Hyundai H-MP718 Service Manual

Service Manual

Converted Frolov V.V. 09/04

V1.2

H-MP718, H-MP738

Precautions for Repair Work

(Provides general guidelines for undertaking safe and efficient repair work.)

※ Please read the following cautions, notes and warnings before any repair action.

 AC Power Cord：

Don’t short the pins together when you use. Don’t damage the AC power cord. Don’t put the AC power cord near the fire source. Take care about the input power specify.

 Battery Pack：

Don’t short the terminals together. Don’t put battery pack near the fire source. Only use the standard battery and charger.

 Component polarity：

Please check the components polarity before soldering

 ESD： Semiconductor devices are easily damage by electric discharge To protect these

drives from ESD a wrist strap connected to ground must be worn. In addition to this work surface must be covered with an anti-electrostatic mat, which should be grounded.

 Grounding： Each test equipment should have electrically grounding, the third pin

provide a safety feature. Ensure the electrical outlet contains grounding feature and connect to ground

 Soldering and De-soldering： First the soldering-iron（or hot air tools）should have

ESD protective feature and fixed the temperature about 300℃. The soldering tip should not be in contact with components or PCB tracks for longer than 2 seconds. Before soldering and de-soldering ensure the cellular phone is power off and disconnected from the power source. Heat the pad on the PCB and the lead, accurately and quickly apply solder, remove heat and cool. After soldering is finished, ensure that all solder joints are of good quality such as no dry joints, solder bridges, cracks or excess solder. After soldering is finished, use a cotton cloth to clean PCB.

 Test equipment calibration：

The test equipment should be calibrated before used and should be calibration periodical.

 Cleaning：

Before soldering and de-soldering ensure the cellular phone is power off

and disconnected from the power source. Use a soft cotton cloth to clean cellular phone’s surface. Never use benzene or any other chemical to clean cellular phone.

 Confidential：

The circuitry within this cellular phone contains several components which are regarded as company confidential. Only TCL specified parts as replacements.

 RF injury：

To avoid RF injury, direct exposure to radio frequency energy should be avoid. To avoid RF injury, do not touch the antenna directly.

 PCB handling：

It is recommend that cotton gloves are worn during repair work. Don’t crash connector finger

Chapter 1 Outer View

I. Model 718 Outer View

1. The cell phone has a diamond nameplate on main panel and double single-color LCDs (65000 shades) as shown in Fig. 1 and Fig. 2:

Fig. 1 Fig. 2

2. The side view is shown in Fig. 3 and Fig. 4. There are two side buttons and one RF port. The side keys are usually used to regulate volume and to switch time mode.

Fig. 3 Fig. 4

II. Model 728 Outer View

Chapter 2 Dismantling and Assembly

1. Unscrew and remove antenna, and remove screws with a Philips driver (two screws on main back case) as shown in Fig. 5 and Fig.6:

Fig. 5 Fig. 6

2. Insert a small blade between the main panel case and main back case, and move it slowly up and down to unlock the buckle between the two. Mind not to damage the cases (Fig. 7 and Fig. 8):

Fig. 7 Fig. 8

3. Unlock the two buckles on the other side and push the cases with force towards

different directions. Mind not to scratch cases (Fig. 9 and Fig. 10):

Fig. 9 Fig. 10

4. Mind not to damage the antenna contact, earphone cap and the two buckles at the

top of cases when splitting them. The inside view is shown in Fig. 11 and Fig. 12:

5. Use an iron to remove FPC line solder points and disconnect FPC from the

mainboard with a pair of forceps. Mind not to damage the cases or break the FPC line (Fig. 13 and Fig. 14):

6. To separate flip component from main panel, hold the main panel in hand and use a

hook to push flip component by the axis. When the axis leaves main panel, press the axis with hook and push flip component out (Fig. 15 and Fig. 16):

7. The flip component has two screws. Hold flip component in hand, remove screw

cap with a pair of forceps and remove screws with a screwdriver (Fig. 17 and Fig. 18):

8. Hold flip component in hand, insert a small blade into flip component and move it

slowly to the second buckle (Fig. 19 and Fig. 20):

1. 9. Separate flip panel from flip back and attach a transparent film on sub LCD. Do not touch

LCD surface with fingers. Remove LCD component along the bend of the FPC line. Do not damage FPC line (Fig. 21 and Fig. 22):

2. 10. Attach a transparent film on main LCD of LCD component. Do not touch LCD surface

with fingers. LCD surface scratch should be absolutely avoided. Otherwise, the LCD might be destructed (Fig. 23):

Fig. 23

11. The front and back view of the mainboard is given in Fig. 24 and Fig. 25. Do not spoil such

peripheral devices as side buttons, button springs and shield cover:

12. The assembly of cell phone is contrary to the dismantling. During the assembly, do not remove

LCD film, and buckles and elements soldering should be installed in right position to avoid element damage. Special attention should be paid to the prevention of dirt. LCD surface should be cleaned and cell phone tested after assembly.

II. Models 728 and 738 Dismantling Flow

1. 1. The main back has two screws. Hold cell phone in hand and remove screws with a Philips driver

as shown below:

2. 2. As shown in Fig. 5, hold cell phone in hand, insert a small blade in cell phone from lower

end, and Otherwise, it will be unable to reassemble.

3. 3. Hold cell phone by the other end, insert small blade into bottom end on the other side and

move it slowly upward to the first buckle (this only one buckle) (Fig. 7).

4. 4. Hold flip component and main panel in one hand, and main back in the other. Turn main

back left and right slightly and pull upward at the same time. Make it tender to avoid damage to the buckle at the top of main back.

5. 5. Separate main panel from main back as shown below:

6. 6. As shown in figure below. Hold sides of main panel in both hands, press mainboard

bottom with two thumbs and push upward and remove mainboard from main panel case.

7. 7. Hold FPC line and use a iron to remove it and then separate mainboard from flip

component.

8. 8. When separating flip component from main panel, hold main panel in hand, press axis

with a hook and push flip component slightly. When axis leaves main panel, press it with hook and push out flip component. Mind not to scratch the case or break the FPC line.

move it upward till the second buckle. Mind not to scratch cases or damage case buckle.

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