HRS CB1 Service Manual

1

Memory Stick®Connectors

CB1 Series

NEWNEW

2003.12

■Outline

Receptacle connectors for use with the new generation of
digital media devices requiring “Memory Stick

®

” type of
consumer removable memory card.
Several variations are available: Miniature, Low Profile and
with or without ejection mechanism.

■Features

1. Indication of Incorrect Card Insertion

The connector will not allow the card to be complete
inserted from the wrong end or reversed.
The card will stop about 7mm before complete insertion
position, visually indicating incorrect insertion.

2. Protection of the Contacts

Incorrect insertion of the card will not damage the
contacts. The card can be easily withdrawn and re­inserted correctly.

3. Excellent Card Handling

The type that is equipped with an ejection mechanism
provides a long ejection of the card which offers excellent
card handling qualities.

*Memory Stick is a registered trademark of the Sony Corporation.

Card Push Insert/Push Eject

<CB1G Series>

● Card ejection distance of 10 mm

● Mounting height of 3.5 mm

● Mounting area: Smaller design is 78% of former

size

Button Touch Ejection

<CB1F Series>

● Card ejection with tactile button operation

● Card ejection distance of 10 mm

● Equipped with card ejection switch

Without Card Ejection

<CB1D Series>

● Miniaturized, low profile design

● Improved installation to the equipment is permitted

using (M1.7) tapping screws

● Can be equipped with an ejection mechanism

depending on the design of the equipment side
portion

Note: Please position the card ejection button at the side of the equipment.

查询CB1A-10S-1.5H供应商

2

1. Insulation resistance 1000 M ohms min. 500 V DC

2. Withstanding voltage No flashover or insulation breakdown 500 V AC / one minute

3. Contact resistance 100 m ohms max. 100mA DC

4. Vibration No electrical discontinuity of 1 µs or more

Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis

5. Humidity

Contact resistance: 40 m ohms max. from initial value
Insulation resistance: 100 M ohms min.

6. Temperature cycle

7. Durability
Contact resistance: 40m ohms max. from initial value

12000 cycles at 400 to 600 cycles per hour

(mating/unmating)

8. Resistance to No deformation of any component. Reflow: At the recommended temperature profile

soldering heat No affect on contacts Manual soldering: 300

ç

for 3 seconds

■Materials

CB 1 E - 10 S - 1.5 H - PEJC -

**

1 4 62 3 5 7 98

Series name : CB

Ejector type : C

E

With eject mechanism

F
G
D

Without eject mechanism

A

1

Contact pitch : 1.5 mm
Surface mount
Eject mechanism codes:

PEJC : Card Push insert/Push eject
EJL : Left button eject
EJR : Right button eject

Suffix

6
7
8

9

2
3

4

Series No. : 1

Number of contacts: 10

5

Connector type S : Receptacle

}

}

Item Specification Conditions

Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç
Duration: 30/5/30/5(Minutes)
5 cycles

Contact resistance: 40 m ohms max. from initial value
Insulation resistance: 100 M ohms min.

CB1E,CB1F,CB1G Series is
without the termination area.

The CB1E Series has termination
area with tin-lead plated.

96 hours at temperature of 40ç±2ç and humidity
of 90% to 95%

■Product Specifications

Note :Includes temperature rise caused by current flow.

Rating

Current rating 0.5A

Voltage rating 125V AC

Operating humidity range
Relative humidity 96% max.
(No condensation)

Operating temperature range -20

ç

to +85

ç(Note)

Storage temperature range

-40çto +85

ç

Insulator Color: Black UL94V-0

Contacts Phosphor bronze

----------

Metal hold down

Phosphor bronze or stainless steel

Cover Stainless steel or cupper alloy ----------

Eject mechanism components ---------- UL94V-0

Part Material Finish Remarks

■Ordering information

Heat resistant glass reinforced
therm oplastic compound

Stainless steel
Heat resistant glass reinforced
therm oplastic compound

Contact area: Gold plated
Termination area: Tin-Iead plated or

tinned copper plated

Contact area: Nickel plating
Termination area:

Tin-Iead plated or
tinned copper plated

3

■Low Profile, Push Insert-Push Eject

33 (31)

29.4

13.5 9.3

26.8
(5.525)

3.2

26.2 (21)

(19.8)

P=1.5

0.6

3.85

3.5

(3.25)

CONTACT No.1

Memory stick card outline

Card ejected

Card fully inserted

Card pushed for ejection

1.9±0.1

4±0.11.9±0.1

26.6±0.1

9.3±0.05P=1.5±0.03

0.9±0.05

1.9±0.126.8±0.1

BPCB mounting pattern

Part No. CL No.

CB1G-10S-1.5H-PEJC2 CL689-0037-5

■Button Touch Eject

27.75

34.9

18.3

37

16.5

32.5

11.15

10.9

22.75
(5.525)11.975

39.8 (13)

(23)

4.5 (0.8)

13.5 4.2

P=1.5

0.6

0.4

1.5

Ø1.2

Ø0.55

3

3.85

3.5

(3.25)

(2)

Eject stroke

CONTACT No.1

Memory stick card outline

Card ejected

4-Ø2.4

Card fully inserted

32.5±00.3

18.3±00.3

11.15±0.03

16.5±0.03

1.5±0.03

10.9±00.3

3.4±0.1

5.3±0.1

4.2±0.0513.5±0.05

P=1.5±0.05

3±0.05

0.9±0.05

0.6±0.05

4-Ø3.2

+

0

.1

­ 0

.0

5

2-Ø1.3

+

0.05

0

BPCB mounting pattern

Part No. CL No.

CB1F-10S-1.5H-TEJL-PA CL689-0028-4

■Without Card Ejection

Ø1.2

CONTACT No.1

0.3

3.55

24.5

13.5

24.7

6.95

P=1.5

4.15

18.7

0.6

5.80.6

4.15

1.45

Ø1.3

19.5

1.4

3.5

5.5

Ø1.8

+0.1

0

1.05±0.05

6.1±0.05

P=1.5±0.05

13.5±0.05

5.8±0.05

1±0.1

2±0.1

2±0.1

1±0.1

6.1±0.05

Ø1.3

+0.05
0

Ø1.3

+0.05

0

18.7±0.03

4.15±0.05

2.65±0.03

BPCB mounting pattern

Part No. CL No.

CB1D-10S-1.5H CL689-0021-5