Datasheet ICS8431CM-01, ICS8431CM-01T Datasheet (ICST)

Integrated Circuit Systems, Inc.
ICS8431-01
200MHZ, LOW JITTER,
L VPECL FREQUENCY SYNTHESIZER
GENERAL DESCRIPTION
,&6
HiPerClockS™
bandwidth PLL timing channel. A 16.666MHz crystal is used as the input to the on-chip oscillator. The M is configured to produce a fixed output frequency of 200MHz.
Programmable features of the ICS8431-01 support four operational modes. The four modes are spread spectrum clocking (SSC), non-spread spectrum clock and two test modes which are controlled by the SSC_CTL[1:0] pins. Un­like other synthesizers, the ICS8431-01 can immediately change spread-spectrum operation without having to reset the device.
In SSC mode, the output clock is modulated in order to achieve a reduction in EMI. In one of the PLL bypass test modes, the PLL is disconnected as the source to the differential output allowing an external source to be connnected to the TEST_I/O pin. This is useful for in­circuit testing and allows the differential output to be driven at a lower frequency throughout the system clock tree. In the other PLL bypass mode, the oscillator divider is used as the source to both the M and the Fout divide by 2. This is useful for characterizing the oscillator and internal dividers.
The ICS8431-01 is a general purpose clock frequency synthesizer for IA64/32 application and a member of the HiPerClockS™ family of High Performance Clock Solutions from ICS. The ICS8431-01 consists of one independent low
FEATURES
Fully integrated PLL
Differential 3.3V L VPECL output
200MHz output frequency
48% to 52% duty cycle
Crystal oscillator interface
Spread Spectrum Clocking (SSC) fixed at 1/2% modulation
for environments requiring ultra low EMI. T ypical10dB EMI reduction can be achieved with spread spectrum modulation
LVTTL / L VCMOS control inputs
PLL bypass modes supporting in-circuit testing and on-chip
functional block characterization
28 lead SOIC
RMS cycle-to-cycle jitter of 2ps
Typical cycle-to-cycle jitter of 18ps
0° to 85°C ambiant operating temperature
BLOCK DIAGRAM PIN ASSIGNMENT
nc
SSC_CTL0 SSC_CTL1
ICS8431CM-01 www.icst.com/products/hiperclocks.html REV. A JUNE 5, 2001
OSC
÷ 16
PHASE
DETECTOR
÷ M
SSC
Control
Logic
PLL
VCO
÷ 2
FOUT nFOUT
TEST_I/O
1
SSC_CTL0 SSC_CTL1
TEST_I/O
1
nc
2
nc
3
nc
4
nc
5
nc
6
nc
7
nc
8
nc
9 10 11
VEE
12 13
VDD
14
ICS8431-01
28-Lead SOIC
M Package
Top View
28 27 26 25 24 23 22 21 20 19 18 17 16 15
nc VDDI XTAL2 XTAL1 nc nc VDDA VEE RESERVED nc VDDO FOUT nFOUT VEE
Integrated Circuit Systems, Inc.
TABLE 1. PIN DESCRIPTIONS
rebmuNemaNepyTnoitpircseD
,91,9-1
82,42,32
11,01 21DNGrewoP.tuptuotsetdnaerocrofnipdnuorG 31O/I_TSET
72,41DDVrewoP.tuptuotsetdnaerocrofnipylppusrewoP
51DNGrewoP.tuptuorofnipdnuorG
71,61TUOF,TUOFntuptuO
81ODDVrewoP.tuptuorofnipylppusrewoP 02DEVRESERevreseR.nipevreseR 12EEVrewoP.nipdnuorG 22ADDVrewoP.nipylppusrewopLLP
62,522LATX,1LATXtupnI.tupnirotallicsolatsyrC
72IDDVrewoP.V3.3ottcennoC.nipylppusrewoperocdnatupnI
cndesunU.snipdesunU
,0LTC_CSS
1LTC_CSS
tupnIpulluP.slevelecafretniSOMCVL/LTTVL.sniplortnocCSS
/tupnI
tuptuO
ICS8431-01
200MHZ, LOW JITTER,
L VPECL FREQUENCY SYNTHESIZER
..elbaTnoitcnuF3elbaTnidenifedsademmargorP
.rezisehtnysehtrofsrevirdtuptuoniamerastuptuolaitnereffidesehT
LCEPVLdecnereferevitisopdetanimrethtiwelbitapmocerayehT
.cigol
TABLE 2. PIN CHARACTERISTICS
lobmySretemaraPsnoitidnoCtseTmuminiMlacipyTmumixaMstinU
NICecnaticapaCniPtupnI 4Fp
PULLUPRrotsiseRpulluPtupnI 15K
NWODLLUPRrotsiseRnwodlluPtupnI 15K
TABLE 3. SSC CONTROL INPUTS FUNCTION TABLE
stupnI
1LTC_CSS0LTC_CSS
00 lanretnIdelbasiDLATXf ÷ 23 01LLPdelbanEzHM002Z-iHtnecreP½=rotcaFnoitaludoM;CSStluafeD
10 lanretxEdelbasiDklCtseTtupnI 11LLPdelbasiDzHM002Z-iHnoitaludoMCSSoN
O/I_TSET
ecruoS
CSS
,TUOF
TUOFn
.noitaziretcarahcdnagubedesuohnirofdesU:1ETON
stuptuO
LATXf ÷ 61
÷ M
sedoMlanoitarepO
O/I_TSET
1ETON.edomtsetsredivid
1ETON;edoMcitsongaiD
zHM1( klCtseT )zHM002
NdnaM,rotallicso,rotallicsO;ssapybLLP
ICS8431CM-01 www.icst.com/products/hiperclocks.html REV. A JUNE 5, 2001
2
Integrated Circuit Systems, Inc.
ICS8431-01
200MHZ, LOW JITTER,
L VPECL FREQUENCY SYNTHESIZER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage 4.6V Inputs -0.5V to VDD + 0.5V
Outputs -0.5V to VDDO + 0.5V Ambient Operating T emperature 0°C to 85°C Storage T emperature -65°C to 150°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only and functional operation of product at these condition or any conditions beyond those listed in
DC Characteristics
the periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDA = VDDI = VDDO = 3.3V±5%, TA = 0°C TO 85°C
lobmySretemaraPsnoitidnoCtseTmuminiMlacipyTmumixaMstinU
DDVegatloVylppuSrewoP 531.33.3564.3V
ODDVegatloVylppuSrewoPtuptuO 531.33.3564.3V ADDVegatloVylppuSrewoPgolanA 531.33.3564.3V IDDVegatloVylppuSrewoPtupnI 531.33.3564.3V
EEI 041Am
or
AC Characteristics
is not implied. Exposure to absolute maximum rating conditions for extended
TABLE 4B. L VCMOS / LVTTL DC CHARACTERISTICS, VDD = VDDA = VDDI = VDDO = 3.3V±5%, TA = 0°C TO 85°C
lobmySretemaraPsnoitidnoCtseTmuminiMlacipyTmumixaMstinU
,0LTC_CSS
HIVegatloVhgiHtupnI
LIVegatloVwoLtupnI
HIItnerruChgiHtupnI
LIItnerruCwoLtupnI
,1LTC_CSS
O/I_TSET
,0LTC_CSS ,1LTC_CSS
O/I_TSET
,0LTC_CSS ,1LTC_CSS
OI_TSET
,0LTC_CSS ,1LTC_CSS
OI_TSET
V531.3 DDV V564.32 3.0+DDVV
V531.3 DDV V564.33.0-8.0V
V564.3=NIV=DDV5Aµ
V0=NIV,V564.3=DDV051-Aµ
TABLE 4C. L VPECL DC CHARACTERISTICS, VDD = VDDA = VDDI = VDDO = 3.3V±5%, TA = 0°C TO 85°C
lobmySretemaraPsnoitidnoCtseTmuminiMlacipyTmumixaMstinU
HOV1ETON;egatloVhgiHtuptuO 82.1-ODDV089.0-ODDVV LOVegatloVwoLtuptuO1ETON;0.2-ODDV7.1-ODDVV
GNIWSVgniwSegatloVtuptuOkaeP-ot-kaeP006007058Vm
05htiwdetanimrettuptuO:1ETON .V2-ODDVot
ICS8431CM-01 www.icst.com/products/hiperclocks.html REV. A JUNE 5, 2001
3
Integrated Circuit Systems, Inc.
ICS8431-01
200MHZ, LOW JITTER,
L VPECL FREQUENCY SYNTHESIZER
TABLE 5. CRYST AL CHARACTERISTICS
retemaraPsnoitidnoCtseTmuminiMlacipyTmumixaMstinU
noitallicsOfoedoM latnemadnuF
ycneuqerF 666.61zHM
ecnareloTycneuqerF 05-05+mpp
ytilibatSycneuqerF 001-001+mpp
leveLevirD 001Wµ
)RSE(ecnatsiseRseireStnelaviuqE 05
ecnaiticapaCtnuhS 37Fp
ecnaiticapaCdaoL 018123Fp
ecnatcudnIniPseireS 37Hn
egnaRerutarepmeTgnitarepO 007C°
gnigAC°52@raeyreP5-5+mpp
TABLE 6. AC CHARACTERISTICS, VDD = VDDA = VDDI = VDDO = 3.3V±5%, TA = 0°C TO 85°C, 16.666MHZ CRYST AL
lobmySretemaraPsnoitidnoCtseTmuminiMlacipyTmumixaMstinU
DOIREPt2ETON;doirePtuptuOegarevAzHM002=TUOF59945005sp
t
j)cc(ti
cdo;elcyCytuDtuptuO2ETONzHM002=TUOF8425% Rt2,1ETON;emiTesiRtuptuO%08ot%02003054006sp Ft2,1ETON;emiTllaFtuptuO%08ot%02003054006sp
latxFegnaRtupnIlatsyrC41666.6181zHM
mF
fmF
derCSS;noitcudeRlartcepS2,1ETON701Bd
ELBATSttuptuOkcolCelbatSotpu-rewoP 01sm
t
j.snoitinifed56DSEJCEDEJotmrofnoccdo,Ft,Rt,)cc(ti
2,1ETON
2,1ETON
2ETON;rettiJelcyC-ot-elcyCzHM002=TUOF8103sp
;ycneuqerFnoitaludoMCSS
;rotcaFnoitaludoMCSS
.delbanegnikcolcmurtcepSdaerpS:1ETON
05htiwdetanimretstuptuO:2ETON .V2-ODDVot
0333.33zHK
4.06.0%
ICS8431CM-01 www.icst.com/products/hiperclocks.html REV. A JUNE 5, 2001
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Integrated Circuit Systems, Inc.
PARAMETER MEASUREMENT INFORMATION
ICS8431-01
200MHZ, LOW JITTER,
L VPECL FREQUENCY SYNTHESIZER
Clock Inputs and Outputs
X_CLK, 1X_FOUT
nX_CLK, n1X_FOUT
nX_CLK, n1X_FOUT
X_CLK, 1X_FOUT
80%
20%
trise tfall
FIGURE 1 — INPUT AND OUTPUT SLEW RATES
t
cycle n
t
jit(cc) = tcycle n –tcycle n+1
FIGURE 2 — CYCLE-TO-CYCLE JITTER
Pulse Width (
t
pw)
odc =
t
PERIOD
t
pw
t
PERIOD
80%
t
cycle n+1
Vswing
20%
FIGURE 3 — odc & tPERIOD
ICS8431CM-01 www.icst.com/products/hiperclocks.html REV. A JUNE 5, 2001
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Integrated Circuit Systems, Inc.
CRYSTAL INPUT AND OSCILLATOR INTERFACE
The ICS8431-01 features an internal oscillator that uses an external quartz crystal as the source of its reference frequency . A 16.666 MHz crystal divided by 16 before being sent to the phase detector provides the reference frequency. The oscillator is a series resonant, multi-vibrator type design. This design provides better stability and eliminates the need for large on chip capacitors. Though a series resonant crystal is preferred, a parallel resonant crystal can be used. A parallel resonant mode crystal used in a series resonant circuit will exhibit a frequency of oscillation a few hundred ppm lower than specified. A few hundred ppm translates to KHz inaccuracy. In general computing applications this level of inaccuracy is irrelevant. If better ppm accuracy is required, an external capacitor can be added to a parallel resonant crystal in series to pin 25.
Figure 1A
Figures 1A, 1B, and 1C show various crystal parameters which are recommended only as guidelines. Figure 1A shows how to interface a capacitor with a parallel resonant crystal. Figure 1B shows the capacitor value needed for the optimum PPM performance over various parallel resonant crystals. Figure 1C shows the recommended tuning capacitance for a
16.666MHz parallel resonant crystal.
shows how to interface with a crystal.
ICS8431-01
200MHZ, LOW JITTER,
L VPECL FREQUENCY SYNTHESIZER
ICS8431-01
XTAL2
(Pin 26, SOIC)
XTAL1
(Pin 25, SOIC)
Quartz Crystal Selection: (1) Raltron Series Resonant: AS-16.66-S-SMD-T -MI (2) Raltron Parallel Resonant: AS-16.66-18-SMD-T -MI
FIGURE 1A. CRYSTAL INTERFACE
Optional
FIGURE 1B. Recommended tuning capacitance for various parallel resonant crystals.
60
14.318
50 40 30 20 10
Series Capacitor, C1 (pF)
0
15.000
16.667
14 15 16 17 18 19 20 21 22 23 24 25
Crys t al F requency (MHz )
19.440
20.000
24.000
IGURE 1C. Recommended tuning capacitance for 16.666MHz
F
parallel resonant crystal.
100
80 60 40 20
0
0 102030405060
-20
-40
-60
Frequency Accuracy (ppm)
-80
-100
16.666MHz
Series Capacit or, C1 (pF)
ICS8431CM-01 www.icst.com/products/hiperclocks.html REV. A JUNE 5, 2001
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Integrated Circuit Systems, Inc.
SPREAD SPECTRUM
Spread-spectrum clocking is a frequency modulation tech­nique for EMI reduction. When spread-spectrum is enabled, a 30KHz triangle waveform is used with 0.5% down-spread (+0.0% / -0.5%) from the nominal 200MHz clock frequency. An example of a triangle frequency modulation profile is shown
Figure 2
in
Fnom = Nominal Clock Frequency in Spread OFF mode
Fm = Nominal Modulation Frequency (30KHz)
δ = Modulation Factor (0.5% down spread)
(1 - δ) fnom + 2 fm x δ x fnom x t when 0 < t < , (1 - δ) fnom - 2 fm x δ x fnom x t when < t <
Fnom
below. The ramp profile can be expressed as:
(200MHz with 16.666MHz IN)
1
2 fm
1
2 fm
1
fm
ICS8431-01
200MHZ, LOW JITTER,
L VPECL FREQUENCY SYNTHESIZER
The ICS8431-01 triangle modulation frequency deviation will not exceed 0.6% down-spread from the nominal clock fre­quency (+0.0% / -0.5%). An example of the amount of down spread relative to the nominal clock frequency can be seen in the frequency domain, as shown in width to the fundamental frequency is typically 0.4%, and will not exceed 0.6%. The resulting spectral reduction will be greater than 7dB, as shown in Figure 3. It is important to note the ICS8431-01 7dB minimum spectral reduction is the com­ponent-specific EMI reduction, and will not necessarily be the same as the system EMI reduction.
Figure 3.
∆ − 10 dBm
The ratio of this
(1 - δ) Fnom
0.5/fm
FIGURE 2. TRIANGLE FREQUENCY MODULATION
1/fm
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry , the power supply pins are vulnerable to random noise. The ICS8431-01 provides separate power supplies to isolate any high switching noise from the outputs to the internal PLL. VDD, VDDI, VDDA, and VDDO should be individually connected to the power supply plane through vias, and bypass capacitors should be used for each pin. To achieve optimum jitter performance, better power supply isolation is required. 10 along with a 10µF and a .01µF bypass capacitor should be connected to each power supply pin.
Figure 4
illustrates how a
B
A
δ = .4%
FIGURE 3. 200MHZ CLOCK OUTPUT IN FREQUENCY DOMAIN
(A) SPREAD-SPECTRUM OFF (B) SPREAD-SPECTRUM ON
3.3V
VDD
.01µF
VDDA
.01µF
FIGURE 4. POWER SUPPLY FILTERING
10
10 µF
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Integrated Circuit Systems, Inc.
TERMINATION FOR PECL OUTPUTS
The clock layout topology shown below is typical for IA64/32 platforms. The two different layouts mentioned are recommended only as guidelines.
FOUT and nFOUT are low impedance follower outputs that generate ECL/PECL compatible outputs. Therefore, terminat­ing resistors (DC current path to ground) or current sources must be used for functionality . These outputs are designed to
ICS8431-01
200MHZ, LOW JITTER,
L VPECL FREQUENCY SYNTHESIZER
drive 50 transmission lines. Matched impedance techniques should be used to maximize operating frequency and mini­mize signal distortion. There are a few simple termination schemes.
Figures 5A and 5B
are recommended only as guidelines. Other suitable clock lay­outs may exist and it would be recommended that the board designers simulate to guarantee compatibility across all printed circuit and clock component process variations.
show two different layouts which
Zo = 50
Zo = 50
Zo = 50
Zo = 50
5
FINFOUT
Zo = 50 Zo = 50
3.3V 5
Z
o
2
Z
o
2
FOUT FIN
RTT =
(VOH + VOL / VCC –2) –2
50
1
Z
o
FIGURE 5A. L VPECL OUTPUT TERMINATION
RTT
50
VCC-2V
Z
= 50 Zo = 50
o
3
Z
o
2
3
Z
o
2
FIGURE 5B. L VPECL OUTPUT TERMINATION
LAYOUT GUIDELINE
The schematic of the ICS8431-01 layout example used in this layout guideline is shown in PCB board layout for this example is shown in
Figure 6B.
This layout example is used as a general guideline. The layout in the actual system will depend on the selected component types, the density of the components, the density of the traces, and the stacking of the P .C. board.
U1
1
nc
2
nc
3
nc
4
nc
5
nc
6
nc
7
nc
8
nc
9
nc
10
SSC_CTL0
11
SSC_CTL1
12
VEE
13
VDD
C1
0.1uF
TEST_IO
14 15
VDD VEE
8431-01
VDDI XTAL2 XTAL1
VDDA
VEE
VDDO
FOUT
nFOUT
28
nc
27
VDD
26 25 24
nc
23
nc
22 21 20
nc
19
nc
VDD
18 17 16
C2
0.1uF
X1
VDDA
C3
0.01uF
C6
0.01uF
R5 10
C4 10uF
Zo = 50 Ohm
TL1
Zo = 50 Ohm
TL2
Figure 6A.
Termination A
VDD0
R1 125
IN+
IN-
R2 84
The ICS8431-01 recommended
Termination B (not shown in the layout)
IN+
IN-
R3 125
R4 84
R1
R2
50
50
R3 50
FIGURE 6A. RECOMMENDED SCHEMATIC LAYOUT
ICS8431CM-01 www.icst.com/products/hiperclocks.html REV. A JUNE 5, 2001
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Integrated Circuit Systems, Inc.
ICS8431-01
200MHZ, LOW JITTER,
L VPECL FREQUENCY SYNTHESIZER
The following component footprints are used in this layout example:
All the resistors and capacitors are size 0603. The Crystal X1 is Raltron Part # AS-16.666-18-SMD.
POWER AND GROUNDING
Place the decoupling capacitors C1, C2 and C3, C4, C5, C6 as close as possible to the power pins. If space allows, placing the decoupling capacitor at the component side is preferred. This can reduce unwanted inductance between the decoupling capacitor and the power pin generated by the via.
Maximize the pad size of the power (ground) at the decoupling capacitor. Maximize the number of vias between power (ground) and the pads. This can reduce the inductance between the power (ground) plane and the component power (ground) pins.
If VDDA shares the same power supply with VDD, insert the RC filter R5, C3, and C4 in between. Place this RC filter as close to the VDDA as possible.
CLOCK TRACES AND TERMINATION
The component placements, locations and orientations should be arranged to achieve the best clock signal quality . Poor clock signal quality can degrade the system performance or cause system failure. In the synchronous high-speed digital system, the clock signal is less tolerable to poor signal quality than other signals. Any ringing on the rising or falling edge or excessive ring back can cause system failure. The trace shape and the trace delay might be restricted by the available space on the board and
the component location. While routing the traces, the clock signal traces should be routed first and should be locked prior to routing other signals traces.
The traces with 50Ω transmission lines TL1 and TL2 at FOUT and nFOUT should have equal delay and run ad­jacent to each other. Avoid sharp angles on the clock trace. Sharp angle turns cause the characteristic impedance to change on the transmission lines.
Keep the clock trace on same layer. Whenever possible, avoid any vias on the clock traces. Any via on the trace can affect the trace characteristic impedance and hence degrade signal quality.
T o prevent cross talk, avoid routing other signal traces in parallel with the clock traces. If running parallel traces is unavoidable, allow more space between the clock trace and the other signal trace.
Make sure no other signal trace is routed between the clock trace pair.
The matching termination resistors R1, R2, R3 and R4 should be located as close to the receiver input pins as possible. Other termi­nation scheme can also be used but is not shown in this example.
CRYSTAL
The crystal X1 should be located as close as possible to the pins 26 (XTAL1) and 25 (XTAL2). The trace length between the X1 and U1 should be kept to a minimum to avoid unwanted parasitic inductance and capacitance. Other signal traces should not be routed near the crystal traces.
C1
U1
ICS8431-01
C6
X1
C3
FIGURE 6B. PCB BOARD LAYOUT FOR ICS8431-01
C4
R5
C2
TL1 (50 Ohm)
TL2 (50 Ohm)
Close to the input pins of the receiver
IN+
IN-
GND
VDD
Signals
VIA
R1
R2
R3
R4
ICS8431CM-01 www.icst.com/products/hiperclocks.html REV. A JUNE 5, 2001
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Integrated Circuit Systems, Inc.
PACKAGE OUTLINE - M SUFFIX
ICS8431-01
200MHZ, LOW JITTER,
L VPECL FREQUENCY SYNTHESIZER
N
1
D
A2
e
TABLE 7. PACKAGE DIMENSIONS
C
1528
H
E
14
h x 45º
A
A1
B
SEATING PLANE
.10 (.004)
L
α
LOBMYS
N82 A--56.2--401.0
1A01.0--0400.0--
2A50.255.2180.0001.0 B33.015.0310.0020.0 C81.023.0700.0310.0 D07.7104.81796.0427.0 E04.706.7192.0992.0 eCISAB72.1CISAB050.0 H00.0156.01493.0914.0 h52.057.0010.0920.0 L04.072.1610.0050.0
α
REFERENCE DOCUMENT: JEDEC PUBLICATION 95, MS-013, MO-1 19
ICS8431CM-01 www.icst.com/products/hiperclocks.html REV. A JUNE 5, 2001
NIMXAMNIMXAM
°0 °8 °0 °8
sretemilliMsehcnI
10
Integrated Circuit Systems, Inc.
TABLE 8. ORDERING INFORMATION
rebmuNredrO/traPgnikraMegakcaPtnuoCerutarepmeT
10-MC1348SCI10-MC1348SCICIOSdaeL82ebuTreP62C°58otC°0
T10-MC1348SCI10-MC1348SCIleeRdnaepaTnoCIOSdaeL820001C°58otC°0
ICS8431-01
200MHZ, LOW JITTER,
L VPECL FREQUENCY SYNTHESIZER
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical instruments.
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