Integrated Device Technology, Inc.
4K x 36
BiCMOS DUAL-PORT
STATIC RAM MODULE
IDT7M1014
FEATURES
• High-density 4K x 36 BiCMOS Dual-Port Static RAM
module
• Fast access times
— Commercial: 15, 20ns
— Military: 25, 30ns
• Fully asynchronous read/write operation from either port
• Surface mounted LCC packages allow through-hole
module to fit on a ceramic PGA footprint
• Single 5V (±10%) power supply
• Multiple GND pins and decoupling capacitors for maximum noise immunity
• Inputs/outputs directly TTL-compatible
FUNCTIONAL BLOCK DIAGRAM
DESCRIPTION
The IDT7M1014 is a 4K x 36 asynchronous high-speed
BiCMOS Dual-Port static RAM module constructed on a cofired ceramic substrate using 4 IDT7014 (4K x 9) asynchronous Dual-Port RAMs. The IDT7M1014 module is designed
to be used as stand-alone 36-bit dual-port RAM.
This module provides two independent ports with separate
control, address, and I/O pins that permit independent and
asynchronous access for reads or writes to any location in
memory.
The IDT7M1014 module is packaged in a 142-lead ceramic
PGA (Pin Grid Array). Maximum access times as fast as 15ns
and 25ns are available over the commercial and military
temperature ranges respectively.
All IDT military modules are constructed with semiconductor components manufactured in compliance with the latest
revision of MIL-STD-883, Class B making them ideally suited
to applications demanding the highest level of performance
and reliability.
L_A
L_I/O
L_I/O
L_I/O
L_I/O
L_
L_R/
L_R/
18 – 26
L_
L_R/
27 – 35
L_R/
0 – 11
0 – 8
9 – 17
R_A
0 – 11
R_I/O
0 – 8
L
0
1
H
2
3
IDT7014
4K x 9
IDT7014
4K x 9
IDT7014
4K x 9
IDT7014
4K x 9
R_
R_R/
R_I/O
R_R/
R_I/O
R_
R_R/
R_I/O
R_R/
L
0
9 – 17
1
18 – 26
H
2
27 – 35
3
2819 drw 01
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
MILITARY AND COMMERCIAL TEMPERATURE RANGES DECEMBER 1995
©1996 Integrated Device Technology, Inc. DSC-2819/4
7.03 1
IDT7M1014 4K x 36 BiCMOS
DUAL-PORT STATIC RAM MODULE MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN CONFIGURATION
12345678910111213
3
L_I/O
2
A GND L_I/O
GND L_I/O
1
L_I/O
0
GND R_I/O0R_I/O
1
GND R_I/O2R_I/O
3
GND
B L_I/O
C L_I/O
D L_I/O9L_I/O
E L_I/O
F L_I/O
G GND L_R/
H L_I/O14L_R/
J L_I/O
K L_I/O
L L_I/O
M L_I/O
N GND L_I/O
4
L_I/O
5
8
V
CC
10
12
N.C. N.C. L_A
13
L_
OE
L
W0L_R/
W2L_R/
15
L_I/O
16
20
L_I/O
19
21
V
CC
23
L_I/O
24
26
L_I/O
L_I/O
L_I/O
L_
L_I/O
L_I/O
L_I/O
L_I/O
L_I/O
OE
6
L_A
2
L_A
1
7
GND N.C. N.C. N.C. N.C. N.C. GND R_I/O
11
L_A
3
GND GND R_A
4
H
L_A5 R_A
W
1
GND GND R_R/
W
3
L_A
6
17
L_A
7
18
22
25
27
GND L_A
L_A
8
L_I/O
29
L_I/O
28
10
L_A
9
L_I/O
30
GND L_I/O
PIN NAMES
Left Port Right Port Names
L_R/W 0-3 R_R/W 0-3 Byte Read/Write Enables
L_OE L, H R_OE L, H Word Output Enables
L_A 0-11 R_A 0-11 Address Inputs
L_I/O 0-35 R_I/O 0-35 Data Input/Outputs
VCC Power
GND Ground
L_A
L_A
L_I/O
L_I/O
2819 tbl 01
0
N.C. R_A
11
GND R_A
31
R_I/O35R_I/O34R_I/O
32
L_I/O
35
R_I/O33R_I/O31R_I/O29R_I/O25R_I/O24R_I/O
33
L_I/O
34
R_I/O
0
R_A
1
R_A
2
R_I/O6R_I/O5R_I/O
7
V
CC
3
R_A
4
R_I/O11R_I/O
R_A
5
N.C. N.C. R_I/O
6
R_
OE
H
W1R_R/
R_A7R_R/
R_A
8
11
R_A
10
32
GND R_I/O28R_I/O27R_I/O
GND R_I/O18R_I/O19R_I/O
30
R_A
9
W3R_R/
R_I/O17R_I/O16R_I/O
R_I/O
22
10
R_
OE LR_I/O
W
0
W2R_I/O
V
CC
26
4
R_I/O
8
R_I/O
9
12
13
GND
14
15
20
R_I/O
21
23
GND
2819 drw 02
2809 drw 02
7.03 2
IDT7M1014 4K x 36 BiCMOS
DUAL-PORT STATIC RAM MODULE MILITARY AND COMMERCIAL TEMPERATURE RANGES
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Rating Commercial Military Unit
(2)
V
TERM
Terminal Voltage –0.5 to +7.0 –0.5 to +7.0 V
with Respect to
GND
(3)
VTERM
T
Terminal Voltage –0.5 to +7.0 –0.5 to +7.0 V
A Operating 0 to +70 –55 to +125 °C
Temperature
BIAS Temperature –10 to +85 –65 to +135 °C
T
Under Bias
T
STG Storage –55 to +125 –65 to +150 °C
Temperature
OUT DC Output 50 50 mA
I
Current
NOTES: 2819 tbl 02
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS
may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
2. Inputs and V
3. I/O terminals only.
CC terminals only.
RECOMMENDED DC
OPERATING CONDITIONS
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage 4.5 5.0 5.5 V
GND Supply Voltage 0 0 0 V
VIH Input HIGH Voltage 2.2 — 6.0 V
V
IL Input LOW Voltage –0.5
NOTE: 2819 tbl 03
1. VIL ≥ –3.0V for pulse width less than 20ns.
(1)
— 0.8 V
RECOMMENDED OPERATING
TEMPERATURE AND SUPPLY VOLTAGE
Ambient
Grade Temperature GND VCC
Military –55°C to +125°C 0V 5.0V ± 10%
Commercial 0°C to +70°C 0V 5.0V ± 10%
2819 tbl 04
CAPACITANCE TABLE (TA = +25°C, f = 1.0MHz)
Symbol Parameter Conditions Max. Unit
C_IN(1) Input Capacitance (Address) V_IN = 0V 50 pF
C_IN(2) Input Capacitance (Data, R/W)V_IN = 0V 15 pF
C_IN(3) Input Capacitance (OE)V_IN = 0V 25 pF
C
OUT Output Capacitance (Data) V_OUT = 0V 15 pF
NOTE: 2819 tbl 05
1. This parameter is guaranteed by design but not tested.
7.03 3