Icom IC-F4GT, IC-F4GS Service manual

SERVICE MANUAL
UHF FM TRANSCEIVERS
Communication Equipment Himmelgeister Str. 100, D-40225 Düsseldorf, Germany Phone: 0211 346047 Fax : 0211 333639 URL : http://www.icomeurope.com
Unit 9, Sea St., Herne Bay, Kent, CT6 8LD, U.K. Phone: 01227 741741 Fax : 01227 741742 URL : http://www.icomuk.co.uk
Zac de la Plaine, Rue Brindejonc des Moulinais BP 5804, 31505 Toulouse Cedex, France Phone: 561 36 03 03 Fax : 561 36 03 00 URL : http://www.icom-france.com
Crta. de Gracia a Manresa Km. 14,750 08190 Sant Cugat del Valles Barcelona, SPAIN Phone: (93) 590 26 70 Fax : (93) 589 04 46 URL : http://www.icomspain.com
<
Corporate Headquarters
>
2380 116th Avenue N.E., Bellevue, WA 98004, U.S.A. Phone: (425) 454-8155 Fax : (425) 454-1509 URL : http://www.icomamerica.com
<
Customer Service
>
Phone: (425) 454-7619
A.C.N. 006 092 575 290-294 Albert Street, Brunswick, Victoria, 3056, Australia Phone: 03 9387 0666 Fax : 03 9387 0022 URL : http://www.icom.net.au
6F No. 68, Sec. 1 Cheng-Teh Road, Taipei, Taiwan, R.O.C. Phone: (02) 2559 1899 Fax : (02) 2559 1874
3071 #5 Road, Unit 9, Richmond, B.C., V6X 2T4, Canada Phone: (604) 273-7400 Fax : (604) 273-1900 URL : http://www.icomcanada.com

INTRODUCTION

DANGER
ORDERING PARTS
REPAIR NOTES
This service manual describes the latest service information for the
IC-F4GT and IC-F4GS
at the time of publication.
NEVER connect the transceiver to an AC outlet or to a DC power supply that uses more than 16 V. Such a connection could cause a fire hazard and/or electric shock.
DO NOT expose the transceiver to rain, snow or any liquids. DO NOT reverse the polarities of the power supply when con-
necting the transceiver. DO NOT apply an RF signal of more than 20 dBm (100mW)
to the antenna connector. This could damage the transceiv­er’s front end.
Be sure to include the following four points when ordering replacement parts:
1. 10-digit order numbers
2. Component part number and name
3. Equipment model name and unit name
4. Quantity required <SAMPLE ORDER>
1130007610 S.IC µPD3140GS IC-F4GT MAIN UNIT 1 pieces 8810009510 Screw BT M2 x 4 NI-ZU IC-F4GS Chassis 10 pieces
Addresses are provided on the inside back cover for your convenience.
1. Make sure a problem is internal before disassembling the transceiver.
2. DO NOT open the transceiver until the transceiver is disconnected from its power source.
3. DO NOT force any of the variable components. Turn them slowly and smoothly.
4. DO NOT short any circuits or electronic parts. An insulated turning tool MUST be used for all adjustments.
5. DO NOT keep power ON for a long time when the transceiver is defective.
6. DO NOT transmit power into a signal generator or a sweep generator.
7. ALWAYS connect a 40 dB to 50 dB attenuator between the transceiver and a deviation meter or spectrum analyzer when using such test equipment.
8. READ the instructions of test equipment thoroughly before connecting equipment to the transceiver.
To upgrade quality, all electrical or mechanical parts and internal circuits are subject to change without notice or oblig­ation.
IC-F4GT IC-F4GS

TABLE OF CONTENTS

SECTION 1 SPECIFICATIONS
SECTION 2 INSIDE VIEWS
SECTION 3 DISASSEMBLY AND OPTION INSTRUCTIONS
3-1 DISASSEMBLY INSTRUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1
3-2 OPTIONAL UNIT INSTALLATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-2
SECTION 4 CIRCUIT DESCRIPTION
4-1 RECEIVER CIRCUITS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
4-2 TRANSMITTER CIRCUITS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
4-3 PLL CIRCUITS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-2
4-4 POWER SUPPLY CIRCUITS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-3
4-5 CPU PORT ALLOCATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-4
SECTION 5 ADJUSTMENT PROCEDURES
5-1 PREPARATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1
5-2 PLL ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-4
5-3 SOFTWARE ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-5
SECTION 6 PARTS LIST
SECTION 7 MECHANICAL PARTS AND DISASSEMBLY
SECTION 8 SEMI-CONDUCTOR INFORMATION
SECTION 9 BOARD LAYOUTS
SECTION 10 BC-137 OPTIONAL DESKTOP CHARGER INFORMATION
10-1 PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-1
10-2 DISASSEMBLY INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-1
10-3 VOLTAGE DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-2
10-4 BOARD LAYOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-2
SECTION 11 BLOCK DIAGRAM
SECTION 12 VOLTAGE DIAGRAM
1 - 1

SECTION 1 SPECIFICATIONS

GENERAL
• Frequency coverage : 440.000–470.000 MHz
• Type of emission : 8K50F3E
• Number of channels : 32 ch (16 channels × 2 banks: 2-BANK version), 16 ch (16 channel version)
• Power supply requirement : 7.2 V DC (negative ground; supplied battery pack)
• Current drain (approx.) : Transmit at High (4.0 W) 1.55 A at Low (1.0 W) 800 mA
Receive rated audio 250 mA
stand-by 70 mA
• Frequency stability : ±0.00025 %
• Usable temperature range : –30˚C to +60˚C; –22˚F to +140˚F
• Dimensions (projections not included) : 54(W) × 132(H) × 35(D) mm; 2
5
32(W) × 5 3⁄16(H) × 1 3⁄8(D) in.
• Weight (with ant., BP-209) : 355 g; 12.5 oz.
TRANSMITTER
• RF output power (at 7.2 V DC) : 4 W / 1 W (High / Low)
(with supplied battery pack)
• Modulation system : Variable reactance frequency modulation
• Maximum frequency deviation : ±2.5 kHz
• Spurious emissions : 73 dBc (typical)
• Adjacent channel power : 60 dB (typical)
• Transmitter audio distortion : Less than 3% at 1 kHz, 40% deviation
• Limitting charact of modulator : 70–100% of max. deviation
• Ext. microphone connector : 3-conductor 2.5(d) mm (
1
10”)/2.2 k
RECEIVER
• Receive system : Double conversion superheterodyne system
• Intermediate frequencies : 1st 46.35 MHz
2nd 450 kHz
• Sensitivity : 0.3 µV at 12 dB SINAD (typical)
• Squelch sensitivity : 0.3 µV at threshold (typical)
• Adjacent channel selectivity : 65 dB (typical)
• Spurious response rejection : 70 dB (typical)
• Intermodulation rejection ratio : 70 dB (typical)
• Hum and noise : 40 dB (typical)
• Audio output power (at 7.2 V DC) : 500 mW typical at 5% distortion with an 8 load
• Ext. speaker connector : 3-conductor 3.5(d) mm (
1
8”)/8
Specifications are measured in accordance with EIA/TIA-603.
All stated specifications are subject to change without notice or obligation.
2 - 1

SECTION 2 INSIDE VIEWS

• MAIN UNIT
Antenna switcing circuit (D1: 1SV307)
1st mixer (Q13: 3SK239A)
VCO circuit
D/A converter (IC10: M62363FP-650C)
EEPROM (IC7: HN58X2432TI)
CPU (IC8: HD6433876B34H)
Low pass filter circuit
Antenna switcing circuit (D2, D8: MA77)
Power amplifier (Q1: 2SK2974)
IF amplifier (Q14: 2SC4215 O)
PLL IC (IC1: µPD3140GS)
TX/RX switch (D3, D4: MA77)
Mic amplifier circuit
APC IC3A: NJM3403AV Q37: DTA144EU
TOP VIEW
BOTTOM VIEW
3 - 1

SECTION 3 DISASSEMBLY AND OPTION INSTRUCTIONS

3-1 DISASSEMBLY INSTRUCTION
• REMOVING THE CHASSIS PANEL
1 Unscrew 1 nut A, and remove 1 knob B. 2 Unscrew 2 screws C. 3 Take off the chassis in the direction of the arrow. 4 Unplug J6 to separate front panel and chassis.
• REMOVING THE MAIN UNIT
1 Remove the searing rubber. 2 Unsolder 3 points D, and unscrew 1 nut E. 3 Unscrew 3 screws F and 6 screws G (silver, 2 mm) to separate the chassis and the MAIN unit. 4 Take off the MAIN unit in the direction of the arrow.
(nickel, 2 mm) x 2
Front panel
Chassis
J6 (Speaker connector)
B
C
A
D
F
F
G
G
G
D
(silver, 2 mm) x 6
E
Shield cover
Guide holes
MAIN unit
Sealing rubber
Chassis
D
F
3 - 2
3-2 OPTIONAL UNIT INSTALLATIONS
1 Remove the option cover. 2 Remove the bottom protective paper of spoge. 3 Connect one of UT-96, UT-105, UT-108, UT-109, UT-110, UT-111, and UT-113 optional units to J5. 4 Replace the option cover to the chassis-hole.
SPONGE Parts name : 1556 sponge Order No. : 8930013545
Option cover
Optional unit
J5
4 - 1

SECTION 4 CIRCUIT DESCRIPTION

4-1 RECEIVER CIRCUITS
4-1-1 ANTENNA SWITCHING CIRCUIT
The antenna switching circuit functions as a low-pass filter while receiving. However, its impedance becomes very high while D2 and D8 are turned ON. Thus transmit signals are blocked from entering the receiver circuits. The antenna switching circuit employs a λ⁄4 type diode switching system.
Received signals are passed through the low-pass filter (L1, L2, C3, C8, C666). The filtered signals are applied to the λ⁄4 type antenna switching circuit (D2, D8). The passed signals are then applied to the RF amplifier cir­cuit.
4-1-2 RF CIRCUIT
The RF circuit amplifies signals within the range of frequen­cy coverage and filters out-of-band signals.
The signals from the antenna switching circuit are amplified at the RF amplifier (Q12) after passing through the tunable bandpass filter (L17, D10, C85, C86). The amplified signals are applied to the 1st mixer circuit (Q13) after out-of-band signals are suppressed at the 3 stages tunable bandpass fil­ter (D401, L18, C89, C406, D11, L402, C91, C92, C94, D12, L19, C97, C98).
Varactor diodes are employed at the bandpass filters that track the filters and are controlled by the CPU (IC8) via the expander IC (IC10) using T1–T4 signals. These diodes tune the centre frequency of an RF passband for wide bandwidth receiving and good image response rejection.
4-1-3 1ST MIXER AND 1ST IF CIRCUITS
The 1st mixer circuit converts the received signal into a fixed frequency of the 1st IF signal with a PLL output frequency. By changing the PLL frequency, only the desired frequency will pass through a crystal filter at the next stage of the 1st mixer.
The signals from the RF circuit are mixed at the 1st mixer (Q13) with a 1st LO signal coming from the VCO circuit to produce a 46.35 MHz 1st IF signal.
The 1st IF signal is applied to a pair of crystal filters (FI1) to suppress out-of-band signals. The filtered 1st IF signal is applied to the IF amplifier (Q14), then applied to the 2nd mixer circuit (IC2, pin 16).
4-1-4 2ND IF AND DEMODULATOR CIRCUITS
The 2nd mixer circuit converts the 1st IF signal into a 2nd IF signal. Adouble conversion superheterodyne system (which converts receive signals twice) improves the image rejection ratio and obtains stable receiver gain.
The 1st IF signal from the IF amplifier is applied to the 2nd mixer section of the FM IF IC (IC2, pin 16), and is mixed with the 2nd LO signal to be converted into a 450 kHz 2nd IF sig­nal.
The FM IF IC contains the 2nd mixer, limiter amplifier, quad­rature detector and active filter circuits. A 2nd LO signal (45.9 MHz) is produced at the PLL circuit by tripling it’s ref­erence frequency.
The 2nd IF signal from the 2nd mixer (IC2, pin 3) passes through a ceramic filter (FI2) to remove unwanted hetero­dyned frequencies. It is then amplified at the limiter amplifi­er (IC2, pin 5) and applied to the quadrature detector (IC2, pins 10, 11) to demodulate the 2nd IF signal into AF signals.
• 2ND IF AND DEMODULATOR CIRCUITS
Mixer
16
Limiter amp.
2nd IF filter 450 kHz
PLL IC
IC1
X4
15.3 MHz
IC2 TA31136F
12
1st IF from the IF amplifier (Q14)
"SD" signal to the CPU pin 98
11109
87 5 3
AF signal "DET"
R5
X3
R86
C122
C121
R88R87
R83
"SQLIN" signal to the D/A convertor (IC10, pin 23)
R82
C112 C113
C116
2
17 16
Active filter
FI2
Noise
detector
FM
detector
13
"NOIS" signal to the CPU pin 19
RSSI
Noise comp.
×3
R84
4 - 2
4-1-5 AF CIRCUIT
AF signals from the FM IF IC (IC2, pin 9) are applied to the mute switch (IC4, pin 1) via the AF filter circuit (IC3b, pins 6,
7). The output signals from pin 11 are applied to the AF power amplifier (IC5, pin 4) after being passed through the [VOL] control (R143).
The applied AF signals are amplified at the AF power ampli­fier circuit (IC5, pin 4) to obtain the specified audio level. The amplified AF signals, output from pin 10, are applied to the internal speaker (SP1) as the “SP” signal via the [SP] jack when no plug is connected to the jack.
4-1-6 SQUELCH CIRCUIT
Asquelch circuit cuts out AF signals when no RF signals are received. By detecting noise components in the AF signals, the squelch switches the AF mute switch.
Aportion of the AF signals from the FM IF IC (IC2, pin 9) are applied to the active filter section (IC2, pin 8) where noise components are amplified and detected with an internal noise detector.
The active filter section amplifies noise components. The fil­tered signals are rectified at the noise detector section and converted into “NOIS” (pulse type) signals at the noise com­parator section. The “NOIS” signal is applied to the CPU (IC8, pin 19).
The CPU detects the receiving signal strength from the number of the pulses, and outputs an “RMUT” signal from pin 49. This signal controls the mute switch (IC4, pin 13) to cut the AF signal line.
4-2 TRANSMITTER CIRCUITS
4-2-1 MICROPHONE AMPLIFIER CIRCUIT
The microphone amplifier circuit amplifies audio signals with +6 dB/octave pre-emphasis characteristics from the micro­phone to a level needed for the modulation circuit.
The AF signals from the microphone are applied to the microphone amplifier circuit (IC3c, pin 10). The amplified AF signals are passed through the low-pass filter circuit (IC3d, pins 13, 14) via the mute switch (IC4, pins 4, 3). The filtered AF signals are applied to the modulator circuit after being passed through the mute switch (IC4, pins 9, 8).
4-2-2 MODULATION CIRCUIT
The modulation circuit modulates the VCO oscillating signal (RF signal) using the microphone audio signal.
The audio signals change the reactance of a diode (D404) to modulate an oscillated signal at the VCO circuit (Q7, Q8). The oscillated signal is amplified at the buffer-amplifiers (Q4, Q6), then applied to the T/R switching circuit (D3, D4).
4-2-3 DRIVE/POWER AMPLIFIER CIRCUITS
The signal from the VCO circuit passes through the T/R switching circuit (D3) and is amplified at the buffer (Q403, Q3), pre-drive (Q2) and power amplifier (Q1) to obtain 4 W of RF power (at 7.2 V DC). The amplified signal passes through the antenna switching circuit (D1), and low-pass fil­ter and is then applied to the antenna connector.
The bias current of the pre-drive (Q2) and the power ampli­fier (Q1) is controlled by the APC circuit.
4-2-5 APC CIRCUIT
The APC circuit (IC3a, Q37) protects the drive and the power amplifiers from excessive current drive, and selects HIGH or LOW output power.
The signal output from the power detector circuit (D32, D33) is applied to the differential amplifier (IC3a, pin 2), and the “T4” signal from the expander (IC10, pin 11), controlled by the CPU (IC8), is applied to the other input for reference.
• APC CIRCUIT
Q1 Power amp.
Q2 Driver amp.
IC3a
+
VCC
RF signal from PLL
to antenna
T4
TXC
Q37
S5
APC control circuit
Power detector circuit (D32, D33)
D33 D32
L4
LPF
4 - 3
When the driving current is increased, input voltage of the differential amplifier (pin 2) will be increased. In such cases, the differential amplifier output voltage (pin 1) is decreased to reduce the driving current.
4-3 PLL CIRCUIT
A PLL circuit provides stable oscillation of the transmit fre­quency and receive 1st LO frequency. The PLL output com­pares the phase of the divided VCO frequency to the refer­ence frequency. The PLL output frequency is controlled by the divided ratio (N-data) of a programmable divider.
The PLL circuit contains the VCO circuit (Q7, Q8). The oscil­lated signal is amplified at the buffer-amplifiers (Q6, Q5) and then applied to the PLL IC (IC1, pin 2).
The PLL IC contains a prescaler, programmable counter, programmable divider and phase detector, etc. The entered signal is divided at the prescaler and programmable counter section by the N-data ratio from the CPU. The divided signal is detected on phase at the phase detector using the refer­ence frequency.
If the oscillated signal drifts, its phase changes from that of the reference frequency, causing a lock voltage change to compensate for the drift in the oscillated frequency.
A portion of the VCO signal is amplified at the buffer-ampli­fier (Q4), and is then applied to the receive 1st mixer (Q13) or transmit buffer-amplifier circuit (Q403) via the T/R switch­ing diode (D3, D4).
4-4 POWER SUPPLY CIRCUITS
VOLTAGE LINE
• PLL CIRCUIT
Shift register
3
Prescaler
Phase detector
Loop
filter
Programmable counter
Programmable divider
X4
15.3 MHz
45.9 MHz signal to the FM IF IC
"DEV" signal from the D/A convertor (IC10, pin 22) when transmitting
16
Q7, Q8
VCO circuit
Buffer Q6
Buffer Q4
Buffer Q5
3 4 5
PLST SCK SO
to transmitter circuit to 1st mixer circuit
D4
D3
17
8
2
LINE
HV
VCC
CPU5
T5
R5
S5
OPT
DESCRIPTION
The voltage from the attached battery pack. The same voltage as the HV line (battery volt-
age) which is controlled by the power swtich ([VOL] control).
Common 5 V converted from the VCC line by the reference regulator circuit (IC6). The output volt­age is applied to the CPU (IC8), the 5 V regula­tor circuit (Q18, Q19), reset circuit (IC11) and etc.
5 V for transmitter circuits regulated by the T5 regulator circuit (Q22).
5 V for receiver circuits regulated by the R5 reg­ulator circuit (Q21).
Common 5 V converted from the VCC line by the S5 regulator circuit (Q18, Q19).
The same voltage as the CPU5 line for the optional HM-46L, HM-75A or HS-51 through a resistor (R132).
4 - 4
4-5 PORT ALLOCATIONS
4-5-1 CPU (IC8)
Pin
number
1 9
11
12
15
16 17
18 19
21
36–38
44–47
49
50
51
52
53
54
55
56
57
58
59
Port
name
VIN
RESET
CSIFT
SCK
DAST
CLIN
CLOUT
PLST NOIS
BUSY
OPV3–
OPV1
KR3–
KR0
RMUT
MMUT
DUSE
S5C
R5C
T5C
TXC
AFON
LIGT
ESCK
ESDA
Description
Input port for battely voltage detection. Input port for RESET signal. Outputs reference oscillator for the
CPU control signal. Outputs clock signal to the PLL IC
(IC1), EEPROM (IC7), etc.
• Outputs strobe signals to the expander IC (IC10, pin 6).
• Input port for the initial version sig­nal.
Input port for the cloning signal. Outputs the cloning signal. Outputs strobe signals to the PLL IC
(IC1, pin 3). Input port for noise signals (pulse
type). Outputs BUSY detection.
Low: The channel is busy.
Input ports for the optional unit detec­tion signal from J5.
Output ports for key matrix.
Low: When the key is pushed.
• Outputs RX mute control signal.
• Input port for the RX mute signal from optional units.
• Output TX mute control signal.
• Input port for the TX mute signal from optional units.
Outputs low-pass filter cut-off frequen­cy control signal when DTCS is acti­vated.
Outputs S5 regulator control signal.
Low: While power is ON.
Outputs R5 regulator control signal.
Low: While receiving.
Outputs T5 regulator control signal.
Low: While transmitting.
Outputs APC circuit control signal.
High: While transmitting.
Outputs control signal for the regulator circuit of AF power amplifier.
High: When squelch is open, etc.
Outputs LCD backlight control signal.
High: Lights ON.
Outputs EEPROM (IC7, pin 6) clock signal.
I/O port for data signals from/to EEP­ROM (IC7, pin 5)
Pin
number
63
90
91
94
95
96
97 98
99
100
Port
name
UNLK
MTONE
DTMF
CTCIN
PTT
BDET
REM0
SD
LVIN
TEMP
Description
Input port for unlock signal.
High:PLL is unlocked.
Output port for: Beep audio while receiving. 2/5-tone signals while transmitting.
Outputs DTMF tone signal while trans­mitting.
CTCSS/DTCS signals input port for decording.
Input port for the [PTT] switch.
High:While [PTT] switch is pushed.
Input port for the battery’s type detec­tion.
Input port for the remote-control signal from external MIC (HM-75).
Input port for the RSSI detection. Input port for the PLL lock voltage. Input port for the transceiver’s internal
temperature detection.
4-5-2 OUTPUT EXPANDER IC (IC10)
Pin
number
2, 3,
10, 11
6
7
Port
name
T1–T4
DAST
SCK
Description
Output tunable bandpass filter control signals.
Input port for strobe signal from the CPU (IC8, pin 15).
Input port for clock signal from the CPU (IC8, pin 12).
CPU (IC8)–continued
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