BSC200P03LS G
OptiMOSTM-P Power-Transistor
Product Summary
Features
• P-Channel
• Enhancement mode
• Logic level
• 150°C operating temperature
• Avalanche rated
• Vgs=25V, specially suited for notebook applications
Type Package Marking Lead free Packing
BSC200P03LS G PG-TDSON-8 200P03LS Yes Dry
Maximum ratings, at T
=25 °C, unless otherwise specified
j
V
DS
R
DS(on),max
I
D
-30 V
20
-12.5 A
PG-TDSON-8
mΩ
Parameter Symbol Conditions Unit
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Gate source voltage
Power dissipation
Operating and storage temperature
I
D
I
D,pulse
E
AS
V
GS
P
tot
T
j
, T
TC=25 °C
T
=70 °C
C
1)
=25 °C
T
A
TC=25 °C
2)
ID=-12.5 A, RGS=25 Ω
TC=25 °C
=25 °C
1)
stg
T
A
ESD class JESD22-C101-HBM
Soldering temperature
IEC climatic category; DIN IEC 68-1
Value
-12.5
-12.5
-9.9
-50
98
±25
63
2.8
-55 ... 150
1B (500V-1kV)
260 °C
55/150/56
A
mJ
V
W
°C
Rev. 1.1 page 1 2008-07-10
BSC200P03LS G
Parameter Symbol Conditions Unit
Values
min. typ. max.
Thermal characteristics
Thermal resistance,
junction - case
Thermal resistance,
junction - ambient
Electrical characteristics, at T
R
thJC
R
thJA
=25 °C, unless otherwise specified
j
6 cm2 cooling area
- - 2 K/W
1)
--50
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
V
(BR)DSS
V
GS(th)
I
DSS
VGS=0 V, ID=-250µA
VDS=VGS, ID=-100 µA
VDS=-30 V, VGS=0 V,
T
=25 °C
j
-30 - - V
-2.2 -1.5 -1
- -0.1 -1 µA
V
=-30 V, VGS=0 V,
DS
T
=125 °C
j
Gate-source leakage current
Drain-source on-state resistance
Gate resistance
Transconductance
1)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
I
R
R
g
GSS
DS(on)
G
fs
VGS=-25 V, VDS=0 V
VGS=-10 V,
I
=-12.5 A
D
|VDS|>2|ID|R
I
=-12.5 A
D
DS(on)max
- -10 -100
- -10 -100 nA
- 17.1 20
- 3.9 -
,
12 23 - S
mΩ
Ω
Rev. 1.1 page 2 2008-07-10
BSC200P03LS G
g
Parameter Symbol Conditions Unit
Values
min. typ. max.
Dynamic characteristics
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate Char
e Characteristics
Gate to source charge
Gate charge at threshold
Gate to drain charge
Switching charge
3)
C
C
C
t
t
t
t
Q
Q
Q
Q
iss
oss
rss
d(on)
r
d(off)
f
gs
g(th)
gd
sw
=0 V, VDS=-15 V,
V
GS
f =1 MHz
VDD=-15 V, VGS=10 V, I
R
V
I
=-10 A,
D
=6 Ω
G
=-24 V,
DD
=-12.5 A, VGS=0 to -
D
10 V
- 1830 2430 pF
- 569 757
- 460 690
- 9 14 ns
-3349
-3451
-1827
- -4.8 -6.5 nC
- -2.6 -3.5
- -13.6 -20.4
- -15.8 -23.3
Gate charge total
Gate plateau voltage
Output charge
Reverse Diode
Diode continous forward current
Diode pulse current
Diode forward voltage
Reverse recovery time
Reverse recovery charge
Q
V
plateau
Q
I
S
I
S,pulse
V
SD
t
rr
Q
g
oss
rr
VDD=-15 V, VGS=0 V
=25 °C
T
C
VGS=0 V, IF=-12.5 A,
T
=25 °C
j
VR=15 V, IF=|IS|,
di
/dt =100 A/µs
F
- -36.4 -48.5
- -2.6 - V
- 10.2 13.5
- - -12.5 A
- - -50
- -0.9 -1.2 V
-22-ns
-11-nC
Rev. 1.1 page 3 2008-07-10
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