INFINEON BSS87 User Manual

Rev. 1.1
)
j
g
BSS87
SIPMOSÒ Small-Signal-Transistor
Feature
· N-Channel
· Enhancement mode
· Logic Level
· dv/dt rated
Type Package Ordering Code Tape and Reel Information
BSS87
P-SOT89-4-2 Q62702-S506
E6327: 1000 pcs/reel
Maximum Ratings, at Tj = 25 °C, unless otherwise specified
Product Summary
DS
R
DS(on
I
D
P-SOT89-4-2
3
240 V
6 W
0.26 A
1
2
2
VPS05558
Marking
KA
Parameter
Continuous drain current
TA=25°C
T
=70°C
A
Pulsed drain current
TA=25°C
Reverse diode dv/dt
IS=0.26A, VDS=192V, di/dt=200A/µs, T
jmax
=150°C
Gate source voltage V
Symbol Value Unit
I
D
0.26
0.21
I
D puls
dv/dt
GS
1.04
6 kV/µs
±20
ESD Sensitivity (HBM) as per MIL-STD 883 Class 1
Power dissipation, related to min. footprint
TA=25°C
Operating and storage temperature T
P
tot
T
,
st
1 W
-55... +150
IEC climatic category; DIN IEC 68-1 55/150/56
A
V
°C
Page 1
2004-12-1
Rev. 1.1
BSS87
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - case
R
thJC
- - 10 K/W
(Pin 2)
SMD version, device on PCB:
@ min. footprint
@ 6 cm
2
cooling area
1)
R
thJA
-
-
-
-
125
70
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
VGS=0, ID=250µA
Gate threshold voltage, VGS = V
I
=108µA
D
Zero gate voltage drain current
VDS=240V, VGS=0, Tj=25°C
DS
(BR)DSS
GS(th)
I
DSS
240 - - V
0.8 1.2 1.8
-
-
0.1
µA
V
=240V, VGS=0, Tj=150°C
DS
Gate-source leakage current
VGS=20V, VDS=0
Drain-source on-state resistance
VGS=4.5V, ID=0.24A
Drain-source on-state resistance
VGS=10V, ID=0.26A
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
I
GSS
R
DS(on)
R
DS(on)
-
-
100
- - 10 nA
- 4.6 7.5
- 3.9 6
2004-12-1
W
Rev. 1.1
)
)
f
g
g
(p
)
BSS87
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Dynamic Characteristics
Transconductance g
Input capacitance C
Output capacitance C
Reverse transfer capacitance C
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Gate Charge Characteristics
Gate to source charge Q
Gate to drain charge Q
Gate charge total Q
Gate plateau voltage V
fs
iss
oss
rss
d(on
r
d(off
g
s
d
lateau
VDS³2*ID*R
I
=0.21A
D
VGS=0, VDS=25V,
f=1MHz
DS(on)max
,
0.16 0.33 - S
- 77.5 97 pF
- 11.2 14
- 5.8 7.3
VDD=120V, VGS=10V,
I
=0.28A, RG=6W
D
- 3.7 5.5 ns
- 3.5 5.2
- 17.6 26.4
- 27.3 41
VDD=192V, ID=0.26A - 0.14 0.21 nC
- 1.7 2.5
VDD=192V, ID=0.26A,
V
=0 to 10V
GS
VDD=192V, ID = 0.26 A - 2.7 - V
- 3.7 5.5
Reverse Diode
Inverse diode continuous
I
forward current
Inv. diode direct current, pulsedI
Inverse diode forward voltage V
Reverse recovery time t
Reverse recovery charge Q
S
SM
SD
rr
rr
TA=25°C - - 0.26 A
- - 1.04
VGS=0, IF = I
VR=120V, I
di
/dt=100A/µs
F
Page 3
F
S
=
lS,
- 0.82 1.2 V
- 53.6 80.4 ns
- 101 152 nC
2004-12-1
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