Infineon IM393 Series, IM393-S6E, IM393-M6E, IM393-S6F, IM393-L6E Application Note
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IM393 Application note
IM393 IPM Technical Description
About this document
Scope and purpose
The scope of this application note is to describe the IM393 product family and the basic requirements for
operating the products in a recommended mode. This includes integrated components, such as IGBT,
bootstrap functionality or gate drive IC, as well as the design of the necessary external circuitry, interfacing and
application use.
Intended audience
Power electronics engineers who want to design reliable and efficient motor drive application with IM393 IPM
family.
Table of contents
About this document ....................................................................................................................... 1
Table of contents ............................................................................................................................ 1
1 Introduction .......................................................................................................................... 3
1.1 Product line-up ........................................................................................................................................ 4
1.2 Nomenclature .......................................................................................................................................... 5
2 Internal components and package technology .......................................................................... 6
2.1 Power transistor and diode technology ................................................................................................. 6
2.2 Control IC – Six-channel gate driver IC ................................................................................................... 6
2.3 Thermistor ............................................................................................................................................... 7
2.4 Package technology ................................................................................................................................ 8
3 Product overview and pin description ...................................................................................... 9
3.1 Internal circuit and features ................................................................................................................... 9
3.2 Maximum electrical rating .................................................................................................................... 10
3.3 Description of the input and output pins ............................................................................................. 10
3.4 Outline drawings ................................................................................................................................... 15
4 Interface circuit and layout guide ........................................................................................... 17
4.1 Input/output signal connection ............................................................................................................ 17
4.2 Input/output signal connection ............................................................................................................ 19
4.3 Recommended circuit current of power supply .................................................................................. 20
4.4 Recommended layout for over-current protection (OCP) and short-circuit protection (SCP)
functions ................................................................................................................................................ 21
4.5 Recommended wiring of shunt resistor and snubber capacitor ......................................................... 21
4.6 Pin and screw hole coordinates for IM393-XX footprint ...................................................................... 23
5 Function and protection circuit ............................................................................................... 25
5.1 Over-current protection ........................................................................................................................ 25
5.1.1 Timing chart of over-current protection (OCP) ............................................................................... 25
5.1.2 Selecting current-sensing shunt resistor ........................................................................................ 26
5.1.3 Delay time ......................................................................................................................................... 27
Application Note Please read the Important Notice and Warnings at the end of this document V 1.0
www.infineon.com page 1 of 53 2019-04-01
IM393 Application note
IM393 IPM Technical Description
Introduction
5.2 Fault output and auto-clear function ................................................................................................... 27
5.3 Undervoltage lockout (UVLO) ............................................................................................................... 29
5.4 Over-temperature protection ............................................................................................................... 31
6 Bootstrap circuit ................................................................................................................... 33
6.1 Bootstrap circuit operation .................................................................................................................. 33
6.2 Initial charge of bootstrap capacitor .................................................................................................... 34
6.3 Bootstrap capacitor selection .............................................................................................................. 34
6.4 Charging and discharging of the bootstrap capacitor during PWM inverter operation ..................... 35
7 Thermal design ..................................................................................................................... 37
7.1 Introduction ........................................................................................................................................... 37
7.2 Power losses .......................................................................................................................................... 38
7.2.1 Conduction losses ............................................................................................................................ 38
7.2.2 Switching losses ............................................................................................................................... 39
7.3 Thermal impedance .............................................................................................................................. 39
7.4 Temperature rise considerations and calculation example ................................................................ 40
7.5 Heat sink selection guide ...................................................................................................................... 42
7.5.1 Required heat sink performance ..................................................................................................... 42
7.5.2 Heat sink characteristics .................................................................................................................. 43
7.5.2.1 Heat transfer from heat source to heat sink .............................................................................. 43
7.5.2.2 Heat transfer within the heat sink .............................................................................................. 43
7.5.2.3 Heat transfer from heat sink surface to ambient ....................................................................... 43
7.5.3 Selecting a heat sink ........................................................................................................................ 45
7.6 Online simulation tool .......................................................................................................................... 45
8 Heat sink mounting and handling guidelines ............................................................................ 47
8.1 Heat sink mounting ............................................................................................................................... 47
8.1.1 General guidelines ........................................................................................................................... 47
8.1.1.1 Recommended tightening torque .............................................................................................. 47
8.1.1.2 Screw tightening to heat sink ..................................................................................................... 48
8.2 Handling guideline ................................................................................................................................ 49
8.3 Storage guideline .................................................................................................................................. 50
8.3.1 Recommended storage conditions ................................................................................................. 50
9 References ........................................................................................................................... 51
Revision history............................................................................................................................. 52
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IM393 Application note
IM393 IPM Technical Description
Introduction
1 Introduction
With the global emphasis on energy efficiency, there are ever stricter requirements on the efficiency of motor
drive circuits. CIPOS™ Integrated Power Modules (IPMs) are becoming more popular in the home appliance and
industrial motor-drive applications, because of their higher efficiency, smaller size, easier assembly and shorter
development time.
The next generation of CIPOS™ IPM from Infineon Technologies has been developed with a focus on improving
module efficiency and long-term reliability. The combined benefits of advanced trench IGBT technology and
optimized package design have enabled us to achieve higher efficiency and improved reliability, along with
minimized module system costs. Integrating discrete power semiconductors and drivers into one package
allows designers to reduce the time and effort spent on design. To meet the strong demand for small size and
higher power density, Infineon has developed a new family of highly integrated intelligent power modules that
contain nearly all of the semiconductor components required to drive electronically controlled variable-speed
electric motors.
This advanced IPM is a combination of Infineon’s newest low V
best trade-off between conduction and switching losses, and the industry benchmark three-phase high voltage,
high-speed driver (3.3 V-compatible) in a fully isolated thermally enhanced package. A built-in high precision
temperature monitor and over-current protection feature, along with the short-circuit rated IGBTs and
integrated undervoltage lockout function, deliver a high level of protection and fail-safe operation. Using a dual
or single in-line package with full transfer molded structure resolves the isolation problem to the heat sink.
The application note concerns the following products:
− IM393-S6E
− IM393-S6F
− IM393-M6E
− IM393-M6F
− IM393-L6E
− IM393-L6F
− IM393-X6E
− IM393-X6F
IM393-XX is part of CIPOS™ Tiny family of intelligent power modules which are designed for motor drives in
household appliances covering a wide range of power from 100 W up to 1500 W with products such as:
− Washing machines
− Dish washers
− Refrigerators
− Air conditioning compressors
− Pumps
trench IGBT technology optimized for the
CE(ON)
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IM393 Application note
IM393 IPM Technical Description
Introduction
1.1 Product line-up
Table 1 IM393-XX Products
Rating
Part Number
Current
(A)
Voltage
(V)
Internal
Circuit
Package
Isolation
voltage (V
RMS
Main applications
)
Refrigerator
IM393-S6E(F) 6 A
E(Fully
Dryer
Dish washer
molded
Washing
machine
Dryer
Elevator door
Washing
machine
Air conditioner
Elevator door
IM393-M6E(F) 10 A
IM393-L6E(F) 15 A
600 V
3 ф Bridge
Open
emitter
DIP
Module)
F(Fully
molded
SIP
Module)
2000 V
RMS
sinusoidal,
1min.
IM393-X6E(F) 20 A Air conditioner
Fan
Pump
GPI
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IM393 Application note
IM393 IPM Technical Description
Introduction
1.2 Nomenclature
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IM393 Application note
IM393 IPM Technical Description
Internal components and package technology
2 Internal components and package technology
2.1 Power transistor and diode technology
IM393-XX IPM products are based on new Infineon IGBT6 TRENCHSTOP™ technology [1]. This new IGBT
generation is based on trench and field-stop technology, and offers significant improvements in terms of loss
reduction. It features the well-known properties of robustness of Infineon’s IGBT, including short-circuitwithstand capability and maximum-junction temperature. Moreover, all the advantages of this technology are
maintained in order to achieve the highest efficiency and power density. The features include very low static
parameters such as the saturation voltage of the IGBT or the forward voltage of the diode. Excellent dynamic
parameters such as turn-off energy of the IGBT or the reverse-recovery charge of the diode are also valuable
features. The forward diodes are ultrafast with very soft recovery characteristics that lead to a reduction in
reverse-recovery and turn-on energy losses.
2.2 Control IC – Six-channel gate driver IC
The driver is a high-voltage, high-speed IGBT gate driver with three high-side and three low-side referenced
output channels for three-phase applications. The IC is designed to be used with low-cost bootstrap power
supplies. The bootstrap diode functionality has been integrated into this device to reduce the component
count on the PCB. Proprietary HVIC and latch-up immune CMOS technologies have been implemented in a
rugged monolithic structure. The floating logic input is compatible with standard CMOS and LSTTL output
(down to 3.3 V logic). A current-trip function which terminates all six outputs can be done by an external current
sense resistor. Enable functionality is available to terminate all six outputs simultaneously. An open-drain
FAULT signal is provided to indicate that a fault has occurred. Fault conditions are cleared automatically after a
delay programmed externally via an RC network connected to the RCIN input. The output drivers feature a
high-pulse current buffer stage designed for minimum driver cross conduction. Shoot-through protection
circuitry and a minimum dead-time circuitry have been integrated into this IC. Propagation delays are matched
to simplify the HVIC’s use in high-frequency applications.
The HVIC technology uses proprietary monolithic structures integrating bipolar, CMOS and lateral DMOS
devices [2]. Using this mixed-signal HVIC technology, both high-voltage, level-shifting circuits, and low-voltage
analog and digital circuits can be implemented. This technology places high-voltage circuits in a ‘well’ formed
by polysilicon rings which can float 600 V within the same silicon, away from the low-voltage circuitry, as shown
in Figure 1.
These HVIC gate drivers with floating switches are well-suited for topologies requiring high-side and bridge
configuration.
Figure 1 Structure and cross section of the HVIC
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IM393 Application note
IM393 IPM Technical Description
Internal components and package technology
2.3 Thermistor
All IM393-XX IPMs have internal thermistors to sense the module temperature. Figure 2 shows the correlation
between NTC temperature (TTH) and the thermistor output voltage which can be used to set the threshold for
over-temperature protection.
Table 2 Raw data of the thermistor used in IM393-XX
T [℃] R
[kΩ] R
min
[kΩ] R
typ
max
[kΩ]
Tol [%]
T [℃] R
[kΩ] R
min
[kΩ] R
typ
max
[kΩ]
Tol [%]
-40 1438.40 1568.15 1705.34 8.7% 45 18.930 20.097 21.282 5.9%
-35 1040.65 1130.82 1225.73 8.4% 50 15.448 16.432 17.436 6.1%
-30 761.64 825.03 891.47 8.1% 55 12.695 13.531 14.385 6.3%
-25 563.53 608.58 655.58 7.7% 60 10.4830 11.1942 11.9238 6.5%
-20 421.23 453.57 487.16 7.4% 65 8.6961 9.3033 9.9279 6.7%
-15 317.53 340.93 365.14 7.1% 70 7.2454 7.7652 8.3016 6.9%
-10 241.62 258.72 276.33 6.8% 75 6.0619 6.5084 6.9703 7.1%
-5 185.51 198.10 211.02 6.5% 80 5.0922 5.4767 5.8755 7.3%
0 143.62 152.98 162.53 6.2% 85 4.3017 4.6342 4.9800 7.5%
5 112.35 119.37 126.51 6.0% 90 3.6482 3.9366 4.2372 7.6%
10 88.440 93.740 99.109 5.7% 95 3.1056 3.3565 3.6186 7.8%
15 70.033 74.055 78.112 5.5% 100 2.6533 2.8721 3.1012 8.0%
20 55.770 58.837 61.918 5.2% 105 2.2748 2.4661 2.6669 8.1%
25 44.650 47.000 49.350 5.0% 110 1.9567 2.1245 2.3009 8.3%
30 35.772 37.737 39.711 5.2% 115 1.6886 1.8360 1.9913 8.5%
35 28.801 30.449 32.110 5.5% 120 1.4616 1.5915 1.7287 8.6%
40 23.298 24.682 26.084 5.7% 125 1.2690 1.3837 1.5050 8.8%
Thermistor temperature (or voltage reading) can then be linked to the IGBT junction temperature. The VTH can
be used as a microcontroller input to monitor IGBT junction temperature during operation.
Figure 2 IGBT junction temperature vs. internal thermistor temperature for IM393-L6E
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IM393 Application note
IM393 IPM Technical Description
Internal components and package technology
Figure 2 is valid only for the following conditions:
- V
= 300 V
DC
- PWM sinusoidal modulation
- I
- F
- F
phase = 5 A
rms
= 16 kHz
sw
= 50 Hz
mod
- MI = 0.8
- PF = 0.6
- Heat sink R
For different application conditions, the difference between TJ and T
less heat. Also in the extreme case of zero current, TJ and T
= 1.25 °C/W
th
will be smaller if the module dissipates
TH
will be identical. In any case, it should be ensured
TH
for safety reasons that the absolute maximum junction temperature is not reached.
Please note that an over-temperature event in the IGBT will only be visible in the NTC readings after a certain
time, which depends significantly on the application conditions.
2.4 Package technology
IM393-XX offers the smallest size while providing high-power density up to 600 V and 20 A by employing
TRENCHSTOP™ IGBT and emitter-controlled diodes with a six-channel gate drive IC. It contains all power
components such as IGBTs, and isolates them from each other and from the heat sink. All low-power
components such as the gate drive IC and thermistor are assembled on a lead frame.
The electric insulation is provided by the mold compound, which is simultaneously the thermal contact to the
heat sink. In order to further decrease the thermal impedance, the internal lead-frame design has been
optimized [3]. Figure 3 shows the external view of the IM393-XX package.
(a) Dual in-line package (b) Single in-line package
Figure 3 External view of IM393-XX
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IM393 Application note
IM393 IPM Technical Description
Product overview and pin description
3 Product overview and pin description
3.1 Internal circuit and features
Figure 3 illustrates the internal block diagram of the IM393-XX. It consists of a three-phase IGBT inverter circuit
and a driver IC with control functions. The detailed features and integrated functions of IM393-XX are described
as follows:
(1) P
(35) P
(1) P
(3) VS(W)
(4) VB(W)
(6) VS(V)
(7) VB(V)
(9) VS(U)
(10) VB(U)
(12) VDD
(13) VTH
(14) COM
(15) COM
(16) ITRIP
(17) RFE
(18) HIN(U)
(19) HIN(V)
(20) HIN(W)
(21) LIN(U)
(22) LIN(V)
(23) LIN(W)
(24) N(W)
(25) N(V)
(26) N(U)
(33) P
VB3
VB2
VB1
VDD
-t°
COM
VSS
ITRIP
RFE
HIN1
HIN2
HIN3
LIN1
LIN2
LIN3
HO3
HO2
HO1
VS3
VS2
VS1
LO3
LO2
LO1
(32) W
(31) V
(30) U
(29) N(W)
(28) N(V)
(27) N(U)
(3) VS(W)
(4) VB(W)
(6) VS(V)
(7) VB(V)
(9) VS(U)
(10) VB(U)
(12) VDD
(13) VTH
(14) COM
(15) COM
(16) ITRIP
(17) RFE
(18) HIN(U)
(19) HIN(V)
(20) HIN(W)
(21) LIN(U)
(22) LIN(V)
(23) LIN(W)
(24) N(W)
(25) N(V)
(26) N(U)
VB3
VB2
VB1
VDD
-t°
COM
VSS
ITRIP
RFE
HIN1
HIN2
HIN3
LIN1
LIN2
LIN3
HO3
VS3
HO2
VS2
HO1
VS1
LO3
LO2
LO1
(a) Dual in-line package (b) Single in-line package
Figure 4 Internal circuit
Features
− 600 V / 6 A to 20 A rating in one physical package size (mechanical layouts are identical)
− Motor power range from 100 W to 1.5 kW
− Fully isolated dual in-line package (DIP) and single in-line package (SIP) molded module
− Infineon low- V
− Undervoltage lockout for all channels
− Rugged gate driver technology with stability against transients and negative voltage
− Integrated bootstrap functionality
− Matched delay times of all channels / Built-in deadtime
− Over-current protection
− Lead-free terminal plating; RoHS-compliant
− 3.3 V Schmitt triggered input logic
− Cross conduction preventing logic
− Low-side emitter pins accessible for current monitoring
− Active high input signal logic
− Isolation 2000 V
− High operating case temperature, T
− Temperature monitor
TRENCHSTOP™ IGBTs with separate freewheeling diode
CE(ON)
min and CTI>600
RMS
= 125°C
Cmax
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IM393 Application note
IM393 IPM Technical Description
Product overview and pin description
3.2 Maximum electrical rating
Table 3 Detailed description of absolute maximum ratings (IM393-M6E/F case)
Item Symbol Rating Description
Max. blocking
voltage
Output RMS
current
Output peak
current
Junction
temperature
Operating case
temperature
range
V
I
Peak
T
T
CES
I
600 V The sustained collector-emitter voltage of internal IGBTs
C
10 A
15 A
J
-40 ~ 150°C
The allowable RMS IGBT collector current at steady state and
Tc = 25 °C.
The allowable peak IGBT collector current at Tc = 25°C
Considering temperature ripple on the power chips, the
maximum junction temperature rating of IM393-XX is 150°C.
Tc (case temperature) is defined as a temperature of the
package surface underneath the specified power chip. Please
C
-40 ~ 125°C
mount a temperature sensor on a heat-sink surface at the
defined position in Figure 5 so as to get accurate temperature
information.
Figure 5 TC measurement point
3.3 Description of the input and output pins
The following tables define the DIP type of IM393-XX input and output pins. The detailed functional descriptions
are as follows:
Pin Name Description
1 P Positive bus input voltage
2 N/A None
3 VS(W) W-phase high side floating supply offset voltage
4 VB(W) W-phase high side floating supply voltage
5 N/A None
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IM393 IPM Technical Description
Product overview and pin description
6 VS(V) V-phase high side floating supply offset voltage
7 VB(V) V-phase high side floating supply voltage
8 N/A None
9 VS(U) U-phase high side floating supply offset voltage
10 VB(U) U-phase high side floating supply voltage
11 N/A None
12 VDD Low side control supply
13 VTH Temperature monitor
14 COM Low side control negative supply
15 COM Low side control negative supply
16 ITRIP Over current protection input
17 RFE RCIN / Fault / Enable
18 HIN(U) U-phase high side gate driver input
19 HIN(V) V-phase high side gate driver input
20 HIN(W) W-phase high side gate driver input
21 LIN(U) U-phase low side gate driver input
22 LIN(V) V-phase low side gate driver input
23 LIN(W) W-phase low side gate driver input
24 N(W) W-phase low side emitter
25 N(V) V-phase low side emitter
26 N(U) U-phase low side emitter
27 N(U) U-phase low side emitter (DIP only)
28 N(V) V-phase low side emitter (DIP only)
29 N(W) W-phase low side emitter (DIP only)
30 U U-phase output (DIP only)
31 V V-phase output (DIP only)
32 W W-phase output (DIP only)
33 P Positive bus input voltage (DIP only)
34 N/A None
35 P Positive bus input voltage (DIP only)
36 N/A None
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IM393 Application note
IM393 IPM Technical Description
Product overview and pin description
The following tables define the SIP type of IM393-XX input and output pins. The detailed functional descriptions
are as follows:
Pin Name Description
1 P Positive bus input voltage
2 N/A None
3 VS(W) / W W-phase high side floating supply offset voltage / W-phase output
4 VB(W) W-phase high side floating supply voltage
5 N/A None
6 VS(V) / V V-phase high side floating supply offset voltage / V-phase output
7 VB(V) V-phase high side floating supply voltage
8 N/A None
9 VS(U) / U U-phase high side floating supply offset voltage / U-phase output
10 VB(U) U-phase high side floating supply voltage
11 N/A None
12 VDD Low side control supply
13 VTH Temperature monitor
14 COM Low side control negative supply
15 COM Low side control negative supply
16 ITRIP Over current protection input
17 RFE RCIN / Fault / Enable
18 HIN(U) U-phase high side gate driver input
19 HIN(V) V-phase high side gate driver input
20 HIN(W) W-phase high side gate driver input
21 LIN(U) U-phase low side gate driver input
22 LIN(V) V-phase low side gate driver input
23 LIN(W) W-phase low side gate driver input
24 N(W) W-phase low side emitter
25 N(V) V-phase low side emitter
26 N(U) U-phase low side emitter
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IM393 Application note
IM393 IPM Technical Description
Product overview and pin description
High-side bias voltage pins for driving the IGBT
Pins: VB(U) – VS(U) , VB(V) – VS(V), VB(W) – VS(W)
• These pins provide the gate drive power to the high-side IGBTs.
• The ability to utilize a bootstrap circuit scheme for the high-side IGBTs eliminates the need for external power
supplies.
• Each bootstrap capacitor is charged from the V
IGBT or the freewheeling state of the low-side freewheeling diode.
• In order to prevent malfunctions caused by noise and ripple in the supply voltage, a good quality (low ESR,
low ESL) filter capacitor should be mounted very close to these pins.
Low-side bias voltage pin
Pin: VDD
• This is the control supply pin for the internal IC.
• In order to prevent malfunctions caused by noise and ripple in the supply voltage, a good quality (low ESR,
low ESL) filter capacitor should be mounted very close to this pin.
supply during the ON-state of the corresponding low-side
DD
Low-side common supply ground pin
Pin: COM
• This pin connects the control ground for the internal IC.
Signal Input pins
Pins: HIN(U), HIN(V), HIN(W), LIN(U), LIN(V), LIN(W)
• These are pins to control the operation of the internal IGBTs.
• They are activated by voltage input signals. The terminals are internally connected to a Schmitt trigger circuit
composed of 5 V-class CMOS.
• The signal logic of these pins is active-high. The IGBT associated with each of these pins will be turned ON
when a sufficient logic voltage is applied to these pins.
• The wiring of each input should be as short as possible to protect the IM393-XX against noise influences.
• To prevent signal oscillations, an RC coupling is recommended as illustrated in Figure 4.1.
Over-current detection pin
Pin: ITRIP
• The current-sensing shunt resistor should be connected between the pin N (emitter of low-side IGBT) and the
power ground to detect short-circuit current (refer to Figure 4.3). An RC filter should be connected between
the shunt resistor and the pin ITRIP to eliminate noise.
• The integrated comparator is triggered if the voltage V
selected to meet this level for the specific application. In case of a trigger event, the voltage at pin RFE is pulled
down to LOW.
• The connection length between the shunt resistor and ITRIP pin should be minimized.
Application Note 13 of 53 V 1.0
is higher than 0.49 V. The shunt resistor should be
ITRIP
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IM393 Application note
IM393 IPM Technical Description
Product overview and pin description
RCIN/Fault/Enable input pin
Pin: RFE
• In case of an over-current event, the FLT/EN pin will get low with the turning ON of the open-drain MOSFET.
This pin is used to post I
• There are two situations in which the fault is reported via the RCIN/FLT/EN pin.
• The first is an undervoltage condition of V
pin will get low with the turning ON of the open-drain MOSFET.
• When the fault has been removed, the fault clear timer is started, and the length of the fault clear time period
is determined by the external capacitor value. (see section 5.2)
Temperature-monitoring output pin
Pin: VTH
• The VTH pin provides a voltage linked to NTC temperature. (see section 5.4)
to switch turn-OFF clear time. (see section 5.2)
TRIP
, the second is an over-current event condition, and the FLT/EN
DD
Positive DC-link pin
Pin: P
• This is the DC-link positive power supply pin of the IM393-XX IPM.
• It is internally connected to the collectors of the high-side IGBTs.
• In order to suppress the surge voltage caused by the DC-link wiring or PCB-pattern inductance, connect a
smoothing filter capacitor close to this pin. (Typically metal film capacitors are used.)
Negative DC-link pins
Pins: N(U), N(V), N(W)
• These are the DC-link negative power supply pins (power ground) of the inverter.
• These pins are connected to the low-side IGBT emitters of the each phase.
Inverter power output pins
Pins: U, V, W
• Inverter output pins for connecting to the inverter load (e. g. motor).
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IM393 IPM Technical Description
Product overview and pin description
3.4 Outline drawings
Figure 6 DIP version (IM393-X6E)
Figure 7 DIP version (IM393-X6E2)
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IM393 IPM Technical Description
Product overview and pin description
Figure 8 DIP version (IM393-X6E3)
Figure 9 SIP version (IM393-X6F)
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