Pin Configuration and Function
Pin number Pin name Pin description
1,2,3 GND Ground
4/tab V
Output voltage from common node of the MOSFETs
OUT
5 IN Input signal from PWM controller
6,7 VCC Supply voltage to MOSFETs and Driver IC
General Description
The Integrated Switch TDA21201 incorporates an intelligent MOSFET driver and two
Power MOSFETs in a single package to form a fully integrated and optimized power
stage of a DC/DC synchronous buck converter including the bootstrap components
for the high-side MOSFET.
The Power MOSFETs are optimized for lowest static and dynamic losses for a 12 V
to sub-3.5 V conversion and can handle up to 30 A output current. The TDA21201 is
manufactured in Infineon´s state-of-the-art multi-chip assembly using a low-Rth 7-Pin
Page 1 Apr-29, 2002
Preliminary Data SheetTDA21201
TO-220 package or its associated SMD counterpart TO-263 and Infineon´s latest
chip technologies.
Block Diagram
VCC
= 12 V (Pin 6-7)
High side FET
VIN
FET Drive
Circuitry
V
OUT
to PWM IC
(Pin 5)
Low side FET
to output inductor
(Pin 4/tab)
GND
(Pin 1-3)
Absolute Maximum Ratings
At Tj = 25 °C, unless otherwise specified
Parameter Symbol
Value
Unit
Min. Max.
Peak voltage supplied to ‘VCC’ pins V
Peak voltage supplied to ‘IN’ pin, D
< 10 % VIN -5 10
IN_Peak
Peak voltage at ‘Vout’ pin to GND V
Maximum DC output current, VCC = 12 V, V
≤ 3.3 V
OUT
CC_PEAK
OUT_PK
I
OUT_MAX
Junction temperature TJ 150
Storage temperature TS -55 150
Lead temperature TO-263;
TL 225
20*
-5 20*
-10 30 A
°C
V
MSL1, IPC/JEDEC J-STD-020A
Lead temperature TO-220 (soldering, 10 seconds) TL 260
ESD rating (Human body model) ESD 2 k V
IEC climatic category; DIN EN 60068-1 55/150/56 -
* The positive peak voltage (= the voltage overshoot during switching transients) at the VCC pins and
the OUT pin/tab is limited by the Integrated Switch itself (pls., see the “Over-voltage protection of
VCC” paragraph
SMD version, device on PCB:
@ min. footprint
@ 6 cm² cooling area
Preliminary Data SheetTDA21201
62
40
Electrical Characteristics
At Tj = 25 °C, unless otherwise specified
Parameter Symbol
Conditions
Min.
Values
Typ. Max.
Unit
Input Characteristic (= MOSFET Driver)
Shut down window V
Shut down hold-off
IN_SHUT
t_
SHUT
t_
1.2 V ≤ V
> 1.5 µs 1.2 1.6 V
SHUT
≤ 1.6 V
IN
0.8 1.5 2.5 µs
time
Supply current during
shut down
Current into ‘IN’ pin,
during shut down
Current into ‘IN’ pin,
I
CC_SHUT
I
IN_SHUT
I
IN_LOW
1.2 V ≤ V
≤ 1.6 V
IN
10 16 22 mA
VCC = 12 V
VIN = 1.4 V-10 10
VIN = 0.4 V-2 -10 -50
µA
Low
Current into ‘IN’ pin,
I
IN_HIGH
VIN = 4.5 V20 35 80
High
Static Characteristic (= High Side and Low Side MOSFET)
D-S Breakdown
Voltage High Side
D-S Breakdown
DS_HS
V
DS_LS
1.2 V ≤ V
I
D
≤ 1.6 V
IN
= 0.25 A
30
V
V
Voltage Low Side
D-S Leakage Current
High Side
D-S Leakage Current
High Side
Drain-Source on
Resistance High Side
Drain-Source on
Resistance Low Side
Drain-Source on
Resistance High Side
Drain-Source on
I
DSS_HS
I
DSS_LS
R
DSon_HS
R
DSon_LS
R
DSon_HS
R
DSon_LS
1.2 V ≤ V
V
CC
≤ 1.6 V
IN
= 12 V
I
= 15 A
OUT
Tj = 25 °C
I
= 15 A
OUT
Tj = 125 °C
0.1 1 µA
13.3
4.8
17.7
6.4
mΩ
Resistance Low Side
Dynamic Characteristic (= Integrated Switch)
IN to OUT delay time
L à H; 50 % to 50 %
IN to OUT delay time
H à L; 50 % to 50 %
OUT rise time; 20 %
t
110 150
d(ON)
= 15 A
t
70 100
d(OFF)
I
OUT
tr 10 25
(s. Timing Diagram)
ns
to 80 %
OUT fall time; 80 to
tf
10 30
20 %
Page 3 Apr-29, 2002
t
d(on)
t
d(off)
VIN
V
OUT
t
d(on)
t
d(off)
Preliminary Data SheetTDA21201
Operating Conditions
At Tj = 25 °C, unless otherwise specified
Parameter Symbol
Voltage supplied to
VCC 9 15
‘VCC’ pins
Voltage ‘IN’ Low V
Voltage ‘IN’ High V
Input signal transition
-0.5 0.8
IN_L
2.1 5.5
IN_H
f 100 500 KHz
Conditions
Min.
Values
Typ. Max.
Unit
V
frequency
Pulse width Input t
Power dissipation P
90 ns
P_IN
10 W
TOT
Junction temperature TJ -25 125 °C
Timing Diagram
50%
50%
Typical application
A circuit designer will value the Integrated Switch TDA21201 as cost-optimized
power stage solution in high-density DC/DC conversion applications using a Vcc = 12
V input where efficiency and board space is an issue, e.g. in multi-phase
microprocessor supplies on motherboards, in VRMs and servers.
The TDA21201 can also be used to power Logic circuits, Memory banks etc. that
require higher voltages, e.g. 2.5 or 3.3 V. The efficiency of the Integrated Switch and
the overall efficiency of the converter will even go up at these elevated output
voltages compared to the 1.6 V efficiency given later on in this data sheet.
Page 4 Apr-29, 2002
PWM 1
1
N
N
C
Preliminary Data SheetTDA21201
Designing a 12 V to sub-3.3 V converter using the TDA21201
General info
To design a multi-phase converter with a 12 V input simply use in each phase
just one TDA21201 instead of using a MOSFET driver, a high side MOSFET,
bootstrap components, and one or more low side MOSFETs. The entire
converter is completed by the input filter, the output filter and a multi-phase
PWM IC.
Input compatibility to standard PWM controllers / shut-down mode
The Integrated Switch TDA21201 has a high impedance input pin ‘IN’ to be
connected to PWM controller outputs ‘PWM1’, ‘PWM2’ etc. It sinks or sources
only a fraction of a mA from the controller’s output. The TDA21201 is
compatible to standard controller and driver signals in terms of the signal level
(5 V TTL) and in terms of the ‘Low’/’High’ relationship (’Low’ turns the low side
MOSFET on, ‘High` turns the High side MOSFET on).
The TDA21201 can be shut down (the high side MOSFET and the low side
MOSFET is turned off) by applying an input signal V
= 1.2 ... 1.6 V for more
IN
than 1.5 µs typical. This way the TDA21201 reduces the power dissipation by
saving the gate charges of both the high side and the low side MOSFET
during no load conditions. The shutdown state is terminated when V
moves
IN
into the ‘Low’ or ‘High’ threshold.
Typical Application: 12 V à 1.x V N-Phase Converter using the TDA21201
12 V
L1
1...2 V
FET
Driver
PWM
IC
PWM 2
PWM N
L
FET
Driver
Page 5 Apr-29, 2002
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