Integrated Device Technology, Inc.
1M x 32
CMOS STATIC RAM MODULE
IDT7MP4120
FEATURES
• High-density 4MB Static RAM module
• Low profile 72-pin ZIP (Zig-zag In-line vertical Package)
or 72-pin SIMM (Single In-line Memory Module)
• Fast access time: 20ns (max.)
• Surface mounted plastic components on an epoxy
laminate (FR-4) substrate
• Single 5V (±10%) power supply
• Multiple GND pins and decoupling capacitors for maximum noise immunity
• Inputs/outputs directly TTL-compatible
PIN CONFIGURATION
NC
PD
3
PD
0
I/O
0
I/O
1
I/O
2
I/O
3
V
CC
A
7
A
8
A
9
I/O
4
I/O
5
I/O
6
I/O
7
WE
A
14
CS
1
CS
3
A
16
GND
I/O
16
I/O
17
I/O
18
I/O
19
A
10
A
11
A
12
A
13
I/O
20
I/O
21
I/O
22
I/O
23
GND
A
19
NC
NOTE:
1. Pins 3, 4, 6 and 7 (PD
user to determine the density of the module. If PD
2 reads GND and PD3 reads NC, then the module has a 1M depth.
NC, PD
The IDT logo is a registered trademark of Integrated Device Technology Inc.
0, PD1, PD2 and PD3 respectively) are read by the
(1)
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
ZIP, SIMM
TOP VIEW
NC
1
PD
3
2
5
GND
7
PD
1
9
I/O
8
11
I/O
9
13
I/O
10
15
I/O
11
17
A
0
19
A
1
21
A
2
23
I/O
12
25
I/O
13
27
I/O
14
29
I/O
15
31
GND
33
A
15
35
CS
2
37
CS
4
39
A
17
41
OE
43
I/O
24
45
I/O
25
47
I/O
26
49
I/O
27
51
A
3
53
A
4
55
A
5
57
V
CC
59
A
6
61
I/O
28
63
I/O
29
65
I/O
30
67
I/O
31
69
A
18
71
NC
0 reads GND, PD1 reads
PD
PD
PD
PD
0 -
GND
1 -
NC
2 -
GND
3 -
NC
3019 drw 01
DESCRIPTION
The IDT7MP4120 is a 1M x 32 Static RAM module constructed on an epoxy laminate (FR-4) substrate using 8 1M x
4 Static RAMs in plastic packages. Availability of four chip
select lines (one for each group of two RAMs) provides byte
access. The IDT7MP4120 is available with access time as fast
as 20ns with minimal power consumption.
The IDT7MP4120 is packaged in a 72-pin FR-4 ZIP (Zigzag In-line vertical Package)or a 72-pin SIMM (Single In-line
Memory Module). The ZIP configuration allows 72 pins to be
placed on a package 4.05" long and 0.365" wide. At only 0.60"
high, this low-profile package is ideal for systems with minimum board spacing while the SIMM configuration allows use
of edge mounted sockets to secure the module.
All inputs and outputs of the IDT7MP4120 are TTL-compatible and operate from a single 5V supply. Full asynchronous circuitry requires no clocks or refresh for operation and
provides equal access and cycle times for ease of use.
Four identification pins (PD0, PD1, PD2 and PD3) are provided for applications in which different density versions of the
module are used. In this way, the target system can read the
respective levels of PD
0, PD1, PD2 and PD3 to determine a 1M
depth.
The contact pins are plated with 100 micro-inches of nickel
covered by 30 micro-inches minimum of selective gold.
FUNCTIONAL BLOCK DIAGRAM
A0 – A19
WE
OE
CS1CS2CS3CS
20
1M x 32
RAM
8
8 8 8
I/O0-7
8-15 I/O16-23 I/O24-31
I/O
4
3
PD0 – PD3
3019 drw 02
PIN NAMES
I/O0–I/O31 Data Inputs/Outputs
A0–A19 Addresses
CS1–CS
WE
OE
PD0–PD3 Depth Identification
VCC Power
GND Ground
NC No Connect
4 Chip Selects
Write Enable
Output Enable
3019 tbl 01
COMMERCIAL TEMPERATURE RANGE SEPTEMBER 1996
1996 Integrated Device Technology, Inc. DSC-3019/5
7.07 1
IDT7MP4120
1M x 32 CMOS STATIC RAM MODULE COMMERCIAL TEMPERATURE RANGE
CAPACITANCE (TA = +25°C, F = 1.0MHz)
Symbol Parameter
CI/O Data I/O Capacitance V(IN) = 0V 15 pF
IN1 Input Capacitance V(IN) = 0V 60 pF
C
(Address)
IN2 Input Capacitance V(IN) = 0V 75 pF
C
(WE, OE)
IN3 Input Capacitance (
C
NOTE: 3019 tbl 02
1. This parameter is guaranteed by design but not tested.
(1)
Conditions Max. Unit
CS
)V(IN) = 0V 20 pF
RECOMMENDED DC OPERATING
CONDITIONS
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage 4.5 5.0 5.5 V
GND Supply Voltage 0 0 0 V
VIH Input High Voltage 2.2 — 6.0 V
IL Input Low Voltage –0.5
V
NOTE: 3019 tbl 03
1. VIL (min) = –1.5V for pulse width less than 10ns.
(1)
— 0.8 V
TRUTH TABLE
Mode
Standby H X X High-Z Standby
Read L L H DATAOUT Active
Write L X L DATAIN Active
Read L H H High-Z Active
ABSOLUTE MAXIMUM RATINGS
Symbol Rating Value Unit
TERM Terminal Voltage with –0.5 to +7.0 V
V
TA Operating Temperature 0 to +70 °C
TBIAS Temperature Under Bias –10 to +85 °C
TSTG Storage Temperature –55 to +125 °C
OUT DC Output Current 50 mA
I
NOTE: 3019 tbl 06
1. Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
CSCSOEOEWE
Respect to GND
WE
Output Power
3019 tbl 05
(1)
RECOMMENDED OPERATING
TEMPERATURE AND SUPPLY VOLTAGE
Ambient
Grade Temperature GND VCC
Commercial 0°C to +70°C 0V 5.0V ± 10%
3019 tbl 04
DC ELECTRICAL CHARACTERISTICS
(VCC = 5.0V ±10%, TA = 0°C to +70°C)
Symbol Parameter Test Conditions Min. Max. Unit
LI| Input Leakage VCC = Max.; VIN = GND to VCC —80µA
|I
(Address and Control)
|ILI| Input Leakage (Data) VCC = Max.; VIN = GND to VCC —10µA
|ILO| Output Leakage VCC = Max.; CS = VIH, VOUT = GND to VCC —10µA
VOL Output LOW VCC = Min., IOL = 8mA — 0.4 V
OH Output HIGH VCC = Min., IOH = –4mA 2.4 — V
V
3019 tbl 07
7MP4120
Symbol Parameter Test Conditions Max. Unit
CC Dynamic Operating f = fMAX;
I
Current V
SB Standby Supply
I
CS
Current Outputs Open, f = f
ISB1 Full Standby
CS
Supply Current V
CS
= VIL 1280 mA
CC = Max.; Output Open
≥ VIH, VCC = Max. 480 mA
MAX
≥ VCC – 0.2V; f = 0 120 mA
IN > VCC – 0.2V or < 0.2V
3019 tbl 08
7.07 2
IDT7MP4120
1M x 32 CMOS STATIC RAM MODULE COMMERCIAL TEMPERATURE RANGE
AC TEST CONDITIONS
Input Pulse Levels GND to 3.0V
Input Rise/Fall Times 5ns
Input Timing Reference Levels 1.5V
Output Reference Levels 1.5V
Output Load See Figures 1 and 2
2769 tbl 09
DATA
OUT
255Ω
Figure 1. Output Load
+5 V
480 Ω
30 pF*
3019 drw 03
*Includes scope and jig.
DATA
OUT
255Ω
Figure 2. Output Load
OLZ,tOHZ, tCHZ, tCLZ, tWHZ, tOW)
(for t
+5 V
480 Ω
5 pF*
3019 drw 04
7.07 3