Integrated Device Technology Inc IDT7024S15PF, IDT7024S17F, IDT7024S17G, IDT7024S17J, IDT7024S17PF Datasheet

...
Integrated Device Technology, Inc.
HIGH-SPEED 4K x 16 DUAL-PORT STATIC RAM
IDT7024S/L
FEATURES:
• True Dual-Ported memory cells which allow simulta­neous access of the same memory location
• High-speed access — Military: 20/25/35/55/70ns (max.) — Commercial: 15/17/20/25/35/55ns (max.)
• Low-power operation — IDT7024S
Active: 750mW (typ.) Standby: 5mW (typ.)
— IDT7024L
Active: 750mW (typ.) Standby: 1mW (typ.)
• Separate upper-byte and lower-byte control for multiplexed bus compatibility
• IDT7024 easily expands data bus width to 32 bits or more using the Master/Slave select when cascading
FUNCTIONAL BLOCK DIAGRAM
W
L
R/
UB
L
more than one device
•M/S = H for M/S = L for
BUSY
output flag on Master
BUSY
input on Slave
• Busy and Interrupt Flags
• On-chip port arbitration logic
• Full on-chip hardware support of semaphore signaling between ports
• Devices are capable of withstanding greater than 2001V
electrostatic discharge.
• Fully asynchronous operation from either port
• Battery backup operation—2V data retention
• TTL-compatible, single 5V (±10%) power supply
• Available in 84-pin PGA, 84-pin quad flatpack, 84-pin PLCC, and 100-pin Thin Quad Plastic Flatpack
• Industrial temperature range (–40°C to +85°C) is avail­able, tested to military electrical specifications
W
R
R/
UB
R
NOTES:
1. (MASTER):
BUSY
is output; (SLAVE): is input.
2.
BUSY
outputs
and
INT
outputs are non-tri-stated push-pull.
BUSY
I/O8L-I/O
I/O0L-I/O
BUSY
LB CE OE
A
A
SEM INT
15L
(1,2) L
11L
L L L
I/O
12
Control
MEMORY
ARRAY
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
M/
S
7L
Address
0L
L
(2)
L
Decoder
CE OE
R/
W
L L L
I/O
Control
Address Decoder
12
CE
R
OE
R
R/
W
R
LB
R
CE
R
OE
R
I/O8R-I/O
I/O0R-I/O
BUSY
A
11R
A
0R
SEM
R (2)
INT
R
2740 drw 01
R
15R
7R
(1,2)
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
MILITARY AND COMMERCIAL TEMPERATURE RANGES OCTOBER 1996
©1996 Integrated Device Technology, Inc. DSC-2740/6
For latest information contact IDT’s web site at www.idt.com or fax-on-demand at 408-492-8391.
6.15
1
IDT7024S/L HIGH-SPEED 4K x 16 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
DESCRIPTION:
The IDT7024 is a high-speed 4K x 16 Dual-Port Static RAM. The IDT7024 is designed to be used as a stand-alone 64K-bit Dual-Port RAM or as a combination MASTER/SLAVE Dual-Port RAM for 32-bit or more word systems. Using the IDT MASTER/SLAVE Dual-Port RAM approach in 32-bit or wider memory system applications results in full-speed, error­free operation without the need for additional discrete logic.
This device provides two independent ports with separate control, address, and I/O pins that permit independent, asynchronous access for reads or writes to any location in memory. An automatic power down feature controlled by chip enable ( CE ) permits the on-chip circuitry of each port to enter
PIN CONFIGURATIONS
6L
3L
5L
INDEX
I/O
I/O I/O I/O I/O I/O
GND I/O I/O
V
GND
I/O I/O I/O
V I/O I/O I/O I/O I/O I/O
7L
I/O
I/O
11109876543218483
8L
12
9L
13
10L
14
11L
15
12L
16
13L
17 18
14L
19
15L
20
CC
21 22
0R
23
1R
24
2R
25
CC
26
3R
27
4R
28
5R
29
6R
30
7R
31
8R
32
33 34 35 36 37 38 39 40 41 42 43 44 45
9R
11R
10R
I/O
I/O
I/O
NOTES:
1. All Vcc pins must be connected to the power supply.
2. All GND pins must be connected to the ground supply.
3. This text does not indicate orientation of the actual part-marking.
I/O
12R
I/O
4L
I/O
13R
I/O
I/O
14R
I/O
2L
I/O
GND
GND
15R
I/O
(1,2)
L
1L
0L
CC
I/O
OE
V
I/O
IDT7024
J84-1 F84-2
84-PIN PLCC /
FLATPACK
TOP VIEW
R
R
W
OE
GND
R/
L
L
L
L
SEM
CE
UB
L
N/C
LB
W
R/
82 81 80 79 78 77 76 75
(3)
46 47 48 49 50 51 52 53
R
R
R
R
SEM
CE
UB
11R
N/C
LB
A
10R
A
11L
A
10L
9L
8L
A
A
A
A
7L
74
A
6L
73
A
5L
72
A
4L
71
A
3L
70
A
2L
69
A
1L
68
A
0L
67
INT
L
66
BUSY
65
GND
64 63
M/
S
62
BUSY
61
INT
R
60
A
0R
59
A
1R
58
A
2R
57
A
3R
56
A
4R
A
5R
55
A
6R
54
2740 drw 02
9R
7R
8R
A
A
A
a very low standby power mode.
Fabricated using IDT’s CMOS high-performance technol ogy, these devices typically operate on only 750mW of power. Low-power (L) versions offer battery backup data retention capability with typical power consumption of 500µW from a 2V battery.
The IDT7024 is packaged in a ceramic 84-pin PGA, an 84­pin quad flatpack, an 84-pin PLCC, and a 100-pin TQFP. Military grade product is manufactured in compliance with the latest revision of MIL-STD-883, Class B, making it ideally suited to military temperature applications demanding the highest level of performance and reliability.
L
R
Index
I/O I/O I/O I/O
GND I/O I/O
GND
I/O I/O I/O
I/O I/O I/O I/O
9L
8L
7L
6L
5L
I/O
I/O
I/O
I/O
I/O
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
N/C
1
N/C
2
N/C
3
N/C
4
10L
5
11L
6
12L
7
13L
8 9
14L
10
15L
11
V
CC
12 13
0R
14
1R
15
2R
16
V
CC
17
3R
18
4R
19
5R
20
6R
21
N/C
22
N/C
23
N/C
24
N/C
25
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
7R
8R
9R
10R
11R
I/O
I/O
I/O
I/O
I/O
4L
I/O
12R
I/O
3L
I/O
13R
I/O
2L
I/O
14R
I/O
1L
I/O
GND
TOP VIEW
15R
GND
I/O
L
0L
I/O
OE
IDT7024 PN100-1
100-PIN
TQFP
R
R
W
OE
R/
CC
V
GND
L
W
R/
(3)
R
SEM
L
SEM
R
CE
L
CE
R
UB
L
UB
R
LB
L
LB
N/C
N/C
11R
A
11L
A
10R
A
10L
A
9R
A
9L
8L
7L
6L
A
A
A
A
75 74
73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
2740 drw 03
6R
5R
8R
7R
A
A
A
A
N/C N/C N/C N/C A
5L
A
4L
A
3L
A
2L
A
1L
A
0L
INT
BUSY
GND M/
S
BUSY
INT
A
0R
A
1R
A
2R
A
3R
A
4R
N/C N/C N/C N/C
L
L
R
R
6.15 2
IDT7024S/L HIGH-SPEED 4K x 16 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN CONFIGURATIONS (CONT'D)
63 61 60 58 55 54 51 48 46 45
11
66
10
I/O
67
09
I/O
69
08
I/O
72
07
I/O
75
06
76
05
79
04
81
03
82
02
84346915131618
01
I/O
I/O
7L
5L
I/O4LI/O2LI/O
64
62
10L
I/O8LI/O6LI/O3LI/O
65
11L
I/O
9L
68
13L
I/O
12L
71
73
15L
I/O
14L
V
70
74
GND
I/O
I/O
I/O
11R
GND
78
V
2R
4R
7R
9R
I/O
I/O
I/O
0R
77
I/O
1R
80
I/O
3R
83
I/O
5R
125
I/O6RI/O
I/O8RI/O
CC
CC
(1,2)
A
0L
59 56 49 50 40
1L
57 53 52
GND
IDT7024
84-PIN PGA
TOP VIEW
7
81110
10R
I/O
13R
I/O
15R
12R
I/O
14R
OERLB
SEM
OE
L
UB
L
V
CC
G84-3
(3)
12
SEM
GNDGND
14 17 20
R
R/
W
R
R/
UB
CE
CE
L
L
W
L
R
R
R
LB
47 44
N/C
A
N/C
L
11R
11L
A
9L
33 35
BUSY
L
32 31
GND
28 29
A
0R
A
8R
A
10R
A
10L
43
A
8L
41
A
6L
38
A
3L
A
0L
M/
S
INT
R
26
A
2R
23
A
5R
22 24
A
6R
19 21
A
9R
42
A
7L
A
5L
39
A
4L
37
A
2L
34
INT
36
A
1L
30
BUSY
27
A
1R
25
A
3R
A
4R
A
7R
L
R
ABCDEFGHJ KL
Index
NOTES:
1. All Vcc pins must be connected to the power supply.
2. All GND pins must be connected to the ground supply.
3. This text does not indicate orientation of the actual part-marking.
PIN NAMES
Left Port Right Port Names
CE
L
R/
W
L R/WR Read/Write Enable
OE
L
A
0L – A11L A0R – A11R Address
I/O
0L – I/O15L I/O0R – I/O15R Data Input/Output
SEM
L
UB
L
LB
L
INT
L
BUSY
L
CE
R Chip Enable
OE
R Output Enable
SEM
R Semaphore Enable
UB
R Upper Byte Select
LB
R Lower Byte Select
INT
R Interrupt Flag
BUSY
R Busy Flag
M/
S
V
CC Power
Master or Slave Select
GND Ground
2740 tbl 1
2740 drw 04
RECOMMENDED OPERATING TEMPERATURE AND SUPPLY VOLTAGE
Ambient
Grade Temperature GND V
Military –55°C to +125°C 0V 5.0V ± 10% Commercial 0°C to +70°C 0V 5.0V ± 10%
CC
2740 tbl 02
6.15 3
IDT7024S/L HIGH-SPEED 4K x 16 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
TRUTH TABLE I – NON-CONTENTION READ/WRITE CONTROL
(1)
Inputs
CECE
CE
CECE
R/
WW
W
WW
OEOE
OE
OEOE
UBUB
UB
UBUB
LBLB
LB
LBLB
SEMSEM
SEM
SEMSEM
H X X X X H High-Z High-Z Deselected: Power-Down X X X H H H High-Z High-Z Both Bytes Deselected
L L X L H H DATA L L X H L H High-Z DATA L L X L L H DATA L H L L H H D ATA L H L H L H High-Z DATA L H L L L H DATA
X X H X X X High-Z High-Z Outputs Disabled
NOTE: 2740 tbl 03
1. A0L — A11L are not equal to A0R — A11R.
TRUTH TABLE II – SEMAPHORE READ/WRITE CONTROL
Inputs Outputs
CECE
CE
CECE
H H L X X L DATA X H L H H L DATA H X
L X X L X L Not Allowed L X X X L L Not Allowed
NOTE:
1. There are eight semaphore flags written to via I/O
R/
WW
W
WW
u u
OEOE
OE
OEOE
UBUB
UB
UBUB
LBLB
LB
LBLB
SEMSEM
SEM
SEMSEM
X X X L DATA X H H L DATA
0 and read from all of the I/O's (I/O0 - I/O15). These eight semaphores are addressed by A0 - A2.
Outputs
8-15 I/O0-7 Mode
I/O
IN High-Z Write to Upper Byte Only
IN Write to Lower Byte Only
IN DATAIN Write to Both Bytes
OUT High-Z Read Upper Byte Only
OUT Read Lower Byte Only
OUT DATAOUT Read Both Bytes
(1)
8-15 I/O0-7 Mode
I/O
OUT DATAOUT Read Semaphore Flag Data Out OUT DATAOUT Read Semaphore Flag Data Out
IN DATAIN Write I/O0 into Semaphore Flag IN DATAIN Write I/O0 into Semaphore Flag
2740 tbl 04
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Rating Commercial Military Unit
(2)
V
TERM
Terminal Voltage –0.5 to +7.0 –0.5 to +7.0 V with Respect to GND
T
A Operating 0 to +70 –55 to +125 °C
Temperature
T
BIAS Temperature –55 to +125 –65 to +135 °C
Under Bias
STG Storage –55 to +125 –65 to +150 °C
T
Temperature
I
OUT DC Output 50 50 mA
Current
NOTES: 2740 tbl 05
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. V
TERM must not exceed Vcc +0.5V for more than 25% of the cycle time or
10ns maximum, and is limited to
.
+ 0.5V
< 20ma for the period over VTERM > Vcc
RECOMMENDED DC OPERATING CONDITIONS
Symbol Parameter Min. Typ. Max. Unit
CC Supply Voltage 4.5 5.0 5.5 V
V GND Supply Voltage 0 0 0 V
IH Input High Voltage 2.2 6.0
V V
IL Input Low Voltage –0.5
NOTES: 2740 tbl 06
1. VIL > -1.5V for pulse width less than 10ns.
TERM must not exceed Vcc + 0.5V.
2. V
CAPACITANCE
(1)
(1)
0.8 V
(TA = +25°C, F = 1.0MHZ) TQFP ONLY
Symbol Parameter Condition
IN Input Capacitance VIN = 3dV 9 pF
C
OUT Output Capacitance VOUT = 3dV 10 pF
C
NOTES: 2740 tbl 07
1. This parameter are determined by device characterization, but is not production tested.
2. 3dV references the interpolated capacitance when the input and output signals switch from 0V to 3V or from 3V to 0V.
(2)
(2)
Max. Unit
V
6.15 4
IDT7024S/L HIGH-SPEED 4K x 16 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
DC ELECTRICAL CHARACTERISTICS OVER THE OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE
Symbol Parameter Test Conditions Min. Max. Min. Max. Unit
LI| Input Leakage Current
|I
LO| Output Leakage Current
|I
OL Output Low Voltage IOL = 4mA 0.4 0.4 V
V
OH Output High Voltage IOH = -4mA 2.4 2.4 V
V
NOTE:
1. At Vcc
< 2.0V input leakages are undefined.
(1)
VCC = 5.5V, VIN = 0V to VCC —10—5µA
CE
= VIH, VOUT = 0V to VCC —10—5µA
(VCC = 5.0V ± 10%)
IDT7024S IDT7024L
2740 tbl 08
DC ELECTRICAL CHARACTERISTICS OVER THE OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE
7024X15 7024X17 7024X20 7024X25
Test Com'l. Only Com'l. Only
Symbol Parameter Condition Version Typ.
CC Dynamic Operating
I Current
(Both Ports Active) f = f
CE
"A"=VIL, Outputs Open MIL S 160 370 155 340 mA
SEM
= V
IH L 160 320 155 280
(3)
MAX
COM S 170 310 170 310 160 290 155 265
L 170 260 170 260 160 240 155 220
I
SB1 Standby Current CER = CEL = VIH MIL S 20 90 16 80 mA
(Both Ports — TTL Level Inputs) f = f
SEM
R =
MAX
SEM
L = VIH L————20701665
(3)
COMS2060206020601660
L2050205020501650
I
SB2 Standby Current
CE
"A"=VIL and CE"B"=VIL
(5)
MIL S 95 240 90 215 mA
(One Port — TTL Active Port Outputs Open L 95 210 90 180
(3)
Level Inputs) f = f
I
SB3 Full Standby Current Both Ports CEL and MIL S 1.0 30 1.0 30 mA
(Both Ports — All CMOS Level Inputs) V
MAX
SEM
R =
SEM
L = VIH L 105 160 105 160 95 150 90 140
CE
R >VCC - 0.2V L 0.2 10 0.2 10
IN > VCC - 0.2V or COM S 1.0 15 1.0 15 1.0 15 1.0 15
V
IN < 0.2V, f = 0
SEM
R
=
SEM
(4)
L> VCC - 0.2V
COM S 105 190 105 190 95 180 90 170
L 0.2 5 0.2 5 0.2 5 0.2 5
(2)
Max. Typ.
(1)
(VCC = 5.0V ± 10%)
(2)
Max. Typ.
(2)
Max. Typ.
(2)
Max. Unit
I
SB4 Full Standby CurrentCE"A" < 0.2 and MIL S 90 225 85 200 mA
(One Port — All CMOS Level Inputs) V V
CE
"B" > VCC - 0.2V
R =
SEM
SEM
IN > VCC - 0.2V or COM S 100 170 100 170 90 155 85 145 IN < 0.2V, Active Port L 100 140 100 140 90 130 85 120
(5)
L> VCC - 0.2V
L 90 200 85 170
Outputs Open,
(3)
f = f
NOTES: 2740 tbl 09
1. "X" in part numbers indicates power rating (S or L).
2. V
CC = 5V, TA = +25°C, and are not production tested. ICC DC = 120mA (typ.)
3. At f = f
4. f = 0 means no address or control lines change.
5. Port "A" may be either left or right port. Port "B" is the opposite from port "A".
MAX, address and I/O'S are cycling at the maximum frequency read cycle of 1/ tRC, and using “AC Test Conditions” of input levels of GND to 3V.
MAX
6.15 5
IDT7024S/L HIGH-SPEED 4K x 16 DUAL-PORT STATIC RAM MILITARY AND COMMERCIAL TEMPERATURE RANGES
DC ELECTRICAL CHARACTERISTICS OVER THE OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE
Test Mil. Only
Symbol Parameter Condition Version Typ.
CC Dynamic Operating
I
Current (Both Ports Active) f = f
SB1 Standby Current
I
(Both Ports — TTL Level Inputs) f = f
SB2 Standby Current
I
(One Port — TTL Active Port Outputs Open L 85 160 85 160 80 160 Level Inputs) f = f
I
SB3 Full Standby Current Both Ports CEL and MIL. S 1.0 30 1.0 30 1.0 30 mA
(Both Ports — All CMOS Level Inputs) V
SB4 Full Standby Current
I
(One Port — All CMOS Level Inputs)
NOTES: 2740 tbl 10
1. "X" in part numbers indicates power rating (S or L).
CC = 5V, TA = +25°C, and are not production tested. ICCDC = 120mA (typ.)
2. V
3. At f = f
4. f = 0 means no address or control lines change.
5. Port "A" may be either left or right port. Port "B" is the opposite from port "A".
MAX, address and I/O'S are cycling at the maximum frequency read cycleof 1/tRC, and using “AC Test Conditions”of input levels of GND to 3V.
CE
= VIL, Outputs Open MIL. S 150 300 150 300 140 300 mA
SEM
= V
IH L 150 250 150 250 140 250
(3)
MAX
COM’L. S 150 250 150 250
L 150 210 150 210
CE
L = CER = VIH MIL. S 13 80 13 80 10 80 mA
SEM
R =
SEM
L = VIH L13 65 13651065
(3)
MAX
COM’L. S 13 60 13 60
L13 50 13 50 — —
(4)
(5)
(5)
MIL. S 85 190 85 190 80 190 mA
COM’L. S 85 155 85 155
L 0.2 5 0.2 5
L 80 150 80 150 75 150
CE
"A"=VIL and CE"B"=VIH
(3)
MAX
R =
SEM
SEM
CE
R > VCC - 0.2V L 0.2 10 0.2 10 0.2 10
IN > VCC - 0.2V or COM’L. S 1.0 15 1.0 15
V
IN < 0.2V, f = 0
SEM
R =
CE
"A" < 0.2 and MIL. S 80 175 80 175 75 175 mA
CE
"B" > VCC - 0.2V
R =
SEM
V
IN > VCC - 0.2V or COM’L. S 80 135 80 135 IN < 0.2V, L 80 110 80 110
V
L = VIH L 85 130 85 130
SEM
L > VCC - 0.2V
SEM
L > VCC - 0.2V
Active Port Outputs Open,
(3)
f = f
MAX
(1)
(Cont.) (VCC = 5.0V ± 10%)
7024X35 7024X55 7024X70
(2)
Max. Typ.
(2)
Max. Typ.
(2)
Max. Unit
DATA RETENTION CHARACTERISTICS OVER ALL TEMPERATURE RANGES (L Version Only)
(VLC = 0.2V, VHC = VCC - 0.2V)
Symbol Parameter Test Condition Min. Typ.
DR VCC for Data Retention VCC = 2V 2.0 V
V
CCDR Data Retention Current
I
(3)
CDR
t
(3)
R
t
NOTES: 2740 tbl 11
1. TA = +25°C, VCC = 2V, and are by characterization but are not production tested.
2. t
RC = Read Cycle Time
3. This parameter is guaranteed by device characterization but are not production tested.
. At Vcc < 2.0V, input leakages are not defined.
4
Chip Deselect to Data Retention Time Operation Recovery Time tRC
(4)
(1)
Max. Unit
CE
> VHC MIL. 100 4000 µA
IN > VHC or < VLC COM’L. 100 1500
V
SEM
> VHC 0——ns
(2)
——ns
DATA RETENTION WAVEFORM
DATA RETENTION MODE
V
V
CC
CE
V
t
CDR
IH
4.5V
DR
2V
V
DR
6.15 6
4.5V t
R
V
IH
2740 drw 05
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