els. True or inverting, single-ended to LVCMOS translation
can be achieved with a resistor bias on the nCLK or CLK
inputs, respectively. The effective fanout can be increased
from 20 to 40 by utilizing the ability of the outputs to drive two
series terminated lines.
The divide select inputs, DIV_SELx, control the output frequency of each bank. The outputs can be utilized in the ÷1,
÷2 or a combination of ÷1 and ÷2 modes. The bank enable
inputs, BANK_EN0:1, supports enabling and disabling each
bank of outputs individually. The master reset input, nMR/OE,
resets the internal frequency dividers and also controls the
enabling and disabling of all outputs simultaneously.
The ICS8702 is characterized at 3.3V and mixed 3.3V input
supply, and 2.5V output supply operating modes. Guaranteed
bank, output, multiple frequency and part-to-part skew characteristics make the ICS8702 ideal for those clock distribution applications demanding well defined performance and
repeatability.
Generator and a member of the HiPerClockS
family of High Performance Clock Solutions
from ICS. The ICS8702 is designed to translate any differential signal levels to LVCMOS lev-
FE ATURES
20 LVCMOS outputs, 7Ω typical output impedance
Output frequency up to 250 MHz
150ps bank skew, 200ps output, 250ps multiple frequency
skew, 650ps part-to-part skew
Translates any differential input signal (PECL, HSTL, LVDS)
to LVCMOS levels without external bias networks
Translates any single-ended input signal to LVCMOS levels
with a resistor bias on nCLK input
Translates any single-ended input signal to inverted LVCMOS
levels with a resistor bias on CLK input
LVCMOS / LVTTL control inputs
Bank enable logic allows unused banks to be disabled
in reduced fanout applications
3.3V or mixed 3.3V input, 2.5V output operating
supply modes
48 lead low-profile QFP (LQFP), 7mm x 7mm x 1.4mm
Inputs-0.5V to VDD + 0.5V
Outputs-0.5V to VDDO + 0.5V
Ambient Operating Temperature0°C to 70°C
Storage Temperature-65°C to 150°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress
specifications only and functional operation of product at these condition or any conditions beyond those listed in the DC ElectricalCharacteristics or AC Electrical Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may
affect product reliability.
8702www.icst.comREV. A - AUGUST 7, 2000
3
Page 4
Integrated
Circuit
Systems, Inc.
LOW SKEW¸1, ¸2
C
LOCK GENERATOR
ICS8702
TABLE 4A. DC ELECTRICAL CHARACTERISTICS, VDDI=VDDO=3.3V±5%, TA=0°C TO 70°C
FIGURE 2C- LVCMOS AND LVTTL SINGLE ENDED I NPUT LEVEL
8702www.icst.comREV. A - AUGUST 7, 2000
7
Page 8
Integrated
Circuit
Systems, Inc.
FIGURE 3A, 3B - TIMING WAVEFORMS
CLK
Vpp
nCLK
ICS8702
LOW SKEW¸1, ¸2
C
LOCK GENERATOR
nMR/OE,
BANK_ENx
BANK_ENx
Q
VDDO/2
3.3V
0V
VOH
VDDO/2
VDDO/2
tPHL
Q
tPLH
FIGURE 3 A - PROPAGATION DELAYS
fin = 200MHz, Vpp = 300mV, tr = tf = 200ps
tPHZ
VOH - 300mV
tPLZ
tPZH
tPZL
VOL
Q
VOL + 300mV
FIGURE 3B - DISABLEAND ENABLE TIMES
fin = 10MHz, Vamp = 3.3V, tr = tf = 600ps
8702www.icst.comREV. A - AUGUST 7, 2000
8
Page 9
Integrated
Circuit
Systems, Inc.
LOW SKEW¸1, ¸2
LOCK GENERATOR
C
ICS8702
FIGURE 4A, 4B- SKEW DEFINITIONS & WAVEFORMS
Bank Skew - Skew between outputs within a bank. Outputs operating at the same temperature, supply voltages and with equal
load conditions.
CLK
Vpp
nCLK
Qx0
○○○○○○○○
VDDO/2VDDO/2
tsk(b)tsk(b)
Qx4
VDDO/2VDDO/2
FIGURE 4A - BANK SKEW
fin = 200MHz, Vpp = 300mV, tr = tf = 200ps
Output Skew - Skew between outputs of any bank. Outputs operating at the same temperature, supply voltages and with equal
load conditions.
CLK
Vpp
nCLK
QA0 - QA4
VDDO/2VDDO/2
tsk(o)tsk(o)
QB0 - QB4
QC0 - QC4
QD0 - QD4
VDDO/2VDDO/2
FIGURE 4B - OUTPUT SKEW
fin = 200MHz, Vpp = 300mV, tr = tf = 200ps
8702www.icst.comREV. A - AUGUST 7, 2000
9
Page 10
Integrated
Circuit
Systems, Inc.
LOW SKEW¸1, ¸2
C
LOCK GENERATOR
ICS8702
FIGURE 4C, 4D- SKEW DEFINITIONS & WAVEFORMS
Multiple Frequency Skew - Skew between banks of outputs operating at different frequencies. Outputs operating at the same
temperature, supply voltages and with equal load conditions.
CLK
Vpp
nCLK
QA0 - QA4,
QB0 - QB4,
QC0 - QC4,
or
QD0 - QD4
in ÷1
VDDO/2VDDO/2
tsk(w)tsk(w)
VDDO/2VDDO/2
QA0 - QA4,
QB0 - QB4,
QC0 - QC4,
or
QD0 - QD4
in ÷2
FIGURE 4C - MULTIPLE FREQUENCY S KEW
fin = 200MHz, Vpp = 300mV, tr = tf = 200ps
Part to Part Skew - Skew between outputs of any bank on different parts. Outputs operating at the same temperature, supply
voltages and with equal load conditions.
CLK
Vpp
nCLK
PART 1 QA0 - QA4
PART 2 QA0 - QA4
QB0 - QB4
QC0 - QC4
QD0 - QD4
QB0 - QB4
QC0 - QC4
QD0 - QD4
VDDO/2VDDO/2
tsk(p)tsk(p)
VDDO/2VDDO/2
FIGURE 4B - OUTPUT SKEW
fin = 200MHz, Vpp = 300mV, tr = tf = 200ps
8702www.icst.comREV. A - AUGUST 7, 2000
10
Page 11
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINEAND D IMENSIONS - Y SUFFIX
NOTE 4
NOTE 4
D
D
NOTE 5, 7
NOTE 5, 7
D1
D1
NOTE 3
NOTE 3
-D-
-D-
NOTE 3
NOTE 3
-A-
-A-
e
e
N/4 TIPS
N/4 TIPS
0.20 C A-B D4X
0.20 C A-B D4X0.20 C A-B D0.20 C A-B D4X
SEE DETAIL “A”
SEE DETAIL “A”
8 PLACES
8 PLACES
11 / 13°
11 / 13°
D/2
D/2
D1/2
D1/2
NOTE 3
NOTE 3
-B-
-B-
E/2
E/2
E1/2
E1/2
A
A
NOTE 2 / / 0.10 C
NOTE 2 / / 0.10 C
-H-
-H-
-C-
-C-
SEE DETAIL “B”
SEE DETAIL “B”
ccc
ccc
ICS8702
LOW SKEW¸1, ¸2
LOCK GENERATOR
C
e / 2
e / 2
-A, B, OR -D-
-A, B, OR -D-
b
b
E
E1
E
E1
N
N
N
N
O
O
O
O
T
T
T
T
E
E
E
E
4
4
5,
5,
7
7
NOTES:
1. A LL DIMENSIONS AND TOLERA NCING CONFO RM T O ANSI
Y14.5-1982
2. DATUM PLANE -H-LOCATED AT MOLD PARTING LINE AND
COINCIDENT WITH LEAD, WHERE LEAD EXITS PLASTIC BODY
AT BOTT OM OF PARTING LINE.
3. DA TUMS A-B AND -D- TO BE DETERMINED AT CE NT ERLINE
BETWEEN LEADS WHERE LEADS EXIT PLA STIC AT DATUM
PLANE -H- .
4. TO BE DETERMINED AT SEATING PLACE -C- .
5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOL D
PROT RUSION.
6. “N” IS THE TOTAL NUMBER OF TERMINALS.
7. THESE DIMENSIONS TO BE DETEREMINED AT DATUM PL ANE
-H-.
8. PACKAGE TOP DIMENSI ONS ARE SMALLER THAN BOTTOM
DIM ENSIONS AND TOP OF PACKAGE WILL NOT OVER HANG
BOTTOM OF PACKAGE.
9. DIMENSION b DOES NOT INCL UDE DAMBAR PROTRUSION.
ALLOWABL E DAMBAR PROTRUSION SHALL BE 0.08mm TOTAL
IN EXCESS OF THE b DIMENSION AT MAXIMUM MATERIAL
CONDITION.
10. CONTROLLING DIMENSION: MILLIMETER.
11. THIS OUT LINE CONFORMS TO JE DEC PUBLIBCATION 95
REGISTRAT ION M S-026, VARIATION BBC.
12. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE
TO THE LOWEST POINT OF THE PACKAGE.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use or
for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal
commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use
in life support devices or critical medical instruments.
8702www.icst.comREV. A - AUGUST 7, 2000
12
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