Huawei MediaPad S7 PRO Schematics

S7-PRO Maintenance Manual (Basic Version V2.1)

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Mediapad Maintenance Manual (Basic Version V2.1)

Huawei Technologies Co., Ltd.

All Rights Reserved

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Contents

1 Product Introduction .................................................................................................................... 4

1.1 Appearance ....................................................................................................................................................... 4

1.2 S7 PRO Models ................................................................................................................................................ 4

1.3 Product Specifications ...................................................................................................................................... 4

2 Maintenance Instructions ............................................................................................................ 6

2.1 Application Scope ............................................................................................................................................ 6

2.2 Maintenance Precautions .................................................................................................................................. 6

2.3 Maintenance Information ................................................................................................................................. 6

3 Exploded View Drawing ............................................................................................................. 7

4 Components on the Main Board ................................................................................................ 8

4.1 Diagram of Components on the Mediapad Main Board ................................................................................... 8

4.2 BOM List ......................................................................................................................................................... 9

5 Software Upgrade ....................................................................................................................... 14

5.1 Preparation ..................................................................................................................................................... 14

5.2 Upgrade Using the Micro SD Card ................................................................................................................ 14

5.2.1 Upgrade Process .................................................................................................................................... 14

5.2.2 Troubleshooting .................................................................................................................................... 15

5.3 Upgrade Using the USB ................................................................................................................................. 16

5.3.1 Entering the USB Upgrade Mode ......................................................................................................... 16

5.3.2 Installing the USB Device Driver ......................................................................................................... 16

5.3.3 Programming Using the QPST Software .............................................................................................. 19

5.3.4 Troubleshooting .................................................................................................................................... 24

5.4 Viewing the Software Version ........................................................................................................................ 26

6 Maintenance Tools ...................................................................................................................... 26

7 Disassembly Procedures ............................................................................................................ 28

8 Assembly Procedures ................................................................................................................. 33

9 Troubleshooting for Common Failures .................................................................................. 37

9.1 Principle ......................................................................................................................................................... 37

9.2 Power-on Failure ............................................................................................................................................ 40

9.2.1 Power-on Failure — High Current ........................................................................................................ 47

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9.2.2 Power-on Failure — Low Current ........................................................................................................ 50

9.3 Charge Failure ................................................................................................................................................ 51

9.4 Failure to Identify SIM Card ................................................................ ................................ .......................... 52

9.5 Failure to Identify SD Card ............................................................................................................................ 54

9.6 Display Failure ............................................................................................................................................... 58

9.7 Touchscreen Failure ....................................................................................................................................... 60

9.8 Audio Failure .................................................................................................................................................. 61

9.8.1 Speaker Failure ..................................................................................................................................... 61

9.8.2 Headset Failure ..................................................................................................................................... 63

9.9 Camera Failure ............................................................................................................................................... 63

9.10 Vibration Failure .......................................................................................................................................... 64

9.11 RF Failure ..................................................................................................................................................... 65

9.12 Maintenance Procedures for Transmit Failure.............................................................................................. 69

9.12.1 WCMDA2100 Transmit Calibration Failure ....................................................................................... 69

9.12.2 WCMDA1900 Transmit Calibration Failure ....................................................................................... 70

9.12.3 AWS Transmit Calibration Failure ...................................................................................................... 71

9.12.4 WCMDA850 Transmit Calibration Failure ......................................................................................... 72

9.12.5 WCMDA900 Transmit Calibration Failure ......................................................................................... 73

9.12.6 GSM HB Transmit Calibration Failure ............................................................................................... 74

9.12.7 GSM LB Transmit Calibration Failure................................................................................................ 75

9.13 Maintenance Procedures for Receiving Failure............................................................................................ 76

9.13.1 Maintenance Procedures for WCDMA Receiving Failure .................................................................. 76

9.13.2 Maintenance Procedures for GSM Receive Failure ................................................................ ............ 77

9.14 GPS Failure .................................................................................................................................................. 78

9.15 Wi-Fi/BT Failure .......................................................................................................................................... 80

10 Diagram of Soldered Connections on PCB and BGA Chip .............................................. 82

11 Function Test .............................................................................................................................. 82

11.1 MMI Test ...................................................................................................................................................... 82

11.2 Voice Call Test .............................................................................................................................................. 96

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1 Product Introduction

Model

Specification

Standard and Frequency Band

S7-301u

UMTS 900

UMTS 900 MHz/2100 MHz

S7-302u

UMTS 850

UMTS 850 MHz/1900 MHz/2100 MHz

S7-303u

UMTS AWS

UMTS 1900 MHz/2100 MHz/AWS

Item

Description

Dimensions (H
x W x D)

190 mm x 124 mm x 10.5 mm
Weight

About 390 g

1.1 Appearance

1.2 S7 PRO Models

The following table lists the S7-PRO models and related descriptions.
The MediaPad has several models. The following table lists the differences between these

models.

1.3 Product Specifications

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Item

Description

Power supply
Input: 100–240 V AC, 50 Hz/60 Hz

Output: 5 V DC, 2.0 A

Antenna

Built-in antenna

Technical
standards

3GPP FDD Release 6

WCDMA 900/2100 MHz & HSDPA 14.4 Mbit/s & GSM/GPRS/EDGE

850/900/1800/1900 MHz

S7-PRO-301u
frequency band

850 MHz (CLR): 824 MHz-849 MHz/869 MHz-894 MHz
(uplink/downlink)

900 MHz (GSM): 880 MHz-915 MHz/925 MHz-960 MHz
(uplink/downlink)

1900 MHz (PCS): 1850–1910 MHz/1930–1990 MHz (uplink/downlink)

2100 MHz (IMT): 1920–1980 MHz/2110–2170 MHz (uplink/downlink)

AWS: 1710–1755 MHz/2110–2155 MHz (uplink/downlink)

Battery

Li-ion battery

3.7 V, 4100 mAh

Video playback time: about 6 hours

Standby time: about 369 hours

Interface

3.5 mm TRRS stereo headset interface

MicroSD card slot: compatible with an SDHC card of a maximum
capacity of 32 GB

USB port: Micro USB 2.0

HDMI: HDMI 1.3b type D

SIM card slot

Display screen

Type: IPS LCD, Glare

Size: 7 inches

Resolution: WXGA (1280x800 pixels), 217 ppi

Visual angles: upward 89°/downward 89°/leftward 89°/rightward 89°

Colors: 16,000,000 colors

Contrast: 800:1

Brightness: 400 cd/m2 (maximum)

Touchscreen

7-inch captive touchscreen

Camera

Front camera: 1.3 megapixels, rear camera: 5 megapixels, autofocus

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Item

Description

GPS

Qualcomm GPS

Bluetooth (BT)
Standard: 2.1 + EDR

Configuration: A2DP, HFP, HSP, and PBAP

Wi-Fi
Standards: IEEE 802.11b/g/n, WEP, WPA, and WPA2

Working frequency band: 2.4 GHz

Working
environment

Working temperature: –10°C to +45°C (14°F to 113°F)

Storage temperature: –40°C to +70°C (–40°F to 158°F)

Humidity: 5% to 95% RH (non-condensing)

Electrostatic discharging is the major cause for the damage of sensitive electronic
components. Each service site should attach great importance to the electrostatic
discharging and strictly observe the antistatic measures described in this manual.

2 Maintenance Instructions

2.1 Application Scope

This document provides instructions for the maintenance of Huawei products by technical
personnel at service sites authorized by Huawei. This manual is Huawei proprietary and is
only permitted to be used by authorized service sites or companies. Although every effort has
been made to ensure the accuracy, mistakes may still be found. If you find any error or have
any suggestions, contact our customer service personnel.

2.2 Maintenance Precautions



Only qualified technicians are allowed to perform maintenance and calibration.



Always wear ESD wrist straps during operation and conduct the maintenance in an ESD
room.



Ensure that all components, screws, and insulators are properly installed after
maintenance and calibration. Ensure that all cables are properly connected.



Ensure that the soldering complies with environmental requirements and is lead-free.

2.3 Maintenance Information

To obtain related product and maintenance information, visit

http://www.huaweidevice.com/cn/technicaIndex.do

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3 Exploded View Drawing

1

13

2 3

4

5

6

14

15

16

7

8

9 10

11 12

17

18

19

20 21

22 23

No.

Description

Quantity

1

Rear camera lens

1

2

Cover B assembly

1

3

POGO PIN

1

4

Diversity antenna support

1

5

Speaker

1

6

Rear camera

1

7

Headset connector

1 8 Speaker FPC

1 9 Main board

1

10

LCD

1

11

Cover A assembly

1

12

TP

1

The exploded view shows the phone structure only and cannot be regarded as a reference for
applying for spare parts.

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No.

Description

Quantity

13

Left decorative cover

1

14

Right decorative cover

1

15

Side buttons

1

16

Battery

1

17

Wi-Fi antenna support

1

18

MIC-FPC

1

19

MIC

1

20

SUB FPC

1

21

Front camera

1

22

DC-JACK

1

23

SUB-PCB-FPC

1

J48 battery socket

Failure symptom:
power-on failure
with no DC
inserted

U7 power supply
control IC
(PM8058)

Failure symptom:
power-on failure
and other failures

U12 NAND Flash-
EMMC-WLAN

Failure symptom:
WLAN failure

U34 CPU
(MSM8260)

Failure symptom:
power-on failure,
RF failure, and
other failures

J10 touchscreen

connector

Failure symptom:
nothing happens
when you touch the
screen

U48 charger IC
Failure symptom:
battery charging
fails

J24 SIM card
socket

Failure symptom:
SIM registration
fails

U36 touchscreen
and speaker driver
IC

Failure symptom:
touchscreen and
speaker failure

U1 LCD

management IC

Failure symptom:
display failure

U2 power
management IC
(PM8901)

Failure symptom:
power-on failure
and other failures

U20/22/24/25 RF
power module

Failure symptom:
abnormal RF
transmitter power

U47 RF power
module

Failure symptom:
RF failure

U23 RF modem
Failure symptom:
RF failure

J21 speaker FPC
connector

Failure symptom:
no voice

U33 RF signaling
regulating sensor

Failure symptom:
RF failure

J2 rear camera
connector

Failure symptom:
rear camera failure

U40 LCD
management IC

Failure symptom:
display failure

J31 Headset
connector

Failure symptom:
no voice

J12 connector for

power-on and voice
buttons

Failure symptom:
failure to power on
and adjust the voice

U6 6D sensor with
accelerometer and
compass

Failure symptom:
accelerometer and
compass failure

LCD-FPC

connector

Failure symptom:
display failure

U17 voltage-level
transformer IC

Failure symptom:
display failure

U7 power supply
control IC
(PM8058)

Failure symptom:
power-on failure
and other failures

U12 NAND Flash­EMMC-WLAN

Failure symptom:
WLAN failure

U34 CPU
(MSM8260)

Failure symptom:
power-on failure,
RF failure, and
other failures

J10 touchscreen

connector

Failure symptom:
nothing happens
when you touch the
screen

U48 charger IC
Failure symptom:
battery charging
fails

J24 SIM card
socket

Failure symptom:
SIM registration
fails

U36 touchscreen
and speaker driver
IC

Failure symptom:
touchscreen and
speaker failure

U1 LCD

management IC

Failure symptom:
display failure

U2 power
management IC
(PM8901)

Failure symptom:
power-on failure
and other failures

U20/22/24/25 RF
power module

Failure symptom:
abnormal RF
transmitter power

U47 RF power
module

Failure symptom:
RF failure

U23 RF modem
Failure symptom:
RF failure

J21 speaker FPC
connector

Failure symptom:
no sound

U33 RF signal
regulating sensor

Failure symptom:
RF failure

J2 rear camera
connector

Failure symptom:
rear camera failure

U40 LCD
management IC

Failure symptom:
display failure

J31 Headset
connector

Failure symptom:
no sound

J12 connector for
power-on and
sound

Failure symptom:
failure to power on
and adjust the
sound

U6 6D sensor with
accelerometer and
compass

Failure symptom:
accelerometer and
compass failure

LCD-FPC

connector

Failure symptom:
display failure

U17 level shifter IC

Failure symptom:
display failure

4 Components on the Main Board

4.1 Diagram of Components on the Mediapad Main Board

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U4 voltage-level translator
for RF power amplifier
control signal

Failure symptom: RF
failure

U13 RF switch

Failure symptom: RF
failure

U3 RF low noise amplifier

Failure symptom: RF
failure

U19 voltage-level
transformer IC for
touchscreen signal

Failure symptom:
touchscreen failure

J8 auxiliary board FPC
connector for USB/HDMI/
SD card

Failure symptom: USB/
HDMI/SD card failure

U10 voltage-level
transformer IC

Failure symptom:
coulometer failure

U1001 current limiting IC

Failure symptom: USB­HOST faults

U37 coulometer

Failure symptom:
coulometer failure

U16 voltage-level
transformer IC for
touchscreen signal

Failure symptom:
touchscreen failure

U15 speaker power
amplifier

Failure symptom: no sound

U14 speaker power
amplifier

Failure symptom: no sound

U11 BT/Wi-Fi driver IC

Failure symptom: BT/Wi-Fi
failure

. U18 coulometer I2C
voltage-level transformer IC

Failure symptom:
coulometer failure

U9 voltage-level
transformer IC for
touchscreen I2C signal

Failure symptom:
touchscreen failure

U35 touchscreen power
management IC

Failure symptom:
touchscreen failure

J6 front camera connector

Failure symptom: front
camera failure

BOM

Description

Location

15010248

Schottky diode-30 V-0.2 A-0.5 V

D1

15040238

Transient voltage suppression diode-6
V-14 V-10 W-12 A

D10, D1002, D1003, D1004,
D1005, D1006, D1007, D1100,
D13, D17,

D18, D19, D2, D23, D24, D25,
D26,

D27, D3, D5, D6, D9

15010235

Schottky diode-40 V-0.5 A-0.425 V

D12

14240309

IO connector-female-5pin-WTB
connector-SMT

J1

14240181

BTB connector-female-24-0.4 mm-1
mm-SMT

J2, J6

4.2 BOM List

The following table is provided for reference only and is subject to change without notice.
The latest component list is available on corresponding Huawei system. If you have any
questions, contact the local technical personnel

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BOM

Description

Location

14240004

RF connector-straight-female-SMT

J19, J3, J4

51621274

Main antenna SMT spring

J13, J14, J15, J20, J23, J27, J30,
J32, J5

14240210

BTB connector-female-40Pin-0.4
mm-0.9 mm

J8, J9

14240199

BTB connector-female-10pin-0.4
mm-0.9 mm

J10, J12, J21

51621023

Ground spring

J11, J25, J26, J28, J29, J33,
J34, J35, J36, J37, J38, J39, J40,
J41, J42, J43, J44, J45, J46, J48

14240301

Card connector-SIM card socket

J24

14240283

FPC connector-11-0.3 mm-0.1 mm-0.6
mm

J31
15060228

MOSFET-P-channel

Q1, Q17, Q2, Q9

15050014

NPN transistor

Q22, Q5

15060153

MOSFET-N-channel

Q1000, Q1001, Q1101, Q1102,
Q1103,

Q1104, Q1105, Q1206, Q19

39110582

Power Driver-Boost DCDC

U1

39200270

Power management IC-PM8901

U2

47090034

RF low noise
amplifier-869-894/1930-1990/2110-217
0 MHz

U3
36020366

CMOS-4BIT bidirectional voltage-level
translator with auto direction sensing

U17, U19, U4

38140016

Semiconductor sensor-6-axis sensor
with accelerometer and compass

U6

39200177

Dedicated power management chip of
Qualcomm MSM7x30 series (PM8058)

U7

40020131

DDR2 DRAM-8Gb LPDDR2-800
MHz-32 bit

U8

36020395

CMOS-4BIT bidirectional voltage-level
translator with auto direction
sensing-I2C bus

U10, U16, U18, U9

39200222

Chip with the combination of single
band 2.4GHz WLAN, Bluetooth 2.1, and
FM-BCM4329

U11

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BOM

Description

Location

47140045

RF switch-0.5–2.5 GHz

U13

39080077

Audio power amplifier

U14, U15

13080038

Duplexer-RX: 2110–2170 MHz/TX:
1920–1980 MHz

U20

13080060

Duplexer-TX: 824–849 MHz/RX:
869–894 MHz

U21
47100280

Power module-1920–1980 MHz

U22

39200249

WCMDA/GSM radio transceiver
(QTR8615)

U23
47100289

Power module-1850-1910 MHz

U24

47100360

RF power module-1710-1785 MHz

U25

13080072

Duplexer-RX: 2110–2155 MHz/TX:
1710–1755 MHz

U31
38140022

Semiconductor-capacitive sensor

U33

39200289

Digital base band processor-1.2
GHz-MSM8260

U34
39110548

LDO-3.3 V

U35

39110567

Switching regulators-2.0–5.5 V

U36

39070073

Power management IC-0.3–2.75
V-battery coulometer

U37
43140104

Connector controller-LCD Drive IC

U40

13080082

Duplexer-RX: 1930–1990 MHz/TX:
1850–1910 MHz

U41
47090042

RF low noise amplifier-0.5–3 GHz

U42

47140049

RF switch-0.5–3.0 GHz

U43

47140054

RF switch-600–2700 M

U46

47100307

RF power module-824–849 MHz,
880–915 MHz, 1710–1785 MHz,
1850–1910 MHz

U47
39070085

Battery management IC-4.1–16
V-DC-DC charging chip

U48

39070055

Battery management IC-2.5–6.5
V-average current limiting-percentage
(10%)-DRV

U1001
12020141

Crystal oscillator-19.2 MHz

X1

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BOM

Description

Location

12020171

Crystal oscillator-27 MHz

X2

12020125

Crystal oscillator-0.032768 MHz

X3

12020168

Crystal oscillator-37.4 MHz

X4

13010262

SAW filter-2140 MHz

Z1

13010177

SAW filter-1960 MHz

Z3

13010175

SAW filter-1732.5 MHz

Z4

13010265

SAW filter-1574.42 MHz/1605.89 MHz

Z5

07040064

Varistor-8 V-4 V-30
V-SMT-0405-ESD+EMI noise filter

Z10, Z9
13030052

Ceramics filter-2450 MHz

Z11

07040072

ESD_EMI Filter-14 V-30 pF-800–3000
MHz

Z12
13010131

Sound filter-1960 MHz

Z16

13010148

Sound filter-2140 MHz

Z17

13080106

Duplexer-1565–1607 MHz/2400–2500
MHz

Z18
13010264

SAW filter-1590.16 MHz

Z22

40060318

NAND flash-16 GB eMMC V4.4-52
MHz

U12

03021CNP

Interface
board-MediaPad-HIDS7PIA-with TF
slot, type D HDMI, and micro USB
connector

15040238

Transient voltage suppression diode-6
V-14 V-10 W-12 A

D21, D5, D9

15040264

Transient voltage suppression diode-5.5
V-15 V-1 A

D10, D7

15040293

Transient voltage suppression diode-6
V-15 V-15 W-1.5 A

D19, D20
14240243

Card connector-micro SD receptacle

J2

14240272

IO
connector-micro_B-female-5pin-bend-S
MT

J3
14240268

IO connector-micro HDMI-19-D type

J4

14240199

BTB connector-female-10pin-0.4
mm-0.9 mm

J6

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BOM

Description

Location

14240210

BTB connector-female-40Pin-0.4
mm-0.9 mm

J8

10040059

Common mode EMI filter-20 V DC/280
mA-0805

T1

07040064

Varistor-8 V-4 V-30
V-SMT-0405-ESD+EMI noise filter

Z1

03021CNQ

Speaker
board-MediaPad-HIDS7PSK-1x1

14240200

BTB connector-male-10Pin-0.4 mm-0.9
mm

J1
03021CNW

LED board-MediaPad-HIDS7PFR-1x1

14240200

BTB connector-male-10Pin-0.4 mm-0.9
mm

J3
03021CPB

Key board-S7-301u-HIDS7PKA-1x1

14240200

BTB connector-male-10Pin-0.4 mm-0.9
mm

J1

38140014

Semiconductor sensor-ambient light
sensor

U1
03021CPF

BTB board-MediaPad-HIDS7PFI

14240221

BTB connector-male-40Pin-0.4 mm-0.9
mm

J1, J5

03021DTK

BTB to ZIF FPC bridge
board-MediaPad-HIDS7PFL

14240221

BTB connector-male-40Pin-0.4 mm-0.9
mm

J1
32050018

Vibrator-column

22020058

Speaker

22050048

Microphone

23040205

LCD module-single display

23060061

Camera module group-CMOS-1.3 M-FF

23060062

Camera module group-CMOS-5 M-AF

14240276

IO connector-DC JACK

14240340

Headset connector

27160803

Main antenna-S7-303u-(sensor FPC)
SAA

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BOM

Description

Location

23070113

Touchscreen-S7 PRO CTP with AF

27160802

Main antenna
S7-303 u-1710–2170 MHz/824–894

MHz

27160804

GPS WIFI antenna
S7-30 3u-1565–1620 MHz/2400–2500

MHz

27160805

Diversity antenna-S7-303 u-1910–2170
MHz

Item

Contents

Remarks

Preparation

Battery

At least two bars on the battery level
indicator

Micro SD card

More than 512 M

USB cable

BOM: 97065432

PC

Windows 2000, Windows XP

File

S7-30Xu V100R001C002B027T01
(not the final version)

This version is only for reference.
Download the latest version for
upgrade (the upgrade using USB).

Tool

eMMC Software Download

For upgrade using the USB

Upgrade
method

Using the Micro SD card

Using the USB

5 Software Upgrade

5.1 Preparation

5.2 Upgrade Using the Micro SD Card

5.2.1 Upgrade Process

Step 1 Delete the information in the Micro SD card or format the SD card.
Step 2 Create a folder named dload in the root directory of the Micro SD card, and copy the upgrade

file to dload.

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Step 3 Ensure that the board is powered off, and that the battery is fully charged or connected to a

Upgrade
State

Upgrade of the Device

Upgrade of the Board

Upgrading.

The LED indicator blinks at the
frequency of 1 Hz.

Upgrade
succeeded.

The LED indicator stays on.

Upgrade
failed.

The LED indicator blinks at the
frequency of 4 Hz.

charger. Insert the Micro SD card into the board, and the upgrade will be performed
automatically after the board is powered on.

Step 4 When the upgrade is completed, remove the SD card and press and hold the POWER button

to restart the device.

5.2.2 Troubleshooting

During the update using the SD card, if the device presents a flash screen indicating the
upgrade failure, check for any mis-operation or incorrect upgrade version. You can remove
the SD card and try it again or change the SD card.

Method to check whether the SD card is damaged:
Because the size of the upgrade package of some version is large, try to open the compressed

upgrade package that is copied to the SD card to check for damage. Remove and plug the SD
card before you open the compressed upgrade package. If you open the compressed upgrade
package directly, the opened package may be a cache on the PC. Alternatively, you can check
the reliable storage capacity of the SD card with the MyDiskTest (an SD card check tool) to
ensure that the size of the upgrade package does not exceed the storage capacity of the SD
card. For more information, see the appendix of this chapter.

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5.3 Upgrade Using the USB

5.3.1 Entering the USB Upgrade Mode

When the system is powered on, quickly press the VOLUME_UP button and the
VOLUME_DOWN button. If it is the first time for your PC to connect the USB, the message

"Found New Hardware" will be displayed, which indicates that the system has entered the
USB upgrade mode successfully, as shown in the following figure.

5.3.2 Installing the USB Device Driver

If the driver has not been installed before, you must install the driver on the PC before the
update using the USB.

Step 1 When the MediaPad is connected, it enters into the Emergency Download mode, and a

window is displayed, showing the port Qualcomm HS-USB QDLoader 9008. If the port
driver has not been installed before, a message for installing the driver will be displayed.

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Step 2 Select Choose the install from a list or specific location (Advanced). Then click Next.

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Step 3 Click Browse in the window displayed to select the USB driver to be installed, as shown in

the following figure. Then click Next.

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Step 4 If the corresponding file is found, the window indicating successful installation will be

displayed, as shown in the following figure.

Step 5 The USB port (COM15) is shown in the Device Manager window.

5.3.3 Programming Using the QPST Software

If the QPST software has been installed, run the eMMC Software Download tool and do as
follows:

Step 1 Ensure that you select Program Boot Loaders and Program MMC device.

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Step1

Step 2

Step 2 Set Flash Programmer file name to MPRG8660.hex, and set Boot Image to

8660_msimage.mbn.

Step 3 Click Browse. In the Select Port window, check whether the value of Phone is Q/QCP-XXX

(Download) (COM15), and whether the port is consistent with that shown in the Device
Manager window. Then click OK.

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NOTE

Step3

If the Q/QCP-XXX (Download) port is not found in the Select Port window, right-click the
icon in the taskbar on the lower right corner to display the QPST Configuration window. In the
displayed window, click Ports, and click Add New Port. In the Add New Port window displayed,
select corresponding USB/QC Diagnostic port. Double-click the selected port to add it to Port on the
right. Then click OK.

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The following window is displayed (if the port is available, the Q/QCP-XXX (Download) is
displayed).

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Step 4 Click Load XML def, and open the modem folder in the upgrade package in the displayed

box. Then select rawprogram0.xml in the modem folder. If the file is successfully opened,
the save path of rawprogram0.xml will be displayed in Seach path1.

Step 5 Click Load patch def, and open the modem folder in the upgrade package in the displayed

box. Then select patch0.xml in the modem folder (this step is mandatory; otherwise, the
MediaPad startup will fail).

Step 6 Select Search path2, and click the icon for browsing. Then select the apps folder in the

upgrade package in the Seach Path Folder window.

Step 7 When all preceding steps are completed, the Download button will become clickable. Then

click Download.

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Step 4

Step 5

Step 6

Step 7

Step 8 After the upgrade is completed, press and hold the Power button for more than 10 seconds to

re-start the MediaPad.

5.3.4 Troubleshooting

Click Download, if the following dialog box for installing the driver is displayed, as shown in
the following figure. You can ignore it, because you may enter the trusted mode that requires
no driver (USB MassStorage port is used in the trusted mode).

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Step 1 In this mode, the message "Remote devices wait for time out" will be displayed occasionally,

or the message "Image Download Failed. Cookie (if present) not received" will be displayed
during restart.

In these cases, you may repeat the preceding steps. If the download fails, restart the MediaPad
and connect it to the PC to check whether the upgrade is conducted in the trusted mode using
the QPST software (that is, the Qualcomm MMC Storage USB Device is displayed). Then
perform the upgrade using the USB according to the steps for upgrade in the trusted mode.

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Name: constant-temperature hot air gun
Purpose: heat components

Step 2 If the message "Phone is not in download mode" is displayed, you may not uncheck Program

Boot Loaders (mandatory for upgrade in the trusted mode). Then uncheck Program Boot
Loaders as shown in the following figure.

Click Scan&&Download, if the message "port open" is displayed, check whether the driver
is properly installed, and whether DBAdapter Reserved Interface port functions well.

5.4 Viewing the Software Version

In the standby state, choose Settings > About phone to view the information about the
software version.

6 Maintenance Tools

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Name: constant-temperature hot air gun
Purpose: heat components

Name: soldering iron
Purpose: soldering during maintenance

Name: DC power
Purpose: supply power

Name: soldering
Purpose: secure the main board.

Name: lead-free solder wire
Purpose: soldering

Name: digital multimeter
Purpose: measurement during maintenance

Name: tool kit
Purpose: assemble and disassemble the device

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Name: electric screwdriver
Purpose: fasten and remove screws.

Name: small sucker (diameter: about 25 mm)
Purpose: remove the upper decorative cover.

1.

Ensure that the ESD wrist strap is
properly grounded.

2.

Disassembly procedures are as shown
below.

3.

Remove the lower decorative cover
with the sucker.

4.

Remove the upper decorative cover with
the sucker.

7 Disassembly Procedures

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5.

Remove the six screws on the rear
cover.

6.

Unlock the rear cover.

7.

Disassemble the rear cover.

8.

Loosen the BTB connector of the battery.

9.

Take out the glued battery.

10.

Loosen the BTB connector marked in the
picture.

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11.

Remove the 5-megapixel camera.

12.

Loosen the BTB connector of the headset.

13.

Remove the JACK FPC of the headset.

14.

Remove the screws marked in the picture.

15.

Remove the connector of the headset.

16.

Remove the auxiliary board.