IBM C1C 1.12, C4C 4.51, C1B 1.12, C4B 4.51, SSA User Manual

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OEM FUNCTIONAL SPECIFICATION

ULTRASTAR XP (DFHC) S S A MODELS

1.12/2.25 GB - 1.0" HIGH

4.51 GB - 1.6" HIGH

3. 5 FORM FACTOR DISK DRIVE VERSION 5.0

August 15, 1995

Publication number 3304

IBM Corporation

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Preface

This document details the product hardware specification for the Ultrastar XP SSA family of Direct Access Storage Devices. The capacity model offerings are 1.12, 2.25, and 4.51 GBytes (see 2.1.1, “Capacity Equations” o n page 13 for exact capacities based on model and block size). The form factor offerings ar e 'Brick On Sled' carrier a n d 3.5-inch small form factor (refer to 4.1.1, “Weight and Dimensions” on page 51 for exact dimensions).

This document, in conjunction with the Ultrastar XP (DFHC) SS A Models Interface Specification, make up the Functional Specification for t h e Ultrastar X P SSA (DFHC) product.

The product description a nd other data found in this document represent IBM's design objectives an d is provided for information and comparative purposes. Actual results may vary based on a variety of factors and the information herein is subject to change. T H IS PRODUCT DATA DOES NO T CONSTITUTE A WARRANTY, EXPRESS O R IMPLIED. Questions regarding IBM's warranty terms or the methodology used t o derive the data should be referred to your IB M customer representative.

Note: Not all mod els described in this document are in plan. Contact your IB M customer representative for actual product plans.

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Contents

1.0 Description .................................................... 9

1.1 Features ...................................................... 9

1.1.1 General Features .............................................. 9

1.1.2 Performance Summary .......................................... 9

1.1.3 Interface Controller Features ....................................... 9

1.1.4 Reliability Fea tu r es ...........................................

1.2 Models

..................................................... 10

2.0 Specifications .................................................. 11

2.1 General ..................................................... 11

2.1.1 Capacity Equations ........................................... 13

2.2 Power Requirements by Model ....................................... 15

2.2.1 C1x Models ................................................ 15

2.2.2 C2x Models ................................................ 21

2.2.3 C4x Models ................................................ 27

2.2.4 CxB Models ............................................... 33

2.2.5 Power Supply Ripple .......................................... 34

2.2.6 Grounding Requirements of the Disk Enclosure ........................... 34

2.2.7 Hot plug/unplug support ........................................ 34

2.2.8 Bring-up Sequence (and Stop) Times ................................. 36

3.0 Performance .................................................. 39

3.1 Environment Definition ........................................... 39

3.2 Workload Definition ............................................. 39

3.2.1 Sequential ................................................. 40

3.2.2 Random .................................................. 40

3.3 Command Execution Time ......................................... 40

3.3.1 Basic Component Descriptions ..................................... 40

3.3.2 Comments ................................................ 42

3.4 Approximating Performance for Different Environments ......................... 43

3.4.1 For Different Transfer Sizes ....................................... 44

3.4.2 When Read Caching is Enabled .................................... 44

3.4.3 When Write Caching is Enabled .................................... 44

3.4.4 When Adaptive Caching is Enabled .................................. 44

3.4.5 When Read-ahead is Enabled ...................................... 44

3.4.6 When N o Seek is Required ....................................... 45

3.4.7 For Queued Com mands ......................................... 45

3.4.8 Out of Order Transfers ......................................... 45

3.5 Skew ...................................................... 46

3.5.1 Cylinder to Cylinder Skew ....................................... 46

3.5.2 Track to Track Skew .......................................... 46

3.6 Idle Time Functions ............................................. 47

3.6.1 Servo R un Out Measurements ..................................... 48

3.6.2 Servo Bias Measurements ........................................ 48

3.6.3 Predictive Failure Analysis ....................................... 48

3.6.4 Channel Calibration ........................................... 48

3.6.5 Save Logs and Pointers ......................................... 49

3.6.6 Disk Sweep ................................................ 49

3.6.7 Summary ................................................. 49

3.7 Command Timeout Limits .......................................... 49

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4.0 Mechanical ................................................... 51

4.1 Small Form Factor Models (CxC) ..................................... 51

4.1.1 Weight and Dimensions ......................................... 51

4.1.2 Clearances ................................................. 51

4.1.3 Mounting ................................................. 51

4.1.4 Unitized Connector Locations ..................................... 55

4.2 Carrier Models (CxB) ............................................. 57

4.2.1 Weight and Dimensions ......................................... 57

4.2.2 Clearances ................................................. 57

4.2.3 Mounting ................................................. 57

4.2.4 Auto-docking Assembly Side Rails .................................. 60

4.2.5 Electrical Connector and Indicator Locations ............................ 62

5.0 Electrical Interface .............................................. 63

5.1 SSA Unitized Connector ........................................... 63

5.2 Carrier Connector ............................................... 64

5.3 SSA Link Cable ................................................ 66

5.4 SSA Link Electrical Characteristics ..................................... 66

5.5 Option Pins and Indicators .......................................... 66

5.5.1 - Manufacturing Test Mode (Option Port Pin 1) .......................... 66

5.5.2 - Auto Start P i n (Option Port Pin 2) ................................. 66

5.5.3 - Sync Pi n (Option Port Pin 3) ..................................... 66

5.5.4 - Write Protect (Option Port Pin 4) .................................. 67

5.5.5 - Ground long (Option Port Pin 5) .................................. 67

5.5.6 - Device Activity Pin/Indicator (Option Port Pin 6) ......................... 67

5.5.7 + 5V (Option Port Pin 7) ....................................... 67

5.5.8 - Device Fault Pin/Indicator (Option Port Pin 8) .......................... 67

5.5.9 Programmable pin 1 (Option Port Pin 9) ............................... 68

5.5.10 Programmable pin 2 (Option Port Pin 10) ............................. 68

5.5.11 - Early Power Off Warning or Power Fail (Power Port Pin 11) ................. 68

5.5.12 12V Charge and 5V Charge (Power Port pin 1 and 2) ....................... 68

5.6 Front Jumper Connector ........................................... 68

5.7 Spindle Synchronization ........................................... 69

5.7.1 Synchronization overview ........................................ 69

5.7.2 Synchronization Mode ......................................... 69

5.7.3 Synchronization time .......................................... 69

5.7.4 Synchronization with Offset ...................................... 69

5.7.5 Synchronization Route ......................................... 69

6.0 Reliability .................................................... 73

6.1 Error Detection ................................................ 73

6.2 Data Reliability ................................................ 73

6.3 Seek Error Rate ................................................ 73

6.4 Power On Hours Examples: ........................................ 73

6.5 Power on/off cycles .............................................. 74

6.6 Useful Life ................................................... 74

6.7 *Mean Time Between Failure (*MTBF) .................................. 75

6.7.1 Sample Failure Rate Projections .................................... 75

6.8 SPQL (Shipped product quality level) ................................... 75

6.9 Install Defect Free ............................................... 75

6.10 Periodic Maintenance ............................................ 76

6.11 ES D Protection ............................................... 76

6.12 Connector Insertion Cycles ......................................... 76

7.0 Operating Limits ............................................... 77

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7.1 Environmental ................................................. 77

7.1.1 Temperature Measurement Points ................................... 77

7.2 Vibration and Shock ............................................. 79

7.2.1 Drive Mounting Guidelines ....................................... 80

7.2.2 Output Vibration Limits ........................................ 80

7.2.3 Operating Vibration ........................................... 80

7.2.4 Operating Shock ............................................. 82

7.2.5 Nonoperating Shock ........................................... 82

7.3 Contaminants ................................................. 82

7.4 Acoustic Levels ................................................ 83

8.0 Standards .................................................... 85

8.1 Safety ...................................................... 85

8.2 Electromagnetic Compatibility (EMC) ................................... 85

Bibliography ..................................................... 87

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1.0 Description

1.1 Features

1.1.1 General Features

1.12/2.25/4.51 gigabytes formatted capacity (512 bytes/sector) Serial Storage Architecture (SSA) attachment (dual port) Brick On Sled carrier and 3.5" small form factor mod els Rotary voice coil motor actuator Closed-loop digital actuator servo (embedded sector servo) Magnetoresistive (MR) heads (0,8,6,infinity) 8/ 9 rate encoding Partial Response Maximum Likelihood (PRML) data channel with digital filter All mounting orientations supported Jumperable au to spindle motor start Jumperable write protection Spindle synchronization Two LED drivers Bezel (optional)

1.1.2 Performance Summary

Average read seek time (1.12 GB): 6.9 milliseconds Average read seek time (2.25 GB): 7.5 milliseconds Average read seek time (4.51GB): 8.0 milliseconds Average Latency: 4.17 milliseconds Split read/write control Media data transfer rate: 9.59 to 12.58 MegaBytes/second (10 bands) SSA data transfer rate: 20 Megabytes/second

1.1.3 Interface Controller Features

Multiple initiator support Supports blocksizes from 256 to 5952 bytes 512K byte, multi-segmented, dual port data buffer Read-ahead caching Adaptive caching algorithms Write Cache supported (write back & write thru) Tagged command queuing Command reordering Back-to-back writes (merged writes) Split reads and writes Nearly co ntig uou s read/write Link error recovery procedure exit Disable registration Duplicate tags Two byt e ULP message codes SCSI response Move data transfer messages Multiple ULP's Automatic retry and d at a correction on read errors

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Automatic sector reallocation In-line alternate sector assignment for high-performance Improved technique for down-loadable SSA firmware

1.1.4 Reliability Features

Self-diagnostics on power up Dedicated head landing zone Automatic actuator latch Embedded Sector Servo for improving on-track positioning capability Buffer memory parity Longitudinal Redundancy Check (LRC) on Customer Data ECC on the fly Error logging and analysis Data Recovery Procedures (DRP) Predictive Failure Analysis  (PFA &tm) No preventative maintenance required Tw o Field Replaceable Units (FRU's): Electronics Card and Head Disk Assembly (HDA) Probability of n ot recovering data: 10 in 1015bits read

1.2 Models

The Ultrastar XP SSA disk drive is available in various models as shown below.

The Ultrastar XP SSA d at a storage capacities vary as a function of model and user block size. The emerging industry trend is capacity poi nt s in multiples of 1.08GB (i.e. 1.08/2.16/4.32) at a block size of 512 bytes. Future IB M products will plan to provide capacities that are consistent with this trend. Users that choose t o make full use of the Ultrastar XP SSA drive capacity above the standard capacity points may n ot find equivalent capacity breakpoints in future products.

Model # Capacity GB (@512 Byte) Form Factor Connector Type

C1B 1.12 Brick O n Sled Carrier 128-pin HPC C1C 1.12 3.5-inch Small FF 38-pin Unitized C2B 2.25 Brick O n Sled carrier 128-pin HPC C2C 2.25 3.5-inch Small FF 38-pin Unitized C4B 4.51 Brick O n Sled carrier 128-pin HPC C4C 4.51 3.5-inch Small FF 38-pin Unitized

Note: CxB models (C1B, C2B, and C4B) include a DC/DC converter, activity a nd check indicators. Note: Please refer to section 2.1.1, “Capacity Equations” on page 13 fo r exact capacities based on user block size.

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2.0 Specifications

All specifications are nominal values unless otherwise noted.

The Ultrastar XP SSA data storage capacities vary as a function of model and user block size. The emerging Industry trend is capacity points in 1.08GB (i.e. 1.08/2.16/4.32) at a block size of 512 bytes. This and future products will always p l a n to provide capacities that are consistent with this trend. Users that choose t o make full use of the Ultrastar XP SSA drive capacity above the standard capacity poi n ts m a y n o t find equivalent capacity breakpoints in future products.

2.1 General

Note: Th e recording band located nearest t he disk outer diameter (OD ) is referred to as 'Notch #1'. While the recording band located nearest the inner diameter (ID) is called 'Notch #10'. 'Average' values are weighted with respect to th e number of LBAs per notch when the drive is formatted with 512 byte blocks.

Data transfer rates

Notch #1 Notch #10 Average

Buffer to/from media 12.58 9.59 12.07 MB/s (instantaneous) Host to/from buffer up to 20.0 MB/s (synchronous) (sustained)

Data Buffer Size (bytes) 512 K (See 3.0, “Performance” on page 39 for user data capacity.)

Rotational speed (RPM) 7202.7

Average latency (milliseconds) 4.17

Track Density (TPI) 4352

Minimum Maximum

Recording density (BPI) 96,567 124,970 Areal density (Megabits/square inch) 420.3 543.9

(model numbers - > ) C4x C2x C1x Disks 842 User Data Heads (trk/cyl) 16 8 4 Seek times (in milliseconds)

Single cylinder (Read) 0.5 0.5 0.5

(Write) 2.0 2.0 2.0

Average (weighted) (Read) 8.0 7.5 6.9

(Write) 9.5 9.0 8.5

Full stroke (Read) 16.5 15.0 14.0

(Write) 18.0 16.5 15.5

Note: Times are typical for a drive population under nominal voltages

and casting temperature of 25˚C. Weighted seeks a r e seeks to the cylinders of random logical block addresses (LBAs).

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Total Cylinders (tcyl) All models C4x Models C2x Models C1x Models & User Cylinders (ucyl) tcyl ucyl ucyl ucyl

Notch # 1 1893 1879 1877 1872 Notch # 2 956 955 955 955 Notch # 3 49 48 48 48 Notch # 4 310 309 309 309 Notch # 5 349 348 348 348 Notch # 6 116 115 115 115 Notch # 7 214 213 213 213 Notch # 8 190 189 189 189 Notch # 9 131 130 130 130 Notch #10 208 206 206 206

Sum of all Notches 4416 4392 4390 4385

Spares Sectors/cylinder (spr/cyl) C4x Models C2x Models C1x Models

Notch # 1 40 20 10 Notch # 2 40 20 10 Notch # 3 38 19 10 Notch # 4 37 19 9 Notch # 5 36 18 9 Notch # 6 34 17 9 Notch # 7 33 17 8 Notch # 8 32 16 8 Notch # 9 31 16 8 Notch #10 30 15 7

Last cylinder extra spares (lcspr) 60 30 14

User bytes/sector (ub/sct) 256 - 744 (even number of bytes only)

Sectors/logical block (sct/lba) 1-8

The lowest sct/lba that satisfies the following rules is used...

1. Block Length is evenly divisible by a number 2-8.

2. Quotient of previous equation is evenly divisible by 2.

3. Quotient must be ≥ 256 a nd ≤ 744.

User bytes/logical block (ub/lba) 256 - 5952 (See rules for determining sct/lba above for determining sup-

ported ub/lba values.)

Sectors/track (sct/trk) (See Table 1 o n page 13 o r contact an IB M Customer Representative

for other block lengths.)

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Notch #

User bytes /

logical block

256 216 216 216 202 195 180 180 180 180 162 512 135 135 130 126 120 115 112 108 105 100 520 128 128 128 123 115 112 108 105 102 99 522 128 128 128 122 115 112 108 105 102 90 524 128 128 128 120 115 112 108 105 102 90 528 128 128 126 120 112 112 108 105 101 90 600 115 115 115 110 102 101 97 90 90 90 688 102 102 102 98 90 90 90 90 81 78 744 96 96 96 90 90 90 81 78 77 73

1 2 3 4 5 6 7 8 9 10

Table 1. Gross sectors per track for several block lengths

C4x Models C2x Models C1x Models

User bytes / logical block

formatted

capacity

(bytes)

logical

blocks /

drive

formatted

capacity

(bytes)

logical

blocks /

drive

formatted

capacity

(bytes)

logical

blocks /

drive

256 3,654,540,800 14,275,550 1,826,312,448 7,134,033 912,135,680 3,563,030 512 4,512,701,440 8,813,870 2,255,098,368 4,404,489 1,126,337,536 2,199,878 520 4,375,536,880 8,414,494 2,186,554,760 4,204,913 1,092,119,600 2,100,230 522 4,374,300,492 8,379,886 2,185,931,898 4,187,609 1,091,803,716 2,091,578 524 4,385,878,952 8,369,998 2,191,716,460 4,182,665 1,094,691,544 2,089,106 528 4,408,629,984 8,349,678 2,203,082,640 4,172,505 1,100,365,728 2,084,026 600 4,512,402,000 7,520,670 2,254,925,400 3,758,209 1,126,282,800 1,877,138 688 4,604,578,976 6,692,702 2,300,969,904 3,344,433 1,149,310,880 1,670,510 744 4,675,830,192 6,284,718 2,336,559,528 3,140,537 1,167,099,408 1,568,682

Table 2. User capacity for several block lengths

2.1.1 Capacity Equations

2.1.1.1 For Each Notch

The next group of equations must be calculated separately for each notch.

user bytes/sector (ub/sct) =

user sectors/cyl (us/cyl) = (sct/trk)(trk/cyl) - spr/cyl

spares/notch (spr/nch) = (spr/cyl)(ucyl) Note: Add lcspr t o the equation above for the notch closest t o the inner diameter (#10).

user sectors/notch (us/nch) = (us/cyl)(ucyl)

Note: Subtract lcspr from the equation above for the notch closest to the inner diameter (#10).

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ub/lba sct/l b a

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2.1.1.2 For Entire Drive

spares/drive (spr/drv) =

notch = 1

user sectors/drive (us/drv) =

∑

notch = 1

spr/nch

∑

us/nch

logical blocks/ drive (lba/drv) = I NT

user capacity (fcap) = (lba/drv)(ub/lba)

[

us/ drv sct/l b a

]

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2. 2 Power Requirements by Model

2.2.1 C1x Models

The following voltage specifications apply at the drive power connector. There is no special power on/off sequencing required. Th e extra power needed for Brick O n Sled mod els a nd t h e +38V power option are described in 2.2.4, “CxB Models” on page 33.

Input Voltage

+ 5 Volts Supply 5V (± 5% during r un a n d spin-up) +1 2 Volts Supply 12V (± 5% during ru n) ( +5 % / -7% during spin-up)

The following current values are the combination measured values of SCSI models an d SSA Cx4 model. T he differences between SCSI and SSA is +5 V currents. Because of different interface electronics a n d speed, SSA electronics card requires more +5 V current than SCSI. Read/Write Base Line is 290 m a higher. Idle Average is 500 ma higher. (290ma an d 500ma differences were found by measuring SSA Cx4 model). SSA +5V current numbers are derived from SCSI +5 V current numbers by adding 290ma a n d 500ma accordingly.

Population Population

Power Supply Current Notes Mean Stand. Dev.

+5VDC (power-up) Minimum voltage slew rate = 4.5 V/sec +5VDC (idle avg) 1.23 Amps 0.02 Amps +5VDC (R/W baseline) 1.25 Amps

0.05 Amps

+5VDC (R/W pulse) Base-to-peak .36 Amps 0.06 Amps

+12VDC (power-up) Minimum voltage slew rate = 7.4 V/sec +12VDC (idle avg) 0.28 Amps 0.02 Amps

+12VDC (seek avg) 1 op/sec 0.0027 Amps 0.002 Amps +12VDC (seek peak) 1.20 Amps +12VDC (spin-up) 3.0 sec max 1.5 Amps

0.02 Amps

0.1 Amps

Drive power

Avg idle power 9.51 Watts .35 Watts Avg R/W power 30 ops/sec 10.58 Watts .35 Watts

See Figure 1 on page 18 for a plot of ho w the read/write baseline a n d read/write pulse s um together.

Th e idle average an d seek peek should be added together to determine the total 12 volt peak current. See Figure 2 on page 19 for a typical buildup of these currents. Refer to examples on the following page to see how to combine these values.

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2.2.1.1 Power Calculation Examples

Note: The following formulas assume all system ops as a 1 block read or write transfer from a random

cylinder while at nominal voltage condition.

Example 1. Calculate the mean 12 volt average current.

If we assume a case of 30 operations/second then to compute the sum of the 12 volt mean currents th e following is done.

mean +12VDC (idle average) 0.28 amps +12VDC (seek average) 0.027 * 30 = 0.081 amps

TOTAL 0.361 amps

Example 2. Calculate the mean plus 3 sigma 12 volt average current.

To compute the sum of the 12 volt mean current's 1 sigma value assume all the distributions are normal. Therefore the square root of the sum of the squares calculation applies. Assume a case of 30 operations/second.

sigma +12VDC (idle average) 0.02 amps +12VDC (seek average) sqrt(30*((0.0002)**2))= 0.001 amps

TOTAL sqrt((0.02)**2+(.001)**2))=0.02 amps

So the mean plus 3 sigma mean current is 0.361 + 3*0.02 = 0.42 amps

Example 3. Power Calculation.

Nominal idle drive power = (1.23 Amps * 5 Volts) + (0.28 Amps * 12 Volts) = 9.51 Watts

Nominal R/ W drive power at 30 ops/sec = (1.25 Amps * 5 Volts) + (0.361 Amps * 12 Volts) = 10.58 Watts

Mean plus 3 sigma drive power for 30 random R/W operations/second. Assume that the 5 volt a nd 12 volt distributions are independent therefore the square root of the sum of the squares applies.

+5VDC (1 sigma power) 0.05 * 5 = 0.25 watts +12VDC (1 sigma power) 0.02 * 12 = 0.24 watts

Total (1 sigma power) sqrt((0.25)**2+(0.24)**2) = 0.347 watts

Total power 9.13 + 3 * 0.347 = 10.2 watts

The current at start is the total 12 volt current required (ie. th e motor start current, module current a n d voice coil retract current). See Figure 3 o n page 20 for typical 12 volt current during spindle motor start.

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Example 4. Calculate the 12 volt peak current.

To compute the sum of the 12 volt peak currents the following is done.

mean +12VDC (idle avg) 0.28 amps +12VDC (seek peak) 1.2 amps

TOTAL 1.48 amps

Example 5. Calculate the mean plus 3 sigma 12 volt peak current.

To compute the sum of the 12 volt peak current's 1 sigma value assume all distributions are normal. Therefore the square root of the sum of the squares calculation applies.

sigma +12VDC (idle avg) 0.02 amps +12VDC (seek peak) 0.02 amps

TOTAL sqrt((0.02)**2+(0.02)**2)=0.028 amps

So the mean plus 3 sigma peak current is 1.48 + 3*0.028 = 1.56 amps

Things to check when measuring 12 V supply current:

Null the current probe frequently. Be sure to let it warm up. Adjust the power supply t o 12.00 V at the drive terminals. Use a proper window width, covering an integral number of spindle revolutions. Measure values at 25 degree C casting temperature. Get a reliable trigger for Seek Peak readings.

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Figure 1. 5 volt current during read/write operations — C1x Models

1. Read/write baseline voltage.

2. Read/write pulse. T he width of the pulse is proportional to the number of consecutive blocks read or written. The 5 volt supply must be able to provide the required current during this event.

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Figure 2. Typical 12 volt current —C1x Models

1. Maximum slew rate is 7 amps/millisecond.

2. Maximum slew rate is 100 amps/millisecond.

3. Maximum slew rate is 7 amps/millisecond.

4. Maximum slew rate is 3 amps/millisecond.

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Figure 3. Typical 12 volt spin-up current — C1x Models

1. Maximum slew rate is 20 amps/millisecond.

2. Current drops off as motor comes up t o speed.

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2.2.2 C2x Models

The following voltage specifications apply at the drive power connector. There is no special power on/off sequencing required. T h e extra power needed for Brick O n Sled models an d t he +38V power option are described in 2.2.4, “CxB Models” on page 33.

Input Voltage

+ 5 Volts Supply 5V (± 5% during r un a n d spin-up) +1 2 Volts Supply 12V (± 5% during ru n) ( +5 % / -7% during spin-up)

The following current values are the combination measured values of SCSI models an d SSA Cx4 model. T he differences between SCSI and SSA is + 5V currents. Because of different interface electronics and speed, SSA electronics card requires more +5 V current than SCSI. Read/Write Base Line is 290 m a higher. Idle Average is 500 m a higher. (290ma and 500ma differences were found by measuring SSA Cx4 model). SSA +5V current numbers are derived from SCSI + 5V current numbers by adding 290ma and 500ma accordingly.

Population Population

Power Supply Current Notes Mean Stand. Dev.

+5VDC (power-up) Minimum voltage slew rate = 4.5 V/sec +5VDC (idle avg) 1.23 Amps 0.02 Amps +5VDC (R/W baseline) 1.25 Amps

0.05 Amps

+5VDC (R/W pulse) Base-to-peak .36 Amps 0.06 Amps

+12VDC (power-up) Minimum voltage slew rate = 7.4 V/sec +12VDC (idle avg) 0.41 Amps 0.02 Amps

+12VDC (seek avg) 1 op/sec 0.0031 Amps 0.0002 Amps +12VDC (seek peak) 1.20 Amps +12VDC (spin-up) 4.2 sec max 1.5 Amps

0.02 Amps

0.1 Amps

Drive power

Avg idle power 11.07 Watts .35 Watts Avg R/W power 30 ops/sec 12.25 Watts .35 Watts

See Figure 4 on page 24 for a plot of ho w the read/write baseline a n d read/write pulse s um together.

Th e idle average a n d seek peek should be added together to determine the total 12 volt peak current. See Figure 5 on page 25 for a typical buildup of these currents. Refer to examples on the following page to see how to combine these values.

The current at start is the total 12 volt current required (ie. the motor start current, module current a nd voice coil retract current). See Figure 6 o n page 26 for typical 12 volt current during spindle motor start.

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2.2.2.1 Power Calculation Examples

Note: The following formulas assume all system ops as a 1 block read or write transfer from a random

cylinder while at nominal voltage condition.

Example 1. Calculate the mean 12 volt average current.

If we assume a case of 30 operations/second then to compute the sum of the 12 volt mean currents the following is done.

mean +12VDC (idle average) 0.41 amps +12VDC (seek average) 0.0031 * 30 = 0.09 amps

TOTAL 0.50 amps

Example 2. Calculate the mean plus 3 sigma 12 volt average current.

sigma +12VDC (idle average) 0.02 amps +12VDC (seek average) sqrt(30*((0.0002)**2))= 0.001 amps

TOTAL sqrt((0.02)**2+(.001)**2))=0.02 amps

So the mean plus 3 sigma mean current is 0.50 + 3*0.02 = 0.56 amps

Example 3. Power Calculation.

Nominal idle drive power = (1.23 Amps * 5 Volts) + (0.41 Amps * 12 Volts) = 11.07 Watts

Nominal R /W drive power at 30 ops/sec = (1.25 Amps * 5 Volts) + (0.50 Amps * 12 Volts) = 12.25 Watts

Mean plus 3 sigma drive power for 30 random R/W operations/second. Assume that the 5 volt a nd 12 volt distributions are independent therefore the square root of the sum of the squares applies.

+5VDC (1 sigma power) 0.05 * 5 = 0.25 watts +12VDC (1 sigma power) 0.02 * 12 = 0.24 watts

Total (1 sigma power) sqrt((0.25)**2+(0.24)**2) = 0.35 watts

Total power 10.8 + 3 * 0.35 = 11.9 watts

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Example 4. Calculate the 12 volt peak current.

To compute the sum of the 12 volt peak currents the following is done.

mean +12VDC (idle avg) 0.41 amps +12VDC (seek peak) 1.20 amps

TOTAL 1.61 amps

Example 5. Calculate the mean plus 3 sigma 12 volt peak current.

To compute the sum of the 12 volt peak current's 1 sigma value assume all distributions are normal. Therefore the square root of the sum of the squares calculation applies.

sigma +12VDC (idle avg) 0.03 amps +12VDC (seek peak) 0.02 amps

TOTAL sqrt((0.03)**2+(0.02)**2)=0.036 amps

So the mean plus 3 sigma peak current is 1.61 + 3*0.036= 1.72 amps

Things to check when measuring 12 V supply current:

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Figure 4. 5 volt current during read/write operations — C2x Models

1. Read/write baseline voltage.

2. Read/write pulse. T he width of the pulse is proportional to the number of consecutive blocks read or written. The 5 volt supply must be able to provide the required current during this event.

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Figure 5. Typical 12 volt current —C2x Models

1. Maximum slew rate is 7 amps/millisecond.

2. Maximum slew rate is 100 amps/millisecond.

3. Maximum slew rate is 7 amps/millisecond.

4. Maximum slew rate is 3 amps/millisecond.

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Figure 6. Typical 12 volt spin-up current — C2x Models

1. Maximum slew rate is 20 amps/millisecond.

2. Current drops off as motor comes up t o speed.

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2.2.3 C4x Models

The following voltage specifications apply at the drive power connector. There is no special power on/off sequencing required. T h e extra power needed for Brick O n Sled models an d t he +38V power option are described in 2.2.4, “CxB Models” on page 33.

Input Voltage

+ 5 Volts Supply 5V (± 5% during r un a n d spin-up) +1 2 Volts Supply 12V (± 5% during ru n) ( +5 % / -7% during spin-up)

The following current values are the combination measured values of SCSI models an d SSA Cx4 model. T he differences between SCSI and SSA is + 5V currents. Because of different interface electronics and speed, SSA electronics card requires more +5 V current than SCSI. Read/Write Base Line is 290 m a higher. Idle Average is 500 m a higher. (290ma and 500ma differences were found by measuring SSA Cx4 model). SSA +5V current numbers are derived from SCSI + 5V current numbers by adding 290ma and 500ma accordingly.

Population Population

Power Supply Current Notes Mean Stand. Dev.

+5VDC (power-up) Minimum voltage slew rate = 4.5 V/sec +5VDC (idle avg) 1.26 Amps 0.02 Amps +5VDC (R/W baseline) 1.27 Amps

0.05 Amps

+5VDC (R/W pulse) Base-to-peak .36 Amps 0.06 Amps

+12VDC (power-up) Minimum voltage slew rate = 7.4 V/sec +12VDC (idle avg) 0.77 Amps 0.03 Amps

+12VDC (seek avg) 1 op/sec 0.0036 Amps 0.0002 Amps +12VDC (seek peak) 1.3 Amps +12VDC (spin-up) 8.5 sec max 2.2 Amps

0.02 Amps

0.1 Amps

Drive power

Avg idle power 15.54 Watts .44 Watts Avg R/W power 30 ops/sec 16.91 Watts .44 Watts

See Figure 7 on page 30 for a plot of ho w the read/write baseline a n d read/write pulse s um together.

Th e idle average a n d seek peek should be added together to determine the total 12 volt peak current. See Figure 8 on page 31 for a typical buildup of these currents. Refer to examples on the following page to see how to combine these values.

The current at start is the total 12 volt current required (ie. the motor start current, module current a nd voice coil retract current). See Figure 9 o n page 32 for typical 12 volt current during spindle motor start.

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2.2.3.1 Power Calculation Examples

Note: The following formulas assume all system ops as a 1 block read or write transfer from a random

cylinder while at nominal voltage condition.

Example 1. Calculate the mean 12 volt average current.

If we assume a case of 30 operations/second then to compute the sum of the 12 volt mean currents the following is done.

mean +12VDC (idle average) 0.77 amps +12VDC (seek average) 0.0036 * 30 = 0.11 amps

TOTAL 0.88 amps

Example 2. Calculate the mean plus 3 sigma 12 volt average current.

sigma +12VDC (idle average) 0.02 amps +12VDC (seek average) sqrt(30*((0.0002)**2))= 0.001 amps

TOTAL sqrt((0.02)**2+(.001)**2))=0.02 amps

So the mean plus 3 sigma mean current is 0.88 + 3*0.02 = 0.94 amps

Example 3. Power Calculation.

Nominal idle drive power = (1.26 Amps * 5 Volts) + (0.77 Amps * 12 Volts) = 15.54 Watts

Nominal R /W drive power at 30 ops/sec = (1.27 Amps * 5 Volts) + (0.88 Amps * 12 Volts) = 16.91 Watts

Mean plus 3 sigma drive power for 30 random R/W operations/second. Assume that the 5 volt a nd 12 volt distributions are independent therefore the square root of the sum of the squares applies.

+5VDC (1 sigma power) 0.05 * 5 = 0.25 watts +12VDC (1 sigma power) 0.03 * 12 = 0.36 watts

Total (1 sigma power) sqrt((0.25)**2+(0.36)**2) = 0.44 watts

Total power 15.46 + 3 * 0.44 = 16.8 watts

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Example 4. Calculate the 12 volt peak current.

To compute the sum of the 12 volt peak currents the following is done.

mean +12VDC (idle avg) 0.77 amps +12VDC (seek peak) 1.3 amps

TOTAL 2.07 amps

Example 5. Calculate the mean plus 3 sigma 12 volt peak current.

To compute the sum of the 12 volt peak current's 1 sigma value assume all distributions are normal. Therefore the square root of the sum of the squares calculation applies.

sigma +12VDC (idle avg) 0.02 amps +12VDC (seek peak) 0.02 amps

TOTAL sqrt((0.02)**2+(0.02)**2)=0.028 amps

So the mean plus 3 sigma peak current is 2.07 + 3*0.028= 2.1 amps

Things to check when measuring 12 V supply current:

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Figure 7. 5 volt current during read/write operations — C4x Models

1. Read/write baseline voltage.

2. Read/write pulse. T he width of the pulse is proportional to the number of consecutive blocks read or written. The 5 volt supply must be able to provide the required current during this event.

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Figure 8. Typical 12 volt current —C4x Models

1. Maximum slew rate is 7 amps/millisecond.

2. Maximum slew rate is 100 amps/millisecond.

3. Maximum slew rate is 7 amps/millisecond.

4. Maximum slew rate is 3 amps/millisecond.

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Figure 9. Typical 12 volt spin-up current — C4x Models

1. Maximum slew rate is 20 amps/millisecond.

2. Current drops off as motor comes up t o speed.

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2.2.4 CxB Models

Th e carrier m od el s include a DC/DC power converter, device activity and fault/service indicators. There is no additional current required for +5 V or +12V.

2.2.4.1 Power supply methods

When +38V is applied to the interface connector pins +38V Source A, +38V Source B, and Ground, the + 38V supply is input to a DC/DC converter that provides +12V and + 5V t o t he drive electronics.

2.2.4.2 DC/DC Converter

Typical efficiency of this converter is 8 0% at maximum output load with input voltage at 38V.

There are tw o independent +38V power supply inputs o n the interface connector which supply two independent inputs to the DC/DC converter, +38V Source A and +38V Source B (refer to Table 12 on page 65). The DC/DC converter will operate while one input voltage is i n th e range of +3 4V t o + 40V a n d the other input voltage is in the range of 0 to +40 volts. Input voltage ripple must be less than 1.0 volts peak-to-peak at the fundamental frequency of 420 H z maximum, less than 500mv at the frequency from 421hz to 1 kh z , less than 100mv at the frequency greater than 1 khz. The converter output is + 5 volts a t

0.3 amps to 2.6 amps and + 12 volts at 0.3 amps to 1.4 amps continuous current. Th e +12v output can handle a surge current of 2.2 amps in 9 seconds.

The total input current to the converter is 1.6A amps when the highest input voltage on the power supply input pins is +3 4 volts and t he converter outputs are operating at full load. Th e input current ripple, due to converter switching is no more than 100 milliamps peak-to-peak at 1 M H z Maximum inrush current is limited to 3 amps during turn on except for a maximum period of 2 microseconds (during h o t plugging) where the current can exceed 3 amps bu t is less than 8 amps.

A DC/DC converter output enable is provided on the interface connector. This signal, +DC/DC Enable,is pulled up within the converter. T o enable the DC outputs, this line must be at or above 2.4 volts. T o disable t h e DC outputs, the signal must be at or below 1.4 volts.

The DC/DC converter has over-current, over-voltage, an d over-temperature detection. A ny of these conditions will latch off the converter. Th e latch is reset by insuring that both input voltages fall below + 5 volts for a period greater than o r equal t o 10 milliseconds.

Refer to 5.5, “Option Pins and Indicators” on page 66 for descriptions of the Early Power Off Warning and Loss of Redundancy fault signals associated wi th th e +3 8V supply inputs.

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2.2.5 Power Supply Ripple

Externally Generated Ripple as seen at drive power connector Maximum Notes

+5VDC 150 mV 0-20 MHz

+12VDC 150 mV 0-20 MHz

During drive start u p a nd seeking, 12 volt ripple is generated by the drive (referred to as dynamic loading). If several drives have their power daisy chained together then the power supply ripple plus other drive's dynamic loading must remain within the regulation tolerance window of + /- 5%. A common supply with separate power leads to each drive is a more desirable method of power distribution.

peak-to-peak

2.2.6 Grounding Requirements of the Disk Enclosure

Th e disk enclosure is at Power Supply ground potential. I t is allowable for the user mounting scheme to common the Disk Enclosure to Frame Ground potential or t o leave it isolated from Frame Ground.

From a Electro-Magnetic Compatibility (EMC) standpoint it will, in most cases be preferable to common the Disk Enclosure to the system's mounting frame. With this in mind, it is important that the Disk Enclosure not become an excessive return current path from the system frame t o power supply. Th e drive's mounting frame must be within ± 150 millivolts of the drive's power supply ground. At no time should more than 35 milliamps of current (0 t o 100Mhz) be injected into the disk enclosure.

Please contact your IB M Customer Representative if you have questions o n ho w to integrate this drive in your system.

2.2.7 Hot plug/unplug support

Power supply and SSA link h ot plug and un-plug is allowed for all SSA models.

For Form Factor models, there is n o special sequence required for connecting 5 volt, 12 volt, or ground. During a ho t plug-in event the drive being plugged will draw a large amount of current at the instant of plug-in. This current spike is du e to charging the bypass capacitors o n th e drive. This current pulse may cause t h e power supply to go out of regulation. If this supply is shared by other drives then a low voltage power on reset ma y be initiated o n those drives. Therefore the recommendation for ho t plugging is to have one supply for each drive. Never daisy chain the power leads if hot plugging is planned. H o t plugging should be minimized to prevent wear o n the power connector.

The carrier models may be hot plugged ONLY IF the ground pins (longer pin) make contact first (before other pins which are shorter). Vice versa, the carrier m ay be h ot unplugged ONLY IF the ground pins (longer pins) are the last to remove (after other pins which are shorter). DAMAGE TO THE FILE ELEC-

TRONICS AND THE ADAPTER ELECTRONICS COULD RESULT IF THE ABOVE C OND IT ION S ARE NO T MET. The mating HP C connector MUST HAVE PROGRAMMABLE PIN LENGTH. GN D PINS MUST BE LONGER THAN SIGNAL AN D POWER PINS. THE GUIDE PIN S MUST BE TIED TO THE DOKING ASSEMBLY FRAME GN D

This ripple must not cause the power supply to the drive to go outside of the ± 5% regulation tolerance.

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Hot plugging t h e SSA link will be recognized by the n e x t node which will cause a configuration process to be started by the Initiators.

During hot plugging, th e supplies must not go over the upper voltage limit. Th i s means that proper ESD protection must be used during the plugging event.

During ho t un-plugging if the operating shock limit specification c a n be exceeded then the drive should be issued a Start/Stop Unit command (spin down) that is allowed t o complete before un-plugging.

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2.2.8 Bring-up Sequence (and Stop) Times

Figure 10. Start Time Diagram

Note: BATS is the abbreviation for Basic Assurance Tests. Start-up sequence spins u p the spindle motor, initializes the servo subsystem, up-loads code, performs BATS2 (verifies read/write hardware), resumes "Reassign in Progress" operations, and more. Fo r more information on the start-up sequence, refer to the Ultrastar XP (DFHC) SS A Models Interface Specification.

Note: If a RESET is issued before th e drive comes ready, the power on sequence will start again. In all other cases when a RESET is issued the present state of the motor is not altered.

Note: Reference “Start/Stop Unit Time” o n page 49 for additional details. Note: See 5.7, “Spindle Synchronization” on page 69 for details about Start-up time increases when the

device is requested via Mode Parameters to synchronize the spindle motor to another device.

Event Nominal Maximum Notes

Power-up 1.5 sec 2.0 sec *see Figure 10 Start-up 12.4 sec 45 sec. *see Figure 10 Spin-up 8.2 sec 29.2 sec *see Figure 10 Spindle St o p 6.0 sec 12.0 sec

Table 3. Bring-up Sequence Times a nd Stop Time for C1x Models

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Event Nominal Maximum Notes

Power-up 1.5 sec 2.0 sec *see Figure 10 Start-up 17.6 sec 45 sec. *see Figure 10 Spin-up 13.2 sec 29.2 sec *see Figure 10 Spindle St o p 9.0 sec 12.0 sec

Table 4. Bring-up Sequence Times a nd Stop Time for C2x Models

Event Nominal Maximum Notes

Power-up 1.5 sec 2.0 sec *see Figure 10 o n page 36 Start-up 16.5 sec 45 sec. *see Figure 10 on page 36 Spin-up 11.17 sec 30.9 sec *see Figure 10 o n page 36 Spindle St o p 8.0 sec 12.0 sec

Table 5. Bring-up Sequence Times a nd Stop Time for C4x Models

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3.0 Performance

Drive performance characteristics are dependent upon the workloads ru n and the environments in which they are run.

All times listed in this chapter are typical values provided for information only, so that the performance for environments and workloads other than those shown as examples can be approximated. Actual minimum and maximum values will vary depending upon factors such as workload, logical and physical operating environments.

3.1 Environment Definition

Drive performance criteria is based on the following operating environment. Deviations from this environment may cause deviations from values listed in this specification.

Block lengths are formatted at 512 bytes per block. The number of data buffer cache segments is 8. The total data buffer length is 512k bytes. Each

segment is of equal length. Therefore, each cache segment is 64k bytes. The number of blocks of customer data that can fit into one segment is reduced because 2 bytes of L RC

information is also stored in th e segment for each block of customer data stored in the segment. Therefore, use t he following equation to determine how many blocks c an fit into one segment.

512KB

(

# of segments

ub/lba +2

Ten byte Read and Write commands are used. SSA environment consists of a single initiator and single target with no SSA link contention. The Initiator delay in responding t o messages from the Target is assumed to be zero. All performance enhancing functions are disabled, except where noted. More specifically,

− Comman ds are no t queued

− Caching is disabled (RCD=1, WCE=0)

− Out of order transfers are not allowed (OOTM=0, OOTI=0)

The media is formatted with th e skew definition that optimizes the disk d a ta transfer rate for unsynchronized spindle operation.

All Current Mode Parameters are set to their Default values except where noted. Averages are based on a sample size of 10,000 operations.

)

3.2 Workload Definition

Th e drive's performance criteria is based on the following command workloads. Deviations from these workloads m ay cause deviations from this specification.

Operations are either all Reads or all Writes. The specifications for Command Execution Time with Read Ahead describe exceptions to this restriction. F or that scenario all commands are preceded by a Read command, except for sequential write commands.

The Data Transfer size is set to 64 Blocks.

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The time between the end of a n operation, and when the next operation is issued is 50 msec, +/ - a random value of 0 to 50 msec, unless otherwise noted.

3.2.1 Sequential

N o Seeks. The target LBA for all operations is the previous L B A + 64.

3.2.2 Random

All operations are to random LBAs. The average seek is an average weighted seek.

3.3 Command Execution Time

Command execution, or service, times are th e su m of several Basic Components:

1. Seek

2. Latency

3. Command Execution Overhead

4. Data Transfer to/from Disk

5. Data Transfer to/from SSA Link

The impact or contribution of those Basic Components to Command Execution Time is a function of the workload being sent to the drive a nd the environment in which the drive is being operated.

3.3.1 Basic Component Descriptions

Seek

The average time from the initiation of the seek, to the acknowledgement that the R/ W head is on the track that contains the first requested L B A . Values are population averages, a nd vary as a function of operating conditions. T h e values used t o determine Command Execution Times for sequential commands is 0 milliseconds and th e values for random commands are shown in section 2.0, “Specifications” on page 11.

Latency

The average time required from the activation of the read/write hardware until the target sector has rotated to the head and the read/write begins. This time is 1/2 of a revolution of the disk, or

4.17 milliseconds.

Command Execution Overhead

The average time added to the Command Execution Time due to the processing of t he command. It includes all ti m e the drive spends not doing a disk operation or SSA link data transfer.

The following values are used whe n calculating the Command Execution Times.

Workload Command Execution

Sequential Read .65 ms Sequential Write 1.00 ms

Random Read .25 ms Random Write .30 ms

Table 6. Overhead Values

A number of Initiator controlled factors affect Command Execution Overhead. These are examined separately in 3.4, “Approximating Performance for Different Environments” on page 43.

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The Post Command Processing time of .26 ms is defined as the average time required for process cleanup after the command has completed. If a re-instruct period faster tha n this time is used, the difference is added t o th e Command Execution Overhead of the next operation.

Data Transfer to/from Disk

The average time used t o transfer th e data between th e media and t he drive's internal data buffer. This is calculated from:

(Data Transferred)/(Media Transfer Rate). There are four interpretations of Media Transfer Rate. H ow it is to be used helps decide which

interpretation is appropriate t o use.

1. Instantaneous Data Transfer Rate The same for a given notch formatted at any of the supported logical block lengths. I t varies

by notch only and does no t include any overhead.

2. Track Data Sector Transfer Rate Varies depending upon the formatted logical block length and varies from notch t o notch. It

includes t h e overhead associated with each individual sector. This is calculated from: (user bytes/sector)/(individual sector time) (Contact an IBM Customer Representative for individual sector times of the various for-

matted block lengths.)

3. Theoretical Data Sector Transfer Rate Also includes t im e required for track and cylinder skew and overhead associated with each

track. (See 3.3.2.1, “Theoretical Data Sector Transfer Rate” on page 43 for a description on how to calculate it.)

4. Typical Data Sector Transfer Rates Also includes th e effects of defective sectors and skipped revolutions due to error recovery.

See Appendix B of the Ultrastar XP (DFHC) SSA Models Interface Specification for a description of error recovery procedures.

Rates for drives formatted at 512 bytes/block are located in Table 7 on page 42.

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Model Type All C4x C2x C1x

Notch # Instant. Track Theoretical Typical Theoretical Typical Theoretical Typical

Average 12.07 7.91 7.17 7.13 7.13 7.10 7.06 7.03 1 12.58 8.30 7.52 7.48 7.48 7.44 7.40 7.37 2 12.58 8.30 7.52 7.48 7.48 7.44 7.40 7.37 3 12.51 7.99 7.22 7.18 7.18 7.15 7.11 7.08 4 11.96 7.74 7.02 6.99 6.99 6.95 6.92 6.89 5 11.26 7.38 6.66 6.63 6.63 6.60 6.57 6.54 6 11.05 7.07 6.41 6.38 6.38 6.35 6.31 6.28 7 10.64 6.88 6.23 6.20 6.19 6.16 6.13 6.10 8 10.29 6.64 6.03 6.00 6.00 5.97 5.94 5.91 9 10.01 6.45 5.85 5.83 5.83 5.80 5.77 5.74 10 9.59 6.15 5.55 5.53 5.53 5.50 5.48 5.45 Note: The values for Typical Data Sector Transfer Rates assume a typically worst case value of 3.16 errors in 109bits read at

nominal conditions for soft error rate.

Note: Contact an IBM Customer Representative for values when formatted at other block lengths. Note: "Average" values a re sums of the individual notch values weighted by the number of LBAs in the associated notches.

Table 7. Data Sector Transfer Rates. (All rates are in MB/sec)

Data Transfer to/from SSA Link

The time required to transfer data between the SSA link an d the drive's internal dat a buffer, that is n o t overlapped with t he time for the Seek, Latency or Data Transfer to/from Disk.

When the drive is reading, data is transferred from the medium to its data buffer an d from the buffer across the SSA link simultaneously. However, data transfer t o the link from the data buffer buffer lags transfer from the medium t o the buffer b y one block. At the e nd of the transfer from the medium, one block still has to be transferred across the link.

For a write operation, the data is normally transferred t o the d at a buffer during the seek and latency time. In the rare case that these are both zero, the write cannot begin until one sector is transferred, a n d th e ti me t o do this becomes part of the overhead.

Each block of data is transferred as one or more frames on the SSA Link. Each frame requires 10 bytes of overhead and may contain up t o 128 bytes of data. The time to transfer one block depends on the number of frames required. For example, a 744 byte block needs 6 frames (5 x 128 byte, 1 x 104). T his adds 60 bytes of overhead making 804 bytes total. At an instantaneous transfer rate of 20MB/s, that is 40 microseconds per block (17.7MB/s sustained).

3.3.2 Comments

Overlap has been removed from the Command Execution Time calculations. The components of the Command Execution Times are truly additive times to the entire operation. Fo r example,

The Post Command Processing times are n o t components of the Command Execution time therefore they are not included in the calculation of environments where the re-instruct period exceeds the Post Command Processing time.

The effects of idle time functions are not included in the above examples. The 3.2.1, “Sequential” o n page 40 and 3.2.2, “Random” on page 40 bot h define environments where the effects due to increased command overhead of Idle Time Functions upon Command Execution time are less than 0.15%.

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3.3.2.1 Theoretical Data Sector Transfer Rate

This Rate does no t account for time required for error recovery or defective sectors (the Typical Data Sector Transfer Rate described in 3.3.1, “Basic Component Descriptions” on page 40 does include those effects). Each group of cylinders with a different number of gross sectors per track is called a notch. Th e following shows values for notch #1 of C4x models. Th e "Average" values used in this specification are sums of the individual notch values weighted b y the number of LBAs in the associated notches. Fo r the other notches and block lengths use values that correspond to those notches and block lengths.

Data Sector Transfer Rate =

Bytes/cylinder

time for 1 cyl+ track skews + 1 cyl skew

Bytes/cylinder = {(tracks/cyl)(gross sectors/track) - spares/cyl}(user bytes/sector)

= {(16)(135) - 40}(512) = 1,085,440 Bytes/cyl

time for 1 cyl of data = {(tracks/cyl)(gross sectors/track) - spares/cyl}(avg. sector time)

= {(16)(135) - 40}(.061705) = 130.815 msec/cyl

time for track skews = (tracks/cyl - 1)(track skew)(avg. sector time)

= (16-1)(13)(.061700) = 12.032 msec/cyl

time for 1 cyl skew = (cylinder skew)(avg. sector time)

= (25)(.061705) = 1.543 msec/cyl

Data Sector Transfer Rate =

1,085,440 Bytes

130.815 msec + 12.032 msec + 1.543 msec

= 7.517 MB/sec (Notch #1)

Note: See 2.0, “Specifications” on page 11 for the descriptions of

tracks/cyl (trk/cyl) gross sectors/track (gs/trk) spares/cyl (b1spr/cyl an d b2spr/cyl) user bytes/sector (ub/sct) gross bytes/sector (gb/sct)

See 3.5, “Skew” o n page 46 for the descriptions of

track skew (tss) cylinder skew (css)

Average sector times per notch can be calculated as follows:

average sector time (ast) =

1 sec

120.045 × gs/trk

3.4 Approximating Performance for Different Environments

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3.4.1 For Different Transfer Sizes

The primary performance change due to a change of transfer size is the Data Transfer to/from Disk parameter. See 3.3.1, “Basic Component Descriptions” on page 40 for an explanation of the calculation of this parameter.

The Command Execution Overhead m ay also change if the transfer size is reduced to the point where certain internal control functions can n o longer be overlapped with either t he SSA Link or Disk data transfer.

For example, a short read may incur u p t o .65ms extra overhead if t he Data Ready/Reply exchange does not overlap th e disk transfer.

3.4.2 When Read Caching i s Enabled

For read commands with Read Caching Enabled Command Execution time can be approximated by deleting Seek, Latency, and Data Transfer to/from Disk components if all of the requested data is available in a cache segment (cache hit). Command Execution Overhead increases by approximately .1ms in this case as there is n o overlap with seek/latency.

When some, bu t n o t all, of the requested data is available in a cache segment (partial cache hit) Data Transfer to/from Disk will be reduced b u t n ot eliminated. Seek and Latency may or may n o t be reduced depending upon the location of requested data not in the cache and location of the read/write heads at the time the command was received.

The contribution of the Data Transfer to/from SSA link to the Command Execution time may increase since a larger, or entire, portion of the transfer may no longer be overlapped with the components that were reduced.

3.4.3 When Write Caching i s Enabled

For write commands with th e Write Caching Enabled (WCE) Mode parameter bit set, Command Execution time can be approximated by deleting Seek, Latency, and Data Transfer to/from Disk components. The contribution of the Data Transfer to/from SSA link to th e Command Execution time may increase since a larger, or entire, portion of the transfer may no longer be overlapped with the components that were reduced. T h e reduced times effectively are added to the Post Command Processing Time.

Command completion status is returned when data is completely stored in the buffer. T he time to transfer this group of data to the disk will be added to the performance of any next command that was in the queue.

3.4.4 When Adaptive Caching is Enabled

The Adaptive Caching feature attempts to increase Read Cache hit ratios by monitoring workload and adjusting cache control parameters, normally determined by the using system via th e Mode Parameters, with algorithms using the collected workload information.

3.4.5 When Read-ahead is Enabled

If read-ahead is active, th e service tim e is affected i n several ways:

If the data requested by a read command is all in the data buffer already, t h e command can be serviced very quickly.

If th e beginning of the requested dat a is in t he buffer, an d the read-ahead is still in progress, data transfer

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for the command can start immediately. This effectively avoids latency tim e for read operations sequential on a previous read.

If the data requested by a read operation is not in the read-ahead buffers, there is an increase in t h e command overhead time due to the time spent searching t h e buffers. This time depends o n the number of buffer segments selected by the Mode Select command.

If read-ahead is still in progress whe n the next command is received and th e data requested is not sequential, the drive aborts read-ahead and starts the command. T he time t o perform this abort increases t he Command Execution Overhead by .23ms.

3.4.6 When No Seek is Required

For a Read command, the additional Command Execution Overhead when no seek is required is approximately .50ms. For a Write, it is approximately .70ms.

3.4.7 For Queued Commands

If commands are sent t o the drive wh en it is busy performing a previous command, they can be queued. I n this case, some of the command processing is performed during the previous command and the overhead for the queued command is reduced by approximately .20 milliseconds.

3.4.7.1 Reordered Commands

If the Queue Algorithm Modifier Mode Parameter field is set to allow it, commands in the device command queue may be executed in a different order than they were received. Commands are reordered so that the seek portion of Command Execution time is minimized. The amount of reduction is a function of the location of the 1st requested block per command and the rate at which t he commands are sent to th e drive.

A Queue Algorithm Modifier Mode Parameter value of 9 enables an algorithm that gives the using system the ability t o place ne w commands into the drive command queue execution order relative to t h e outstanding commands in the queue. For example, if a request is sent to the drive that the using system prioritizes such that it's completion time is more important than one or more of the outstanding commands, the using system can increase the likelihood that command is executed before those others by using a tag value greater than those outstanding commands.

3.4.7.2 Back-To-Back Commands

If consecutive read/write commands access contiguous data, they can be serviced without incurring disk latency between commands.

Note: There is a minimum transfer length for a given environment where continuous access to t he disk can not be maintained without missing a motor revolution. For Write commands with Write Caching enabled the likelihood is increased that shorter transfers c a n fulfill the requirements needed to maintain continuous writing to the disk.

Back-to-back Read is only enabled if Read-ahead is disabled.

3.4.8 Out of Order Transfers

Tw o bits in th e SCSI Command message control out of order transfers. OOTM applies to transfers to/from the media a nd OOTI applies to transfers to/from the interface (SSA Link).

Th e benefit from setting OOTM increases as t h e transfer length approaches o ne disk revolution. This affects both reads an d writes and is du e to the reduction in latency.

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The full benefit of o ut of order transfers in only achieved if OOTI is also set. Read data is transferred on the interface in t h e same order as it was read from the media.

3.5 Skew

3.5.1 Cylinder to Cylinder Skew

Cylinder skew is the s um of the sectors required for physically moving the heads (csms), which is a function of the formatted block length and recording density (notch #), and reassign allowance sectors (ras = 3) used to maintain optimum performance over t he normal life of the drive.

Note: The values in t h e Mode Page 3 'Cylinder Skew Factor' are notch specific non-synchronized spindle mode values. The value for notch 1 is returned when the Active Notch is set to 0.

Notch #

User bytes / logical

block

256 42 42 42 40 38 36 36 36 36 32 512 28 28 27 26 25 24 24 23 22 21 520 26 26 26 26 24 24 23 22 22 21 522 26 26 26 25 24 24 23 22 22 20 524 26 26 26 25 24 24 23 22 22 20 528 26 26 26 25 24 24 23 22 22 20 600 24 24 24 23 22 22 21 20 20 20 688 22 22 22 21 20 20 20 20 18 18 744 21 21 21 20 20 20 18 18 17 17

Note: Contact an IBM Customer Representative for values at other formatted block lengths.

Table 8. Optimal Cylinder Skew for several block lengths

1 2 3 4 5 6 7 8 9 10

In order to increase th e likelihood that equivalent LBA's on two or more devices are located at the same relative physical position when the devices ar e used in a synchronized spindle mode, cylinder skew is calculated differently. The cylinder skew calculations d o n o t take into account known defective sites. To prohibit revolutions from being missed on cylinder crossings by drives formatted while i n a synchronized spindle mode, an extra allowance for 6 defects is added that is not added when optimally formatted in a nonsynchronized mode.

3.5.2 Track t o Track Skew

Note: The values in t h e SCSI Mode Page 3 'Track Skew Factor' are notch specific values. The value for notch 1 is returned when the Active Notch is set to 0.

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Notch #

User bytes / logical

block

256 20 20 20 19 19 17 17 17 17 15 512 13 13 13 12 12 11 11 10 10 10 520 12 12 12 12 11 11 10 10 10 10 522 12 12 12 12 11 11 10 10 10 9 524 12 12 12 12 11 11 10 10 10 9 528 12 12 12 12 11 11 10 10 10 9 600 11 11 11 11 10 10 10 9 9 9 688 10 10 10 10 9 9 9 9 8 8 744 9 9 9 9 9 9 8 8 8 7

Note: Contact an IBM Customer Representative for values at other formatted block lengths.

Table 9. Track (or Head) Skew f or several block lengths

1 2 3 4 5 6 7 8 9 10

3.6 Idle Time Functions

The execution of various functions by the drive during idle times may result in delays of commands requested by initiators. ‘Idle time’ is defined as time spent by the drive n ot executing a command requested by a initiator. Th e functions performed during idle time are:

1. Servo R un Out Measurements

2. Servo Bias Measurements

3. Predictive Failure Analysis (PFA)

4. Channel Calibration

5. Save Logs a nd Pointers

6. Disk Sweep

The command execution time for commands received while performing idle time activities may be increased by the amount of time it takes t o complete the idle time activity. The messages and d a t a exchanged across the SSA link are no t affected by idle time activities.

Note: Command Timeout Limits do no t change d ue to idle time functions.

All Idle Time Functions have mechanisms to lessen performance impacts for critical response time periods of operation. And in some cases virtually eliminate those impacts from an Initiator's point of view. All Idle Time Functions will only be started if the drive has not received a SCSI command for at least 5 seconds (40 seconds for Sweep). This means that multiple SCSI commands are accepted and executed without delay if the commands are received b y the drive within 5 seconds after the completion of a previous SCSI command. This mechanism has the benefit of n ot requiring special system software (such as issuing SCSI Rezero U nit commands at known & fixed time intervals) in order to control if and when this function executes.

Note: Applications which can only accommodate Idle Time Function delays at certain times, bu t can no t guarantee a 5 second re-instruction period, may consider synchronizing idle activities to the system needs through use of the LITF bit in Mode Select Page 0, a n d the Rezero Unit command. Refer to the Ultrastar XP (DFHC) S SA Models Interface Specification for more details

Following are descriptions of th e various types of idle functions, ho w often they execute a n d their duration. Duration is defined to be t he maximum amount of time the activity c a n add to a command when n o errors occur. No more than one idle function will be interleaved with each command.

Following th e descriptions is a summary of the possible impacts to performance.

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3.6.1 Servo Run Out Measurements

The drive periodically measures servo run out, the amount of wobble o n each disk, t o track follow more precisely.

Servo run out for all heads is measured every 60 minutes, therefore th e frequency of r u n out measurements is dependent on the number of heads a particular model has. Th e drive attempts to spread t he measurements evenly in time and each measurement takes 100 milliseconds. For example, a model C4x with 8 heads performs o ne r u n o u t measurement every 7 1/2 minutes (60 / 8).

3.6.2 Servo Bias Measurements

The drive periodically measures servo bias, the amount of resistance to head movement as a function of disk radius. It also helps prevent disk lubrication migration by moving t he heads over th e entire disk surface.

Servo bias is measured every 12 minutes during the first hour after a power cycle, and every 60 minutes after that. The measurement takes 200 milliseconds.

3.6.3 Predictive Failure Analysis

Predictive Failure Analysis measures drive parameters an d can predict if a drive failure is imminent.

Eight different PFA measurements are taken for each head. All measurements for all heads are taken over a period of 4 hours, therefore the frequency of PF A is dependent on the number of heads a particular model has. The drive attempts to spread the measurements evenly in ti m e an d each measurement takes about 80 milliseconds. For example, a C4x model with 8 heads will perform on e P F A measurement every 3.7 minutes (240 / 8 × 8). Fo r the last head tested for a particular measurement type (once every 1/ 2 hour), the data is analyzed and stored. The extra execution time for those occurrences is approximately 40 milliseconds.

This measurement/analysis feature can be disabled for critical response time periods of operation by setting the Page 0h Mode Parameter LITF = 1. The using system also ha s the option of forcing execution at known times by issuing the Rezero Uni t command if the Page 0h Mode Parameter TCC = 1. All tests for all heads occur at those times.

Note: Refer t o the Ultrastar X P (DFHC) SS A Models Interface Specification for more details about PFA, LITF, and TCC.

3.6.4 Channel Calibration

The drive periodically calibrates the channel to insure that the read a nd write circuits function optimally, thus reducing the likelihood of soft errors.

Channel calibration is done once every 4 hours and typically completes in 20 milliseconds, but may take up to 64 milliseconds p er measurement.

The measurement will only be started if the drive has not received a command for at least 5 seconds. Th i s means that multiple commands are accepted a n d executed without delay if th e commands are received by the drive within 5 seconds after the completion of a previous command. This function also makes use of the mechanism t o alter t h e idle detection period to limit execution for critical response time periods of operation, if needed.

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3.6.5 Save Logs and Pointers

The drive periodically saves data in logs in the reserved area of the disks. Th e information is used by the drive to support various commands and for the purpose of failure analysis.

Logs are saved every 35 minutes. The amount of time it takes to update the logs varies depending o n th e number of errors since the last update. In most cases, updating those logs and th e pointers to those logs will occur in less than 30 milliseconds.

3.6.6 Disk Sweep

The heads are moved to another area of the disk if the drive has not received a command for at least 40 seconds. After flying in the same spot for 9 minutes, the heads are moved t o another position. Execution time is less than 1 full stroke seek.

3.6.7 Summary

Idle Time Function Type Max. Frequency of Occurrence

(minutes)

Servo Run Out 60/(trk/cyl) 100 Re-instruction Period Servo Bias ( < 1st hour) 12 200 Re-instruction Period Servo Bias ( > 1st hour) 60 200 Re-instruction Period

PFA 30/(trk/cyl) 80 Re-instruction Period / LITF

Channel Calibration 240 64 Re-instruction Period Save Logs & Pointers 35 30 Re-instruction Period

Note: "Re-instruction Period" is the time between consecutive SCSI command requests.

Table 10. Summary of Idle Time Function Performance Impacts

Duration (ms) Mechanism to Delay/Disable

3.7 Command Timeout Limits

The 'Command Timeout Limit' is defined as th e time period from w hen the SCSI_command message is received b y the drive until the corresponding SCSI_status message is transmitted by the drive.

Th e following times are for environments where Automatic Reallocation is disabled and there are n o queued commands.

Reassignment Time:

Blocks" command.

The drive sh ould be allowed a minimum of 45 seconds to complete a "Reassign

Format Time:

The time to complete a "Format Unit" command (with Immed bit = 0) varies by model:

C4x 45 minutes C2x 25 minutes C1x 15 minutes

Initiators should also use this time to allow format sequences initiated by "Format Unit" commands (with Immed bit = 1) to compete and place the drive in a "ready for use" state.

Start/Stop Unit Time:

The drive sho u l d b e allowed a minimum of 30 seconds t o complete a "Start/Stop

Unit" command (with Immed bit = 0).

Initiators should also use this ti me t o allow start-up sequences initiated by au t o start u ps a n d "Start/Stop Unit" commands (with Immed bit = 1) to complete and place th e drive in a "ready for use" state.

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Note: A timeout of one minute or more is recommended but N O T required. T h e larger system timeout limit allows the system to tak e advantage of the extensive ERP/DRP that the drive may attempt in order to successfully complete the start-up sequence.

Note: A 60 second minimum is required if electronics card replacement is required as a service practice. Please contact an IB M Customer Representative for more details if required.

Medium Access Command Time:

The timeout limit for medium access commands that transfer user data

and/or non-user data should be a minimum of 30 seconds. These commands are:

Log Select Log Sense Mode Select Mode Sense Pre-Fetch Read Read Capacity

Read Defect Data Read Long Receive Diagnostic Results Release Reserve Rezero Un it Seek

Send Diagnostic Verify Write Write a nd Verify Write Buffer Write Long Write Sam e

Note: The 30 sec limit assumes the absence of SSA link contention and user data transfers of 64 blocks or less. This time sho uld be adjusted for anticipated SSA link contention and if longer user d at a transfers are requested.

Timeout limits for other commands:

The drive s h o u l d be allowed a minimum of 5 seconds to complete

these commands:

Format Unit (with Immed bit = 1) Inquiry Read Buffer Read Memory

Request Sense Start/Stop Un it (with Immed bit = 1) Synchronize Cache Test Uni t Ready

When Automatic Reallocation is enabled add 45 seconds t o the timeout of the following commands: Read (6), Read (10), Write (6), Write (10), Write an d Verify, and Write Same.

The command timeout for a command that is not located at th e head of the command queue should be increased b y the sum of command timeouts for all of the commands that are performed before it is.

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4.0 Mechanical

4.1 Small Form Factor Models (CxC)

4.1.1 Weight and Dimensions

C1C & C2C Models C4C Models

U.S. S.I. Metric U.S. S.I. Metric Weight 1.00 pounds 0.46 kilograms 1.80 pounds 0.82 kilograms Height 1.00 inches 25.4 millimeters 1.63 inches 41.3 millimeters Width 4.00 inches 101.6 millimeters 4.00 inches 101.6 millimeters Depth 5.75 inches 146.0 millimeters 5.75 inches 146.0 millimeters

4.1.2 Clearances

A minimum of 2 mm clearance sh o u l d be given to the bottom surface except for a 10 mm maximum diameter area around the bottom mounting holes. Figure 11 and Figure 12 show the clearance requirements (Note 1). Fo r proper cooling it is suggested that a clearance of 6 mm be provided under the drive a nd on top of the drive.

There should be 7 m m of clearance between drive's that are mounted with their t o p sides (see Figure 22 o n page 78 for top view of drive) facing each other.

4.1.3 Mounting

The drive can b e mounted with any surface facing down.

The drive is available with both side and bottom mounting holes. Refer t o Figure 11 t o Figure 13 for the location of these mounting holes for each configuration.

The maximum allowable penetration of the mounting screws is 3.8 m m.

The torque applied t o t he mounting screws must be 0.8 Newton-meters ± 0.1 Newton-meters.

The recommended torque t o be applied t o t he mounting screw is 0.8 Newton-meter ± 0.4 Newton-meter. IBM will provide technical support to users that wish t o investigate higher mounting torques in their application.

WARNING: The drive may be sensitive to user mounting implementation due to frame distortion effects.

IBM will provide technical support to assist users to overcome mounting sensitivity.

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notes: 1) Bottom clearance required by 4.1.2, “Clearances.”

2) Dimensions are in millimeters.

Figure 11. Location of Side Mounting Holes of C1C & C2C Models

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notes: 1) Bottom clearance required by 4.1.2, “Clearances” on page 51.

2) Dimensions are in millimeters.

Figure 12. Location of Side Mounting Holes of C4C Models

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notes:

1) T he purpose of this drawing is to show the bottom hole pattern.

2) Dimensions are in millimeters.

Figure 13. Location of Bottom Mounting Holes of CxC Models

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4.1.4 Unitized Connector Locations

The Unitized connector is located on t he left side of the top view (bottom drawing) as shown in Figure 14 on page 56. T he jumper connector is located o n the right side of th e to p view (bottom drawing) as shown in Figure 14 on page 56. This jumper connector is referred to as Front Jumper because of its front location. I t is reserved for I BM Engineering used only.

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Figure 14. Electrical connectors (rear an d top view) -- CxC Models.

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4.2 Carrier Models (CxB)

The carrier model assemblies include the disk drive, drawer mounting hardware (rails, latching mechanism, and connector), a nd DC/DC power converter.

4.2.1 Weight and Dimensions

C1B & C2B Models C4B Models

U.S. S.I. Metric U.S. S.I. Metric Weight 2.00 pounds 0.92 kilograms 2.80 pounds 1.288 kilograms Height 1.75 inches 44.5 millimeters 1.75 inches 44.5 millimeters Width 4.26 inches 108.3 millimeters 4.26 inches 108.3 millimeters Depth 10.72 inches 272.3 millimeters 10.72 inches 272.3 millimeters

Refer t o Figure 15 o n page 58 for detailed dimensions.

4.2.2 Clearances

For proper cooling, a clearance of 6 millimeters s ho u ld b e provided above and below the carrier surfaces. Adequate airflow is needed in order t o meet the operating specifications. Maximum temperatures are specified for critical drive components in Table 15 on page 78.

4.2.3 Mounting

The drive can b e mounted with any surface facing down.

The carrier is designed to be plugged into a n auto-docking assembly. The auto-docking assembly contains an electrical receptacle that provides connections for DC power, SSA interface signals, an d fault sensing and reporting signals (see 5.2, “Carrier Connector” on page 64). The carrier design allows for positive retention of t h e carrier in all axes whe n plugged into the auto-docking assembly. I n addition, the carrier retention provides a force to bottom out the carrier auto-docking connector into the auto-docking assembly an d maintain a force of 5 pounds minimum, 40 pounds maximum.

The mating connector should contain two guide pins to align the carrier receptacle during seating. These guide pins are BERG part number 77693-014 (IBM part number 72G0343) or AM P equivalent part number 1-532808-1 (IBM part number 19G6789). Th e guide pi n length shoul d be 26.04 millimeters while th e t h r e a d depth depends upon the thickness of t he circuit board the connector is mounted to. The guide pins sh ould be tied t o the docking assembly frame ground.

Note: The connector pins must be lubricated t o insure seating of the carrier into the auto-docking assembly. The type of lubricant recommended is Stauffer CL-920 or equivalent.

WARNING: The drive may be sensitive to user mounting implementation due to frame distortion effects.

IBM will provide technical support to assist users to overcome mounting sensitivity.

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Note: Dimensions are in millimeters.

Figure 15. Dimensions —CxB Models

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Figure 16. Handle Docking and Ejection System

The handle on the carrier is used for insertion into and extraction from the drawer. It also provides enough force to ensure seating of the carrier electrical receptacle with the mating connector. Referring to Figure 16, with the handle in the STOP or open position, a carrier inserted into the auto-docking assembly will have the connector guide pins inserted into the carrier receptacle but th e connector pins will not be making contact with the carrier receptacle. Moving the carrier handle to the C A M IN position and eventually to the LOCKED position sets the auto-docking connector with the carrier receptacle and holds the carrier i n all the mounting positions listed above. Moving the handle from the LOCKED position to the EJECT position provides leverage via the c am surface on t he handle acting against th e side rails to separate the connector pins from the receptacle.

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4.2.4 Auto-docking Assembly Side Rails

IBM supplied side rails that can be used for the auto-docking assembly are shown in Figure 17 on page 61 along with mounting location information. Refer to the figure for the following notes:

Note 1: With the side rails mounted within the given tolerances, there will be a nominal 1.5 millimeter

interference between the handle and side rail to provide positive retention of the carrier an d the handle.

Note 2: Th e IB M part number of the auto-docking side rails is 36G6422.

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Figure 17. Side Rail Positioning

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4.2.5 Electrical Connector and Indicator Locations

The HPC electrical connectors are located as shown in Figure 15 o n page 58. The indicators (LEDs) are located as shown in Figure 18 o n page 62.

Figure 18. LE D Locations (front view) —CxB Models.

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5.0 Electrical Interface

5.1 SS A Unitized Connector

Electrical connections for Cx C models are provided by a single connector mounted o n the rear of the drive (see Figure 14 o n page 56). Connections are provided for tw o SSA ports, fault sensors and indicators, option customization, and power. Refer t o Figure 19 an d Table 11 o n page 64 for contact assignments.

Figure 19. Unitized Connector (looking in the file at the connector end)

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Pin SSA PORT SSA PORT OPTION PORT POWER PORT

1 + Line O ut + Line Out - MTM + 12V Charge

(long) 2 - Line O u t - Line Ou t - Auto Start + 5V Charge (long) 3 Gnd (long) Gn d (long) - Sync Gn d (long) 4 Gn d (long) Gnd (long) - Write Protect + 12V 5 - Line I n - Line In Gn d (long) + 12V 6 + Line I n + Line In - Device Activity + 12V 7 N/A N/A +5V Gnd (long) 8 N/A N/A - Device Fault Gnd (long) 9 N/A N/A Programmable 1 +5V 10 N/A N/A Programmable 2 +5V 11 N/A N/A N/A - Power Fail 12 N/A N/A N/A G ND (long) 13 N/A N/A N/A + 3.3V 14 N/A N/A N/A + 3.3V 15 N/A N/A N/A Gn d (long) 16 N/A N/A N/A Gn d (long)

Table 11. Electrical Connector Contact Assignments — C x C Models

5.2 Carrier Connector

Electrical connections for Cx B models are provided by a single 128 pin connector mounted o n the rear of the drive (see Figure 15 o n page 58 for lo ca t io n) . Connections are provided for t wo SSA ports, fault sensors a nd indicators, an d power. Th e receptacle used is a 4×32, female contact, BERG HPC connector, IBM part number 99F9429. Refer t o Figure 20 an d Table 12 o n page 65 for contact assignments.

Figure 20. Carrier Interface Receptacle

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Row A B C D

1 n/c n/c n/c n/c 2 n/c n/c n/c n/c 3 n/c n/c n/c n/c 4 n/c n/c n/c n/c 5 n/c n/c n/c n/c 6 n/c n/c n/c n/c 7 n/c n/c n/c Device Fault (*) 8 +38V Source A +38V Source A +38V Source A + 38V Source A 9 +38V Source A +38V Source A +38V Source A + 38V Source A 10 Ground Ground Ground Ground 11 Ground Ground Ground Ground 12 +38V Source B +38V Source B +38V Source B +38V Source B 13 +38V Source B +38V Source B +38V Source B +38V Source B 14 n/c n/c n/c n/c 15 n/c n/c n/c n/c 16 n/c n/c n/c n/c 17 Shield Shield Shield Shield 18 + Out 1 + Out 1 +In2 +In2 19 − Out 1 − Out 1 − In 2 − In 2 20 Shield Shield Shield Shield 21 +In1 +In1 + Out 2 + Out 2 22 − In 1 − In 1 − Out 2 − Out 2 23 Shield Shield Shield Shield 24 n/c n/c n/c n/c 25 n/c n/c n/c n/c 26 n/c n/c n/c n/c 27 n/c n/c n/c n/c 28 n/c n/c n/c n/c 29 n/c n/c n/c n/c 30 n/c n/c n/c n/c 31 n/c n/c n/c n/c 32 n/c n/c n/c n/c

Note:

"n/c" means "no connection" (not used). (*) means pin is reserved for this function bu t model CxB does no t provide connection t o support it.

Table 12. Electrical Connector Contact Assignments — C xB Models

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5.3 SSA Link Cable

Th e SSA link cable must meet the specifications described in t h e Electrical Specifications section of Serial Storage Architecture SSA-PH (Transport Layer), X3T10.1/94-015 rev 01.

5.4 SSA Link Electrical Characteristics

The drive S S A link line driver, line receiver, and line receiver termination are fully compliant with the specifications described in the Electrical Specifications section of Serial Storage Architecture SSA-PH (Transport Layer), X3T10.1/94-015 rev 01.

5.5 Option Pins and Indicators

Ultrastar XP SSA drives contain option pins and/or indicators used to sense and report fault conditions, and to enable certain features of the drive. The electrical characteristics and requirements of these pins are fully compliant with the specifications described in the Electrical Specification section of Serial Storage Architec- ture SSA-PH (Transport Layer), X3T10.1/989D rev 01. The existence a n d definition of these pins are model dependent. Refer to Figure 14 on page 56 an d Figure 18 o n page 62 for locations of pins a n d LEDs on the front of the drive. Refer to Table 11 o n page 64 and Table 12 on page 65 for locations of pins o n t he rear of t he drive.

5.5.1 - Manufacturing Test Mode (Option Port Pin 1)

A low active input pin, that when active (pulled below .8V) makes pins 2, 3, 4, 6, 8 ,9 and 10 available t o be redefined. Pins 5 a nd 7 must remain Ground and +5V respectively. On e possible purpose for this p in is to allow a manufacturing tester t o redefine th e option pins to whatever functions it desires, while allowing the shipped product to return to the standard definitions in the customers environment. All models (CxC and CxB) reserve this pin b u t it is n o t connected t o any internal logic.

5.5.2 - Auto Start Pin (Option Port Pin 2)

A low active input pin, that when active (pulled below 0.8 V) o n C x C model causes the drive motor to spin up and become ready for media access operations after power is applied without the need to receive a Start/Stop Unit command. When inactive (pulled above 2.0 V), the drive motor shall not spin up until after the receipt of a Start/Stop Unit command. The signal is to be sampled by the device at power on, or hard reset o r soft reset conditions. Refer to the "Option Pins" section of the Ultrastar XP (DFHC) SS A Models Interface Specification for a detailed functional description of operations associated with this pin.

This pin is not accessible on CxB models.

5.5.3 - Sync Pin (Option Port Pin 3)

The Sync input/output pin on CxC model can be used for synchronizing among devices. The synchronization is achieved by having on e device use s this pin as output to transmit o ne sync character once per its spindle revolution. Th e other node may use this pi n as a n input and synchronize their spindle revolution position t o match the Sync signal. The SSA network provide Sync character over SSA link, b u t this option pin allows synchronization across multiple SSA networks, or allow tighter latency of th e Sync pulse. Refer t o Figure 21 o n page 70 for examples of Synchronization connection.

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The width, period, a nd tolerance of t he negative active Sync pulse is manufacturer dependent, and thus synchronization across different manufacturers or even different product lines of the same manufacturer is n ot guaranteed. T h e Sync pi n usage is con t rolled by mod e pages within the mode select command.

This pin is not accessible on CxB model.

5.5.4 - Write Protect (Option Port Pin 4)

a low active input pin, that when active (pulled below 0.8 V), the drive will prohibit commands that alter t h e customer data area portion of the the media from being performed. T h e state of this pin is monitored on a per command basis. Refer to "Option pins" section of the Ultrastar X P (DFHC) S SA Models Interface Specification for a detailed functional description of this pin.

This pin is not accessible on CxB models.

5.5.5 - Ground long (Option Port Pin 5)

The Ground long output pin o n CxC and CxB models shall be capable of syncing 1.0 Amp of current. This pin is longer than any others in the option block t o allow for t h e ground to mate first or last in a hot-plug or hot-unplug situation.

5.5.6 - Device Activity Pin/Indicator (Option Port Pin 6)

A low active LE D output pin on CxC models can be used to drive an external Light Emitting Diode. CxB models have a n integrated Green LED . Refer to the "Option Pins" section of the Ultrastar X P (DFHC) S SA Models Interface Specification for a detailed func tion al description of this pin/LED.

CxC models provide up to 24 mA of TT L level LED sink current capability. Current limiting for t he LED is provided on the electronics card. The anode may be tied to the +5 V power source (provided on the th e unitized connector). Th e LED Cathode is then connected t o the Device Activity pin t o complete the circuit.

5.5.7 + 5V (Option Port Pin 7)

The +5Voutput pin on CxC and CxB models shall supply up to 1.0 A m p of current limited + 5 V (+/- 10%), as long as power is supplied to the device.

5.5.8 - Device Fault Pin/Indicator (Option Port Pin 8)

The Device Fault pin on CxC models can be used t o drive a n external Light Emitting Diode. CxB models have a n integrated Amber LED . Refer to t he "Option Pins" section of the Ultrastar X P (DFHC) SS A Models Interface Specification for a detailed functional description of this pin/LED.

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5.5.9 Programmable pin 1 (Option Port Pin 9)

This pin can be used by a manufacturer for what ever purposes it desires within th e specified definition, electrical characteristic and th e availability of microcode. This pin is completely controlled by microcode. Refer t o the "Option Pins" section of the Ultrastar XP (DFHC) S SA Models Interface Specification for a detailed functional description of this pin.

This pins is no t accessible externally on CxB models.

5.5.10 Programmable pin 2 (Option Port Pin 10)

Thi s pin is reserved and i t is not connected to any internal logic.

This pins is no t accessible externally on CxB models.

5.5.11 - Early Power Off Warning or Power Fail (Power Port Pin 11)

The Early Power Off Warning input pin on CxC models can be used t o indicate to th e drive that a power loss will occur by pulling this signal to ground. T he input must provide a minimum of 6 milliseconds warning before power falls below operating specifications in order for the drive to stop its activities and handle the fault. Refer t o t he "Option Pins" section of the Ultrastar XP (DFHC) SSA Models Interface Specification for a detailed functional description of t he fault handling associated w ith this pin..

This pin is not accessible on CxB models.

5.5.12 12V Charge and 5V Charge (Power Port pin 1 and 2)

These pins are longer th a n the others. They help t o reduce current spikes during h ot plug. Each pin require a resistor (not in the drive) in series between the power source a nd t he drive connector. This allows for more controlled current draw as prior to other voltage pins. I t is up to the subsystem to determine the proper resistance t o add to these pins to meet the + /- 1 0 % voltage drop limitations an d the current draw limitation of the connector.

These pins are no t accessible on C xB mod els

5.6 Front Jumper Connector

All models contain a jumper block (refer to Figure 14 o n page 56) that is reserved for I BM Engineering use only.

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5.7 Spindle Synchronization

5.7.1 Synchronization overview

Spindle synchronization of drives is achieved b y one node transmitting a special Sync character or a Sync pulse once per every revolution of its drive. The transmitting is done either o n SSA Link (sending Sync character) o r o n a hard-wire (Sending Sync pulse) that connects all th e drives via t he S S A Option Port 'Sync' pin. The synchronization mo de is controlled by the RP L field of the Mode Select Page 04h parameter (see Ultrastar XP (DFHC) SSA Models Interface Specification for more details). The drive can operate in one of three modes:

5.7.2 Synchronization Mode

Mode Operation No Sync Spindle synchronization is disabled. Slave Sync Spindle synchronization is attempted by synchronizing the spindle motor to the Sync

special character o n SSA link (or th e Sync pulse on Sync hard-wire) that is driven by another node.

Master Sync Spindle synchronization is no t attempted by this device. It generates a Sync special

character via SSA link (or a Sync pulse via a hard-wire) once per its spindle revolution.

Master Sync Control Master Sync Control is not supported.

5.7.3 Synchronization time

It will take 6 seconds t o synchronize the Slave drive to the Master drive. While the Slave drive is synchronizing t o these characters, it is n ot able to read or write data. Once synchronized the drive will maintain ± 20 microseconds synchronization tolerance.

When operating in Slave Sync mode, the drive must receive the Spindle Sync special characters a t a period of

8.333 milliseconds with a tolerance of ± .025% (2.08 microseconds).

5.7.4 Synchronization with Offset

The Rotational Offset value is th e amount of rotational skew that the Target uses when synchronized. The rotational skew is applied in t he retarded direction (lagging the synchronized spindle master control). Th e value in th e field is the numerator of a fractional multiplier that has 256 as its denominator (e.g., a value of 128 indicates a one-half revolution skew). A value of 00h indicates that rotational offset is no t used. Th e rotational offset is only used when the Drive is running in the Slave Sync R PL mode.

5.7.5 Synchronization Route

5.7.5.1 Over SSA Link

Spindle Sync special characters are forwarded from one SSA link t o the other with a delay of 350 nanoseconds with a tolerance of ± 50 nanoseconds. This delay ca n b e increased by 50 nanoseconds when the drive is sending the second of a double character sequence (R R or ACK) and by 50 nanoseconds when sending a S AT or SAT' character.

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Th e spindle synchronization timing requirements are met in a string composed of Ultrastar XP SSA drives when there are n o more tha n seventeen drives between the o ne operating in Master Sync mo d e a n d t he furthest drive operating in Slave Sync mode.

5.7.5.2 Over Sync Hard-wire

There will be a single wire that connects all t he drives together throught the SSA Option Port pin 3 (- Sync pin). O n e of these drives will be a Master drive. Two potential configurations of this hard-wire connection are shown in the following figures:

Figure 21. Two examples of Daisy-Chain Connection of Synchronization .

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Termination Bus termination of the - SYNC signals is internal to the drive. This signal has a 5.1K o h m pulled-up to

the + 5 volt supply. A maximum of 30 drives can have their - SYNC line daisy chained together. Violating this could damage the Master drive line driver o n the - SYNC line

It is the using system's responsibility t o provide the cable to connect the - SYNC line where needed, of the synchronized drives.

Bus Characteristics

− maximum Bus length = 6 meters

− 2 micro-second negative active pulse (when sourced by drive)

− minimum of 1 micro-second negative active pulse w h e n externally sourced

− 0.8 volts = valid lo w input

− 2.2 volts = valid hig h input

− 0.4 volts = low output

− Vcc volts = High output

− 30 milli-amps = maximum output low level sink current

The driver used for these t w o signal lines is a Open Drain buffer.

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6.0 Reliability

Note: The reliability projections are based o n t he conditions stated below. All of the SSA models will meet the projections as long as reliability operating conditions are no t exceeded.

6.1 Error Detection

Error reporting ≥ 99% All detected errors excluding interface a n d BATs #1 (Basic Assur-

ance Test) errors

Error detection ≥ 99% FRU isolation = 100% To the device when the "Recommended Initiator Error Recovery

Procedures" in the Ultrastar XP (DFHC) SSA Models Interface Specification are followed.

No isolation t o sub-assemblies within the device are specified.

6.2 Data Reliability

Probability of not recovering data 10 i n 1015bits read Recoverable read errors 10 in 1013bits read (measured at nominal DC conditions and room

environment with default error recovery —QPE**)

Probability of miscorrecting unrecoverable data Note: Eighteen bytes of ECC and two bytes of LR C are provided for each d ata block.

6.3 Seek Error Rate

The drives ar e designed t o have less than 10 errors in 10,000,000 seeks. In th e field, a seek error rate of 40 in 100, 000 seeks will trip P FA (Predictive Failure Analysis) error.

The drives are designed t o achieve Soft Seek Error rate of 1 error in 100,000,000 seeks.

6.4 Power On Hours Examples:

Maximum power on hours (with minimum power on/off cycles)

43,800 hours for life based on:

- 5 Power on/off cycles per month

- 730 power on hours per month

Nominal power on hours (with nominal power on/off cycles)

30,000 hours for life based on:

Refer to Ultrastar XP (DFHC) SSA Models Interface Specification for t he definition of QP E (Qualify Post Error).

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- 25 Power on/off cycles per month

- 500 power on hours per month

6.5 Power on/off cycles

Maximum on/off cycles 1080/ year

6.6 Useful Life

Product Life 5 Years

Useful life is the length of time prior to the point at which product degradation begins to occur. The specification for the useful life calculation is the same as that for the *MTBF specification.

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6.7 *Mean Time Between Failure (*MTBF)

The mean time t o failure targe t is 1,000,000 device hours per fail (3.0% CDF) based o n the following assumptions:

6000 power on hours per year (500 power on hours per month times 12 months) 300 average on/off cycles per year (25 power cycles per month times 12 months) Seeking/Reading/Writing is assumed to be 20% of power on hours (Approximately 10 read/write operations per second) Operating at or below the Reliability temperature specifications (See Table 15 on page 78) an d nominal voltages (See 2.2, “Power Requirements by Model” on page 15)

Note: *MTBF - is a measure of the failure characteristics over total product life. *MTBF includes normal integration induced, installation, early life (latent), and intrinsic failures. *MTBF is predicated on supplier qualification, product design verification test, a n d field performance data.

6.7.1 Sample Failure Rate Projections

Th e following tables are for reference only. Th e tables contain failure rate projections for a given set of user conditions. Similar projections will be provided, upon request, for each user specific power o n hour and power cycles per month condition. Contact your I B M customer representative for a customized projection.

Application Electronics only - (RA/MM)

1st 30

days

500POH/MM 0.00120 0.0010 0.00096 0.00036 2.1% 730POH/MM 0.00160 0.00140 0.00125 0.00047 2.8%

Table 13. Projected failure rates for the electronics only.

Application Electronics and HDA - (RA/MM)

1st 30

days

500POH/MM 0.00150 0.00130 0.00120 0.00050 3.0% 730POH/MM 0.00200 0.00170 0.00160 0.00070 4.1%

Table 14. Projected failure rates for the entire drive. (Electronics and HDA).

1st 60

days

1st 90

days

30 day

average

30 day

average

over

life

CDF

6.8 SPQL (Shipped product quality level)

LA vintage Ultimate (13th month)

Targets .25% .10%

6.9 Install Defect Free

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Install Defect Free percentage 99.99 percent

6.10 Periodic Maintenance

No n e required

6.11 ESD Protection

The Ultrastar XP SSA disk drives contain electrical components sensitive to damage due t o electrostatic discharge ( ESD) . Proper E SD procedures must be followed during handling, installation, a nd removal. This includes t h e use of ESD wrist straps a nd ESD protective shipping containers.

6.12 Connector Insertion Cycles

Live insertion and removal of th e electrical connector causes pitting o n the connector terminals. Because of this th e number of live insertion and removal cycles must be limited.

Maximum Insertion/Removal Cycles (for hot and normal insertion) 25

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7.0 Operating Limits

The IB M Corporate specifications a n d bulletins, such as C-S 1-9700-000 in the contaminants section, that are referenced in this document are available for review. (Please contact your IB M Customer)

7.1 Environmental

Temperature

Operating Ambient 41 to 131˚F (5 t o 55˚C) Operating Casting Temperature 41 to 158˚F (5 to 70˚C) Storage 34 to 149˚F (1 to 65˚C) See Note Shipping - 4 0 to 149˚F (-40 to 65˚C)

Temperature Gradient

Operating 36˚F (20˚C) per hour Shipping and storage below condensation

Humidity

Operating 5 % to 9 0 % noncondensing Storage 5% to 9 5 % noncondensing Shipping 5 % to 100% (Applies at th e packaged level)

Wet Bulb Temperature

Operating 80˚F (26.7˚C) maximum Shipping and Storage 85˚F (29.4˚C) maximum

Elevation

Operating and Storage -1000 to 10,000 feet (-304.8 to 3048 meters) Shipping -1000 to 40,000 feet (-304.8 to 12,192 meters)

Note: Guidelines for storage below 1˚ C are given i n IBM Technical Report T R 07.2112.

7.1.1 Temperature Measurement Points

The following is a list of measurement points an d their temperatures (maximum and reliability). Maximum temperatures must not be exceeded at t he worst case drive and system operating conditions with the drive randomly seeking, reading an d writing. Reliability temperatures must not be exceeded at t he nominal drive and system operating conditions with the drive randomly seeking, reading, and writing.

There must be significant air flow through the drive s o that the casting an d module temperature limits define in Table 15 are no t exceeded. Figure 22 o n page 78 defines where measurements should be made to determine the to p casting temperature during drive operation. Figure 23 on page 79 identify the module locations o n t he bottom side of the card and t h e measurement location o n the bottom of the casting.

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Table 15. Maximum and Reliability Operating Temperature Limits

Maximum Reliability

Disk Enclosure Top 158˚F (70˚C) 131˚ F (55˚C) Disk Enclosure Bottom 158˚F (70˚ C) 131˚F (55˚ C) PRDF Prime Module 203˚F (95˚C) 176˚ F (80˚C) W D 61C40 Modul e 185˚F (85˚C) 167˚ F (75˚c) SIC Module 203˚F (95˚ C) 176˚F (80˚ C) Microprocessor Mo dul e 194˚F (90˚C) 167˚F (75˚C) VCM FE T 194˚F (90˚ C) 167˚F (75˚ C) DC/DC Converter (CxB only) 185˚F (85˚C) 167˚F (75˚C) SMP F ET 194˚F (90˚C) 167˚F (75˚C)

Note 1: Modu le temperature measurements should be taken from the to p surface of the module. Note 2: If copper tape is used t o attach temperature sensors, it sh ou l d be n o larger than 6 square milli-

meters.

notes: 1) dimensions are in millimeters.

Figure 22. Temperature Measurement Points for All Models (top view of DE)

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Notes: 1) Center thermocouple on the top surface of th e module.

2) If copper tape is used t o attach temperature sensors, it s hould be no larger tha n 6 mm square.

3) Dimensions are in millimeters.

4) The connector (on the left edge) does n o t represent SSA connector.

Figure 23. Temperature Measurement Points for all Models (bottom view)

7.2 Vibration and Shock

The operating vibration and shock limits in this specification are verified in two mount configurations for CxC models:

1. By mounting with the 6-32 bottom holes with t he drive o n 2 m m clearance as required by 4.1.2, “Clearances” o n page 51

2. By mounting o n any two opposing pairs of t he 6-32 side mount holes.

CxB models are mounted rigidly to the test fixture using the carrier guides, connector, and latch mechanism. Th e test fixture is then mounted to the vibration table (the test fixture must not have any resonance within the frequencies tested).

Other mount configurations may result in different operating vibration a nd shock performance.

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7.2.1 Drive Mounting Guidelines

The following guidelines may be helpful as drive mounting systems are being designed.

1. Mount the drive t o its carrier/rack using the fo ur extreme side holes t o ensure that the drive's center of gravity is as close as possible t o t he center of stiffness of the mounting.

2. Do not permit any metal-to-metal impacts or chattering between the carrier/rack a nd t he drive or between th e carrier/rack and anything else. Metal-to-metal impacts create complex shock waveforms with short periods; such waveforms can excite high frequency modes of the components inside the drive.

3. The carrier/rack sh o ul d n ot allow t h e drive t o rota te i n t he plane of th e disk a n d t he carrier/rack itself should be mounted so that it does not rotate in the plane of the disk when the drive is running. Even though the drive uses a balanced rotatory actuator, its position can still be influenced by rotational acceleration.

4. Keep the rigid body resonances of the drive away from harmonics of the spindle speed. Consider no t only the drive as mounted o n its carrier but also wh e n the drive is mounted to a carrier and then the carrier is mounted in a rack, the resonances of th e drive in the entire system must be considered.

7200 RPM Harmonics: 120 hz, 240 hz, 360 hz, 480 hz, .....

5. When the entire system/rack is vibration tested, th e vibration amplitude of the drive as measured in all axis should decrease significantly for frequencies above 300 hz.

6. Consider the use of plastics or rubber in the rack/carrier design. Unlike metal, these materials can dampen vibration energy from other drives o r fans located elsewhere in the rack.

7. Rather that creating a weak carrier/rack that flexes to fit the drive/carrier, h o l d t h e mounting gap to tighter tolerances. A flexible carrier/rack m a y contain resonances that cause operational vibration and/or shock problems.

7.2.2 Output Vibration Limits

spindle imbalance 1.0 gram-millimeters maximum for C1x, C2x models

1.5 gram-millimeters maximum for C4x model

7.2.3 Operating Vibration

The vibration is applied in each of the three mutual ly perpendicular axis, on e axis at a time. Referring to Figure 24 o n page 81, the x-axis is defined as a line normal to the front/rear faces, th e y-axis is defined as a line normal to the left side/right side faces, a nd the z-axis is normal to the x-y plane.

WARNING: The Ultrastar XP SSA drives are sensitive t o rotary vibration. Mounting within using

systems sh ou ld minimize the rotational input to the drive mounting points due to external vibration. IBM will provide technical support to assist users to overcome problems due to vibration.

Random Vibration

For excitation in t he x-direction an d th e y-direction, the drive meets the required throughput specifications when subjected to vibration levels not exceeding th e V4 vibration level defined below.

For excitation in t he z-direction, the drive meets the required throughput specifications when subjected t o vibration levels not exceeding the V4S vibration level defined below.

Note: The RM S value in the table below is obtained by taking the square root of the area defined by th e g²/h z spectrum from 5 to 500 hz.

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Table 16. Random Vibration Levels

Class 5hz 17 hz 45 hz 48 hz 62 hz 65 hz 150 hz 200 hz 500 hz RMS V4 2.0E-5 1.1E-3 1.1E-3 8.0E-3 8.0E-3 1.0E-3 1.0E-3 8.0E-5 8.0E-5 0.56 V4S 2.0E-5 1.1E-3 1.1E-3 8.0E-3 8.0E-3 1.0E-3 1.0E-3 4.0E-5 4.0E-5 0.55 units g2/hz g

Swept Sine Vibration

The drive will operate without hard errors when subjected to the swept sine vibration of 1.0 G peak from 5 to 300 hz in the x- a n d y direction. For input in the z-direction, an input of 1.0 G peak amplitude can be applied from 5 hz to 250 hz, the amplitude at 300 hz is 0.5 G peak. Linear interpolation is used to determine the acceleration levels between 250 hz and 300 hz.

Th e test will consist of a sweep from 5 to 300 hz a nd back to 5 hz. The sweep rate will be one hz per second.

Note: 1.0 G acceleration at 5 h z requires 0.78 inch double amplitude displacement.

(The connector on the right edge does n o t represent SSA connector)

Figure 24. Ultrastar XP SSA Drive Small Form Factor Assembly — C x C Models

7.2.3.1 Nonoperating Vibration

No damage will occur as long as vibration at the un-packaged drive in all three directions defined above does not exceed t he levels defined in t h e table below. Th e test will consist of a sweep from 5 hz to 200 hz and back t o 5 hz at a sweep rate of eight decades per hour.

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Table 17. Non-operating Vibration Levels

Frequency 5hzto7hz 7 hz to 200 hz Amplitude 0.8 inch D A 2.0 G peak

7.2.4 Operating Shock

No permanent damage will occur to the drive when subjected to a 10 G half sine wave shock pulse of 11 milliseconds duration.

No permanent damage will occur to the drive when subjected to a 10 G half sine wave shock pulse of 2 millisecond duration.

The shock pulses are applied in either direction in each of three mu tua ll y perpendicular axis, one axis at a time.

7.2.5 Nonoperating Shock

Translational Shock

No damage will occur if t he un-packaged drive is not subjected to a square wave shock greater than a "faired" value of 35 G s applied t o all three axis for a period of 20 milliseconds, one direction at a time.

No damage will occur if t he un-packaged drive is not subjected to an 11 millisecond half sine wave shock greater than 70 Gs applied to all three axis, one direction at a time.

No damage will occur if t he un-packaged drive is not subjected to a 2 millisecond half sine wave shock greater than 125 Gs applied to all three axis, one direction at a time.

Rotational Shock

No damage will occur if t he un-packaged drive is not subjected to an 11 millisecond half sine wave shock greater than 7,000 radians per second squared applied t o all three axis, one direction at a time.

No damage will occur if t he unpackaged drive is not subjected to a 2 millisecond half sine wave shock greater than 15,000 radians per second squared applied t o all three axis, one direction at a time.

7.3 Contaminants

Th e corrosive gas concentration expected t o b e typically encountered is Subclass G1; the particulate environment is expected to be P1 of C-S 1-9700-000 (1/89).

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7.4 Acoustic Levels

Upper Limit Sound Power Requirements (Bels) for C1x & C2x Models

Octave Band Center Frequency (Hz) A-weighted (see notes)

125 250 500 1K 2K 4K 8K Maximum Mean Idle 4.5 3.5 3.3 3.5 4.5 4.5 4.5 5.00 4.7 Operating 4.5 4.0 3.6 4.1 4.8 4.8 4.5 5.25 5.0

Additionally, th e population average of t he sound pressure measured o n e meter above the center of th e drive in idle mode will no t exceed 36 dB.

Upper Limit Sound Power Requirements (Bels) for C4x Models

Octave Band Center Frequency (Hz) A-weighted (see notes)

125 250 500 1K 2K 4K 8K Maximum Mean Idle 4.6 3.5 3.3 3.5 4.5 4.8 4.8 5.0 4.7 Operating 4.6 4.0 3.6 4.1 5.1 4.8 4.8 5.3 5.0

Additionally, th e population average of t he sound pressure measured o n e meter above the center of th e drive in idle mode will no t exceed 41 dBA.

Notes:

1. Th e above octave band and maximum sound power levels are statistical upper limits of the sound power levels. See C-B 1-1710-027 an d C-S 1-1710-006 for further explanation.

2. T he drive's are tested after a minimum of 20 minutes warm-up in idle mode.

3. Th e operating mod e is simulated by seeking at a rate between 28 and 32 seeks per second.

4. The mean of a sample size of 10 or greater will be less than or equal t o th e stated mean with 95% confidence.

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8.0 Standards

8.1 Safety

UNDERWRITERS LABORATORY (UL) APPROVAL: The product is approved as a Recognized Component for use in Information Technology Equipment

according t o UL 1950 (without any Code 3 deviations). The UL Recognized Component marking is located o n the product.

CANADIAN STANDARDS ASSOCIATION (CSA) APPROVAL: The product is certified to CAN/CSA-C22.2 No. 950-M89 (without any D3 deviations). The CSA

certification mark is located on the product. INTERNATIONAL ELECTROTECHNICAL COMMISSION (IEC) STANDARDS The product is certified to comply to EN60950 (IEC 950 with Eu r op e an additions) by TUV Rheinland.

The T UV Rheinland Bauart mark is located o n the product. SAFE HANDLING: The product is conditioned for safe handling in regards to sharp edges and corners. ENVIRONMENT: IBM will not knowingly o r intentionally ship a ny units which during normal intended use or foreseeable

misuse, would expose the user to toxic, carcinogenic, or otherwise hazardous substances at levels above the limitations identified in t he current publications of the organizations listed below.

International Agency for Research o n Cancer (IARC) National Toxicology Program (NTP) Occupational Safety and Health Administration (OSHA) American Conference of Governmental Industrial Hygienists (ACGIH) California Governor's List of Chemical Restricted under California Safe Drinking Water and Toxic

Enforcement Act 1986 (also known as California Proposition 65) SECONDARY CIRCUIT PROTECTION REQUIRED IN USING SYSTEMS IBM has exercised care not to use a ny unprotected components or constructions that are particularly

likely to cause fire. However, adequate secondary overcurrent protection is the responsibility of the user of the product. Additional protection against the possibility of sustained combustion due to circuit or component failure may need to be implemented by the user with circuitry external t o the product. Overcurrent limit t o the drive of 10 Amps or less should provide sufficient protection.

8.2 Electromagnetic Compatibility (EMC)

FC C Requirements Pertaining t o the disk drive, IBM will provide technical support to assist users i n complying with t he

United States Federal Communications Commission (FCC) Rules and Regulations, Part 15, Subpart J Computing Devices “Class A and B Limits”. Tests for conformance t o this requirement are performed

with the disk drive mounted in the using system. VDE Requirements

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Pertaining t o the disk drive, IBM will provide technical support to assist users i n complying with t he requirements of t he German Vereingung Deutcher Elektriker (VDE) 0871/6.78, both the Individual Operation Permit (IOP) and the General Operation Permit (GOP) Limits.

CS P R Requirements Pertaining t o the disk drive, IBM will provide technical support to assist users i n complying with t he

Comite International Special des Perturbations Radio Electriques (International Special Committee on Radio Interference) CISPR 22 “Class A and B Limits”.

European Declaration of Conformity Pertaining t o the disk drive, IBM will provide technical support to assist users i n complying with t he

European Council Directive 89/336/ECC so t he final product can thereby bear the “CE” Mark of Conformity.

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Bibliography

1. Serial Storage Architecture SSA-PH (Transport Layer), X3T10.1/989-D_rev_01, January 19th,

1994, Editor: John Scheible.

2. Serial Storage Architecture SSA-SCSI (SCSI-2 Mapping), SSA-UIG/93-036_rev_01, January 20th, 1994, Editor: John Scheible.

3. Serial Storage Architecture SSA-PH (Transport Layer), UIG95PH-9509_Revision_1, June 19th, 1995, Editor: Adge Hawes.

4. Serial Storage Architecture SSA-SCSI-2 Protocol, UIG/95SP-9508_Revision_1, Ma y 25th, 1995, Editor: No r man Apperley.

5. Ultrastar X P (DFHC) SS A Models Interface Spec- ification, AZ09-0100-04E, February 20th, 1995.

6. Ultrastar X P (DFHC) SS A Models Produc Hard- ware Specification, RZ09-0104-04E, J an 1 st 1994.

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