appropriate to the surface the unit is mounted on. The bolts and the floor material must endure force of 5000 N.

The installer must ensure that the upper shelf attachment screws are tightened.

The unit should be installed in a place with enough space for safe operation. See the unit installation manual for recommended minimum site dimensions. It is the responsibility of the customer to ensure that the site is large enough for the patients.

Be aware of hot surfaces when removing covers during installation and maintenance.

When installing a dental X-ray unit always observe local and national safety, radiation control and electrical regulations.

1.6.2.1 Cautions for Electrostatic discharge

Electrostatic Discharge (ESD) can damage or destroy electronic components.

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1 Introduction

When servicing the device take precautions to avoid electrostatic build up and discharge (ESD). Follow the recommendations for the prevention of ESD that are used in the country in which you are working. If no recommendations are available follow the guide lines below.

Leave all new or replacement circuit boards and electrical parts in their protective packaging until the boards are needed.

Before handling circuit boards and electrical parts make sure that any static electricity charge that has built up in you body is discharged.

When handling circuit boards hold them by their edges and do not touch any connectors or components.

When examining and checking circuit boards use an elasticated wrist wrap which is connected to a ground point through a 1 Mohm current limiting cable. For a ground point use water pipes, radiators or other objects that are known to be connected to the ground. Also use a cable to connect the x-ray unit to the same ground potential as the wrist wrap.

If an antistatic mat is used, connect the wrist wrap to the mat and the mat to the ground potential.

Wash the wrist wrap and check that it is in good condition frequently.

1.6.3 General warnings

Personnel operating the device must be adequately trained with respect to the technological principles of operation and radiation protection when using cone beam computed tomography (CBCT) imaging.

This unit complies with the EMC (Electromagnetic Compatibility) according to IEC 60601-1-2. Radio transmitting equipment, cellular phones etc. shall not be used in close proximity of the unit as they could influence the performance of the unit.

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1 Introduction

The correct software and settings in the workstation are essential to the performance of the unit. Consult technical support to ensure correct setup.

Danger: Explosion hazard - do not use in the presence of flammable anesthetics, gases or vapors.

The unit is factory set to operate using a 230-240 ±10 VAC power supply. Never connect the unit to a power supply different to the voltage marked on the unit.

The site must fulfill the environmental requirements in the installation manual chapter technical specifications.There should be free space around the unit for safe operation.To maintain patient safety it is mandatory to use an unshielded CAT6 Ethernet cable between the unit and the network or workstation, so that multiple chassis are not connected. Non-medical grade PC should not be used in patient environment.This product itself complies with IEC 60601-1 medical safety standard but in order to the system incorporating also a PC to comply the standard, EITHER the PC has to be a medical PC OR the PC has to be located over 1,5 meters apart from the unit. The installer and the user of the system shall confirm that at least one of the above requirements is fulfilled. A PC is a medical one if it complies IEC 60601-1 standard and that is indicated in the accompanying documents of the PC. See chapter Technical specifications, Minimum PC Requirements, in user manual.

All service operations must be made by authorized service personnel only.

The annual service as described in manual is mandatory for the correct and safe operation of the unit.When taking exposures, operators and service personnel must protect themselves from radiation and remain at least two meters (six feet) away from the unit during exposure. Protect the patient from scattered radiation by placing a protective lead apron over the patient.The unit must be installed and serviced according to the unit Installation & adjustments manual by a qualified technician.Only personnel trained and approved by the manufacturer of the unit are allowed to service the unit.

3D should not be used for routine or screening examinations in which a radiograph is taken regardless of the presence or absence of clinical signs and symptoms. 3D imaging examinations must be justified for each patient to demonstrate that the benefits outweigh the risks.

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1 Introduction

Where it is likely that evaluation of soft tissues will be required as part of the patient’s radiological assessment, the imaging should be done using conventional medical CT or MR, rather than 3D imaging using Cone Beam technology.

Make sure that patient’s thyroid glands are protected by a lead apron during the exposure.

The place where the unit is to be installed and the position from where the user will take exposures must be correctly shielded from the radiation that is generated when the unit is operated. Ensure to fulfill or exceed the requirements of your local regulations.

The unit or its parts must not be changed or modified in any way without approval and instructions from the manufacturer.

When servicing use only approved replacement parts supplied by the manufacturer.

The use of accessories not complying with the equivalent safety requirements of this equipment may lead to a reduced level of safety of the resulting system.

If this device is used with 3rd party imaging application software not supplied by the manufacturer, the 3rd party imaging application software must comply with all local laws on patient information software. This includes the Medical Device Directive 93/42/EEC and/or relevant legal requirements in the USA.

Do not connect any equipment to the unit that has not been supplied with the unit or that is not recommended by the manufacturer. The use of accessory equipment not complying with the equivalent safety requirements of this equipment may lead to a reduced level of safety of the resulting system.

All protective covers must be properly installed before handing unit to the user or when operating the unit. Correct sharp layer should be chosen when using multilayer PAN images. See user manual chapter Multilayer PAN images for correct procedure.

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1.7 Unauthorized Modifications

Unauthorized changes or modifications to any part of the unit or its equipment can have hazardous consequences. Changes or modifications must not be made unless specifically authorized by the manufacturer. When properly assembled with a compatible beam limiting device, the diagnostic source assembly will fully meet the United States of America Federal Performance Standards for Diagnostic X-Ray Systems and Their Components (21 CFR 1020. 30-32) provided. No parts may be removed from the unit and no unauthorized adjustments are made to the beam limiting device or tube housing assembly.

Never remove or remanufacture any part of the tubehead assembly or beam limiting device. Never adjust any part of the beam limiting device unless under the direction of the manufacturer or their authorized distributor.

1 Introduction

1.8 Disclaimer

The manufacturer shall have no liability for consequential damages, personal injury, loss, damage or expense directly or indirectly arising from the use of its products. No agent, distributor or other party is authorized to make any warranty or other liability on behalf of the manufacturer with respect to its products.

1.9 Disposal

The device, its spare parts, its replacement parts and its accessories may include parts that are made of or include materials that are non-environmentally friendly or hazardous. These parts must be disposed of in accordance with all local, national and international regulations regarding the disposal of non-environmentally friendly or hazardous materials.

Unit has at least the following parts that should be regarded as non-environmental friendly waste products:

■ Tubehead (Pb, oil)

■ Collimator (Pb)

■ All electronic circuits, electronic boards inside

■ Sensor covers (EMC painted)

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1 Introduction

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2 Unit description

1. Column

2. Carriage

3. Main support

4. Rotating unit

5. On/off switch (rear of carriage) and main fuses

6. Tubehead assembly

7. Touch screen display

8. Positioning panel

9. Sensor head

10.Head support

11.Chin rest

12.Handles

13.Cephalostat unit

14.Cephalostat sensor

15.Secondary collimator

16.Positioning panel

Fig 2.1. On/off switch and main fuses

2.1 Main parts and controls

PC with MDD approved dental imaging software and 3D viewing software (not included).

All software must conform to the MDD and the relevant legal requirements in the USA.

The PC must conform to all the unit and dental imaging software requirements.

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2 Unit description

1. Sensor holder (units without 3D option)

2. Panoramic sensor

1. 3D sensor (units with 3D option)

2. Panoramic sensor

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2.2 Patient positioning lights

2 Unit description

1. Midsagittal light

2. Frankfort horizontal (FH) light / Horizontal light, top of 130 mm high FOV (3D MFOV (Maxio) option only)

3. Image layer light

4. Cephalometric FH light

5. TMJ light

6. Horizontal light, top of 78 mm high FOV (3D MFOV (Maxio) option only)

7. Horizontal light, top of 61 mm high FOV (3D option only)

8. Horizontal light, top of 50 mm FOV (3D MFOV (Maxio) option only)

9. Horizontal light, bottom of FOV (3D option only)

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2 Unit description

Fig 2.1.

Fig 2.2.

Panoramic lights

1. Midsagittal light

2. FH light

1. Image layer light

2. TMJ light

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Cephalometric lights

Fig 2.3.

Fig 2.4.

1. FH light

2 Unit description

3D lights (optional)

Note! Appropriate lasers are turned automatically on based on selected FOV.

1. Midsagittal light

2. Horizontal light, top of FOV

Note! With 3D MFOV (Maxio) option height 130 mm is indicated with Frankfort horizontal (FH) light. Move FH light to 130 mm position.

3. Horizontal light, bottom of FOV

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2 Unit description

2.3 Patient positioning panel

1. Carriage UP

2. Carriage DOWN

3. Positioning lights ON/OFF

4. Patient positioning

5. Start positioning

6. Chin support UP

7. Chin support DOWN

8. Move the image layer anterior before exposure 3 mm, with sinus program 10 mm

9. Normal occlusion/ reset position

10.Move the image layer posterior before exposure 3 mm, with sinus program 10 mm

2.3.1 Cephalometric unit (optional)

1. Carriage UP

2. Carriage DOWN

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3. Carriage UP

4. Carriage DOWN

5. Positioning lights ON/OFF

Approved

D511961, 2

2.4 Main control panel

2 Unit description

1. Modality / imaging program section

2. Status of the unit

3. Settings

4. End examination

5. Exposure settings

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2 Unit description

Fig 2.6.

2.5 Unit identification labels

1. Main label

2. 10A & 15A Fuse labels (next to the fuse holder)

3. Laser class 1 warning label IEC 60825-1:2007

4. Ethernet label

5. Sensors

6. (Primary) collimator label

7. (Secondary) cephalostat collimator label

8. Tubehead label (on the tubehead and on the tubehead cover)

9. Warning label for deadly voltages (inside the tubehead cover)

10.Cephalostat main label

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2.6 Unit movements

(R)

(C)

(J)

(D)

Fig 2.7.

Panoramic unit movements

2 Unit description

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2 Unit description

Fig 2.8.

Cephalometric unit movements

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2.7 Finger guards

If finger guards are installed incorrectly during the service, unit may get stuck in some extreme positions in N-movements.

Correct installing of finger guards:

2 Unit description

1. These marks should be in this corner facing up.

2. part number 204373 / SP00374

3. part number 204374 / SP00374

4. part number 204375 / SP00374

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2 Unit description

Fig 2.9.

Fig 2.10.

2.8 Emergency stop switch

In case of malfunction of the exposure button or other protective devices of the unit, an emergency stop switch is provided near the handles and on the roof of the cephalostat head so that the patient can reach it.

If the emergency stop switch is pressed during an exposure, the exposure is terminated immediately and the x-ray unit is completely stopped. An interrupted exposure cannot be continued later, but has to be retaken from the beginning.

Press to stop the unit, rotate to release.

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D511961, 2

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+ 156 hidden pages