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HiRel K-Band GaAs Super Low Noise HEM T
HiRel Discrete and Microwave Semiconductor
•
• Pseudo-morphic AlGaAs/InGaAs/G aAs HEMT
• For professional super low-noise amplifiers
• For frequencies from 500 MHz to > 20 GHz
CFY67
34
• Hermetically sealed microwave package
12
• Super low noise figure, high associated g ain
• Space Qualified
ESA/SCC Detail Spec. No.: 5613/004,
Type Variant No.s 01 to 04, 05 foreseen ( t bc.)
ESD: Electrostatic discharge sensitive device, observe handling precautions!
Type Marking Ordering Code Pin Configuration Package
1234
CFY67-06 (ql)
CFY67-08 (ql)
CFY67-08P (ql)
- see below G S D S Micro-X
CFY67-10 (ql)
CFY67-10P (ql)
CFY67-nnl: specifies gain and output power levels (see electrical characteristics)
(ql) Quality Level: P: Professional Quality, Ordering Code: Q62702F1699
H: High Rel Quality, Ordering Code: on request
S: Space Quality, Ordering Code: on request
ES: ESA Space Quality, Ordering Code: Q62702F1699
(see order instructions for or der ing example)
Semiconductor Group 1 of 10 Draft D, September 99
CFY67
Maximum Ratings
Parameter Symbol Values Unit
Drain-source voltage V
Drain-gate voltage V
Gate-source voltage (reverse / forward) V
Drain current I
Gate forward current I
RF Input Power, C- and X-Band
1)
Junction temperature T
Storage temperature r ange T
Total power dissipation
Soldering temperature
2)
3)
Thermal Resistance
Junction-soldering point R
P
P
T
DS
DG
GS
D
G
RF,in
J
stg
tot
sol
th JS
3.5 V
4.5 V
- 3... + 0.5 V
60 mA
2mA
+ 10 dBm
150
- 65... + 150
°C
°C
200 mW
230 °C
≤ 515 (tbc.)
K/W
Notes.:
1) For VDS ≤ 2 V. For VDS > 2 V, derating is required.
2) At T
= + 47 °C. For TS > + 47 °C derating is required.
S
3) During 15 sec. maximum. The same terminal shall not be resoldered until 3 minutes have
elapsed.
Semiconductor Group 2 of 10 Draft D, September 99
CFY67
Electrical Characteristics (at T
=25°C; unless otherwise specified)
A
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Drain-source saturation current
= 2 V, VGS = 0 V
V
DS
Gate threshold voltage
= 2 V, ID = 1 mA
V
DS
Drain current at pinch-off
= 1.5 V, VGS = - 3 V
V
DS
Gate leakage current at pinch- off
= 1.5 V, VGS = - 3 V
V
DS
Transconductance
= 2 V, ID = 15 mA
V
DS
I
Dss
-V
I
Dp
-I
g
Gth
Gp
m15
15 30 60 mA
0.2 0.7 2.0 V
-< 50-µA
- < 50 200 µA
50 65 - mS
Gate leakage current at oper ation
= 2 V, ID = 15 mA
V
DS
Thermal resistance
junction to soldering point
-I
R
G15
th JS
-< 0.52µA
- 450 - K/W
Semiconductor Group 3 of 10 Draft D, September 99