Integrated Device Technology Inc IDT70121L25J, IDT70121L35J, IDT70121L45J, IDT70121L55J, IDT70121S25J Datasheet

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Integrated Device Technology, Inc.
HIGH-SPEED 2K x 9 DUAL-PORT STATIC RAM WITH BUSY & INTERRUPT
IDT70121S/L IDT70125S/L
FEATURES:
• High-speed access – Commercial: 25/35/45/55ns (max.)
Active: 500mW (typ.) Standby: 5mW (typ.)
– IDT70121/70125L
Active: 500mW (typ.) Standby: 1mW (typ.)
• Fully asychronous operation from either port
• MASTER IDT70121 easily expands data bus width to 18 bits or more using SLAVE IDT70125 chip
• On-chip port arbitration logic (IDT70121 only)
BUSY
output flag on Master;
INT
flag for port-to-port communication
BUSY
input on Slave
• Battery backup operation—2V data retention
• TTL-compatible, signal 5V (±10%) power supply
• Available in 52-pin PLCC
• Industrial temperature range (–40°C to +85°C) is avail­able, tested to military electrical specifications
FUNCTIONAL BLOCK DIAGRAM
OE
L
CE
L
R/
W
L
DESCRIPTION:
The IDT70121/IDT70125 are high-speed 2K x 9 Dual-Port Static RAMs. The IDT70121 is designed to be used as a stand-alone 9-bit Dual-Port RAM or as a “MASTER” Dual-Port RAM together with the IDT70125 “SLAVE” Dual-Port in 18­bit-or-more word width systems. Using the IDT MASTER/ SLAVE Dual-Port RAM approach in 18-bit-or-wider memory system applications results in full-speed, error-free operation without the need for additional discrete logic.
Both devices provide two independent ports with separate control, address, and I/O pins that permit independent, asyn­chronous access for reads or writes to any location in memory. An automatic power-down feature, controlled by CE, permits the on-chip circuitry of each port to enter a very low standby power mode.
The IDT70121/IDT70125 utilizes a 9-bit wide data path to allow for Data/Control and parity bits at the user’s option. This feature is especially useful in data communications applications where it is necessary to use a parity bit for transmission/reception error checking.
OE
R
CE
R
R/
W
R
I/O0L- I/O
NOTES:
1. 70121 (MASTER):
BUSY
is non-tri­stated push-pull output. 70125 (SLAVE):
BUSY
2.
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
is input.
INT
is totem-pole
output.
8L
(1,2) (1,2)
BUSY
L
A
INT
10L
A
0L
(2)
L
Address Decoder
CE OE
R/
W
L L L
I/O
Control
MEMORY
ARRAY
11
ARBITRATION
INTERRUPT
SEMAPHORE
LOGIC
I/O
Control
Address Decoder
11
CE
R
OE
R
R/
W
R
2654 drw 01
I/O0R-I/O
BUSY
A
11R
A
0R
INT
R
8R
R
(2)
COMMERCIAL TEMPERATURE RANGE OCTOBER 1996
©1996 Integrated Device Technology, Inc. DSC-2654/4
For latest information contact IDT’s web site at www.idt.com or fax-on-demand at 408-492-8391.
6.10
1
IDT 70121/70125S/L HIGH-SPEED 2K x 9 DUAL-PORT STATIC RAM WITH BUSY & INTERRUPT COMMERCIAL TEMPERATURE RANGE
DESCRIPTION (Cont'd):
Fabricated using IDT’s CMOS high-performance
technology, these devices typically operate on only 500mW of power. Low-power (L) versions offer battery backup data
PIN CONFIGURATIONS
NDEX
A
1L
A
2L
A
3L
A
4L
A
5L
A
6L
A
7L
A
8L
A
9L
I/O
0L
I/O
1L
I/O
2L
I/O
3L
NOTES:
1. All Vcc pins must be connected to the power supply.
2. All GND pins must be connected to the ground supply.
3. This text does not indicate the orientation of the actual part-marking.
L
0L
10L
OE
A
A
7
6
8 9 10 11 12 13 14 15 16 17 18 19 20
5
2122232425262728293031
4L
6L
5L
I/O
I/O
I/O
(1,2)
L
L
L
L
W
BUSY
CE
INT
R/
3
2
4
1
IDT70121/125
J52-1
PLCC
TOP VIEW
8L
7L
0R
I/O
I/O
GND
I/O
CC
V
52
1R
I/O
R
R
R
R
W
10R
INT
CE
BUSY
A
R/
51
50
49
48
4733
46
OE
R
45
A
0R
44
A
1R
43
A
2R
42
A
3R
41
A
4R
40
A
5R
3R
I/O
4R
I/O
32
5R
I/O
39 38 37 36 35 34
6R
I/O
A A A A I/O I/O
6R 7R 8R 9R
8R 7R
2654 drw 02
(3)
2R
I/O
retention capability with each port typically consuming 200µW from a 2V battery.
The IDT70121/IDT70125 devices are packaged in a 52-pin
PLCC.
RECOMMENDED OPERATING TEMPERATURE AND SUPPLY VOLTAGE
Grade Ambient Temperature GND VCC
Commercial 0°C to +70°C 0V 5.0V ± 10%
2654 tbl 02
RECOMMENDED DC OPERATING CONDITIONS
Symbol Parameter Min. Typ. Max. Unit
V
CC Supply Voltage 4.5 5 5.5 V
GND Supply Voltage 0 0 0.0 V V
IH Input High Voltage 2.2 6.0 IL Input Low Voltage –0.5
V
(1)
0.8 V
NOTES: 2654 tbl 03
1. VIL > -1.5V for pulse width less than 10ns.
2. V
TERM must not exceed Vcc + 0.5V.
(2)
V
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol Rating Commercial Unit
(2)
V
TERM
Terminal Voltage –0.5 to +7.0 V with Respect to GND
T
A Operating 0 to +70 °C
Temperature
T
BIAS Temperature –55 to +125 °C
Under Bias
T
STG Storage –55 to +125 °C
Temperature
I
OUT DC Output 50 mA
Current
NOTES: 2654 tbl 01
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliabilty.
2. V
TERM must not exceed Vcc + 0.5V for more than 25% of the cycle time or
10ns maximum, and is limited to
0.5V.
< 20mA for the period of VTERM > Vcc +
CAPACITANCE
Symbol Parameter Condition
C
IN Input Capacitance VIN = 3dV 9 pF OUT Output Capacitance VOUT = 3dV 10 pF
C
NOTES:
(1)
(TA = +25°C, f = 1.0MHz)
(2)
Max. Unit
2654 tbl 13
1. This parameter is determined by device characterization but is not production tested.
2. 3dV represents the interpolated capacitance when the input and output
signals switch from 0V to 3V or from 3V to 0V.
6.10 2
IDT 70121/70125S/L HIGH-SPEED 2K x 9 DUAL-PORT STATIC RAM WITH BUSY & INTERRUPT COMMERCIAL TEMPERATURE RANGE
DC ELECTRICAL CHARACTERISTICS OVER THE OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE
Symbol Parameter Test Condition Min. Max. Min. Max. Unit
|I
LI| Input Leakage Current
|I
LO| Output Leakage Current
VOL Output Low Voltage IOL = 4mA 0.4 0.4 V V
OH Output High Voltage IOH = –4mA 2.4 2.4 V
1. At Vcc
< 2.0V leakages are undefined.
(5)
(5)
VCC = 5.5V, VIN = 0V to VCC —10 — 5µA VCC = 5.5V, CE = VIH —10 — 5µA
OUT = 0V to VCC
V
(VCC = 5.0V ± 10%)
70121S 70121L 70125S 70125L
2654 tbl 04NOTE:
DC ELECTRICAL CHARACTERISTICS OVER THE
(1,4)
OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE
70121X25 70121X35 70121X45 70121X55
Test 70125X25 70125X35 70125X45 70125X55
Symbol Parameter Condition Version Typ. Max. Typ. Max. Typ. Max. Typ. Max. Unit
I
CC Dynamic Operating
Current (Both Ports f = f Active)
SB1 Standby Current
I
(Both Ports—TTL f = f Level Inputs)
SB2 Standby Current
I
(One Port—TTL Active Port Outputs Open, L 80 145 80 135 80 130 80 125 Level Inputs) f = f
ISB3 Full Standby
Current (Both Ports V CMOS Level Inputs) or V
ISB4 Full Standby
Current (One Port V CMOS Level Inputs) V
NOTES: 2654 tbl 05
1. “X” in part numbers indicates power rating (S or L).
2. At f = f
3. f = 0 means no address or control lines change. Applies only to inputs at CMOS level standby.
4. Vcc=5V, T
5. Port "A" may be either left or right port. Port "B" is opposite from port "A".
MAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/tRC, and using “AC TEST
CONDITIONS” of input levels of GND to 3V.
A=+25°C for Typical values, and they are not production tested.
CE
= VIL,Outputs Open, Com’l. S 125 260 125 250 125 245 125 240 mA
(2)
MAX
CE
"A" and CE"B" = VIH, Com’l. S 30 65 30 65 30 65 30 65 mA
(2)
MAX
(3)
MAX
(2)
(5)
Com’l. S 80 175 80 165 80 160 80 155 mA
(5
)
Com’l. S 70 170 70 160 70 155 70 150 mA
CE
"A"=VIL and CE"B"=VIH
(2)
MAX
CE
"A" and CE"B" VCC – 0.2V, Com’l. S 1.0 15 1.0 15 1.0 15 1.0 15 mA
IN VCC – 0.2V L 0.2 5 0.2 5 0.2 5 0.2 5
IN 0.2V, f = 0
CE
"A"<0.2V and CE"B">VCC-0.2V
IN VCC – 0.2V or L 70 140 70 130 70 125 70 120 IN 0.2V, Active Port
Outputs Open, f = f
L 125 220 125 210 125 205 125 200
L3045304530453045
(VCC = 5V ± 10%)
6.10 3
IDT 70121/70125S/L
1250
30pF775
DATA
OUT
BUSY
INT
5V
5V
1250
5pF775
DATA
OUT
2654 drw 04
HIGH-SPEED 2K x 9 DUAL-PORT STATIC RAM WITH BUSY & INTERRUPT COMMERCIAL TEMPERATURE RANGE
DATA RETENTION CHARACTERISTICS (L Version Only)
70121L/70125L
Symbol Parameter Test Condition Min. Typ.
V
DR VCC for Data Retention 2 V
I
CCDR Data Retention Current VCC = 2.0V,
(3)
CDR
t
(3)
t
R
NOTES: 2654 tbl 06
1. VCC = 2V, TA = +25°C, and are not production tested.
RC = Read Cycle Time.
2. t
3. This parameter is guaranteed by device characterization but is not production tested.
Chip Deselect to Data Retention Time VIN VCC – 0.2V or VIN 0.2V 0 ns Operation Recovery Time tRC
CE
VCC – 0.2V Com’l. 100 1500 µA
(2)
(1)
Max. Unit
——ns
DATA RETENTION WAVEFORM
DATA RETENTION MODE
Vcc
CE
V
t
CDR
IH
4.5V
V
DR
2V
V
DR
4.5V t
R
V
IH
AC TEST CONDITIONS
Input Pulse Levels GND to 3.0V Input Rise/Fall Times 5ns Input Timing Reference Levels 1.5V Output Reference Levels 1.5V Output Load Figures 1 and 2
2654 tbl 07
Figure 1. AC Output Test Load
Figure 2. Output Test Load
(For tLZ, tHZ, tWZ, tOW)
Including scope and jig.
AC ELECTRICAL CHARACTERISTICS OVER THE OPERATING TEMPERATURE AND SUPPLY VOLTAGE RANGE
Symbol Parameter Min. Max. Min. Max. Min. Max. Min. Max. Unit Read Cycle
t
RC Read Cycle Time 25 35 45 55 ns
t
AA Address Access Time 25 35 45 55 ns
t
ACE Chip Enable Access Time 25 35 45 55 ns
t
AOE Output Enable Access Time 12 25 30 35 ns
t
OH Output Hold from Address Change 0 0 0 0 ns
t
LZ Output Low-Z Time
t
HZ Output High-Z Time
t
PU Chip Enable to Power-Up Time
t
PD Chip Disable to Power-Down Time
NOTES: 2654 tbl 08
1. Transition is measured ±500mV from Low or High-impedance voltage with the Output Test Load (Figure 2).
2. This parameter guaranteed by device characterization, but is not production tested.
3. “X” in part numbers indicates power rating (S or L).
(1,2)
(1,2)
(2)
(2)
6.10 4
(3)
70121X25 70121X35 70121X45 70121X55 70125X25 70125X35 70125X45 70125X55
0—0—0—0—ns
—10—15—20—30ns
0—0—0—0—ns
—50—50—50—50ns
2654 drw 03
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