
OptiMOS™ Small-Signal-Transistor
Features
• N-channel
• Enhancement mode
• Avalanche rated
• Qualified according to AEC Q101
• 100% lead-free; RoHS compliant
• Halogen-free according to IEC61249-2-21
Maximum ratings, at Tj=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous drain current
Avalanche energy, single pulse
E
AS
ID=1.8 A, RGS=25 W
33 mJ
Reverse diode dv/dt dv/dt
ID=1.8 A, VDS=80 V,
di/dt=200 A/µs,
T
j,max
=150 °C
6 kV/µs
Gate source voltage
Power dissipation
1)
P
tot
TA=25 °C
W
Operating and storage temperature
JESD22-A114 -HBM 0 (<250V)
Soldering Temperature 260 °C
IEC climatic category; DIN IEC 68-1 55/150/56
Tape and Reel Information
Rev 2.0 page 1 2013-04-04

BSP373N
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance
junction - soldering point
R
thJA
minimal footprint - - 110
6 cm2 cooling area
1)
- - 70
Electrical characteristics, at Tj=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSSVGS
=0 V, ID=250 µA
100 - - V
2.1 3.0 4.0
Drain-source leakage current
VDS=100 V, VGS=0 V,
Tj=25 °C
VDS=100 V, VGS=0 V,
Tj=150 °C
- - 10
Gate-source leakage current
I
GSS
VGS=20 V, VDS=0 V
- - 10 nA
Drain-source on-state resistance
R
DS(on)
VGS=10 V, ID=1.8 A
- 177 240
mW
|VDS|>2|ID|R
DS(on)max
,
ID=1.5 A
1)
Device on 40mm x 40mm x 1.5mm epoxy PCB FR4 with 6cm² (one layer, 70µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev 2.0 page 2 2013-04-04

BSP373N
Parameter Symbol Conditions Unit
min. typ. max.
Reverse transfer capacitance
Gate Charge Characteristics
Gate to source charge
Diode continous forward current
I
S
- - 1.8 A
VGS=0 V, IF=1.8 A,
Tj=25 °C
- 0.82 1.1 V
Reverse recovery time
VR=50 V, IF=1.8 A,
diF/dt=100 A/µs
VGS=0 V, VDS=25 V,
f=1 MHz
VDD=50 V, VGS=10 V,
ID=1.8 A, RG=6 W
VDD=50 V, ID=1.8 A,
VGS=0 to 10 V
Rev 2.0 page 3 2013-04-04