IEI Integration DB-9S User Manual
ICE Module
ICE Module Carrier Board Design Guide
Page i
Date Version Changes
2008-09 1.00 Initial release
ICE Module
Revision
Page ii
ICE Module
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the
part of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
Copyright
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for
identification purposes only and may be trademarks and/or registered trademarks of
their respective owners.
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ICE Module
Table of Contents
1 INTRODUCTION.....................................................................................................1
1.1 INTRODUCTION .....................................................................................................2
1.2 ACRONYMS AND ABBREVIATIONS DEFINITION .....................................................2
1.3 REFERENCE DOCUMENTS......................................................................................4
2 ICE MODULE OVERVIEW...................................................................................5
2.1 CHAPTER OVERVIEW.............................................................................................6
2.2 ICE SPECIFICATIONS.............................................................................................7
2.2.1 ICE-9152-R10...............................................................................................8
2.2.2 ICE-9102-1GZ-R10.....................................................................................10
2.2.3 ICE-9102-1G512-R10.................................................................................12
2.2.4 ICE-ATOM-R10..........................................................................................14
2.2.5 ICE-GM45A-R10 ........................................................................................16
2.2.6 ICE-DB-9S-R10 ..........................................................................................17
2.3 PERFORMANCE....................................................................................................19
3 PIN ASSIGNMENTS..............................................................................................20
3.1 CHAPTER OVERVIEW...........................................................................................21
3.2 TYPE 1, TYPE 2, TYPE 3, TYPE 4 AND TYPE 5 .....................................................22
3.3 SIGNAL TABLE TERMINOLOGY ...........................................................................23
3.4 CONNECTOR PINOUT ROW A AND ROW B...........................................................24
3.5 CONNECTOR PINOUT ROWS C AND D..................................................................26
4 SIGNAL DESCRIPTION AND ROUTING GUIDELINE.................................29
4.1 PEG (PCI EXPRESS GRAPHIC)............................................................................30
4.1.1 Signal Description ......................................................................................30
4.1.2 PEG Connector...........................................................................................32
4.1.3 SDVO ..........................................................................................................33
4.1.4 PEG_ENABLE#..........................................................................................34
4.1.5 PCI Express Test Points and Probing ........................................................34
4.1.6 PCI Express Routing Guideline..................................................................35
4.1.6.1 Impedance Consideration.....................................................................35
4.1.6.2 AC Coupling Capacitors......................................................................36
4.1.6.3 Routing Notices ...................................................................................37
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ICE Module
4.2 PCI EXPRESS ......................................................................................................38
4.2.1 Signal Description ......................................................................................39
4.2.2 PCI Express Slot X1....................................................................................40
4.2.3 Express Card Connector.............................................................................40
4.2.4 PCIe Mini Card...........................................................................................43
4.2.5 PCI Express Clock Buffer...........................................................................46
4.2.5.1 PCI Express Routing Guideline...........................................................46
4.3 PCI .....................................................................................................................47
4.3.1 Signal Description ......................................................................................47
4.3.2 PCI Connector............................................................................................48
4.3.3 PCI IRQ Assignment...................................................................................48
4.3.4 PCI Clock Buffer.........................................................................................50
4.3.5 PCI Routing Guideline................................................................................50
4.4 SATA (SERIAL ATA INTERFACE) ......................................................................51
4.4.1 Signal Description ......................................................................................51
4.4.2 SATA Connector..........................................................................................52
4.4.3 SATA LED#.................................................................................................53
4.4.4 SATA Routing Guideline.............................................................................53
4.5 UNIVERSAL SERIAL BUS (USB)..........................................................................54
4.5.1 Signal Description ......................................................................................54
4.5.2 USB Keyed Connector Protocol .................................................................55
4.5.3 ESD/EMI.....................................................................................................57
4.5.4 Over Current Protection.............................................................................58
4.5.5 Reference Schematics..................................................................................58
4.5.6 USB Routing Guideline...............................................................................60
4.5.6.1 Impedance............................................................................................60
4.5.6.2 General Routing and Placement...........................................................60
4.6 LVDS .................................................................................................................61
4.6.1 Signal Description ......................................................................................61
4.6.2 LVDS Cable Consideration.........................................................................62
4.6.3 Backlight and LCD Power Timing Control.................................................62
4.6.4 LVDS Routing Guideline.............................................................................64
4.6.4.1 Impedance............................................................................................64
4.6.4.2 Implement............................................................................................64
4.7 AUDIO CODEC INTERFACE(AC’97/HDA) ...........................................................65
4.7.1 Signal Description ......................................................................................65
4.8 REFERENCE CIRCUIT...........................................................................................65
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4.8.1 Audio Routing Guideline.............................................................................65
4.8.1.1 Analog Power Delivery........................................................................65
4.8.1.2 Digital and Analog Signals Isolation...................................................66
4.8.1.3 EMI Consideration...............................................................................66
4.9 IDE.....................................................................................................................66
4.9.1 Signal Description ......................................................................................66
4.9.2 IDE Connector............................................................................................67
4.9.3 CF Connector..............................................................................................68
4.10 TV-OUT............................................................................................................69
4.10.1 Signal Description ....................................................................................69
4.10.2 TV -Out Routing Guideline ........................................................................69
4.10.2.1 Signal Termination.............................................................................69
4.10.2.2 Video Filter........................................................................................69
4.10.2.3 ESD Protection...................................................................................70
ICE Module
4.10.2.4 Reference Schematic..........................................................................70
4.11 LAN (LOCAL AREA NETWORK)........................................................................71
4.11.1 Signal Description.....................................................................................71
4.11.2 Giga LAN Connector.................................................................................72
4.11.3 LAN Link Activity and Speed LED............................................................72
4.11.4 LAN Routing Guideline.............................................................................73
4.11.4.1 Impedance..........................................................................................73
4.11.4.2 LAN Ground Plane Separation..........................................................74
4.12 LPC (LOW PIN COUNT INTERFACE)..................................................................74
4.12.1 Signal Description ....................................................................................74
4.12.2 Clock and Reset Buffer..............................................................................75
4.12.3 LPC SuperIO for Legacy IO Support........................................................76
4.12.3.1 Keyboard/Mouse................................................................................76
4.12.3.2 RS-232/Floppy/LPT/IR......................................................................77
4.13 VGA.................................................................................................................79
4.13.1 Signal Description ....................................................................................79
4.13.2 VGA Connector.........................................................................................80
4.13.3 VGA DAC Filter........................................................................................80
4.13.4 Routing Guide Line...................................................................................80
4.13.4.1 HSYNC and VSYNC Signals............................................................80
4.13.4.2 ESD....................................................................................................80
4.13.4.3 DDC Interface....................................................................................80
4.13.5 VGA Reference Design .............................................................................81
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4.14 MISCELLANEOUS ..............................................................................................82
4.14.1 Signal Description ....................................................................................82
4.14.2 Speaker/FAN Control/RTC Reference.......................................................84
4.14.2.1 Speaker Out........................................................................................84
4.14.2.2 FAN Control.......................................................................................84
4.14.2.3 RTC....................................................................................................85
5 PCB STACK AND POWER DELIVER DESIGN............................................86
5.1 CHAPTER OVERVIEW...........................................................................................87
5.2 MICROSTRIP OR STRIPLINE..................................................................................87
5.3 PCB STACKUP EXAMPLE....................................................................................87
5.3.1 Four-Layer Stack-up...................................................................................88
5.3.2 Six-Layer Stack-up......................................................................................88
5.4 ATX POWER DELIVERY GUIDELINES ..................................................................90
5.4.1 ATX Power Status (S0,S3,S4,S5,G3)...........................................................91
5.4.2 ATX Power Diagram...................................................................................92
6.3.3 ATX Power On Timing................................................................................92
5.5 AT POWER DELIVERY GUIDELINE......................................................................93
5.5.1 AT Power Diagram.....................................................................................93
5.5.2 AT Power On Timing..................................................................................94
6 MECHANICAL DESIGN GUIDELINES............................................................95
6.1 CHAPTER OVERVIEW...........................................................................................96
6.2 COM MODULE AND CARRIER BOARD CONNECTOR............................................96
6.2.1 Module Connector ......................................................................................96
6.2.2 Carrier Board Connector ...........................................................................97
6.3 CONNECTOR FOOTPRINT.....................................................................................98
6.4 COM EXPRESS FORM FACTORS..........................................................................99
6.5 HEAT SPREAD....................................................................................................100
6.6 DESIGN NOTES..................................................................................................103
6.6.1 Component Height — Module Back and Carrier Board Top....................103
6.6.2 Air Follow Issue........................................................................................105
6.6.3 Grounding Issue........................................................................................105
6.7 OTHERS KITS SPECIFICATION............................................................................105
6.7.1 Heat Sink...................................................................................................105
A ICE MODULE DESIGN SCHEMATIC CHECK LIST ..................................107
B APPLICA TION NOTES......................................................................................116
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B.1 TERMINOLOGY .................................................................................................117
B.2 UPDATING BIOS VERSION ...............................................................................117
B.2.1 Using AFUWIN.........................................................................................118
6.7.2 Using DOS Command...............................................................................121
A.1 RTC OVERVIEW...............................................................................................123
A.1.1 How to Calculate the Battery Life............................................................123
B REFERENCE CARRIER BOARD SCHEMATIC...........................................124
ICE Module
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List of Figures
Figure 2-1: ICE Module Application..............................................................................................6
Figure 2-2: ICE-9152-R10...............................................................................................................8
Figure 2-3: ICE-9102-1GZ-R10.....................................................................................................10
Figure 2-4: ICE-9102-1G512-R10.................................................................................................12
Figure 2-5: ICE-ATOM-R10...........................................................................................................14
Figure 2-6: ICE-DB-9S-R10 ..........................................................................................................17
Figure 3-1: COM Express Type 2 Module Diagram...................................................................21
Figure 4-1: PCI Express x16 Slot Example ................................................................................32
Figure 4-2: Intel Recommend Test Structure for PCI Express Data Eye Measurement........35
Figure 4-3: PEG Lane Connection Topology Example.............................................................37
Figure 4-4: PEG Layout Trace Example .....................................................................................38
Figure 4-5: PCI Express x1 Slot Example ..................................................................................40
Figure 4-6: Express Card Slot Example...................................................................................41
Figure 4-7: Express Card 54&34 Type (Refer to www.expresscard.org)..............................42
Figure 4-8: Express Card 54 & 34 Plug Way (Refer to www.expresscard.org)....................43
Figure 4-9: Express Card Slot Example .....................................................................................44
Figure 4-10: Mini Card Bottom Side Dimensions (Refer to www.pcisig.com)........................45
Figure 4-11: Mini Card Top Side Dimensions (Refer to www.pcisig.com)..............................45
Figure 4-12: Mini Card Connector (Refer to www.pcisig.com) ................................................46
Figure 4-13: PCI Express Clock Buffer Example.......................................................................46
Figure 4-14: PCI Slot Connection Example................................................................................48
Figure 4-15: PCI Slot Routing Example...................................................................................49
Figure 4-16: PCI Clock Buffer Example......................................................................................50
Figure 4-17: SATA 7-pin Connector Example.........................................................................52
Figure 4-18: SATA LED Connection Example.........................................................................53
Figure 4-19: Keyed Connector Protocol (Refer to USB2.0 Spec.)...........................................55
Figure 4-20: USB Connector........................................................................................................56
Figure 4-21: RailClamp SRV05-4 Low Capacitance TVS Diode Array for ESD ......................57
Figure 4-22: 90 ohm Common Mode Choke at 100MHz for EMI ..............................................57
Figure 4-23: MIC2026 Block Diagram(Please refer the datasheet from MICREL ).................58
Figure 4-24: USB Reference Design...........................................................................................59
Figure 4-25: LVDS Power Control...............................................................................................62
Figure 4-26: Backlight Control Circuit........................................................................................63
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Figure 4-27: LCD Power Sequence Example(Refer to AUO G150XG01).................................63
Figure 4-28: Audio Analog Power Example...............................................................................66
Figure 4-29: IDE Reference Design.............................................................................................67
Figure 4-30: CF Connector ..........................................................................................................68
Figure 4-31: CompactFlash® Reference Design.......................................................................68
Figure 4-32: TV Out Schematic Reference.................................................................................70
Figure 4-33: Giga Lan Connection Exampel (including Transformer)....................................72
Figure 4-34: Clock Buffer.............................................................................................................75
Figure 4-35: Windbond W83627EHG Reference Design...........................................................76
Figure 4-36: Keyboard/Mouse Reference Schematic................................................................77
Figure 4-37: RS-232 Reference Schematic ................................................................................77
Figure 4-38: LPT Reference Schematic......................................................................................78
Figure 4-39: Floppy Reference Schematic.................................................................................78
Figure 4-40: IR Reference Schematic.........................................................................................79
ICE Module
Figure 4-41: VGA Connector D-SUB15.......................................................................................80
Figure 4-42: VGA Reference Design...........................................................................................81
Figure 4-43: Speaker Out Reference Schematic .......................................................................84
Figure 4-44: FAN Reference Schematic .....................................................................................84
Figure 4-45: RTC Reference Schematic .....................................................................................85
Figure 5-1: Four Layers Stack.....................................................................................................88
Figure 5-2: Six Layers Stack........................................................................................................89
Figure 5-3: ATX Power Delivery Block Diagram........................................................................92
Figure 5-4: ATX Power On Sequence.........................................................................................92
Figure 5-5: AT Power Delivery Block Diagram..........................................................................93
Figure 5-6: AT Power On Sequence............................................................................................94
Figure 6-1: Module Connector Picture .......................................................................................97
Figure 6-2: Carrier Board Connector..........................................................................................97
Figure 6-3: Single Connector Physical Dimensions.................................................................98
Figure 6-4: Dual Connector Footprint and Alignment ..............................................................98
Figure 6-5: Compact, Basic and Extended Form Factor ....................................................... 100
Figure 6-6: Overall Height for Heat-Spreader in Basic and Extended Modules.................. 101
Figure 6-7: Basic Module Heat-Spreader ................................................................................ 102
Figure 6-8: Basic Module Heat-Spreader Footprint ............................................................... 102
Figure 6-9: IEI Heat Spread Module......................................................................................... 103
Figure 6-10: Component Clearances Underneath Module.................................................... 104
Figure 6-11: IEI Heat Sink Module Dimensions...................................................................... 105
Figure 6-12: IEI Heat Sink Module Picture .............................................................................. 106
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ICE Module
Figure 6-13: BIOS Main Menu (BIOS Version: MR10) ............................................................ 118
Figure 6-14: AFUWIN – Open BIOS File................................................................................... 118
Figure 6-15: Locate BIOS File................................................................................................... 119
Figure 6-16: Check Program All Block.................................................................................... 119
Figure 6-17: AFUWIN – Flash ................................................................................................... 120
Figure 6-18: BIOS Main Menu – Updated BIOS Version (MR11)........................................... 120
Figure 6-19: USB Flash Drive and BIOS Updating Files........................................................ 121
Figure 6-20: BIOS Updating File Directory.............................................................................. 121
Figure 6-21: GO Command....................................................................................................... 122
Figure 6-22: BIOS Updating Complete (DOS)......................................................................... 122
Figure 6-23: BIOS Main Menu – Updated BIOS Version (MR11)........................................... 123
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ICE Module
List of Tables
Table 1-1: Conventions and Terminology....................................................................................2
Table 1-2: Reference Documents..................................................................................................4
Table 2-1: IEI ICE Modules.............................................................................................................7
Table 2-2: ICE-9152-R10 Specification .........................................................................................8
Table 2-3: ICE-9102-1GZ-R10 Specification...............................................................................10
Table 2-4: ICE-9102-1G512-R10 Specification...........................................................................12
Table 2-5: ICE-ATOM-R10 Specification.....................................................................................14
Table 2-6: ICE-GM45A-R10 Specification...................................................................................16
Table 2-7: ICE-DB-9S-R10 Specification ....................................................................................17
Table 3-1 ........................................................................................................................................22
Table 3-2: Conventions and Terminology..................................................................................23
Table 3-3: Module Type 2 Connector Pinout Rows (A and B)..................................................24
Table 3-4: Module Type 2 Connector Pinout Rows (C and D)..................................................26
Table 4-1: PCI Express Signal Descriptions..............................................................................30
Table 4-2: PEG & S DVO Pin Assignment..................................................................................33
Table 4-3: Intel® SDVO Support Device List..............................................................................33
Table 4-4: PCI Express Impedance Consideration....................................................................35
Table 4-5: PCI Express Signal Descriptions..............................................................................39
Table 4-6: Express Card Pin Definition ......................................................................................41
Table 4-7: Mini Card Pin-out .....................................................................................................44
Table 4-8: PCI Signal Description...............................................................................................47
Table 4-9: PCI Slot Routing Table...............................................................................................49
Table 4-10: PCI Impedance Consideration.................................................................................51
Table 4-11: Serial ATA Signal Descriptions...............................................................................52
Table 4-12: SATA Impedance Consideration.............................................................................53
Table 4-13: USB Signal Description............................................................................................54
Table 4-14: USB Connector Signal Description ........................................................................56
Table 4-15: LVDS Signals Description........................................................................................61
Table 4-16: LVDS Impedance Consideration.............................................................................64
Table 4-17: Audio Signals Description.......................................................................................65
Table 4-18: IDE signals description............................................................................................66
Table 4-19: TV-Out Signal Descriptions.....................................................................................69
Table 4-20: Ethernet signals description...................................................................................71
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Table 4-21: LAN Impedance Consideration ...............................................................................73
Table 4-22: LPC Interface Signal Descriptions..........................................................................75
Table 4-23: VGA signals description..........................................................................................79
Table 4-24: Miscellaneous pin assignment................................................................................82
Table 5-1: Signal Tables Terminology Descriptions.................................................................91
Table 5-2: Power State Behavior.................................................................................................91
Table 5-3: ATX Power On Sequence Timing..............................................................................93
Table 5-4: AT Power On Sequence Timing ................................................................................94
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ICE Module
Chapter
1
1 Introduction
Page 1
1.1 Introduction
This design guide describes the design concept of the IEI COM Express module and
how to teach customers to develop their own COM Express baseboard. IEI COM
Express module is compatible with all baseboards compliant with COM Express
specification.
1.2 Acronyms and Abbreviations Definition
Table 1-1 defines the acronyms, conventions, and terminology that are used
throughout the design guide.
Table 1-1: Conventions and Terminology
Terminology Description
AC97 Audio Codec 97’
ICE Module
HDA High Definition Audio
SATA Serial AT Attachment: serial-interface standard for hard disks
IDE (ATA) Integrated Drive Electronics (Advanced Technology Attachment)
SDVO Serial Digital Video Out is a proprietary technology introduced by Intel®
to add additional video signaling interfaces to a system
EMI Electromagnetic Interference
ESD Electrostatic Discharge
PCIe x1, x2, x4, x16 x1 refers to one PCI Express Lane of basic bandwidth; x2 to two PCI
Express Lanes; etc.. Also referred to as x1, x2, x4, x16 link.
PCI Express (PCIe) Peripheral Component Interface Express – next-generation high speed
Serialized I/O bus
ExpressCard A PCMCIA standard built on the latest USB 2.0 and PCI Express buses
GBE Gigabit Ethernet
CRT Cathode Ray Tube
DDR Double Data Rate SDRAM memory technology
DVI Digital Visual Interface is the interface specified by the DDWG (Digital
Display working Group) DVI Spec. Rev. 1.0
DDC Display Data Channel is an I2C bus interface between a display and a
graphics adapter.
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ICE Module
I2C Inter-IC (a two wire serial bus created by Philips)
LCD Liquid Crystal Display
LFP Local Flat Panel
LVDS Low Voltage Differential Signaling: A high speed, low power data
transmission standard used for display connections to LCD panels.
NTSC National Television Standards Committee
PAL Phase Alternate Line
PCI Peripheral Component Interface
RTC Real Time Clock
SMBus System Management Bus.
COM Computer On Module
STD Suspend To Disk
STR Suspend To RAM
ULV Ultra-Low Voltage
USB Universal Serial Bus
PCI
N.C. Not connected
N.A. Not available
T.B.D. To be determined
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ICE Module
1.3 Reference Documents
Table 1-2 lists all the reference documents of this design guide.
Table 1-2: Reference Documents
Document Location
PICMGR COM Express Module™ Base Specification
I2C Bus Interface
PCI Local Bus Specification, Revision 2.3
Serial ATA Specification, Revision 1.0a
PC104
SMBus
Universal Serial Bus (USB) Specification, Revision 2.0
IrDA
Ethernet(IEEE 802.3)
RS-232
Advanced Configuration and Power Management (ACPI)
Specification 1.0b & 2.0
Advanced Power Management (APM) Specification 1.2
PCI Express Base Specification, Revision 2.0
ExpressCard Standard Release 1.0
http://www.picmg.org/
http://www.semiconductors.philips.com/
http://www.pcisig.com/
http://www.serialata.org/
http://www.pc104.org/technology/pc104_tech.html
http://www.smbus.org/specs/
http://www.usb.org/home
http://www.irda.org/
http://www.ieee.org/portal/site
http://www.eia.org/
http://www.teleport.com/~acpi/
http://www.microsoft.com/hwdev/busbios/amp_12.
htm
http://www.pcisig.com/specifications
http://www.expresscard.org/
High Definition Audio Specification, Rev. 1.0
Extended Display Identification Data Standard Version 1.3
(EDID™)
Enhanced Display Data Channel Specifi cation Version 1.1
(DDC)
Audio Codec ‘97 Component Specification, Version 2.3
http://www.intel.com/standards/hdaudio/
http://www.vesa.org/
http://www.vesa.org/
http://www.intel.com/design/chipsets/audio/
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ICE Module
Chapter
2
2 ICE Module Overview
Page 5
2.1 Chapter Overview
ICE modules have various options for users to choose. IEI provides high-end,
mid-range and low-end CPU modules. Using the ICE module can overcome the
problems that may be caused by designing a compatible and stable module. IEI also
provides the service of deigning COM Express baseboard.
ICE Module
Figure 2-1: ICE Module Application
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ICE Module
2.2 ICE Specifications
IEI provides many kinds of ICE modules for customers, including BGA type and socket
type.
Table 2-1 lists the IEI ICE modules and the specifications.
Table 2-1: IEI ICE Modules
ICE 910/915 Series Description
ICE-9152-R10
ICE-9102-1GZ-R10
ICE-9102-1G512-R10
ICE Atom Series Description
ICE-ATOM-R10
ICE GM45 Series Description
ICE-GM45A-R10
COM Express Basic Type 2 Module, Socket 479
Intel® Pentium M CPU, VGA/LVDS, LAN, CF, SATA,
USB 2.0 and Audio
COM Express Basic Type 2 Module with Intel®
Celeron® M 1G zero cache CPU, VGA/LVDS, LAN,
CF, SATA, USB 2.0 and Audio
COM Express Basic Type 2 Module with Intel®
Celeron® M 1G 512KB cache CPU, VGA/LVDS,
LAN, CF, SATA, USB 2.0 and Audio
COM Express Basic Type 2 Module with Intel®
Diamondville-SC Processor at FSB 533MHz, Intel®
945GSE/ICH7M Basic Mobile Platform supports
COM Express Module with Intel® GM45/Penryn
processor DDR2, GbE, LVDS/CRT/HDTV-out,
SATAII, USB2.0
Carrier Board Description
ICE-DB-9S-R10 Base Board for COM Express Type 2 modules
Others Description
Page 7
2.2.1 ICE-9152-R10
The ICE-9152 is shown in Figure 2-2 and the specifications are list in Table 2-2.
ICE Module
Figure 2-2: ICE-9152-R10
Table 2-2: ICE-9152-R10 Specification
Item Description
CPU Socket 479 Intel® Pentium® M, Celeron® M processor
with a 533/400MHz FSB
System Memory One 200-pin 533/400MHz DDR2 SDRAM SO-DIMM
supported (system max. 2GB)
System Chipset
BIOS AMI Flash BIOS
WatchDog Timer
Expansion Interface
MIO
USB 8 x USB 2.0 (Signal to Base Board)
Intel® 915GME + ICH6M
255 levels timer interval, from 1 to 255 sec or min
setup by software, jumperless selection, generates
system reset
1 x PCIe x16 signal to Base Board
4 x PCIe x1 signal to Base Board
4 x PCI , 32 bit / 33 MHz PCI bus Singal to Base Base
Board
2 x SATA (Signal to Base Board)
1 x IDE channel (Signal to Base Board)
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Audio
Ethernet
CRT Display mode
LCD Display mode
Dimensions (L x W) 125 mm x 95 mm
Power Supply Voltage ATX / AT supported
Operating
Temperature
Operating Humidity 0% ~ 90% relative humidity, non-condensing
AC’97 Audio Signal to Base Board (Audio Codec on
Base Board)
One Intel® 82541PI GbE Chipset (co-layout Intel®
82551ER 10/100Mbps Ethernet chipset)
Signal to Base Board
VGA Integrated in Intel 915GME Signal (Signal to Base
Board)
18/24-bit Dual channel LVDS Signal (to Base Board)
0 ~ 60˚ C (32 ~ 140˚ F)
Page 9
2.2.2 ICE-9102-1GZ-R10
The ICE-9102-1GZ is shown in Figure 2-3 and the specifications are listed in Table
2-3.
ICE Module
Figure 2-3: ICE-9102-1GZ-R10
Table 2-3: ICE-9102-1GZ-R10 Specification
Item Description
CPU On board Intel® Celeron® M 1GHz zero cache
processor
System Memory One 200-pin 400MHz DDR2 SDRAM SO-DIMM
supported (system max. 2GB)
System Chipset
BIOS AMI Flash BIOS
WatchDog Timer
Expansion Interface
MIO
USB 8 x USB 2.0 (Signal to Base Board)
Audio
Ethernet
Intel® 910GMLE + ICH6-M
Software programmable supports 1 ~255 sec. System
reset
2 x SATA (Signal to Base Board)
1 x IDE channel (Signal to Base Board)
4 x PCIe x1 Signal to Base Board
4 x PCI , 32 bit / 33 MHz PCI bus Signal to Base Board
AC’97 Audio Signal to Base Board (Audio Codec on
Base Board)
One Intel® 82541PI GbE Chipset (co-layout Intel®
82551ER 10/100Mbps Ethernet chipset)
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ICE Module
Singal to Base Board
CRT Display mode
LCD Display mode
Dimensions (L x W) 125 mm x 95 mm
Power Supply Voltage ATX / AT supported
Operating
Temperature
Operating Humidity 0% ~ 90% relative humidity, non-condensing
VGA Integrated in Intel 910GMLE Signal (Signal to
Base Board)
18/24-bit Dual channel LVDS Signal (Signal to Base
Board)
0 ~ 60˚ C (32 ~ 140˚ F)
Page 11
A
2.2.3 ICE-9102-1G512-R10
The ICE-9152-1G512 is shown in Figure 2-4 and the specifications are listed in Table
2-4.
ICE Module
Figure 2-4: ICE-9102-1G512-R10
Table 2-4: ICE-9102-1G512-R10 Specification
Item Description
CPU On board Intel® Celeron® M 1GHz 512KB cache
processor
System Memory One 200-pin 400MHz DDR2 SDRAM SO-DIMM
supported (system max. 2GB)
Intel® 910GMLE + ICH6-M
Software programmable supports 1 ~255 sec. System
reset
2 x SATA (Signal to Base Board)
1 x IDE channel (Signal to Base Board)
4 x PCIe x1 Signal to Base Board
4 x PCI , 32 bit / 33 MHz PCI bus Signal to Base Board
C’97 Audio Signal to Base Board (Audio Codec on
Page 12
System Chipset
BIOS AMI Flash BIOS
WatchDog Timer
Expansion Interface
MIO
USB 8 x USB 2.0 (Signal to Base Board)
Audio
ICE Module
Base Board)
One Intel® 82541PI GbE Chipset (co-layout Intel®
Ethernet
CRT Display mode
LCD Display mode
Dimensions (L x W) 125 mm x 95 mm
Power Supply Voltage ATX / AT supported
Operating
Temperature
Operating Humidity 0% ~ 90% relative humidity, non-condensing
82551ER 10/100Mbps Ethernet chipset)
Signal to Base Board
VGA Integrated in Intel 910GMLE Signal (Signal to
Base Board)
18/24-bit Dual channel LVDS Signal (Signal to Base
Board)
0 ~ 60˚ C (32 ~ 140˚ F)
Page 13
A
2.2.4 ICE-ATOM-R10
The ICE-ATOM is shown in Figure 2-5 and the specifications are listed in Table 2-5.
ICE Module
Figure 2-5: ICE-ATOM-R10
Table 2-5: ICE-ATOM-R10 Specification
Item Description
CPU Intel Diamondville-SC support at FSB 533Mhz
System Memory 1x DDR2 SO-DIMM 400/533MHz support up to 2GB
System Chipset
BIOS AMI BIOS
WatchDog Timer
Audio
MIO
USB 8 USB ports, USB 2.0 (Signal to Base Board)
Ethernet
Display
Intel 945GSE + ICH7M
Sofware Programmable support 1~255 sec. System
reset
HD Audio Signal to Base Board (Audio Codec on Base
Board)
2 x SATA II (Signal to Base Board)
1 x IDE channel (Signal to Base Board)
1 x Intel® 82541PI GbE Chipset (co-layout Intel®
82551ER 10/100Mbps Ethernet chipset) (Signal to
Base Board)
nalog CRT(VGA) Integrated in Intel® 945GSE (Signal
Page 14
ICE Module
to Base Board)
18-bits Dual Channel LVDS Signal (Signal to Base
Board)
HDTV-out (Signal to Base Board)
1 x SDVO Interface (Only SDVO Port_B)
Dimensions (L x W) 125 mm x 95 mm
Power Supply Voltage AT/ATX support
Operating
Temperature
Operating Humidity 0% ~ 90% relative humidity, non-condensing system
0 ~ 60° C (32 ~ 140° F)
Page 15
2.2.5 ICE-GM45A-R10
The ICE-GM45A is shown in Error! Reference source not found. and the specifications
ICE Module
are listed in
Table 2-6: ICE-GM45A-R10 Specification
Item Description
CPU Socket P Intel® mobile Core™ 2 Duo(Penryn), Intel®
System Memory 2 x 200-pins 1066/800MHz DDR2 SDRAM SO-DIMM
System Chipset
BIOS AMI BIOS
WatchDog Timer
Audio
MIO
Expansion
USB 8 x USB 2.0 (Signal to Base Board)
Ethernet 1 x Intel 82574L GbE chipset (Signal to Base Board)
Display
Dimensions (L x W) 125 mm x 95 mm
Power Supply Voltage ATX/AT supported
Operating
Temperature
Operating Humidity 0% ~ 90% relative humidity, non-condensing system
Table 2-6.
Celeron® M
Supported
Intel® GM45 + Intel® ICH9M
Software programmable supports 1 ~255 sec. System
reset
HD Audio Signal to Base Board (Audio Codec on Base
Board)
4 x SATA II (Signal to Base Board)
1 x IDE channel (Signal to Base Board)
1 x PCIe x16 signal to Base Board
4 x PCIe x1 signal to Base Board
4 x PCI, 32 bit / 33 MHz PCI bus to Base Board
Analog CRT(VGA) Integrated in Intel® GM45 (Signal to
Base Board)
18/24-bits Dual-Channel LVDS (Signal to Base Board)
HDTV-out (Signal to Base Board)
0 ~ 60° C (32 ~ 140° F)
Page 16
ICE Module
2.2.6 ICE-DB-9S-R10
The ICE-DB-9S is a full function carrier board for customers to apply or test the COM
Express module. The carrier board can be used for any combination, including
software and hardware. Using the carrier board to develop and test the ICE module
also can achieve a quicker time to market. The ICE-DB-9S is shown in
the specifications are listed in
Table 2-7.
Figure 2-6 and
Figure 2-6: ICE-DB-9S-R10
Table 2-7: ICE-DB-9S-R10 Specification
Item Description
CPU module interface Supports COM Express Compact/Basic/Extended
modules using connector pin out Type 2
Realtek ALC888 7.1 channels HD audio codec
Audio
MIO
Front Audio by pin-header(Line in, Line out, Mic in)
SPDIF by pin-header
CD-IN by pin-header
1 x PCIe by 16 Slot
4 x PCIe by 1 Slot
3 x PCI Slot
1 x PCIe Mini card Slot
1 x Express Card Slot
1 x Mini PCI Card Slot
Page 17
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