Huawei MediaPad S7 PRO Schematics

S7-PRO Maintenance Manual (Basic Version V2.1)

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Mediapad Maintenance Manual (Basic Version V2.1)

Huawei Technologies Co., Ltd.

S7-PRO Maintenance Manual (Basic Version V2.1)

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Contents

1 Product Introduction .................................................................................................................... 4

1.1 Appearance ....................................................................................................................................................... 4

1.2 S7 PRO Models ................................................................................................................................................ 4

1.3 Product Specifications ...................................................................................................................................... 4

2 Maintenance Instructions ............................................................................................................ 6

2.1 Application Scope ............................................................................................................................................ 6

2.2 Maintenance Precautions .................................................................................................................................. 6

2.3 Maintenance Information ................................................................................................................................. 6

3 Exploded View Drawing ............................................................................................................. 7

4 Components on the Main Board ................................................................................................ 8

4.1 Diagram of Components on the Mediapad Main Board ................................................................................... 8

4.2 BOM List ......................................................................................................................................................... 9

5 Software Upgrade ....................................................................................................................... 14

5.1 Preparation ..................................................................................................................................................... 14

5.2 Upgrade Using the Micro SD Card ................................................................................................................ 14

5.2.1 Upgrade Process .................................................................................................................................... 14

5.2.2 Troubleshooting .................................................................................................................................... 15

5.3 Upgrade Using the USB ................................................................................................................................. 16

5.3.1 Entering the USB Upgrade Mode ......................................................................................................... 16

5.3.2 Installing the USB Device Driver ......................................................................................................... 16

5.3.3 Programming Using the QPST Software .............................................................................................. 19

5.3.4 Troubleshooting .................................................................................................................................... 24

5.4 Viewing the Software Version ........................................................................................................................ 26

6 Maintenance Tools ...................................................................................................................... 26

7 Disassembly Procedures ............................................................................................................ 28

8 Assembly Procedures ................................................................................................................. 33

9 Troubleshooting for Common Failures .................................................................................. 37

9.1 Principle ......................................................................................................................................................... 37

9.2 Power-on Failure ............................................................................................................................................ 40

9.2.1 Power-on Failure — High Current ........................................................................................................ 47

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9.2.2 Power-on Failure — Low Current ........................................................................................................ 50

9.3 Charge Failure ................................................................................................................................................ 51

9.4 Failure to Identify SIM Card ................................................................ ................................ .......................... 52

9.5 Failure to Identify SD Card ............................................................................................................................ 54

9.6 Display Failure ............................................................................................................................................... 58

9.7 Touchscreen Failure ....................................................................................................................................... 60

9.8 Audio Failure .................................................................................................................................................. 61

9.8.1 Speaker Failure ..................................................................................................................................... 61

9.8.2 Headset Failure ..................................................................................................................................... 63

9.9 Camera Failure ............................................................................................................................................... 63

9.10 Vibration Failure .......................................................................................................................................... 64

9.11 RF Failure ..................................................................................................................................................... 65

9.12 Maintenance Procedures for Transmit Failure.............................................................................................. 69

9.12.1 WCMDA2100 Transmit Calibration Failure ....................................................................................... 69

9.12.2 WCMDA1900 Transmit Calibration Failure ....................................................................................... 70

9.12.3 AWS Transmit Calibration Failure ...................................................................................................... 71

9.12.4 WCMDA850 Transmit Calibration Failure ......................................................................................... 72

9.12.5 WCMDA900 Transmit Calibration Failure ......................................................................................... 73

9.12.6 GSM HB Transmit Calibration Failure ............................................................................................... 74

9.12.7 GSM LB Transmit Calibration Failure................................................................................................ 75

9.13 Maintenance Procedures for Receiving Failure............................................................................................ 76

9.13.1 Maintenance Procedures for WCDMA Receiving Failure .................................................................. 76

9.13.2 Maintenance Procedures for GSM Receive Failure ................................................................ ............ 77

9.14 GPS Failure .................................................................................................................................................. 78

9.15 Wi-Fi/BT Failure .......................................................................................................................................... 80

10 Diagram of Soldered Connections on PCB and BGA Chip .............................................. 82

11 Function Test .............................................................................................................................. 82

11.1 MMI Test ...................................................................................................................................................... 82

11.2 Voice Call Test .............................................................................................................................................. 96

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1 Product Introduction

Model

Specification

Standard and Frequency Band

S7-301u

UMTS 900

UMTS 900 MHz/2100 MHz

S7-302u

UMTS 850

UMTS 850 MHz/1900 MHz/2100 MHz

S7-303u

UMTS AWS

UMTS 1900 MHz/2100 MHz/AWS

Item

Description

Dimensions (H x W x D)

190 mm x 124 mm x 10.5 mm Weight

About 390 g

1.1 Appearance

1.2 S7 PRO Models

The following table lists the S7-PRO models and related descriptions. The MediaPad has several models. The following table lists the differences between these

models.

1.3 Product Specifications

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Item

Description

Power supply Input: 100–240 V AC, 50 Hz/60 Hz

Output: 5 V DC, 2.0 A

Antenna

Built-in antenna

Technical standards

3GPP FDD Release 6

WCDMA 900/2100 MHz & HSDPA 14.4 Mbit/s & GSM/GPRS/EDGE

850/900/1800/1900 MHz

S7-PRO-301u frequency band

850 MHz (CLR): 824 MHz-849 MHz/869 MHz-894 MHz (uplink/downlink)

900 MHz (GSM): 880 MHz-915 MHz/925 MHz-960 MHz (uplink/downlink)

1900 MHz (PCS): 1850–1910 MHz/1930–1990 MHz (uplink/downlink)

2100 MHz (IMT): 1920–1980 MHz/2110–2170 MHz (uplink/downlink)

AWS: 1710–1755 MHz/2110–2155 MHz (uplink/downlink)

Battery

Li-ion battery

3.7 V, 4100 mAh

Video playback time: about 6 hours

Standby time: about 369 hours

Interface

3.5 mm TRRS stereo headset interface

MicroSD card slot: compatible with an SDHC card of a maximum capacity of 32 GB

USB port: Micro USB 2.0

HDMI: HDMI 1.3b type D

SIM card slot

Display screen

Type: IPS LCD, Glare

Size: 7 inches

Resolution: WXGA (1280x800 pixels), 217 ppi

Visual angles: upward 89°/downward 89°/leftward 89°/rightward 89°

Colors: 16,000,000 colors

Contrast: 800:1

Brightness: 400 cd/m2 (maximum)

Touchscreen

7-inch captive touchscreen

Camera

Front camera: 1.3 megapixels, rear camera: 5 megapixels, autofocus

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Item

Description

GPS

Qualcomm GPS

Bluetooth (BT) Standard: 2.1 + EDR

Configuration: A2DP, HFP, HSP, and PBAP

Wi-Fi Standards: IEEE 802.11b/g/n, WEP, WPA, and WPA2

Working frequency band: 2.4 GHz

Working environment

Working temperature: –10°C to +45°C (14°F to 113°F)

Storage temperature: –40°C to +70°C (–40°F to 158°F)

Humidity: 5% to 95% RH (non-condensing)

Electrostatic discharging is the major cause for the damage of sensitive electronic components. Each service site should attach great importance to the electrostatic discharging and strictly observe the antistatic measures described in this manual.

2 Maintenance Instructions

2.1 Application Scope

This document provides instructions for the maintenance of Huawei products by technical personnel at service sites authorized by Huawei. This manual is Huawei proprietary and is only permitted to be used by authorized service sites or companies. Although every effort has been made to ensure the accuracy, mistakes may still be found. If you find any error or have any suggestions, contact our customer service personnel.

2.2 Maintenance Precautions



Only qualified technicians are allowed to perform maintenance and calibration.



Always wear ESD wrist straps during operation and conduct the maintenance in an ESD room.



Ensure that all components, screws, and insulators are properly installed after maintenance and calibration. Ensure that all cables are properly connected.



Ensure that the soldering complies with environmental requirements and is lead-free.

2.3 Maintenance Information

To obtain related product and maintenance information, visit

http://www.huaweidevice.com/cn/technicaIndex.do

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3 Exploded View Drawing

1

13

2 3

4

5

6

14

15

16

7

8

9 10

11 12

17

18

19

20 21

22 23

No.

Description

Quantity

1

Rear camera lens

1

2

Cover B assembly

1

3

POGO PIN

1

4

Diversity antenna support

1

5

Speaker

1

6

Rear camera

1

7

Headset connector

1 8 Speaker FPC

1 9 Main board

1

10

LCD

1

11

Cover A assembly

1

12

TP

1

The exploded view shows the phone structure only and cannot be regarded as a reference for applying for spare parts.

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No.

Description

Quantity

13

Left decorative cover

1

14

Right decorative cover

1

15

Side buttons

1

16

Battery

1

17

Wi-Fi antenna support

1

18

MIC-FPC

1

19

MIC

1

20

SUB FPC

1

21

Front camera

1

22

DC-JACK

1

23

SUB-PCB-FPC

1

J48 battery socket

Failure symptom: power-on failure with no DC inserted

U7 power supply control IC (PM8058)

Failure symptom: power-on failure and other failures

U12 NAND Flash- EMMC-WLAN

Failure symptom: WLAN failure

U34 CPU (MSM8260)

Failure symptom: power-on failure, RF failure, and other failures

J10 touchscreen

connector

Failure symptom: nothing happens when you touch the screen

U48 charger IC Failure symptom: battery charging fails

J24 SIM card socket

Failure symptom: SIM registration fails

U36 touchscreen and speaker driver IC

Failure symptom: touchscreen and speaker failure

U1 LCD

management IC

Failure symptom: display failure

U2 power management IC (PM8901)

Failure symptom: power-on failure and other failures

U20/22/24/25 RF power module

Failure symptom: abnormal RF transmitter power

U47 RF power module

Failure symptom: RF failure

U23 RF modem Failure symptom: RF failure

J21 speaker FPC connector

Failure symptom: no voice

U33 RF signaling regulating sensor

Failure symptom: RF failure

J2 rear camera connector

Failure symptom: rear camera failure

U40 LCD management IC

Failure symptom: display failure

J31 Headset connector

Failure symptom: no voice

J12 connector for

power-on and voice buttons

Failure symptom: failure to power on and adjust the voice

U6 6D sensor with accelerometer and compass

Failure symptom: accelerometer and compass failure

LCD-FPC

connector

Failure symptom: display failure

U17 voltage-level transformer IC

Failure symptom: display failure

U7 power supply control IC (PM8058)

Failure symptom: power-on failure and other failures

U12 NAND FlashEMMC-WLAN

Failure symptom: WLAN failure

U34 CPU (MSM8260)

Failure symptom: power-on failure, RF failure, and other failures

J10 touchscreen

connector

Failure symptom: nothing happens when you touch the screen

U48 charger IC Failure symptom: battery charging fails

J24 SIM card socket

Failure symptom: SIM registration fails

U36 touchscreen and speaker driver IC

Failure symptom: touchscreen and speaker failure

U1 LCD

management IC

Failure symptom: display failure

U2 power management IC (PM8901)

Failure symptom: power-on failure and other failures

U20/22/24/25 RF power module

Failure symptom: abnormal RF transmitter power

U47 RF power module

Failure symptom: RF failure

U23 RF modem Failure symptom: RF failure

J21 speaker FPC connector

Failure symptom: no sound

U33 RF signal regulating sensor

Failure symptom: RF failure

J2 rear camera connector

Failure symptom: rear camera failure

U40 LCD management IC

Failure symptom: display failure

J31 Headset connector

Failure symptom: no sound

J12 connector for power-on and sound

Failure symptom: failure to power on and adjust the sound

U6 6D sensor with accelerometer and compass

Failure symptom: accelerometer and compass failure

LCD-FPC

connector

Failure symptom: display failure

U17 level shifter IC

Failure symptom: display failure

4 Components on the Main Board

4.1 Diagram of Components on the Mediapad Main Board

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U4 voltage-level translator for RF power amplifier control signal

Failure symptom: RF failure

U13 RF switch

Failure symptom: RF failure

U3 RF low noise amplifier

Failure symptom: RF failure

U19 voltage-level transformer IC for touchscreen signal

Failure symptom: touchscreen failure

J8 auxiliary board FPC connector for USB/HDMI/ SD card

Failure symptom: USB/ HDMI/SD card failure

U10 voltage-level transformer IC

Failure symptom: coulometer failure

U1001 current limiting IC

Failure symptom: USBHOST faults

U37 coulometer

Failure symptom: coulometer failure

U16 voltage-level transformer IC for touchscreen signal

Failure symptom: touchscreen failure

U15 speaker power amplifier

Failure symptom: no sound

U14 speaker power amplifier

Failure symptom: no sound

U11 BT/Wi-Fi driver IC

Failure symptom: BT/Wi-Fi failure

. U18 coulometer I2C voltage-level transformer IC

Failure symptom: coulometer failure

U9 voltage-level transformer IC for touchscreen I2C signal

Failure symptom: touchscreen failure

U35 touchscreen power management IC

Failure symptom: touchscreen failure

J6 front camera connector

Failure symptom: front camera failure

BOM

Description

Location

15010248

Schottky diode-30 V-0.2 A-0.5 V

D1

15040238

Transient voltage suppression diode-6 V-14 V-10 W-12 A

D10, D1002, D1003, D1004, D1005, D1006, D1007, D1100, D13, D17,

D18, D19, D2, D23, D24, D25, D26,

D27, D3, D5, D6, D9

15010235

Schottky diode-40 V-0.5 A-0.425 V

D12

14240309

IO connector-female-5pin-WTB connector-SMT

J1

14240181

BTB connector-female-24-0.4 mm-1 mm-SMT

J2, J6

4.2 BOM List

The following table is provided for reference only and is subject to change without notice. The latest component list is available on corresponding Huawei system. If you have any questions, contact the local technical personnel

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BOM

Description

Location

14240004

RF connector-straight-female-SMT

J19, J3, J4

51621274

Main antenna SMT spring

J13, J14, J15, J20, J23, J27, J30, J32, J5

14240210

BTB connector-female-40Pin-0.4 mm-0.9 mm

J8, J9

14240199

BTB connector-female-10pin-0.4 mm-0.9 mm

J10, J12, J21

51621023

Ground spring

J11, J25, J26, J28, J29, J33, J34, J35, J36, J37, J38, J39, J40, J41, J42, J43, J44, J45, J46, J48

14240301

Card connector-SIM card socket

J24

14240283

FPC connector-11-0.3 mm-0.1 mm-0.6 mm

J31 15060228

MOSFET-P-channel

Q1, Q17, Q2, Q9

15050014

NPN transistor

Q22, Q5

15060153

MOSFET-N-channel

Q1000, Q1001, Q1101, Q1102, Q1103,

Q1104, Q1105, Q1206, Q19

39110582

Power Driver-Boost DCDC

U1

39200270

Power management IC-PM8901

U2

47090034

RF low noise amplifier-869-894/1930-1990/2110-217 0 MHz

U3 36020366

CMOS-4BIT bidirectional voltage-level translator with auto direction sensing

U17, U19, U4

38140016

Semiconductor sensor-6-axis sensor with accelerometer and compass

U6

39200177

Dedicated power management chip of Qualcomm MSM7x30 series (PM8058)

U7

40020131

DDR2 DRAM-8Gb LPDDR2-800 MHz-32 bit

U8

36020395

CMOS-4BIT bidirectional voltage-level translator with auto direction sensing-I2C bus

U10, U16, U18, U9

39200222

Chip with the combination of single band 2.4GHz WLAN, Bluetooth 2.1, and FM-BCM4329

U11

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BOM

Description

Location

47140045

RF switch-0.5–2.5 GHz

U13

39080077

Audio power amplifier

U14, U15

13080038

Duplexer-RX: 2110–2170 MHz/TX: 1920–1980 MHz

U20

13080060

Duplexer-TX: 824–849 MHz/RX: 869–894 MHz

U21 47100280

Power module-1920–1980 MHz

U22

39200249

WCMDA/GSM radio transceiver (QTR8615)

U23 47100289

Power module-1850-1910 MHz

U24

47100360

RF power module-1710-1785 MHz

U25

13080072

Duplexer-RX: 2110–2155 MHz/TX: 1710–1755 MHz

U31 38140022

Semiconductor-capacitive sensor

U33

39200289

Digital base band processor-1.2 GHz-MSM8260

U34 39110548

LDO-3.3 V

U35

39110567

Switching regulators-2.0–5.5 V

U36

39070073

Power management IC-0.3–2.75 V-battery coulometer

U37 43140104

Connector controller-LCD Drive IC

U40

13080082

Duplexer-RX: 1930–1990 MHz/TX: 1850–1910 MHz

U41 47090042

RF low noise amplifier-0.5–3 GHz

U42

47140049

RF switch-0.5–3.0 GHz

U43

47140054

RF switch-600–2700 M

U46

47100307

RF power module-824–849 MHz, 880–915 MHz, 1710–1785 MHz, 1850–1910 MHz

U47 39070085

Battery management IC-4.1–16 V-DC-DC charging chip

U48

39070055

Battery management IC-2.5–6.5 V-average current limiting-percentage (10%)-DRV

U1001 12020141

Crystal oscillator-19.2 MHz

X1

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BOM

Description

Location

12020171

Crystal oscillator-27 MHz

X2

12020125

Crystal oscillator-0.032768 MHz

X3

12020168

Crystal oscillator-37.4 MHz

X4

13010262

SAW filter-2140 MHz

Z1

13010177

SAW filter-1960 MHz

Z3

13010175

SAW filter-1732.5 MHz

Z4

13010265

SAW filter-1574.42 MHz/1605.89 MHz

Z5

07040064

Varistor-8 V-4 V-30 V-SMT-0405-ESD+EMI noise filter

Z10, Z9 13030052

Ceramics filter-2450 MHz

Z11

07040072

ESD_EMI Filter-14 V-30 pF-800–3000 MHz

Z12 13010131

Sound filter-1960 MHz

Z16

13010148

Sound filter-2140 MHz

Z17

13080106

Duplexer-1565–1607 MHz/2400–2500 MHz

Z18 13010264

SAW filter-1590.16 MHz

Z22

40060318

NAND flash-16 GB eMMC V4.4-52 MHz

U12

03021CNP

Interface board-MediaPad-HIDS7PIA-with TF slot, type D HDMI, and micro USB connector

15040238

Transient voltage suppression diode-6 V-14 V-10 W-12 A

D21, D5, D9

15040264

Transient voltage suppression diode-5.5 V-15 V-1 A

D10, D7

15040293

Transient voltage suppression diode-6 V-15 V-15 W-1.5 A

D19, D20 14240243

Card connector-micro SD receptacle

J2

14240272

IO connector-micro_B-female-5pin-bend-S MT

J3 14240268

IO connector-micro HDMI-19-D type

J4

14240199

BTB connector-female-10pin-0.4 mm-0.9 mm

J6

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BOM

Description

Location

14240210

BTB connector-female-40Pin-0.4 mm-0.9 mm

J8

10040059

Common mode EMI filter-20 V DC/280 mA-0805

T1

07040064

Varistor-8 V-4 V-30 V-SMT-0405-ESD+EMI noise filter

Z1

03021CNQ

Speaker board-MediaPad-HIDS7PSK-1x1

14240200

BTB connector-male-10Pin-0.4 mm-0.9 mm

J1 03021CNW

LED board-MediaPad-HIDS7PFR-1x1

14240200

BTB connector-male-10Pin-0.4 mm-0.9 mm

J3 03021CPB

Key board-S7-301u-HIDS7PKA-1x1

14240200

BTB connector-male-10Pin-0.4 mm-0.9 mm

J1

38140014

Semiconductor sensor-ambient light sensor

U1 03021CPF

BTB board-MediaPad-HIDS7PFI

14240221

BTB connector-male-40Pin-0.4 mm-0.9 mm

J1, J5

03021DTK

BTB to ZIF FPC bridge board-MediaPad-HIDS7PFL

14240221

BTB connector-male-40Pin-0.4 mm-0.9 mm

J1 32050018

Vibrator-column

22020058

Speaker

22050048

Microphone

23040205

LCD module-single display

23060061

Camera module group-CMOS-1.3 M-FF

23060062

Camera module group-CMOS-5 M-AF

14240276

IO connector-DC JACK

14240340

Headset connector

27160803

Main antenna-S7-303u-(sensor FPC) SAA

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BOM

Description

Location

23070113

Touchscreen-S7 PRO CTP with AF

27160802

Main antenna S7-303 u-1710–2170 MHz/824–894

MHz

27160804

GPS WIFI antenna S7-30 3u-1565–1620 MHz/2400–2500

MHz

27160805

Diversity antenna-S7-303 u-1910–2170 MHz

Item

Contents

Remarks

Preparation

Battery

At least two bars on the battery level indicator

Micro SD card

More than 512 M

USB cable

BOM: 97065432

PC

Windows 2000, Windows XP

File

S7-30Xu V100R001C002B027T01 (not the final version)

This version is only for reference. Download the latest version for upgrade (the upgrade using USB).

Tool

eMMC Software Download

For upgrade using the USB

Upgrade method

Using the Micro SD card

Using the USB

5 Software Upgrade

5.1 Preparation

5.2 Upgrade Using the Micro SD Card

5.2.1 Upgrade Process

Step 1 Delete the information in the Micro SD card or format the SD card. Step 2 Create a folder named dload in the root directory of the Micro SD card, and copy the upgrade

file to dload.

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Step 3 Ensure that the board is powered off, and that the battery is fully charged or connected to a

Upgrade State

Upgrade of the Device

Upgrade of the Board

Upgrading.

The LED indicator blinks at the frequency of 1 Hz.

Upgrade succeeded.

The LED indicator stays on.

Upgrade failed.

The LED indicator blinks at the frequency of 4 Hz.

charger. Insert the Micro SD card into the board, and the upgrade will be performed automatically after the board is powered on.

Step 4 When the upgrade is completed, remove the SD card and press and hold the POWER button

to restart the device.

5.2.2 Troubleshooting

During the update using the SD card, if the device presents a flash screen indicating the upgrade failure, check for any mis-operation or incorrect upgrade version. You can remove the SD card and try it again or change the SD card.

Method to check whether the SD card is damaged: Because the size of the upgrade package of some version is large, try to open the compressed

upgrade package that is copied to the SD card to check for damage. Remove and plug the SD card before you open the compressed upgrade package. If you open the compressed upgrade package directly, the opened package may be a cache on the PC. Alternatively, you can check the reliable storage capacity of the SD card with the MyDiskTest (an SD card check tool) to ensure that the size of the upgrade package does not exceed the storage capacity of the SD card. For more information, see the appendix of this chapter.

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5.3 Upgrade Using the USB

5.3.1 Entering the USB Upgrade Mode

When the system is powered on, quickly press the VOLUME_UP button and the VOLUME_DOWN button. If it is the first time for your PC to connect the USB, the message

"Found New Hardware" will be displayed, which indicates that the system has entered the USB upgrade mode successfully, as shown in the following figure.

5.3.2 Installing the USB Device Driver

If the driver has not been installed before, you must install the driver on the PC before the update using the USB.

Step 1 When the MediaPad is connected, it enters into the Emergency Download mode, and a

window is displayed, showing the port Qualcomm HS-USB QDLoader 9008. If the port driver has not been installed before, a message for installing the driver will be displayed.

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Step 2 Select Choose the install from a list or specific location (Advanced). Then click Next.

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Step 3 Click Browse in the window displayed to select the USB driver to be installed, as shown in

the following figure. Then click Next.

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Step 4 If the corresponding file is found, the window indicating successful installation will be

displayed, as shown in the following figure.

Step 5 The USB port (COM15) is shown in the Device Manager window.

5.3.3 Programming Using the QPST Software

If the QPST software has been installed, run the eMMC Software Download tool and do as follows:

Step 1 Ensure that you select Program Boot Loaders and Program MMC device.

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Step1

Step 2

Step 2 Set Flash Programmer file name to MPRG8660.hex, and set Boot Image to

8660_msimage.mbn.

Step 3 Click Browse. In the Select Port window, check whether the value of Phone is Q/QCP-XXX

(Download) (COM15), and whether the port is consistent with that shown in the Device Manager window. Then click OK.

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NOTE

Step3

If the Q/QCP-XXX (Download) port is not found in the Select Port window, right-click the icon in the taskbar on the lower right corner to display the QPST Configuration window. In the displayed window, click Ports, and click Add New Port. In the Add New Port window displayed, select corresponding USB/QC Diagnostic port. Double-click the selected port to add it to Port on the right. Then click OK.

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The following window is displayed (if the port is available, the Q/QCP-XXX (Download) is displayed).

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Step 4 Click Load XML def, and open the modem folder in the upgrade package in the displayed

box. Then select rawprogram0.xml in the modem folder. If the file is successfully opened, the save path of rawprogram0.xml will be displayed in Seach path1.

Step 5 Click Load patch def, and open the modem folder in the upgrade package in the displayed

box. Then select patch0.xml in the modem folder (this step is mandatory; otherwise, the MediaPad startup will fail).

Step 6 Select Search path2, and click the icon for browsing. Then select the apps folder in the

upgrade package in the Seach Path Folder window.

Step 7 When all preceding steps are completed, the Download button will become clickable. Then

click Download.

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Step 4

Step 5

Step 6

Step 7

Step 8 After the upgrade is completed, press and hold the Power button for more than 10 seconds to

re-start the MediaPad.

5.3.4 Troubleshooting

Click Download, if the following dialog box for installing the driver is displayed, as shown in the following figure. You can ignore it, because you may enter the trusted mode that requires no driver (USB MassStorage port is used in the trusted mode).

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Step 1 In this mode, the message "Remote devices wait for time out" will be displayed occasionally,

or the message "Image Download Failed. Cookie (if present) not received" will be displayed during restart.

In these cases, you may repeat the preceding steps. If the download fails, restart the MediaPad and connect it to the PC to check whether the upgrade is conducted in the trusted mode using the QPST software (that is, the Qualcomm MMC Storage USB Device is displayed). Then perform the upgrade using the USB according to the steps for upgrade in the trusted mode.

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Name: constant-temperature hot air gun Purpose: heat components

Step 2 If the message "Phone is not in download mode" is displayed, you may not uncheck Program

Boot Loaders (mandatory for upgrade in the trusted mode). Then uncheck Program Boot Loaders as shown in the following figure.

Click Scan&&Download, if the message "port open" is displayed, check whether the driver is properly installed, and whether DBAdapter Reserved Interface port functions well.

5.4 Viewing the Software Version

In the standby state, choose Settings > About phone to view the information about the software version.

6 Maintenance Tools

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Name: constant-temperature hot air gun Purpose: heat components

Name: soldering iron Purpose: soldering during maintenance

Name: DC power Purpose: supply power

Name: soldering Purpose: secure the main board.

Name: lead-free solder wire Purpose: soldering

Name: digital multimeter Purpose: measurement during maintenance

Name: tool kit Purpose: assemble and disassemble the device

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Name: electric screwdriver Purpose: fasten and remove screws.

Name: small sucker (diameter: about 25 mm) Purpose: remove the upper decorative cover.

1.

Ensure that the ESD wrist strap is properly grounded.

2.

Disassembly procedures are as shown below.

3.

Remove the lower decorative cover with the sucker.

4.

Remove the upper decorative cover with the sucker.

7 Disassembly Procedures

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5.

Remove the six screws on the rear cover.

6.

Unlock the rear cover.

7.

Disassemble the rear cover.

8.

Loosen the BTB connector of the battery.

9.

Take out the glued battery.

10.

Loosen the BTB connector marked in the picture.

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11.

Remove the 5-megapixel camera.

12.

Loosen the BTB connector of the headset.

13.

Remove the JACK FPC of the headset.

14.

Remove the screws marked in the picture.

15.

Remove the connector of the headset.

16.

Remove the auxiliary board.

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17.

Remove the three screws on the main board.

18.

Remove the conductive fabric between the main board and the LCD support.

19.

Remove the main board.

20.

Remove the FPCs marked in the picture.

21.

Remove the seven screws securing the LCD.

22.

Remove the LCD from other cover A assembly.

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23.

Place the protective film on the LCD.

24.

Place the protective film on the lens.

25.

Remove the speaker on the rear cover.

26.

Remove the vibrator on the rear cover.

27.

Remove the front camera.

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8 Assembly Procedures

1.

Ensure that the ESD wrist strap is properly grounded.

2.

Remove the protective film on the lens.

3.

Remove the protective film on the LCD.

4.

Install the LCD.

5.

Tighten the screws marked in the picture to secure the LCD.

6.

Place FPCs at the positions marked in the picture.

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7.

Install the front camera to the main board.

8.

Install the main board.

9.

Place the conductive fabric at the position marked in the picture.

10.

Tighten the screws marked in the picture to secure the main board.

11.

Install the auxiliary board.

12.

Install the connector of the headset.

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13.

Tighten the screws marked in the picture.

14.

Install the FPC for the connector of the headset.

15.

Secure the BTB connector of the headset.

16.

Install the rear camera.

17.

Secure the BTB connectors marked in the picture.

18.

Install the battery.

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19.

Secure the connector of the battery.

20.

Install the vibrator.

21.

Install the speakers.

Note:

The springs of them must face each other.

22.

Install the rear cover.

23.

Secure the front cover and rear cover.

24.

Tighten the screws on the rear cover.

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25.

Install the lower decorative cover.

26.

Install the upper decorative cover.

9 Troubleshooting for Common Failures

9.1 Principle

The S7 Pro, customized for home and mobile users, provides high-speed radio interface (WCDMA, WIFI) for access to the Broadband Metropolitan Area Network (BMAN), and HDMI to support various multimedia formats. The S7 Pro supports multimedia, games, GPS, IM, audio, and data communication to provide satisfactory entertainment and communication services to home and mobile users. The S7 Pro uses a single board to control the device, and process the graph, image, and baseband signal.

The key components of Mediapad include: processor MSM8260, RF transceiver QTR8615, PMU PM8058 and PM8901, power management IC MAX8903, WLAN/BT module BCM4329, and RGB to LVDS 8-bit transceiver.

The MSM8260 is Qualcomm's new generation processor, and mainly includes the following sub-processors:

Apps processing: two Scorpion cores, with combined L2 (512 kB) cache running at up to 1.2 GHz

Applications DSP: QDSP6 processor (565 MHz) Modem μP: ARM1136™ + L2 cache (256 kB) at up to 384 MHz Modem DSP: QDSP4 processor (to 147 MHz) Resource power manager: ARM7 (54 MHz) Sensor peripheral subsystem (SPSS): ARM7 (64 MHz) Characteristics of the chip:

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For baseband processing, it supports the UMTS (WCDMA), HSPA+, and GSM/GPRS/EDGE.

The AP processing speed o is up to 1.2 GHz; the 256 MHz ARM1136 P modem processor and the 122 MHz QDSP4 DSP are used.

For storage, it supports the LPDDR2 SDRAM (Pro Via EBI1), NAND flash, OneNAND, and NOR flash.

ISM — 32-bit LPDDR2 SDRAM up to 333 MHz (64 MB) for multimedia EBI1 support — 32-bit LPDDR2 SDRAM up to 266 MHz (512 MB as a minimum) SD support — eMMC NAND flash (The versions of eMMC BOOT and eMMC on the board

must be version 4.4 or later versions). Camera connectors: Qcamera™ Feature Rear camera (via 4-lane MIPI_CSI) — support the CMOS and CCD sensors; 16 megapixel as

a maximum. Front camera (via 2-lane MIPI_CSI) — support the CMOS and CCD sensors; 12 megapixel

as a maximum; maximum resolution: WSXGA 1440 x 900; supports up to three displays. Primary: 4-lane MIPI_DSI – up to 24-bit WSXGA (1440 x 900); refresh rate up to 60 Hz Secondary: RGB interface – up to WSXGA (1440 x 900); refresh rate up to 60 Hz Tertiary: EBI2 interface – up to 400 x 240, non-active refresh Color depth: 24 bits per pixel (bpp)

Audio/video (A/V) output

---»Composite video plus line audio for NTSC/PAL TVs

---»S -video plus line audio for NTSC/PAL TVs

---»High Definition Multimedia Interface (HDMI) Ver. 1.3

---»Integrated HDMI Tx core and HDMI PHY

---»1080p with a refresh rate of 60 Hz; 24-bit RGB color

---» Up to 8-channel audio for 7.1 surround sound

--»Dolby® Digital Plus, Dolby True-HD, and DTS-HD Master



Video decoding (Windows Mobile and Linux) supports the following: Program source: 30 fps at 1080p (H.264/MPEG2/MPEG4/DivX/VC-1), 30 fps at D1

(H.263) Video source: 30 fps at 1080p (H.264/MPEG2/MPEG4/DivX/VC-1), 30 fps at D1

(H.263) Video calling: 15 fps at QCIF (MPEG4/H.263)



Audio codec via the QTR8615 or QTR9215 device



External interfaces:

---»UART ports, UIM ports, I2C ports, and SPI ports (master only);

---»USB interfaces: HS USB 2.0 OTG with built-in USB PHY, FS USB (without built-in USB PHY), and USB-UICC

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---»Secure digital interfaces: up to five ports, MMC and SD cards, eMMC NAND flash, UBM and WLAN, and SD/eMMC boot

---»I2S interfaces: up to 18 multiple I2S channels over five interfaces

---»PCM: for Bluetooth

---»TSIF: up to two ports

---»NFC: with external NFC device

The MSM8260 functional block diagram is shown in the following figures.

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9.2 Power-on Failure

The following three conditions must be met to power the PRO on:

1. Press and hold the Power button for two seconds with the battery in place.

2. Connect the 5 V DC regulated power supply to the DC power interface with the battery

in place. The device is powered on, and charging begins.

3. Connect the 5 V DC regulated power supply to the DC power interface with the battery

not in place. The device is powered on and starts to run.

Connect the DC adapter to the power-on circuits.

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Power_key circuit:

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NOTE

Mediapad power-on sequence: Standard sequence:

VREG_S0A--->VREG_S1A--->VREG_S3A--->VREG_S2A--->VREG_L0A--->VREG_L21 A--->VREG_L7A--->VREG_L13A--->VREG_L16A--->VREG_L5A--->VREG_L6A--->VR EG_S0B--->VREG_S3B--->VREG_L3B--->VREG_L11A--->--->TP_3V3--->VREG_L4B

1. VDD_MEM (internal memory)

2. VDD_C1 (digital core circuits)

3. VDD_ISM1 and VDD_P3 (ISM 1.8 V power and most pad circuits/peripheral I/Os respectively)

4. VDD_A3 (1.3 V RF, GPS ADC)

5. VDD_A2 (MIPI-DSI display)

6. VDD_A1, VDD_PXO, and VDD_MXO (PLLs, PXO, and MXO crystal power respectively)

7. VDD_USBPHY_1P8 (1.8 V USB supply)

8. VDD_A5 (DACs and BBRx)

9. VDD_A4; VDD_A4_GPLL and VDD_A4_HFPLL (HDMI and MIPI-CSI; PLLs)

10. VDD_P2 (2.85 V SD card)

11. VDD_USBPHY_3P3 (3.3 V USB supply)

12. VDD_SC1 (1.1 V Scorpion core 1 – optional)

1. The core voltage (VDD_C1) needs to be powered up before the pad circuits

(VDD_PX) are powered up, so that internal circuits can take control of the I/Os and pads.

2. If pad voltages are powered up first, the output drivers may be stuck in unknown

states, and may cause high leakage current until VDD_C1 is powered on.

3. The pad voltages must precede the analog voltages (VDD_AX), because the SSBIs

are initialized to the default state before VDD_AX is powered up (analog circuits are controlled by SSBI).

4. VDD_QDSP, VDD_SC1, and VDD_SC2 (QDSP and Scorpion core circuits) can be

powered up by the software after the MSM device has completed the boot process.

5. Other non-critical supplies are included in the power-up sequence. Any other desired

supplies can be powered up by software after the sequence is completed.

6. Each domain needs to reach the 90% value before the next domain starts ramping up.

For example, when VDD_C1 reaches 90% of the specified value, the VDD_P3 supply can start ramping up.

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NOTE

VDD_QFUSE_PRG must be powered down before any of the pad power supplies are powered down

The VDD_QFUSE_PRG pin should be connected to a 1.8 V power supply only for blowing fuses; otherwise, this pin must be grounded and never be left floating.

The kernel system power-on waveform is shown in the following figure.

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Voltage:

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Type/Name

Default

Conditions

Programmable

Range

Operating Range

Intended Use

SMPS – Buck S0 (1.5 A) 2 3 S1 (1.5 A) S2 (1.5 A) S3 (1.5 A) S4 (1.5 A)

On, 1.100 V On, 1.100 V Off, 1.350 V On, 1.800 V Off, 2.200 V

0.375 to 3.05 V

0.500 to 1.350 V

0.500 to 1.500 V

1.700 to 1.900 V

2.100 to 2.400 V

Processor core #1 Processor core #2 (if available) Low-voltage RF circuits Digital pads and EBI High-voltage RF circuits

Linear – 300 mA L1 (NMOS) L2 (PMOS) L5 (PMOS) L8 (PMOS) L9 (PMOS) L10 (PMOS) L13 (PMOS) L14 (PMOS) L15 (PMOS) L16 (PMOS) L22 (NMOS) L23 (NMOS)

On, 1.350 V Off On, 2.850 V Off, 2.200 V Off, 2.100 V Off, 2.600 V Off, 2.900 V Off, 2.850 V Off, 2.850 V Off, 1.800 V Off, 1.200 V Off, 1.200 V

0.75 to 1.525 V

1.5 to 3.3 V

0.75 to 1.525 V

1.100 to 1.450 V

2.500 to 3.3 V

2.750 to 3.3 V

1.500 to 3.3 V

1.000 to 1.400 V

DDR2 core (EBI1), HSIC, digital I/Os

Digital pads; Tx DAC; XO digital outputs

SDIO Analog and RF circuits; S-video;

combo DAC Analog baseband circuits; S-video

DAC UBM analog; MDDI; NCP WLAN PA RF front-end circuits LCD Multimedia controls General-purpose General-purpose

Linear – 150 mA L0 (NMOS) L3 (PMOS) L11 (PMOS) L12 (PMOS) L17 (PMOS) L18 (PMOS) L19 (PMOS) L20 (PMOS) L21 (NMOS) L24 (NMOS) L25 (NMOS)

On, 1.200 V Off Off, 2.800 V Off, 2.900 V Off, 2.200 V Off, 2.200 V Off, 2.500 V Off, 1.500 V On, 1.100 V Off, 1.300 V Off, 1.300 V

0.75 to 1.525 V

1.5 to 3.3 V

0.75 to 1.525 V

1.100 to 1.300 V

1.700 to 3.3 V

1.500 to 3.3 V

2.100 to 3.3 V

1.500 to 3.3 V

1.000 to 1.400 V

DDR2; digital I/Os; HDMI; UBM digital

UIM/UICC Camera analog NFC; RF front-end circuits General-purpose ADCs (XO, HK, TS, UBM) WLAN analog MDDI; multimedia controls MPLL circuits General-purpose General-purpose

Linear – 50 mA L4 (PMOS)4 L6 (PMOS) L7 (PMOS)

On, 2.850 V On, 3.075 V On, 1.800 V

1.5 to 3.3 V

1.5 to 3.6 V

1.5 to 3.3 V

2.750 to 3.3 V

2.950 to 3.6 V

1.750 to 3.3 V

XO circuits and sine wave output buffers

USB PHY; HDMI USB PHY; RF XO circuits; PA

DAC; Q-fuse

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Type/Name

Default

Conditions

Programmable

Range

Operating Range

Intended Use

Low-voltage Switches LVS0 (100 mA) LVS1 (100 mA)

Off, 1.800 V Off, 1.800 V

Not applicable Not applicable

Camera Sensors, HDMI

NCP (200 mA)

Off, –1.800 V

–1.700 to –1.900 V

Headset circuits

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9.2.1 Power-on Failure — High Current

Analysis: Adjust the DC regulated power supply to 5 V/3 A, and connect it to the PRO_DC interface for power-on. When the device is powered on, the current exceeds 500 mA. In this case, the power-on failure is usually caused by improper SMT or IC damage. For the maintenance procedures, see Figure 9-1, Figure 9-2, and Figure 9-3.

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Power-on fails due to high

current

Switch off the power and check

whether short circuit occurs in

C665 and C624

Check whether short circuit

occurs in the C418/C419/C420/

C423/C424

Check whether short circuit

occurs in C442, C435, C444, and

C445

Replace U2

Yes

No

Replace U48

Replace U7

Replace U2

Yes

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Figure 9-1

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Figure 9-2

Figure 9-3

9.2.2 Power-on Failure — Low Current

Analysis: Adjust the DC regulated power supply to 5 V/3 A, and connect it to the PRO_DC interface for power-on. When the device is powered on, the current is below 70 mA. In this case, the power-on failure is usually caused by improper eMMC programming or SMT. For the maintenance procedures, see Figure 9-1, Figure 9-2, and Figure 9-3.

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Power-on fails due to low current

Check the U48 output and

measure whether the voltage

difference between C665 and

C624 is 4.2 V

Check the U7 output and measure whether the voltage difference between C418 and C419 is 1.8 V

Perform eMMC programming

again (U12)

No

Yes

Replace U48

Replace U7No

9.3 Charge Failure

The Mediapad charging management circuits are shown in the following figure.

Principle: The DC regulated power supply provides the 5 V/3 A power supply to the DC-DC circuits in the MAX8903, and MAX8903 and the power is output through VBAT and VPH_PWR respectively.

Analysis: The U48 manages the charging of S7 Pro. For the maintenance procedures upon charge failure, see the Appendix 1 (diagram of PRO components).

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Charging fails

Check whether the voltage

difference among D3, D20, C747,

C486, and C108 is 5 V

Measure the R4 voltage

difference and check for improper

SMT

Solder R4

No

Yes

Replace D3, D20, C747,

C486, and C108

Replace U48No

9.4 Failure to Identify SIM Card

Diagram of the circuits:

The SIM_CD indicates the PIN of the SIM card and is used for identifying the SIM card. When the SIM card is inserted, the voltage of SIM_CD changes from a high level to a low

level. Remark: For the maintenance procedures, see Appendix 1 (diagram of PRO components). Perform the eMMC programming again (U12).

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SIM card identification fails.

Check whether the device

enters the airplane mode when

it is powered on

Check whether the voltage of

C591 ranges from 1.8 V to 3.3 V

Perform the eMMC programming

again (U12)

Yes

No

Set the device to non-

airplane mode

Replace Z12Yes

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9.5 Failure to Identify SD Card

Diagram of the circuits:

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The SDC3_CARA_CD indicates PIN of the SD card and is used for identifying the SD card. When the SD card is inserted, the voltage of SDC3_CARA_CD changes from a high level to

a low level. The MSM8260 determines that the SD card is available. Then call the SD card driver to access the SD card.

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SD card identification fails

Check whether the voltage of

C514 on the main board

（PCB） is 2.85 V

Check whether the voltage of R4

on the auxiliary board is 2.85 V

Repair the auxiliary board

No

Yes

Replace U7

Replace the FPC connecting the

main board PCB and auxiliary

board PCB

No

Check whether short circuit to

ground occurs in R10, R9, R12,

R13, and R8 on the auxiliary

PCB

Yes

Replace the SD card socketNo

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9.6 Display Failure

LCD driver circuits:

LCD backlight driver circuits:

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Principles: SN75LVDS83BZQLR is used as the RGB to LVDS transmitter for T1, having the following

characteristics:



LVDS display SerDes interfaces directly to LCD display panels with integrated LVDS



1.8 V up to 3.3 V tolerant data inputs to connect directly to low-power, low-voltage application and graphic processors



Transfer rate up to 135 Mpps (mega pixel per second); pixel clock frequency range: 10 MHz to 135 MHz



Operates from a single 3.3 V supply and 170 mW (typ.) at 75 MHz



28 data channels plus clock in low-voltage TTL to 4 data channels plus clock out low-voltage differential



Consumes less than 1 mW when disabled

The block diagram of SN75LVDS83BZQLR is shown in the following figure.

Remark 1: Although the backlight can be turned on, no image is displayed. See the following chart for maintenance procedures.

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Display failure (no image) occurs

Check whether short circuit occurs in U40 Yes

No

Replace U40

Replace the LCD

Display failure occurs (the

backlight cannot be turned on)

Check whether short circuit

occurs in U1

Check whether short circuit

occurs in Q22

Yes

No

Replace U1

Replace Q22Yes

Check whether J9 shows any

insufficient or staggered soldering

No

Repair J9Yes

Replace the LCD

Remark 2: The backlight cannot be turned on. See the following chart for maintenance procedures.

9.7 Touchscreen Failure

Diagram of circuits:

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Touchscreen failure occurs

Check whether short circuit occurs in U1000

Check whether short circuit occurs in U35

Yes

No

Replace U1000

Replace U35Yes

Check whether short circuit occurs in U19

No

Replace U19Yes

Replace the TP (touchscreen)

Principle: The Mediapad power-on system loads the touchscreen driver through the I2C port. See the following chart for maintenance procedures.

9.8 Audio Failure

9.8.1 Speaker Failure

Diagram of circuits:

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Speaker failure occurs

Check whether short circuit

occurs in U14 and U15

Check whether short circuit

occurs in SKP

Yes

No

Replace U14 and U15

Replace the SPKYes

Replace the SPK-FPC

In the case of no sound from the speaker, check for sound output after the S7 Pro is connected to the TV through the HDMI. If there is sound, repair the device according to the following chart.

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9.8.2 Headset Failure

Diagram of circuits:

Upon a headset failure, check whether the headset interface is properly assembled. If the problem persists, replace the headset jack.

9.9 Camera Failure

Diagram of circuits: The S7 Pro camera transmits signals through the MIPI. The red part indicates the power

supply circuit of the camera.

See the following chart for maintenance procedures.

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Camera failure occurs

Check whether the voltage of C246 and C247 is 1.8 V, and whether the

voltage of C248 and 249 is 2.8 V

Visually check for any improper SMT

in J2 and J6

No

Yes

Replace U7

Repair J2 and J6No

Replace the camera

9.10 Vibration Failure

Diagram of circuits:

Principle: The motor controls the vibration based on the differential pressure of the input PIN.

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Vibration failure occurs

The motor becomes faulty No

Yes

Replace the motor PFC

Replace the motor

9.11 RF Failure

Figure 9-4 Block diagram of QTR8615 RF

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As shown in the block diagram, the transmitter includes high frequency, intermediate frequency, and low frequency channels. The IQ signal is transmitted to the built-in power amplifier through the up-converter. The AGC is used to control the power output, and the AGC circuit includes a power detector to achieve a transmit power control range greater than 85 dB. The output radio frequency signal is sent to the front-end module, and transmitted by the antenna to QTR8615. After the signal is amplified in the internal LNA, it is down-converted to I/Q baseband signal.

The device supports WCDMA that uses the frequency band of 5 MHz and GSM that uses the frequency band of 4 MHz.

Figure 9-5 Diagram of circuits of the RF antenna switch

The red part indicates that the signal is transmitted into the antenna switch (U46) through the transmit channel, and the blue part indicates that the signal is transmitted out of U46 through the receive channel.

Figure 9-6 Diagram of circuits of WCDMA2100 RF channels

The red part indicates the transmit channel, and the blue part indicates the receive channel. Both the transmit channel and the receive channel are connected to the antenna switch through the duplexer (U20).

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Figure 9-7 Diagram of circuits of WCDMA1900 RF channels

The red part indicates the transmit channel, and the blue part indicates the receive channel. Both the transmit channel and the receive channel are connected to the antenna switch through the duplexer (U41).

Figure 9-8 Diagram of circuits of WCDMA AWS RF channels

The red part indicates the transmit channel, and the blue part indicates the receive channel. Both the transmit channel and the receive channel are connected to the antenna switch through the duplexer (U31).

Figure 9-9 Diagram of circuits of WCDMA850 RF channels

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The red part indicates the transmit channel, and the blue part indicates the receive channel. Both the transmit channel and the receive channel are connected to the antenna switch through the duplexer (U21).

Figure 9-10 Diagram of circuits of WCDMA900 RF channels

The red part indicates the transmit channel, and the blue part indicates the receive channel. Both the transmit channel and the receive channel are connected to the antenna switch through the duplexer (U32).

Figure 9-11 Diagram of circuits of GSM transmit channels

The green part indicates the GSM HB channel, and the blue part indicates the GSM LB channel.

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9.12 Maintenance Procedures for Transmit Failure

Y

Check the input power of QTR8615

End

Check whether the 19.2

MHz crystal (X1) is

normal

Power on the

board

Maintenance procedures

No

Check whether QTR8615 can

output the signal TX_IMT

normally

Check whether the power

supply for QTR8615 (U23) is

normal

Check whether the power output

of the power amplifier (U22) is

within the specified range

Check whether the duplexer

(U20) works normally

Check whether the antenna

switch (U46) works normally

Replace QTR8615 (U23)

Check the input signal, output signal, and

power supply. If any exception is found,

replace the power amplifier (U22)

Replace the duplexer (U20)

Check the input signal, output signal,

logic control signal, and power supply.

If any exception is found, replace U46

Replace X1

Yes

9.12.1 WCMDA2100 Transmit Calibration Failure

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9.12.2 WCMDA1900 Transmit Calibration Failure

Y

Check the input power of QTR8615

End

Check whether the 19.2

MHz crystal (X1) is

normal

Power on the

board

Maintenance procedures

No

Check whether QTR8615 can

output the signal TX_PCS

normally

Check whether the power

supply for QTR8615 (U23) is

normal

Check whether the power output

of the power amplifier (U24) is

within the specified range

Check whether the duplexer

(U41) works normally

Check whether the antenna

switch (U46) works normally

Replace QTR8615 (U23)

Check the input signal, output signal, and

power supply. If any exception is found,

replace the power amplifier (U24)

Replace the duplexer (U41)

Check the input signal, output signal,

logic control signal, and power supply.

If any exception is found, replace U46

Replace X1

Yes

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9.12.3 AWS Transmit Calibration Failure

Y

Check the input power of QTR8615

End

Check whether the 19.2

MHz crystal (X1) is

normal

Power on the

board

Maintenance procedures

No

Check whether QTR8615 can

output the signal TX_PCS

normally

Check whether the power

supply for QTR8615 (U23) is

normal

Check whether the power output

of the power amplifier (U25) is

within the specified range

Check whether the duplexer

(U31) works normally

Check whether the antenna

switch (U46) works normally

Replace QTR8615 (U23)

Check the input signal, output signal, and

power supply. If any exception is found,

replace the power amplifier (U25)

Replace the duplexer (U31)

Check the input signal, output signal,

logic control signal, and power supply.

If any exception is found, replace U46

Replace X1

Yes

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9.12.4 WCMDA850 Transmit Calibration Failure

Y

Check the input power of QTR8615

End

Check whether the 19.2

MHz crystal (X1) is

normal

Power on the

board

Maintenance procedures

No

Check whether QTR8615 can

output the signal TX_850

normally

Check whether the power

supply for QTR8615 (U23) is

normal

Check whether the power output

of the power amplifier (U44) is

within the specified range

Check whether the duplexer

(U21) works normally

Check whether the antenna

switch (U46) works normally

Replace QTR8615 (U23)

Check the input signal, output signal, and

power supply. If any exception is found,

replace the power amplifier (U44)

Replace the duplexer (U21)

Check the input signal, output signal,

logic control signal, and power supply.

If any exception is found, replace U46

Replace X1

Yes

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9.12.5 WCMDA900 Transmit Calibration Failure

Y

Check the input power of QTR8615

End

Check whether the 19.2

MHz crystal (X1) is

normal

Power on the

board

Maintenance procedures

No

Check whether QTR8615 can

output the signal TX_U900

normally

Check whether the power

supply for QTR8615 (U23) is

normal

Check whether the power

output of the power amplifier

(U29) is within the specified

Check whether the antenna

switch (U46) works normally

Check whether the antenna

switch (U46) works normally

Replace QTR8615 (U23)

Check the input signal, output signal, and

power supply. If any exception is found,

replace the power amplifier (U29)

Replace the duplexer (U32)

Check the input signal, output signal,

logic control signal, and power supply.

If any exception is found, replace U46

Replace X1

Yes

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9.12.6 GSM HB Transmit Calibration Failure

Y

Check the input power of QTR8615

End

No

Check whether the

power supply for

QTR8615 (U23)

Replace X1

Replace QTR8615 (U23)

Check the input signal, output signal, and

power supply. If any exception is found,

replace the power amplifier (U47)

No

Yes

Check whether QTR8615

can output the signal

TX_GSM_LB normally

Check whether the

19.2 MHz crystal (X1) is normal

Check whether the

TX_DCS1800_PCS19 power

output of the power amplifier (U47)

No Yes

No

Power on the

board

Yes

Check whether the antenna switch

(U46) works normally

Check the input signal, output signal,

logic control signal, and power

supply. If any exception is found,

replace U46

Maintenance procedures

Yes

No

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9.12.7 GSM LB Transmit Calibration Failure

Y

Check the input power of QTR8615

End

No

Check whether the power

supply for QTR8615

(U23) is normal

Replace X1

Replace QTR8615 (U23)

Check the input signal, output signal, and

power supply. If any exception is found,

replace the power amplifier (U47)

No

Yes

Check whether QTR8615

can output the signal

TX_GSM_LB normally

Check whether the

19.2 MHz crystal (X1) is normal

Check whether the

TX_GSM850_EGSM9 power

output of the power amplifier (U47)

No Yes

No

Power on the

board

Yes

Check whether the antenna

switch (U46) works normally

Check the input signal, output signal,

logic control signal, and power

supply. If any exception is found,

replace U46

Maintenance procedures

Yes

No

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9.13 Maintenance Procedures for Receiving Failure

Yes

No

Y

Replace U20, U41 U31, U21, and U32

Check the input signal, output signal,

logic control signal, and power supply.

If any exception is found, replace U46

Check whether the antenna switch

(U46) and the WCDMA receive

channel work normally

No

Y

No

Check the power supply for U23. If any

exception is found, replace U23

Check whether the input and

output signals of duplexers

(U20, U41, U31, U21, and

U32) are normal

Power the board

on

End

Yes

Check whether

QTR8615 (U23) works

normally

Maintenance procedures

Yes

9.13.1 Maintenance Procedures for WCDMA Receiving Failure

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9.13.2 Maintenance Procedures for GSM Receive Failure

Yes

No

Y

Replace U21

Check the input signal, output signal,

logic control signal, and power supply.

If any exception is found, replace U46

Check whether the antenna switch

(U46) and the GSM receive channel

work normally

No

Y

No

Check the power supply for U23. If any

exception is found, replace U23

Check whether the input and

output signals of duplexers

(U21) (GSM850) are normal

Power the board

on

End

Yes

Check whether

QTR8615 (U23) works

normally

Maintenance procedures

Yes

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9.14 GPS Failure

Figure 9-12 Diagram of GPS front end circuit

The area in red indicates the SAW filter and LANchannel, and the area in blue indicates the commonly used duplexer for Wi-Fi.

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Y

Replace Z18

End

Check whether the 19.2

MHz crystal (X1) is

normal

Power on the

board

Maintenance procedures

No

Check whether Z22 pin 4 can

receive the GPS signal

normally

Check whether Z18 pin 4 can

receive the GPS signal

normally

Check whether the LNA U44

works normally

Check whether Z5 pin 3 and

pin 4 can receive the GPS

signal normally

Check whether QTR8615

(U23) works normally

Replace Z22

Check the input signal, output signal,

logic control signal, and power supply. If

any exception is found, replace U44

Replace Z5

Check the power supply for

U23. If any exception is found,

replace U23

Replace X1

Yes

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9.15 Wi-Fi/BT Failure

Figure 9-13 Diagram of circuits channel

Use the 1P3T switch to choose the channel for Wi-Fi and BT channel. The Broadcom BCM4329 chip is used.

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Y

End

No

Check whether the power

output signals TX_WLBG

and TX_BT of U11are

normal

Replace X4

Replace Z11

No

Yes

Check whether U43 pin

1 can output power

signal normally

Whether the 37.4

MHz crystal (X4)

is normal

Check whether Z11 pin 1

can output power signal

normally

No Yes

No

Power on the

board

Yes

Check whether Z18 pin 3 can output power signal normally

Replace Z18

Maintenance procedures

Yes

No

Check the power supply for U11. If any

exception is found, replace U11

Check the power supply and control

signals of U43. If any exception is

found, replace U43

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10 Diagram of Soldered Connections on PCB and BGA Chip

11 Function Test

11.1 MMI Test

Run the Calculator application, enter ()()2846579()(), and select Testing.

Click MMI Test to start the MMI test.

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Step 1 SD card test

Test the Micro-SD card: If the Micro-SD card is inserted, the message "SD card exists" is displayed; otherwise, the message "No SD card" is displayed. Click Success to proceed.

Step 2 SIM card test

Test the SIM card: If the SIM card is inserted, the message "SIM card exists" is displayed; otherwise, the message "No SIM card" is displayed. Click Success to proceed.

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Step 3 Keypad test

Press a key. If the keypad is functional, the icon will turn gray. Click Success to proceed.

Step 4 Gravity sensor test

According to the icons on the screen, tilt the device in different directions. After a few seconds, the symbol "√" is displayed, indicating that the test succeeded. Click Success to proceed.

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Step 5 Touchscreen test

Touch blue parts on the screen. If the blue parts turn red, the test succeeded. Click Success to proceed.

Step 6 LCD test

If the device displays white, black, black-white strips, and colorful strips in sequence, the test succeeded. Click Success to proceed.

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Step 7 Number test

The device will complete the test automatically. Click Success to proceed.

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Step 8 LCD backlight test

The device will complete the backlight test automatically. Click Success to proceed.

Step 9 Speaker test

If you can hear sound from the top and bottom speakers, the test succeeded. Click Success to proceed.

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Step 10 Headset test

Plug in or pull out the headset. If the color of the icon changes, the test succeeded. Click Success to proceed.

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Step 11 Camera test

After the test is started, the device displays the real scene to be captured by camera, indicating that the test succeeded. Click Success to proceed.

Step 12 Bluetooth test

When nearby Bluetooth devices searched after the Bluetooth function is activated are displayed on the screen, the test succeeded. Click Success to proceed.

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Step 13 Wi-Fi test

When nearby Wi-Fi signals found after the Wi-Fi function is enabled are displayed on the screen, the test succeeded. Click Success to proceed.

Step 14 Headset speaker test

If you can hear sound from both the left channel and the right channel, the test succeeded. Click Success to proceed.

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Step 15 Compass test

The device will complete the compass test automatically. Click Success to proceed.

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Step 16 Built-in microphone test

Switch between Record and Play. The sound will enter into the microphone and travel out from the speaker. Click Success to proceed.

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Step 17 Coulometer test

The device will complete the coulometer test automatically. Click Success to proceed.

Step 18 Motor test

After the test is started, the motor will vibrate automatically. Click Success to proceed.

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Step 19 USB-HOST test

The device will complete the USB-HOST test automatically. The message "USB-HOST test success" is displayed when the test is completed. Click Success to proceed.

Step 20 HDMI test

The device will complete the HDMI test automatically. If there is image and sound from the TV, the test succeeded. Click Success.

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Step 21 Displaying test results

When all tests are completed, the results are displayed on the screen. Press the Home key to exit.

11.2 Voice Call Test

Step 1 Insert a functional SIM card, and press and hold the Power button to power on the device.

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Step 2 Check the signal strength after the device is connected to the local network. You can compare

it with a functional phone.

Step 3 Call a fixed-line number to test the voice quality during the call. Step 4 If no problem is found during the test, end the test.

Huawei MediaPad S7 PRO Schematics

Specifications and Main Features

Frequently Asked Questions

User Manual