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DB-T6
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IEI Integration DB-T6 User Manual

Type 6 Carrier Board Design Guide
’s Carrier Board Design Guide
COM Express Type 6 Module Carrier Board Design Guide
User Manual
Rev. 1.01 – 1 August, 2013
Page I
Revision
Date Version Changes
1 August, 2013 1.01 Modified Section 4.5: AT Power Deli very Gui deline
15 March, 2013 1.00 Initial release
Page II
Type 6 Carrier Board Design Guide
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
Copyright
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.
Page III
Table of Contents
1 INTRODUCTION.......................................................................................................... 1
1.1 INTRODUCTION........................................................................................................... 2
1.2 ICE-QM770 COM EXPRESS MODULE....................................................................... 2
1.2.1 ICE-QM770 Specifications................................................................................ 3
1.3 ICE-CV-D25501/N26001 COM EXPRESS MODULE.................................................. 4
1.3.1 ICE-CV-D25501/N26001 Specifications ........................................................... 5
1.4 ICE-DB-T6 REFERENCE CARRIER BOARD................................................................. 7
1.4.1 ICE-DB-T6 Specifications ................................................................................. 7
2 PIN ASSIGNMENTS................................................................................................... 10
2.1 CHAPTER OVERVIEW.................................................................................................11
2.2 COM EXPRESS CONNECTOR TYPE........................................................................... 12
2.3 SIGNAL TABLE TERMINOLOGY................................................................................. 13
2.4 CONNECTOR PINOUT ROW A AND ROW B................................................................. 14
2.5 CONNECTOR PINOUT ROWS C AND D....................................................................... 16
3 SIGNAL DESCRIPTION AND ROUTING GUIDELINE ...................................... 19
3.1 PEG (PCI EXPRESS GRAPHIC) ................................................................................. 20
3.1.1 Signal Description ........................................................................................... 20
3.1.2 PEG Connector................................................................................................ 22
3.1.3 PEG_ENABLE#............................................................................................... 23
3.1.4 PCI Express Test Points and Probing ............................................................. 23
3.1.5 PCI Express Routing Guideline....................................................................... 24
3.1.5.1 Impedance Consideration.......................................................................... 24
3.1.5.2 AC Coupling Capacitors...........................................................................25
3.1.5.3 Routing Notices ........................................................................................ 26
3.2 PCI EXPRESS............................................................................................................ 27
3.2.1 Signal Description ........................................................................................... 28
3.2.2 PCI Express x1 Slot ......................................................................................... 29
3.2.3 PCIe Mini Card................................................................................................ 29
3.2.4 PCI Express Clock Buffer................................................................................ 32
Page IV
Type 6 Carrier Board Design Guide
3.3 SATA (SERIAL ATA INTERFACE)............................................................................ 33
3.3.1 Signal Description ........................................................................................... 33
3.3.2 SATA Connector............................................................................................... 34
3.3.3 SATA LED#...................................................................................................... 34
3.3.4 SATA Routing Guideline..................................................................................35
3.4 UNIVERSAL SERIAL BUS (USB)............................................................................... 36
3.4.1 Signal Description ........................................................................................... 36
3.4.2 USB Keyed Connector Protocol ...................................................................... 37
3.4.3 ESD/EMI.......................................................................................................... 39
3.4.4 Over Current Protection.................................................................................. 40
3.4.5 Reference Schematics....................................................................................... 40
3.4.6 USB Routing Guideline.................................................................................... 42
3.4.6.1 Impedance................................................................................................. 42
3.4.6.2 General Routing and Placement................................................................ 42
3.5 DDI.......................................................................................................................... 43
3.5.1 Signal Description ........................................................................................... 43
3.5.2 DDI Pins and Video Interfaces ........................................................................ 45
3.5.2.1 DDI Signal Description: SDVO................................................................ 46
3.5.2.2 DDI Signal Description: DisplayPort ....................................................... 46
3.5.2.3 DDI Signal Description: HDMI/DVI........................................................ 47
3.6 LVDS....................................................................................................................... 47
3.6.1 Signal Description ........................................................................................... 47
3.6.2 LVDS Cable Consideration.............................................................................. 48
3.6.3 Backlight and LCD Power Timing Control...................................................... 48
3.6.4 LVDS Routing Guideline.................................................................................. 50
3.6.4.1 Impedance................................................................................................. 50
3.6.4.2 Implement................................................................................................. 51
3.7 AUDIO CODEC INTERFACE (AC’97/HDA)................................................................ 51
3.7.1 Signal Description........................................................................................... 51
3.8 REFERENCE CIRCUIT................................................................................................ 52
3.8.1 Audio Routing Guideline.................................................................................. 52
3.8.1.1 Analog Power Delivery............................................................................. 52
3.8.1.2 Digital and Analog Signals Isolation........................................................ 53
3.8.1.3 EMI Consideration.................................................................................... 53
3.9 LAN (LOCAL AREA NETWORK)............................................................................... 53
Page V
3.9.1 Signal Description ........................................................................................... 53
3.9.2 Giga LAN Connector ....................................................................................... 54
3.9.3 LAN Link Activity and Speed LED................................................................... 55
3.9.4 LAN Routing Guideline.................................................................................... 55
3.9.4.1 Impedance................................................................................................. 55
3.9.4.2 LAN Ground Plane Separation................................................................. 56
3.10 LPC (LOW PIN COUNT INTERFACE)....................................................................... 56
3.10.1 Signal Description ......................................................................................... 56
3.10.2 LPC Super IO for Legacy IO Support............................................................ 57
3.10.2.1 Keyboard/Mouse..................................................................................... 58
3.10.2.2 RS-232 .................................................................................................... 59
3.11 VGA...................................................................................................................... 59
3.11.1 Signal Description.......................................................................................... 60
3.11.2 VGA Connector.............................................................................................. 60
3.11.3 VGA DAC Filter............................................................................................. 60
3.11.4 Routing Guide Line........................................................................................ 61
3.11.4.1 HSYNC and VSYNC Signals................................................................. 61
3.11.4.2 ESD......................................................................................................... 61
3.11.4.3 DDC Interface......................................................................................... 61
3.11.5 VGA Reference Design .................................................................................. 61
3.12 MISCELLANEOUS.................................................................................................... 62
3.12.1 Signal Description ......................................................................................... 62
3.12.2 Speaker/FAN Control/RTC Reference............................................................ 64
3.12.2.1 Speaker Out............................................................................................. 64
3.12.2.2 RTC......................................................................................................... 64
3.12.2.3 Fan Control ............................................................................................. 65
4 PCB STACK AND POWER DELIVER DESIGN................................................. 66
4.1 CHAPTER OVERVIEW................................................................................................ 67
4.2 MICROSTRIP OR STRIPLINE....................................................................................... 67
4.3 PCB STACKUP EXAMPLE ......................................................................................... 67
4.3.1 Four-Layer Stack-up........................................................................................ 68
4.3.2 Six-Layer Stack-up........................................................................................... 68
4.4 ATX POWER DELIVERY GUIDELINES........................................................................ 70
4.4.1 ATX Power States (S0, S3, S4, S5, G3)............................................................ 71
Page VI
Type 6 Carrier Board Design Guide
4.4.2 ATX Power Diagram........................................................................................ 72
4.5 AT POWER DELIVERY GUIDELINE ........................................................................... 72
5 MECHANICAL DESIGN GUIDELINES................................................................. 73
5.1 CHAPTER OVERVIEW................................................................................................ 74
5.2 COM MODULE AND CARRIER BOARD CONNECTOR................................................. 74
5.2.1 Module Connector ........................................................................................... 74
5.2.2 Carrier Board Connector ................................................................................ 75
5.3 CONNECTOR FOOTPRINT .......................................................................................... 76
5.4 COM EXPRESS FORM FACTORS ............................................................................... 77
5.5 HEAT SPREAD........................................................................................................... 78
5.6 DESIGN NOTES......................................................................................................... 81
5.6.1 Component Height — Module Back and Carrier Board Top........................... 81
5.6.2 Air Follow Issue............................................................................................... 82
5.6.3 Grounding Issue............................................................................................... 82
5.7 OTHERS KITS SPECIFICATION ................................................................................... 83
5.7.1 Cooling Kit....................................................................................................... 83
A TERMINOLOGY........................................................................................................ 84
B APPLICA TION NOTES............................................................................................. 87
B.1 TERMINOLOGY ........................................................................................................ 88
B.2 UPDATING BIOS VERSION....................................................................................... 88
B.2.1 Using AFUWIN................................................................................................ 89
B.2.2 Using DOS Command ..................................................................................... 92
B.3 RTC OVERVIEW....................................................................................................... 94
B.3.1 How to Calculate the Battery Life................................................................... 94
C REFERENCE DOCUMENTS...................................................................................95
D REFERENCE CARRIER BOARD SCHEMATIC.................................................. 97
Page VII
List of Figures
Figure 1-1: ICE-QM770 ...................................................................................................................2
Figure 1-2: ICE-CV-D25501/N26001...............................................................................................4
Figure 1-3: ICE-DB-T6 ....................................................................................................................7
Figure 2-1: COM Express Type 6 Module Diagram...................................................................11
Figure 3-1: PCI Express x16 Slot Example ................................................................................22
Figure 3-2: Intel Recommend Test Structure for PCI Express Data Eye Measurement........24
Figure 3-3: PEG Lane Connection Topology Example.............................................................26
Figure 3-4: PEG Layout Trace Example .....................................................................................27
Figure 3-5: PCI Express x1 Slot Example ..................................................................................29
Figure 3-6: Express Card Slot Example .....................................................................................30
Figure 3-7: Mini Card Bottom Side Dimensions (Refer to www.pcisig.com)..........................31
Figure 3-8: Mini Card Top Side Dimensions (Refer to www.pcisig.com)................................32
Figure 3-9: Mini Card Connector (Refer to www.pcisig.com) ..................................................32
Figure 3-10: PCI Express Clock Buffer Example.......................................................................33
Figure 3-11: SATA 7-pin Connector Example............................................................................34
Figure 3-12: SATA LED Connection Example ...........................................................................35
Figure 3-13: Keyed Connector Protocol (Refer to USB2.0 Spec.)...........................................38
Figure 3-14: USB Connector........................................................................................................38
Figure 3-15: RailClamp SRV05-4 Low Capacitance TVS Diode Array for ESD ......................39
Figure 3-16: 90 ohm Common Mode Choke at 100MHz for EMI ..............................................39
Figure 3-17: MIC2026 Block Diagram (Please refer the datasheet from MICREL )................40
Figure 3-18: USB Reference Design...........................................................................................41
Figure 3-19: LVDS Power Control...............................................................................................49
Figure 3-20: Backlight Control Circuit........................................................................................49
Figure 3-21: LCD Power Sequence Example (Refer to AUO G150XG01)................................50
Figure 3-22: Audio Analog Power Example...............................................................................52
Figure 3-23: GbE LAN Connection Example (including Transformer)....................................54
Figure 3-24: Windbond W83627DHG Reference Design...........................................................58
Figure 3-25: Keyboard/Mouse Reference Schematic................................................................59
Figure 3-26: RS-232 Reference Schematic ................................................................................59
Page VIII
Type 6 Carrier Board Design Guide
Figure 3-27: VGA Connector D-SUB15.......................................................................................60
Figure 3-28: VGA Reference Design...........................................................................................62
Figure 3-29: Speaker Out Reference Schematic .......................................................................64
Figure 3-30: RTC Reference Schematic .....................................................................................64
Figure 3-31: Fan Reference Schematic ......................................................................................65
Figure 4-1: Four-Layer Stack.......................................................................................................68
Figure 4-2: Six-Layer Stack .........................................................................................................69
Figure 4-3: ATX Power Delivery Block Diagram........................................................................72
Figure 4-5: AT Power Delivery Block Diagram..........................................................................72
Figure 5-1: Module Connector Picture .......................................................................................75
Figure 5-2: Carrier Board Connector..........................................................................................75
Figure 5-3: Single Connector Physical Dimensions.................................................................76
Figure 5-4: Dual Connector Footprint and Alignment ..............................................................76
Figure 5-5: Compact, Basic and Extended Form Factor ..........................................................78
Figure 5-6: Overall Height for Heatspreader in Basic and Extended Modules ......................79
Figure 5-7: Basic Module Heatspreader.....................................................................................79
Figure 5-8: Basic Module Heatspreader Footprint....................................................................80
Figure 5-9: IEI Heat Spread Module............................................................................................81
Figure 5-10: Component Clearances Underneath Module.......................................................82
Figure 5-11: IEI Heat Sink Module Dimensions.........................................................................83
Figure 5-12: IEI Heat Sink Module Picture .................................................................................83
Figure B-1: BIOS Main Menu (BIOS Version: MR10).................................................................89
Figure B-2: AFUWIN – Open BIOS File.......................................................................................89
Figure B-3: Locate BIOS File.......................................................................................................90
Figure B-4: Check Program All Block.........................................................................................90
Figure B-5: AFUWIN – Flash........................................................................................................91
Figure B-6: BIOS Main Menu – Updated BIOS Version (MR11) ...............................................91
Figure B-7: USB Flash Drive and BIOS Updating Files ............................................................92
Figure B-8: BIOS Updating File Directory..................................................................................92
Figure B-9: GO Command ...........................................................................................................93
Figure B-10: BIOS Update Complete (DOS)...............................................................................93
Figure B-11: BIOS Main Menu – Updated BIOS Version (MR11) .............................................94
Page IX
List of Tables
Table 1-1: ICE-QM770 Specifications ...........................................................................................4
Table 1-2: ICE-CV-D25501/N26001 Specifications.......................................................................6
Table 1-3: ICE-DB-T6 Specifications.............................................................................................9
Table 2-1: COM Express Connector Type Variations ...............................................................12
Table 2-2: Conventions and Terminology..................................................................................13
Table 3-1: PCI Express Signal Descriptions..............................................................................21
Table 3-2: PCI Express Impedance Consideration....................................................................24
Table 3-3: PCI Express Signal Descriptions..............................................................................28
Table 3-4: Mini Card Pin-out........................................................................................................31
Table 3-5: Serial ATA Signal Descriptions.................................................................................34
Table 3-6: SATA Impedance Consideration...............................................................................35
Table 3-7: USB Signal Description..............................................................................................37
Table 3-8: USB Connector Signal Description ..........................................................................39
Table 3-9: DDI Signal Descriptions.............................................................................................44
Table 3-10: DDI Pins and Video Interfaces Mapping.................................................................46
Table 3-11: DDI Signal Descriptions - SDVO .............................................................................46
Table 3-12: DDI Signal Descriptions - DisplayPort....................................................................46
Table 3-13: DDI Signal Descriptions – HDMI/DVI.......................................................................47
Table 3-14: LVDS Signals Description........................................................................................48
Table 3-15: LVDS Impedance Consideration.............................................................................51
Table 3-16: Audio Signals Description.......................................................................................52
Table 3-17: Ethernet Signals Description ..................................................................................54
Table 3-18: LAN Impedance Consideration ...............................................................................55
Table 3-19: LPC Interface Signal Descriptions..........................................................................57
Table 3-20: VGA Signals Description .........................................................................................60
Table 3-21: Miscellaneous Pin Assignment...............................................................................63
Table 4-1: Signal Tables Terminology Descriptions.................................................................71
Table 4-2: Power State Behavior.................................................................................................71
Page X
Type 6 Carrier Board Design Guide
Chapter
1

1 Introduction

Page 1

1.1 Introduction

This design guide describes the design concept of the COM Express Type 6 module and
teaches customers how to develop their own COM Express carrier board. The IEI COM
Express Type 6 module is compatible with all baseboards compliant with COM Express
specification.

1.2 ICE-QM770 COM Express Module

Figure 1-1: ICE-QM770
The ICE-QM770 COM Express module provides the main processing chips and is
connected to a compatible COM Express baseboard. The ICE-QM770 is equipped with
the Intel® QM77 Express Chipset and Socket G2 that supports 2nd and 3rd generation
Intel® Core™ i7/i5/i3, Pentium® and Celeron® processors. The COM Express standard
allows the COM Express baseboard to be designed, while leaving the choice of processor
till the later stages of design. The ICE-QM770 provides a low power option with the full
range of modern I/O options. The ICE-QM770 embedded module is designed for flexible
integration by system developers into customized platform devices.
Page 2
Type 6 Carrier Board Design Guide

1.2.1 ICE-QM770 Specifications

The ICE-QM770 technical specifications are listed below.
Specifications/Model ICE-QM770
PICMG COM Express R2.0 Type 6 for basic size
Form Factor
(95 mm x 125 mm)
CPU Socket
CPU Supported
Express Chipset
Memory
Graphics Engine
Ethernet
BIOS Embedded Controller
Socket G2
2nd and 3rd generation Intel® Core™ i7/i5/i3, Pentium® and
Celeron® processors
Intel® QM77
Two 204-pin 1600/1333/1066 MHz dual-channel
DDR3/DDR3L (1.35V) SO-DIMMs supported
(system max. 16 GB)
Intel® HD Graphics 2000/3000
Supports DirectX 11 OCL 1.1 and OpenGL 3.0
Full MPEG2, VC-1 and AVC decoding
Intel® 82579LM
Supports Intel® AMT 8.0
UEFI BIOS
iWDD
Watchdog Timer
Display (Signal to Baseboard)
Expansions (Signal to Baseboard)
Software programmable supports 1~255 sec. system reset
One VGA (up to 2048 x 1536 @ 75Hz) is integrated in the
Intel® QM77
One 18-/24-bit dual-channel LVDS (up to 1920 x 1200 @
60Hz)
Three DDI (up to 2560 x 1600 @ 60Hz)
One PCIe x16
Seven PCIe x1
Page 3
Specifications/Model ICE-QM770
I/O Interfaces (Signal to Baseboard)
Power Consumption
Operating Temperature
Storage Temperature Humidity (Operating) Dimensions Weight (GW/NW)
Four USB 3.0
Eight USB 2.0
Two SATA 6Gb/s
Two SATA 3Gb/s
Two RS-232
HD Audio
+12V @ 1.75 A , Vcore_12V @ 3.33A (2.30 GHz Intel®
Core™ i7-3610QE CPU with two 8 GB 1600 MHz DDR3
SO-DIMMs)
-10ºC ~ 60ºC
-20ºC ~ 70ºC
5% ~ 95% (non-condensing)
125 mm x 95 mm
700 g/250 g
8-bit GPIO
SMBus
I2C
LPC
TPM
SPI
Table 1-1: ICE-QM770 Specifications

1.3 ICE-CV-D25501/N26001 COM Express Module

Figure 1-2: ICE-CV-D25501/N26001
Page 4
Type 6 Carrier Board Design Guide
The ICE-CV-D25501/N26001 COM Express module provides the main processing chips
and is connected to a compatible COM Express baseboard. The ICE-CV-D25501/N26001
is equipped with an Intel® Atom™ D2550/N2600 CPU and Intel® NM10 PCH. The COM
Express standard allows the COM Express baseboard to be designed, while leaving the
choice of processor till the later stages of design. The ICE-CV-D25501/N26001 provides a
low power option with the full range of modern I/O options. The ICE-CV-D25501/N26001
embedded module is designed for flexible integration by system developers into
customized platform devices.

1.3.1 ICE-CV -D25501/N26001 Specifications

The ICE-CV-D25501/N26001 technical specifications are listed below.
Specifications/Model ICE-CV-D25501/N26001
Form Factor
CPU
Chipset
Memory
Graphics Engine
Display (Signal to Baseboard)
PICMG COM Express R2.0 Type 6 for compact size (95 mm x 95 mm)
10 layers
1.86 GHz Intel® Atom™ D2550 dual-core CPU (2 x 512KB L2 cache)
1.6 GHz Intel® Atom™ N2600 dual-core CPU (2 x 512KB L2 cache)
Intel® NM10
D2550: One 1066 MHz DDR3/DDR3L (1.35V) SO-DIMM support (up to
4 GB)
N2600: One 800 MHz DDR3/DDR3L (1.35V) SO-DIMM support (up to
2 GB)
D2550: Intel® GMA 3650 with 640 MHz graphics core speed
N2600: Intel® GMA 3600 with 400 MHz graphics core speed
Supports DirectX 9 and Blu-ray 2.0
MPEG2, H.264, VC-1 and 1080p decoding
One VGA (up to 2048 x 1536 @ 75Hz) is integrated in the CPU
One LVDS is integrated in the CPU:
D2550: 24-bit single-channel LVDS (up to 1440 x 900 @ 60Hz)
N2600: 18-bit single-channel LVDS (up to 1366 x 768 @ 60Hz)
Ethernet
Two DDI (up to 2560 x 1600 @ 60Hz)
Realtek RTL8111E PCIe GbE controller
Page 5
Specifications/Model ICE-CV-D25501/N26001
BIOS USB 3.0 Embedded Controller Watchdog Timer Expansion
I/O Interfaces (Signal to Baseboard)
UEFI BIOS
ASMedia ASM1042
iWDD
Software programmable supports 1~255 sec. system reset
Four PCIe x1 (signal to baseboard)
Two USB 3.0
Eight USB 2.0
Two SATA 3Gb/s
Two UART (by EC)
HD Audio
GPIO
SMBus
I2C
LPC
SPI
Power Consumption
Operating Temperature
Storage Temperature Humidity (Operating) Dimensions Weight (GW/NW) Table 1-2: ICE-CV-D25501/N26001 Specifications
+12V @ 0.45 A , Vcore_12V @ 1.0A (1.86 GHz Intel® Atom™ D2550
CPU with 2 GB 1066 MHz DDR3 SO-DIMM)
-10ºC ~ 60ºC
-20ºC ~ 70ºC
5% ~ 95% (non-condensing)
95 mm x 95 mm
600 g/200 g
Page 6
Type 6 Carrier Board Design Guide

1.4 ICE-DB-T6 Reference Carrier Board

The ICE-DB-T6 is a full function carrier board for customers to apply or test the COM
Express Type 6 module. The carrier board can be used for any combination, including
software and hardware. Using the carrier board to develop and test the Type 6 module
also can achieve a quicker time to market. The ICE-DB-T6 is shown in
specifications are listed in
Table 1-3.
Figure 1-3 and the
Figure 1-3: ICE-DB-T6

1.4.1 ICE-DB-T6 Specifications

The ICE-DB-T6 technical specifications are listed below.
Specifications/Model ICE-DB-T6 Reference Carrier Board Form Factor
CPU
Super I/O
ATX form factor baseboard
Support COM Express compact/basic module using Type 6
connector
Winbond W83627DHG
Page 7
Specifications/Model ICE-DB-T6 Reference Carrier Board
Audio
GPIO Watchdog Timer
Display
Expansions (Signal to Baseboard)
SMBus I2C
Front Panel
Realtek ALC892 HD Audio codec
8-bit GPIO (GPIO from iWDD co-lay SDIO)
Software programmable supports1~255 sec. system reset
1 x 18/24-bit single/dual-channel LVDS
1 x VGA
3 x DisplayPort (two by external connector, one by pin header)
One PCIe x16
Five PCIe x1
Two PCIe Mini (with USB)
One LPC
One 4-pin wafer
One 4-pin wafer
One connector supports power LED, HDD LED, power button,
reset button, speaker/buzzer
TPM
Fan Connector
SD
Other Internal I/O
One 20-pin header
One 4-pin and one 3-pin CPU module fan connectors
One 3-pin system fan connector by SIO
One SD slot
4 x SATA 3Gb/s port
2 x RS-232 from COM Express (only TX, RX and GND)
2 x RS-232 from SIO
2 x USB 2.0
1 x Audio connector
Page 8
Type 6 Carrier Board Design Guide
Specifications/Model ICE-DB-T6 Reference Carrier Board
1 x VGA
4 x USB 3.0
1 x RJ-45 GbE
External I/O
Power Supply Operating
Temperature Storage Temperature Humidity (Operating) Dimensions Table 1-3: ICE-DB-T6 Specifications
2 x DisplayPort
3 x Audio jacks (Line-in, Line-out, Mic)
1 x PS/2 keyboard
1 x PS/2 mouse
ATX/AT p o w e r s upply
-10ºC ~ 60ºC
-20ºC ~ 70ºC
5% ~ 95% (non-condensing)
304.8 mm x 243.8 mm (12” x 9.6”)
Page 9
Chapter
2

2 Pin Assignments

Page 10
Type 6 Carrier Board Design Guide

2.1 Chapter Overview

This chapter describes pin assignments and I/O characteristics for COM Express modules.
The carrier board uses two 220-pin 0.5 mm fine pitch board-to-board connectors. There
are seven different pin-out types currently defined by the COM Express Specification. The
preferred choice of the embedded computer industry is the Type 2 pin-out and the latest
pin-outs added in COM Express specification are Type 6 and Type 10. This design guide
focuses on the latest Type 6 pin-out which provides the latest technologies including PCI
Express, Serial ATA and DDI graphics.
Figure 2-1: COM Express Type 6 Module Diagram
Page 11

2.2 COM Express Connector Type

The differences among the Module Types are summarized in Table 2-1.
Module Type 1 and 10 supports a single connector with two rows of pins
(220 pins total).
Module Types 2-6 support two connectors with four rows of pins
(440 pins total).
Type Rows PCIe
Lanes
1 AB Up to 6 - - - 4 1 8 / 0 VGA, LVDS 2 AB, CD Up to 22 1/2 32-bit 1 4 1 8 / 0 VGA, LVDS,
3 AB, CD Up to 22 1/2 32-bit - 4 3 8 / 0 VGA, LVDS,
4 AB, CD Up to 32 1/2 - 1 4 1 8 / 0 VGA, LVDS,
5 AB, CD Up to 32 1/2 - - 4 3 8 / 0 VGA, LVDS,
6 AB, CD Up to 24 1/NA - - 4 1 8 / 4 VGA, LVDS,
10 AB Up to 4 -/1 - - 2 1 8 / 0 1 x DDI
PEG/ SDVO
PCI IDE SATA LAN USB
2.0/3.0
Table 2-1: COM Express Connector Type Variations
Display
PEG/SDVO
PEG/SDVO
PEG/SDVO
PEG/SDVO
PEG, 3 x DDI
Page 12
Type 6 Carrier Board Design Guide

2.3 Signal Table Terminology

The following section describes the signals found on the Type 6 connectors. Table 2-2
below describes the terminology used in this section for the Signal Description tables. The
“#” symbol at the end of the signal name indicates that the active or asserted state occurs
when the signal is at a low voltage level. When “#” is not present, the signal is asserted
when at a high voltage level.
Term Description
I/O Bi-directional signal
I Input signal
O Output signal
I/F Interface
GND Ground
PWR Power
OD Open drain output
PD Pull down
PU Pull up
+V12 +12V ±5% Volts Normal Power
+V5SB +5V ±5% Standby Power
+3.3VSB +3.3V ±5% Standby Power
+V3.3 +3.3V ±5% Volts Normal Power
+V5 +5V ±5% Volts Normal Power
# Active-Low Signals
‘+’ and ‘-‘ Differential Pairs
PM Power Management
GBE Gigabit Ethernet
Table 2-2: Conventions and Terminology
Page 13

2.4 Connector Pinout Row A and Row B

Pin Signal I/F I/O Pin Signal I/F I/O A1 GND0 GND - B1 GND15 GND - A2 GBE0_MDI3- GBE I/O B2 GBE0_ACT# GBE O 3.3V A3 GBE0_MDI3+ GBE I/O B3 LPC_FRAME# LPC O 3.3V A4 GBE0_LINK100# GBE O 3.3V B4 LPC_AD0 LPC I/O 3.3V A5 GBE0_LINK1000# GBE O 3.3V B5 LPC_AD1 LPC I/O 3.3V A6 GBE0_MDI2- GBE I/O B6 LPC_AD2 LPC I/O 3.3V A7 GBE0_MDI2+ GBE I/O B7 LPC_AD3 LPC I/O 3.3V A8 GBE0_LINK# GBE O 3.3V B8 LPC_DRQ0# LPC I 3.3V A9 GBE0_MDI1- GBE I/O B9 LPC_DRQ1# LPC I 3.3V A10 GBE0_MDI1+ GBE I/O B10 LPC_CLK LPC O 3.3V A11 GND1 GND - B11 GND16 GND - A12 GBE0_MDI0- GBE I/O B12 PWRBTN# PM I A13 GBE0_MDI0+ GBE I/O B13 SMB_CK SMB - A14 GBE0_CTREF GBE B14 SMB_DAT SMB - A15 SUS_S3# PM O B15 SMB_ALERT# SMB I A16 SATA0_TX+ SATA O B16 SATA1_TX+ SATA O A17 SATA0_TX- SATA O B17 SATA1_TX- SATA O A18 SUS_S4# PM O B18 SUS_STAT# PM O A19 SATA0_RX+ SATA I B19 SATA1_RX+ SATA I A20 SATA0_RX- SATA I B20 SATA1_RX- SATA I A21 GND2 GND - B21 GND17 GND - A22 SATA2_TX+ SATA O B22 SATA3_TX+ SATA O A23 SATA2_TX- SATA O B23 SATA3_TX- SATA O A24 SUS_S5# PM O B24 PWR_OK PM I A25 SATA2_RX+ SATA I B25 SATA3_RX+ SATA I A26 SATA2_RX- SATA I B26 SATA3_RX- SATA I A27 BATLOW# PM I B27 WDT - - A28 ATA_ACT# SATA O 3.3V B28 AC/HD_SDIN2 HDA I 3.3V A29 AC/HD _SYNC HDA O 3.3V B29 AC/HD_SDIN1 HDA I 3.3V A30 AC/HD _RST# HDA O 3.3V B30 AC/HD_SDIN0 HDA I 3.3V A31 GND3 GND - B31 GND18 GND - A32 AC/HD_BITCLK HDA O 3.3V B32 SPKR - - A33 AC/HD_SDOUT HDA O 3.3V B33 I2C_CK I2C - A34 BIOS_DISABLE# - - B34 I2C_DAT I2C - A35 THRMTRIP# PM O B35 THRM# PM I A36 USB6- USB I/O B36 USB7- USB I/O A37 USB6+ USB I/O B37 USB7+ USB I/O A38 USB_6_7_OC# USB I 3.3V B38 USB_4_5_OC# USB I 3.3V A39 USB4- USB I/O B39 USB5- USB I/O A40 USB4+ USB I/O B40 USB5+ USB I/O A41 GND4 GND - B41 GND19 GND - A42 USB2- USB I/O B42 USB3- USB I/O A43 USB2+ USB I/O B43 USB3+ USB I/O A44 USB_2_3_OC# USB I 3.3V B44 USB_0_1_OC# USB I 3.3V A45 USB0- USB I/O B45 USB1- USB I/O
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Type 6 Carrier Board Design Guide
Pin Signal I/F I/O Pin Signal I/F I/O A46 USB0+ USB I/O B46 USB1+ USB I/O A47 VCC_RTC PWR -- B47 EXCD1_PERST# PCIE - A48 EXCD0_PERST# PCIE - B48 EXCD1_CPPE# PCIE - A49 EXCD0_CPPE# PCIE - B49 SYS_RESET# PM I A50 LPC_SERIRQ LPC I/O
3.3V
A51 GND5 GND - B51 GND20 GND - A52 PCIE_TX5+ PCIE O B52 PCIE_RX5+ PCIE I A53 PCIE_TX5- PCIE O B53 PCIE_RX5- PCIE I A54 GPI0 GPIO I B54 GPO1 GPIO O A55 PCIE_TX4+ PCIE O B55 PCIE_RX4+ PCIE I A56 PCIE_TX4- PCIE O B56 PCIE_RX4- PCIE I A57 GND6 GND - B57 GPO2 GPIO O A58 PCIE_TX3+ PCIE O B58 PCIE_RX3+ PCIE I A59 PCIE_TX3- PCIE O B59 PCIE_RX3- PCIE I A60 GND7 GND - B60 GND21 GND - A61 PCIE_TX2+ PCIE O B61 PCIE_RX2+ PCIE I A62 PCIE_TX2- PCIE O B62 PCIE_RX2- PCIE I A63 GPI1 GPIO I B63 GPO3 GPIO O A64 PCIE_TX1+ PCIE O B64 PCIE_RX1+ PCIE I A65 PCIE_TX1- PCIE O B65 PCIE_RX1- PCIE I A66 GND8 GND - B66 WAKE0# PCIE I A67 GPI2 GPIO I B67 WAKE1# PM I A68 PCIE_TX0+ PCIE O B68 PCIE_RX0+ PCIE I A69 PCIE_TX0- PCIE O B69 PCIE_RX0- PCIE I A70 GND9 GND - B70 GND22 GND - A71 LVD S_A0+ LVD S O B71 LVDS_B0+ LVDS O A72 LVD S_A0- LVDS O B72 LVDS_B0 - LV D S O A73 LVD S_A1+ LVD S O B73 LVDS_B1+ LVDS O A74 LVD S_A1- LVDS O B74 LVDS_B1 - LV D S O A75 LVD S_A2+ LVD S O B75 LVDS_B2+ LVDS O A76 LVD S_A2- LVDS O B76 LVDS_B2 - LV D S O A77 LVDS_VDD_EN LVDS O 3.3V B77 LVDS_B3+ LVDS O A78 LVD S_A3+ LVD S O B78 LVDS_B3- LVDS O A79 LVD S_A3- LVDS O B79 LVDS_BKLT_EN LVDS O 3.3V A80 GND GND - B80 GND GND - A81 LVD S_A_CK+ LVDS O B81 LV D S _ B _ C K+ LVDS O A82 LVD S_A_CK- LVDS O B82 LVDS_B_ C K - LV D S O A83 LVDS_I2C_CK LVDS O 3.3V B83 LVDS_BKLT_CTRL LVDS O 3.3V A84 LVDS_I2C_DAT LVDS IO 3.3V B84 VCC5SBY1 PWR - A85 GPI3 GPIO I B85 VCC5SBY2 PWR - A86 RSVD - - B86 VCC5SBY3 PWR - A87 RSVD - - B87 VCC5SBY4 PWR - A88 PCIE0_CK_REF+ PCIE O B88 BIOS_DIS1# - I 3.3V A89 PCIE0_CK_REF- PCIE O B89 VGA_RED VGA O A90 GND11 GND - B90 GND 24 GND - A91 SPI_VCC SPI O 3.3V B91 VGA_GRN VGA O A92 SPI_MISO SPI IO 3.3V B92 VGA_BLU VGA O
B50 CB_RESET# PM O
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Pin Signal I/F I/O Pin Signal I/F I/O A93 GPO0 GPIO O B93 VGA_HSYNC VGA O A94 SPI_CLK SPI O B94 VGA_VSYNC VGA O A95 SPI_MOSI SPI IO B95 VGA_I2C_CK VGA I/O A96 PP_TPM TPM I B96 VGA_I2C_DAT VGA I/O A97 RSVD - - B97 SPI_CS# SPI O A98 RS1_TX UART O B98 RSVD - - A99 RS1_RX UART I B99 RSVD - - A100 GND13 GND - B100 GND25 GND - A101 RS2_TX UART O B101 FAN_PWMOUT FAN O A102 RS2_RX UART I B102 FAN_TACHIN FAN I A103 LID# - I B103 SLEEP# - I A104 VCC_12V7 PWR - B104 VCC_12V16 PWR - A105 VCC_12V8 PWR - B105 VCC_12V17 PWR - A106 VCC_12V9 PWR - B106 VCC_12V18 PWR - A107 VCC_12V10 PWR - B107 VCC_12V19 PWR - A108 VCC_12V11 PWR - B108 VCC_12V20 PWR - A109 VCC_12V12 PWR - B109 VCC_12V21 PWR - A110 GND14 GND - B110 GND26 GND -

2.5 Connector Pinout Rows C and D

Pin Signal I/F I/O Pin Signal I/F I/O C1 GND0 GND - D1 GND15 GND - C2 GND GND - D2 GND GND - C3 USB_SSRX0- USB 3.0 I D3 USB_SSTX0- USB 3.0 O C4 USB_SSRX0+ USB 3.0 I D4 USB_SSTX0+ USB 3.0 O C5 GND GND - D5 GND GND - C6 USB_SSRX1- USB 3.0 I D6 USB_SSTX1- USB 3.0 O C7 USB_SSRX1+ USB 3.0 I D7 USB_SSTX1+ USB 3.0 O C8 GND GND - D8 GND GND - C9 USB_SSRX2- USB 3.0 I D9 USB_SSTX2- USB 3.0 O C10 USB_SSRX2+ USB 3.0 I D10 USB_SSTX2+ USB 3.0 O C11 GND1 GND - D11 GND16 GND - C12 USB_SSRX3- USB 3.0 I D12 USB_SSTX3- USB 3.0 O C13 USB_SSRX3+ USB 3.0 I D13 USB_SSTX3+ USB 3.0 O C14 GND GND - D14 GND GND - C15 DDI1_PAIR6+ DDI O D15 DDI1_AUX+ DDI O C16 DDI1_PAIR6- DDI O D16 DDI1_AUX- DDI O C17 RSVD - - D17 RSVD - - C18 RSVD - - D18 RSVD - - C19 PCIE_RX6+ PCIE I D19 PCIE_TX6+ PCIE O C20 PCIE_RX6- PCIE I D20 PCIE_TX6- PCIE O C21 GND2 GND - D21 GND17 GND - C22 RSVD - - D22 RSVD - - C23 RSVD - - D23 RSVD - - C24 DDI1_HPD DDI I D24 RSVD - - C25 DDI1_PAIR4+ DDI O D25 RSVD - -
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Type 6 Carrier Board Design Guide
Pin Signal I/F I/O Pin Signal I/F I/O C26 DDI1_PAIR4- DDI O D26 DDI1_PAIR0+ DDI O C27 RSVD - - D27 DDI1_PAIR0- DDI O C28 RSVD - - D28 RSVD - - C29 DDI1_PAIR5+ DDI O D29 DDI1_PAIR1+ DDI O C30 DDI1_PAIR5- DDI O D30 DDI1_PAIR1- DDI O C31 GND3 GND - D31 GND18 GND - C32 DDI2_AUX+ DDI O D32 DDI1_PAIR2+ DDI O C33 DDI2_AUX- DDI O D33 DDI1_PAIR2- DDI O C34 DDI2_CTRLCLK DDI O D34 DDI2_CTRLDATA DDI O C35 RSVD - - D35 RSVD - - C36 DDI3_AUX+ DDI O D36 DDI1_PAIR3+ DDI O C37 DDI3_AUX- DDI O D37 DDI1_PAIR3- DDI O C38 DDI3_CTRLCLK DDI O D38 DDI3_CTRLDATA DDI O C39 DDI3_PAIR0+ DDI O D39 DDI2_PAIR0+ DDI O C40 DDI3_PAIR0- DDI O D40 DDI2_PAIR0- DDI O C41 GND4 GND - D41 GND19 GND - C42 DDI3_PAIR1+ DDI O D42 DDI2_PAIR1+ DDI O C43 DDI3_PAIR1- DDI O D43 DDI2_PAIR1- DDI O C44 DDI3_HPD DDI I D44 DDI2_HPD DDI I C45 RSVD - - D45 RSVD - - C46 DDI3_PAIR2+ DDI O D46 DDI2_PAIR2+ DDI O C47 DDI3_PAIR2- DDI O D47 DDI2_PAIR2- DDI O C48 RSVD - - D48 RSVD - - C49 DDI3_PAIR3+ DDI O D49 DDI2_PAIR3+ DDI O C50 DDI3_PAIR3- DDI O D50 DDI2_PAIR3- DDI O C51 GND5 GND - D51 GND20 GND - C52 PEG_RX0+ PEG I D52 PEG_TX0+ PEG O C53 PEG_RX0- PEG I D53 PEG_TX0- PEG O C54 RSVD - - D54 PEG_LANE_RV# C55 PEG_RX1+ PEG I D55 PEG_TX1+ PEG O C56 PEG_RX1- PEG I D56 PEG_TX1- PEG O C57 RSVD - - D57 TYPE2# C58 PEG_RX2+ PEG I D58 PEG_TX2+ PEG O C59 PEG_RX2- PEG I D59 PEG_TX2- PEG O C60 GND7 GND - D60 GND21 GND - C61 PEG_RX3+ PEG I D61 PEG_TX3+ PEG O C62 PEG_RX3- PEG I D62 PEG_TX3- PEG O C63 RSVD1 - - D63 RSVD9 - - C64 RSVD2 - - D64 RSVD10 - - C65 PEG_RX4+ PEG I D65 PEG_TX4+ PEG O C66 PEG_RX4- PEG I D66 PEG_TX4- PEG O C67 RSVD3 - O D67 GND28 GND - C68 PEG_RX5+ PEG I D68 PEG_TX5+ PEG O C69 PEG_RX5- PEG I D69 PEG_TX5- PEG O C70 GND9 GND - D70 GND22 GND - C71 PEG_RX6+ PEG I D71 PEG_TX6+ PEG O C72 PEG_RX6- PEG I D72 PEG_TX6- PEG O C73 DDI1_CTRLDATA DDI O D73 DDI1_CTRLCLK DDI O
Page 17
Pin Signal I/F I/O Pin Signal I/F I/O C74 PEG_RX7+ PEG I D74 PEG_TX7+ PEG O C75 PEG_RX7- PEG I D75 PEG_TX7- PEG O C76 GND8 GND - D76 GND29 GND - C77 RSVD4 - - D77 RSVD - - C78 PEG_RX8+ PEG I D78 PEG_TX8+ PEG O C79 PEG_RX8- PEG I D79 PEG_TX8- PEG O C80 GND10 GND - D80 GND23 GND - C81 PEG_RX9+ PEG I D81 PEG_TX9+ PEG O C82 PEG_RX9- PEG I D82 PEG_TX9- PEG O C83 RSVD5 - - D83 RSVD8 - - C84 GND6 GND - D84 GND30 GND - C85 PEG_RX10+ PEG I D85 PEG_TX10+ PEG O C86 PEG_RX10- PEG I D86 PEG_TX10- PEG O C87 GND35 GND - D87 GND31 GND - C88 PEG_RX11+ PEG I D88 PEG_TX11+ PEG O C89 PEG_RX11- PEG I D89 PEG_TX11- PEG O C90 GND27 GND - D90 GND24 GND - C91 PEG_RX12+ PEG I D91 PEG_TX12+ PEG O C92 PEG_RX12- PEG I D92 PEG_TX12- PEG O C93 GND11 GND - D93 GND32 GND - C94 PEG_RX13+ PEG I D94 PEG_TX13+ PEG O C95 PEG_RX13- PEG I D95 PEG_TX13- PEG O C96 GND12 GND - D96 GND33 GND - C97 RSVD6 - - D97 PEG_ENABLE# PEG I C98 PEG_RX14+ PEG I D98 PEG_TX14+ PEG O C99 PEG_RX14- PEG I D99 PEG_TX14- PEG O C100 GND13 GND - D100 GND25 GND - C101 PEG_RX15+ PEG I D101 PEG_TX15+ PEG O C102 PEG_RX15- PEG I D102 PEG_TX15- PEG O C103 GND GND - D103 GND34 GND - C104 VCC_12V1 PWR - D104 VCC_12V7 PWR - C105 VCC_12V2 PWR - D105 VCC_12V8 PWR - C106 VCC_12V3 PWR - D106 VCC_12V9 PWR - C107 VCC_12V4 PWR - D107 VCC_12V10 PWR - C108 VCC_12V5 PWR - D108 VCC_12V11 PWR - C109 VCC_12V6 PWR - D109 VCC_12V12 PWR - C110 GND14 GND - D110 GND26 GND -
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Type 6 Carrier Board Design Guide
Chapter
3
3 Signal Description and
Routing Guideline
Page 19

3.1 PEG (PCI Express Graphic)

The PEG Port can utilize COM Express PCIe lanes 16 through 32 to drive a PCIe x16 link
for a PCI Express Graphics card. It supports a theoretical bandwidth of up to 4 GB/s. Each
lane of the PEG Port consists of a receiver and transmit differential signal pair. The
corresponding signals can be found on the Module connector rows C and D.

3.1.1 Signal Description

Pin Signal I/O Description
C52 C53 D52 D53 C55 C56 D55 D56 C58 C59 D58 D59 C61 C62 D61 D62 C65 C66 D65 D66 C68 C69 D68 D69 C71 C72 D71 D72 C74 C75 D74 D75 C78 C79 D78 D79 C81 C82
PEG_RX0+ PEG_RX0­PEG_TX0+ PEG_TX0­PEG_RX1+ PEG_RX1­PEG_TX1+ PEG_TX1­PEG_RX2+ PEG_RX2­PEG_TX2+ PEG_TX2­PEG_RX3+ PEG_RX3­PEG_TX3+ PEG_TX3­PEG_RX4+ PEG_RX4­PEG_TX4+ PEG_TX4­PEG_RX5+ PEG_RX5­PEG_TX5+ PEG_TX5­PEG_RX6+ PEG_RX6­PEG_TX6+ PEG_TX6­PEG_RX7+ PEG_RX7­PEG_TX7+ PEG_TX7­PEG_RX8+ PEG_RX8­PEG_TX8+ PEG_TX8­PEG_RX9+ PEG_RX9-
I PEG Port 0. Receive Input differential pair.
O PEG Port 0. Transmit Output differential pair.
I PEG Port 1. Receive Input differential pair.
O PEG Port 1. Transmit Output differential pair.
I PEG Port 2. Receive Input differential pair.
O PEG Port 2. Transmit Output differential pair.
I PEG Port 3. Receive Input differential pair.
O PEG Port 3. Transmit Output differential pair.
I PEG Port 4. Receive Input differential pair.
O PEG Port 4. Transmit Output differential pair.
I PEG Port 5. Receive Input differential pair.
O PEG Port 5. Transmit Output differential pair.
I PEG Port 6. Receive Input differential pair.
O PEG Port 6. Transmit Output differential pair.
I PEG Port 7. Receive Input differential pair.
O PEG Port 7. Transmit Output differential pair.
I PEG Port 8,. Receive Input differential pair.
O PEG Port 8. Transmit Output differential pair.
I PEG Port 9,. Receive Input differential pair.
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